Multi-layer high-density double-sided PCB (Printed Circuit Board) preparation device

Abstract

The invention belongs to the technical field of printed circuit board manufacturing equipment, and particularly relates to a multi-layer high-density double-sided PCB manufacturing device which comprises a workbench provided with a machining opening, a cover plate is arranged in the machining opening, a cover plate pressing mechanism is arranged on the workbench, a drill point driven by a driving motor is arranged on the workbench, and a drill rod is arranged on the drill point. A first conveying frame, a second conveying frame and a bearing plate are arranged on the workbench, and an air compressor and a vortex tube are fixed to the outer wall of the workbench through connecting plates. The turnover mechanism and the vortex tube are arranged, the turnover mechanism drives the circuit board to rotate and intermittently extrudes the water bag to guide out water flow, hot air flow generated by the vortex tube can make contact with the rotating circuit board to achieve uniform preheating of the circuit board, internal stress and moisture of the circuit board are eliminated, and the stability of the circuit board during drilling is improved; and hot air flow generated by the vortex tube can cool the water body, so that the water body can continuously cool the cover plate and the drill point, and the working stability of the drill point is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board manufacturing equipment, and in particular to a multi-layer high-density double-sided PCB circuit board manufacturing device. Background Art

[0002] PCB circuit board is the core component used to support and connect electronic components in electronic equipment. It is known as the "mother of electronic products". It realizes electrical interconnection between components through the combination of conductive circuits and insulating substrates. It has the characteristics of high density, high reliability, and strong designability.

[0003] Double-sided PCBs are wired on both sides and connected via guide holes. To achieve this connection, holes need to be drilled in the PCB. Then, through a chemical copper deposition process, the holes are made conductive, allowing the circuits on both sides of the PCB to connect. Therefore, a drilling device is required to drill holes in the PCB. Before drilling holes in a multi-layer PCB, an aluminum cover plate and a backing plate need to be placed on the upper and lower sides of the PCB. The aluminum cover plate improves hole position accuracy, hole wall quality, and drill bit life during processing, reduces needle breakage, prevents burrs and scratches on the PCB surface, and acts as a temperature reducer. However, due to friction between the drill bit and the cover plate, the temperature of the cover plate and drill bit will rise rapidly. On the one hand, the temperature of the cover plate and drill bit will directly affect the stability of the PCB itself, causing problems such as overheating of the copper foil and melting of the resin. On the other hand, the drill bit penetrates deep into the cover plate and PCB, making it difficult for the drill bit to dissipate its own heat, causing the drill tip temperature to reach 600-800°C, exacerbating the oxidation of the drill bit material and grain boundary embrittlement.

[0004] To solve the above problems, we proposed a multi-layer high-density double-sided PCB circuit board preparation device. Summary of the Invention

[0005] The purpose of the present invention is to solve the problems in the background technology and to propose a multi-layer high-density double-sided PCB circuit board preparation device.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a multi-layer high-density double-sided PCB circuit board preparation device, comprising a workbench with a processing opening, a cover plate provided in the processing opening, a cover plate pressing mechanism provided on the workbench, a drill bit driven by a drive motor provided on the workbench, a conveying frame 1, a conveying frame 2 and a carrying plate provided on the workbench, an air compressor and a vortex tube fixed to the outer wall of the workbench through a connecting plate, the air compressor is connected to the vortex tube, a cold air pipe is fixed to the cold end of the vortex tube, a water bag is provided on the carrying plate, the cold air pipe is arranged through the water bag, a cooling chamber is provided in the cover plate, a water supply pipe is connected between the water bag and the cooling chamber, and a water return mechanism is provided on the side wall of the cover plate; The conveying frame is provided with a turning mechanism for driving the circuit board to turn over and squeeze the water bag to deform. The hot end of the vortex tube is connected to a hot air pipe arranged toward the turning mechanism. The hot air discharged by the hot air pipe contacts the circuit board to achieve preheating of the circuit board. The turning mechanism completes the turning of the circuit board to achieve uniform preheating of the circuit board and squeezes the water bag to deform to achieve water flow to cool the cover plate. The preheating and cooling operations are carried out simultaneously.

