Panel release system and operation method thereof

Abstract

The invention relates to the technical field of semiconductors, in particular to a release station for processing a panel carrier assembly, a panel release system for processing a panel carrier assembly comprising the release station, and a method for operating the panel release system. The release station may include a carrier table having a table top that may support the panel carrier assembly and equipped with a carrier table heater associated with the table top for heating the panel carrier assembly to a release temperature. The release station may also include a release unit having a release head movable toward the table top of the carrier table to contact the molded panel in the panel carrier assembly located on the table top. The panel release system may also include a panel processing station, a carrier processing station, an unloading station, a preheating station, a feeding station, and / or a cutting station.

Description

[0001] Related applications

[0002] This application claims priority to Singapore Patent Application No. 10202401897T filed on June 26, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of semiconductor technology, and more particularly to a panel release system for handling a panel carrier assembly (including a molded panel and a carrier) and an operating method thereof. The panel release system includes a release station for releasing the molded panel from the carrier. Background Art

[0004] In the panel-level packaging process, electronic components (such as chips, wafers, passive components, and metal components) are attached to a first carrier and encapsulated into a molded panel on the first carrier during a first molding process. Subsequently, the molded panel containing the electronic components is released from the first carrier and flipped onto a second carrier to expose the active surfaces of the electronic components, thereby forming circuits on the active surfaces. Finally, the molded panel and the circuits formed thereon undergo a second molding process before being released from the second carrier.

[0005] Conventionally, in the process of releasing the molded panel from the carrier, the molded panel is usually released by means of heating or ultraviolet (UV) light irradiation, which are two main methods of releasing the molded panel.

[0006] To release the molded panel using UV light, a glass carrier is required. A layer of UV release adhesive is applied to the glass carrier. The components involved in the package, such as bare dies and / or silicon wafers and / or passive components and / or metal parts, are then arranged on the glass carrier via the UV release adhesive layer. The encapsulation process then proceeds to form a plastic encapsulation layer on the glass carrier to encapsulate the components on the glass carrier, thus forming the molded panel. To release the molded panel, the back of the glass carrier is irradiated with UV light, separating the molded panel from the glass carrier. However, the UV release method is not ideal because glass is expensive and fragile. Furthermore, the use of a glass carrier limits the size of the carrier, as large glass carriers are generally not suitable due to its brittle nature. Furthermore, the fragile nature of glass requires delicate manual handling during the release and transfer process. For example, the manual peeling and removal of the UV release adhesive layer can easily generate electrostatic discharge, which can lead to significant product quality issues during panel-level packaging.

[0007] In order to release the molded panel using a heating method, a thermal separation adhesive layer is usually laminated on a glass carrier. Then, the components involved in the package are arranged on the glass carrier through the thermal separation adhesive layer, and then the packaging process is carried out to form a plastic sealing layer on the glass carrier to cover the components involved in the package on the glass carrier, thereby forming a molded panel. In order to release the molded panel, heat is applied to the glass carrier to separate the molded panel from the glass carrier. However, applying heat directly to the glass carrier may damage the glass carrier. In addition, heating may also cause uncontrolled warping of the molded panel. In addition, similar to the UV separation method, the use of a glass carrier will limit the size of the carrier. In addition, due to the fragile nature of glass, the use of a glass carrier during the release and transfer process also requires some manual delicate handling. For example, in the process of manually peeling and removing the UV separation adhesive layer, electrostatic discharge may be easily generated, which will lead to major product quality issues in the panel-level packaging process.

[0008] Therefore, a more efficient panel release system and method thereof is needed to solve the above problems, especially the problem of releasing the molded panel with circuits from the second carrier after the second packaging process. Summary of the Invention

[0009] The present application discloses a release station for handling a panel carrier assembly. The release station comprises: a carrier table and a release unit. The carrier table comprises: a first surface capable of supporting the panel carrier assembly, wherein the panel carrier assembly comprises a molded panel attached to the carrier by a heat release tape; and a carrier table heater associated with the first surface of the carrier table, capable of heating the panel carrier assembly to a heat release temperature of the heat release tape when the panel carrier assembly is supported on the first surface of the carrier table. The release unit comprises: a release head movable toward the first surface of the carrier table for engaging with the molded panel in the panel carrier assembly located on the first surface of the carrier table, wherein the release head further comprises: a release head retaining member capable of releasably retaining the molded panel on the first engaging surface of the release head when the molded panel has been separated from the carrier and engaged to the release head. Wherein, after the carrier table heater has heated the panel carrier assembly to the thermal release temperature, and after the release head holding member releasably holds the molded panel on the first joint surface of the release head, the release head can be moved in the direction away from the first table surface of the carrier table, thereby separating the molded panel from the carrier, and the molded panel separated from the carrier is located on the first joint surface of the release head, while the carrier with the thermal release tape is maintained on the first table surface of the carrier table.

[0010] The present application also discloses a panel release system for handling a panel carrier assembly. The panel release system comprises: a release station as described in claim 1; a panel handling station capable of receiving a molded panel separated from the carrier from the release station; and a panel stage capable of moving between the panel handling station and the release station. When the panel stage is located within the release station and aligned with a release head of the release unit, the release head can release the molded panel separated from the carrier onto the panel stage. After the molded panel separated from the carrier is released onto the panel stage, the panel stage can move from the release station to the panel handling station, thereby transporting the molded panel separated from the carrier from the release station to the panel handling station. The panel handling station comprises: a panel handling unit. The panel handling unit further comprises: a panel handling head capable of moving toward the panel stage when the panel stage is located in the panel handling station and holds the molded panel separated from the carrier, for engaging the molded panel separated from the carrier. The panel processing head includes a panel processing head holding component. When the panel processing head moves to engage the molded panel separated from the carrier, the panel processing head can releasably hold the molded panel on the second engaging surface of a panel processing head of the panel processing unit, and move the molded panel separated from the carrier held by it away from the panel table, so as to move the molded panel out of the panel release system.

[0011] The present application further discloses a method for operating the panel release system. The method includes: heating a panel carrier assembly held on the first surface of the carrier table by a carrier table heater associated with the first surface of the carrier table, wherein the panel carrier assembly is heated to a release temperature of the thermal release tape; when the carrier table is aligned with a release head in a release station, moving a release head of the release unit toward the first surface of the carrier table to contact the panel carrier assembly on the first surface of the carrier table and temporarily hold the molded panel at a first engagement surface of the release head; after the carrier table heater has heated the panel carrier assembly to the thermal release temperature, moving the release head temporarily holding the molded panel away from the first surface of the carrier table, thereby separating the molded panel from the carrier, and holding the separated molded panel on the first engagement surface of the release head, while the carrier remains on the first surface of the carrier table. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In the drawings, like reference numerals generally refer to like parts throughout the different views. The drawings are not necessarily drawn to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various embodiments are described with reference to the following drawings, in which:

[0013] According to various embodiments, Figure 1A and Figure 1B A panel release handling system and the release stations therein are schematically shown.

[0014] According to various embodiments, Figure 1C and Figure 1D Schematically shown, with Figure 1A The panel release system of the release station, and the corresponding panel processing station and carrier processing station.

[0015] According to various embodiments, Figure 1E Schematic diagram showing a panel release system with Figure 1C and Figure 1D An unloading station connected to the carrier processing station.

[0016] According to various embodiments, Figure 1F Schematically shown is a panel release system in which the unloading station is directly connected to the releasing station.

[0017] According to various embodiments, Figures 1G to 1J One mode of operation of the tape removal tool is schematically illustrated.

[0018] According to various embodiments, Figures 1K to 1N Another mode of operation of the tape removal tool is schematically shown.

[0019] According to various embodiments, Figure 1O and Figure 1P The operating mechanism of the tape removal tool is schematically shown.

[0020] According to various embodiments, Figure 1Q The panel release system is schematically shown with a preheating station connected to the release station.

[0021] According to various embodiments, Figure 1R The feeding station is schematically shown to be directly connected to the preheating station, wherein the feeding station comprises an alignment unit.

[0022] According to various embodiments, Figure 2A A perspective view schematically illustrates another panel release system.

[0023] According to various embodiments, Figure 2B and Figure 2C Other configurations of panel release systems are shown schematically.

[0024] According to various embodiments, Figure 3A A control unit that may be integrated into a panel release system (eg a release station) is schematically shown.

[0025] According to various embodiments, Figure 3BThe cutting station of the panel release system is shown schematically.

[0026] According to various embodiments, Figure 3C The molded panel is schematically shown with a peripheral edge portion cut away.

[0027] According to various embodiments, Figure 3D The molded panel is schematically shown to be cut into a plurality of unit areas.

[0028] According to various embodiments, Figure 3E Schematically shows a plan view of a release head with a multi-zone vacuum holding device.

[0029] According to various embodiments, Figure 3F A cutting station integrated into a panel release system is schematically shown.

[0030] According to various embodiments, Figure 3G A mode of connecting the cutting station to the feeding station is schematically shown.

[0031] According to various embodiments, Figure 3H Another mode of connecting the cutting station to the feeding station is schematically shown.

[0032] According to various embodiments, Figure 4 A perspective view schematically illustrates another panel release system.

[0033] According to various embodiments, Figures 5A to 5F A schematic diagram schematically illustrates the first and second release processes.

[0034] Reference numerals:

[0035] 1000, 2000, 4000 panel release system, 101 molded panel, 301a first molded panel, 301b second molded panel, 101a peripheral edge portion, 101b inner central portion, 101c unit area, 102 thermal release tape, 102a heat-sensitive adhesive layer, 102b pressure-sensitive adhesive layer, 102c base layer, 102d carrier first edge portion, 102e carrier second edge portion, 1022 peripheral portion, 1022a first peripheral portion, 1022b second peripheral portion, 1022c middle peripheral portion, 1024 remaining portion, 1026, 312 raised portion, 103 carrier body, 104 panel carrier assembly, 504a first panel carrier assembly, 504b second panel carrier assembly, 110, 210 release station, 111 carrier table, 111a first table surface, 112 carrier table heater, 113 carrier table holder, 115 release unit, 116 release head, 116a first bonding surface, 117 release head heater, 118 release head holder, 120, 220 panel processing station, 121 panel table, 121a second table surface, 122 first temperature regulating heater, 123 panel table holder, 125 panel processing unit, 126 panel processing head, 126a second bonding surface, 127 second Temperature regulating heater, 128 panel processing head holder, 131, 314 tape removal tool, 132 separation auxiliary tool, 133 plowing member, 134 blade, 134a first blade, 134b second blade, 134c third blade, 139 blade support head, 139a first edge portion of blade support head, 139b second edge portion of blade support head, 139c inner portion, 137 clamping mechanism, 1372 first clamping finger, 1374 second clamping finger, 130, 230 carrier processing station, 135 carrier processing unit, 136 carrier processing head, 136a third joint surface, 138 carrier processing head holder, 14 0, 240 unloading station, 141 unloading tray, 150, 250 preheating station, 151 preheating table, 151a third table surface, 152 first preheater, 153 preheating table holder, 154 alignment structure, 155 preheating unit, 156 preheating head, 156a fourth joint surface, 157 second preheater, 158 preheating head holder, 160, 260 feeding station, 161 feeding mechanism, 161a conveying surface, 165 alignment unit, 166 alignment head, 166a fifth joint surface, 168 alignment head holder, 170, 470 cutting station, 171 cutting table, 173 cutting table holder, 179 cutter, 180,480 control unit, 182a first alignment element, 182b second alignment element, 190 multi-zone vacuum holding device, 190a first vacuum holding area, 190b second vacuum holding area, 190c third vacuum holding area, 191 main vacuum suction port, 192 auxiliary vacuum suction port, 193a first pump, 193b second pump, 193c third pump, 194a first valve, 194b second valve, 194c third valve, 195a first filter, 195b second filter, 195c third filter, 196a first sensor, 196b second sensor, 196c third sensor, 4001 conveying mechanism, 116p release head moving plane, 126p panel processing head moving plane, 136p carrier processing head moving plane, 136r carrier processing unit rotation axis, 156p preheating head Moving plane, 156r preheating head rotation axis, 166p alignment head moving plane, 166r alignment unit rotation axis, 111p carrier stage moving plane, 121p panel stage moving plane, 226q panel processing head lateral moving plane, 141p, 241p unloading tray moving planes, 151p preheating table moving plane, 161p feed mechanism moving plane, 166q alignment head lateral moving plane, 300 first release process, 302 semiconductor chip, 304 first molding layer, 306 first carrier, 308 first thermal release tape, 3082 first thermal release tape peripheral portion, 310 ejector pin, 3012 panel active surface, 320 second release process, 322 second carrier, 324 second thermal release tape, 326 panel-level circuit, 328 second molding layer, 229 panel processing guide rail, 80 actuator. DETAILED DESCRIPTION

[0036] The embodiments described in the context of the following apparatus are analogously valid for the corresponding methods, and vice versa.In addition, it is understood that the embodiments described below may be combined, for example, part of one embodiment may be combined with part of another embodiment.

[0037] It should be understood that the terms "upper," "upper," "top," "bottom," "lower," "side," "rear," "left," "right," "front," "lateral," "side," "upper," "lower," etc., when used in the following description, are for convenience and to aid understanding of relative positions or directions, and are not intended to limit the orientation of any device, or structure, or any part of any device or structure. In addition, singular terms may include plural references unless the context clearly indicates otherwise. Similarly, the word "or" is intended to include "and" unless the context clearly indicates otherwise.

[0038] According to various embodiments, Figure 1A and Figure 1B A release station 110 and a panel release system 1000 are shown.

[0039] According to various embodiments, processing the molded panel 101 may include releasing the molded panel 101. The molded panel 101 may be attached to the carrier 103 by a thermal release tape (also referred to as a thermal release film) 102. The thermal release tape 102 may be sandwiched between the molded panel 101 and the carrier 103 to secure the molded panel 101 to the carrier 103, forming a panel-carrier assembly 104. For example, the molded panel 101 may encapsulate a plurality of electronic components, such as one or more wafers, chips, passive components (such as capacitors, resistors, etc.), and / or metal parts. The carrier 103 may be a supporting substrate, such as a temporary or reusable substrate, that facilitates handling, transport, and transportation of the molded panel 101 before it is released from the carrier 103. The carrier 103 may have a planar or substantially planar structure and may be made of a single material or a composite material, such as a metal or a metal alloy, such as a steel alloy, in particular a steel alloy 46. The material used to make the carrier 103 may have one or more of the following properties: high temperature resistance, high mechanical strength, good thermal stability, dimensional stability under thermal cycling, hardness, good toughness, durability, high thermal conductivity, good thermal conductivity, and compatibility with the thermal release tape 102 (e.g., no chemical reaction with the thermal release tape 102). The use of durable materials allows the carrier 103 to withstand various process conditions and handling procedures, such as mechanical handling, thereby supporting efficient and scalable panel-level manufacturing processes.

[0040] According to various embodiments, heating the thermal release tape 102 of the panel carrier assembly 104 to a predetermined or specific temperature, referred to as the thermal release temperature, may cause the thermal release tape 102 to adhere to one side of the molded panel 101 to be reduced in adhesion or even lost. Figure 1A -a is shown by the oval dotted line mark, and the heat release tape 102 has a heat-sensitive adhesive layer 102a, a relative pressure-sensitive adhesive layer 102b, and a base layer 102c sandwiched between the two. The heat-sensitive adhesive layer 102a and the pressure-sensitive adhesive layer 102b are in contact with the molded panel 101 and the carrier 103, respectively. When a predetermined temperature is reached, the heat-sensitive adhesive layer 102a loses its stickiness and can be separated from the molded panel 101; at this time, the pressure-sensitive adhesive layer 102b can still maintain adhesion to the carrier 103. The base layer 102c provides mechanical support for the heat-sensitive adhesive layer 102a and the pressure-sensitive adhesive layer 102b. Optionally, the heat release temperature is about 210°C.

[0041] According to various embodiments, referring to Figure 1A The panel release system 1000 may include a release station 110 . The release station 110 may process the panel carrier assembly 104 so that the molded panel 101 may be released or separated from the carrier 103 .

[0042] According to various embodiments, the release station 110 may include a carrier table 111, such as an independent or dedicated table, workbench, platform, stand, etc. The carrier table 111 may have a first surface 111a (e.g., an upper surface or an upward-facing surface) for supporting the panel carrier assembly 104. Specifically, the first surface 111a of the carrier table 111 is capable of supporting the panel carrier assembly 104 in a specific orientation, i.e., the molded panel 101 is located on the top or upper side of the panel carrier assembly 104. Therefore, when the panel carrier assembly 104 is placed or supported on the first surface 111a of the carrier table 111, the carrier 103 therein is located between the carrier table 111 and the molded panel 101.

[0043] According to various embodiments, the panel carrier assembly 104 can be delivered to the release station 110 with the molded panel 101 on its upper side. For example, the release station 110 can be a separate machine connected to one or more components of the panel release system 1000. Alternatively, the release station 110 can be an intermediate component of the panel release system 1000, receiving the panel carrier assembly 104 from other components of the panel release system 1000 via a transport mechanism (e.g., one or more movable tables and / or actuating components of the panel release system 1000). Alternatively, the release station 110 can be the first component of the panel release system 1000. The panel carrier assembly 104 can be fed into the release station 110 by a feeder mechanism or manually. Thus, the release station 110 can receive the panel carrier assembly depending on the configuration of the panel release system 1000 and the overall production, manufacturing, assembly, or packaging process.

[0044] According to various embodiments, the carrier table 111 may include a carrier table heater 112 for heating the panel carrier assembly 104 while the panel carrier assembly 104 is on the carrier table 111 (e.g., while the carrier table 111 is within the release station 110). The carrier table heater 112 may be associated with the first surface 111a of the carrier table 111 such that the carrier table heater 112 heats the panel carrier assembly 104 when the panel carrier assembly 104 is in contact with the first surface 111a of the carrier table 111. For example, the carrier table heater 112 may be disposed on the first surface 111a of the carrier table 111 so as to form a direct or indirect thermal conductive connection with the panel carrier assembly 104 positioned on the first surface 111a. In other words, the carrier table heater 112 may be directly or indirectly thermally coupled to the panel carrier assembly 104 when the panel carrier assembly 104 is on the first surface 111a of the carrier table 111. For example, the carrier table heater 112 can be positioned along the first surface 111a of the carrier table 111, in direct contact with the panel carrier assembly 104 when the panel carrier assembly 104 is positioned on the first surface 111a. The carrier table heater 112 can be embedded within the first surface 111a, embedded within a superstructure of the carrier table 111d proximate to the first surface 111a, or otherwise coupled to the first surface 111a, for example, positioned below the first surface 111a so as to heat the first surface 111a, for example, by heat transfer. Thus, the first surface 111a can transfer heat from the carrier table heater 112 to the panel carrier assembly 104. The first surface 111a can include or be made of a thermally conductive or heat-conductive material. Optionally, a layer of thermal interface material is disposed on the first surface 111a (e.g., between the first surface 111a and the panel carrier assembly 104). Thus, the carrier 103 in the panel carrier assembly 104 can be in direct or indirect thermal contact with the first surface 111a of the carrier table 111 and / or the carrier table heater 112. Optionally, the carrier table heater 112 can include a heating plate. Optionally, the heating plate can constitute or function as the first surface 111a of the carrier table 111. Alternatively, the heating plate can be independent of the first surface 111a of the carrier table 111. For example, the independent heating plate can be positioned below the first surface 111a and thermally coupled thereto. It will be appreciated that the carrier table heater 112 can be implemented in any other suitable manner, including but not limited to a solid-state heating element, a radiant heating device, for example, directly or indirectly coupled to the carrier table 111, or any other suitable configuration capable of achieving the desired thermal effect. Optionally, the carrier table heater 112 can provide heating based on a heating control signal. The heating control signal can be transmitted to the carrier table heater 112 while or after the panel carrier assembly 104 is positioned on the carrier table 111 (e.g., within the release station 110).Optionally, the carrier stage 111 includes a sensor for detecting contact or coupling between the carrier stage 111 and the panel carrier assembly 104 to trigger a heating control signal.

[0045] According to multiple embodiments, when the panel carrier assembly 104 is located on the first table surface 111a of the carrier table 111, the carrier table heater 112 can heat the panel carrier assembly 104 to the heat release temperature of the thermal release tape 102 and maintain the heat release temperature for a certain period of time until the adhesion strength between the thermal release tape 102 and the molded panel 101 is weakened or reduced, thereby enabling the molded panel 101 to be separated from the carrier 103.

[0046] According to various embodiments, the release station 110 may include a release unit 115. Optionally, the release unit 115 includes a release head 116 as a driving component. Optionally, the release head 116 is located within the release station 110, opposite to and / or above the carrier stage 111. For example, in the release station 110, the carrier stage 111 may be located in a lower area, while the release head 116 may be located in an upper area.

