Light intensity dynamic balance control method in semiconductor laser cleaning process

Abstract

The invention relates to the technical field of semiconductor laser cleaning processes, in particular to a light intensity dynamic balance control method in a semiconductor laser cleaning process, which comprises the following steps: acquiring data in real time through a light intensity distribution monitoring device, generating an instruction by a dynamic adjusting module, adjusting a light beam by an adjustable optical component, and feeding back a mechanism optimization strategy. The method further comprises the steps of clamping preparation, initial calibration, dynamic adjustment, process monitoring, quality detection and the like. Uniformity control over light intensity distribution can be achieved, the problem of uneven cleaning is avoided, the cleaning efficiency and quality are improved, meanwhile, the stability and adaptability of equipment are enhanced, and an efficient and intelligent laser cleaning solution is provided for the modern industry.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor laser processing and precision control, and in particular relates to a method for dynamically balancing light intensity in a semiconductor laser cleaning process. Background Art

[0002] With the continuous development of semiconductor laser cleaning technology, the importance of dynamic intensity balance control methods in improving cleaning efficiency, ensuring cleaning quality, and reducing equipment loss has gradually become apparent. However, existing semiconductor laser cleaning technology still has certain limitations in achieving dynamic intensity balance control, which affects the stability and applicability of the cleaning process.

[0003] After searching, a semiconductor laser cleaning machine with publication number CN116959958B was found, with a publication date of October 1, 2024. This patent achieves continuous operation by setting up a laser cleaning component and avoids damage to the equipment caused by the laser. However, this technical solution does not involve a specific method for dynamic and balanced control of light intensity. In actual application, uneven cleaning effects may occur due to fluctuations in light intensity. In addition, its adaptability to workpieces of different materials and shapes is weak, and the cleaning requirements in complex scenarios need to be further optimized.

[0004] A search revealed a laser optical path system for a semiconductor-pumped laser cleaning machine with publication number CN106025777B, published on February 5, 2019. This patent achieves efficient ultraviolet laser output through dual-pump light sources and intracavity frequency doubling conversion, and features high repetition rate and narrow pulse width. However, this technical solution primarily focuses on optimizing the output performance of the laser and lacks a design for dynamic balanced control of light intensity. This can lead to localized overheating or incomplete cleaning during large-area or long-term cleaning processes. Furthermore, the complexity of its optical path structure increases the difficulty and cost of equipment maintenance.

[0005] The above issues indicate that existing semiconductor laser cleaning technology still has certain deficiencies in terms of dynamic balanced control of light intensity, particularly in terms of cleaning uniformity, adaptability, and equipment stability. Therefore, the present invention provides a method for dynamic balanced control of light intensity in a semiconductor laser cleaning process. This method aims to ensure uniformity and stability during the cleaning process by real-time monitoring and adjustment of light intensity distribution, while also improving the adaptability and service life of the equipment, thereby meeting the modern industry's demand for efficient and intelligent laser cleaning technology. Summary of the Invention

[0006] The present invention aims to provide a method for dynamically balancing light intensity during semiconductor laser cleaning processes, addressing the shortcomings of the prior art in dynamic balancing light intensity control mentioned in the background art. This method effectively addresses the uneven cleaning effect caused by light intensity fluctuations during the cleaning process, while also improving the equipment's adaptability to workpieces of varying materials and shapes.

[0007] The embodiments of this application adopt the following technical solutions: A method for dynamically balancing light intensity in a semiconductor laser cleaning process comprises the following steps: Step 1: Obtain laser light intensity distribution data through the real-time monitoring module and generate a light intensity distribution map; Step 2: Based on the light intensity distribution diagram, the feedback adjustment module is used to adjust the laser output parameters; Step 3: Use the multi-dimensional scanning module to scan the workpiece surface in sections to ensure uniform light intensity distribution in each area; Step 4: Combined with the environmental compensation module, the light intensity distribution is dynamically corrected according to changes in the external environment; Preferably, the real-time monitoring module includes a light intensity sensor array, a data acquisition unit and an analysis processor. The light intensity sensor array is fixedly mounted on an annular bracket below the laser head, and the annular bracket is connected to the laser head housing by bolts. The light intensity sensor array is composed of multiple independent photodiodes, and the sensing area corresponding to each photodiode is a circular range with a diameter of 5 mm, and there is an overlapping area of ​​1 mm between adjacent sensing areas; the data acquisition unit is connected to the light intensity sensor array through a flexible cable, and one end of the flexible cable is provided with a plug connector, and the other end is fixed in the interface slot of the data acquisition unit by a snap; the analysis processor is connected to the data acquisition unit through a wireless communication module, and the wireless communication module uses a 2.4 GHz frequency band to transmit signals, and the maximum transmission rate is 1 Mbps.

