A spot welding mechanism for integrated circuit chip processing

Abstract

This invention relates to the field of integrated circuit chip processing technology, and more particularly to a spot welding mechanism for integrated circuit chip processing. The mechanism includes a base plate, with a column fixedly connected to one side of the top of the base plate. A fixing post and a fixing seat are fixedly connected to the upper and lower sides of one end of the column, respectively. The fixing seat is equipped with a clamping and protection mechanism, a cooling mechanism, and an absorption and purification mechanism. The clamping and protection mechanism includes a placement plate, the inner wall of which is used to place the chip body. Guide posts slide through the top diagonally on both sides of the top of the placement plate, and a top cover plate is fixedly connected to the top of the two guide posts. This invention can position and clamp both the chip body and the wires, thereby bringing the chip body's pins and the wires into contact, and then placing the pins on the support post. During this process, workers do not need to hold the chip, avoiding burns to their fingers from the spot welding head, thus improving safety during spot welding.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit chip processing technology, and in particular to a spot welding mechanism for integrated circuit chip processing. Background Technology

[0002] An integrated circuit chip is a miniature electronic device made by placing a large number of microelectronic components (such as transistors, resistors, capacitors, etc.) on a silicon-based or semiconductor substrate. The pins of integrated circuit chips are divided into single-row pins and double-row pins, etc.

[0003] Before use, dual-pin integrated circuit chips need to have their pins soldered to the wires by spot welding, which requires a special spot welding machine.

[0004] In existing technologies, when spot welding the pins and wires of a dual-pin integrated circuit chip together, a person needs to hold the chip with one hand and the wires with the other to bring them into contact and place it on a support post. Then, the chip is fixed by a spot welding head. However, due to the shaking caused by the manual hand, the pins and wires of the dual-pin integrated circuit chip may become misaligned, resulting in a smaller welding surface during spot welding. This affects the quality and effect of the spot welding. Furthermore, during welding, the hands are close to the welding head. When workers work for a long time, they may become fatigued and accidentally touch the welding head with their fingers, which could burn their fingers. This poses a low safety risk.

[0005] Furthermore, during spot welding, the support post is in contact with the pins of the dual-pin integrated circuit chip for a long time. The prolonged spot welding operation can cause the top of the support post to become too hot, resulting in a slow cooling rate of the solder joint, which in turn reduces the strength and stability of the solder joint. Summary of the Invention

[0006] The purpose of this invention is to address the shortcomings of the prior art by proposing a spot welding mechanism for integrated circuit chip processing.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a spot welding mechanism for integrated circuit chip processing, comprising a base plate, a column fixedly connected to one side of the top of the base plate, a fixed column and a fixed seat fixedly connected to the upper and lower sides of one end of the column, and a clamping protection mechanism, a cooling mechanism and an absorption and purification mechanism respectively provided on the fixed seat;

[0008] The clamping and protection mechanism includes a placement plate, the inner wall of which is used to place the chip body, and guide posts that slide through the top diagonally on both sides of the top of the placement plate. A top cover plate is fixedly connected to the top of the two guide posts. A groove adapted to the shape of the chip body is opened at the bottom of the top cover plate. The top cover plate and the placement plate are combined together for positioning and clamping the chip body.

[0009] The clamping and protection mechanism also includes a fixed clamping plate and a movable clamping plate. The fixed clamping plate and the movable clamping plate are symmetrically provided with arc-shaped grooves. The arc-shaped grooves between the fixed clamping plate and the movable clamping plate form a circle and clamp and fix the wire. Both ends of the movable clamping plate are fixedly connected to fixed connecting plates. Both fixed connecting plates are fixedly connected to the upper cover plate.

[0010] Preferably, the clamping protection mechanism further includes a circular plate A fixedly connected to the bottom end of the guide column, a third tension spring fixedly connected between each of the two circular plates A and the placement plate, a placement groove symmetrically connected to the bottom of the inner wall of the placement plate, a lifting column slidably passing through each of the two placement grooves, a lifting plate fixedly connected to the top of each of the two lifting columns, a circular plate B fixedly connected to the bottom end of each of the two lifting columns, and a second tension spring fixedly connected between each of the two circular plates B and the placement plate.

[0011] Preferably, the clamping protection mechanism further includes a slot formed on one side of the top of the placement plate, a limiting post slidingly passing through the slot, a side plate fixedly connected to the end of the limiting post away from the placement plate, and a first tension spring fixedly connected to both sides of the side plate corresponding to the limiting post at the end of the side plate near the placement plate, both of the first tension springs being fixedly connected to the placement plate, and an insert plate fixedly connected to the bottom of the upper cover plate above the slot, with a limiting groove formed on one side of the insert plate.

