Display device

Abstract

The invention provides a display device which is provided with an active area and a peripheral area adjacent to the active area. The display device comprises a first substrate, a first conductive layer, a first insulating layer, a second conductive layer and a second insulating layer. The first conductive layer is disposed on the first substrate. The first insulating layer is disposed on the first conductive layer and includes a first opening disposed in the peripheral region. The second conductive layer is disposed on the first conductive layer and includes a first conductive portion. The first conductive portion is electrically connected to the first conductive layer through the first opening. The second insulating layer includes a plurality of protruding structures disposed in the peripheral region and on the first insulating layer. In a plan view, the plurality of protruding structures are separated from each other, part of the plurality of protruding structures are arranged along a first direction, the other part of the plurality of protruding structures are arranged along a second direction, the first direction is different from the second direction, the first opening is arranged between two of the part of the plurality of protruding structures, and the second opening is arranged between two of the part of the plurality of protruding structures. And the first opening is arranged between two of the plurality of protruding structures of the other part.

Description

[0001] Related divisional applications

[0002] This disclosure is a divisional application of the invention patent application with application number 202110314313.4 filed on March 24, 2021, and invention name “Adjustment Device”. Technical Field

[0003] The present disclosure relates to a display device, and more particularly to a display device capable of improving the adhesion of a sealant layer. Background Art

[0004] Display panels are widely used in electronic products such as mobile phones, televisions, monitors, tablets, automotive displays, wearable devices, and desktop computers. With the rapid development of electronic products, the demand for quality and functionality is becoming increasingly higher. These electronic products often also function as electronic modulation devices, such as antennas that modulate electromagnetic waves. However, existing antenna devices still do not fully meet consumer needs in all aspects. Summary of the Invention

[0005] The present disclosure provides a display device which can improve the adhesion of a sealant layer.

[0006] The present disclosure provides a display device having an active area and a peripheral area adjacent to the active area. The display device includes a first substrate, a first conductive layer, a first insulating layer, a second conductive layer and a second insulating layer. The first conductive layer is arranged on the first substrate. The first insulating layer is arranged on the first conductive layer and includes a first opening arranged in the peripheral area. The second conductive layer is arranged on the first conductive layer and includes a first conductive portion. The first conductive portion is electrically connected to the first conductive layer via the first opening. The second insulating layer includes a plurality of protruding structures, which are arranged in the peripheral area and on the first insulating layer. In a top view, the plurality of protruding structures are separated from each other, a portion of the plurality of protruding structures are arranged along a first direction, and another portion of the plurality of protruding structures are arranged along a second direction, the first direction is different from the second direction, the first opening is arranged between two of the portion of the plurality of protruding structures, and the first opening is arranged between two of the other portion of the plurality of protruding structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure.

[0008] Figure 1A A schematic top view of an adjustment device according to an embodiment of the present disclosure;

[0009] Figure 1B for Figure 1AAn enlarged schematic diagram of region R in FIG.

[0010] Figure 1C for Figure 1B A schematic cross-sectional view of the adjustment device along section line Ⅰ-Ⅰ';

[0011] Figure 1D for Figure 1A A schematic cross-sectional view of the adjustment device along section line II-II';

[0012] Figure 2 A schematic top view of an adjustment device according to another embodiment of the present disclosure;

[0013] Figure 3 A schematic top view of an adjustment device according to another embodiment of the present disclosure;

[0014] Figure 4A A schematic top view of an adjustment device according to another embodiment of the present disclosure;

[0015] Figure 4B for Figure 4A A schematic cross-sectional view of the adjustment device along section line III-III';

[0016] Figure 5A A schematic top view of an adjustment device according to another embodiment of the present disclosure;

[0017] Figure 5B for Figure 5A A schematic cross-sectional view of the adjustment device along section line IV-IV';

[0018] Figure 6A A schematic top view of an adjustment device according to another embodiment of the present disclosure;

[0019] Figure 6B for Figure 6A A schematic cross-sectional view of the adjustment device along section line V-V'.

[0020] Explanation of Figure Numbers

[0021] 100, 100a, 100b, 100c, 100d, 100e: adjustment device;

[0022] 101: active zone;

[0023] 102: surrounding area;

[0024] 103: antenna unit;

[0025] 110: first substrate;

[0026] 110a, 120a, 160a: boundaries;

[0027] 120: first conductive layer;

[0028] 121, 122: insulation layer;

[0029] 122a, 122b: opening;

[0030] 123: LCD;

[0031] 130: first insulating layer;

[0032] 131, 131A: first opening;

[0033] 131B: Another first opening;

[0034] 132, 132A: second opening;

[0035] 132B: Another second opening;

[0036] 133: Opening;

[0037] 134: surface;

[0038] 140: second conductive layer;

[0039] 141, 141A: first conductive portion;

