Heat dissipation structure and electronic device with same

Abstract

The embodiment of the invention provides a heat dissipation structure and an electronic device with the heat dissipation structure. Comprising a first surface and a second surface which are opposite; the heat dissipation plate comprises a third surface and a fourth surface which are opposite to each other, the second surface is opposite to the third surface, and the substrate and the heat dissipation plate are connected to form a cavity; the inlet and the outlet are positioned at two ends of the heat dissipation plate and are communicated with the cavity; the cavity comprises a first inner wall and a second inner wall, a flow dividing piece is arranged on the first inner wall and extends in the direction from the inlet to the outlet, and a heat dissipation piece is arranged on the second inner wall and extends towards the first inner wall; and the distance between the first inner wall and the second inner wall is gradually reduced in the direction from the inlet to the outlet. In the process that the heat exchange medium flows to the outlet from the inlet, the flow speed of the heat exchange medium can be gradually increased along with the gradual reduction of the space of the cavity, and then the heat exchange efficiency of the heat exchange medium and the part, close to the outlet side, of the base plate can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of power electronic devices, and in particular to a heat dissipation structure and an electronic device having the heat dissipation structure. Background Art

[0002] With the current explosive growth in production and sales of new energy vehicles, automotive inverter technology is developing at an increasingly rapid pace, and market demand is also increasing. Automotive inverters contain multiple electronic components. During operation, some of these components generate heat, which in turn causes heat loss and affects the performance of the inverter. Therefore, heat dissipation is necessary for these electronic components.

[0003] In the thermal management system of the inverter, the above-mentioned devices are generally connected to a water-cooled heat dissipation component. Multiple devices are arranged in sequence along the flow direction of the coolant in the water-cooled heat dissipation component. Through the flow of coolant inside the water-cooled heat dissipation component, heat exchange is carried out between the coolant and the devices, thereby achieving heat dissipation and cooling of the devices.

[0004] However, as the coolant flows, the temperature of the coolant will increase due to heat exchange with the front device, which reduces the heat exchange efficiency between the coolant and the rear device, affecting the heat dissipation effect of the water-cooled heat dissipation component on the rear device, thereby affecting the performance of the inverter. Summary of the Invention

[0005] An embodiment of the present application provides a heat dissipation structure and an electronic device having the heat dissipation structure. In the process of a heat exchange medium flowing from an inlet to an outlet, as the space of the cavity gradually decreases, the flow rate of the heat exchange medium will gradually increase, thereby improving the heat exchange efficiency between the heat exchange medium and the portion of the substrate close to the outlet side.

[0006] In a first aspect, an embodiment of the present application provides a heat dissipation structure, comprising:

[0007] A substrate, wherein the substrate includes a first surface and a second surface opposite to each other along a thickness direction of the substrate;

[0008] The heat dissipation plate includes a third surface and a fourth surface opposite to each other along the thickness direction of the heat dissipation plate, and the second surface is opposite to the third surface, and the substrate and the heat dissipation plate are connected to form a cavity;

[0009] an inlet and an outlet, located at both ends of the heat dissipation plate and connected to the cavity;

[0010] The cavity includes a first inner wall and a second inner wall relative to each other. A diverter is provided on the first inner wall, and the diverter extends in the direction from the inlet to the outlet. A heat sink is provided on the second inner wall, and the heat sink extends toward the first inner wall. Along the direction from the inlet to the outlet, the distance between the first inner wall and the second inner wall gradually decreases.

[0011] In a possible embodiment, along the direction from the inlet to the outlet, the cavity includes at least two sub-cavities arranged in sequence;

[0012] The average spacing of the sub-cavities close to the outlet is smaller than the average spacing of the sub-cavities close to the inlet; the average spacing of any sub-cavity is the average spacing between the corresponding first inner wall and the second inner wall.

[0013] In a possible implementation manner, the distance between any sub-cavities remains unchanged or gradually increases or decreases.

[0014] In a possible implementation, the thickness of the substrate gradually increases from the inlet to the outlet, so that the distance between the first inner wall and the second inner wall gradually decreases.

[0015] In a possible implementation, the thickness of the heat dissipation plate gradually increases from the inlet to the outlet, so that the distance between the first inner wall and the second inner wall gradually decreases.

[0016] In a possible implementation, the flow dividing member forms fluid channels on both sides along a first direction, and the first direction is perpendicular to an extension direction of the flow dividing member.

[0017] In a possible embodiment, the diverter includes a plurality of spoilers, which are respectively arranged on both sides of the diverter along the first direction, and are arranged at intervals along the direction from the inlet to the outlet.

[0018] In one possible embodiment, the flow dividing member has a first end surface and a second end surface opposite to each other along the direction from the inlet to the outlet;

[0019] A first convex portion is provided at the first end surface, and a cross-sectional area of ​​the first convex portion in the first direction gradually increases from the inlet to the outlet;

[0020] And / or, a second convex portion is provided at the second end surface, and a cross-sectional area of ​​the second convex portion in the first direction gradually decreases from the inlet to the outlet.

[0021] In a possible embodiment, the first inner wall is formed by at least a portion of the heat dissipation plate being recessed in a direction away from the substrate, and the first inner wall is connected to the third surface of the heat dissipation plate;

[0022] The second inner wall is formed by at least a portion of the base plate being recessed in a direction away from the heat dissipation plate, and the second inner wall is communicated with the second surface of the base plate.

[0023] In a second aspect, an embodiment of the present application provides an electronic device comprising a heat dissipation structure as described above and a plurality of power modules, wherein the plurality of power modules are located on the first surface of the substrate and are arranged at intervals along the direction from the inlet to the outlet and / or the first direction, and the first direction is perpendicular to the direction from the inlet to the outlet.

