Heat dissipation module and antenna array device with same

Abstract

The invention provides a heat dissipation module and an antenna array device with the heat dissipation module. The heat dissipation module is applied to the antenna array device. The antenna array device comprises a circuit board and an upper cover. The heat dissipation module comprises a body; the plurality of heat conduction structures are arranged on one side of the body in an array manner; the supporting structures are used for supporting the circuit board, and the heat conduction structures and the supporting structures are arranged on the same side of the body; the connecting structures are arranged on the edge of the body and used for being connected with the upper cover. The heat dissipation module provided by the invention can effectively dissipate heat of the antenna array device.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a heat dissipation module and an antenna array device having the heat dissipation module. Background Art

[0002] An antenna system composed of many identical individual antennas arranged in a regular pattern is also called an antenna array. Phased array antennas, formed by antenna arrays, are highly flexible and offer wide-angle scanning, making them highly effective for communicating with low-orbit satellites. With the advancement of low-orbit satellite communication technology, wireless communication devices equipped with antenna arrays capable of communicating with these satellites have also emerged. However, antenna arrays have poor heat dissipation performance, particularly within the confined space of wireless communication devices. Failure to quickly dissipate the heat generated by the antenna array during operation will compromise signal transmission quality. Summary of the Invention

[0003] In view of the above, the present invention provides a heat dissipation module and an antenna array device having the heat dissipation module, which can effectively dissipate heat for the antenna array device.

[0004] In a first aspect, the present application provides a heat dissipation module for use in an antenna array device. The antenna array device includes a circuit board and an upper cover. The heat dissipation module comprises: a main body; a plurality of heat-conducting structures arranged in an array on one side of the main body; a plurality of support structures for supporting the circuit board, with the plurality of heat-conducting structures and the plurality of support structures arranged on the same side of the main body; and a plurality of connecting structures arranged at the edges of the main body for connecting to the upper cover.

[0005] In one embodiment, the heat-conducting structure is made of a heat-conducting material.

[0006] In one embodiment, each heat-conducting structure is a strip-shaped structure, and a plurality of heat-conducting structures are arranged in rows to form an array.

[0007] In one embodiment, the heat dissipation module further includes a heat conducting plate, and a limiting portion is provided at at least one end of the heat conducting structure, and the limiting portion is used to limit the heat conducting plate.

[0008] In one embodiment, the thermal conductivity of the thermal conductive sheet is greater than or equal to 0.8 W / Mk, the hardness of the thermal conductive sheet is greater than or equal to 10 Shore, and the hardness of the thermal conductive sheet is less than or equal to 70 Shore.

[0009] In one embodiment, the antenna array device includes a plurality of radiating units, the plurality of radiating units are arranged on one side of a circuit board, and the plurality of heat-conducting structures are arranged on the other side of the circuit board away from the plurality of radiating units, and the plurality of heat-conducting structures are arranged corresponding to the plurality of radiating units, and the area of ​​the plurality of heat-conducting structures accounts for a proportion of the area of ​​the plurality of radiating units that is greater than or equal to 20%.

[0010] In one embodiment, the heat dissipation module further includes a plurality of heat dissipation fins, which are spaced apart and disposed on the other side of the body and extend radially outward.

[0011] A second aspect of the present application provides an antenna array device, comprising a circuit board, an upper cover, a plurality of radiation units and a heat dissipation module as described in any one of the above items.

[0012] In one embodiment, the antenna array device further includes a lower cover connected to the upper cover to form a receiving space for receiving a plurality of radiation units, a circuit board, and a heat dissipation module.

[0013] In one embodiment, the antenna array device further includes a sub-circuit board, which is disposed on a side of the heat dissipation module away from the circuit board, is electrically connected to the circuit board, and is used to supply power to the circuit board.

[0014] The heat dissipation module provided in the present application increases the thermal conductivity efficiency of the thermally conductive structures by arranging a plurality of thermally conductive structures in an array, thereby effectively dissipating heat for the antenna array device; at the same time, the circuit board is supported by a plurality of supporting structures and is connected to the upper cover by a plurality of connecting structures, thereby reducing the probability of displacement of the radiation module in the antenna array device and improving the phase control accuracy of the antenna array device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of an antenna array device provided in one embodiment of the present application.

[0016] Figure 2 for Figure 1 A partial exploded view of the antenna array device is shown.

[0017] Figure 3 For the Figure 1 Cross-sectional view along line III-III.

[0018] Figure 4 for Figure 1 Schematic diagram of the disassembly of the heat dissipation module.

[0019] Figure 5 Schematic diagram of the ratio of the areas of several heat-conducting structures to the areas of several radiation units.

[0020] Figure 6 for Figure 1 Schematic diagram of the heat dissipation module from another perspective.

[0021] Figure 7 For the Figure 1 Cross-sectional view along line VI-VI.

[0022] Figure 8A schematic diagram of an antenna array device provided in another embodiment of the present application.

[0023] Figure 9 for Figure 8 A schematic diagram of a heat dissipation module in an antenna array device is shown.

[0024] Figure 10 for Figure 8 A partially disassembled schematic diagram of the antenna array device is shown.