[0040] 141B: another first conductive portion;

[0041] 142, 142A: second conductive portion;

[0042] 142B: another second conductive portion;

[0043] 150, 150-1, 150-2, 150-3: first protruding structure;

[0044] 150A: second insulation layer;

[0045] 151, 151a, 151b: interval;

[0046] 152: lateral surface;

[0047] 153: top surface;

[0048] 154, 154-1, 154-2, 155: Second protruding structure;

[0049] 155: third protruding structure;

[0050] 155a, 155a1, 155a2: third opening;

[0051] 155b: top surface;

[0052] 156: The fourth opening;

[0053] 160: frame glue layer;

[0054] 161, 161c: conductive particles;

[0055] 170: second substrate;

[0056] 180, 181, 183, 185: conductive layer;

[0057] 182, 184, 186: Insulation layer

[0058] 182a, 184a, 184b: opening;

[0059] D1, D4: depth;

[0060] Da: diameter;

[0061] Dg: distance;

[0062] G1, G2: gap;

[0063] H: height;

[0064] R, R1: region;

[0065] S1, S2: lateral;

[0066] X: first direction;

[0067] Y: third direction;

[0068] Z: Second direction. DETAILED DESCRIPTION

[0069] The present disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of simplicity, the various drawings in this disclosure depict only a portion of the adjustment device, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustration only and are not intended to limit the scope of this disclosure. For example, the material of the film layer, the thickness of the film layer, the profile of the film layer, the structure of the transistor, the circuit layout, etc. are merely exemplary, and the dimensions or ranges are also merely exemplary and are not intended to limit this disclosure.

[0070] In the following description and claims, the words “including” and “comprising” are open-ended words, and thus should be interpreted as meaning “including but not limited to…”.

[0071] It should be understood that when an element or film layer is referred to as being “on” or “connected to” another element or film layer, it can be directly on or directly connected to the other element or layer, or there may be intervening elements or film layers between the two (indirect case). Conversely, when an element is referred to as being “directly on” or “directly connected to” another element or film layer, there are no intervening elements or film layers between the two.

[0072] Although the terms "first," "second," "third," etc. may be used to describe various components, these terms are not intended to limit the components to these terms. These terms are used solely to distinguish a single component from other components within the specification. Claims may not use the same terms, but may be replaced with "first," "second," "third," etc., according to the order in which the components are stated in the claims. Therefore, in the following description, the first component may be referred to as the second component in a claim.

[0073] The phrases "ranging from a first value to a second value" and "ranging between a first value and a second value" mean that the range includes the first value, the second value and other values ​​therebetween.

[0074] In some embodiments of the present disclosure, terms related to bonding and connection, such as "connected" and "interconnected," unless otherwise specified, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, with another structure positioned between the two structures. Furthermore, such terms related to bonding and connection may include situations where both structures are movable or both structures are fixed. Furthermore, the term "coupled" encompasses any direct and indirect electrical connection means.

[0075] In the present disclosure, the length and width can be measured using an optical microscope, and the thickness can be measured using a cross-sectional image obtained through an electron microscope, but the present disclosure is not limited thereto. In addition, any two values ​​or directions used for comparison may have a certain degree of error.

[0076] The adjustment device disclosed herein may include an electromagnetic wave adjustment device, but is not limited thereto. The adjustment device disclosed herein may include an antenna device, but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna or an antenna splicing device, but is not limited thereto. It should be noted that the adjustment device may be any of the aforementioned arrangements and combinations, but is not limited thereto. In addition, the shape of the adjustment device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The adjustment device may have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. to support the display device, the antenna device, or the splicing device.

[0077] It should be noted that the following embodiments may be implemented by replacing, recombining, or combining features from several different embodiments to create other embodiments without departing from the spirit of the present disclosure. Features from various embodiments may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0078] Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0079] Figure 1A FIG1 is a top view of an adjustment device according to an embodiment of the present disclosure. Figure 1B for Figure 1A Schematic diagram of the enlarged area R in FIG. Figure 1C for Figure 1B A schematic cross-sectional view of the adjustment device along section line Ⅰ-Ⅰ'. Figure 1D for Figure 1A The schematic cross-sectional view of the adjustment device along the section line II-II'. For the sake of clarity and convenience of illustration, Figure 1A and Figure 1C Several elements of the adjustment device are omitted, for example, Figure 1B The sealant layer 160 is omitted from illustration, but the present invention is not limited thereto. According to some embodiments, the adjustment device may be an electromagnetic wave adjustment device.

[0080] Please refer to Figure 1A The adjustment device 100 of this embodiment includes an active region 101, a peripheral region 102, and an antenna unit 103. The peripheral region 102 is adjacent to the active region 101. The peripheral region 102 may surround the active region 101. The antenna unit 103 is disposed within the active region 101.

