LED support structure and processing method thereof

Abstract

The invention relates to the technical field of LEDs, in particular to an LED support structure and a processing method thereof.The LED support structure comprises a terminal board piece, the terminal board piece comprises at least one terminal unit, and the terminal unit comprises a plurality of terminal assemblies which are arranged in a rectangular array in the first direction and the second direction perpendicular to the first direction; each terminal assembly comprises two conductive terminals which are arranged at an interval in the first direction, and each conductive terminal is connected with the adjacent conductive terminal in the adjacent terminal assembly through a connecting part; the insulating plate comprises a plurality of insulating bases, the insulating bases and the terminal assemblies are arranged in a one-to-one correspondence mode, and the insulating bases wrap the corresponding terminal assemblies so that the two conductive terminals can be insulated; wherein the surfaces of the two ends, in the third direction, of each conductive terminal are exposed out of the insulating base, and the third direction is perpendicular to the first direction and the second direction. According to the invention, the product yield of the LED support structure is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and in particular to an LED bracket structure and a processing method thereof. Background Art

[0002] With the advancement of display panel technology, the demand for thinner, higher-definition flexible displays is growing. However, traditional LED (Light Emitting Diode) displays suffer from numerous issues that prevent them from meeting market demand. The large pixel pitch of traditional LED displays limits image clarity, making it difficult to achieve high-definition display effects. Furthermore, the backlight source of traditional LED displays is typically thick and heavy, making it difficult to achieve thinness and lightness, limiting their portability and design flexibility.

[0003] Given these shortcomings of traditional LED displays, mini LED technology was developed. Mini LEDs offer significantly smaller pixel pitches, enabling higher resolutions and meeting the demands of high-definition displays. Furthermore, mini LED backlights are thinner and lighter, making them more suitable for thinner display devices, meeting the demands of modern consumer electronics for thinner and lighter products. Despite these advantages, mini LED technology suffers from smaller, less robust supports, making them susceptible to deformation during production and resulting in low product yields. Summary of the Invention

[0004] Based on this, the present invention provides an LED bracket structure, comprising:

[0005] A terminal plate, comprising at least one terminal unit, wherein the terminal unit comprises a plurality of terminal assemblies arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction, each of the terminal assemblies comprising two conductive terminals spaced apart in the first direction, each of the conductive terminals being connected to an adjacent conductive terminal in an adjacent terminal assembly via a connecting portion; and

[0006] An insulating plate, comprising a plurality of insulating bases, each of which is provided in a one-to-one correspondence with the terminal assembly, and each of which is covered with the corresponding terminal assembly to insulate the two conductive terminals;

[0007] Wherein, both end surfaces of each conductive terminal in a third direction are exposed from the insulating base, and the third direction is perpendicular to the first direction and the second direction.

[0008] Furthermore, the two conductive terminals are a first conductive terminal and a second conductive terminal, and the connecting portion includes a first connector, a second connector and a third connector, the first connector connects two adjacent first conductive terminals in the two terminal assemblies adjacent in the second direction, the second connector connects the adjacent first conductive terminals and the second conductive terminals in the two terminal assemblies adjacent in the first direction and / or the second direction, and the third connector connects two adjacent second conductive terminals in the two terminal assemblies adjacent in the second direction.

[0009] Furthermore, the two conductive terminals are a first conductive terminal and a second conductive terminal, the first conductive terminal and the second conductive terminal are centrally symmetrically arranged about a central axis of the terminal assembly, and the central axis extends along the third direction.

[0010] Furthermore, the conductive terminal includes:

[0011] A body having a first surface and a second surface arranged opposite to each other in the third direction, wherein the first surface of the body is used for connecting the LED chip;

[0012] a convex body, convexly provided on the second surface, the convex body having a third surface away from the second surface in the third direction, the third surface being used for connecting to a driving circuit board; and

[0013] a connecting arm, connecting the main body and the connecting portion;

[0014] The ratio of the thickness of the main body to the thickness of the protrusion is 1:1, and the thickness of the connecting arm is equal to the thickness of the main body.

[0015] Furthermore, the thickness of the insulating base in the third direction is equal to the thickness of the conductive terminal in the third direction, and the insulating base has a fourth surface and a fifth surface arranged opposite to each other in the third direction, the fourth surface and the first surface are located on the same plane, and the fifth surface and the third surface are located on the same plane.

