Light-emitting substrate, manufacturing method thereof and display device

Abstract

The invention discloses a light-emitting substrate, a manufacturing method thereof and a display device, a light-emitting chip packaging mode of combining a lens and a protective adhesive layer is adopted, the protective adhesive layer is firstly used for packaging and protecting a light-emitting chip, then the lens is mounted outside the protective adhesive layer, the protective adhesive layer plays a role in protecting the light-emitting chip and isolating water and oxygen, and the light-emitting chip is prevented from being damaged. The lens improves the light shape of the light-emitting chip, the lens is generally manufactured in an injection molding mode, the boundary dimension precision is high, the problems that in the prior art, due to the morphology and dimension difference of protection glue, brightness and darkness of a picture are not uniform, and brightness and darkness stripes are caused can be effectively solved, and the picture uniformity is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a light-emitting substrate, a manufacturing method thereof, and a display device. Background Art

[0002] Mini LED (Light Emitting Diode) has the characteristics of energy saving, light weight, wide color gamut, ultra-high contrast, fine dynamic zoning, etc., and is widely used in display backlight. The backlight sources using LED are mainly divided into two types: side-entry and direct-down. Among them, the direct-down backlight method can achieve regional brightness adjustment by increasing the number of backlight sources, that is, placing multiple LED chips on the light board. LEDs are usually packaged with protective glue. The protective glue not only improves the light shape, but also protects the LED. However, the protective glue needs to be made by dispensing equipment. The shape of the protective glue is not easy to control, the external dimensions fluctuate greatly, and there is a problem of bubbles in the protective glue, which causes uneven brightness of the backlight screen. Summary of the Invention

[0003] The embodiments of the present invention provide a light-emitting substrate, a method for manufacturing the same, and a display device, which are used to improve the uneven brightness of backlight images in the background art and enhance the uniformity of the image. The specific solution is as follows:

[0004] An embodiment of the present invention provides a light-emitting substrate, comprising:

[0005] substrate;

[0006] A light-emitting chip is provided on the substrate;

[0007] a protective adhesive layer, disposed on a side of the light-emitting chip facing away from the substrate, the protective adhesive layer covering the light-emitting chip;

[0008] The lens is arranged on the side of the protective adhesive layer away from the substrate. The bottom surface of the lens is provided with an arc-shaped cavity with an opening toward the substrate. At least part of the protective adhesive layer and the light-emitting chip are located in the arc-shaped cavity.

[0009] Optionally, in the above-mentioned light-emitting substrate provided in an embodiment of the present invention, the protective adhesive layer includes: a flat portion covering the side of the light-emitting chip facing away from the substrate, and an inclined portion covering the side of the light-emitting chip; the protective adhesive layer is completely located inside the arc-shaped cavity.

[0010] Optionally, in the above-mentioned light-emitting substrate provided in an embodiment of the present invention, the distance between the orthographic projection boundary of the arc-shaped cavity on the substrate and the orthographic projection boundary of the protective adhesive layer on the substrate is greater than 0.7 mm, and the distance from the side of the flat portion away from the substrate to the substrate is less than the height of the arc-shaped cavity.

[0011] Optionally, the above-mentioned light-emitting substrate provided in an embodiment of the present invention further includes an adhesive layer arranged between the substrate and the lens, and the lens is fixed on the substrate through the adhesive layer, and the orthographic projection of the adhesive layer on the substrate is located between the orthographic projection boundary of the lens on the substrate and the orthographic projection boundary of the arc-shaped cavity on the substrate.

[0012] Optionally, in the above-mentioned light-emitting substrate provided by an embodiment of the present invention, the material of the protective adhesive layer includes silicone, and the material of the adhesive layer includes polyurethane reactive adhesive.

[0013] Optionally, in the above-mentioned light-emitting substrate provided by an embodiment of the present invention, the adhesive layer includes at least three adhesive portions spaced apart around the arc-shaped cavity.

[0014] Optionally, in the above-mentioned light-emitting substrate provided by an embodiment of the present invention, the material of the protective adhesive layer includes silicone, and the material of the adhesive layer is the same as that of the protective adhesive layer.

