Clamping device for processing circuit board bottom shell and control method thereof

Abstract

The invention relates to a clamping device for circuit board bottom shell machining and a control method thereof.The device comprises a vacuum clamp with a vacuum adsorption function and a plurality of clamp mechanisms used for workpiece positioning and fixing, the vacuum clamp is provided with a concave cavity used for containing workpieces, and the side wall of the concave cavity is provided with a plurality of through holes; the clamp mechanism comprises a clamp support, a needle type air cylinder and a clamping block, the clamp support is arranged on the outer side wall of the vacuum clamp and arranged at the penetrating hole, the needle type air cylinder is fixed to the clamp support, the telescopic end of the needle type air cylinder is connected with the clamping block, and the clamping block is movably arranged in the penetrating hole so as to be separated from or abut against the side wall of the workpiece in the concave cavity. The clamping device is high in clamping reliability and wide in application range, one-time machining forming of equipment can be supported, meanwhile, the structural lightweight design is achieved, and the operation convenience and the automation degree can be improved.

Description

Technical Field

[0001] The invention relates to a clamping device for processing a circuit board bottom shell and a control method thereof, belonging to the technical field of circuit board processing. Background Art

[0002] Currently, circuit board chassis are primarily manufactured using injection molding. However, due to the shrinkage of the injection molding material and the large size of the chassis itself, the flatness of the final product is often poor. Therefore, it needs to be fixed during subsequent processing to ensure machining accuracy. There are two main methods for fixing circuit board chassis: one uses clamping to fix the chassis flat on the workbench; the other uses vacuum suction to fix the chassis flat on the workbench.

[0003] However, the above-mentioned existing fixing methods all have certain limitations in practical applications. For example, when using the pressure-holding fixing method, when the bottom shell is large in size and has a complex internal structure and irregular shape, in order to ensure the stability and flatness of the clamping, it is necessary to apply clamping force at multiple positions, which not only increases the difficulty of positioning, but also may affect the processing technology. For example, if the surface of the bottom shell needs further processing, the clamping structure may interfere with the processing area, resulting in the need to design additional avoidance structures or perform secondary processing during the processing, thereby complicating the clamping device, making the processing technology cumbersome, and reducing production efficiency. Although the other vacuum adsorption fixing method can avoid the interference problem caused by mechanical clamping, the adsorption effect is often not ideal for bottom shells with irregular shapes or poor surface flatness. It is easy to cause loose fixation due to poor sealing, affecting the processing accuracy. In addition, the vacuum adsorption method also has certain requirements for the surface material and structure of the bottom shell, and its scope of application is limited.

[0004] Therefore, the existing methods for fixing circuit board bottom shells, especially for fixing large circuit board bottom shells with irregular shapes, still have problems such as complex clamping structure, low processing efficiency, and poor adaptability. Summary of the Invention

[0005] The present invention provides a clamping device and control method for processing circuit board bottom shells, aiming to address at least one of the technical problems existing in the prior art. To this end, the clamping device and control method for processing circuit board bottom shells proposed in the present invention offer high clamping reliability and a wide range of applications, enabling one-time processing and forming of the equipment while achieving a lightweight structure, improving operational convenience, and enhancing automation.

[0006] The technical solution of the present invention relates, on one hand, to a clamping device for processing a circuit board bottom shell, comprising:

[0007] A vacuum clamp with a vacuum adsorption function, wherein the vacuum clamp is provided with a cavity for accommodating a workpiece, and a side wall of the cavity is provided with a plurality of through holes;

[0008] Multiple clamping mechanisms for positioning and fixing workpieces, the clamping mechanisms comprising a clamping bracket, a needle-shaped cylinder, and a clamping block, the clamping bracket being arranged on the outer side wall of the vacuum clamp and at the through-hole; the needle-shaped cylinder being fixed to the clamping bracket, and the telescopic end of the needle-shaped cylinder being connected to the clamping block;

[0009] The clamping block is movably disposed in the through hole to be separated from or abut against the side wall of the workpiece in the cavity.

[0010] Furthermore, the clamp bracket is provided with a mounting channel, an internal nut is provided in the mounting channel, and the needle cylinder is provided with an external thread; the needle cylinder is partially provided in the mounting channel, and the external thread of the needle cylinder is threadedly connected to the internal nut.

[0011] Furthermore, the protruding end of the needle-type cylinder facing away from the telescopic end thereof protrudes from the clamp bracket, and the protruding end is connected to an external nut.

[0012] Furthermore, it also includes a base plate and a plurality of support rods, wherein the lower ends of the support rods are connected to the base plate, and the upper ends of the support rods are connected to the vacuum clamp.

[0013] Furthermore, the vacuum clamp is provided with a groove, in which a sealing ring for abutting against the outer periphery of the workpiece is provided.

[0014] Another aspect of the technical solution of the present invention relates to a control method for a clamping device for processing a circuit board bottom shell, which is applied to the clamping device for processing a circuit board bottom shell of the above embodiment, wherein a plurality of needle-type cylinders (220) are connected to a plurality of cylinder solenoid valves, and the vacuum clamp (100) is connected to a vacuum generator and a vacuum solenoid valve; the method comprises the following steps:

[0015] S100, when it is detected that there is a workpiece (500) on the vacuum clamp (100), the needle cylinder (220) is activated to drive the clamping block (230) to move and press toward the workpiece (500);

[0016] S200, according to the detected position of the workpiece (500), controlling the extension amount of the corresponding clamping block (230) by the needle cylinder (220) to adjust the position of the workpiece (500) in the vacuum clamp (100), until the position of the workpiece (500) meets the set requirements, making the clamp mechanism (200) maintain the state of clamping the workpiece (500), and starting the vacuum clamp (100) to suck the workpiece (500);

[0017] S300, when receiving an instruction for the equipment to process the workpiece (500), the workpiece (500) is processed by the equipment;

[0018] S400: When receiving the equipment completion instruction, wait until all the clamping mechanisms (200) release the workpiece (500) and the vacuum clamp (100) stops adsorbing the workpiece before removing the workpiece (500).

