Device and method for testing residual stress in thin plates

Abstract

The present invention provides a thin plate residual stress testing device and a thin plate residual stress testing method. The thin plate residual stress testing device includes: a clamping support assembly, a cutting assembly, and a laser testing assembly. The clamping support assembly includes at least one clamping test structure, which includes a test bench, a first clamping portion, a second clamping portion, and a bottom support portion. The test bench has a test cavity inside, and the test bench also has a test inlet connected to the test cavity. At least a portion of the first clamping portion, the second clamping portion, and the bottom support portion are respectively disposed within the test cavity. The thin plate to be tested enters the test cavity from the test inlet along its length, and the bottom support portion is used to support the bottom of the thin plate to be tested. The cutting assembly is used to cut grooves of varying depths on the thin plate to be tested. The present invention solves the problems of low testing efficiency, complex structure, and high equipment cost in thin plate residual stress testing devices in the prior art, and can achieve fully automated testing.

Description

Technical Field

[0001] This invention relates to the field of residual stress testing technology for thin plates, and more specifically, to a device and method for testing residual stress in thin plates. Background Technology

[0002] In the processing and application of thin sheet materials, thin sheets (including metallic and non-metallic materials) are increasingly widely used in aircraft skins, automotive panels, silicon steel sheets, PCB substrates, and other fields. However, the presence of residual stress within thin sheets has become a major challenge affecting their processing accuracy and performance. Residual stress is usually generated during material processing (such as cold rolling, heat treatment, welding, etc.), which can lead to warping and deformation of the sheet during subsequent machining, chemical milling, etching, and other sheet removal processes, thereby affecting the dimensional accuracy and process quality of the finished product.

[0003] Currently, the main methods for testing residual stress inside thin plates include X-ray diffraction, neutron diffraction, and laser diffraction. These methods primarily focus on testing residual stress on the surface or near-surface region of the thin plate. Effective means are lacking for testing residual stress across the entire thickness, especially for quantitatively assessing the fluctuations in residual stress between different batches of material. Existing X-ray diffraction and neutron diffraction methods can test residual stress inside materials, but the equipment is expensive, the operation is complex, and the testing accuracy is limited by the material's thickness and surface roughness. While laser diffraction has advantages such as being non-contact and fast, it can only test surface residual stress, and its effectiveness in testing residual stress across the entire thickness is limited.

[0004] In addition, there is a lack of efficient testing equipment for testing the residual stress of thin plates in the existing technology. Some integrated testing equipment is usually complex in structure, cumbersome in operation, and difficult to achieve full automation, resulting in low testing efficiency and difficulty in meeting the needs of large-scale industrial testing.

[0005] Therefore, existing testing devices for residual stress inside thin plates have the following main drawbacks: 1. Low testing efficiency: Existing testing equipment has a complex structure and is cumbersome to operate, making it difficult to achieve fully automated testing and unsuitable for large-scale industrial testing; 2. High equipment cost: Some testing methods require expensive equipment and are complex to operate, resulting in high testing costs; 3. Lack of integrated design: Existing testing equipment is difficult to control cutting parameters precisely, and lacks cooling and debris collection systems during testing, affecting testing accuracy and equipment maintenance. Summary of the Invention

[0006] This invention provides a thin plate residual stress testing device and a thin plate residual stress testing method to at least solve the problems of low testing efficiency, complex structure and high equipment cost of existing thin plate residual stress testing devices.

[0007] To address the aforementioned problems, according to one aspect of the present invention, a thin plate residual stress testing device is provided, comprising: a clamping support assembly, a cutting assembly, and a laser testing assembly; the clamping support assembly includes at least one clamping testing structure, which includes a test platform, a first clamping part, a second clamping part, and a bottom support part; the test platform has a test cavity inside, and the test platform also has a test inlet communicating with the test cavity; at least a portion of the first clamping part, the second clamping part, and the bottom support part are respectively disposed within the test cavity, and the first clamping part is disposed at the test inlet; the thin plate to be tested enters the test cavity from the test inlet along its length direction, and the two ends of the thin plate to be tested along its length direction are a first end and a second end, respectively, with the first end close to the test inlet; the bottom support part is used to support the bottom of the thin plate to be tested; the first clamping part is used to fix the first end; the second clamping part is used to fix the second end; the cutting assembly is used to cut grooves of different depths on the thin plate to be tested; and the laser testing assembly is used to detect the warping deformation of the thin plate to be tested.