[0016] Furthermore, the terminal plate also includes a connection frame surrounding the terminal unit, and the connection frame is connected to the adjacent conductive terminals through the connection portion.

[0017] Furthermore, the terminal plate includes a plurality of terminal units arranged in a rectangular array along the first direction and the second direction, and two adjacent terminal units are connected into one through the connecting frame.

[0018] Furthermore, the connection frame is provided with a plurality of tool-aligning grooves arranged around the terminal unit, and the plurality of tool-aligning grooves are arranged along the first direction and the second direction and are located on the same straight line as the corresponding connection portions.

[0019] Furthermore, the insulating plate is an integrally formed injection molded part, and the insulating base is connected to the insulating base through a waste part.

[0020] The present invention also provides a method for processing an LED bracket structure, comprising:

[0021] providing a metal sheet;

[0022] Etching the metal plate to form a terminal plate, the terminal plate including at least one terminal unit, the terminal unit including a plurality of terminal assemblies arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction, each of the terminal assemblies including two conductive terminals spaced apart in the first direction, each of the conductive terminals being connected to an adjacent conductive terminal in an adjacent terminal assembly via a connecting portion;

[0023] The terminal plate is injection molded as an insert to form an insulating plate, which includes a plurality of insulating bases. The insulating bases are arranged in a one-to-one correspondence with the terminal assemblies. The insulating bases are covered on the outside of the corresponding terminal assemblies to insulate the two conductive terminals, wherein the end surfaces of each conductive terminal in a third direction are exposed from the insulating base, and the third direction is perpendicular to the first direction and the second direction.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: the LED bracket structure and the LED bracket structure processing method, the LED bracket structure includes at least one terminal unit, the terminal unit includes a plurality of terminal assemblies arranged in a rectangular array, each terminal assembly includes two conductive terminals spaced apart in a first direction, each conductive terminal is cross-interconnected with adjacent conductive terminals in adjacent terminal assemblies through a connecting portion, thereby improving the strength of the conductive terminal, and avoiding deformation of the conductive terminal due to factors such as injection molding pressure when forming an insulating plate, thereby improving the product yield of the LED bracket structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the terminal plate structure in the LED bracket structure according to an embodiment of the present invention;

[0026] Figure 2 for Figure 1 A magnified view of the local A structure;

[0027] Figure 3 for Figure 2 A magnified view of the local B structure;

[0028] Figure 4 This is a schematic diagram of the terminal assembly structure in the LED bracket structure according to an embodiment of the present invention;

[0029] Figure 5 for Figure 4 CC cross-sectional view;

[0030] Figure 6 for Figure 4 DD cross-sectional view;

[0031] Figure 7 for Figure 4 Rear view;

[0032] Figure 8 This is a schematic diagram of the LED bracket structure according to an embodiment of the present invention;

[0033] Figure 9 for Figure 8 A magnified view of the local E structure;

[0034] Figure 10 for Figure 9 A magnified view of the local F structure;

[0035] Figure 11 This is a schematic diagram of an LED bracket unit in the LED bracket structure according to an embodiment of the present invention;

[0036] Figure 12 for Figure 11 Bottom view of

[0037] Figure 13 for Figure 11 Right view of;

[0038] Figure 14 for Figure 11 rear view. DETAILED DESCRIPTION

[0039] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0040] It should be noted that when an element is referred to as being “fixed to” another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or there may be an intermediate element.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0042] Please refer to Figures 1 to 14 The LED support structure of the embodiment of the present invention includes a terminal plate 100 and an insulating plate 200. The terminal plate 100 includes at least one terminal unit 101, each terminal unit 101 includes a plurality of terminal assemblies 1, and the plurality of terminal assemblies 1 are arranged in a rectangular array along a first direction and a second direction, and the second direction is perpendicular to the first direction. Each terminal assembly 1 includes two conductive terminals 11, and the two conductive terminals 11 are spaced apart in the first direction. Each conductive terminal 11 is connected to the adjacent conductive terminals 11 in the adjacent terminal assembly 1 through a connecting portion 2. The insulating plate 200 includes a plurality of insulating bases 3, and the insulating bases 3 are arranged in a one-to-one correspondence with the terminal assemblies 1. The insulating bases 3 are covered on the outside of the corresponding terminal assembly 1 to insulate the two conductive terminals 11. The two end surfaces of each conductive terminal 11 in the third direction are exposed to the insulating base 3 to facilitate electrical connection of the LED chip and the driver circuit board, wherein the third direction is perpendicular to the first direction and the second direction.

