Light-emitting device, display device and preparation method

Abstract

The invention relates to a light-emitting device, a display device and a preparation method, and relates to the technical field of display. The light-emitting device comprises a substrate, a light-emitting array and a plurality of isolation parts, the light-emitting array is arranged on one side of the substrate, the light-emitting array comprises a plurality of light-emitting units, the light-emitting units are distributed in an array mode, and the light-emitting units can be controlled to independently emit light to work or the light-emitting units work together; each isolation part is respectively distributed between two adjacent light emitting units; partitions are arranged on the portions, wrapping the isolation parts, of the organic layer, and the partitions are distributed on part of the peripheral sides of the isolation parts so as to block carriers on part of the peripheral sides of the isolation parts. According to the invention, the current carrier flow of the adjacent light-emitting units can be reduced, the problem of light crosstalk caused by lighting of the adjacent pixels by the light-emitting pixels is avoided, and the display definition is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting device, a display apparatus, and a preparation method thereof. Background Art

[0002] Active-matrix organic light-emitting diodes (AMOLEDs) are typically manufactured using an evaporation process. They have multiple light-emitting sub-pixels. In related technologies, when a sub-pixel is driven to emit light, a small amount of charge carriers flow through the common layer due to its high conductivity to adjacent sub-pixels, causing them to illuminate. This can lead to color shift in the display and reduce the product's color gamut. Summary of the Invention

[0003] Based on this, it is necessary to provide a light-emitting device, a display device and a manufacturing method to address the problem of adjacent sub-pixels of AMOLED being illuminated.

[0004] To achieve the above objectives, the technical solutions adopted in this application are as follows:

[0005] In a first aspect, an embodiment of the present application provides a light-emitting device, comprising:

[0006] substrate;

[0007] A light emitting array is provided on one side of the substrate, the light emitting array comprising a plurality of light emitting units, each of the light emitting units being capable of being controlled to emit light independently or to operate in conjunction with the light emitting units;

[0008] a plurality of isolation portions, each of the isolation portions being disposed between two adjacent light-emitting units;

[0009] Each of the light-emitting units includes a first electrode layer, an organic layer, a light-emitting layer, and a second electrode layer. The first electrode layers of two adjacent light-emitting units are arranged at intervals. The organic layer is arranged on a side of the first electrode layer of the light-emitting unit facing away from the substrate, on the side of the isolation portion, and on a side of the isolation portion facing away from the substrate. The light-emitting layer is arranged on a side of the organic layer facing away from the first electrode layer and is confined between the four isolation portions distributed along the axis. The second electrode layer is arranged on a side of the light-emitting layer facing away from the organic layer and on a side of the organic layer facing away from the isolation portion.

[0010] Partitions are provided at the portion of the organic layer covering the isolation portion, and the partitions are distributed on a portion of the periphery of each isolation portion to block carriers on a portion of the periphery of the isolation portion.

[0011] In one embodiment of the first aspect, a partition is provided between two adjacent light-emitting units.

[0012] In one embodiment of the first aspect, a groove is formed on at least one side of each of the isolation portions, the groove is provided between the isolation portion and the first electrode layer, and the organic layer is broken at the groove.

[0013] In one embodiment of the first aspect, the groove is filled with an inorganic layer disposed on a side away from the groove opening.

[0014] In one embodiment of the first aspect, the light-emitting device further includes an insulating layer, wherein the insulating layer is disposed between two adjacent first electrode layers, the isolation portion covers the insulating layer and forms a slope at the bottom of the insulating layer, and the organic layer covers the slope.

[0015] In one embodiment of the first aspect, the inorganic layer includes a first film layer, a second film layer and a third film layer stacked in sequence along a first direction, the first direction is perpendicular to the substrate, the isolation portion is provided on the side of the third film layer facing away from the second film layer, at least one side of the second film layer is shorter than the first film layer and the third film layer to form a gap between the first film layer and the third film layer, and the organic layer is broken at the gap.

[0016] In one embodiment of the first aspect, each partition has an L-shaped structure, and each partition is distributed on two sides adjacent to a corresponding light-emitting unit.

[0017] In a second aspect, an embodiment of the present application further provides a display device comprising the light-emitting device described in any of the above embodiments.