[0019] Furthermore, the cylinder solenoid valves are provided in plurality, the plurality of cylinder solenoid valves include a first battery valve group and a second battery valve group, and the plurality of needle cylinders include a first cylinder group (221) and a second cylinder group (222); the first battery valve group is used to control the first cylinder group (221), and the second battery valve group is used to control the second cylinder group (222);

[0020] The method comprises the following steps:

[0021] B100, when it is detected that there is a workpiece (500) on the vacuum clamp (100), the first cylinder group (221) is activated to drive the clamping block (230) to move and press toward the workpiece (500);

[0022] B200, according to the detected position of the workpiece (500), controlling the extension amount of the corresponding clamping block (230) through the first cylinder group (221) or the second cylinder group (222) to adjust the position of the workpiece (500) in the vacuum clamp (100), until the position of the workpiece (500) meets the set requirements, starting the second cylinder group (222) or the first cylinder group (221) to control the extension amount of the corresponding clamping block (230) to clamp the workpiece (500), and then starting the vacuum clamp (100) to suck the workpiece (500);

[0023] Alternatively, after the first cylinder group (221) or the second cylinder group (222) moves the workpiece (500) to a set position, the vacuum clamp (100) is first started to suck the workpiece (500), and then the second cylinder group (222) or the first cylinder group (221) is started to control the corresponding clamping block (230) to extend to clamp the workpiece (500);

[0024] B300, upon receiving an instruction from the equipment to process the workpiece (500), processes the workpiece (500) through the equipment.

[0025] Furthermore, in step S200, after the position of the workpiece (500) meets the set requirements, the clamping mechanism (200) is first kept in a state of clamping the workpiece (500), and then the vacuum clamp (100) is started to suck the workpiece (500).

[0026] Furthermore, in step S400, when the equipment completion instruction is received, all the clamping mechanisms (200) release the workpiece (500) first, and then the vacuum clamp (100) stops adsorbing the workpiece, and then the workpiece (500) is taken out.

[0027] Furthermore, the vacuum fixture is provided with a vacuum detector; the step S300 further includes: when it is detected that the vacuum degree of the vacuum fixture is not satisfied, stopping the equipment from processing the workpiece.

[0028] The beneficial effects of the present invention are as follows.

[0029] The clamping device and control method for processing circuit board bottom shells according to embodiments of the present invention offer high clamping reliability and a wide range of applications, enabling one-time processing and forming of equipment while achieving a lightweight structural design, improving operational convenience and automation. Unlike conventional methods of applying downward pressure on the upper surface of a workpiece, the clamping device of the present invention incorporates multiple clamping mechanisms on the side walls of a vacuum clamp, applying pressure from the side of the workpiece while simultaneously cooperating with the suction effect of the vacuum clamp. This lightweight structural design improves positioning accuracy and clamping reliability while also reducing production costs.

[0030] The structural design of the vacuum clamp and multiple clamping mechanisms of the present invention utilizes the respective advantages of the vacuum clamp and clamping mechanisms in a simple and easy-to-operate manner, and flexibly adjusts the clamping sequence, so that the clamping accuracy can meet the processing accuracy requirements of circuit board bottom shells with different shapes and characteristics. For example, pressure is first applied to the side walls of the circuit board bottom shell by the clamping mechanism, while the vacuum clamp is inactive. By adjusting the pressure on the opposite sides of the workpiece, the workpiece is pushed and moved within the vacuum clamp to position the workpiece within the vacuum clamp. After the workpiece is positioned, the vacuum clamp is activated to vacuum the workpiece, and the lateral pressure of the clamping mechanism is combined with the clamping device to achieve higher clamping reliability and higher workpiece clamping and positioning accuracy. For example, multiple needle-type cylinders 220 are divided into two groups. First, one group of needle-type cylinders 220 pushes the workpiece 500 to reach the set position, and then another group of needle-type cylinders 220 and the vacuum clamp 100 cooperate to achieve clamping and positioning. According to the actual flatness of the side walls and bottom surfaces of the workpiece 500, the clamping order of the vacuum clamp 100 and the other group of needle-type cylinders 200 is flexibly adjusted, effectively avoiding the problem of displacement of the workpiece 500 caused by uneven force. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0032] Figure 1 2 is a schematic structural diagram of a clamping device for processing a circuit board bottom shell according to an embodiment of the present invention.

[0033] Figure 2 2 is a schematic structural diagram of a clamping device with a workpiece according to an embodiment of the present invention.

[0034] Figure 3 2 is a front view of the structure of a clamping device for processing a bottom shell of a circuit board according to an embodiment of the present invention.

[0035] Figure 4 2 is a structural exploded view of a clamping mechanism according to an embodiment of the present invention.

[0036] Figure 5 4 is a schematic diagram of a first control circuit of a clamping device according to an embodiment of the present invention.

[0037] Figure 6 4 is a schematic diagram of a second control circuit of a clamping device according to an embodiment of the present invention.