[0047] According to various embodiments, the release head 116 can move along a release head movement plane 116p within the release station 110. The release head movement plane 116p can be a substantially flat plane and can be oriented substantially vertically (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is positioned vertically and / or facing upward on the ground). Specifically, when the carrier table 111 is positioned within the release station 110, the release head movement plane 116p can be aligned with (e.g., intersect with) the carrier table 111 (e.g., the first table surface 111a thereof). Alternatively, the release unit 115 can operate in a manner similar to a pressing device or a press device, wherein the release head 116 can move in an upward and downward direction (e.g., in relatively linear directions) within a release head movement plane 116p to engage the panel carrier assembly 104 when the panel carrier assembly 104 is aligned with and / or positioned below the release head 116 and / or to at least lift the molded panel 101 of the panel carrier assembly 104 away from the carrier table 111. Thus, when the carrier table 111 is positioned within the release station 110 and aligned with the release head 116, the release head 116 can move toward the first surface 111a of the carrier table 111 to engage the molded panel 101 of the panel carrier assembly 104 positioned on the first surface 111a of the carrier table 111. The movement of the release head 116 along the release head movement plane 116p can be based on a movement signal. The movement signal can be transmitted to the release head 116 or an actuator connected thereto to instruct the release head 116 to move.

[0048] According to various embodiments, the release head 116 may include one or more release head holders 118 for releasably holding (e.g., releasably clamping or securing) the molded panel 101 of the panel carrier assembly 104, or the molded panel 101 separated from the carrier 103, to a contact surface of the release head 116, e.g., a downwardly facing surface. Optionally, the release head holder 118 is located at or near the contact surface of the release head 116. For example, the release head holder 118 may include a vacuum suction mechanism (e.g., a vacuum plate, vacuum suction holes, vacuum cups, etc.), a clamping mechanism (e.g., a fixture or clamp), an electrostatic chuck, an end effector, etc. Optionally, the operation of the release head holder 118 may be based on a holding control signal. The holding control signal may be transmitted to the release head holder 118 to instruct the release head holder 118 to perform the operation.

[0049] Therefore, after the carrier table heater 112 of the carrier table 111 heats the panel carrier assembly 104 to the heat release temperature, until the heat-sensitive adhesive layer 102a of the heat release tape 102 loses adhesion to the mold panel 101, while the release head holder 118 releasably holds the mold panel 101 on the contact surface of the release head 116, the release head 116 can be moved away from the table surface of the carrier table 111, for example, upward, thereby releasing or separating the mold panel 101 from the carrier 103. In particular, once the adhesion strength between the mold panel 101 and the heat release tape 102 of the panel carrier assembly 104 is weakened or reduced to a certain extent, the release head 116 can only lift the mold panel 101, that is, enough to separate the mold panel 101 from the underlying carrier 103. When the mold panel 101 is lifted, the carrier 103 and the heat release tape 102 remain on the first table surface 111a of the carrier table 111.

[0050] According to various embodiments, the release head 116 may include a release head heater 117, such as a heater or a heating plate, and the release head heater 117 may be associated with the contact surface of the release head 116. For example, the release head heater 117 may be disposed at the contact surface of the release head 116. Optionally, the release head heater 117 may cooperate with the carrier table heater 112 to heat the panel carrier assembly 104, that is, when the panel carrier assembly 104 is located between the carrier table 111 and the release head 116, in other words, when the panel carrier assembly 104 is located on the first table surface 111a of the carrier table 111 and the contact surface of the release head 116 engages with the panel carrier assembly 104, so that the panel carrier assembly 104 reaches and is maintained at a thermal release temperature, thereby weakening or reducing the adhesion strength between the thermal release tape 102 and the molded panel 101, so that the release head 116 can subsequently lift and separate the molded panel 101 from the carrier 103. In other words, heat can be applied to both sides of the panel carrier assembly 104 to weaken the adhesion strength between the thermal release tape 102 and the molded panel 101. Optionally, the release head heater 117 can provide heating based on a heating control signal. Optionally, the heating control signal can be transmitted to the release head heater 117 when the release head 116 is engaged with the molded panel 101 and the carrier stage 111 is engaged with the carrier 103, thereby cooperating with the carrier stage heater 112 to heat the panel carrier assembly 104. Optionally, the release station 110 (e.g., the release head 116) can also include a sensor for detecting the engagement between the release head 116 and the panel carrier assembly 104, thereby triggering the heating control signal.

[0051] According to various embodiments, the carrier stage 111 may include one or more carrier stage holders 113 for releasably holding (e.g., releasably clamping or fixing) the carrier 103 of the panel carrier assembly 104 on the first surface 111a of the carrier stage 111. Optionally, the carrier stage holder 113 is associated with the first surface 111a of the carrier stage 111, for example, located above or adjacent to the first surface 111a. Optionally, the carrier stage holder 113 includes a vacuum suction mechanism (e.g., a vacuum plate, vacuum suction holes, vacuum suction cups, etc.), a clamping mechanism (e.g., a clamp or a clamp), an electrostatic chuck, an end effector, etc. Alternatively, to facilitate separation of the molded panel 101 from the carrier 103, the carrier stage holder 113 may hold the carrier 103 on the first table surface 111a of the carrier stage 111, while the release head 116 may releasably hold the molded panel 101 on its engagement surface and lift the molded panel 101 from the carrier 103. Alternatively, the operation of the carrier stage holder 113 may be based on a holding control signal. Alternatively, the holding control signal may be transmitted to the carrier stage holder 113 to instruct the carrier stage holder 113 to perform a holding operation.

[0052] According to various embodiments, Figure 1C and Figure 1D Shown with Figure 1A The panel release system 1000 of the release station, and the corresponding panel processing station 120 and carrier processing station 130.

[0053] According to various embodiments, the panel release system 1000 may include one or more other components connected to the release station 110. Optionally, the other components may be connected to each other via a transport or conveying mechanism, such as one or more movable platforms and / or drive members.

[0054] According to various embodiments, Figure 1C and Figure 1D As shown, the panel release system 1000 may include a panel processing station 120 and / or a carrier processing station 130 , each connected to the release station 110 .

[0055] According to various embodiments, the panel processing station 120 can receive the molded panel 101 separated from the carrier 103 from the releasing station 110 . In other words, the separated molded panel 101 can be transported or moved from the releasing station 110 to the panel processing station 120 .

[0056] According to various embodiments, the panel handling station 120 may include a panel table 121, such as a deck, a workbench, a platform, a table, or the like, movable between the panel handling station 120 and the release station 110 for transferring the separated molded panels 101 from the release station 110 to the panel handling station 120. Specifically, the panel table 121 is movable at least from the release station 110 to the panel handling station 120 for transferring the separated molded panels 101 from the release station 110 to the panel handling station 120. Thus, the panel table 121 may correspond to an independent conveyor. The panel table 121 may be movable along a panel table moving plane 121p extending between the panel handling station 120 and the release station 110. The panel table moving plane 121p may be a substantially flat surface and may be oriented substantially horizontally (e.g., relative to a base of the panel release system 1000 and / or when the panel release system 1000 is positioned vertically and / or facing upward on the ground). The panel stage movement plane 121p may be non-parallel to the release head movement plane 116p, for example, perpendicular or substantially perpendicular. The panel release system 1000 may include a corresponding guide rail, track, or slide, such as a linear guide rail, track, or slide, as a guide element extending between the panel processing station 120 and the release station 110, guiding the panel stage 121 along the guide rail. The panel stage 121 may be movable within the panel stage movement plane 121p in a transverse or lateral direction (e.g., a relative linear direction), i.e., moving from the panel processing station 120 to the release station 110, or moving from the release station 110 to the panel processing station 120. The movement of the panel stage 121 along the panel stage movement plane 121p may be based on a movement signal. Optionally, the movement signal may be transmitted to the panel stage 121 or an actuator connected thereto to instruct the movement of the panel stage 121.

[0057] According to various embodiments, after the molded panel 101 is released or separated from the carrier 103 (at the release station 110 ), the panel table 121 may be moved into the release station 110 , aligned with the release head 116 , so as to be able to receive the separated molded panel 101 from the release head 116 .

[0058] Specifically, when the panel table 121 is positioned in the release station 110 and aligned with the release head 116, the release head 116 may release the separated molded panel 101 onto the panel table 121. Alternatively, when the separated molded panel 101 is located on the panel table 121, the panel table 121 may be moved out of the release station 110 and into the panel processing station 120, thereby transferring the separated molded panel 101 from the release station 110 to the panel processing station 120.

[0059] According to various embodiments, the panel stage moving plane 121p of the panel stage 121 may be aligned with the carrier stage moving plane 111p of the carrier stage 111. Figure 1D, as described below, are spatially separated and / or parallel to each other. Therefore, when the panel stage 121 moves to the release station 110, the panel stage 121 can be located above the carrier stage 111 or its moving plane 111p, thereby being aligned with the release head 116 and / or the separated molded panel 101 held therein. It is understood that the panel stage moving plane 121p can also be located below the carrier stage moving plane 111p. Therefore, the carrier stage 111 can move along the carrier stage moving plane 111p, and the panel stage 121 can also move along the panel stage moving plane 121p, with the carrier stage moving plane 111p and the panel stage moving plane 121p being parallel to each other and / or spaced apart from each other.

[0060] According to various embodiments, the carrier stage 111 can be moved into and out of the release station 110 synchronously with the panel stage 121. Thus, the carrier stage 111 can be moved out of the release station 110 to facilitate the entry of the panel stage 121 into the release station 110 and / or alignment with the release head 116 within the release station 110. Optionally, the carrier stage 111 and the panel stage 121 can move along the same plane, or can each move along two different and spatially separated planes, for example, one plane being positioned above the other plane.

[0061] According to various embodiments, after the panel stage 121 is aligned with the release head 116, the release head 116 may move toward the panel stage 121 (together with the separated molded panel 101 held thereby) to release the separated molded panel 101 onto the panel stage 121. Specifically, the release head 116 may move downward along a release head movement plane 116 p until the separated molded panel 101 approaches or contacts the second surface 121 a of the panel stage 121, e.g., the upper surface thereof, and then release the separated molded panel 101 onto the panel stage 121. After placing the separated molded panel 101 onto the panel stage 121, the release head 116 may move in the opposite direction, i.e., away from the panel stage 121, to facilitate the panel stage 121 (now holding the separated molded panel 101) to be removed from the release station 110 and into the panel processing station 120.

[0062] According to various embodiments, the panel processing station 120 may include a panel processing unit 125. Optionally, the panel processing unit 125 includes a panel processing head 126. Optionally, when in the panel processing station 120, the panel processing head 126 is located opposite and / or above the panel stage 121. For example, the panel stage 121 may be located in a lower area, while the panel processing head 126 may be located in an upper area.

[0063] According to various embodiments, the panel processing head 126 can be oriented along a panel processing head movement plane 126p. The panel processing head movement plane 126p can be a substantially flat plane and can be oriented substantially vertically (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is configured to be placed upright on an external floor). Thus, the panel processing head movement plane 126p within the panel processing station 120 can be parallel or substantially parallel to the release head movement plane 116p within the release station 110. Furthermore, the panel processing head movement plane 126p can be non-parallel to the panel table movement plane 121p, e.g., perpendicular or substantially perpendicular. When both the panel table 121 and the panel processing head 126 are within the panel processing station 120, the panel processing head movement plane 126p can be aligned with the panel table 121, e.g., intersecting its second table surface 121a. The panel handling unit 125 can operate in a manner similar to a laminating device or a press device, wherein the panel handling head 126 can move upward and downward, e.g., in opposite linear directions, along a panel handling head movement plane 126p. This configuration allows the panel handling head 126 to engage the separated molded panel 101 when the separated molded panel 101 is aligned with and / or positioned below the panel handling head 126, and / or can lift the separated molded panel 101 from the panel table 121, e.g., move it away from the panel table 121. Thus, when the panel table 121 is within the panel handling station 120 and / or aligned with the panel handling head 126, the panel handling head 126 can move toward the second surface 121a of the panel table 121, e.g., in a downward direction, to engage the separated molded panel 101 positioned on the second surface 121a, e.g., to transfer the separated molded panel 101 from the panel table 121 to the panel handling head 126. The movement of the panel processing head 126 along the panel processing head movement plane 126p may be based on a movement signal. Optionally, the movement signal may be transmitted to the panel processing head 126 to instruct the movement thereof.

[0064] According to various embodiments, the panel processing head 126 may include one or more panel processing head holders 128 for releasably holding (e.g., releasably clamping or fixing) the separated molded panel 101 to the second mating surface 126a of the panel processing head 126, e.g., the downwardly facing surface. Optionally, the panel processing head holder 128 is associated with the second mating surface 126a of the panel processing head 126, e.g., located at or near the mating surface. Optionally, the panel processing head holder 128 includes a vacuum adsorption mechanism (e.g., a vacuum plate, vacuum suction holes, vacuum suction cups, etc.), a clamping mechanism (e.g., a clamp or fixture), an electrostatic suction cup, an end effector, etc. Optionally, the panel processing head holder 128 may operate based on a holding control signal. Optionally, the holding control signal may be transmitted to the panel processing head holder 128 to instruct its operation.

[0065] According to an embodiment, the panel processing head 126 may further include a second temperature regulating heater 127 for regulating the temperature of the separated molded panel 101 , for example, to a temperature lower than the heat release temperature.

[0066] According to various embodiments, the second temperature regulating heater 127 can be disposed at the second engaging surface 126a of the panel processing head 126 so as to regulate the temperature of the separated molded panel 101 when the second engaging surface 126a of the panel processing head 126 engages the separated molded panel 101. For example, the second temperature regulating heater 127 can be disposed at the second engaging surface 126a of the panel processing head 126 so as to form a thermal conduction or thermal coupling with the separated molded panel 101 releasably secured to the engaging surface. Alternatively, the second temperature regulating heater 127 can be in direct contact with the separated molded panel 101. Alternatively, the second temperature regulating heater 127 can be embedded in the engaging surface or embedded in the lower portion of the panel processing head 126 having the engaging surface, or can be connected to the engaging surface in a manner capable of heating or regulating the temperature of the engaging surface, for example, disposed behind or to the rear side of the engaging surface so as to conduct heat (e.g., in a controlled manner) to the engaging surface. The joint surface can conduct heat or thermal energy from the separated molded panel 101 to the second temperature regulating heater 127. Therefore, the joint surface can be composed of a thermally conductive material. Optionally, a thermal interface material layer can be provided on the joint surface, for example, between the joint surface and the separated molded panel 101. Therefore, the separated molded panel 101 can be in direct or indirect thermal contact with the second joint surface 126a of the panel processing head 126 and / or the second temperature regulating heater 127. The second temperature regulating heater 127 of the panel processing head 126 can have a heating plate. Optionally, the heating plate can constitute the second joint surface 126a of the panel processing head 126. Alternatively, the heating plate can be provided independently of the second joint surface 126a of the panel processing head 126. For example, an independent heating plate can be provided at a position adjacent to the joint surface, for example, behind the joint surface, and thermally coupled to the joint surface. It will be appreciated that the second temperature regulating heater 127 of the panel processing head 126 may also be implemented in any other suitable form to achieve the above-mentioned functions, including but not limited to a solid-state heating element, a radiant heating device (e.g., directly or indirectly coupled to the second engaging surface 126a of the panel processing head 126), or any other suitable configuration capable of achieving the desired thermal effect. Optionally, the second temperature regulating heater 127 of the panel processing head 126 may be temperature regulated according to a temperature regulating control signal. Optionally, the temperature regulating control signal may be transmitted to the second temperature regulating heater 127 of the panel processing head 126 after the molded panel 101 is separated and engaged with the panel processing head 126. Therefore, the panel release system 1000 or the panel processing station 120 (e.g., the panel processing head 126) may include a sensor that detects the engagement between the panel processing head 126 and the separated molded panel 101, for triggering the temperature regulating control signal.

[0067] According to various embodiments, the second temperature regulating heater 127 of the panel processing head 126 regulates the temperature of the panel processing head 126 (e.g., its interface) and the separated molded panel 101 to a temperature between the heat release temperature and the ambient temperature, i.e., below the heat release temperature. Alternatively, when the separated molded panel 101 is transferred from the release station 110 to the panel processing station 120 via the panel stage 121, the molded panel 101 may be at or near the heat release temperature. Simultaneously, the temperature of the second temperature regulating heater 127 of the panel processing head 126 (or its interface) may be between the ambient temperature and the heat release temperature, i.e., higher than the ambient temperature but lower than the heat release temperature and / or lower than the temperature of the separated molded panel 101. In this manner, when the panel handling head holder 128 is engaged with the separated molded panel 101, the second temperature regulating heater 127 enables the panel handling head 126 to act as a thermal buffer, allowing heat to be transferred from the separated molded panel 101 to the panel handling head 126, thereby initiating a controlled and / or progressive cooling process of the separated molded panel 101. Because the temperature difference between the panel handling head 126 and the separated molded panel 101 may be less than the temperature difference between the separated molded panel 101 and the ambient temperature, the cooling rate of the separated molded panel 101 can be regulated or controlled while the separated molded panel 101 is releasably retained on the panel handling head 126 and / or in a thermally conductive or thermally coupled state with the second temperature regulating heater 127. This progressive cooling process or gradual temperature reduction helps minimize thermal stresses and reduces or eliminates the potential risk of panel warping or deformation.

[0068] According to various embodiments, the panel stage 121 can serve as another thermal buffer. For example, the panel stage 121 can include a first temperature-regulating heater 122, which functions as an auxiliary temperature-regulating heater or temperature-regulating element. Optionally, when the separated molded panel 101 is held on the supporting surface of the panel stage 121, the first temperature-regulating heater 122 can maintain the separated molded panel 101 at a temperature between the heat release temperature and the ambient temperature, i.e., regulate its temperature to a temperature below the heat release temperature.

[0069] According to various embodiments, a first temperature-regulating heater 122 may be associated with the support surface of the panel stage 121. When the support surface is in contact with the separated molded panel 101, the first temperature-regulating heater 122 can maintain the separated molded panel 101 at a temperature between the heat release temperature and the ambient temperature. For example, the first temperature-regulating heater 122 can be disposed on the support surface of the panel stage 121 so as to be in thermal communication or thermally coupled with the separated molded panel 101 transferred from the release head 116 to the support surface. Alternatively, the first temperature-regulating heater 122 can be arranged along the support surface of the panel stage 121 so as to be in direct contact with the separated molded panel 101. Alternatively, the first temperature-regulating heater 122 can be embedded within the support surface or in an upper region of the panel stage 121 having the support surface, or can be configured to be coupled to the support surface (e.g., disposed below the support surface), thereby heating or temperature-regulating the support surface, for example, by conducting heat to the support surface in a controlled manner. Therefore, the supporting surface can conduct or transfer heat or thermal energy from the separated molded panel 101 to the first temperature regulating heater 122. Optionally, the supporting surface of the panel stage 121 can be composed of a heat conductive material or a heat conducting material. Optionally, a thermal interface material layer can be provided on the supporting surface, for example, between the supporting surface and the separated molded panel 101. Thus, the separated molded panel 101 can be in direct or indirect thermal contact with the supporting surface and / or the first temperature regulating heater 122 of the panel stage 121. Optionally, the first temperature regulating heater 122 of the panel stage 121 can have a heating plate. Optionally, the heating plate can constitute the supporting surface of the panel stage 121. Optionally, the heating plate can be provided separately from the supporting surface of the panel stage 121. For example, an independent heating plate can be placed below the supporting surface and thermally coupled to the supporting surface. It is understood that the first temperature regulating heater 122 of the panel stage 121 can achieve its above-mentioned functions in any other suitable form, including but not limited to a solid-state heating element, a radiant heating device (e.g., directly or indirectly coupled to the supporting surface of the panel stage 121), or any other suitable configuration that can achieve the desired thermal effect. Optionally, the first temperature regulating heater 122 of the panel stage 121 can be temperature-regulated based on a temperature regulation control signal. When the molded panel 101 is separated from the carrier 103 and is held or in contact with the panel stage 121, the temperature regulation control signal can be transmitted to the first temperature regulating heater 122. For example, the panel release system 1000 or the panel handling station 120 (e.g., the panel stage 121) can include a sensor for detecting the holding or contact between the panel stage 121 and the separated molded panel 101, thereby triggering the temperature regulation control signal.

[0070] According to various embodiments, the first temperature-regulating heater 122 of the panel stage 121 can regulate the temperature of the panel stage 121 and the separated molded panel 101 to a temperature between the heat release temperature and the ambient temperature, i.e., a temperature below the heat release temperature. Specifically, the temperature of the first temperature-regulating heater 122 can be controlled or regulated by a heater so that it is between the heat release temperature and the ambient temperature; more specifically, above the ambient temperature but below the heat release temperature, and / or below the temperature of the separated molded panel 101. In this manner, when the first temperature-regulating heater 122 is in operation and in contact with the separated molded panel 101, the panel stage 121 can act as a thermal buffer, allowing heat to be transferred from the separated molded panel 101 to the panel stage 121, thereby performing a controlled and gradual cooling process on the separated molded panel 101 on the panel stage 121.

