Electric appliance box constant temperature control method and device, electric appliance box, electronic equipment and medium

Abstract

The application discloses an electric appliance box constant temperature control method and device, an electric appliance box, electronic equipment and a medium. The electric appliance box is provided with a semiconductor refrigeration sheet. The semiconductor refrigeration sheet comprises a first end and a second end. The first end is located in the electric appliance box, and the second end is located outside the electric appliance box. The method comprises the following steps: acquiring the temperature of the electric appliance box; if the temperature of the electric appliance box is greater than an upper temperature threshold, controlling the semiconductor refrigeration sheet to be turned off or to cool the electric appliance box according to a load opening ratio; if the temperature of the electric appliance box is less than a lower temperature threshold, controlling the semiconductor refrigeration sheet to be turned off or to heat the electric appliance box according to the load opening ratio, the temperature of the first end of the semiconductor refrigeration sheet and a bus energy storage capacitor capacity reduction ratio; and if the temperature of the electric appliance box is greater than or equal to the lower temperature threshold and less than or equal to the upper temperature threshold, turning off the semiconductor refrigeration sheet. The application is based on multiple parameters, and the control of the semiconductor refrigeration sheet is more accurate. The semiconductor refrigeration sheet is turned off as much as possible while ensuring the constant temperature of the electric appliance box, so that the refrigeration sheet loss is reduced and electricity is saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature control, in particular to a kind of electric appliance box constant temperature control method, device, electric appliance box, electronic equipment and medium. BACKGROUND

[0002] The working environment of some electric appliances (such as water heaters, air conditioners, etc.) is harsh, and the performance of the controller in the electric appliance box decreases when used in ultra-low temperature and ultra-high temperature conditions, which is prone to poor load capacity or high-temperature damage, so the electric appliance box needs to be controlled at constant temperature.

[0003] At present, the temperature of the electric appliance box is detected by temperature control device, and if the temperature of the electric appliance box is in the preset range, the temperature control device is turned off, if the temperature of the electric appliance box is too high, the temperature control device is used to cool the electric appliance box, and if the temperature of the electric appliance box is too low, the temperature control device is used to heat the electric appliance box. However, in this control mode, the temperature control device is large in loss and high in power consumption.

[0004] In view of the problem that the temperature control device is large in loss and high in power consumption in the constant temperature control of the electric appliance box in the prior art, no effective solution has been proposed so far. SUMMARY

[0005] The embodiments of the present application provide a kind of electric appliance box constant temperature control method, device, electric appliance box, electronic equipment and medium, to at least solve the problem that the temperature control device is large in loss and high in power consumption in the constant temperature control of the electric appliance box in the prior art.

[0006] To solve the above technical problems, the present application provides a kind of electric appliance box constant temperature control method, the electric appliance box is installed with semiconductor refrigeration piece, the semiconductor refrigeration piece includes first end and second end, the first end is located in the electric appliance box, the second end is located outside the electric appliance box, and the method comprises:

[0007] Obtain the temperature of the electric appliance box;

[0008] If the temperature of the electric appliance box is greater than the upper limit threshold value, the semiconductor refrigeration piece is controlled to be closed or the electric appliance box is cooled according to the load opening ratio;

[0009] If the temperature of the electric appliance box is less than the lower limit threshold value, the semiconductor refrigeration piece is controlled to be closed or the electric appliance box is heated according to the load opening ratio, the first end temperature of the semiconductor refrigeration piece and the capacity reduction ratio of the bus energy storage capacitor;

[0010] If the temperature of the electric appliance box is greater than or equal to the lower limit threshold value and less than or equal to the upper limit threshold value, the semiconductor refrigeration piece is controlled to be closed.

[0011] Optionally, according to the load opening ratio, the semiconductor refrigeration piece is controlled to be closed or the electric appliance box is cooled, comprising:

[0012] The current load opening ratio is obtained;

[0013] If the load opening ratio is greater than a first preset ratio, the power direction of the semiconductor refrigeration piece is controlled to make the first end refrigerate and the second end heat, and the electric appliance box is cooled;

[0014] If the load opening ratio is less than or equal to the first preset ratio, the semiconductor refrigeration piece is closed.

[0015] Optionally, according to the load opening ratio, the semiconductor refrigeration piece first end temperature and the bus energy storage capacitor capacity reduction ratio, the semiconductor refrigeration piece is controlled to be closed or the electric appliance box is heated, comprising:

[0016] The current load opening ratio is obtained;

[0017] If the load opening ratio is less than or equal to a second preset ratio, the semiconductor refrigeration piece is closed;

[0018] In the case that the first end is the cold end and only the second end is provided with a heat sink when the semiconductor refrigeration piece is forward powered, if the load opening ratio is greater than the second preset ratio, the semiconductor refrigeration piece is controlled to be closed or the electric appliance box is heated according to the semiconductor refrigeration piece first end temperature and the bus energy storage capacitor capacity reduction ratio;

[0019] In the case that the second end is the cold end and the first end and the second end are both provided with heat sinks when the semiconductor refrigeration piece is forward powered, if the load opening ratio is greater than the second preset ratio, the semiconductor refrigeration piece is controlled to be closed or the electric appliance box is heated according to the bus energy storage capacitor capacity reduction ratio.

[0020] Optionally, according to the semiconductor refrigeration piece first end temperature and the bus energy storage capacitor capacity reduction ratio, the semiconductor refrigeration piece is controlled to be closed or the electric appliance box is heated, comprising:

[0021] The current semiconductor refrigeration piece first end temperature is obtained;

[0022] If the semiconductor refrigeration piece first end temperature is greater than a heating temperature upper limit, the semiconductor refrigeration piece is closed;

[0023] If the semiconductor refrigeration piece first end temperature is less than or equal to the heating temperature upper limit, the semiconductor refrigeration piece is controlled to be closed or the electric appliance box is heated according to the bus energy storage capacitor capacity reduction ratio.

[0024] Optionally, the method further comprises: controlling the semiconductor refrigeration piece to be closed or heating the electric appliance box according to the bus energy storage capacitor capacity reduction ratio, comprising:

[0025] obtaining the current bus energy storage capacitor capacity reduction ratio;

[0026] if the bus energy storage capacitor capacity reduction ratio is greater than the upper limit threshold, controlling the power-on direction of the semiconductor refrigeration piece to heat the first end and cool the second end, and heating the electric appliance box;

[0027] if the bus energy storage capacitor capacity reduction ratio is less than or equal to the upper limit threshold, closing the semiconductor refrigeration piece.

