Method for improving display and touch reliability of touch display panel and touch display panel

Abstract

The invention provides a method for improving display and touch reliability of a touch display panel and the touch display panel, and relates to the technical field of touch display. The display panel comprises a thin film transistor array back plate, the thin film transistor array back plate comprises a second-layer metal wiring and a second-layer top-layer metal wiring lap joint area, the second-layer metal wiring and the second-layer top-layer metal wiring are in one-to-one correspondence, the lap joint area has a length, the length direction is perpendicular to the direction of the second-layer top-layer metal wiring, and the thickness of the lap joint area is smaller than that of the second-layer top-layer metal wiring. The method comprises the steps that a metal organic electrode layer with a preset width is provided in a lap joint area, and the metal organic electrode layer is arranged between a second-layer metal wiring and a second-layer top-layer metal wiring in the length direction of the lap joint area, the preset width can cover the overlapped part of the second layer metal wiring and the second layer top layer metal wiring. According to the method provided by the invention, the cost can be reduced, and meanwhile, the wire breakage risk of the second layer of top layer metal wiring is reduced, so that the reliability of the touch display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of touch display technology, and in particular to a method for improving the display and touch reliability of a touch display panel and a touch display panel. Background Art

[0002] In the field of organic light-emitting diodes (OLEDs), hybrid touch technology uses rigid glass as the thin-film transistor (TFT) array backplane, combined with flexible thin-film encapsulation. This technology typically connects the second metal layer (M2) to the driver chip or the bonding pad (COF pad) of the flexible substrate.

[0003] Generally, the standard process will set a passivation layer (PV layer) above the second metal layer. However, the cost of setting a passivation layer is expensive, and in order to save costs, the prior art usually adopts a solution without a passivation layer (PV SKIP). However, when the passivation layer is omitted, the pads of the flexible substrate will inevitably produce excessive lateral etching when wet etching. Not only that, since the second metal layer usually adopts a sandwich structure of titanium / aluminum / titanium, and the wet etching solution has a faster etching rate for aluminum, it is easy to form a concave sidewall of the second metal layer, resulting in poor climbing morphology of the touch electrode and the touch metal layer above the second metal layer, and the metal traces in the touch metal layer are broken, thereby making the touch function of the touch display panel ineffective.

[0004] Therefore, how to effectively suppress excessive etching of the M2 sidewall while maintaining low cost (i.e., maintaining the PV Skip solution) is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] To address the problems of the background art, a first aspect of an embodiment of the present application provides a method for improving the display and touch reliability of a touch display panel, wherein the display panel includes a thin film transistor array backplane, which includes a second layer of metal wiring and a second layer of top metal wiring overlap region, wherein the second layer of metal wiring corresponds to the second layer of top metal wiring in a one-to-one manner, and the overlap region has a length, and the length direction is perpendicular to the direction of the second layer of top metal wiring. The method is characterized in that it includes:

[0006] A metal organic electrode layer of predetermined width is provided in the overlapping area. The metal organic electrode layer is arranged between the second layer metal wiring and the second layer top metal wiring along the length direction of the overlapping area. The predetermined width can cover the overlapping part of the second layer metal wiring and the second layer top metal wiring.

[0007] Optionally, the metal-organic electrode layer is divided into a plurality of metal-organic electrode layer segments along the length direction of the overlapping region, each metal-organic electrode layer segment has a predetermined length, and the predetermined length can cover at least one second-layer metal wiring.

[0008] Optionally, each metal-organic electrode layer covers the corresponding second-layer metal wiring.

[0009] Optionally, the method includes:

[0010] The predetermined length of each metal-organic electrode layer segment is adjusted according to a risk index of each metal-organic electrode layer segment being peeled off from the second-layer metal wiring.

[0011] Optionally, overlapping portions of adjacent second-layer metal wirings and second-layer top-layer metal wirings are staggered along the direction of the second-layer top-layer metal wirings, so that adjacent metal-organic electrode layer segments are staggered along the direction of the second-layer top-layer metal wirings.

[0012] Optionally, touch electrodes are provided on the second-layer metal wiring, and the contact area where each touch electrode overlaps with the second-layer metal wiring remains unchanged.

[0013] Optionally, each metal-organic electrode layer segment covers a second-layer metal wiring and is arranged around the edge of the second-layer metal wiring.

