Heat dissipation assembly and electronic equipment

Abstract

The invention discloses a heat dissipation assembly and electronic equipment, and relates to the technical field of electronic equipment heat dissipation, the heat dissipation assembly comprises a uniform temperature plate and an auxiliary uniform temperature plate, the uniform temperature plate is provided with a first wall plate and a second wall plate which are opposite to each other, and a heat conduction cavity is defined between the first wall plate and the second wall plate; a heat-conducting medium is accommodated in the heat-conducting cavity, and the first wall plate is provided with a convex area; the auxiliary temperature-uniforming plate is arranged on the first wall plate in an overlapped mode, an avoiding groove matched with the protruding area is formed in the side, facing the first wall plate, of the auxiliary temperature-uniforming plate, and at least part of the peripheral side of the auxiliary temperature-uniforming plate exceeds the temperature-uniforming plate in the direction towards the periphery of the auxiliary temperature-uniforming plate. The heat dissipation performance of the heat dissipation assembly for the electronic equipment is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation component and an electronic device. Background Art

[0002] Currently, the terminal industry's auxiliary mid-frame heat dissipation solutions are through solutions such as temperature spreaders and graphene. However, due to the space constraints of terminal electronic equipment, the heat dissipation capacity of the existing heat dissipation structure is difficult to further improve, and further breakthroughs in the heat dissipation principle are difficult to make. Therefore, how to further improve the heat dissipation performance without expanding the installation space of the heat dissipation structure is an urgent problem that needs to be solved now and in the future, and the market potential value is huge.

[0003] Application Contents

[0004] The main purpose of this application is to provide a heat dissipation component and an electronic device, aiming to at least improve the heat dissipation performance of the heat dissipation component for the electronic device.

[0005] To achieve the above objectives, the present application proposes a heat dissipation assembly for use in electronic equipment, wherein the heat dissipation assembly includes:

[0006] A temperature homogenizing plate having a first wall plate and a second wall plate facing each other, wherein a heat conduction cavity is defined between the first wall plate and the second wall plate, wherein a heat conduction medium is contained in the heat conduction cavity, and wherein the first wall plate has a raised area; and

[0007] An auxiliary temperature averaging plate is stacked on the first wall panel. The auxiliary temperature averaging plate is provided with an avoidance groove that cooperates with the raised area on the side facing the first wall panel. The peripheral side of the auxiliary temperature averaging plate at least partially extends beyond the temperature averaging plate in the direction toward its periphery.

[0008] In the technical solution of the embodiment of the present application, the heat dissipation assembly is mainly formed by combining the temperature averaging plate and the auxiliary temperature averaging plate. The temperature averaging plate is the main heat dissipation structure, and its thermal conductivity is relatively high. It is mainly used for thermally connecting with the heat source in the electronic device, absorbing the heat from the heat source to cool the heat source. The auxiliary temperature averaging plate is an auxiliary heat dissipation structure, which is mainly used for thermally connecting with the temperature averaging plate and the heat dissipation part on the electronic device, and assisting in conducting the heat on the temperature averaging plate to the heat dissipation part of the electronic device, which then conducts the heat out of the electronic device to achieve heat dissipation of the electronic device. In the embodiment of the present application, the temperature averaging plate is protruded to form the raised area, and at the same time, the avoidance groove corresponding to the raised area is opened on the auxiliary temperature averaging plate. Thus, without increasing the overall thickness of the heat dissipation assembly, the thickness of the temperature averaging plate is partially increased, thereby improving the heat dissipation performance of the temperature averaging plate, and then improving the heat dissipation performance of the heat dissipation assembly, meeting functional requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0010] Figure 1 A schematic diagram of the three-dimensional structure of an electronic device according to an embodiment of the present application;

[0011] Figure 2 for Figure 1 Schematic diagram of the three-dimensional explosion;

[0012] Figure 3 for Figure 1 A schematic diagram of the three-dimensional structure of an electronic device after removing the screen;

[0013] Figure 4 for Figure 3 Schematic diagram of the three-dimensional structure of the electronic device after removing the auxiliary temperature plate;

[0014] Figure 5 for Figure 4 Schematic diagram of the three-dimensional structure of the electronic device after removing the temperature plate;

[0015] Figure 6 for Figure 1 A simplified cross-sectional diagram of an electronic device in FIG.

[0016] Description of Figure Numbers:

[0017] 1000. Electronic device; 100. Heat dissipation assembly; 1. Vapor chamber; 11. First wall panel; 111. Raised area; 112. First joint; 12. Second wall panel; 121. Main body; 122. Second joint; 13. Heat conduction cavity; 14. Liquid absorption structure; 2. Auxiliary vapor chamber; 21. Avoidance groove; 200. Middle frame; 300. Electronic components; 400. Screen.