[0028] Optionally, the method further comprises: when the controller in the electric appliance box starts to work, the initial state of the semiconductor refrigeration piece is closed.

[0029] The embodiment of the application further provides an electric appliance box constant temperature control device, wherein the electric appliance box is provided with a semiconductor refrigeration piece, the semiconductor refrigeration piece comprises a first end and a second end, the first end is located in the electric appliance box, and the second end is located outside the electric appliance box, and the device comprises:

[0030] an acquisition module for acquiring the electric appliance box temperature;

[0031] a first control module for controlling the semiconductor refrigeration piece to be closed or cooling the electric appliance box according to the load opening ratio when the electric appliance box temperature is greater than the upper limit threshold;

[0032] a second control module for controlling the semiconductor refrigeration piece to be closed or heating the electric appliance box according to the load opening ratio, the semiconductor refrigeration piece first end temperature and the bus energy storage capacitor capacity reduction ratio when the electric appliance box temperature is less than the lower limit threshold;

[0033] a third control module for controlling the semiconductor refrigeration piece to be closed when the electric appliance box temperature is greater than or equal to the lower limit threshold and less than or equal to the upper limit threshold.

[0034] The embodiment of the application further provides an electric appliance box, comprising: a controller, a semiconductor refrigeration piece and a first temperature sensor.

[0035] The semiconductor refrigeration piece comprises a first end and a second end, the first end is located in the electric appliance box, and the second end is located outside the electric appliance box;

[0036] The first temperature sensor is used for detecting the electric appliance box temperature.

[0037] The controller comprises the electric appliance box constant temperature control device of the embodiment of the application, and the controller has the functions of controlling the load and detecting the capacity of the bus energy storage capacitor.

[0038] Optionally, the second end is the cold end when the semiconductor refrigeration piece is powered in the forward direction, and the first end and the second end are both provided with a heat sink; or the first end is the cold end when the semiconductor refrigeration piece is powered in the forward direction, and only the second end is provided with a heat sink, in which case, the electric appliance box further comprises a second temperature sensor for detecting the temperature of the first end of the semiconductor refrigeration piece.

[0039] The embodiment of the application further provides an electronic device, comprising a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method of the embodiment of the application when executing the computer program.

[0040] The embodiment of the application further provides a nonvolatile computer readable storage medium, which stores a computer program, wherein the computer program is executed by a processor to implement the steps of the method of the embodiment of the application.

[0041] The technical scheme of the application controls the semiconductor refrigeration piece based on the temperature of the electric appliance box, the opening ratio of the load, the temperature of the first end of the semiconductor refrigeration piece and the capacity reduction ratio of the bus energy storage capacitor, realizes the electric appliance box constant temperature control that can adapt to wide-range temperature changes, and controls the semiconductor refrigeration piece more finely, so that the semiconductor refrigeration piece is not started as much as possible while the constant temperature of the electric appliance box is ensured, thereby reducing the loss of the semiconductor refrigeration piece and saving the power of the controller, which is more power-saving, and solves the problems of large loss and high power consumption of the temperature control device in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0042] Figure 1 is a flowchart of the electric appliance box constant temperature control method provided by the embodiment of the application;

[0043] Figure 2 is a schematic diagram of the controller provided by the embodiment of the application;

[0044] Figure 3 is a schematic diagram of the electric appliance box provided by the embodiment of the application;

[0045] Figure 4 is the electric appliance box constant temperature control flow provided by the embodiment of the application Figure 1 ;

[0046] Figure 5 is the electric appliance box constant temperature control flow provided by the embodiment of the application Figure 2 ;

[0047] Figure 6is a structural block diagram of the constant temperature control device for the electric appliance box provided by the embodiment of the present application.

[0048] Figure 7 is a hardware structure schematic diagram of the electronic device provided by the embodiment of the present application. DETAILED DESCRIPTION

[0049] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0050] It should be noted that the terms "first", "second" and the like in the description and claims of the present application and the drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not necessarily limit to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0051] It should be noted that the steps shown in the flowchart of the drawings can be executed in a computer system such as a set of computer executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described herein can be executed in an order different from that described herein.

[0052] It should be understood that the term "and / or" used herein is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after it.

[0053] The optional embodiments of the present application will be described in detail below with reference to the drawings.

[0054] Embodiment 1

[0055] The electric appliance box of the present embodiment is provided with a semiconductor refrigeration sheet, which is used to cool or heat the electric appliance box, so as to realize temperature regulation of the electric appliance box.

[0056] A thermoelectric cooler consists of a cold end and a hot end. The cold end absorbs heat, and the hot end releases heat. The thermoelectric cooler is driven by direct current. When the thermoelectric cooler is disconnected and not energized, it is off. When energized, it is on, and the cold and hot ends interchange as the current direction changes. For example, let's denote the two ends of the thermoelectric cooler as end A and end B. The thermoelectric cooler includes a positive and a negative electrode. If the positive and negative electrodes are connected in the forward direction (i.e., forward energization), end A is the cold end and end B is the hot end. If the positive and negative electrodes are connected in the reverse direction (i.e., reverse energization), end A is the hot end and end B is the cold end. By controlling the positive and negative connections of the power supply (i.e., controlling the energization direction of the thermoelectric cooler), the cooling and heating functions of the thermoelectric cooler can be switched.

[0057] The semiconductor cooling chip in this embodiment includes a first end and a second end. The first end is located inside the electrical box, and the second end is located outside the electrical box. One of the first and second ends serves as the cold end to absorb heat, and the other end serves as the hot end to release heat.

[0058] In this embodiment, the semiconductor cooling chip is arranged in the following two ways:

[0059] (1) When the thermoelectric cooler is energized in the forward direction, the first end inside the electrical box is the cold end, and the second end outside the electrical box is the hot end. Only the second end is equipped with a heat sink. Correspondingly, when the thermoelectric cooler is energized in the reverse direction, the first end inside the electrical box is the hot end, and the second end outside the electrical box is the cold end.

[0060] (2) When the thermoelectric cooler is energized in the forward direction, the second end located outside the electrical box is the cold end, and the first end located inside the electrical box is the hot end. Heat sinks are provided at both the first and second ends. Correspondingly, when the thermoelectric cooler is energized in the reverse direction, the second end located outside the electrical box is the hot end, and the first end located inside the electrical box is the cold end.