[0014] Optionally, the metal organic electrode layer is not in contact with the touch electrode.

[0015] Optionally, the method includes:

[0016] An insulating layer is formed between the metal organic electrode layer and the second-layer metal wiring.

[0017] Optionally, the metal organic electrode layer includes an indium tin oxide layer, a silver layer and an indium tin oxide layer stacked in sequence.

[0018] Optionally, the metal organic electrode layer includes a third metal layer and a fourth metal layer that are stacked.

[0019] According to a second aspect of an embodiment of the present application, a touch display panel is provided. The touch display panel includes:

[0020] A touch display panel is manufactured according to a method for improving the display and touch reliability of a touch display panel described in the first aspect of an embodiment of the present application.

[0021] The beneficial effects that can be achieved by the embodiments of the present application are:

[0022] The embodiment of the present application sets a metal organic electrode layer in the overlapping area between the second-layer metal wiring and the second-layer top metal wiring to avoid the problem of the second-layer metal wiring being broken due to excessive lateral etching of the second-layer metal wiring during the wet etching process, thereby ensuring the touch and display reliability of the touch display panel.

[0023] In addition, in the embodiment of the present application, a passivation layer (PV layer) and a photoresist layer (PLN layer) are not set between the second-layer metal wiring and the second-layer top-layer metal wiring. The method of setting only a metal organic electrode layer can not only effectively reduce costs compared to setting a passivation layer (PV layer) and a photoresist layer (PLN layer), but also greatly shorten the interlayer thickness between the second-layer metal wiring and the second-layer top-layer metal wiring, thereby reducing the thickness and volume of the touch display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0025] Figure 1 A schematic structural diagram of an optional second-layer metal wiring (M2) and a second-layer top-layer metal wiring (TM2) provided in Example 1 of the present application;

[0026] Figure 2 A schematic diagram of a partial structure of an optional second-layer metal wiring (M2) and a second-layer top-layer metal wiring (TM2) provided in Example 1 of the present application;

[0027] Figure 3 A schematic cross-sectional view of a thin film transistor in a backplane display area (AA) of a thin film transistor array (Array) provided in an embodiment of the present application;

[0028] Figure 4 A schematic structural diagram of an optional second-layer metal wiring (M2) and a second-layer top-layer metal wiring (TM2) provided in Example 2 of the present application, wherein multiple metal-organic electrode layer segments (RE segments) are provided;

[0029] Figure 5 A schematic diagram of a partial structure of a plurality of metal-organic electrode layer segments (RE segments) provided between an optional second-layer metal wiring (M2) and a second-layer top-layer metal wiring (TM2) provided in Example 2 of the present application;

[0030] Figure 6 A schematic structural diagram of an optional metal organic electrode layer (RE) provided in Example 3 of the present application, arranged around the outer edge of the second metal wiring (M2) and between the second top metal wiring (TM2);

[0031] Figure 7 A schematic diagram of a partial structure of an optional metal-organic electrode layer (RE) provided in Example 3 of the present application, arranged around the outer edge of the second metal wiring (M2) and between the second top metal wiring (TM2);

[0032] Figure 8 A schematic diagram of an optional structure provided in Example 4 of the present application in which adjacent metal-organic electrode layer segments (RE segments) are staggered along the direction of the second top metal wiring (TM2);

[0033] Figure 9 A schematic diagram of a partial structure of an optional adjacent metal-organic electrode layer segment (RE segment) staggered along the direction of the second top metal wiring (TM2) provided in Example 4 of the present application;

[0034] Figure 10 Schematic diagram of the structure of a touch display panel in the prior art, as well as overall, partial and cross-sectional diagrams of a touch electrode sensor provided on the touch display panel and a thin film transistor provided in a touch display panel driving circuit;

[0035] Figure 11 Find the interlayer development diagram of the second-layer metal wiring (M2) and the second-layer top metal wiring (TM2) in the prior art;

[0036] Figure 12 It is a cross-sectional schematic diagram of a thin film transistor in a back panel display area (AA) of a thin film transistor array (Array) in the prior art. DETAILED DESCRIPTION