[0081] Please also refer to Figures 1A to 1D The adjustment device 100 of this embodiment includes a first substrate 110, a first conductive layer 120, a first insulating layer 130, a second conductive layer 140, a second insulating layer 150A, a sealant layer 160 and a second substrate 170. The first substrate 110 and the second substrate 170 are arranged on the upper and lower sides of the adjustment device 100 relative to each other. The first substrate 110 and the second substrate 170 may include a flexible substrate, a rigid substrate, or a combination thereof. For example, the material of the first substrate 110 and the second substrate 170 may include polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), glass, other suitable substrate materials, or a combination thereof, but is not limited thereto.

[0082] Please refer to Figure 1B and Figure 1CThe first conductive layer 120 is disposed on the first substrate 110. The first insulating layer 130 is disposed on the first conductive layer 120 and includes a plurality of openings, such as the first openings 131, disposed in the peripheral region 102. The second conductive layer 140 is disposed on the first conductive layer 120. The second conductive layer 140 includes a first conductive portion 141. The first conductive portion 141 is electrically connected to the first conductive layer 120 via the first opening 131. The second insulating layer 150A includes a plurality of first protruding structures 150 disposed in the peripheral region 102 and on the first insulating layer 130. In this embodiment, the plurality of first protruding structures 150 may extend continuously and surround the active region 101, but is not limited thereto.

[0083] In some embodiments, the plurality of first protruding structures 150 may extend discontinuously and surround the active region 101 , such as Figure 3 The sealant layer 160 is disposed in the peripheral region 102 and on the second insulating layer 150A. The first opening 131 is disposed between two first protruding structures 150 among the plurality of first protruding structures 150 .

[0084] Specifically, the first conductive layer 120 is disposed within the active region 101 and the peripheral region 102 on the first substrate 110, and the first conductive layer 120 is not disposed within the antenna unit 103. The first conductive layer 120 located within the peripheral region 102 may overlap the sealant layer 160 in the third direction (Y). In this embodiment, the boundary 160a of the sealant layer 160 is, for example, closer to the boundary 110a of the first substrate 110 than the boundary 120a of the first conductive layer 120, but this is not limited to this. In some embodiments, although not shown, the boundary 120a of the first conductive layer may also be closer to the boundary 110a of the first substrate than the boundary 160a of the sealant layer, but this is not limited to this. In addition, the first conductive layer 120 located within the peripheral region 102 can transmit signals from the second substrate 170 to the active region 101. The first conductive layer 120 within the active region 101 can be used to shield invisible light, such as electromagnetic waves, but this is not limited to this. In this embodiment, the material of the first conductive layer 120 may be, for example, molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co), zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), other suitable metals, or alloys or combinations thereof, but is not limited thereto.

[0085] like Figure 1C As shown, the first insulating layer 130 is disposed on the first conductive layer 120 and is disposed in the active region 101 and the peripheral region 102. Figure 1A and Figure 1DAs shown, the first insulating layer 130 includes a plurality of openings 133 disposed in the active region 101 and corresponding to the antenna units 103 .

[0086] The first insulating layer 130 includes a plurality of openings disposed within the peripheral region 102, for example, including a first opening 131 and a second opening 132. For example, the first protruding structure 150 may extend along the second direction Z. Along the first direction (X), at least one first opening 131 may be disposed between the two first protruding structures 150-1 and 150-2, and at least one second opening 132 may be disposed between the two first protruding structures 150-2 and 150-3. Along the first direction (X), the first protruding structure 150-2 may be disposed between the first opening 131 and the second opening 132. The first opening 131 and the second opening 132 may respectively expose portions of the first conductive layer 120. The second conductive layer 140 may include a first conductive portion 141 and a second conductive portion 142. The first conductive portion 141 may be electrically connected to the first conductive layer 120 via the first opening 131, and the second conductive portion 142 may be electrically connected to the first conductive layer 120 via the second opening 132. The first conductive portion 141 and the second conductive portion 142 may be separated from each other, but are not limited thereto. In this embodiment, the first direction (X), the second direction (Z), and the third direction (Y) are different directions, wherein the third direction (Y) is, for example, the normal direction of the first substrate 110, the first direction (X) is, for example, the extension direction of the cross-section line I-I' and is perpendicular to the third direction (Y), and the second direction (Z) is perpendicular to the first direction (X) and the third direction (Y), respectively, but is not limited thereto.