[0061] In practical applications, a heat sink is generally placed on the side of the thermoelectric cooler that is the hot end when the thermoelectric cooler is forward-biased. Considering that the electrical box mainly requires cooling, the above-mentioned arrangement (1) can be preferred to avoid placing the heat sink in a small electrical box. For the above-mentioned arrangement (2), the first end is the hot end when the thermoelectric cooler is forward-biased, that is, the first end is equipped with a heat sink. If the thermoelectric cooler is to be used to cool the electrical box, it needs to be reverse-biased. At this time, the second end is the hot end. If the second end is not equipped with a heat sink, there is an upper limit to the heating temperature, which is not conducive to cooling the electrical box. Since the electrical box mainly requires cooling, a heat sink is also provided on the second end.

[0062] This embodiment provides a method for constant temperature control of an electrical box, which can be executed by a controller inside the electrical box. Figure 1 This is a flowchart of the electrical box constant temperature control method provided in the embodiments of the present invention, such as...Figure 1 As shown, the method comprises the following steps:

[0063] S101, obtaining the temperature of the electric appliance box.

[0064] S102, if the temperature of the electric appliance box is greater than the upper temperature threshold, controlling the semiconductor refrigeration sheet to be turned off or the electric appliance box to be cooled according to the load opening ratio.

[0065] S103, if the temperature of the electric appliance box is less than the lower temperature threshold, controlling the semiconductor refrigeration sheet to be turned off or the electric appliance box to be heated according to the load opening ratio, the first end temperature of the semiconductor refrigeration sheet and the capacity reduction ratio of the bus energy storage capacitor.

[0066] S104, if the temperature of the electric appliance box is greater than or equal to the lower temperature threshold and less than or equal to the upper temperature threshold, controlling the semiconductor refrigeration sheet to be turned off.

[0067] The temperature of the electric appliance box refers to the temperature inside the electric appliance box, which can be detected by a temperature sensor arranged inside the electric appliance box. The temperature of the electric appliance box is affected by the heat of the controller and the ambient temperature. The upper temperature threshold and the lower temperature threshold can be set in advance according to the actual situation of the electric appliance box and the use environment, for example, [-30℃, 45℃]. The temperature of the electric appliance box is greater than the upper temperature threshold, indicating that the electric appliance box is high temperature, and the temperature of the electric appliance box is less than the lower temperature threshold, indicating that the electric appliance box is low temperature.

[0068] The controller in the electric appliance box is the signal receiving and processing center of the electric appliance device, which can control the load output and has the function of detecting the capacity of the bus energy storage capacitor. The load can be a compressor, a fan, etc. The load opening ratio refers to the ratio of the current total power of the opened load to the maximum total power of all loads. The load opening ratio can reflect the workload demand and temperature rise degree of the controller.

[0069] The controller is driven by power and needs to set the bus energy storage capacitor, referring to Figure 2 Taking the controller taking power from the switching power supply scheme as an example, the bus energy storage capacitor is located in the strong current filtering and rectifying circuit. In the case that the temperature of the electric appliance box is low, the capacity of the bus energy storage capacitor will decrease, resulting in the decrease of the power quality of the controller, which may cause voltage deviation and affect the load carrying capacity of the controller. Therefore, the capacity of the bus energy storage capacitor is detected in this embodiment, and through the capacity reduction ratio of the bus energy storage capacitor, it can be known whether the load carrying capacity of the controller is affected and the degree of influence.

[0070] For the above setting mode (1), that is, when the semiconductor refrigeration piece is forward powered, the first end is the cold end, the second end is the hot end, and only the second end is provided with a heat sink, if the semiconductor refrigeration piece is reversely powered, at this time the first end is switched to the hot end, since the first end is not provided with a heat sink, its heating has a temperature upper limit requirement, if the temperature is too high, it will cause damage to the semiconductor refrigeration piece. By detecting the temperature of the first end of the semiconductor refrigeration piece, the damage caused by excessive heating of the first end in this case can be avoided.

[0071] If it is needed to cool the electric appliance box, the power-on direction of the semiconductor refrigeration piece is controlled to make the first end located in the electric appliance box as the cold end to refrigerate. If it is needed to heat the electric appliance box, the power-on direction of the semiconductor refrigeration piece is controlled to make the first end located in the electric appliance box as the hot end to heat.

[0072] The present embodiment controls the semiconductor refrigeration piece based on multiple parameters such as the temperature of the electric appliance box, the load opening ratio, the temperature of the first end of the semiconductor refrigeration piece, and the capacity reduction ratio of the bus energy storage capacitor, to achieve electric appliance box constant temperature control that can adapt to a wide range of temperature changes, and the control of the semiconductor refrigeration piece is more precise, which can minimize the opening of the semiconductor refrigeration piece while ensuring the constant temperature of the electric appliance box, thereby reducing the loss of the semiconductor refrigeration piece and saving the power of the controller, which is more energy-saving, and solves the problem of large loss and high power consumption of temperature control devices in the prior art.

[0073] In one embodiment, the semiconductor refrigeration piece is controlled to be turned off or to cool the electric appliance box according to the load opening ratio, comprising:

[0074] Obtaining the current load opening ratio;

[0075] If the load opening ratio is greater than a first preset ratio, the power-on direction of the semiconductor refrigeration piece is controlled to make the first end refrigerate and the second end heat, to cool the electric appliance box;

[0076] If the load opening ratio is less than or equal to the first preset ratio, the semiconductor refrigeration piece is turned off.

[0077] The first preset ratio can be obtained in advance by temperature rise test, and the first preset ratio is the limit value of the load opening ratio when the electric appliance box does not need to be cooled additionally at high temperature.

[0078] In the case that the temperature of the electric appliance box is greater than the upper temperature threshold, if the load opening ratio is greater than the first preset ratio, it indicates that the load is opened more, the controller load is large, the controller generates more heat, and the electric appliance box needs to be cooled to avoid the temperature of the electric appliance box continuing to rise under the influence of the controller heat. If the load opening ratio is less than or equal to the first preset ratio, it indicates that the load is opened less, the controller load is small, the controller generates less heat, the temperature of the electric appliance box is less affected by the temperature rise of the controller, the temperature of the electric appliance box is close to the ambient temperature, the temperature of the electric appliance box will not continue to rise, the temperature requirement of the controller for use can generally cover the harsh ambient temperature range (for example, -35℃ to 48℃), and the device design is left with a margin, so that the controller can operate normally even if the upper limit of the harsh ambient temperature is exceeded, and therefore the electric appliance box can not be cooled.