[0025] Figure 11 for Figure 8 A schematic diagram of an antenna array device from another perspective is shown.

[0026] Figure 12 for Figure 8 A schematic diagram showing the connection between the antenna array device and the bracket is shown.

[0027] Description of main component symbols Antenna array devices 10, 10a

[0028] Upper cover 110

[0029] Radiation module 120

[0030] The third positioning hole 121

[0031] Circuit board 130

[0032] First positioning hole 131

[0033] Second positioning hole 132

[0034] Heat dissipation modules 140, 140a

[0035] Thermal conductive structure 141

[0036] Limiting portion 1411

[0037] Thermal Conductive Sheet 144

[0038] Support structure 142

[0039] First support portion 1421

[0040] Second support portion 1422

[0041] Connection structure 143

[0042] Buffer 145

[0043] Ontology 146

[0044] Groove 1461

[0045] First Area 1462

[0046] Second Area 1463

[0047] Storage tank 1464

[0048] First channel 1465

[0049] Second channel 1466

[0050] Positioning column 147

[0051] Heat sink 148

[0052] First heat sink 1481a

[0053] Second heat sink 1482a

[0054] Boss 149

[0055] Lower covers 150, 150a

[0056] Third heat sink 1501a

[0057] Heat sink 151

[0058] First mounting hole 152

[0059] Containment Space 160

[0060] Sub-circuit board 170

[0061] Bracket 180

[0062] Base 181

[0063] Support 182

[0064] Angle adjustment connector 183

[0065] Coupling 184

[0066] First coupling portion 1841

[0067] Second coupling portion 1842

[0068] The third coupling portion 1843

[0069] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0070] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0071] It should be noted that when an element is referred to as being "electrically connected" to another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "electrically connected" to another element, it may be a contact connection, for example, a wire connection, or a contactless connection, for example, a contactless coupling.

[0072] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0073] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0074] An antenna system composed of many identical individual antennas arranged in a regular pattern is also called an antenna array. Phased array antennas, formed by antenna arrays, are highly flexible and offer wide-angle scanning, making them highly effective for communicating with low-orbit satellites. With the advancement of low-orbit satellite communication technology, wireless communication devices equipped with antenna arrays capable of communicating with these satellites have also emerged. However, antenna arrays have poor heat dissipation performance, particularly within the confined space of wireless communication devices. Failure to quickly dissipate the heat generated by the antenna array during operation will compromise signal transmission quality.

[0075] Based on this, the present application provides a heat dissipation module and an antenna array device having the heat dissipation module, which can accelerate the heat dissipation speed of the antenna array.

[0076] See also Figure 1 An embodiment of the present application provides an antenna array device 10. The antenna array device 10 is used to implement communication with one or more of a low-orbit satellite, a communication base station, and a wireless communication device.

[0077] Please continue reading Figure 2The antenna array device 10 includes an upper cover 110, a radiation module 120, a circuit board 130, a heat dissipation module 140 and a lower cover 150. The radiation module 120 is used to receive or transmit signals to realize communication between the antenna array device 10 and other communication devices, such as low-orbit satellites, communication base stations or wireless communication devices. Furthermore, the radiation module 120 includes at least one radiation layer and at least one dielectric layer. The radiation layer is provided with a plurality of radiation units. The plurality of radiation units together form an antenna array to efficiently realize communication between the antenna array device 10 and low-orbit satellites. The antenna array includes a receiving antenna array and / or a transmitting antenna array. When the antenna array includes a receiving antenna array and a transmitting antenna array, a part of the radiation units can form a receiving antenna array, and another part of the radiation units can form a transmitting antenna array. The circuit board 130 is provided with a radio frequency circuit and a control circuit, etc., for realizing communication control of the antenna array device 10. The heat dissipation module 140 is in contact with the circuit board 130 and is used to dissipate heat for the circuit board 130 and / or the components on the circuit board 130, so as to reduce the temperature of the antenna array device 10 and enable the antenna array device 10 to operate normally. Figure 3 The upper cover 110 is connected to the lower cover 150 to form a receiving space 160 . The radiation module 120 , the circuit board 130 and the heat dissipation module 140 are stacked and accommodated in the receiving space 160 .

[0078] Please continue reading Figure 4 The heat dissipation module 140 includes a plurality of heat-conducting structures 141, a plurality of supporting structures 142, a plurality of connecting structures 143 and a body 146. The body 146 includes a first side and a second side that are separated from each other. Figure 2 and Figure 4 The side of the body 146 close to the circuit board 130 is the first side, and the side of the body 146 away from the circuit board 130 is the second side. The plurality of heat conducting structures 141 and the plurality of supporting structures 142 are disposed on the first side of the body 146. The plurality of connecting structures 143 are disposed on the edge of the body 146.

[0079] A plurality of heat-conducting structures 141 are arranged in an array on one side of the body 146. Each heat-conducting structure 141 is made of a heat-conducting material. Heat-conducting materials include, but are not limited to, any one or a combination of two or more of heat-conducting plastics, ceramics, and metals. In some embodiments, the heat-conducting structures 141 may be made of one or an alloy of two or more of gold, silver, copper, iron, aluminum, and tin. In other embodiments, the heat-conducting structures 141 may be made of one or a combination of any ceramic materials such as silicon oxide, aluminum oxide, and zinc oxide.