[0087] In some embodiments, the first opening 131 and the second opening 132 may be recessed from the surface 134 of the first insulating layer 130 toward the first substrate 110. The surface 134 of the first insulating layer 130 is the surface of the first insulating layer 130 away from the first substrate 110. The first opening 131 and the second opening 132 may have a depth D1. The depth D1 is, for example, the maximum depth of the first opening 131 and the second opening 132 measured along the normal direction of the first substrate 110. In this embodiment, the first insulating layer 130 may be a single-layer structure or a multi-layer structure, and the material of the first insulating layer 130 may be, for example, an organic insulating material, an inorganic insulating material (such as silicon nitride), or a combination thereof, but is not limited thereto. The depth D1 may be between 0.05 micrometers (μm) and 2 μm, for example, between 0.05 μm and 1 μm, for example, between 0.08 μm and 0.5 μm.

[0088] like Figure 1CAs shown, in some embodiments, the second conductive layer 140 may be disposed in the peripheral region 102 and may not be disposed in the active region 101. In some embodiments, although not shown, the second conductive layer 140 may also be disposed in both the peripheral region 102 and the active region 101. In this embodiment, the material of the second conductive layer 140 may be, for example, a transparent conductive material or a metal material. For example, the material of the second conductive layer 140 may be, for example, indium tin oxide, indium zinc oxide, indium oxide, zinc oxide, tin oxide, a metal material (such as aluminum, molybdenum, copper, silver, etc.), other suitable materials, or a combination thereof, but is not limited thereto.

[0089] The second insulating layer 150A may include a plurality of first protruding structures 150, and the plurality of first protruding structures 150 are arranged on the surface 134 of the first insulating layer 130 and in the peripheral area 102. In some embodiments, the plurality of first protruding structures 150 may not be arranged in the active area 101. In some embodiments, although not shown in the figure, the plurality of first protruding structures 150 may be arranged in the active area 101 and in the peripheral area 102 at the same time. Each first protruding structure 150 in the plurality of first protruding structures 150 is separated from each other, but not limited to this. The plurality of first protruding structures 150 can be separated from each other by having a plurality of gaps 151, but not limited to this. Among them, the plurality of gaps 151 are arranged between two adjacent first protruding structures 150 in the plurality of first protruding structures 150, and the plurality of gaps 151 are respectively arranged corresponding to the plurality of first openings 131 of the first insulating layer 130. Specifically, as Figure 1B and Figure 1C As shown, the space 151 a is provided corresponding to the first opening 131 of the first insulating layer 130 , and the space 151 b is provided corresponding to the second opening 132 of the first insulating layer 130 .

[0090] like Figure 1C As shown, in this embodiment, the side surfaces 152 of the plurality of first protruding structures 150 and the top surface 153 away from the first substrate 110 may be covered by the sealant layer 160. According to some embodiments, the side surfaces 152 and the top surface 153 of the plurality of first protruding structures 150 may be in contact with the sealant layer 160. In addition, according to some embodiments, since the plurality of first protruding structures 150 may be three-dimensional structures protruding from the surface 134 of the first insulating layer 130 toward the second substrate 170, the contact area between the plurality of first protruding structures 150 and the sealant layer 160 may be increased, thereby improving the adhesion of the sealant layer 160. In addition, according to some embodiments, since the plurality of first protruding structures 150 are protruding three-dimensional structures and are disposed in the peripheral area 102, the plurality of first protruding structures 150 may also have the effect of preventing moisture from penetrating, thereby improving the yield of the adjustment device 100.

[0091] In this embodiment, the material of the plurality of first protruding structures 150 may be, for example, an organic insulating material, an inorganic insulating material, or a combination thereof, but is not limited thereto. The inorganic insulating material may be, for example, silicon nitride, silicon oxide, or a combination thereof. In this embodiment, the height H of at least one of the plurality of first protruding structures 150 may be, for example, between 0.1 micrometers (μm) and 3 micrometers, but is not limited thereto. According to some embodiments, the height H of all the plurality of first protruding structures 150 may be, for example, between 0.1 micrometers (μm) and 3 micrometers. When the height of the plurality of first protruding structures is less than 0.1 μm, the contact area between the plurality of first protruding structures and the sealant layer is insufficient, thereby failing to effectively improve the adhesion of the sealant layer. The height H is, for example, the maximum height of the plurality of first protruding structures 150 measured along the normal direction of the first substrate 110. Furthermore, in this embodiment, the distance Dg of the gap G1 between the first substrate 110 and the second substrate 170 may be, for example, between 2 μm and 10 μm, but is not limited thereto. In some embodiments, the distance Dg of the gap G1 may also be 3 μm. Therefore, when the gap G1 between the first substrate 110 and the second substrate 170 has a distance Dg of approximately 3 microns and the height of the plurality of first protruding structures is greater than 3 microns, the plurality of first protruding structures may press against the second substrate, resulting in poor flowability of the sealant layer during fabrication. The distance Dg is, for example, the distance between the first substrate 110 and the second substrate 170 measured along the normal direction of the first substrate 110.