[0079] Controlling the power-on direction of the semiconductor refrigeration sheet to cool the first end and heat the second end to cool the electric appliance box, specifically comprising: for the setting mode (1) of the semiconductor refrigeration sheet, controlling the semiconductor refrigeration sheet to be powered on in the forward direction; and for the setting mode (2) of the semiconductor refrigeration sheet, controlling the semiconductor refrigeration sheet to be powered on in the reverse direction.

[0080] In the case that the temperature of the electric appliance box is greater than the upper temperature threshold, the embodiment judges whether to use the semiconductor refrigeration sheet to cool the electric appliance box or to turn off the semiconductor refrigeration sheet according to the load opening ratio, in the case that the temperature of the electric appliance box is high and the load is opened more, the semiconductor refrigeration sheet can cool the electric appliance box in time, and in the case that the temperature of the electric appliance box is high but the load is opened less, the semiconductor refrigeration sheet is turned off, which can reduce the loss of the semiconductor refrigeration sheet and save the power of the controller.

[0081] In one embodiment, the semiconductor refrigeration sheet is controlled to be turned off or heated to the electric appliance box according to the load opening ratio, the first end temperature of the semiconductor refrigeration sheet, and the bus energy storage capacitor capacity reduction ratio, comprising:

[0082] Obtaining the current load opening ratio;

[0083] If the load opening ratio is less than or equal to the second preset ratio, the semiconductor refrigeration sheet is turned off;

[0084] In the case that the first end is the cold end and only the second end is provided with a heat sink when the semiconductor refrigeration sheet is powered on in the forward direction, if the load opening ratio is greater than the second preset ratio, the semiconductor refrigeration sheet is controlled to be turned off or heated to the electric appliance box according to the first end temperature of the semiconductor refrigeration sheet and the bus energy storage capacitor capacity reduction ratio;

[0085] In the case that the second end is the cold end and the first end and the second end are both provided with heat sinks when the semiconductor cooling sheet is forwardly powered, if the load opening ratio is greater than the second preset ratio, the semiconductor cooling sheet is controlled to be turned off or the electric appliance box is heated according to the bus energy storage capacitor capacity reduction ratio.

[0086] The second preset ratio can be obtained by experimental test in advance, and the second preset ratio is a limit value of the load opening ratio at which the controller and the load can still normally operate when the electric appliance box is at low temperature.

[0087] In the case that the temperature of the electric appliance box is less than the temperature lower limit threshold value, if the load opening ratio is less than or equal to the second preset ratio, it means that the load is opened less. Even if the bus energy storage capacitor capacity is reduced due to low temperature, the load opening is less, and the controller can still control the load to normally operate, so the electric appliance box can not be heated.

[0088] In the case that the temperature of the electric appliance box is less than the temperature lower limit threshold value, if the load opening ratio is greater than the second preset ratio, it means that the load is opened more. Other parameters can be further combined for judgment to more accurately control the semiconductor cooling sheet and reduce its loss. Specifically, according to the semiconductor cooling sheet first end temperature and the bus energy storage capacitor capacity reduction ratio, the semiconductor cooling sheet is controlled to be turned off or the electric appliance box is heated, or only according to the bus energy storage capacitor capacity reduction ratio, the semiconductor cooling sheet is controlled to be turned off or the electric appliance box is heated.

[0089] In the case that the temperature of the electric appliance box is less than the temperature lower limit threshold value, according to the load opening ratio, the semiconductor cooling sheet first end temperature and the bus energy storage capacitor capacity reduction ratio, or according to the load opening ratio and the bus energy storage capacitor capacity reduction ratio, it is judged whether to heat the electric appliance box by the semiconductor cooling sheet or to turn off the semiconductor cooling sheet. In the case that the temperature of the electric appliance box is low and the load is opened less, the semiconductor cooling sheet is turned off, which can reduce the loss of the semiconductor cooling sheet and save the power of the controller. In the case that the temperature of the electric appliance box is low but the load is opened more, other parameters are further combined for judgment to more accurately control the semiconductor cooling sheet, reduce its loss and reduce energy consumption.

[0090] Further, according to the semiconductor cooling sheet first end temperature and the bus energy storage capacitor capacity reduction ratio, the semiconductor cooling sheet is controlled to be turned off or the electric appliance box is heated, comprising:

[0091] The current semiconductor cooling sheet first end temperature is obtained.

[0092] if the first end temperature of the semiconductor refrigeration sheet is greater than the upper limit of the heating temperature, the semiconductor refrigeration sheet is turned off;

[0093] if the first end temperature of the semiconductor refrigeration sheet is less than or equal to the upper limit of the heating temperature, the semiconductor refrigeration sheet is turned off or the electric appliance box is heated according to the capacity reduction ratio of the bus energy storage capacitor.

[0094] The upper limit of the heating temperature refers to the upper limit requirement of the temperature corresponding to the one end of the semiconductor refrigeration sheet without a heat sink as the hot end for heating. The upper limit of the heating temperature can be set according to the actual situation of the semiconductor refrigeration sheet. If the first end temperature of the semiconductor refrigeration sheet is greater than the upper limit of the heating temperature, the semiconductor refrigeration sheet cannot continue to work and needs to be turned off, otherwise it is easy to be damaged. If the first end temperature of the semiconductor refrigeration sheet is less than or equal to the upper limit of the heating temperature, the electric appliance box can be heated by the semiconductor refrigeration sheet, and the specific judgment is combined with the capacity reduction ratio of the bus energy storage capacitor.

[0095] In this embodiment, when the temperature of the electric appliance box is less than the lower limit threshold and the load is turned on, for the setting mode that the first end in the electric appliance box is the cold end and the second end outside the electric appliance box is the hot end when the semiconductor refrigeration sheet is forward powered, and only the second end is provided with a heat sink, the semiconductor refrigeration sheet is turned off or the electric appliance box is heated according to the first end temperature of the semiconductor refrigeration sheet and the capacity reduction ratio of the bus energy storage capacitor in turn. If the first end temperature of the semiconductor refrigeration sheet is high, the semiconductor refrigeration sheet is turned off, the electric appliance box is heated by the first end temperature of the semiconductor refrigeration sheet and the working temperature rise of the controller itself, the loss of the semiconductor refrigeration sheet is reduced, and the power consumption of the controller is saved. If the first end temperature of the semiconductor refrigeration sheet is low, the capacity reduction ratio of the bus energy storage capacitor is further judged, so that the semiconductor refrigeration sheet is more accurately controlled, the loss thereof is reduced, and the energy consumption is reduced.