[0080] Please refer again Figure 2In the embodiment of the present application, the radiation module 120 is disposed on a side of the circuit board 130 away from the heat dissipation module 140. That is, a plurality of radiating elements are disposed on a side of the circuit board 130 away from the heat dissipation module 140. The RF circuit on the circuit board 130 may include a plurality of RF modules (not shown). The RF modules on the circuit board 130 may be disposed in a one-to-one correspondence with the radiating elements in the radiation module 120. RF modules include, but are not limited to, at least one of a waveform generator, a signal generator, an analog-to-digital converter (ADC), a phase shifter, and a power divider. For example, when the radiation module 120 includes 1024 radiating elements, the RF circuit on the circuit board 130 may include 1024 corresponding RF modules. The radiating elements form a first array, and the RF modules form a second array, with the first array and the second array corresponding to each other. Therefore, it is imperative to dissipate heat from the RF modules on the circuit board 130 to maintain the normal operation of the RF modules and the corresponding radiating elements. In the present invention, a plurality of heat-conducting structures 141 are arranged on the other side of the circuit board 130 away from the plurality of radiation units. The plurality of heat-conducting structures 141 are arranged in an array, for example, forming a third array. The third array corresponds to the second array. Since the second array corresponds to the first array, the third array corresponds to the first array. In other words, a plurality of heat-conducting structures 141 are arranged corresponding to the plurality of radiation units. In this way, each heat-conducting structure 141 can respectively contact the circuit board 130 and / or the corresponding RF module on the circuit board 130, and each heat-conducting structure 141 is used to conduct the heat on the circuit board 130 and / or the corresponding RF module to itself, thereby reducing the temperature of the circuit board 130 and / or the RF module to ensure the normal operation of the antenna array device 10. In the present application, the RF module is arranged on the side of the circuit board 130 close to the heat dissipation module 140. In this way, the heat-conducting structure 141 can directly contact the RF module to conduct the heat generated by the RF module to the outside.

[0081] In some embodiments, each heat-conducting structure 141 is a strip structure, and a plurality of heat-conducting structures 141 are arranged in rows to form an array. In this way, when a plurality of RF modules on the circuit board 130 are arranged in rows, each heat-conducting structure 141 can respectively correspond to a plurality of RF modules arranged in rows and conduct heat at the same time. It is understandable that the present application does not limit the number of heat-conducting structures 141. For example, in other embodiments, a plurality of heat-conducting structures 141 can also be arranged in a one-to-one correspondence with a plurality of RF modules, so that the number of heat-conducting structures 141 can be equal to the number of RF modules. In other embodiments, each heat-conducting structure 141 can also be a circular structure or a polygonal structure, etc., and the present invention does not impose any structural limitation on the heat-conducting structure 141.

[0082] See also Figure 5 , Figure 5 The figure below is a schematic diagram illustrating the area of ​​the plurality of heat-conducting structures 141 and the area of ​​the plurality of radiating units. S1 represents the area of ​​one of the plurality of heat-conducting structures 141, and S2 represents the area occupied by the plurality of radiating units. In some embodiments, the ratio of the area of ​​the plurality of heat-conducting structures 141 (i.e., all S1) to the area of ​​the plurality of radiating units (i.e., S2) is greater than or equal to 20%. This ensures that the plurality of heat-conducting structures 141 effectively dissipates heat for the antenna array device 10, ensuring proper operation of the antenna array device 10.

[0083] Please refer again Figure 4 In some embodiments, the heat dissipation module 140 further includes a heat conductive sheet 144. The heat conductive sheet 144 is disposed between the RF module and the heat conductive structure 141, or the heat conductive sheet 144 is disposed between the circuit board 130 and the heat conductive structure 141. The thermal conductivity of the heat conductive sheet 144 is greater than or equal to 0.8 watts per meter kelvin (W / Mk). The Shore hardness of the heat conductive sheet 144 is greater than or equal to 10 degrees, and the Shore hardness of the heat conductive sheet 144 is less than or equal to 70 degrees. In other words, the heat conductive sheet 144 has heat conductive properties and has a certain elasticity. For example, the heat conductive sheet 144 includes but is not limited to any one of a thermally conductive silicone sheet, a thermally conductive tape, a thermally conductive paste, a thermally conductive putty, a thermally conductive sealant, a thermally conductive glass fiber cloth, a ceramic heat sink, a graphite sheet, graphene, a phase change material, and a composite material. Understandably, when the heat-conducting structure 141 is formed of a relatively hard heat-conducting material and is in direct contact with the circuit board 130 or the RF module on the circuit board 130, the heat-conducting structure 141 may damage the circuit board 130 or the RF module. Therefore, in this embodiment, by providing a heat-conducting sheet 144 between the heat-conducting structure 141 and the RF module (or the circuit board 130), the heat from the circuit board 130 or the RF module on the circuit board 130 can be transferred to the heat-conducting structure 141 via the heat-conducting sheet 144, while reducing the probability of damage to the RF module (or the circuit board 130).