[0092] The sealant layer 160 may be disposed in the peripheral area 102 and on the second insulating layer 150A. The sealant layer 160 may be disposed in the gap G1 between the first substrate 110 and the second substrate 170 so that the first substrate 110 can be adhered and aligned with the second substrate 170 through the sealant layer 160. In this embodiment, the sealant layer 160 may surround the plurality of first protruding structures 150. In addition, the sealant layer 160 may include conductive particles 161. Figure 1C As shown, the conductive particles 161 can contact the second conductive layer 140 on the first substrate 110 and the conductive layer 185 on the second substrate 170. In this way, the second conductive layer 140 can transmit signals from the second substrate 170 to the first conductive layer 120 and the active region 101. In this embodiment, the diameter Da of the conductive particles 161 can be, for example, 2 microns to 10 microns, but is not limited thereto. In some embodiments, the diameter Da of the conductive particles 161 can also be 3 microns. The diameter Da is, for example, the maximum diameter of the conductive particles 161 measured along the normal direction of the first substrate 110.

[0093] like Figure 1C and Figure 1DAs shown, in this embodiment, the adjustment device 100 may further include an insulating layer 121, an insulating layer 122, a liquid crystal 123, a conductive layer 180, a conductive layer 181, an insulating layer 182, a conductive layer 183, an insulating layer 184, and a conductive layer 185. Specifically, the insulating layer 121 is disposed between the first conductive layer 120 and the first substrate 110, and is disposed within the active region 101 and the peripheral region 102. The insulating layer 122 is disposed on the first insulating layer 130 and within the opening 133 of the first insulating layer 130, and the insulating layer 122 is disposed within the active region 101. The insulating layer 122 has an opening 122a and an opening 122b, wherein the opening 122a exposes a portion of the first insulating layer 130, and the opening 122b exposes a portion of the insulating layer 121. The opening 122b may be disposed corresponding to the antenna unit 103. The liquid crystal 123 is disposed in the active area 101 , and is disposed in the gap G1 between the first substrate 110 and the second substrate 170 , in the opening 122 a , and in the opening 122 b .

[0094] Next, a conductive layer 180 is disposed on the second substrate 170 and within the active region 101 and the peripheral region 102. An insulating layer 182 is disposed on the second substrate 170 and within the active region 101 and the peripheral region 102 to cover the conductive layer 180. The insulating layer 182 has an opening 182a to expose a portion of the conductive layer 180. A conductive layer 183 is disposed on the insulating layer 182 and within the active region 101 and the peripheral region 102. An insulating layer 184 is disposed within the active region 101 and the peripheral region 102. The insulating layer 184 located within the peripheral region 102 is disposed on the insulating layer 182 to cover the conductive layer 183. The insulating layer 184 located within the peripheral region 102 has an opening 184a and an opening 184b, wherein the opening 184a communicates with the opening 182a to expose a portion of the conductive layer 180, and the opening 184b exposes a portion of the conductive layer 183. Conductive layer 181 is disposed on insulating layer 184 and within active region 101. Insulating layer 186 within active region 101 is disposed on second substrate 170 to cover conductive layer 181. Conductive layer 185 is disposed on insulating layer 184, within opening 184a, within opening 182a, and within opening 184b. Conductive layer 185 may be disposed within peripheral region 102 and active region 101. According to some embodiments, conductive layer 185 may be disposed within peripheral region 102 and may not be disposed within active region 101. Conductive layer 185 may be electrically connected to conductive layer 180 via opening 184a, and conductive layer 185 may also be electrically connected to conductive layer 183 via opening 184b. The conductive layer 185 can also contact the conductive particles 161 in the sealant layer 160. Therefore, the signal from the conductive layer 180 in the second substrate 170 can be transmitted to the first conductive layer 120 in the first substrate 110 through the conductive layer 185, the conductive particles 161 and the second conductive layer 140, and the signal from the conductive layer 183 in the second substrate 170 can also be transmitted to the first conductive layer 120 in the first substrate 110 through the conductive layer 185, the conductive particles 161 and the second conductive layer 140.

[0095] Although the first protruding structure 150 in this embodiment is located in the peripheral region 102 and disposed on the first substrate 110, the present disclosure does not limit the placement of the first protruding structure. In other words, in some embodiments, the first protruding structure may also be disposed on the second substrate. In some embodiments, the first protruding structure may also be disposed on both the first substrate and the second substrate.

[0096] like Figure 1A and Figure 1BAs shown, the first substrate 110 includes a side S1 and a side S2, with side S1 connecting to side S2. Side S1 extends along a first direction (X), and side S2 extends along a second direction (Z). Taking region R as an example, region R is adjacent to side S2 of the first substrate 110. The first protruding structure 150 in region R can extend in the second direction (Z), that is, it can be the same as the extension direction of side S2. Region R1 is adjacent to side S1 of the first substrate 110. The first protruding structure 150 in region R1 can extend in the first direction (X), that is, it can be the same as the extension direction of side S1.