[0096] In one embodiment, the semiconductor refrigeration sheet is turned off or the electric appliance box is heated according to the capacity reduction ratio of the bus energy storage capacitor, comprising:

[0097] The current capacity reduction ratio of the bus energy storage capacitor is obtained.

[0098] If the capacity reduction ratio of the bus energy storage capacitor is greater than the upper limit threshold, the power-on direction of the semiconductor refrigeration sheet is controlled so that the first end heats and the second end cools, and the electric appliance box is heated.

[0099] If the capacity reduction ratio of the bus energy storage capacitor is less than or equal to the upper limit threshold, the semiconductor refrigeration sheet is turned off.

[0100] The proportional upper limit threshold refers to the percentage decrease in the bus energy storage capacitor capacity when the controller's power quality is affected by low temperatures in the electrical box. The proportional upper limit threshold can be set according to actual conditions.

[0101] If the decrease in the bus energy storage capacitor capacity is greater than the upper limit threshold, it indicates that the bus energy storage capacitor capacity has decreased significantly. Low temperature environment will affect the normal operation of the controller, and it is necessary to use a semiconductor cooling chip to heat the electrical box.

[0102] If the decrease in the bus energy storage capacitor capacity is less than or equal to the upper limit threshold, it means that the decrease in the bus energy storage capacitor capacity is not significant and has little impact on the power quality of the controller. In this case, the thermoelectric cooler can be turned on, and the controller's own operating temperature rise can be used to heat the electrical box, reducing thermoelectric cooler losses and saving controller power consumption.

[0103] Controlling the energizing direction of the semiconductor refrigeration chip to heat the first end and cool the second end, thereby heating the electrical box, specifically includes: controlling the semiconductor refrigeration chip to be energized in reverse for the above-mentioned semiconductor refrigeration chip configuration (1); and controlling the semiconductor refrigeration chip to be energized in the forward direction for the above-mentioned semiconductor refrigeration chip configuration (2).

[0104] In this embodiment, when the temperature of the electrical box is below the lower limit threshold and many loads are turned on, the final determination is made based on the percentage decrease in the capacity of the bus energy storage capacitor to either heat the electrical box using a thermoelectric cooler or to turn off the thermoelectric cooler. This reduces the loss of the thermoelectric cooler and saves power for the controller.

[0105] In one embodiment, the method further includes: when the controller inside the electrical box starts working, the initial state of the thermoelectric cooler is off, thereby accurately controlling the temperature of the electrical box, avoiding unnecessary turning on of the thermoelectric cooler, reducing the wear of the thermoelectric cooler, and reducing power consumption.

[0106] Example 2

[0107] This embodiment provides a specific implementation method for the constant temperature control of the electrical box, based on the above embodiments. Explanations of terms that are the same as or corresponding to those in the above embodiments will not be repeated in this embodiment.

[0108] The above-mentioned electrical box constant temperature control scheme will be described below with reference to a specific example. However, it should be noted that this specific embodiment is only for better illustration of this application and does not constitute an improper limitation of this application.

[0109] like Figure 3 As shown, the electrical box includes: a controller 10, a semiconductor cooling chip 20, and an electrical box temperature sensing bulb 30.

[0110] The controller 10 is the signal receiving and processing center of the electrical equipment belonging to the electrical box. The controller 10 has a bus energy storage capacitor. The controller 10 can control the load 50 and has the function of detecting the capacity of the bus energy storage capacitor. The controller 10 is also used to control the opening and closing and the energizing direction of the semiconductor cooling chip 20.

[0111] The temperature sensor 30 in the electrical box is used to detect the temperature inside the electrical box and feed it back to the controller 10.

[0112] The thermoelectric cooler 20 includes a first end and a second end. The first end is located inside the electrical box, and the second end is located outside the electrical box. One of the first and second ends serves as a cold end to absorb heat, and the other end serves as a hot end to release heat.

[0113] The semiconductor cooling chip 20 can be configured in the following two ways:

[0114] (1) When the thermoelectric cooler is forward-energized, the first end inside the electrical box is the cold end, and the second end outside the electrical box is the hot end; only the second end is equipped with a heat sink. Correspondingly, when the thermoelectric cooler is reverse-energized, the first end inside the electrical box is the hot end, and the second end outside the electrical box is the cold end. In this case, the electrical box also includes a thermoelectric cooler temperature sensor 40, used to detect the temperature of the first end of the thermoelectric cooler and feed it back to the controller 10.

[0115] (2) When the thermoelectric cooler is energized in the forward direction, the second end located outside the electrical box is the cold end, and the first end located inside the electrical box is the hot end. Heat sinks are provided at both the first and second ends. Correspondingly, when the thermoelectric cooler is energized in the reverse direction, the second end located outside the electrical box is the hot end, and the first end located inside the electrical box is the cold end.

[0116] The following section uses a water heater as an example to explain the corresponding electrical box temperature control method for the two settings mentioned above.

[0117] Regarding setting method (1), such as Figure 4 As shown, the electrical box constant temperature control method includes the following steps:

[0118] S401, the unit is started up and running.

[0119] S402, the initial state of the thermoelectric cooler 20 is off.

[0120] S403, the electrical box temperature sensor 30 detects the temperature of the electrical box, the semiconductor refrigeration chip temperature sensor 40 detects the temperature of the first end of the semiconductor refrigeration chip, and the controller 10 detects the capacity of the bus energy storage capacitor.

[0121] S404, determine whether the electrical box temperature is greater than the upper temperature threshold. If yes, proceed to S405; otherwise, proceed to S407.

[0122] S405, determining whether the load-on ratio meets the load heating minimum ratio (i.e., the first preset ratio), if yes, going to S406, if no, going to S412.

[0123] S406, controlling the semiconductor cooling sheet to be powered in the positive direction to cool the electric appliance box.

[0124] S407, determining whether the electric appliance box temperature meets the temperature lower limit threshold, if yes, going to S408, if no, going to S412.

[0125] S408, determining whether the load-on ratio meets the minimum temperature load upper limit ratio (i.e., the second preset ratio), if yes, going to S409, if no, going to S412.

[0126] S409, determining whether the semiconductor cooling sheet first end temperature meets the heating temperature upper limit, if no, going to S410, if yes, going to S412.