[0071] According to various embodiments, when both the panel stage 121 and the panel processing head 126 include respective first and second temperature regulating heaters 122 and 127, the separated molded panel 101 can first be gradually cooled to a first temperature (e.g., a temperature lower than the heat release temperature but higher than the ambient temperature) by the panel stage 121 (i.e., by the first temperature regulating heater 122), and then gradually cooled to a second temperature (lower than the first temperature) by the panel processing head 126 (i.e., by the second temperature regulating heater 127). Therefore, the first temperature regulating heater 122 of the panel stage 121 can regulate the temperature of the panel stage 121 and the separated molded panel 101 in contact therewith to a temperature between the heat release temperature and the first temperature, while the second temperature regulating heater 127 of the panel processing head 126 can regulate the temperature of the panel processing head 126 and the separated molded panel 101 in contact therewith to a temperature between the first and second temperatures.

[0072] According to various embodiments, the panel stage 121 may include one or more panel stage holders 123 that releasably hold (e.g., releasably clamp or fix) the separated molded panel 101 on a supporting surface (e.g., an upward-facing surface) of the panel stage 121. Optionally, the panel stage holder 123 may be disposed on or near the supporting surface of the panel stage 121, for example, at or near the supporting surface. Optionally, the panel stage holder 123 may include a vacuum adsorption mechanism (e.g., a vacuum suction cup plate, vacuum suction holes, vacuum suction cups, etc.), a clamping mechanism (e.g., a clamp or a clamp), an electrostatic chuck, an electric end effector, etc. Optionally, the panel stage holder 123 may operate based on a holding control signal. Optionally, the holding control signal may be transmitted to the panel stage holder 123 to instruct it to perform a holding or releasing operation.

[0073] As shown, the panel handling head 126 is initially located at a certain position, for example, at an upper area within the panel handling station 120, so that the panel table 121 moves out of the release station 110 (for example, after receiving the separated molded panel 101) and enters the panel handling station 120 and is located below the panel handling head 126. When the panel table 121 (holding the separated molded panel 101 thereon) is aligned with (for example, located directly below) the panel handling head 126, the panel handling head 126 can be moved toward the separated molded panel 101, thereby engaging with the separated molded panel 101 and releasably holding the separated molded panel 101 via the panel handling head holder 128. The panel handling head 126 (holding the separated molded panel 101) can then move or lift the separated molded panel 101 off the panel table 121, for example, to transfer the separated molded panel 101 to another component or location in the panel release system 1000, or to rotate it out of the panel release system 1000. Optionally, the panel table 121 can then return to the release station 110 to receive a separated molded panel 101 for delivery to another panel carrier assembly 104 within the panel release system 1000.

[0074] According to various embodiments, the panel processing head 126 or the panel processing unit 125 can be laterally or transversely movable along a panel processing head lateral movement plane 226q (see FIG. 2 ), which can be non-parallel to, for example, perpendicular or substantially perpendicular to, the panel processing head movement plane 126p. The panel processing head lateral movement plane 226q can be a substantially flat plane and can be oriented substantially horizontally (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is positioned upright on an external floor). Thus, the panel processing head 126 or the panel processing unit 125 can be movable along the panel processing head lateral movement plane 226q in a transverse or transverse direction (e.g., in opposite linear directions). Optionally, the direction of transverse or transverse movement of the panel processing head 126 or the panel processing unit 125 along the panel processing head lateral movement plane 226q can be, but is not limited to, non-parallel to, for example, perpendicular or substantially perpendicular to, the direction of transverse or transverse movement of the panel stage 121 along the panel stage movement plane 121p. The above-mentioned arrangement of the panel processing head 126 or the panel processing unit 125 can transport the separated molded panel 101 held by the panel processing head 126 out of the panel processing station 120. For example, the separated molded panel 101 is transported to another component or location for further processing or operation, or is sent out from the panel release system 1000. The panel release system 1000 may include corresponding guide rails, tracks or slides for guiding the panel processing head 126 to move laterally along the panel processing head lateral movement plane 226q, for example, linear guide rails, tracks or slides. The movement of the panel processing head 126 along the panel processing head lateral movement plane 226q can be based on a movement signal. Optionally, the movement signal can be transmitted to the panel processing head 126 to instruct it to move.

[0075] See also Figure 1C and Figure 1D According to various embodiments, the carrier handling station 130 may receive the carrier 103 separated from the molded panel 101 from the release station 110 while the thermal release tape 102 is still adhered thereto. In other words, the separated carrier 103 may be moved from the release station 110 to the carrier handling station 130.

[0076] According to various embodiments, the carrier stage 111 can be moved between the release station 110 and the carrier processing station 130 to transport the separated carrier 103 from the release station 110 to the carrier processing station 130. That is, the carrier stage 111 can be moved from the release station 110 to the carrier processing station 130 to transport the separated carrier 103 to the carrier processing station 130. The carrier stage 111 can have an independent movable platform or a slide or a sliding platform. The carrier stage 111 can be moved along a carrier stage moving plane 111p extending between the release station 110 and the carrier processing station 130, see Figure 1D. The carrier table moving plane 111p can be a substantially flat plane and can be oriented substantially horizontally (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is configured to stand upright on an external ground). Therefore, the carrier table 111 can move laterally (laterally) (e.g., in opposite linear directions) along the carrier table moving plane 111p between the release station 110 and the carrier processing station 130. The direction in which the carrier table 111 moves laterally or laterally along the carrier table moving plane 111p (between the release station 110 and the carrier processing station 130) can be, but is not limited to, non-parallel to the direction in which the panel table 121 moves laterally or laterally along the panel table moving plane 121p (between the panel processing station 120 and the release station 110), e.g., perpendicular or substantially perpendicular. The movement of the carrier table 111 along the carrier table moving plane 111p can be based on a movement signal. Optionally, the movement signal is transmitted to the carrier table 111 to instruct its movement.

[0077] According to various embodiments, the carrier stage moving plane 111 p and the release head moving plane 116 p may be non-parallel to each other, for example, perpendicular or substantially perpendicular.

[0078] According to various embodiments, the panel processing head lateral movement plane 226q may be (but is not limited to) parallel to the carrier table movement plane 111p, but spatially separated. In other words, the panel processing head 126 and the carrier table 111 can move at different heights within the panel release system 1000 (e.g., when the panel release system 1000 is positioned upright on an external floor). Thus, within the panel release system 1000, the panel processing head 126 and the carrier table 111 can each move at different heights along different and / or parallel guide rails, tracks, or slides.

[0079] According to various embodiments, the carrier stage moving plane 111p and the panel stage moving plane 121p may be parallel to each other. Therefore, the carrier stage moving plane 111p and the panel stage moving plane 121p may be oriented horizontally or substantially horizontally. The direction in which the carrier stage 111 moves along the carrier stage moving plane 111p and the direction in which the panel stage 121 moves along the panel stage moving plane 121p may not be parallel to each other, for example, vertically or substantially vertically. Therefore, see Figure 1D, the carrier stage 111 and the panel stage 121 can move in different and / or non-parallel (e.g., perpendicular) directions. In this way, the carrier stage 111 and the panel stage 121 can be moved along the carrier stage moving plane 111p and the panel stage moving plane 121p respectively in a synchronous and / or coordinated and / or parallel and / or simultaneous manner, for example, without overlapping or otherwise interfering with each other. For example, the carrier stage 111 and the panel stage 121 can both move in parallel and / or simultaneously: first, the carrier stage 111 is moved out of the release station 110 and toward the carrier processing station 130, thereby transporting the carrier 103 with the heat release tape 102 separated from the molded panel 101 to the carrier processing station 130; second, the panel stage 121 is moved out of the panel processing station 120 and toward the release station 110, thereby receiving the separated molded panel 101. In various embodiments, the movement of the carrier table 111 and the panel table 121 can be coordinated such that the carrier table 111 leaves the release station 110 before the panel table 121 enters the release station 110, or both can simultaneously leave the panel processing station 120 and the carrier processing station 130, respectively. The panel table 121 and the carrier table 111 can also simultaneously leave the release station 110, for example, to simultaneously transfer the separated molded panel 101 and the separated carrier 103 to the panel processing station 120 and the carrier processing station 130, respectively. For example, the panel table 121 can move along a panel table moving plane 121p that is above the carrier table moving plane 111p of the carrier table 111. Therefore, after the molded panel 101 is separated from the carrier 103, the carrier 103 can remain on the carrier table 111, while the panel table 121 can move above the carrier table 111 and the separated carrier 103 thereon, thereby receiving the separated molded panel 101 from the release head 116. Subsequently, the panel stage 121 (carrying the separated molded panel 101) and the carrier stage 111 (carrying the separated carrier 103) can depart the release station 110 in a coordinated and / or synchronized manner (e.g., in parallel or simultaneously). Therefore, the panel stage movement plane 121p of the panel stage 121 can be spatially separated from the carrier stage movement plane 111p of the carrier stage 111. For example, the two can be parallel, but the panel stage movement plane 121p is located below the carrier stage movement plane 111p. This arrangement also allows the carrier stage 111 and the panel stage 121 to move in a coordinated and / or synchronized manner.

[0080] According to various embodiments, the panel processing station 120 and the carrier processing station 130 may each be connected to the release station 110 and / or located downstream of the release station 110 .

[0081] For example, the panel release system 1000 may include corresponding guide rails, tracks, or slides, such as linear guide rails, tracks, or slides, for connecting the panel processing station 120 and the carrier processing station 130 to the release station 110, respectively. For example, one guide rail may extend between the release station 110 and the panel processing station 120 to guide the panel stage 121 to move between the release station 110 and the panel processing station 120; another guide rail may extend between the release station 110 and the carrier processing station 130 to guide the carrier stage 111 to move between the release station 110 and the carrier processing station 130.

[0082] According to various embodiments, the carrier processing station 130 may include a carrier processing unit 135. The carrier processing unit 135 may include a carrier processing head 136. When the carrier stage 111 is located in the carrier processing station 130, the carrier processing head 136 may be positioned opposite and / or above the carrier stage 111. That is, in the carrier processing station 130, the carrier stage 111 may be located in a lower area, while the carrier processing head 136 may be located in an upper area.

[0083] According to various embodiments, within the carrier processing station 130, the carrier processing head 136 can move along a carrier processing head movement plane 136p. The carrier processing head movement plane 136p can be a substantially flat plane and can be oriented substantially vertically (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is vertically positioned on an external floor). The carrier processing head movement plane 136p within the carrier processing station 130 can be parallel or substantially parallel to the release head movement plane 116p within the release station 110 and / or the panel processing head movement plane 126p within the panel processing station 120. Furthermore, the carrier processing head movement plane 136p can be non-parallel to the carrier table movement plane 111p, e.g., perpendicular or substantially perpendicular. When the carrier table 111 is within the carrier processing station 130, the carrier processing head movement plane 136p can be aligned with (e.g., intersecting) the carrier table 111 (e.g., the second table surface 121a thereof). Optionally, the carrier handling unit 135 operates in a manner similar to a pressing device or a pressing device. The carrier handling head 136 can move up and down along a carrier handling head moving plane 136p, for example, in opposite linear directions, so that when the separated carrier 103 is aligned with and / or located below the carrier handling head 136, the separated carrier 103 can be lifted and / or removed from the carrier table 111. Therefore, when the carrier table 111 is located in the carrier handling station 130 and aligned with the carrier handling head 136, the carrier handling head 136 can move along the carrier handling head moving plane 136p to the first table 111a of the carrier table 111 to grasp the separated carrier 103 located on the first table 111a of the carrier table 111. The movement of the carrier handling head 136 along the carrier handling head moving plane 136p can be based on a movement signal. Optionally, the movement signal can be transmitted to the carrier handling head 13 to instruct it to move.

[0084] According to various embodiments, the carrier processing head 136 may include a carrier processing head holder 138. The carrier processing head holder 138 releasably holds (e.g., releasably grips or fixes) the separated carrier 103 so that it is held on the third engagement surface 136a of the carrier processing head 136. The carrier processing head holder 138 may be associated with the third engagement surface 136a of the carrier processing head 136, for example, located at or near the third engagement surface 136a. Optionally, the carrier processing head holder 138 includes a vacuum suction mechanism (e.g., a vacuum plate, vacuum suction holes, vacuum suction cups, etc.), a clamping mechanism (e.g., a clamp or clamp), an electrostatic suction device, an end effector, etc. The carrier processing head holder 138 may operate based on a holding control signal. Optionally, the holding control signal may be transmitted to the carrier processing head holder 138 to instruct its operation.

[0085] According to various embodiments, the carrier handling head 136 is initially positioned, for example, in an upper region of the carrier handling station 130, to facilitate entry of the carrier table 111 carrying the separated carrier 103 into the carrier handling station 130. Subsequently, when the carrier table 111 is aligned with the carrier handling head 136 (e.g., along the carrier handling head movement plane 136p), the carrier handling head 136 can be moved toward the separated carrier 103, engage the separated carrier 103, and releasably hold the separated carrier 103 on its third engagement surface 136a via the carrier handling head holder 138. Subsequently, the carrier handling head 136 can move (e.g., lift) the separated carrier 103 away from the carrier table 111, and finally, the carrier table 111 is removed from the carrier processing station 130, for example, returned to the release station 110.

[0086] Figure 1E The panel release system 1000 is schematically shown with an unloading station 140. According to various embodiments, the unloading station 140 may be connected to Figure 1C and Figure 1D The carrier processing station 130 is connected to the carrier processing station 130.

[0087] According to various embodiments, the unloading station 140 in the panel releasing system 1000 may be connected to the carrier processing station 130. In particular, the unloading station 140 may be located downstream of the carrier processing station 130.

[0088] According to various embodiments, the unloading station 140 may receive the separated carriers 103 transferred from the carrier processing station 130 .

[0089] According to various embodiments, the unloading station 140 may include an unloading tray 141 that is movable between the unloading station 140 and the carrier processing station 130 for transporting the separated carriers 103 from the carrier processing station 130 to the unloading station 140. Thus, the unloading tray 141 may be an independent transfer table or shuttle table, a sliding table or a movable table. The unloading tray 141 may be movable along an unloading tray movement plane 141p extending between the unloading station 140 and the carrier processing station 130. The unloading tray movement plane 141p may be a substantially flat plane that may be substantially horizontally oriented relative to the base of the panel release system 1000 (e.g., when the panel release system 1000 is placed and / or vertically on an external floor or the ground). Optionally, the unloading tray movement plane 141p is non-parallel to the carrier processing head movement plane 136p, for example, perpendicular or substantially perpendicular. The unloading tray 141, which moves between the unloading station 140 and the carrier processing station 130, can move in a lateral or transverse direction (e.g., opposite linear directions) relative to the unloading tray moving plane 141p. Optionally, the lateral or transverse direction is parallel to the lateral or transverse direction of the panel stage 121 along the panel stage moving plane 121p, i.e., the direction of movement between the panel processing station 120 and the release station 110. The panel release system 1000 may include a track, guide, or slide, such as a linear track, extending between the unloading station 140 and the carrier processing station 130, so that the unloading tray 141 can be guided and / or moved, e.g., slid, along the track. Thus, the unloading tray 141 can move from the unloading station 140 to the carrier processing station 130, or from the carrier processing station 130 to the unloading station 140. The movement of the unloading tray 141 along the unloading tray moving plane 141p can be based on a movement signal. Optionally, the movement signal may be transmitted to the unloading tray 141 to instruct the unloading tray 141 to move.

[0090] In addition, according to multiple embodiments, the upper side or upper surface of the unloading tray 141 (i.e., the portion capable of supporting the separated carrier 103) may include a roller or roller conveyor device, or a movable conveyor belt or roller belt, etc., so that the separated carrier 103 can be moved thereon.

[0091] According to multiple embodiments, at the carrier processing station 130, after the carrier processing head 136 lifts the separated carrier 103 from the carrier table 111, the unloading tray 141 can be moved to the carrier processing station 130 and aligned with the carrier processing head 136. At this time, the carrier processing head 136 can releasably hold the separated carrier 103 and then receive the separated carrier 103 held by the carrier processing head 136, for example, to the upper side or upper surface of the unloading tray 141.

[0092] According to various embodiments, when the unloading tray 141 is located at the carrier processing station 130 and aligned with the carrier processing head 136, the carrier processing head 136 may release the separated carriers 103 onto the unloading tray 141. After the separated carriers 103 are located on the unloading tray 141, the unloading tray 141 may be moved out of the carrier processing station 130 and into the unloading station 140, thereby transporting the separated carriers 103 from the carrier processing station 130 to the unloading station 140, for example, for subsequently sending the carriers 103 out of the panel release system 1000.

[0093] According to various embodiments, the unloading tray moving plane 141p of the unloading tray 141 can be spatially separated from and parallel to the carrier stage moving plane 111p of the carrier stage 111. Therefore, after the unloading tray 141 is moved into the carrier processing station 130, the unloading tray 141 can be positioned above the carrier stage 111. In other words, the unloading tray moving plane 141p can be positioned above the carrier stage moving plane 111p to align with the carrier processing head 136 and / or the separated carrier 103 releasably held by the carrier processing head 136. In other embodiments, the unloading tray moving plane 141p can also be positioned below the carrier stage moving plane 111p.

[0094] According to various embodiments, the carrier table 111 can be moved synchronously with the unloading tray 141 into and out of the carrier processing station 130. Thus, the carrier table 111 can be moved out of the carrier processing station 130 to facilitate the movement of the unloading tray 141 into the carrier processing station 130. Optionally, the carrier table 111 and the unloading tray 141 can move along the same plane, or they can each move along different and spatially separated planes, for example, one plane above / below the other plane.

[0095] According to various embodiments, when the unloading tray 141 is aligned with the carrier handling head 136, which is now releasably holding the separated carriers 103, the carrier handling head 136 can be moved toward the unloading tray 141 to release the separated carriers 103 onto the unloading tray 141. The carrier handling head 136 can move downward along the carrier handling head movement plane 136p until the separated carriers 103 contact the upper side or upper surface of the unloading tray 141, and then release the separated carriers 103 onto the unloading tray 141. Subsequently, the carrier handling head 136 can be moved in the opposite direction, away from the unloading tray 141, to facilitate the unloading tray 141 (now carrying the separated carriers 103) to be moved out of the carrier handling station 130 and into the unloading station 140. Therefore, after the carrier handling head 136 releases the separated carrier 103 onto the unloading tray 141 , the unloading tray 141 can transport the separated carrier 103 to the unloading station 140 , for example, for removing the carrier 103 from the panel release system 1000 .

[0096] According to various embodiments, the carrier 103 may include an orientation feature 103a, such as a chamfered or chamfered edge, a mark, a notch, or other physical identification mark, for indicating the orientation of the carrier 103 in the panel release system 1000. The orientation identification of the carrier 103 can ensure that the carrier 103 and the bonded molded panel 101 can be correctly aligned and handled in the panel release system 1000. Figure 1A in Figure 1A As shown in FIG. 1 -b, the directional feature 103a is a chamfer, which can be formed by cutting a corner of the carrier 103 that is originally square or approximately square.

[0097] According to various embodiments, the direction of lateral or transverse movement of the unloading tray 141 along the unloading tray moving plane 141p may be non-parallel to the direction of lateral or transverse movement of the carrier stage 111 on the carrier stage moving plane 111p, for example, perpendicular or substantially perpendicular. In other words, the carrier stage 111 and the unloading tray 141 may move in directions that are different and / or non-parallel (for example, perpendicular) to each other. Therefore, before releasing the separated carrier 103 onto the unloading tray 141, and while the carrier processing head holder 138 is still holding the separated carrier 103 on the third engagement surface 136a of the carrier processing head 136, the carrier processing head 136 may further rotate the separated carrier 103 by an angle, for example, approximately a right angle or 90° in a clockwise direction. Optionally, the rotation angle is approximately equal to the angle between the direction of movement of the unloading tray 141 on the unloading tray moving plane 141p and the direction of movement of the carrier stage 111 on the carrier stage moving plane 111p, so as to align the separated carrier 103 with the downstream process before sending it out of the panel release system 1000. Specifically, the carrier handling head 136 or at least its lower portion having the third joint surface 136a can rotate around a carrier handling unit rotation axis 136r, see Figure 1C Optionally, the carrier handling unit rotation axis 136r is perpendicular or substantially perpendicular to a base relative to the panel release system 1000 and / or a ground surface on which the panel release system 1000 is positioned upright. Optionally, the carrier handling unit rotation axis 136r passes through the carrier handling head 136, e.g., through a central axis thereof, and is aligned with, e.g., parallel to and / or coincident with, the carrier handling head movement plane 136p.

