Laser processing device

Abstract

The invention provides a laser processing device. In order to suppress interference between a member for supporting a housing and a workpiece while bringing the housing and the workpiece close to each other, the laser processing apparatus includes: a laser scanning section that deflects laser light to be emitted toward an irradiation region according to a predetermined processing setting; and a housing that accommodates the laser scanning unit. In the housing, an exit window through which the laser light emitted toward the irradiation region via the laser scanning portion is transmitted, and a top surface disposed to face the exit window and attached to the attachment target position are formed.

Description

[0001] This application is a divisional application of the patent application filed on November 10, 2022, with application number 202211404947.X and invention name “Laser processing device”. Technical Field

[0002] The technology disclosed herein relates to a laser processing device. Background Art

[0003] JP 2019-104047 A discloses an example of a laser processing device.

[0004] Specifically, the laser processing equipment according to JP 2019-104047 A includes: a laser deflection unit (laser scanning unit) that deflects the laser; a shell that accommodates the laser deflection unit; and an exit window that is formed on the lower surface of the shell and transmits the laser deflected by the laser deflection unit.

[0005] Incidentally, in the laser processing apparatus as disclosed in JP 2019-104047 A, there is a case where the distance from the exit window to the workpiece (workpiece distance) is set as an index indicating the installation situation for obtaining a preferred processing result.

[0006] Further, in a case where an exit window is formed on the lower surface of the shell as in the laser processing equipment according to JP 2019-104047 A, it is conventionally known to adjust the height position of the exit window by supporting the lower surface of the shell from below by a predetermined member for supporting the shell (hereinafter referred to as a "support member") and adjusting the height of the support member so as to achieve the workpiece distance.

[0007] Alternatively, it is conceivable to position the workpiece closer to the lower surface of the housing in the height direction, corresponding to the workpiece distance set in the laser processing apparatus, in order to reduce the installation space of the laser processing apparatus. However, when the workpiece is positioned closer to the lower surface of the housing, there is the problem of interference between the support member and the workpiece. Summary of the Invention

[0008] The technology disclosed herein has been made in view of this point, and an object thereof is to suppress interference between a member for supporting the housing and the workpiece while bringing the housing and the workpiece close to each other.

[0009] According to one embodiment of the present disclosure, a laser processing device is provided that is attached to a target attachment location and irradiates an irradiation area with laser light to process a workpiece. The laser processing device includes a laser deflection unit that deflects the laser light toward the irradiation area according to predetermined processing settings, and a housing that houses the laser deflection unit.

[0010] Further, according to the one embodiment of the present disclosure, in the housing, an exit window that transmits the laser light emitted toward the irradiation area via the laser deflecting portion, and an attachment surface that is arranged to face the exit window and attached to an attachment target position are formed.

[0011] According to one embodiment, in the housing according to this embodiment, the attachment surface is formed on the opposite side of the exit window. Since the housing is configured so that it is not the outer surface on which the exit window is formed, but rather the attachment surface facing the opposite side that is attached to the target attachment location, the housing can be supported so as to be suspended from the target attachment location. This eliminates the need to insert a support member between the housing and the workpiece, thereby allowing the housing and the workpiece to be brought closer together.

[0012] At this time, the member for supporting the housing (support member) is located on the opposite side of the exit window similar to the attachment target position, thereby being sufficiently separated from the workpiece. This makes it possible to suppress interference between the support member and the workpiece while bringing the housing and the workpiece close to each other.

[0013] In addition, according to another embodiment of the present disclosure, the housing can accommodate: a solid-state laser crystal that generates laser light based on excitation light; and a support plate that extends in a direction from the attachment surface toward the exit window and supports the solid-state laser crystal, and the support plate can be attached to the housing without being integrated with the attachment surface.

[0014] According to the other embodiment, the influence of distortion, vibration, etc. generated on the attachment surface at the attachment target position on the solid-state laser crystal can be suppressed. Therefore, even when the housing is configured to be supported at the attachment target position, laser light can be generated favorably.

[0015] In addition, according to still another embodiment of the present disclosure, the attachment surface may be provided with an attachment portion capable of attaching the attachment surface to an attachment target location.

[0016] According to this further embodiment, since the support member provided at the attachment target position and the attachment surface of the housing are connected to each other via an attachment portion rather than directly connected, the housing can be attached to the support member, which can take various forms, without having to redesign the structure of the housing itself. This is advantageous in facilitating replacement of various processing devices with the laser processing device according to the present disclosure in a production line where various processing devices are assumed to be used.

[0017] In addition, according to another embodiment of the present disclosure, the shell may include: an exit surface on which an exit window is formed; and an open surface, which surrounds the laser deflection portion together with the attachment surface and the exit surface, and is at least partially open to communicate with the exit window, and the open surface may be provided with a cover member capable of opening and closing the open surface.

[0018] According to the further embodiment, the open surface (other than the exit surface facing the workpiece and the attachment surface attached to the attachment target position) is configured to be openable and closable, making it possible to access the exit window without causing interference with the workpiece, support members, etc. Therefore, the maintainability of the laser processing apparatus can be improved.

[0019] In addition, according to another embodiment of the present disclosure, the housing may include a connection surface facing the opposite side of the open surface and surrounding the laser deflecting portion together with the open surface, the attachment surface and the exit surface, and a cable for supplying power into the housing may be connected to the connection surface.

[0020] According to this further embodiment, the open surface of the cover member and the connection surface to which the cable is connected are located on opposite sides. This reduces interference between the cover member and the cable when opening, closing, attaching, or detaching the cover member. This improves the maintainability of the laser processing apparatus.

[0021] In addition, according to another embodiment of the present disclosure, the workpiece can be transported along a predetermined transport direction, the irradiation area can have a constant size in the transport direction, and the spot diameter of the laser on the workpiece can be set so that the focal depth of the laser corresponds to the longest part of the optical path length of the laser in the irradiation area and the shortest part of the optical path length of the laser in the irradiation area.

[0022] In addition, according to yet another embodiment of the present disclosure, a path corresponding to the irradiation area in the movement path of the workpiece may include portions having different distances from the exit window.

[0023] In addition, according to another embodiment of the present disclosure, the workpiece can be conveyed along a predetermined conveying direction, the size of the irradiation area in the conveying direction can be 120 mm or larger, the laser deflection unit can include a first mirror that deflects the laser to irradiate the irradiation area, the first mirror can be arranged to face the workpiece across the exit window, the relative position of the workpiece relative to the housing can be set so that the distance from the first mirror to the workpiece is 150 mm or less, and the spot diameter of the laser on the workpiece at the relative position can be 60 μm or larger.

[0024] Typically, the difference in optical path length between the center and end portions of the irradiation area increases as the size of the irradiation area increases. In this case, in order to adopt a configuration that allows for the difference in optical path length without separately providing a mechanism for adjusting the focus of the laser light, a laser having a predetermined focal depth or greater is required.

[0025] According to findings obtained as a result of intensive studies by the inventors of the present application, in the arrangement provided as in the further embodiment, a sufficient depth of focus can be ensured by setting the spot diameter of the laser light on the workpiece to 60 μm or more.

[0026] According to another embodiment of the present disclosure, a laser processing device is provided. The device is supported by a support member and emits laser light toward an irradiation area configured according to a print area setting to process a workpiece. The support member is connectable to a connection surface of a substantially rectangular parallelepiped printing device. The printing device includes a printing surface and a connection surface different from the printing surface. A printing portion that contacts the print area on the workpiece is exposed on the printing surface. The laser processing device includes a laser deflection unit that deflects the laser light toward the irradiation area according to a predetermined processing setting; and a housing that houses the laser deflection unit.

[0027] Further, according to the still another embodiment of the present disclosure, in the housing, an exit window that transmits the laser light emitted toward the irradiation area via the laser deflecting portion, and an attachment surface connected to the support member are formed.

[0028] According to another embodiment, the housing of the further embodiment includes an exit window corresponding to the printing portion of the substantially rectangular parallelepiped printing device and an attachment surface corresponding to the connection surface of the printing device. The support member is configured to connect to the attachment surface, allowing the housing to be supported by the support member from the side or from above. This allows the housing and workpiece to be brought closer together, compared to a configuration in which the housing is supported from below.

[0029] At this time, the support member is located on the side or above the housing to support the housing, thereby being sufficiently separated from the workpiece. This makes it possible to suppress interference between the support member and the workpiece while bringing the housing and the workpiece closer.

[0030] In addition, according to still another embodiment of the present disclosure, the workpiece may be a workpiece that is conveyed in a state of being placed around conveying rollers, and the conveying rollers may be arranged to overlap with the irradiation area.

[0031] In addition, according to another embodiment of the present disclosure, the workpiece can be transported along a predetermined transport direction, the size of the irradiation area in the transport direction can be 120 mm or larger, the output of the laser through the exit window can be set to 2 W or less, and the spot diameter of the laser on the irradiation area can be set to 60 μm or larger.

[0032] According to findings obtained as a result of intensive studies by the inventors of the present application, by adopting the configuration of the further embodiment, it is possible to achieve downsizing of the housing while ensuring a sufficient depth of focus.

[0033] As described above, according to the present disclosure, it is possible to suppress interference between the member for supporting the housing and the workpiece while bringing the housing and the workpiece close to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a diagram illustrating the overall configuration of a laser processing system;

[0035] Figure 2 is a block diagram illustrating a schematic configuration of a laser processing apparatus;

[0036] Figure 3A is a perspective view illustrating the appearance of a marking head;

[0037] Figure 3B is a perspective view illustrating the appearance of a marking head;

[0038] Figure 4 It is a side view of the marking machine head;

[0039] Figure 5 is a perspective view illustrating a state where the cover member is removed from the marking head;

[0040] Figure 6 This is the rear view of the marking head;

[0041] Figure 7 1 is a diagram illustrating a connection structure of cables in a marking head;

[0042] Figure 8 is a perspective view illustrating a housing structure of a marking head;

[0043] Figure 9 is a perspective view illustrating a housing structure of a marking head;

[0044] Figure 10 is a transverse cross-sectional view schematically illustrating the internal structure of the marking head;

[0045] Figure 11 is a longitudinal sectional view schematically illustrating the internal structure of the marking head;

[0046] Figure 12 is a side view schematically illustrating a main portion in a board receiving portion;

[0047] Figure 13 is a side view schematically illustrating a main portion of a crystal housing;

[0048] Figure 14 is a perspective view schematically illustrating a main portion of a mirror housing;

[0049] Figure 15 is a perspective diagram for describing laser deflection performed by a laser scanning unit;

[0050] Figure 16 is a perspective diagram for describing laser deflection performed by a laser scanning unit;

[0051] Figure 17A is a schematic diagram for describing the replacement of a printing device and a marking head;

[0052] Figure 17B is a perspective view for describing the attachment of a marking head to a support member;

[0053] Figure 18 This is a diagram used to describe the various sizes of the marking head and support members;

[0054] Figure 19 is a flowchart illustrating a basic control process of a laser processing device;

[0055] Figure 20 This is a block diagram for describing the circuit structure related to the power supply unit;

[0056] Figure 21 is a flowchart illustrating a specific example of a control process related to the power supply unit;

[0057] Figure 22 is a perspective view illustrating a modification of the attachment surface and the attachment portion; and

[0058] Figure 23 is a schematic diagram illustrating another modification of the attachment surface. DETAILED DESCRIPTION

[0059] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Note that the following description is given as an example.

[0060] That is, in this specification, a laser marker is described as an example of a laser processing apparatus, but the technology disclosed herein can be applied to general equipment that uses lasers regardless of the names of the laser processing apparatus and the laser marker.

[0061] In addition, in this specification, as a typical example of processing, printing will be described, but this technology can be used for various types of processing using laser light, such as image marking, without being limited to printing.

[0062] <Overall Structure>

[0063] Figure 1 is a diagram illustrating the overall configuration of a laser processing system S, and Figure 2 : is a diagram illustrating a schematic configuration of a laser processing device L in a laser processing system S. Figure 17A is a diagram for describing the replacement of the printing device 1001 and the marking head 1, Figure 17B is a perspective view for describing the attachment of the marking head 1 to the support member.

[0064] Figure 1 The illustrated laser processing system S includes a laser processing device L and external equipment 400 connected thereto. Among these equipments, Figure 1 and Figure 2 The illustrated laser processing apparatus L is configured to perform processing corresponding to a predetermined processing pattern Pp on a workpiece W by irradiating a predetermined irradiation region R1 with laser light.

[0065] Note that the irradiation area R1 mentioned herein is an area set on the surface of the workpiece W. The irradiation area R1 can take various forms depending on the relative positional relationship between the laser processing device L and the workpiece W, the specifications of the laser processing device L, the movement path of the workpiece W, etc. Figure 1 As shown, the irradiation area R1 is configured as a rectangular area in this embodiment.

[0066] In particular, the laser processing device L according to this embodiment can emit laser light having a wavelength of approximately 350 nm as the laser light used to process the workpiece W. This wavelength falls within the ultraviolet wavelength range. Therefore, in the following description, the laser light used to process the workpiece W will sometimes be referred to as "UV laser light" to distinguish it from other laser light sources, such as near-infrared light. Note that laser light other than ultraviolet light, such as infrared light, can also be used to process the workpiece W.

[0067] Hereinafter, a case will be described in which a workpiece W made of a sheet-like film is set as an object to be processed, and the film has a UV reactive layer that chemically reacts with UV laser light.

[0068] However, in the laser processing apparatus L according to the present disclosure, the workpiece W that can be used as the object to be processed is not limited to a film containing a UV-reactive layer. A film that chemically reacts with laser light having a wavelength other than ultraviolet light may be used, or a workpiece W made of various materials such as paper and synthetic resin may be used as the object to be processed.

[0069] In addition, the laser processing device L according to the present embodiment is configured to perform so-called two-dimensional printing by performing two-dimensional scanning using laser light, but since the laser processing device L is configured to have a deep depth of focus as will be described later, so-called three-dimensional printing can also be performed. Therefore, the laser processing device L can even process the workpiece W conveyed along a three-dimensional moving path, as will be described later. Figure 18 shown.

[0070] like Figure 1 and Figure 2 By way of example, the laser processing device L according to this embodiment includes a marking head 1 , a marking machine controller 100 , a cable 200 , and an operation terminal 300 .

[0071] The marking machine controller 100 can receive settings related to a processing pattern and supply power to the outside, and is configured as a controller for controlling the marking head 1 .

[0072] On the other hand, the marking head 1 can irradiate the irradiation region R1 with laser light by being controlled by the marking machine controller 100 .

[0073] In this embodiment, the marking head 1 and the marking machine controller 100 are separated from each other and connected by a cable 200. The cable 200 includes at least electrical wiring that transmits power from the inside of the marking machine controller 100 (specifically, the power supply unit 104, which will be described later) to the outside. Specifically, the cable 200 according to this embodiment is constructed by bundling electrical wiring for transmitting power and signal wiring for sending and receiving analog signals, digital signals, etc.

[0074] The marking head 1 according to this embodiment is mounted on a processing device 500 for processing a workpiece W made of a sheet film. Figure 17A and Figure 17B As shown, the processing apparatus 500 includes a support member 501 that supports the marking head 1 and a conveying roller 502 around which the workpiece W is placed.

[0075] In addition, the processing apparatus 500 further includes: two rail members 503l and 503r, which slidably support the marking head 1 via the support member 501; two fixing members 505 and 506, to which the ends of the two rail members 503l and 503r are attached, respectively; and a first driven roller 504l and a second driven roller 504r, which are driven when the workpiece W is conveyed by the drive of the conveying roller 502, as shown in FIG. Figure 17B 、 Figure 18 At this time, the workpiece W is preferably placed around the conveyor roller 502 so that the contact length between the conveyor roller 502 and the workpiece W is longer than the contact length between the first driven roller 504l and the workpiece W and longer than the contact length between the second driven roller 504r and the workpiece W. Then, when the conveyor roller 502 conveys the workpiece W, the workpiece W is less likely to slip on the conveyor roller 502. Note that the "contact length" used herein refers to the length observed in a cross section orthogonal to the rotational axes of the conveyor roller 502, the first driven roller 504l, and the second driven roller 504r.

[0076] In this way, the workpiece W according to the present embodiment may be a workpiece that is conveyed while being placed around the conveying roller 502, and the conveying roller 502 used at this time may be arranged to overlap with the irradiation area R1 in the vertical direction (Z direction to be described later), for example. Figure 1 、 Figure 17A The following figure and Figure 18 Example.

[0077] The supporting member 501 can attach the laser processing device L, in particular the housing 10 of the marking head 1, to a predetermined attachment target position, such as Figure 17A Example. Although Figure 1 、 Figure 17A and Figure 17B The support member 501 configured to suspend the housing 10 from above is illustrated, but the housing 10 may be supported from another direction such as a side, as will be described later.

[0078] On the other hand, the conveying roller 502 is formed in a cylindrical shape having a central axis extending laterally of the workpiece W. In this case, the workpiece W is conveyed in a longitudinal direction (such as the left-right direction described later) along a predetermined movement path by the rotation of the conveying roller 502 .

[0079] Here, the processing apparatus 500 according to the present embodiment is shared between the marking head 1 according to the present embodiment and a printing device 1001 that performs printing using a scheme other than marking using a laser, such as Figure 17A The above and below figures show examples.

[0080] That is, the marking head 1 according to the present embodiment (instead of the printing device 1001 ) may be attached to the supporting member 501 of the processing equipment 500 configured to attach the printing device 1001 .

[0081] Examples of the printing device 1001 that can be replaced with the marking head 1 include a thermal transfer overprinter (TTO), but other printing devices 1001 can also be replaced.

[0082] As a printing device 1001 that can be replaced with the marking head 1, for example, any printing device can be used that is provided with a shell 1010 formed in a roughly rectangular shape and includes a printing surface 1010d obtained by exposing a printing portion 1006 that contacts a printing area on the workpiece W and a connecting surface 1010u that is different from the printing surface 1010d and can be connected to the support member 501.

[0083] In this case, the marking head 1 is supported by a support member 501 which can be connected to the connection surface 1010u, as shown in FIG. Figure 17A The marking head 1 supported thereby irradiates an irradiation area R1 set to correspond to the printing area (the area in contact with the printing portion 1006 in the printing device 1001) with laser light, thereby processing the workpiece W.

[0084] On the other hand, the operation terminal 300 includes, for example, a central processing unit (CPU) and a memory, and is connected to the marking machine controller 100 so as to be able to transmit and receive electric signals in a wired or wireless manner.