[0012] Preferably, the clamping protection mechanism further includes a U-shaped clamping plate B and a U-shaped frame plate A symmetrically fixedly connected to the fixed clamping plate and the movable clamping plate near the placement plate. The two sets of U-shaped clamping plates B and U-shaped frame plates A are used to limit the insulation layer of the wire, so that the metal wire of the wire falls above the chip body pin. The bottom ends of the fixed clamping plate and the placement plate are respectively fixedly connected to L-shaped plates B and L-shaped plates A, and both L-shaped plates B and L-shaped plates A are fixedly connected to the fixing base.

[0013] Preferably, the cooling mechanism includes a support column A and a support column B fixedly passing through the fixed base. The support column A and the support column B are in contact with the bottom of the pins of the chip body. The bottom of the support column A and the support column B are respectively provided with an output flow channel and an input flow channel. The support column A and the support column B are connected by a pipe. A tapered tube is fixedly connected to the bottom of the inner wall of the output flow channel.

[0014] Preferably, a cooling box is fixedly connected to the other side of the top of the base plate, and a water pump is fixedly connected to the side of the top of the base plate corresponding to the cooling box. The water pumps are all connected to the cooling box and the support column B through pipes. The support column A and the cooling box are connected through pipes.

[0015] Preferably, the absorption and purification mechanism includes a connecting plate fixedly connected to the top of the fixed connecting plate, and a fixed cover fixedly connected to the other end of each of the two connecting plates. It also includes a purification box fixedly connected to the top of the cooling box. The purification box and the fixed cover are connected by a flexible hose. A box cover is provided at the top of the purification box. Multiple activated carbon plates are fixedly connected to the bottom of the box cover. An exhaust fan is fixedly connected to the side of the top of the cooling box corresponding to the purification box. The exhaust fan and the purification box are connected by a flexible hose.

[0016] Preferably, an electric push rod is fixedly connected to the top of the fixed column, and a movable seat is fixedly connected to the telescopic end of the electric push rod. Two spot weld heads are fixedly connected through the movable seat.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The clamping and protection mechanism allows the chip body to be placed inside the top cover and placement plate, which are adapted to its shape. This enables precise positioning and clamping of the chip body. Simultaneously, the pins of the chip body are positioned at the midpoint of the top of support pillars A and B, completing the contact operation. The wire is then placed in the arc-shaped groove, and the wire's metal wire contacts the arc-shaped notches on U-shaped clamps B and A. The wire is then secured to the insulation layer by U-shaped clamps B and A, ensuring the wire's metal wire falls precisely on the chip body's pins. This positioning and clamping prevents displacement during spot welding, guaranteeing welding quality and effectiveness. Furthermore, the mechanism eliminates the need for manual handling, preventing burns to the welding head and improving safety. After spot welding, the chip body can be quickly separated from the clamping and protection mechanism using the second and third tension springs, allowing for rapid removal.

[0019] The cooling mechanism allows cooling water to be injected into the output and input channels of support pillars A and B during spot welding of chip body pins and wires. The conical cylinder allows the cooling water to fill the top of the output and input channels, thus cooling the top of the support pillars and removing the heat generated during spot welding. This accelerates the cooling speed of the solder joint and improves its strength and stability.

[0020] The absorption and purification mechanism can absorb the irritating gases generated during spot welding through a fixed cover, and then transport them into a purification chamber through a hose. The activated carbon plate in the purification chamber will then purify the irritating gases to prevent them from entering the surrounding environment and protect the health of the surrounding workers. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a spot welding mechanism for integrated circuit chip processing according to the present invention;

[0022] Figure 2 This invention relates to a spot welding mechanism for integrated circuit chip processing. Figure 1 Enlarged view of point A in the middle;

[0023] Figure 3 This is another top view of a spot welding mechanism for integrated circuit chip processing according to the present invention;

[0024] Figure 4 This invention relates to a spot welding mechanism for integrated circuit chip processing. Figure 3 Enlarged view at point B in the middle;

[0025] Figure 5 This is a partial bottom view of a spot welding mechanism for integrated circuit chip processing according to the present invention;

[0026] Figure 6 This is a separate view of the upper cover plate and the placement plate of a spot welding mechanism for integrated circuit chip processing according to the present invention;

[0027] Figure 7 This is a structural diagram of the upper cover plate and the placement plate of a spot welding mechanism for integrated circuit chip processing according to the present invention;

[0028] Figure 8 This is a partial cross-sectional view of the placement plate of a spot welding mechanism for integrated circuit chip processing according to the present invention;

[0029] Figure 9 This is a separate diagram of the fixed clamping plate and the movable clamping plate of a spot welding mechanism for integrated circuit chip processing according to the present invention;

[0030] Figure 10 This is a cross-sectional view of support column A and support column B of a spot welding mechanism for integrated circuit chip processing according to the present invention.