[0043] The LED bracket structure of the embodiment of the present invention includes at least one terminal unit 101, and the terminal unit 101 includes a plurality of terminal assemblies 1 arranged in a rectangular array. Each terminal assembly 1 includes two conductive terminals 11 spaced apart in a first direction. Each conductive terminal 11 is cross-interconnected with adjacent conductive terminals 11 in adjacent terminal assemblies 1 through a connecting portion 2, thereby improving the strength of the conductive terminals 11 and avoiding deformation of the conductive terminals 11 due to factors such as injection molding pressure when forming the insulating plate 200, thereby improving the product yield of the LED bracket structure.

[0044] It should be noted that in Figures 8 to 11 as well as Figure 14 In the figure, to more intuitively illustrate the insulating plate 200 and distinguish between the terminal plate 100 and the insulating plate 200, the surface of the insulating plate 200 is marked with hatching, which does not indicate that the surface of the insulating plate 200 has textures. It is understood that the surface of the insulating plate 200 can be processed into a smooth surface or a non-smooth surface with textures, markings, etc. according to actual conditions, and this is not limited here.

[0045] In some preferred embodiments, the terminal plate 100 can be formed from a metal plate, exemplarily a copper plate. The insulating plate 200 can be injection molded, with the terminal plate 100 serving as an insert during the injection molding process, effectively improving the efficiency of the LED support structure manufacturing process. In some more preferred embodiments, the terminal plate 100 can be formed from a metal plate by etching, effectively improving the efficiency of the LED support structure manufacturing process.

[0046] In some preferred embodiments, please refer to Figure 3 The two conductive terminals 11 are respectively a first conductive terminal 11a and a second conductive terminal 11b, and each terminal assembly 1 has the same structure. That is, the conductive terminals located on either side of the first conductive terminal 11a in the first direction are both second conductive terminals 11b, the conductive terminals located on either side of the first conductive terminal 11a in the second direction are both first conductive terminals 11a, and the conductive terminals located on either side of the second conductive terminal 11b in the second direction are both second conductive terminals 11b. The connecting portion 2 includes a first connector 21, a second connector 22, and a third connector 23. The first connector 21 connects two adjacent first conductive terminals 11a in two adjacent terminal assemblies 1, the second connector 22 connects the adjacent first and second conductive terminals 11b in two adjacent terminal assemblies 1, and the third connector 23 connects two adjacent second conductive terminals 11b in two adjacent terminal assemblies 1. In this embodiment, each conductive terminal 11 is connected to adjacent conductive terminals 11 in multiple adjacent terminal assemblies 1 via the connecting portion 2, ensuring that the conductive terminals 11 have sufficient strength to withstand factors such as injection molding pressure.

[0047] As an implementation, please refer to Figure 3The conductive terminal 11 has a first end 111 and a second end 112 arranged opposite to each other in the first direction. The conductive terminal 11 also has a third end 113 and a fourth end 114 arranged opposite to each other in the second direction. The first end 111 of the first conductive terminal 11a is close to the second end 112 of the second conductive terminal 11b in the same terminal assembly 1. In other words, the second end 112 of the first conductive terminal 11a is away from the first end 111 of the second conductive terminal 11b in the same terminal assembly 1. The second end 112 of the first conductive terminal 11a is connected to the first end 111 of the adjacent second conductive terminal 11b in the adjacent terminal assembly 1 in the first direction via the second connector 22. The third end 113 and the fourth end 114 of the first conductive terminal 11a are respectively connected to the first conductive terminal 11a in the adjacent terminal assembly 1 in the second direction via the first connector 21. The third end 113 of the first conductive terminal 11a is also connected to the fourth end 114 of the second conductive terminal 11b in the adjacent terminal assembly 1 in the second direction via the second connector 22. The third end 113 and the fourth end 114 of the second conductive terminal 11 b are respectively connected to the second conductive terminal 11 b in the terminal assembly 1 adjacent in the second direction through the third connector 23 .