[0018] In a third aspect, an embodiment of the present application further provides a method for preparing a light-emitting device, which is applied to the light-emitting device or display device described in any of the above embodiments, and the preparation method includes:

[0019] preparing the substrate;

[0020] generating a plurality of first electrode layers on the substrate;

[0021] generating the isolation portion between two adjacent first electrode layers;

[0022] vapor-depositing the organic layer on the first electrode layer and the isolation portion, and breaking the organic layer on at least one side of the isolation portion;

[0023] A light-emitting layer and a second electrode layer are sequentially formed on the organic layer.

[0024] In one embodiment of the third aspect, generating the isolation portion between two adjacent first electrode layers includes:

[0025] A groove is formed on one side of the isolation portion, and an inorganic layer is filled in the groove, and the organic layer is broken at the groove.

[0026] Alternatively, an insulating layer is formed between two adjacent first electrode layers, and a gap is formed on a side of the insulating layer;

[0027] The isolation portion is formed on the insulating layer, the isolation portion covers the insulating layer and forms a slope at the bottom of the insulating layer, the notch is exposed at one side of the isolation portion, and the organic layer is broken at the notch.

[0028] Compared with the related art, the beneficial effect of the present application is: the present application provides a light-emitting device, a display device and a preparation method, which reduces the carrier flow of adjacent light-emitting units by isolating the organic layer on the side of the isolation part, avoids the problem of light crosstalk caused by the light-emitting pixels lighting up the adjacent pixels, and improves the display clarity. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 Schematic diagram of the structure of a light-emitting device in related art;

[0031] Figure 2 Schematic diagram of the structure of the light emitting device in some embodiments of this application Figure 1 ;

[0032] Figure 3 for Figure 2 The enlarged structural diagram of part A is shown;

[0033] Figure 4 Schematic diagram of the structure of the groove in some embodiments of this application Figure 1 ;

[0034] Figure 5 Schematic diagram of the structure of the groove in some embodiments of this application Figure 2 ;

[0035] Figure 6 Schematic diagram of the structure of the light emitting device in some embodiments of this application Figure 2 ;

[0036] Figure 7 This is a schematic diagram of a structure in which the isolation portion has no slope in some embodiments of the present application;

[0037] Figure 8 Schematic diagram of a sloped structure of the isolation portion in some embodiments of the present application;

[0038] Figure 9 Schematic diagram of a process for preparing a light-emitting device in some embodiments of the present application;

[0039] Figure 10 This is a schematic structural diagram of a substrate in some embodiments of the present application;

[0040] Figure 11 Schematic diagram of the preparation of the first electrode layer in some embodiments of the present application;

[0041] Figure 12 This is a schematic structural diagram of the first electrode layer in some embodiments of the present application;

[0042] Figure 13 Schematic diagram of the structure of the isolation part in some embodiments of this application Figure 1 ;

[0043] Figure 14 Schematic diagram of the grooves of the isolation portion in some embodiments of the present application;

[0044] Figure 15 Schematic diagram of the structure of the inorganic layer in some embodiments of this application Figure 1 ;

[0045] Figure 16 Schematic diagram of the structure of the inorganic layer in some embodiments of this application Figure 2 ;

[0046] Figure 17 Schematic diagram of the structure of the isolation part in some embodiments of this application Figure 2 ;

[0047] Figure 18 Schematic diagram of the structure of the organic layer in some embodiments of this application Figure 1 ;

[0048] Figure 19 Schematic diagram of the structure of the organic layer in some embodiments of this application Figure 2 ;

[0049] Figure 20 Schematic diagram of the structure of the light-emitting layer in some embodiments of this application Figure 1 ;

[0050] Figure 21 Schematic diagram of the structure of the light-emitting layer in some embodiments of this application Figure 2 .

[0051] Description of reference numerals:

[0052] 1. Common layer;

[0053] 100. Light-emitting device; 110. Substrate; 120. Light-emitting unit; 121. First electrode layer; 122. Organic layer; 1221. Partition; 123. Light-emitting layer; 124. Second electrode layer; 130. Isolation portion; 131. Groove; 140. Inorganic layer; 141. First film layer; 142. Second film layer; 143. Third film layer; 144. Notch. DETAILED DESCRIPTION

[0054] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0055] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0056] See Figure 1 As shown in the related art, some layers within the organic layer of an AMOLED (Active-matrix organic light-emitting diode), such as the HIL (Hole Injection Layer) and HTL (Hole Transport Layer), are vapor-deposited across the entire surface using a universal metal mask. This layer is referred to as common layer 1. However, when a sub-pixel, such as a green pixel, is driven to emit light, due to the good conductivity of common layer 1, a small amount of carriers will flow through the common layer to adjacent sub-pixels, causing them to emit light. This can lead to color shift in the display, reducing the product's color gamut and causing pixel crosstalk or color unevenness due to lateral leakage.