[0031] Figure 11 This is a structural diagram of a cleanroom box for a spot welding mechanism used in integrated circuit chip processing according to the present invention.

[0032] In the diagram: 1. Base plate; 2. Column; 3. Electric push rod; 4. Fixed column; 5. Moving seat; 6. Spot welding head; 7. L-shaped plate A; 8. Water pump; 9. Cooling box; 10. Fixed seat; 11. Support column A; 12. L-shaped plate B; 13. Fixed cover; 14. Connecting plate; 15. Fixed clamping plate; 16. Moving clamping plate; 17. Wire; 18. U-shaped frame plate A; 19. Support column B; 20. Fixed connecting plate; 21. Top cover plate; 22. Placement plate; 23. First tension spring; 24. 25. Limiting post; 26. Side plate; 27. Purification box; 28. Exhaust fan; 29. ​​Chip body; 30. Second tension spring; 31. Third tension spring; 32. Circular plate A; 33. Circular plate B; 34. Guide post; 35. Lifting post; 36. Lifting plate; 37. Placement slot; 38. Limiting slot; 39. Insert plate; 40. Arc-shaped slot; 41. U-shaped clamping plate B; 42. Inlet channel; 43. Conical tube; 44. Outlet channel; 45. Activated carbon plate; 46. Box cover. Detailed Implementation

[0033] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0034] like Figures 1-11 The illustrated spot welding mechanism for integrated circuit chip processing includes a base plate 1. A column 2 is fixedly connected to one side of the top of the base plate 1. A fixed column 4 and a fixed seat 10 are fixedly connected to the upper and lower sides of one end of the column 2, respectively. An electric push rod 3 is fixedly connected to the top of the fixed column 4. A movable seat 5 is fixedly connected to the telescopic end of the electric push rod 3. Two spot welding heads 6 are fixedly passed through the movable seat 5. The fixed seat 10 is respectively provided with a clamping protection mechanism, a cooling mechanism, and an absorption and purification mechanism. When spot welding is performed, the electric push rod 3 is activated to push the movable seat 5 downward. A guide and limit mechanism is provided between the movable seat 5 and the fixed column 4 to prevent the movable seat 5 from deflecting. The movable seat 5 moves downward with the spot welding heads 6, thereby enabling the spot welding operation.

[0035] like Figure 2 , Figure 6 , Figure 7 As shown, the clamping and protection mechanism includes a placement plate 22. The inner wall of the placement plate 22 is used to place the chip body 28. Guide posts 33 slide through the top diagonal sides of the placement plate 22. The top of the two guide posts 33 are fixedly connected to the top of the upper cover plate 21. The bottom of the upper cover plate 21 has a groove that matches the shape of the chip body 28. The upper cover plate 21 and the placement plate 22 are combined together to position and clamp the chip body 28.

[0036] like Figure 2 , Figure 9As shown, the clamping protection mechanism also includes a fixed clamping plate 15 and a movable clamping plate 16. Arc-shaped grooves 40 are symmetrically provided between the fixed clamping plate 15 and the movable clamping plate 16. The arc-shaped grooves 40 between the fixed clamping plate 15 and the movable clamping plate 16 form a circle and clamp and fix the wire 17. Fixed connecting plates 20 are fixedly connected to both ends of the movable clamping plate 16. Both fixed connecting plates 20 are fixedly connected to the upper cover plate 21.