[0085] The operation terminal 300 serves as a terminal configured to set various processing conditions (also referred to as printing conditions) such as print settings and to display information related to the processing of the workpiece W to the user. The operation terminal 300 includes a display section 301 configured to display information to the user, an operation section 302 that receives operation input from the user, and a storage device 303 configured to store various types of information.

[0086] For example, the display unit 301 may be configured using a liquid crystal display or an organic EL panel. The operation unit 302 may be configured using a keyboard and a pointing device. Here, the pointing device includes a mouse, a joystick, etc. The operation unit 302 may be configured using, for example, a touch panel console directly connected to the marking machine controller 100, rather than a pointing device.

[0087] The operation terminal 300 configured as described above can set processing conditions for laser processing based on user input. The processing conditions include one or more of the content of the character string and graphics to be printed on the workpiece W (processing pattern Pp), the target output of the laser (laser power), and the scanning speed of the laser on the workpiece W (scanning speed).

[0088] The processing conditions set by the operation terminal 300 are output to the marking machine controller 100 and stored in the storage unit 102 of the marking machine controller 100. The storage device 303 in the operation terminal 300 can store the processing conditions as needed.

[0089] Note that, for example, the operation terminal 300 may be integrated into the marking machine controller 100 .

[0090] The external device 400 is connected to the marking machine controller 100 as needed. Figure 1 and Figure 2 In the illustrated example, a conveyance speed sensor 401 and a programmable logic controller (PLC) 402 are provided as the external devices 400 .

[0091] The conveying speed sensor 401 is configured using, for example, a rotary encoder and can detect the conveying speed of the workpiece W. The conveying speed sensor 401 outputs a signal (detection signal) indicating the detection result to the marking machine controller 100. The marking machine controller 100 controls two-dimensional scanning of the laser beam, etc. based on the detection signal input from the conveying speed sensor 401.

[0092] The PLC 402 is configured using a microprocessor, for example, and can input a control signal to the marking machine controller 100. The PLC 402 is used to control the laser processing system S according to a predetermined sequence.

[0093] In addition to the above-mentioned devices and apparatuses, devices configured to perform operations and controls, computers configured to perform various other processes, storage devices, peripheral devices, etc. may also be connected to the laser processing apparatus L in a wired or wireless manner.

[0094] Hereinafter, the hardware configuration of each of the marking head 1 and the marking machine controller 100 will be described in detail, and then, an overview of control of the marking head 1 by the marking machine controller 100 will be described.

[0095] <Marking Machine Controller 100>

[0096] like Figure 2 By way of example, the marking machine controller 100 includes: a receiving unit 101 that receives settings related to processing conditions including a processing pattern (processing settings); a storage unit 102 that stores the processing conditions; a control unit 103 that controls the marking head 1 based on the processing conditions; and a power supply unit 104 that serves as a power source for supplying power to the marking head 1.

[0097] (Receiving Unit 101)

[0098] The receiving unit 101 is configured to receive processing conditions input through the operation terminal 300 and output the received processing conditions to the storage unit 102 and / or the control unit 103 .

[0099] Specifically, the receiving unit 101 according to this embodiment is electrically connected to the operation terminal 300 and can display a setting screen (not shown) for setting various processing conditions on the display unit 301 in the operation terminal 300. The receiving unit 101 can reflect the content input through the setting screen in the various processing conditions and output the reflected processing conditions to the storage unit 102 and / or the control unit 103.

[0100] (Storage Unit 102)

[0101] The storage section 102 is configured to temporarily or continuously store the processing conditions received by the receiving section 101 and, if necessary, output the stored processing conditions to the control section 103 , the display section 301 , and the like.

[0102] Specifically, the storage section 102 according to the present embodiment is configured using, for example, a nonvolatile memory such as a hard disk drive (HDD) or a solid state drive (SSD), and can temporarily or continuously store data indicating processing conditions.

[0103] (Control Unit 103)

[0104] The control unit 103 is configured to perform processing corresponding to the processing conditions on the workpiece W by controlling the power supply unit 104 , the laser output unit 4 , the laser scanning unit 5 , and the like based on the processing conditions.

[0105] Specifically, the control unit 103 according to this embodiment includes a processor, a volatile memory, an input / output bus, etc. The control unit 103 generates a control signal based on the processing conditions read from the storage unit 102 or directly input from the receiving unit 101, and outputs the generated control signal to various components of the laser processing apparatus L to control the processing of the workpiece W.

[0106] For example, when machining of the workpiece W starts, the control unit 103 reads a target output as a machining condition from the storage unit 102 and inputs a control signal generated in relation to the target output to the power supply unit 104, etc., thereby controlling the generation of laser excitation light.

[0107] (Power supply unit 104)

[0108] The power supply section 104 supplies a driving current to the excitation light generating section 2 based on a control signal output from the control section 103. Although not described in detail, the power supply section 104 determines a driving current based on a target output input from the control section 103 and supplies the determined driving current to the excitation light generating section 2. The power supply section 104 supplies power to the excitation light generating section 2 and may be configured using a DC power supply 104a or the like, as will be described later. Figure 20 The details of the power supply unit 104 will be described later.

[0109] Note that the excitation light generating section 2 configured using an excitation light source such as a laser diode is configured to be built into the marking head 1 rather than the marking machine controller 100 in this embodiment. Power supplied from the power supply section 104 is supplied to the excitation light generating section 2 through the cable 200.

[0110] <Marking head 1>

[0111] Figure 3A and Figure 3B It is a perspective view illustrating the appearance of the marking head 1 . Figure 4 This is a side view of the marking head 1. Figure 5 is a perspective view illustrating a state where the cover member 13 is removed from the marking head 1. Figure 6 It is a rear view of the marking head 1.

[0112] in addition, Figure 7 2 is a diagram illustrating a connection structure of the cable 200 in the marking head 1. Figure 8 and Figure 9 It is a perspective view illustrating the housing structure of the marking head 1. Figure 10 is a transverse cross-sectional view schematically illustrating the internal structure of the marking head 1. Figure 11 1 is a longitudinal sectional view schematically illustrating the internal structure of the marking head 1 . Figure 10 The cross section and along Figure 11The cross-section taken along line AA is roughly the same.

[0113] in addition, Figure 11 is a longitudinal sectional view schematically illustrating the internal structure of the marking head 1. Figure 12 is a side view schematically illustrating a main portion of the board accommodation portion H13, Figure 13 is a side view schematically illustrating a main portion in the crystal housing H12 .

[0114] in addition, Figure 14 is a perspective view schematically illustrating the main parts of the mirror housing portion H11. Figure 15 and Figure 16 This is a perspective view for describing laser deflection by the laser scanning unit.

[0115] (Schematic Structure of Marking Head 1)

[0116] like Figure 2 By way of example, the marking head 1 includes, as main components, an excitation light generating unit 2 , an excitation light guiding unit 3 as a light guiding optical system, a laser output unit 4 , and a laser scanning unit 5 as a laser deflecting unit.

[0117] As will be described in detail later, the excitation light generating section 2 generates excitation light for exciting laser light based on power supplied via the cable 200. The excitation light guiding section 3 guides the excitation light generated by the excitation light generating section 2 and inputs the excitation light to the laser output section 4. The laser output section 4 includes a solid-state laser crystal 41 that generates laser light based on the excitation light guided by the excitation light guiding section 3.

[0118] Furthermore, the laser scanning section 5 includes a first scanner 51 that drives a first mirror 51 a so that the laser light generated by the solid-state laser crystal 41 is emitted toward a desired position in the irradiation region R1 , and a first control board 53 that controls the first scanner 51 .

[0119] More specifically, the laser scanning section 5 according to the present embodiment is configured using a so-called dual-axis (X-axis and Y-axis) electric scanner, and includes, in addition to a first scanner 51 serving as a Y scanner, a second scanner 52 serving as an X scanner and a second control board 54 for controlling the second scanner 52.

[0120] The laser scanning section 5 controls the first scanner 51 via the first control board 53 and controls the second scanner 52 via the second control board 54 , thereby driving the first mirror 51 a of the first scanner 51 and the second mirror 52 a of the second scanner 52 .

[0121] At this time, the laser scanning unit 5 as a laser deflecting unit drives the first mirror 51a and the second mirror 52a according to predetermined processing settings (settings related to the processing pattern Pp) to deflect the laser generated by the laser output unit 4 so as to be emitted toward the desired position within the irradiation area R1.

[0122] The marking head 1 further includes a housing 10 that houses the aforementioned components, namely, the excitation light generating section 2, the excitation light guiding section 3, the laser output section 4, and the laser scanning section 5. An exit window 6 is formed in the housing 10 for transmitting the laser light deflected by the first mirror 51a of the laser scanning section 5 (i.e., the laser light emitted toward the irradiation region R1 via the laser scanning section 5).

[0123] Hereinafter, the configuration regarding the appearance of the marking head 1 (specifically, the configuration of six surfaces of the housing 10 ) and the internal structure of the marking head 1 will be described in sequence.

[0124] (Outer surface of housing 10)

[0125] like Figure 3A For example, the housing 10 of the marking head 1 is constructed in a substantially rectangular shape. Figure 3A The substantially rectangular shape is larger in the front-to-rear direction ( Figure 3A Note that the "left and right" in this specification correspond to the left and right when viewed from a user facing the housing 10.

[0126] Hereinafter, the front-back direction of the housing 10 is referred to as the X direction, the left-right direction is referred to as the Y direction, and the height direction is referred to as the Z direction. Figure 3A The depth side of the plane of the figure in the X direction is regarded as the +X direction, and the Figure 3A The front side of the plane of the figure is regarded as the -X direction. Similarly, Figure 3A The front side of the plane of the figure in the Y direction is regarded as the +Y direction, and Figure 3A The depth side of the plane of the figure is considered to be the -Y direction. Similarly, Figure 3A The upper side of the plane of the figure in the Z direction is regarded as the -Z direction, and Figure 3A The lower side of the plane of the drawing is regarded as the +Z direction.

[0127] Definitions based on the outer shape of the housing 10 have been exemplified herein for convenience, but definitions based on the operating directions and positional relationships of the various constituent elements accommodated in the housing 10 may be used instead of or in addition to these definitions.

[0128] For example, the first direction, which is the deflection direction of the first mirror 51a, can be defined as the Y direction, and the second direction, which is the deflection direction of the second mirror 52a, can be defined as the X direction. Note that in this embodiment, the deflection direction of the mirror included in and driven by the laser scanning unit 5 indicates the direction in which the irradiation position in irradiation area R1 is scanned by driving the mirror. That is, when the first mirror 51a is driven to rotate, the irradiation position in irradiation area R1 is scanned in the Y direction. Furthermore, when the second mirror 52a is driven to rotate, the irradiation position in irradiation area R1 is scanned in the X direction. Similarly, the direction from the marking head 1 toward irradiation area R1 (more specifically, the irradiation direction from the exit window 6 toward irradiation area R1) can be considered the Z direction. The irradiation direction can be the direction from the first mirror 51a toward irradiation area R1. Note that in this embodiment, the "direction from the specific component toward irradiation area R1" refers to one direction in the axial direction in which the specific component and irradiation area R1 face each other. The "direction from the specific component toward irradiation area R1" does not indicate the direction in which light travels from the specific component toward irradiation area R1. Therefore, the irradiation position in the irradiation area R1 (ie, the traveling direction of light toward the irradiation area R1) changes by the rotation of the first mirror 51a and the rotation of the second mirror 52a, but the irradiation direction in this embodiment does not change with the change in the traveling direction of light.

[0129] In the following description, a description will be given assuming that the definition based on the outer shape of the housing 10 coincides with the definitions based on the deflection direction and the irradiation direction of the first mirror 51 a and the second mirror 52 a .

[0130] like Figures 3A to 7 For example, the housing 10 has a bottom surface 10 d on which the exit window 6 is formed, and a top surface 10 u facing the bottom surface 10 d and the exit window 6. For example, the bottom surface 10 d faces the +Z direction, and the top surface 10 u faces the -Z direction, and both are composed of one or more plate-like members having a thickness in the Z direction. Note that the term "facing" used herein indicates a conceptual orientation when the housing 10 is considered to be a conceptual rectangular parallelepiped.

[0131] The housing 10 further includes a front surface 10f, a rear surface 10b, a left side surface 10l and a right side surface 10r which surround the excitation light generating section 2, the excitation light guiding section 3, the laser output section 4 and the laser scanning section 5 together with the bottom surface 10d and the top surface 10u.

[0132] The front surface 10f, rear surface 10b, left side surface 10l, and right side surface 10r all face a direction orthogonal to the top surface 10u and bottom surface 10d (i.e., a direction along the XY plane). For example, the front surface 10f faces the -X direction, the rear surface 10b faces the +X direction, and both are composed of one or more plate-like members having a thickness in the X direction. Similarly, for example, the left side surface 10l faces the +Y direction, the right side surface 10r faces the -Y direction, and both are composed of one or more plate-like members having a thickness in the Y direction.

[0133] The following describes the six surfaces of the housing 10 in order. Note that the term "surface" in the bottom surface 10d, top surface 10u, front surface 10f, rear surface 10b, left side surface 10l, and right side surface 10r also includes plate-like members having a predetermined thickness. Furthermore, these six surfaces are categorized for convenience only and do not need to be separated from one another. For example, at least one of the left side surface 10l and the right side surface 10r and at least a portion of the bottom surface 10d (particularly the non-offset portion 18 described later) may be integral.

[0134] -Top surface 10u-

[0135] like Figure 3A For example, the top surface 10u of the six surfaces constituting the housing 10 is formed into a rectangular plate shape, extending in both the X and Y directions, with the X-direction dimension being longer than the Y-direction dimension. The top surface 10u according to this embodiment is configured as an attachment surface connected to a support member and attached to the aforementioned attachment target location. In this case, the plate thickness of the top surface 10u is greater than the plate thickness of the left side surface 10l and the right side surface 10r.

[0136] Furthermore, the top surface 10u as the attachment surface is provided with an attachment portion 7 that can be attached to the attachment target position. The attachment portion 7 is configured as a plate-like member that extends in directions (X direction and Y direction) substantially parallel to the top surface 10u and has a thickness in a direction (Z direction) orthogonal to the top surface 10u. The attachment portion 7 is placed on the top surface 10u and is fastened to the top surface 10u by, for example, a fastener 7b (such as a bolt), as shown in FIG. Figure 10 As described above, the plate thickness of the top surface 10u is greater than the plate thickness of the left side surface 101, the right side surface 10r, etc. The greater plate thickness of the top surface 10u is advantageous in ensuring an insertion margin for the fastener 7b.

[0137] The upper surface of the attachment portion 7 is provided with fastening holes 7a corresponding to the support member 501 arranged at the attachment target position. With the support member 501 placed on the attachment portion 7, the support member 501 can be attached to the attachment portion 7 by fastening fasteners such as bolts to the fastening holes 7a. Thus, the top surface 10u is attached to the attachment target position via the attachment portion 7, while the housing 10 is suspended from the support member 501.

[0138] -Bottom 10d-

[0139] like Figure 4 As shown in FIG. 1 , the bottom surface 10 d among the six surfaces is arranged on the opposite side of the top surface 10 u with the laser scanning section 5 interposed therebetween. Figure 5 As shown, the bottom surface 10 d is formed in a curved shape that extends along the X direction and has a central portion in the Y direction that is recessed toward the −Z side.

[0140] Specifically, if Figure 5 and Figure 10 For example, bottom surface 10d according to this embodiment includes offset portion 16a located in the center in the Y direction and offset toward the -Z side, and non-offset portions 18 located at both ends in the Y direction and protruding further toward the +Z side than offset portion 16a. Both offset portion 16a and non-offset portion 18 are formed to extend flatly along the X direction.

[0141] Specifically, the bottom surface 10d according to the present embodiment is formed with a groove having a trapezoidal cross section, which has an offset portion 16a as an upper side and increases in diameter toward the +Z side. The exit window 6 is provided in the offset portion 16a as the upper side. The bottom surface 10d according to the present embodiment is configured as an exit surface, on which the exit window 6 is formed. The details of the exit window 6 will be described later.

[0142] On the other hand, the non-offset portion 18 is formed from the portion corresponding to the hypotenuse of the trapezoidal shape to the +Z side end of the bottom surface 10d. According to this embodiment, the non-offset portion 18 includes a first plate-shaped member 18l located on the +Y side of the offset portion 16a, and a second plate-shaped member 18r located on the -Y side of the offset portion 16a.

[0143] The first plate-shaped member 181 is formed as follows Figure 10 The illustrated thin plate shape has an inverted L-shape when viewed from the -X side. Here, "inverted L-shape" refers to a shape obtained by inverting the L-shape relative to an axis of symmetry extending in the Z direction. First plate-shaped member 18l is arranged on the opposite side of second plate-shaped member 18r, with offset portion 16a interposed therebetween. The vertical sides of the inverted L-shape in first plate-shaped member 18l form the hypotenuse on the +Y side of the trapezoidal shape, and the horizontal sides of the inverted L-shape form the +Z side end on the +Y side.

[0144] The second plate-shaped member 18r is formed as follows Figure 10 The illustrated thin plate shape has an L-shape when viewed from the -X side. The second plate-shaped member 18r is arranged on the opposite side of the first plate-shaped member 18l, with the offset portion 16a interposed therebetween. The vertical sides of the L-shaped portion of the second plate-shaped member 18r form the oblique sides of the trapezoid on the -Y side, and the horizontal sides of the L-shaped portion form the +Z side end on the -Y side.

[0145] In addition, the first plate-shaped member 181 and the lower half of the left side surface 101 together cover the exit window 6 from the +Y side, as shown in FIG. Figure 10 On the other hand, the second plate-shaped member 18r, together with the lower half of the right side surface 10r, covers the exit window 6 from the -Y side. Thus, the first plate-shaped member 18l and the second plate-shaped member 18r, together with the lower half of the left side surface 10l and the lower half of the right side surface 10r, form a skirt-shaped cover (skirt portion).

[0146] -Front surface 10f-

[0147] like Figure 3B and Figure 5 As illustrated, the front surface 10 f among the six surfaces is formed in a plate shape, which extends in the Y direction and the Z direction, and is provided with the indicator 11 , two vent holes 12 and 12 , and the notch 10 c .

