Glow discharge control method and device and electronic equipment

Abstract

The invention provides a glow discharge control method and device and electronic equipment, and the method comprises the steps: receiving a set discharge power and a set pressure, and controlling to enter automatic control temperature rise until the discharge power and the pressure meet an automatic control condition; in the process of automatically controlling the temperature rise, acquiring the temperature of a sample table in the reaction cavity, alternately increasing the pressure intensity and the discharge power according to the current discharge power and pressure intensity on the basis of an upper and lower limit power curve and an upper and lower limit pressure intensity curve, and entering a continuous control process until the discharge power and the pressure intensity reach final values of the temperature rise; in the continuous control process, the temperature in the reaction cavity is maintained according to the temperature upper limit, the temperature lower limit, the current discharge power and pressure, the upper and lower limit power curve and the upper and lower limit pressure curve; and in response to entering an automatic control cooling process, alternately reducing the pressure intensity and the discharge power according to the current discharge power and pressure intensity based on the upper and lower limit power curve and the upper and lower limit pressure intensity curve until the discharge power and the pressure intensity reach final values of cooling. The deposition success rate is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of microwave plasma chemical vapor deposition, and in particular to a glow discharge control method, device and electronic equipment. Background Art

[0002] The glow discharge in the microwave plasma chemical vapor deposition reaction chamber undergoes four stages: ignition, temperature rise, continuous process control, and temperature drop. The optimal glow discharge area in each stage is located directly above the sample stage, centered horizontally and above and below the intersection of the lower edge of the discharge zone and the upper edge of the sample stage. (The size of the visible discharge area may vary depending on the process gas flow.)

[0003] Different microwave energy powers and reaction chamber pressures (process gas is continuously input into the reaction chamber while the vacuum pump continuously extracts air from the reaction chamber. A stable pressure can be maintained by controlling the opening of the electric proportional valve) will cause the glow discharge area to be located at different positions in the reaction chamber, causing the center area to shift or the glow discharge to fail, thereby leading to deposition failure. Summary of the Invention

[0004] In view of the above-mentioned problems, in combination with the first aspect of the present invention, an embodiment of the present invention provides a glow discharge control method, the method comprising: In response to a glow discharge start operation, receiving a set discharge power and a set pressure of the reaction chamber input through an operation panel according to upper and lower limit power curves and upper and lower limit pressure curves, and controlling the reaction chamber to enter automatic temperature rise until the discharge power and pressure of the reaction chamber meet automatic control conditions, wherein the upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on optimal discharge power, minimum discharge power, and maximum discharge power that meet an optimal glow discharge region obtained through tests at different pressures; During the automatic temperature rise process, the temperature of the sample stage in the reaction chamber is obtained by an infrared thermometer disposed in the reaction chamber, and based on the upper and lower limit power curves and the upper and lower limit pressure curves, the pressure and the discharge power are alternately increased according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature rise, thereby entering a continuous control process; During the continuous control process, the temperature in the reaction chamber is maintained according to the upper and lower temperature limits received through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower power limit curves, and the upper and lower pressure limit curves; In response to entering the automatic control temperature reduction process, based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, the pressure and the discharge power are alternately reduced until the discharge power and the pressure of the reaction chamber reach final values ​​for temperature reduction.

[0005] In a preferred embodiment, in response to the glow discharge start-up operation, receiving the set discharge power and set pressure input into the reaction chamber through the operation panel, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and controlling to enter the automatic control temperature rise, includes: In response to the start-up operation of the glow discharge, receiving a first set pressure input through the operation panel, wherein the first set pressure is less than a first preset pressure threshold; continuously increasing the pressure in the reaction chamber according to the first set pressure, and prohibiting inputting the set discharge power of the reaction chamber through the operation panel during the process of continuously increasing the pressure, until the pressure in the reaction chamber is greater than or equal to a second preset pressure threshold, wherein the first preset pressure threshold is greater than the second preset pressure threshold; When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, receiving a set discharge power and a set pressure of the reaction chamber input through an operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, and controlling the reaction chamber to enter automatic temperature increase until the discharge power and pressure of the reaction chamber meet automatic control conditions.

[0006] In a preferred embodiment, when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, receiving the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and controlling to enter automatic control temperature increase, includes: When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, if the discharge power is less than the preset power threshold, receiving a set discharge power set through the operation panel that is between upper and lower power limits of the discharge power corresponding to the current pressure relative to the pressure, where the upper and lower power limits are determined based on upper and lower power limit curves of the discharge power relative to the pressure; When the discharge power is greater than or equal to the preset power threshold, if the pressure in the reaction chamber is less than the second preset pressure threshold, receiving a set pressure set through the operation panel that is between the pressure corresponding to the current discharge power and the upper and lower pressure limits of the discharge power, where the upper and lower pressure limits are determined based on a curve of the pressure relative to the upper and lower pressure limits of the discharge power; Until the discharge power and pressure of the reaction chamber meet the automatic control conditions, the control enters the automatic control temperature rise, and the automatic control conditions include that the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold.

[0007] In a preferred embodiment, based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, the pressure and the discharge power are alternately increased until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature increase, and a continuous control process is entered, including: Alternate the following steps: According to the current discharge power of the reaction chamber, the pressure is controlled to increase according to a preset pressure increase value until the current pressure in the reaction chamber reaches the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve; According to the current pressure of the reaction chamber, the discharge power is controlled to increase according to a preset power increase value until the current discharge power of the reaction chamber reaches the upper limit power corresponding to the current pressure in the upper and lower limit power curve; Until the discharge power and the pressure of the reaction chamber reach the final value of temperature increase, a continuous control process is entered.

[0008] In a preferred embodiment, the continuous control process, maintaining the temperature in the reaction chamber according to the upper and lower temperature limits received and inputted through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower power limit curves, and the upper and lower pressure limit curves, includes: During the continuous control process, if the temperature in the reaction chamber is higher than the upper temperature limit, the following steps are executed cyclically until the temperature in the reaction chamber is lower than the upper temperature limit, and the control is stopped: According to a first interval duration, the discharge power is reduced by a first preset power change amount until the number of times the discharge power is reduced reaches a first number threshold or the temperature in the reaction chamber is lower than the upper temperature limit, thereby stopping the current control or the discharge power is reduced to the lower power limit corresponding to the current pressure in the upper and lower power limit curves; and if the number of times the discharge power is reduced reaches the first number threshold or the discharge power is reduced to the lower power limit corresponding to the current pressure in the upper and lower power limit curves, and the temperature in the reaction chamber is still higher than the upper temperature limit, then according to a second interval duration, the pressure is reduced by a first preset pressure change amount until the number of times the pressure is reduced reaches a second number threshold or the temperature in the reaction chamber is lower than the upper temperature limit, thereby stopping the current control or the pressure is reduced to the lower pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves; During the continuous control process, if the temperature in the reaction chamber is lower than the lower temperature limit, the following steps are executed cyclically until the temperature in the reaction chamber is higher than the lower temperature limit, and the control is stopped: The pressure is increased by a second preset pressure change amount according to a third interval duration until the number of times the pressure is increased reaches a third number threshold or the temperature in the reaction chamber is higher than the lower temperature limit, at which point the current control is terminated, or the pressure is increased to an upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves. If the number of times the pressure is increased reaches the third number threshold or the pressure is increased to the upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves, and the temperature in the reaction chamber is still lower than the lower temperature limit, the discharge power is increased by a second preset power change amount according to a fourth interval duration until the number of times the discharge power is increased reaches a fourth number threshold or the temperature in the reaction chamber is higher than the lower temperature limit, at which point the current control is terminated, or the discharge power is increased to the upper pressure limit corresponding to the current pressure in the upper and lower power limit curves.

[0009] In a preferred embodiment, the step of alternately reducing the pressure and the discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature reduction comprises: Alternate the following steps: According to the current pressure of the reaction chamber, the discharge power is controlled to decrease according to a preset power reduction value until the current discharge power of the reaction chamber reaches the lower limit power corresponding to the current pressure in the upper and lower limit power curve; According to the current discharge power of the reaction chamber, the pressure is controlled to decrease according to a preset pressure reduction value until the current pressure in the reaction chamber reaches the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve; Until the discharge power and the pressure of the reaction chamber reach the final value of temperature reduction.

[0010] In a preferred embodiment, the upper and lower limit power curves include: Upper limit power curve: ;Lower power limit curve: ; Wherein, x1 is the pressure in the reaction chamber, y1 and y2 are the discharge powers respectively, y1 and y2 are the upper and lower limit discharge powers for the same pressure in the reaction chamber, a1, b1, c1, d1, and e1 are all fitted parameters, and a2, b2, c2, d2, and e2 are all fitted parameters.

[0011] In a preferred embodiment, the upper and lower limit pressure curves include: Upper limit pressure curve: ;Lower pressure curve: ; Wherein, x2 is the discharge power, y3 and y4 are the pressures in the reaction chamber respectively, y3 and y4 are the upper and lower pressure limits for the same discharge power, a3, b3, c3, d3, and e3 are all fitted parameters, and a4, b4, c4, d4, and e4 are all fitted parameters.

