Heat dissipation structure of electronic equipment and electronic equipment

Abstract

The invention relates to a heat dissipation structure of electronic equipment and an electronic structure, the heat dissipation structure of the electronic equipment comprises a shell with an accommodating cavity, the shell is provided with a first heat dissipation sheet and a second heat dissipation sheet, and the shell extends into the accommodating cavity to be provided with a first heat dissipation part and a second heat dissipation part; the first heat dissipation assembly comprises a first heat dissipation plate, a second heat dissipation plate and a heat dissipation piece, the first heat dissipation plate and the second heat dissipation plate are arranged in one-to-one correspondence with the first heat dissipation part and the second heat dissipation part respectively to form a first heat dissipation channel and a second heat dissipation channel, the heat dissipation piece is connected with the first heat dissipation part and the second heat dissipation part, and the surface of one side of the heat dissipation piece is used for installing a T / R assembly; the surface of the other side is used for installing a wave control module, and the first heat dissipation plate and the second heat dissipation plate are used for installing a signal processing module and a radio frequency module. The first heat pipe, the second heat pipe, the first fan and the second fan are arranged on the shell. According to the invention, each structure part is compactly installed, miniaturization is facilitated, and heat dissipation paths do not have crosstalk.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation structure of an electronic equipment and the electronic equipment. Background Art

[0002] Existing small and medium-sized electronic devices are equipped with multiple electronic components such as T / R components, signal processing modules, wave control modules and radio frequency modules. These electronic components generate a large amount of heat during operation. If heat dissipation measures are not taken in time, the electronic device may crash or even damage the internal components of the electronic device.

[0003] Current heat dissipation designs for small and medium-sized electronic devices typically involve adding independent ventilation ducts within the device or combining forced air cooling with heat pipes and natural heat dissipation. These designs can address heat dissipation issues to a certain extent. However, designs using independent ventilation ducts for heat dissipation take up a lot of space, hindering the miniaturization and lightweighting of electronic devices. Combining multiple heat dissipation designs not only takes up a lot of space but also creates crosstalk between multiple electronic components, compromising cooling effectiveness.

[0004] Therefore, it is necessary to provide a new technical solution to improve one or more problems existing in the above solutions.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0006] The purpose of the embodiments of the present disclosure is to provide a heat dissipation structure of an electronic device and the electronic device, which has a compact structure and is conducive to miniaturization, and the heat dissipation paths do not interfere with each other, thereby improving the heat dissipation effect.

[0007] According to a first aspect of an embodiment of the present disclosure, there is provided a heat dissipation structure of an electronic device, comprising:

[0008] A housing having an accommodating cavity, wherein the housing is provided with a first heat sink and a second heat sink at two ends along a first direction, respectively, and a first heat dissipation portion and a second heat dissipation portion extending into the accommodating cavity at two ends along the first direction, respectively;

[0009] A first heat dissipation assembly, comprising a first heat dissipation plate, a second heat dissipation plate, and a heat dissipation element, wherein the first heat dissipation plate and the second heat dissipation plate are respectively arranged in a one-to-one correspondence with the first heat dissipation portion and the second heat dissipation portion to form a first heat dissipation channel and a second heat dissipation channel. The two sides of the heat dissipation element along the first direction are respectively connected to the first heat dissipation portion and the second heat dissipation portion. One side surface of the heat dissipation element along the second direction is used for mounting a T / R assembly, and the other side surface is used for mounting a wave control module. The first heat dissipation plate and the second heat dissipation plate are used for mounting a signal processing module and a radio frequency module.

[0010] a second heat dissipation assembly comprising a first heat pipe and a second heat pipe, wherein a portion of the first heat pipe is sandwiched between the first heat dissipation portion and the heat dissipation element, and another portion is bent and extended to the first heat dissipation fin; a portion of the second heat pipe is sandwiched between the second heat dissipation portion and the heat dissipation element, and another portion is bent and extended to the second heat dissipation fin;

[0011] The third heat dissipation component is provided with a first fan and a second fan on the shell, the first fan is used to dissipate heat to the first heat dissipation channel, and the second fan is used to dissipate heat to the second heat dissipation channel; wherein the first direction is perpendicular to the second direction.

[0012] According to a second aspect of an embodiment of the present disclosure, there is provided an electronic device, comprising a signal processing module, a radio frequency module, a wave control module, a T / R component, and a heat dissipation structure of the electronic device as described in any one of the above items;

[0013] Wherein, the signal processing module and the radio frequency module are respectively installed on the first heat dissipation plate and the second heat dissipation plate of the heat dissipation structure;

[0014] The T / R assembly is mounted on one side surface of the heat sink of the heat dissipation structure along the second direction, and the wave control module is mounted on the other side surface of the heat sink along the second direction.

[0015] The technical solution provided by the present disclosure may have the following beneficial effects:

[0016] In the embodiment of the present disclosure, on the one hand, in terms of structure, the accommodating cavity of the shell is divided into two cavities in the second direction through the structural design of the heat sink of the first heat dissipation assembly and the first heat dissipation part and the second heat dissipation part on the shell, and the first heat dissipation part and the second heat dissipation part have installation space in the first direction, so that it is convenient to use one part of the cavity to accommodate the T / R component of the electronic device, and use the installation space between the first heat dissipation part and the second heat dissipation part in the other part of the cavity to accommodate the wave control module, and the cavity located on both sides along the first direction in the other part of the cavity accommodates the signal processing module and the radio frequency module, so that the various parts of the electronic device are installed compactly, which is conducive to the miniaturization design of the electronic device; on the other hand, in terms of heat dissipation, for the T / R components mounted on both sides of the heat sink, The components and the wave control module can not only transfer the heat of the T / R component and the wave control module to the first heat sink and the second heat sink of the shell through the cooperation of the heat sink and the second heat sink, but also transfer the heat of the T / R component and the wave control module to the first heat dissipation channel and the second heat dissipation channel through the cooperation of the heat sink, the first heat dissipation part and the second heat dissipation part, and then discharge the heat outward through the first fan and the second fan. For the signal processing module and the radio frequency module, the heat can be transferred to the corresponding first heat dissipation channel and the second heat dissipation channel through the first heat dissipation plate and the second heat dissipation plate, and then discharge the heat outward through the first fan and the second fan. This not only meets the effective heat dissipation of multiple heat sources in the electronic device, but also prevents the heat dissipation paths from crosstalk, thereby improving the heat dissipation effect.

