Semiconductor refrigeration helmet

Abstract

The invention belongs to the technical field of helmets, and relates to a semiconductor refrigeration helmet which comprises a shell, a semiconductor refrigeration piece, a cooling fin, a control module, a fan, an air inlet, an interlayer, an air conveying channel and an air outlet, the semiconductor refrigeration piece is arranged at the position, close to the afterbrain, of the upper end of the helmet, and refrigeration is achieved through the thermoelectric effect of a semiconductor material; one side of the semiconductor chilling plate is connected with the interior of the helmet, the other side of the semiconductor chilling plate is connected with the cooling fin through heat conduction, the cooling fin is arranged outside the helmet and connected with the hot end of the semiconductor chilling plate, and the control module is arranged inside or outside the helmet and used for regulating and controlling the working state of the semiconductor chilling plate. The fan is arranged in the center of the helmet and used for sucking external air into the helmet through the air inlet. The wearing comfort is improved, and meanwhile, a powerful guarantee is provided for work in a special environment.

Description

Technical Field

[0001] The present invention relates to the technical field of helmets, and more particularly to a semiconductor refrigeration helmet. Background Art

[0002] Traditional helmets can easily cause the head to overheat after prolonged wear, compromising both comfort and health. Existing helmets often lack effective heat dissipation, leading to internal heat buildup. Traditional helmets lack intelligent temperature control mechanisms, making them difficult to meet personalized needs. Existing helmets also lack optimal airflow, which can lead to turbid air inside and compromise respiratory health. Summary of the Invention

[0003] In view of the above-mentioned defects of the prior art, the present invention provides a semiconductor refrigeration helmet, comprising:

[0004] The helmet comprises a shell, a semiconductor refrigeration sheet, a heat sink, a control module, a fan, an air inlet, a partition, an air duct and an air outlet. The semiconductor refrigeration sheet is arranged at the upper end of the helmet near the back of the head and realizes cooling by utilizing the thermoelectric effect of semiconductor materials. One side of the refrigeration sheet is connected to the inside of the helmet, and the other side is connected to the heat sink through heat conduction. The heat sink is arranged on the outside of the helmet and is connected to the hot end of the semiconductor refrigeration sheet. The control module is arranged inside or outside the helmet and is used to regulate the working state of the semiconductor refrigeration sheet. The fan is arranged in the center of the helmet and is used to draw external air into the helmet through the air inlet and promote the air circulation inside the helmet. The air inlet is arranged at the top of the helmet and is used to introduce external air. The air outlets are distributed on both sides of the air duct inside the helmet and are used to blow the cooled air toward the wearer's head. The partition is arranged inside the helmet and is used to isolate the cooling area from the non-cooling area. The semiconductor refrigeration sheet, the heat sink, the control module and the fan are electrically connected, and the shell and the heat sink are connected by fasteners.

[0005] Preferably, the control module includes: pin 1 of the linear charge management chip IC1 is respectively connected to one end of the resistor R1 and pin 3 of the linear charge management chip IC1, pin 2 of the linear charge management chip IC1 is connected to one end of the resistor R1, and pin 4 of the linear charge management chip IC1 is respectively connected to pin 2 of the connection terminal CN1, pin 8 of the linear charge management chip IC1, one end of the capacitor C1, the positive electrode of the light-emitting diode D4, the positive electrode of the light-emitting diode D3, the positive electrode of the light-emitting diode D2, and the positive electrode of the light-emitting diode D1. The other end of the capacitor C1 is respectively connected to pin 1 of the connection terminal CN1, the negative electrode of the battery BT2, the negative electrode of the battery BT1, the negative electrode of the light-emitting diode D5, one end of the resistor R9, the source of the transistor Q2, one end of the resistor R6, and the source of the transistor Q1 and is grounded. The positive electrode of the battery BT2 is connected to the positive electrode of the diode D7, and the negative electrode of the diode D7 is respectively connected to the positive electrode of the battery BT1, one end of the switch S2, and the switch S1. One end of the linear charge management chip IC1, pin 5 of the linear charge management chip IC1, the cathode of the diode D6, one end of the fan FA1, one end of the fan FAN2, and one end of the connector TE are connected, pin 6 of the linear charge management chip IC1 is connected to one end of the resistor R3, pin 7 of the linear charge management chip IC1 is connected to one end of the resistor R2, the cathode of the light-emitting diode D1 is respectively connected to the cathode of the light-emitting diode D2 and the other end of the resistor R3, the other end of the resistor R9 is respectively connected to one end of the resistor R5 and the gate of the transistor Q2, the other end of the resistor R5 is connected to the other end of the switch S1, the drain of the transistor Q2 is connected to one end of the resistor R7, the other end of the resistor R6 is respectively connected to one end of the resistor R4 and the gate of the transistor Q1, the other end of the resistor R4 is connected to the other end of the switch S1, and the drain of the transistor Q1 is respectively connected to the anode of the diode D6, the other end of the fan FA1, the other end of the fan FAN2, the other end of the resistor R7, and the other end of the connector TE.