[0127] S410, determining whether the bus energy storage capacitor capacity reduction ratio meets the ratio upper limit threshold, if yes, going to S411, if no, going to S412.

[0128] S411, controlling the semiconductor cooling sheet to be powered in the reverse direction to heat the electric appliance box.

[0129] S412, keeping the semiconductor cooling sheet closed.

[0130] In the embodiment, the ultimate purpose of the electric appliance box constant temperature is to let the controller in the electric appliance box control the load to run normally, so the load-on ratio is determined first, then the semiconductor cooling sheet first end temperature, and finally the bus energy storage capacitor capacity reduction ratio, the ultimate purpose of controlling the load is prioritized, and then the semiconductor cooling sheet loss and energy saving are considered.

[0131] Through the above control, the semiconductor cooling sheet loss can be reduced, and the controller power consumption can be saved, as follows:

[0132] 1. When the electric appliance box temperature is high and the load-on is small, the semiconductor cooling sheet is not started to cool, the semiconductor cooling sheet loss is reduced, and the controller power consumption is saved.

[0133] 2. When the electric appliance box temperature is low and the load-on is small, the semiconductor cooling sheet is not started to heat, the semiconductor cooling sheet loss is reduced, and the controller power consumption is saved.

[0134] 3. When the electric appliance box temperature is low and the load-on is large, but the semiconductor cooling sheet first end temperature is high, the semiconductor cooling sheet is not started to heat, the first end temperature and the controller itself working temperature rise are used to heat the electric appliance box, the semiconductor cooling sheet loss is reduced, and the controller power consumption is saved.

[0135] 4. The temperature of the electric appliance box is low, the load is turned on, the first end temperature of the semiconductor refrigerating sheet is less than or equal to the upper limit of the semiconductor heat radiator heating temperature, and the capacity of the bus energy storage capacitor is not reduced much. At this time, the semiconductor refrigerating sheet is not turned on for heating, the controller itself is used to heat the electric appliance box, the loss of the semiconductor refrigerating sheet is reduced, and the power consumption of the controller is saved.

[0136] For the setting mode (2), the first end and the second end are provided with heat sinks, and there is no need to detect the first end temperature of the semiconductor refrigerating sheet, as shown in Figure 5 The electric appliance box constant temperature control method includes the following steps:

[0137] S501, the unit is turned on and runs.

[0138] S502, the initial state of the semiconductor refrigerating sheet 20 is closed.

[0139] S503, the electric appliance box temperature sensing bag 30 detects the electric appliance box temperature, and the controller 10 detects the capacity of the bus energy storage capacitor.

[0140] S504, determine whether the electric appliance box temperature is greater than the temperature upper limit threshold value, if yes, go to S505, if no, go to S507.

[0141] S505, determine whether the load opening ratio is greater than the minimum load heating ratio (i.e. the first preset ratio), if yes, go to S506, if no, go to S511.

[0142] S506, control the semiconductor refrigerating sheet to reverse power, and cool the electric appliance box.

[0143] S507, determine whether the electric appliance box temperature is less than the temperature lower limit threshold value, if yes, go to S508, if no, go to S511.

[0144] S508, determine whether the load opening ratio is greater than the minimum temperature load upper limit ratio (i.e. the second preset ratio), if yes, go to S509, if no, go to S511.

[0145] S509, determine whether the capacity reduction ratio of the bus energy storage capacitor is greater than the ratio upper limit threshold value, if yes, go to S510, if no, go to S511.

[0146] S510, control the semiconductor refrigerating sheet to forward power, and heat the electric appliance box.

[0147] S511, keep the semiconductor refrigerating sheet closed.

[0148] Through the above control, the loss of the semiconductor refrigerating sheet can be reduced, the power consumption of the controller can be saved, and the specific implementation is as follows:

[0149] 1. When the temperature of the electrical box is high but the load is low, the thermoelectric cooler is not turned on to cool it down, thus reducing the wear of the thermoelectric cooler and saving the controller's power consumption.

[0150] 2. When the temperature of the electrical box is low and the load is low, the thermoelectric cooler is not turned on for heating, which reduces the wear of the thermoelectric cooler and saves the power consumption of the controller.

[0151] 3. When the temperature of the electrical box is low, many loads are turned on, and the capacity of the bus energy storage capacitor does not decrease much, the thermoelectric cooler should not be turned on for heating. Instead, the controller's own operating temperature rise should be used to heat the electrical box, reducing the loss of the thermoelectric cooler and saving the controller's power consumption.

[0152] In summary, this embodiment provides a constant temperature control scheme for an electrical box that can adapt to harsh ambient temperatures. Based on multiple parameters such as the electrical box temperature, load activation ratio, first-end temperature of the thermoelectric cooler, and the rate of decrease in the bus energy storage capacitor capacity, the thermoelectric cooler is controlled, achieving constant temperature control of the electrical box that can adapt to a wide range of temperature changes. This improves controller performance and provides more precise control over the thermoelectric cooler. While ensuring a constant temperature for the electrical box, the thermoelectric cooler is kept as still as possible, thereby reducing its wear and tear and saving controller power. This solves the problem of high wear and power consumption of temperature control devices in existing electrical box constant temperature control technologies. All detection is performed within the electrical box, preventing the introduction of external interference.

[0153] Example 3

[0154] Based on the same inventive concept, this embodiment provides an electrical box temperature control device, which can be used to implement the electrical box temperature control method described in the above embodiments. This electrical box temperature control device can be implemented through software and / or hardware, and is generally integrated into a controller inside the electrical box. The electrical box is equipped with a semiconductor cooling chip, which includes a first end and a second end, the first end being located inside the electrical box and the second end being located outside the electrical box.

[0155] Figure 6 This is a structural block diagram of the electrical box constant temperature control device provided in an embodiment of the present invention, as shown below. Figure 6 As shown, the electrical box temperature control device includes:

[0156] Module 61 is used to acquire the temperature of the electrical box;

[0157] The first control module 62 is used to control the semiconductor cooling chip to turn off or cool the electrical box according to the load activation ratio when the temperature of the electrical box is greater than the upper temperature threshold.

[0158] The second control module 63 is configured to control the semiconductor refrigeration piece to be turned off or heat the electrical appliance box according to the load opening ratio, the first end temperature of the semiconductor refrigeration piece and the bus energy storage capacitor capacity reduction ratio when the electrical appliance box temperature is less than the temperature lower threshold.

