IGBT temperature monitoring system and method based on multichannel sampling
By designing a multi-channel sampling IGBT temperature monitoring system, the efficiency and real-time issues of temperature monitoring of multiple IGBT modules in centralized energy storage converters are solved, achieving hardware resource savings and improved system reliability.
Patent Information
- Application Number
- CN202511119121.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-11
- Publication Date
- 2025-09-16
AI Technical Summary
Existing technologies are unable to efficiently and accurately monitor the temperatures of multiple IGBT modules in centralized energy storage converters, resulting in increased hardware costs or insufficient real-time performance, affecting system reliability and safety.
An IGBT temperature monitoring system based on multi-channel sampling is designed. Through the temperature signal selection circuit, voltage-frequency conversion circuit and control unit, efficient acquisition and processing of multiple NTC temperature sampling signals are achieved. The voltage signal is converted into a frequency signal using a multiplexer and voltage-frequency conversion circuit. The control unit determines the junction temperature and triggers the protection mechanism.
It achieves efficient monitoring of the temperature of multiple IGBT modules without increasing hardware resources, triggering over-temperature protection in a timely manner, and improving the reliability and safety of the system.
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Figure CN120651374A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of power electronics technology, and in particular to an IGBT temperature monitoring system and method based on multi-channel sampling. Background Art
[0002] In centralized energy storage converters, IGBTs (insulated-gate bipolar transistors) serve as core power devices, and their operating temperature directly impacts system reliability and lifespan. To prevent IGBT damage due to overheating, NTC (negative temperature coefficient) temperature sampling resistors are typically packaged within the IGBT module to monitor its junction temperature in real time. However, in practical applications, centralized energy storage converters typically utilize multiple IGBTs connected in parallel. For example, each phase may require 12 IGBT modules to form a power module, with each IGBT module containing two IGBTs and one NTC temperature sampling resistor. This means each phase has 12 NTC temperature sampling nodes, but existing driver modules typically only receive one temperature sampling signal and cannot monitor the temperatures of multiple IGBT modules simultaneously.
[0003] In the existing technology, the following two methods are usually used to solve the multi-temperature sampling problem: 1. Increase hardware resources: Configure an independent temperature detection circuit for each NTC temperature sampling node, but this approach will significantly increase hardware costs and space occupancy.
[0004] 2. Rotational sampling: Multiple NTC temperature sampling signals are collected in turn through a multiplexer. However, this method may result in insufficient real-time temperature detection and inability to respond to overtemperature conditions in a timely manner.
[0005] Therefore, how to efficiently and accurately monitor the temperature of multiple IGBT modules without increasing hardware resources has become a technical problem that needs to be solved urgently in this field. Summary of the Invention
[0006] The purpose of the present invention is to solve at least one technical problem in the background technology and provide an IGBT temperature monitoring system and method based on multi-channel sampling.
[0007] To achieve the above objectives, the present invention provides an IGBT temperature monitoring system based on multi-channel sampling, comprising: Power module, including multiple IGBTs and multiple NTC temperature sampling resistors; The drive module receives the NTC signal and converts it into a voltage signal; The temperature signal selection circuit selects an NTC signal from multiple NTC temperature sampling resistors through a multiplexer and transmits the NTC signal to the drive module for voltage signal conversion. At the same time, the multiplexer collects the voltage signals at each NTC temperature sampling resistor converted by the drive module and transmits the voltage signals to the voltage-frequency conversion circuit. The voltage-frequency conversion circuit converts the voltage signal transmitted by the temperature signal selection circuit into a frequency signal and transmits it to the control unit; The control unit determines whether the junction temperature of the IGBT module exceeds the preset threshold based on the received frequency signal. If so, the software protection mechanism is triggered to turn off the IGBT drive pulse and shut down the device.
[0008] According to one aspect of the present invention, the power module includes 12 IGBT modules, and each of the IGBT modules has two IGBTs and one NTC temperature sampling resistor encapsulated therein.
[0009] According to one aspect of the present invention, the temperature signal selection circuit includes: an acquisition circuit, a filter circuit, an amplification circuit and a clamping circuit; The acquisition circuit acquires the voltage signals at each NTC temperature sampling resistor converted by the driving module, and then sends the voltage signals to the amplifier circuit and the filter circuit in sequence for amplification and filtering processing; The clamping circuit selects the lowest voltage in the voltage signal and sends the lowest voltage to the voltage-frequency conversion circuit.
[0010] According to one aspect of the present invention, the clamping circuit selects the lowest voltage in the voltage signal through a diode.
[0011] To achieve the above object, the present invention further provides an IGBT temperature monitoring method of an IGBT temperature monitoring system based on multi-channel sampling, comprising: Initialize the temperature signal selection circuit, set the switching frequency of the multiplexer and the order of selecting the nodes of the NTC temperature sampling resistor; The voltage signal of each NTC temperature sampling node is collected in sequence through the multiplexer, and the collected voltage signal is transmitted to the voltage-frequency conversion circuit; The voltage-frequency conversion circuit converts the received voltage signal into a frequency signal and sends it to the control unit; The control unit determines whether the junction temperature of the IGBT module exceeds the preset threshold based on the received frequency signal. If so, the software protection mechanism is triggered, the IGBT drive pulse is turned off, and the device is shut down.