[0038] Figure 7 This is a basic flow chart of a clamping device for processing a circuit board bottom shell according to an embodiment of the present invention.

[0039] Figure 8 The figure is a control flow chart of a clamping device for processing a bottom shell of a circuit board according to an embodiment of the present invention.

[0040] Figure 9 1 is a control principle diagram of a clamping device for processing a circuit board bottom shell according to an embodiment of the present invention.

[0041] Description of reference numerals:

[0042] 100, vacuum fixture; 110, cavity; 120, perforation; 130, sidewall; 140, fixture plate; 150, groove; 160, air groove; 170, interface;

[0043] 200, clamp mechanism; 210, clamp bracket; 211, mounting channel; 220, needle cylinder; 221, first cylinder group; 222, second cylinder group; 230, clamp block; 231, main part; 232, protrusion; 240, connecting screw; 250, inner nut; 260, outer nut;

[0044] 300, base plate; 400, support rod; 500, workpiece. DETAILED DESCRIPTION

[0045] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other unless there is a conflict.

[0046] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, terms such as "upper," "lower," "left," "right," "top," and "bottom" used in this disclosure are intended solely to describe the relative positions of the components of the disclosure as shown in the accompanying drawings.

[0047] In addition, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art. The terms used in this specification are only for describing specific embodiments and are not intended to limit the present invention. The term "and / or" as used herein includes any combination of one or more of the related listed items.

[0048] It should be understood that although the terms first, second, third, etc. may be used to describe various elements in the present disclosure, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from each other. For example, a first element may also be referred to as a second element, and similarly, a second element may also be referred to as a first element without departing from the scope of the present disclosure.

[0049] See also Figures 1 to 6 The clamping device for processing the bottom shell of a circuit board according to the technical solution of the present invention includes a vacuum clamp 100 with a vacuum adsorption function and a plurality of clamping mechanisms 200 for positioning and fixing a workpiece 500. The vacuum clamp 100 is provided with a cavity 110 for accommodating the workpiece 500, and the side wall 130 of the cavity 110 is provided with a plurality of through-holes 120; the clamping mechanism 200 includes a clamp bracket 210, a needle-type cylinder 220 and a clamping block 230. The clamp bracket 210 is arranged on the outer wall 130 of the vacuum clamp 100 and is arranged at the through-hole 120; the needle-type cylinder 220 is fixed on the clamp bracket 210, and the telescopic end of the needle-type cylinder 220 is connected to the clamping block 230; wherein the clamping block 230 can be movably arranged in the through-hole 120 to detach from or abut against the side wall 130 of the workpiece 500 in the cavity 110.

[0050] See also Figure 1 and Figure 2A plurality of through-holes 120 are provided on the side wall 130 of the vacuum clamp 100, and a plurality of clamping mechanisms 200 are connected to the outside of the side wall 130 of the vacuum clamp 100. The clamping block 230 of each clamping mechanism 200 can enter the concave cavity 110 of the vacuum clamp 100 through a through-hole 120 and abut against the side wall 130 of the workpiece 500 in the concave cavity 110. It can be understood that multiple clamping mechanisms 200 are symmetrically arranged on opposite sides of the workpiece 500, and pressure is applied to the inner side of the workpiece 500 by the clamping mechanisms 200 on the symmetrical sides, so that the workpiece 500 is fixed in the vacuum clamp 100. For example, there are eight clamping mechanisms 200, and the circuit board bottom shell of the workpiece 500 is a square plate. Two clamping mechanisms 200 are arranged on each side of the circuit board bottom shell, and the clamping mechanisms 200 on the two sides of the workpiece 500 are symmetrically arranged, so that the workpiece 500 is evenly stressed and it is easy to adjust the position of the workpiece 500 by pushing and cooperating with the side pressure.

[0051] The clamping device for processing the bottom shell of a circuit board according to an embodiment of the present invention has high clamping reliability and a wide range of applications. It can support one-time processing and molding of the equipment, while realizing a lightweight structural design, which can improve operational convenience and the degree of automation. Unlike the traditional method of applying pressure from the top to the top surface of the workpiece, the clamping device of the present invention is provided with multiple clamping mechanisms 200 on the side wall of the vacuum clamp, which applies pressure to the side wall of the workpiece 500 from the side, and cooperates with the adsorption effect of the vacuum clamp 100 at the same time. Through the lightweight structural design, the positioning accuracy and clamping reliability are improved, while the production cost is reduced. The structural design and control method of the present invention can utilize the respective advantages of the vacuum clamp 100 and the clamping mechanism 200, and by flexibly adjusting the clamping sequence, the clamping accuracy can meet the processing accuracy requirements of the bottom shell of the circuit board. In some embodiments, in the clamping device for processing the bottom shell of the circuit board of the present invention, pressure is first applied to the side wall 130 of the bottom shell of the circuit board by the clamping mechanism 200. At this time, the vacuum clamp 100 is not working. The pressure on the two sides of the workpiece 500 is adjusted to push the workpiece 500 to move in the vacuum clamp 100 to position the workpiece 500 in the vacuum clamp 100. After the workpiece 500 is positioned, the vacuum clamp 100 is started to vacuum adsorb the workpiece 500. In combination with the side pressure of the clamping mechanism 200, the clamping reliability of the clamping device is higher and the clamping positioning accuracy of the workpiece 500 is also higher.