[0057] Continue reading Figure 2As shown, to improve the above-mentioned problems, the embodiment of the present application provides a light-emitting device 100, which can improve the optical crosstalk phenomenon between adjacent pixels and enhance display clarity. It should be noted that, for ease of understanding, the light-emitting device 100 in the embodiment of the present application is only illustrated by AMOLED. In other embodiments, other LED display technologies such as Micro LED (Micro Light Emitting Diode) and Mini LED (MiniLight Emitting Diode) can also be used.

[0058] The light-emitting device 100 provided in this solution can be applied not only to the projection part of electronic devices such as optical projection and vehicle-mounted HUD, but also to the display part of electronic devices. For example, the electronic devices may include: smart phones, smart watches, laptops, tablet computers, driving recorders, navigation systems, head-mounted devices, and any other devices with a display screen.

[0059] Specifically, the light-emitting device 100 includes a substrate 110, a light-emitting array, and multiple isolation portions 130. The light-emitting array includes multiple light-emitting units 120, each distributed in an array on the substrate 110. Under the control of the substrate 110, each light-emitting unit 120 can operate independently or in conjunction with the other. An isolation portion 130 is provided between adjacent light-emitting units 120 to isolate different light-emitting pixels.

[0060] Exemplarily, substrate 110 may be a CMOS (Complementary Metal Oxide Semiconductor) driver board or a TFT (Thin Film Transistor) driver board. In this embodiment, substrate 110 may be a TFT driver board. A TFT driver board is one of the core components of a display device, acting as the brains of the device. It is responsible for controlling the switching and grayscale adjustment of each pixel, thereby achieving image display. Its performance directly affects image quality, power consumption, and cost.

[0061] The PDL (Pixel Definition Layer) is a key structure in OLED display manufacturing. It defines and isolates individual pixel areas, ensuring precise deposition of luminescent materials and preventing crosstalk between adjacent pixels. The PDL physically separates the red, green, and blue sub-pixels, preventing the different colors of luminescent materials from mixing.

[0062] Furthermore, each light-emitting unit 120 can be divided into a red light-emitting unit 120, a green light-emitting unit 120, and a blue light-emitting unit 120, so that white light can be formed by mixing the three primary colors of red, green, and blue between each light-emitting color adjustment unit. In the embodiment of the present application, the light-emitting units 120 are arranged in the order of red, green, and blue. For example, the first column of light-emitting units 120 are all red light-emitting units 120, the second column of light-emitting units 120 are all green light-emitting units 120, the third column of light-emitting units 120 are blue light-emitting units 120, the fourth column of light-emitting units 120 are red light-emitting units 120, and so on.

[0063] Exemplarily, the light-emitting unit 120 includes a first electrode layer 121, an organic layer 122, a light-emitting layer 123, and a second electrode layer 124. The first electrode layers 121 of two adjacent light-emitting units 120 are spaced apart. The organic layer 122 sequentially covers the first electrode layers 121 and the surface side of the isolation portion 130 of all light-emitting units 120. The light-emitting layer 123 is disposed on the side of the organic layer 122 facing away from the first electrode layer 121 and is confined between two adjacent isolation portions 130. The second electrode layer 124 sequentially covers the side of the light-emitting layer 123 facing away from the organic layer 122 and the side of the organic layer 122 facing away from the isolation portion 130.

[0064] Specifically, the first electrode layer 121 is used to efficiently inject holes into organic functional layers, such as the HIL (Hole Injection Layer) and the HTL (Hole Transport Layer). The first electrode layer 121 can be made of materials such as ITO (indium tin oxide), FTO (fluorine-doped tin oxide), metal mesh (Ag / Cu nanowires), graphene / carbon nanotubes, and ultrathin metal. In this specific embodiment, the first electrode layer 121 can be made of ITO. Adjacent first electrode layers 121 are spaced apart so that the conduction or de-energization of each first electrode layer 121 can be controlled separately through the substrate 110, enabling independent operation of each light-emitting unit 120.

[0065] The organic layer 122 is disposed on the first electrode layer 121 and enables current transmission between the first electrode layer 121 and the light-emitting layer 123. It is formed by full-surface evaporation using a universal metal mask, sequentially covering the first electrode layer 121 and the separator 130. The second electrode layer 124 is disposed on the side of the organic layer 122 facing away from the separator 130, making the organic layer 122 a common layer for the cathode and anode.