[0015] Optionally, in the above-mentioned light-emitting substrate provided by an embodiment of the present invention, the adhesive layer is an annular structure arranged around the arc-shaped cavity.

[0016] Optionally, in the above-mentioned light-emitting substrate provided by an embodiment of the present invention, the lens has a groove at a position corresponding to the adhesive layer, and the adhesive layer fills the groove.

[0017] Optionally, in the above-mentioned light-emitting substrate provided by an embodiment of the present invention, the protective adhesive layer includes: a main body portion filling the arc-shaped cavity, and an extension portion extending from the bottom of the main body portion to between the lens and the substrate.

[0018] Optionally, the above-mentioned light-emitting substrate provided in an embodiment of the present invention further includes: a routing layer located between the substrate and the light-emitting chip, and a reflective layer located between the routing layer and the light-emitting chip; wherein the reflective layer has an opening, and the light-emitting chip is located in the opening.

[0019] Correspondingly, an embodiment of the present invention further provides a display device, comprising: the above-mentioned light-emitting substrate provided by an embodiment of the present invention, and a display panel located on the light-emitting side of the light-emitting substrate; the light-emitting substrate provides backlight for the display panel.

[0020] Accordingly, an embodiment of the present invention further provides a method for manufacturing a light-emitting substrate, which is used to manufacture the light-emitting substrate provided by an embodiment of the present invention. The manufacturing method includes:

[0021] forming a light-emitting chip on a substrate;

[0022] forming a protective adhesive layer covering the light-emitting chip on a side of the light-emitting chip facing away from the substrate;

[0023] The lens is attached to the substrate; wherein the bottom surface of the lens is provided with an arc-shaped cavity with an opening toward one side of the substrate, and at least a portion of the protective adhesive layer and the light-emitting chip are located in the arc-shaped cavity.

[0024] Optionally, in the above-mentioned manufacturing method provided by the embodiment of the present invention, forming the protective adhesive layer specifically includes:

[0025] A protective adhesive material is applied on the side of the light emitting chip away from the substrate and waited for the protective adhesive material to be leveled, so that the protective adhesive layer includes a flat portion covering the side of the light emitting chip away from the substrate and an inclined portion covering the side of the light emitting chip.

[0026] Optionally, in the above-mentioned manufacturing method provided by the embodiment of the present invention, forming the protective adhesive layer specifically includes:

[0027] A protective adhesive material is applied on a side of the light-emitting chip facing away from the substrate to form an arc-shaped protective adhesive; wherein the height of the arc-shaped protective adhesive is greater than the height of the arc-shaped cavity, and the diameter of the arc-shaped protective adhesive is greater than the diameter of the arc-shaped cavity;

[0028] The arc-shaped cavity of the lens is aligned and fitted with the arc-shaped protective adhesive, so that the arc-shaped protective adhesive forms a main body portion filling the arc-shaped cavity and an extension portion extending from the bottom of the main body portion to between the lens and the substrate.

[0029] The beneficial effects of the embodiments of the present invention are as follows:

[0030] The embodiments of the present invention provide a light-emitting substrate, a manufacturing method thereof, and a display device. By adopting a light-emitting chip packaging method combining a lens and a protective adhesive layer, the light-emitting chip is first packaged and protected with a protective adhesive layer, and then a lens is mounted on the outside of the protective adhesive layer. The protective adhesive layer protects the light-emitting chip and isolates water and oxygen, and the lens improves the light shape of the light-emitting chip. Since the lens is generally manufactured by injection molding and has high external dimensional accuracy, it can effectively improve the problems of uneven brightness and light and dark stripes in the picture caused by differences in the morphology and size of the protective adhesive in the existing technology, thereby improving the uniformity of the picture. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic structural diagram of a light-emitting substrate provided in the related art;

[0032] Figure 2 for Figure 1 Schematic diagram of the local structure in;

[0033] Figure 3 for Figure 2 corresponding top view schematic diagram;

[0034] Figure 4 Schematic diagram of the difference in protective glue morphology;

[0035] Figure 5 Schematic diagram of protective glue bubble;