[0098] In various embodiments, the rotation angle of the carrier 103 about the carrier handling unit rotation axis 136r may be determined not only by the relative movement direction of the unloading tray 141 and the carrier stage 111, but also by the layout of the unloading station 140 and / or the carrier handling station 130, and / or alignment requirements affected by other factors. For example, the rotation angle of the carrier 103 about the carrier handling unit rotation axis 136r may be determined by various factors, including but not limited to the layout of various components within the panel release system 1000 (e.g., the unloading station 140 and / or the carrier handling station 130), and the positioning requirements of upstream and / or downstream processes and / or automation adjacent to the panel release system 1000.

[0099] According to various embodiments, the rotation of the carrier handling head 136 about the carrier handling unit rotation axis 136r may be based on a rotation signal. Optionally, the rotation signal may be transmitted to the carrier handling head 136 to instruct it to rotate according to a setting.

[0100] According to various embodiments, Figure 1F As schematically shown in the panel release system 1000 , the unloading station 140 may be directly connected to the release station 110 .

[0101] like Figure 1F As shown, the unloading station 140 may be directly connected to the releasing station 110 , ie, the unloading station 140 may be immediately adjacent to and located downstream of the releasing station 110 .

[0102] like Figure 1F As shown, the carrier stage 111 can be moved between the release station 110 and the unloading station 140 to transport the separated carrier 103 directly from the release station 110 to the unloading station 140. Figure 1E In contrast, there is no carrier processing station 130 between the release station 110 and the unload station 140 .

[0103] According to various embodiments, Figures 1G to 1J One mode of operation of the tape removal tool 131 is schematically shown.

[0104] According to various embodiments, the panel release system 1000 may include a tape removal tool 131 for removing the thermal release tape 102 from the carrier 103. After the molded panel 101 is separated from the carrier 103 at the release station 110, the thermal release tape 102 may remain adhered to the separated carrier 103 because the pressure-sensitive adhesive layer 102b in the thermal release tape 102 may retain its adhesiveness after being heated to the thermal release temperature, i.e., after the release operation is completed.

[0105] like Figures 1G to 1JWhen the carrier stage 111 carrying the carrier 103 and the residual thermal release tape 102 thereon is aligned with the tape removal tool 131, the tape removal tool 131 can remove the thermal release tape 102 that remains on the carrier 103 after the molded panel 101 is separated from the carrier 103. The tape removal tool 131 can first peel the peripheral portion 1022 of the thermal release tape 102 upward from the carrier 103. Then, the tape removal tool 131 can grab (e.g., clamp) the peripheral portion 1022 of the thermal release tape 102, while the remaining portion 1024 of the thermal release tape 102 is still adhered to the carrier 103. Optionally, after grabbing the thermal release tape 102, the tape removal tool 131 can move between the carrier first edge portion 102d and the opposite carrier second edge portion 102e, thereby picking up the thermal release tape 102 from the carrier first edge portion 102d and moving it across the entire carrier 103 toward the carrier second edge portion 102e, thereby completely removing the thermal release tape 102. The carrier first edge portion 102d is the first edge portion of the carrier 103, located at the outer periphery 1022 of the thermal release tape 102; the carrier second edge portion 102e is the second edge portion of the carrier 103, located away from the outer periphery 1022 of the thermal release tape 102.

[0106] Optionally, the tape removal tool 131 includes an attachment mechanism for gripping the peripheral portion 1022 of the thermal release tape 102 and the ridge 1026 formed thereby. Optionally, the attachment mechanism includes a gripping mechanism 137, such as a clamp, a clamp, a jaw, or a clamping finger, for gripping the peripheral portion 1022 of the thermal release tape 102. Optionally, as Figure 1G As shown, the clamping mechanism 137 may include a first clamping finger 1372 and a second clamping finger 1374 disposed opposite to each other. Figure 1H As shown, the first clamping finger 1372 and the second clamping finger 1374 can move toward each other, as shown in FIG. Figure 1H As shown by the relative dotted arrows in the figure, a clamping force is applied to clamp the peripheral portion 1022 (e.g., the raised portion 1026) of the thermal release tape 102. Alternatively, the attachment mechanism may also include a vacuum mechanism, such as a suction cup (not shown in the figure), for picking up the peripheral portion 1022 of the thermal release tape 102. The attachment mechanism can be operated according to a corresponding control signal to pick up the peripheral portion 1022 of the thermal release tape 102. Optionally, the tape removal tool 131 can be moved on the carrier 103, for example, from the first edge portion 102d of the carrier to the opposite second edge portion 102e of the carrier, while maintaining a grip on the thermal release tape 102, thereby peeling or pulling up the remaining portion 1024 from the carrier 103, as shown in the figure. Figure 1I As shown, the thermal release tape 102 is completely removed from the carrier 103, as shown in FIG. Figure 1HThe tape removal tool 131 can also move along a predetermined path or trajectory (eg, a straight line, an arc, or a multi-segment path) so as to completely separate the thermal release tape 102 from the carrier 103 .

[0107] According to various embodiments, in order to facilitate engagement with the thermal release tape 102 and initiate the tape removal process, the tape removal tool 131 may further include a separation assisting tool 132 for performing an initial separation step. Optionally, the separation assisting tool 132 may include a plowing member 133, such as a blade, which may move (i.e., plow) the peripheral portion 1022 of the thermal release tape 102 laterally or in parallel, thereby hooking the thermal release tape 102 and forming a ridge 1026, i.e., Figure 1H As shown, a wave-like structure is formed on the outer portion 1022 of the thermal release tape 102. Subsequently, the raised portion 1026 can be easily gripped, pulled up, and peeled off by the tape removal tool 131. The initial separation step can be performed before or in conjunction with the activation of the tape removal tool 131, thereby continuously and reliably removing the thermal release tape 102 from the surface of the carrier 103.

[0108] Alternatively, the separation assisting tool 132 may be first positioned in the same plane as the thermal release tape 102, and then a pushing force may be applied toward the side or edge of the thermal release tape 102 to form a ridge 1026 on the thermal release tape 102. Subsequently, the ridge 1026 may be clamped by the opposing first and second clamping fingers 1372, 1374 of the clamping mechanism 137, thereby initiating the peeling or removal process of the thermal release tape 102.

[0109] According to various embodiments, Figures 1K to 1N Another mode of operation of the tape removal tool 131 is schematically shown.

[0110] Optionally, the separation assisting tool 132 includes a plow 133 that is limited in lateral or transverse movement, for example, unable to move laterally or transversely, but movable up and down along a plow movement plane 133p. Optionally, the plow movement plane 133p may be parallel or substantially parallel to the release head movement plane 116p. Specifically, when the thermal release tape 102 is aligned with the plow 133, the plow 133 may move away from or toward the thermal release tape 102 on the carrier 103.

[0111] In various embodiments, the plowing member 133 may initially be in a raised position so that the carrier table 111 (the carrier 103 carrying the thermal release tape 102) can be smoothly moved until the outer portion 1022 of the thermal release tape 102 is aligned with the plowing member 133. Subsequently, the plowing member 133 may be lowered to contact and engage with the outer portion 1022 of the thermal release tape 102, as shown in FIG. Figure 1LSubsequently, the carrier 111 carrying the thermal release tape 102 can be moved laterally or lateral relative to the plowing member 133, for example, along the carrier movement plane 111p, at which time the plowing member 133 can remain fixed and engage with the peripheral portion 1022 of the thermal release tape 102, as shown. Figure 1M As shown. Through the relative movement, the outer portion 1022 of the heat release tape 102 is hooked or caught by the plowing member 133, so that the heat release tape 102 contacts the plowing member 133 and forms a ridge 1026 when moving, as shown. Figure 1N Once the ridge 1026 is formed, the tape removal tool 131 can easily grip, peel, and pull up the ridge 1026. After the process is completed, the plow 133 can be raised, for example, to the raised position, away from the carrier table 111, so that the carrier table 111 can be moved away from the plow 133, for example, to another component of the panel release system 1000 or another location.

[0112] According to various embodiments, Figure 1O and Figure 1P Schematically shown, according to Figures 1K to 1N The described manner operates the operating mechanism of the tape removal tool 131. Specifically, Figure 1O Schematically shows the Figure 1K Cross-sectional view of section AA in FIG.

[0113] According to various embodiments, referring to Figure 1O and Figure 1P , the separation assist tool 132 may include one or more blades 134 for engaging the thermal release tape 102. For example, the blades 134 include one or more first blades 134a for engaging a first peripheral portion 1022a of the thermal release tape 102; one or more second blades 134b for engaging a second (opposite) peripheral portion 1022b of the thermal release tape 102; and one or more third blades 134c for engaging an intermediate peripheral portion 1022c of the thermal release tape 102 (e.g., located between the first peripheral portion 1022a and the second peripheral portion 1022b).

[0114] According to various embodiments, the blade 134 may be mounted on the blade support head 139 of the separation assist tool 132. For example, the blade 134 may be rigidly fixed to the blade support head 139. Alternatively, the blade 134 may be elastically connected to the blade support head 139 via a damping mechanism (e.g., a spring (not shown)). The damping mechanism can controllably adjust the connection between the blade 134 and the thermal release tape 102, thereby ensuring sufficient contact between the blade 134 and the thermal release tape 102 while preventing the blade 134 from applying excessive pressure to the thermal release tape 102. Alternatively, the plurality of blades 134 may be arranged in a straight line so that they can engage the thermal release tape 102 in a linear manner (i.e., along the width of the thermal release tape 102), thereby facilitating a uniform peeling of the thermal release tape 102 from the carrier 103.

[0115] According to various embodiments, the density (e.g., the number of blades per unit length or unit area) of the first and second blades 134a, 134b at the first and second peripheral portions 1022a, 1022b of the thermal release tape 102 may be higher than the density of blades at the middle peripheral portion 1022c. Because the thermal release tape 102 generally has stronger adhesion at the first and second peripheral portions 1022a, 1022b, making it more difficult to initiate peeling, this design facilitates more effective formation of the ridges 1026 at the first and second peripheral portions 1022a, 1022b. However, the density of the first and second blades 134a, 134b at the first and second peripheral portions 1022a, 1022b of the thermal release tape 102 may be the same as or similar to the density of the third blade 134c at the middle peripheral portion 1022c.

[0116] According to various embodiments, referring to Figure 1O The plowing member 133 may include a pair of first blades 134a fixed to the first edge portion 139a of the blade support head, for example, arranged in a linear single row or arranged side by side horizontally, for engaging the first peripheral portion 1022a of the thermal release tape 102; and another pair of second blades 134b fixed to the second (opposite) edge portion 139b of the blade support head, for engaging the second peripheral portion 1022b of the thermal release tape 102. Optionally, the plowing member 133 includes a third blade 134c fixed to the inner portion 139c of the blade support head 139, that is, located between the first edge portion 139a of the blade support head and the second edge portion 139b of the blade support head. Optionally, the plowing member 133 may also include a pair of third blades 134c fixed to the inner portion 139c of the blade support head 139. The blade support head first edge portion 139 a is the first edge portion of the blade support head 139 , and the blade support head second edge portion 139 b is the second edge portion of the blade support head 139 .

[0117] According to various embodiments, the blade support head 139 can be connected to an actuator 80 (e.g., a pneumatic actuator, a linear actuator) of the panel release system 1000. The actuator 80 can move the blade support head 139 along with the blade 134 relative to the thermal release tape 102 on the carrier 103 along the plow movement plane 133p.

[0118] According to various embodiments, the plurality of first clamping fingers 1372 of the clamping mechanism 137 may be coupled with the corresponding plurality of second clamping fingers 1374 (e.g., Figures 1G to 1N ) work together to form a raised portion 1026 on the thermal release tape 102 and then clamp it, thereby initiating the peeling or removal of the thermal release tape 102.

[0119] According to various embodiments, the blade 134 moves along the plow member movement plane 133p (see Figure 1K ) can move independently of the movement of the clamping mechanism 137 (e.g., the first and second clamping fingers 1372, 1374). In other words, the blade 134 can move freely relative to the clamping mechanism 137. However, the blade 134 and the clamping mechanism 137 (e.g., the first and second clamping fingers 1372, 1374) can also move synchronously or in coordination as a whole along the plow member movement plane 133p.

[0120] According to various embodiments, the plurality of blades 134 of the plow 133 can be disposed between opposing first and second clamping fingers 1372, 1374 of the clamping mechanism 137. For example, the plow 133 can be positioned at the same distance from the opposing first and second clamping fingers 1372, 1374. In other words, the plow 133 (e.g., the plurality of blades 134) can be located on the central axis of the clamping mechanism 137.

[0121] According to various embodiments, the tape removal tool 131 can be a separate removal module or a part of the removal module in the panel release system 1000. Alternatively, the removal module can be integrated into any suitable component of the panel release system 1000, for example, at the release station 110, or at a suitable location downstream of the release station 110, such as at the carrier processing station 130.

[0122] Alternatively, the thermal release tape 102 can be removed outside of the panel release system 1000. For example, the carrier 103, along with the thermal release tape 102 still adhered thereto, can be removed from the panel release system 1000 without undergoing a removal process. Accordingly, the thermal release tape 102 can be removed in a separate, external device outside of the panel release system 1000, such as in a downstream process connected to the panel release system 1000.

[0123] According to various embodiments, Figure 1Q The panel release system 1000 is schematically shown having a preheating station 150 connected to the release station 110 .

[0124] According to various embodiments, the preheating station 150 may be directly or indirectly connected to the releasing station 110. Specifically, the preheating station 150 may be located upstream of the releasing station 110, for example, directly upstream.

[0125] According to various embodiments, the panel carrier assembly 104 may first pass through a preheating station 150 before being sent to the release station 110 .

[0126] According to various embodiments, the preheating station 150 can be configured to receive the panel carrier assembly 104 depending on how the panel release system 1000 is positioned in the overall packaging process and integrated into the overall production, manufacturing, assembly, etc. process. For example, the preheating station 150 can be manually fed or fed through the feed station 160, as described below. Figure 1Q As shown, the panel carrier assembly 104 is fed into the preheating station 150 with the molded panel 101 on the upper side.

[0127] According to various embodiments, the preheating station 150 may include a preheating table 151. The preheating table 151 may have a third table surface 151 a, for example, an upper surface or an upward-facing surface thereof, for receiving and / or supporting the panel carrier assembly 104. Specifically, the third table surface 151 a of the preheating table 151 may support the panel carrier assembly 104 and keep the molded panel 101 facing upward.

[0128] According to various embodiments, the preheating station 151 may further include a first preheater 152 that can heat, i.e., preheat, the panel carrier assembly 104 when the panel carrier assembly 104 is located on the third surface 151a of the preheating station 151. The preheating can cause the panel carrier assembly 104 to reach an intermediate temperature between the ambient temperature and the heat release temperature. Preferably, the intermediate temperature is approximately 120°C. Optionally, the first preheater 152 can be associated with the third surface 151a of the preheating station 151. When the third surface 151a of the preheating station 151 contacts the panel carrier assembly 104, the first preheater 152 can preheat the panel carrier assembly 104. For example, the first preheater 152 can be disposed on the third surface 151a of the preheating station 151, and when the panel carrier assembly 104 is located on the third surface 151a, heat conduction or thermal coupling with the panel carrier assembly 104 can be achieved. For another example, the first preheater 152 can be arranged on the third surface 151a of the preheating table 151, so that the panel carrier assembly 104 can be in direct contact with the third surface 151a. For another example, the first preheater 152 can be embedded within the third surface 151a, thereby heating the third surface 151a. The third surface 151a can then conduct heat generated by the first preheater 152 to the panel carrier assembly 104. In this case, the third surface 151a can be made of a material with good thermal conductivity. Alternatively, a layer of thermal interface material can be provided on the third surface 151a, for example, between the third surface 151a and the panel carrier assembly 104. Thus, the carrier 103 in the panel carrier assembly 104 can be in direct or indirect thermal contact with the third surface 151a and / or the first preheater 152. Optionally, the first preheater 152 comprises a heating plate. Alternatively, the heating plate may be disposed separately from the third surface 151a of the preheating station 151. For example, the heating plate may be independent and disposed below the third surface 151a and thermally coupled to the third surface 151a. It is understood that the first preheater 152 of the preheating station 151 may also be implemented in any other suitable manner, including but not limited to a solid-state heating element, a radiant heating device, or any other structure capable of producing the desired thermal effect. Alternatively, the first preheater 152 of the preheating station 151 may perform a preheating operation based on a preheating control signal. After the panel carrier assembly 104 is placed on the preheating station 151 within the preheating station 150, and / or before the panel carrier assembly 104 is released at the release station 110, the preheating control signal may be transmitted to the first preheater 152 of the preheating station 151. Accordingly, the panel release system 1000 (eg, the preheating stage 151 ) may include a sensor for detecting contact or engagement between the preheating stage 151 and the panel carrier assembly 104 , thereby triggering the preheating control signal.

[0129] According to various embodiments, the preheating stage 151 may further include a preheating stage holder 153 that releasably holds the panel carrier assembly 104 on the third surface 151a of the preheating stage 151. Optionally, the preheating stage holder 153 may be associated with the third surface 151a of the preheating stage 151, for example, located on or near it. Optionally, the preheating stage holder 153 may include a vacuum adsorption mechanism (e.g., a vacuum plate, vacuum suction holes, vacuum suction cups, etc.), a clamping mechanism (e.g., a clamp or clamp), an electrostatic clamp, an end effector, etc. The operation of the preheating stage holder 153 may be based on a holding control signal. Optionally, the holding control signal may be transmitted to the preheating stage holder 153 to instruct its operation.

[0130] According to various embodiments, the preheating station 150 (eg, via the first preheater 152 ) may gradually heat the panel carrier assembly 104 to the intermediate temperature and then maintain the temperature at or near the intermediate temperature for a predetermined period of time.

[0131] According to various embodiments, the preheating station 150 may include a preheating unit 155. The preheating unit 155 may include a preheating head 156. The preheating head 156 may be disposed within the preheating station 150, opposite and / or above the preheating stage 151. For example, within the preheating station 150, the preheating stage 151 may be located in a lower region (lower portion), while the preheating head 156 may be located in a higher region (upper portion).

[0132] According to various embodiments, the preheating head 156 can move along a preheating head movement plane 156p within the preheating station 150. The preheating head movement plane 156p can be a substantially flat plane and be oriented substantially vertically (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is placed vertically on the ground outside). The preheating head movement plane 156p can be parallel or substantially parallel to the release head movement plane 116p at the release station 110. According to various embodiments, when the preheating table 151 is located within the preheating station 150, the preheating head movement plane 156p can be aligned with (e.g., intersecting) the preheating table 151. Alternatively, the preheating unit 155 can operate in a manner similar to a laminating device or a press device, with the preheating head 156 being movable upward and downward along a preheating head moving plane 156p. When the panel carrier assembly 104 is aligned with and / or positioned below the preheating head 156, the preheating head 156 can engage with the panel carrier assembly 104 and / or lift the panel carrier assembly 104. When the preheating table 151 is positioned within the preheating station 150 and aligned with the preheating head 156, the preheating head 156 can move toward the third surface 151a of the preheating table 151 to engage the molded panel 101 of the panel carrier assembly 104. The movement of the preheating head 156 along the preheating head moving plane 156p can be based on a movement signal. Alternatively, the movement signal can be transmitted to the preheating head 156 to instruct it to move.

[0133] According to various embodiments, the preheating head 156 may include a preheating head holder 158. The preheating head holder 158 may be used to releasably hold (e.g., releasably fix or lock) the panel carrier assembly 104 at the fourth engagement surface 156a of the preheating head 156. The preheating head holder 158 may be associated with the fourth engagement surface 156a of the preheating head 156. Optionally, the preheating head holder 158 may include a vacuum adsorption mechanism (e.g., a vacuum plate, vacuum suction holes, vacuum suction cups, etc.), a clamping mechanism (e.g., a clamp or fixture), an electrostatic chuck, an end effector, etc. The operation of the preheating head holder 158 may be based on a maintenance control signal. Optionally, the maintenance control signal may be transmitted to the preheating head holder 158 to instruct its operation.

[0134] According to various embodiments, the preheating head 156 may include a second preheater 157 associated with the fourth engagement surface 156a of the preheating head 156, such that the second preheater 157 can preheat the panel carrier assembly 104 when the fourth engagement surface 156a of the preheating head 156 is engaged with the panel carrier assembly 104. For example, the second preheater 157 can be disposed at the fourth engagement surface 156a of the preheating head 156. When the panel carrier assembly 104 is held on the third surface 151a of the preheating table 151 and the fourth engagement surface 156a of the preheating head 156 is engaged with the panel carrier assembly 104, the second preheater 157 of the preheating head 156 can preheat the panel carrier assembly 104 in coordination with the first preheater 152 of the preheating table 151. The second preheater 157 of the preheating head 156 can perform a preheating operation based on a preheating control signal. When both the preheating head 156 and the preheating stage 151 are engaged with the panel carrier assembly 104, the preheating control signal may be transmitted to the second preheater 157 of the preheating head 156 to coordinately preheat the panel carrier assembly 104. The panel release system 1000 (e.g., the preheating head 156) may further include a sensor for detecting engagement of the preheating head 156 with the panel carrier assembly 104 to trigger the preheating control signal.