[0012] In conjunction with the second aspect of the present invention, an embodiment of the present invention provides a glow discharge control device, the device comprising: a receiving module configured to, in response to a glow discharge start operation, receive a set discharge power and a set pressure of the reaction chamber input through an operation panel according to upper and lower limit power curves and upper and lower limit pressure curves, and control the reaction chamber to enter automatic temperature rise control until the discharge power and pressure of the reaction chamber meet automatic control conditions, wherein the upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on optimal discharge power, minimum discharge power, and maximum discharge power that meet an optimal glow discharge region obtained through tests at different pressures; a temperature rise control module configured to obtain the temperature of the sample stage in the reaction chamber through an infrared thermometer disposed in the reaction chamber during the automatic temperature rise process, and alternately increase the pressure and the discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature rise, thereby entering a continuous control process; a continuous control module configured to maintain the temperature in the reaction chamber during the continuous control process according to the upper and lower temperature limits inputted through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower power limit curves, and the upper and lower pressure limit curves; The temperature reduction control module is configured to, in response to entering the automatic control temperature reduction process, alternately reduce the pressure and the discharge power of the reaction chamber according to the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, until the discharge power and the pressure of the reaction chamber reach final values ​​for temperature reduction.

[0013] In conjunction with the third aspect of the present invention, an embodiment of the present invention provides an electronic device, including: A processor and a machine-readable storage medium; the machine-readable storage medium is connected to the processor, the machine-readable storage medium is used to store programs, instructions or codes, and the processor is used to execute the programs, instructions or codes in the machine-readable storage medium to implement any one of the methods in the first aspect.

[0014] Compared with the prior art, the glow discharge control method, device, and electronic device provided by the present disclosure can achieve at least the following beneficial effects: The set discharge power and set pressure are received until the discharge power and pressure meet the automatic control conditions, and the control enters the automatic control temperature rise process; during the automatic control temperature rise process, the temperature of the sample stage in the reaction chamber is obtained, and based on the upper and lower limit power curves and the upper and lower limit pressure curves, the pressure and discharge power are alternately increased according to the current discharge power and pressure until the discharge power and pressure reach the final value of the temperature rise, and the continuous control process is entered; during the continuous control process, the temperature in the reaction chamber is maintained according to the upper and lower temperature limits, the current discharge power and pressure, the upper and lower limit power curves, and the upper and lower limit pressure curves; in response to entering the automatic control temperature drop process, the pressure and discharge power are alternately reduced according to the current discharge power and pressure based on the upper and lower limit power curves and the upper and lower limit pressure curves until the discharge power and pressure reach the final value of the temperature drop. In this way, during the entire process of glow ignition and continuous discharge, the matching relationship between microwave power and reaction chamber pressure can be controlled, so that the glow discharge area is stabilized at the optimal position, the success rate of glow discharge is improved, and thus the success rate of deposition is improved.

[0015] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 This is a block diagram of the architecture of the microwave plasma chemical vapor deposition device provided by an embodiment of the present invention.

[0017] Figure 2 It is a schematic diagram of the execution flow of the glow discharge control method provided by an embodiment of the present invention.

[0018] Figure 3 Schematic diagram of upper and lower power limit curves provided by an embodiment of the present invention.

[0019] Figure 4 Schematic diagram of upper and lower limit pressure curves provided by an embodiment of the present invention.

[0020] Figure 5 It is a schematic block diagram of a glow discharge control device provided by an embodiment of the present invention.

[0021] Figure 6 FIG. 4 is a schematic diagram of exemplary hardware and software components of a glow discharge control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0024] The embodiment of the present invention provides a glow discharge control method, which can be applied to an MPCVD (Microwave Plasma Chemical Vapor Deposition) device, see Figure 1 As shown, the MPCVD apparatus may include: A reaction chamber, a microwave energy source, a process gas supply unit, an electric proportional valve, a vacuum pump, and a vacuum gauge; the reaction chamber is used to provide a crystal growth environment, a sample stage is provided in the reaction chamber, the sample stage is used to support the grown crystal, the microwave energy source and the process gas supply unit are respectively connected to the reaction chamber through pipelines, the vacuum pump is connected to the reaction chamber through pipelines, and the electric proportional valve and vacuum gauge are provided on the pipeline connecting the vacuum pump and the vacuum reaction chamber.

[0025] Further, see Figure 2 As shown, the method includes the following steps.

[0026] In step S11, in response to a glow discharge start operation, the set discharge power and set pressure of the reaction chamber are input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, and the temperature rise is automatically controlled until the discharge power and pressure of the reaction chamber meet the automatic control conditions, wherein the upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on the optimal discharge power, minimum discharge power, and maximum discharge power that meet the optimal glow discharge region obtained by testing at different pressures; Glow discharge occurs when a sufficiently high voltage is applied between two electrodes, ionizing the atoms or molecules in a gas, producing electrons, ions, and neutral particles. These charged particles move under the influence of the electric field, forming an electric current and emitting a glow, hence the name glow discharge. During a glow discharge, electrons are emitted from the cathode, accelerated in the electric field, and collide with gas atoms or molecules, ionizing them and generating new electrons and ions. This creates an electron avalanche effect that sustains the discharge. Glow discharge, with its low discharge current and high voltage, is commonly used in fields such as plasma processing and thin film deposition.

[0027] The upper and lower power limit curves describe the upper and lower limits of the permissible range of discharge power in the reaction chamber as a function of pressure during a specific process. They define the appropriate range of discharge power values ​​at different stages to ensure process stability and product quality. These upper and lower power limit curves are developed based on extensive experimental data and process experience. The upper power limit prevents excessive power from causing equipment damage, sample overheating, or undesirable physical and chemical reactions; the lower power limit ensures sufficient energy to maintain glow discharge or achieve desired process effects, such as thin film growth rate and quality.

[0028] The upper and lower pressure limit curves are used to describe the upper and lower limits of the permissible range of pressure changes in the reaction chamber as a function of discharge power during the process. They control the gas environment in the reaction chamber, affecting the molecular density of the gas, reaction rate, and so on. The upper and lower pressure limit curves are also determined based on experiments and process requirements. If the upper pressure limit is too high, it may cause gas leakage, equipment sealing problems, or affect the ionization and reaction process of the gas; if the lower pressure limit is too low, it may not provide enough gas molecules to participate in the reaction, affecting process effects such as the uniformity and density of the film.

[0029] See also Figure 3 The upper and lower power limit curves are shown in FIG. 1 , which include an upper power limit curve, a curve corresponding to the optimum power, and a lower power limit curve. The upper and lower power limit curves are obtained based on the control range of the discharge power relative to the pressure; see FIG. Figure 4 The upper and lower pressure limit curves shown in the figure include the upper pressure limit curve, the curve corresponding to the optimal pressure, and the lower pressure limit curve. The upper and lower pressure limit curves are derived based on the control range of pressure relative to discharge power. The minimum starting power and pressure data were collected and determined. The minimum starting pressure is 6 Torr and the power is 480-530W. The optimal power, minimum power, and maximum power that meet the optimal glow discharge range are tested at different pressures.

[0030] It can be explained that the matching relationship between power and pressure is obtained by obtaining sampling data through the actual operation of the MPCVD device, and the best matching data between them is obtained; because the power and pressure values ​​fluctuate during the operation of the MPCVD device and the process requirements require fine-tuning the values ​​on the best data, upper and lower limits are added to the best matching data to form an upper and lower limit curve range between power and pressure. The control purpose is to maintain the power and pressure of the equipment during operation within the upper and lower limit curve range when they change.

[0031] In the disclosed embodiment, when the operator triggers the glow discharge start command via the operation panel, the system begins executing subsequent operations. The system receives the discharge power and pressure settings entered by the operator via the operation panel for the reaction chamber, based on the upper and lower power limit curves and the upper and lower pressure limit curves. These setting parameters are initial values ​​determined by the operator based on process requirements and experience, within the range specified by the upper and lower limit curves.

[0032] Furthermore, the system continuously monitors the actual discharge power and pressure of the reaction chamber and compares them with automatic control conditions. These conditions are typically a pre-set threshold range or a specific logical relationship. When the actual discharge power and pressure meet these conditions, the reaction chamber's initial state has met the requirements for automatic temperature rise. Once the discharge power and pressure of the reaction chamber meet these conditions, the system issues a control signal, initiating the automatic temperature rise phase.

[0033] In step S12, during the automatic temperature rise process, the temperature of the sample stage in the reaction chamber is obtained by an infrared thermometer disposed in the reaction chamber, and based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, the pressure and the discharge power are alternately increased until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature rise, thereby entering a continuous control process; During heating, the MPCVD apparatus is equipped with an infrared thermometer to monitor the sample stage temperature in real time. Changes in power and pressure are applied to the sample stage, serving as a reference temperature for the glow discharge. In the disclosed embodiment, an infrared thermometer located within the reaction chamber measures the sample stage temperature in real time and transmits the temperature signal to the control system.