[0037] By referring to the detailed description and drawings of the following embodiments, the features of the inventive concept and its implementation method can be more easily understood. However, the inventive concept can be embodied in many different forms and should not be considered to be limited to the embodiments presented herein. Hereinafter, example embodiments will be described in more detail with reference to the accompanying drawings, wherein the same reference numerals refer to the same elements throughout the accompanying drawings. However, the present application can be embodied in various different forms and should not be considered to be limited to the embodiments shown herein. On the contrary, these embodiments are provided as examples so that this application will be sufficient and complete and will fully convey the aspects and features of the present invention to those skilled in the art. Therefore, for those of ordinary skill in the art, processes, elements and techniques that are not necessary for a complete understanding of the aspects and features of the present invention may not be described. Unless otherwise stated, the same reference numerals represent the same elements throughout the drawings and written description, and therefore their descriptions will not be repeated. In the drawings, the relative sizes of elements, layers and regions may be exaggerated for clarity.

[0038] Unless otherwise defined, the technical terms or scientific data used in this application shall have the ordinary meanings understood by persons having ordinary skills in the technical field to which this application belongs. In the description of this application, it should be understood that the terms "middle", "both sides", "longitudinal", "lateral", "upper", "lower", "first direction", "second direction" and the like, indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description. They are not intended to indicate or presume that the devices or components referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting this application.

[0039] It will be understood that when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or one or more intervening elements or layers may also be present. Additionally, it will be understood that when an element or layer is referred to as being “between” two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may also be present.

[0040] In order to make the technical problems solved by this application, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of this application will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0041] In order to solve the problems existing in the background technology, there is a solution in the prior art that a photoresist is applied between the second-layer metal wiring (M2) and the second-layer top metal wiring (TM2), and the photoresist is retained during the etching process to form a photoresist layer (PLN layer), so as to solve the problem that the side wall of the second-layer metal wiring (M2) is excessively etched during the wet etching process, thereby causing the second-layer top metal wiring (TM2) to break. However, when designing a touch display panel, it is necessary to consider that the thickness of the PLN layer is generally 1 to 2 μm, which makes the climbing angle of the second-layer top metal wiring (TM2) too large, and may also cause the second-layer top metal wiring (TM2) to break at the climbing position of the second-layer metal wiring (M2), such as Figure 11 As shown, the touch effect of the touch display panel is affected.

[0042] It should be understood that if Figure 10As shown, a touch display panel (oneglass TP, or TPOT) differs from a rigid organic light-emitting diode (OLED) touch panel. Rigid OLED touch panels incorporate the touch sensor (TP sensor) onto the glass encapsulation, bonding the touch sensor's glass substrate to the thin-film transistor (TFT) backplane glass via glass adhesive. Touch display panels, on the other hand, utilize a flexible thin-film encapsulation layer, forming the touch sensor through low-temperature film deposition, exposure, and etching. Rigid OLED sensor controllers utilize TP bonding pads designed into the glass encapsulation. Each sensor controller is interconnected via metal wires and the touch sensor bonding pads. The touch sensor signals are then processed and analyzed via the bonding port between the touch sensor and the flexible substrate. Oneglass TP, however, lacks separate touchscreen (TP) glass, making it impossible to design a TP bonding pad on the TP glass. Instead, the TP sensor signal is typically connected to the TFT backplane's solder points on the flexible substrate via the metal film layer within the TPOT, or directly to the non-glass pads on the panel's glass substrate (COF / COP bonding pad). After the COF / COP bonding pad is bonded to the flexible substrate using the ACF bonding process, it simultaneously outputs both the TFT backplane display signal and the TPOT touch signal.

[0043] Figure 10 This is a simple TOPT structure. Each green square in the left image represents a TP sensor, which is connected to the IC or COF pad on the TFT backplane using metal traces. The right image shows a simple TP sensor and traces. The metal traces connecting the TP sensor and IC / COF pad typically run between sensors and along the panel border.

[0044] Figure 12 This is a cross-sectional schematic diagram of a thin film transistor (TFT) in the display area (AA) of a simple thin film transistor array (Array) in the prior art. The structure includes a PV layer and a PLN layer, wherein Poly is the active layer, M1 is the first metal layer, M2 is the second metal layer, RE is the metal organic electrode layer, Buffer / GI / IMD / ILD / PV are inorganic insulating layers, and PLN / PDL / PS are organic insulating layers. Figure 12 The middle TPOT film layer is located above the TFT structure of the array backplane.