[0024] In a possible implementation, the power module includes a first power unit and a second power unit, and the heat generated by the first power unit is higher than the heat generated by the second power unit;

[0025] The first power unit is located on a side of the second power unit close to the inlet.

[0026] In a possible implementation, the first power unit is a silicon carbide device, and the second power unit is a silicon device.

[0027] In a possible implementation, the position of the first power unit and the position of the second power unit both correspond to at least one heat sink.

[0028] In a possible implementation, a first number of heat sinks are corresponding to the position of the first power unit, a second number of heat sinks are corresponding to the position of the second power unit, and the first number is greater than the second number.

[0029] An embodiment of the present application provides a heat dissipation structure and an electronic device having the heat dissipation structure. In the direction from the inlet to the outlet, the distance between the first inner wall and the second inner wall tends to gradually decrease, so that in the process of the heat exchange medium flowing from the inlet to the outlet, as the space of the cavity gradually decreases, the flow rate of the heat exchange medium will gradually accelerate, thereby improving the heat exchange efficiency between the heat exchange medium and the part of the substrate close to the outlet side, so that the heat exchange medium can effectively dissipate heat from the part of the substrate close to the outlet side. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0031] Figure 1 Schematic diagram of an electronic device provided in some embodiments of the present application;

[0032] Figure 2 A schematic diagram of a substrate provided in some embodiments of this application;

[0033] Figure 3 A schematic diagram of a heat dissipation plate provided in some embodiments of the present application;

[0034] Figure 4 A first cross-sectional view of an electronic device provided in some embodiments of the present application;

[0035] Figure 5 A cross-sectional view of a heat dissipation structure provided in some embodiments of the present application;

[0036] Figure 6 A second cross-sectional view of the electronic device provided in some embodiments of the present application, with the heat sink and the diverter hidden;

[0037] Figure 7 A partial cross-sectional view of the substrate and the heat sink provided in some embodiments of the present application after connection;

[0038] Figure 8 A partial cross-sectional view of a heat dissipation plate provided in some embodiments of the present application;

[0039] Figure 9 A partial cross-sectional view of a first substrate provided in some embodiments of the present application;

[0040] Figure 10 A partial cross-sectional view of a second substrate provided in some embodiments of the present application;

[0041] Figure 11 This is a top view of an electronic device provided in some embodiments of the present application.

[0042] Reference numerals:

[0043] 100, substrate; 101, first surface; 102, second surface;

[0044] 200, heat sink; 201, third surface; 202, fourth surface; 210, inlet; 211, first connecting pipe; 220, outlet; 221, second connecting pipe;

[0045] 300, cavity; 310, first inner wall; 311, first concave surface; 312, second concave surface; 313, third concave surface; 320, second inner wall; 320a, fourth concave surface; 320b, fifth concave surface; 320c, sixth concave surface; 321, heat sink; 330, fluid channel; 331, first sub-fluid channel; 332, second sub-fluid channel; 340, sub-cavity; 341, first sub-cavity; 342, second sub-cavity; 343, third sub-cavity;

[0046] 400, flow divider; 410, flow spoiler; 420, first end surface; 421, first protrusion; 421a, first guide surface; 421b, second guide surface; 430, second end surface; 431, second protrusion; 431a, third guide surface; 431b, fourth guide surface;

[0047] 500, power module; 510, first power unit; 520, second power unit.

[0048] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0049] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0050] The present application provides a heat dissipation structure and an electronic device having the heat dissipation structure. In the direction from the inlet to the outlet, the distance between the first inner wall and the second inner wall tends to gradually decrease, so that in the process of the heat exchange medium flowing from the inlet to the outlet, as the space of the cavity gradually decreases, the flow rate of the heat exchange medium will gradually accelerate, thereby improving the heat exchange efficiency between the heat exchange medium and the part of the substrate close to the outlet side, so that the heat exchange medium can effectively dissipate heat to the part of the substrate close to the outlet side.

[0051] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0052] First, see Figure 1-Figure 2 and Figure 4 As shown, an embodiment of the present application provides a heat dissipation structure, comprising a substrate 100 and a heat dissipation plate 200; along the thickness direction X of the substrate 100, the substrate 100 comprises a first surface 101 and a second surface 102 opposite to each other; along the thickness direction X of the heat dissipation plate 200, the heat dissipation plate 200 comprises a third surface 201 and a fourth surface 202 opposite to each other. The second surface 102 of the substrate 100 is opposite to and cooperates with the third surface 201 of the heat dissipation plate 200, so that the substrate 100 and the heat dissipation plate 200 jointly define a cavity 300. See Figure 3 As shown, an inlet 210 and an outlet 220 are also provided on the heat sink 200, and the inlet 210 and the outlet 220 are respectively located at the two ends of the fourth surface 202 of the heat sink 200. The inlet 210 and the outlet 220 are both connected to the cavity 300. The inlet 210 is used to allow an external heat exchange medium to flow into the cavity 300, and the outlet 220 is used to allow the heat exchange medium in the cavity 300 to flow out of the cavity 300. The heat exchange medium here can be a gas medium, a liquid medium, or a gas-liquid mixed medium. When the heat exchange medium is in the cavity 300, the heat exchange medium can exchange heat with at least one of the substrate 100 and the heat sink 200. In order to clearly describe a heat dissipation structure of an embodiment of the present application, the following description takes heat exchange between a heat exchange medium and the substrate 100 as an example.