[0148] like Figure 3B and Figure 5 As shown, the indicator 11 is provided on the upper side and near the right end of the front surface 10f and includes three lamps 11a, 11b and 11c arranged side by side along the Y direction (only in the Figure 5 Each of the three lamps 11a, 11b, and 11c includes a light emitting diode (LED) electrically connected to the marking machine controller 100. Hereinafter, the three lamps 11a, 11b, and 11c are referred to as the first lamp 11a, the second lamp 11b, and the third lamp 11c in order from the +Y side.

[0149] The first lamp 11a is configured using, for example, a blue LED and is illuminated blue in conjunction with a key switch (not shown) provided in the laser processing apparatus L. Note that the "key switch" referred to herein is a switch that is switched by a key managed by a safety officer or the like. By inserting a key into the laser processing apparatus L and turning the key in a predetermined direction, the apparatus switches between an "off" state (corresponding to a power-off state), an "on" state (corresponding to a power-on state and prohibiting laser emission), and a "laser-on" state (corresponding to a power-on state and permitting laser emission).

[0150] On the other hand, the second lamp 11b is configured to be able to switch the luminous color to one of green and orange, and to switch the luminous color according to various states other than the state of the key switch. In addition, the third lamp 11c is configured to be able to switch the luminous color to any one of green, orange and red, and to switch the luminous color according to various states other than the state of the key switch.

[0151] Each of the first lamp 11a, the second lamp 11b, and the third lamp 11c is electrically connected to the marking machine controller 100, and is configured to light up in response to a control signal input from the control section 103. Details of the control of the indicator 11 will be described later.

[0152] like Figure 3B and Figure 5 In this example, one of the two vent holes 12 and 12 is provided on the lower side of the front surface 10f and near the left end, and the other of the two vent holes 12 and 12 is provided on the lower side of the front surface 10f and near the right end. Both vent holes 12 and 12 penetrate the front surface 10f in the thickness direction and are each connected to the second accommodation portion H2 to be described later.

[0153] like Figure 3B and Figure 5 The notch 10c is formed by cutting away a portion including the lower end of the front surface 10f and connected to the front end (end on the X direction side) of the offset portion 16a. The notch 10c is arranged between the two vent holes 12 and 12 in the Y direction.

[0154] Specifically, the notch 10c is formed into a substantially trapezoidal shape, the diameter of which increases in a tapered shape toward the +Z direction, so as to have a cross section substantially consistent with the cross section of the trapezoid having the offset portion 16a as the upper side. The front surface 10f according to the present embodiment is configured as a user-accessible surface (open surface) by providing the notch 10c in the lower half, which is at least partially open so as to lead to the exit window 6 via the offset portion 16a.

[0155] -Detail 1 of the front surface 10f (dust collector and camera)-

[0156] In addition to the maintenance action of the exit window 6 (for example, the cleaning action performed by inserting a cleaning tool from the notch 10 c ), the notch 10 c according to the present embodiment can be used for various purposes.

[0157] Typically, when a workpiece W, such as a film, is irradiated with UV laser light, smoke is generated. Therefore, a dust collector separate from the marking head 1 can be connected to the front surface 10f to extract the smoke through the notch 10c. Note that the dust collector can be built into the marking head 1 rather than attached to the marking head 1, such as by attaching it to the front surface 10f.

[0158] In addition, after the workpiece W, such as a film, is irradiated with UV laser light to perform printing, a camera can be built into or externally attached to the marking head 1 to inspect the printed content. Such a camera can be attached, for example, to the notch 10c or to the offset portion 16a. In the former case, a reflector can be provided around the exit window 6 so that as much of the image of the irradiated area R1 as possible can be captured from directly above (the -Z side). In addition, lighting can be provided around the camera or the exit window 6 to obtain the brightest possible image.

[0159] -Detail 2 of the front surface 10f (cover member 13 and opening and closing sensor)

[0160] Furthermore, a cover member 13 capable of opening and closing the front surface 10f is attached to the front surface 10f serving as the opening surface. The cover member 13 includes: a first cover portion 13a fixed to the upper half of the front surface 10f; a second cover portion 13b swingable so as to open and close the lower half of the front surface 10f (particularly, the opening portion formed by the notch 10c); and a hinge mechanism 13c coupling the first cover portion 13a and the second cover portion 13b (see FIG. Figure 3A and Figure 3B ).

[0161] The first cover portion 13a is formed in a rectangular plate shape covering the upper half of the front surface 10f and has a through hole (reference numeral omitted) formed at substantially the same position as the indicator 11. The first cover portion 13a is fixed to the upper half of the front surface 10f using fasteners such as screws.

[0162] The second cover portion 13b is formed in a rectangular plate shape capable of covering the lower half of the front surface 10f (particularly the notch 10c), and has a through hole (reference numerals thereof omitted) formed at substantially the same position as the two vent holes 12 and 12. The second cover portion 13b is supported to the first cover portion 13a via a hinge mechanism 13c.

[0163] The hinge mechanism 13 c is located at a central portion of the front surface 10 f in the Z direction, and swingably couples an upper edge portion of the second cover portion 13 b to a lower edge portion of the first cover portion 13 a .

[0164] In a state where the first cover portion 13a is fixed to the front surface 10f, the hinge mechanism 13c can swing the second cover portion 13b around a rotation axis extending in the Y direction (see Figure 3A and Figure 3BWhen the second cover portion 13b is swung in the opening direction, the notch 10c of the front surface 10f can be exposed. Since the notch 10c is exposed, various types of maintenance, such as cleaning of the exit window 6, can be performed through the offset portion 16a connected to the notch 10c.

[0165] Note that the cover member 13 is not essential and the front surface 10f may be exposed without providing the cover member 13.

[0166] In addition, although not illustrated, an opening and closing sensor that senses the opening and closing of the cover member 13 can be provided on at least one of the cover member 13 (particularly the second cover portion 13b) and the front surface 10f (particularly the peripheral portion of the notch 10c on the front surface 10f).

[0167] As such an opening and closing sensor, for example, a magnetic sensor including a magnet provided on one of the second cover portion 13b and the front surface 10f and a magnetic sensor (e.g., a Hall element) provided on the other of the second cover portion 13b and the front surface 10f can be used. Note that the magnetic sensor is merely an example, and an optical sensor, a mechanical sensor, etc. can also be used.

[0168] Such a magnetic sensor is electrically connected to the marking machine controller 100 and / or the circuit board in the marking head 1 and can output a sensing signal indicating the open or closed state of the cover member 13, in particular the second cover part 13b, to the marking machine controller 100 and / or the circuit board.

[0169] The provision of this opening / closing sensor allows detection of the open / closed state of the cover member 13, enabling various types of control based on this state. For example, the marking machine controller 100 according to this embodiment performs an emergency stop of laser emission when the cover member 13 is opened during laser emission. Subsequently, the cover member 13 is closed, and the emergency stop release operation is executed via the operating unit 302, allowing laser emission to resume.

[0170] Note that, in the case where the cover member 13 is regarded as one outer surface of the housing 10, the cover member 13 is visually recognized by the user when attaching the marking head 1 or the like. In this case, for example, Figure 3A For example, a first mark M1 as a mark may be added to the second cover portion 13 b of the cover member 13 .

[0171] The first mark M1 includes: a first center line M11 indicating the center of the irradiation area R1 (the intersection point where the diagonal lines of the irradiation area R1 intersect); a +Y edge M12 indicating the edge on the +Y side of the irradiation area R1; and a -Y edge M13 indicating the edge on the -Y side of the irradiation area R1.

[0172] Note that the cover member 13 is not essential. When the front surface 10 f is regarded as the outer surface of the housing 10 without providing the cover member 13 , the first mark M1 may be added to the front surface 10 f.

[0173] -Rear surface 10b-

[0174] like Figure 3B and Figure 5 As shown, the rear surface 10b of the six surfaces is arranged on the opposite side of the front surface 10f, with the laser scanning unit 5 interposed therebetween, and is formed into a plate shape extending in the Y and Z directions. The rear surface 10b according to this embodiment can be regarded as one outer surface of the housing 10 (different from the outer surface of the cover member 13), and forms a connection surface to which the cable 200 supplying power to the housing 10 is connected. The rear surface 10b, which serves as the connection surface, surrounds the laser scanning unit 5, which serves as the laser deflection unit, together with the front surface 10f, which serves as an open surface, the top surface 10u, which serves as an attachment surface, and the bottom surface 10d, which serves as an exit surface.

[0175] Further, the rear surface 10b as the connection surface is provided with a connection cover 14 covering the connection portion between the rear surface 10b and the cable 200, as shown in FIG. Figure 7 The connection cover 14 adjusts the extension direction Ae of the cable 200 so that the cable 200 is led out in the in-plane directions (Y and Z directions) of the rear surface 10b, more specifically, in the direction (Y direction) intersecting the irradiation direction (Z direction) among the in-plane directions (Y and Z directions).

[0176] In other words, the connection cover 14 is configured to lead out the cable 200 in a direction (Y direction or Z direction) orthogonal to the X direction, which is a direction connecting the front surface 10 f and the rear surface 10 b .

[0177] Specifically, the connection cover 14 according to this embodiment includes: an enclosing portion 14a, which encloses the connection terminal of the marking head 1 relative to the cable 200; a cover 14b, which closes the enclosing portion 14a; a sealing member 14c, which liquid-tightly seals the space between the enclosing portion 14a and the cover 14b; and a wire diameter conversion connector 14d, which adjusts the wire diameter of the cable 200.

[0178] The surrounding portion 14a is formed to surround the connector and is open from the side to the rear surface 10b (Y direction and Z direction). Specifically, the surrounding portion 14a according to the present embodiment is formed in a thin rectangular box shape open in the +X direction.

[0179] Furthermore, when surrounding portion 14a is considered a thin box, two openings (reference numerals omitted) are formed on bottom surface 14e, communicating with different connection terminals. Furthermore, among the multiple side walls constituting surrounding portion 14a, left side wall portion 14f facing the +Y side is provided with a first through-hole 14g that penetrates left side wall portion 14f along the Y direction, which serves as an extension direction Ae. When cable 200 is inserted through first through-hole 14g, its extension direction Ae is adjusted.

[0180] The wire diameter conversion connector 14d is arranged inside the enclosure 14a and housed in the housing space defined by the enclosure 14a and the cover 14b. The cable 200 according to this embodiment includes a first cable portion 201 extending from the marking machine controller 100 and connected to the wire diameter conversion connector 14d; and a second cable portion 202 extending from the wire diameter conversion connector 14d and connected to the connection terminals of the marking head 1. The wire diameter of the second cable portion 202 is set to be smaller than that of the first cable portion 201 so that it can fit into the connection terminals of the marking head 1.

[0181] That is, in this embodiment, the cable 200 is connected to the marking head 1 in a state where the wire diameter has been converted by the wire diameter conversion connector 14 d .

[0182] Generally, the cable length of the cable 200 needs to be changed depending on the installation environment of the marking head 1. Here, when attempting to use a longer cable 200 than usual, there is a problem regarding voltage drop compared to a relatively short cable. Therefore, it is conceivable to use a cable 200 with a larger wire diameter as a countermeasure.

[0183] In this way, the wire diameter of the cable 200 can be changed according to the installation environment of the marking head 1. Therefore, it is conceivable to use the wire diameter conversion connector 14d as described above, but there is the following problem: by simply using the wire diameter conversion connector 14d, the connection part between the first cable part 201 and the wire diameter conversion connector 14d and the connection part between the second cable part 202 and the wire diameter conversion connector 14d may be wetted by water.

[0184] In this regard, Figure 7 For example, the wire diameter conversion connector 14d is housed in the connection cover 14, so that the above-mentioned connection parts can be prevented from getting wet by water. Therefore, the marking head 1 can be adapted to a wider range of installation environments.

[0185] -Left side 10l-

[0186] like Figure 3A 、 Figure 3B and Figure 10As illustrated, the left side surface 101 among the six surfaces is arranged on the +Y side with respect to the laser scanning unit 5 , and is formed in a plate shape extending in the Z direction and the X direction.

[0187] Note that, in the case where the left side surface 101 is regarded as one outer surface of the housing 10, the left side surface 101 is visually recognized by the user when attaching the marking head 1 or the like. Figure 3A For example, a second mark M2 as a mark may be added to the left side surface 101.

[0188] The second mark M2 includes: a second center line M21 indicating the center of the irradiation area R1 (the intersection point where the diagonal lines of the irradiation area R1 intersect); a +X edge M22 indicating the edge on the +X side in the irradiation area R1; and a -X edge M23 indicating the edge on the -X side in the irradiation area R1.

[0189] -Right side 10r-

[0190] like Figure 4 、 Figure 5 and Figure 10 Of the six surfaces, the right side surface 10r is arranged on the -Y side relative to the laser scanning unit 5 and is formed into a plate shape extending in the Z and X directions. The right side surface 10r is arranged on the opposite side of the left side surface 101 with the laser scanning unit 5 interposed therebetween.

[0191] Note that, in the case where the right side surface 10 r is regarded as one outer surface of the housing 10 , a third mark M3 configured similarly to the second mark M2 may be added to the right side surface 10 r.

[0192] The third mark M3 includes: a third center line M31 indicating the center of the irradiation area R1 (the intersection point where the diagonal lines of the irradiation area R1 intersect); a +X edge M32 indicating the edge on the +X side in the irradiation area R1; and a -X edge M33 indicating the edge on the -X side in the irradiation area R1.

[0193] Note that a configuration including both the second mark M2 and the third mark M3 is not essential, and one of the second mark M2 and the third mark M3 may be provided.

[0194] (Internal space of housing 10)

[0195] The housing 10 defines an interior space surrounded by six surfaces: a bottom surface 10d, a top surface 10u, a front surface 10f, a rear surface 10b, a left side surface 10l, and a right side surface 10r. The interior space is partitioned into a plurality of accommodation portions by a plate-like member disposed in the housing 10.

[0196] The marking head 1 according to this embodiment includes a first base plate 15, a second base plate 16, and a third base plate 17 as such plate-like members. In this embodiment, the first base plate 15, the second base plate 16, and the third base plate 17 are separated from each other. Furthermore, the first base plate 15 is configured as a support plate capable of supporting the solid-state laser crystal 41 among these plate-like members.

[0197] Hereinafter, the configuration of each plate-like member will be described in sequence.

[0198] -First bottom plate 15-

[0199] like Figure 8 、 Figure 9 and Figure 10 For example, the first bottom plate 15 is configured as a metal plate-shaped member extending in the X direction and is housed in the housing 10 (in other words, surrounded by the six surfaces of the housing 10). The plate thickness of the first bottom plate 15 is set to be greater than the plate thickness of at least the left side surface 101 and the right side surface 10r among the six surfaces of the housing 10.

[0200] In particular, the first bottom plate 15 according to this embodiment has an inverted L-shape when viewed from the -X side. Here, the "inverted L-shape" refers to a shape obtained by inverting the L-shape relative to an axis of symmetry extending in the Z direction. Hereinafter, the portion of the first bottom plate 15 corresponding to the vertical side of the inverted L-shape is referred to as the vertical side portion 15a, and the portion corresponding to the horizontal side of the inverted L-shape is referred to as the horizontal side portion 15b.

[0201] The first bottom plate 15 is arranged between the left side 101 and the right side 10r in the Y direction and on the +Y side of the second bottom plate 16. The first bottom plate 15 is arranged on the +Y side of the third bottom plate 17 with the second bottom plate 16 interposed therebetween.

[0202] Here, a sealing member (not illustrated) that liquid-tightly seals the gap between the first bottom plate 15 and the left side surface 101 is provided between the left end (end on the +Y side) of the horizontal side portion 15b and the left side surface 101 of the housing 10 .

[0203] The first bottom plate 15 is arranged below the top surface 10 u in the Z direction.

[0204] Here, if Figure 10 As shown in the example of the surrounding portion C1, the upper end (the end on the -Z side) of the vertical side portion 15a faces the top surface 10u with a predetermined gap. Therefore, the first bottom plate 15 is not integral with the top surface 10u of the housing 10 (a state in which relative displacement of the first bottom plate 15 with respect to the top surface 10u is permitted).

[0205] Note that, when an outer surface other than the top surface 10u among the six surfaces of the housing 10 is an attachment surface, a gap may be provided between the outer surface serving as the attachment surface and the first bottom plate 15, rather than providing a gap between the top surface 10u and the vertical side portion 15a. For example, when the left side surface 10l of the housing 10 is an attachment surface, a gap may be provided between the left end of the horizontal side portion 15b and the left side surface 10l.

[0206] The first bottom plate 15 is arranged between the front surface 10f and the rear surface 10b in the X direction. Figure 11 As illustrated, the first bottom plate 15 is fixed to the front surface 10 f by a front surface side fastener 15 c , and is fixed to the rear surface 10 b by a rear surface side fastener 15 d .

[0207] That is, the first bottom plate 15 as a support plate is attached to the housing 10 through the front surface 10 f and the rear surface 10 b in a state where it is not integrated with the top surface 10 u as an attachment surface.

[0208] Next, when the vertical side portion 15a is described in detail, the vertical side portion 15a according to the present embodiment is formed into a thick plate shape extending along the Z direction and the X direction as the irradiation direction. Figure 11 Illustratively, at least two through holes 15e and 15f are formed in the vertical side portion 15a.

[0209] Of the two through holes 15e and 15f, the second through hole 15e on the +X side is used to optically couple the excitation light guide 3 and the laser output 4. The second through hole 15e forms a first incident window 91 that allows the excitation light to enter the laser output 4 from the excitation light guide 3.

[0210] Of the two through holes 15e and 15f, the third through hole 15f located on the -X side is used to optically couple the laser output section 4 and the laser scanning section 5. An optical member 15h, such as glass, that transmits laser light is mounted in the third through hole 15f. The third through hole 15f and the optical member 15h, together with the fifth through hole 50b, which will be described later, form a second entrance window 92 that allows laser light to enter the laser scanning section 5 from the laser output section 4.

[0211] In addition, of the left and right side surfaces of the vertical side portion 15a, the left side surface facing the +Y side forms a partition surface 15g which defines a crystal housing H12 to be described later. Various optical components including the solid-state laser crystal 41 are fastened to the partition surface 15g.

[0212] In addition, of the left and right side surfaces of the vertical side portion 15a, the right side surface facing the -Y side supports the first housing 50 from the left side, which defines a mirror receiving portion H11 to be described later. The right side surface may define a portion of the mirror receiving portion H11 instead of supporting the first housing 50 by the right side surface of the vertical side portion 15a.

