A high-precision OCA bonding and positioning device

Abstract

This invention discloses a high-precision OCA bonding and positioning device, comprising a base plate and an upper mold. A support base is fixedly mounted on the base plate, and multiple guide pillars are fixedly mounted on the base plate. The upper mold is slidably connected to the guide pillars. Multiple first springs are arranged between the base plate and the upper mold, with both ends of the first springs fixedly connected to the base plate and the upper mold, respectively. Multiple support pillars are slidably mounted on the upper mold, and multiple second springs are arranged between each support pillar and the upper mold, with both ends of the second springs fixedly connected to the support pillars and the upper mold, respectively. The first springs support the upper mold, facilitating the placement of the OCA on the support base and positioning the OCA through the upper mold. Simultaneously, when the CG is placed, the second springs and support pillars support the CG, increasing the distance between the CG and the OCA, preventing the CG from sticking to the OCA during placement and causing deviations during the pressing process, thus ensuring the positioning effect of the CG and OCA.

Description

Technical Field

[0001] This invention relates to the field of display screen bonding technology, and more specifically to a high-precision OCA bonding and positioning device. Background Technology

[0002] In the automotive full lamination industry, the bonding of CG (Cover Glass) and OCA (Optically Clear Adhesive) is a key process in the production of automotive display panels. Specialized fixtures are required to ensure bonding accuracy and avoid bubbles and misalignment.

[0003] In the vacuum bonding process of CG and OCA, traditional bonding fixtures and positioning fixtures are integrated, and the groove depth of the fixture used for OCA positioning is insufficient, which makes OCA positioning difficult, often resulting in misalignment that is not easy to detect, leading to serious loss of yield and low efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a high-precision OCA bonding and positioning device to overcome the above-mentioned shortcomings in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A high-precision OCA bonding and positioning device includes a base plate and an upper mold. A support seat is fixedly mounted on the base plate, and multiple guide posts are fixedly mounted on the base plate. The upper mold is slidably connected to the guide posts. Multiple first springs are provided between the base plate and the upper mold, and the two ends of the first springs are fixedly connected to the base plate and the upper mold, respectively.

[0007] The upper mold is slidably provided with multiple support columns, and multiple second springs are provided between the multiple support columns and the upper mold. The two ends of the second springs are fixedly connected to the support columns and the upper mold, respectively.

[0008] It also includes a bonding block, which is adapted to the upper mold. A plug rod is fixedly provided on the bonding block. The plug rod is slidably disposed in the support base. A guide block is fixedly provided on the plug rod. A guide groove is provided on the support base. The guide block is slidably disposed in the guide groove. The guide groove is L-shaped.

[0009] Preferably, a lifting block is slidably provided on the upper mold, a support tube is fixedly provided on the lifting block, and a pressing buckle is rotatably provided on the support tube.

[0010] Preferably, a column is fixedly provided on the upper mold, a traction groove is provided on the column, and a second protrusion is fixedly provided on the pressing buckle, the second protrusion being slidably disposed in the traction groove;

[0011] The traction groove includes a vertical section and a spiral section.

[0012] Preferably, a reciprocating rod is slidably provided on the upper mold, the reciprocating rod abuts against the fitting block, a first protrusion is fixedly provided on the reciprocating rod, and an inclined groove is provided on the lifting block, with the first protrusion slidably disposed in the inclined groove.

[0013] Preferably, a fixing block is fixedly provided on the upper mold, a sliding groove is provided on the fixing block, a snap-fit ​​rod is slidably provided on the sliding groove, and a snap-fit ​​groove is provided on one of the guide posts, and the snap-fit ​​rod engages with the snap-fit ​​groove.

[0014] A push-pull rod is fixedly installed on the reciprocating rod, and an abutment groove is provided on the push-pull rod. The locking rod is slidably installed in the abutment groove, and both ends of the abutment groove are engaged with the locking rod.

[0015] Preferably, a fourth spring is provided between the reciprocating rod and the upper die, and the two ends of the fourth spring are fixedly connected to the reciprocating rod and the upper die, respectively.

[0016] Preferably, a pressing key is slidably provided on the bonding block, a locking pin is fixedly provided on the pressing key, a through hole is provided on the base plate, and the locking pin is inserted into the through hole.

[0017] Preferably, a third spring is provided between the pressing button and the bonding block, and the two ends of the third spring are fixedly connected to the pressing button and the bonding block respectively.

[0018] Preferably, a long rod is fixedly provided on the bonding block, and a long groove is provided on the upper mold, with the long rod and the long groove being inserted into each other.

[0019] Preferably, a plurality of limiting pins are fixedly provided on the base plate, and the limiting pins abut against the upper mold.