[0034] Furthermore, according to the upper and lower limit power curves and the upper and lower limit pressure curves, combined with the current discharge power and pressure of the reaction chamber, the pressure and discharge power are alternately increased according to a certain strategy. For example, first, according to the provisions of the upper and lower limit pressure curves, the pressure in the reaction chamber is increased within a certain range to increase the density of gas molecules, which is conducive to improving the reaction rate; then, according to the provisions of the upper and lower limit power curves, the discharge power is increased to provide more energy for the reaction and promote temperature increase. This alternating increase method can avoid process instability caused by excessive adjustment of a single parameter. For example, if only the discharge power is increased without adjusting the pressure, it may cause local overheating or uneven gas ionization; conversely, if only the pressure is increased without increasing the power, it may not provide enough energy to maintain the temperature rise.

[0035] Furthermore, the discharge power and pressure of the reaction chamber are continuously monitored. When they reach the final value of the temperature increase, it means that the temperature in the reaction chamber has approached or reached the expected process temperature, and the continuous control process is entered at this time.

[0036] In step S13, during the continuous control process, the temperature in the reaction chamber is maintained according to the upper and lower temperature limits received through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower limit power curves, and the upper and lower limit pressure curves; In the disclosed embodiment, the operator receives the upper and lower temperature limits input via the control panel, and simultaneously obtains the current discharge power and pressure of the reaction chamber, as well as the upper and lower power and pressure limit curves. Based on the received parameters, the temperature of the sample stage within the reaction chamber is monitored in real time. When the temperature approaches the upper temperature limit, the system reduces the discharge power or adjusts the pressure according to a control algorithm (such as a PID control algorithm), reducing energy input to the reaction chamber and causing the temperature to drop. When the temperature approaches the lower temperature limit, the system increases the discharge power or adjusts the pressure, increasing energy input and causing the temperature to rise.

[0037] By dynamically adjusting the discharge power and pressure, the temperature in the reaction chamber is maintained between the upper and lower temperature limits, ensuring the stability of the process and the consistency of product quality.

[0038] In step S14, in response to entering the automatic control cooling process, based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, the pressure and the discharge power are alternately reduced until the discharge power and the pressure of the reaction chamber reach the final values ​​of the cooling.

[0039] In the embodiment of the present disclosure, when the operator triggers the instruction to enter the automatic control cooling process, the system starts to perform the cooling operation. Based on the upper and lower limit power curves and the upper and lower limit pressure curves, the control system alternately reduces the pressure and discharge power according to the current discharge power and pressure of the reaction chamber, following a strategy opposite to the heating process. For example, first reduce the discharge power and energy input to start the temperature drop; then reduce the pressure in the reaction chamber, reduce the density of gas molecules, and further promote the temperature drop. This alternating reduction method can ensure that the cooling process is carried out smoothly, avoiding damage to the equipment or cracks in the sample due to improper parameter adjustment.

[0040] Furthermore, the discharge power and pressure of the reaction chamber are continuously monitored. When they reach the final value of the cooling process, it indicates that the temperature in the reaction chamber has dropped to a safe range and the cooling process is completed.

[0041] The above technical solution receives the set discharge power and set pressure, and controls the process until the discharge power and pressure meet the automatic control conditions, and then enters the automatic control temperature rise process. During the automatic control temperature rise process, the temperature of the sample stage in the reaction chamber is obtained, and based on the upper and lower limit power curves and the upper and lower limit pressure curves, the pressure and discharge power are alternately increased according to the current discharge power and pressure until the discharge power and pressure reach the final value of the temperature rise, and then enters the continuous control process. During the continuous control process, the temperature in the reaction chamber is maintained according to the upper and lower temperature limits, the current discharge power and pressure, the upper and lower limit power curves, and the upper and lower limit pressure curves. In response to entering the automatic control temperature drop process, the pressure and discharge power are alternately reduced according to the current discharge power and pressure, based on the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure reach the final value of the temperature drop. In this way, during the entire process of glow ignition and continuous discharge, the matching relationship between microwave power and reaction chamber pressure can be controlled, so that the glow discharge area is stabilized at the optimal position, improving the success rate of glow discharge and crystal deposition.

[0042] In a preferred embodiment, in step S11, in response to the glow discharge start operation, receiving the set discharge power and set pressure input into the reaction chamber through the operation panel, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and controlling to enter the automatic control temperature rise, including: In step S111, in response to the start operation of the glow discharge, a first set pressure input through the operation panel is received, wherein the first set pressure is less than a first preset pressure threshold; In the disclosed embodiment, when an operator triggers a glow discharge start command via the operation panel, this electrical signal change is detected and transmitted to a central processing unit (CPU) or a dedicated control chip as a trigger signal to start subsequent processes.

[0043] The operation panel features a dedicated pressure input interface. Based on process requirements and the initial range of the upper and lower pressure curves, the operator enters a relatively low first set pressure value. This value is set lower than the first preset pressure threshold, a safety upper limit determined based on the equipment's pressure capacity, the performance of the gas supply system, and past experimental data.

[0044] In step S112, the pressure in the reaction chamber is continuously increased according to the first set pressure, and during the process of continuously increasing the pressure, inputting the set discharge power of the reaction chamber through the operation panel is prohibited until the pressure in the reaction chamber is greater than or equal to a second preset pressure threshold, wherein the first preset pressure threshold is greater than the second preset pressure threshold; In the disclosed embodiment, a control signal is sent to the gas supply system based on the received first set pressure value. The gas supply system typically includes components such as a gas source, a gas flow controller, and a valve. The control system controls the flow of gas entering the reaction chamber by adjusting the opening of the gas flow controller, thereby gradually increasing the pressure within the reaction chamber. Specifically, the gas valve is gradually opened to allow more gas to enter the reaction chamber, causing the pressure to rise accordingly.

[0045] Furthermore, during the pressure increase, the actual pressure within the reaction chamber is monitored in real time. This is achieved using a pressure sensor installed within the reaction chamber. The pressure sensor converts the pressure signal into an electrical signal, which is then transmitted to the control system's analog-to-digital converter (ADC), where it is converted into a digital signal for processing and display. Based on the deviation between the actual pressure and the target value (the first set pressure), the control system uses an appropriate control algorithm (such as the proportional-integral-derivative (PID) algorithm) to precisely adjust the gas flow rate, ensuring that the pressure rises steadily at the desired rate.

[0046] Furthermore, during the process of continuously increasing the pressure, the discharge power input function on the operation panel is locked. This is to prevent the operator from mistakenly inputting the discharge power when the pressure has not yet reached the appropriate range, resulting in an unstable discharge state in the reaction chamber, affecting the safety of the equipment and the process effect. For example, if too high a discharge power is applied when the pressure is too low, the gas may not be fully ionized, resulting in local overheating or arc discharge, and damaging the electrodes or samples in the reaction chamber. The control system uses software programming to shield the buttons or touch operations related to the discharge power input on the operation panel during the pressure increase stage. At the same time, a prompt message can be displayed on the display screen of the operation panel to inform the operator that the pressure adjustment stage is currently in progress and the input of discharge power is prohibited.

[0047] Furthermore, when the pressure within the reaction chamber exceeds or equals a second preset pressure threshold, the signal detected by the pressure sensor, after being processed by the control system, triggers a corresponding status flag change. The second preset pressure threshold is a key parameter, indicating that the gas environment within the reaction chamber has reached the conditions for safe application of discharge power. This value is typically optimized based on process requirements and equipment characteristics. When the actual pressure reaches or exceeds this value, the control system deems the pressure adjustment phase complete and unlocks the discharge power input function on the operation panel.

[0048] For example, when power = 0, it is allowed to set and output a pressure of 0-276 Torr; when the actual pressure is lower than 6 Torr, it is not allowed to set and discharge power.

[0049] In step S113, when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves are received, and the temperature is automatically increased until the discharge power and pressure of the reaction chamber meet the automatic control conditions.

[0050] In the embodiment of the present disclosure, when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, the discharge power and pressure input functions on the operation panel return to normal. The operator can input the set discharge power and set pressure value of the reaction chamber through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, combined with specific process requirements. The upper and lower limit power curves and the upper and lower limit pressure curves have been verified and optimized through a large number of experiments. They specify the reasonable value range of discharge power and pressure at different process stages to ensure process stability and product quality. The value entered by the operator will be checked for legitimacy again by the control system to ensure that it is within the range specified by the upper and lower limit curves.

[0051] Furthermore, the actual discharge power and pressure of the reaction chamber are continuously monitored and compared with the set values ​​entered by the operator and the automatic control conditions. The automatic control conditions are usually a judgment logic that integrates multiple factors. Once the discharge power and pressure of the reaction chamber meet the automatic control conditions, the control system will issue a control signal to start the automatic control temperature rise program.