[0018] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0020] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0021] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0022] Currently, the terminal industry's auxiliary mid-frame heat dissipation solutions are through solutions such as temperature spreaders and graphene. However, due to the space constraints of terminal electronic equipment, the heat dissipation capacity of the existing heat dissipation structure is difficult to further improve, and further breakthroughs in the heat dissipation principle are difficult to make. Therefore, how to further improve the heat dissipation performance without expanding the installation space of the heat dissipation structure is an urgent problem that needs to be solved now and in the future, and the market potential value is huge.

[0023] In view of this, the present application embodiment proposes a heat dissipation component, please refer to Figures 2 to 4 as well as Figure 6 , is an embodiment of the heat dissipation component proposed in this application, and the heat dissipation component will be described in detail below with reference to specific drawings.

[0024] See also Figure 6 The heat dissipation component 100 is applied to an electronic device 1000, wherein the heat dissipation component 100 includes a temperature averaging plate 1 and an auxiliary temperature averaging plate 2, the temperature averaging plate 1 has a first wall plate 11 and a second wall plate 12 opposite to each other, a heat conduction cavity 13 is defined between the first wall plate 11 and the second wall plate 12, the heat conduction cavity 13 is filled with a heat conduction medium, and the first wall plate 11 has a raised area 111; the auxiliary temperature averaging plate 2 is stacked on the first wall plate 11, and the auxiliary temperature averaging plate 2 is provided with an avoidance groove 21 that cooperates with the raised area 111 on the side facing the first wall plate 11, and the peripheral side of the auxiliary temperature averaging plate 2 is at least partially arranged beyond the temperature averaging plate 1 in the direction toward its outer periphery.

[0025] In the technical solution of the embodiment of the present application, the heat dissipation assembly 100 is mainly formed by the combination of the temperature equalizing plate 1 and the auxiliary temperature equalizing plate 2. The temperature equalizing plate 1 is the main heat dissipation structure, and its thermal conductivity is relatively high. It is mainly used for thermally connecting with the heat source in the electronic device 1000, absorbing the heat from the heat source to cool the heat source. The auxiliary temperature equalizing plate 2 is an auxiliary heat dissipation structure, which is mainly used for thermally connecting with the temperature equalizing plate 1 and the heat dissipation part on the electronic device 1000, and assisting in conducting the heat on the temperature equalizing plate 1 to the heat dissipation part of the electronic device 1000. The heat dissipation part exports the heat out of the electronic device 1000, thereby realizing heat dissipation of the electronic device 1000. The electronic device 1000 in the embodiment of the present application mainly includes a tablet, a mobile phone, and a notebook. In order to meet the requirements of lightweight design, the existing auxiliary temperature averaging plate 2 is generally stacked with the temperature averaging plate 1, and the peripheral side of the auxiliary temperature averaging plate 2 is set to extend beyond the temperature averaging plate 1 so as to laterally contact the heat dissipation part of the electronic device 1000 to achieve an auxiliary heat dissipation effect. On this basis, the heat dissipation performance of the stacked auxiliary temperature averaging plate 2 and the temperature averaging plate 1 is difficult to further improve when the thickness size is limited. Based on the above problems, the embodiment of the present application takes into account that the main function of the auxiliary temperature averaging plate 2 is to be set at the intersection of the temperature averaging plate 1 and the heat dissipation part of the electronic device 1000 for heat transfer, and the increase in the thickness of the temperature averaging plate 1 can significantly improve its heat dissipation performance. Therefore, in the embodiment of the present application, the temperature averaging plate 1 is protruded to form the protruding area 111, and at the same time, the auxiliary temperature averaging plate 2 is provided with the avoidance groove 21 corresponding to the protruding area 111. In this way, without affecting the main function of the auxiliary temperature averaging plate 2 and without increasing the overall thickness of the heat dissipation assembly 100, the thickness of the temperature averaging plate 1 is partially increased, the heat dissipation performance of the temperature averaging plate 1 is improved, and then the heat dissipation performance of the heat dissipation assembly 100 is improved to meet the functional requirements. It should be noted that the specific setting position of the protruding area 111 on the temperature averaging plate 1 is not specifically limited. In some embodiments, the middle part of the temperature averaging plate 1 is protruded to form the protruding area 111.