[0052] In some embodiments, see Figure 2 and Figure 3The vacuum fixture 100 of the clamping device of the present invention includes a fixture plate 140 and a side wall 130. The side wall 130 protrudes from the upper plane of the fixture plate 140 to form a concave cavity 110. The fixture plate 140 is provided with an air groove 160 and an interface 170 for connecting to a vacuum air source, so that the concave cavity 110 on the fixture plate 140 can be a vacuum cavity. When the workpiece 500 is placed in the concave cavity 110 and covers the air groove 160 and the interface 170, the vacuum air source causes the workpiece 500 to be vacuum-adsorbed on the fixture plate 140. Furthermore, the vacuum air source connected to the vacuum fixture 100 of the present invention is controlled by a vacuum solenoid valve. At the same time, a vacuum detector is provided on the fixture plate 140. The vacuum solenoid valve controls the on-off of the vacuum air source. At the same time, the vacuum detector detects the vacuum degree of the concave cavity 110 of the vacuum fixture 100. When the vacuum degree does not meet the requirements, timely feedback can be given to the equipment system, achieving effective prompts and warnings, which is conducive to improving processing effects and product qualification rates.

[0053] In some application embodiments, the vacuum clamp 100 of the present invention includes a clamping plate 140, and a side wall 130 is provided around the clamping plate 140. A cavity 110 for accommodating the workpiece 500 is formed inside the clamping plate 140. Furthermore, the shape of the cavity 110 of the vacuum clamp 100 can match the shape of the workpiece 500. The outer periphery of the concave cavity 110 of the vacuum clamp 100 is provided with a sealing groove according to the shape of the workpiece 500, and the sealing ring is arranged in the sealing groove. The middle part of the concave cavity 110 of the vacuum clamp 100 is provided with multiple air grooves 160 and multiple interfaces 170 for connecting the air source. The air grooves 160 and the interfaces 170 are arranged in the sealing ring. When the workpiece 500 is placed in the concave cavity 110, the outer periphery of the workpiece 500 contacts or abuts the sealing ring, and the bottom surface of the workpiece 500 covers the air grooves 160 and the interfaces 170, thereby forming a sealed space between the clamp plate 140 and the workpiece 500. The vacuum air source connected by the interface 170 forms a vacuum cavity in the sealed space, and the workpiece 500 is adsorbed on the vacuum clamp 100. Furthermore, the multiple air grooves 160 and the multiple interfaces 170 are evenly distributed in the sealing ring or symmetrically arranged, which can make the vacuum adsorption effect of the vacuum clamp 100 more reliable.

[0054] In some embodiments, the clamping mechanism 200 of the present invention includes a clamping bracket 210, a telescopic actuator, and a clamping block 230. The clamping bracket 210 is fixed to the outside of the vacuum clamp 100, and the telescopic actuator is fixed to the clamping bracket 210. The telescopic end of the telescopic actuator is connected to the clamping block 230 so as to drive the clamping block 230 to perform telescopic movement through the telescopic actuator. It is understood that the telescopic actuator of the embodiment of the present invention can be a telescopic cylinder, a telescopic motor, a telescopic servo motor, or a telescopic stepping motor. Furthermore, the clamping mechanism 200 of the embodiment of the present invention uses a needle-type cylinder 220 as the telescopic actuator, which makes the clamping device small in size and compact in structure, realizes a lightweight design, and improves the response speed and control accuracy.

[0055] In some application embodiments, the telescopic actuator is a needle-type cylinder 220, and the clamp bracket 210 is a square block. The clamp bracket 210 is fixed to the side wall 130 of the vacuum clamp 100 by connecting screws 240 and covers the through hole 120 of the vacuum clamp 100. Figure 1 and Figure 4 , a mounting channel 211 is provided in the clamp bracket 210, and an internal nut 250 is provided in the mounting channel 211. A side portion of the needle cylinder 220 close to the telescopic end is provided in the mounting channel 211 of the clamp bracket 210, and the external thread of the needle cylinder 220 is threadedly connected with the internal nut 250 of the mounting channel 211 of the clamp bracket 210, so that the needle cylinder 220 is fixed on the clamp bracket 210, and the protruding end portion of the needle cylinder 220 facing away from its telescopic end protrudes from the clamp bracket 210 to connect the signal line. Furthermore, an external nut 260 is provided on the protruding end of the needle cylinder 220, and the external thread of the needle cylinder 220 is threadedly connected with the external nut 260, and the needle cylinder 220 is doubly locked and fixed, which can make the needle cylinder 220 more firmly installed. Furthermore, the side of the mounting channel 211 facing the vacuum clamp 100 is smaller in width. When the inner nut 250 is in the mounting channel 211 , the side of the inner nut 250 facing the vacuum clamp 100 contacts the mounting channel 211 , thereby positioning the inner nut 250 .

[0056] In some embodiments, multiple needle cylinders 220 can share a single cylinder solenoid valve for control, which helps ensure synchronized movement of the needle cylinders 220 and simplifies system control. Furthermore, multiple cylinder solenoid valves can be provided, and each needle cylinder 220 can be individually controlled by a cylinder solenoid valve, providing more flexible control. Furthermore, multiple needle cylinders 220 on the same side can share a cylinder solenoid valve for control, or multiple needle cylinders 220 on opposite sides can share a cylinder solenoid valve for control. Furthermore, the vacuum clamp 100 has a square-like structure, and multiple cylinder solenoid valves are divided into two groups, namely the first battery valve group and the second battery valve group. Correspondingly, multiple needle-type cylinders 220 are also divided into two groups, one group of needle-type cylinders 220 is located on the two sides of one of the right angles of the vacuum clamp 100, and the other group of needle-type cylinders 220 is located on the remaining two sides of the vacuum clamp 100, that is, the other needle-type cylinder 220 is located on the two diagonal sides of the above-mentioned right angle. The first battery valve group and the second battery valve group control the above-mentioned two groups of needle-type cylinders 220 respectively.