[0036] Figure 6 A schematic structural diagram of a light-emitting substrate provided by an embodiment of the present invention;

[0037] Figure 7 for Figure 6 corresponding top view schematic diagram;

[0038] Figure 8 A schematic structural diagram of another light-emitting substrate provided by an embodiment of the present invention;

[0039] Figure 9 for Figure 8 corresponding top view schematic diagram;

[0040] Figure 10 A schematic structural diagram of another light-emitting substrate provided by an embodiment of the present invention;

[0041] Figure 11 for Figure 10 corresponding top view schematic diagram;

[0042] Figure 12 A schematic flow chart of a method for manufacturing a light-emitting substrate provided by an embodiment of the present invention;

[0043] Figure 13A and Figure 13B For production Figure 6 The schematic diagram of the structure of the light-emitting substrate after performing each step is shown;

[0044] Figure 14 For production Figure 10 The structure diagram of the light-emitting substrate after the manufacturing steps are performed is shown. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. And in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] Unless otherwise defined, the technical or scientific terms used in the present invention shall have the usual meanings understood by persons of ordinary skill in the field to which the present invention belongs. The words “include” or “comprise” and the like used in the present invention mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as “connect” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Inside”, “outside”, “upper”, “lower”, etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0047] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present invention. The same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions.

[0048] Mini LED backlight mainly includes Mini LED light-emitting substrate, diffusion plate, quantum dot film, diffusion sheet and composite film, etc. Among them, the design diagram of Mini LED light-emitting substrate is as follows: Figure 1-Figure 3 As shown, Figure 1 is a cross-sectional schematic diagram of a light-emitting substrate, Figure 2 for Figure 1 Schematic diagram of the local structure in Figure 3 for Figure 2 The corresponding top view shows the light-emitting substrate, from bottom to top, consisting of substrate 1, trace layer 2, reflective layer 3, chip 4, protective adhesive 5, and connector 6. Signals are controlled by a printed circuit board (PCB) and connected by connector 6. Substrate 1 serves as a load-bearing substrate and is typically an Al substrate; trace layer 2, typically a Cu layer, transmits signals; reflective layer 3 reflects light and is typically made of photosensitive ink; chip 4 includes an IC and LED, with the LED being the light-emitting unit and the IC the control unit. Due to cost constraints, current LEDs are usually in the form of bare crystals, so they need to be packaged during the manufacturing process. The packaging is in the form of lenses, which protect the LEDs on the one hand and improve the LED light shape on the other. The protective glue used for packaging is made by dispensing the glue through the equipment glue valve. The diameter and height of the protective glue are adjusted by adjusting the glue amount and path. Due to the limitation of equipment accuracy, the production accuracy of protective glue 5 for the same glue valve is diameter (W1) ±100μm, height (H1) ±70μm; in addition to the fluctuations in height and diameter, the morphology of the protective glue also fluctuates. Due to the limitation of production time, the same substrate usually requires more than 6 glue valves to make protective glue. There are equipment differences and debugging process differences between different glue valves, and the overall production accuracy of the protective glue is worse, which leads to large differences in the morphology of the protective glue on the same substrate. Figure 4 As shown in the figure, some protective glue 5 has a relatively flat top, while some protective glue 5 has a relatively sharp top. The different shapes and sizes of the protective glue 5 make the light shape of the LED different, with some places being bright and some places being dark. In addition, during the protective glue dispensing process, the air in the gap between the protective glue and the LED is not easy to be discharged, resulting in protective glue bubbles 7, such as Figure 5 As shown, the protective glue bubble 7 is on the side of the LED chip, which affects the light output of the LED and causes the area directly above the LED to be brighter.

[0049] In summary, due to fluctuations in equipment precision, there are differences in the shape, position and size of the coated protective glue, which leads to uneven brightness and light and dark stripes when the entire light-emitting substrate is lit.