[0007] In the above-mentioned multi-layer high-density double-sided PCB circuit board preparation device, the turning mechanism includes a rotating motor fixed on the outer wall of the conveying frame, the end of the cold air pipe is arranged toward the rotating motor, the driving end of the rotating motor is fixedly connected to a rotating shaft, the outer wall of the rotating shaft is fixedly connected to a preheating screen frame located in the conveying frame one, a plurality of conveying rollers one located on both sides of the preheating screen frame are installed in the conveying frame one, a plurality of conveying rollers two are installed in the conveying frame two, a through opening is provided on the lower side wall of the conveying frame one, a diverter plate located below the through opening is fixed to the lower side wall of the preheating screen frame, a plurality of hot air ports arranged toward the preheating screen frame are provided on the diverter plate, and the end of the hot air pipe is fixed to the lower side wall of the diverter plate and is connected to the hot air port; A long arc plate for intermittently squeezing the water bag is fixed to the outer wall of the end of the rotating shaft.

[0008] In the above-mentioned multi-layer high-density double-sided PCB circuit board preparation device, a clamping mechanism is provided on the preheating screen frame, and the clamping mechanism includes two right-angle plates symmetrically fixed on the preheating screen frame, a moving rod is slidably inserted on the right-angle plate, the lower end of the moving rod is fixed with a clamping plate, the upper end of the moving rod is sleeved with a telescopic spring, the two ends of the telescopic spring are respectively fixedly connected to the upper side wall of the right-angle plate and the outer wall of the moving rod, the upper side wall of the clamping plate is fixedly embedded with a magnet plate, and the inner top wall of the right-angle plate is fixedly installed with an electromagnet.

[0009] In the above-mentioned multi-layer high-density double-sided PCB circuit board preparation device, a power supply mechanism is also provided on the outer wall of the conveying frame 1, and the power supply mechanism includes a circular conductive ring fixed on the outer wall of the conveying frame 1, and the outer wall of the end of the rotating shaft is fixedly connected to a carbon brush in contact with the inner wall of the circular conductive ring. The rotating shaft is arranged to coincide with the center of the circular conductive ring, and the inner wall of the rotating shaft is distributed with wires connected to the carbon brush and the electromagnet.

[0010] In the above-mentioned multi-layer high-density double-sided PCB circuit board preparation device, the upper side wall of the workbench is fixedly connected to a support frame, the outer wall of the support frame is provided with a transverse guide rail and front and rear guide rails connected to the transverse guide rail, the front and rear guide rails are connected to a telescopic cylinder, and the drive motor is fixed to the drive end of the telescopic cylinder.

[0011] In the above-mentioned multi-layer high-density double-sided PCB circuit board preparation device, the cover plate pressing mechanism includes a flip motor fixed on the outer wall of the workbench, a bent plate is fixedly connected to the outer wall of the driving end of the flip motor, and a clamping column is fixedly connected to the end of the bent plate. A notch connected to the processing port is opened on the side wall of the workbench, and an electric push rod 2 is arranged in the notch, and a clamping plate is fixed to the driving end of the electric push rod 2.

[0012] In the above-mentioned multi-layer high-density double-sided PCB circuit board preparation device, a pushing mechanism is also provided on the workbench, and the pushing mechanism includes an electric push rod, and the driving end of the electric push rod is fixedly connected to a push plate. A slide groove connected to the processing port is opened on the workbench, and the push plate is inserted in the slide groove.

