Material belt for secondary self-sealing of SMT (Surface Mount Technology) electronic material

Abstract

The invention provides a material belt for secondary self-sealing of SMT electronic materials, and relates to collection and packaging of bulk materials after automatic SMT electronic materials are off-line and a feeder is disassembled, the material belt comprises an upper base layer and a lower base layer, and two double-sided adhesive tapes are arranged between the two base layers. And the material belt and the material film of the electronic package material are adhered together again, so that the secondary damage of the scattered material when the feeder is disassembled is avoided, the online treatment time of the scattered material is shortened, and meanwhile, the 5S neatness requirement in the storage process of the electronic material is ensured.

Description

Technical Field

[0001] The present invention relates to the field of production of collecting and sealing bulk materials when dismantling feeders of automatic patch electronic materials, which is of great help in shortening the line change time in the production process and keeping the electronic materials neat and tidy. Background Art

[0002] With the development of the information age, the rapid update of electronic products has brought many challenges to the electronic product processing industry. Not only are the electronic components themselves becoming smaller and smaller, but the number of electronic components is also increasing. Against this background, surface mount technology came into being. It is no longer strange to use advanced placement machines to replace traditional manual soldering and use advanced machines to automatically mount the electronic materials used to the designated position of the circuit board. In the process of automatic placement, the electronic materials used must be packaged in different tapes. Here we have to talk about the tape packaging of electronic materials, which is to place the bulk electronic materials as a whole in the same direction in an anti-static tape with a material trough, and then use a material film to seal it in the material trough to prevent the scattering of electronics and facilitate the use of electronic materials on the machine. Electronic roll materials must be fed to the machine using the feeder that comes with the machine. During use, the feeder pulls open the film of the electronic roll material, and then the machine nozzle absorbs the electronic material and sticks it to the designated place on the circuit board through the edited image. However, when using the feeder, the material film must be stretched in advance (feeder structure requirements). After the production is completed, when the electronic roll material is removed from the feeder, there will always be four or five loose materials that need to be handled. It takes nearly an hour to handle these loose materials. There is a possibility of wrong materials during use (manual placement), and the loose materials may be damaged during the collection process (using tape to stick them to the material tray). This not only wastes time, but also has the risk of wrong materials, which is a serious flaw in the management of electronic materials. Summary of the Invention

[0003] Provide a tape for secondary self-sealing of SMT electronic materials, including two base layers, upper and lower, and two double-sided adhesive tapes in the middle In this new technical solution, the middle layer has two double-sided adhesive tapes, and the two double-sided adhesive tapes are arranged along the long sides of the two base layers. In this new technical solution, there is an intermittent dividing line in the middle of the wide sides of the two base layers, which can be folded in half, making it convenient to fold in half during use. In the technical solution of the present invention, the width of the two middle double-sided adhesive tapes is less than 1 mm. Brief Description Figure 1 Schematic diagram of the structure of the invention Figure 2This is the actual use structure diagram of the intermediate layer, material belt and material film in the invention Figures 1 and 2 base layers; 3 adhesive tape; 4 intermittent dividing line; 5 material strip; 6 material film.

Claims

1. A tape used for secondary self-sealing of SMT electronic materials, comprising two upper and lower base layers and two double-sided adhesive tapes in the middle.

2. A secondary self-sealing tape for electronic materials according to claim 1, characterized in that There are two double-sided adhesive tapes in the middle, and the two double-sided adhesive tapes are arranged along the long sides of the two base layers.

3. A secondary self-sealing strip of electronic materials according to claim 1, wherein a second feature is that there is an intermittent dividing line in the middle of the wide sides of the two base layers that can be folded in half, so as to facilitate folding in half during use.

4. A secondary self-sealing tape for electronic materials according to claim 2, characterized in that The width of the two double-sided adhesive tapes is less than 1 mm.

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