[0213] Next, when the horizontal side portion 15b is described in detail, the horizontal side portion 15b according to the present embodiment is formed in a thick plate shape extending in the X direction and the Y direction. Figure 10 Illustratively, a first heat sink 81 , which is a heat sink according to the present embodiment, is provided on the lower surface of the horizontal side portion 15 b .

[0214] The first heat sink 81 includes a plurality of fins protruding in the +Z direction. These fins are arranged side by side in the Y direction. Each fin is formed to extend in the X direction. The first heat sink 81 is thermally coupled to the components of the laser output unit 4 (e.g., the solid-state laser crystal 41) via the first base plate 15.

[0215] Note that in Figure 10 In the illustrated example, the horizontal side portion 15 b and the first heat sink 81 are integrated, but the horizontal side portion 15 b and the first heat sink 81 may be separate without being limited thereto.

[0216] -Second bottom plate 16-

[0217] like Figure 8 、 Figure 9 and Figure 10 As illustrated, the second bottom plate 16 is configured as a metal plate-shaped member extending in the X direction, and defines a portion of the six surfaces of the housing 10 , particularly, an offset portion 16 a of the bottom surface 10 d .

[0218] Specifically, the second bottom plate 16 according to this embodiment is formed into a Z-shape when viewed from the -Y side. The upper side of the second bottom plate 16 when the second bottom plate 16 is considered to be Z-shaped corresponds to the offset portion 16a in this embodiment. In the X direction, when the second bottom plate 16 is considered to be Z-shaped, the length of the offset portion 16a, which is the upper side, is set to be longer than the length of the bottom side.

[0219] The second bottom plate 16 is arranged between the left and right sides 101 and 10r in the Y direction, more specifically, between the first and third bottom plates 15 and 17. The second bottom plate 16 is supported by the first and third bottom plates 15 and 17 via fasteners (not illustrated) such as screws.

[0220] The second bottom plate 16 is arranged below the top surface 10u in the Z direction. The second bottom plate 16 is arranged on the -Z side of the horizontal side portion 15b of the first bottom plate 15. Specifically, when the vertical side portion 15a of the first bottom plate 15 is divided into two parts in the Z direction, the offset portion 16a, which is the upper side of the Z shape, is arranged in the second bottom plate 16 at approximately the same Z position as the +Z side portion (lower portion). In addition, the portion of the second bottom plate 16 corresponding to the bottom side of the Z shape is arranged at approximately the same Z position as the +Z side end (lower end) of the left side surface 10l and the right side surface 10r.

[0221] Here, a sealing member (not shown) is provided between the +Y side end (left end) of the offset portion 16a in the second bottom plate 16 and the right side surface of the vertical side portion 15a in the first bottom plate 15 to liquid-tightly seal the gap between the offset portion 16a and the right side surface.

[0222] Similarly, a sealing member (not illustrated) that liquid-tightly seals the gap between the offset portion 16a and the left side surface of the vertical side portion 17a of the third bottom plate 17 is provided between the -Y side end (right end) and the left side surface of the offset portion 16a.

[0223] The second bottom plate 16 is arranged between the front surface 10f and the rear surface 10b in the X direction. The second bottom plate 16 is fixed to the front surface 10f and the rear surface 10b via the first bottom plate 15 and the third bottom plate 17. The second bottom plate 16 may be directly fastened to the front surface 10f and the rear surface 10b.

[0224] Next, when the offset portion 16a is described in detail, the offset portion 16a according to the present embodiment is formed into a thick plate shape extending in the X direction and the Y direction. Further, when the offset portion 16a is divided into two parts in the X direction, the exit window 6 according to the present embodiment is formed in the +X side part (the rear part in the front-to-back direction).

[0225] The exit window 6 includes: an exit hole 61 that penetrates the +X side portion of the offset portion 16a; a cover glass 62 that fits in the exit hole 61; and a sealing member (not illustrated) that liquid-tightly seals a gap between the exit hole 61 and the cover glass 62 (see FIG. Figure 10 The cover glass 62 is configured as an optical member that transmits the laser light deflected by the laser scanning unit 5 and directs it toward the irradiation region R1. The cover glass 62 can be formed into a rectangular shape corresponding to the shape of the irradiation region R1, for example, a rectangular shape that is substantially similar to the irradiation region R1 and smaller in size than the irradiation region R1.

[0226] In addition, if Figure 8 、 Figure 9 and Figure 10 For example, the upper surface facing the -Z side between the upper and lower surfaces of the offset portion 16a supports the first housing 50 from below. More specifically, the first housing 50 may be fastened to the upper surface of the offset portion 16a, and the first housing 50 may be fixed relative to the second base plate 16 by this fastening. Instead of supporting the first housing 50 by the upper surface of the offset portion 16a, the upper surface may define a portion of the mirror receiving portion H11.

[0227] -Third base plate 17-

[0228] like Figure 8 、 Figure 9 and Figure 10 For example, the third bottom plate 17 is configured as a metal plate-shaped member extending in the X direction and is housed in the housing 10 (in other words, surrounded by the six surfaces of the housing 10). The plate thickness of the third bottom plate 17 is set to be greater than the plate thickness of at least the left side surface 101 and the right side surface 10r among the six surfaces of the housing 10.

[0229] In particular, the third bottom plate 17 according to the present embodiment has an L-shape when viewed from the -X side. Hereinafter, the portion of the third bottom plate 17 corresponding to the vertical side of the L-shape is referred to as a vertical side portion 17a, and the portion corresponding to the horizontal side of the L-shape is referred to as a horizontal side portion 17b.

[0230] The third bottom plate 17 is arranged between the left side 101 and the right side 10r in the Y direction and on the -Y side of the second bottom plate 16. The third bottom plate 17 is arranged on the -Y side of the first bottom plate 15 with the second bottom plate 16 interposed therebetween.

[0231] Here, a sealing member (not shown) for liquid-tightly sealing the gap between the third bottom plate 17 and the right side 10r of the housing 10 is provided between the right end (end on the +Y side) of the horizontal side portion 17b of the third bottom plate 17 and the right side 10r.

[0232] The third bottom plate 17 is arranged below the top surface 10 u in the Z direction.

[0233] The third bottom plate 17 is arranged between the front surface 10f and the rear surface 10b in the direction X. The third bottom plate 17 is fixed to the front surface 10f and the rear surface 10b by fasteners (not illustrated).

[0234] Next, when describing in detail the vertical side portion 17a of the third bottom plate 17, the vertical side portion 17a according to the present embodiment is formed into a thick plate shape extending in the -Z direction and the X direction, which are the irradiation directions. In the Z direction, the size of the vertical side portion 17a of the third bottom plate 17 is shorter than the size of the vertical side portion 15a of the first bottom plate 15. The vertical side portion 17a supports the second bottom plate 16 from the -Y side.

[0235] Next, when the horizontal side portion 17b of the third bottom plate 17 is described in detail, the horizontal side portion 17b according to the present embodiment is formed into a thick plate shape extending in the X direction and the Y direction. Various components can be attached to the horizontal side portion 17b. The components attached to the horizontal side portion 17b include the first control board 53 of the laser scanning unit 5. In addition, as shown in FIG. Figure 10 By way of example, a second heat sink 82 serving as a heat sink according to the present embodiment is provided on the lower surface of the horizontal side portion 15 b facing the −Z side.

[0236] The second heat sink 82 includes a plurality of fins protruding in the +Z direction. These fins are arranged side by side in the Y direction. Each fin is formed to extend in the X direction. The second heat sink 82 is thermally coupled to the components of the excitation light generating unit 2 (e.g., the excitation light source 21) via the third base plate 17.

[0237] That is, in this embodiment, the first heat sink 81 for cooling the laser output section 4 and the second heat sink 82 for cooling the excitation light generating section 2 are arranged separately.

[0238] Note that in Figure 10 In the illustrated example, the horizontal side portion 17 b and the second heat sink 82 are integrated, but the horizontal side portion 17 b and the second heat sink 82 may be separate without being limited thereto.

[0239] In addition, when the first base plate 15 and the third base plate 17 are separated as in the present embodiment, the first heat sink 81 provided on the first base plate 15 and the second heat sink 82 provided on the third base plate 17 are separated from each other. However, the present disclosure is not limited to this configuration, and the first heat sink 81 and the second heat sink 82 may be integral.

[0240] (Outlines of the first and second accommodating portions H1 and H2)

[0241] As described above, the inner space of the housing 10 is partitioned into a plurality of accommodation portions by the first bottom plate 15 , the second bottom plate 16 , and the third bottom plate 17 .

[0242] As such a housing portion, the housing 10 according to the present embodiment includes a first housing portion H1 in which the cover glass 62 as an optical member is provided, and a second housing portion H2 (see FIG. 1 ) obtained by forming at least a portion of the periphery of the cover glass 62 so as to protrude from the cover glass 62 toward the irradiation region R1. Figure 10 The dashed line SI in FIG.

[0243] The first and second housing sections H1 and H2 are arranged side by side along the illumination direction (-Z direction), with the first housing section H1 located on one side (-Z side) and the second housing section H2 located on the other side (+Z side). The boundary between the first and second housing sections H1 and H2 is defined by the first, second, and third bottom plates 15, 16, and 17.

[0244] The first housing H1 houses optical components related to the generation of excitation light, the generation of laser light, and the deflection of laser light. Specifically, the first housing H1 according to this embodiment houses the excitation light generating unit 2, the excitation light guiding unit 3, the laser output unit 4, and the laser scanning unit 5.

[0245] exist Figure 10In the illustrated example, the first accommodating portion H1 is constructed as a space surrounded by a top surface 10u, an upper portion of the front surface 10f, a lower portion of the rear surface 10b, an upper portion of the left side surface 10l, an upper portion of the right side surface 10r, and a portion of the bottom surface 10d constructed by the second bottom plate 16, the first bottom plate 15, and the third bottom plate 17.

[0246] On the other hand, the second housing section H2 houses cooling components related to cooling the optical components housed in the first housing section H1. Specifically, the second housing section H2 according to the present embodiment houses a first heat sink 81 and a second heat sink 82 that are thermally coupled to the optical components housed in the first housing section H1, a first blower fan 83 that serves as a blower for blowing air toward the first heat sink 81, and a second blower fan 84 that similarly blows air toward the second heat sink 82.

[0247] exist Figure 10 In the illustrated example, the second accommodating portion H2 is constructed as a space surrounded by the lower portion of the front surface 10f, the lower portion of the rear surface 10b, the lower portion of the left side 10l, the lower portion of the right side 10r, a portion of the bottom surface 10d constructed using the non-offset portion 18 excluding the offset portion 16a, the first base plate 15, and the third base plate 17.

[0248] Furthermore, of the first housing H1 and the second housing H2, at least the first housing H1 is constructed to meet the IP standard defined by the International Electrotechnical Commission (IEC). Therefore, the marking head 1 can be cleaned with water without wetting optical components such as the solid-state laser crystal 41 and the first mirror 51a. This helps improve the ease of cleaning of the marking head 1.

[0249] Furthermore, the housing 10 forming the first and second accommodating portions H1 and H2 can also have an external shape that is less likely to collect water during cleaning. This external shape can be achieved, for example, by tilting the top surface 10u relative to the XY plane. This external shape helps improve the sanitation of the marking head 1.

[0250] At this time, as described above, the front surface 10f is configured to be opened and closed by the cover member 13, making it easy to wipe it (especially the periphery of the exit window 6) after washing with water. This helps improve the maintainability of the marking head 1.

[0251] (Details of the first accommodation portion H1)

[0252] Here, in the first housing portion H1 and the second housing portion H2 described above, the first housing portion H1 is further divided into three housing portions arranged side by side in a direction (X direction or Y direction) orthogonal to the illumination direction (e.g., the Y direction). Specifically, the housing 10 according to this embodiment includes a mirror housing portion H11, a crystal housing portion H12, and a plate housing portion H13.

[0253] The mirror accommodating portion H11 accommodates the first mirror 51a and the second mirror 52a in the laser scanning portion 5. The mirror accommodating portion H11 according to the present embodiment is defined by a first housing 50 capable of airtightly sealing the first mirror 51a and the second mirror 52a. The first housing 50 can be defined using the offset portion 16a as described above. In the case where the first housing 50 is defined using the offset portion 16a, a buffer material is preferably provided between the offset portion 16a and the first housing 50. The offset portion 16a is a portion of the bottom surface 10d and is thus susceptible to distortion, vibration, and the like, and the buffer material can prevent the first housing and the components accommodated in the first housing by the buffer material from being affected by such external influences. Alternatively, the mirror accommodating portion H11 can be defined using a first base plate 15, similar to the crystal accommodating portion H12 to be described later.

[0254] Here, the first housing 50 is formed in a bottomed box shape that is open toward the −Z side and is held by the first base plate 15 .

[0255] The size of the first housing 50 in the X direction is substantially consistent with the size of the offset portion 16a in the X direction. Similarly, the size of the first housing 50 in the Y direction is substantially consistent with the size of the offset portion 16a in the Y direction.

[0256] The -Z side opening of the first housing 50 may be formed by, for example Figure 10 The illustrated cover 59 is closed. For example, the opening of the first housing 50 may be sealed by the top surface 10u instead of being sealed by the cover 59. When the opening of the first housing 50 is sealed by the top surface 10u, a buffer material is preferably provided between the top surface 10u and the first housing 50. Therefore, the influence of distortion, vibration, etc. generated on the top surface 10u can be prevented from reaching the first housing 50 and the components accommodated therein.

[0257] In addition, at least four through holes 50a, 50b, 50c, and 50d are formed in the first housing 50. Among the four through holes 50a, 50b, 50c, and 50d, the fourth through hole 50a formed in the left side wall portion of the first housing 50 communicates with the third through hole 15f of the first base plate 15 by assembling the marking head 1, and constitutes the second incident window 92 together with the third through hole 15f and the optical member 15h fitted in the third through hole 15f.

[0258] On the other hand, among the four through holes 50a, 50b, 50c, and 50d, when the first housing 50 including the offset portion 16a is divided into two parts in the X direction, the fifth through hole 50b formed at the bottom of the first housing 50 is arranged on the +X side. A defocus lens 57 as an optical element is provided in the fifth through hole 50b. The defocus lens 57 will be described later.

[0259] In addition, among the four through holes 50a, 50b, 50c, and 50d, when the first housing 50 including the offset portion 16a is divided into two parts in the X direction, the sixth through hole 50c formed in the right side wall portion (the wall portion located on the -Y side) of the first housing 50 is arranged on the +X side. The second motor 52b constituting the second scanner 52 can be inserted into and fixed to the sixth through hole 50c.

[0260] Furthermore, of the four through-holes 50a, 50b, 50c, and 50d, when the first housing 50, including the offset portion 16a, is divided into two parts in the X direction, the seventh through-hole 50d, formed in the rear wall portion (the wall portion located on the +X side) of the first housing 50, is located on the +X side. In the Z direction, the seventh through-hole 50d is located on the +Z side of the sixth through-hole 50c. Furthermore, in the Y direction, the center of the seventh through-hole 50d (the center of the circle when the seventh through-hole 50d is considered to have a circular cross-section) is located at approximately the same position as the optical axis of the cover glass 62. The first motor 51b constituting the first scanner 51 can be inserted into and fixed to the seventh through-hole 50d.

[0261] The crystal housing H12 is defined by a support plate (first base plate 15) having a partition surface 15g extending in the irradiation direction, and is arranged on the opposite side (in the illustrated example, the +Y side) of the mirror housing H11 relative to the partition surface 15g to accommodate the solid-state laser crystal 41. The crystal housing H12 accommodates optical components constituting the laser output section 4, such as the solid-state laser crystal 41. The crystal housing H12 is defined by a second housing 40 capable of hermetically sealing these optical components. The crystal housing H12 according to this embodiment can accommodate the nonlinear optical crystal 45 in a sealed state.

[0262] Here, the second housing 40 is formed into a bottomed box shape that is open toward the -Y side. The second housing 40 is attached to the vertical side portion 15a of the first bottom plate 15 and is supported from the -Y side by the partition surface 15g of the vertical side portion 15a. The -Y side opening of the second housing 40 can be closed by the partition surface 15g.

[0263] The inner space of the crystal housing H12 can be divided into a Q switch housing H121 and a wavelength conversion unit H122 arranged side by side in the X direction. The Q switch housing H121 is a space for housing the Q switch 43. The wavelength conversion unit H122 is a space for housing the nonlinear optical crystal 35.

[0264] Here, the Q-switch housing H121 and the wavelength conversion section H122 are arranged side by side along the X-direction, and both are configured as a space surrounded by the second housing 40 and the partition surface 15g. More specifically, the second housing 40 is composed of a box-shaped body corresponding to the Q-switch housing H121 and a box-shaped body corresponding to the wavelength conversion section H122, and each of the Q-switch housing H121 and the wavelength conversion section H122 is a space surrounded by each of the box-shaped bodies and the partition surface 15g. The Q-switch housing H121 and the wavelength conversion section H122 are optically coupled via an optical member (not shown). Since the Q-switch housing H121 and the wavelength conversion section H122 are configured as separate spaces in this manner, the possibility of impurities generated in the Q-switch 43, which will be described later, adhering to the wavelength conversion element 45, which will be described later, and causing a decrease in laser output, is reduced.

[0265] The board housing H13 is arranged on the opposite side of the crystal housing H11 relative to the mirror housing H12, and houses the first control board 53. The board housing H13 according to the present embodiment is defined as a space excluding the mirror housing H11 and the crystal housing H12 in the internal space of the first housing H1.

[0266] That is, in the present embodiment, the expression “a predetermined member is accommodated in the mirror accommodation portion H11” indicates that the member is surrounded on six sides by the first housing 50, and the expression “a predetermined member is accommodated in the crystal accommodation portion H12” indicates that the member is surrounded on six sides by the second housing 40 and the partition surface 15g.

[0267] On the other hand, the expression "a predetermined component is accommodated in the board accommodation portion H13" merely indicates that the component is arranged in a space other than the mirror accommodation portion H11 and the crystal accommodation portion H12 in the housing 10. Of course, the present invention is not limited to this configuration, and a housing (so-called third housing) dedicated to the board accommodation portion H13 may be provided similarly to the first housing 50 and the second housing 40.

[0268] (Details of the second accommodation portion H2)

[0269] Meanwhile, the second housing portion H2 is defined as a +Z side portion in the housing 10 by the first plate-like member 181 and the second plate-like member 18r as plate-like members. The second housing portion H2 has two spaces arranged at intervals in a direction orthogonal to the irradiation direction (for example, the direction (Y direction) in which the mirror housing H11, the crystal housing H12, and the plate housing H13 are arranged).