[0006] Preferably, the space between the semiconductor refrigeration fins and the heat sink is filled with heat-conducting material.

[0007] Preferably, the heat sink surface is provided with a fin structure.

[0008] Preferably, the spacer is filled with phase change material.

[0009] Preferably, a heat pipe is provided between the heat sink and the semiconductor refrigeration fin, one end of the heat pipe is connected to the heating surface of the semiconductor refrigeration fin, and the other end of the heat pipe is connected to the heat sink.

[0010] Preferably, an active cooling fan is provided outside the heat sink.

[0011] Preferably, multiple layers of heat insulating material are provided inside the shell.

[0012] Preferably, a waterproof and dustproof structure is provided at the air inlet.

[0013] Preferably, a waterproof and dustproof structure is provided at the air outlet.

[0014] The semiconductor refrigeration helmet of the present invention has the following beneficial effects:

[0015] In terms of cooling effect, the semiconductor cooling chip uses the thermoelectric effect to achieve efficient cooling. One side of the chip is connected to the inside of the helmet, which can quickly reduce the temperature inside the helmet, creating a cool and comfortable environment for the wearer. It is especially suitable for high-temperature work or outdoor activities in hot weather.

[0016] The heat dissipation performance is good. The hot end of the semiconductor refrigeration chip is connected to the heat sink outside the helmet through heat conduction. The heat sink can effectively dissipate heat, ensuring the continuous and stable operation of the refrigeration chip and avoiding the cooling effect affected by overheating.

[0017] The helmet's internal air circulation system is rationally designed. The fan is located in the center of the helmet, drawing in external air through the air inlet and pushing the air to circulate inside the helmet. The air outlets are distributed on both sides of the air supply duct, which can blow the cooled air precisely towards the wearer's head, further improving the cooling experience.

[0018] The compartment design is very thoughtful. It can effectively isolate the cooling area from the non-cooling area, preventing cold air from leaking out, improving cooling efficiency, and making more reasonable use of the helmet's internal space. In addition, all components are connected through electrical connections and fasteners, making the structure stable and easy to install and maintain.

[0019] While improving wearing comfort, it also provides strong support for working in special environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative work. The present invention will be further explained below in conjunction with the drawings and embodiments. In the drawings:

[0021] Figure 1 This is a circuit diagram of a control module in a semiconductor refrigeration helmet of the present invention;

[0022] Figure 2 This is a schematic diagram of the arrangement of semiconductors in the semiconductor refrigeration sheet in the semiconductor refrigeration helmet of the present invention;

[0023] Figure 3The figure is a schematic diagram of the working principle of the semiconductor refrigeration plate in the semiconductor refrigeration helmet of the present invention.

[0024] In the figure, 1 is the first metal wire, and 2 is the second metal wire. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0026] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0027] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0028] The semiconductor refrigeration helmet provided in the first embodiment of the present invention at least includes a shell, a semiconductor refrigeration plate, a heat sink, a control module, a fan, an air inlet, a partition, an air duct and an air outlet. The semiconductor refrigeration plate is arranged at the upper end of the helmet near the back of the head, and refrigeration is achieved by utilizing the thermoelectric effect of the semiconductor material. One side of the refrigeration plate is connected to the inside of the helmet, and the other side is connected to the heat sink through heat conduction. The heat sink is arranged outside the helmet and is connected to the hot end of the semiconductor refrigeration plate. The control module is arranged inside or outside the helmet and is used to regulate the working state of the semiconductor refrigeration plate. The fan is arranged in the center of the helmet and is used to suck external air into the helmet through the air inlet and promote the air to circulate inside the helmet. The air inlet is arranged at the top of the helmet and is used to introduce external air. The air outlets are distributed on both sides of the air duct inside the helmet and are used to blow the cooled air toward the wearer's head. The partition is arranged inside the helmet and is used to isolate the cooling area from the non-cooling area. The semiconductor refrigeration plate, the heat sink, the control module and the fan are electrically connected, and the shell and the heat sink are connected by fasteners.