[0026] It can be understood that the depth of the avoidance groove 21 limits the maximum raised height of the raised area 111, that is, limits the maximum thickness of the temperature equalizing plate 1. In order to ensure that the temperature equalizing plate 1 has better thermal conductivity, the raised height of the raised area 111 should be as large as possible, so as to increase the thickness of the temperature equalizing plate 1 and increase the volume of the heat conduction cavity 13 in the temperature equalizing plate 1. Therefore, in some embodiments, the avoidance groove 21 is arranged through the side of the auxiliary temperature equalizing plate 2 facing away from the first wall panel 11. In this way, on the one hand, the limit of the maximum raised height of the raised area 111 by the avoidance groove 21 is released, meeting the above-mentioned functional requirement of improving thermal conductivity. On the other hand, it is convenient to process the avoidance groove 21 on the thinner auxiliary temperature equalizing plate 2, thereby reducing costs.

[0027] In some embodiments, based on the avoidance groove 21 passing through the auxiliary temperature vapor chamber 2, the height of the raised area 111 has no strong correlation with the thickness of the auxiliary temperature vapor chamber 2, that is, the height of the raised area 111 can be set to be less than the thickness of the auxiliary temperature vapor chamber 2, or greater than the thickness of the auxiliary temperature vapor chamber 2, based on actual needs. It can be understood that the thickness of the auxiliary temperature vapor chamber 2 is actually positively correlated with its thermal conductivity. When the electronic device 1000 has a thickness restriction on the heat dissipation component 100, it is obvious that the height of the raised area 111 is set to be consistent with the thickness of the auxiliary temperature vapor chamber 2, that is, the thickness of the auxiliary temperature vapor chamber 2 is equivalent to the raised height of the raised area 111, so that when the thickness of the heat dissipation component 100 is restricted, the thickness of the auxiliary temperature vapor chamber 2 can be as large as possible, and the raised height of the raised area 111 can be as large as possible, so as to obtain better thermal conductivity of the auxiliary temperature vapor chamber 2 and the temperature vapor chamber 1 to meet the needs.

[0028] It is understandable that, based on the function of the auxiliary temperature evaporating plate 2, that is, based on the fact that the auxiliary temperature evaporating plate 2 is used to connect the temperature evaporating plate 1 and the heat dissipation part of the electronic device 1000 for heat conduction, the larger the contact area between the auxiliary temperature evaporating plate 2 stacked on the temperature evaporating plate 1 and the heat dissipation part of the electronic device 1000, the better its thermal conductivity. Therefore, in some embodiments, the peripheral sides of the auxiliary temperature evaporating plate 2 are all arranged beyond the temperature evaporating plate 1, so that the peripheral sides of the auxiliary temperature evaporating plate 2 can be thermally connected to the heat dissipation part of the electronic device 1000, thereby ensuring the thermal conductivity of the auxiliary temperature evaporating plate 2, thereby ensuring the heat dissipation performance of the heat dissipating assembly 100. Of course, based on other functional requirements and structural space avoidance, the auxiliary temperature evaporating plate 2 can also be set to only partially exceed the temperature evaporating plate 1. The actual use scenario requirements of the heat dissipating assembly 100 are mainly based on the main requirements, and are not limited here. It is sufficient to meet the overall heat dissipation performance required by the heat dissipating assembly 100.

[0029] It can be understood that the forming method of the first wall panel 11 and the second wall panel 12 of the temperature equalizing plate 1 is also not limited. The first wall panel 11 and the second wall panel 12 can be formed by bending a plate-like material, or the first wall panel 11 and the second wall panel 12 can be formed by stacking two plate-like materials. To facilitate the processing and forming of the temperature equalizing plate 1, in some embodiments, the first wall panel 11 and the second wall panel 12 are formed by stacking two plate-like materials. Specifically, a first joint portion 112 is formed on the outer edge of the first wall panel 11; the second wall panel 12 includes a main body 121 and a second joint portion 122 located at the outer edge of the main body 121, the second joint portion 122 protrudes toward the first wall panel 11 compared to the main body 121, and the second joint portion 122 is affixed to the first joint portion 112 to seal the first wall panel 11 and the second wall panel 12. The sealed heat conduction cavity 13 is formed by the main body 121 and the first wall panel 11 to meet functional requirements.