[0017] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, serve to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0019] Figure 1 Schematic diagram showing the exploded structure of an electronic device in an exemplary embodiment of the present disclosure Figure 1 ;

[0020] Figure 2 A cross-sectional view showing an electronic device in an exemplary embodiment of the present disclosure Figure 1 ;

[0021] Figure 3 A cross-sectional view showing an electronic device in an exemplary embodiment of the present disclosure Figure 2 ;

[0022] Figure 4 Show Figure 3 Enlarged view of point A in the middle;

[0023] Figure 5 A schematic structural diagram of a heat dissipation substrate in an exemplary embodiment of the present disclosure is shown;

[0024] Figure 6 A cross-sectional view showing an electronic device in an exemplary embodiment of the present disclosure Figure 3 ;

[0025] Figure 7 A cross-sectional view showing an electronic device in an exemplary embodiment of the present disclosure Figure 4 ;

[0026] Figure 8 Show Figure 7 Enlarged view of point B in the middle;

[0027] Figure 9 A schematic structural diagram illustrating a protective cover of an electronic device in an exemplary embodiment of the present disclosure is shown;

[0028] Figure 10 A schematic structural diagram illustrating a frame of an electronic device in an exemplary embodiment of the present disclosure;

[0029] Figure 11 Schematic diagram showing the exploded structure of an electronic device in an exemplary embodiment of the present disclosure Figure 2 ;

[0030] Figure 12 Schematic diagram showing the dimensions of the heat sink in the exemplary embodiment of the present disclosure Figure 1 ;

[0031] Figure 13 Schematic diagram showing the dimensions of the heat sink in the exemplary embodiment of the present disclosure Figure 2 ;

[0032] Figure 14 Schematic diagram showing the structural dimensions of part of the electronic device in the exemplary embodiment of the present disclosure Figure 1 ;

[0033] Figure 15 Schematic diagram 2 showing part of the structural dimensions of an electronic device in an exemplary embodiment of the present disclosure;

[0034] Figure 16 Schematic diagram showing the structural dimensions of part of the electronic device in the exemplary embodiment of the present disclosure Figure 3 ;

[0035] Figure 17 A schematic diagram showing the dimensions of a fifth heat sink in an exemplary embodiment of the present disclosure;

[0036] Figure 18A schematic diagram showing the dimensions of a frame and a first heat sink in an exemplary embodiment of the present disclosure;

[0037] Figure 19 A diagram showing a surface temperature simulation result of a T / R assembly in an exemplary embodiment of the present disclosure;

[0038] Figure 20 A diagram showing surface temperature simulation results of a signal processing module, a beam control module, and a radio frequency module in an exemplary embodiment of the present disclosure;

[0039] Figure 21 A diagram showing surface temperature simulation results of a first heat pipe and a second heat pipe in an exemplary embodiment of the present disclosure;

[0040] Figure 22 A diagram showing a surface temperature simulation result of a frame in an exemplary embodiment of the present disclosure;

[0041] Figure 23 A diagram showing the temperature distribution results of the airflow in the first heat dissipation channel and the second heat dissipation channel in an exemplary embodiment of the present disclosure is shown.

[0042] Description of reference numerals:

[0043] 100, housing; 110, frame; 111, first heat sink; 112, second heat sink; 113, first heat dissipation portion; 1131, third heat sink; 114, second heat dissipation portion; 1141, fourth heat sink; 115, first mounting notch; 116, second mounting notch; 117, first groove; 118, second groove; 119, third strip groove; 1011, heat dissipation groove; 1012, second strip groove; 102, bottom wall; 1021, hole structure; 103, side wall; 1041, first heat dissipation channel; 1042, second heat dissipation channel; 1101, first side frame; 1102, second side frame; 11 03, upper frame; 1104, lower frame; 120, first cover; 130, second cover; 210, first heat sink; 211, fifth heat sink; 220, second heat sink; 221, sixth heat sink; 230, heat sink; 231, heat sink substrate; 2311, third groove; 2312, first strip groove; 232, third heat pipe; 233, cover; 310, first heat pipe; 320, second heat pipe; 410, first fan; 420, second fan; 500, protective cover; 510, ventilation hole; 600, signal processing module; 700, RF module; 800, wave control module; 900, T / R assembly. DETAILED DESCRIPTION