[0045] Based on the above-mentioned prior art, the inventors discovered that a metal-organic electrode layer (RE) can be used to replace the PV layer and the PLN layer. That is, only providing a metal-organic electrode layer (RE) between the second-layer metal wiring (M2) and the second-layer top metal wiring (TM2) can not only avoid excessive side etching of the sidewalls of the second-layer metal wiring (M2) when wet-etched, but also eliminate the need for providing a PV layer and a PLN layer, while also reducing the production cost of the touch display panel. In addition, generally speaking, the thickness of the metal-organic electrode layer (RE) is much smaller than that of the PLN layer. The climbing angle of the second-layer top metal wiring (TM2) at the climbing position of the second-layer metal wiring (M2) decreases with the thickness of the underlying film layer, which is beneficial to the climbing of the second-layer top metal wiring (TM2), reducing the risk of metal fracture of the second-layer top metal wiring (TM2) due to climbing, thereby improving the display and touch reliability of the touch display panel.

[0046] A method for improving the display and touch reliability of a touch display panel provided by an embodiment of the present application will be described in detail below.

[0047] The embodiment of the present application provides a method for improving the display and touch reliability of a touch display panel, such as Figures 1 to 3 As shown, the display panel includes a thin film transistor array backplane (array backplane), which includes an overlapping area between a second layer of metal wiring (M2) and a second layer of top metal wiring (TM2). Along a direction perpendicular to the plane where the thin film transistor array backplane (array backplane) is located, the second layer of metal wiring (M2), the metal organic electrode layer (RE), the touch electrode (TP1) and the second layer of top metal wiring (TM2) are stacked in sequence, and the second layer of metal wiring (M2) and the second layer of top metal wiring (TM2) are overlapped one by one. The overlapping area has a length, and the length direction is perpendicular to the direction of the second layer of top metal wiring (TM2) on the same plane. A metal organic electrode layer (RE) with a predetermined width is provided in the overlapping area. The metal organic electrode layer (RE) is arranged between the second layer of metal wiring (M2) and the second layer of top metal wiring (TM2) along the length direction of the overlapping area, and the predetermined width can cover the overlapping part of the second layer of metal wiring (M2) and the second layer of top metal wiring (TM2).

[0048] It should be noted that if Figure 3As shown, the second metal wiring layer (M2) and the layers below it are all arranged on the thin-film transistor array backplane (array backplane), where the ILD (Inter-Layer Dielectric) is an interlayer insulating layer. A metal organic electrode layer (RE), a touch electrode (TP1), and a second top metal wiring layer (TM2) are stacked in sequence above the second metal wiring layer (M2). Vias are provided in the metal organic electrode layer (RE) for routing to achieve electrical connections between the second metal wiring layer (M2), the touch electrode layer (TP1), and the second top metal wiring layer (TM2).

[0049] A method for improving the display and touch reliability of a touch display panel provided by an embodiment of the present application does not require the provision of a PV layer and a PLN layer between the second-layer metal wiring (M2) and the second-layer top metal wiring (TM2). Only a metal-organic electrode layer (RE) needs to be provided to prevent the sidewalls of the second-layer metal wiring (M2) from being excessively side-etched during the wet etching process, thereby improving the display and touch reliability of the touch display panel and enhancing the touch quality and display quality.

[0050] In some embodiments, the thickness of the metal organic electrode layer (RE) is 0.1 μm to 0.15 μm, which is much thinner than the thickness of the PLN layer in the prior art, and is more conducive to the climbing of the second-layer top metal wiring (TM2), thereby avoiding the risk of metal breakage during the climbing process of the second-layer top metal wiring (TM2).

[0051] In some embodiments, as Figure 1 and Figure 2 As shown, the metal-organic electrode layer (RE) is designed as an integral horizontal strip. Its predetermined width only needs to cover the width of the overlap area between the second-layer metal wiring (M2) and the second-layer top metal wiring (TM2). The metal-organic electrode layer (RE) does not contact the overlapping portion of the touch electrode (TP1) on the second-layer metal wiring (M2), so as to avoid the electrochemical reaction caused by the metal-organic electrode layer (RE) overlapping the second-layer metal wiring (M2) causing the touch display panel to fail. Its predetermined length direction is perpendicular to the direction of the second-layer top metal wiring (TM2) in the same plane, and its predetermined length only needs to cover the length of the overlap area between the second-layer metal wiring (M2) and the second-layer top metal wiring (TM2). It is not necessary to set the metal-organic electrode layer (RE) in the entire predetermined area of ​​the second-layer metal wiring (M2).