[0053] It can be understood that when external devices, especially power devices, are used in conjunction with the heat dissipation structure of the embodiment of the present application, for example, the first surface 101 of the substrate 100 is provided to thermally conduct the external device so that the heat of the external device can be transferred to the substrate 100, and the heat exchange medium in the cavity 300 can exchange heat with the substrate 100, thereby taking away the heat of the substrate 100, so that the temperature of the substrate 100 is reduced, and then the substrate 100 can continuously absorb the heat of the external device, thereby achieving the effect of continuous heat dissipation of the external device.

[0054] Further, see Figure 2-Figure 3 and Figures 8-10 As shown, along the thickness direction X of the substrate 100, the aforementioned cavity 300 includes a first inner wall 310 and a second inner wall 320 relative to each other, wherein at least a portion of the third surface 201 of the heat dissipation plate 200 forms the first inner wall 310, and at least a portion of the second surface 102 of the substrate 100 forms the second inner wall 320; the aforementioned inlet 210 and outlet 220 are both connected to the third surface 201 of the heat dissipation plate 200, that is, the inlet 210 and outlet 220 are both connected to the first inner wall 310, so that the inlet 210 and outlet 220 both remain connected to the cavity 300.

[0055] Further, see Figure 3 and Figure 5 As shown, a diverter 400 is provided on the first inner wall 310. The diverter 400 extends in a long strip shape from the inlet 210 to the outlet 220. When the heat exchange medium flows into the cavity 300 through the inlet 210, the diverter 400 can divert the heat exchange medium so that the heat exchange medium is diverted and directed to the outlet 220 through the predetermined fluid channel 330. This allows the heat exchange medium to specifically exchange heat with the corresponding portions of the substrate 100 and the heat sink 200 and the fluid channel 330. The diverted heat exchange medium has a larger contact area with the substrate 100 and the heat sink 200, thereby improving the efficiency of the heat exchange between the heat exchange medium, the substrate 100 and the heat sink 200.

[0056] Further, see Figure 2 and Figure 4-Figure 5As shown, a heat sink 321 is provided on the second inner wall 320. Along the thickness direction X of the substrate 100, the heat sink 321 has a first end and a second end that are opposite each other. The first end of the heat sink 321 is connected to the second inner wall 320, and the second end of the heat sink 321 extends toward the first inner wall 310. When a heat exchange medium is in the cavity 300, the second end of the heat sink 321 can extend into the heat exchange medium, allowing the heat exchange medium to exchange heat with the substrate 100 not only through the second inner wall 320 but also through the heat sink 321. It is understood that the heat sink 321 provided on the second inner wall 320 can further expand the contact area with the heat exchange medium, thereby improving the heat exchange efficiency between the heat exchange medium and the substrate 100.

[0057] It is worth mentioning that in the process of the heat exchange medium flowing from the inlet 210 to the outlet 220, the heat sink 321 can block the flow of the heat exchange medium to form a turbulent effect. Specifically, the heat exchange medium will impact the heat sink 321, thereby allowing the heat exchange medium to further diffuse in the cavity 300 and improve the fluidity of the heat exchange medium. At the same time, the part of the heat exchange medium close to the first inner wall 310 side will surge toward the second inner wall 320, which can improve the uniformity of the heat exchange medium's own temperature, thereby improving the heat exchange efficiency between the heat exchange medium and the substrate 100.

[0058] In the examples of this application, see Figure 4 and Figure 6-Figure 7 As shown, the distance between the first inner wall 310 and the second inner wall 320 gradually decreases along the direction from the inlet 210 to the outlet 220. That is, in the thickness direction X of the substrate 100, the height dimension of the cavity 300 gradually decreases, so that the space of the cavity 300 gradually decreases from the inlet 210 to the outlet 220. It can be understood that as the heat exchange medium flows from the inlet 210 to the outlet 220, the temperature of the heat exchange medium gradually increases as it exchanges heat with the substrate 100. This causes the heat exchange efficiency between the heat exchange medium and the portion of the substrate 100 near the outlet 220 to decrease compared to the heat exchange efficiency between the heat exchange medium and the portion of the substrate 100 near the inlet 210, resulting in poor heat exchange efficiency between the heat exchange medium and the portion of the substrate 100 near the outlet 220. In the embodiment of the present application, during the process of the heat exchange medium flowing from the inlet 210 to the outlet 220, as the space of the cavity 300 gradually decreases, the flow rate of the heat exchange medium will gradually accelerate, thereby improving the heat exchange efficiency between the heat exchange medium and the part of the substrate 100 close to the outlet 220 side, so that the heat exchange medium can effectively dissipate heat to the part of the substrate 100 close to the outlet 220 side.

[0059] Further, see Figure 1As shown, in the embodiment of the present application, a first connecting tube 211 and a second connecting tube 221 are provided on the fourth surface 202 of the heat dissipation plate 200, wherein the first connecting tube 211 is connected to the inlet 210, and the second connecting tube 221 is connected to the outlet 220, so that the inlet 210 can be connected to the external water supply pipe through the first connecting tube 211, and the outlet 220 can be connected to the external water outlet pipe through the second connecting tube 221.

[0060] In some embodiments, see Figure 6 and Figure 7 As shown, the chamber 300 includes at least two sub-chambers 340 , and the at least two sub-chambers 340 are arranged in sequence along the direction from the inlet 210 to the outlet 220 .

[0061] Furthermore, the average spacing of the sub-cavities 340 near the outlet 220 is smaller than the average spacing of the sub-cavities 340 near the inlet 210, wherein the average spacing of the sub-cavities 340 refers to the average spacing between the first inner wall 310 and the second inner wall 320 corresponding to the sub-cavity 340.