[0084] Accordingly, in some embodiments, a limiting portion 1411 is further provided at least at one end of the heat-conducting structure 141. The limiting portion 1411 is used to limit the heat-conducting sheet 144. In one embodiment of the present application, a groove is dug on the upper surface of the heat-conducting structure 141 near the circuit board 130 to form the limiting portion 1411. The heat-conducting sheet 144 is arranged in the limiting portion 1411. When the heat-conducting sheet 144 is arranged in the limiting portion 1411, the height of the surface of the heat-conducting sheet 144 is greater than the height of the upper surface of the heat-conducting structure 141, and the thickness of the heat-conducting sheet 144 is greater than the gap between the limiting portion 1411 and the RF module (or circuit board 130). In other words, the two sides of the heat-conducting sheet 144 are in close contact with the inner surface of the limiting portion 1411 and the RF module (or circuit board 130), respectively. In this way, the heat conducting sheet 144 can conduct the heat on the RF module (or circuit board 130) to the heat conducting structure 141, and the heat conducting sheet 144 avoids direct contact between the heat conducting structure 141 and the RF module (or circuit board 130), thereby reducing the probability of damage to the RF module (or circuit board 130). In this embodiment, the length of the limiting portion 1411 is approximately the same as the length of the heat conducting structure 141. In this way, only one groove needs to be opened on the surface of each heat conducting structure 141 to form a corresponding limiting portion 1411. In other embodiments, grooves can also be dug at both ends of the heat conducting structure 141 to form limiting portions 1411 respectively, or in other embodiments, three or more grooves can be dug on the heat conducting structure 141 to form limiting portions 1411 respectively. In other words, this application does not limit the number and setting position of the limiting portions 1411 on the heat conducting structure 141. Accordingly, the number of the heat conducting sheets 144 in the present application can be adjusted according to the number of the limiting portions 1411 , and the present application does not limit the number of the heat conducting sheets 144 .

[0085] Please continue reading Figure 4 , each support structure 142 on the heat dissipation module 140 is used to support the circuit board 130. It is understandable that in order to ensure the accuracy of the phase control of the antenna array formed by the radiation module 120, the radiation layer and the dielectric layer on the radiation module 120 should be kept from shifting as much as possible. In this application, the circuit board 130 is supported by the support structure 142 to fix the radiation module 120 between the circuit board 130 and the upper cover 110 (see Figure 2), thereby improving the stability of the radiation module 120, avoiding the misalignment of the radiation layer or the dielectric layer in the radiation module 120, and affecting the accuracy of the phase control and the radiation efficiency of the antenna array device 10. Specifically, the support structure 142 is in contact with the position on the circuit board 130 where the RF module or circuit is not provided. In this way, the probability of the support structure 142 damaging the circuit or electronic device on the circuit board 130 can be reduced. In some embodiments, the support structure 142 is made of a metal material. In this way, the support structure 142 is in contact with the position on the circuit board 130 where the RF module or circuit is not provided. On the one hand, it can conduct heat to the circuit board 130, and on the other hand, it can reduce the interference of the support structure 142 on the radiation module 120 and the circuit on the circuit board 130.

[0086] See also Figure 4 In some embodiments, the support structure 142 includes a first support portion 1421 and a second support portion 1422. The diameter of the first support portion 1421 is larger than that of the second support portion 1422. One end of the first support portion 1421 is connected to the body 146, and the other end of the first support portion 1421 is connected to one end of the second support portion 1422. The other end of the second support portion 1422 abuts the circuit board 130. As can be understood, since the support structure 142 is used to support the circuit board 130, it must be of a certain length to contact the circuit board 130 and provide support. Furthermore, to prevent the support structure 142 from being too long and affecting its strength, its diameter is increased to enhance its strength. Furthermore, to prevent the contact area between the support structure 142 and the circuit board 130 from being too large and affecting the circuit layout design of the circuit board 130, a design with a small head and a large base is adopted to form the first and second support portions 1421 and 1422. In this way, the supporting strength of the supporting structure 142 can be enhanced while reducing the impact of the supporting structure 142 on the circuit board 130 .

[0087] It is understandable that the first support portion 1421 and the second support portion 1422 can be integrally formed or separately connected, and this application does not impose any specific restrictions.

[0088] In other embodiments, the support structure 142 may also be a cylinder or other polygonal cylinder, etc. The present application does not limit the specific shape of the support structure 142 .

[0089] In some embodiments, the antenna array device 10 further includes a plurality of buffers 145. The buffers 145 are disposed between the support structure 142 and the circuit board 130. The buffers 145 may be formed of an elastic material. The buffers 145 are used to provide a gap between the support structure 142 and the circuit board 130 (see FIG. Figure 2) act as a buffer at the moment of collision, thereby reducing the probability of damage to the circuit board 130 due to the abutment between the support structure 142 and the circuit board 130. In other words, the end of the second support portion 1422 away from the first support portion 1421 can abut against the circuit board 130 through the buffer member 145. In some embodiments, the buffer member 145 can be any of sponge, rubber, and foam.