[0030] The temperature averaging plate 1 absorbs heat and performs heat uniformity through the heat conducting medium placed in the heat conducting cavity 13. Therefore, in some embodiments, the temperature averaging plate 1 can be a liquid-cooled temperature averaging plate 1. By setting corresponding pipes and micro water pumps on the outside of the temperature averaging plate 1, the heat conducting liquid in the heat conducting cavity 13 of the temperature averaging plate 1 is driven by the micro water pump to achieve the uniform temperature and heat dissipation function of the temperature averaging plate 1. Such a setting meets the functional requirements of the temperature averaging plate 1, but the setting of additional pipes and micro water pumps is costly. In some embodiments, the temperature averaging plate 1 is set to VC (Vapor Chamber) temperature equalizing plate 1, that is, the heat conduction chamber 13 is configured as an evaporation chamber, the heat conduction medium includes a fluid medium, and a liquid absorption structure 14 attached to the second wall plate 12 is further provided in the evaporation chamber. The fluid medium is heated and evaporated on the side close to the second wall plate 12 in the evaporation chamber, taking away the heat on the second wall plate 12. The evaporated gas diffuses to contact the colder first wall plate 11, so that it releases heat to re-form the fluid medium, and is guided by the liquid absorption structure 14 back to a position close to the second wall plate 12. In this process, the heat on the second wall plate 12 is transferred to the first wall plate 11 through the phase change process of the fluid medium, and is dispersed to the first wall plate 11 to achieve a uniform heat dissipation function. The overall heat dissipation function is excellent, and the structure is simple and easy to arrange.

[0031] In addition, the main function of the auxiliary temperature averaging plate 2 is to be thermally connected to the temperature averaging plate 1 and the heat dissipation part on the electronic device 1000, and the auxiliary temperature averaging plate 2 is arranged to extend beyond the temperature averaging plate 1 in the peripheral direction thereof to be thermally connected to the heat dissipation part of the electronic device 1000, thereby compensating for the low heat conduction efficiency between the side of the temperature averaging plate 1 and the heat dissipation part, and the difficulty in quickly conducting the heat on the temperature averaging plate 1 to the heat dissipation part for export. Therefore, the main heat conduction direction of the auxiliary temperature averaging plate 2 is its facing direction, that is, its planar extension direction. Therefore, in this embodiment, the thermal conductivity coefficient of the auxiliary temperature averaging plate 2 in its thickness direction is lower than its surface thermal conductivity coefficient to meet functional requirements. Specifically, based on the above functional requirements, the material of the auxiliary temperature averaging plate 2 includes graphene, that is, the auxiliary temperature averaging plate 2 is a graphene sheet, which has strong thermal conductivity, and the product is mature, the design and manufacturing cost is relatively low, and the use effect is good.

[0032] See also Figures 1 to 5 The present application also proposes an electronic device 1000, which includes a shell, at least one electronic component 300 and a heat dissipation assembly 100, wherein the shell has a heat dissipation portion; at least one electronic component 300 is arranged in the shell; the heat dissipation assembly 100 is arranged in the shell, and the specific structure of the heat dissipation assembly 100 refers to the above embodiment. Since the electronic device 1000 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which are not described one by one here. The second wall plate 12 of the heat dissipation assembly 100 is thermally connected to the electronic component 300, and at least the auxiliary temperature dispersion plate 2 is thermally connected to the heat dissipation portion.

[0033] Specifically, the structure of the shell is not specifically limited, and can be used to seal the heat dissipation component 100 in the shell, install and fix the heat dissipation component 100 through the shell, and conduct the heat on the heat dissipation component 100 to the outside of the shell. In some embodiments, the shell includes a middle frame 200 located on the periphery of the heat dissipation component 100, the part of the auxiliary temperature equalizing plate 2 that exceeds the temperature equalizing plate 1 is thermally connected to the middle frame 200, and the heat dissipation part includes the middle frame 200.

[0034] In addition, the electronic device 1000 also includes a screen 400 located at one end of the middle frame 200. The screen 400 is positioned corresponding to the auxiliary vapor chamber 2. The area of ​​the screen 400 is a, and the projected area of ​​the raised area 111 on the screen 400 is b. Therefore, 15% ≤ b / a ≤ 50%. The electronic device 1000 primarily includes tablets, mobile phones, and laptops, as described above. In this embodiment, the electronic device 1000 is primarily a mobile phone or tablet, and therefore includes the screen 400. The size of the raised area 111 affects the drop reliability of the electronic device 1000 structure and the heat dissipation performance of the vapor chamber 1. Therefore, in this embodiment, the size of the raised area 111 is limited. Specifically, the projected area of ​​the raised area 111 on the screen 400 accounts for 15% to 50% of the screen 400 area. A size below 15% makes it difficult to achieve the required heat dissipation performance, while a size above 50% will affect the drop reliability of the electronic device 1000.