[0062] It is understood that, along the direction from the inlet 210 to the outlet 220, the spacing between the first inner wall 310 and the second inner wall 320 corresponding to each sub-cavity 340 may vary regularly or irregularly. Therefore, the first inner wall 310 and the second inner wall 320 corresponding to each sub-cavity 340 have an average spacing. When the average spacing between the sub-cavities 340 is large, the flow rate of the heat exchange medium in the corresponding sub-cavity 340 is slower, and when the average spacing between the sub-cavities 340 is small, the flow rate of the heat exchange medium in the corresponding sub-cavity 340 is faster. Therefore, in the embodiment of the present application, along the direction from the inlet 210 to the outlet 220, the heat exchange medium will flow through at least two sub-cavities 340 in sequence, and the average spacing between the sub-cavities 340 will gradually decrease, so that the flow rate of the heat exchange medium will gradually increase, thereby enabling the heat exchange medium to effectively maintain the heat exchange efficiency with the multiple sub-cavities 340.

[0063] In some embodiments, the distance between any one of the at least two sub-cavities 340 along the direction from the inlet 210 to the outlet 220 may remain constant, that is, the distance between the corresponding first inner wall 310 and the second inner wall 320 of any one of the sub-cavities 340 along the direction from the inlet 210 to the outlet 220 remains constant. Alternatively, the distance between any one of the at least two sub-cavities 340 along the direction from the inlet 210 to the outlet 220 may gradually increase, that is, the distance between the corresponding first inner wall 310 and the second inner wall 320 of any one of the sub-cavities 340 along the direction from the inlet 210 to the outlet 220 gradually increases. Alternatively, the distance between any one of the at least two sub-cavities 340 along the direction from the inlet 210 to the outlet 220 may gradually decrease, that is, the distance between the corresponding first inner wall 310 and the second inner wall 320 of any one of the sub-cavities 340 along the direction from the inlet 210 to the outlet 220 gradually decreases.

[0064] For example, see Figure 7As shown, along the direction from the inlet 210 to the outlet 220, the cavity 300 includes a first sub-cavity 341, a second sub-cavity 342, and a third sub-cavity 343 arranged in sequence. Specifically, along the direction from the inlet 210 to the outlet 220, the first inner wall 310 and the second inner wall 320 corresponding to the first sub-cavity 341 remain parallel to each other, the spacing between the first inner wall 310 and the second inner wall 320 corresponding to the second sub-cavity 342 gradually increases, and the spacing between the first inner wall 310 and the second inner wall 320 corresponding to the third sub-cavity 343 gradually decreases. Furthermore, the average spacing between the first sub-cavity 341 is greater than the average spacing between the second sub-cavity 342, and the average spacing between the second sub-cavity 342 is greater than the average spacing between the third sub-cavity 343. When the heat exchange medium flows from the inlet 210 to the outlet 220, the heat exchange medium will pass through the first sub-cavity 341, the second sub-cavity 342 and the third sub-cavity 343 in sequence, and the flow rate of the heat exchange medium in the first sub-cavity 341 is smaller than the flow rate of the heat exchange medium in the second sub-cavity 342, and the flow rate of the heat exchange medium in the second sub-cavity 342 is smaller than the flow rate of the heat exchange medium in the third sub-cavity 343; after the heat exchange medium exchanges heat with the substrate 100 corresponding to the first sub-cavity 341, the temperature of the heat exchange medium will increase. However, as the heat exchange medium enters the second sub-cavity 342, the flow rate of the heat exchange medium accelerates, effectively maintaining the heat exchange efficiency between the heat exchange medium and the substrate 100 corresponding to the second sub-cavity 342. This allows the heat exchange efficiency of the heat exchange medium in the second sub-cavity 342 to remain within a relatively small fluctuation range compared to the heat exchange efficiency of the heat exchange medium in the first sub-cavity 341. Specifically, the heat exchange efficiency of the heat exchange medium in the second sub-cavity 342 can be higher or lower than the heat exchange efficiency of the heat exchange medium in the first sub-cavity 341. Similarly, the heat exchange efficiency of the heat exchange medium in the third sub-cavity 343 to remain within a relatively small fluctuation range compared to the heat exchange efficiency of the heat exchange medium in the second sub-cavity 342, thereby enabling the heat exchange efficiency of the heat exchange medium to be maintained stable in the first sub-cavity 341, the second sub-cavity 342, and the third sub-cavity 343.

[0065] In some embodiments, the thickness of the substrate 100 gradually increases from the inlet 210 to the outlet 220. Figure 9 and Figure 10 As shown, along the direction from the inlet 210 to the outlet 220, the thickness of the portion of the substrate 100 corresponding to the cavity 300 tends to gradually increase, so that the second inner wall 320 tends to gradually approach the first inner wall 310, and the distance between the first inner wall 310 and the second inner wall 320 tends to gradually decrease, so that the space of the cavity 300 gradually decreases.

[0066] When the heat exchange medium flows from the inlet 210 to the outlet 220, as the space of the cavity 300 gradually decreases, the flow rate of the heat exchange medium will gradually increase, thereby improving the heat exchange efficiency between the heat exchange medium and the part of the substrate 100 close to the outlet 220, so that the heat exchange medium can effectively dissipate heat to the part of the substrate 100 close to the outlet 220.

[0067] In some embodiments, the thickness of the heat dissipation plate 200 gradually increases from the inlet 210 to the outlet 220. Figure 3-Figure 4 and Figure 6-Figure 8 As shown, along the direction from the inlet 210 to the outlet 220, the thickness of the portion of the heat dissipation plate 200 corresponding to the cavity 300 tends to gradually increase, so that the first inner wall 310 tends to gradually approach the second inner wall 320, and the distance between the first inner wall 310 and the second inner wall 320 tends to gradually decrease, so that the space of the cavity 300 gradually decreases.