[0048] As an example, please refer to Figure 3The terminal unit 101 includes a terminal assembly 1a, a terminal assembly 1b, a terminal assembly 1c, a terminal assembly 1d, and a terminal assembly 1e. The terminal assemblies 1b and 1c are located on either side of the terminal assembly 1a in a first direction, and the terminal assemblies 1d and 1e are located on either side of the terminal assembly 1a in a second direction. The second end 112 of the first conductive terminal 11a of the terminal assembly 1a is connected to the first end 111 of the second conductive terminal 11b of the terminal assembly 1b via a second connector 22a. The third end 113 of the first conductive terminal 11a of the terminal assembly 1a is connected to the fourth end 114 of the first conductive terminal 11a of the terminal assembly 1d via a first connector 21. The third end 113 of the first conductive terminal 11a of the terminal assembly 1a is also connected to the fourth end 114 of the second conductive terminal 11b of the terminal assembly 1d via a second connector 22b. The fourth end 114 of the first conductive terminal 11a of the terminal assembly 1a is connected to the third end 113 of the first conductive terminal 11a of the terminal assembly 1e via a first connector 21. The first end 111 of the second conductive terminal 11b of the terminal assembly 1a is connected to the second end 112 of the first conductive terminal 11a of the terminal assembly 1c via the second connector 22a. The third end 113 of the second conductive terminal 11b of the terminal assembly 1a is connected to the fourth end 114 of the second conductive terminal 11b of the terminal assembly 1d via the third connector 23. The fourth end 114 of the second conductive terminal 11b of the terminal assembly 1a is connected to the third end 113 of the second conductive terminal 11b of the terminal assembly 1e via the third connector 23. The fourth end 114 of the second conductive terminal 11b of the terminal assembly 1a is also connected to the third end 113 of the first conductive terminal 11a of the terminal assembly 1e via the second connector 22b. In this embodiment, each conductive terminal is cross-connected with four conductive terminals, thereby ensuring the strength of the conductive terminal.

[0049] In some examples, the length of the conductive terminal 11 in the second direction is greater than the length of the conductive terminal 11 in the first direction. In order to further increase the strength of the conductive terminal 11, the adjacent first conductive terminals 11a and the second conductive terminals 11b in the two adjacent terminal assemblies 1 in the first direction are connected by a plurality of second connectors 22a. Figure 3 .

[0050] It should be noted that, in other embodiments, each conductive terminal 11 can be cross-connected with five conductive terminals 11. As an example, the fourth end 114 of the first conductive terminal 11a is further connected to the third end 113 of the second conductive terminal 11b in the terminal assembly 1 adjacent in the second direction via the second connector 22b. For example, the fourth end 114 of the first conductive terminal 11a of the terminal assembly 1a is further connected to the third end 113 of the second conductive terminal 11b of the terminal assembly 1e via the second connector 22b.

[0051] In some preferred embodiments, please refer to Figures 1 to 3 The first conductive terminal 11a and the second conductive terminal 11b are centrally symmetrically arranged about the central axis of the terminal assembly 1, and the central axis extends along the third direction, which can improve the utilization rate of the metal plate used to process the terminal plate 100 and save costs.

[0052] In some preferred embodiments, please refer to Figures 4 to 7 The conductive terminal 11 includes a body 115, a protrusion 116, and a connecting arm 117. The body 115 has a first surface 1151 and a second surface 1152 that are arranged opposite each other in the third direction. The first surface 1151 of the body 115 is used to connect to the LED chip. The protrusion 116 is provided protruding from the second surface 1152 and has a third surface 1161 that is away from the second surface 1152 in the third direction. The third surface 1161 of the protrusion 116 is used to connect to the driver circuit board. The connecting arm 117 connects the body 115 and the connecting portion 2.

[0053] In this embodiment, the LED bracket structure is suitable for POB (Package on Board) packaging. The LED chip is directly fixed on the corresponding terminal assembly 1 and the insulating base 3, and the LED chip is packaged by dispensing glue or the like. The LED chip is electrically connected to the first surface 1151 of the main body 115, and the third surface 1161 of the protrusion 116 is soldered to the driver circuit board using solder paste or other welding materials. In addition, the protrusion 116 is protruding from the main body 115, so that the insulating base 3 can more securely wrap the terminal assembly 1 therein, preventing the terminal assembly 1 from falling out of the insulating base 3, thereby ensuring the tightening effect of the insulating base 3 on the terminal assembly 1.

[0054] In some more preferred embodiments, please refer to Figures 11 to 14 The thickness of the insulating base 3 in the third direction is equal to the thickness of the conductive terminal 11 in the third direction. The insulating base 3 has a fourth surface 31 and a fifth surface 32 arranged opposite to each other in the third direction. The fourth surface 31 and the first surface 1151 are located on the same plane, and the fifth surface 32 and the third surface 1161 are located on the same plane.