[0066] The light-emitting layer 123 is filled on the organic layer 122, and a second electrode layer 124 is provided above it. When the anode and cathode are electrically connected, the light-emitting layer 123 is activated and illuminated to produce light. The material of the light-emitting layer 123 can be a fluorescent material, a phosphorescent material, or a quantum dot material, and the specific design can be reasonably determined according to the actual process.

[0067] The cathode is a key electrode for electron injection in the light-emitting device 100. Its material selection, energy level matching, and fabrication process directly impact the device's efficiency, stability, and lifespan. Because the second electrode layer 124 is positioned above the light-emitting layer 123, it is necessary to use a transparent material to prevent it from blocking light from the light-emitting layer 123. Alternatively, the second electrode layer 124 can be made of a transparent material such as ITO (tin-doped indium oxide) or IZO (indium zinc oxide).

[0068] In some embodiments, the organic layer 122 may be a HIL (Hole Injection Layer) to optimize the injection efficiency of holes (positive charges) from the anode to the light-emitting layer 123, thereby improving device performance and stability. When the OLED is operating, the anode (usually a transparent conductive material such as ITO) injects holes. The HIL acts as an intermediate layer to lower the energy barrier between the anode and the light-emitting layer 123, making hole injection easier. At the same time, the HIL can reduce the injection barrier, which can reduce the driving voltage and improve energy efficiency. The energy level of the HIL must match the anode work function and the energy level of the light-emitting layer 123 to avoid charge accumulation or energy loss. In addition, the HIL can also improve the surface roughness of the anode, prevent short circuits or leakage currents, block electrons in the light-emitting layer 123 from diffusing to the anode, and balance the charge carriers.

[0069] In some embodiments, the organic layer 122 may be a hole transport layer (HTL), responsible for efficiently and stably transporting holes (positive charges) and preventing electron leakage, thereby achieving balanced recombination of charge carriers (electrons and holes) within the light-emitting layer 123, thereby improving luminous efficiency. The HTL receives holes from the HIL and efficiently transfers them to the light-emitting layer 123, reducing driving voltage and improving device efficiency. Furthermore, it works in conjunction with the electron transport layer to ensure balanced recombination of electrons and holes within the light-emitting layer 123, preventing charge accumulation that could lead to reduced efficiency or heat generation. Furthermore, the HTL typically has a deeper energy level, preventing electrons from escaping from the EML to the anode, thereby improving recombination efficiency.

[0070] In some embodiments, the light-emitting device 100 is a stacked OLED, and the organic layer 122 may be a CGL (Carrier Generation Layer) for connecting two light-emitting layers 123 in series. The CGL is disposed between the two light-emitting layers 123 stacked one above the other. The CGL is mainly used to efficiently generate electrons or holes inside the device to optimize charge injection and transport or to achieve a stacked design of a multi-layer device. Under electric field or light excitation, the CGL can dissociate excitons to generate free carriers. The generated electrons and holes are injected into adjacent electron transport layers and hole transport layers, respectively, to improve carrier balance. In addition, the CGL acts as an intermediate layer to connect multiple light-emitting units 120, thereby improving the brightness and life of the device, and through internal charge generation, reduces dependence on electrode injection and reduces overall power consumption.

[0071] Continue reading Figure 3 As shown, further, the portion of the organic layer 122 covering the isolation portion 130 is provided with partitions 1221 , and the partitions 1221 are distributed around a portion of each isolation portion 130 to block carriers around a portion of the isolation portion 130 .

[0072] Specifically, the partitions 1221 in this embodiment refer to cracks formed in the organic layer 122 during the vapor deposition process, or by forming partitions 1221 on the sides of the isolation portion 130 using other masking molds. Thus, when a light-emitting unit 120 emits light, the organic layer 122 prevents carriers from being conducted from the first electrode layer 121 to adjacent light-emitting units 120 through the partitions 1221. This prevents adjacent light-emitting units 120 from emitting light when the cathode is shared, causing light crosstalk and unclear display.

[0073] Continue reading Figure 4 and Figure 5 As shown, in some embodiments, a partition 1221 is provided between two adjacent light-emitting units 120. Thus, when any light-emitting unit 120 operates independently, some carriers on its side will not be introduced into the adjacent light-emitting unit 120 through the organic layer 122, thereby avoiding crosstalk caused by the adjacent light-emitting unit 120 being illuminated.