[0057] In some application embodiments, the clamping block 230 is movably disposed in the through-hole 120. It can be understood that there is a clearance fit between the clamping block 230 and the through-hole 120, and the through-hole 120 guides the telescopic movement of the clamping block 230. When the workpiece 500 is placed in the concave cavity 110 of the vacuum clamp 100, the needle cylinder 220 pushes the clamping block 230 to move inward, so that the end of the clamping block 230 leaves the through-hole 120 and contacts the side wall 130 of the workpiece 500. The clamping block 230 presses the side wall 130 of the workpiece 500 and clamps the workpiece 500 at the same time under the joint action of the clamping mechanisms 200 on both sides.

[0058] Further, see Figure 4 The clamping block 230 includes a main part 231 and a convex part 232. The convex part 232 is arranged on the upper side of the end of the main part 231 that contacts the workpiece 500. When the clamping block 230 contacts the workpiece 500, the end face of the main part 231 contacts the side wall 130 of the workpiece 500, and the lower plane of the convex part 232 contacts the upper plane of the workpiece 500, which cooperates with the bottom surface of the workpiece 500 to be sucked in by the vacuum clamp 100, which is conducive to fastening the workpiece 500 on the clamping device.

[0059] In some embodiments, the clamp bracket 210 and the needle cylinder 220 are threadedly connected. The distance between the needle cylinder 220 and the circuit board bottom shell can be adjusted based on the actual shape and size of the circuit board bottom shell, thereby flexibly adjusting the clamping distance of the clamping block 230. Furthermore, the number and position of the perforations 120 and the clamping mechanism 200 can be adjusted based on the actual shape and size of the workpiece 500, resulting in a more rational layout and higher clamping accuracy and reliability for the workpiece 500.

[0060] In some embodiments, the clamping device of the present invention further includes a base plate 300 and a plurality of support rods 400. The lower ends of the support rods 400 are connected to the base plate 300, and the upper ends of the support rods 400 are connected to the vacuum clamp 100. The base plate 300 is fixed to the processing equipment, and the height of the support rods 400 can be adjusted according to the actual processing. It is understood that the plurality of support rods 400 are evenly distributed on the base plate 300. For example, there are four support rods 400, and the base plate 300 has a quasi-square structure, and the four support rods 400 are distributed at the four corners of the base plate 300. Furthermore, the four support rods 400 are arranged at the same height, which makes installation convenient and adjustment efficient.

[0061] It should be noted that when using a conventional clamping device to clamp a circuit board bottom case, the circuit board bottom case is first placed flat on a workbench. The clamping device then applies downward pressure to the circuit board bottom case from above, forcing the bottom surface of the circuit board bottom case into contact with the workbench and securing it. At this point, the circuit board bottom case must be parallel to the workbench. To ensure optimal clamping flatness, particularly for irregularly shaped panels, such as those with uneven bottom surfaces, the circuit board bottom case generally needs to be clamped at multiple locations. This operation is cumbersome and positioning accuracy is difficult to control. Furthermore, when the surface of the circuit board bottom case requires machining, the clamping locations often overlap the surface of the panel to be machined, requiring secondary clamping and positioning, or the use of a custom-designed clamping device with an avoidance design. This complicates the machining process and increases production costs. Furthermore, the conventional method of solely relying on vacuum adsorption to secure the workpiece 500 is highly susceptible to workpiece 500 displacement during machining for circuit board bottom cases with non-standard shapes, particularly for irregularly shaped panels, such as those with uneven bottom surfaces. The clamping device of the present invention clamps the side wall 130 of the circuit board bottom shell, which can effectively avoid the secondary clamping phenomenon caused by obstruction, and adopts the vacuum adsorption and clamping method of the clamping mechanism 200 to effectively solve the problems of low clamping stability and low positioning accuracy reliability in the existing clamping method, as well as the small scope of application, complex structure, and cumbersome operation. The clamping device for circuit board bottom shell processing of the present invention has a simple structure, simple operation and low manufacturing cost.

[0062] See also Figures 1 to 9 The control method of the clamping device for processing the bottom shell of the circuit board according to the technical solution of the present invention is applied to the clamping device for processing the bottom shell of the circuit board according to the embodiment of the present invention, and the method comprises at least the following steps:

[0063] S100, when it is detected that there is a workpiece 500 on the vacuum clamp 100, the needle cylinder 220 is activated to drive the clamping block 230 to move and press toward the workpiece 500;

[0064] S200, based on the detected position of the workpiece 500, the needle cylinder 220 controls the extension of the corresponding clamping block 230 to adjust the position of the workpiece 500 in the vacuum clamp 100 until the position of the workpiece 500 meets the set requirements, the clamping mechanism 200 maintains the state of clamping the workpiece 500, and the vacuum clamp 100 is started to suck the workpiece 500;

[0065] S300, when receiving an instruction for the equipment to process the workpiece 500, the workpiece 500 is processed by the equipment;

[0066] S400 , when receiving the equipment completion instruction, wait until all the clamping mechanisms 200 release the workpiece 500 and the vacuum clamp 100 stops adsorbing the workpiece before taking out the workpiece 500 .