[0270] As these two spaces, the second accommodation portion H2 according to this embodiment includes a crystal-side accommodation portion H21 and a light source-side accommodation portion H22. Here, since the crystal-side accommodation portion H21 and the light source-side accommodation portion H22 are arranged to be spaced apart from each other in the Y direction, a space that does not belong to the second accommodation portion H2 is defined between the crystal-side accommodation portion H21 and the light source-side accommodation portion H22.

[0271] According to the present embodiment, the first plate-shaped member 181 and the second plate-shaped member 18r are configured to define, in addition to the second housing portion H2, which serves as a space for housing components, a space that includes the optical path (the optical path on the +Z side) that connects the first mirror 51a, which serves as a scanning mirror, and the laser beam that irradiates the irradiation region R1. Hereinafter, this space is referred to as the "optical path defining portion," and is denoted by the reference numeral H3. According to the present embodiment, the optical path defining portion H3 is configured as a space surrounded by the first plate-shaped member 181, the second plate-shaped member 18r, and the cover glass 62 on three sides: the +Y side, the -Y side, and the -Z side.

[0272] Note that the optical path defining portion H3 is configured as a space with an open lower end on the +Z side in the illustrated example, but is not limited to this configuration. The +Z side end of the optical path defining portion H3 may be covered with an optical member such as glass. The optical member covering the +Z side end of the optical path defining portion H3 may be provided in place of the cover glass 62 or may be used in combination with the cover glass 62.

[0273] In addition, of the two spaces constituting the second accommodation portion H2, the crystal-side accommodation portion H21 accommodates the first heat sink 81 and the first blowing fan 83. The first heat sink 81 and the first blowing fan 83 are arranged side by side in the X direction.

[0274] Although overlapping with the above description, the first heat sink 81 according to the present embodiment is thermally coupled to at least the optical components attached to the first base plate 15 among the optical components constituting the laser output section 4 .

[0275] On the other hand, Figure 13 As an example, the first blower fan 83 is arranged on the +X side of the first radiator 81. The first blower fan 83 is configured using a so-called axial flow fan and generates airflow through the first radiator 81 based on a control signal received from the marking machine controller 100. The first blower fan 83 can be arranged on the -X side of the first radiator 81. In this embodiment, since the power and signal for driving the first blower fan are supplied via the cable 200 (the connection portion of the cable 200 is covered by the connection cover 14 arranged on the +X side), if the first blower fan 83 is arranged on the +X side of the first radiator 81, the space required for wiring is reduced, which helps to reduce the size of the marking head 1.

[0276] The air flow generated by the first blowing fan 83 flows from the vent hole 12 provided in the front surface 10f of the housing 10 into the crystal-side accommodation portion H21 as shown in FIG. Figure 13 Then, the inflowing air flows along the X direction from the -X side toward the +X side, thereby passing through the first radiator 81 and the first blower fan 83. The airflow passing through the first blower fan 83 flows out from the exhaust port provided in the rear surface 10b of the housing 10, as shown in FIG. Figure 13 The arrow Al2 in is an example.

[0277] Here, a first rectifying plate 85 that adjusts the flow direction of the air flow is attached to the rear surface 10b of the housing 10 (see also Figure 6 The first rectifying plate 85 guides the flow direction of the airflow flowing out from the rear surface 10b to the opposite side (-Z side) of the direction from the housing 10 toward the workpiece W, as shown in FIG. Figure 13 Therefore, it is advantageous in preventing the collision between the exhaust air and the workpiece W and stabilizing the posture of the workpiece W.

[0278] The light source side housing portion H22 houses the second heat sink 82 and the second blower fan 84. The second heat sink 82 and the second blower fan 84 are arranged side by side in the X direction.

[0279] The second heat sink 82 according to the present embodiment is thermally coupled to at least the excitation light source 21 attached to the third base plate 17 among the optical components accommodated in the board accommodation portion H13 .

[0280] On the other hand, Figure 12 As an example, the second blower fan 84 is arranged on the +X side of the second radiator 82. The second blower fan 84 is configured similarly to the first blower fan 83 using an axial flow fan, and generates airflow through the second radiator 82 based on a control signal received from the marking machine controller 100. The second blower fan 84 can be arranged on the -X side of the second radiator 82. In this embodiment, the power and signal for driving the first blower fan are supplied via the cable 200 (the connection portion of the cable is covered by the connection cover 14 arranged on the +X side). Therefore, if the first blower fan 83 is arranged on the +X side of the second radiator 82, the space required for wiring is reduced, which helps to reduce the size of the marking head 1.

[0281] The air flow generated by the second blowing fan 84 flows into the light source side accommodating portion H22 from the vent hole 12 provided in the front surface 10f of the housing 10, as shown in FIG. Figure 12 Then, the inflowing air flows along the X direction from the -X side toward the +X side, thereby passing through the second radiator 82 and the second blower fan 84. The airflow passing through the second blower fan 84 flows out from the exhaust port provided in the rear surface 10b of the housing 10, as shown in FIG. Figure 12 The arrow Ar2 in FIG.

[0282] Here, a second rectifying plate 86 that adjusts the flow direction of the air flow is attached to the rear surface 10b of the housing 10 (see also Figure 6 The second rectifying plate 86 changes the flow direction of the airflow flowing out from the rear surface 10b to the opposite side (-Z side) of the direction from the housing 10 toward the workpiece W, as shown in FIG. Figure 12 Therefore, it is advantageous in preventing the collision between the exhaust air and the workpiece W and stabilizing the posture of the workpiece W.

[0283] Hereinafter, the configurations of the excitation light generating portion 2 , the excitation light guiding portion 3 , the laser output portion 4 , the laser scanning portion 5 , etc. in the first accommodating portion H1 and the second accommodating portion H2 will be described in detail with reference to the relative positional relationship in the shell 10 .

[0284] (Excitation light generating unit 2)

[0285] The excitation light generating unit 2 includes: an excitation light source 21, which generates laser excitation light (excitation light) based on the power (driving current) supplied from the power supply unit 104; a metal plate 22, which supports the excitation light source 21; a temperature control unit 23, which adjusts the temperature of the excitation light source 21; and a light source control board 24, which supports the excitation light source 21 based on a control signal input from the marking machine controller 100.

[0286] The excitation light source 21, metal plate 22, temperature control unit 23, and light source control board 24 that constitute the excitation light generating unit 2 are all housed in the board housing H13. Thus, the excitation light generating unit 2, particularly the excitation light source 21, is positioned on the opposite side of the laser output unit 4, with the mirror housing H11 interposed therebetween. This allows for the excitation light generating unit 2 and the laser output unit 4 to be separated as much as possible.

[0287] -Metal plate 22-

[0288] The metal plate 22 is configured as a thin plate-shaped member made of metal. Figure 11 and Figure 12 For example, when the third base plate 17 is divided into three parts in the X direction (i.e., the +X side part, the center part, and the -X side part), the metal plate 22 is placed on the -X side part. The metal plate 22 is fastened to the upper surface of the third base plate 17 (more specifically, the upper surface of the horizontal side part 17b of the third base plate 17) and is thermally coupled to the second heat sink 82 via the third base plate 17.

[0289] In addition, the excitation light source 21 is placed on the upper surface of the metal plate 22 , and the temperature control section 23 having a plate shape is sandwiched between the lower surface of the metal plate 22 and the third bottom plate 17 .

[0290] - Excitation light source 21 -

[0291] The excitation light source 21 is configured to receive power supplied from the power supply section 104 through the cable 200 and generate excitation light corresponding to the power. The output of the excitation light generated by the excitation light source 21 increases as the driving current increases.

[0292] The excitation light source 21 according to this embodiment is configured using a laser diode (LD). The laser light oscillating from the excitation light source 21 is collected by a focusing lens (not shown) and output as laser excitation light (excitation light). The excitation light source 21 is optically coupled to an optical cable 31 forming the excitation light guide 3. The laser excitation light output from the excitation light source 21 is guided to the excitation light guide 3 via the optical cable 31.

[0293] In addition, the excitation light source 21 is formed into a rectangular thin plate shape and is fixed to the upper surface of the metal plate 22 with its thickness direction along the Z direction, as shown in FIG. Figure 11 and Figure 12 When the third base plate 17 is divided into three parts in the X direction, the excitation light source 21 is arranged in the -X side part, similar to the metal plate 22. With this arrangement, the excitation light source 21 according to this embodiment is arranged closer to the upstream end of the airflow generated by the second blower fan 84 (the -X side end separated from the second blower fan 84) rather than the downstream end of the airflow (the +X side end adjacent to the second blower fan 84).

[0294] In addition, one side surface of the excitation light source 21 faces obliquely toward the +X side and the +Y side, and the upstream end of the optical cable 31 is connected to the obliquely facing side surface.

[0295] -Temperature control unit 23-

[0296] The temperature control unit 23 is configured to adjust the temperature of the excitation light source 21 to fall within a predetermined temperature range. Here, the temperature range (predetermined temperature range) achieved by the temperature control unit 23 is set based on the guaranteed environment of the marking head 1, preferably set to a temperature higher than the guaranteed environment of the marking head 1, and more preferably set to 40°C or higher and 60°C or lower.

[0297] Specifically, the temperature control unit 23 according to this embodiment is configured using a Peltier element having a generally thin plate shape and is sandwiched between the upper surface of the third base plate 17 (more specifically, the upper surface of the horizontal side portion 17b) and the lower surface of the metal plate 22. The temperature control unit 23 dissipates heat from the metal plate 22. A wiring harness (not shown) for supplying current to the temperature control unit 23 is connected to a side portion of the temperature control unit 23. The temperature control unit 23 absorbs heat from the surface on the metal plate 22 side by the current supplied via the wiring harness, and generates heat on the surface on the third base plate 17 side.

[0298] -Light source control board 24-

[0299] The light source control board 24 is electrically connected to the marking machine controller 100 , and controls the power supplied from the power supply section 104 to the excitation light source 21 .

[0300] The light source control board 24 according to this embodiment is configured using a circuit board having a generally rectangular thin plate shape. The light source control board 24 is arranged with its front and rear surfaces both extending in the Z and X directions, and is fastened to, for example, the vertical side portion 17a of the third base plate 17 from the -Y side (its fastening structure is not illustrated).

[0301] The light source control board 24 is also as shown Figure 12 It is illustratively arranged on the −Z side of the excitation light source 21 in the Z direction, and is electrically connected to the excitation light source 21 through wiring (not illustrated).

[0302] (Excitation light guide 3)

[0303] The excitation light guide section 3, which serves as a light-guiding optical system, includes an optical cable 31 for optically coupling the excitation light source 21 and the solid-state laser crystal 41 in the laser output section 4, and an optical fiber guide 32 configured to be wound around the optical cable 31 with a predetermined bend radius. Both the optical cable 31 and the optical fiber guide 32 are housed in a board housing H13 in the housing 10.

[0304] -Optical Cable 31-

[0305] The optical cable 31 is formed using a so-called optical fiber, one end of which (when viewed in the light propagation direction) is connected to the excitation light source 21 , and the other end of which (the end located on the opposite side of the one end in the light propagation direction) is connected to the first incident window 91 .

[0306] The other end of the optical cable 31 is optically coupled to the solid-state laser crystal 41 via the first incident window 91 and the first deflecting mirror 42 described later.

[0307] The optical cable 31 can guide the excitation light generated in the excitation light source 21 to the solid-state laser crystal 41 .

[0308] -Fiber guide 32-

[0309] The optical fiber guide 32 is configured to be wound around the optical cable 31 at a predetermined bending radius. The bending radius of the optical fiber guide 32 is set to be equal to or greater than the minimum bending radius of the optical cable 31.

[0310] Specifically, the optical fiber guide 32 according to the present embodiment is formed into a substantially cylindrical reel shape capable of winding the optical cable 31 several times. The optical fiber guide 32 is arranged with the central axis of the cylindrical shape along the Y direction and is attached to the vertical side portion 17a of the third bottom plate 17 from the -Y side.

[0311] In addition, if Figure 12 As shown, the optical fiber guide 32 is arranged in a range from the front end of the light source control board 24 to the rear end of the second control board 54. Figure 11 As illustrated, the optical fiber guide 32 is arranged on the +Y side of the light source control board 24 and the second control board 54 in the Y direction, and is arranged on the −Y side of the right side wall portion of the first housing 50 .

[0312] (Laser output unit 4)

[0313] The laser output section 4 includes a first deflecting mirror 42 that bends the optical path of the excitation light; a solid-state laser crystal 41 that generates a fundamental wave based on the excitation light; a Q-switch 43 that pulses the fundamental wave based on a control signal input from the marking machine controller 100; and a first reflecting mirror 44 that reflects the fundamental wave. These optical components are airtightly housed in the Q-switch housing H12, which is formed by dividing the crystal housing H121 into two parts. Note that at least the solid-state laser crystal 41 of these optical components can also be housed in the wavelength conversion section H122.

[0314] The laser output section 4 further includes a nonlinear optical crystal 45 that receives the laser light (fundamental wave) generated by the solid-state laser crystal 41 and converts the wavelength of the laser light to a shorter wavelength; a second reflecting mirror 46 that forms a resonance optical path together with the first reflecting mirror 44; a laser light separation section 47 for separating the laser light whose wavelength has been converted to a shorter wavelength from the resonance optical path; and a second deflecting mirror 48 that bends the optical path of the laser light separated by the laser light separation section 47. These optical components are airtightly housed in the wavelength conversion section H12 obtained by dividing the crystal housing H122 into two parts.

[0315] In particular, the laser output section 4 according to this embodiment is configured as a so-called intracavity laser oscillator. Specifically, the Q-switch 43, the first deflecting mirror 42, the solid-state laser crystal 41, the first splitter 47a constituting the laser splitting section 47, the second wavelength conversion element 45b as the nonlinear optical crystal 45, and the first wavelength conversion element 45a as the nonlinear optical crystal 45 are arranged in this order along the path from the first reflecting mirror 44 to the second reflecting mirror 46. In other words, the first reflecting mirror 44, the second reflecting mirror 46, and the components between the first and second reflecting mirrors 44 and 46 constitute a resonant unit, within which the first and second wavelength conversion elements 45a and 45b are arranged. In this embodiment, the laser output section 4 is configured as an intracavity laser oscillator, but it may be an extracavity laser oscillator in which the nonlinear optical crystal 45 is not located between the first and second reflecting mirrors 44 and 46.

[0316] Here, the first deflecting mirror 42 is arranged to deflect the optical axis (the optical axis extending along the Y direction, as shown in FIG. 1 ) of the excitation light guided by the excitation light guide portion 3 and passing through the first incident window 91. Figure 11 The reference numeral A1 in FIG. Figure 11 and Figure 12 The optical axes of the resonant optical paths indicated by reference numeral A2 in FIG. 1 (optical axes extending along the X direction) are merged.

[0317] In addition, for example, the first splitter 47a is arranged to separate the laser light including the third harmonic from the resonant optical path connecting the first reflecting mirror 44 and the second reflecting mirror 46. That is, the laser output section 4 converts the wavelength of the laser light including photons excited and emitted from the solid-state laser crystal 41 to the shorter wavelength side, while amplifying the laser light through multiple reflections between the first reflecting mirror 44 and the second reflecting mirror 46. The laser light thus amplified is separated by the laser splitter 47 and output from the laser output section 4.

[0318] In addition, the laser output section 4 includes a Q switch driver 49 that drives the Q switch 43 as a component arranged outside the crystal housing section H12. Figure 13 Illustratively, the Q switch driver 49 is attached to the +X side portion obtained by dividing the top surface 10 u into two portions in the X direction. The Q switch driver 49 is also arranged on the +Y side of the vertical side portion 15 a of the first bottom plate 15 .

[0319] Note that the Q-switch driver 49 may be attached to the left side surface 101 , the rear surface 10b , etc. of the housing 10 . The Q-switch driver 49 may be attached to a plate-like member constituting the outer surface of the housing 10 .

[0320] -First reflecting mirror 44-

[0321] The first reflecting mirror 44 is housed in the Q switch housing H121 and is configured to reflect at least the fundamental wave. The first reflecting mirror 44 constitutes a resonator together with the second reflecting mirror 46. Note that the first reflecting mirror 44 according to this embodiment is configured as a total reflecting mirror that reflects the fundamental wave.

[0322] In addition, the first reflecting mirror 44 according to the present embodiment is attached to the partition surface 15 g defining the crystal housing H12 , and is thermally coupled to the first heat sink 81 via the first base plate 15 .

[0323] -Second reflecting mirror 46-

[0324] The second reflecting mirror 46 is housed in the wavelength conversion unit H122 and is configured to reflect at least the fundamental wave. The second reflecting mirror 46 constitutes a resonator together with the first reflecting mirror 44. Note that the second reflecting mirror 46 according to this embodiment is configured as a total reflection mirror that reflects not only the fundamental wave but also the second harmonic having a higher wavelength than the fundamental wave and the third harmonic having a higher wavelength than the second harmonic.

[0325] In addition, the second reflecting mirror 46 according to the present embodiment is attached to the partition surface 15g similarly to the first reflecting mirror 44, and is thermally coupled to the first heat sink 81 via the first base plate 15. In this way, the first reflecting mirror 44 and the second reflecting mirror 46, which are both ends of the resonant optical path, are preferably positioned by the same first base plate 15 so that the resonant optical path is formed with high accuracy as described above.

[0326] -Q switch 43-

[0327] The Q switch 43 is housed in the Q switch housing H121 and is configured to perform pulse oscillation of the fundamental wave generated by the solid-state laser crystal 41. Specifically, the Q switch 43 is arranged to be located on the optical axis of the resonant optical path (optical path of the resonator) and is inserted between the solid-state laser crystal 41 and the first reflecting mirror 44.

[0328] The Q switch 43 according to this embodiment is a so-called active Q switch that operates based on an RF signal applied from a Q switch driver 49. Specifically, if the Q switch 43 is temporarily turned on, the laser light incident on the Q switch 43 is deflected and separated from the resonant optical path. In this case, multiple reflections of the laser light are limited, thereby promoting the generation of an inverse distribution in the solid-state laser crystal 41.

[0329] Further, if the Q switch 43 is switched from the on state to the off state for a predetermined period, the laser light undergoes multiple reflections without being separated by the Q switch 43 and is amplified by the multiple reflections. In this case, the high-output laser light is pulsed.

[0330] In addition, the Q switch 43 according to the present embodiment is attached to the partition surface 15 g similarly to the first reflecting mirror 44 and the like, and is thermally coupled to the first heat sink 81 via the first base plate 15 .