[0135] According to various embodiments, the preheating station 151 can be movable between the preheating station 150 and the release station 110. Specifically, the preheating station 151 can be movable from the preheating station 150 to the release station 110 to transport the panel carrier assembly 104 from the preheating station 150 to the release station 110. Thus, the preheating station 151 can correspond to an independent transport (or shuttle, slide, or movable) platform or workbench. The preheating station 151 can be movable along a preheating station movement plane 151p extending between the preheating station 150 and the release station 110. The preheating station movement plane 151p can be a substantially flat plane and can be oriented substantially horizontally (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is placed vertically on an external floor). The preheating station movement plane 151p can be non-parallel to the preheating head movement plane 156p, for example, perpendicular or substantially perpendicular. The preheating table 151 can move between the preheating station 150 and the release station 110 along the transverse or lateral direction of the preheating table moving plane 151p. The direction of movement along the transverse or lateral direction can be, but is not limited to, non-parallel to the direction of movement of the panel table 121 along the transverse or lateral direction of the panel table moving plane 121p (i.e., the direction of movement of the panel table 121 between the panel processing station 120 and the release station 110), for example, perpendicular or substantially perpendicular. The panel release system 1000 may include a track, guide rail or slide rail, such as a linear track, which can extend between the preheating station 150 and the release station 110, so that the preheating table 151 can move, for example, slide along it. The movement of the preheating table 151 along the preheating table moving plane 151p can be based on a movement signal. Optionally, the movement signal can be transmitted to the preheating table 151 to instruct its movement.

[0136] According to various embodiments, the preheating stage moving plane 151p may be parallel to the carrier stage moving plane 111p.

[0137] According to various embodiments, the preheating table moving plane 151p of the preheating table 151 may be spatially separated from and / or parallel to and / or located above or below the carrier table moving plane 111p of the carrier table 111. For example, after the preheating table 151 moves into the release station 110, it may be located above the carrier table 111, i.e., above the carrier table moving plane 111p, to align with the release head 116. The release head 116 may then lift the panel carrier assembly 104 from the preheating table 151. Alternatively, the preheating table moving plane 151p may be located below the carrier table moving plane 111p. After the release head 116 lifts the panel carrier assembly 104 from the preheating table 151, the preheating table 151 may be removed from the release station 110, for example, returned to the preheating station 150, while the carrier table 111 moves into the release station 110 and aligns with the release head 116. The release head 116 then releases the panel carrier assembly 104 onto the carrier table 111. In this manner, the panel carrier assembly 104 can be first heated to a heat release temperature, and then the release operation can be performed to separate the molded panel 101 from the carrier 103. Therefore, when the preheating table 151 carrying the panel carrier assembly 104 moves into the release station 110 and is aligned with the release head 116, the release head 116 can move toward the preheating table 151. When the carrier table 111 is aligned with the release head 116, the release head 116 can releasably hold the panel carrier assembly 104 on its first engagement surface 116a, thereby removing the panel carrier assembly 104 from the preheating table 151. The panel carrier assembly 104 can then be released onto the carrier table 111. The preheating table moving plane 151p of the preheating table 151 can be parallel to and / or spaced apart from the carrier table moving plane 111p of the carrier table 111 and / or the panel table moving plane 121p of the panel table 121.

[0138] According to various embodiments, the preheating stage moving plane 151p and the carrier stage moving plane 111p can be parallel and aligned with each other, for example, coincident. Alternatively, the panel release system 1000 can include a single, continuous track, guide rail, or slide rail along which the preheating stage 151 and the carrier stage 111 can move. Thus, the carrier stage 111 can be first moved out of the release station 110, allowing the preheating stage 151 to be moved into the release station 110.

[0139] According to various embodiments, referring to Figure 1Q The panel release system 1000 may include a feed station 160, which may be connected to the preheating station 150, for example, directly connected. Specifically, the feed station 160 may be located upstream of the preheating station 150, for example, immediately upstream.

[0140] It is understood that the feed station 160 may also have other configurations. For example, the feed station 160 may be connected to the release station 110, for example, directly connected, and may be located upstream of the release station 110, for example, immediately upstream, so that the panel carrier assembly 104 is directly transferred from the feed station 160 to the release station 110.

[0141] See also Figure 1Q According to various embodiments, the feed station 160 can receive and transfer the panel carrier assembly 104 to a corresponding location connected thereto, such as the preheating station 150. In other words, when the feed station 160 is connected to the preheating station 150, it can have a configuration or function of transferring the panel carrier assembly 104 to the preheating station 150.

[0142] According to various embodiments, the feed station 160 may include a feed mechanism 161, such as a conveyor mechanism, a platform, or a feed tray. The feed mechanism 161 may receive the panel carrier assembly 104 from outside the panel release system 1000. The panel carrier assembly 104 may be placed on a conveying surface 161a on the upper side of the feed mechanism 161 by a robotic arm, a pick-and-place system, an automated guided vehicle or tool, a conveyor belt, or any other suitable means or mechanism.

[0143] According to various embodiments, the conveying surface 161a of the feed mechanism 161 can support the panel carrier assembly 104 and align and limit the movable position of the panel carrier assembly 104 relative to an alignment structure 154 (e.g., a stopper, an end stop or limiter, a cylinder stopper, etc.). Optionally, the alignment structure 154 is located in the preheating station 150. Optionally, the conveying surface 161a of the feed mechanism 161 includes rollers, a roller conveyor, a roller belt, or any other rolling mechanism or any suitable movable conveying device for aligning the panel carrier assembly 104 in the preheating station 150 when the panel carrier assembly 104 is on the conveying surface 161a of the feed mechanism 161 (i.e., having a rolling mechanism).

[0144] According to various embodiments, the alignment structure 154 at the preheating station 150 has a limiting function, that is, it prevents the panel carrier assembly 104 from unexpectedly moving beyond a predetermined position in the preheating station 150, thereby ensuring that the panel carrier assembly 104 is aligned relative to the preheating head 156 in the preheating station 150.

[0145] According to various embodiments, the alignment structure 154 at the preheating station 150 can move up and down in a direction parallel or substantially parallel to the preheating head movement plane 156p. Therefore, when the panel carrier assembly 104 is positioned on the conveying surface of the feed mechanism 161 within the preheating station 150, the alignment structure 154 can move upward to contact a side surface of the panel carrier assembly 104, thereby aligning the panel carrier assembly 104 with respect to the preheating head 156 of the preheating station 150. Once alignment is complete, before or after the panel carrier assembly 104 is picked up by the preheating head 156, the alignment structure 154 can move downward to allow the preheating table 151 to move into the preheating station 150 and align with the preheating head 156 and the panel carrier assembly 104.

[0146] According to various embodiments, the feed mechanism 161 is movable between the feed station 160 and the preheating station 150. Specifically, the feed mechanism 161 is movable from the feed station 160 to the preheating station 150 to transport the panel carrier assembly 104 from the feed station 160 to the preheating station 150. Alternatively, the feed mechanism 161 is a separate transport table, slide, mobile platform, etc. The feed mechanism 161 is movable along a feed mechanism movement plane 161p extending between the feed station 160 and the preheating station 150. The feed mechanism movement plane 161p can be a substantially flat plane and can be oriented substantially horizontally (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is placed vertically on an external floor or ground). The feed mechanism movement plane 161p can be non-parallel to the preheat head movement plane 156p and / or the release head movement plane 116p, for example, perpendicular or substantially perpendicular. The feed mechanism moving plane 161p may be, but is not limited to, parallel to the panel stage moving plane 121p and / or the unloading tray moving plane 141p. Therefore, the feed mechanism 161 can move laterally or laterally along the feed mechanism moving plane 161p between the feed station 160 and the preheating station 150. The direction of this lateral or lateral movement may be, but is not limited to, parallel to the direction of lateral or lateral movement of the panel stage 121 along the panel stage moving plane 121p between the panel processing station 120 and the release station 110. Optionally, the panel release system 1000 includes a guide rail, track, or slide, such as a linear guide, disposed between the feed station 160 and the preheating station 150 to guide the movement, e.g., sliding, of the feed mechanism 161. Therefore, the feed mechanism 161 can move out of the feed station 160 and then into the preheating station 150, or it can move out of the preheating station 150 and then into the feed station 160. Optionally, the movement of the feeding mechanism 161 along the feeding mechanism movement plane 161p can be performed based on a movement signal. Optionally, the movement signal can be transmitted to the feeding mechanism 161 to instruct it to move.

[0147] According to various embodiments, when the preheating head 156 is located in an upper region of the preheating station 150, the feed mechanism 161 can be moved into the preheating station 150 and aligned with the preheating head 156, for example, positioned below the preheating head 156. Furthermore, when the feed mechanism 161 is located within the preheating station 150, the conveying surface 161a of the feed mechanism 161 can align the panel carrier assembly 104 relative to the alignment structure 154 within the preheating station 150 and align it with the preheating head 156 of the preheating station 150.

[0148] Specifically, after the feed mechanism 161 carrying the panel carrier assembly 104 moves into the preheating station 150 and is aligned with the preheating head 156, the preheating head 156 can move to the feed mechanism 161 to engage with the panel carrier assembly 104, releasably hold the panel carrier assembly 104 on the fourth engagement surface 156a of the preheating head 156, and remove the panel carrier assembly 104 from the feed mechanism 161. Subsequently, in the preheating station 150, after the preheating table 151 and the preheating head 156 are aligned, the preheating head 156 can release the panel carrier assembly 104 onto the preheating table 151 to preheat the panel carrier assembly 104 to the intermediate temperature.

[0149] According to various embodiments, the feed mechanism moving plane 161p of the feed mechanism 161 can be spatially separated from and / or parallel to and / or located above the preheating table moving plane 151p of the preheating table 151. Therefore, when the feed mechanism 161 moves into the preheating station 150, the feed mechanism 161 can be located above the preheating table 151 or the preheating table moving plane 151p to align with the preheating head 156. Alternatively, the feed mechanism moving plane 161p can also be located below the preheating table moving plane 151p.

[0150] According to various embodiments, the preheating table 151 can be moved synchronously with the feed mechanism 161 into and out of the preheating station 150. Thus, the preheating table 151 can be moved out of the preheating station 150, for example, to the release station 110, or to a location between the preheating station 150 and the release station 110, thereby facilitating the feed mechanism 161 to enter the preheating station 150 and / or align with the preheating head 156 within the preheating station 150. Alternatively, the preheating table 151 and the feed mechanism 161 can move along the same plane, or they can each move along different and spatially separated planes (e.g., one plane positioned above the other).

[0151] According to various embodiments, after the feed mechanism 161 is aligned with the preheating head 156, the preheating head 156 can be moved toward the feed mechanism 161 to releasably hold and lift the panel carrier assembly 104 away from the feed mechanism 161 (e.g., using the preheating head holder 158). Therefore, when the preheating head 156 (now releasably holding the panel carrier assembly 104) moves away from the feed mechanism 161, the feed mechanism 161 (now free of the panel carrier assembly 104) moves out of the preheating station 150 and returns to the feed station 160 (now ready to receive the next panel carrier assembly 104). Subsequently, when the preheating table 151 is aligned with the preheating head 156, the preheating head 156 can place the panel carrier assembly 104 onto the preheating table 151.

[0152] According to various embodiments, the feed mechanism moving plane 161p and the preheating table moving plane 151p can be horizontal or substantially horizontal (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is placed and / or upright on an exterior ground or floor). Simultaneously, the direction of lateral or transverse movement of the feed mechanism 161 along the feed mechanism moving plane 161p can be non-parallel to, for example, perpendicular or substantially perpendicular to, the direction of lateral or transverse movement of the preheating table 151 along the preheating table moving plane 151p. In other words, the feed mechanism 161 and the preheating table 151 can move in different and / or non-parallel (e.g., perpendicular) directions. Optionally, the preheating head 156 can rotate the panel carrier assembly 104 around a preheating head rotation axis 156r. The preheating head rotation axis 156r may be oriented vertically (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is positioned and / or placed upright on an exterior ground or floor), may pass through the preheating head 156 (e.g., its central axis), and may be aligned with (e.g., parallel to and / or coincident with) the preheating head movement plane 156p. Before releasing the panel carrier assembly 104 to the preheating table 151, the preheating head 156 may rotate the panel carrier assembly 104 by an angle, e.g., a right angle in a clockwise direction when viewed from the top or in a plan view, while the preheating head 156 releasably holds the panel carrier assembly 104 on the fourth engagement surface 156a. The angle is approximately equal to the angle between the direction of movement of the feeding mechanism 161 along the feeding mechanism moving plane 161p and the direction of movement of the preheating table 151 along the preheating table moving plane 151p, for example a right angle, so that the panel carrier assembly 104 is aligned with the preheating station 150.

[0153] According to various embodiments, the angle at which the panel carrier assembly 104 rotates about the preheating head rotation axis 156r is determined not only based on the relative movement direction of the feed mechanism 161 and the preheating table 151, but also taking into account the relative positions of the feed station 160 and / or the preheating station 150, as well as other possible factors. The angle at which the panel carrier assembly 104 rotates about the preheating head rotation axis 156r may be determined by one or more factors, including but not limited to: the layout of the components of the panel release system 1000 (e.g., the feed station 160 and / or the preheating station 150), and the requirements of processes or automation external to the panel release system 1000 (upstream and / or downstream).

[0154] According to various embodiments, the rotation of the preheating head 156 about the preheating head rotation axis 156r may be performed based on a rotation signal. Alternatively, the rotation signal may be transmitted to the preheating head 156 to instruct the preheating head 156 to rotate.

[0155] According to various embodiments, Figure 1R The feeding station 160 is schematically shown to be directly connected to the preheating station 150 , wherein the feeding station 160 includes an alignment unit 165 .

[0156] According to various embodiments, the alignment unit 165 may rotate the panel carrier assembly 104 by an angle, for example, in a clockwise direction when viewed from the top or a plan view of the panel release system 1000. The angle may be approximately equal to the angle between the direction of movement of the feed mechanism 161 along the feed mechanism movement plane 161p and the direction of movement of the preheating stage 151 along the preheating stage movement plane 151p.

[0157] According to various embodiments, the alignment unit 165 may include an alignment head 166. The alignment head 166 may be located on an opposite side of and / or above the feed mechanism 161 within the feed station 160. Thus, within the feed station 160, the feed mechanism 161 may be located in a lower area, while the alignment head 166 may be located in an upper area.

[0158] According to various embodiments, the alignment head 166 can be movable within the feed station 160 along an alignment head movement plane 166p. Optionally, the alignment head movement plane 166p can be a substantially flat plane that is oriented substantially vertically (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is positioned and / or positioned in an upright manner on an exterior ground or floor). Within the feed station 160, the alignment head movement plane 166p can be parallel or substantially parallel to the release head movement plane 116p at the release station 110. The alignment head movement plane 166p can also be non-parallel to the feed mechanism movement plane 161p, for example, perpendicular or substantially perpendicular. When the feed mechanism 161 is located within the feed station 160, the alignment head movement plane 166p can be aligned with (e.g., intersecting) the feed mechanism 161 (e.g., its conveying surface 161a). Alternatively, the alignment unit 165 may be operated as a pressing device or a pressing device, and the alignment head 166 may be movable in an upward and downward direction along an alignment head moving plane 166p. When the panel carrier assembly 104 is aligned with and positioned below the alignment head 166, the alignment head 166 may engage with the panel carrier assembly 104 and lift the panel carrier assembly 104 from the feed mechanism 161 and away from the feed mechanism 161. When the feed mechanism 161 (now carrying the panel carrier assembly 104) is located within the feed station 160 and aligned with the alignment head 166, the alignment head 166 may move toward the conveying surface 161a of the feed mechanism 161 to engage with the panel carrier assembly 104 on the feed mechanism 161. The movement of the alignment head 166 along the alignment head moving plane 166p may be based on a movement signal. Alternatively, the movement signal may be transmitted to the alignment head 166 to instruct it to move.

[0159] According to various embodiments, the alignment head 166 may include an alignment head holder 168. The alignment head holder 168 may releasably hold (e.g., releasably secure or grip) the panel carrier assembly 104 on a fifth engagement surface 166a (e.g., a downwardly facing surface) of the alignment head 166. Optionally, the alignment head holder 168 is disposed at or near the fifth engagement surface 166a of the alignment head 166. The alignment head holder 168 may include a vacuum suction mechanism (e.g., a vacuum plate, vacuum suction holes, vacuum suction cups, etc.), a clamping mechanism (e.g., a clamp or a clamp), an electrostatic chuck, an end effector, etc. The operation of the alignment head holder 168 may be based on a hold control signal. Optionally, the hold control signal may be transmitted to the alignment head holder 168 to instruct its operation.

[0160] According to various embodiments, the alignment head 166 can further rotate about an alignment unit rotation axis 166r. The alignment unit rotation axis 166r can be vertically oriented (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is placed vertically on the ground outside), and can further pass through the alignment head 166, e.g., through its central axis, and can also be aligned with, e.g., parallel to and / or coincident with, the alignment head movement plane 166p.

[0161] According to various embodiments, when the panel carrier assembly 104 is releasably held on the fifth engagement surface 166a of the alignment head 166, and before the alignment head 166 releases the panel carrier assembly 104 to the feed mechanism 161, the alignment head 166 may rotate the panel carrier assembly 104 about the alignment unit rotation axis 166r. Optionally, the rotation angle is approximately equal to the angle formed by the direction in which the feed mechanism 161 moves along the feed mechanism movement plane 161p and the direction in which the preheating stage 151 moves along the preheating stage movement plane 151p, for example, a right angle.

[0162] According to various embodiments, the rotation angle of the panel carrier assembly 104 about the alignment unit rotation axis 166r may be determined not only based on the relative movement direction of the feed mechanism 161 and the preheating station 151, but may also be based on the positional relationship between the feed station 160 and / or the preheating station 150, as well as other factors. Specifically, the rotation angle of the panel carrier assembly 104 about the alignment unit rotation axis 166r may be determined by a combination of factors, including but not limited to the layout of the components within the panel release system 1000 (e.g., the feed station 160 and / or the preheating station 150), upstream and / or downstream processes or automation outside of the panel release system 1000, and the like.

[0163] According to various embodiments, the rotation of the alignment head 166 about the alignment unit rotation axis 166r may be performed based on a rotation signal. Alternatively, the rotation signal may be transmitted to the alignment head 166 to instruct the rotation thereof.

[0164] According to various embodiments, Figure 2A A perspective view of a panel release system 2000 is schematically shown.

[0165] According to various embodiments, panel release system 2000 may have any one or more features of panel release system 1000, and vice versa.

[0166] According to various embodiments, the panel release system 2000 may include a feed station 260 that may have any one or more features of the feed station 160, or vice versa.

[0167] According to various embodiments, the panel release system 2000 may include a preheating station 250, which may have any one or more features of the preheating station 150, or vice versa. The preheating station 250 may be directly or indirectly connected to the feed station 260, for example, via a transport mechanism such as one or more movable platforms and / or actuating components in the panel release system 2000. For example, the preheating station 250 may be located downstream of the feed station 260.

[0168] According to various embodiments, panel release system 2000 may include a release station 210 that may have any one or more features of release station 110, or vice versa. Release station 210 may be directly or indirectly connected to preheating station 250, for example, via a transport mechanism such as one or more movable platforms and / or actuating components. For example, release station 210 may be located downstream of preheating station 250.

[0169] According to various embodiments, the panel release system 2000 may include a panel handling station 220 that may have any one or more features of the panel handling station 120, or vice versa. The panel handling station 220 may be directly or indirectly connected to the release station 210, for example, via one or more movable platforms and / or actuating components. For example, the panel handling station 220 may be located downstream of the release station 210.

[0170] According to various embodiments, the panel release system 2000 can include a carrier handling station 230 that can have any one or more features of the carrier handling station 130. The carrier handling station 230 can be directly or indirectly connected to the release station 210, for example, via one or more movable platforms and / or actuating components. For example, the carrier handling station 230 can be located downstream of the release station 210.

[0171] According to multiple embodiments, when the panel release system 2000 includes both a panel processing station 220 and a carrier processing station 230, the panel processing station 220 and the carrier processing station 230 may both be connected to the release station 210, for example, through different sides of the release station 210, and both may be located downstream of the release station 210, for example, downstream from different sides of the release station 210, respectively.

[0172] According to various embodiments, the panel release system 2000 can include an unloading station 240 that can have any one or more features of the unloading station 140. The unloading station 240 can be directly or indirectly connected to the carrier processing station 230, for example, via one or more movable platforms and / or actuating components. For example, the unloading station 240 can be located downstream of the carrier processing station 230.