[0008] Preferably, the feedback adjustment module includes a power regulator, a wavelength modulation unit and a beam shaping component, the power regulator is connected to the laser power supply through a wire, and a plug and a socket are respectively provided at both ends of the wire, the plug is connected to the output end of the power regulator, and the socket is connected to the input end of the laser power supply; the wavelength modulation unit is connected to the laser cavity through an optical fiber, one end of the optical fiber is provided with a collimating lens, and the other end is connected to the output end of the wavelength modulation unit through a flange; the beam shaping component includes a variable focus lens group and a reflector group, the variable focus lens group is installed inside the laser head through a slide rail, and positioning holes are provided at both ends of the slide rail, and limit pins are inserted into the positioning holes to fix the position of the variable focus lens group; the reflector group is connected to the laser head housing through a rotating shaft, and an angle adjustment knob is provided at the end of the rotating shaft for manually fine-tuning the angle of the reflector.

[0009] Preferably, the multi-dimensional scanning module includes a three-dimensional motion platform, a scanning path planning unit and a synchronous controller. The three-dimensional motion platform includes linear motors in three directions of X-axis, Y-axis and Z-axis. The linear motors are fixed to the base by screws. A shock-absorbing pad is provided at the bottom of the base. The shock-absorbing pad is made of silicone material and has a thickness of 10 mm. The scanning path planning unit is connected to the synchronous controller through a USB interface. The USB interface supports hot-swap function. The synchronous controller communicates with the linear motor through a CAN bus. The maximum transmission distance of the CAN bus is 40 m, and the maximum number of nodes is 110.

[0010] Preferably, the environmental compensation module includes a temperature sensor, a humidity sensor and an airflow detector. The temperature sensor is mounted on the laser head housing through a magnetic fixing seat, and a rubber pad is provided at the bottom of the magnetic fixing seat to prevent sliding; the humidity sensor is fixed to a bracket near the laser head through a clamp, and the clamp is made of aluminum alloy material and the surface is anodized; the airflow detector is installed in the mounting hole on the side of the laser head through a threaded connection, and a sealing ring is provided on the inner wall of the mounting hole to prevent airflow leakage.

[0011] Another technical problem to be solved by the present invention is to provide a specific operation process of a semiconductor laser cleaning process, comprising the following steps: Step 1: Preparation, check whether each module of the equipment is operating normally, and calibrate the initial position of the laser head; Step 2: Start the real-time monitoring module, obtain the initial light intensity distribution data, and record the baseline value; Step 3: Select the appropriate scanning path according to the material and shape of the workpiece and load it into the scanning path planning unit; Step 4: Start the multi-dimensional scanning module and perform partition scanning on the workpiece surface according to the set path; Step 5: During the scanning process, the real-time monitoring module continuously obtains light intensity distribution data and dynamically adjusts it through the feedback adjustment module; Step 6: After the scan is completed, the light intensity distribution is finally corrected through the environmental compensation module; Preferably, the preparation includes the following steps: 1) Check whether the light intensity sensor array is damaged or loose; 2) Test whether the signal transmission of the data acquisition unit is stable; 3) Calibrate the algorithm model of the analysis processor to ensure its calculation accuracy; 4) Confirm whether the output range of the power regulator meets the requirements; 5) Check whether the running trajectory of the three-dimensional motion platform is accurate; Preferably, when starting the real-time monitoring module, the sensing area of ​​the light intensity sensor array must first be aligned with the beam coverage range of the laser head, and then an initial light intensity distribution map is generated by the analysis processor. The initial light intensity distribution map is displayed in the form of a two-dimensional pseudo-color map, and the color gradient from blue to red represents light intensity from low to high.