[0044] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0045] In addition, the accompanying drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. Identical reference numerals in the figures denote identical or similar parts, and thus repetitive descriptions thereof will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities that do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0046] In this exemplary embodiment, a heat dissipation structure of an electronic device is first provided. Figure 1 and Figure 2As shown in , the heat dissipation structure of the electronic device includes a shell 100, a first heat dissipation component, a second heat dissipation component and a third heat dissipation component. The shell 100 has a accommodating cavity, and the shell 100 is provided with a first heat dissipation fin 111 and a second heat dissipation fin 112 at both ends along the first direction, and the shell 100 is provided with a first heat dissipation portion 113 and a second heat dissipation portion 114 at both ends along the first direction extending into the accommodating cavity; the first heat dissipation component includes a first heat dissipation plate 210, a second heat dissipation plate 220 and a heat dissipation element 230, and the first heat dissipation plate 210 and the second heat dissipation plate 220 are respectively arranged in a one-to-one correspondence with the first heat dissipation portion 113 and the second heat dissipation portion 114 to form a first heat dissipation channel 1041 and a second heat dissipation channel 1042, and the heat dissipation element 230 is connected to the first heat dissipation portion 113 and the second heat dissipation portion 114 on both sides along the first direction, and one side surface of the heat dissipation element 230 along the second direction is used to install the T / R component 900, and the other side surface is used to install the T / R component 900. The surface is used to install the wave control module 800, and the first heat dissipation plate 210 and the second heat dissipation plate 220 are used to install the signal processing module 600 and the radio frequency module 700; the second heat dissipation component includes a first heat pipe 310 and a second heat pipe 320, the first heat pipe 310 is partially clamped between the first heat dissipation part 113 and the heat dissipation element 230, and the other part is bent and extended to the first heat dissipation fin 111, the second heat pipe 320 is partially clamped between the second heat dissipation part 114 and the heat dissipation element 230, and the other part is bent and extended to the second heat dissipation fin 112; the third heat dissipation component includes a first fan 410 and a second fan 420 provided on the shell 100, the first fan 410 is used to dissipate heat to the first heat dissipation channel 1041, and the second fan 420 is used to dissipate heat to the second heat dissipation channel 1042.

[0047] It should be noted that the first heat dissipation plate 210 and the second heat dissipation plate 220 are respectively arranged in a one-to-one correspondence with the first heat dissipation part 113 and the second heat dissipation part 114, wherein the first heat dissipation plate 210 and the first heat dissipation part 113 enclose a first heat dissipation channel 1041, and the second heat dissipation plate 220 and the second heat dissipation part 114 enclose a second heat dissipation channel 1042.

[0048] The first direction is perpendicular to the second direction, and the first direction is as follows: Figure 1 The direction indicated by the arrows ab, the second direction is as follows Figure 1 In the direction indicated by the arrow cd.

[0049] In the embodiment of the present disclosure, on the one hand, structurally, the accommodating cavity of the shell 100 is divided into two cavities in the second direction through the structural design of the heat sink 230 of the first heat dissipation assembly and the first heat dissipation portion 113 and the second heat dissipation portion 114 on the shell 100, and the first heat dissipation portion 113 and the second heat dissipation portion 114 leave installation space in the first direction, so that it is convenient to use one part of the cavity to accommodate the T / R component 900 of the electronic device, and use the installation space between the first heat dissipation portion 113 and the second heat dissipation portion 114 in the other part of the cavity to accommodate the wave control module 800, and the cavity located on both sides along the first direction in the other part of the cavity to accommodate the signal processing module 600 and the radio frequency module 700, so that the various parts of the electronic device are installed compactly, which is conducive to the miniaturization design of the electronic device; on the other hand, in terms of heat dissipation, for the T / R component 900 and the wave control module 800 carried on both sides of the heat sink 230, both can be dissipated by The heat of the T / R component 900 and the wave control module 800 is transferred to the first heat sink 111 and the second heat sink 112 of the shell 100 through the cooperation of the heat sink 230 and the second heat sink 113 and the second heat sink 114. The heat of the T / R component 900 and the wave control module 800 can also be transferred to the first heat dissipation channel 1041 and the second heat dissipation channel 1042 through the cooperation of the heat sink 230, the first heat dissipation part 113 and the second heat dissipation part 114, and then the heat is discharged outward through the first fan 410 and the second fan 420. For the signal processing module 600 and the RF module 700, the heat can be transferred to the corresponding first heat dissipation channel 1041 and the second heat dissipation channel 1042 through the first heat dissipation plate 210 and the second heat dissipation plate 220, and then the heat is discharged outward through the first fan 410 and the second fan 420. This not only meets the effective heat dissipation of multiple heat sources in the electronic device, but also prevents the heat dissipation paths from cross-interference, thereby improving the heat dissipation effect.

[0050] Below, each step of the above method in this exemplary embodiment will be described in more detail.

[0051] In one embodiment, reference Figure 1 、 Figure 3 and Figure 4 As shown in , the heat sink 230 includes a heat sink substrate 231, a third heat pipe 232 and a cover plate 233. The two ends of the heat sink substrate 231 along the first direction are respectively connected to the first heat sink 113 and the second heat sink 114, and one side surface of the heat sink substrate 231 along the second direction is used to mount the T / R assembly 900. The cover plate 233 is provided on the other side surface of the heat sink substrate 231 along the second direction for mounting the wave control system.

[0052] The third heat pipe 232 is sandwiched between the heat dissipation substrate 231 and the cover plate 233 and extends along the first direction.

[0053] Through the above-mentioned structural setting, the heat transferred from the T / R component 900 to the heat dissipation substrate 231 can be transferred along the first direction to the area near the first heat dissipation part 113 and the second heat dissipation part 114 of the shell 100 through the third heat pipe 232, and then the heat is transferred to the first heat dissipation channel 1041 by using the first heat dissipation part 113, and the heat is transferred to the second heat dissipation channel 1042 by using the second heat dissipation part 114, and then the heat is discharged to the outside through the first fan 410 and the second fan 420.