[0008] Furthermore, before grooving the thin plate to be tested, the second clamping part clamps the second end, the first clamping part separates from the first end, and the bottom support part separates from the bottom of the thin plate to be tested, so that the first end of the thin plate to be tested is suspended in the air. The laser testing component detects the warping deformation of the thin plate to be tested at this time and obtains initial deformation data. When grooving the thin plate to be tested, the second clamping part clamps the second end, the first clamping part fixes the first end, and the bottom support part supports the bottom of the thin plate to be tested. After grooving the thin plate to be tested once, the second clamping part clamps the second end, the first clamping part separates from the first end, and the bottom support part separates from the bottom of the thin plate to be tested, so that the first end of the cut thin plate to be tested is suspended in the air. The laser testing component detects the warping deformation of the thin plate to be tested at this time and obtains cutting deformation data. Based on the initial deformation data and multiple cutting deformation data obtained after grooving at different depths, the residual stress inside the thin plate to be tested is calculated.

[0009] Furthermore, the second clamping part includes a pressure head and a second limiting plate; the second limiting plate is fixedly mounted on the test bench, and the second limiting plate has a second limiting groove arranged in the vertical direction, and a part of the pressure head slides and limits the inner wall of the second limiting groove; when multiple test structures are clamped, the clamping support assembly also includes a second driving part, which is simultaneously connected to the pressure heads of multiple test structures to drive multiple pressure heads to reciprocate in the vertical direction at the same time, so as to simultaneously move closer to or away from the second end.

[0010] Furthermore, the second drive unit includes two electric pull rods and a pressure plate. The two electric pull rods are respectively connected to both ends of the pressure plate to simultaneously drive the pressure plate to move up and down. The pressure plate is respectively connected to multiple pressure heads that clamp the test structure to drive the multiple pressure heads to reciprocate in the vertical direction simultaneously.

[0011] Furthermore, the first clamping part includes an upper push rod, a first driving part, and a first limiting plate. The first limiting plate is fixedly mounted on the test bench and located above the test inlet. The first limiting plate has a first limiting groove arranged in the vertical direction, and a part of the upper push rod slides and limits the engagement with the inner wall of the first limiting groove. The first driving part is drivenly connected to the upper push rod and is used to drive the upper push rod to reciprocate in the vertical direction to move closer to or away from the first end.

[0012] Furthermore, the bottom support includes a bottom support plate and a bottom drive unit; the bottom support plate is slidably limited to the inner wall of the test chamber; the bottom drive unit is driven to connect with the bottom support plate, and the bottom drive unit is used to drive the bottom support plate to move up and down to approach or move away from the bottom of the thin plate to be tested; wherein, the upper push rod, the bottom support plate, and the thin plate to be tested are projected onto the same horizontal plane in the vertical direction, and the projection of the upper push rod is located within the projection of the bottom support plate, so that the upper push rod and the bottom support plate together clamp and fix the thin plate to be tested, and at least half of the projection of the thin plate to be tested coincides with the projection of the bottom support plate. The overlapping part is the suspended part on the thin plate to be tested, and the laser testing component detects the warping deformation of the suspended part.

[0013] Furthermore, the cutting assembly includes a support frame, a horizontal slide rail structure, a vertical slide rail structure, and a cutting part; the support frame is fixedly installed, the horizontal slide rail structure is fixedly installed on the support frame, and the vertical slide rail structure is horizontally movable on the horizontal slide rail structure; the cutting part is vertically movable on the vertical slide rail structure; the cutting part is used to cut grooves on the thin plate to be inspected.

[0014] Furthermore, the thin plate residual stress testing device also includes a base, with clamping support components and a support frame respectively fixedly mounted on the base; the cutting component also includes a tool setter, which is height-adjustable and mounted on the base. By adjusting the top height of the tool setter, the top height of the tool setter is made consistent with the bottom height of the thin plate to be tested. After the cutting part contacts the top of the tool setter, the cutting part obtains the vertical limit coordinate value. When the cutting part cuts a groove, the groove depth of the cutting part on the thin plate to be tested is determined based on the vertical limit coordinate value and the vertical displacement data of the cutting part; and / or, the cutting part includes a cutting motor and a milling cutter. The cutting motor is fixedly mounted on a vertical slide rail structure to follow the movement of the vertical slide rail structure; the cutting motor and the milling cutter are detachably driven to drive the milling cutter to cut grooves on the thin plate to be tested.