[0173] According to various embodiments, the panel processing head of the panel processing station 220 (the same as or similar to the panel processing head 126) can move along a panel processing head lateral movement plane 226q, and the unloading tray 241 of the unloading station 240 (the same as or similar to the unloading tray 141) can move along an unloading tray movement plane 241p. The panel processing head lateral movement plane 226q can be parallel to and / or spatially separated from the unloading tray movement plane 241p, for example, one being above / below the other. Alternatively, the direction of movement of the panel processing head of the panel processing station 220 along the panel processing head lateral movement plane 226q (as indicated by the dashed arrow 222) can be perpendicular or substantially perpendicular to the direction of movement of the unloading tray 241 of the unloading station 240 along the unloading tray movement plane 241p (as indicated by the solid arrow 242). After being processed by the panel release system 2000, the molded panel 101 and the carrier 103 of the panel carrier assembly 104 are separated. The separated molded panel 101 and the separated carrier 103 can be respectively transported out of the panel release system 2000 in substantially horizontal but perpendicular or orthogonal directions (as indicated by dashed arrows 222 and solid arrows 242). Furthermore, the separated molded panel 101 and the separated carrier 103 can also be transported out of the panel release system 2000 at different heights. Optionally, the panel processing station 220 may include a panel processing guide 229, such as a track, a track, or a slide rail, for guiding the panel processing head of the panel processing station 220 to move along the panel processing head lateral movement plane 226q in the direction indicated by dashed arrow 222. Optionally, the panel processing guide 229 may also include an actuator. The actuator can drive the panel processing head to move based on a movement signal transmitted to the panel processing head.

[0174] According to various embodiments, the panel release system 2000 and / or its components, such as the release station 210, the panel handling station 220, the carrier handling station 230, the unloading station 240, the preheating station 250, and / or the infeed station 260, can be implemented using a modular architecture. For example, any one or more applicable components can be adjusted, omitted, relocated, or replaced as needed.

[0175] According to various embodiments, Figure 2B and Figure 2C Other configurations of panel release system 2000 are shown.

[0176] According to various embodiments, the spatial arrangement of any one or more components of the panel release system 2000 may vary. For example, Figure 2B As shown, the feed station 260, the preheating station 250 and the release station 210 can be aligned in a linear arrangement. Figure 2BAs shown, the feed station 260 and the release station 210 can be located on opposite sides of the preheat station 250. Therefore, the panel carrier assembly 104 can enter the panel release system 2000 from the feed station 260 and be sequentially transferred to the preheat station 250 and then to the release station 210 along a linear path.

[0177] According to various embodiments, the modular architecture of the panel release system 2000 is flexible and can be adapted to different manufacturing sites, processes or automation flows, and / or integrated with other equipment.

[0178] According to various embodiments, Figure 2C As shown, the separated carrier 103 can be directly output from the release station 210 of the panel release system 2000, that is, without passing through the carrier processing station 230 and / or the unloading station 240. In other words, Figure 2C In the embodiment of the present invention, the carrier handling station 230 and / or the unloading station 240 may be omitted from the panel release system 2000. Alternatively, any one or more components of the panel release system 2000 may be selectively omitted.

[0179] According to various embodiments, Figure 3A The control unit 180 that can be integrated into the panel release system 1000 is schematically shown. The control unit 180 can be integrated into any one or more components of the panel release system 1000, such as the release station 110 and / or the cutting station 170, and can be integrated into the panel release system 1000. Figure 3B described in .

[0180] According to multiple embodiments, the control unit 180 (such as a control module, a processor, a controller or a microcontroller, etc.) can directly or indirectly control the operation of the panel carrier assembly 104 to destroy or weaken the bonding strength between the molded plastic panel 101 and the carrier 103 before heating the panel carrier assembly 104 to a release temperature, for example, by heating by the carrier table heater 112 at the carrier table 111 and / or the release head heater 117 of the release head 116, and / or before the molded panel 101 is separated from the carrier 103.

[0181] In other words, the panel release system 1000 may include a pre-release arrangement / process that may perform one or more operations on the panel-carrier assembly 104 to disrupt or weaken the bond between the molded panel 101 and the carrier 103 before the molded panel 101 is separated from the carrier 103. The pre-release arrangement / process may be controlled by the control unit 180 to operate one or more components of the panel release system 1000, such as the carrier stage 111 and / or the material removal tool (e.g., Figure 3B 179 described in the cutter 179), thereby performing an operation on the panel carrier assembly 104 to disturb or weaken the bonding strength between the molded panel 101 and the carrier 103.

[0182] According to various embodiments, the pre-release arrangement / process may apply a suitable force, such as a mechanical force, to the thermal release tape 102. For example, a shear force or a lateral force applied by the carrier stage 111, or a cutting force applied by a material removal tool (e.g., a cutter 179), to weaken the bond between the carrier 103 and the molded panel 101 in the panel carrier assembly 104, thereby reducing the adhesive strength of the thermal release tape 102 before the molded panel 101 is completely separated from the carrier 103.

[0183] According to various embodiments, Figure 3A As shown, the control unit 180 can be integrated with the release station 110, for example, electrically and / or communicatively connected, directly or indirectly connected. The control unit 180 can control one or more components of the panel release system 1000, for example, the release station 110, to operate the pre-release arrangement / process.

[0184] According to various embodiments, when the carrier stage 111 and the release head 116 are cooperatively holding the panel carrier assembly 104, i.e., the carrier stage 111 and the release head 116 are in contact with the carrier 103 and the molded panel 101 in the panel carrier assembly 104, respectively, the control unit 180 can control the carrier stage 111 to move a predetermined distance along the carrier stage movement plane 111p (e.g., in a lateral or shear direction). Optionally, the movement is performed by the carrier stage 111 relative to the release head 116. Optionally, the pre-release arrangement / process is performed before the molded panel 101 is completely separated from the carrier 103, i.e., before the release operation is performed. When the carrier stage 111 and the release head 116 cooperate to hold the panel carrier assembly 104, the relative lateral or shear movement occurs, which can mechanically disturb the adhesion interface between the molded panel 101 and the heat-sensitive adhesive layer 102a of the thermal release tape 102, thereby disrupting or weakening the adhesive strength of the thermal release tape 102 and facilitating partial detachment of the molded panel 101 from the carrier 103 before complete separation from the carrier 103. Optionally, the pre-release arrangement / process is located at the release station 110. The pre-release arrangement / process can improve the efficiency of subsequent complete separation or release of the panel carrier assembly 104. For example, the control unit 180 can control the carrier stage 111 to move (e.g., lateral or shear) a predetermined distance relative to the release head 116 to generate shear movement, thereby inducing stress, disturbance, or displacement at the adhesion interface between the molded panel 101 and the heat-sensitive adhesive layer 102a of the thermal release tape 102, thereby facilitating the subsequent complete separation process between the molded panel 101 and the thermal release tape 102. Optionally, the predetermined distance that the carrier table 111 is controlled to move may be in the range of 0.5 to 3.5 mm, more specifically in the range of 1.5 to 2.5 mm, and more preferably about 2 mm. The carrier table 111 may be controlled to move in one direction or two directions, for example, approximately 2 mm to the right and / or 2 mm to the left. That is, when the release head holder 118 releasably holds the molded panel 101 in the panel carrier assembly 104 on the first engagement surface 116a of the release head 116, and the carrier table holder 113 releasably holds the carrier 103 in the panel carrier assembly 104 on the first table surface 111a of the carrier table 111, the control unit 180 may control the carrier table 111 to move the predetermined distance relative to the release head 116, at which point the molded panel 101 and the carrier 103 still overlap each other. Therefore, when the carrier table 111 and the release head 116 hold the carrier 103 and the molded panel 101 respectively, before the molded panel 101 is completely separated from the carrier 103, the carrier table 111 can be moved along the carrier table moving plane 111p within the release station 110 by the predetermined distance to achieve the pre-release arrangement / process.

[0185] According to various embodiments, the panel release system 1000 may include an actuator, such as a motor, coupled to the carrier stage 111, capable of driving the carrier stage 111 to move the predetermined distance along the carrier stage movement plane 111p. A control unit 180 may be coupled to the actuator (e.g., via communication) to control the movement of the carrier stage 111. The control unit 180 may control the operation of the actuator to initiate, regulate, and / or synchronize the movement of the carrier stage 111 relative to the release head 116, thereby achieving a desired disturbance at the adhesion interface between the molded panel 101 and the thermal release tape 102.

[0186] According to various embodiments, the carrier stage 111 and the release head 116 may include a first alignment element 182a and a second alignment element 182b (e.g., fiducial marks), respectively. Optionally, the first alignment element 182a and the second alignment element 182b are disposed at corresponding locations on the carrier stage 111 and the release head 116. Optionally, the first alignment element 182a and the second alignment element 182b allow for monitoring of the relative lateral or shear displacement between the carrier stage 111 and the release head 116 during the pre-release arrangement / process (e.g., using a vision-based sensor). The first alignment element 182a and the second alignment element 182b may be aligned with each other during the co-heating process of heating the thermal release tape 102 in the panel carrier assembly 104 to the thermal release temperature, but before the molded panel 101 is separated from the carrier 103. Subsequently, the release head 116 is fixed and the carrier stage 111 is controlled (e.g., by the control unit 180) to produce relative lateral or shear movement to disturb the adhesion interface between the mold panel 101 and the heat-sensitive adhesive layer 102a of the thermal release tape 102. At this time, the first alignment elements 182a and the second alignment elements 182b on the carrier stage 111 and the release head 116 may lose their previous alignment (misalignment). The misalignment between the first alignment elements 182a and the second alignment elements 182b can be detected (e.g., by a visual or optical sensor) to confirm the lateral or shear movement of the specific distance. The misalignment between the first alignment elements 182a and the second alignment elements 182b can be used to verify, measure, or calibrate the displacement generated by the actuator controlled by the control unit 180 (e.g., a motor for controlling the movement of the carrier stage 111), thereby ensuring that the disturbance of the adhesion interface between the mold panel 101 and the thermal release tape 102 has been performed as expected. A sensor (e.g., an optical sensor, a camera-based image recognition module, etc.) of the panel release system 1000 can be disposed within the release station 110 to detect alignment and / or misalignment between the first and second alignment elements 182a, 182b. The sensor can be in communication with the control unit 180, enabling the control unit 180 to receive and validate a signal or measurement associated with the predetermined distance. The control unit 180 can thus use this information to verify, calibrate, or adjust the lateral or shear movement and / or provide closed-loop control feedback to an actuator that moves the carrier stage 111 relative to the release head 116 during the pre-release arrangement / process. Optionally, the first and second alignment elements 182a, 182b can be provided as matching or complementary textured or patterned structures on the outer surfaces of the carrier stage 111 and the release head 116, respectively, or any other suitable type of fiducial marking, such as, for example, an ink- or paint-based marking.

[0187] According to various embodiments, the pre-release arrangement / process of the panel release system 1000 may include a carrier stage 111 (i.e., a first mechanical component of the pre-release arrangement) and a release head 116 (i.e., a second mechanical component of the pre-release arrangement), wherein the carrier stage 111 is movable along a carrier stage movement plane 111p. At this time, a release head holder 118 and a carrier stage holder 113 respectively hold the molded panel 101 and carrier 103 in the panel carrier assembly 104 on the first engagement surface 116a of the release head 116 and the first table surface 111a of the carrier stage 111. Optionally, the pre-release arrangement / process also includes a control unit 180 for driving the carrier stage 111.

[0188] According to various embodiments, Figure 3B The cutting station 170 of the panel release system 1000 is schematically shown.

[0189] According to various embodiments, the cutting station 170 can be used to implement the pre-release arrangement / process. Optionally, the cutting station 170 is disposed upstream of the release station 110, for example, directly or indirectly upstream. The cutting station 170 can be connected to the release station 110, for example, directly or indirectly, via a movement or transport mechanism of the panel release system 1000, for example, one or more movable platforms and / or actuating members.

[0190] According to various embodiments, the cutting station 170 may include the material removal tool, such as the cutter 179. Optionally, the material removal tool may remove at least a portion of the panel-carrier assembly 104 (e.g., at least a portion of the molding material of the molded panel 101) before the molded panel 101 is separated from the carrier 103, for example, by cutting and removing the material using the cutter 179. Optionally, the material removal tool may also remove at least a portion of the molding material of the molded panel 101 after the molded panel 101 is separated from the carrier 103.

[0191] It is understood that the material removal tool may also be provided at other components of the panel release system 1000, such as the feed station 160, the release station 110, or the panel handling station 120. Therefore, the panel release system 1000 may not include a separate cutting station 170.

[0192] According to various embodiments, a cutter 179 may be used to cut and remove at least a portion of the molding material of the molded panel 101. Optionally, the cutting occurs before the molded panel 101 is separated from the carrier 103, cutting through the entire thickness of the molded panel 101, that is, completely cutting through the thickness direction. However, the cut molded panel 101 is still adhered to the carrier 103.

[0193] In various embodiments, the cutter 179 may serve as a corresponding mechanical component in the panel release system 1000 to implement the pre-release arrangement / process.

[0194] In various embodiments, the cutter 179 may form a molded panel 101 (before or after separation from the carrier 103) by cutting at least a portion of the molded material. Figure 3D Q panel shown.

[0195] Figure 3C The diagram schematically shows the separated molded panel 101 adhered to the carrier 103 before being released from the carrier 103 or existing independently after being released from the carrier 103, as shown by the dotted box in the figure.

[0196] According to various embodiments, the cutter 179 may cut and remove the peripheral edge portion 101a of the molded panel 101. In other words, the control unit 180 may control the cutter 179 to completely cut through the peripheral edge portion 101a of the molded panel 101.

[0197] According to various embodiments, the peripheral edge portion 101a can be a continuous, uninterrupted, annular portion of the molded panel 101 that surrounds or encloses the inner central portion 101b of the molded panel 101. However, the peripheral edge portion 101a can also be one or more discrete edge portions located at the periphery of the molded panel 101. It will be appreciated that because the peripheral edge portion 101a of the molded panel 101 can adhere more firmly to the thermal release tape 102 than the inner central portion 101b, cutting the peripheral edge portion 101a of the molded panel 101 facilitates subsequent complete separation of the inner central portion 101b of the molded panel 101 from the thermal release tape 102.

[0198] In various embodiments, the peripheral edge portion 101a of the molded panel 101 may correspond to an inactive or non-functional area within the molded panel 101. That is, the peripheral edge portion 101a may comprise only molding material without any chips, dies, and / or other active or passive circuit components. Meanwhile, the inner central portion 101b of the molded panel 101 may correspond to an active or functional area, that is, the inner central portion 101b may comprise chips, dies, and / or other active or passive circuit components.

[0199] According to various embodiments, the cutter 179 may include a laser cutter, a mechanical cutter such as a blade, a saw blade, a tool head, a milling head, etc., or any other suitable cutting device.

[0200] According to various embodiments, when the cutter 179 includes a laser cutter, a focused laser beam can be irradiated onto the molded panel 101, selectively ablating, melting, or vaporizing the molded material along a predetermined cutting path, thereby separating the peripheral edge portion 101a from the inner central portion 101b. The laser cutter can cut according to a pre-programmed cutting profile, so that the cutting profile shown can be defined as the boundary between the peripheral edge portion 101a and the inner central portion 101b. Alternatively, the laser cutter can completely ablate, melt, or vaporize the molded panel 101 in the thickness direction along the boundary. Alternatively, the laser cutter can be controlled by the control unit 180 based on a cutting control signal.

[0201] According to various embodiments, when the cutter 179 comprises a mechanical cutter, it can be mechanically moved relative to the molded panel 101 to cut and remove the molded material along the boundary. For example, the mechanical cutter can be mounted on a movable member. The movable member can be driven by an actuator (e.g., an electric motor) and can be controlled by the control unit 180 based on a cutting control signal.

[0202] According to various embodiments, the panel size of molded panel 101 can be slightly smaller than that of carrier 103, as shown by the dashed box, for example, a square of approximately 700 mm x 700 mm. In this case, the width of peripheral edge portion 101a can be varied to adjust the size of inner central portion 101b, thereby adapting inner central portion 101b to subsequent processing. Furthermore, removing peripheral edge portion 101a of molded panel 101 helps define a neater and more regular boundary for inner central portion 101b, facilitating subsequent processing.

[0203] According to various embodiments, Figure 3D The molded panel 101 (before or after separation from the carrier 103) and a plurality of unit regions 101c cut out by a cutter 179 in the panel release system 1000 (eg, the cutting station 170, or other components) are schematically shown.

[0204] According to various embodiments, Figure 3D As shown, the cutter 179 can separate a plurality of unit areas 101c from the molded panel 101. That is, the cutter 179 can cut the molded panel 101 into one or more smaller-sized parts, namely, Q panels.

[0205] In various embodiments, after the molded panel 101 is cut but before the molded panel 101 is separated from the carrier 103 , the Q panel may still be adhered to the carrier 103 via the thermal release tape 102 , which is still referred to as a panel carrier assembly 104 .

[0206] In various embodiments, the cutter 179 may also cut the interior central portion 101 b of the molded panel 101 in addition to or in lieu of cutting the peripheral edge portion 101 a .

[0207] In various embodiments, the plurality of unit regions 101c can be defined by predetermined cutting paths within the interior central portion 101b of the molded panel 101. Optionally, the cutter 179 can cut along predetermined cutting paths corresponding to each unit region 101c, so that each unit region 101c can be separated from the remainder of the molded panel 101 after the cutting operation is completed, for example, individually or simultaneously. Alternatively, the cutting can penetrate the entire thickness of the molded panel 101, in which case each unit region 101c can exist independently. Alternatively, the cutter 179 can also partially cut the molded panel 101 through its thickness, in which case each unit region 101c does not exist independently.

[0208] According to various embodiments, each unit region 101c may correspond to the shape or outer boundary of one (e.g., a single-chip module (SCM)) or multiple (e.g., a multi-chip module (MCM)) chips, chipsets, device packages, integrated circuits, packaging units, functional units, and / or any applicable electronic, microelectronic, or optoelectronic units, subunits, or devices.

[0209] According to various embodiments, the shapes and sizes of the plurality of unit regions 101 c may be the same as each other, but may also be different from each other.

[0210] According to various embodiments, the cutter 179 may cut the molded panel 101 into a plurality of unit regions 101 c. For example, as shown in the figure, the cutter 179 may cut the molded panel 101 into nine unit regions 101 c in a 3×3 array. Alternatively, the plurality of unit regions 101 c may be evenly spaced apart from one another on the molded panel 101. Alternatively, the plurality of unit regions 101 c may be distributed in any other manner.

[0211] According to various embodiments, Figure 3F The cutting station 170 is schematically shown integrated into the panel release system 1000 .

[0212] Figure 3G A mode in which the cutting station 170 is connected to the feeding station 160 is schematically shown.

[0213] According to various embodiments, Figure 3F and Figure 3GAs shown, before cutting (including the pre-cutting) is performed, the panel carrier assembly 104 can enter the panel release system 1000 from the feed station 160. For example, the panel carrier assembly 104 can be placed on the feed mechanism 161 with the molded panel 101 facing upward. Subsequently, the feed mechanism 161 can be moved from the feed station 160 to the cutting station 170. For example, the feed mechanism 161 can move laterally or sideways along the feed mechanism movement plane 161p between the feed station 160 and the cutting station 170. According to various embodiments, the lateral or sideways movement of the feed mechanism 161 along the feed mechanism movement plane 161p between the feed station 160 and the cutting station 170 can be based on a movement signal. Optionally, the movement signal can be transmitted to the feed mechanism 161 to instruct it to move laterally or sideways.

[0214] According to various embodiments, at the cutting station 170, a cutter 179 can cut the molded panel 101 adhered to the carrier 103. Optionally, the panel carrier assembly 104 (including the molded panel 101) is held on the feed mechanism 161 while the cutting is performed.

[0215] According to various embodiments, the panel carrier assembly 104 may be transferred from the feed mechanism 161 to a cutting table 171 within the cutting station 170, such as a cutting deck or platform. Figure 3H As shown, the molded panel 101 is cut, and then the cut molded panel 101 is sent back to the feeding mechanism 161.

[0216] After the cutting is completed, the feed mechanism 161 can also transport the panel carrier assembly 104 (at this point, the molded panel 101 has been cut into one or more Q panels) to another component of the panel release system 1000, such as the preheating station 150. For example, the feed mechanism 161 can first return to or pass through the feed station 160 before continuing to move downstream to the preheating station 150. For example, the preheating station 150 and the cutting station 170 can be located on opposite linear sides or orthogonal sides of the feed station 160, respectively. Therefore, the direction of movement of the feed mechanism 161 between the feed station 160 and the cutting station 170 may be parallel to the direction of movement between the feed station 160 and the preheating station 150 (for the linear arrangement), but may also be perpendicular (for the orthogonal arrangement).

[0217] Figure 3H Another embodiment in which the cutting station 170 is connected to the feeding station 160 is schematically shown.