[0012] Preferably, the selection of the scanning path varies according to the material of the workpiece. For metal workpieces, the scanning path adopts a spiral distribution with a scanning pitch of 2 mm; for non-metal workpieces, the scanning path adopts a grid distribution with a scanning pitch of 1 mm.

[0013] Preferably, the operating speed range of the multi-dimensional scanning module is 10~50mm / s, and the specific speed is adjusted according to the surface roughness of the workpiece. Workpieces with a roughness less than Ra0.8 are scanned at high speed, and workpieces with a roughness greater than Ra0.8 are scanned at low speed.

[0014] Preferably, the dynamic adjustment frequency of the feedback regulation module is 10 Hz. After each adjustment, the light intensity distribution diagram needs to be regenerated and compared with the reference value. If the deviation exceeds ±5%, the adjustment is continued until the deviation is within the allowable range.

[0015] Preferably, the calibration process of the environmental compensation module includes the following steps: 1) The temperature sensor detects changes in ambient temperature and transmits the data to the analysis processor; 2) The humidity sensor detects changes in ambient humidity and transmits the data to the analysis processor; 3) The airflow detector detects changes in ambient airflow velocity and transmits the data to the analysis processor; 4) The analysis processor combines the three types of data to generate environmental compensation coefficients and applies them to the final correction of the light intensity distribution.

[0016] Compared with the prior art, this application has the following beneficial effects: First, the real-time monitoring of the laser light intensity distribution through the light intensity sensor array can comprehensively capture the changes in light intensity within the coverage area of ​​the beam, avoiding the monitoring blind spot problem caused by relying on only a single sensor in traditional methods; at the same time, through the design of flexible cables and wireless communication modules, an efficient connection between the data acquisition unit and the analysis processor is achieved, reducing interference during signal transmission.

[0017] Secondly, the feedback regulation module achieves precise control of laser output parameters through the synergistic effect of the power regulator, wavelength modulation unit and beam shaping component. The power regulator is responsible for adjusting the laser output power, the wavelength modulation unit is responsible for optimizing the laser wavelength, and the beam shaping component is responsible for improving the beam quality. The three work together to ensure the uniformity and stability of the light intensity distribution.

[0018] Third, the multi-dimensional scanning module can flexibly adjust the scanning path and speed through the cooperation of the three-dimensional motion platform and the scanning path planning unit to meet the cleaning needs of workpieces of different materials and shapes. At the same time, through the design of shock-absorbing pads and sealing rings, it effectively reduces the impact of external vibrations and airflow on scanning accuracy.

[0019] Fourthly, the environmental compensation module can sense changes in the external environment in real time through the joint work of temperature sensors, humidity sensors and airflow detectors, and generate compensation coefficients through analysis processors to dynamically correct the light intensity distribution, thereby improving the adaptability of the equipment in complex environments.

[0020] Fifth, in actual applications, the light intensity distribution diagram generated by the real-time monitoring module can intuitively observe the changing trend of the light intensity distribution, which is convenient for operators to detect problems in time and take corresponding measures; at the same time, the high-frequency dynamic adjustment of the feedback regulation module further improves the stability and consistency of the cleaning process.

[0021] Sixth, the modular design of the entire system makes each part functionally independent and easy to maintain. For example, the light intensity sensor array can be quickly repaired by replacing a single photodiode, and the optical fiber and lens group in the feedback adjustment module can also be removed and replaced individually, which significantly reduces the maintenance cost and time of the equipment.

[0022] Seventh, the partition scanning strategy of the multi-dimensional scanning module can effectively avoid local overheating or incomplete cleaning during large-area cleaning. At the same time, combined with the dynamic correction function of the environmental compensation module, the uniformity and reliability of the cleaning effect are further improved, meeting the modern industry's demand for efficient and intelligent laser cleaning technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the installation structure of the light intensity sensor array in an embodiment of the present invention; Figure 2 for Figure 1 Enlarged view of point A; Figure 3 Schematic diagram of the composition structure of the feedback regulation module; Figure 4 It is a schematic diagram of the three-dimensional motion platform structure of the multi-dimensional scanning module; Figure 5This is a schematic diagram of the sensor layout of the environmental compensation module; Figure 6 Schematic diagram of the generation and adjustment process of the light intensity distribution map.