[0067] See also Figures 1 to 9 The control method of the clamping device for processing the bottom shell of the circuit board according to the technical solution of the present invention is applied to the clamping device for processing the bottom shell of the circuit board according to the embodiment of the present invention, and the method comprises at least the following steps:

[0068] A100, when it is detected that there is a workpiece 500 on the vacuum clamp 100, the needle cylinder 220 is started to drive the clamping block 230 to move and press toward the workpiece 500;

[0069] A200, based on the detected position of the workpiece 500, controls the extension of the corresponding clamping block 230 via the needle cylinder 220 to adjust the position of the workpiece 500 in the vacuum clamp 100 until the position of the workpiece 500 meets the set requirements, and then keeps the clamping mechanism 200 clamping the workpiece 500; then the vacuum clamp 100 is activated to firmly hold the workpiece 500;

[0070] A300, upon receiving an instruction from the device to process the workpiece 500, processes the workpiece 500 through the device;

[0071] A400. When receiving the equipment completion instruction, first all the clamping mechanisms 200 release the workpiece 500, then the vacuum clamp 100 stops adsorbing the workpiece and takes out the workpiece 500.

[0072] In the control method of the clamping device for processing the bottom shell of the circuit board of the present invention, the workpiece 500 is first positioned and fixed by the side pressure action of the clamping mechanism 200, so that the bottom shell of the circuit board is in the set position and tightly attached to the vacuum clamp 100, and then the vacuum clamp 100 is started to adsorb the bottom shell of the circuit board, thereby making the clamping more stable and firm through the dual action of side pressure and vacuum adsorption. The present invention fixes the bottom shell of the circuit board in the clamping device by vacuum adsorption of the workpiece 500, in conjunction with the side pressure structure that applies pressure to the side wall 130 of the workpiece 500, thereby improving the clamping reliability. In addition, the clamping distance of the clamping mechanism 200 is adjustable, and the clamping position and number can be adjusted, which plays a role in guiding and fixing the workpiece 500, replacing the traditional method of pressing the workpiece 500 from top to bottom, and multiple clamping mechanisms 200 can be controlled synchronously, which makes the operation simple and helps to reduce the need for secondary clamping.

[0073] Specifically, the clamping device first controls the needle cylinder 220 to work, so that the needle cylinder 220 drives the clamping block 230 to press the side wall 130 of the bottom shell of the circuit board from the side. It can be understood that the position of the perforation 120 and the clamping mechanism 200 can be set according to the concave and convex shapes of the side wall 130 of the bottom shell of the circuit board, so as to guide the pressing and fixing. Then, the vacuum solenoid valve is started to control the on-off of the air source of the vacuum generator, wherein, when the equipment needs to be processed, the vacuum solenoid valve is opened to make the vacuum generator work, and under the joint action of the vacuum air source and the sealing ring of the vacuum clamp 100, the bottom shell of the circuit board is sucked in by vacuum, so that after the workpiece 500 is clamped, the equipment processes the workpiece 500. In some embodiments, see Figure 5 and Figure 6 A vacuum generator is provided between the vacuum fixture 100 and the gas source, and a vacuum gauge or vacuum detector is provided on the vacuum fixture 100. During the processing of the workpiece 500 and during the processing of the workpiece 500, the vacuum gauge is used to detect the vacuum degree of the vacuum fixture 100. When it is detected that the vacuum degree of the cavity 110 of the vacuum fixture 100 is not satisfied, a signal is fed back to the control system, and the control system controls the equipment to stop processing, thereby realizing vacuum degree detection throughout the entire processing process, thereby playing a good early warning role and facilitating improving the product processing yield. Furthermore, a pressure switch is provided between the vacuum fixture 100 and the vacuum generator. When the pressure in the cavity 110 of the vacuum fixture 100 exceeds the set range, such as when the pressure of the cavity 110 is too high or too low, timely feedback is given to the control system to stop the equipment processing.

[0074] Specifically, after the clamping mechanism 200 positions and clamps the workpiece 500, the control system receives the processing instruction of the workpiece 500, and turns on the vacuum solenoid valve through the output of the control relay, so that the vacuum generator works, and cooperates with the clamping mechanism 200 to press the workpiece 500, so that the workpiece 500 is fixed on the clamping device. At the same time, during the processing of the workpiece 500, the vacuum gauge continuously monitors the vacuum degree of the vacuum clamp 100 and feeds back to the control system to ensure the clamping reliability, which is beneficial to ensure the processing quality of the workpiece 500.

[0075] In some embodiments, see Figure 3 and Figure 6The vacuum clamp 100 of the embodiment of the present invention has a square-like structure, and the multiple cylinder solenoid valves are divided into two groups, namely the first battery valve group and the second battery valve group. Correspondingly, the multiple needle cylinders 220 are also divided into two groups, namely the first cylinder group 221 and the second cylinder group 222, wherein the first cylinder group 221 is located on the two sides of one of the right angles of the vacuum clamp 100, and the second cylinder group 222 is located on the remaining two sides of the vacuum clamp 100, that is, the second cylinder group 222 is located on the two diagonal sides of the above-mentioned right angle. The first battery valve group is used to control the first cylinder group 221, and the second battery valve group is used to control the second cylinder group 222.

[0076] Further, see Figure 8 and Figure 9 The control method of the clamping device for processing the bottom shell of the circuit board according to the embodiment of the present invention comprises at least the following steps:

[0077] B100 , when it is detected that there is a workpiece 500 on the vacuum clamp 100 , the first cylinder group 221 is started to drive the clamping block 230 to move and press toward the workpiece 500 .