[0050] In view of this, in order to solve the above-mentioned uneven brightness and dark stripes of the screen, the embodiment of the present invention provides a light-emitting substrate, such as Figures 6-11 As shown, Figure 6 A schematic cross-sectional view of a light-emitting substrate provided in an embodiment of the present invention is shown. Figure 7 for Figure 6 The corresponding top view diagram, Figure 8 A schematic cross-sectional view of another light-emitting substrate provided by an embodiment of the present invention is shown. Figure 9 for Figure 8 The corresponding top view diagram, Figure 10 A schematic cross-sectional view of another light-emitting substrate provided by an embodiment of the present invention is shown. Figure 11 for Figure 10 Corresponding top view schematic diagram, the light-emitting substrate includes:

[0051] Substrate 10; for example, the substrate 10 may be a glass substrate or a substrate of other applicable materials, which is not limited in the embodiment of the present invention;

[0052] The light emitting chip 20 is disposed on the substrate 10; for example, the light emitting chip 20 is an LED chip;

[0053] The protective adhesive layer 30 is provided on the side of the light emitting chip 20 facing away from the substrate 10 , and covers the light emitting chip 20 . For example, the material of the protective adhesive layer 30 may be silicone.

[0054] The lens 40 is disposed on the side of the protective adhesive layer 30 facing away from the substrate 10 . The bottom surface of the lens 40 is provided with an arc-shaped cavity 401 with an opening toward the substrate 10 . At least part of the protective adhesive layer 30 and the light-emitting chip 20 are located in the arc-shaped cavity 401 .

[0055] The above-mentioned light-emitting substrate provided by the embodiment of the present invention adopts a light-emitting chip packaging method combining a lens and a protective adhesive layer. The light-emitting chip is first encapsulated and protected with a protective adhesive layer, and then a lens is mounted on the outside of the protective adhesive layer. The protective adhesive layer protects the light-emitting chip and isolates water and oxygen, and the lens improves the light shape of the light-emitting chip. Since the lens is generally made by injection molding, the external dimensions are highly accurate, which can effectively improve the problems of uneven brightness and light and dark stripes in the existing technology caused by the morphology and size differences of the protective adhesive, thereby improving the uniformity of the picture.

[0056] In some embodiments, in the above-mentioned light-emitting substrate provided by the embodiment of the present invention, as Figures 6-11 As shown, the substrate 10 further includes a wiring layer 50 positioned between the substrate 10 and the light-emitting chip 20, and a reflective layer 60 positioned between the wiring layer 50 and the light-emitting chip 20. The reflective layer 60 allows light emitted by the light-emitting chip 20 to be emitted toward a side of the light-emitting chip 20 away from the substrate 10. The reflective layer 60 has an opening, and the light-emitting chip 20 is positioned within the opening. Specifically, the reflective layer 60 reflects incident light. For example, the reflective layer 60 may be made of white oil, or other suitable reflective materials, which are not limited in the present invention.

[0057] In some embodiments, in the above-mentioned light-emitting substrate provided by the embodiment of the present invention, as Figure 6-Figure 9 As shown, the protective adhesive layer 30 includes: a flat portion 301 covering the side of the light emitting chip 20 facing away from the substrate 10, and an inclined portion 302 covering the side of the light emitting chip 20; the protective adhesive layer 30 is completely located inside the arc-shaped cavity 401. For example, when preparing the protective adhesive layer 30, the protective adhesive can be dripped onto the upper surface of the light emitting chip 20. Since the protective adhesive has fluidity, it will be cured after it is leveled. By controlling the amount of the dripped protective adhesive, the cured protective adhesive layer 30 can have a Figure 6 and Figure 8 The flat portion 301 and the inclined portion 302 shown in the figure encapsulate the light-emitting chip 20. The protective adhesive layer 30 seals the light-emitting chip 20, preventing moisture from entering the chip 20 and causing corrosion. Furthermore, the method of first dripping and then leveling the protective adhesive layer 30 effectively removes bubbles from the gaps.

[0058] In some embodiments, as Figure 6 and Figure 8 As shown, if the thickness h of the flat portion 301 is too thin, it cannot protect the light emitting chip 20 , and if it is too thick, it will affect the light shape of the light emitting chip 20 . Therefore, the thickness h of the flat portion 301 can be 20 μm to 100 μm.