[0013] In the above-mentioned multi-layer high-density double-sided PCB circuit board preparation device, the return water mechanism includes a piston tube arranged on the side wall of the cover plate and connected to the cooling chamber, a piston column is slidably arranged in the piston tube, and a return spring is provided on the outer wall of the piston column. The two ends of the return spring are respectively fixedly connected to the end of the piston tube and the outer wall of the piston column.

[0014] In the above-mentioned multi-layer high-density double-sided PCB circuit board preparation device, the water supply pipe is composed of a right-angle pipe 1 and a right-angle pipe 2 connected together.

[0015] Compared with existing technologies, the advantages of a multi-layer high-density double-sided PCB circuit board preparation device are: 1. Set up a flip mechanism and vortex tube. The flip mechanism drives the circuit board to rotate. The hot air generated by the vortex tube contacts the circuit board to complete the preheating of the circuit board. The preheating eliminates the internal stress of the circuit board, reduces the hole position deviation or board warping after drilling, removes moisture, and avoids resin softening. The intermittent contact and extrusion between the long arc plate and the water bag enables the outflow and retraction of water, continuously squeezing the cold water flow into the cooling chamber to complete the cooling of the cover plate and the drill bit. The cold air flow generated by the vortex tube flows in the cold air pipe, lowering the temperature of the cold air pipe so that the cold air pipe can continuously cool the water in the water bag, avoiding the increase of water temperature, so that the water can continuously cool the cover plate. The excess cold air flow contacts the rotating motor to complete the cooling of the rotating motor. A clamping mechanism is provided, and the rotating motor drives the preheating screen frame to rotate. While driving the circuit board to rotate, the carbon brush slides in contact with the inner wall of the circular conductive ring, so that the electromagnet can be continuously powered when the preheating screen frame rotates, ensuring the stability of the clamping work; A cover plate clamping mechanism is provided, and the flip motor drives the bending plate and the clamping column to rotate. The clamping column moves into the processing opening and presses against the upper side wall of the cover plate. The second driving end of the electric push rod extends from the side to drive the clamping plate to move and contact and press against the cover plate and the circuit board. At this time, the flip motor can drive the clamping column to rotate away from the processing opening, so that there is no obstacle above the cover plate. At this time, the movement of the drill bit is no longer affected, ensuring that the cover plate and the circuit board are tightly attached without affecting the drilling work. The present invention provides a turnover mechanism and a vortex tube. The turnover mechanism drives the circuit board to rotate and intermittently squeezes the water bag to extract water flow. The hot air flow generated by the vortex tube can contact the rotating circuit board to achieve uniform preheating of the circuit board, eliminate internal stress and moisture in the circuit board, and improve the stability of the circuit board during drilling. The hot air flow generated by the vortex tube can cool the water body, so that the water body can continuously cool the cover plate and the drill bit, ensuring the stability of the drill bit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a multi-layer high-density double-sided PCB circuit board preparation device proposed by the present invention; Figure 2 This is a structural schematic diagram from another perspective of a multi-layer high-density double-sided PCB circuit board preparation device proposed by the present invention; Figure 3 This is a structural schematic diagram of the bottom of a conveying frame in a multi-layer high-density double-sided PCB circuit board preparation device proposed by the present invention; Figure 4 This is a schematic structural diagram of a flipping mechanism in a multi-layer high-density double-sided PCB circuit board preparation device proposed by the present invention; Figure 5 for Figure 2 A magnified view of the structure of part A; Figure 6 This is a partial structural schematic diagram of a workbench in a multi-layer high-density double-sided PCB circuit board preparation device proposed by the present invention.