[0074] See again Figure 2 and Figure 3 As shown, in some embodiments, a groove 131 is formed on at least one side of each isolation portion 130 . The groove 131 is disposed between the isolation portion 130 and the first electrode layer 121 . The organic layer 122 is broken at the groove 131 to form a partition 1221 .

[0075] Specifically, the isolation portion 130 is a pixel define layer, whose main function is to define and isolate each pixel to ensure the precise boundaries between the red, green, and blue light-emitting units 120. The isolation portion 130 can be made of a photosensitive polyimide material. Each isolation portion 130 is arranged between two adjacent first electrode layers 121, and its bottom surface is connected to the substrate 110, and the side overflows the surface of the adjacent first electrode layer 121, thereby opening a groove 131 on the side of the isolation portion 130, so that during the overall evaporation process of the organic layer 122, the portion of the organic layer 122 located in the groove 131 is broken.

[0076] Furthermore, the groove 131 is filled with an inorganic layer 140 . The inorganic layer 140 is disposed on a side of the groove 131 away from the opening, and the opening of the groove 131 is in an open state.

[0077] For example, inorganic layer 140 can be made of IZO, IGZO, or other metals, metal oxides, etc., and the specific material can be reasonably selected according to actual needs. Inorganic layer 140 fills the inner side of groove 131 and leaves the opening side of groove 131 open. At the same time, the opening position of groove 131 is reserved to facilitate the subsequent evaporation and breaking of organic layer 122 in groove 131.

[0078] Optionally, the thickness of the inorganic layer 140 needs to be considered in conjunction with the thickness of the OLED device to ensure that the organic layer 122 is broken at the groove 131, thereby better blocking carriers between adjacent light-emitting layers 123. Preferably, the thickness of the groove 131 can be consistent with the thickness of the light-emitting layer 123.

[0079] See Figure 6 As shown, in some embodiments, the light emitting device 100 further includes an insulating layer, which is filled between two adjacent first electrode layers 121 , the isolation portion 130 covers the insulating layer and forms a slope at the bottom of the insulating layer, and the organic layer 122 covers the slope.

[0080] Specifically, the insulating layer fills the gap between two adjacent first electrode layers 121 and overflows onto the first electrode layers 121. A notch 144 is formed on one side of the insulating layer to allow the organic layer 122 to break at the notch 144 during vapor deposition. A separator 130 is deposited above the inorganic layer 140 to isolate the two adjacent light-emitting layers 123.

[0081] See Figure 7As shown, it is understandable that during the vapor deposition process of the organic layer 122, the portion located on the side of the insulating layer is easily blocked, resulting in a missing corner on the side of the organic layer 122, which can easily lead to the exposure of part of the first electrode layer 121. As a result, during the vapor deposition of the light-emitting layer 123 and the second electrode layer 124, the second electrode layer 124 may directly contact the first electrode layer 121, thereby causing a short circuit fault.

[0082] Continue reading Figure 8 As shown, in order to improve the above-mentioned problem, in an embodiment of the present application, a slope structure is formed on the side of the insulating layer during the evaporation process of the isolation portion 130, so that the organic layer 122 can be completely attached to the slope of the isolation portion 130 during the evaporation process, thereby avoiding the problem of the first electrode layer 121 being exposed due to obstruction during the evaporation process.

[0083] Furthermore, the insulating layer includes a first film layer 141, a second film layer 142 and a third film layer 143 that are stacked together, the first film layer 141 is connected to the substrate 110 and the first electrode layer 121, the second film layer 142 is arranged between the first film layer 141 and the third film layer 143, and an isolation portion 130 is provided on the side of the third film layer 143 facing away from the second film layer 142. At least one side of the second film layer 142 is shorter than the first film layer 141 and the third film layer 143 to form a gap 144 between the first film layer 141 and the third film layer 143, and the organic layer 122 is broken at the gap 144.

[0084] Exemplarily, the first film layer 141, the second film layer 142, and the third film layer 143 are stacked sequentially from bottom to top, with the first film layer 141 deposited between two adjacent first electrode layers 121, with its sides overflowing onto the first electrode layer 121. The second film layer 142 and the third film layer 143 are sequentially deposited on the first film layer 141, and the isolation portion 130 is deposited above the third film layer 143 and has a partial slope on the side of the first film layer 141. The first film layer 141 and the third film layer 143 can both be made of SiO, and the second film layer 142 can be made of SiN. Due to the faster etching rate of SiN, a notch 144 structure can be quickly formed during the formation process to facilitate the evaporation and breaking of the organic layer 122.