[0059] In some embodiments, as Figure 6-Figure 9As shown, the orthographic projection of the protective adhesive layer 30 on the substrate 10 can be circular. While ensuring that the light-emitting chip 20 is completely covered by the protective adhesive layer 30, the diameter B of the protective adhesive layer 30 is as small as possible to prevent the protective adhesive layer 30 from interfering with the lens 40. For example, B can be the length of the light-emitting chip 20 + 0.2 mm. In addition, the size of the aperture A of the arc-shaped cavity 401 of the lens 40 needs to take into account the size and manufacturing accuracy of the light-emitting chip 20 and the lens mounting accuracy, ensuring that the arc-shaped cavity 401 does not interfere with the protective adhesive layer 30. For example, the distance (AB) between the orthographic projection boundary of the arc-shaped cavity 401 on the substrate 10 and the orthographic projection boundary of the protective adhesive layer 30 on the substrate 10 is greater than 0.7 mm, that is, A>B+0.7 mm, where 0.7=2*0.35 mm (0.35 mm is 0.1B size accuracy + 0.1B position accuracy + 0.1 lens position accuracy + 0.05 lens manufacturing accuracy).

[0060] In some embodiments, as Figure 6-Figure 9 As shown, the distance from the side of the flat portion 301 facing away from the substrate 10 to the substrate 10 is less than the height E of the arc cavity 401 . The height E of the arc cavity 401 only needs to ensure that it does not interfere with the light emitting chip 20 , for example, E>0.2 mm.

[0061] In some embodiments, as Figure 6-Figure 9 As shown, the aperture W2 and height H2 of the lens 40 are set according to the product pitch design and the light-emitting chip selection. Usually, W2 is 4mm-5mm, and H2 is 1.3mm-1.7mm.

[0062] It should be noted that Figure 6 and Figure 8 The cross-sectional shape of the lens shown in the figure is for illustration only. Parameters such as the arc-shaped cavity and the curvature of the surface of the lens can be set according to the actual need to achieve a uniform light effect, and the embodiment of the present invention does not impose any limitation on this.

[0063] In some embodiments, as Figure 6-Figure 9 As shown, the lens 40 is further secured to the substrate 10 via an adhesive layer 70 disposed between the substrate 10 and the lens 40. For example, the orthographic projection of the adhesive layer 70 on the substrate 10 is located between the orthographic projection boundary of the lens 40 on the substrate 10 and the orthographic projection boundary of the arc-shaped cavity 401 on the substrate 10. For example, the adhesive layer 70 can be formed on a reflective layer (described later) on the surface of the substrate 10, thereby bonding the lens 40 to the substrate 10.

[0064] In some embodiments, as Figure 6 and Figure 8As shown, the distance D between the adhesive layer 70 and the edge of the lens 40 can be set according to the appearance specifications, the adhesive layer manufacturing accuracy and the lens mounting accuracy; the thickness of the adhesive layer 50 can be 0.15±0.05mm.

[0065] In some embodiments, as Figure 6 and Figure 7 As shown, the material of the protective adhesive layer 30 can be silicone, and the material of the adhesive layer 70 can be polyurethane reactive adhesive. Since the polyurethane reactive adhesive has strong bonding strength, the polyurethane reactive adhesive can be coated on the reflective layer on the surface of the substrate 10 using three points. For example, the adhesive layer 70 includes at least three adhesive portions 701 spaced apart around the arc-shaped cavity 401 (the embodiment of the present invention takes three adhesive portions 701 as an example). This can save the coating time and the amount of adhesive used.

[0066] In some embodiments, as Figure 6 and Figure 7 As shown, the orthographic projection shape of the bonding portion 701 on the substrate 10 can be a circle, and the diameter C of the bonding portion 701 needs to take into account the lens thrust effect and only needs to meet the thrust requirement.

[0067] certainly, Figure 6 and Figure 7 The adhesive layer 70 can also be designed to be annular, but more adhesive material needs to be applied and the process time is longer. Therefore, only three adhesive portions 701 spaced apart around the arc-shaped cavity 401 need to be applied to meet the bonding effect requirements.