[0017] In the figure: 1 workbench, 2 support frame, 3 transverse guide rail, 4 drill bit, 5 conveying frame 1, 6 conveying frame 2, 7 vortex tube, 8 air compressor, 9 cold air pipe, 10 hot air pipe, 11 diverter plate, 12 rotating motor, 13 preheating screen frame, 14 right angle plate, 15 moving rod, 16 clamping plate, 17 telescopic spring, 18 carbon brush, 19 circular conductive ring, 20 long arc plate, 21 water bag, 22 right angle tube 1, 23 right angle tube 2, 24 piston column, 25 return spring, 26 flip motor, 27 bending plate, 28 pressing column, 29 opening, 30 electric push rod 1, 31 push plate, 32 pressing plate, 33 electric push rod 2, 34. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] Reference Figures 1-6 A multi-layer high-density double-sided PCB circuit board preparation device includes a workbench 1 with a processing opening, a cover plate is provided in the processing opening, and a pad is embedded in the bottom of the processing opening. The pad is slidably embedded in the bottom of the processing opening, and the surface of the pad is coated with an anti-stick coating to reduce the adhesion of debris and reduce the cleaning frequency. A graphene composite material is fixed on the lower surface of the pad to enhance the thermal conductivity of the pad. In order to ensure the efficiency of cleaning debris on the pad, dense small holes can also be provided on the pad, and a vacuum adsorption system is used. That is, the pad is connected to components such as a vacuum pump and a suction cup to generate negative pressure at the sealed small hole to quickly discharge the debris and avoid excessive accumulation of debris to scratch the hole wall.

[0020] The workbench 1 is provided with a cover plate clamping mechanism, and the workbench 1 is provided with a drill 4 driven by a drive motor. The upper side wall of the workbench 1 is fixedly connected to the support frame 2, and the outer wall of the support frame 2 is provided with a transverse guide rail 3 and a front and rear guide rail connected to the transverse guide rail 3. The front and rear guide rails are connected to a telescopic cylinder, and the drive motor is fixed on the drive end of the telescopic cylinder. The workbench 1 is provided with a conveying frame 1 5, a conveying frame 2 6 and a carrying plate. The helix angle of the drill 4 is 35-40°. The large helix angle has a strong chip removal ability and can quickly take away the heat during drilling. The drill 4 is connected to the drive end of the drive motor through a heat dissipation wing handle. The heat dissipation wing handle adopts an aluminum alloy disc and is provided with fine circular holes on the surface. Excess cold air flow can also be directly directed to blow towards the drill 4. The cold air flow can directly enter the circular hole, increase the contact area with the drill 4, and complete rapid heat dissipation of the drill 4.

[0021] The conveying frame 15 is provided with a turning mechanism for driving the circuit board to turn over and squeeze the water bag 21 to deform. The turning mechanism includes a rotating motor 12 fixed on the outer wall of the conveying frame 15. The end of the cold air pipe 9 is arranged toward the rotating motor 12. The driving end of the rotating motor 12 is fixedly connected to a rotating shaft. The outer wall of the rotating shaft is fixedly connected to the preheating screen frame 13 located in the conveying frame 15. A plurality of conveying rollers 1 located on both sides of the preheating screen frame 13 are installed in the conveying frame 15. A plurality of conveying rollers 2 are installed in the conveying frame 26. The lower side wall of the conveying frame 15 is provided with a through hole 29. The lower side wall of the preheating screen frame 13 is provided with a through hole 29. A diverter plate 11 is fixed on the lower side of the through-port 29, and a plurality of hot air ports are provided on the diverter plate 11 facing the preheating screen frame 13. The end of the hot air pipe 10 is fixed on the lower side wall of the diverter plate 11 and is connected to the hot air port. The circuit board is transported to the preheating screen frame 13 for preheating. The preheated circuit board stops on the preheating screen frame 13, and the circuit board on the conveying frame 1 5 continues to be conveyed forward. The circuit board stopped on the preheating screen frame 13 is squeezed onto the conveying roller 1, and the preheated circuit board can be transported to the processing port. The next circuit board moves to the preheating screen frame 13 for preheating.