[0085] In some embodiments, each partition 1221 is in an L-shaped structure, and each partition 1221 is distributed on two sides adjacent to a corresponding light emitting unit 123 .

[0086] In one embodiment, the light emitting unit 120 is a rectangular structure, and a partition 1221 is provided on one side of each isolation portion 130. Figure 4For example, a partition 1221 is positioned immediately to the right of each light-emitting layer 123. From left to right, the light-emitting layers 123 in odd-numbered rows have partitions 1221 positioned immediately below them, while the light-emitting layers 123 in even-numbered rows have partitions 1221 positioned immediately above them. Furthermore, the two adjacent partitions 1221 within the same light-emitting layer 123 are connected, forming an L-shaped structure. This ensures that the organic layer 122 between two adjacent light-emitting layers 123 has a partition 1221 structure, thereby reducing carrier crosstalk between adjacent light-emitting units 120 and improving optical crosstalk. Furthermore, the organic layer 122 between two adjacent light-emitting layers 123 still has a partial connection, thereby ensuring its integrity. This not only blocks carriers but also facilitates overall vapor deposition.

[0087] It should be noted that the directional words up, down, left, and right in this embodiment are only used as examples for explanation and can be adjusted arbitrarily in actual applications, and the directional descriptions can be changed according to different viewing angles.

[0088] like Figure 5 As shown in FIG. 1 , in another embodiment, the light emitting unit 120 also has a rectangular structure, and a partition 1221 is provided on one side of each isolation portion 130. Figure 5 For example, a partition 1221 is positioned immediately to the right of each light-emitting layer 123. From left to right, the light-emitting layers 123 in odd-numbered rows have partitions 1221 positioned immediately below them, while the light-emitting layers 123 in even-numbered rows have partitions 1221 positioned immediately above them. Furthermore, the two adjacent partitions 1221 within the same light-emitting layer 123 are independently positioned. This ensures that the organic layer 122 between two adjacent light-emitting layers 123 has a partition 1221 structure, thereby reducing carrier crosstalk between adjacent light-emitting units 120 and improving optical crosstalk. Furthermore, the organic layer 122 between two adjacent light-emitting layers 123 still has a partial connection, thereby ensuring its integrity. This not only blocks carriers but also facilitates overall vapor deposition.

[0089] In other embodiments, the light-emitting unit 120 may also be a circular structure, and the partition 1221 may be arranged on the circumference of the light-emitting layer 123 and set with different curvatures. Similarly, the partitions 1221 of different isolation parts 130 may be arranged around the circumference of the light-emitting layer 123 to ensure that no optical crosstalk occurs between adjacent light-emitting units 120.

[0090] Of course, in other embodiments, the light-emitting unit 120 can also be other polygonal structures, such as triangles, pentagons, hexagons, irregular images, etc., and it is only necessary to ensure that there is a partition 1221 between adjacent light-emitting layers 123 to improve the light crosstalk problem between adjacent light-emitting units 120.

[0091] An embodiment of the present application further provides a display device, comprising the light-emitting device 100 in any of the above embodiments.

[0092] A display device can be the lighting component of an electronic device, such as a vehicle, streetlight, or any other device with a lighting component. A light-emitting device can also be the display component of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigation system, head-mounted device, or any other device with a display screen.

[0093] This embodiment has the light emitting device 100 in any of the above embodiments, and therefore has all the beneficial effects of the light emitting device 100 in any of the above embodiments, which will not be described in detail here.

[0094] Continue reading Figure 9 As shown, an embodiment of the present application further provides a method for preparing a light-emitting device 100 , which is applied to the light-emitting device 100 or the display device in any of the above embodiments.

[0095] Specifically, the preparation method includes:

[0096] S10 , preparing a substrate 110 .

[0097] See Figure 10 As shown, substrate 110 serves as the substrate for depositing various film layers and is one of the core components of the display device, acting as the brains of the device. It is responsible for controlling the switching and grayscale adjustment of each pixel, thereby achieving image display. Its performance directly affects image quality, power consumption, and cost. Substrate 110 can utilize either a CMOS (Complementary Metal Oxide Semiconductor) driver board or a TFT (Thin Film Transistor) driver board. In this embodiment, a TFT driver board can be used for substrate 110.

[0098] S20 , forming a plurality of first electrode layers 121 on the substrate 110 .