[0055] In this embodiment, the thickness of the insulating base 3 is equal to the thickness of the conductive terminal 11, and there is no reflective cup structure. The insulating base 3 requires less plastic, which not only reduces processing difficulty and processing costs, but also reduces the requirements for injection molding production. In addition, the insulating base 3 requires less plastic, and the adverse effects of injection molding on the conductive terminal 11 are smaller, which can minimize the spacing between adjacent terminal assemblies 1 and improve the material utilization rate of the metal sheet. The thickness of the insulating base 3 is equal to the thickness of the conductive terminal 11, which can also minimize the thickness of the LED bracket, and can be applied to small-sized and thin tablet computers and large-sized and thin LED displays.

[0056] As an example, the thickness of the conductive terminal 11 is the distance between the first surface 1151 and the third surface 1161 in the third direction. In other words, the thickness of the conductive terminal 111 is the sum of the thicknesses of the body 115 and the protrusion 116 in the third direction. The ratio of the thickness of the body 115 in the third direction to the thickness of the protrusion 116 in the third direction can be 1:1, and the thickness of the connecting arm 117 in the third direction can be equal to the thickness of the body 115 in the third direction. This ensures the strength of the terminal plate 100, simplifies the manufacturing process, and reduces manufacturing costs.

[0057] In some preferred embodiments, the terminal plate 100 further includes a connecting frame 102, which surrounds the terminal unit 101 and is connected to the adjacent conductive terminal 11 through the connecting portion 2. Figures 1 to 2 , the conductive terminal 11 located at the edge of the terminal unit 101 is connected to the connection frame 102 through the connecting portion 2. As an example, please refer to Figure 10 The connecting part 2 also includes a fourth connecting body 24 and a fifth connecting body 25. The first end 111 and / or the second end 112 of the conductive terminal 11 located at the first direction edge of the terminal unit 101 are connected to the connecting frame 102 through the fourth connecting body 24, and the third end 113 and / or the fourth end 114 of the conductive terminal 11 located at the second direction edge of the terminal unit 101 are connected to the connecting frame 102 through the fifth connecting body 25.

[0058] In some more preferred embodiments, please refer to Figure 1 The terminal plate 100 includes a connecting frame 102 and a plurality of terminal units 101. The plurality of terminal units 101 are arranged in a rectangular array along a first direction and a second direction, and two adjacent terminal units 101 are connected as a whole by the connecting frame 102. In this embodiment, the terminal plate 100 includes a plurality of terminal units 101, further improving processing efficiency. In addition, two adjacent terminal units 101 are connected as a whole by the connecting frame 102, further improving the strength of the terminal plate 100.

[0059] In some preferred embodiments, the insulating plate 200 is an integrally formed injection molded part, and the insulating base 3 is connected to the waste part 4. Figures 8 to 10 The waste portion 4 refers to the waste material that needs to be removed after the LED chip is packaged on the LED bracket structure. It can be understood that during injection molding, the plastic is diverted from the main channel to the branch channel and then enters the cavity of the insulating base 3. The waste portion 4 not only includes the plastic connecting two adjacent insulating bases 3, but also includes the main channel plastic waste located in the main channel and the branch channel plastic waste located in the branch channel, etc.

[0060] In this embodiment, the insulating bases 3 are connected as a whole through the waste portion 4, that is, the cavity of each insulating base 3 is connected to the cavity of the adjacent insulating base 3, which is more conducive to the flow of plastic during injection molding and improves the product yield.

[0061] In some more preferred embodiments, the connection frame 102 is provided with a plurality of tool-aligning grooves arranged around the terminal unit 101 , and the plurality of tool-aligning grooves are arranged along the first direction and the second direction and are located on the same straight line as the corresponding connection portion 2 .