[0022] Reference Figures 1-6 The outer wall of the workbench 1 is fixed with an air compressor 8 and a vortex tube 7 through a connecting plate. The vortex tube 7 is a device that generates energy separation by compressing gas, separating high-pressure gas into cold and hot air flows. Its core principle is based on the vortex effect and the Joule-Thomson effect, which makes it produce a high temperature of about 130°C at the hot end and a low temperature of -20°C-0°C at the cold end. The air compressor 8 is connected to the vortex tube 7. A cold air pipe 9 is fixed to the cold end of the vortex tube 7. A water bag 21 is provided on the bearing plate. The cold air pipe 9 passes through the water bag 21. A cooling cavity is provided in the cover plate. A water supply pipe is connected between the water bag 21 and the cooling cavity. The water supply pipe is made of The right-angle tube 1 22 and the right-angle tube 2 23 are connected to each other. The hot end of the vortex tube 7 is connected to the hot air pipe 10 arranged toward the flip mechanism. The hot air pipe 10 conducts hot air to contact the circuit board to achieve preheating of the circuit board. The cold air flow generated by the cold end flows through the cold air pipe 9 to cool the water in the water bag 21, so that the water temperature is quickly reduced. Subsequently, the water in the water bag 21 is conducted into the cooling chamber, which can quickly absorb the heat of the cover plate and the drill bit 4, completing the rapid cooling of both. The excess cold air flow is discharged from its end to cool the rotating motor 12, realizing the reuse of excess cold air and ensuring the stable operation of the rotating motor 12. Furthermore, the excess cold air flow can also be directly directed to blow towards the drill needle 4. On the one hand, it can blow out the waste chips generated by the drilling work, and on the other hand, it can directly cool the cover plate and the drill needle 4. On the other hand, the cold air flow itself has a sedimentation effect and can directly contact the cover plate and the drill needle 4 with vertical horizontal flow.

[0023] The preheating screen frame 13 is provided with a clamping mechanism, which includes two right-angle plates 14 symmetrically fixed on the preheating screen frame 13, a moving rod 15 is slidably inserted on the right-angle plate 14, a clamping plate 16 is fixed to the lower end of the moving rod 15, and a telescopic spring 17 is sleeved on the upper end of the moving rod 15, and the two ends of the telescopic spring 17 are respectively fixedly connected to the upper side wall of the right-angle plate 14 and the outer wall of the moving rod 15, a magnet plate is fixedly embedded in the upper side wall of the clamping plate 16, an electromagnet is fixedly installed on the inner top wall of the right-angle plate 14, and a power supply mechanism is also provided on the outer wall of the conveying frame 5, the power supply mechanism includes a circular conductive ring 19 fixed on the outer wall of the conveying frame 5, and the outer wall of the end of the rotating shaft is fixedly connected to a carbon brush 18 in contact with the inner wall of the circular conductive ring 19. It is arranged to coincide with the center of the circular conductive ring 19, and the inner wall of the rotating shaft is distributed with wires connected to the carbon brush 18 and the electromagnet. The circuit board is clamped by a clamping mechanism. After the circuit board is moved onto the preheating screen frame 13, the external power supply is connected to the circular conductive ring 19 to realize power supply to the circular conductive ring 19. The carbon brush 18 contacts the circular conductive ring 19 to transfer the current to the electromagnet through the wire. The magnetic repulsion between the electromagnet and the magnet plate pushes the clamping plate 16 to move down and contact the circuit board tightly, completing the clamping and fixation of the circuit board. The rotating motor 12 drives the preheating screen frame 13 to rotate, and the carbon brush 18 slides in contact with the inner wall of the circular conductive ring 19 to realize continuous power supply to the electromagnet when the preheating screen frame 13 rotates, thereby ensuring the stability of the clamping work.