[0052] In a preferred embodiment, in step S113, when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, receiving the set discharge power and set pressure of the reaction chamber input through the operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, until the discharge power and pressure of the reaction chamber meet the automatic control conditions, and controlling to enter the automatic control temperature increase, including: In step S1131, when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, if the discharge power is less than the preset power threshold, a set discharge power set through the operation panel is received, which is between upper and lower power limits of the discharge power corresponding to the current pressure relative to the pressure, where the upper and lower power limits are determined based on upper and lower power limit curves of the discharge power relative to the pressure; In the disclosed embodiment, when the pressure within the reaction chamber exceeds or equals a second preset pressure threshold, the pressure sensor converts the pressure signal into an electrical signal in real time and transmits it to the control system's analog-to-digital converter (ADC). After the ADC converts the analog signal into a digital signal, the control system compares the digital signal with the second preset pressure threshold stored in memory. Once the actual pressure reaches or exceeds this threshold, the control system partially removes restrictions on the discharge power input function on the operation panel, allowing the operator to enter discharge power-related parameters. However, this decision is further made based on the discharge power level.

[0053] The actual discharge power within the reaction chamber is continuously monitored using a power sensor. The power sensor converts the discharge power signal into an electrical signal and transmits it to the control system. After processing, the actual discharge power value is obtained. The control system compares this actual value with a preset power threshold, a key parameter determined based on process requirements and equipment characteristics. If the actual discharge power is determined to be less than the preset power threshold, the control system determines that the discharge power setting needs to be adjusted.

[0054] Furthermore, the control panel displays the upper and lower power limits corresponding to the current pressure, prompting the operator to enter a set discharge power within this range. The operator enters the set value using the buttons or touchscreen on the control panel. This value is then transmitted to the control system, which then performs another validity check to ensure that the entered set discharge power falls within the upper and lower power limits. If the entered value is valid, the control system stores it as the current set discharge power and prepares to adjust the discharge power of the reaction chamber accordingly.

[0055] In step S1132, when the discharge power is greater than or equal to the preset power threshold, if the pressure in the reaction chamber is less than the second preset pressure threshold, a set pressure set through the operation panel is received, which is between the pressure corresponding to the current discharge power and the upper and lower pressure limits of the discharge power, where the upper and lower pressure limits are determined based on a curve of the pressure relative to the upper and lower pressure limits of the discharge power; In the embodiment of the present disclosure, the actual discharge power in the reaction chamber is continuously monitored. When it is determined that the discharge power is greater than or equal to the preset power threshold, it indicates that the discharge power has reached a basic condition required by the process. As mentioned above, the pressure sensor monitors the pressure in the reaction chamber in real time and transmits the signal to the control system. The control system compares the actual pressure value with the second preset pressure threshold. When it is found that the actual pressure is less than the second preset pressure threshold, it determines that the pressure setting needs to be adjusted. For example, the second preset pressure threshold is 40Torr, and the current actual pressure is 35Torr, which means that the pressure has not yet reached the stable range required by the process.

[0056] Furthermore, the control panel displays the upper and lower pressure limits corresponding to the current discharge power, prompting the operator to enter a set pressure within this range. After the operator enters the set value through the control panel, the control system verifies its validity to ensure that the entered set pressure falls within the upper and lower pressure limits. If the input value is valid, the control system stores it as the current set pressure and prepares to adjust the reaction chamber pressure accordingly.

[0057] For example, when the actual pressure is greater than or equal to 6 Torr, the power can be set and output within the range of y1-y2; when the actual power is greater than or equal to 500W, the pressure can be set and output within the range of y3-y4.

[0058] Until the discharge power and pressure of the reaction chamber meet the automatic control conditions, the control enters the automatic control temperature rise, and the automatic control conditions include that the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold.

[0059] In the disclosed embodiment, the pressure and discharge power in the reaction chamber are continuously monitored in real time, and the actual pressure value is compared with the second preset pressure threshold, and the actual discharge power value is compared with the preset power threshold at the same time. Only when the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold, these two conditions are met at the same time, the discharge power and pressure of the reaction chamber are considered to meet the automatic control conditions. This comprehensive judgment is to ensure that the gas environment and energy input in the reaction chamber have reached a stable state suitable for automatic control of temperature rise, to avoid abnormalities in the temperature rise process due to the instability of a single parameter meeting the standard and another parameter. When the automatic control conditions are met, the control system will send a control signal to start the automatic control temperature rise program.

[0060] For example, when the actual pressure is greater than or equal to 6 Torr and the actual power is greater than or equal to 500 W, automatic control can be performed.

[0061] In a preferred embodiment, in step S12, based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, the pressure and the discharge power are alternately increased until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature increase, and a continuous control process is entered, including: Alternate the following steps: According to the current discharge power of the reaction chamber, the pressure is controlled to increase according to a preset pressure increase value until the current pressure in the reaction chamber reaches the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve; In the disclosed embodiment, a power sensor first acquires the current discharge power value of the reaction chamber in real time. This sensor converts the physical quantity of discharge power into an electrical signal. After processing by an analog-to-digital converter (ADC), the resulting digital signal is read and analyzed by the control system. Simultaneously, the control system reads pre-stored upper and lower pressure limit curve data from memory. This curve data is stored in an array or table format, recording the corresponding upper and lower pressure limits at different discharge powers. Based on the current discharge power value, the control system then searches the upper and lower pressure limit curves to determine the corresponding upper pressure limit value at the current discharge power.

[0062] Based on the preset pressure increase, a control signal is sent to the gas supply system. The gas supply system includes components such as a gas source, a gas flow controller, and valves. The control system adjusts the opening of the gas flow controller to control the gas flow entering the reaction chamber, thereby adjusting the pressure.

[0063] After each adjustment, the actual pressure value in the reaction chamber is monitored in real time by the pressure sensor and compared with the target upper pressure limit. If the actual pressure value is less than the target upper pressure limit, the control system continues to increase the gas flow according to the preset pressure increase value to continue to increase the pressure; if the actual pressure value reaches or exceeds the target upper pressure limit, the control system stops increasing the gas flow to maintain the current pressure stable. For example, if the current pressure is 40Torr, the preset pressure increase value is 2Torr / time, and the target upper pressure limit is 50Torr, the control system will first increase the gas flow to raise the pressure to 42Torr, and then test again. If it has not reached 50Torr, it will continue to increase to 44Torr, and so on, until the pressure reaches 50Torr.

[0064] According to the current pressure of the reaction chamber, the discharge power is controlled to increase according to a preset power increase value until the current discharge power of the reaction chamber reaches the upper limit power corresponding to the current pressure in the upper and lower limit power curve; In the disclosed embodiment, when the pressure within the reaction chamber reaches the upper pressure limit set in the previous stage, the control system obtains the current chamber pressure value through the pressure sensor. Simultaneously, it reads pre-stored upper and lower power limit curve data from memory. This curve data records the corresponding upper and lower power limits at different pressures.

[0065] Based on the current pressure, the control system searches the upper and lower power limit curves to determine the upper power limit corresponding to the current pressure. For example, if the current pressure is 50 Torr, the upper power limit corresponding to 50 Torr in the upper and lower power limit curve is 400W, and the lower power limit is 200W. The control system then sets 400W as the target value for this discharge power increase. Based on the preset power increase value, the control system sends a control signal to the discharge power regulator (such as the RF power controller). The discharge power regulator adjusts the output power based on the control signal, thereby changing the discharge power within the reaction chamber.

[0066] After each adjustment, the control system uses a power sensor to monitor the actual discharge power value in the reaction chamber in real time and compares it with the target upper limit power value. If the actual discharge power value is less than the target upper limit power value, the control system continues to increase the discharge power according to the preset power increase value. If the actual discharge power value reaches or exceeds the target upper limit power value, the control system stops increasing the discharge power and maintains the current power stable. For example, if the current discharge power is 300W, the preset power increase value is 20W / time, and the target upper limit power is 400W, the control system will first increase the discharge power to 320W, then test again. If it has not reached 400W, it will continue to increase to 340W, and so on, until the discharge power reaches 400W.

[0067] Until the discharge power and the pressure of the reaction chamber reach the final value of temperature increase, a continuous control process is entered.

[0068] In the disclosed embodiment, a loop structure is employed to implement the alternating execution of the two steps described above. After each step of increasing pressure based on discharge power is completed, the control system automatically switches to the step of increasing discharge power based on pressure, and vice versa. This alternating execution allows the discharge power and pressure of the reaction chamber to be gradually and smoothly adjusted to the final values ​​required for temperature increase.

[0069] For example, during the temperature rise control process: (1) when the final pressure and power setting values ​​of the temperature rise are not within the range of y1-y2 and y3-y4, the power setting value is forcibly adjusted to y1. If the power setting value is greater than 10KW, the power setting value is forcibly adjusted to 10KW. (2) first, according to the current discharge power, the pressure is controlled to increase to an increase value within the range of y3-y4 (the increase value is different for different processes each time). When the increase value is greater than y3, it is increased to y3. (3) After the actual pressure reaches the increase value, the power is controlled to increase to an increase value within the range of y1-y2 (the increase value is different for different processes each time) at the current pressure. When the increase value is greater than y1, it is increased to y1. (4) Repeat steps (1) and (2) until the pressure and power reach the final value of the temperature rise.