[0068] In some embodiments, as Figure 8 and Figure 9 As shown, the material of the protective adhesive layer 30 can be silicone, and the material of the adhesive layer 70 can be the same as that of the protective adhesive layer 30. In this way, the same equipment can be used to directly coat the silicone material on the periphery of the light emitting chip 20 after the protective adhesive layer 30 is made above the light emitting chip 20, and then the lens is attached and cured. This solution can reduce one material and process. However, due to the low adhesive strength of silicone, the use of Figure 6 and Figure 7 The three-point coating shown cannot meet the thrust requirements, so a circle of silicone must be applied to meet the bonding effect requirements, so Figure 8 and Figure 9 The adhesive layer 70 shown is an annular structure disposed around the arc-shaped cavity 401 , which prolongs the time required to manufacture the adhesive layer 70 .

[0069] In some embodiments, as Figure 6 and Figure 8 As shown, the lens 40 has a groove 402 at a position corresponding to the adhesive layer 70, and the adhesive layer 70 fills the groove 402. This can improve the bonding effect between the lens 40 and the substrate 10.

[0070] In some embodiments, as Figure 10 and Figure 11 As shown, the protective adhesive layer 30 includes a main portion 303 that fills the arc-shaped cavity 401, and an extension portion 304 that extends from the bottom of the main portion 303 to between the lens 40 and the substrate 10. This allows the protective adhesive (in the shape of a lens) to be applied to the light-emitting chip 20 first. The height and diameter of the protective adhesive should be larger than the diameter and height of the arc-shaped cavity 401 of the lens 40. This ensures that when the lens 40 is attached, the protective adhesive (i.e., the main portion 303) can completely fill the arc-shaped cavity 401 of the lens 40, and the excess adhesive (i.e., the extension portion 304) can bond the lens 40 to the substrate 10. This embodiment effectively removes bubbles from the protective adhesive during the attachment process of the lens 40. Furthermore, this embodiment can reduce the number of process steps.

[0071] Specifically, Figure 10 The parameters of the middle lens 40 can be found in the previous description. Figure 6 and Figure 8 The description is not detailed here.

[0072] It should be noted that Figures 6-11 The orthographic projection shape of the lens 40 shown in FIG is only an example. Figures 6-11 In addition to the circle shown in the figure, in other examples, the lens 40 can also be other shapes, such as an ellipse, a triangle, a pentagon or a hexagon, etc., which is determined according to the needs of the actual application scenario and is not limited in this embodiment.

[0073] It should be noted that Figures 6-11 The orthographic projection shape of the light emitting chip 20 shown in FIG is only an example. Figures 6-11 In addition to the square shown in the figure, in other examples, the light emitting chip 20 can also be other shapes, such as circle, ellipse, triangle, pentagon or hexagon, etc., which is determined according to the needs of the actual application scenario and is not limited in this embodiment.

[0074] Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a light-emitting substrate, which is used to manufacture the light-emitting substrate provided by an embodiment of the present invention. Figure 12 As shown, the production method may include:

[0075] S1201, forming a light-emitting chip on a substrate;

[0076] S1202, forming a protective adhesive layer covering the light-emitting chip on a side of the light-emitting chip facing away from the substrate;

[0077] S1203, attaching the lens to the substrate; wherein the bottom surface of the lens is provided with an arc-shaped cavity with an opening toward one side of the substrate, and at least a portion of the protective adhesive layer and the light-emitting chip are located in the arc-shaped cavity.

[0078] Below Figure 6 The manufacturing method of the light-emitting substrate shown in FIG. 1 is described, and the specific manufacturing steps include:

[0079] (1) A wiring layer 50, a reflective layer 60 and a light emitting chip 20 are sequentially formed on the substrate, and a protective adhesive material 30' is applied on the side of the light emitting chip 20 away from the substrate, as shown in FIG. Figure 13A After the protective adhesive material 30 'is leveled and solidified to form a protective adhesive layer 30, that is, the protective adhesive layer 30 includes a flat portion 301 covering the light emitting chip 20 away from the side of the substrate 10 and a tilted portion 302 covering the side of the light emitting chip 20, as shown Figure 13B shown.