[0029] The helmet shell is the main structure of the entire device. It is made of lightweight, high-strength composite materials. This ensures the durability of the helmet while reducing the overall weight and making it easier to wear. The design of the helmet shell must be ergonomic to ensure a comfortable and secure fit.

[0030] Semiconductor coolers utilize the thermoelectric effect of semiconductor materials to achieve cooling. It should be noted that the selection of semiconductor coolers requires consideration of factors such as cooling efficiency, power consumption, and thermal stability.

[0031] The heat sink is located on the outside of the helmet and connected to the hot end of the semiconductor cooler. It is used to dissipate the heat generated during the cooling process into the air. The heat sink design must have a large heat dissipation area and good thermal conductivity to improve heat dissipation efficiency.

[0032] Figure 1 This is a circuit diagram of the control module in the semiconductor refrigeration helmet of the present invention. Figure 1As shown, the control module includes: pin 1 of the linear charge management chip IC1 is respectively connected to one end of the resistor R1 and pin 3 of the linear charge management chip IC1, pin 2 of the linear charge management chip IC1 is connected to one end of the resistor R1, pin 4 of the linear charge management chip IC1 is respectively connected to pin 2 of the connection terminal CN1, pin 8 of the linear charge management chip IC1, one end of the capacitor C1, the positive electrode of the light-emitting diode D4, the positive electrode of the light-emitting diode D3, the positive electrode of the light-emitting diode D2, and the positive electrode of the light-emitting diode D1, the other end of the capacitor C1 is respectively connected to pin 1 of the connection terminal CN1, the negative electrode of the battery BT2, the negative electrode of the battery BT1, the negative electrode of the light-emitting diode D5, one end of the resistor R9, the source of the transistor Q2, one end of the resistor R6, and the source of the transistor Q1 and are grounded, the positive electrode of the battery BT2 is connected to the positive electrode of the diode D7, and the negative electrode of the diode D7 is respectively connected to the positive electrode of the battery BT1, one end of the switch S2, and the negative electrode of the switch S1. One end of the linear charge management chip IC1 is connected to pin 5 of the linear charge management chip IC1, the cathode of the diode D6, one end of the fan FA1, one end of the fan FAN2, and one end of the connector TE. Pin 6 of the linear charge management chip IC1 is connected to one end of the resistor R3. Pin 7 of the linear charge management chip IC1 is connected to one end of the resistor R2. The cathode of the light-emitting diode D1 is respectively connected to the cathode of the light-emitting diode D2 and the other end of the resistor R3. The other end of the resistor R9 is respectively connected to one end of the resistor R5 and the gate of the transistor Q2. The other end of the resistor R5 is connected to the other end of the switch S1. The drain of the transistor Q2 is connected to one end of the resistor R7. The other end of the resistor R6 is respectively connected to one end of the resistor R4 and the gate of the transistor Q1. The other end of the resistor R4 is connected to the other end of the switch S1. The drain of the transistor Q1 is respectively connected to the anode of the diode D6, the other end of the fan FA1, the other end of the fan FAN2, the other end of the resistor R7, and the other end of the connector TE.

[0033] When charging, the red LED lights D1, D2, D3 and D4 light up, and when fully charged, the blue LED lights D1, D2, D3 and D4 light up.

[0034] Press the left switch S2, and the 10MM straight-plug LED lights D1, D2, D3 and D4 will light up. Press it again and the LED lights D1, D2, D3 and D4 will go out.

[0035] Pressing the rear switch S1 causes fans FAN1 and FAN2 to rotate at half speed, fully opening the semiconductor cooler. Pressing it again turns fans FAN1 and FAN2 on at full speed, half-opening the semiconductor cooler. Pressing it again turns all fans FAN1 and FAN2 off. The left switch S2 turns the F8 LED on and off. The right switch S1 simultaneously controls the slow, fast, and off operation of the motor and semiconductor cooler. A red light appears during charging, and a blue light appears when fully charged. The charging current is approximately 1A. The first left socket is for an external power supply, such as a battery compartment. The second socket is left empty. The third socket is for a lithium battery, and the fourth and fifth sockets are for the fan motor.