[0062] As an example, please refer to Figure 2 and Figure 10The tool grooves are divided into first tool grooves 1021 and second tool grooves 1022. There are two groups of first tool grooves 1021. The two groups of first tool grooves 1021 are symmetrically arranged in the first direction and are located near the outer edge of the connecting frame 102. Each group of first tool grooves 1021 includes multiple first tool grooves 1021 evenly spaced along the second direction. The multiple first tool grooves 1021 are corresponding to the first connector 21, the second connector 22b, and the third connector 23. In other words, the multiple first tool grooves 1021 are corresponding to the gaps between two adjacent terminal assemblies 1 in the second direction. Multiple first tool grooves 1021 are also corresponding to the fifth connector 25. The first tool grooves 1021 in the two groups of first tool grooves 1021 are arranged in a one-to-one correspondence in the first direction. The straight path between the two corresponding first tool grooves 1021 is constructed as a first cutting path 301. The width of the first cutting path 301 is equal to the width of the first tool groove 1021 and the width of the grinding wheel of the corresponding cutting device. There are two groups of second pairing knife grooves 1022. The two groups of second pairing knife grooves 1022 are symmetrically arranged in the second direction and are arranged near the outer edge of the connecting frame 102. Each group of second pairing knife grooves 1022 includes a plurality of second pairing knife grooves 1022 evenly spaced along the first direction, wherein a plurality of second pairing knife grooves 1022 are arranged corresponding to the second connector 22a. In other words, a plurality of second pairing knife grooves 1022 are arranged corresponding to the gap between two adjacent terminal assemblies 1 in the first direction. A plurality of second pairing knife grooves 1022 are also arranged corresponding to the fourth connector 24. The second pairing knife grooves 1022 in the two groups of second pairing knife grooves 1022 are arranged in a one-to-one correspondence in the second direction. The straight path between the two corresponding second pairing knife grooves 1022 is constructed as a second cutting path 302. The width of the second cutting path 302 is equal to the width of the second pairing knife groove 1022 and equal to the width of the grinding wheel of the corresponding cutting device. After the LED chip is packaged on the LED bracket structure, the connection part 2 and the waste part 4 are waste materials that need to be cut off. In other words, the distance between two adjacent terminal components 1 is equal to the width of the corresponding knife groove. After the LED chip is packaged on the LED bracket structure, the grinding wheel of the cutting equipment is aligned with the first knife groove 1021 to cut off the corresponding connection part 2 and the waste part 4 located in the first cutting path 301 along the first cutting path 301, and the grinding wheel of the cutting equipment is aligned with the second knife groove 1022 to cut off the corresponding connection part 2 and the waste part 4 located in the second cutting path 302 along the second cutting path 302 to obtain multiple packaged LED bracket monomers. The number of LED bracket monomers obtained is the same as the number of terminal components 1. Figures 11 to 14 The LED chip is not shown in the LED bracket unit shown.

[0063] The LED support structure processing method of the embodiment of the present invention is used to prepare the LED support structure provided by any of the above embodiments.

[0064] The LED support structure processing method according to the embodiment of the present invention includes steps S11 to S13:

[0065] Step S11: providing a metal plate.

[0066] As an example, the metal plate may be a copper plate.

[0067] In step S12, the metal plate is etched to form a terminal plate 100. The terminal plate 100 includes at least one terminal unit 101. The terminal unit 101 includes a plurality of terminal assemblies 1 arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction. Each terminal assembly 1 includes two conductive terminals 11 spaced apart in the first direction. Each conductive terminal 11 is connected to an adjacent conductive terminal 11 in an adjacent terminal assembly 1 via a connecting portion 2. In this embodiment, the terminal plate 100 is formed by etching, which improves processing efficiency.

[0068] As an embodiment, the metal plate has a sixth surface and a seventh surface arranged opposite to each other in the third direction. Step S12 specifically includes steps S121 to S124:

[0069] Step S121 , forming a first photosensitive adhesive layer on the sixth surface, forming a second photosensitive adhesive layer on the seventh surface, and performing printing and exposure on the first photosensitive adhesive layer and the second photosensitive adhesive layer.

[0070] The first photosensitive adhesive layer completely covers the sixth surface, and the second photosensitive adhesive layer completely covers the seventh surface. During printing exposure, a preset pattern is printed on the first and second photosensitive adhesive layers by laser printing or other means, and then exposed to light, causing the first and second photosensitive adhesive layers to undergo photosensitive denaturation.

[0071] In step S122 , the first photosensitive resin layer and the second photosensitive resin layer after printing and exposure are developed to form patterned grooves, exposing the sixth surface and the seventh surface to be etched.

[0072] In one embodiment, a developer can be used to clean and remove the unexposed first and second photosensitive layers, forming patterned grooves in the first and second photosensitive layers. The metal plate area to be etched is exposed in the patterned grooves, while the metal plate area not to be etched is shielded by the first or second photosensitive layer. Exemplarily, the developer can be a Na2CO3 solution, for example.