[0078] B200. Based on the detected position of the workpiece 500, the first cylinder group 221 or the second cylinder group 222 controls the extension of the corresponding clamp 230 to adjust the position of the workpiece 500 within the vacuum clamp 100. After the position of the workpiece 500 meets the set requirements, the second cylinder group 222 or the first cylinder group 221 is activated to control the extension of the corresponding clamp 230 to clamp the workpiece 500; and the vacuum clamp 100 is then activated to firmly hold the workpiece 500. It should be noted that in other embodiments of the present invention, after the first cylinder group 221 or the second cylinder group 222 moves the workpiece 500 to the set position, the vacuum clamp 100 is first activated to firmly hold the workpiece 500, and then the second cylinder group 222 or the first cylinder group 221 is activated to control the extension of the corresponding clamp 230 to clamp the workpiece 500.

[0079] B300, when receiving the instruction of the equipment to process the workpiece 500, the workpiece 500 is processed by the equipment.

[0080] The method of the present invention is based on the characteristic that the positioning accuracy of the bottom shell of the circuit board is much higher than that of general workpieces. The method adopts the method of mutual cooperation between the vacuum clamp 100 and the clamping mechanism 200, so that the clamping device of the present invention has a simple structure and is easy to operate, and can achieve high-precision positioning and clamping of the bottom shell of the circuit board. It first pushes the workpiece 500 to reach the set position through a group of needle-type cylinders 220, and then realizes clamping and positioning through the cooperation of another group of needle-type cylinders 220 and the vacuum clamp 100. The structural design feature of the needle-type cylinder 220 acting from the side and the vacuum clamp 100 acting from the bottom allows the clamping method to effectively utilize the respective advantages of the clamping mechanism 200 and the vacuum clamp 100.

[0081] It is understood that for workpieces 500 with uneven bottom surfaces but smooth sidewalls, after positioning the workpiece 500, the two sets of needle-type air cylinders 220 can be used to clamp the workpiece 500, and then the vacuum clamp 100 can be activated to secure the workpiece. Furthermore, for workpieces 500 with uneven sidewalls but smooth bottom surfaces, after positioning the workpiece 500, the vacuum clamp 100 can be used to secure the workpiece, and then the two sets of needle-type air cylinders 220 can be used to secure the workpiece. For workpieces 500 whose sidewalls and bottom surfaces of the circuit board bottom shell are uneven, the two clamping methods can be flexibly set according to their actual accuracy. Furthermore, for workpieces 500 whose sidewalls and bottom surfaces of the circuit board bottom shell are uneven, the positions of multiple needle cylinders 220 can be adjusted according to the actual shape of the workpiece 500 so that each needle cylinder 200 can contact a relatively flat portion of the sidewall of the circuit board bottom shell, thereby facilitating the clamping reliability of the clamping mechanism 200. After all needle cylinders 220 clamp the workpiece so that the bottom surface of the workpiece 500 is in close contact with the vacuum clamp 100, the vacuum clamp 100 is activated to suck the workpiece. The method of the present invention utilizes the respective advantages of the vacuum clamp 100 and the clamping mechanism 200, and can flexibly adopt different clamping methods according to the actual shape characteristics of the workpiece 500, thereby ensuring that the clamping device of the present invention has a wider range of applicability while ensuring positioning accuracy.

[0082] It should be noted that the multiple needle-type cylinders 220 of the present invention are divided into two groups, which act on the two diagonal right-angled sides of the vacuum clamp 100 respectively. During the clamping process, according to the position of the workpiece 500 in the vacuum clamp 100, one group of needle-type cylinders 220 is used to push the workpiece 500 so that the workpiece 500 reaches the set position. Then, according to the actual flatness of the side walls and bottom surfaces of the workpiece 500, the clamping order of the vacuum clamp 100 and the other group of needle-type cylinders 200 is flexibly adjusted, effectively avoiding the problem of displacement of the workpiece 500 due to uneven force. Specifically, see Figure 1 The first cylinder group 221 acts on the two sides of the upper left corner of the vacuum clamp 100, and the second cylinder group 222 acts on the two sides of the lower right corner of the vacuum clamp 100. When the workpiece 500 deviates toward the upper left corner, the workpiece 500 can be pushed toward the lower right corner by the first cylinder group 221. Correspondingly, when the workpiece 500 deviates toward the lower right corner, the workpiece 500 can be pushed toward the upper left corner by the second cylinder group 222.

[0083] In some application embodiments of the present invention, the first battery valve group for controlling the first cylinder group 221 includes two cylinder battery valves, and the second battery valve group for controlling the second cylinder group 222 includes two cylinder battery valves. Figure 3One of the cylinder battery valves in the first battery valve group is divided into two groups for controlling the needle cylinder 220 on the right-angled side of the horizontal line, and the other one in the first battery valve group is used to control the needle cylinder 200 on the right-angled side of the vertical line. Correspondingly, one of the cylinder battery valves in the second battery valve group is divided into two groups for controlling the needle cylinder 200 on the right-angled side of the horizontal line, and the other one in the second battery valve group is used to control the needle cylinder 200 on the right-angled side of the vertical line, thereby achieving positioning control of the workpiece 500 and making the control process simpler. It is understandable that the first battery valve group can also include multiple cylinder battery valves, and the second battery valve group can also include multiple cylinder battery valves, so that control can be performed according to any actual combination of needle cylinders 200, making the control more flexible and applicable to a wider range.

[0084] The above description is merely a preferred embodiment of the present invention. The present invention is not limited to the aforementioned embodiments. As long as the technical effects of the present invention are achieved by the same means, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included within the scope of protection of the present disclosure. Within the scope of protection of the present invention, its technical solutions and / or implementation methods may be modified and varied in various ways.