[0052] In some embodiments, as Figure 4 and Figure 5As shown, the metal-organic electrode layer (RE) is divided into multiple metal-organic electrode layer segments (RE segments) along the length direction of the overlapping region. In a specific embodiment, the multiple metal-organic electrode layer segments (RE segments) may also include two metal-organic electrode layer segments (RE segments). Each metal-organic electrode layer segment (RE segment) has a predetermined length. In one embodiment, the predetermined length of each metal-organic electrode layer segment (RE segment) is the same. In another embodiment, the predetermined length of each metal-organic electrode layer segment (RE segment) is different.

[0053] According to the above embodiment, Figure 3 As shown, the predetermined length of each metal-organic electrode layer segment (RE segment) can cover at least one second-layer metal wiring (M2), and the distance between adjacent metal-organic electrode layer segments (RE segments) is equal to the distance between adjacent second-layer metal wirings (M2). In a specific embodiment, each metal-organic electrode layer segment (RE segment) covers a second-layer metal wiring (M2). In the embodiment of the present application, since the length of the horizontally long strip-shaped metal-organic electrode layer (RE) is too long, there is a risk of peeling off and warping from the second-layer metal wiring (M2), resulting in poor touch display function. Therefore, the metal-organic electrode layer (RE) is designed into a multi-segment structure, each segment structure is used to cover one or more second-layer metal wirings (M2), which reduces the length of each metal-organic electrode layer segment (RE segment) used to cover the second-layer metal wiring (M2) to a certain extent, thereby reducing the risk of the metal-organic electrode layer (RE) peeling off and warping from the second-layer metal wiring (M2).

[0054] According to the above embodiment, the metal-organic electrode layer (RE) can dynamically adjust the predetermined length of each metal-organic electrode layer segment (RE segment) according to the risk index of peeling and warping with the second-layer metal wiring (M2), that is, dynamically adjust the number of the second-layer metal wiring (M2) that each metal-organic electrode layer segment (RE segment) can cover. Specifically, when the peeling risk of the metal-organic electrode layer segment (RE segment) and the corresponding second-layer metal wiring (M2) it covers is high, the predetermined length of the metal-organic electrode layer segment (RE segment) can be designed to be shorter, thereby reducing the peeling risk. When the peeling risk of the metal-organic electrode layer segment (RE segment) and the corresponding second-layer metal wiring (M2) it covers is low, the predetermined length of the metal-organic electrode layer segment (RE segment) can be designed to be longer, thereby simplifying the process flow while ensuring low peeling risk.

[0055] In some embodiments, as Figure 8 and Figure 9As shown, the overlapping portion between the adjacent second-layer metal wiring (M2) and the second-layer top metal wiring (TM2) is staggered along the direction of the second-layer top metal wiring (TM2), so that the adjacent metal organic electrode layer segments (RE segments) are staggered along the direction of the second-layer top metal wiring (TM2). Specifically, as Figure 9 As shown in the figure, it can be seen that the contact area of ​​the overlapping portion between the touch electrode (TP1) and each second-layer metal wiring (M2) is the same. In other words, in this embodiment, the staggered arrangement of adjacent metal-organic electrode layer segments (RE segments) only requires adjusting the second-layer metal wiring (M2) and the second-layer top-layer metal wiring (TM2) according to the position of each metal-organic electrode layer segment (RE segment), without adjusting the position of the touch electrode (TP1). Therefore, the contact area of ​​the overlapping portion between the touch electrode (TP1) and each second-layer metal wiring (M2) remains unchanged, thereby ensuring that the contact resistance between each second-layer metal wiring (M2) and the second-layer top-layer metal wiring (TM2) is substantially consistent, thereby improving the stability of the touch display panel.

[0056] In a specific embodiment, Figure 9 As shown, each metal-organic electrode layer segment (RE segment) covers a second-layer metal wiring (M2), and the multiple metal-organic electrode layer segments (RE segments) arranged along the length direction of the overlapping area are divided into a first row and a second row, and adjacent metal-organic electrode layer segments (RE segments) are staggered.