[0015] Furthermore, the laser testing assembly includes multiple laser displacement sensors, at least one of which is disposed within a test cavity of a test bench. The laser displacement sensor is used to detect the warping deformation of the thin plate to be tested located within the test cavity. When there are multiple clamping test structures, at least one laser displacement sensor is disposed on the test bench of each clamping test structure. And / or, the first clamping part includes a first limiting plate with a laser hole. The test laser emitted by the laser displacement sensor illuminates the thin plate to be tested through the laser hole to perform warping deformation detection.

[0016] Furthermore, the thin plate residual stress testing device also includes a base and multiple adjustable feet. The clamping support assembly and the cutting assembly are respectively fixedly mounted on the base. The multiple adjustable feet are spaced apart at the bottom of the base to support the base together. The base is leveled by adjusting the adjustable feet. And / or, the thin plate residual stress testing device also includes a debris collection assembly, which includes a debris collection box and a vacuum cleaner. The debris collection box is connected to the test chamber and is used to collect debris generated when the cutting assembly cuts grooves. The debris collection box has a debris discharge port. The vacuum cleaner is connected to the inside of the debris collection box through the debris discharge port. The vacuum cleaner sucks up the debris collected in the debris collection box through the debris discharge port to clean the debris collection box.

[0017] Furthermore, the thin plate residual stress testing device also includes a central controller, which is electrically connected to the clamping support assembly, the cutting assembly, and the laser testing assembly to control their coordinated operation. The device also includes a control box, inside which the central controller is located. The control box has ventilation holes and wiring harness holes. The ventilation holes are used for ventilation and heat dissipation inside the control box; the wiring harness holes are used for the wiring harness connected to the central controller. The central controller calculates the residual stress inside the thin plate under test based on initial deformation data and multiple cutting deformation data obtained after multiple groovings at different depths. The device also includes a touch screen display and a master control button. The touch screen display is electrically connected to the central controller for displaying information and touch control; the master control button is electrically connected to the central controller for controlling the opening or closing of the thin plate residual stress testing device. And / or, the device also includes a base and a protective housing, with the clamping support assembly, the cutting assembly, and the laser testing assembly respectively housed inside the protective housing; the protective housing is mounted on the base.

[0018] According to another aspect of the present invention, a method for testing residual stress in thin plates is provided. This method is applied to the aforementioned thin plate residual stress testing device and further includes the following steps: S1, clamping and fixing the second end while suspending the first end, detecting the warping deformation of the thin plate under test, and obtaining initial deformation data; S2, clamping and fixing the second end and the first end, supporting the bottom of the thin plate under test, and then performing a grooving operation on the thin plate under test at a set depth and length. After grooving, clamping the second end and suspending the first end, detecting the warping deformation of the thin plate under test, and obtaining cutting deformation data; S3, repeating step S2 multiple times to obtain multiple cutting deformation data corresponding to multiple groovings at different depths. Based on the initial deformation data and the multiple cutting deformation data, the residual stress distribution inside the thin plate under test at different depths is calculated, realizing the residual stress test of the thin plate under test along its thickness direction from the top surface to the interior.

[0019] Applying the technical solution of this invention, this invention provides a thin plate residual stress testing device, comprising: a clamping support assembly, a cutting assembly, and a laser testing assembly; the clamping support assembly includes at least one clamping testing structure, which includes a test platform, a first clamping part, a second clamping part, and a bottom support part; the test platform has a test cavity inside, and the test platform also has a test inlet communicating with the test cavity; at least a portion of the first clamping part, the second clamping part, and the bottom support part are respectively disposed in the test cavity, and the first clamping part is disposed at the test inlet; the thin plate to be tested enters the test cavity from the test inlet along its length direction, and the two ends of the thin plate to be tested along its length direction are a first end and a second end, respectively, with the first end close to the test inlet; the bottom support part is used to support the bottom of the thin plate to be tested; the first clamping part is used to fix the first end; the second clamping part is used to fix the second end; the cutting assembly is used to cut grooves of different depths on the thin plate to be tested; the laser testing assembly is used to detect the warping deformation of the thin plate to be tested.