[0068] When the heat exchange medium flows from the inlet 210 to the outlet 220, as the space of the cavity 300 gradually decreases, the flow rate of the heat exchange medium will gradually increase, thereby improving the heat exchange efficiency between the heat exchange medium and the part of the substrate 100 close to the outlet 220, so that the heat exchange medium can effectively dissipate heat to the part of the substrate 100 close to the outlet 220.

[0069] In some embodiments, by arranging a diverter 400 on the first inner wall 310, the diverter 400 can separate the cavity 300 so that fluid channels 330 can be formed on both sides of the diverter 400 respectively. Specifically, the diverter 400 forms fluid channels 330 on both sides in the first direction Z respectively, wherein the first direction Z is perpendicular to the extension direction Y of the diverter 400.

[0070] For example, see Figure 5As shown, along the first direction Z, a first sub-fluid channel 331 and a second sub-fluid channel 332 are formed on both sides of the diverter 400 respectively; when the heat exchange medium enters the cavity 300, under the diversion effect of the end of the diverter 400 close to the inlet 210, part of the heat exchange medium will enter the first sub-fluid channel 331 and flow to the outlet 220 through the first sub-fluid channel 331, and the other part of the heat exchange medium will enter the second sub-fluid channel 332 and flow to the outlet 220 through the second sub-fluid channel 332. In this process, the first sub-fluid channel 33 1 performs heat exchange with the corresponding part of the substrate 100, and the heat exchange medium in the second sub-fluid channel 332 performs heat exchange with the corresponding part of the substrate 100; when the heat exchange medium in the first sub-fluid channel 331 flows to the end of the diverter 400 close to the outlet 220, and the heat exchange medium in the second sub-fluid channel 332 flows to the end of the diverter 400 close to the outlet 220, the heat exchange medium in the first sub-fluid channel 331 can merge with the heat exchange medium in the second sub-fluid channel 332 and flow out of the cavity 300 from the outlet 220.

[0071] It can be understood that the setting of the diverter 400 can better divert the heat exchange medium and guide the diverted heat exchange medium to different fluid channels 330, so that the heat exchange medium can be targeted to perform heat exchange with the corresponding parts of the substrate 100. At the same time, the diverted heat exchange medium has a larger contact surface overall, which can improve the heat exchange efficiency between the heat exchange medium and the substrate 100.

[0072] In some embodiments, see Figure 3 and Figure 5 As shown, a plurality of spoilers 410 are provided on both sides of the diverter 400 along the first direction Z, and the plurality of spoilers 410 are arranged at intervals along the direction from the inlet 210 to the outlet 220 .

[0073] Exemplarily, the spoiler 410 is a protrusion protruding from the side wall of the diverter 400, and the protrusion extends in the thickness direction X of the heat dissipation plate 200 and is in the shape of a long strip; when the heat exchange medium in the first sub-fluid channel 331 flows toward the outlet 220, since the protrusion is in the flow path of the heat exchange medium, the protrusion can form a barrier to the heat exchange medium, and then the heat exchange medium will successively impact multiple protrusions in the process of flowing toward the outlet 220, thereby stirring the heat exchange medium, so that the protrusion can play a role in disturbing the flow of the heat exchange medium.

[0074] It can be understood that, in the process of the heat exchange medium impacting the spoiler 410, first, the flow direction of the heat exchange medium will change. Compared with the single flow direction from the inlet 210 to the outlet 220, the diversity and uncertainty of the flow direction of the heat exchange medium are increased, which can better improve the fluidity of the heat exchange medium and the uniformity of the temperature of the heat exchange medium itself, thereby improving the heat exchange efficiency between the heat exchange medium and the substrate 100. Secondly, the part of the heat exchange medium close to the heat sink 200 can surge toward the direction of the substrate 100, so that the heat exchange medium with a lower temperature at the bottom can be closer to the substrate 100, which can also improve the heat exchange efficiency between the heat exchange medium and the substrate 100.

[0075] Furthermore, the spoiler 410 of the embodiment of the present application has a semicircular cross-section along a direction perpendicular to the thickness direction X of the heat sink 200. This allows the spoiler 410 to improve the fluidity and temperature uniformity of the heat exchange medium while minimizing the impact on the flow rate of the heat exchange medium from the inlet 210 to the outlet 220. It should be noted that the spoiler 410 may also have other shapes, and the present application is not limited thereto.

[0076] In some embodiments, see Figure 3 and Figure 5 As shown, along the direction from the inlet 210 to the outlet 220 , the flow dividing member 400 has a first end surface 420 and a second end surface 430 opposite to each other, wherein the first end surface 420 is close to the inlet 210 , and the second end surface 430 is close to the outlet 220 .

[0077] In the embodiment of the present application, a first convex portion 421 is provided on the first end surface 420, and the cross-sectional area of ​​the first convex portion 421 in the first direction Z tends to gradually increase in the direction from the inlet 210 to the outlet 220. That is, the volume of the first convex portion 421 tends to gradually increase in the direction from the inlet 210 to the outlet 220. Through this design, a first guide surface 421a and a second guide surface 421b can be formed on the first convex portion 421, respectively. The end of the first guide surface 421a close to the inlet 210 is aligned with the end of the second guide surface 421b. The guide surface 421b is connected to the end close to the inlet 210, and the first guide surface 421a extends to the first sub-fluid channel 331 away from the end of the inlet 210, so that the first guide surface 421a can guide part of the heat exchange medium entering the chamber from the inlet 210 to the first sub-fluid channel 331, and the second guide surface 421b extends to the second sub-fluid channel 332 away from the end of the inlet 210, so that the second guide surface 421b can guide another part of the heat exchange medium entering the cavity 300 from the inlet 210 to the second sub-fluid channel 332.