[0024] The hot air flow generated by the hot end is discharged into the manifold 11 through the hot air pipe 10, flows out evenly through multiple hot air ports and contacts the preheating screen frame 13 and the circuit board. The rotating motor 12 drives the preheating screen frame 13 and the circuit board to rotate, so that the circuit board and the hot air flow are evenly contacted. During the manufacturing process of the PCB board, internal stress will be generated due to processes such as lamination and copper foil shrinkage. Preheating can release this stress through thermal relaxation, reduce hole position offset or board warping after drilling, and remove moisture. When the board absorbs moisture, it will cause the resin to soften during drilling, produce glue residue or rough hole walls. Preheating can evaporate moisture, avoiding delamination or micro cracks in the hole wall caused by moisture expansion. At the same time, after baking, the thermal expansion coefficient of the board tends to be stable, reducing the hole position accuracy deviation caused by temperature and humidity changes. Furthermore, the hot air outlet of the diverter plate 11 adopts a multi-porous grille design, and the hot air outlet is opened in turn or simultaneously through a multi-position multi-way solenoid valve to balance its dynamic load and reduce the power consumption of the air compressor 8. The hot air outlet position is designed as a "V"-shaped design with back pressure balance to reduce airflow interference, reduce noise and balance flow rate.

[0025] The cover plate pressing mechanism includes a flip motor 26 fixed on the outer wall of the workbench 1, and a bent plate 27 is fixedly connected to the outer wall of the driving end of the flip motor 26, and a clamping column 28 is fixedly connected to the end of the bent plate 27. A notch connected to the processing port is provided on the upper side wall of the workbench 1, and an electric push rod 2 33 is provided in the notch. The driving end of the electric push rod 2 33 is fixed with a clamping plate 32. A pushing mechanism is also provided on the workbench 1, and the pushing mechanism includes an electric push rod 1 30. The driving end of the electric push rod 1 30 is fixedly connected to a push plate 31. A chute connected to the processing port is provided on the workbench 1, and the push plate 31 is inserted in the chute. After the circuit board is transported to the processing port, the cover plate is placed, and the flip motor 26 is started. The flip motor 26 drives the bent plate 27 and the clamping column 28 to rotate, and the clamping column 28 is transferred to the processing port. The inner and the upper side wall of the cover plate are pressed tightly to ensure the tight contact between the cover plate and the circuit board. In order to prevent the bent plate 27 and the pressing column 28 from affecting the movement of the drive motor and the drill needle 4, thereby hindering the drilling work, after the cover plate and the circuit board are tightly attached, the driving end of the electric push rod 23 extends from the side to drive the pressing plate 32 to move and contact and press against the cover plate and the circuit board. At this time, the flip motor 26 can drive the pressing column 28 to rotate away from the processing port, so that there is no obstacle above the cover plate. At this time, the movement of the drill needle 4 is no longer affected. When drilling, the lateral and front and rear positions of the drive motor and the drill needle 4 are adjusted by the transverse guide rail 3 and the front and rear guide rails, the drive motor and the telescopic cylinder are started, the telescopic cylinder drives the drive motor to move downward, the drill needle 4 drills into the cover plate and the circuit board, and the circuit board can be drilled.

[0026] Further explanation: in order to facilitate the removal of the cover, a negative pressure suction cup can be provided on the surface of the clamping column 28. After the drilling work is completed, the driving motor and the drill bit 4 are moved to the side of the workbench 1, and the clamping column 28 is rotated to contact the cover, and the cover is adsorbed by the negative pressure suction cup. After the clamping column 28 is rotated out, the negative pressure suction cup can be taken out. After the cover is taken out, the driving end of the electric push rod 30 is extended to drive the push plate 31 to move forward, and the circuit board in the processing port is pushed onto the conveying frame 2 6, and the circuit board can continue to be conveyed forward.