[0331] -Q switch driver 49-

[0332] The Q switch driver 49 is housed inside the housing 10 and outside the crystal housing H12 , and generates an RF signal to be applied to the Q switch 43 based on a control signal input from the marking machine controller 100 .

[0333] The Q-switch driver 49 is attached to the top surface 10 u via a metal support plate, and is thermally coupled to the housing 10 via the support plate and the top surface 10 u.

[0334] -First deflecting mirror 42-

[0335] The first deflection mirror 42 is housed in the Q-switch housing H121 and is arranged between the Q-switch 43 and the solid-state laser crystal 41 in the X direction. The first deflection mirror 42 according to this embodiment is configured using a so-called beam splitter. The first deflection mirror 42 reflects all of the excitation light incident from the first incident window 91 toward the +Y side so that it propagates in the X direction. On the other hand, the first deflection mirror 42 transmits the fundamental wave propagating in the X direction without reflecting it. The fundamental wave transmitted through the first deflection mirror 42 reaches the first reflection mirror 44 via the Q-switch 43.

[0336] In addition, the first deflecting mirror 42 according to the present embodiment is attached to the partition surface 15 g similarly to the first reflecting mirror 44 and the like, and is thermally coupled to the first heat sink 81 via the first base plate 15 .

[0337] -Solid-state laser crystal 41-

[0338] The solid-state laser crystal 41 is housed in the Q-switch housing H121 and is made of a laser medium capable of forming an inverse distribution. When laser excitation light is incident on its end face, the solid-state laser crystal 41 is configured to perform stimulated emission corresponding to the incident laser excitation light. The wavelength of photons emitted by stimulated emission (the so-called fundamental wavelength) increases or decreases depending on the specific configuration of the solid-state laser crystal 41, but in this embodiment, it is within the infrared range of approximately 1 μm.

[0339] In this embodiment, rod-shaped Nd:YVO4 (yttrium vanadate) is used as a laser medium constituting the solid-state laser crystal 41. Laser excitation light is incident from one end face of the rod-shaped solid-state laser crystal 41, and laser light having a fundamental wavelength (so-called fundamental wave) is emitted from the other end face (so-called unidirectional excitation scheme by end face pumping). In this embodiment, the fundamental wavelength is set to 1064 nm. On the other hand, the wavelength of the excitation light is set near the center wavelength of the absorption spectrum of Nd:YVO4 in order to promote stimulated emission. However, for example, rare earth-doped YAG, YLF, GdVO4, etc. can be used as other laser media without being limited to this example. Various solid-state laser media can be used according to the application of the laser processing device L.

[0340] In addition, the solid-state laser crystal 41 according to the present embodiment is attached to the partition surface 15 g similarly to the first reflecting mirror 44 and the like, and is thermally coupled to the first heat sink 81 via the first base plate 15 .

[0341] -Nonlinear Optical Crystal 45-

[0342] The nonlinear optical crystal 45 is configured by combining a first wavelength conversion element 45a that receives the fundamental wave generated by the solid-state laser crystal 41 and generates a second harmonic having a wavelength higher than that of the fundamental wave, and a second wavelength conversion element 45b that generates a third harmonic having a wavelength higher than that of the second harmonic. Both the first wavelength conversion element 45a and the second wavelength conversion element 45b are housed in the wavelength conversion section H122.

[0343] The first wavelength conversion element 45a is a nonlinear optical crystal capable of generating second harmonics. When a fundamental wave is incident, it doubles the frequency of the fundamental wave and emits the fundamental wave as a second harmonic (second harmonic generation: SHG). Specifically, the wavelength of the laser light generated when the fundamental wave is incident on the first wavelength conversion element 45a is within the visible light region of approximately 500 nm. Specifically, in this embodiment, the wavelength of the second harmonic is set to 532 nm.

[0344] Generally, the conversion efficiency of the first wavelength conversion element 45a is lower than 100%. Therefore, when the fundamental wave is incident on the first wavelength conversion element 45a, laser light in which the fundamental wave and the second harmonic are mixed is emitted.

[0345] Note that in this embodiment, LBO (LiB 3 O 3 ) is used as the first wavelength conversion element 45 a . However, various organic nonlinear optical materials, inorganic nonlinear optical materials, etc. can be used as the first wavelength conversion element 45 a without being limited to this example.

[0346] The second wavelength conversion element 45b is a nonlinear optical crystal capable of generating a third harmonic. When the fundamental wave and the second harmonic are incident (particularly when the propagation directions of the fundamental wave and the second harmonic are the same), the second harmonic is converted into a third harmonic having a frequency three times that of the fundamental wave and emitted (third harmonic generation: THG). Specifically, the wavelength of the laser light generated when the fundamental wave and the second harmonic are incident on the second wavelength conversion element 45b is in the ultraviolet region of approximately 350 nm (specifically, near the boundary between the visible light region and the ultraviolet region). In particular, in this embodiment, the wavelength of the third harmonic is set to 355 nm.

[0347] Generally, the conversion efficiency of the second wavelength conversion element 45b is lower than 100%. Therefore, when the fundamental wave and the second harmonic are incident on the first wavelength conversion element 45a, laser light in which the fundamental wave, the second harmonic, and the third harmonic are mixed is emitted.

[0348] Note that in this embodiment, LBO (LiB 3 O 3 ) is used as the second wavelength conversion element 45 b . However, various organic nonlinear optical materials, inorganic nonlinear optical materials, etc. can be used as the second wavelength conversion element 45 b without being limited to this example.

[0349] In addition, the nonlinear optical crystal 45 according to the present embodiment is attached to the partition surface 15 g similarly to the first reflecting mirror 44 and the like, and is thermally coupled to the first heat sink 81 via the first base plate 15 .

[0350] -Laser separation unit 47-

[0351] The laser light separation section 47 is housed in the wavelength conversion section H122 and is configured to separate the third harmonic from the resonance optical path of the laser light to generate UV laser light for laser processing.

[0352] The laser separation unit 47 includes a plurality of optical components. Specifically, the laser separation unit 47 according to this embodiment includes: a first separator 47a for extracting the second harmonic and the third harmonic from the laser light; a concave lens 47b for adjusting the beam diameter of the laser light including the second harmonic and the third harmonic; and a second separator 47c for extracting the third harmonic from the laser light.

[0353] The first splitter 47a is a so-called beam splitter, and is configured to transmit the fundamental wave and reflect the second and third harmonics. The first splitter 47a is arranged to intersect the optical axis of the resonant optical path connecting the first reflector 44 and the second reflector 46, and is tilted approximately 45 degrees relative to the optical axis. The laser light reflected by the first splitter 47a propagates toward the -Z side.

[0354] The concave lens 47b is configured to transmit the laser light reflected by the first splitter 47a, that is, the laser light separated from the resonant optical path, thereby expanding the beam diameter of the transmitted laser light. In this embodiment, the concave lens 47b is inserted between the first splitter 47a and the second splitter 47c, but is not limited to this arrangement.

[0355] Second splitter 47c is a beam splitter similar to first splitter 47a, and is configured to transmit the second harmonic and reflect the third harmonic. Second splitter 47c is arranged to intersect the optical axis of the laser light that has passed through concave lens 47b, and is tilted approximately 45 degrees relative to the optical axis. The laser light reflected by second splitter 47c propagates toward the -X side.

[0356] In addition, the optical components constituting the laser separation section 47 are attached to the separation surface 15g similarly to the first reflection mirror 44 and the like, and are thermally coupled to the first heat sink 81 via the first base plate 15 (see also FIG. Figure 10 ).

[0357] In this way, preferably, the first reflecting mirror 44, the second reflecting mirror 46, the Q switch 43, the first deflecting mirror 42, the solid-state laser crystal 41, the nonlinear optical crystal 45 and the laser separation part 47 are all positioned by the same first base plate 15 so as to generate laser light with high accuracy in the optical path.

[0358] -Second deflecting mirror 48-

[0359] The second deflection mirror 48 is housed in the wavelength conversion unit H122 and is arranged on the -X side relative to the other optical components housed in the crystal housing H12. The second deflection mirror 48 according to this embodiment is configured using a so-called beam splitter. The second deflection mirror 48 reflects the laser light that has passed through the second splitter 47c and propagated toward the -X side. The laser light reflected by the second deflection mirror 48 is deflected so as to propagate toward the -Y side.

[0360] In addition, the second deflecting mirror 48 according to the present embodiment is attached to the partition surface 15g similarly to the first reflecting mirror 44 and the like, and is thermally coupled to the first heat sink 81 via the first base plate 15. In this way, the second deflecting mirror 48 that emits laser light from the laser output section 4 to the outside is preferably positioned via the first base plate 15 similarly to the first reflecting mirror 44 and the like in order to improve the accuracy of the position at which the generated laser light is output.

[0361] Finally, the laser light deflected by the second deflection mirror 48 passes through the second incident window 92 and enters the first housing 50 from the laser output portion 4. Figure 11 For example, the laser beam entering the first housing 50 propagates toward the −Y side and reaches the third deflecting mirror 56 of the laser scanning unit 5 .

[0362] (Laser scanning unit 5)

[0363] In addition to the above-mentioned first scanner 51 and second scanner 52, the first control board 53 and second control board 54, the laser scanning unit 5 also includes an intermediate deflection unit 55, a third deflection mirror 56, a defocusing lens 57 as an optical element, and a first housing 50 that accommodates at least the first mirror 51a of the first scanner 51 and the second mirror 52a of the second scanner 52.

[0364] Hereinafter, these constituent elements will be described in the order in which the laser light arrives during laser oscillation.

[0365] -Third deflecting mirror 56-

[0366] like Figure 11 For example, the third deflection mirror 56 is housed in the first housing 50 and is arranged side by side with the second deflection mirror 48 and the second incident window 92 along the Y direction, and is located on the -Y side of these components. The third deflection mirror 56 is arranged between the second incident window 92 and the light source control board 24 in the Y direction (in other words, on the -Y side of the second incident window 92 and on the +Y side of the light source control board 24).

[0367] The third deflecting mirror 56 is configured using, for example, a total reflection mirror. It receives the laser light that enters the first housing 50 and propagates toward the -Y side and reflects the laser light toward the +X side. The laser light reflected by the third deflecting mirror 56 reaches the second mirror 52a of the second scanner 52. Note that the third deflecting mirror 56 can be configured using a mirror that partially transmits the laser light, rather than a total reflection mirror. In this case, the partially transmitted laser light can be used to detect the output of the laser light that enters the first housing 50 from the laser output unit 4.

[0368] -Second scanner 52-

[0369] like Figure 14 、 Figure 15 and Figure 16 For example, the second scanner 52 includes a second mirror 52a for scanning laser light in a predetermined second direction and a second motor 52b for rotatably supporting the second mirror 52a. The second mirror 52a is housed in the mirror housing H11, and the second motor 52b is mostly housed in the board housing H13.

[0370] The second mirror 52a is configured as a so-called galvanometer mirror. Figure 11 The illustrated third deflecting mirror 56 and the like receive laser light generated by the solid-state laser crystal 41. The second mirror 52a deflects the received laser light by reflecting it toward the +Z side. When the second mirror 52a rotates, the irradiation position of the laser light in the irradiation region R1 is scanned in the second direction.

[0371] Here, the second direction as the deflection direction of the second mirror 52a is a direction orthogonal to both the first direction as the deflection direction of the first mirror 51a of the first scanner 51 and the -Z direction as the irradiation direction, and is set to coincide with the X direction in this embodiment.

[0372] Specifically, the second mirror 52a is a fully reflective mirror having a generally rectangular plate shape and is housed within the mirror housing H11, supported by the distal end of the rotation axis of the second motor 52b. The second mirror 52a rotates integrally with the shaft of the second motor 52b and is configured to be rotated about a predetermined second rotation axis Ac2 by the second motor 52b. The deflection amount of the second mirror 52a and the irradiation position of the laser light in the second direction are determined based on the rotation angle of the second mirror 52a about the second rotation axis Ac2.

[0373] Here, if Figure 14 and Figure 15 For example, the second rotation axis Ac2 as the rotation center of the second mirror 52a extends orthogonally to the first rotation axis Ac1 as the rotation center of the first mirror 51a and the Z direction as the irradiation direction, and is provided to extend along the Y direction in this embodiment.

[0374] The second mirror 52a is also arranged side by side with the third deflecting mirror 56 along the X direction, and is located on the +X side of the third deflecting mirror 56. The second mirror 52a is further located on the -Y side of the first mirror 51a and the defocusing lens 57 in the Y direction, and is located on the -Z side of the first mirror 51a and the defocusing lens 57 in the Z direction.

[0375] The second motor 52b is a current motor configured using a DC motor or the like, and is formed into a generally cylindrical shape centered on the second rotation axis Ac2. The distal end (+Y side end) of the second motor 52b in the direction of the second rotation axis Ac2 (the Y direction) is inserted into the sixth through-hole 50c of the first housing 50. On the other hand, the other end (-Y side end of the second motor 52b) located opposite the distal end in the direction of the second rotation axis Ac2 protrudes from the sixth through-hole 50c and is exposed within the board receiving portion H13.

[0376] The second scanner 52 reflects the laser light through the second mirror 52a. The laser light reflected by the second mirror 52a is emitted from the exit window 6 via the intermediate deflection unit 55, the first mirror 51a, and the defocusing lens 57. At this time, the second scanner 52 can scan the irradiation area R1 with the laser light in the second direction (X direction) by adjusting the reflection angle of the laser light through the second motor 52b.

[0377] -Intermediate deflecting portion 55-

[0378] like Figure 14 、 Figure 15 and Figure 16 For example, the intermediate deflecting unit 55 includes an intermediate mirror 55a that relays laser light between the second mirror 52a and the first mirror 51a, and a base 55b that supports the intermediate mirror 55a. The intermediate mirror 55a and the base 55b are both housed in the mirror housing H11.

[0379] The intermediate mirror 55a is configured using, for example, a total reflection mirror. The intermediate mirror 55a allows the laser light reflected by the second mirror 52a to enter and reflects it toward the first mirror 51a.

[0380] The intermediate mirror 55a is also arranged side by side with the second mirror 52a in the Z direction and on the +Z side of the second mirror 52a. The intermediate mirror 55a is further arranged side by side with the first mirror 51a in the Y direction and on the -Y side of the first mirror 51a.

[0381] The intermediate mirror 55 a receives the laser light reflected by the second mirror 52 a and propagating toward the +Z side, and reflects the laser light toward the +Y side. The laser light reflected by the intermediate mirror 55 a reaches the first mirror 51 a of the first scanner 51 .

[0382] The base 55b is arranged at the bottom of the first housing 50 and supports the intermediate mirror 55a from the +Z side. The base 55b according to the present embodiment supports the intermediate mirror 55a so as to guide the mirror surface toward the +Y side and the -Z side.

[0383] -First Scanner 51-

[0384] like Figure 14 、 Figure 15 and Figure 16 For example, the first scanner 51 includes a first mirror 51a for scanning laser light in a predetermined first direction and a first motor 51b for rotatably supporting the first mirror 51a. The first mirror 51a is housed in a mirror housing H11, and the majority of the first motor 51b is housed in a board housing H13.

[0385] The first mirror 51a is configured as a so-called galvanometer mirror. The first mirror 51a receives the laser light reflected by the intermediate mirror 55a. The first mirror 51a reflects the received laser light toward the +Z side, thereby deflecting the laser light. As the first mirror 51a rotates, the laser light irradiation position in irradiation area R1 is scanned in the first direction.

[0386] Here, the first direction as the deflection direction of the first mirror 51a is a direction orthogonal to both the second direction and the Z direction as the irradiation direction, as shown in FIG. Figure 14 and Figure 15 exemplified, and in this embodiment is arranged to be consistent with the Y direction.

[0387] Note that the first direction and the second direction are not limited to the arrangement of this embodiment. The first direction may coincide with the X direction, the second direction may coincide with the Y direction, or the first direction and the second direction may be inclined relative to the X direction and the Y direction, respectively.

[0388] Specifically, the first mirror 51a is a fully reflective mirror having a generally rectangular plate shape and is housed within the mirror housing H11, supported by the distal end of the rotation axis of the first motor 51b. The first mirror 51a rotates integrally with the shaft of the first motor 51b and is configured to be rotated about a predetermined first rotation axis Ac1 by the first motor 51b. The deflection amount of the first mirror 51a and the irradiation position of the laser light in the first direction are determined based on the rotation angle of the first mirror 51a about the first rotation axis Ac1.

[0389] Here, the first rotation axis Ac1 as the rotation center of the first mirror 51a extends orthogonally to the second rotation axis Ac2 as the rotation center of the second mirror 52a and the -Z direction as the irradiation direction, and is provided to extend along the X direction in this embodiment.

[0390] With this arrangement, both the first rotation axis Ac1 and the second rotation axis Ac2 extend in a direction different from the irradiation direction (e.g., a direction orthogonal to the irradiation direction (X direction or Y direction)). Note that the configuration in which the first rotation axis Ac1 and the second rotation axis Ac2 are orthogonal to the irradiation direction is not essential, and an inclination angle of, for example, within 20 degrees relative to the X direction or the Y direction may be provided.

[0391] In addition, in this embodiment, the first rotation axis Ac1 is offset to the +Z side relative to the second rotation axis Ac2, but the first rotation axis Ac1 and the second rotation axis Ac2 can be arranged on the same plane depending on the configuration of the intermediate mirror 55a.

[0392] The first mirror 51a is also arranged side by side with the intermediate mirror 55a along the Y direction and is located on the +Y side of the intermediate mirror 55a. The first mirror 51a is further arranged side by side with the cover glass 62 and the defocus lens 57 along the Z direction and is located on the -Z side of the defocus lens 57. As a result of this configuration, the first mirror 51a according to this embodiment is arranged to face the workpiece W and the irradiation region R1, with the exit window 6 interposed therebetween. The first mirror 51a is located directly above the exit window 6, with no other reflective mirror interposed between the first mirror 51a and the exit window 6. Although in this embodiment, the first mirror 51a is defined under the assumption that no reflective mirror is interposed between the first mirror 51a and the exit window 6 for ease of description, the insertion of a specific reflective mirror between the first mirror and the exit window 6 is not excluded. In the case where a reflective mirror is interposed between the first mirror 51a and the exit window 6, the mirror that scans the irradiation position in the irradiation region R1 immediately before reaching the irradiation region R1 is considered to be the first mirror 51a. Note that due to the rotation of the second mirror 52a and the rotation of the first mirror 51a, the area through which the laser light passes expands between the first mirror 51a and the exit window 6. Therefore, the inserted reflective mirror has a size sufficient to cover the area through which the laser light passes. Therefore, it is preferable that the reflective mirror is not inserted between the first mirror 51a and the exit window 6 in order to reduce the size of the marking head 1.