[0012] To achieve the above objectives, the present invention also provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the computer program implements the above-described IGBT temperature monitoring method when executed by the processor.
[0013] To achieve the above object, the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the IGBT temperature monitoring method described above is implemented.
[0014] According to the present invention, a temperature signal selection circuit is designed to efficiently collect and process multiple NTC temperature sampling signals, saving hardware resources and improving the efficiency of the temperature detection circuit. The system can monitor the temperature of multiple IGBT modules in real time and trigger overtemperature protection in a timely manner, improving system reliability and safety. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 Schematically showing a structural block diagram of an IGBT temperature monitoring system based on multi-channel sampling according to an embodiment of the present invention; Figure 2 The figure schematically shows a principle diagram of a temperature signal selection circuit according to an embodiment of the present invention. DETAILED DESCRIPTION
[0016] The present invention will now be discussed with reference to exemplary embodiments. It should be understood that the embodiments discussed are only intended to enable those skilled in the art to better understand and implement the present invention, rather than to imply any limitation on the scope of the present invention.
[0017] As used herein, the term "including" and variations thereof are to be interpreted as open-ended terms meaning "including, but not limited to." The term "based on" is to be interpreted as "based, at least in part, on." The terms "one embodiment" and "an embodiment" are to be interpreted as "at least one embodiment."
[0018] Figure 1 The following schematically shows a structural block diagram of an IGBT temperature monitoring system based on multi-channel sampling according to an embodiment of the present invention. Figure 1 As shown, in this embodiment, the IGBT temperature monitoring system based on multi-channel sampling includes: Power module, including multiple IGBTs and multiple NTC temperature sampling resistors; The drive module sends or shuts down the drive pulse for driving the IGBT according to the control instructions of the control unit; at the same time, it receives the NTC signal and converts it into a voltage signal, while enhancing the driving capability of the PWM control The temperature signal selection circuit selects an NTC signal from multiple NTC temperature sampling resistors through a multiplexer and transmits the NTC signal to the drive module for voltage signal conversion. At the same time, the multiplexer collects the voltage signals at each NTC temperature sampling resistor converted by the drive module and transmits the voltage signals to the voltage-frequency conversion circuit. The voltage-frequency conversion circuit converts the voltage signal transmitted by the temperature signal selection circuit into a frequency signal and transmits it to the control unit; The control unit determines whether the junction temperature of the IGBT module exceeds the preset threshold based on the received frequency signal. If so, it triggers the software protection mechanism (outputs the DSP over-temperature protection instruction to control the action of the drive module), turns off the IGBT drive pulse, and shuts down the equipment.
[0019] In this embodiment, the driving module is a signal processing unit, and its main function is to increase the driving capability of the signal and convert the NTC signal into a voltage signal.
[0020] Furthermore, according to an embodiment of the present invention, the power module includes 12 IGBT modules, and each IGBT module is internally encapsulated with two IGBTs and one NTC temperature sampling resistor.
[0021] Furthermore, if Figure 2 As shown, the temperature signal selection circuit is a three-way NTC temperature selection circuit. In this embodiment, 12-way temperature signal selection circuits can be realized by simply multiplexing.
[0022] Furthermore, according to an embodiment of the present invention, the temperature signal selection circuit includes: an acquisition circuit, a filtering circuit, an amplifying circuit, and a clamping circuit; The acquisition circuit collects the voltage signal at each NTC temperature sampling resistor, and then sends the voltage signal to the amplifier circuit and filter circuit for amplification and filtering processing; The clamping circuit selects the lowest voltage in the voltage signal and sends it to the voltage-frequency conversion circuit. Because NTC has a negative temperature coefficient, the higher the temperature, the smaller the resistance, and the smaller the voltage.
[0023] Furthermore, according to an embodiment of the present invention, the clamping circuit selects the lowest voltage in the voltage signal through a diode.
[0024] According to the above-described solution of the present invention, by designing a temperature signal selection circuit, the present invention achieves efficient acquisition and processing of multiple NTC temperature sampling signals, saving hardware resources and improving the efficiency of the temperature detection circuit. The system can monitor the temperature of multiple IGBT modules in real time and trigger overtemperature protection in a timely manner, thereby improving system reliability and safety.
[0025] Furthermore, to achieve the above-mentioned object, the present invention also provides an IGBT temperature monitoring method of an IGBT temperature monitoring system based on multi-channel sampling, comprising: Initialize the temperature signal selection circuit, set the switching frequency of the multiplexer and the order of selecting the nodes of the NTC temperature sampling resistor; The voltage signal of each NTC temperature sampling node is collected in sequence through the multiplexer, and the collected voltage signal is transmitted to the voltage-frequency conversion circuit; The voltage-frequency conversion circuit converts the received voltage signal into a frequency signal and sends it to the control unit; The control unit determines whether the junction temperature of the IGBT module exceeds the preset threshold based on the received frequency signal. If so, the software protection mechanism is triggered, the IGBT drive pulse is turned off, and the device is shut down.