[0024] The accompanying drawings are numbered as follows: 1. Light intensity sensor array; 2. Flexible cable; 3. Laser head; 4. Power regulator; 5. Wavelength modulation unit; 6. Beam shaping component; 7. Linear motor; 8. Base; 9. Shock pad; 10. Temperature sensor; 11. Humidity sensor; 12. Airflow detector. DETAILED DESCRIPTION

[0025] This embodiment provides a specific implementation method of a method for dynamically balancing light intensity in a semiconductor laser cleaning process. Figures 1 to 5 The method uses a real-time monitoring module to obtain laser light intensity distribution data and generate a light intensity distribution map, uses a feedback adjustment module to adjust the laser output parameters, uses a multi-dimensional scanning module to scan the workpiece surface in sections to ensure uniform light intensity distribution, and combines with an environmental compensation module to dynamically correct external environmental changes.

[0026] like Figure 1-2 As shown, the light intensity sensor array 1 is fixedly mounted on the annular bracket below the laser head 3, and the annular bracket is connected to the outer shell of the laser head 3 by bolts. The light intensity sensor array 1 is composed of a plurality of independent photodiodes, and the sensing area corresponding to each photodiode is a circular range with a diameter of 5 mm, and there is an overlapping area of ​​1 mm between adjacent sensing areas. A plug connector is provided at one end of the flexible cable 2 and is connected to the light intensity sensor array 1, and the other end is fixed in the interface slot of the data acquisition unit by a snap. The data acquisition unit is connected to the analysis processor via a wireless communication module, and the wireless communication module uses a 2.4 GHz frequency band to transmit signals. The sensing area of ​​the light intensity sensor array 1 needs to be aligned with the beam coverage range of the laser head 3 to ensure the accuracy of the monitoring data. The analysis processor generates an initial light intensity distribution map based on the collected data. The initial light intensity distribution map is displayed in the form of a two-dimensional pseudo-color map, and the color gradient from blue to red represents the light intensity from low to high.

[0027] like Figure 3As shown, the feedback regulation module includes a power regulator 4, a wavelength modulation unit 5, and a beam shaping assembly 6. The power regulator 4 is connected to the laser power supply via a wire with a plug and a socket at each end. The plug connects to the output of the power regulator 4, and the socket connects to the input of the laser power supply. The wavelength modulation unit 5 is connected to the laser cavity via an optical fiber. One end of the optical fiber is equipped with a collimating lens, and the other end is connected to the output of the wavelength modulation unit 5 via a flange. The beam shaping assembly 6 includes a variable focus lens assembly and a reflector assembly. The variable focus lens assembly is mounted inside the laser head 3 via a slide rail. The slide rails have positioning holes at each end, and limit pins are inserted into the positioning holes to fix the position of the variable focus lens assembly. The reflector assembly is connected to the laser head 3 housing via a rotating shaft. The end of the rotating shaft has an angle adjustment knob for manually fine-tuning the reflector angle. The power regulator 4 is responsible for adjusting the laser output power, the wavelength modulation unit 5 is responsible for optimizing the laser wavelength, and the beam shaping assembly 6 is responsible for improving the beam quality. These three components work together to ensure uniform and stable light intensity distribution.