Claims

1. A clamping device for processing a circuit board bottom shell, characterized in that: include: A vacuum clamp (100) with a vacuum adsorption function, wherein the vacuum clamp (100) is provided with a cavity (110) for accommodating a workpiece (500), and a side wall (130) of the cavity (110) is provided with a plurality of through holes (120); A plurality of clamping mechanisms (200) for positioning and fixing a workpiece (500), the clamping mechanisms (200) comprising a clamping bracket (210), a needle-type cylinder (220) and a clamping block (230), the clamping bracket (210) being arranged on the outer side wall (130) of the vacuum clamp (100) and at the through hole (120); the needle-type cylinder (220) being fixed on the clamping bracket (210), and the telescopic end of the needle-type cylinder (220) being connected to the clamping block (230); The clamping block (230) is movably disposed in the through hole (120) to be separated from or abut against the side wall (130) of the workpiece (500) in the cavity (110).

2. The clamping device for processing a circuit board bottom shell according to claim 1, characterized in that: The clamp bracket (210) is provided with a mounting channel (211), an internal nut (250) is provided in the mounting channel (211), and the needle cylinder (220) is provided with an external thread; the needle cylinder (220) is partially provided in the mounting channel (211), and the external thread of the needle cylinder (220) and the internal nut (250) are threadedly connected.

3. The clamping device for processing a circuit board bottom shell according to claim 2, characterized in that: The protruding end of the needle-type cylinder (220) facing away from the telescopic end thereof protrudes from the clamp bracket (210), and the protruding end is connected to an external nut (260).

4. The clamping device for processing a circuit board bottom shell according to claim 1, characterized in that: It also includes a base plate (300) and a plurality of support rods (400), wherein the lower ends of the support rods (400) are connected to the base plate (300), and the upper ends of the support rods (400) are connected to the vacuum clamp (100).

5. The clamping device for processing a circuit board bottom shell according to claim 1, characterized in that: The vacuum clamp (100) is provided with a groove (150), and a sealing ring for abutting against the outer periphery of the workpiece (500) is provided in the groove (150).

6. A control method for a clamping device for processing a circuit board bottom shell, characterized in that: The clamping device for processing a circuit board bottom shell according to any one of claims 1 to 5, wherein the plurality of needle cylinders (220) are connected to a plurality of cylinder solenoid valves, and the vacuum clamp (100) is connected to a vacuum generator and a vacuum solenoid valve; The method comprises the following steps: S100, when it is detected that there is a workpiece (500) on the vacuum clamp (100), the needle cylinder (220) is activated to drive the clamping block (230) to move and press toward the workpiece (500); S200, according to the detected position of the workpiece (500), controlling the extension amount of the corresponding clamping block (230) by the needle cylinder (220) to adjust the position of the workpiece (500) in the vacuum clamp (100), until the position of the workpiece (500) meets the set requirements, making the clamp mechanism (200) maintain the state of clamping the workpiece (500), and starting the vacuum clamp (100) to suck the workpiece (500); S300, when receiving an instruction for the equipment to process the workpiece (500), the workpiece (500) is processed by the equipment; S400: When receiving the equipment completion instruction, wait until all the clamping mechanisms (200) release the workpiece (500) and the vacuum clamp (100) stops adsorbing the workpiece before removing the workpiece (500).

7. The method according to claim 6, characterized in that in, The cylinder solenoid valves are provided in plurality, the plurality of cylinder solenoid valves comprising a first battery valve group and a second battery valve group, and the plurality of needle cylinders comprising a first cylinder group (221) and a second cylinder group (222); the first battery valve group is used to control the first cylinder group (221), and the second battery valve group is used to control the second cylinder group (222); The method comprises the following steps: B100, when it is detected that there is a workpiece (500) on the vacuum clamp (100), the first cylinder group (221) is activated to drive the clamping block (230) to move and press toward the workpiece (500); B200, according to the detected position of the workpiece (500), controlling the extension amount of the corresponding clamping block (230) through the first cylinder group (221) or the second cylinder group (222) to adjust the position of the workpiece (500) in the vacuum clamp (100), until the position of the workpiece (500) meets the set requirements, starting the second cylinder group (222) or the first cylinder group (221) to control the extension amount of the corresponding clamping block (230) to clamp the workpiece (500), and then starting the vacuum clamp (100) to suck the workpiece (500); Alternatively, after the first cylinder group (221) or the second cylinder group (222) moves the workpiece (500) to a set position, the vacuum clamp (100) is first started to suck the workpiece (500), and then the second cylinder group (222) or the first cylinder group (221) is started to control the corresponding clamping block (230) to extend to clamp the workpiece (500); B300, upon receiving an instruction from the equipment to process the workpiece (500), processes the workpiece (500) through the equipment.

8. The method according to claim 6, characterized in that In step S200, after the position of the workpiece (500) meets the set requirements, the clamping mechanism (200) is first kept in a state of clamping the workpiece (500), and then the vacuum clamp (100) is started to suck the workpiece (500).

9. The method according to claim 6, characterized in that In the step S400, when the equipment completion instruction is received, all the clamping mechanisms (200) release the workpiece (500) first, and then the vacuum clamp (100) stops adsorbing the workpiece, and then the workpiece (500) is taken out.

10. The method according to claim 6, characterized in that in, The vacuum clamp (100) is provided with a vacuum detector; the step S300 further comprises: when it is detected that the vacuum degree of the vacuum clamp (100) is not satisfied, stopping the equipment from processing the workpiece (500).

Images