[0070] In a preferred embodiment, in step S13, the continuous control process includes maintaining the temperature in the reaction chamber according to the upper and lower temperature limits received through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower power limit curves, and the upper and lower pressure limit curves, including: During the continuous control process, if the temperature in the reaction chamber is higher than the upper temperature limit, the following steps are executed cyclically until the temperature in the reaction chamber is lower than the upper temperature limit, and the control is stopped: According to a first interval duration, the discharge power is reduced by a first preset power change amount until the number of times the discharge power is reduced reaches a first number threshold or the temperature in the reaction chamber is lower than the upper temperature limit, thereby stopping the current control or the discharge power is reduced to the lower power limit corresponding to the current pressure in the upper and lower power limit curves; and if the number of times the discharge power is reduced reaches the first number threshold or the discharge power is reduced to the lower power limit corresponding to the current pressure in the upper and lower power limit curves, and the temperature in the reaction chamber is still higher than the upper temperature limit, then according to a second interval duration, the pressure is reduced by a first preset pressure change amount until the number of times the pressure is reduced reaches a second number threshold or the temperature in the reaction chamber is lower than the upper temperature limit, thereby stopping the current control or the pressure is reduced to the lower pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves; In the disclosed embodiment, during the continuous control process, a temperature sensor monitors the temperature within the reaction chamber in real time, converts the signal into an electrical signal, and transmits it to the control system. The control system converts the electrical signal into a digital signal using an analog-to-digital converter (ADC) and compares it with the upper temperature limit input via the operation panel. If the temperature within the reaction chamber is detected to be above the upper temperature limit, the control system initiates a temperature adjustment process.

[0071] The first interval duration is determined based on factors such as the thermal inertia of the reaction chamber and process stability requirements. If the reaction chamber has high thermal inertia and temperature changes relatively slowly, the first interval can be set longer, such as 5 seconds, to avoid system instability caused by overly frequent adjustments. Conversely, if the thermal inertia is low, the first interval can be set shorter, such as 1 second.

[0072] The first preset power variation is set based on equipment performance and process characteristics. It ensures that each power reduction effectively reduces the energy input into the reaction chamber, thereby lowering the temperature, while also preventing excessive power changes from adversely affecting the process. For example, in a plasma etching process, the first preset power variation might be set to 10W.

[0073] Then, at a first interval, a control signal is periodically sent to a discharge power adjustment device (e.g., an RF power controller) to reduce the output power by a first predetermined power variation. After each power reduction, the control system again monitors the temperature within the reaction chamber using the temperature sensor.

[0074] The number of power reductions is recorded in a counter. If the number of power reductions reaches a first threshold (this threshold is set based on the process's allowable power adjustment range and temperature regulation efficiency, for example, 5 times), or the temperature inside the reaction chamber falls below the upper temperature limit, or the discharge power drops to the lower power limit corresponding to the current pressure in the upper and lower power limit curve (the control system searches the upper and lower power limit curve data based on the current pressure value to determine the lower power limit), the current power reduction operation is terminated.

[0075] If the number of times the discharge power is reduced reaches the first number threshold or the discharge power is reduced to the lower limit power corresponding to the current pressure in the upper and lower limit power curve, and the temperature in the reaction chamber is still higher than the upper temperature limit, the control system starts the pressure adjustment program.

[0076] The pressure is reduced over a second interval (also set based on the chamber characteristics and process requirements, and may be slightly longer or shorter than the first interval, such as 3 seconds) by a first preset pressure change (set based on the equipment's gas supply system performance and the process's pressure sensitivity, such as 2 Torr). The control system adjusts the opening of the gas flow controller to reduce the gas flow entering the chamber, thereby lowering the pressure.

[0077] After each pressure reduction, the temperature inside the reaction chamber is monitored. The number of pressure reductions is recorded by a counter. When the number of pressure reductions reaches a second threshold (for example, 4 times), or the temperature inside the reaction chamber falls below the upper temperature limit, or the pressure drops to the lower pressure limit corresponding to the current discharge power in the upper and lower pressure limit curve (the control system searches the upper and lower pressure limit curve data for the lower pressure limit value based on the current discharge power value), the pressure reduction operation is terminated.

[0078] During the continuous control process, if the temperature in the reaction chamber is lower than the lower temperature limit, the following steps are executed cyclically until the temperature in the reaction chamber is higher than the lower temperature limit, and the control is stopped: The pressure is increased by a second preset pressure change amount according to a third interval duration until the number of times the pressure is increased reaches a third number threshold or the temperature in the reaction chamber is higher than the lower temperature limit, at which point the current control is terminated, or the pressure is increased to an upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves. If the number of times the pressure is increased reaches the third number threshold or the pressure is increased to the upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves, and the temperature in the reaction chamber is still lower than the lower temperature limit, the discharge power is increased by a second preset power change amount according to a fourth interval duration until the number of times the discharge power is increased reaches a fourth number threshold or the temperature in the reaction chamber is higher than the lower temperature limit, at which point the current control is terminated, or the discharge power is increased to the upper pressure limit corresponding to the current pressure in the upper and lower power limit curves.

[0079] In the embodiment of the present disclosure, the temperature sensor continuously monitors the temperature in the reaction chamber and transmits the temperature to the control system. When the control system detects that the temperature in the reaction chamber is lower than the lower temperature limit, the temperature increase adjustment program is started.

[0080] The third interval is set based on the response time of the gas state adjustment in the reaction chamber and the stability of the process. If the gas state adjustment response is fast, the third interval can be shorter, such as 2 seconds; otherwise, it can be longer, such as 4 seconds.

[0081] The second preset pressure change is set based on the process pressure requirements and the gas supply system capabilities. For example, in a chemical vapor deposition process, the second preset pressure change might be set to 3 Torr to ensure that increasing the gas flow rate does not significantly impact the process.

[0082] Then, at a third interval, a control signal is periodically sent to the gas flow controller, causing it to increase the gas flow entering the reaction chamber by a second predetermined pressure change, thereby increasing the pressure within the reaction chamber. After each pressure increase, the control system monitors the temperature within the reaction chamber via a temperature sensor.

[0083] The number of pressure increases is recorded by a counter. If the number of pressure increases reaches the third threshold (set based on the process's allowable pressure adjustment range and temperature regulation efficiency, for example, 6 times), or the temperature inside the reaction chamber exceeds the lower temperature limit, or the pressure increases to the upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curve (the control system searches the upper and lower pressure limit curve data for the upper and lower pressure limit value based on the current discharge power value), the pressure increase operation is terminated.

[0084] If the pressure is increased for the third time or the pressure is increased to the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve, and the temperature in the reaction chamber is still lower than the lower limit temperature, the control system starts the power adjustment program.

[0085] The discharge power is increased by a second preset power increment (set based on equipment performance and process sensitivity to power, for example, 15W) according to a fourth interval (set based on the power response characteristics of the reaction chamber and process requirements, for example, 3 seconds). The control system sends a control signal to the discharge power adjustment device to increase its output power.

[0086] After each power increase, the temperature within the reaction chamber is monitored. The number of power increases is recorded by a counter. When the number of power increases reaches a fourth threshold (e.g., 5 times), or the temperature within the reaction chamber exceeds the lower temperature limit, or the discharge power increases to the upper power limit corresponding to the current pressure in the upper and lower power limit curve (the control system searches the upper and lower power limit curve data based on the current pressure value to obtain the upper power limit value), the current power increase operation is terminated.

[0087] For example, during continuous process control, (1) set the temperature upper limit and temperature lower limit; (2) when the temperature is higher than the temperature upper limit, reduce the power by a power variation (settable) at an interval of 1 minute (settable), and if the reduced power value is lower than y2 according to the current pressure, the power is reduced to y2; (3) if the temperature is lower than the temperature upper limit within 3 power reductions, stop the current adjustment; (4) if the power reduction times are greater than 3 times, or the power has been reduced to y2, and the temperature is still higher than the temperature upper limit, reduce the pressure by a pressure variation (settable) at an interval of 1 minute (settable), and if the reduced pressure value is lower than y4, the pressure is reduced to y4; (5) if the pressure reduction times are greater than 3 times, or the pressure has been reduced to y4, and the temperature is still higher than the temperature upper limit, stop the current adjustment; (6) if the pressure reduction times are greater than 3 times, or the pressure has been reduced to y4, and the temperature is still higher than the temperature upper limit, repeat the above steps (2) to (6) until the temperature is lower than the temperature upper limit, stop the current adjustment. (7) When the temperature is lower than the lower temperature limit, the pressure is increased by a pressure change (settable) at an interval of 1 minute (settable). According to the current discharge power, if the increased pressure value is higher than y3, the pressure is increased to y3; (8) If the temperature is higher than the lower temperature limit within 3 times of pressure increase, the current adjustment is stopped; (9) If the pressure is increased more than 3 times, or the pressure has increased to y3, and the temperature is still lower than the lower temperature limit, the power is increased by a power change (settable) according to the current pressure at an interval of 1 minute (settable). If the increased power value is higher than y1, the power is increased to y1; (10) If the temperature is higher than the lower temperature limit within 3 times of power increase, the current adjustment is stopped; If the power is increased more than 3 times, or the power has increased to y1, and the temperature is still higher than the lower temperature limit, the above steps (7) to (11) are repeated until the temperature is higher than the lower temperature limit, and the current adjustment is stopped.