[0054] Specifically, refer to Figure 4 and Figure 5 As shown in FIG, a third groove 2311 is formed on the other side of the heat dissipation substrate 231 along the second direction. The third groove 2311 is used to mount the cover plate 233. A first strip-shaped groove 2312 is formed at the bottom of the third groove 2311. The first strip-shaped groove 2312 extends along the first direction and is used to accommodate the third heat pipe 232. The heat dissipation substrate 231, the cover plate 233, and the third heat pipe 232 are bonded together using thermally conductive adhesive or soldering to ensure that there are no gaps between the heat dissipation substrate 231, the cover plate 233, and the third heat pipe 232.

[0055] Optionally, multiple third heat pipes 232 and third grooves 2311 are provided, and the multiple third grooves 2311 are evenly arranged along the third direction. The multiple third heat pipes 232 are installed in the multiple third grooves 2311 one by one. The setting of the multiple third heat pipes 232 can provide a more efficient heat dissipation effect for the multiple T / R components 900 arranged in an array.

[0056] In one embodiment, reference Figure 1 、 Figure 2 and Figure 6 As shown in , the housing 100 is provided with a first mounting slot 115 and a second mounting slot 116 at one end portion along the third direction, and the first mounting slot 115 and the second mounting slot 116 are spaced apart along the first direction;

[0057] The first mounting slot 115 is connected to the first heat dissipation channel 1041 , and the first fan 410 is disposed in the first mounting slot 115 ; the second mounting slot 116 is connected to the second heat dissipation channel 1042 , and the second fan 420 is disposed in the second mounting slot 116 ;

[0058] The third direction is the height direction of the housing 100 and is perpendicular to both the first direction and the second direction. Figure 1 The direction indicated by the arrow ef.

[0059] Through the above structural setting, the heat transferred to the first heat dissipation channel 1041 can be passed into the fan through the first installation slot 115, and the heat in the second heat dissipation channel 1042 can be passed into the fan through the second installation slot 116, thereby dissipating the heat outward.

[0060] For further reference, Figure 2 and Figure 6 As shown in , the first heat dissipation portion 113 and the second heat dissipation portion 114 are both provided with a heat dissipation slot 1011 that opens toward the second direction and extends along the third direction. One end of the heat dissipation slot 1011 of the first heat dissipation portion 113 along the third direction is connected to the first mounting slot 115, and the other end of the heat dissipation slot 1011 of the second heat dissipation portion 114 along the third direction is connected to the second mounting slot 116.

[0061] The first heat dissipation plate 210 is disposed at the notch of the heat dissipation slot 1011 of the first heat dissipation portion 113 to enclose the first heat dissipation portion 113 to form the first heat dissipation channel 1041;

[0062] The second heat dissipation plate 220 is disposed at the notch of the heat dissipation slot 1011 of the second heat dissipation portion 114 to form the second heat dissipation channel 1042 together with the second heat dissipation plate 220 .

[0063] A heat dissipation slot 1011 is designed on the first heat dissipation portion 113, which is open in the second direction and extends along the third direction. The first heat dissipation plate 210 is arranged at the notch of the heat dissipation slot 1011 of the first heat dissipation portion 113, and the heat dissipation slot 1011 of the first heat dissipation portion 113 is connected to the first mounting notch 115 at one end thereof along the third direction, so that the first heat dissipation plate 210 and the first heat dissipation portion 113 enclose a first heat dissipation channel 1041 that is connected to the first mounting notch 115. A heat dissipation slot 1011 is designed on the second heat dissipation portion 114, which is open in the second direction and extends along the third direction, and the second heat dissipation plate 220 is arranged at the notch of the heat dissipation slot 1011 of the second heat dissipation portion 114, and the heat dissipation slot 1011 of the second heat dissipation portion 114 is connected to the second mounting notch 116 at one end thereof along the third direction, so that the second heat dissipation plate 220 and the second heat dissipation portion 114 enclose a second heat dissipation channel 1042 that is connected to the second mounting notch 116.

[0064] It should be noted that the first heat dissipation plate 210 is connected to the notch of the heat dissipation groove 1011 of the first heat dissipation part 113 by structural adhesive bonding or vacuum brazing welding; the second heat dissipation plate 220 is connected to the notch of the heat dissipation groove 1011 of the second heat dissipation part 114 by structural adhesive bonding or vacuum brazing welding.

[0065] For further reference, Figure 1 、 Figure 2 and Figure 6 As shown in , the first heat dissipation portion 113 and the second heat dissipation portion 114 are respectively provided with a third heat dissipation fin 1131 and a fourth heat dissipation fin 1141, and the first heat dissipation plate 210 and the second heat dissipation plate 220 are respectively provided with a fifth heat dissipation fin 211 and a sixth heat dissipation fin 221;

[0066] The third heat sink 1131 and the fifth heat sink 211 are accommodated in the heat sink 1011 of the first heat sink 113 and extend along the third direction. The fourth heat sink 1141 and the sixth heat sink 221 are accommodated in the heat sink 1011 of the second heat sink 114 and extend along the third direction.

[0067] The third heat sink 1131 accommodated in the heat dissipation groove 1011 of the first heat dissipation part 113 can quickly conduct the heat transferred by the T / R component 900 and the wave control module 800 along the third direction to the first fan 410 in the first installation slot 115, and the fourth heat sink 1141 accommodated in the heat dissipation groove 1011 of the second heat dissipation part 114 can quickly conduct the heat transferred by the T / R component 900 and the wave control module 800 along the third direction to the second fan 420 in the second installation slot 116; the fifth heat sink 211 accommodated in the heat dissipation groove 1011 of the first heat dissipation part 113 and the sixth heat sink 221 accommodated in the heat dissipation groove 1011 of the second heat dissipation part 114 can quickly conduct the heat transferred by the signal processing module 600 and the RF module 700 along the third direction to the first fan 410 in the corresponding first installation slot 115 and the second fan 420 in the second installation slot 116 to achieve heat dissipation.