[0097] The above embodiment is based on Figure 1A Taking region R in FIG. 1 as an example, the first protruding structure 150 extends along the second direction (Z). Along the first direction (X), at least one first opening 131 may be disposed between the two first protruding structures 150-1 and 150-2. Although not shown, in region R1, the first protruding structure 150 may extend along the first direction (X). Along the second direction (Z), at least one first opening 131 may be disposed between the two first protruding structures 150.

[0098] The following examples are provided for illustration purposes only. It should be noted that the following examples share the same component numbers and some of the details as the previous examples, with the same numbers used to represent the same or similar components, and descriptions of the same technical details omitted. For the omitted details, please refer to the previous examples, and the following examples will not be repeated.

[0099] Figure 2 This is a top view of an adjustment device according to another embodiment of the present disclosure. Figure 1B and Figure 2 The adjustment device 100a of this embodiment is roughly similar to Figure 1BThe adjustment device 100 of this embodiment is described in detail, and therefore, the same and similar components of the two embodiments will not be repeated here. The adjustment device 100a of this embodiment differs from the adjustment device 100 primarily in the design of the second conductive layer 140 and the first opening 131. In the adjustment device 100a of this embodiment, the first insulating layer 130 includes a first opening 131A and another first opening 131B disposed within the peripheral region 102. The other first opening 131B is disposed along the second direction (Z) corresponding to the first opening 131A. The first protruding structure 150 can extend along the second direction (Z). The first opening 131A is disposed along the first direction (X) between the two first protruding structures 150-1 and 150-2. The second conductive layer 140 includes a first conductive portion 141A and another first conductive portion 141B. The first conductive portion 141A is electrically connected to the first conductive layer 120 via the first opening 131A, and the other first conductive portion 141B is electrically connected to the first conductive layer 120 via the other first opening 131B. The first conductive portion 141A is connected to the other first conductive portion 141B. In detail, the first conductive portion 141A and the other first conductive portion 141B are connected to each other along the second direction (Z). In addition, the first insulating layer 130 may further include a second opening 132A and another second opening 132B disposed within the peripheral area 102, and the other second opening 132B is disposed corresponding to the second opening 132A along the second direction (Z). The second conductive layer 140 may further include a second conductive portion 142A and another second conductive portion 142B. The second conductive portion 142A is electrically connected to the first conductive layer 120 via the second opening 132A, and the other second conductive portion 142B is electrically connected to the first conductive layer 120 via the other second opening 132B. The second conductive portion 142A and the other second conductive portion 142B are connected to each other. In detail, the second conductive portion 142A and the other second conductive portion 142B are connected to each other along the second direction (Z).

[0100] Figure 3 This is a top view of an electromagnetic wave adjustment device according to another embodiment of the present disclosure. Figure 1B and Figure 3 The electromagnetic wave adjustment device 100b of this embodiment is roughly similar to Figure 1BThe electromagnetic wave adjustment device 100 of the present embodiment is different from the electromagnetic wave adjustment device 100b of the present embodiment in that the second insulating layer 150A of the present embodiment further includes a plurality of second protruding structures 154 disposed within the peripheral region 102 and separated from the plurality of first protruding structures 150. The first opening 131 is disposed between two first protruding structures 150 along the first direction (X) and between two second protruding structures 154 of the plurality of second protruding structures 154 along the second direction (Z). Specifically, the first opening 131 is disposed between the first protruding structures 150-1 and 150-2 along the first direction (X) and between the two second protruding structures 154-1 and 154-2 along the second direction (Z).

[0101] In this embodiment, the first protruding structure 150-1 (or first protruding structure 150-2, or first protruding structure 150-3) is disposed and extended discontinuously, resulting in a gap G2 between two adjacent first protruding structures 150-1 (or first protruding structure 150-2, or first protruding structure 150-3). This gap G2 facilitates the flow of the sealant layer 160 during fabrication. Specifically, the first protruding structure 150 extending in the second direction (Z) is provided with a gap G2. For example, using the first protruding structure 150-1 as an example, a gap G2 is provided between two adjacent first protruding structures 150-1 extending in the second direction (Z).

[0102] In this embodiment, the material of the plurality of second protruding structures 154 is the same as or similar to that of the plurality of first protruding structures 150b and is therefore not further described here. Furthermore, since the plurality of second protruding structures 154 may also be three-dimensional structures protruding from the surface of the first insulating layer 130 toward the second substrate (not shown), the contact area between the plurality of second protruding structures 154 and the sealant layer (not shown) can be increased, thereby further improving the adhesion of the sealant layer.