[0028] like Figure 4 As shown, the multi-dimensional scanning module includes a three-dimensional motion platform, a scanning path planning unit, and a synchronous controller. The three-dimensional motion platform includes linear motors 7 for the X, Y, and Z axes. These are fixed to a base 8 with screws. A shock-absorbing pad 9 made of silicone and 10 mm thick is located on the bottom of the base 8. The scanning path planning unit connects to the synchronous controller via a hot-swappable USB interface. The synchronous controller communicates with the linear motor 7 via the CAN bus, which has a maximum transmission distance of 40 m and a maximum number of 110 nodes. The operating speed of the linear motor 7 ranges from 10 to 50 mm / s, adjusted based on the workpiece surface roughness. High-speed scanning is used for workpieces with a roughness less than Ra0.8, while low-speed scanning is used for workpieces with a roughness greater than Ra0.8. The scanning path selection varies depending on the workpiece material. For metallic workpieces, a spiral scanning path is used with a 2 mm scanning pitch; for non-metallic workpieces, a grid scanning path is used with a 1 mm scanning pitch.

[0029] like Figure 5As shown, the environmental compensation module includes a temperature sensor 10, a humidity sensor 11 and an airflow detector 12. The temperature sensor 10 is mounted on the outer casing of the laser head 3 through a magnetic fixing seat, and a rubber pad is provided at the bottom of the magnetic fixing seat to prevent sliding. The humidity sensor 11 is fixed to the bracket near the laser head 3 by a clamp. The clamp is made of aluminum alloy material and the surface is anodized. The airflow detector 12 is installed in the mounting hole on the side of the laser head 3 through a threaded connection. A sealing ring is provided on the inner wall of the mounting hole to prevent airflow leakage. The temperature sensor 10 detects changes in ambient temperature and transmits data to the analysis processor, the humidity sensor 11 detects changes in ambient humidity and transmits data to the analysis processor, and the airflow detector 12 detects changes in ambient airflow velocity and transmits data to the analysis processor. The analysis processor integrates the three types of data to generate an environmental compensation coefficient and applies it to the final correction of the light intensity distribution.

[0030] like Figure 6 As shown in the figure, the generation and adjustment process of the light intensity distribution map is as follows: the real-time monitoring module obtains the initial light intensity distribution data and records the reference value. The analysis processor generates the initial light intensity distribution map and transmits it to the feedback adjustment module through the wireless communication module. The feedback adjustment module adjusts the laser output parameters according to the light intensity distribution map, and the adjustment frequency is 10Hz. After each adjustment, the light intensity distribution map is regenerated and compared with the reference value. If the deviation exceeds ±5%, the adjustment is continued until the deviation is within the allowable range. After the multi-dimensional scanning module is started, the workpiece surface is scanned in sections according to the set path. During the scanning process, the real-time monitoring module continuously obtains the light intensity distribution data and dynamically adjusts it through the feedback adjustment module. After the scan is completed, the light intensity distribution is finally corrected through the environmental compensation module.

[0031] The modular design of the entire system allows for independent functionality and easy maintenance. For example, the light intensity sensor array 1 can be quickly repaired by replacing a single photodiode, and the optical fiber and lens assembly in the feedback control module can also be removed and replaced independently. The multi-dimensional scanning module's partitioned scanning strategy effectively prevents localized overheating and incomplete cleaning during large-area cleaning. Combined with the dynamic correction function of the environmental compensation module, this further improves the uniformity and reliability of the cleaning effect.

[0032] In order to better enable relevant personnel in this technical field to fully understand and implement the present invention, the specific implementation principle of the present invention is further supplemented below with reference to a specific application scenario.

[0033] In actual operation, it is necessary to first initialize the various modules of the laser cleaning equipment. The light intensity sensor array 1 is fixed to the ring bracket below the laser head 3 by bolts, and its sensing area is ensured to be precisely aligned with the beam coverage of the laser head 3. One end of the flexible cable 2 is connected to the light intensity sensor array 1, and the other end is fixed in the interface slot of the data acquisition unit by a buckle to ensure the stability of signal transmission. Subsequently, the wireless communication module is started to transmit the collected light intensity distribution data to the analysis processor through the 2.4GHz frequency band. The analysis processor generates an initial light intensity distribution map based on the received data. The distribution map is displayed in the form of a two-dimensional pseudo-color map, and the color gradient from blue to red indicates that the light intensity is from low to high. This step ensures that the real-time monitoring module can accurately capture the changes in light intensity within the beam coverage range.