[0218] According to various embodiments, Figure 3HAs shown, the alignment head 166 can be movable between the feed station 160 and the cutting station 170. Optionally, the alignment head 166 can be movable laterally along an alignment head transverse movement plane 166q. The alignment head transverse movement plane 166q can be a substantially flat plane that is substantially horizontal relative to the base of the panel release system 1000 (e.g., when the panel release system 1000 is positioned in a vertical manner and / or is located on an exterior ground or floor). Optionally, the alignment head transverse movement plane 166q is non-parallel to the alignment head movement plane 166p, e.g., perpendicular or substantially perpendicular. Optionally, the alignment head transverse movement plane 166q is parallel to the carrier stage movement plane 111p. Thus, the alignment head 166 can be movable in a transverse direction (e.g., a relatively linear direction) along the alignment head transverse movement plane 166q between the feed station 160 and the cutting station 170. Optionally, the direction in which the alignment head 166 moves laterally along the alignment head transverse movement plane 166q between the feed station 160 and the cutting station 170 may be non-parallel to, for example, perpendicular to, the direction in which the panel table 121 moves laterally along the panel table movement plane 121p between the panel processing station 120 and the release station 110 (but not limited to). Optionally, the panel release system 1000 includes a guide rail, track, or slide, such as a linear guide. The guide rail may extend between the feed station 160 and the cutting station 170 and guide the alignment head 166 along the same. Optionally, the movement of the alignment head 166 along the alignment head transverse movement plane 166q may be based on a movement signal. The movement signal may be transmitted to the alignment head 166 to instruct it to move.

[0219] According to several embodiments, after the panel carrier assembly 104 (having an uncut or only pre-cut molded panel 101) is placed in the feed station 160 (e.g., above the feed mechanism 161), the alignment head 166 can engage with the panel carrier assembly 104 at the feed station 160 (e.g., via the alignment head retainer 168), thereby releasably retaining the panel carrier assembly 104, and then the panel carrier assembly 104 is lifted (e.g., from above the feed mechanism 161) and transported laterally to the cutting station 170.

[0220] According to various embodiments, at the cutting station 170, the alignment head 166 may be aligned with the cutting table 171 and the panel carrier assembly 104 may be placed on the cutting table 171. At this point, the alignment head 166 and the cutting table 171 may be located in a higher area and a lower area of ​​the cutting station 170, respectively. Specifically, after the alignment head 166 is aligned with the cutting table 171, the alignment head 166 may move along an alignment head movement plane 166p to release the panel carrier assembly 104 onto the cutting table 171 at the cutting station 170.

[0221] According to various embodiments, the cutting table 171 of the cutting station 170 may include a cutting table holder 173, such as a vacuum suction mechanism, a clamping mechanism, an electrostatic chuck, an end effector, etc., for releasably securing the molded panel 101 during the cutting process. Optionally, the cutting table holder 173 may operate based on a holding control signal. The holding control signal may be transmitted to the cutting table holder 173 to instruct the cutting table holder 173 to operate.

[0222] Therefore, after the molded panel 101 is placed on the cutting table 171 , the cutter 179 may perform a cutting operation.

[0223] After the cutting is completed, the alignment head 166 can engage the panel carrier assembly 104 (with the cut molded panel 101), then lift the panel carrier assembly 104 (with the cut molded panel 101) from the cutting table 171 and transfer the panel carrier assembly 104 (along with the cut molded panel 101) to the next component of the panel release system 1000, such as the preheating station 150, according to the process of the panel release system 1000. Optionally, the panel carrier assembly 104 can be returned to the infeed station 160 (e.g., when the infeed station 160 is located between the cutting station 170 and the next component) before the alignment head 166 moves to the next component of the panel release system 1000. For example, if the next component is the preheating station 150, the alignment head 166 can pass through the infeed station 160 again during the process of transferring the panel carrier assembly 104 (with the cut molded panel 101) from the cutting station 170 to the preheating station 150.

[0224] According to various embodiments, the functional or active portion of the molded panel 101, such as the inner central portion 101b and / or the individual unit regions 101c, i.e., the Q-panel, may be separated from the carrier 103 within the release station 110. In other words, the non-functional or inactive portion of the molded panel 101, such as the peripheral edge portion 101a or any remaining portion outside the unit regions 101c, may not be separated from the carrier 103.

[0225] According to various embodiments, the molded panel 101 may not be cut before being released from the carrier 103. Therefore, the separated molded panel 101 may be removed from the release station 110 as a whole while remaining in a cut state. Subsequently, the separated molded panel 101 is moved out of the release station 110 and then moved to the cutting station 170, for example, possibly passing through the panel processing station 120, and cut in the manner described above, for example, into one or more Q panels. Optionally, the cutting station 170 may also be disposed outside the panel release system 1000. After the separated molded panel 101 is removed from the panel release system 1000, it may enter the cutting station 170 (or a similar device located outside the panel release system 1000) and be cut in the manner described above or in a similar manner.

[0226] According to various embodiments, Figure 3E A plan view of a release head 116 is schematically shown, wherein the release head 116 has a multi-zone vacuum holding device 190 .

[0227] According to various embodiments, the release head 116 includes a multi-zone vacuum holding device 190. Optionally, the multi-zone vacuum holding device 190 may be located at the first engagement surface 116a of the release head 116. Figure 3E As shown, the multi-zone vacuum holding device 190 may have a first vacuum holding area 190a, a second vacuum holding area 190b surrounded by the first vacuum holding area 190a, and a third vacuum holding area 190c surrounded by the second vacuum holding area 190b. That is, the second vacuum holding area 190b is located between the first vacuum holding area 190a and the third vacuum holding area 190c. Figure 3E As shown, the first vacuum holding zone 190a and the second vacuum holding zone 190b can both be annular, for example, a continuous or discontinuous closed loop. It should be understood that the multi-zone vacuum holding device 190 can include any number of vacuum holding zones, for example, two or more than three vacuum holding zones, and the other (additional) vacuum holding zones can have the same or similar structures as the first vacuum holding zone 190a, the second vacuum holding zone 190b, or the third vacuum holding zone 190c.

[0228] According to various embodiments, the multi-zone vacuum holding device 190 may include a main vacuum suction port 191 and an auxiliary vacuum suction port 192 for holding the molded panel 101 (cut or uncut) by vacuum suction. Optionally, the main vacuum suction port 191 may be larger than the auxiliary vacuum suction port 192, so that the main vacuum suction port 191 can provide a stronger suction force, thereby more firmly holding the molded panel 101 on the first engaging surface 116a of the release head 116.

[0229] According to various embodiments, the first vacuum holding area 190a can hold an uncut or pre-cut molded panel 101, which is still adhered to the carrier 103 or has been separated from the carrier 103. Optionally, the first vacuum holding area 190a can also engage with the peripheral edge portion 101a (e.g., an inactive area or a non-functional area) of the molded panel 101. Thus, the first vacuum holding area 190a can releasably hold the molded panel 101 as a whole on the first engagement surface 116a of the release head 116. Optionally, the first vacuum holding area 190a includes a set of main vacuum suction ports 191 and / or a set of auxiliary vacuum suction ports 192. For example, the main vacuum suction ports 191 and / or the auxiliary vacuum suction ports 192 can be distributed in an interval manner along the annular structure of the first vacuum holding area 190a.

[0230] According to various embodiments, the second vacuum holding zone 190b and / or the third vacuum holding zone 190c can be used to hold the inner central portion 101b or Q-panel formed after the mold panel 102 is cut. Thus, the second vacuum holding zone 190b and / or the third vacuum holding zone 190c can releasably hold the inner central portion 101b or Q-panel on the first engagement surface 116a of the release head 116. Active or reactive components (e.g., chips) in the inner central portion 101b of the mold panel 101 may have a relatively small pitch, which may limit the use of a primary vacuum port 191 in the inner central portion 101b, which requires a relatively large space. Therefore, the second vacuum holding zone 190b and the third vacuum holding zone 190c may only have auxiliary vacuum ports 192, i.e., the auxiliary vacuum ports 192 can be distributed on the first engagement surface 116a of the release head 116 in a manner that matches the compact layout of the inner central portion 101b or Q-panel of the mold panel 101. In other words, the second vacuum holding area 190 b and the third vacuum holding area 190 c may not have the main vacuum suction port 191 .

[0231] Optionally, the first vacuum holding area 190a, the second vacuum holding area 190b, and the third vacuum holding area 190c operate independently. Preferably, each main vacuum suction port 191 and / or each auxiliary vacuum suction port 192 in the first vacuum holding area 190a, the second vacuum holding area 190b, and the third vacuum holding area 190c can operate independently. For example, the multi-zone vacuum holding device 190 may have independent vacuum lines corresponding to the first vacuum holding area 190a, the second vacuum holding area 190b, and the third vacuum holding area 190c, respectively. In addition, each vacuum line can also be connected to its dedicated vacuum source or vacuum module. For example, Figure 3EAs shown, each vacuum line of the first vacuum holding area 190a, the second vacuum holding area 190b, and the third vacuum holding area 190c may correspond to a first pump 193a, a second pump 193b, and a third pump 193c (for example, vacuum pumps), a first valve 194a, a second valve 194b, and a third valve 194c (for example, solenoid valves), a first filter 195a, a second filter 195b, and a third filter 195c (for example, particulate air filters), and a first sensor 196a, a second sensor 196b, and a third sensor 196c (for example, vacuum sensors) for collaboratively monitoring and controlling the vacuum levels of the corresponding first vacuum holding area 190a, the second vacuum holding area 190b, and the third vacuum holding area 190c. In other words, the first vacuum holding area 190a, the second vacuum holding area 190b, and the third vacuum holding area 190c can be respectively equipped with their own independent vacuum systems (i.e., pumps 193, valves 194, filters 195, and sensors 196), thereby ensuring operational redundancy and reliability. Therefore, if one or even two of the three first vacuum holding areas 190a, the second vacuum holding areas 190b, and the third vacuum holding areas 190c fail, the remaining first vacuum holding areas 190a, the second vacuum holding areas 190b, and the third vacuum holding areas 190c can still provide vacuum suction to hold the molded panel 101 (including the inner central portion 101b, the unit area 101c, or the Q panel).

[0232] According to various embodiments, first pump 193a associated with first vacuum holding zone 190a may provide greater vacuum suction force than second pump 193b, third pump 193c associated with second vacuum holding zone 190b, third vacuum holding zone 190c.

[0233] According to various embodiments, the multi-zone vacuum holding device 190 can also be applied to different components that need to have a holding function within the panel release system 1000. For example, the multi-zone vacuum holding device 190 can be applied to any one or more of the following components: the carrier stage 111, the panel stage 121, the panel handling head 126, the preheating stage 151, the preheating head 156, the alignment head 166, the cutting stage 171, and / or any component that releasably holds the molded panel 101 (e.g., the molded panel 101 (still adhered to the carrier 103), or the inner central portion 101b, or the individual unit areas 101c, or the Q-panel).

[0234] like Figure 3D and Figure 3FAs shown, after the molded panel 101 is cut into a plurality of individual unit regions 101c, the release head holder 118 of the release head 116 can be configured (e.g., in terms of position, shape, and / or size, etc.) to releasably hold the individual unit regions 101c of the molded panel 101 on the first engagement surface 116a of the release head 116. For example, the release head holder 118 can selectively contact only the individual unit regions 101c of the molded panel 101, without contacting the remaining portion of the molded panel 101, e.g., the remaining portion of the molded panel 101 other than the individual unit regions 101c in the inner central portion 101b of the molded panel 101. Therefore, after the release station 110 heats the heat release tape 102 to the heat release temperature, the release head holder 118 can separate the individual unit regions 101c of the molded panel 101 from the carrier 103, e.g., one by one in sequence, or as a whole at once. In other words, the cut active area or functional area of ​​the molded panel 101, for example, the inner central portion 101b, the unit area 101c, or the Q-panel, can be separated from the carrier 103. Accordingly, the remaining portion of the molded panel 101 (i.e., the inactive area or functional area still adhered to the carrier 103) can be selectively removed from the panel release system 1000 via the release station 110, or can be removed from the panel release system 1000 together with the carrier 103 via the unloading station 140.

[0235] In various embodiments, when the cutting station 170 may cut the molded panel 101 into a plurality of individual unit regions 101c (i.e., Q-panels), the panel table holder 123 and / or the panel handling head holder 128 may be configured (e.g., positioned, shaped, and / or sized, etc.) to contact and / or releasably hold only the individual unit regions 101c in the molded panel 101, for example, one by one in sequence, or as a whole at once. For example, the panel table holder 123 and / or the panel handling head holder 128 may have vacuum suction ports, for example, similar to the main vacuum suction ports 191 and the auxiliary vacuum suction ports 192. The layout and / or position of the vacuum suction ports may correspond to the layout and / or position of the plurality of individual unit regions 101c in the molded panel 101 after being cut into Q-panels, for example, matching the layout of downstream components of the panel release system 1000 through which the plurality of unit regions 101c will pass.

[0236] According to various embodiments, Figure 3AAs shown, the control unit 180 of the panel release system 1000 can transmit various signals, instructions, or commands to various components and / or corresponding assemblies in the panel release system 1000, such as movement signals and / or control signals (e.g., heating control signals, temperature adjustment control signals, preheating control signals, holding control signals, cutting control signals), etc. Thus, the control unit 180 can be in communication with various components and / or assemblies in the panel release system 1000 to instruct and / or control their operation. For example, a movable assembly in the panel release system 1000 can be driven by a corresponding actuator, which can be controlled by the control unit 180.

[0237] According to various embodiments, Figure 4 A perspective view of a panel release system 4000 is schematically shown.

[0238] According to various embodiments, panel release system 4000 may include any one or more features of panel release systems 1000 and / or 2000, and vice versa.

[0239] According to various embodiments, the panel release system 4000 may be used with Figure 2A The illustrated panel release system 2000 differs in that the panel release system 4000 may further include a cutting station 470. The cutting station 470 may include any one or more features of the cutting station 170.

[0240] According to various embodiments, the cutting station 470 may be located directly or indirectly upstream of the release station 210 .

[0241] According to various embodiments, the panel release system 4000 may include a transport mechanism 4001 for transporting the panel carrier assembly 104 to the carrier table 111 within the release station 210. The transport mechanism 4001 may include one or more movable platforms and / or actuators of the panel release system 4000.

[0242] like Figure 4 As shown, the cutting station 470 can be connected to the feed station 260 in such a manner that after the panel carrier assembly 104 enters the panel release system 4000 through the feed station 260, it can be transferred from the feed station 260 to the cutting station 470 for cutting the molded panel 101 in the panel carrier assembly 104 as described above. Figure 4 As shown, the cutting station 470 and the preheating station 250 can be connected to the feed station 260, and the connection positions are respectively located on non-opposite sides of the feed station 260. Optionally, the cutting station 470 can be connected to the feed station 260 by an alignment head (e.g., Figure 3HThe alignment head 166 in FIG. 1 is directly connected to the feed station 260 and can be moved laterally between the feed station 260 and the cutting station 470. At the same time, the preheating station 250 can be connected to the feed station 260 by the feed mechanism (e.g., Figure 3H The feeding mechanism 161 (same or similar to the feeding mechanism 161 in ) is directly connected to the feeding station 260, and the feeding mechanism can be moved between the feeding station 260 and the preheating station 250.

[0243] Subsequently, the cut molded panels 101 can be transported from the cutting station 470 to the preheating station 250 (e.g., via the feed station 260) for preheating the panel carrier assembly 104 (in this case, the cut molded panels 101). According to various embodiments, both the preheating station 250 and the cutting station 470 can be connected to the feed station 260. For example, the feed station 260 can be located between the preheating station 250 and the cutting station 470. However, it will be understood that the panel release system 4000 can also adopt any other arrangement for the cutting station 470. For example, the cutting station 470 can be located directly (immediately) downstream of the feed station 260, while the preheating station 250 can be located directly (immediately) downstream of the cutting station 470. For example, the cutting station 470 can be located directly (immediately) upstream of the release station 210.

[0244] After the preheating of the panel carrier assembly 104 is completed, the panel carrier assembly 104 can be transferred from the preheating station 250 to the releasing station 210, and the releasing is performed in the releasing station 210, that is, the molded panel 101 can be separated from the thermal release tape 102 and the carrier 103. After the molded panel 101 has been cut into individual unit areas 101c or Q panels, the separation performed at the releasing station 210 can only involve separating the unit areas 101c or Q panels of the molded panel 101 from the thermal release tape 102 and the carrier 103, for example, sequentially separating them one by one, or separating them all at once.

[0245] Subsequently, the separated molded panel 101 or Q panel can be transferred to the panel processing station 220; and the carrier 103, the heat release tape 102 adhered thereto, and the remaining portion of the molded panel 101 can be transferred to the carrier processing station 230 and can be removed from the panel release system 400 through the unloading station 240.

[0246] like Figure 4As shown, the panel release system 4000 may further include a control unit 480, which may include all or part of the functions of the control unit 180. Optionally, the control unit 480 may send various signals, instructions or commands to the various components and / or assemblies within the panel release system 4000, such as movement signals and / or control signals (e.g., heating control signals, temperature adjustment control signals, preheating control signals, holding control signals, cutting control signals). Therefore, the control unit 480 may be in communication with the various components and / or assemblies within the panel release system 4000 to control their operation. Optionally, the movable components of the panel release system 4000 may be driven by corresponding actuators, which may be controlled by the control unit 480.

[0247] According to various embodiments, the panel release system 4000 and its various components, such as the release station 210, the panel handling station 220, the carrier handling station 230, the unloading station 240, the preheating station 250, the feeding station 260, and / or the cutting station 470, can be implemented using a modular architecture. For example, any one or more of the components or their components can be omitted, relocated, or replaced as needed.

[0248] According to various embodiments, the present application provides a method for handling a panel carrier assembly 104 (including a molded panel 101), for example, an automated method using a panel release system 1000, 2000, or 4000. The method may include heating the panel carrier assembly 104 to a release temperature of a thermal release tape 102 by a carrier table heater 112 on the carrier table 111 while the panel carrier assembly 104 is held on a first surface 111a of the carrier table 111 with the molded panel 101 positioned thereon. The method may also include moving a release head 116 toward the panel carrier assembly 104 held by the first surface 111a of the carrier table 111, thereby engaging the molded panel 101 of the panel carrier assembly 104. Specifically, the method may include: in the release station 110, when the carrier table 111 is aligned with the release head 116, the release head 116 of the release unit 115 moves toward the first surface 111a of the carrier table 111 to engage with the panel carrier assembly 104 on the first surface 111a of the carrier table 111. The method may also include: subsequently, using the release head 116 to releasably hold the molded panel 101 on the first engagement surface 116a of the release head 116, and moving the release head 116 away from the first surface 111a of the carrier table 111, wherein the release head holder 118 releasably holds the molded panel 101 (uncut or cut) on the first engagement surface 116a of the release head 116, thereby separating the molded panel 101 from the carrier 103, while the heat release tape 102 adhered to the carrier 103 remains on the first surface 111a of the carrier table 111. Therefore, the operation may be referred to as a release operation or a heat-release operation.

[0249] According to various embodiments, the heat-release operation may further include: using a release head heater 117 at the release head 116 in coordination with a carrier stage heater 112 at the carrier stage 111 to heat the panel carrier assembly 104 to a release temperature of the thermal release tape 102; and then separating the molded panel 101 from the thermal release tape 102 and the carrier 103. Optionally, the coordinated heating is performed within the release station 110.

[0250] According to various embodiments, the method may further include: moving the panel stage 121 into the release station 110 so as to align with the release head 116 within the release station 110, and receiving the separated molded panel 101 (uncut or cut) from the release head 116. Optionally, this operation is performed after the heating-release operation is completed. Subsequently, the panel stage 121 holding the separated molded panel 101 is moved to the panel processing station 120 to transport the separated molded panel 101 from the release station 110 to the panel processing station 120.

[0251] According to various embodiments, the method may further include: while the separated molded panel 101 is held on the panel stage 121, and / or while the panel stage 121 is moving the separated molded panel 101 from the release station 110 to the panel processing station 120, regulating the temperature of the separated molded panel 101 by the first temperature regulating heater 122 of the panel stage 121 to a temperature between the heat release temperature and the ambient temperature. This operation may be referred to as a temperature regulating operation. Optionally, the temperature regulating operation may be performed after the heat-release operation.

[0252] According to various embodiments, the method may further include: using the panel handling head 126 to releasably hold (e.g., vacuum suction) the separated molded panel 101 at the second engaging surface 126a of the panel handling head 126. Specifically, the panel handling head 126 may lift the separated molded panel 101 from the panel stage 121 and remove it from the panel release system 1000.