[0099] See Figure 11 and Figure 12As shown, an electrode material is deposited on one side of the substrate 110 by evaporation. The first electrode layer 121 can be made of materials such as ITO (indium tin oxide), FTO (fluorine-doped tin oxide), metal mesh (Ag / Cu nanowires), graphene / carbon nanotubes, and ultra-thin metal. In this specific embodiment, the first electrode layer 121 can be made of ITO. Then, through a patterning process, multiple first electrode layers 121 are formed in an array on the substrate 110, with spacing between adjacent first electrode layers 121. This allows the substrate 110 to individually control the conduction or de-energization of each first electrode layer 121, thereby enabling the individual operation of each light-emitting unit 120.

[0100] S30 , providing an isolation portion 130 between two adjacent first electrode layers 121 .

[0101] For example, the isolation layer is the Pixel Definition Layer (PDL), a key structure in OLED display manufacturing. It defines and isolates individual pixel areas, ensuring precise deposition of luminescent materials and preventing crosstalk between adjacent pixels. The isolation layer physically separates the red, green, and blue sub-pixels, preventing the different colors of luminescent materials from mixing.

[0102] Continue reading Figure 13-15 As shown, in some embodiments, step S30 includes:

[0103] S31 , depositing an isolation material between two adjacent first electrode layers 121 .

[0104] See Figure 13 As shown, specifically, an isolation material is deposited between the first electrode layers 121 through a mask, and a specific trapezoidal boss structure is formed by etching or photolithography.

[0105] S32, cutting along the bottom of the boss structure to form a groove 131.

[0106] See Figure 14 As shown, specifically, through a cutting process, a groove 131 is cut along the bottom side of the boss structure connected to the first electrode layer 121 to form the groove 131, and the groove 131 can be opened only on one or two sides of the boss structure to achieve the partition 1221 between each light-emitting layer 123.

[0107] S33 , an inorganic layer 140 is grown in the groove 131 .

[0108] See Figure 15Specifically, an inorganic material is filled inside the groove 131 to fill the inside of the groove 131 and improve support for the isolation portion 130. At the same time, the inorganic layer 140 does not completely fill the groove 131, leaving the opening side of the groove 131 open. This prevents excessive organic layer 122 or light-emitting layer 123 from entering the groove 131 during the deposition process, causing luminescence disturbances. Furthermore, the opening of the groove 131 is reserved to facilitate subsequent deposition of the organic layer 122 at the groove 131.

[0109] Continue reading Figure 16-17 As shown, in some other embodiments, step 30 includes:

[0110] S34 , generating an insulating layer between two adjacent first electrode layers 121 , and forming a gap 144 on a side of the insulating layer.

[0111] See Figure 16 As shown, specifically, SiO, SiN, and SiO are sequentially formed on the substrate 110 and the first electrode layer 121, and then SiO, SiN, and SiO are etched. Since SiN has a faster etching rate, a notch 144 structure can be quickly formed during the formation process, facilitating the evaporation and breaking of the organic layer 122.

[0112] S35 , forming an isolation portion 130 on the insulating layer. The isolation portion 130 covers the insulating layer and forms a slope at the bottom of the insulating layer. The notch 144 is exposed at one side of the isolation portion 130 .

[0113] See Figure 17 As shown, specifically, an isolation material is deposited on the insulating layer through a mask, and a specific trapezoidal boss structure is formed by etching or photolithography, and a slope is formed at the bottom of the insulating layer, while exposing the gap 144 of the insulating layer to facilitate the subsequent deposition and breaking of the organic layer 122.

[0114] S40 , vapor-depositing an organic layer 122 on the first electrode layer 121 and the isolation portion 130 , and breaking the organic layer 122 on at least one side of the isolation portion 130 .

[0115] Continue reading Figure 18 and Figure 19 As shown, specifically, an organic material is evaporated on the first electrode layer 121 and the isolation portion 130. Due to the particularity of the evaporation process, the organic material naturally breaks at the opening side of the notch 144 or the groove 131 to prevent the carriers of the adjacent light-emitting unit 120 from being injected into the adjacent non-operating light-emitting unit 120.

[0116] Exemplarily, the organic layer 122 may be a HIL (Hole Injection Layer) to optimize the injection efficiency of holes (positive charges) from the anode to the light-emitting layer 123, thereby improving device performance and stability. The organic layer 122 may also be an HTL (Hole Transport Layer), which is responsible for efficiently and stably transporting holes (positive charges) and blocking electron leakage to achieve balanced recombination of carriers (electrons and holes) within the light-emitting layer 123, thereby improving luminous efficiency. The organic layer 122 may also be a CGL (Carrier Generation Layer), which is primarily used to efficiently generate electrons or holes within the device to optimize charge injection and transport or implement a stacked design for multi-layer devices.