[0159] The third control module 64 is configured to control the semiconductor refrigeration piece to be turned off when the electrical appliance box temperature is greater than or equal to the temperature lower threshold and less than or equal to the temperature upper threshold.

[0160] Optionally, the first control module 62 comprises:

[0161] The first acquisition unit is configured to acquire the current load opening ratio.

[0162] The first control unit is configured to control the power supply direction of the semiconductor refrigeration piece to make the first end refrigerate and the second end heat to cool the electrical appliance box when the load opening ratio is greater than the first preset ratio.

[0163] The second control unit is configured to turn off the semiconductor refrigeration piece when the load opening ratio is less than or equal to the first preset ratio.

[0164] Optionally, the second control module 63 comprises:

[0165] The second acquisition unit is configured to acquire the current load opening ratio.

[0166] The third control unit is configured to turn off the semiconductor refrigeration piece when the load opening ratio is less than or equal to the second preset ratio.

[0167] The fourth control unit is configured to control the semiconductor refrigeration piece to be turned off or heat the electrical appliance box according to the first end temperature of the semiconductor refrigeration piece and the bus energy storage capacitor capacity reduction ratio when the first end is the cold end and only the second end is provided with a heat sink when the semiconductor refrigeration piece is forward powered and the load opening ratio is greater than the second preset ratio.

[0168] The fifth control unit is configured to control the semiconductor refrigeration piece to be turned off or heat the electrical appliance box according to the bus energy storage capacitor capacity reduction ratio when the second end is the cold end and the first end and the second end are both provided with heat sinks when the semiconductor refrigeration piece is forward powered and the load opening ratio is greater than the second preset ratio.

[0169] Optionally, the fourth control unit comprises:

[0170] The acquisition subunit is configured to acquire the current first end temperature of the semiconductor refrigeration piece.

[0171] The first control subunit is configured to turn off the semiconductor refrigeration sheet when the first end temperature of the semiconductor refrigeration sheet is greater than the upper limit of the heating temperature.

[0172] The second control subunit is configured to control the semiconductor refrigeration sheet to be turned off or heat the electric appliance box according to the capacity reduction ratio of the bus energy storage capacitor when the first end temperature of the semiconductor refrigeration sheet is less than or equal to the upper limit of the heating temperature.

[0173] Optionally, the fifth control unit and the second control subunit are both configured to: acquire the current capacity reduction ratio of the bus energy storage capacitor; control the power-on direction of the semiconductor refrigeration sheet to heat the first end and cool the second end to heat the electric appliance box when the capacity reduction ratio of the bus energy storage capacitor is greater than a ratio upper limit threshold; and turn off the semiconductor refrigeration sheet when the capacity reduction ratio of the bus energy storage capacitor is less than or equal to the ratio upper limit threshold.

[0174] Optionally, the electric appliance box constant temperature control device further comprises an initial control module configured to control the initial state of the semiconductor refrigeration sheet to be turned off when the controller in the electric appliance box starts to work.

[0175] The electric appliance box constant temperature control device described above can execute the electric appliance box constant temperature control method provided in the embodiments of the present application, and has the corresponding function modules and beneficial effects of the execution method. Technical details not described in detail in the embodiments can be referred to the electric appliance box constant temperature control method provided in the embodiments of the present application.

[0176] The device embodiments described above are only schematic, and the units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place or distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiments.

[0177] Embodiment 4

[0178] The present embodiment provides an electric appliance box, comprising: a controller, a semiconductor refrigeration sheet, and a first temperature sensor.

[0179] The semiconductor refrigeration sheet comprises a first end and a second end, the first end is located in the electric appliance box, and the second end is located outside the electric appliance box.

[0180] The first temperature sensor is configured to detect the temperature of the electric appliance box.

[0181] The controller comprises the electric appliance box constant temperature control device described in the above embodiments, and has the functions of controlling the load and detecting the capacity of the bus energy storage capacitor.

[0182] The semiconductor refrigeration sheet is arranged in the following two ways: (1) when the semiconductor refrigeration sheet is forward powered, the second end is the cold end, and the first end and the second end are both provided with a heat sink; or (2) when the semiconductor refrigeration sheet is forward powered, the first end is the cold end, and only the second end is provided with a heat sink, in which case, the electric appliance box further comprises: a second temperature sensor for detecting the temperature of the first end of the semiconductor refrigeration sheet. The two arrangement modes make the implementation of the scheme more flexible.

[0183] Embodiment 5

[0184] The embodiment provides a non-volatile computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the electric appliance box constant temperature control method in the above embodiment.

[0185] Embodiment 6

[0186] The embodiment provides an electronic device, which comprises a memory, a processor and a computer program stored in the memory and executable on the processor, and the processor implements the electric appliance box constant temperature control method in the above embodiment when executing the computer program.

[0187] Figure 7 is a hardware structure schematic diagram of the electronic device provided by the embodiment of the application, as shown in the figure, the electronic device comprises one or more processors 710 and a memory 720, Figure 7 in the embodiment, the processor 710 is taken as an example. Figure 7

[0188] The electronic device can further comprise an input device 730 and an output device 740.

[0189] The processor 710, the memory 720, the input device 730 and the output device 740 can be connected through a bus or other means, Figure 7 in the embodiment, the connection through the bus is taken as an example.

[0190] The memory 720 is a non-volatile computer readable storage medium, which can be used to store non-volatile software programs, non-volatile computer executable programs and modules, such as the program instructions / modules of the electric appliance box constant temperature control method in the embodiment of the application. The processor 710 executes various function applications and data processing by running the non-volatile software programs, instructions and modules stored in the memory 720, that is, the electric appliance box constant temperature control method is implemented.

[0191] ​The memory 720 can include a program storage area and a data storage area, wherein the program storage area can store application programs required by the operation of the apparatus, at least one function, and the like; and the data storage area can store running data, threshold data, and the like. In addition, the memory 720 can include a high-speed random access memory, and can further include a nonvolatile memory, such as at least one magnetic disk storage device, a flash memory device, or other nonvolatile solid-state memory device.

[0192] The input device 730 can receive input digital or character information, and generate key signal input related to user settings and function control of the electronic device.

[0193] The one or more modules are stored in the memory 720 and, when executed by the one or more processors 710, perform the above-mentioned electric appliance box constant temperature control method.