[0035] In some embodiments, a first joint portion 112 is formed on the outer edge of the first wall panel 11, and a second joint portion 122 is formed on the outer edge of the second wall panel 12. The first joint portion 112 and the second joint portion 122 are attached to form a joint portion, and the joint portion is overlapped on one side of the middle frame 200 to fix the heat dissipation assembly 100. The structures of the first wall plate 11 and the second wall plate 12 on the temperature vapor chamber 1 have been described above. The outer edge of the first wall plate 11 forms the first joint portion 112, and the outer edge of the second wall plate 12 forms the second joint portion 122. The joint portion is formed by affixing the first joint portion 112 and the second joint portion 122, thereby simplifying the molding structure and facilitating the molding of the temperature vapor chamber 1. Here, the first joint portion 112 and the second joint portion 122 are generally affixed by welding to ensure sealing. Based on this structure, the temperature vapor chamber 1 can be installed to the middle frame 200 through the joint portion. Its installation structure is simple and stable. However, the joint portion is far away from the heat conduction cavity 13 in the temperature vapor chamber 1, that is, the thermal conductivity of the joint portion is the thermal conductivity of its own material, which is relatively poor. Therefore, the auxiliary temperature vapor chamber 2 is used to improve the thermal conductivity here, ensuring that the heat on the temperature vapor chamber 1 is transferred to the middle frame 200, thereby meeting the heat dissipation requirements of the electronic device 1000 from the inside to the outside.

[0036] The above description is merely an exemplary embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structural transformation made using the contents of the present application specification and drawings under the technical concept of the present application, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A heat dissipation component, applied to electronic equipment, characterized in that: include: The temperature equalizing plate comprises a first wall plate and a second wall plate facing each other, wherein a heat conduction cavity is defined between the first wall plate and the second wall plate, wherein a heat conduction medium is contained in the heat conduction cavity, and wherein the first wall plate has a raised area; as well as, An auxiliary temperature averaging plate is stacked on the first wall panel. The auxiliary temperature averaging plate is provided with an avoidance groove that cooperates with the raised area on the side facing the first wall panel. The peripheral side of the auxiliary temperature averaging plate at least partially extends beyond the temperature averaging plate in the direction toward its periphery.

2. The heat dissipation assembly according to claim 1, wherein: The avoidance groove is arranged through a side of the auxiliary temperature uniform plate facing away from the first wall plate.

3. The heat dissipation assembly according to claim 1 or 2, wherein: The thickness of the auxiliary temperature homogenizing plate is equivalent to the height of the raised area.

4. The heat dissipation assembly according to claim 1, wherein: A first joint portion is formed on the outer edge of the first wall panel; The second wall panel includes a main body and a second connecting portion located at an outer edge of the main body. The second connecting portion is protruded toward the first wall panel compared to the main body, and the second connecting portion is in contact with the first connecting portion.

5. The heat dissipation assembly according to claim 1, wherein: The temperature averaging plate includes a VC (Vapor Chamber) temperature averaging plate.

6. The heat dissipation assembly according to claim 1, wherein: The auxiliary temperature homogenizing plate has a thermal conductivity in its thickness direction that is lower than its surface thermal conductivity.

7. The heat dissipation assembly according to claim 6, wherein: The auxiliary temperature homogenizing plate is made of graphene.

8. An electronic device, characterized in that: include: a housing having a heat dissipation portion; at least one electronic component disposed in the housing; as well as, The heat dissipation assembly is arranged in the shell and is the heat dissipation assembly according to any one of claims 1 to 7. The second wall plate of the heat dissipation assembly is thermally connected to the electronic component, and at least the auxiliary temperature equalizing plate is thermally connected to the heat dissipation part.

9. The electronic device according to claim 8, wherein The housing includes a middle frame located at the periphery of the heat dissipation assembly, a portion of the auxiliary temperature vaporizer extending beyond the temperature vaporizer is thermally connected to the middle frame, and the heat dissipation portion includes the middle frame.

10. The electronic device according to claim 9, wherein The electronic device further includes a screen located at one end of the middle frame, and the screen is arranged corresponding to the auxiliary temperature vapor chamber.

11. The electronic device according to claim 10, wherein: The area of ​​the screen is a, and the projection area of ​​the raised area on the screen is b, then 15%≤b / a≤50%.

12. The electronic device according to claim 9, wherein A first joint portion is formed on the outer edge of the first wall plate, and a second joint portion is formed on the outer edge of the second wall plate. The first joint portion and the second joint portion are attached to form a joint portion, and the joint portion is overlapped on one side of the middle frame to fix the heat dissipation component.

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