[0020] In the above technical solution, the high-precision OCA bonding and positioning device provided by the present invention has the following beneficial effects:

[0021] The first spring supports the upper mold, making it easy to place the OCA on the support base and position the OCA. This facilitates the placement of the OCA. At the same time, when the CG is placed, the second spring and support column support the CG, increasing the distance between the CG and the OCA. This prevents the CG from sticking to the OCA during placement, which could cause deviations during the pressing process and ensures the positioning effect of the CG and OCA.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this disclosure.

[0023] This application provides an overview of various implementations or examples of the technology described in this disclosure, and is not a full disclosure of the entire scope or all features of the disclosed technology. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0025] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the base plate structure provided in an embodiment of the present invention;

[0027] Figure 3 This is a cross-sectional view of the base plate and support seat provided in an embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the internal structure of the upper mold provided in an embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of the bonding block structure provided in an embodiment of the present invention;

[0030] Figure 6 This is a schematic diagram of the reciprocating rod and push-pull rod structure provided in an embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of the guide post, the snap fastener, the column, and the lifting block provided in an embodiment of the present invention;

[0032] Figure 8 This is a schematic diagram of the OCA structure provided in an embodiment of the present invention.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. Base plate; 11. Support base; 12. Guide groove; 13. Through hole; 14. Guide post; 15. Snap-fit ​​groove; 16. First spring; 17. Limiting pin; 2. Upper mold; 21. Support post; 22. Second spring; 23. Column; 24. Vertical part; 25. Spiral part; 26. Fixing block; 27. Snap-fit ​​rod; 28. Long groove; 3. Fitting block; 31. Insert rod; 32. Guide block; 33. Long rod; 34. Press button; 35. Locking pin; 36. Third spring; 4. Reciprocating rod; 41. Push-pull rod; 42. Abutment groove; 43. Fourth spring; 44. First protrusion; 5. Lifting block; 51. Inclined groove; 52. Support tube; 53. Press buckle; 54. Second protrusion. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0036] Please refer to 1-8. A high-precision OCA bonding and positioning device includes a base plate 1 and an upper mold 2. A support base 11 is fixedly mounted on the base plate 1, and multiple guide pillars 14 are fixedly mounted on the base plate 1. The upper mold 2 is slidably connected to the guide pillars 14. Multiple first springs 16 are arranged between the base plate 1 and the upper mold 2, and the two ends of the first springs 16 are fixedly connected to the base plate 1 and the upper mold 2 respectively. Multiple support pillars 21 are slidably mounted on the upper mold 2, and multiple second springs 22 are arranged between each of the multiple support pillars 21 and the upper mold 2. The end is fixedly connected to the support column 21 and the upper mold 2 respectively; it also includes a bonding block 3, which is adapted to the upper mold 2. A plug-in rod 31 is fixedly provided on the bonding block 3. The plug-in rod 31 is slidably disposed in the support base 11. A guide block 32 is fixedly provided on the plug-in rod 31. A guide groove 12 is provided on the support base 11. The guide block 32 is slidably disposed in the guide groove 12. The guide groove 12 is L-shaped. When bonding OCA and CG, OCA is placed on the support base 11 and CG is placed on the upper mold 2. The CG is supported by multiple guide pillars 14. Meanwhile, the first spring 16 supports the upper mold 2, facilitating the placement of the OCA on the support base 11 and positioning the OCA via the upper mold 2. Simultaneously, during CG placement, the second spring 22 and support pillars 21 support the CG, increasing the distance between the CG and OCA. This prevents the CG from sticking to the OCA during placement, avoiding deviations during pressing and ensuring the proper bonding of the CG and OCA. Positioning effect; at the same time, by setting the bonding block 3, after the OCA is positioned, the sliding of the bonding block 3 exposes one corner of the OCA, making it easier to remove the covering film on the surface of the OCA. When the bonding block 3 slides, the guide block 32 on the plug rod 31 slides on the long side of the "L" shape of the guide groove 12. When pressing the CG and OCA, the upper mold 2 and the bonding block 3 move down, and the guide block 32 slides on the "L" shape of the guide groove 12 to avoid the bonding block 3 and the upper mold 2 moving down and being affected by the support base 11.

[0037] Specifically, a lifting block 5 is slidably mounted on the upper mold 2, and a support tube 52 is fixedly mounted on the lifting block 5. A pressing buckle 53 is rotatably mounted on the support tube 52. After the OCA is positioned, the OCA is limited by the inner edge of the upper mold 2. Then, by the downward movement of the lifting block 5, the pressing buckle 53 presses the edge of the OCA. At the same time, the bonding block 3 slides to expose one corner of the OCA, making it easy to peel off the covering film of the OCA from that corner.