[0027] A carrying port of the same size as the water bag 21 can be provided on the carrying plate to facilitate the placement of the water bag 21. A long arc plate 20 for intermittently squeezing the water bag 21 is fixed on the outer wall of the end of the rotating shaft. The rotating motor 12 drives the preheating screen frame 13 to rotate while the rotating shaft drives the long arc plate 20 to rotate. At the same time, the intermittent contact and squeezing of the long arc plate 20 and the water bag 21 realizes the outflow and retraction of the water body, and continuously squeezes the cold water flow into the cooling chamber to complete the cooling of the cover plate and the drill bit 4. A return water mechanism is provided on the side wall of the cover plate. The return water mechanism includes a piston tube provided on the side wall of the cover plate and connected to the cooling chamber. A piston column 24 is slidably provided in the piston tube, and a reset spring 25 is provided on the outer wall of the piston column 24. The two ends of the reset spring 25 are fixedly connected to the end of the piston tube and the outer wall of the piston column 24 respectively. During the drilling operation, the cover plate absorbs the heat from the drill needle 4. After the long arc plate 20 contacts and squeezes the water bag 21, the water in the water bag 21 cooled by the cold air pipe 9 is squeezed into the cooling chamber and the piston tube, absorbing the heat on the cover plate, so that the temperature of the cover plate drops rapidly, so that the cover plate can continue to absorb the heat from the drill needle 4. At this time, the return spring 25 is in a stretched state. When the long arc plate 20 rotates away from the water bag 21, the piston rod 24 moves back under the reverse elastic force of the return spring 25, pushing the water back into the water bag 21. Through the above work, the water body flows back and forth, absorbing the heat on the cover plate, and the cold air flow flows in the cold air pipe 9, reducing the temperature of the cold air pipe 9, so that the cold air pipe 9 can continuously cool the water in the water bag 21, avoiding the increase of the water temperature, and allowing the water body to continuously cool the cover plate; Furthermore, the surface of the long arc plate 20 is provided with irregular protrusions, which can realize the change of the flow amplitude of the water flow during the extrusion process, so that the water body has a higher turbulence intensity, significantly improves the convection heat transfer coefficient, and thus improves the heat absorption efficiency.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A multi-layer high-density double-sided PCB circuit board preparation device, comprising a workbench (1) with a processing opening, characterized in that: A cover plate is provided in the processing port, a cover plate pressing mechanism is provided on the workbench (1), a drill bit (4) driven by a driving motor is provided on the workbench (1), a conveying frame 1 (5), a conveying frame 2 (6) and a supporting plate are provided on the workbench (1), an air compressor (8) and a vortex tube (7) are fixed to the outer wall of the workbench (1) through a connecting plate, the air compressor (8) is connected to the vortex tube (7), a cold air pipe (9) is fixed to the cold end of the vortex tube (7), a water bag (21) is provided on the supporting plate, the cold air pipe (9) passes through the water bag (21), a cooling cavity is provided in the cover plate, a water supply pipe is connected between the water bag (21) and the cooling cavity, and a water return mechanism is provided on the side wall of the cover plate; The conveying frame (5) is provided with a turning mechanism for driving the circuit board to turn over and squeeze the water bag (21) to deform. The hot end of the vortex tube (7) is connected to a hot air pipe (10) arranged toward the turning mechanism. The hot air pipe (10) conducts hot air to contact the circuit board to achieve preheating of the circuit board. The turning mechanism completes the turning of the circuit board to achieve uniform preheating of the circuit board and squeezes the water bag (21) to deform to achieve water flow to complete cooling of the cover plate. The preheating and cooling work are carried out simultaneously.

2. The device for preparing a multi-layer high-density double-sided PCB circuit board according to claim 1, characterized in that: The flip mechanism includes a rotating motor (12) fixed on the outer wall of the conveying frame (5), the end of the cold air pipe (9) is arranged toward the rotating motor (12), the driving end of the rotating motor (12) is fixedly connected to a rotating shaft, the outer wall of the rotating shaft is fixedly connected to the preheating screen frame (13) located in the conveying frame (5), a plurality of conveying rollers (1) are installed in the conveying frame (5) on both sides of the preheating screen frame (13), a plurality of conveying rollers (2) are installed in the conveying frame (6), a through opening (29) is opened on the lower side wall of the conveying frame (5), a diverter plate (11) located on the lower side of the through opening (29) is fixed on the lower side wall of the preheating screen frame (13), a plurality of hot air ports arranged toward the preheating screen frame (13) are opened on the diverter plate (11), and the end of the hot air pipe (10) is fixed on the lower side wall of the diverter plate (11) and is connected to the hot air port; A long arc plate (20) for intermittently squeezing the water bag (21) is fixed to the outer wall of the end of the rotating shaft.