[0020] This invention utilizes a simple structure to fix, cut, and detect internal residual stress in a thin plate by employing a clamping support assembly, a cutting assembly, and a laser testing assembly working together. Based on the grooving method, this invention achieves efficient and automatic measurement of internal residual stress in the thin plate. It releases internal stress by cutting a series of grooves into the plate, measures the warping deformation caused by stress release, and calculates the internal residual stress based on initial deformation data and multiple cutting deformation data obtained after grooving at different depths. By considering different groove depths, lengths, and widths, and the relationship between plate thickness, groove depth, and warping deformation, it achieves quantitative characterization of residual stress from the surface to the core of the thin plate, thus enabling quantitative testing of residual stress from the surface to the interior of the thin plate. The thin-plate residual stress testing device proposed in this invention can test not only surface residual stress but also residual stress along the entire thickness. This invention can quickly assess the magnitude of residual stress within the thin plate under test, as well as the fluctuation of residual stress between different batches of material. This enables effective monitoring of residual stress across multiple batches of thin plates, facilitating the establishment of residual stress control standards and improving the uniformity of residual stress in thin-plate materials. This invention features a simple structure and low cost, facilitating assembly and subsequent maintenance. It solves the problems of low testing efficiency, complex structure, and high equipment cost in existing thin-plate residual stress testing devices. It can achieve fully automated testing, improving testing efficiency for large batches of thin plates and effectively meeting the needs of industrial-scale, large-scale thin-plate residual stress testing, making it suitable for large-scale promotion and use. Attached Figure Description

[0021] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0022] Figure 1 This diagram shows a partial structural schematic of the thin-plate residual stress testing device provided in an embodiment of the present invention after the protective shell has been removed.

[0023] Figure 2 A schematic diagram of the external structure of the thin plate residual stress testing device provided in an embodiment of the present invention is shown;

[0024] Figure 3 This diagram shows a partial structural schematic of the thin plate residual stress testing device provided in an embodiment of the present invention from a frontal view angle.

[0025] Figure 4 This shows a partial structural schematic diagram of the thin plate residual stress testing device provided in an embodiment of the present invention after the protective shell has been removed, viewed from the main view angle.

[0026] Figure 5 This shows a partial structural schematic diagram of the thin plate residual stress testing device provided in an embodiment of the present invention after the protective shell has been removed, viewed from a side angle.

[0027] Figure 6 A partial structural schematic diagram of the clamping test structure provided in an embodiment of the present invention is shown;

[0028] Figure 7 This diagram shows a partial structural schematic of the clamping test structure provided in an embodiment of the present invention from a frontal view angle.

[0029] Figure 8 This diagram shows the internal structure of the clamping test structure provided in an embodiment of the present invention from a side view angle.

[0030] Figure 9 This diagram shows the internal structure of the clamping test structure provided by an embodiment of the present invention after the thin plate to be tested is placed in it from a side view.

[0031] Figure 10 This diagram shows the internal structure of the clamping test structure provided in an embodiment of the present invention when detecting initial deformation data from a side view angle;

[0032] Figure 11 This diagram shows the internal structure of the clamping test structure provided in the embodiment of the present invention when it is fully clamped and fixed to the thin plate to be tested from a side view angle;

[0033] Figure 12 This diagram illustrates the internal structure of the clamping test structure provided in an embodiment of the present invention when cutting the thin plate to be tested from a side view angle.

[0034] Figure 13 This diagram illustrates the internal structure of the clamping test structure provided in an embodiment of the present invention when detecting cutting deformation data after cutting is completed from a side view angle.

[0035] Figure 14 The diagram shows the internal structure of the clamping test structure provided in the embodiment of the present invention when the thin plate to be tested is released after cutting is completed from a side view.

[0036] The above figures include the following reference numerals:

[0037] 10. Clamping support assembly; 11. Clamping test structure; 12. Test bench; 121. Test chamber; 122. Test inlet; 13. First clamping part; 131. Upper push rod; 132. First drive part; 133. First limiting plate; 14. Second clamping part; 141. Pressure head; 142. Second limiting plate; 15. Bottom support part; 151. Bottom support plate; 152. Bottom drive part; 16. Second drive part; 161. Electric pull rod; 162. Pressure plate;

[0038] 20. Cutting assembly; 21. Support frame; 22. Horizontal slide rail structure; 23. Vertical slide rail structure; 24. Cutting part; 241. Cutting motor; 242. Milling cutter; 25. Tool setting device;

[0039] 30. Laser testing components; 31. Laser displacement sensor;

[0040] 40. Thin plate to be tested; 41. First end; 42. Second end;

[0041] 50. Base;

[0042] 60. Adjust the feet;

[0043] 70. Debris collection assembly; 71. Debris collection box; 711. Debris discharge outlet;

[0044] 80. Control box; 81. Ventilation vent; 82. Wiring harness hole;