[0057] In another specific embodiment, each metal-organic electrode layer segment (RE segment) may cover at least one second-layer metal wiring (M2), and each metal-organic electrode layer segment (RE segment) is staggered along the same direction.

[0058] The embodiments of the present application do not limit the staggered arrangement of the metal-organic electrode layer segments (RE segments), as long as the adjacent metal-organic electrode layer segments (RE segments) can be staggered to ensure sufficient space between adjacent metal-organic electrode layer segments (RE segments).

[0059] According to the above embodiment, the metal-organic electrode layer (RE) designed in this way can indirectly increase the space between each metal-organic electrode layer segment (RE segment), thereby reducing the etching residue during the etching process of the metal-organic electrode layer segment (RE segment), and further delaying the corrosion time of short circuit between each metal-organic electrode layer segment (RE segment).

[0060] In some embodiments, as Figure 6 and Figure 7As shown, each metal organic electrode layer segment (RE segment) is designed to be ring-shaped and is arranged around the edge of the second layer of metal wiring (M2), wrapping the side wall of the entire second layer of metal wiring (M2), so that the side wall of the entire second layer of metal wiring (M2) can be protected by the metal organic electrode layer (RE).

[0061] According to the above embodiment, the touch electrode (TP1) and the metal-organic electrode layer (RE) are not in contact. This is because the metal-organic electrode layer (RE) is more likely to undergo an electrochemical reaction when it is connected to the second layer of metal wiring (M2), which can cause failure of the touch display panel. Therefore, to ensure the performance of the touch display panel, it is necessary to set the touch electrode (TP1) and the metal-organic electrode layer (RE) to a non-contact state.

[0062] In some embodiments, an inorganic insulating layer is provided between the metal-organic electrode layer (RE) and the second-layer metal wiring (M2), as well as between the metal-organic electrode layer (RE) and the second-layer top metal wiring (TM2), so as to achieve insulation protection for the lower interlayer insulating layer (ILD) and the touch electrode (TP1), avoid the problem of interlayer short circuit, and effectively prevent corrosion between each metal-organic electrode layer segment (RE segment) and between the metal-organic electrode layer segment (RE segment) and the corresponding contact second-layer metal wiring (M2).

[0063] In some embodiments, the metal-organic electrode layer (RE) comprises a three-layer structure of an indium tin oxide layer, a silver layer, and an indium tin oxide layer (ITO / Ag / ITO) stacked in sequence. The present invention does not limit the specific material of the metal-organic electrode layer (RE), as long as it can prevent the chemical solution from over-etching the sidewalls of the second metal wiring (M2) during the wet etching process.

[0064] In other embodiments, in addition to directly adopting a complex conductive stacked structure, the metal-organic electrode layer (RE) can also adopt a metal film layer arrangement between the second metal wiring (M2) and the metal-organic electrode layer (RE). For example, a third metal wiring layer and / or a fourth metal wiring layer are arranged between the second metal wiring layer (M2) and the metal-organic electrode layer (RE), that is, the metal-organic electrode layer (RE) as a whole of the third metal wiring layer and / or the fourth metal wiring layer and the metal-organic electrode layer (RE) is arranged in the overlapping area. In a specific embodiment, the third metal wiring layer and / or the fourth metal wiring layer can also be directly used to replace the metal-organic electrode layer (RE). The above embodiment can achieve the effect of preventing the chemical solution from excessively etching the side wall of the second metal wiring layer (M2) without adopting a complex process and stacked design, while simplifying the interlayer structure and process and reducing costs.

[0065] According to a second aspect of an embodiment of the present application, a touch display panel is provided. The touch display panel includes:

[0066] A touch display panel is manufactured according to a method for improving the display and touch reliability of a touch display panel provided in a first aspect of an embodiment of the present application.

[0067] Example 1

[0068] The first embodiment provides a metal organic electrode layer (RE), which is designed to be an integral horizontal strip and completely covers the overlap area between the second layer metal wiring (M2) and the second layer top metal wiring (TM2) along the direction of the second layer top metal wiring (TM2). Figure 1 and Figure 2 shown.