[0080] (2) A three-point adhesive portion 701 is formed on the reflective layer 60 (forming an adhesive layer 70), and then the lens 40 is attached to the substrate 10, as shown in FIG. Figure 6 As shown; the bonding glue adopts a naturally curing glue material (such as a polyurethane reactive glue material).

[0081] Production Figure 8 The light-emitting substrate shown is made Figure 6 The light-emitting substrates shown are basically the same, the only difference is that the material of the adhesive layer 70 is the same as that of the protective adhesive layer 30, that is, after the protective adhesive layer 30 is made, a circle of adhesive material is coated on the reflective layer 60 using the same equipment to form an annular adhesive layer 70.

[0082] Below Figure 10 The manufacturing method of the light-emitting substrate shown in FIG. 1 is described, and the specific manufacturing steps include:

[0083] (1) A wiring layer 50, a reflective layer 60 and a light emitting chip 20 are sequentially formed on the substrate, and a protective adhesive material is applied on the side of the light emitting chip 20 away from the substrate 10 to form an arc-shaped protective adhesive 30', as shown in FIG. Figure 14 wherein the arc-shaped protective glue 30 'is greater than the height of the arc-shaped cavity 401 of the lens 40, and the arc-shaped protective glue 30 'is greater than the diameter of the arc-shaped cavity 401.

[0084] (2) Align the arc-shaped cavity 401 of the lens 40 with the arc-shaped protective adhesive 30', so that the arc-shaped protective adhesive 30' forms a main body 303 that fills the arc-shaped cavity 401 and an extension 304 that extends from the bottom of the main body 303 to between the lens 40 and the reflective layer 60, as shown in FIG. Figure 10 shown.

[0085] Based on the same inventive concept, embodiments of the present invention further provide a display device comprising: the aforementioned light-emitting substrate provided in embodiments of the present invention; and a display panel located on the light-emitting side of the light-emitting substrate; the light-emitting substrate provides backlight for the display panel. The principles of this display device are similar to those of the aforementioned light-emitting substrate, so the implementation of this display device can refer to the implementation of the aforementioned light-emitting substrate, and any overlaps will not be repeated here.

[0086] For example, the display panel may be a liquid crystal display panel. In this case, the display panel includes an array substrate and an opposing substrate disposed oppositely, with the light-emitting substrate located on a side of the array substrate away from the opposing substrate. For example, the opposing substrate may be a color filter substrate, with a liquid crystal layer further disposed between the array substrate and the color filter substrate.

[0087] For example, the display device may further include a backlight film portion located between the light-emitting substrate and the display panel. For example, the backlight film portion may include a film material such as tape that bonds the light-emitting substrate to the display panel. For details, please refer to the relevant art and this embodiment will not be described in detail.

[0088] The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigation system, etc. Other essential components of the display device are well understood by those skilled in the art and are not described in detail here, nor should they be construed as limiting the present invention.

[0089] The embodiments of the present invention provide a light-emitting substrate, a manufacturing method thereof, and a display device. By adopting a light-emitting chip packaging method combining a lens and a protective adhesive layer, the light-emitting chip is first packaged and protected with a protective adhesive layer, and then a lens is mounted on the outside of the protective adhesive layer. The protective adhesive layer protects the light-emitting chip and isolates water and oxygen, and the lens improves the light shape of the light-emitting chip. Since the lens is generally manufactured by injection molding and has high external dimensional accuracy, it can effectively improve the problems of uneven brightness and light and dark stripes in the picture caused by differences in the morphology and size of the protective adhesive in the existing technology, thereby improving the uniformity of the picture.

[0090] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A light-emitting substrate, characterized in that: include: substrate; A light-emitting chip is provided on the substrate; a protective adhesive layer, disposed on a side of the light-emitting chip facing away from the substrate, the protective adhesive layer covering the light-emitting chip; The lens is arranged on the side of the protective adhesive layer away from the substrate. The bottom surface of the lens is provided with an arc-shaped cavity with an opening toward the substrate. At least part of the protective adhesive layer and the light-emitting chip are located in the arc-shaped cavity.