[0194] From the above description of the embodiments, those skilled in the art can clearly understand that the embodiments can be implemented by means of software plus necessary universal hardware platforms, and of course can also be implemented by hardware. Based on such understanding, the above technical solutions, essentially or in other words, the part that makes a contribution to the prior art, can be embodied in the form of a software product, which can be stored in a computer readable storage medium, such as a ROM / RAM, a magnetic disk, an optical disk, and the like, and includes a number of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute the methods described in each embodiment or some parts of the embodiments.

[0195] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to some technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A thermostat control method for an electrical box, comprising: The electric appliance box is provided with a semiconductor refrigeration sheet, the semiconductor refrigeration sheet comprises a first end and a second end, the first end is located in the electric appliance box, and the second end is located outside the electric appliance box, and the method comprises the following steps: Obtain the temperature of the electric appliance box; If the temperature of the electric appliance box is greater than the upper temperature threshold, control the semiconductor refrigeration sheet to be turned off or the electric appliance box to be cooled according to the load opening ratio; If the temperature of the electric appliance box is less than the lower temperature threshold, control the semiconductor refrigeration sheet to be turned off or the electric appliance box to be heated according to the load opening ratio, the first end temperature of the semiconductor refrigeration sheet and the capacity reduction ratio of the bus energy storage capacitor; If the temperature of the electric appliance box is greater than or equal to the lower temperature threshold and less than or equal to the upper temperature threshold, control the semiconductor refrigeration sheet to be turned off.

2. The method of claim 1, wherein, Controlling the semiconductor refrigeration sheet to be turned off or the electric appliance box to be cooled according to the load opening ratio comprises: Obtain the current load opening ratio; If the load opening ratio is greater than the first preset ratio, control the power supply direction of the semiconductor refrigeration sheet to make the first end refrigerate and the second end heat, so as to cool the electric appliance box; If the load opening ratio is less than or equal to the first preset ratio, turn off the semiconductor refrigeration sheet.

3. The method of claim 1, wherein, Controlling the semiconductor refrigeration sheet to be turned off or the electric appliance box to be heated according to the load opening ratio, the first end temperature of the semiconductor refrigeration sheet and the capacity reduction ratio of the bus energy storage capacitor comprises: Obtain the current load opening ratio; If the load opening ratio is less than or equal to the second preset ratio, turn off the semiconductor refrigeration sheet; If the load opening ratio is greater than the second preset ratio, control the semiconductor refrigeration sheet to be turned off or the electric appliance box to be heated according to the first end temperature of the semiconductor refrigeration sheet and the capacity reduction ratio of the bus energy storage capacitor, in the case that the first end is a cold end and only the second end is provided with a heat sink when the semiconductor refrigeration sheet is forward powered; If the load opening ratio is greater than the second preset ratio, control the semiconductor refrigeration sheet to be turned off or the electric appliance box to be heated according to the capacity reduction ratio of the bus energy storage capacitor, in the case that the second end is a cold end and both the first end and the second end are provided with heat sinks when the semiconductor refrigeration sheet is forward powered.

4. The method of claim 3, wherein, Controlling the semiconductor refrigeration sheet to be turned off or the electric appliance box to be heated according to the first end temperature of the semiconductor refrigeration sheet and the capacity reduction ratio of the bus energy storage capacitor comprises: Obtain the current first end temperature of the semiconductor refrigeration sheet; If the first end temperature of the semiconductor refrigeration sheet is greater than the upper heating temperature limit, turn off the semiconductor refrigeration sheet; If the first end temperature of the semiconductor refrigeration sheet is less than or equal to the upper heating temperature limit, control the semiconductor refrigeration sheet to be turned off or the electric appliance box to be heated according to the capacity reduction ratio of the bus energy storage capacitor.

5. The method according to claim 3 or 4, characterized in that, Controlling the semiconductor refrigeration sheet to be turned off or the electric appliance box to be heated according to the capacity reduction ratio of the bus energy storage capacitor comprises: Obtain the current capacity reduction ratio of the bus energy storage capacitor; If the bus energy storage capacitor capacity drop ratio is greater than the upper limit threshold, the power-on direction of the semiconductor refrigeration sheet is controlled to heat the first end and cool the second end to heat the electric appliance box. If the bus energy storage capacitor capacity drop ratio is less than or equal to the upper limit threshold, the semiconductor refrigeration sheet is turned off.

6. The method according to any one of claims 1 to 4, characterized in that, The method further includes that when the controller in the electric appliance box starts to work, the initial state of the semiconductor refrigeration sheet is turned off.

7. An electrical box constant temperature control device, characterized in that, The electric appliance box is provided with a semiconductor refrigeration sheet, the semiconductor refrigeration sheet includes a first end and a second end, the first end is located in the electric appliance box, and the second end is located outside the electric appliance box, and the device includes: An acquisition module is configured to acquire the temperature of the electric appliance box. A first control module is configured to, when the temperature of the electric appliance box is greater than an upper limit threshold, control the semiconductor refrigeration sheet to be turned off or to cool the electric appliance box according to a load opening ratio. A second control module is configured to, when the temperature of the electric appliance box is less than a lower limit threshold, control the semiconductor refrigeration sheet to be turned off or to heat the electric appliance box according to the load opening ratio, the temperature of the first end of the semiconductor refrigeration sheet, and the bus energy storage capacitor capacity drop ratio. A third control module is configured to, when the temperature of the electric appliance box is greater than or equal to the lower limit threshold and less than or equal to the upper limit threshold, control the semiconductor refrigeration sheet to be turned off.

8. An electrical box, characterized by: It includes: A controller, a semiconductor refrigeration sheet, and a first temperature sensor. The semiconductor refrigeration sheet includes a first end and a second end, the first end is located in the electric appliance box, and the second end is located outside the electric appliance box. The first temperature sensor is configured to detect the temperature of the electric appliance box. The controller includes the electric appliance box thermostat control device of claim 7, and has the functions of controlling a load and detecting the bus energy storage capacitor capacity.

9. The electric appliance box of claim 8, wherein: When the semiconductor refrigeration sheet is powered in a forward direction, the second end is a cold end, and both the first end and the second end are provided with heat sinks; or When the semiconductor refrigeration sheet is powered in a forward direction, the first end is a cold end, and only the second end is provided with a heat sink, and in this case, the electric appliance box further includes a second temperature sensor configured to detect the temperature of the first end of the semiconductor refrigeration sheet.

10. An electronic device comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method of any one of claims 1 to 6 when executing the computer program.

11. A non-transitory computer readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method of any one of claims 1 to 6.

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