[0038] In a further embodiment of the present invention, a column 23 is fixedly provided on the upper mold 2, and a traction groove is provided on the column 23. A second protrusion 54 is fixedly provided on the press buckle 53, and the second protrusion 54 is slidably disposed in the traction groove. The traction groove includes a vertical part 24 and a spiral part 25. After the OCA positioning is completed, the lifting block 5 moves down with the press buckle 53 through the support tube 52. Under the cooperation of the second protrusion 54 and the spiral part 25 of the traction groove, the press buckle 53 moves down and rotates at the same time. When the second protrusion 54 is at the connection position of the vertical part 24 and the spiral part 25, the press buckle 53 presses down. The pressing position is aligned with the edge of the OCA. Then, the lifting block 5 continues to move downwards while the pressing buckle 53 is pressing against the edge of the OCA. When the pressing buckle 53 presses and releases against the edge of the OCA, it moves vertically up and down without rotating. This effectively avoids the problem of the OCA being deformed or shifted due to the torque exerted by the pressing buckle 53 when pressing against the OCA. This ensures the pressing effect of the pressing buckle 53 on the OCA and improves the stability of the OCA during the film peeling and pressing process.

[0039] Furthermore, a reciprocating rod 4 is slidably mounted on the upper mold 2, and the reciprocating rod 4 abuts against the fitting block 3. A first protrusion 44 is fixedly mounted on the reciprocating rod 4, and a inclined groove 51 is provided on the lifting block 5. The first protrusion 44 is slidably mounted in the inclined groove 51. A fourth spring 43 is provided between the reciprocating rod 4 and the upper mold 2, and the two ends of the fourth spring 43 are fixedly connected to the reciprocating rod 4 and the upper mold 2 respectively. When the fitting block 3 is fitted with the upper mold 2, under the pressing action of the fitting block 3 on the reciprocating rod 4, When the fourth spring 43 is stretched, the pressing buckle 53 is located inside the upper mold 2, which facilitates the positioning of the OCA. When the bonding block 3 slides away from the upper mold 2 and exposes one corner of the OCA, the reciprocating rod 4 slides under the action of the fourth spring 43 and drives the lifting block 5 to move down through the cooperation of the first protrusion 44 and the inclined groove 51. This causes the pressing buckle 53 to rotate and move down under the action of the second protrusion 54 and the traction groove, pressing the OCA to facilitate the removal of the OCA cover film.

[0040] Furthermore, a fixing block 26 is fixedly installed on the upper mold 2, and a sliding groove is provided on the fixing block 26. A snap-fit ​​rod 27 is slidably installed on the sliding groove. One of the guide posts 14 is provided with a snap-fit ​​groove 15, and the snap-fit ​​rod 27 is snapped into the snap-fit ​​groove 15. A push-pull rod 41 is fixedly installed on the reciprocating rod 4, and an abutment groove 42 is provided on the push-pull rod 41. The snap-fit ​​rod 27 is slidably installed in the abutment groove 42, and both ends of the abutment groove 42 are abutted into the snap-fit ​​rod 27. When the fitting block 3 slides against the upper mold 2. During the removal of the OCA film, under the action of the fourth spring 43, the reciprocating rod 4 and the push-pull rod 41 slide. When the push-pull rod 41 slides, the locking rod 27 slides in the abutment groove 42. The inner wall of one side of the abutment groove 42 abuts against the locking rod 27 and pushes the locking rod 27 to slide and engage with the locking groove 15, so that the upper mold 2 and the bottom plate 1 are relatively stable. This prevents the upper mold 2 from sliding under external force during the removal of the OCA film and causes instability, thus improving the stability during the removal of the film.

[0041] In a further embodiment of the present invention, a pressing key 34 is slidably provided on the bonding block 3, and a locking pin 35 is fixedly provided on the pressing key 34. A through hole 13 is provided on the base plate 1. The locking pin 35 is inserted into the through hole 13. The insertion of the locking pin 35 into the through hole 13 ensures the stability of the bonding block 3 when it is bonded to the upper mold 2, and avoids the phenomenon of instability caused by the reciprocating rod 4 pushing the bonding block 3 due to the fourth spring 43 being in a stretched state. Furthermore, the setting of the through hole 13 will not hinder the downward movement of the bonding block 3. During the pressing process, the upper mold 2 and the bonding block 3 slide relative to the base plate 1 and the support seat 11. At this time, the locking pin 35 slides in the through hole 13, ensuring the stability during the pressing process.