[0393] The first motor 51b is a current motor configured using a DC motor or the like, and is formed into a generally cylindrical shape centered on the first rotation axis Ac1. The distal end (-X end) of the first motor 51b in the direction of the first rotation axis Ac1 (the X direction) is inserted into the seventh through-hole 50d of the first housing 50. Meanwhile, the other end (+Y end) of the first motor 51b, located opposite the distal end in the direction of the first rotation axis Ac1, protrudes from the seventh through-hole 50d and is exposed within the board receiving portion H13.

[0394] The first scanner 51 reflects the laser light through the first mirror 51 a. The laser light reflected by the first mirror 51 a passes through the defocusing lens 57 and is emitted from the exit window 6. At this time, the first scanner 51 can scan the irradiation area R1 with the laser light in the first direction (Y direction) by adjusting the reflection angle of the laser light by the first motor 51 b.

[0395] -Defocus lens 57-

[0396] The defocus lens 57 is configured to transmit the laser light deflected by the first mirror 51a and diffuse the laser light in an outward direction orthogonal to the irradiation direction. When the Z direction is the irradiation direction as in this embodiment, the outward direction as the diffusion direction is a direction along the XY plane.

[0397] Specifically, the defocus lens 57 may include, for example, a biconcave lens. In this case, the defocus lens 57 is fitted in the fifth through hole 50b with its central axis along the Z direction.

[0398] The defocusing lens 57 is also arranged in a straight line connecting the first mirror 51 a and the central portion of the cover glass 62 in the exit window 6. The defocusing lens 57 is arranged between the first mirror 51 a and the cover glass 62 in the Z direction (in other words, on the +Z side of the first mirror 51 a and on the −Z side of the cover glass 62).

[0399] The defocus lens 57 is further arranged so that the optical axis of the defocus lens 57 is coaxial with the optical axis of the cover glass 62. Hereinafter, the optical axes of the defocus lens 57 and the cover glass 62 are collectively referred to as "laser emission axis", which is denoted by reference symbol A1 (see also Figure 4 The laser emission axis A1 is configured to extend along the Z direction, and is offset toward the +Y side relative to the second mirror 52a and the intermediate mirror 55a, and intersects the mirror surface of the first mirror 51a.

[0400] Note that the configuration of the defocus lens 57 as an optical element is not limited to a configuration using a single biconcave lens. The optical element may be configured using a plurality of lenses, or may be configured using a lens other than a biconcave lens. Furthermore, the laser scanning unit 5 may be configured without using the defocus lens 57.

[0401] -Second control board 54-

[0402] The second control board 54 is electrically connected to the marking machine controller 100 and the second scanner 52 and is configured to control the second scanner 52. More specifically, the second control board 54 can control the rotation angle of the second mirror 52a by driving the second motor 52b according to a control signal input from the marking machine controller 100.

[0403] The second control board 54 according to this embodiment is configured using a circuit board having a generally rectangular thin plate shape. The second control board 54 is housed in the board housing H13 with its front and rear surfaces extending in the Z and X directions, and is fastened to the vertical side portion 17a of the third base plate 17, for example, from the -Y side.

[0404] like Figure 12 As shown, the second control board 54 is arranged on the +X side of the light source control board 24 in the X direction and on the -Y side of the first housing 50 and the light source control board 24 in the Y direction. The second control board 54 is also electrically connected to the second motor 52b through wiring (not shown).

[0405] -First control board 53-

[0406] The first control board 53 is electrically connected to the marking machine controller 100 and the first scanner 51 and is configured to control the first scanner 51. More specifically, the first control board 53 can control the rotation angle of the first mirror 51a by driving the first motor 51b according to a control signal input from the marking machine controller 100.

[0407] The first control board 53 according to this embodiment is configured using a circuit board having a generally rectangular thin plate shape. The first control board 53 is housed in the board housing H13 with its front and rear surfaces extending in the Z and X directions, and is fastened to the vertical side portion 17a of the third base plate 17, for example, from the -Y side.

[0408] like Figure 12 As shown, the first control board 53 is also arranged side by side with the second control board 54 in the X direction and is located on the +X side of the light source control board 24 and the second control board 54. The first control board 53 is also electrically connected to the first motor 51b through wiring (not shown).

[0409] <Main Operation and Main Processing of Laser Processing Device L>

[0410] Figure 19 is a flowchart illustrating a basic control process of the laser processing device L. Figure 19 The main operation and main processing of the laser processing device L are described.

[0411] First, in Figure 19 In step S1, an input of a processing pattern Pp to be printed on the installation plane R2, displayed on the display unit 301, is received. This input is received by the receiving unit 101 and read by the control unit 103. The control unit 103 generates print data based on the input processing pattern Pp. The print data includes a trajectory (so-called scan line) of the laser beam on the workpiece W set according to the processing pattern Pp.

[0412] In the subsequent step S2, the control section 103 sets the voltage (power supply voltage) to be supplied to the excitation light source 21. Figure 20 and Figure 21 Describe the details of the setting.

[0413] In subsequent step S3 , the control section 103 inputs a control signal to the light source control board 24 and the like so that power is supplied to the excitation light source 21 . Thus, excitation light is generated in the excitation light generating section 2 and input to the laser output section 4 .

[0414] In the subsequent step S4 , when the control unit 103 inputs a control signal to the Q switch driver 49 , etc., the Q switch 43 is controlled to be turned on and off, thereby pulsating the UV laser. The laser light is output from the laser output unit 4 and input to the laser scanning unit 5 .

[0415] In the subsequent step S5, the control unit 103 inputs a control signal to the first control board 53, the second control board 54, etc., so that two-dimensional scanning using the UV laser is performed. The two-dimensional scanning mentioned herein means that the irradiation position of the laser light moves in a two-dimensional direction (i.e., in this embodiment, along the XY plane). Note that the shape of the workpiece W irradiated with the laser light is not limited to a two-dimensional shape along the XY plane, but can also be a three-dimensional shape with different positions in the Z direction (a shape with varying height in the Z direction).

[0416] At this time, the UV laser light deflected by the second mirror 52a is reflected by the intermediate mirror 55a and then deflected again by the first mirror 51a in the laser scanning section 5. Figure 10 and Figure 18 For example, the UV laser light deflected by the first mirror 51 a sequentially passes through the defocusing lens 57 and the cover glass 62, and then passes through the aforementioned optical path defining portion H3, thereby being emitted to the outside of the housing 10. The UV laser light emitted to the outside of the housing 10 is emitted toward an irradiation region R1 provided on the workpiece W. The UV laser light emitted onto the workpiece W is two-dimensionally scanned in the irradiation region R1 to outline a scan line according to the print data.

[0417] <Countermeasures against Heat Generation in the Excitation Light Source 21>

[0418] Figure 20 is a block diagram for describing a circuit configuration according to the power supply section 104, and Figure 21 : is a flowchart illustrating a control process according to the power supply section 104. As described so far, the excitation light source 21 is configured to be supplied with electric power from the power supply section 104 as a power source.

[0419] Specifically, the power supply section 104 according to the present embodiment includes: a DC power supply 104a that converts AC power supplied from the outside into DC power and outputs the DC power; and a DC / DC converter 104b that performs DC / DC conversion on the power output from the DC power supply 104a. Figure 20 The power (particularly, DC power) converted by the DC / DC converter 104 b is input to the excitation light source 21 configured using an LD.

[0420] Here, a relay 25 is inserted between the DC / DC converter 104b and the excitation light source 21. The relay 25 opens and closes the electrical contact between the DC / DC converter 104b and the excitation light source 21.

[0421] The relay 25 can be configured using, for example, a field effect transistor (FET). The relay 25 according to the present embodiment includes a FET and opens and closes an electrical contact based on a control signal input from the PLC 902 or the control section 103 via the light source control board 24.

[0422] Conventionally, the output voltage input from the DC / DC converter 104b to the excitation light source 21 via the relay has a fixed value. Furthermore, variations in the forward voltage (so-called Vf) of the excitation light source 21 cause heat generation in the relay 25. Note that variations in Vf can be caused by, for example, variations in the quality of the excitation light source 21 itself, and variations in the Vf required to output a specific laser beam. Therefore, in order to ensure the minimum output of the laser beam even in the worst case, it is necessary to provide a margin for the output of the DC / DC converter 104b (in other words, to set the output voltage of the DC / DC converter 104b to a large value).

[0423] However, in the case of using this conventional configuration, the amount of heat generated in the relay 25 tends to increase. This results in an increase in the size of a heat generating structure such as a heat sink, which may cause trouble when the excitation light source 21 is built into the marking head 1.

[0424] Therefore, the control section 103 according to the present embodiment controls the output voltage output from the power supply section 104 as a power source and input to the excitation light source 21. Therefore, in the present embodiment, the control section 103 and the DC / DC converter 104b are electrically connected, as shown in FIG. Figure 20 exemplified, and the output (output voltage) from the DC / DC converter 104 b is adjusted based on the control signal output from the control section 103 .

[0425] Furthermore, the control unit 103 according to the present embodiment detects a voltage drop occurring in the relay 25 and controls the output voltage based on the detected voltage drop. Specifically, the control unit 103 controls the output voltage so that the detected voltage drop becomes a predetermined value. Figure 20For example, in this embodiment, a first monitoring circuit 26 is provided to monitor the voltage on the upstream side of the relay 25, and a second monitoring circuit 27 is provided to monitor the voltage on the downstream side of the relay 25. The control unit 103 can estimate the voltage drop generated in the relay 25 by calculating the difference between the voltage monitored by the first monitoring circuit 26 and the voltage monitored by the second monitoring circuit 27.

[0426] In addition, the "predetermined value" as a criterion for determining the voltage drop can be set to, for example, 2.5 V in a state where 1 ampere has flowed through the excitation light source 21. Note that the setting of the predetermined value is pre-stored in the storage section 102 and is configured to be read by the control section 103 when necessary.

[0427] As described above, when the predetermined value is set to 2.5 V, the control section 103 adjusts the output voltage of the DC / DC converter 104 b so that the voltage drop generated in the relay 25 becomes 2.5 V. With this configuration, it is not necessary to provide a margin for the output voltage of the DC / DC converter 104 b, whereby the output voltage can be suppressed, and the generation of heat in the relay 25 can be suppressed.

[0428] Figure 21 is a flowchart illustrating a control process related to the power supply unit 104. This control process can be performed, for example, Figure 19 The control process is performed in step S2 during the control process.

[0429] First, in Figure 21 In step S101, the control section 103 inputs a control signal to the relay 25 via the light source control board 24 to electrically connect the DC / DC converter 104b and the excitation light source 21. Further, the control section 103 inputs a control signal to the power supply section 104, and supplies the output voltage of the DC / DC converter 104b to the excitation light source 21 via the relay 25.

[0430] In the subsequent step S102 , the control portion 103 detects a voltage drop generated in the relay 25 based on the detection signals of the first monitoring circuit 26 and the second monitoring circuit 27 .

[0431] In the subsequent step S103, the control section 103 determines whether the voltage drop detected in step S102 is consistent with the predetermined value set as described above. When the determination is no, the control section 103 advances the control process to step S105, adjusts the output voltage from the DC / DC converter 104, and returns to step S101. That is, the control section 103 is configured to repeat the processing according to steps S101 to S103 and step S105 until the voltage drop is consistent with the predetermined value. Note that in the present embodiment, the control section 103 determines whether the voltage drop generated in the relay 25 is consistent with the predetermined value ( Figure 21), but the present disclosure is not limited thereto. For example, it may be determined whether the voltage drop falls within a specific range above and below a predetermined value. In short, the control unit 103 may control the output voltage based on the detected voltage drop.

[0432] On the other hand, when the determination in step S103 is YES, the control section 103 advances the control process to step S104 and ends the adjustment (output determination) of the output of the DC / DC converter 104. In this case, the control section 103 ends Figure 21 The process illustrated in the example and make the control process from Figure 19 The process proceeds from step S2 to step S3. The same subsequent processing as above is performed.

[0433] <Lighting Control of Indicator 11>

[0434] As described above, the first, second, and third lamps 11a, 11b, and 11c that comprise the indicator 11 illuminate in response to control signals input from the marking machine controller 100. For example, when the marking head 1 is powered on, the first lamp 11a illuminates. Meanwhile, the second lamp 11b illuminates in accordance with UV laser standards, and the third lamp 11c illuminates based on the status of the laser processing device L (such as the UV laser irradiation status and whether an error has occurred in the marking head 1). Details of the lamp status are exemplified in Table 1.

[0435] Specifically, when the key switch is in the "off" state (KSW: OFF), the marking machine controller 100 turns off all of the first lamp 11a, the second lamp 11b, and the third lamp 11c.

[0436] When the key switch is in the “power on” state (KSW: Power On), the marking machine controller 100 causes only the first lamp 11 a to emit blue light, and turns off the second lamp 11 b and the third lamp 11 c.

[0437] When the key switch is in the “laser on” state (Laser On (KSW)), the marking machine controller 100 causes the first lamp 11 a to emit blue light, causes the second lamp 11 b to emit green light, and maintains the third lamp 11 c in an off state.

[0438] When the marking head 1 is ready to emit UV laser light (ready state), the marking machine controller 100 causes the first lamp 11 a to emit blue light, and causes the second lamp 11 b and the third lamp 11 c to emit green light.

[0439] While UV laser light is being emitted from the marking head 1 (during laser irradiation), the marking machine controller 100 causes the first lamp 11 a to emit blue light, the second lamp 11 b to emit yellow light, and the third lamp 11 c to emit green light.

[0440] When a warning that needs to be notified to the user occurs in the laser processing device L (a warning error occurs), the marking machine controller 100 causes the first lamp 11 a to emit blue light, the second lamp 11 b to emit green light, and the third lamp 11 c to emit orange light.

[0441] When any abnormality occurs in the laser processing device L (an abnormal error occurs), the marking machine controller 100 causes the first lamp 11 a to emit blue light, the second lamp 11 b to emit green light, and the third lamp 11 c to emit red light.

[0442] When the laser processing device L is in an interlocked state (for example, when the safety junction box is closed), the marking machine controller 100 causes the first lamp 11 a to emit blue light, turns off the second lamp 11 b , and causes the third lamp 11 c to emit red light.

[0443] In this way, by controlling the light state of the indicator 11 provided on the front surface 10 f of the housing 10 , the user can intuitively and visually recognize the state of the laser processing device L.

[0444]

Table 1

[0445]

[0446] <Setting of Processing Equipment 500 and Marking Head 1>

[0447] Figure 18 5 is a diagram for describing various sizes of the marking head 1 and the support member 501. Figure 17A and Figure 17B As shown, the marking head 1 is attached to the support member 501 of the processing equipment 500 by replacing it with a printing device 1001 such as a TTO. The marking head 1 attached to the support member 501 irradiates a workpiece W made of a sheet film with UV laser light to cause a chemical reaction in the UV reactive layer included in the workpiece W, thereby performing printing on the workpiece W.

[0448] The processing device 500 and the marking head 1 according to this embodiment are configured to be suitable for this usage mode.

[0449] First, the processing equipment 500 according to this embodiment includes, in addition to the conveying roller 502 that is driven to convey the workpiece W,: a first driven roller 504l, which is arranged on the +Y side of the conveying roller 502, and the workpiece W is placed around the first driven roller from the +Z side; and a second driven roller 504r, which is arranged on the -Y side of the conveying roller 502, and the workpiece W is placed around the second driven roller from the -Z side.

[0450] The transport roller 504 as a driving roller transports the workpiece W at a speed of 1500 mm / s or more and 2000 mm / s or less in the Y direction as the transport direction At. The workpiece W transported by the transport roller 504 moves along a movement path defined by the transport roller 502, the first driven roller 5041, and the second driven roller 504r.

[0451] Here, the path corresponding to the irradiation region R1 in the moving path of the workpiece W includes portions having different distances from the exit window 6. That is, the moving path of the workpiece W is configured to have different heights within the range of the irradiation region R1, such as Figure 18 Example.

[0452] Furthermore, the first driven roller 5041, which is located immediately above and closest to the conveyor roller 502 among the rollers that contact the workpiece W upstream of the conveyor rollers in the workpiece W's travel path, and the second driven roller 504r, which is located immediately below and closest to the conveyor roller 502 among the rollers that contact the workpiece W downstream of the conveyor rollers, are driven rollers that rotate as the workpiece W is conveyed. The rollers immediately above and immediately below the conveyor rollers are not limited to driven rollers, but are preferably rollers that allow the workpiece W to slide significantly relative to the conveyor rollers 502 even when driven by a separate drive source. For example, if the material has a high frictional force relative to the workpiece W, the amount of slippage is small. Furthermore, if the surfaces of the rollers are made of the same material, the amount of slippage decreases as the amount of contact with the workpiece W increases. When the positive upper and lower rollers are constructed using driven rollers or rollers with a large amount of slip relative to the transport roller 502, there is little error in the amount of movement of the workpiece W relative to the rotation of the transport roller 502. Therefore, by executing print control based on the rotation of the transport roller 502, print quality can be improved. In particular, compared to TTO, the marking head 1 of this embodiment performs printing on the workpiece W in a non-contact manner. Therefore, if slip occurs in the transport roller 502, the print position is likely to deviate. Therefore, the marking head 1 is preferably arranged in the irradiation area R1 so that the transport roller is positioned with a small amount of slip relative to the rollers immediately before and after the irradiation area R1.

[0453] Here, the region irradiated with the UV laser corresponding to the irradiation region R1 in the movement path of the workpiece W is arranged to be further separated from the cover glass 62 as the optical member than the end of the second accommodation portion H2 in the protruding direction of the second accommodation portion H2.

[0454] Here, in this embodiment, the protruding direction of the second receiving portion H2 is consistent with the UV laser irradiation direction (ie, the +Z direction). In addition, in this embodiment, the end of the second receiving portion H2 in the protruding direction corresponds to the +Z side end of the housing 10.

[0455] That is, the area of ​​the workpiece W's moving path that is irradiated with the UV laser is located on the +Z side of the +Z side end of the housing 10. In other words, the area of ​​the workpiece W's moving path that is irradiated with the UV laser does not enter the optical path defining portion H3 (which is located on the +Z side of the optical path defining portion H3). This configuration allows the workpiece W to be easily inserted into the moving path from the front side of the moving path. Therefore, it is easy to place the workpiece W in the moving path.