[0036] The control module is located inside or outside the helmet in an easily accessible position and is responsible for regulating the working status of the semiconductor refrigeration plate, including cooling power, working time, etc.

[0037] It should be noted that the design of the air inlet and outlet needs to take into account the smoothness and uniformity of air flow to ensure that the cooling effect inside the helmet is evenly distributed.

[0038] When selecting a fan, factors such as air volume, air speed, and noise level should be considered to ensure adequate cooling while maintaining a low noise level. The fan is driven by a control module that automatically adjusts its speed based on the internal temperature of the helmet.

[0039] The space between the semiconductor refrigeration chip and the heat sink is filled with heat-conducting material.

[0040] The heat sink dissipates heat generated during the cooling process into the air. In practice, the surface of the heat sink can be configured with fins to increase the heat dissipation area and accelerate air convection. It should be noted that the heat sink design must have a large heat dissipation area and good thermal conductivity to improve heat dissipation efficiency.

[0041] The interlayer is used to separate the cooling area from the non-cooling area to prevent cooling loss. It should be noted that the design of the interlayer must ensure that air can pass through smoothly while reducing cooling leakage.

[0042] In practice, the interlayer is filled with a phase-change material, such as paraffin wax or hydrated salts. This material's latent heat absorption properties improve the helmet's internal heat capacity and cooling efficiency. When the helmet's internal temperature rises, the material absorbs the heat and undergoes a phase change, slowing the temperature rise. When the temperature drops, the material releases the heat and returns to its solid state, preparing for the next cooling cycle.

[0043] A heat pipe is installed between the heat sink and the semiconductor cooling element. One end of the heat pipe is connected to the heating surface of the semiconductor cooling element, and the other end is connected to the heat sink. This heat pipe utilizes the phase change heat transfer characteristics of the working fluid within the heat pipe to improve heat conduction efficiency. When the semiconductor cooling element generates heat, the heat is rapidly transferred to the heat sink through the heat pipe and dissipated into the air. The heat pipe offers advantages such as high thermal conductivity, low thermal resistance, and excellent temperature uniformity, significantly improving the heat dissipation efficiency of the semiconductor cooling helmet.

[0044] An active cooling fan is installed outside the heat sink to improve heat dissipation efficiency. This fan increases air flow, accelerating convection heat transfer across the heat sink surface, thereby reducing heat sink temperature. The fan's speed automatically adjusts based on the heat sink temperature to achieve energy savings.

[0045] Multiple layers of insulation are installed inside the enclosure to minimize cooling leakage and heat transfer. When selecting insulation, factors such as thermal conductivity, density, and thickness should be considered to maximize the insulation effect. The design of these multiple layers of insulation must ensure smooth air flow while minimizing cooling leakage and heat transfer.

[0046] The air inlet is equipped with a waterproof and dustproof structure to prevent moisture and dust from entering the helmet and affecting the cooling effect and electrical safety. It should be noted that the waterproof and dustproof design must take into account factors such as the helmet's usage environment and maintenance convenience to ensure the long-term stable operation of the helmet.

[0047] The air outlet is equipped with a waterproof and dustproof structure to prevent moisture and dust from entering the helmet and affecting cooling performance and electrical safety. The waterproof and dustproof design must take into account factors such as the helmet's usage environment and maintenance ease to ensure long-term stable operation of the helmet.

[0048] In practice, ergonomic design can also be optimized to improve the wearer's comfort and stability. By adjusting parameters such as the helmet's shape, size, and weight, the helmet can be made to fit the curves of the human head more closely. Adding accessories such as headbands and earmuffs can improve the helmet's wearing stability and comfort. Optimizing ergonomic design can enhance the wearer's work efficiency and user experience.

[0049] In practice, a modular design approach can be adopted, allowing the semiconductor cooling helmet of the present invention to be split into multiple independent modules, such as a cooling module, a heat dissipation module, and a control module, to facilitate maintenance and upgrades. This modular design can reduce production and maintenance costs and improve product maintainability and scalability.