[0090] The plurality of connection structures 143 are used to connect the body 146 and the upper cover 110. Through the connection between the connection structure 143 and the upper cover 110, the radiation module 120 and the circuit board 130 can be further fixed between the upper cover 110 and the heat dissipation module 140 (see FIG. Figure 2 ). In this way, on the one hand, the heat dissipation module 140 can be in close contact with the circuit board 130, thereby effectively conducting heat from the circuit board 130 and the RF module on the circuit board 130; on the other hand, the radiation module 120 and the circuit board 130 can be confined between the upper cover 110 and the heat dissipation module 140, reducing the probability of displacement between the radiation layer and the dielectric layer in the radiation module 120, thereby increasing the operating accuracy of the antenna array device 10. In some embodiments, the connection structure 143 can be a connection hole formed on the edge of the body 146. Correspondingly, the edge of the inner side of the upper cover 110 (i.e., the side close to the radiation module 120) is also provided with a corresponding mating connection structure (not shown in the figure). For example, in some embodiments, the edge of the body 146 is provided with a connection hole as the connection structure 143. The inner edge of the upper cover 110 is provided with a mating connection hole as the mating connection structure. The connection between the body 146 and the upper cover 110 can be achieved by passing the connector through the connection structure 143 and the mating connection structure. The connection structure 143 can be made of a metal material or a non-metallic material, which is not limited in this application.

[0091] Please refer again Figure 2 In some embodiments, a plurality of positioning posts 147 are further provided on the first side of the body 146. The plurality of positioning posts 147 are used to achieve preliminary positioning between the heat dissipation module 140, the circuit board 130 and the upper cover 110. Specifically, corresponding to the plurality of positioning posts 147, a plurality of first positioning holes 131 are provided on the circuit board 130. A mounting post (not shown in the figure) is provided on the inner side of the upper cover 110. A through hole is provided on the positioning post 147, and a receiving hole is provided on the mounting post. The through hole on the positioning post 147 is aligned with the corresponding first positioning hole 131 and the receiving hole on the mounting post, and the positioning member passes through the through hole and the first positioning hole 131 and is partially received in the receiving hole of the mounting post, thereby preliminarily achieving preliminary positioning of the upper cover 110, the circuit board 130 and the heat dissipation module 140. The positioning post 147 can be made of metal material or non-metal material, and this application is not limited to this.

[0092] See also Figure 6In some embodiments, the heat dissipation module 140 further includes a plurality of heat dissipation fins 148. The heat dissipation fins 148 are spaced apart from each other and disposed at one end of the second side of the body 146. The heat dissipation fins 148 are also made of a heat conductive material and are generally in the shape of a sheet. The plane where the heat dissipation fins 148 are located is generally perpendicular to the plane where the body 146 is located. Correspondingly, the lower cover 150 is further provided with heat dissipation slots 151 corresponding to the plurality of heat dissipation fins 148 (see FIG. 1 ). Figure 2 ). Several heat sinks 148 pass through the heat dissipation slots 151 and emerge from the lower cover 150. In this way, the several heat-conducting structures 141 and the several support structures 142 conduct heat through the body 146 to the several heat sinks 148, which then transfer the heat to the air outside the lower cover 150 through the several heat sinks 148, thereby effectively dissipating heat. In some embodiments, the several heat sinks 148 also extend radially outward. It can be understood that the present application increases the surface area by providing several heat sinks 148, improves the efficiency of heat conduction to the air, and improves the heat dissipation effect.

[0093] Please also refer to Figure 2 and Figure 6 The heat dissipation module 140 further includes a plurality of bosses 149. These bosses 149 surround the plurality of heat sinks 148 and are disposed on the second side of the body 146. These bosses 149 are configured to connect to the lower cover 150. In one embodiment, each boss 149 is provided with a locking hole. Accordingly, the lower cover 150 is provided with through-holes surrounding the heat dissipation slots 151. The connection between the body 146 of the heat dissipation module 140 and the lower cover 150 is achieved by inserting a locking member through the through-hole and partially receiving it within the locking hole.

[0094] Please also refer to Figure 4 and Figure 6 In some embodiments, the plurality of heat-conducting structures 141, the plurality of supporting structures 142, the plurality of connecting structures 143, the body 146, the plurality of positioning posts 147, the plurality of heat sinks 148, and the plurality of protruding posts 149 are all formed of a heat-conducting material, and the plurality of heat-conducting structures 141, the plurality of supporting structures 142, the plurality of connecting structures 143, the body 146, the plurality of positioning posts 147, the plurality of heat sinks 148, and the plurality of protruding posts 149 can be integrally formed using a CNC (Computer Numerical Control Machine Tools) process. In other embodiments, the body 146 is also made of a heat-conducting material, and the plurality of heat-conducting structures 141, the plurality of supporting structures 142, the plurality of connecting structures 143, the body 146, and the heat sinks 148 can be assembled to form the heat dissipation module 140. In some embodiments, the surface of the body 146 can be bent to form a strip-shaped protrusion to serve as the heat-conducting structure 141. Accordingly, a groove 1461 is formed on the second side of the body 146 corresponding to the position of the heat-conducting structure 141, which helps to reduce the weight of the antenna array device 10.