[0037] like Figure 5 , Figure 6 As shown, the clamping protection mechanism also includes a circular plate A31 fixedly connected to the bottom of the guide post 33. A third tension spring 30 is fixedly connected between the two circular plates A31 and the placement plate 22. A placement groove 36 is symmetrically connected to the bottom of the inner wall of the placement plate 22. A lifting post 34 slides through the two placement grooves 36. A lifting plate 35 is fixedly connected to the top of the two lifting posts 34. A circular plate B32 is fixedly connected to the bottom of the two lifting posts 34. A second tension spring 29 is fixedly connected between the two circular plates B32 and the placement plate 22. During disassembly, the elastic reset of the second tension spring 29 allows the circular plate B32 and the lifting column 34 to move upward, along with the lifting plate 35, so that the chip body 28 can be separated from the placement plate 22. At the same time, the elastic reset of the third tension spring 30 allows the circular plate A31 and the guide column 33 to move upward. Since the length of the guide column 33 is greater than that of the lifting column 34, the lifting height of the upper cover plate 21 is greater than that of the lifting plate 35, and also greater than that of the chip body 28, making it easier to remove the spot-welded chip body 28.

[0038] like Figure 7 , Figure 8 As shown, the clamping protection mechanism also includes a slot 39 on one side of the top of the placement plate 22. A limiting post 24 slides through the slot 39. A side plate 25 is fixedly connected to the end of the limiting post 24 away from the placement plate 22. A first tension spring 23 is fixedly connected to both sides of the limiting post 24 at the end of the side plate 25 closest to the placement plate 22. Both first tension springs 23 are fixedly connected to the placement plate 22. An insert plate 38 is fixedly connected to the bottom of the top cover plate 21 above the slot 39. A limiting groove 37 is formed on the outer side of the insert plate 38. When clamping, the insert plate 38 will first contact the inclined surface on the limiting post 24, causing the limiting post 24 and the side plate 25 to move outward, while stretching the first tension spring 23. When the insert plate 38 is fully inserted into the slot 39, the elastic action of the first tension spring 23 can insert the limiting post 24 into the limiting groove 37, completing the clamping and fixing.

[0039] like Figure 2 , Figure 5 , Figure 9As shown, the clamping and protection mechanism also includes U-shaped clamping plates B41 and U-shaped support plates A18 symmetrically fixedly connected to the fixed clamping plate 15 and the movable clamping plate 16 near the placement plate 22. The two sets of U-shaped clamping plates B41 and U-shaped support plates A18 are used to limit the insulation layer of the wire 17, ensuring that the metal wire of the wire 17 falls above the pins of the chip body 28. L-shaped plates B12 and A7 are fixedly connected to the bottom ends of the fixed clamping plate 15 and the placement plate 22, respectively. Both L-shaped plates B12 and A7 are fixedly connected to the fixing base 10. The U-shaped clamping plates B41 and U-shaped support plates A18 can clamp and position the wire 17, while the L-shaped plates B12 and A7 support and fix the fixed clamping plate 15 and the placement plate 22, thus fixing them onto the fixing base 10.

[0040] like Figure 1 , Figure 2 As shown, the cooling mechanism includes a support column A11 and a support column B19 fixedly passing through the fixed base 10. The support column A11 and the support column B19 are in contact with the bottom of the pins of the chip body 28. The bottom of the support column A11 and the support column B19 are respectively provided with an output flow channel 44 and an input flow channel 42. The support column A11 and the support column B19 are connected by a pipe. A tapered tube 43 is fixedly connected to the bottom of the inner wall of the output flow channel 44. A cooling box 9 is fixedly connected to the other side of the top of the base plate 1. A water pump 8 is fixedly connected to the side of the top of the base plate 1 corresponding to the cooling box 9. The water pump 8 is connected to the cooling box 9 and the support column B19 through pipes. The support column A11 and the cooling box 9 are connected by pipes. The water pump 8 is started to draw the cooling water in the cooling tank 9 into the inlet channel 42 of the support column B19 through the pipe. Since the support column A11 and the support column B19 are connected by the pipe, the cooling water can flow into the outlet channel 44. Since the smaller diameter end of the tapered pipe 43 faces upward, the flow rate of the cooling water can be reduced, so that the cooling water fills the top of the inlet channel 42 and the outlet channel 44 to complete the cooling operation. Afterward, the water flows back into the cooling tank 9 through the pipe for further cooling, thus allowing for recycling and saving resources.