[0034] Next, the feedback adjustment module starts working. The power regulator 4 is connected to the laser power supply through a wire, the wavelength modulation unit 5 is connected to the laser cavity through an optical fiber, and the beam shaping component 6 is installed inside the laser head 3 through a slide rail and a rotating shaft. When the analysis processor detects that the light intensity distribution deviation exceeds ±5%, the feedback adjustment module will start the adjustment program. The power regulator 4 adjusts the laser output power according to the instructions, the wavelength modulation unit 5 optimizes the laser wavelength, and the beam shaping component 6 improves the beam quality through a variable focus lens group and a reflector group. After each adjustment, the system regenerates the light intensity distribution diagram and compares it with the baseline value until the deviation is controlled within the allowable range. This process achieves uniformity and stability of the light intensity distribution through high-frequency dynamic adjustment.

[0035] The multi-dimensional scanning module plays a key role in the process of partition scanning of the workpiece surface. The linear motor 7 of the three-dimensional motion platform is fixed to the base 8 by screws, and the silicone shock-absorbing pad 9 at the bottom of the base 8 effectively reduces the impact of external vibration on the scanning accuracy. The scanning path planning unit is connected to the synchronous controller through a USB interface, and the synchronous controller communicates with the linear motor 7 through the CAN bus to ensure the precise execution of the scanning path. For metal workpieces, the scanning path adopts a spiral distribution with a scanning spacing of 2mm; for non-metallic workpieces, the scanning path adopts a grid distribution with a scanning spacing of 1mm. The running speed of the linear motor 7 is adjusted according to the surface roughness of the workpiece. Workpieces with a roughness less than Ra0.8 are scanned at high speed, and workpieces with a roughness greater than Ra0.8 are scanned at low speed. This step meets the cleaning needs of workpieces of different materials and shapes by flexibly adjusting the scanning path and speed.

[0036] The environmental compensation module operates continuously throughout the cleaning process. The temperature sensor 10, humidity sensor 11, and airflow detector 12 are mounted near the laser head 3 via a magnetic mount, a clamp, and a threaded connection. The temperature sensor 10 detects changes in ambient temperature, the humidity sensor 11 detects changes in ambient humidity, and the airflow detector 12 detects changes in ambient airflow velocity. These three types of data are transmitted to the analysis processor. The analysis processor integrates this data to generate an environmental compensation coefficient, which is then applied to the final correction of the light intensity distribution. This step enhances the device's adaptability to complex environments through real-time perception and dynamic correction of environmental changes.

[0037] After completing the above steps, the entire cleaning process is complete. The light intensity distribution diagram generated by the real-time monitoring module allows operators to visually observe changing trends in the light intensity distribution, promptly identify problems, and take appropriate measures. The high-frequency dynamic adjustment of the feedback control module, the partitioned scanning strategy of the multi-dimensional scanning module, and the dynamic correction function of the environmental compensation module work together to effectively avoid localized overheating or incomplete cleaning during large-area cleaning, significantly improving the uniformity and reliability of the cleaning effect.

[0038] The modular design of the entire system allows for independent functionality and easy maintenance. For example, the light intensity sensor array 1 can be quickly repaired by replacing a single photodiode, and the optical fiber and lens assembly in the feedback control module can also be removed and replaced independently. This design significantly reduces equipment maintenance costs and time while meeting modern industry's demand for efficient, intelligent laser cleaning technology.

[0039] Any content not described in detail in the specification belongs to the prior art known to those skilled in the art, and the model parameters of each electrical appliance are not specifically limited, and conventional equipment can be used. In this technical solution, electrical control components not mentioned are not shown in the figures because they belong to the prior art and will not be described here.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for dynamic balanced control of light intensity in a semiconductor laser cleaning process, characterized in that The following steps are involved: Step 1: Obtain laser light intensity distribution data through the real-time monitoring module and generate a light intensity distribution map; Step 2: Adjust the laser output parameters using the feedback adjustment module based on the light intensity distribution diagram; Step 3: Use the multi-dimensional scanning module to scan the workpiece surface in sections to ensure uniform light intensity distribution in each area; Step 4: Combine the environmental compensation module to dynamically correct the light intensity distribution according to changes in the external environment.