[0068] It should be noted that the signal processing module 600 and the RF module 700 are mounted on the first heat sink 210 and the second heat sink 220 in a one-to-one correspondence. That is, the signal processing module 600 is mounted on the first heat sink 210 and the RF module 700 is mounted on the second heat sink 220; or the signal processing module 600 is mounted on the second heat sink 220 and the RF module 700 is mounted on the first heat sink 210. This embodiment does not limit the types of electronic components mounted on the first heat sink 210 and the second heat sink 220. Based on the specific installation conditions of the signal processing module 600 and the RF module 700, heat can be dissipated through the corresponding first heat dissipation channels 1041 and second heat dissipation channels 1042.

[0069] Optional, reference Figure 6 、 Figure 7 and Figure 8As shown in , along the second direction, the sum of the length of the third heat sink 1131 and the length of the fifth heat sink 211 is less than the groove depth of the heat sink 1011 of the first heat dissipation part 113, and the sum of the length of the fourth heat sink 1141 and the length of the sixth heat sink 221 is less than the groove depth of the heat sink 1011 of the second heat dissipation part 114.

[0070] The above-mentioned structural arrangement enables a first gap to exist between the third heat sink 1131 and the fifth heat sink 211 in the second direction, and a second gap to exist between the fourth heat sink 1141 and the sixth heat sink 221 in the second direction, that is, the opposite ends of the third heat sink 1131 and the fifth heat sink 211 will not contact each other, and the opposite ends of the fourth heat sink 1141 and the sixth heat sink 221 will not contact each other, so as to ensure that there is no heat crosstalk between the third heat sink 1131 and the fifth heat sink 211, and there is no heat crosstalk between the fourth heat sink 1141 and the sixth heat sink 221, thereby ensuring that the heat transfer between the cavity where the TR component is located and the cavity where the signal processing module 600 and the RF module 700 are installed do not affect each other.

[0071] Optionally, a plurality of each of the third heat sink 1131, the fourth heat sink 1141, the fifth heat sink 211, and the sixth heat sink 221 are provided, and the plurality of third heat sink fins 1131, the plurality of fourth heat sink fins 1141, the plurality of fifth heat sink fins 211, and the plurality of sixth heat sink fins 221 are evenly spaced apart along the first direction. By providing a plurality of each of the third heat sink 1131, the fourth heat sink 1141, the fifth heat sink 211, and the sixth heat sink 221, heat dissipation efficiency and uniformity are improved.

[0072] In one embodiment, reference Figure 6 As shown in the figure, the first mounting slot 115 and the second mounting slot 116 both include a bottom wall 102 and a side wall 103 arranged around the periphery of the bottom wall 102, the bottom wall 102 is provided with a hole structure 1021 connected to the heat dissipation slot 1011, and from the hole structure 1021 of the bottom wall 102 toward the side wall 103, the inner surface of the bottom wall 102 gradually moves away from the heat dissipation slot 1011.

[0073] The structural design of the bottom wall of the first mounting slot 115 and the bottom wall of the second mounting slot 116 can prevent the small amount of liquid formed in the first mounting slot 115 and the second mounting slot 116 due to heat dissipation from accumulating on the bottom wall of the first mounting slot 115 and the second mounting slot 116, but flows along the bottom wall 102 with an inclined angle design to the side wall 103, and then flows out of the housing 100 from the slot. The inclined angle is referenced to Figure 15 As shown in , it can be specifically set to 10°.

[0074] In one embodiment, reference Figure 2 and Figure 6 As shown in the figure, the other end of the shell 100 along the third direction is provided with a first groove 117 and a second groove 118, and the first groove 117 and the second groove 118 are arranged at intervals along the first direction, wherein the first groove 117 is connected to the first heat dissipation channel 1041, and the second mounting notch 116 is connected to the second heat dissipation channel 1042.

[0075] By providing the first groove 117 and the second groove 118 at the other end of the shell 100 along the third direction, on the one hand, the weight of the shell 100 can be reduced, and on the other hand, the heat in the first heat dissipation channel 1041 and the second heat dissipation channel 1042 can be naturally dissipated. The structure in which the first mounting notch 115, the first heat dissipation channel 1041, and the first groove 117 are connected along the third direction is also conducive to more quickly dissipating the heat in the first heat dissipation channel 1041 out of the shell 100. The structure in which the second mounting notch 116, the second heat dissipation channel 1042, and the second groove 118 are connected along the third direction is also conducive to more quickly dissipating the heat in the second heat dissipation channel 1042 out of the shell 100.

[0076] Optional, reference Figure 2 、 Figure 6 、 Figure 9 As shown in FIG, the first mounting notch 115, the second mounting notch 116, and the first groove 117 and the second groove 118 are all provided with a protective cover 500, and the protective cover 500 is provided with a plurality of ventilation holes 510. By installing the protective cover 500, dustproof effect can be achieved without affecting heat dissipation.

[0077] In one embodiment, the first heat pipe 310 and the second heat pipe 320 of the second heat dissipation assembly are L-shaped heat pipes, so that a portion of the first heat pipe 310 can be clamped between the first heat dissipation portion 113 and the heat dissipation element 230, and the other portion is fixed to the first heat dissipation fin 111, and a portion of the second heat pipe 320 can be clamped between the second heat dissipation portion 114 and the heat dissipation element 230, and the other portion is fixed to the second heat dissipation fin 112.