[0103] Figure 4A FIG1 is a top view of an adjustment device according to another embodiment of the present disclosure. Figure 4B for Figure 4A The schematic cross-sectional view of the adjustment device along the section line Ⅲ-Ⅲ'. Please also refer to Figure 1B-1C and Figure 4A-4B The adjustment device 100c of this embodiment is roughly similar to Figure 1B-1CThe adjustment device 100 of this embodiment is similar to the adjustment device 100, so the same or similar components of the two embodiments will not be repeated here. The adjustment device 100c of this embodiment differs from the adjustment device 100 primarily in that it further includes a plurality of third protruding structures 155 and a plurality of third openings 155a. In the first direction (X), the third protruding structure 155 can be disposed between the two first protruding structures 150.

[0104] like Figure 4A and Figure 4B As shown, the second insulating layer 150A further includes a plurality of third protruding structures 155 disposed in the peripheral region 102. The plurality of third protruding structures 155 may extend continuously and surround the active region 101, but is not limited thereto. A portion of the first conductive portion 141 may be disposed on at least one of the plurality of third protruding structures 155. At least one of the plurality of third protruding structures 155 includes a third opening 155a. Figure 4B As shown, the third opening 155a can be connected to the first opening 131 of the first insulating layer 130. Another portion of the first conductive portion 141 can be disposed on the sidewall of the third opening 155a. Although not shown, the plurality of third protruding structures 155 can also be disposed and extended in a discontinuous manner. For example, the first protruding structures 155 extending in the second direction (Z) can be provided with gaps (such as Figure 3 As shown in the gap G2, the sealant layer 160 can flow more easily during manufacturing due to the setting of the gap.

[0105] A plurality of fourth openings 156 may be disposed between adjacent first protruding structures 150 and third protruding structures 155. The fourth openings 156 expose portions of the first insulating layer 130 and have a depth D4. Depth D4 is, for example, the maximum depth of the fourth openings 156 measured along a normal to the first substrate 110. In some embodiments, depth D4 of the fourth openings 156 is, for example, equal to, but not limited to, the height H of the first protruding structures 150.

[0106] In this embodiment, the plurality of third protruding structures 155 include a plurality of third openings 155a. In this embodiment, the plurality of first conductive portions 141 (or the plurality of second conductive portions 142) of the second conductive layer 140 can be disposed on the top surface 155b of the plurality of third protruding structures 155 away from the first substrate 110, within the plurality of third openings 155a, and within the plurality of first openings 131. Figure 4BAs shown, the third opening 155a of the third protruding structure 155 can be connected to the first opening 131 of the first insulating layer 130. Thus, the first conductive portion 141 can be electrically connected to the first conductive layer 120 via the third opening 155a and the first opening 131. In this embodiment, since the second conductive layer 140 can be disposed on the top surfaces 155b of the plurality of third protruding structures 155, the distance between the conductive layer 185 on the second substrate 170 and the second conductive layer 140 on the first substrate 110 can be reduced, thereby enabling the use of conductive particles 161c with a smaller diameter Da. This can reduce the cost of the conductive particles 161c and provide greater flexibility in the design of the size of the gap G1.

[0107] In this embodiment, since the plurality of third protruding structures 155 can also be three-dimensional structures protruding from the surface 134 of the first insulating layer 130 toward the second substrate 170, the contact area between the plurality of third protruding structures 155 and the sealant layer 160 can be increased, thereby further improving the adhesion of the sealant layer 160.

[0108] According to some embodiments, the second insulating layer 150A may include a plurality of protruding structures. For example, the second insulating layer 150A may include a plurality of first protruding structures 150. For example, the second insulating layer 150A may include a plurality of first protruding structures 150 and a plurality of second protruding structures 154. For example, the second insulating layer 150A may include a plurality of first protruding structures 150 and a plurality of third protruding structures 155. For example, the second insulating layer 150A may include a plurality of first protruding structures 150, a plurality of second protruding structures 154, and a plurality of third protruding structures 155. Figure 3 , the extension direction of the first protruding structure 150 is the second direction (Z), and at least one first opening 131 is provided between the two first protruding structures 150-1 and 150-2 along the first direction (X). The first opening 131 is also provided between the two second protruding structures 154-1 and 154-2 along the second direction (Z). The second conductive layer 140 is not provided above the first protruding structure 150 and the second protruding structure 154. According to some embodiments, the protruding structure provided with the second conductive layer 140 may be defined as a third protruding structure 155. For example, referring to Figure 4B Part of the second conductive layer 140 is disposed on the third protruding structure 155. Specifically, the first conductive portion 141 of the second conductive layer 140 is disposed on the third protruding structure 155. Furthermore, the third protruding structure 155 may have a third opening 155a, which may be connected to the first opening 131 of the first insulating layer 130.