[0117] S50 , sequentially forming the light emitting layer 123 and the second electrode layer 124 on the organic layer 122 .

[0118] See Figure 20 and Figure 21 The space between two adjacent isolation portions 130 is filled with a luminescent material, which is activated and illuminated when the anode and cathode are electrically connected, thereby emitting light. The material of the luminescent layer 123 can be a fluorescent material, a phosphorescent material, or a quantum dot material, and can be reasonably designed according to the actual process.

[0119] See again Figure 2 and Figure 6 As shown, a cathode material is deposited on the entire top surface of the light-emitting side to form a second electrode layer 124 , and finally a light-emitting device 100 is obtained.

[0120] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0121] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A light emitting device, characterized in that: include: substrate; A light emitting array is provided on one side of the substrate, the light emitting array comprising a plurality of light emitting units, each of the light emitting units being capable of being controlled to emit light independently or to operate in conjunction with the light emitting units; a plurality of isolation portions, each of the isolation portions being disposed between two adjacent light-emitting units; Each of the light-emitting units includes a first electrode layer, an organic layer, a light-emitting layer, and a second electrode layer. The first electrode layers of two adjacent light-emitting units are arranged at intervals. The organic layer is arranged on a side of the first electrode layer of the light-emitting unit facing away from the substrate, on the side of the isolation portion, and on a side of the isolation portion facing away from the substrate. The light-emitting layer is arranged on a side of the organic layer facing away from the first electrode layer and is confined between the four isolation portions distributed along the axis. The second electrode layer is arranged on a side of the light-emitting layer facing away from the organic layer and on a side of the organic layer facing away from the isolation portion. Partitions are provided at the portion of the organic layer covering the isolation portion, and the partitions are distributed on a portion of the periphery of each isolation portion to block carriers on a portion of the periphery of the isolation portion.

2. The light emitting device according to claim 1, wherein The partition is provided between two adjacent light emitting units.

3. The light emitting device according to claim 1, wherein At least one side of each of the isolation parts is provided with a groove, the groove is arranged between the isolation part and the first electrode layer, and the organic layer is broken at the groove.

4. The light emitting device according to claim 3, characterized in that The groove is filled with an inorganic layer which is arranged on a side away from the groove opening.

5. The light emitting device according to claim 1, wherein The light emitting device further includes an insulating layer, which is disposed between two adjacent first electrode layers. The isolation portion covers the insulating layer and forms a slope at the bottom of the insulating layer. The organic layer covers the slope.

6. The light emitting device according to claim 5, characterized in that The insulating layer includes a first film layer, a second film layer and a third film layer stacked in sequence along a first direction, the first direction is perpendicular to the substrate, the isolation portion is provided on the side of the third film layer facing away from the second film layer, at least one side of the second film layer is shorter than the first film layer and the third film layer to form a gap between the first film layer and the third film layer, and the organic layer is broken at the gap.

7. The light emitting device according to claim 1, characterized in that Each partition has an L-shaped structure, and each partition is distributed on two sides adjacent to a corresponding light-emitting unit.

8. A display device, characterized in that: A light emitting device comprising the light emitting device according to any one of claims 1 to 7.

9. A method for preparing a light-emitting device, characterized in that: Applicable to the light-emitting device according to any one of claims 1 to 7 or the display device according to claim 8, the preparation method comprising: preparing the substrate; generating a plurality of first electrode layers on the substrate; generating the isolation portion between two adjacent first electrode layers; vapor-depositing the organic layer on the first electrode layer and the isolation portion, and breaking the organic layer on at least one side of the isolation portion; A light-emitting layer and a second electrode layer are sequentially formed on the organic layer.

10. The preparation method according to claim 9, characterized in that Generating the isolation portion between two adjacent first electrode layers includes: A groove is formed on one side of the isolation portion, and an inorganic layer is filled in the groove, and the organic layer is broken at the groove; Alternatively, an insulating layer is formed between two adjacent first electrode layers, and a gap is formed on a side of the insulating layer; The isolation portion is formed on the insulating layer, the isolation portion covers the insulating layer and forms a slope at the bottom of the insulating layer, the notch is exposed at one side of the isolation portion, and the organic layer is broken at the notch.

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