[0041] like Figure 2 , Figure 3 , Figure 11As shown, the absorption and purification mechanism includes a connecting plate 14 fixedly connected to the top of the fixed connecting plate 20, and a fixed cover 13 fixedly connected to the other end of each of the two connecting plates 14. It also includes a purification box 26 fixedly connected to the top of the cooling box 9. The purification box 26 and the fixed cover 13 are connected via a flexible hose. A box cover 46 is provided at the top of the purification box 26, and multiple activated carbon plates 45 are fixedly connected to the bottom of the box cover 46. An exhaust fan 27 is fixedly connected to the side of the top of the cooling box 9 corresponding to the purification box 26, and the exhaust fan 27 and the purification box 26 are connected via a flexible hose. During spot welding, irritating gases are generated. When this is done, the exhaust fan 27 is activated, generating suction within the fixed cover 13 through the flexible hose, thereby drawing the irritating gases into the purification box 26. The multiple activated carbon plates 45 inside the purification box 26 filter and absorb harmful substances in the irritating gases, thus expelling clean gas. Because the box cover 46 and the purification box 26 are detachably connected, the activated carbon plates 45 can be replaced, thus maintaining a high-efficiency filtration and purification effect.

[0042] Working principle: First, place the chip body 28 on the lifting plate 35 and press the chip body 28 so that the lifting plate 35 is locked in the placement slot 36. At this time, the chip body 28 is locked inside the placement plate 22, and the second tension spring 29 is in a stretched state. Then, place the wire 17 in the arc-shaped groove 40. The U-shaped clamp B41 can limit the insulation layer of the wire 17, so that the metal wire of the wire 17 is placed above the pin of the chip body 28. The pin of the chip body 28 is placed on the top of the support pillar A11 and support pillar B19. Then, press down the top cover plate 21 and cover the top of the chip body 28. At the same time, the insertion plate 38 is inserted into the slot 39. The inclined surface of the limiting post 24 is squeezed and moved outward. When the insert plate 38 is fully inserted into the slot 39, the elastic reset action of the first tension spring 23 and the cooperation of the side plate 25 allow the limiting post 24 to be inserted into the limiting groove 37, thus limiting the insert plate 38 and the upper cover plate 21. Due to the presence of the fixed connecting plate 20, the moving clamp 16 moves downward synchronously, so that the moving clamp 16 covers the top of the fixed clamp 15, thus clamping and fixing the wire 17. Therefore, during spot welding, the worker does not need to hold the chip body 28 and the wire 17 to complete the spot welding operation, thereby avoiding the worker's fingers from being burned or crushed, and improving the safety of spot welding.

[0043] After clamping and fixing, the water pump 8 is started to transport the cooling water in the cooling tank 9 into the input channel 42 in the support column B19 through the pipe. Since the support column B19 and the support column A11 are connected by the pipe, the cooling water flows into the output channel 44 through the pipe. The tapered pipe 43 can slow down the flow rate of the cooling water, so that the cooling water fills the top of the input channel 42 and the output channel 44, thereby better cooling operation, accelerating the cooling speed of the solder joint, improving the strength and stability of the solder joint, and improving adaptability and practicality. At this time, the electric push rod 3 is started to push the moving seat 5 and the spot welding head 6 downward, and the spot welding head 6 contacts the pins of the chip body 28 and the metal wire of the lead wire 17 for spot welding. During spot welding, the exhaust fan 27 is started to generate suction in the fixed cover 13 through the hose, so that the irritating gas generated by spot welding can be absorbed into the purification box 26, and the activated carbon plate 45 in the purification box 26 absorbs the harmful substances in the irritating gas, avoiding the impact on the surrounding environment and ensuring the health of the staff.

[0044] After spot welding is completed, pull the side plate 25 outward. Since the side plate 25 and the limiting post 24 are fixed together, the limiting post 24 can be moved outward and away from the range of the limiting groove 37, thereby releasing the limitation on the insertion plate 38. At this time, the elastic reset of the third tension spring 30 causes the circular plate A31 and the guide post 33 to move upward, while the upper cover plate 21 moves upward. Similarly, the elastic reset of the second tension spring 29 causes the circular plate B32 and the lifting post 34 to move upward. Therefore, the chip body 28 can be quickly separated and removed.

[0045] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection claimed by the appended claims and their equivalents is defined.