[0073] In step S123 , the metal plate region exposed in the patterned groove is etched to form the terminal plate 100 .

[0074] As an embodiment, the unetched sixth surface includes the first surface 1151, that is, the sixth surface that is still shielded by the first photosensitive adhesive layer after development includes the first surface 1151. The unetched seventh surface includes the third surface 1161, that is, the seventh surface that is still shielded by the second photosensitive adhesive layer after development includes the third surface 1161. In this embodiment, the sixth surface of the metal plate corresponding to the terminal assembly 1 and the connecting portion 2 is not etched, the seventh surface of the metal plate corresponding to the protrusion 116 is not etched, and the seventh surface of the metal plate corresponding to the connecting portion 2 and the terminal assembly 1 except the protrusion 116 is etched, so that the thickness of the metal plate in the corresponding area of ​​the connecting portion 2 and the terminal assembly 1 except the protrusion 116 in the third direction is reduced by half, please refer to Figure 5 and Figure 6 The area on the metal plate corresponding to the branch channel is completely etched away to form a through hole 1023 that penetrates the metal plate in the third direction. The sixth surface of the area on the metal plate corresponding to the main channel is etched, and the seventh surface of the area on the metal plate corresponding to the main channel is not etched, so that the thickness of the area corresponding to the main channel in the third direction is reduced by half to form a groove 1024, making it easier for plastic to flow during injection molding.

[0075] In this embodiment, the terminal assembly 1 excluding the protrusion 116 includes a main body 115 and a connecting arm 117. The ratio of the thickness of the main body 115 in the third direction to the thickness of the protrusion 116 in the third direction is 1:1, the thickness of the connecting arm 117 in the third direction is equal to the thickness of the main body 115 in the third direction, and the thickness of the connecting part 2 in the third direction is equal to the thickness of the main body 115 in the third direction. This can ensure the strength of the terminal plate 100, simplify the processing technology, and reduce the processing cost.

[0076] As an embodiment, the metal plate can be placed in an etching solution for etching. As an example, the etching solution can be acidic copper chloride or the like. Alternatively, a spray etching machine can be used to etch the metal plate.

[0077] Step S124 , removing the remaining photosensitive resin layer on the metal plate.

[0078] As an example, a NaOH solution may be used to remove the remaining photosensitive resin layer.

[0079] It should be noted that, in other embodiments, the terminal plate 100 may be formed by mechanical engraving, stamping, etc., and may be configured according to actual conditions, which will not be elaborated here.

[0080] In step S13, the terminal plate 100 is injection molded as an insert to form an insulating plate 200, resulting in an LED bracket structure including the terminal plate 100 and the insulating plate 200. The insulating plate 200 includes a plurality of insulating bases 3, each corresponding to a terminal assembly 1. The insulating bases 3 cover the corresponding terminal assembly 1 to insulate the two conductive terminals 11. The two end surfaces of each conductive terminal 11 in a third direction are exposed from the insulating base 3, and the third direction is perpendicular to the first and second directions.

[0081] In some preferred embodiments, after step S13, the LED support structure processing method further includes steps S14 to S15:

[0082] Step S14 , encapsulating the LED chip in the LED support structure, with the LED chip and the terminal assembly 1 being arranged in a one-to-one correspondence.

[0083] As an implementation method, the LED chip adopts a POB (Package on Board) packaging method, and the LED chip is directly fixed on the corresponding terminal assembly 1 and the insulating base 3, and the LED chip is packaged by, for example, dispensing glue.

[0084] Step S15 , cutting off the connecting portion 2 and the waste portion 4 to obtain a plurality of packaged LED bracket units.

[0085] As an embodiment, after the LED chips are packaged on the LED bracket structure, the grinding wheel of the cutting device is aligned with the first pair of knife grooves 1021 to cut off the corresponding connecting portion 2 and the waste portion 4 located within the first cutting street 301 along the first cutting street 301. The grinding wheel of the cutting device is aligned with the second pair of knife grooves 1022 to cut off the corresponding connecting portion 2 and the waste portion 4 located within the second cutting street 302 along the second cutting street 302, thereby obtaining a plurality of packaged LED bracket units. It should be noted that the cutting device in this embodiment is conventional technology and will not be described in detail here.

[0086] In some more preferred embodiments, after step S13 and before step S14, the LED support structure processing method further includes step S16:

[0087] In step S16 , the first surface 1151 and the third surface 1161 are electroplated with metals such as gold or silver to improve the conductivity, bonding performance, and stability of the conductive terminals 11 .