[0042] In the embodiment provided by the present invention, a third spring 36 is provided between the pressing key 34 and the bonding block 3. The two ends of the third spring 36 are fixedly connected to the pressing key 34 and the bonding block 3, respectively. When the pressing key 34 slides, the third spring 36 is compressed, and the locking pin 35 is disengaged from the through hole 13, so that the bonding block 3 can slide and disengage from the upper mold 2. During the resetting process of the bonding block 3, the bonding block 3 is pushed to slide and reset. The locking pin 35 is provided with an inclined surface. When the inclined surface contacts the bottom plate 1, the locking pin 35 slides under the action of the inclined surface, and the third spring 36 is compressed. After the bonding block 3 is reset to fit with the upper mold 2, the locking pin 35 pops out and inserts into the through hole 13 under the action of the third spring 36, thus completing the limiting of the bonding block 3.

[0043] Specifically, a long rod 33 is fixedly installed on the bonding block 3, and a long groove 28 is installed on the upper mold 2. The long rod 33 and the long groove 28 are inserted into each other. By setting the long rod 33 and the long groove 28 and inserting the long rod 33 into the long groove 28, when the upper mold 2 slides relative to the base plate 1, the insertion of the long rod 33 into the long groove 28 ensures the synchronous stability of the bonding block 3 and the upper mold 2 during the sliding process.

[0044] In a further embodiment of the present invention, a plurality of limiting pins 17 are fixedly provided on the base plate 1. The limiting pins 17 abut against the upper mold 2. Under the support of the first spring 16, there is a certain gap between the upper mold 2 and the base plate 1. Through the supporting force of the first spring 16 and the limiting action of the limiting pins 17, the upper mold 2 is kept stable, and the phenomenon of tilting of the upper mold 2 under the support of the plurality of first springs 16 is avoided.

[0045] Working principle: During the bonding process of CG and OCA, the bonding block 3 and the upper mold 2 are in a bonded state, and the pressing buckle 53 is in a state of tightening inside the upper mold 2. The OCA is placed on the support base 11. Then, the finger pinches the pressing button 34, causing it to slide and compress the third spring 36, thus disengaging the locking pin 35 of the pressing button 34 from the through hole 13. Pulling the pressing button 34 then causes the bonding block 3 to slide and disengage from the upper mold 2. During this process, because the fourth spring 43 is in a stretched state... After the reciprocating rod 4 loses the contact limit of the contact block 3, the fourth spring 43 drives the reciprocating rod 4 and the push-pull rod 41 to slide. During the sliding process, the first protrusion 44 on the reciprocating rod 4 cooperates with the inclined groove 51, so that when the reciprocating rod 4 slides, the lifting block 5, the support tube 52 and the pressing buckle 53 move down. During the downward movement of the pressing buckle 53, the second protrusion 54 moves down from the top of the spiral part 25 of the traction groove. Under the action of the spiral part 25, the pressing buckle 53 rotates during the downward displacement, so that the pressing... The pressing position of the snap fastener 53 extends out of the upper mold 2, aligning the pressing position of the snap fastener 53 with the edge of the OCA. At this time, the second protrusion 54 is located at the connection between the spiral part 25 and the vertical part 24 of the traction groove. Subsequently, the reciprocating rod 4 continues to slide under the action of the fourth spring 43, causing the lifting block 5 to move downward with the snap fastener 53. At this time, the second protrusion 54 moves downward along the vertical part 24. During the downward movement, the snap fastener will not rotate, and the pressing position of the snap fastener 53 will be aligned with the edge of the OCA. The device is pressed to facilitate the tearing of the OCA film. At the same time, during the sliding process of the reciprocating rod 4 and the push-pull rod 41, the locking rod 27 slides in the abutment groove 42. When the push-pull rod 41 is about to complete the sliding, one side of the inner wall of the abutment groove 42 abuts against the locking rod 27 and drives the locking rod 27 to slide, so that the locking rod 27 engages with the locking groove 15 on the guide post 14, limiting the lifting and sliding of the upper mold 2, so as to ensure the stability of the upper mold 2 during the OCA film tearing process.

[0046] After the OCA film is peeled off, push the bonding block 3 to reset it. During the reset process, the bonding block 3 abuts against the reciprocating rod 4 and pushes the reciprocating rod 4 to slide and reset it. During the reset process of the reciprocating rod 4 and the push-pull rod 41, the lifting block 5 and the pressing buckle 53 move upward and reset through the cooperation of the first protrusion 44 and the inclined groove 51. During the upward movement, under the action of the vertical part 24, the pressing buckle 53 first rises vertically and then rotates and retracts into the upper mold 2. When the push-pull rod 41 is reset, it abuts against the inner wall of the other side of the groove 42 and abuts against the locking rod 27, and pushes the locking rod 27 to disengage it from the locking groove 15 on the guide post 14. After the bonding block 3 is reset, under the elastic force of the third spring 36, the locking pin 35 is inserted into the through hole 13 to complete the fixing of the bonding block 3.