[0078] Specifically, refer to Figure 3 、 Figure 6 and Figure 10As shown in the figure, in the second direction, a second strip groove 1012 is provided on the surface of the first heat dissipation portion 113 and the second heat dissipation portion 114 facing away from the heat dissipation slot 1011, and a third strip groove 119 is provided on the inner wall at both ends of the housing 100 along the first direction; wherein, in the third direction, the second strip groove 1012 and the third strip groove 119 are directly opposite each other. This arrangement allows the first heat pipe 310 to be installed in the second strip groove 1012 of the first heat dissipation portion 113 and the third strip groove 119 on the inner wall at one end of the housing 100 along the first direction, and the second heat pipe 320 to be installed in the second strip groove 1012 of the second heat dissipation portion 114 and the third strip groove 119 on the inner wall at the other end of the housing 100 along the first direction.

[0079] It should be noted that the first heat sink 111 and the second heat sink 112 are specifically arranged on the outer walls at both ends of the shell 100 along the first direction, so that heat is transferred to the first heat sink 111 located on the outer wall through the first heat pipe 310 located on the inner wall, and then heat is transferred to the second heat sink 112 located on the outer wall through the second heat pipe 320 located on the inner wall.

[0080] Optionally, a plurality of first heat pipes 310 and a plurality of second heat pipes 320 are respectively provided, and the plurality of first heat pipes 310 and the plurality of second heat pipes 320 are respectively evenly spaced along the third direction; a plurality of first heat sinks 111 and the plurality of second heat sinks 112 are respectively provided, and the plurality of first heat sinks 111 and the plurality of second heat sinks 112 are respectively evenly spaced along the second direction to improve heat dissipation efficiency and heat dissipation uniformity.

[0081] In one embodiment, reference Figure 1 As shown in , the shell 100 includes a frame body 110 and a first cover body 120 and a second cover body 130, wherein the frame body 110 includes a first side frame body 1101 and a second side frame body 1102 which are opposite to and spaced apart in a first direction, an upper frame body 1103 and a lower frame body 1104 which are opposite to and spaced apart in a third direction, and the first side frame body 1101, the second side frame body 1102, the upper frame body 1103 and the lower frame body 1104 are arranged to form a rectangular frame with a cavity; the first cover body 120 and the second cover body 130 are installed at the two end openings of the frame body 110 along the second direction, and the frame body 110 and the first cover body 120 and the second cover body 130 are arranged to form a rectangular shell body 100.

[0082] It should be noted that in the above embodiment, the first heat sink 111 and the second heat sink 112 are respectively provided on the outer walls of the first side frame 1101 and the second side frame 1102 of the frame 110, the first heat dissipation portion 113 is provided on the inner wall of the first side frame 1101 and extends into the interior of the frame 110, and the second heat dissipation portion 114 is provided on the inner wall of the second side frame 1102 and extends into the interior of the frame 110. In the above embodiment, the first mounting notch 115 and the second mounting notch 116 are provided on the upper frame 1103 of the frame 110, and the first groove 117 and the second groove 118 are provided on the lower frame 1104 of the frame 110.

[0083] It should also be noted that the housing 100 is a housing 100 of a heat dissipation structure and is also a housing 100 of an electronic device. Various electronic components of the electronic device are installed inside the housing 100 .

[0084] The following combination Figure 9 、 Figures 12 to 18 The electronic components of the electronic device are shown to exemplify specific size parameters of the heat dissipation structure of the electronic device.

[0085] (1) According to the number n1 of T / R components 900 arranged along the first direction, the number n2 of T / R components 900 arranged along the third direction, the spacing dx between units arranged along the first direction, and the spacing dy between units arranged along the third direction, the outer dimensions of the heat sink 230 (the length L1 along the first direction, the width L2 along the third direction) are determined to satisfy L1>(n1-1)·dx, L2>(n2-1)·dy; according to the thickness d1 of the third heat pipe 232 along the second direction and the thickness d2 of the cover plate 233 along the second direction, the thickness L3 of the heat sink 230 along the second direction is determined to satisfy L3=d1+d2+δ1, where δ1 is 5-7mm.

[0086] (2) According to Determine the length L4 of the first and second fans 410 and 420 along the first direction, their width L4 along the second direction, and their thickness L5 along the third direction. Determine the number n3 of third heat pipes 232 based on n3 = P1 / x1, where q is the air volume required by the first and second fans 410 and 420, P1 is the sum of the thermal powers of the T / R assembly 900, signal processing module 600, wave control module 800, and RF module 700, c is the specific heat of air, ρ is the air density, Δt is the design temperature difference between the inlet and outlet, and x1 is the maximum heat dissipation of a single heat pipe. It should be noted that the parameters of the first and second fans 410 and 420 are identical.

[0087] (3) The outer dimensions L6 and L7 of the frame 110 are determined based on the length L1 and width L2 of the heat sink 230, the length and width L4, and the thickness L5 of the first fan 410 and the second fan 420, and must satisfy L1<L6<L1+2×L4 and L7>L2+2×L5, where L6 is the dimension of the frame 110 along the first direction, and L7 is the dimension of the frame 110 along the third direction.