[0088] The LED support structure in any embodiment of the present invention can be obtained by using the LED support structure processing method provided in any embodiment of the present invention. It should be noted that in other embodiments, the LED support structure in the embodiment of the present invention can also be obtained by using other processing methods, which can be set according to actual conditions and will not be described in detail here.

[0089] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The above embodiments merely represent preferred embodiments of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. An LED bracket structure, characterized in that: include: A terminal plate, comprising at least one terminal unit, wherein the terminal unit comprises a plurality of terminal assemblies arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction, each of the terminal assemblies comprising two conductive terminals spaced apart in the first direction, each of the conductive terminals being connected to an adjacent conductive terminal in an adjacent terminal assembly via a connecting portion; and An insulating plate, comprising a plurality of insulating bases, each of which is provided in a one-to-one correspondence with the terminal assembly, and each of which is covered with the corresponding terminal assembly to insulate the two conductive terminals; Wherein, both end surfaces of each conductive terminal in a third direction are exposed from the insulating base, and the third direction is perpendicular to the first direction and the second direction.

2. The LED support structure according to claim 1, wherein: The two conductive terminals are a first conductive terminal and a second conductive terminal, and the connecting portion includes a first connector, a second connector and a third connector, the first connector connecting two adjacent first conductive terminals in two adjacent terminal assemblies in the second direction, the second connector connecting two adjacent first conductive terminals and second conductive terminals in two adjacent terminal assemblies in the first direction and / or the second direction, and the third connector connecting two adjacent second conductive terminals in two adjacent terminal assemblies in the second direction.

3. The LED support structure according to claim 1, wherein: The two conductive terminals are a first conductive terminal and a second conductive terminal. The first conductive terminal and the second conductive terminal are centrally symmetrically arranged about a central axis of the terminal assembly, and the central axis extends along the third direction.

4. The LED support structure according to claim 1, wherein: The conductive terminal comprises: A body having a first surface and a second surface arranged opposite to each other in the third direction, wherein the first surface of the body is used for connecting the LED chip; a convex body, convexly provided on the second surface, the convex body having a third surface away from the second surface in the third direction, the third surface being used for connecting to a driving circuit board; and a connecting arm, connecting the main body and the connecting portion; The ratio of the thickness of the main body to the thickness of the protrusion is 1:1, and the thickness of the connecting arm is equal to the thickness of the main body.

5. The LED support structure according to claim 4, characterized in that: The thickness of the insulating base in the third direction is equal to the thickness of the conductive terminal in the third direction. The insulating base has a fourth surface and a fifth surface arranged opposite to each other in the third direction. The fourth surface and the first surface are located on the same plane, and the fifth surface and the third surface are located on the same plane.

6. The LED support structure according to claim 1, wherein: The terminal plate also includes a connection frame surrounding the terminal unit, and the connection frame is connected to the adjacent conductive terminals through the connection portion.

7. The LED support structure according to claim 6, wherein: The terminal plate includes a plurality of terminal units arranged in a rectangular array along the first direction and the second direction, and two adjacent terminal units are connected into one through the connecting frame.

8. The LED support structure according to claim 6, wherein: The connection frame is provided with a plurality of tool-aligning grooves arranged around the terminal unit. The plurality of tool-aligning grooves are arranged along the first direction and the second direction and are located on the same straight line as the corresponding connection portions.

9. The LED support structure according to claim 1, wherein: The insulating plate is an integrally formed injection molded part, and the insulating base is connected into one piece via a waste part.

10. A method for processing an LED bracket structure, characterized in that: include: providing a metal sheet; Etching the metal plate to form a terminal plate, the terminal plate including at least one terminal unit, the terminal unit including a plurality of terminal assemblies arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction, each of the terminal assemblies including two conductive terminals spaced apart in the first direction, each of the conductive terminals being connected to an adjacent conductive terminal in an adjacent terminal assembly via a connecting portion; The terminal plate is injection molded as an insert to form an insulating plate, which includes a plurality of insulating bases. The insulating bases are arranged in a one-to-one correspondence with the terminal assemblies. The insulating bases are covered on the outside of the corresponding terminal assemblies to insulate the two conductive terminals, wherein the end surfaces of each conductive terminal in a third direction are exposed from the insulating base, and the third direction is perpendicular to the first direction and the second direction.

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