2. The method for dynamic balanced control of light intensity in a semiconductor laser cleaning process according to claim 1, characterized in that The real-time monitoring module comprises a light intensity sensor array (1), a data acquisition unit and an analysis processor. The light intensity sensor array (1) is composed of a plurality of photodiodes. The sensing area corresponding to each photodiode is a circular range with a diameter of 5 mm. There is an overlapping area of ​​1 mm between adjacent sensing areas. The data acquisition unit is connected to the light intensity sensor array (1) via a flexible cable (2), and the analysis processor is connected to the data acquisition unit via a wireless communication module.

3. The method for dynamic balanced control of light intensity in a semiconductor laser cleaning process according to claim 1, characterized in that The feedback regulation module comprises a power regulator (4), a wavelength modulation unit (5) and a beam shaping component (6), wherein the power regulator (4) is connected to the laser power supply via a wire, the wavelength modulation unit (5) is connected to the laser cavity via an optical fiber, and the beam shaping component (6) comprises a variable focus lens group and a reflector group, wherein the variable focus lens group is installed inside the laser head (3) via a slide rail and fixed in position via a limit pin, and the reflector group is connected to the outer shell of the laser head (3) via a rotating shaft.

4. The method for dynamic balanced control of light intensity in a semiconductor laser cleaning process according to claim 1, characterized in that The multi-dimensional scanning module comprises a three-dimensional motion platform, a scanning path planning unit and a synchronous controller, wherein the three-dimensional motion platform comprises a linear motor (7) in three directions of the X-axis, the Y-axis and the Z-axis, the linear motor (7) being fixed to a base (8) by screws, and a silicone shock-absorbing pad (9) with a thickness of 10 mm is provided at the bottom of the base (8), the scanning path planning unit is connected to the synchronous controller via a USB interface, and the synchronous controller communicates with the linear motor (7) via a CAN bus.

5. The method for dynamic balanced control of light intensity in a semiconductor laser cleaning process according to claim 1, characterized in that The environmental compensation module comprises a temperature sensor (10), a humidity sensor (11) and an airflow detector (12); the temperature sensor (10) is mounted on the outer shell of the laser head (3) via a magnetic fixing seat; the humidity sensor (11) is fixed to the bracket via a clamp; the airflow detector (12) is mounted in a mounting hole on the side of the laser head (3) via a threaded connection; and a sealing ring is provided on the inner wall of the mounting hole.

6. The method for dynamic balanced control of light intensity in a semiconductor laser cleaning process according to claim 1, characterized in that The selection of the scanning path varies depending on the material of the workpiece. For metal workpieces, the scanning path adopts a spiral distribution with a scanning pitch of 2 mm, and for non-metal workpieces, the scanning path adopts a grid distribution with a scanning pitch of 1 mm.

7. The method for dynamic balanced control of light intensity in a semiconductor laser cleaning process according to claim 1, characterized in that The operating speed range of the multi-dimensional scanning module is 10 to 50 mm / s, and the specific speed is adjusted according to the surface roughness of the workpiece. Workpieces with a roughness less than Ra0.8 are scanned at high speed, and workpieces with a roughness greater than Ra0.8 are scanned at low speed.

8. The method for dynamic balanced control of light intensity in a semiconductor laser cleaning process according to claim 1, characterized in that The dynamic adjustment frequency of the feedback regulation module is 10 Hz. After each adjustment, the light intensity distribution diagram is regenerated and compared with the reference value. If the deviation exceeds ±5%, the adjustment is continued until the deviation is within the allowable range.

9. The method for dynamic balanced control of light intensity in a semiconductor laser cleaning process according to claim 1, characterized in that The calibration process of the environmental compensation module includes the following steps: The temperature sensor (10) detects changes in ambient temperature and transmits data to the analysis processor, the humidity sensor (11) detects changes in ambient humidity and transmits data to the analysis processor, and the airflow detector (12) detects changes in ambient airflow velocity and transmits data to the analysis processor. The analysis processor integrates the three types of data to generate an environmental compensation coefficient and applies it to the final correction of the light intensity distribution.

Images