[0078] It is understandable that, by disposing the first protrusion 421 on the first end surface 420 , the diversion efficiency of the heat exchange medium at the end of the diverter 400 close to the inlet 210 can be preferably improved.

[0079] Furthermore, in the embodiment of the present application, a second convex portion 431 is provided on the second end surface 430, and in the direction from the inlet 210 to the outlet 220, the cross-sectional area of ​​the second convex portion 431 in the first direction Z tends to gradually decrease, that is, in the direction from the inlet 210 to the outlet 220, the volume of the first convex portion 421 tends to gradually decrease. Through this design, a third guide surface 431a and a fourth guide surface 431b can be formed on the second convex portion 431, respectively, wherein the end of the third guide surface 431a close to the outlet 220 and the end of the fourth guide surface 431b close to the outlet 220 are aligned. The ends are connected, and the third guide surface 431a extends from the end of the outlet 220 to the first sub-fluid channel 331, so that the third guide surface 431a can guide the heat exchange medium in the first sub-fluid channel 331 to the outlet 220, and the fourth guide surface 431b extends from the end of the outlet 220 to the second sub-fluid channel 332, so that the fourth guide surface 431b can guide the heat exchange medium in the second sub-fluid channel 332 to the outlet 220, and then the heat exchange medium in the first sub-fluid channel 331 and the heat exchange medium in the second sub-fluid channel 332 merge and flow out of the cavity 300 through the outlet 220.

[0080] It should be noted that the first convex portion 421 is used to assist the diverter 400 in diverting the heat exchange medium, and the second convex portion 431 is used to assist the diverter 400 in converging the heat exchange medium. Therefore, the shapes of the first convex portion 421 and the second convex portion 431 are not limited in the embodiment of the present application. The first convex portion 421 and the second convex portion 431 can be specifically triangular prism-shaped, semi-cylindrical, or conical; accordingly, according to the different shapes of the first convex portion 421 and the second convex portion 431, the connection relationship between the first guide surface 421a and the second guide surface 421b can be various. , and the connection relationship between the third guide surface 431a and the fourth guide surface 431b can be various. For example, when the first protrusion 421 is triangular prism-shaped or semi-cylindrical, only the end of the first guide surface 421a close to the inlet 210 is connected to the end of the second guide surface 421b close to the inlet 210; when the first protrusion 421 is conical, only the end of the first guide surface 421a away from the inlet 210 is not connected to the end of the second guide surface 421b away from the inlet 210, so that the first guide surface 421a and the second guide surface 421b constitute the conical surface of the cone.

[0081] In some embodiments, the first inner wall 310 of the cavity 300 may be formed by at least a portion of the heat dissipation plate 200 being recessed in a direction away from the substrate 100 .

[0082] For example, see Figure 6 and Figure 7 As shown, along the direction from the inlet 210 to the outlet 220, the cavity 300 includes a first sub-cavity 341, a second sub-cavity 342 and a third sub-cavity 343 arranged in sequence, wherein, see Figure 3 、 Figure 7 and Figure 8 As shown, the portion of the heat dissipation plate 200 corresponding to the first sub-cavity 341 is recessed in a direction away from the substrate 100, so that a first concave surface 311 is formed on the third surface 201; the portion of the heat dissipation plate 200 corresponding to the second sub-cavity 342 is recessed in a direction away from the substrate 100, so that a second concave surface 312 is formed on the third surface 201; the portion of the heat dissipation plate 200 corresponding to the third sub-cavity 343 is recessed in a direction away from the substrate 100, so that a third concave surface 313 is formed on the third surface 201; the first concave surface 311, the second concave surface 312 and the third concave surface 313 form a first inner wall 310, and the first inner wall 310 can be connected to the third surface 201; the average depth of the first concave surface 311 on the heat dissipation plate 200 is greater than the average depth of the second concave surface 312 on the heat dissipation plate 200; and the average depth of the second concave surface 312 on the heat dissipation plate 200 is greater than the average depth of the third concave surface 313 on the heat dissipation plate 200.

[0083] As another example, see Figure 3 and Figure 6 As shown, the first concave surface 311 and the second concave surface 312 are respectively formed only at the positions corresponding to the heat dissipation plate 200 and the first sub-cavity 341 and the second sub-cavity 342, so that part of the third surface 201 corresponds to the third sub-cavity 343 and serves as the third concave surface 313, and then the first concave surface 311, the second concave surface 312 and part of the third surface 201 form a first inner wall 310, and the first inner wall 310 can be connected to the third surface 201, and the average depth of the first concave surface 311 on the heat dissipation plate 200 is greater than the average depth of the second concave surface 312 on the heat dissipation plate 200.

[0084] In some embodiments, the second inner wall 320 of the cavity 300 may be formed by at least a portion of the substrate 100 being recessed in a direction away from the heat dissipation plate 200 .

[0085] For example, participating Figure 6 and Figure 7 As shown, along the direction from the inlet 210 to the outlet 220, the cavity 300 includes a first sub-cavity 341, a second sub-cavity 342 and a third sub-cavity 343 arranged in sequence, wherein, see Figure 9As shown, the portion of the substrate 100 corresponding to the first sub-cavity 341 is recessed in a direction away from the heat dissipation plate 200, so that a fourth concave surface 320a is formed on the second surface 102. The portion of the substrate 100 corresponding to the second sub-cavity 342 is recessed in a direction away from the heat dissipation plate 200, so that a fifth concave surface 320b is formed on the second surface 102. The portion of the substrate 100 corresponding to the third sub-cavity 343 is recessed in a direction away from the heat dissipation plate 200, so that a sixth concave surface 320c is formed on the second surface 102. The fourth concave surface 320a, the fifth concave surface 320b and the sixth concave surface 320c form a second inner wall 320, and the second inner wall 320 can be connected to the second surface 102. The average depth of the fourth concave surface 320a on the substrate 100 is greater than the average depth of the fifth concave surface 320b on the substrate 100, and the average depth of the fifth concave surface 320b on the substrate 100 is greater than the average depth of the sixth concave surface 320c on the substrate 100.