[0456] In addition, if Figure 18 As shown, the vertex 502a of the conveying roller 502 on the cover glass 62 side (-Z side) is offset (offset to the +Y side in the illustrated example) toward the upstream side (+Y side) or downstream side (-Y side) in the conveying direction At that is roughly consistent with the Y direction relative to the center line (laser emission axis Al) penetrating the central part of the cover glass 62.

[0457] That is, the center line Ar extending in the Z direction and passing through the rotation axis of the conveying roller 502 is offset to the upstream or downstream side relative to the laser emission axis A1. In other words, the laser emission axis A1 extending in the Z direction and the rotation axis of the conveying roller 502 extending in the X direction are arranged so as not to intersect with each other.

[0458] In other words, the laser emission axis A1 is offset to the upstream side (+Y side) or downstream side (-Y side) in the transmission direction At relative to the vertex 502a (offset to the -Y side in the illustrated example). Specifically, Figure 18 For example, between the workpiece W located upstream and the workpiece W located downstream relative to the vertex 502a, the latter workpiece W has a smaller inclination relative to the plane (XY plane) perpendicular to the laser emission axis A1. That is, the workpiece W located downstream relative to the vertex 502a is tilted more gently than the workpiece W located upstream. According to this embodiment, the laser emission axis A1 is offset toward the side of the upstream and downstream sides in the transport direction At where the workpiece W has a smaller inclination relative to the plane perpendicular to the laser emission axis A1 (e.g., the downstream workpiece W).

[0459] Note that the size of the irradiation area R1 is set to be larger than the printable area (printing area) in the printing device 1001 before replacement configured as TTO. The TTO brings the printing section 1006 extending in the lateral direction of the workpiece W into contact with the workpiece W to perform printing on the workpiece W. Therefore, even if the printing area on the workpiece W is an area having a certain length in the longitudinal direction of the workpiece W, if there is a positional relationship in which the printable range of the printing section 1006 includes the printing area on the workpiece W in the lateral direction of the workpiece W, printing can be performed on the entire printing area on the workpiece W by passing the workpiece W through the printing section 1006. On the other hand, the portion irradiated with the laser at a certain moment in the marking head 1 has a certain area, but has a point shape. Therefore, when the printing area on the workpiece W is an area having a certain length in the longitudinal direction of the workpiece W, the irradiation area R1 irradiated with the laser preferably has a certain length (size) in the direction corresponding to the longitudinal direction of the workpiece W. Specifically, when the workpiece W is parallel to the XY plane, the size of the irradiation area R1 in the conveying direction At (see Figure 17A Note that the irradiation region R1 in the present embodiment indicates a region on the surface of the workpiece W that can be irradiated with laser light by the first scanner 51 and the second scanner 52.

[0460] In addition, the size of the irradiation area R1 when the workpiece W is parallel to the XY plane is set so that the irradiation area R1 is covered by the bottom surface 10d of the shell 10 in the XY plane. That is, when viewed in the Z direction orthogonal to the XY plane, the entire irradiation area R1 overlaps with the bottom surface 10d, the size L5 of the irradiation area R1 in the Y direction is smaller than the size of the bottom surface 10d of the shell 10 in the Y direction, and the size L6 of the irradiation area R1 in the X direction is smaller than the size of the shell 10 in the X direction. According to this configuration, the laser used to irradiate the workpiece W is less likely to leak to the surroundings. In particular, when the distance from the +Z side end of the shell 10 to the workpiece W (see Figure 18When the distance L2 in the image is set to be greater than or equal to 0 mm and less than or equal to 20 mm, the leakage of the laser is reduced. Furthermore, when the workpiece W is a sheet-like workpiece W that is placed and conveyed around a plurality of conveying rollers, the user can easily set the workpiece W on the moving path of the workpiece W by inserting the workpiece W from the front side of the conveying rollers. Therefore, when the front side of the moving path of the workpiece W is opened, the work of setting the workpiece W in the moving path becomes easy. Therefore, by opening the front side of the moving path according to the structure accommodated in the bottom surface 10d along the X direction according to the full length of the irradiation area R1, the leakage of the laser can be reduced while maintaining the workability of setting the workpiece W. Note that in the case of adopting a structure that uses a member covering the front side of the workpiece W to reduce the leakage of the laser, there is the possibility that when the workpiece W moves obliquely, the workpiece W contacts the member, causing the workpiece W to be contaminated. Thus, according to the structure of opening the front side of the workpiece W, the possibility of contamination of the workpiece W is reduced.

[0461] Note that these settings are particularly effective when printing eight characters on workpiece W by irradiating the workpiece W with UV laser light for 10 ms per character in a 3 mm × 2 mm square. Here, the parameters related to the UV laser are suitable for achieving a line width of 0.2 to 0.35 mm (corresponding to a target line width of 100 to 150 μm for one scan line) by bold printing using three scan lines.

[0462] When the irradiation area R1 is set larger than the printable area in TTO, printing can be performed in the irradiation area R1 while making the irradiation position of the UV laser follow the conveyance of the workpiece W. Therefore, a printable area similar to that in TTO can be ensured.

[0463] On the other hand, the output of the laser light generated by the marking head 1 and passing through the exit window 6 is set to be equal to or greater than 1 W and equal to or less than 2 W. This setting is determined to achieve downsizing of the marking head 1. The color development during printing when the laser light is emitted for a specific period of time varies depending on the power density of the emitted laser light. When the laser light output is equal to or greater than 1 W and equal to or less than 2 W, the laser light spot diameter is preferably 160 μm or less to achieve sufficient color development.

[0464] More preferably, the spot diameter of the laser light in irradiation region R1 is set to be greater than or equal to 60 μm and less than or equal to 80 μm. The spot diameter can be set so that the focal depth of the laser light corresponds to the portion of irradiation region R1 having the longest optical path length of the laser light (the end portion of irradiation region R1) and the portion of irradiation region R1 having the shortest optical path length (the central portion of irradiation region R1).

[0465] For example, the lower limit value of the spot diameter is a setting corresponding to the number and line width of the above-mentioned scanning lines. In this setting, when the distance from the +Z side end of the housing 10 to the workpiece W (see Figure 18 When the distance L2 in the image is set to be greater than or equal to 0 mm and less than or equal to 20 mm, the size of the irradiation area R1 is set to 120 mm or larger, which is advantageous in suppressing the influence of the optical path length difference between the central part and the end part of the irradiation area R1 without adjusting the focus along the Z direction.

[0466] On the other hand, the upper limit of the spot diameter is advantageous when performing boldface printing with a thickness of 200 μm (0.2 mm) or greater (such as the line width of 0.2 to 0.35 mm described above). In this case, there is a problem that the processing time required for boldface processing becomes relatively long. However, by setting the upper limit of the spot diameter as described above, the irradiation area R1 of the UV laser can be made larger, and the irradiation time can be prolonged.

[0467] Note that the upper limit of the spot diameter (80 μm) is the optimal value when the UV laser is emitted parallel to the irradiation direction and the distance L2 is set to 10 mm. When the distance L2 varies within the range of 0 mm to 20 mm, the upper limit of the spot diameter is 120 μm.

[0468] Note that when there is a problem regarding the optical path length difference in the irradiation region R1, the depth of focus can be made deeper by providing the above-described defocus lens 57. Making the depth of focus deeper is advantageous in suppressing the influence of the optical path length difference.

[0469] In addition, in the relative position of the workpiece W with respect to the housing 10, in particular, the relative position at which printing can be performed with respect to the workpiece W is set so that the distance from the first mirror 51a to the surface of the workpiece W (particularly, the distance when viewed along the irradiation direction, and corresponding to Figure 19 The sum of the distance L2 and the distance L3) is 150 mm or less.

[0470] Note that in addition to the above distances, in this embodiment, the distance from the top surface 10u of the housing 10 to the workpiece W is set to 195 mm or less. The TTO, which is the printing device 1001 before replacement, is often used in an environment where the distance from the top surface to the workpiece W is approximately 200 mm, and can be used in environments similar to the environment of the printing device 1001 before replacement. Specifically, in this embodiment, the distance L1 from the top surface 10u of the housing 10 to the +Z side end of the bottom surface 10d is set to 165 mm. Furthermore, the distance L2 from the +Z side end of the bottom surface 10d to the workpiece W is preferably set to 30 mm or less, and more preferably to 20 mm or less.

[0471] Here, when the distance L2 is set to 30 mm or less, the regularly reflected light of the laser light used to irradiate the irradiation area R1 and generated by the workpiece W can be guided to the area between the first plate-shaped member 181 and the second plate-shaped member 18r (i.e., the optical path defining portion H3). This is advantageous in suppressing the regularly reflected light from leaking to the outside of the housing 10.

[0472] In addition, in this embodiment, the distance L3 from the first mirror 51a to the +Z side end of the bottom surface 10d is set to 123 mm. Furthermore, the distance L4 from the lower surface of the defocus lens 57 to the +Z side end of the bottom surface 10d is set to 100 mm. Here, considering that the thickness of the defocus lens 57 is 2 mm, the distance (not shown) from the upper surface of the defocus lens 57 to the +Z side end of the bottom surface 10d is set to 102 mm.

[0473] Here, the distance from the top surface 10u to the first mirror 51a (= L1-L3) is 42mm, and the distance from the top surface 10u to the defocus lens 57 (= L1-L4) is 65mm. On the other hand, when viewed from the top surface 10u, the center portion of the housing 10 in the Z direction corresponds to a position approximately 82mm (= L1 / 2). Therefore, according to this embodiment, the first mirror 51a and the defocus lens 57 are both located on the -Z side of the center portion of the housing 10 in the Z direction.

[0474] <Positional Relationship Between Housing 10, Support Member 501, and Workpiece W>

[0475] As described above, according to the present embodiment, the attachment surface of the housing 10 is formed on the opposite side of the exit window 6 (see FIG. Figure 17A (see lower figure). In the housing 10, rather than the bottom surface 10d forming the exit window 6, the top surface 10u facing the opposite side is configured to be attached to the attachment target position as the attachment surface, so that the housing 10 can be supported so as to be suspended from the attachment target position. This eliminates the need to insert the support member 501 between the housing 10 and the workpiece W, thereby allowing the housing 10 and the workpiece W to be brought close to each other.

[0476] At this time, the support member 501 for supporting the housing 10 is located on the opposite side of the exit window 6 similarly to the attachment target position, and can thus be sufficiently separated from the workpiece W. This makes it possible to suppress interference between the support member 501 and the workpiece W while bringing the housing 10 and the workpiece W close to each other.

[0477] In addition, if Figure 10 、 Figure 13As shown in the example of FIG. 1 , a gap is provided between the first base plate 15 and the top surface 10 u serving as the attachment surface, so that the solid-state laser crystal 41 can be suppressed from being affected by distortion, vibration, etc. generated on the attachment surface at the attachment target position. Therefore, even when the housing 10 is configured to be supported at the attachment target position, laser light can be generated favorably.

[0478] In addition, the support member 501 and the attachment surface are configured to be connected via the attachment portion 7, rather than as shown in FIG. Figure 17A The examples of direct connection make it possible to attach the housing 10 to the support member 501, which can take various forms, without redesigning the structure of the housing 10 itself. This is advantageous in facilitating replacement of various processing devices with the laser processing device L according to the present disclosure.

[0479] In addition, if Figure 3A and Figure 3B As shown in the example of FIG. 1 , the front surface 10 f as an open surface (instead of the exit surface facing the workpiece W (i.e., the bottom surface 10 d ) and the attachment surface attached to the attachment target position (i.e., the top surface 10 u )) is configured to be openable and closable, so that the exit window 6 can be accessed without causing interference with the workpiece W, the support member 501, etc. Therefore, the maintainability of the laser processing device L can be improved.

[0480] In addition, since the front surface 10f as the open surface on which the cover member 13 is provided and the rear surface 10b as the connection surface to which the cable 200 is connected are as follows: Figure 4 The like is located on the opposite side, so when opening, closing, attaching or detaching the cover member 13, interference between the cover member 13 and the cable 200 is suppressed. Therefore, the maintainability of the laser processing apparatus L can be improved.

[0481] <<Other embodiments>>

[0482] Although the second housing portion H2 is formed in the housing 10 in the above embodiment, the second housing portion H2 is not essential. For example, the first heat sink 81 and the second heat sink 82 may be housed in the first housing portion H1. In addition, the optical path defining portion H3 may also be omitted as appropriate.

[0483] In addition, in the above embodiment, the excitation light source 21 is housed in the housing 10 of the marking head 1 , but the present disclosure is not limited to this configuration. For example, the excitation light source 21 may be provided in the marking machine controller 100 .

[0484] In addition, in the above-described embodiment, the crystal housing H12, the mirror housing H11, and the plate housing H13, which are obtained by dividing the first housing H1 in the housing 10 into three parts, are arranged side by side in this order along the Y direction orthogonal to the irradiation direction. However, the present disclosure is not limited to this configuration. For example, the arrangement order of the crystal housing H12, the mirror housing H11, and the plate housing H13 may be changed, or any two of the crystal housing H12, the mirror housing H11, and the plate housing H13 may be arranged side by side along the irradiation direction.

[0485] In the above embodiment, the top surface 10u, which faces the bottom surface 10d on which the exit window 6 is formed, is used as the attachment surface among the six surfaces of the housing 10. However, the present disclosure is not limited to this arrangement. Any of the six surfaces other than the bottom surface 10d on which the exit window 6 is formed can be considered an attachment surface. For example, if the right side surface 10r is used as the attachment surface, the support member 501 supports the housing 10 to be supported from the left side.

[0486] In addition, among the six surfaces of the housing 10, two or more surfaces other than the bottom surface 10d can be regarded as attachment surfaces. For example, in the case where the left side surface 10l and the top surface 10u are attachment surfaces, the attachment portion 7 can be attached to one of the left side surface 10l and the top surface 10u, or can be attached to both the left side surface 10l and the top surface 10u, as shown in FIG. Figure 22 In the marking head 1 ' shown in FIG.

[0487] For example, Figure 22 The attachment portion 2007 illustrated in FIG has a first portion 2007a attached to the top surface 10u and a second portion 2007b attached to the left side surface 101, and the support member 501' also has a shape that conforms to the attachment portion 2007. In this way, the attachment surface can be set according to the form of the support member 501', and the attachment portion 2007 corresponding to the setting can be used.

[0488] In addition, the attachment portion 7 is not necessary in the first place. Figure 23 In the housing 10 ″ of the illustrated marking head 1 ″, the support member 501 can also be directly attached to the attachment surface (the top surface 10u ″ in the illustrated example) without the intervention of the attachment portion 7. In this case, a partial area of ​​the attachment surface can be regarded as the attachment portion. In addition, a portion of the attachment surface can protrude in the direction opposite to the exit window 6, and such a protrusion can serve as the attachment portion.

Claims

1. A laser processing device for printing a sheet workpiece by irradiating an irradiation area formed on a sheet workpiece having a UV reactive layer with a UV laser to induce a chemical reaction in the UV reactive layer, characterized in that: The laser processing device comprises: a controller that stores processing conditions including a character string to be printed on the sheet-like workpiece and outputs a control signal based on the processing conditions; and a marking head attached to an attachment target position, connected to the controller via a cable, and irradiating the sheet workpiece with UV laser light based on the control signal; The marking head has: an excitation light generating unit that generates excitation light; a laser output unit that generates and outputs UV laser light based on the excitation light generated by the excitation light generating unit; a laser deflecting section that deflects the UV laser light output from the laser output section based on a control signal output from the controller; and a housing that accommodates the excitation light generating unit, the laser output unit, and the laser deflecting unit, and has a bottom surface through which the UV laser light deflected by the laser deflecting unit passes, and a top surface opposite to the bottom surface; The housing comprises: an attachment surface attached to the attachment target location; an offset portion provided on the bottom surface of the housing and recessed from the bottom side end portion of the housing toward the top side; an exit window provided at the offset portion and transmitting the UV laser light irradiated toward the irradiation area via the laser deflection unit; and The non-offset portion, which includes the bottom-side end portion of the housing, protrudes toward the bottom-side end portion of the housing relative to the offset portion.

2. The laser processing device according to claim 1, wherein: The non-offset portion protrudes toward the bottom end portion of the housing to define a space through which air flows in a direction perpendicular to a direction from the top surface of the housing toward the bottom end portion.

3. The laser processing device according to claim 2, wherein: The non-offset portion accommodates a first heat sink thermally coupled to the laser output portion for cooling the laser output portion.

4. The laser processing device according to claim 3, wherein: The non-offset portion accommodates a first air supply fan for supplying air to the first heat sink.

5. The laser processing device according to claim 3 or 4, wherein: The first heat sink is composed of a plurality of fins protruding toward a bottom end portion of the housing.

6. The laser processing device according to any one of claims 2 to 5, wherein: The non-offset portion accommodates a second heat sink thermally coupled to the excitation light generating portion for cooling the excitation light generating portion.

7. The laser processing device according to claim 6, wherein: The non-offset portion accommodates a second air supply fan for supplying air to the second heat sink.

8. The laser processing device according to claim 6 or 7, wherein: The second heat sink is composed of a plurality of fins protruding toward a bottom end portion of the housing.

9. The laser processing device according to any one of claims 1 to 8, wherein: A groove having a trapezoidal cross section is formed on the bottom surface of the housing, with the offset portion as an upper base and the diameter of which increases toward the bottom end of the housing.

10. The laser processing device according to any one of claims 1 to 9, wherein: The housing is supported from the side or from above by attaching the attachment surface to a support member for supporting the housing.

11. The laser processing device according to claim 10, wherein: The housing is configured to attach the attachment surface directly to the support member.

12. The laser processing device according to claim 10 or 11, wherein: The attachment surface of the housing is provided with fastening holes corresponding to the support member, The housing is attached to the support member by fastening a fastener in the fastening hole.

13. The laser processing device according to any one of claims 1 to 12, wherein: The marking head is configured to be replaceable with a thermal transfer industrial thermal printer via the attachment surface.

14. The laser processing device according to any one of claims 1 to 13, wherein: The housing includes an excitation light guide portion that guides the excitation light generated by the excitation light generating portion toward the laser output portion.

15. The laser processing device according to any one of claims 1 to 14, wherein: The sheet-like workpiece consists of a film containing a UV-reactive layer.

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