[0069] In this embodiment 1, the metal-organic electrode layer (RE) has a predetermined width, which can cover the overlapping portion between the second-layer metal wiring (M2) and the second-layer top-layer metal wiring (TM2), and the metal-organic electrode layer (RE) does not contact the touch electrode (TP1) to avoid failure of the touch display panel due to electrochemical reaction caused by the contact between the metal-organic electrode layer (RE) and the touch electrode (TP1).

[0070] The above-mentioned metal organic electrode layer (RE) with an integrated horizontal strip design can ensure that the etching solution will not corrode the side walls of the second layer of metal wiring (M2) under the wet etching process, thereby ensuring the performance of the touch display panel.

[0071] Example 2

[0072] like Figure 4 and Figure 5 As shown, this embodiment 3 provides a metal-organic electrode layer (RE), which is designed to have multiple metal-organic electrode layer segments (RE segments) arranged along the direction of the second-layer top-layer metal wiring (TM2), and each metal-organic electrode layer segment (RE segment) has the same predetermined width. The predetermined width of each metal-organic electrode layer segment (RE segment) covers the overlapping area between a second-layer metal wiring (M2) and a second-layer top-layer metal wiring (TM2), and the metal-organic electrode layer (RE) does not contact the touch electrode (TP1) to avoid failure of the touch display panel due to electrochemical reaction caused by the contact between the metal-organic electrode layer (RE) and the touch electrode (TP1).

[0073] In this embodiment 2, the multi-segment arrangement of the metal-organic electrode layer segments (RE segments) can effectively avoid an excessively high peeling index between the metal-organic electrode layer (RE) and the second-layer metal wiring (M2) due to the excessive length of the metal-organic electrode layer (RE), thereby improving the touch quality and display quality of the touch display panel.

[0074] Example 3

[0075] like Figure 6 and Figure 7 As shown, this embodiment 3 provides a metal-organic electrode layer (RE). The metal-organic electrode layer (RE) is also divided into multiple metal-organic electrode layer segments (RE segments). Each metal-organic electrode layer segment (RE segment) is designed in a ring shape and is arranged around the edge of a corresponding second-layer metal wiring (M2). In addition, each metal-organic electrode layer segment (RE segment) is also arranged in the overlapping area between a corresponding second-layer metal wiring (M2) and a second-layer top metal wiring (TM2). This protects the sidewalls of each second-layer metal wiring (M2), greatly improving the stability of the touch display panel.

[0076] According to the third embodiment, the multiple metal-organic electrode layer segments (RE segments) do not contact the touch electrodes (TP1), thereby preventing the metal-organic electrode layer (RE) from contacting the touch electrodes (TP1) and causing electrochemical reactions that may cause failure of the touch display panel.

[0077] In this embodiment 3, each annular metal-organic electrode layer segment (RE segment) is arranged around the edge of the corresponding second-layer metal wiring (M2). Through this design, the side walls of the second-layer metal wiring (M2) can be wrapped, so that the side walls of the second-layer metal wiring (M2) can be protected by the metal-organic electrode layer (RE), greatly improving the touch performance and display performance of the touch display panel.

[0078] Example 4

[0079] In this embodiment 4, based on the structures provided in the above-mentioned embodiments 1, 2 and 3, an inorganic layer is provided on the side walls of the metal-organic electrode layer (RE) or each metal-organic electrode layer segment (RE segment) provided in this embodiment that is in contact with the second-layer metal wiring (M2) and the second-layer top-layer metal wiring (TM2) to achieve insulation between the metal layers and avoid the risk of short circuit between the metal layers.

[0080] According to the fourth embodiment, the multiple metal-organic electrode layer segments (RE segments) do not contact the touch electrodes (TP1), thereby preventing the metal-organic electrode layer (RE) from contacting the touch electrodes (TP1) and causing electrochemical reactions that may cause failure of the touch display panel.

[0081] Example 5

[0082] In this embodiment 5, based on the structure of the metal organic electrode layer (RE) provided in the above embodiment 2, this embodiment staggers the overlapping areas between the adjacent second-layer metal wiring (M2) and the second-layer top metal wiring (TM2) so that the adjacent multi-segment metal organic electrode layer segments (RE segments) are staggered.