[0095] Please refer again Figure 2 In some embodiments, the edge of the circuit board 130 is further defined with a plurality of second positioning holes 132. Accordingly, each dielectric layer and each radiating layer in the radiation module 120 is defined with a third positioning hole 121. By inserting a plurality of fasteners through the corresponding second positioning holes 132 and third positioning holes 121, the circuit board 130 and the radiation module 120 can be positioned and connected.

[0096] The lower cover 150 is also provided with a plurality of first mounting holes 152 on a side near the heat dissipation module 140. The upper cover 110 is also provided with second mounting holes (not shown) corresponding to the plurality of first mounting holes 152. A plurality of mounting members pass through the corresponding first mounting holes 152 and are partially received in the second mounting holes, thereby achieving connection between the upper cover 110 and the lower cover 150.

[0097] In some embodiments, the antenna array device 10 further includes a sub-circuit board 170. The sub-circuit board 170 is disposed on a side of the heat dissipation module 140 away from the circuit board 130. That is, the sub-circuit board 170 is disposed between the heat dissipation module 140 and the lower cover 150. The sub-circuit board 170 is provided with a processor, a power conversion circuit, a modem board, a GPS (Global Positioning System, GPS) communication module, an interface, etc. The sub-circuit board 170 is electrically connected to the circuit board 130 for supplying power to the circuit board 130. It is understandable that in other embodiments, the power conversion circuit may also be disposed on the circuit board 130. By providing the sub-circuit board 170, the present application can reduce the area of ​​the circuit board 130.

[0098] It is understandable that the installation process of the antenna array device 10 is roughly as follows:

[0099] First, please refer again to Figure 2 , a number of fasteners connect the second positioning holes 132 and the corresponding third positioning holes 121 to achieve the positioning and connection between the circuit board 130 and the radiation module 120. Then, the through holes on the positioning posts 147 are aligned with the corresponding first positioning holes 131 and the receiving holes on the mounting posts, and the positioning members pass through the through holes and the first positioning holes 131 and are partially received in the receiving holes of the mounting posts, thereby preliminarily achieving the preliminary positioning of the upper cover 110, the circuit board 130 and the heat dissipation module 140. Further, please refer to Figure 7The connecting member passes through the connecting structure 143 and the matching connecting structure on the inner side of the upper cover 110, achieving a locked connection between the body 146 and the upper cover 110. Next, the locking member passes through the through-hole of the lower cover 150 and is partially received in the locking hole of the boss 149, thus achieving a preliminary connection between the body 146 of the heat dissipation module 140 and the lower cover 150. Finally, several mounting members pass through the corresponding first mounting holes 152 and are partially received in the second mounting holes, thus completing the connection between the upper cover 110 and the lower cover 150.

[0100] It is understood that the first positioning hole 131, the second positioning hole 132, the third positioning hole 121, the through hole, the receiving hole, the mounting hole, the locking hole, the first mounting hole 152, and the second mounting hole mentioned in this application can be threaded holes. Accordingly, the fasteners, positioning members, connecting members, locking members, and mounting members can be bolts, hot-melt bolts, etc. This application does not limit the connection or positioning method between the modules in the antenna array device 10. In other embodiments, connection or positioning can also be achieved through adhesives and / or snap-fit ​​methods.

[0101] See also Figure 7 In some embodiments, when the connection structure 143 (or the positioning post 147) is made of a metal material, the height of the connection structure 143 (or the positioning post 147) is less than or equal to the height of the circuit board 130. This can reduce the interference of the connection structure 143 on the radiation module 120. Accordingly, in this application, the upper cover 110 and the lower cover 150 are also made of an insulating material to reduce interference with the radiation module 120.

[0102] It is understandable that the present application does not limit the specific shape of the main body 146. In other embodiments, the main body 146 may also be a circular sheet or a polygonal sheet, etc.

[0103] It is understandable that in the present application, waterproof gaskets are further provided corresponding to the heat dissipation slots 151 and the connection between the upper cover 110 and the lower cover 150 to achieve the functions of waterproofing, dustproofing and reducing vibration.

[0104] In summary, the heat dissipation module 140 provided in the present application increases the thermal conductivity of the thermally conductive structure 141 by arranging a plurality of thermally conductive structures 141 in an array, thereby effectively dissipating heat for the antenna array device 10; at the same time, the circuit board 130 is supported by a plurality of supporting structures 142 and a plurality of connecting structures 143 are connected to the upper cover 110, thereby reducing the probability of displacement of the radiation module 120 in the antenna array device 10 and improving the phase control accuracy of the antenna array device 10.

[0105] Please also refer to Figure 8 and Figure 9Another embodiment of the present application further provides an antenna array device 10a. The antenna array device 10a includes an upper cover 110, a radiation module 120, a circuit board 130, a heat dissipation module 140a, and a lower cover 150a. The antenna array device 10a has substantially the same structure as the antenna array device 10, with the difference being that the heat dissipation module 140a and the lower cover 150a in the antenna array device 10a have different structures from the heat dissipation module 140 and the lower cover 150 in the antenna array device 10, and the placement of the sub-circuit board 170 is different.