[0045] 90. Touch screen; 100. Master control button; 110. Protective casing. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] like Figures 1 to 14As shown, an embodiment of the present invention provides a thin plate residual stress testing device, including: a clamping support assembly 10, a cutting assembly 20, and a laser testing assembly 30; the clamping support assembly 10 includes at least one clamping testing structure 11, the clamping testing structure 11 including a test platform 12, a first clamping part 13, a second clamping part 14, and a bottom support part 15; the test platform 12 has a test cavity 121 inside, and the test platform 12 also has a test inlet 122 communicating with the test cavity 121; at least a portion of the first clamping part 13, the second clamping part 14, and the bottom support part 15 are respectively disposed in the test cavity 121. A clamping part 13 is provided at the test inlet 122; the thin plate 40 to be tested enters the test chamber 121 from the test inlet 122 along its length direction. The two ends of the thin plate 40 to be tested along its length direction are the first end 41 and the second end 42, respectively. The first end 41 is close to the test inlet 122. The bottom support part 15 is used to support the bottom of the thin plate 40 to be tested; the first clamping part 13 is used to fix the first end 41; the second clamping part 14 is used to fix the second end 42; the cutting assembly 20 is used to cut grooves of different depths on the thin plate 40 to be tested; the laser testing assembly 30 is used to detect the warping deformation of the thin plate 40 to be tested.

[0048] This invention utilizes a simple structure to fix, cut, and detect internal residual stress in a thin plate 40 under test by setting up a clamping support assembly 10, a cutting assembly 20, and a laser testing assembly 30 working together. Based on the grooving method, this invention achieves efficient and automatic measurement of internal residual stress in the thin plate 40. By cutting a series of grooves into the thin plate 40, the internal stress of the material is gradually released. The warping deformation caused by stress release is measured. Based on the initial deformation data and multiple cutting deformation data obtained after grooving at different depths, the internal residual stress of the thin plate 40 is calculated. Based on different groove depths, lengths, and widths, and according to the relationship between plate thickness, groove depth, and warping deformation, the residual stress from the surface to the core of the thin plate is quantitatively characterized, thereby achieving quantitative testing of the residual stress from the surface to the interior of the thin plate 40. The thin-plate residual stress testing device proposed in this invention can test not only surface residual stress but also residual stress along the entire thickness. This invention can quickly assess the magnitude of internal residual stress in the thin plate under test, as well as the fluctuation of residual stress between different batches of material. This enables effective monitoring of residual stress across multiple batches of thin plates, helps establish residual stress control standards for thin plates, and improves the uniformity of residual stress in thin plate materials. This invention has a simple structure and low cost, is easy to assemble and maintain, and solves the problems of low testing efficiency, complex structure, and high equipment cost in existing thin-plate residual stress testing devices. It can achieve fully automated testing, improve testing efficiency for large batches of thin plates, effectively meet the needs of industrial-scale large-scale thin-plate residual stress testing, and is suitable for large-scale promotion and use.

[0049] Specifically, before the thin plate 40 to be tested is slotted, the second clamping part 14 clamps the second end 42, the first clamping part 13 separates from the first end 41, and the bottom support part 15 separates from the bottom of the thin plate 40 to be tested, so that the first end 41 of the thin plate 40 to be tested is suspended in the air. The laser testing assembly 30 detects the warping deformation of the thin plate 40 to be tested at this time and obtains the initial deformation data. When the thin plate 40 to be tested is slotted, the second clamping part 14 clamps the second end 42, the first clamping part 13 fixes the first end 41, and the bottom support part 15 supports the thin plate 40 to be tested. Bottom; After the thin plate 40 to be tested is grouted once, the second clamping part 14 clamps the second end 42, the first clamping part 13 separates from the first end 41, and the bottom support part 15 separates from the bottom of the thin plate 40 to be tested, so that the first end 41 of the thin plate 40 to be tested after cutting is suspended in the air. The laser testing component 30 detects the warping deformation of the thin plate 40 to be tested at this time and obtains a cutting deformation data. Based on the initial deformation data and multiple cutting deformation data obtained after grooving at different depths, the residual stress inside the thin plate 40 to be tested is calculated.