[0050] Figure 2 This is a schematic diagram of the arrangement of semiconductors in the semiconductor refrigeration sheet of the semiconductor refrigeration helmet of the present invention. Figure 2As shown, the cooling plate is composed of alternating N-type and P-type semiconductors. When a DC power source is connected, the current direction is determined. Under the action of the current, the free electrons in the N-type semiconductor and the holes in the P-type semiconductor move in a directional manner.

[0051] At one end of the cooling plate, the movement of electrons and holes absorbs heat, known as the cold end, reducing the temperature inside the helmet and providing a cool experience for the user. At the other end, the movement of electrons and holes releases heat, known as the hot end, which must be dissipated through a heat sink to maintain cooling.

[0052] The ceramic sheet acts as an insulator and a heat conductor, ensuring circuit safety while effectively conducting heat. The metal conductor connects the N-type and P-type semiconductors and the DC power supply, ensuring smooth current flow.

[0053] Through this ingenious semiconductor sequencing and current control, the semiconductor refrigeration helmet realizes the cooling function, which can provide a comfortable temperature environment for the user's head in hot environments. It has the advantages of high efficiency, environmental protection, and no noise.

[0054] Figure 3 This is a schematic diagram of the working principle of the semiconductor refrigeration sheet in the semiconductor refrigeration helmet of the present invention. Figure 3 As shown, in a closed circuit composed of two different metal wires, the first metal wire 1 and the second metal wire 2, after power is turned on, the heat at point A is transferred to point B, causing the temperature at point A to decrease and the temperature at point B to increase.

[0055] In a specific implementation, the air supply process of the semiconductor cooling helmet of the present invention can be achieved by providing a dedicated channel directly connected to the semiconductor cooling plate through the air outlet. The fan blows the cooled air and then sends it through the air duct surrounding the helmet, which reduces the space and improves the cooling effect.

[0056] The working principle of the semiconductor refrigeration helmet of the present invention is:

[0057] Based on the thermoelectric effect of semiconductor materials, when current passes through a semiconductor cooling plate, one side absorbs heat and cools, while the other side releases heat and heats. The cooling surface is connected to the inside of the helmet, transferring the cold energy to the air inside the helmet; the heating surface dissipates the heat to the air through the heat sink.

[0058] The fan draws outside air into the helmet through the air inlet. As the air flows through the helmet, it is cooled by the cooling fins, creating cool air. This cool air is then distributed along ducts on either side of the fins to other areas within the helmet, providing localized cooling. Based on the temperature signal from the temperature sensor, the control module adjusts the power output of the semiconductor cooling fins and the fan speed to maintain a constant temperature inside the helmet.

[0059] The present invention has the following beneficial effects through the design of the above embodiments:

[0060] In terms of cooling effect, the semiconductor cooling chip uses the thermoelectric effect to achieve efficient cooling. One side of the chip is connected to the inside of the helmet, which can quickly reduce the temperature inside the helmet, creating a cool and comfortable environment for the wearer. It is especially suitable for high-temperature work or outdoor activities in hot weather.

[0061] The heat dissipation performance is good. The hot end of the semiconductor refrigeration chip is connected to the heat sink outside the helmet through heat conduction. The heat sink can effectively dissipate heat, ensuring the continuous and stable operation of the refrigeration chip and avoiding the cooling effect affected by overheating.

[0062] The helmet's internal air circulation system is rationally designed. The fan is located in the center of the helmet, drawing in external air through the air inlet and pushing the air to circulate inside the helmet. The air outlets are distributed on both sides of the air supply duct, which can blow the cooled air precisely towards the wearer's head, further improving the cooling experience.

[0063] The compartment design is very thoughtful. It can effectively isolate the cooling area from the non-cooling area, preventing cold air from leaking out, improving cooling efficiency, and making more reasonable use of the helmet's internal space. In addition, all components are connected through electrical connections and fasteners, making the structure stable and easy to install and maintain.

[0064] While improving wearing comfort, it also provides strong support for working in special environments.

[0065] While the present invention has been described with reference to specific embodiments, those skilled in the art will appreciate that various modifications and equivalents may be made without departing from the scope of the present invention. Furthermore, numerous modifications may be made to adapt the present invention to specific applications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but encompasses all embodiments falling within the scope of the claims.