[0047] Subsequently, the CG is placed on the support column 21 and supported by the second spring 22. Foam is placed on the CG, and then the fixture is placed in the vacuum bonding machine. The bonding machine platform presses down, causing the CG to descend and be compressed by the second spring 22. The upper mold 2, as a support surface, continues to press down, causing the upper mold 2 to move down and compress the first spring 16 until the upper mold 2 presses into contact with the base plate 1, completing the pressing of the CG and OCA. After pressing, under the reset action of the first spring 16 and the second spring 22, the support column 21 lifts the CG, and it can then be removed.

[0048] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A high-precision OCA bonding and positioning device, comprising a base plate (1) and an upper mold (2), characterized in that, A support base (11) is fixedly provided on the base plate (1), and a plurality of guide posts (14) are fixedly provided on the base plate (1). The upper mold (2) is slidably connected to the guide posts (14). A plurality of first springs (16) are provided between the base plate (1) and the upper mold (2). The two ends of the first springs (16) are fixedly connected to the base plate (1) and the upper mold (2) respectively. Multiple support columns (21) are slidably arranged on the upper mold (2), and multiple second springs (22) are arranged between the multiple support columns (21) and the upper mold (2). The two ends of the second springs (22) are fixedly connected to the support columns (21) and the upper mold (2) respectively. It also includes a bonding block (3), which is adapted to the upper mold (2). A plug rod (31) is fixedly provided on the bonding block (3). The plug rod (31) is slidably disposed in the support base (11). A guide block (32) is fixedly provided on the plug rod (31). A guide groove (12) is provided on the support base (11). The guide block (32) is slidably disposed in the guide groove (12). The guide groove (12) is L-shaped. A lifting block (5) is slidably provided on the upper mold (2), a support tube (52) is fixedly provided on the lifting block (5), and a press buckle (53) is rotatably provided on the support tube (52). A column (23) is fixedly provided on the upper mold (2), a traction groove is provided on the column (23), and a second protrusion (54) is fixedly provided on the pressing buckle (53), and the second protrusion (54) is slidably provided in the traction groove; The traction groove includes a vertical part (24) and a spiral part (25); A reciprocating rod (4) is slidably provided on the upper mold (2). The reciprocating rod (4) abuts against the fitting block (3). A first protrusion (44) is fixedly provided on the reciprocating rod (4). A sloping groove (51) is provided on the lifting block (5). The first protrusion (44) is slidably provided in the sloping groove (51). A fixing block (26) is fixedly provided on the upper mold (2), a sliding groove is provided on the fixing block (26), a snap-fit ​​rod (27) is slidably provided on the sliding groove, and a snap-fit ​​groove (15) is provided on one of the guide posts (14), and the snap-fit ​​rod (27) is snapped into the snap-fit ​​groove (15). A push-pull rod (41) is fixedly provided on the reciprocating rod (4), and an abutment groove (42) is provided on the push-pull rod (41). The snap-fit ​​rod (27) is slidably disposed in the abutment groove (42), and both ends of the abutment groove (42) are engaged with the snap-fit ​​rod (27). A fourth spring (43) is provided between the reciprocating rod (4) and the upper mold (2), and the two ends of the fourth spring (43) are fixedly connected to the reciprocating rod (4) and the upper mold (2) respectively.

2. The high-precision OCA bonding and positioning device according to claim 1, characterized in that, A pressing key (34) is slidably provided on the bonding block (3), and a locking pin (35) is fixedly provided on the pressing key (34). A through hole (13) is provided on the base plate (1), and the locking pin (35) is inserted into the through hole (13).

3. The high-precision OCA bonding and positioning device according to claim 2, characterized in that, A third spring (36) is provided between the pressing key (34) and the bonding block (3), and the two ends of the third spring (36) are fixedly connected to the pressing key (34) and the bonding block (3) respectively.

4. The high-precision OCA bonding and positioning device according to claim 1, characterized in that, A long rod (33) is fixedly provided on the bonding block (3), and a long groove (28) is provided on the upper mold (2). The long rod (33) and the long groove (28) are inserted into each other.

5. The high-precision OCA bonding and positioning device according to claim 1, characterized in that, Multiple limiting pins (17) are fixedly provided on the base plate (1), and the limiting pins (17) abut against the upper mold (2).

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