[0050] Through the coordinated action of the clamping support assembly 10, the cutting assembly 20, and the laser testing assembly 30, accurate testing of the residual stress inside the thin plate is achieved. The clamping support assembly 10 ensures the stable fixation of the thin plate during the testing process, the cutting assembly 20 performs precise grooving operations, and the laser testing assembly 30 monitors the warping deformation of the thin plate in real time, providing accurate data for subsequent stress calculations. Based on the grooving method, by grooving the thin plate at different depths, observing and measuring the warping changes of the thin plate before and after grooving, the distribution of internal residual stress can be calculated. The above technical solution enables efficient and automatic measurement of the residual stress inside the thin plate, solving the problems of low testing efficiency and complex structure in the prior art, and improving the accuracy and efficiency of the test. In other embodiments, the testing accuracy can be further improved by optimizing the cutting parameters of the cutting assembly 20, such as the cutting speed and cutting path.

[0051] like Figure 1 , Figure 6 and Figure 8 As shown, the second clamping part 14 includes a pressure head 141 and a second limiting plate 142; the second limiting plate 142 is fixedly mounted on the test bench 12, and the second limiting plate 142 has a second limiting groove arranged in the vertical direction, and a part of the pressure head 141 slides and limits the inner wall of the second limiting groove; when multiple test structures 11 are clamped, the clamping support assembly 10 also includes a second driving part 16, which is simultaneously driven connected to the pressure heads 141 of multiple test structures 11 to drive multiple pressure heads 141 to reciprocate in the vertical direction at the same time, so as to simultaneously approach or move away from the second end 42.

[0052] By setting a second limiting plate 142 and a second driving unit 16, the synchronous fixing and releasing of the second ends 42 of multiple thin plates can be achieved, improving the batch processing capability of the test. The second limiting groove on the second limiting plate 142 ensures the precise movement of the pressure head 141 in the vertical direction, while the second driving unit 16 realizes unified control of multiple pressure heads 141, ensuring the consistency and accuracy of the test. This setting makes the testing process more efficient, capable of processing multiple thin plates simultaneously, and greatly improving testing efficiency. In other embodiments, the driving capability of the first driving unit 132 can be increased to achieve faster fixing and releasing of the first end 41, further improving the testing speed.

[0053] like Figure 1 and Figure 4 As shown, the second drive unit 16 includes two electric pull rods 161 and a pressure plate 162. The two electric pull rods 161 are respectively connected to both ends of the pressure plate 162 to drive the pressure plate 162 to move up and down simultaneously. The pressure plate 162 is respectively connected to the pressure heads 141 of multiple clamping test structures 11 to drive the multiple pressure heads 141 to reciprocate in the vertical direction simultaneously.

[0054] The combined use of the electric pull rod 161 and the pressure plate 162 enables synchronous control of multiple pressure heads 141, ensuring stability and consistency during the testing process. The electric pull rod 161, through precise motor control, ensures the smooth lifting and lowering of the pressure plate 162, thereby driving the synchronous movement of multiple pressure heads 141 and avoiding errors caused by manual operation. This technical solution improves the automation level of the test, reduces manual intervention, and makes the testing process more efficient and accurate. In other embodiments, a hydraulic drive system can be used instead of the electric pull rod 161 to provide greater driving force, suitable for testing thicker or harder thin sheet materials.

[0055] like Figure 1 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the first clamping part 13 includes an upper push rod 131, a first driving part 132, and a first limiting plate 133. The first limiting plate 133 is fixedly mounted on the test bench 12 and is located above the test inlet 122. The first limiting plate 133 has a first limiting groove arranged in the vertical direction. A part of the upper push rod 131 slides and limits the movement with the inner wall of the first limiting groove. The first driving part 132 is driven to connect with the upper push rod 131. The first driving part 132 is used to drive the upper push rod 131 to reciprocate in the vertical direction to move closer to or away from the first end 41.

[0056] The design of the first clamping part 13 ensures the precise fixing and release of the first end 41 of the thin plate, improving the accuracy of the test. The cooperation between the upper push rod 131 and the first limiting groove restricts the movement direction of the upper push rod 131, ensuring its stable movement in the vertical direction, while the first driving part 132 provides the power for the movement of the upper push rod 131, realizing precise control of the first end 41. The above design ensures the stable fixing of the thin plate during the test, avoids test errors caused by insecure fixing, and improves the reliability of the test. In other embodiments, the movement accuracy of the upper push rod 131 can be further improved by increasing the driving accuracy of the first driving part 132, which is suitable for occasions with higher requirements for test accuracy.