2. The light-emitting substrate according to claim 1, wherein The protective adhesive layer includes: a flat portion covering the side of the light-emitting chip facing away from the substrate, and an inclined portion covering the side of the light-emitting chip; the protective adhesive layer is completely located inside the arc-shaped cavity.

3. The light-emitting substrate according to claim 2, wherein The distance between the orthographic projection boundary of the arc-shaped cavity on the substrate and the orthographic projection boundary of the protective adhesive layer on the substrate is greater than 0.7 mm, and the distance from the side of the flat portion away from the substrate to the substrate is less than the height of the arc-shaped cavity.

4. The light-emitting substrate according to claim 3, wherein It also includes an adhesive layer arranged between the substrate and the lens, the lens is fixed to the substrate through the adhesive layer, and the orthographic projection of the adhesive layer on the substrate is located between the orthographic projection boundary of the lens on the substrate and the orthographic projection boundary of the arc-shaped cavity on the substrate.

5. The light-emitting substrate according to claim 4, wherein The material of the protective adhesive layer includes silicone, and the material of the adhesive layer includes polyurethane reactive adhesive.

6. The light-emitting substrate according to claim 5, wherein The bonding adhesive layer includes at least three bonding parts spaced apart around the arc-shaped cavity.

7. The light-emitting substrate according to claim 4, wherein The material of the protective adhesive layer includes silica gel, and the material of the bonding adhesive layer is the same as that of the protective adhesive layer.

8. The light-emitting substrate according to claim 7, wherein The adhesive layer is an annular structure arranged around the arc-shaped cavity.

9. The light-emitting substrate according to any one of claims 4 to 8, wherein: The lens has a groove at a position corresponding to the adhesive layer, and the adhesive layer fills the groove.

10. The light-emitting substrate according to claim 1, wherein The protective adhesive layer includes a main body portion filling the arc-shaped cavity and an extending portion extending from the bottom of the main body portion to between the lens and the substrate.

11. The light-emitting substrate according to any one of claims 1 to 8 and 10, characterized in that: The invention further comprises: a wiring layer located between the substrate and the light-emitting chip, and a reflection layer located between the wiring layer and the light-emitting chip; wherein the reflection layer has an opening, and the light-emitting chip is located in the opening.

12. A display device, characterized in that: include: The light-emitting substrate according to any one of claims 1 to 11, and a display panel located on the light-emitting side of the light-emitting substrate; The light emitting substrate provides backlight for the display panel.

13. A method for manufacturing a light-emitting substrate, for manufacturing the light-emitting substrate according to any one of claims 1 to 11, characterized in that: The production method comprises: forming a light-emitting chip on a substrate; forming a protective adhesive layer covering the light-emitting chip on a side of the light-emitting chip facing away from the substrate; The lens is attached to the substrate; wherein the bottom surface of the lens is provided with an arc-shaped cavity with an opening toward one side of the substrate, and at least a portion of the protective adhesive layer and the light-emitting chip are located in the arc-shaped cavity.

14. The production method according to claim 13, wherein: Forming the protective adhesive layer specifically includes: A protective adhesive material is applied on the side of the light emitting chip away from the substrate and waited for the protective adhesive material to be leveled, so that the protective adhesive layer includes a flat portion covering the side of the light emitting chip away from the substrate and an inclined portion covering the side of the light emitting chip.

15. The manufacturing method according to claim 13, wherein: Forming the protective adhesive layer specifically includes: A protective adhesive material is applied on a side of the light-emitting chip facing away from the substrate to form an arc-shaped protective adhesive; wherein the height of the arc-shaped protective adhesive is greater than the height of the arc-shaped cavity, and the diameter of the arc-shaped protective adhesive is greater than the diameter of the arc-shaped cavity; The arc-shaped cavity of the lens is aligned and fitted with the arc-shaped protective adhesive, so that the arc-shaped protective adhesive forms a main body portion filling the arc-shaped cavity and an extension portion extending from the bottom of the main body portion to between the lens and the substrate.

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