[0088] By using the above control steps when the temperature is higher than the upper limit and lower than the lower limit, the discharge power and pressure can be flexibly adjusted according to the actual temperature conditions in the reaction chamber, combined with the upper and lower limit power curves and the upper and lower limit pressure curves, so as to maintain the temperature in the reaction chamber stable within the set range, thereby ensuring the smooth progress of the process and the stability of product quality.

[0089] In a preferred embodiment, in step S14, based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, alternately reducing the pressure and the discharge power until the discharge power and the pressure of the reaction chamber reach the final value of the temperature reduction includes: Alternate the following steps: According to the current pressure of the reaction chamber, the discharge power is controlled to decrease according to a preset power reduction value until the current discharge power of the reaction chamber reaches the lower limit power corresponding to the current pressure in the upper and lower limit power curve; In the disclosed embodiment, during the cooling process, the control system uses a high-precision pressure sensor to monitor the pressure within the reaction chamber in real time. The pressure sensor converts the pressure within the reaction chamber into an electrical signal. After signal conditioning (such as amplification and filtering), the signal is converted to a digital signal by an analog-to-digital converter (ADC) and transmitted to the control system for reading and analysis.

[0090] Read pre-stored upper and lower power limit curve data from its storage unit (such as memory, hard disk, etc.). This data is usually stored in an array or table, recording the corresponding upper and lower power limits at different pressure values. Based on the currently monitored pressure value, search the upper and lower power limit curve data. If the current pressure value happens to be a sampling point on the curve, directly obtain the corresponding lower power limit value.

[0091] The preset power reduction value is determined based on a combination of factors, including the thermal inertia of the reaction chamber, the stability requirements of the process, and the safe operating range of the equipment. If the reaction chamber has a large thermal inertia and the temperature changes relatively slowly, the preset power reduction value can be set higher to speed up the cooling process. However, if the thermal inertia is small and the temperature is sensitive to changes, the preset power reduction value should be set lower to avoid a rapid temperature drop that could lead to process instability or equipment damage. For example, in a semiconductor manufacturing process with strict temperature control requirements, the preset power reduction value might be set to 10W / time; whereas in material processing processes with a greater tolerance for temperature changes, the preset power reduction value might be set to 50W / time.

[0092] At the same time, the preset power reduction value must also take into account the performance of the discharge power adjustment device. If the discharge power adjustment device can quickly and accurately adjust the power output and responds sensitively to power changes, then the preset power reduction value can be appropriately increased; otherwise, the preset power reduction value should be reduced to ensure the smoothness and accuracy of power adjustment.

[0093] According to the current discharge power of the reaction chamber, the pressure is controlled to decrease according to a preset pressure reduction value until the current pressure in the reaction chamber reaches the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve; In the embodiment of the present disclosure, the discharge power value of the reaction chamber is monitored in real time by a power sensor, and converted into a digital signal for processing and analysis. The working principle of the power sensor is similar to that described above, converting the physical quantity of power into an electrical signal, which is then read by the control system after signal processing and conversion. The pre-stored upper and lower limit pressure curve data are read from the storage unit. These data record the corresponding upper and lower pressure limits under different discharge power values. According to the currently monitored discharge power value, the upper and lower limit pressure curves are searched to determine the corresponding lower limit pressure value under the current discharge power.

[0094] The setting of the preset pressure reduction value needs to comprehensively consider the process's pressure requirements and the performance of the gas supply system. If the process is sensitive to pressure changes and excessively rapid pressure changes may affect the process effect, then the preset pressure reduction value should be set to a smaller value. Conversely, if the process has a greater tolerance for pressure changes and in order to improve cooling efficiency, the preset pressure reduction value can be appropriately increased. For example, in a chemical vapor deposition process, the preset pressure reduction value may be set to 1 Torr / time; while in some simple material heating processes, the preset pressure reduction value can be set to 5 Torr / time.

[0095] At the same time, the preset pressure reduction value must also match the response speed and control accuracy of the gas supply system. If the gas supply system can quickly and accurately adjust the gas flow to control the pressure, then the preset pressure reduction value can be appropriately increased; otherwise, the preset pressure reduction value should be reduced to ensure the stability and accuracy of the pressure adjustment.

[0096] Until the discharge power and the pressure of the reaction chamber reach the final value of temperature reduction.

[0097] In the disclosed embodiment, a loop structure is employed to implement the alternating execution of the two steps described above. After completing the step of reducing the discharge power based on the current pressure, the control system automatically switches to the step of reducing the pressure based on the current discharge power, and vice versa. This alternating execution method can gradually and smoothly reduce the discharge power and pressure of the reaction chamber to the final values ​​required for cooling.

[0098] After each adjustment of the discharge power or pressure, the current actual discharge power and pressure values are monitored in real time and compared with the preset final cooling values. The final cooling values are determined according to specific process requirements and the safe operating range of the equipment. When the actual discharge power and pressure values reach or are lower than the final cooling values simultaneously, the control system determines that the final stage of cooling has been reached, stops the operation of alternately reducing the pressure and discharge power, and completes the cooling process. For example, if the final cooling values are set to a discharge power of 100 W and a pressure of 20 Torr, when the actually monitored discharge power is 98 W and the pressure is 19 Torr, the control system considers that the final cooling values have been reached and stops the control operation.

[0099] Exemplarily, (1) when the set values of the final pressure and power during cooling are not within the range of y1 - y2 and y3 - y4, the power set value is forced to be adjusted to y2; (2) first, according to the current pressure, the power is controlled to decrease to a decreasing value within the range of y1 - y2 (the decreasing value is different for each process), and when the decreasing value < y2, it is decreased to y2; (3) after the actual power reaches the decreasing value, then according to the current discharge power, the pressure is controlled to decrease to a decreasing value within the range of y3 - y4 (the decreasing value is different for each process), and when the decreasing value < y4, it is decreased to y4; (4) steps (1) and (2) are repeated until the pressure and power reach the final cooling values.

[0100] In a preferred embodiment, the upper and lower limit power curves include: Upper limit power curve: ; Lower limit power curve: ; where x1 is the pressure in the reaction chamber, y1 and y2 are the discharge powers respectively, y1 and y2 are the upper limit discharge power and lower limit discharge power for the same pressure in the reaction chamber, a1, b1, c1, d1, e1 are all parameters obtained by fitting, and a2, b2, c2, d2, e2 are all parameters obtained by fitting.

[0101] In a preferred embodiment, the upper and lower limit pressure curves include: Upper limit pressure curve: ; Lower limit pressure curve: ; where x2 is the discharge power, y3 and y4 are the pressures in the reaction chamber respectively, y3 and y4 are the upper limit pressure and lower limit pressure for the same discharge power, a3, b3, c3, d3, e3 are all parameters obtained by fitting, and a4, b4, c4, d4, e4 are all parameters obtained by fitting.

[0102] As shown in Table 1, the lower limit and upper limit of power can be obtained by experimenting with different pressures and optimal powers: Table 1

[0103]

[0104] By fitting the pressure, optimal power, power lower limit and power upper limit shown in Table 1, the upper and lower limit pressure curves and the upper and lower limit power curves are obtained, for example: a1, b1, c1, d1, e1 can be respectively: a1 is , b1 is , c1 is -0.0193, d1 is 31.923, e1 is 377.09; and a2, b2, c2, d2, e2 can be: a2 is , b2 is , c2 is -0.0455, d2 is 29.996, e2 is 294.17. At the same time, a3, b3, c3, d3, e3 can be: a3 is , b3 is , c3 is , d3 is 0.0154, e3 is -4.2561; and a4, b4, c4, d4, e4 can be respectively: a4 is , b4 is , c4 is , d4 is 0.019, e4 is -4.1996, and then we get Figure 3 and Figure 4 Upper and lower limit pressure curves and upper and lower limit power curves.

[0105] The embodiment of the present invention provides a glow discharge control device, see Figure 5 As shown, the device includes: The receiving module 510 is configured to receive, in response to a glow discharge start operation, a set discharge power and a set pressure of the reaction chamber input through the operation panel according to upper and lower limit power curves and upper and lower limit pressure curves, and control the reaction chamber to enter automatic temperature rise control until the discharge power and pressure of the reaction chamber meet automatic control conditions, wherein the upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on optimal discharge power, minimum discharge power, and maximum discharge power that meet the optimal glow discharge region obtained through tests at different pressures; The temperature rise control module 520 is configured to obtain the temperature of the sample stage in the reaction chamber through an infrared thermometer disposed in the reaction chamber during the automatic temperature rise process, and alternately increase the pressure and the discharge power according to the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power and the current pressure in the reaction chamber, until the discharge power and the pressure in the reaction chamber reach the final values ​​of the temperature rise, thereby entering a continuous control process; The continuous control module 530 is configured to maintain the temperature in the reaction chamber during the continuous control process according to the upper and lower temperature limits inputted through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower power limit curves, and the upper and lower pressure limit curves; The temperature reduction control module 540 is configured to, in response to entering the automatic control temperature reduction process, alternately reduce the pressure and the discharge power of the reaction chamber according to the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, until the discharge power and the pressure of the reaction chamber reach the final value of the temperature reduction.