[0057] like Figure 7 , Figure 8 and Figure 9 As shown, the bottom support 15 includes a bottom support plate 151 and a bottom drive 152; the bottom support plate 151 is slidably limited to the inner wall of the test chamber 121; the bottom drive 152 is driven to connect with the bottom support plate 151, and the bottom drive 152 is used to drive the bottom support plate 151 to move up and down to approach or move away from the bottom of the thin plate 40 to be tested; wherein, the upper push rod 131, the bottom support plate 151, and the thin plate 40 to be tested are projected onto the same horizontal plane in the vertical direction, and the projection of the upper push rod 131 is located within the projection of the bottom support plate 151, so that the upper push rod 131 and the bottom support plate 151 together clamp and fix the thin plate 40 to be tested, and at least half of the projection of the thin plate 40 to be tested coincides with the projection of the bottom support plate 151. The overlapping part is the suspended part on the thin plate 40 to be tested, and the laser testing assembly 30 detects the warping deformation of the suspended part.

[0058] The design of the bottom support portion 15 ensures stable support for the bottom of the thin plate and enables precise control of the bottom support. The sliding limit cooperation between the bottom support plate 151 and the inner wall of the test chamber 121 ensures stable movement in the vertical direction, while the bottom drive portion 152 provides the power for the movement of the bottom support plate 151, achieving precise control of the bottom support. This technical solution ensures stable support for the bottom of the thin plate during testing, avoiding cutting errors caused by unstable bottom support, thereby improving the accuracy and reliability of the test. In other embodiments, the performance of the bottom support portion 15 can be further improved by optimizing the driving speed and stability of the bottom drive portion 152, making it suitable for applications requiring higher testing speed and accuracy.

[0059] like Figure 1 , Figure 4 and Figure 5As shown, the cutting assembly 20 includes a support frame 21, a horizontal slide rail structure 22, a vertical slide rail structure 23, and a cutting part 24. The support frame 21 is fixedly installed, the horizontal slide rail structure 22 is fixedly installed on the support frame 21, and the vertical slide rail structure 23 is horizontally movable on the horizontal slide rail structure 22. The cutting part 24 is vertically movable on the vertical slide rail structure 23. The cutting part 24 is used to cut grooves on the thin plate 40 to be inspected.

[0060] The design of the cutting assembly 20 ensures the accuracy and stability of the grooving process. The combined use of the support frame 21, the horizontal slide rail structure 22, and the vertical slide rail structure 23 provides a precise movement trajectory for the cutting part 24, ensuring the accuracy of the grooving depth and position. This configuration enables accurate testing of residual stress inside the thin plate, improving the accuracy and reliability of the test. In other embodiments, the testing accuracy and equipment lifespan can be further improved by optimizing the cutting parameters of the cutting part 24, such as the cutting speed and the cooling system.

[0061] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the thin plate residual stress testing device also includes a base 50, with the clamping support assembly 10 and the support frame 21 respectively fixedly mounted on the base 50; the cutting assembly 20 also includes a tool setter 25, which is height-adjustably mounted on the base 50. By adjusting the top height of the tool setter 25, the top height of the tool setter 25 is made consistent with the bottom height of the thin plate 40 to be tested, and after the cutting part 24 contacts the top of the tool setter 25, the cutting part 24 obtains the vertical limit coordinate value. When the cutting part 24 cuts grooves, the groove depth of the cutting part 24 on the thin plate 40 to be tested is known based on the vertical limit coordinate value and the vertical displacement data of the cutting part 24; and / or, the cutting part 24 includes a cutting motor 241 and a milling cutter 242. The cutting motor 241 is fixedly mounted on the vertical slide rail structure 23 to follow the movement of the vertical slide rail structure 23. The cutting motor 241 is detachably driven connected to the milling cutter 242 to drive the milling cutter 242 to cut grooves on the thin plate 40 to be tested.

[0062] The combined use of the tool setter 25 and the cutting unit 24 ensures precise control of the grooving depth, improving test accuracy. The adjustment of the top height of the tool setter 25 and the acquisition of the vertical limit coordinates of the cutting unit 24 provide a benchmark for controlling the cutting depth, while the combined use of the cutting motor 241 and the milling cutter 242 enables precise cutting of thin plates. In terms of effectiveness, the above technical solution ensures precise control of the grooving depth, avoids test errors caused by inaccurate grooving depth, and improves the accuracy and reliability of the test. In other embodiments, the performance of the cutting unit 24 can be further improved by increasing the driving precision of the cutting motor 241, making it suitable for applications requiring higher test accuracy.