[0253] According to various embodiments, the temperature adjustment operation may further include: while the panel handling head 126 releasably secures the separated molded panel 101 to the second joining surface 126a, using the second temperature adjustment heater 127 at the panel handling head 126 to adjust the temperature of the separated molded panel 101 between a heat release temperature and an ambient temperature. This operation may also be performed separately from the temperature adjustment operation performed by the first temperature adjustment heater 122 of the panel stage 121. In other words, after the panel handling head 126 lifts the separated molded panel 101 from the panel stage 121, the temperature adjustment operation may be performed using the second temperature adjustment heater 127.

[0254] According to various embodiments, the method may further include: moving the carrier table 111 (still holding the heat release tape 102 and the carrier 103 separated from the molded panel 101) from the release station 110 to the carrier handling station 130, for transporting the heat release tape 102 and the carrier 103 from the release station 110 to the carrier handling station 130. The method may further include: using the carrier handling head 136 to releasably hold the heat release tape 102 and the carrier 103 at their third engaging surface 136a, and lifting the heat release tape 102 and the carrier 103 from the carrier table 111. Subsequently, the carrier table 111 (now without holding the heat release tape 102 and the carrier 103) may be moved out of the carrier handling station 130, for example, returned to the release station 110.

[0255] In various embodiments, at the carrier processing station 130 , before the carrier 103 is held and / or lifted by the carrier processing head 136 , the method may further include: using a tape removal tool 131 to remove the thermal release tape 102 still adhered to the carrier 103 . This operation may be referred to as a tape removal operation. The tape removal operation may be performed on the thermal release tape 102 still adhered to the carrier 103 after the heat release operation is completed.

[0256] In various embodiments, the method may further include: moving the unloading tray 141 into the carrier handling station 130, aligning the unloading tray 141 with the carrier handling head 136 (which releasably holds the separated carrier 103), and then receiving the carrier 103 from the carrier handling head 136. Subsequently, the unloading tray 141 holding the carrier 103 is moved to the unloading station 140 for removing the carrier 103 from the panel release system 1000.

[0257] In various embodiments, the method may further include preheating the panel carrier assembly 104 prior to the heating and releasing operations. Specifically, the panel carrier assembly 104 is placed at a preheating station 151 and preheated to an intermediate temperature lower than the heat release temperature using a first preheater 152 at the preheating station 151. This operation may be referred to as a preheating operation. Optionally, the preheating station 151 holding the panel carrier assembly 104 may be moved from the preheating station 150 to the release station 110. The preheating operation may be performed within the preheating station 150, for example, by the cooperation of the preheating station 151 and the preheating head 156, but may also be performed during the movement of the preheating station 151 from the preheating station 150 to the release station 110, for example, by the preheating station 151 alone.

[0258] In various embodiments, the preheating operation may further include using a second preheater 157 at the preheating head 156 to cooperate with the preheating head 156 at the preheating stage 151 to preheat the panel carrier assembly 104 within the preheating station 150 .

[0259] In various embodiments, prior to the heating and releasing operations, the control unit 180 of the panel release system 1000 or 2000 or the control unit 480 of the panel release system 4000 may be used to control (e.g., directly or indirectly instruct or command) the panel carrier assembly 104 (e.g., the thermal release tape 102 in the panel carrier assembly 104) to implement the pre-release arrangement / process, thereby disrupting and / or weakening the bond strength between the thermal release tape 102 in the panel carrier assembly 104 and the molded panel 101. This operation may be referred to as a release initiation operation. Alternatively, the release initiation operation may be performed prior to the heating and releasing operations, or prior to the preheating operation.

[0260] According to various embodiments, the release initiation operation may include moving the carrier table 111 relative to the release head 116 while the release head holder 118 releasably holds the molded panel 101 in the panel carrier assembly 104 on the first engagement surface 116a of the release head 116, and the carrier table holder 113 releasably holds the thermal release tape 102 and the carrier 103 on the first table surface 111a of the carrier table 111. Alternatively, the operation may be performed within the release station 110.

[0261] According to various embodiments, the release activation operation may further include cutting the molded panel 101 into peripheral edge portions 101a and / or individual unit regions 101c (e.g., using a cutter 179 in the cutting station 170). Subsequently, the cut molded panel 101 is still adhered to the carrier 103 by the thermal release tape 102 and transferred to another component, such as the preheating station 150.

[0262] In various embodiments, the method may further include feeding the panel carrier assembly 104 into the panel release system 1000 through the feeding station 160. Specifically, the panel carrier assembly 104 is fed to the cutting station 170, the preheating station 150 or the release station 110 through the feeding station 160.

[0263] In multiple embodiments, the method may also include: transferring the panel carrier assembly 104, the molded panel 101 (e.g., as a whole before cutting or in the form of a Q panel after cutting), and the carrier 103 (e.g., separated from or still adhered to the thermal release tape 102) out of the panel release system 1000 via one or more movable pallets and / or actuating components of the panel release system 1000.

[0264] According to various embodiments, Figures 5A to 5F Schematic diagrams of a first release process 300 and a second release process 320 are shown.

[0265] Figure 5AAs shown, multiple semiconductor chips 302 can be mounted on a first carrier 306. Subsequently, a first encapsulation layer 304 can be formed through a first packaging process to encapsulate the semiconductor chips 302. This can form a first molded panel 301a. The first molded panel 301a can include the semiconductor chips 302 and the first encapsulation layer 304.

[0266] According to various embodiments, the first thermal release tape 308 may be pre-adhered to the first carrier 306 to secure the semiconductor chip 302 in place, for example, to prevent it from moving during the first packaging process. In particular, the first thermal release tape 308 may include a heat-sensitive layer (e.g., Figure 1A The heat-sensitive adhesive layer 102a shown is the same as or similar to the heat-sensitive adhesive layer 102a) and a pressure-sensitive layer (e.g., Figure 1A At this stage, the first thermal release tape 308 can be positioned so that the heat-sensitive layer contacts and adheres to the first carrier 306, while the pressure-sensitive layer contacts and adheres to the first molded panel 301a.

[0267] According to various embodiments, the panel size of the first molded panel 301a can be smaller than the tape size of the first thermal release tape 308, so that the first thermal release tape peripheral portion 3082 does not contact the first molded panel 301a. The first thermal release tape peripheral portion 3082 is the peripheral portion of the first thermal release tape 308.

[0268] Thus, a first panel carrier assembly 504 a may be formed, which may include the first molded panel 301 a , the first carrier 306 , and the first thermal release tape 308 .

[0269] Figure 5B FIG. 3 shows a first release process 300. The first panel carrier assembly 504a may be heated to a first heat release temperature of the first heat release tape 308. At the first heat release temperature, the heat sensitive layer may lose adhesion to the first carrier 306, while the pressure sensitive layer may still adhere to the first molded panel 301a. Figure 5B As shown, the first molded panel 301 a , along with the first heat release tape 308 adhered thereto, can be released or peeled from the first carrier 306 .

[0270] Figure 5CThe process of removing the first thermal release tape 308 from the first molded panel 301a is shown. According to various embodiments, the molded panel 101 can first be flipped over so that its panel active surface 3012 faces upward. Then, because the outer portion 3082 of the first thermal release tape is not in contact with or blocked by the first molded panel 301a, a vertically movable ejector pin 310 (or other suitable device, such as an ejector pin or pusher) can be used to push the outer portion 3082 of the first thermal release tape upward, forming a raised portion 312. Subsequently, a tape removal tool 314 (e.g., the same as or similar to the tape removal tool 131) can grip the raised portion 312 and subsequently peel the first thermal release tape 308 laterally from the first molded panel 301a until the first thermal release tape 308 is completely removed from the first molded panel 301a. This exposes the panel active surface 3012 of the first molded panel 301a for subsequent processing.

[0271] Figure 5D 3. As shown, the first molded panel 301a is then mounted on the second carrier 322 with its panel active surface 3012 exposed upward. The second thermal release tape 324 has a similar structure to the first thermal release tape 308 and can be applied to the second carrier 322. However, at this stage, the second thermal release tape 324 is applied in the same manner as the first thermal release tape 308. Figure 5A In contrast to the first thermal release tape 308 described in the previous embodiment, its heat-sensitive layer and pressure-sensitive layer are in contact with and adhere to the first molded panel 301a and the second carrier 322. Subsequently, a panel-level circuit 326 is formed on the panel active surface 3012 of the first molded panel 301a.

[0272] In various embodiments, Figure 5E As shown, a second molding process can be used to form a second molding layer 328 for encapsulating the semiconductor chip 302, the first molding layer 304, and the panel-level circuit 326. Therefore, a second panel carrier assembly 504b can be formed. The second panel carrier assembly 504b may include a second molded panel 301b (including the first molded panel 301a, the panel-level circuit 326, and the second molding layer 328), a second carrier 322, and a second thermal release tape 324. As described above, it can be seen that the second panel carrier assembly 504b may correspond to the above Figures 1A to 4 The panel carrier assembly 104 is depicted.

[0273] like Figure 5EAs shown, in the second release process 320, the second panel carrier assembly 504b can be heated to the second heat release temperature of the second heat release tape 324. At the second heat release temperature, the heat-sensitive layer of the second heat release tape 324 loses adhesion to the second molded panel 301b, while the pressure-sensitive layer thereof can still adhere to the second carrier 322. Therefore, the second molded panel 301b can be released or separated from the second carrier 322 and the second heat release tape 324.

[0274] Subsequently, the second thermal release tape 334 can be released or separated from the second carrier 332 by applying a force, such as a lateral force. However, the tape size of the second thermal release tape 334 may be approximately equal to the carrier size of the second carrier 322. In other words, the second thermal release tape 334 may substantially completely cover the second carrier 322. Therefore, at this time, the second thermal release tape 334 does not extend beyond the second carrier 322. For example, there will be no Figure 5C The features similar to the first heat release tape peripheral portion 3082 are described. Therefore, it is not possible to use Figure 5C To solve this problem, a separation aid 132 (e.g., Figures 1G-1J or as Figures 1K-1N ) to form the raised portion 1026 to initiate separation and removal of the second thermal release tape 334. Therefore, the release station 110 described above, and the panel release systems 1000, 2000, 4000 including the release station 110 and the related operating methods are particularly suitable for the second release process 320 (i.e. Figure 5F Afterwards), the second thermal release tape 324 (ie, corresponding to the thermal release tape 102 ) is removed from the second carrier 322 (ie, corresponding to the carrier 103 ).

[0275] It can be understood that in the above embodiments, some structures are represented by multiple numbers, such as 1000, 2000, and 4000 all represent panel release systems, 1026 and 312 both represent raised parts, 110 and 210 both represent release stations, 130 and 230 both represent carrier processing stations, 150 and 250 both represent preheating stations, 170 and 470 both represent cutting stations, 180 and 480 both represent control units, and 141p and 241p both represent unloading tray moving planes. Although each of the above structure names corresponds to multiple numbers, the multiple numbers all refer to the same structure with the same or similar structure and performance. The same structure is labeled and referred to by different serial numbers in the drawing groups of different forms or states.

[0276] While the present invention has been particularly shown and described with reference to specific embodiments, it will be understood by those skilled in the art that various changes, modifications, changes in form and details may be made therein without departing from the scope of the invention as defined by the appended claims. The scope of the present invention is therefore indicated by the appended claims and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced.

Claims

1. A release station for handling panel carrier assemblies, characterized in that include: A carrier platform, comprising: a first table capable of supporting the panel carrier assembly, wherein the panel carrier assembly comprises a molded panel attached to the carrier by a heat release tape; and a carrier table heater associated with the first surface of the carrier table, capable of heating the panel carrier assembly to a heat release temperature of the thermal release tape when the panel carrier assembly is supported on the first surface of the carrier table; A release unit comprising: a release head movable toward the first surface of the carrier table for engaging the molded panel in the panel carrier assembly positioned on the first surface of the carrier table, wherein the release head further comprises: a release head retaining member for releasably retaining the molded panel on the first engagement surface of the release head when the molded panel has been separated from the carrier and engaged to the release head; Wherein, after the carrier table heater has heated the panel carrier assembly to the thermal release temperature, and after the release head holding member releasably holds the molded panel on the first joint surface of the release head, the release head can be moved in the direction away from the first table surface of the carrier table, thereby separating the molded panel from the carrier, and the molded panel separated from the carrier is located on the first joint surface of the release head, while the carrier with the thermal release tape is maintained on the first table surface of the carrier table.

2. A release station according to claim 1, characterized in that The release head further comprises: A release head heater associated with the first engagement surface of the release head is operable to heat the panel carrier assembly in coordination with a carrier table heater of the carrier table when the panel carrier assembly is positioned between the carrier table and the release head.

3. The release station according to claim 1, characterized in that Also includes: a tape removal tool for removing the thermal release tape, wherein the tape removal tool further comprises: a separation aid capable of forming a raised portion on the thermal release tape; as well as An attachment mechanism can secure the tilted segment for initiating removal of the thermal release tape.

4. A release station according to claim 3, characterized in that in The separation auxiliary tool can be vertically moved toward an edge portion of the thermal release tape to form the raised section on the thermal release tape.

5. The release station according to claim 1, characterized in that in The thermal release tape comprises a heat-sensitive layer and a pressure-sensitive layer; and When the thermal release tape is located between the mold panel and the carrier, the heat-sensitive layer can be adhered to the mold panel, and the pressure-sensitive layer can be adhered to the carrier.

6. A panel release system for handling a panel carrier assembly, characterized in that include: The release station as claimed in claim 1; a panel handling station capable of receiving the molded panel separated from the carrier from the release station; as well as a panel stage movable between the panel processing station and the release station, wherein, when the panel stage is located within the releasing station and aligned with the releasing head of the releasing unit, the releasing head may release the molded panel separated from the carrier onto the panel stage; wherein, after the molded panel separated from the carrier is released to the panel stage, the panel stage may be moved from the release station to the panel processing station, thereby transporting the molded panel separated from the carrier from the release station to the panel processing station; Wherein, the panel processing station includes: A panel processing unit, comprising: a panel handling head movable toward the panel stage for engaging the molded panel separated from the carrier when the panel stage is located at the panel handling station and holds the molded panel separated from the carrier; The panel processing head includes a panel processing head holding component. When the panel processing head moves to engage the molded panel separated from the carrier, the panel processing head can releasably hold the molded panel on the second engaging surface of a panel processing head of the panel processing unit, and move the molded panel separated from the carrier held by it away from the panel table, so as to move the molded panel out of the panel release system.

7. The panel release system of claim 6, wherein: in, The panel processing head further includes a temperature regulating heater associated with the second engagement surface thereof; When the second joint surface of the panel processing head is joined to the molded panel, the temperature regulating heater may regulate the temperature of the molded panel between the heat release temperature and the ambient temperature.

8. The panel release system of claim 6, It is characterized by: in, The panel stage includes: a second table for supporting the molded panel separated from the carrier; as well as A temperature regulating heater is associated with the second surface of the panel stage, and when the molded panel separated from the carrier is held on the second surface of the panel stage, the temperature regulating heater can maintain the temperature of the molded panel between the heat release temperature and the ambient temperature.

9. The panel release system of claim 6, wherein: Also includes: a carrier processing station; wherein the carrier stage is movable between the release station and the carrier processing station; Wherein, the carrier processing station includes: A carrier processing unit, comprising: a carrier handling head movable toward the carrier table to engage the carrier when the carrier table and the carrier held thereon are positioned within the carrier handling station and aligned with the carrier handling head; The carrier handling head includes a carrier handling head retaining member that releasably retains the carrier on the third engagement surface of the carrier handling head when the carrier handling head engages the carrier and moves the retained carrier away from the carrier stage.

10. The panel release system of claim 9, wherein: Also includes: an unloading tray adapted to receive the carrier from the carrier handling head when aligned with the carrier handling head within the carrier handling station; After receiving the carrier, the carrier can be moved out of the carrier processing station to move the carrier out of the panel release system.

11. The panel release system of claim 9, wherein: in, the thermal release tape remaining on the carrier after the molded panel is separated from the carrier in the release station; Wherein, the carrier processing station further comprises: a tape removal tool operable to remove the thermal release tape from the carrier while the carrier having the thermal release tape is held on a carrier table within the carrier processing station and before a carrier processing head releasably holds and removes the carrier from the carrier table; The tape removal tool can be moved between a first side of the carrier and a second side opposite thereto. When the tape removal tool engages with an edge portion of the first side of the thermal release tape, the thermal release tape covering the carrier can be removed sequentially from the first side to the second side.

12. The panel release system of claim 11, wherein: in, The tape removal tool includes a clamping mechanism for clamping the edge portion of the thermal release tape.

13. The panel release system of claim 9, wherein: The panel stage can move along a panel stage moving plane. The carrier stage is movable along a carrier stage movement plane, and The panel stage and the carrier stage can move in a coordinated manner along the panel stage moving plane and the carrier stage moving plane, respectively, wherein the panel stage moving plane and the carrier stage moving plane are parallel.

14. The panel release system of claim 13, wherein: The panel stage and the carrier stage move in directions that are not parallel to each other along the panel stage moving plane and the carrier stage moving plane, respectively.

15. The panel release system of claim 6, wherein: Also includes: A cutting station located upstream of the release station is capable of processing the panel carrier assembly before it is transferred to the release station, the cutting station comprising: a cutter for cutting the molded panel into at least one Q panel; A conveying mechanism is used to convey the panel carrier assembly having the molded panel cut into the at least one Q panel to the carrier table in the release station, and heat the panel carrier assembly to the release temperature using the carrier table heater of the carrier table.

16. The panel release system of claim 6, wherein: Also includes: a preheating station upstream of the release station; as well as A preheating station, comprising: a third table capable of holding the panel carrier assembly with the molded panel facing upward; a preheating heater connected to the third surface of the preheating station, for heating the panel carrier assembly to an intermediate temperature lower than the release temperature when the panel carrier assembly is located on the third surface of the preheating station; wherein the preheating station is movable from the preheating station to the releasing station for transferring the panel carrier assembly from the preheating station to the releasing station; In which, when the preheating table carrying the panel carrier assembly moves from the preheating station to the release station and is aligned with the release head in the release station, the release head can move toward the preheating table to contact the panel carrier assembly, temporarily fix it at the first engaging surface of the release head, and move it away from the preheating table, so that the panel carrier assembly can be released onto the carrier table in the release station when the release head is aligned with the carrier table.

17. The panel release system of claim 16, wherein: The preheating station further comprises: A preheating unit comprising a preheating head, which can move toward the third surface of the preheating table and contact the panel carrier assembly held by it; when the preheating table carrying the panel carrier assembly is located in the preheating station and aligned with the preheating head, the preheating head can engage the panel carrier assembly; the preheating head includes A preheater is associated with the fourth joint surface of the preheating head. When the panel carrier assembly is located between the preheating table and the preheating head, the preheating heater of the preheating head can cooperate with the preheater of the preheating table to heat the panel carrier assembly.

18. The panel release system of claim 17, wherein: Also includes: A feeding station, including a feed tray capable of receiving and supporting the panel carrier assembly; wherein the feed tray is movable from the feed station to the preheating station for transferring the panel carrier assembly from the feed station to the preheating station; Wherein, the preheating head further comprises a retaining member for temporarily retaining the panel carrier assembly on the fourth engaging surface of the preheating head of the preheating unit when the preheating head is engaged with the panel carrier assembly. In which, when the feed tray carrying the panel carrier assembly moves from the feed station to the preheating station and is aligned with the preheating head in the preheating station, the preheating head can move toward the feed tray and contact the panel carrier assembly, and temporarily hold it on the fourth joint surface of the preheating head, and move it away from the feed tray, so that the preheating head can release the panel carrier assembly to the preheating table when it is subsequently aligned with the preheating table.

19. A method for operating a panel release system according to any one of claims 6 to 18, characterized in that: include: heating a panel carrier assembly held on the first surface of the carrier table by a carrier table heater associated with the first surface of the carrier table, wherein the panel carrier assembly is heated to a release temperature of the thermal release tape; When the carrier table is aligned with a release head in a release station, the release head of the release unit moves toward the first table surface of the carrier table to contact the panel carrier assembly located on the first table surface of the carrier table, and temporarily holds the molded panel at the first engagement surface of the release head; After the carrier table heater has heated the panel carrier assembly to the thermal release temperature, the release head that temporarily holds the molded panel is moved away from the first surface of the carrier table, thereby separating the molded panel from the carrier, and the separated molded panel is maintained on the first engagement surface of the release head, while the carrier remains on the first surface of the carrier table.

20. The operating method according to claim 19, wherein: include: Positioning the panel table within the release station and aligned with the release head such that the separated molded panel is temporarily retained on the first engagement surface of the release head; Subsequently, the separated molded panel is released from the release head to the second table surface of the panel table; Then, moving the panel table carrying the separated molded panels from the releasing station to the panel processing station; Afterwards When the panel table is aligned with the panel processing head in the panel processing station, the panel processing head is moved toward the second table surface of the panel table to contact the separated molded panel located thereon, and the molded panel is temporarily held at the second engaging surface of the panel processing head, so as to move the separated molded panel out of the panel release system through the panel processing head.

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