Claims

1. A spot welding mechanism for integrated circuit chip processing, comprising a base plate (1), wherein a column (2) is fixedly connected to one side of the top of the base plate (1), and a fixing column (4) and a fixing seat (10) are fixedly connected to the upper and lower sides of one end of the column (2), characterized in that: The fixed base (10) is respectively provided with a clamping protection mechanism, a cooling mechanism and an absorption and purification mechanism; The clamping and protection mechanism includes a placement plate (22), the inner wall of which is used to place the chip body (28), and guide posts (33) slidingly pass through the top diagonal sides of the placement plate (22). The top ends of the two guide posts (33) are fixedly connected to an upper cover plate (21). The bottom end of the upper cover plate (21) is provided with a groove that matches the shape of the chip body (28). The upper cover plate (21) and the placement plate (22) are combined together to position and clamp the chip body (28). The clamping protection mechanism also includes a fixed clamping plate (15) and a movable clamping plate (16). The fixed clamping plate (15) and the movable clamping plate (16) are symmetrically provided with arc-shaped grooves (40). The arc-shaped grooves (40) between the fixed clamping plate (15) and the movable clamping plate (16) form a circle and clamp and fix the wire (17). The movable clamping plate (16) is fixedly connected to both ends with fixed connecting plates (20). Both fixed connecting plates (20) are fixedly connected to the upper cover plate (21). The clamping protection mechanism also includes a U-shaped clamping plate B (41) and a U-shaped frame plate A (18) symmetrically fixedly connected to the fixed clamping plate (15) and the movable clamping plate (16) at one end near the placement plate (22). The two sets of U-shaped clamping plates B (41) and U-shaped frame plates A (18) are used to limit the insulation layer of the wire (17) so that the metal wire of the wire (17) falls above the pin of the chip body (28). The bottom ends of the fixed clamping plate (15) and the placement plate (22) are respectively fixedly connected to an L-shaped plate B (12) and an L-shaped plate A (7). The L-shaped plate B (12) and the L-shaped plate A (7) are both fixedly connected to the fixed base (10). The cooling mechanism includes a support column A (11) and a support column B (19) fixedly passing through the fixed base (10). The support column A (11) and the support column B (19) are in contact with the bottom of the pins of the chip body (28). The bottom of the support column A (11) and the support column B (19) are respectively provided with an output flow channel (44) and an input flow channel (42). The support column A (11) and the support column B (19) are connected by a pipe. A tapered tube (43) is fixedly connected to the bottom of the inner wall of the output flow channel (44). An electric push rod (3) is fixedly connected to the top of the fixed column (4), and a movable seat (5) is fixedly connected to the telescopic end of the electric push rod (3). Two spot weld heads (6) are fixedly connected through the movable seat (5).

2. The spot welding mechanism for integrated circuit chip processing according to claim 1, characterized in that: The clamping protection mechanism also includes a circular plate A (31) fixedly connected to the bottom end of the guide post (33). A third tension spring (30) is fixedly connected between the two circular plates A (31) and the placement plate (22). The bottom of the inner wall of the placement plate (22) is symmetrically connected to a placement groove (36). A lifting post (34) slides through the two placement grooves (36). A lifting plate (35) is fixedly connected to the top of the two lifting posts (34). A circular plate B (32) is fixedly connected to the bottom of the two lifting posts (34). A second tension spring (29) is fixedly connected between the two circular plates B (32) and the placement plate (22).

3. The spot welding mechanism for integrated circuit chip processing according to claim 2, characterized in that: The clamping protection mechanism also includes a slot (39) opened on one side of the top of the placement plate (22). A limiting post (24) slides through the slot (39). A side plate (25) is fixedly connected to the end of the limiting post (24) away from the placement plate (22). A first tension spring (23) is fixedly connected to both sides of the limiting post (24) at the end of the side plate (25) close to the placement plate (22). Both first tension springs (23) are fixedly connected to the placement plate (22). An insert plate (38) is fixedly connected to the bottom of the upper cover plate (21) above the slot (39). A limiting groove (37) is opened on the outer side of the insert plate (38).

4. The spot welding mechanism for integrated circuit chip processing according to claim 1, characterized in that: A cooling box (9) is fixedly connected to the other side of the top of the base plate (1). A water pump (8) is fixedly connected to the side of the top of the base plate (1) corresponding to the cooling box (9). The water pump (8) is connected to the cooling box (9) and the support column B (19) through pipes. The support column A (11) and the cooling box (9) are connected through pipes.

5. The spot welding mechanism for integrated circuit chip processing according to claim 4, characterized in that: The absorption and purification mechanism includes a connecting plate (14) fixedly connected to the top of the fixed connecting plate (20), and a fixed cover (13) fixedly connected to the other end of each of the two connecting plates (14). It also includes a purification box (26) fixedly connected to the top of the cooling box (9). The purification box (26) and the fixed cover (13) are connected by a hose. The top of the purification box (26) is provided with a box cover (46). Multiple activated carbon plates (45) are fixedly connected to the bottom of the box cover (46). A fan (27) is fixedly connected to the top of the cooling box (9) on the side corresponding to the purification box (26). The fan (27) and the purification box (26) are connected by a hose.

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