[0088] (4) The fluid simulation software FLoEFD is used to optimize the thickness d3 of the third heat sink 1131 and the fourth heat sink 1141 along the first direction, the number n4, the gap δ3 along the first direction, and the height h3 along the second direction, as well as the thickness d3 of the fifth heat sink 211 and the sixth heat sink 221 along the first direction, the number n4, the gap δ3 along the first direction, and the height h2 along the second direction to determine the size L9 of the first heat dissipation channel 1041 and the size L9 along the second direction. 10 , must satisfy L9=n4×d3+δ3×(n4+1) and L 10 =h2+h3+δ2, where δ2 is 1-3 mm. It should be noted that the third heat sink 1131 and the fourth heat sink 1141 have the same parameters; the fifth heat sink 211 and the sixth heat sink 221 have the same parameters; and the fifth heat sink 211, the sixth heat sink 221, the third heat sink 1131, and the fourth heat sink 1141 have the same parameters in terms of thickness along the first direction and gaps along the first direction; and the first heat dissipation channel 1041 and the second heat dissipation channel 1042 have the same parameters.

[0089] (5) The fluid simulation software FLoEFD is used to optimize the thickness d5 of the first heat sink 111 and the second heat sink 112 along the second direction, the number n5, the gap δ4 along the second direction, and the height h4; the number n6 of the first heat pipe 310 and the second heat pipe 320 is determined according to n6=P2x2, where x2 is the maximum heat dissipation of a single first heat pipe 310 or second heat pipe 320, and P2 is the sum of the thermal powers of the T / R assembly 900 and the wave control module 800. It should be noted that the parameters of the first heat pipe 310 and the second heat pipe 320 are set to the same. It should be noted that the parameters of the first heat sink 111 and the second heat sink 112 are set to the same.

[0090] (6) According to the height L of the signal processing module 600 along the second direction 11 , the height L of the RF module 700 along the second direction 12 , determine the thickness L8 of the frame 110 along the second direction, which must meet Where n is a positive integer and λ is the wavelength of the electronic device.

[0091] (7) The number n7 of the ventilation holes 510 of the protective cover 500 and the aperture d4 of the ventilation holes 510 satisfy the relationship

[0092] Specific examples are as follows:

[0093] The heat dissipation of the T / R assembly 900 is 0.9W, n1=16, n2=16, dx=20mm, dy=20mm; the heat dissipation of the signal processing module 600 is 35W, L 11 =15.5mm; the heat dissipation of the wave control module 800 is 80W; the heat dissipation of the RF module 700 is 28W, L 12 =33mm.

[0094] The size L4 of the first fan 410 and the second fan 420 determined after modeling and optimization using the fluid simulation software FLoEFD is 80 mm, and the thickness L5 is 25.4 mm.

[0095] The main parameters of the frame 110 are: L6=645mm, L7=450mm, L8=105mm, d3=1.2mm, δ3=2.7mm, n4=17mm, h3=17.25mm, h4=9mm, d2=1.5mm, δ4=4.5mm, n5=11mm.

[0096] The main parameters of the heat sink 230 are: L1 = 560 mm, L2 = 370 mm, L3 = 10.5 mm, d1 = 3 mm, d2 = 1 mm, and δ1 = 5.5 mm.

[0097] The main parameters of the first heat dissipation plate 210 and the second heat dissipation plate 220 are: h2=7.25 mm.

[0098] The main parameters of the first heat dissipation channel 1041 and the second heat dissipation channel 1042 are: L9=69mm, L 10 =25.5mm.

[0099] The main parameters of the protective cover 500 are: n7 = 4.5 mm;

[0100] The main parameters of the first heat pipe 310 and the second heat pipe 320 are: n6=32, x2=15w.

[0101] Based on the above parameters, thermal simulation of electronic equipment is carried out. Figures 19 to 23The simulation results are as follows: the maximum temperature of the T / R component 900 is 63.9°C, the maximum temperature of the signal processing module 600 is 60.9°C, the maximum temperature of the beam control module 800 is 63.7°C, and the maximum temperature of the RF module 700 is 60.9°C; among them, the ambient temperature is 55°C, and the allowable temperature of the T / R component 900 is required to be ≤85°C, the allowable temperature of the signal processing module 600, the beam control module 800, and the RF module 700 is required to be ≤75°C, the temperature consistency of the T / R component 900 is ≤10°C, and the temperature consistency of the T / R component 900 is about 4°C, which meets the use requirements.

[0102] This exemplary embodiment also provides an electronic device, referring to Figures 1 to 11 As shown in , the electronic device includes a signal processing module 600, a radio frequency module 700, a wave control module 800 and a T / R component 900 and the heat dissipation structure of the electronic device in any of the above embodiments;

[0103] The signal processing module 600 and the radio frequency module 700 are respectively mounted on the first heat dissipation plate 210 and the second heat dissipation plate 220 of the heat dissipation structure;

[0104] The T / R assembly 900 is mounted on one side surface of the heat sink 230 of the heat dissipation structure along the second direction, and the wave control module 800 is mounted on the other side surface of the heat sink 230 along the second direction.

[0105] In the embodiments of the present disclosure, through the heat dissipation structure of the electronic device and the structural design of the signal processing module 600, radio frequency module 700, wave control module 800 and T / R component 900 of the electronic device, the various parts of the electronic device can be installed compactly, which is conducive to the miniaturization design of the electronic device; and in terms of heat dissipation, not only can the signal processing module 600, radio frequency module 700, wave control module 800 and T / R component 900 in the electronic device be effectively cooled, but the heat dissipation paths do not interfere with each other, thereby improving the heat dissipation effect.

[0106] In one embodiment, multiple T / R components 900 are provided, and the multiple T / R components 900 are arranged in an array on the heat dissipation substrate 231. The multiple third heat pipes 232 can provide efficient and stable heat dissipation effects for the multiple T / R components 900 arranged in an array.