3. The device for preparing a multi-layer high-density double-sided PCB circuit board according to claim 2, characterized in that: The preheating screen frame (13) is provided with a clamping mechanism, and the clamping mechanism includes two right-angle plates (14) symmetrically fixed on the preheating screen frame (13), a moving rod (15) is slidably inserted on the right-angle plate (14), a clamping plate (16) is fixed to the lower end of the moving rod (15), and a telescopic spring (17) is sleeved on the upper end of the moving rod (15), and the two ends of the telescopic spring (17) are respectively fixedly connected to the upper side wall of the right-angle plate (14) and the outer wall of the moving rod (15), a magnet plate is fixedly embedded in the upper side wall of the clamping plate (16), and an electromagnet is fixedly installed on the inner top wall of the right-angle plate (14).

4. The device for preparing a multi-layer high-density double-sided PCB circuit board according to claim 3, characterized in that: A power supply mechanism is also provided on the outer wall of the conveying frame (5), and the power supply mechanism includes a circular conductive ring (19) fixed on the outer wall of the conveying frame (5). The outer wall of the end of the rotating shaft is fixedly connected to a carbon brush (18) in contact with the inner wall of the circular conductive ring (19). The center of the rotating shaft and the circular conductive ring (19) are arranged to coincide with each other, and the inner wall of the rotating shaft is distributed with a wire connected to the carbon brush (18) and the electromagnet.

5. The device for preparing a multi-layer high-density double-sided PCB circuit board according to claim 1, characterized in that: The upper side wall of the workbench (1) is fixedly connected to a support frame (2), and a transverse guide rail (3) and front and rear guide rails connected to the transverse guide rail (3) are provided on the outer wall of the support frame (2), and a telescopic cylinder is connected to the front and rear guide rails, and the drive motor is fixed to the drive end of the telescopic cylinder.

6. The device for preparing a multi-layer high-density double-sided PCB circuit board according to claim 1, characterized in that: The cover plate clamping mechanism includes a flip motor (26) fixed on the outer wall of the workbench (1), a bent plate (27) is fixedly connected to the outer wall of the driving end of the flip motor (26), and a clamping column (28) is fixedly connected to the end of the bent plate (27). A notch connected to the processing port is opened on the upper side wall of the workbench (1), and an electric push rod (33) is arranged in the notch. The driving end of the electric push rod (33) is fixed to a clamping plate (32).

7. The device for preparing a multi-layer high-density double-sided PCB circuit board according to claim 1, characterized in that: The workbench (1) is also provided with a material pushing mechanism, which includes an electric push rod (30), a driving end of which is fixedly connected to a push plate (31), and a chute connected to the processing port is provided on the workbench (1), and the push plate (31) is inserted into the chute.

8. The device for preparing a multi-layer high-density double-sided PCB circuit board according to claim 1, characterized in that: The water return mechanism comprises a piston tube arranged on the side wall of the cover plate and connected to the cooling chamber, a piston column (24) is slidably arranged in the piston tube, a return spring (25) is sleeved on the outer wall of the piston column (24), and two ends of the return spring (25) are fixedly connected to the end of the piston tube and the outer wall of the piston column (24), respectively.

9. The device for preparing a multi-layer high-density double-sided PCB circuit board according to claim 1, characterized in that: The water supply pipe is composed of a right-angle pipe 1 (22) and a right-angle pipe 2 (23) connected together.

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