[0026] According to the above-described solution of the present invention, by designing a temperature signal selection circuit, the present invention achieves efficient acquisition and processing of multiple NTC temperature sampling signals, saving hardware resources and improving the efficiency of the temperature detection circuit. The system can monitor the temperature of multiple IGBT modules in real time and trigger overtemperature protection in a timely manner, thereby improving system reliability and safety.
[0027] Furthermore, to achieve the above objectives, the present invention also provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the computer program implements the above-described IGBT temperature monitoring method when executed by the processor.
[0028] Furthermore, to achieve the above-mentioned object, the present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the IGBT temperature monitoring method described above is implemented.
[0029] Those skilled in the art will appreciate that the modules and algorithm steps described in conjunction with the embodiments disclosed herein can be implemented using electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.
[0030] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described devices and equipment can refer to the corresponding processes in the aforementioned method implementation methods and will not be repeated here.
[0031] In the embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the modules is merely a logical function division. In actual implementation, there may be other division methods, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.
[0032] The modules described as separate components may or may not be physically separate, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed across multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the objectives of the embodiments of the present invention.
[0033] In addition, each functional module in the embodiment of the present invention may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.
[0034] If the functions are implemented in the form of software modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, or the portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the sending / receiving method of each embodiment of the present invention. The aforementioned storage medium includes various media that can store program code, such as a USB flash drive, a mobile hard drive, ROM, RAM, a magnetic disk, or an optical disk.
[0035] The above description is merely a preferred embodiment of the present application and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solutions formed by the specific combination of the above-mentioned technical features, but also encompasses other technical solutions formed by any combination of the above-mentioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the above-mentioned features with (but not limited to) technical features with similar functions disclosed in this application.
[0036] It should be understood that the size of the serial numbers of each step in the content of the invention and the implementation methods of the present invention does not absolutely mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the implementation methods of the present invention.
Claims
1. The IGBT temperature monitoring system based on multi-channel sampling is characterized by: include: Power module, including multiple IGBTs and multiple NTC temperature sampling resistors; The drive module receives the NTC signal and converts it into a voltage signal; The temperature signal selection circuit selects an NTC signal from multiple NTC temperature sampling resistors through a multiplexer and transmits the NTC signal to the drive module for voltage signal conversion. At the same time, the multiplexer collects the voltage signals at each NTC temperature sampling resistor converted by the drive module and transmits the voltage signals to the voltage-frequency conversion circuit. The voltage-frequency conversion circuit converts the voltage signal transmitted by the temperature signal selection circuit into a frequency signal and transmits it to the control unit; The control unit determines whether the junction temperature of the IGBT module exceeds the preset threshold based on the received frequency signal. If so, the software protection mechanism is triggered to turn off the IGBT drive pulse and shut down the device.
2. The IGBT temperature monitoring system based on multi-channel sampling according to claim 1, characterized in that: The power module includes 12 IGBT modules, and each IGBT module is internally encapsulated with 2 IGBTs and 1 NTC temperature sampling resistor.
3. The IGBT temperature monitoring system based on multi-channel sampling according to claim 1, characterized in that: The temperature signal selection circuit includes: an acquisition circuit, a filter circuit, an amplification circuit and a clamping circuit; The acquisition circuit acquires the voltage signals at each NTC temperature sampling resistor converted by the driving module, and then sends the voltage signals to the amplifier circuit and the filter circuit in sequence for amplification and filtering processing; The clamping circuit selects the lowest voltage in the voltage signal and sends the lowest voltage to the voltage-frequency conversion circuit.
4. The IGBT temperature monitoring system based on multi-channel sampling according to claim 3, characterized in that: The clamping circuit selects the lowest voltage in the voltage signal through a diode.
5. The IGBT temperature monitoring method of the IGBT temperature monitoring system based on multi-channel sampling according to any one of claims 1 to 4, characterized in that: include: Initialize the temperature signal selection circuit, set the switching frequency of the multiplexer and the order of selecting the nodes of the NTC temperature sampling resistor; The voltage signal of each NTC temperature sampling node is collected in sequence through the multiplexer, and the collected voltage signal is transmitted to the voltage-frequency conversion circuit; The voltage-frequency conversion circuit converts the received voltage signal into a frequency signal and sends it to the control unit; The control unit determines whether the junction temperature of the IGBT module exceeds the preset threshold based on the received frequency signal. If so, the software protection mechanism is triggered, the IGBT drive pulse is turned off, and the device is shut down.
6. An electronic device, characterized in that The system comprises a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the computer program implements the IGBT temperature monitoring method according to claim 5 when executed by the processor.
7. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the IGBT temperature monitoring method according to claim 5 is implemented.