[0083] like Figure 8 and Figure 9 As shown, the metal organic electrode layer segments (RE segments) arranged at intervals are arranged in the same row along a direction perpendicular to the second top metal wiring (TM2), and the adjacent metal organic electrode layer segments (RE segments) are staggered to form a Figure 8 and Figure 9 Arrangement shown.

[0084] According to the fifth embodiment, the multiple metal-organic electrode layer segments (RE segments) do not contact the touch electrodes (TP1), thereby preventing the metal-organic electrode layer (RE) from contacting the touch electrodes (TP1) and causing electrochemical reactions that may cause failure of the touch display panel.

[0085] According to the above-described fifth embodiment, when the distance between adjacent second-layer metal wirings (M2) is too small, etching residues may exist between adjacent multiple metal-organic electrode layer segments (RE segments), thereby causing a short circuit between metal layers. Therefore, in this embodiment, adjacent metal-organic electrode layer segments (RE segments) are staggered to increase the space between adjacent metal-organic electrode layer segments (RE segments), thereby reducing the risk of etching residues between adjacent metal-organic electrode layer segments (RE segments), further delaying the corrosion time of adjacent metal-organic electrode layer segments (RE segments) causing electrode short circuits, and thus extending the service life of the touch display panel.

[0086] According to the above embodiment, the staggered arrangement between adjacent metal organic electrode layer segments (RE segments) needs to ensure that the contact area between the touch electrode (TP1) and the second-layer metal wiring (M2) is the same, so that the contact resistance between the adjacent second-layer metal wiring (M2) and the corresponding second-layer top-layer metal wiring (TM2) is basically consistent, so as to achieve the stability of the touch display panel.

[0087] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art who can easily conceive of changes or substitutions within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A method for improving the display and touch reliability of a touch display panel, wherein the display panel includes a thin film transistor array backplane, which includes a second layer of metal wiring and a second layer of top metal wiring overlap area, wherein: The second layer of metal wiring corresponds to the second layer of top metal wiring in a one-to-one manner, the overlapping region has a length, and the length direction is perpendicular to the direction of the second layer of top metal wiring, characterized in that the method includes: A metal organic electrode layer of predetermined width is provided in the overlapping area, and the metal organic electrode layer is arranged between the second layer metal wiring and the second layer top metal wiring along the length direction of the overlapping area, and the predetermined width can cover the overlapping part of the second layer metal wiring and the second layer top metal wiring.

2. The method according to claim 1, characterized in that The metal-organic electrode layer is divided into a plurality of metal-organic electrode layer segments along the length direction of the bonding region. Each of the metal-organic electrode layer segments has a predetermined length, and the predetermined length can cover at least one second-layer metal wiring.

3. The method according to claim 2, characterized in that Each of the metal organic electrode layers covers the corresponding second layer metal wiring.

4. The method according to claim 2, characterized in that The method comprises: The predetermined length of each metal-organic electrode layer segment is adjusted according to a risk index of each metal-organic electrode layer segment being peeled off from the second-layer metal wiring.

5. The method according to claim 2, characterized in that The overlapping parts of the adjacent second-layer metal wirings and the second-layer top-layer metal wirings are staggered along the direction of the second-layer top-layer metal wirings, so that the adjacent metal-organic electrode layer segments are staggered along the direction of the second-layer top-layer metal wirings.

6. The method according to claim 4, characterized in that Touch electrodes are provided on the second layer of metal wiring, and the contact area where each touch electrode overlaps with the second layer of metal wiring remains unchanged.

7. The method according to claim 2, characterized in that Each of the metal-organic electrode layer segments covers one of the second-layer metal wirings and is arranged around the edge of the second-layer metal wiring.

8. The method according to claim 6, characterized in that The metal organic electrode layer does not contact the touch electrode.

9. The method according to claim 1, characterized in that The method comprises: An insulating layer is formed between the metal organic electrode layer and the second metal wiring layer.

10. The method according to claim 1, characterized in that The metal organic electrode layer includes an indium tin oxide layer, a silver layer and an indium tin oxide layer which are stacked in sequence.

11. The method according to claim 1 or 10, characterized in that The metal organic electrode layer includes a third metal layer and a fourth metal layer which are stacked.

12. A touch display panel, characterized in that: include: A touch display panel manufactured according to the method of claims 1-11.

Images