[0106] The structure of the heat dissipation module 140a is substantially the same as that of the heat dissipation module 140 in the antenna array device 10. The heat dissipation module 140a also includes a plurality of heat conducting structures 141, a plurality of supporting structures 142, a plurality of connecting structures 143, a plurality of heat conducting sheets 144, a plurality of buffer members 145, a body 146, and a plurality of positioning posts 147 (see Figure 4 The difference between the heat dissipation module 140a and the heat dissipation module 140 is that the second side of the body 146 has a different structural arrangement, and in the heat dissipation module 140a, the second side of the body 146 and the lower cover 150a simultaneously serve as the bottom cover of the antenna array device 10a (see Figure 8 ).

[0107] Specifically, see Figure 10 In this embodiment, the heat dissipation module 140a includes a plurality of first heat sinks 1481a and a plurality of second heat sinks 1482a. The second side of the body 146 includes a first region 1462 and a second region 1463. The first region 1462 is located approximately in the center of the second side. The body 146 also has a receiving groove 1464 on one side of the first region 1462 for accommodating the sub-circuit board 170. The second region 1463 surrounds the first region 1462 and the receiving groove 1464.

[0108] A plurality of first heat sinks 1481a are arranged in a row at intervals within the first region 1462. A first channel 1465 is formed between every two adjacent rows. In each row, every two adjacent first heat sinks 1481a form a second channel 1466. The first channel 1465 extends in a first direction (e.g., Figure 10 The extension direction of the second channel 1466 is the second direction (eg Figure 10 In this embodiment, the second direction and the first direction are substantially perpendicular to each other.

[0109] A plurality of second heat sinks 1482a are spaced apart within the second region 1463, and the plurality of second heat sinks 1482a are centered around the first region 1462 and extend outward in a generally radial pattern. Each second heat sink 1482a is generally arc-shaped, and the closer to the periphery of the body 146, the greater the curvature of the edge of the second heat sink 1482a. In other words, each second heat sink 1482a is generally fin-shaped and disposed on the second side of the body 146. Furthermore, the plurality of second heat sinks 1482a located on the side of the first region 1462 away from the receiving groove 1464 are disposed one-to-one with the plurality of adjacent first heat sinks 1481a, such that the second channels 1466 continue to extend outward in a generally radial pattern within the second region 1463. At least two of the plurality of second heat sinks 1482a are disposed correspondingly to the first channels 1465, such that the first channels 1465 also continue to extend within the second region 1463.

[0110] In other embodiments, the plurality of second heat sinks 1482a may also extend in the second region 1463 in a corrugated shape or other shapes, and the present application is not limited thereto.

[0111] In other embodiments, only a plurality of first heat sinks 1481a may be disposed spaced apart from each other on the second side of the body 146. The plurality of first heat sinks 1481a may extend outward in a radial, corrugated, or other shape.

[0112] It can be understood that in the heat dissipation module 140a, the heat-conducting structure 141, the plurality of supporting structures 142, the plurality of connecting structures 143, the main body 146, the plurality of positioning posts 147, the plurality of first heat sinks 1481a and the plurality of second heat sinks 1482a can be integrally formed from metal materials through a CNC (Computer numerical control machine tools) process, thereby improving the heat dissipation effect of the heat dissipation module 140a.

[0113] The lower cover 150a is used to cover the receiving groove 1464 to protect the sub-circuit board 170 in the receiving groove 1464. In this embodiment, in order to accelerate the heat dissipation speed of the sub-circuit board 170, the side of the lower cover 150a close to the sub-circuit board 170 can also be provided with a plurality of heat conducting structures, a plurality of supporting structures, and a plurality of heat conducting sheets ( Figure 10(not shown). Furthermore, a plurality of third heat sinks 1501a are provided on the side of the lower cover 150a away from the sub-circuit board 170, corresponding to the plurality of second heat sinks 1482a in the second region 1463. Thus, when the lower cover 150a is closed over the receiving groove 1464, the plurality of second heat sinks 1482a located on the side of the first region 1462 close to the receiving groove 1464 are connected to the plurality of third heat sinks 1501a, so that the second channel 1466 continues to extend outward in a generally radial pattern within the second region 1463 (see FIG. 14). Figure 11 ).

[0114] In this way, the heat dissipation module 140a provided in this embodiment is provided with a plurality of first heat dissipation fins 1481a and a plurality of second heat dissipation fins 1482a, and a first channel 1465 and a second channel 1466 are formed on the second side of the main body 146 through the plurality of first heat dissipation fins 1481a and the plurality of second heat dissipation fins 1482a, thereby further increasing the surface area of ​​the heat dissipation module 140a in contact with the air, thereby improving the heat dissipation efficiency of the heat dissipation module 140a.