[0086] As another example, see Figure 10 As shown, the fourth concave surface 320a and the fifth concave surface 320b are respectively formed only at the positions corresponding to the first sub-cavity 341 and the second sub-cavity 342 on the substrate 100, so that a portion of the second surface 102 corresponds to the third sub-cavity 343 and serves as the sixth concave surface 320c, and further, the fourth concave surface 320a, the fifth concave surface 320b and a portion of the second surface 102 form a second inner wall 320, and the second inner wall 320 can be connected to the second surface 102, and the average depth of the fourth concave surface 320a on the heat dissipation plate 200 is greater than the average depth of the fifth concave surface 320b on the heat dissipation plate 200.

[0087] On the second aspect, an embodiment of the present application provides an electronic device, which includes the above-mentioned heat dissipation structure, and therefore can have the corresponding technical effects and advantages as described above.

[0088] Further, see Figure 1 、 Figure 4 、 Figure 6 and Figure 11 As shown, the electronic device of the embodiment of the present application further includes a plurality of power modules 500, and the plurality of power modules 500 are all soldered to the first surface 101 of the substrate 100. The plurality of power modules 500 can be arranged on the first surface 101 at intervals along the direction from the inlet 210 to the outlet 220, or can be arranged at intervals along the first direction Z, wherein the first direction Z is perpendicular to the direction from the inlet 210 to the outlet 220.

[0089] Furthermore, in order to better improve the heat dissipation effect of the heat dissipation structure on the multiple power modules 500, the welding positions of the multiple power modules 500 on the first surface 101 must correspond to the flow path of the heat exchange medium in the cavity 300. When the multiple power modules 500 are arranged at intervals along the first direction Z, illustratively, the multiple power modules 500 are arranged at intervals along the first direction Z at positions corresponding to the first sub-fluid channel 331 and the second sub-fluid channel 332; when the multiple power modules are arranged at intervals along the direction from the inlet 210 to the outlet 220, illustratively, the positions of the multiple power modules 500 correspond to the positions of the first sub-fluid channel 331, and thus the multiple power modules 500 are arranged at intervals along the direction from the inlet 210 to the outlet 220, that is, the multiple power modules 500 are arranged at intervals along the flow direction of the heat exchange medium in the first sub-fluid channel 331. By arranging multiple power modules 500 at positions corresponding to the first surface 101 and the first sub-cavity 341 and / or the second sub-cavity 342, the distance that heat from the power modules 500 is transferred to the heat exchange medium through the substrate 100 can be preferably reduced, thereby effectively improving the heat exchange efficiency.

[0090] Furthermore, in the embodiment of the present application, the material of the substrate 100 is copper with good thermal conductivity, so that when the power module 500 is soldered on the substrate 100, the copper substrate 100 can better conduct the heat of the power module 500, thereby effectively improving the heat dissipation effect of the power module 500.

[0091] In some embodiments, the power module 500 includes a first power unit 510 and a second power unit 520 . In actual applications, the heat generated by the first power unit 510 is higher than that of the second power unit 520 .

[0092] In the embodiment of the present application, when the first power unit 510 and the second power unit 520 are welded to the first surface 101, the first power unit 510 is closer to the inlet 210 than the second power unit 520. It is understandable that in the direction from the inlet 210 to the outlet 220, due to the heat exchange between the heat exchange medium and the substrate 100, the temperature of the heat exchange medium will gradually rise, and the temperature rise of the heat exchange medium will affect the heat exchange efficiency between the heat exchange medium and the substrate 100. In the embodiment of the present application, the heat exchange medium can first exchange heat with the first power unit 510 with a higher heat output, and then exchange heat with the second power unit 520 with a lower heat output, which can better meet the heat dissipation requirements of the first power unit 510 and the second power unit 520.

[0093] In some embodiments, the first power unit 510 is a silicon carbide device, and the second power unit 520 is a silicon device. It is understood that in actual applications, the heat generated by the silicon carbide device is greater than the heat generated by the pure silicon device. Therefore, the heat dissipation requirement of the silicon carbide device is greater than the heat dissipation requirement of the silicon device. Therefore, when the silicon carbide device and the silicon device are welded and connected on the first surface 101, the silicon carbide device should be located on the side of the silicon device closer to the inlet 210.

[0094] In some embodiments, a first power unit 510 and a second power unit 520 are welded to the first surface 101 of the substrate 100, and a heat sink 321 is provided on the second surface 102 of the substrate 100. The heat sink 321 can extend into the heat exchange medium, and there is a larger contact area between the heat sink 321 and the heat exchange medium. Therefore, the heat sink 321 can improve the heat exchange efficiency between the substrate 100 and the heat exchange medium at the corresponding position, and can assist the heat exchange between the substrate 100 and the heat exchange medium.

[0095] Furthermore, in the embodiment of the present application, in the thickness direction X of the substrate 100, the position of the first power unit 510 corresponds to the position of the at least one heat sink 321, thereby improving the heat dissipation efficiency of the first power unit 510. Correspondingly, in the embodiment of the present application, in the thickness direction X of the substrate 100, the position of the second power unit 520 corresponds to the position of the at least one heat sink 321, thereby improving the heat dissipation efficiency of the second power unit 520.