[0107] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A heat dissipation structure of an electronic device, characterized in that: include: A housing having an accommodating cavity, wherein the housing is provided with a first heat sink and a second heat sink at two ends along a first direction, respectively, and a first heat dissipation portion and a second heat dissipation portion extending into the accommodating cavity at two ends along the first direction, respectively; A first heat dissipation assembly, comprising a first heat dissipation plate, a second heat dissipation plate, and a heat dissipation element, wherein the first heat dissipation plate and the second heat dissipation plate are respectively arranged in a one-to-one correspondence with the first heat dissipation portion and the second heat dissipation portion to form a first heat dissipation channel and a second heat dissipation channel. The two sides of the heat dissipation element along the first direction are respectively connected to the first heat dissipation portion and the second heat dissipation portion. One side surface of the heat dissipation element along the second direction is used for mounting a T / R assembly, and the other side surface is used for mounting a wave control module. The first heat dissipation plate and the second heat dissipation plate are used for mounting a signal processing module and a radio frequency module. a second heat dissipation assembly comprising a first heat pipe and a second heat pipe, wherein a portion of the first heat pipe is sandwiched between the first heat dissipation portion and the heat dissipation element, and another portion is bent and extended to the first heat dissipation fin; a portion of the second heat pipe is sandwiched between the second heat dissipation portion and the heat dissipation element, and another portion is bent and extended to the second heat dissipation fin; The third heat dissipation component is provided with a first fan and a second fan on the shell, the first fan is used to dissipate heat to the first heat dissipation channel, and the second fan is used to dissipate heat to the second heat dissipation channel; wherein the first direction is perpendicular to the second direction.

2. The heat dissipation structure of an electronic device according to claim 1, wherein: The heat dissipation element includes a heat dissipation substrate, a third heat pipe and a cover plate. The two ends of the heat dissipation substrate along the first direction are respectively connected to the first heat dissipation part and the second heat dissipation part, and one side surface of the heat dissipation substrate along the second direction is used to install the T / R component. The cover plate is arranged on the other side surface of the heat dissipation substrate along the second direction for installing the wave control system; wherein, the third heat pipe is clamped between the heat dissipation substrate and the cover plate and extends along the first direction.

3. The heat dissipation structure of an electronic device according to claim 1, wherein: A first mounting slot and a second mounting slot are formed at one end of the housing along the third direction. The first mounting slot and the second mounting slot are spaced apart along the first direction. The first mounting slot communicates with the first heat dissipation channel, and the first fan is disposed in the first mounting slot. The second mounting slot communicates with the second heat dissipation channel, and the second fan is disposed in the second mounting slot. The third direction is the height direction of the shell and is perpendicular to both the first direction and the second direction.

4. The heat dissipation structure of an electronic device according to claim 3, characterized in that: The first heat dissipation portion and the second heat dissipation portion are both provided with a heat dissipation slot opening toward the second direction and extending along the third direction, one end of the heat dissipation slot of the first heat dissipation portion along the third direction is connected to the first mounting slot, and the other end of the heat dissipation slot of the second heat dissipation portion along the third direction is connected to the second mounting slot; Wherein, the first heat dissipation plate is arranged at the notch of the heat dissipation slot of the first heat dissipation portion to enclose the first heat dissipation portion to form the first heat dissipation channel; The second heat dissipation plate is arranged at the notch of the heat dissipation slot of the second heat dissipation portion to form the second heat dissipation channel together with the second heat dissipation plate.

5. The heat dissipation structure of an electronic device according to claim 4, characterized in that: A third heat sink and a fourth heat sink are respectively provided on the first heat sink and the second heat sink, and a fifth heat sink and a sixth heat sink are respectively provided on the first heat sink and the second heat sink; The third heat sink and the fifth heat sink are accommodated in the heat sink of the first heat sink and extend along the third direction, and the fourth heat sink and the sixth heat sink are accommodated in the heat sink of the second heat sink and extend along the third direction.

6. The heat dissipation structure of an electronic device according to claim 5, characterized in that: Along the second direction, the sum of the length of the third heat sink and the length of the fifth heat sink is less than the groove depth of the heat dissipation groove of the first heat dissipation part, and the sum of the length of the fourth heat sink and the length of the sixth heat sink is less than the groove depth of the heat dissipation groove of the second heat dissipation part.

7. The heat dissipation structure of an electronic device according to claim 4, characterized in that: The first mounting slot and the second mounting slot both include a bottom wall and a side wall arranged around the outer periphery of the bottom wall. The bottom wall is provided with a hole structure connected to the heat dissipation slot, and from the hole structure of the bottom wall toward the side wall, the inner surface of the bottom wall gradually moves away from the heat dissipation slot.

8. The heat dissipation structure of an electronic device according to any one of claims 3 to 7, characterized in that: The other end of the housing along the third direction is provided with a first groove and a second groove, the first groove and the second groove are spaced apart along the first direction, wherein the first groove is connected to the first heat dissipation channel, and the second installation notch is connected to the second heat dissipation channel.

9. The heat dissipation structure of an electronic device according to claim 6, wherein: The first installation notch, the second installation notch, and the notches of the first groove and the second groove are all provided with protective covers, and the protective covers are provided with a plurality of ventilation holes.

10. An electronic device, characterized in that: A heat dissipation structure of an electronic device comprising a signal processing module, a radio frequency module, a wave control module, a T / R component, and any one of claims 1 to 9; Wherein, the signal processing module and the radio frequency module are respectively installed on the first heat dissipation plate and the second heat dissipation plate of the heat dissipation structure; The T / R assembly is mounted on one side surface of the heat sink of the heat dissipation structure along the second direction, and the wave control module is mounted on the other side surface of the heat sink along the second direction.

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