[0106] In a preferred embodiment, the receiving module 510 is configured to: In response to the start-up operation of the glow discharge, receiving a first set pressure input through the operation panel, wherein the first set pressure is less than a first preset pressure threshold; continuously increasing the pressure in the reaction chamber according to the first set pressure, and prohibiting inputting the set discharge power of the reaction chamber through the operation panel during the process of continuously increasing the pressure, until the pressure in the reaction chamber is greater than or equal to a second preset pressure threshold, wherein the first preset pressure threshold is greater than the second preset pressure threshold; When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, receiving a set discharge power and a set pressure of the reaction chamber input through an operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, and controlling the reaction chamber to enter automatic temperature increase until the discharge power and pressure of the reaction chamber meet automatic control conditions.

[0107] In a preferred embodiment, the receiving module 510 is configured to: When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, if the discharge power is less than the preset power threshold, receiving a set discharge power set through the operation panel that is between upper and lower power limits of the discharge power corresponding to the current pressure relative to the pressure, where the upper and lower power limits are determined based on upper and lower power limit curves of the discharge power relative to the pressure; When the discharge power is greater than or equal to the preset power threshold, if the pressure in the reaction chamber is less than the second preset pressure threshold, receiving a set pressure set through the operation panel that is between the pressure corresponding to the current discharge power and the upper and lower pressure limits of the discharge power, where the upper and lower pressure limits are determined based on a curve of the pressure relative to the upper and lower pressure limits of the discharge power; Until the discharge power and pressure of the reaction chamber meet the automatic control conditions, the control enters the automatic control temperature rise, and the automatic control conditions include that the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold.

[0108] In a preferred embodiment, the temperature rise control module 520 is configured to: Alternate the following steps: According to the current discharge power of the reaction chamber, the pressure is controlled to increase according to a preset pressure increase value until the current pressure in the reaction chamber reaches the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve; According to the current pressure of the reaction chamber, the discharge power is controlled to increase according to a preset power increase value until the current discharge power of the reaction chamber reaches the upper limit power corresponding to the current pressure in the upper and lower limit power curve; Until the discharge power and the pressure of the reaction chamber reach the final value of temperature increase, a continuous control process is entered.

[0109] In a preferred embodiment, the continuous control module 530 is configured to: During the continuous control process, if the temperature in the reaction chamber is higher than the upper temperature limit, the following steps are executed cyclically until the temperature in the reaction chamber is lower than the upper temperature limit, and the control is stopped: According to a first interval duration, the discharge power is reduced by a first preset power change amount until the number of times the discharge power is reduced reaches a first number threshold or the temperature in the reaction chamber is lower than the upper temperature limit, thereby stopping the current control or the discharge power is reduced to the lower power limit corresponding to the current pressure in the upper and lower power limit curves; and if the number of times the discharge power is reduced reaches the first number threshold or the discharge power is reduced to the lower power limit corresponding to the current pressure in the upper and lower power limit curves, and the temperature in the reaction chamber is still higher than the upper temperature limit, then according to a second interval duration, the pressure is reduced by a first preset pressure change amount until the number of times the pressure is reduced reaches a second number threshold or the temperature in the reaction chamber is lower than the upper temperature limit, thereby stopping the current control or the pressure is reduced to the lower pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves; During the continuous control process, if the temperature in the reaction chamber is lower than the lower temperature limit, the following steps are executed cyclically until the temperature in the reaction chamber is higher than the lower temperature limit, and the control is stopped: The pressure is increased by a second preset pressure change amount according to a third interval duration until the number of times the pressure is increased reaches a third number threshold or the temperature in the reaction chamber is higher than the lower temperature limit, at which point the current control is terminated, or the pressure is increased to an upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves. If the number of times the pressure is increased reaches the third number threshold or the pressure is increased to the upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves, and the temperature in the reaction chamber is still lower than the lower temperature limit, the discharge power is increased by a second preset power change amount according to a fourth interval duration until the number of times the discharge power is increased reaches a fourth number threshold or the temperature in the reaction chamber is higher than the lower temperature limit, at which point the current control is terminated, or the discharge power is increased to the upper pressure limit corresponding to the current pressure in the upper and lower power limit curves.

[0110] In a preferred embodiment, the temperature reduction control module 540 is configured to: Alternate the following steps: According to the current pressure of the reaction chamber, the discharge power is controlled to decrease according to a preset power reduction value until the current discharge power of the reaction chamber reaches the lower limit power corresponding to the current pressure in the upper and lower limit power curve; According to the current discharge power of the reaction chamber, the pressure is controlled to decrease according to a preset pressure reduction value until the current pressure in the reaction chamber reaches the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve; Until the discharge power and the pressure of the reaction chamber reach the final value of temperature reduction.

[0111] In a preferred embodiment, the upper and lower limit power curves include: Upper limit power curve: ;Lower power limit curve: ; Wherein, x1 is the pressure in the reaction chamber, y1 and y2 are the discharge powers respectively, y1 and y2 are the upper and lower limit discharge powers for the same pressure in the reaction chamber, a1, b1, c1, d1, and e1 are all fitted parameters, and a2, b2, c2, d2, and e2 are all fitted parameters.

[0112] In a preferred embodiment, the upper and lower limit pressure curves include: Upper limit pressure curve: ;Lower pressure curve: ; Wherein, x2 is the discharge power, y3 and y4 are the pressures in the reaction chamber respectively, y3 and y4 are the upper and lower pressure limits for the same discharge power, a3, b3, c3, d3, and e3 are all fitted parameters, and a4, b4, c4, d4, and e4 are all fitted parameters.

[0113] An embodiment of the present invention provides an electronic device, including: processor, machine-readable storage medium; The machine-readable storage medium is connected to the processor, and the machine-readable storage medium is used to store programs, instructions or codes. The processor is used to execute the programs, instructions or codes in the machine-readable storage medium to implement any one of the methods in the aforementioned embodiments.

[0114] Figure 6 The glow discharge control device 100 shown includes a processor 1001 and a memory 1003. The processor 1001 and the memory 1003 are connected, for example, via a bus 1002. Optionally, the glow discharge control device 100 may also include a communication component 1004, which can be used for data exchange between the device 100 and other devices, such as data transmission and / or data reception. It should be noted that in actual deployment, the number of communication components 1004 is not limited to one, and the structure of the glow discharge control device 100 does not constitute a limitation on the embodiments of this application.

[0115] Processor 1001 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic device, transistor logic device, hardware component, or any combination thereof. It may implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. Processor 1001 may also be a combination that implements computing functions, such as a combination of one or more microprocessors, or a combination of a DSP and a microprocessor.

[0116] Bus 1002 may include a path for transmitting information between the above components. Bus 1002 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus. Bus 1002 may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, Figure 6 Only one thick line is used in the diagram, but this does not mean that there is only one bus or one type of bus.

[0117] The memory 1003 may be a ROM (Read Only Memory) or other type of static storage device that can store static information and instructions, a RAM (Random Access Memory) or other type of dynamic storage device that can store information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory) or other optical disk storage, optical disk storage (including compact discs, laser discs, optical discs, digital versatile discs, Blu-ray discs, etc.), magnetic disk storage media, other magnetic storage devices, or any other medium that can be used to carry or store program code and can be read by a computer, without limitation herein.

[0118] The memory 1003 is used to store program codes for executing the embodiments of the present disclosure, and the execution is controlled by the processor 1001. The processor 1001 is used to execute the program codes stored in the memory 1003 to implement the steps shown in the above-mentioned glow discharge control method embodiment.

[0119] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, various changes, modifications, replacements and variations can be made to these embodiments, and these changes, modifications, replacements and variations all fall within the scope of protection of the present disclosure.

[0120] It should also be noted that the various specific technical features described in the above specific embodiments may be combined in any suitable manner, unless there is any contradiction, and these combinations shall also be considered as the contents disclosed in this disclosure. To avoid unnecessary repetition, this disclosure will not further describe various possible combinations. The technical scope of this application is not limited to the contents of the specification and must be determined based on the scope of the claims.

Claims

1. A glow discharge control method, characterized in that: The method comprises: In response to a glow discharge start operation, receiving a set discharge power and a set pressure of the reaction chamber input through an operation panel according to upper and lower limit power curves and upper and lower limit pressure curves, and controlling the reaction chamber to enter automatic temperature rise until the discharge power and pressure of the reaction chamber meet automatic control conditions, wherein the upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on optimal discharge power, minimum discharge power, and maximum discharge power that meet an optimal glow discharge region obtained through tests at different pressures; During the automatic temperature rise process, the temperature of the sample stage in the reaction chamber is obtained by an infrared thermometer disposed in the reaction chamber, and based on the upper and lower limit power curves and the upper and lower limit pressure curves, the pressure and the discharge power are alternately increased according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature rise, thereby entering a continuous control process; During the continuous control process, the temperature in the reaction chamber is maintained according to the upper and lower temperature limits received through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower power limit curves, and the upper and lower pressure limit curves; In response to entering the automatic control temperature reduction process, based on the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, the pressure and the discharge power are alternately reduced until the discharge power and the pressure of the reaction chamber reach final values ​​for temperature reduction.