[0115] See also Figure 12 In one embodiment, the antenna array device 10a further includes a bracket 180. The bracket 180 is used to adjust the height and angle of the antenna array device 10a. The bracket 180 includes a base 181, a support member 182, an angle adjustment connector 183, and a coupling member 184. One end of the support member 182 is connected to the base 181, and the other end is connected to the angle adjustment connector 183. The angle adjustment connector 183 is connected to the second side of the body 146 via a coupling member 184.

[0116] Specifically, the coupling member 184 includes a first coupling portion 1841, a second coupling portion 1842 and a third coupling portion 1843. The first coupling portion 1841 is roughly sheet-shaped. The two ends of the first coupling portion 1841 first extend upward and then bend inward to form the second coupling portion 1842 and the third coupling portion 1843 respectively. In this way, the ends of the first coupling portion 1841 and the second coupling portion 1842 have a height difference with the plane where the first coupling portion 1841 is located. In this embodiment, the second coupling portion 1842 and the third coupling portion 1843 are used to connect with the main body 146. The first coupling portion 1841 is used to connect with the angle adjustment connector 183. In this way, there is a gap between the first coupling portion 1841 and the main body 146 to reduce the influence of the coupling member 184 on the heat dissipation effect of the heat dissipation module 140a.

[0117] Furthermore, the base 181 is used to provide stable support for the antenna array device 10. The support member 182 is a retractable member, and the height of the antenna array device 10a is adjusted by adjusting the height of the support member 182. The angle adjustment connector 183 is used to adjust the angle of the antenna array device 10a. In this embodiment, the angle adjustment connector 183 can achieve angle adjustment by cooperating between a fixed shaft and a rotating shaft (not shown in the figure). It is understandable that the angle adjustment connector 183 is not limited to Figure 12 The specific structure shown in the figure is not limited in the present application to the specific structure of the angle adjustment connecting member 183. In other embodiments, other connecting members for achieving angle adjustment may also be used, such as a movable hinge.

[0118] Thus, in this embodiment, by providing the bracket 180 on the antenna array device 10a, the height and angle of the antenna array device 10a can be adjusted according to the use environment, thereby improving the flexibility of the antenna array device 10a when used.

[0119] It is understandable that the antenna array device 10 may also be provided with a bracket 180 , which will not be described in detail here.

[0120] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent replacements of the technical solutions of the present invention may be made without departing from the spirit and scope of the technical solutions of the present invention. Those skilled in the art may also make other changes within the spirit of the present invention and apply them to the design of the present invention, as long as they do not deviate from the technical effects of the present invention. These changes made in accordance with the spirit of the present invention should all be included in the scope of protection claimed by the present invention.

Claims

1. A heat dissipation module, applied to an antenna array device, wherein the antenna array device comprises a circuit board and an upper cover, characterized in that: The heat dissipation module includes: ontology; A plurality of heat-conducting structures are arranged in an array on one side of the body; A plurality of supporting structures for supporting the circuit board, wherein the plurality of heat-conducting structures and the plurality of supporting structures are arranged on the same side of the body; A plurality of connection structures are arranged on the edge of the body and are used to connect the upper cover.

2. The heat dissipation module according to claim 1, wherein: The heat-conducting structure is made of heat-conducting material.

3. The heat dissipation module according to claim 1, wherein: Each of the heat-conducting structures is a strip-shaped structure, and a plurality of the heat-conducting structures are arranged in rows to form the array.

4. The heat dissipation module according to claim 1, wherein: The heat dissipation module further includes a heat conducting sheet. At least one end of the heat conducting structure is provided with a limiting portion, and the limiting portion is used to limit the heat conducting sheet.

5. The heat dissipation module according to claim 4, wherein: The thermal conductivity of the thermal conductive sheet is greater than or equal to 0.8 W / Mk, the hardness of the thermal conductive sheet is greater than or equal to 10 Shore, and the hardness of the thermal conductive sheet is less than or equal to 70 Shore.

6. The heat dissipation module according to claim 1, wherein: The antenna array device includes a plurality of radiating units, wherein the plurality of radiating units are arranged on one side of the circuit board, and the plurality of heat-conducting structures are arranged on the other side of the circuit board away from the plurality of radiating units, and the plurality of heat-conducting structures are arranged corresponding to the plurality of radiating units, and the area of ​​the plurality of heat-conducting structures accounts for a proportion of the area of ​​the plurality of radiating units that is greater than or equal to 20%.

7. The heat dissipation module according to claim 1, wherein: The heat dissipation module further includes a plurality of heat dissipation fins, which are arranged at intervals on the other side of the body and extend radially outward.

8. An antenna array device, characterized in that: The antenna array device includes a circuit board, an upper cover, a plurality of radiation units and a heat dissipation module according to any one of claims 1 to 7.

9. The antenna array device according to claim 8, wherein: The antenna array device further includes a lower cover, which is connected to the upper cover to form a receiving space, and the receiving space is used to receive a plurality of the radiation units, the circuit board and the heat dissipation module.

10. The antenna array device according to claim 8, wherein: The antenna array device further includes a sub-circuit board, which is arranged on a side of the heat dissipation module away from the circuit board and is electrically connected to the circuit board.

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