[0096] In some embodiments, in the thickness direction X of the substrate 100, a first number of heat sinks 321 corresponds to the position of the first power unit 510, and a second number of heat sinks 321 corresponds to the position of the second power unit 520. Because the heat generated by the first power unit 510 is greater than that generated by the second power unit 520, the heat dissipation requirement of the first power unit 510 is greater than that of the second power unit 520. Therefore, in the embodiment of the present application, the first number is greater than the second number, that is, the number of heat sinks 321 corresponding to the position of the first power unit 510 is greater than the number of heat sinks 321 corresponding to the position of the second power unit 520, thereby effectively improving the heat dissipation efficiency of the first power unit 510.

[0097] Finally, it should be noted that those skilled in the art will readily identify other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The present invention is not limited to the precise structure described above and illustrated in the accompanying drawings, and various modifications and variations may be made without departing from the scope thereof. The scope of the present invention is limited solely by the appended claims.

Claims

1. A heat dissipation structure, characterized in that: include: A substrate (100), wherein along a thickness direction of the substrate (100), the substrate (100) comprises a first surface (101) and a second surface (102) that are opposite to each other; A heat dissipation plate (200), wherein along a thickness direction of the heat dissipation plate (200), the heat dissipation plate (200) comprises a third surface (201) and a fourth surface (202) opposite to each other, and the second surface (102) is opposite to the third surface (201); the substrate (100) and the heat dissipation plate (200) are connected to form a cavity (300); an inlet (210) and an outlet (220), located at two ends of the heat dissipation plate (200) and communicating with the cavity (300); The cavity (300) comprises a first inner wall (310) and a second inner wall (320) facing each other. A diverter (400) is provided on the first inner wall (310), and the diverter (400) extends in a direction from the inlet (210) to the outlet (220). A heat sink (321) is provided on the second inner wall (320), and the heat sink (321) extends toward the first inner wall (310). Along the direction from the inlet (210) to the outlet (220), the distance between the first inner wall (310) and the second inner wall (320) gradually decreases.

2. The heat dissipation structure according to claim 1, wherein: Along the direction from the inlet (210) to the outlet (220), the cavity (300) includes at least two sub-cavities (340) arranged in sequence; The average spacing of the sub-cavities (340) near the outlet (220) is smaller than the average spacing of the sub-cavities (340) near the inlet (210); the average spacing of any sub-cavity (340) is the average spacing of the corresponding first inner wall (310) and the second inner wall (320).

3. The heat dissipation structure according to claim 2, wherein: The spacing between any of the sub-cavities (340) remains unchanged or gradually increases or decreases.

4. The heat dissipation structure according to claim 1, wherein: Along the direction from the inlet (210) to the outlet (220), the thickness of the substrate (100) gradually increases, so that the distance between the first inner wall (310) and the second inner wall (320) gradually decreases.

5. The heat dissipation structure according to claim 1, wherein: Along the direction from the inlet (210) to the outlet (220), the thickness of the heat dissipation plate (200) gradually increases, so that the distance between the first inner wall (310) and the second inner wall (320) gradually decreases.

6. The heat dissipation structure according to claim 1, characterized in that: The flow diverter (400) forms fluid channels (330) on both sides along a first direction, wherein the first direction is perpendicular to the extension direction of the flow diverter (400).

7. The heat dissipation structure according to claim 6, characterized in that: The diverter (400) comprises a plurality of spoilers (410), the plurality of spoilers (410) being respectively arranged on both sides of the diverter (400) along the first direction, and the plurality of spoilers (410) being arranged at intervals along the direction from the inlet (210) to the outlet (220).

8. The heat dissipation structure according to claim 6, characterized in that: Along the direction from the inlet (210) to the outlet (220), the flow dividing member (400) has a first end surface (420) and a second end surface (430) that are opposite to each other; A first convex portion (421) is provided at the first end surface (420), and along the direction from the inlet (210) to the outlet (220), the cross-sectional area of ​​the first convex portion (421) in the first direction gradually increases; And / or, a second convex portion (431) is provided at the second end surface (430), and the cross-sectional area of ​​the second convex portion (431) in the first direction gradually decreases along the direction from the inlet (210) to the outlet (220).

9. The heat dissipation structure according to claim 1, characterized in that: The first inner wall (310) is formed by at least a portion of the heat dissipation plate (200) being recessed in a direction away from the substrate (100), and the first inner wall (310) is connected to the third surface (201) of the heat dissipation plate (200); The second inner wall (320) is formed by at least a portion of the substrate (100) being recessed in a direction away from the heat dissipation plate (200), and the second inner wall (320) is connected to the second surface (102) of the substrate (100).

10. An electronic device, characterized in that: The heat dissipation device comprises a heat dissipation structure according to any one of claims 1 to 9 and a plurality of power modules (500), wherein the plurality of power modules (500) are located on a first surface (101) of a substrate (100) of the heat dissipation structure and are arranged at intervals along a direction from an inlet (210) to an outlet (220) and / or a first direction, wherein the first direction is perpendicular to the direction from the inlet (210) to the outlet (220).

11. The electronic device according to claim 10, wherein: The power module (500) comprises a first power unit (510) and a second power unit (520), wherein the heat generated by the first power unit (510) is higher than the heat generated by the second power unit (520); The first power unit (510) is located on a side of the second power unit (520) close to the inlet (210).

12. The electronic device according to claim 11, wherein: The first power unit (510) is a silicon carbide device, and the second power unit (520) is a silicon device.

13. The electronic device according to claim 11, wherein: The position of the first power unit (510) and the position of the second power unit (520) both correspond to at least one heat sink (321).

14. The electronic device according to claim 13, wherein: The position of the first power unit (510) corresponds to a first number of the heat sinks (321), and the position of the second power unit (520) corresponds to a second number of the heat sinks (321), and the first number is greater than the second number.

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