2. The glow discharge control method according to claim 1, wherein: The step of responding to the glow discharge start operation, receiving the set discharge power and set pressure input into the reaction chamber through the operation panel, and controlling the reaction chamber to enter automatic temperature rise until the discharge power and pressure meet the automatic control conditions, includes: In response to the start-up operation of the glow discharge, receiving a first set pressure input through the operation panel, wherein the first set pressure is less than a first preset pressure threshold; continuously increasing the pressure in the reaction chamber according to the first set pressure, and prohibiting inputting the set discharge power of the reaction chamber through the operation panel during the process of continuously increasing the pressure, until the pressure in the reaction chamber is greater than or equal to a second preset pressure threshold, wherein the first preset pressure threshold is greater than the second preset pressure threshold; When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, receiving a set discharge power and a set pressure of the reaction chamber input through an operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, and controlling the reaction chamber to enter automatic temperature increase until the discharge power and pressure of the reaction chamber meet automatic control conditions.

3. The glow discharge control method according to claim 2, wherein: When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, receiving a set discharge power and a set pressure of the reaction chamber input through an operation panel according to the upper and lower limit power curves and the upper and lower limit pressure curves, and controlling the reaction chamber to enter automatic temperature increase until the discharge power and pressure of the reaction chamber meet automatic control conditions, including: When the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold, if the discharge power is less than the preset power threshold, receiving a set discharge power set through the operation panel that is between upper and lower power limits of the discharge power corresponding to the current pressure relative to the pressure, where the upper and lower power limits are determined based on upper and lower power limit curves of the discharge power relative to the pressure; When the discharge power is greater than or equal to the preset power threshold, if the pressure in the reaction chamber is less than the second preset pressure threshold, receiving a set pressure set through the operation panel that is between the pressure corresponding to the current discharge power and the upper and lower pressure limits of the discharge power, where the upper and lower pressure limits are determined based on a curve of the pressure relative to the upper and lower pressure limits of the discharge power; Until the discharge power and pressure of the reaction chamber meet the automatic control conditions, the control enters the automatic control temperature rise, and the automatic control conditions include that the pressure in the reaction chamber is greater than or equal to the second preset pressure threshold and the discharge power is greater than or equal to the preset power threshold.

4. The glow discharge control method according to claim 1, wherein: The step of alternately increasing the pressure and the discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature increase and entering the continuous control process includes: Alternate the following steps: According to the current discharge power of the reaction chamber, the pressure is controlled to increase according to a preset pressure increase value until the current pressure in the reaction chamber reaches the upper limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve; According to the current pressure of the reaction chamber, the discharge power is controlled to increase according to a preset power increase value until the current discharge power of the reaction chamber reaches the upper limit power corresponding to the current pressure in the upper and lower limit power curve; Until the discharge power and the pressure of the reaction chamber reach the final value of temperature increase, a continuous control process is entered.

5. The glow discharge control method according to claim 1, wherein: The continuous control process includes maintaining the temperature in the reaction chamber according to the upper and lower temperature limits received and inputted through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower power limit curves, and the upper and lower pressure limit curves, including: During the continuous control process, if the temperature in the reaction chamber is higher than the upper temperature limit, the following steps are executed cyclically until the temperature in the reaction chamber is lower than the upper temperature limit, and the control is stopped: According to a first interval duration, the discharge power is reduced by a first preset power change amount until the number of times the discharge power is reduced reaches a first number threshold or the temperature in the reaction chamber is lower than the upper temperature limit, thereby stopping the current control or the discharge power is reduced to the lower power limit corresponding to the current pressure in the upper and lower power limit curves; and if the number of times the discharge power is reduced reaches the first number threshold or the discharge power is reduced to the lower power limit corresponding to the current pressure in the upper and lower power limit curves, and the temperature in the reaction chamber is still higher than the upper temperature limit, then according to a second interval duration, the pressure is reduced by a first preset pressure change amount until the number of times the pressure is reduced reaches a second number threshold or the temperature in the reaction chamber is lower than the upper temperature limit, thereby stopping the current control or the pressure is reduced to the lower pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves; During the continuous control process, if the temperature in the reaction chamber is lower than the lower temperature limit, the following steps are executed cyclically until the temperature in the reaction chamber is higher than the lower temperature limit, and the control is stopped: The pressure is increased by a second preset pressure change amount according to a third interval duration until the number of times the pressure is increased reaches a third number threshold or the temperature in the reaction chamber is higher than the lower temperature limit, at which point the current control is terminated, or the pressure is increased to an upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves. If the number of times the pressure is increased reaches the third number threshold or the pressure is increased to the upper pressure limit corresponding to the current discharge power in the upper and lower pressure limit curves, and the temperature in the reaction chamber is still lower than the lower temperature limit, the discharge power is increased by a second preset power change amount according to a fourth interval duration until the number of times the discharge power is increased reaches a fourth number threshold or the temperature in the reaction chamber is higher than the lower temperature limit, at which point the current control is terminated, or the discharge power is increased to the upper pressure limit corresponding to the current pressure in the upper and lower power limit curves.

6. The glow discharge control method according to claim 1, wherein: The step of alternately reducing the pressure and the discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber until the discharge power and the pressure of the reaction chamber reach final values ​​for temperature reduction includes: Alternate the following steps: According to the current pressure of the reaction chamber, the discharge power is controlled to decrease according to a preset power reduction value until the current discharge power of the reaction chamber reaches the lower limit power corresponding to the current pressure in the upper and lower limit power curve; According to the current discharge power of the reaction chamber, the pressure is controlled to decrease according to a preset pressure reduction value until the current pressure in the reaction chamber reaches the lower limit pressure corresponding to the current discharge power in the upper and lower limit pressure curve; Until the discharge power and the pressure of the reaction chamber reach the final value of temperature reduction.

7. The glow discharge control method according to any one of claims 1 to 6, characterized in that: The upper and lower limit power curves include: Upper limit power curve: ;Lower power limit curve: ; Wherein, x1 is the pressure in the reaction chamber, y1 and y2 are the discharge powers respectively, y1 and y2 are the upper and lower limit discharge powers for the same pressure in the reaction chamber, a1, b1, c1, d1, and e1 are all fitted parameters, and a2, b2, c2, d2, and e2 are all fitted parameters.

8. The glow discharge control method according to any one of claims 1 to 6, characterized in that: The upper and lower limit pressure curves include: Upper limit pressure curve: ;Lower pressure curve: ; Wherein, x2 is the discharge power, y3 and y4 are the pressures in the reaction chamber respectively, y3 and y4 are the upper and lower pressure limits for the same discharge power, a3, b3, c3, d3, and e3 are all fitted parameters, and a4, b4, c4, d4, and e4 are all fitted parameters.

9. A glow discharge control device, characterized in that: The device comprises: a receiving module configured to, in response to a glow discharge start operation, receive a set discharge power and a set pressure of the reaction chamber input through an operation panel according to upper and lower limit power curves and upper and lower limit pressure curves, and control the reaction chamber to enter automatic temperature rise control until the discharge power and pressure of the reaction chamber meet automatic control conditions, wherein the upper and lower limit power curves and the upper and lower limit pressure curves are obtained based on optimal discharge power, minimum discharge power, and maximum discharge power that meet an optimal glow discharge region obtained through tests at different pressures; a temperature rise control module configured to obtain the temperature of the sample stage in the reaction chamber through an infrared thermometer disposed in the reaction chamber during the automatic temperature rise process, and alternately increase the pressure and the discharge power based on the upper and lower limit power curves and the upper and lower limit pressure curves according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, until the discharge power and the pressure of the reaction chamber reach the final values ​​of the temperature rise, thereby entering a continuous control process; a continuous control module configured to maintain the temperature in the reaction chamber during the continuous control process according to the upper and lower temperature limits inputted through the operation panel, the current discharge power and pressure of the reaction chamber, the upper and lower power limit curves, and the upper and lower pressure limit curves; The temperature reduction control module is configured to, in response to entering the automatic control temperature reduction process, alternately reduce the pressure and the discharge power of the reaction chamber according to the upper and lower limit power curves and the upper and lower limit pressure curves, according to the current discharge power of the reaction chamber and the current pressure in the reaction chamber, until the discharge power and the pressure of the reaction chamber reach final values ​​for temperature reduction.

10. An electronic device, characterized in that: include: processor, machine-readable storage medium; The machine-readable storage medium is connected to the processor, the machine-readable storage medium is used to store programs, instructions or codes, and the processor is used to execute the programs, instructions or codes in the machine-readable storage medium to implement the method according to any one of claims 1 to 8.

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