Claims

1. A semiconductor refrigeration helmet, characterized in that: include: The helmet comprises a shell, a semiconductor refrigeration sheet, a heat sink, a control module, a fan, an air inlet, a partition, an air duct and an air outlet. The semiconductor refrigeration sheet is arranged at the upper end of the helmet near the back of the head and realizes cooling by utilizing the thermoelectric effect of semiconductor materials. One side of the refrigeration sheet is connected to the inside of the helmet, and the other side is connected to the heat sink through heat conduction. The heat sink is arranged on the outside of the helmet and is connected to the hot end of the semiconductor refrigeration sheet. The control module is arranged inside or outside the helmet and is used to regulate the working state of the semiconductor refrigeration sheet. The fan is arranged in the center of the helmet and is used to draw external air into the helmet through the air inlet and promote the air circulation inside the helmet. The air inlet is arranged at the top of the helmet and is used to introduce external air. The air outlets are distributed on both sides of the air duct inside the helmet and are used to blow the cooled air toward the wearer's head. The partition is arranged inside the helmet and is used to isolate the cooling area from the non-cooling area. The semiconductor refrigeration sheet, the heat sink, the control module and the fan are electrically connected, and the shell and the heat sink are connected by fasteners.

2. The semiconductor refrigeration helmet according to claim 1, characterized in that: The control module includes: pin 1 of the linear charge management chip IC1 is respectively connected to one end of the resistor R1 and pin 3 of the linear charge management chip IC1, pin 2 of the linear charge management chip IC1 is connected to one end of the resistor R1, pin 4 of the linear charge management chip IC1 is respectively connected to pin 2 of the connection terminal CN1, pin 8 of the linear charge management chip IC1, one end of the capacitor C1, the positive electrode of the light-emitting diode D4, the positive electrode of the light-emitting diode D3, the positive electrode of the light-emitting diode D2, and the positive electrode of the light-emitting diode D1, the other end of the capacitor C1 is respectively connected to pin 1 of the connection terminal CN1, the negative electrode of the battery BT2, the negative electrode of the battery BT1, the negative electrode of the light-emitting diode D5, one end of the resistor R9, the source of the transistor Q2, one end of the resistor R6, and the source of the transistor Q1 and grounded, the positive electrode of the battery BT2 is connected to the positive electrode of the diode D7, and the negative electrode of the diode D7 is respectively connected to the positive electrode of the battery BT1, one end of the switch S2, and one end of the switch S1. The first terminal of the power supply 110 is connected to the first terminal of the power supply 110, and the second terminal of the power supply 110 is connected to the first terminal of the power supply 110. The first terminal of the power supply 110 is connected to the first terminal of the power supply 110. The second terminal of the power supply 110 is connected to the first terminal of the power supply 110. The first terminal of the power supply 110 is connected to the first terminal of the power supply 110. The second terminal of the power supply 110 is connected to the second terminal of the power supply 110. The third terminal of the power supply 110 is connected to the first terminal of the power supply 110. The first terminal of the power supply 110 is connected to the first terminal of the power supply 110. The second terminal of the power supply 110 is connected to the first terminal of the power supply 110. The third terminal of the power supply 110 is connected to the first terminal of the power supply 110.

3. The semiconductor refrigeration helmet according to claim 1, characterized in that: The space between the semiconductor refrigeration fins and the heat sink is filled with heat-conducting material.

4. The semiconductor refrigeration helmet according to claim 1, characterized in that: The surface of the heat sink is arranged in a fin structure.

5. The semiconductor refrigeration helmet according to claim 1, characterized in that: The partition layer is filled with phase change material.

6. The semiconductor refrigeration helmet according to claim 1, characterized in that: A heat pipe is provided between the heat sink and the semiconductor refrigeration chip. One end of the heat pipe is connected to the heating surface of the semiconductor refrigeration chip, and the other end of the heat pipe is connected to the heat sink.

7. The semiconductor refrigeration helmet according to claim 1, characterized in that: An active cooling fan is provided outside the heat sink.

8. The semiconductor refrigeration helmet according to claim 1, characterized in that: Multiple layers of heat insulation material are provided inside the shell.

9. The semiconductor refrigeration helmet according to any one of claims 1 to 8, characterized in that: The air inlet is provided with a waterproof and dustproof structure.

10. The semiconductor refrigeration helmet according to claim 9, characterized in that: The air outlet is provided with a waterproof and dustproof structure.

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