[0109] Figure 5A FIG1 is a top view of an adjustment device according to another embodiment of the present disclosure. Figure 5B for Figure 5A The cross-sectional diagram of the adjustment device along the section line IV-IV'. Please also refer to Figure 4A-4B and Figure 5A-5B The adjustment device 100d of this embodiment is roughly similar to Figure 4A-4B The adjustment device 100c of this embodiment is different from the adjustment device 100c in the design of the third opening 155a in the third protruding structure 155. In this embodiment, the third protruding structure 155 is disposed between the two first protruding structures 150 along the first direction (X). The third protruding structure 155 includes at least two third openings 155a1 and 155a2 along the first direction (X). The first insulating layer 130 includes a first opening 131A and another first opening 131B disposed within the peripheral region 102. The second conductive layer 141 includes a first conductive portion 141A and another first conductive portion 141B. The first conductive portion 141A and the other first conductive portion 141B are electrically connected to the first conductive layer 120 via the two third openings 155a1 and 155a2, respectively. The first conductive portion 141 and the other conductive portion 142 are not connected along the first direction (X).

[0110] Figure 6A FIG1 is a top view of an adjustment device according to another embodiment of the present disclosure. Figure 6B for Figure 6A The schematic cross-sectional view of the adjustment device along the section line V-V'. Please also refer to Figure 5A-5B and Figure 6A-6B The adjustment device 100e of this embodiment is roughly similar to Figure 5A-5B The adjustment device 100d of the present embodiment is different from the adjustment device 100d, so the same and similar components in the two embodiments will not be repeated here. The adjustment device 100e of this embodiment is different from the adjustment device 100d mainly in the design of the third opening 155a in the third protruding structure 155. Along the first direction (X), the third protruding structure 155 includes third openings 155a1 and 155a2. The first insulating layer 130 includes a first opening 131A and another first opening 131B arranged in the peripheral area 102, and the second conductive layer 140 includes a first conductive portion 141A and another first conductive portion 141B. Along the first direction (X), the first conductive portion 141A and the other first conductive portion 141B are connected to each other. Moreover, the connected first conductive portion 141A and the other first conductive portion 141B are filled in the third openings 155a1 and 155a2 of the third protruding structure 155. As such, the connected first conductive portion 141A and the other first conductive portion 141B are electrically connected to the first conductive layer 120 via the third openings 155 a 1 and 155 a 2 , the first opening 131A, and the other first opening 131B.

[0111] In summary, in the disclosed embodiment of the adjustment device, by disposing the multiple first protruding structures within the peripheral region, the contact area between the multiple first protruding structures and the sealant layer is increased, thereby improving the adhesive strength of the sealant layer. Furthermore, because the multiple first protruding structures are protruding three-dimensional structures and are disposed within the peripheral region, they also prevent moisture from penetrating, thereby improving the yield of the adjustment device.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A display device, characterized in that: The display device has an active area and a peripheral area, wherein the peripheral area is adjacent to the active area, and includes: a first substrate; a first conductive layer, disposed on the first substrate; a first insulating layer disposed on the first conductive layer and comprising a first opening disposed in the peripheral region; a second conductive layer disposed on the first conductive layer and comprising a first conductive portion, wherein the first conductive portion is electrically connected to the first conductive layer via the first opening; and a second insulating layer comprising a plurality of protruding structures disposed in the peripheral region and on the first insulating layer; In which, in a top view, the multiple protrusion structures are separated from each other, part of the multiple protrusion structures are arranged along a first direction, and another part of the multiple protrusion structures are arranged along a second direction, the first direction is different from the second direction, the first opening is arranged between two of the multiple protrusion structures of the part, and the first opening is arranged between two of the multiple protrusion structures of the other part.

2. The display device according to claim 1, wherein Also includes: The sealant layer is disposed in the peripheral area and overlaps the plurality of protruding structures.

3. The display device according to claim 1, wherein The material of the second conductive layer includes a transparent conductive material.

4. The display device according to claim 1, wherein The first insulating layer further includes another first opening disposed in the peripheral region, and the first conductive portion is electrically connected to the first conductive layer via the another first opening.

5. The display device according to claim 1, wherein The thickness of the second conductive layer is smaller than that of the first conductive layer.

6. The display device according to claim 1, wherein The thickness of the second conductive layer is smaller than the thickness of one of the plurality of protruding structures.

7. The display device according to claim 1, wherein In the plan view, along the second direction, a width of one of the plurality of protruding structures of the other portion is greater than a width of the first opening.

8. The display device according to claim 1, wherein In the plan view, a distance between the two of the plurality of protruding structures in the other portion along the second direction is different from a distance between the two of the plurality of protruding structures in the portion along the first direction.

9. The display device according to claim 1, wherein In the plan view, a maximum width of one of the plurality of protruding structures of the other portion is smaller than a maximum width of the first conductive portion.

10. The display device according to claim 1, wherein In the plan view, the maximum width of the first conductive layer is greater than the maximum width of the first conductive portion.

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