[0063] like Figures 8 to 14 As shown, the laser testing assembly 30 includes multiple laser displacement sensors 31. At least one laser displacement sensor 31 is disposed in the test cavity 121 of a test bench 12. The laser displacement sensor 31 is used to detect the warping deformation of the thin plate 40 to be tested located in the test cavity 121. When there are multiple clamping test structures 11, at least one laser displacement sensor 31 is disposed on the test bench 12 of each clamping test structure 11. And / or, the first clamping part 13 includes a first limiting plate 133. The first limiting plate 133 has a laser hole. The test laser emitted by the laser displacement sensor 31 irradiates the thin plate 40 to be tested through the laser hole to perform warping deformation detection.

[0064] The design of the laser testing assembly 30 ensures accurate measurement of the warpage deformation of the thin plate. The use of the laser displacement sensor 31 enables real-time monitoring of the warpage deformation, while the laser hole on the first limiting plate 133 ensures accurate irradiation of the test laser, improving the accuracy and reliability of the test. This configuration ensures accurate measurement of the warpage deformation of the thin plate, avoids test errors caused by inaccurate measurement, and improves the accuracy and reliability of the test. In other embodiments, the accuracy and reliability of the measurement can be further improved by increasing the number and precision of the laser displacement sensors 31, making it suitable for applications requiring higher testing accuracy.

[0065] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, the thin plate residual stress testing device also includes a base 50 and multiple adjustable feet 60. The clamping support assembly 10 and the cutting assembly 20 are respectively fixedly mounted on the base 50. The multiple adjustable feet 60 are spaced apart at the bottom of the base 50 to jointly support the base 50. The base 50 is leveled by adjusting the adjustable feet 60. And / or, the thin plate residual stress testing device also includes a debris collection assembly 70, which includes a debris collection box 71 and a vacuum cleaner. The debris collection box 71 is connected to the test chamber 121 and is used to collect debris generated when the cutting assembly 20 cuts grooves. The debris collection box 71 has a debris discharge port 711. The vacuum cleaner is connected to the inside of the debris collection box 71 through the debris discharge port 711 and sucks up the debris collected in the debris collection box 71 through the debris discharge port 711 to clean the debris collection box 71.

[0066] The use of adjustable feet 60 and debris collection components 70 improves the stability and cleanliness of the equipment, ensuring a tidy testing environment. The adjustable feet 60 ensure the levelness and stability of the base 50, while the debris collection components 70 effectively collect and clean debris generated during the cutting process, preventing debris from affecting the test results. In terms of effectiveness, the above technical solution improves the stability and cleanliness of the equipment, avoids test errors caused by equipment instability or an unclean testing environment, and improves the accuracy and reliability of the test. In other embodiments, the performance of the equipment can be further improved by increasing the adjustment precision of the adjustable feet 60 and the cleaning efficiency of the debris collection components 70, making it suitable for occasions with higher requirements for the testing environment.

[0067] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, the thin plate residual stress testing device also includes a central controller, which is electrically connected to the clamping support assembly 10, the cutting assembly 20, and the laser testing assembly 30 to control their coordinated operation. The device also includes a control box 80, inside which the central controller is located. The control box 80 has ventilation holes 81 and wiring harness holes 82. The ventilation holes 81 are used for ventilation and heat dissipation inside the control box 80; the wiring harness holes 82 are used for the wiring harness connected to the central controller. The central controller calculates the stress based on initial deformation data and multiple grooves at different depths. The residual stress inside the thin plate 40 to be tested is calculated from the multiple cutting deformation data obtained thereafter. The thin plate residual stress testing device also includes a touch screen 90 and a master control button 100. The touch screen 90 is electrically connected to the central controller and is used to display information and for touch control. The master control button 100 is electrically connected to the central controller and is used to control the opening or closing of the thin plate residual stress testing device. And / or, the thin plate residual stress testing device also includes a base 50 and a protective housing 110. The clamping support assembly 10, the cutting assembly 20 and the laser testing assembly 30 are respectively disposed inside the protective housing 110. The protective housing 110 is disposed on the base 50.

[0068] The use of a central controller and control box 80 enables automated control and data processing of the equipment, improving testing efficiency and accuracy. The central controller, through electrical connections with the clamping support assembly 10, cutting assembly 20, and laser testing assembly 30, achieves precise control of the testing process and real-time data processing. The touchscreen display 90 and master control button 100 provide an intuitive operating interface, simplifying the operation process. This technical solution achieves automated control and data processing of the equipment, avoiding testing errors caused by manual operation and improving testing efficiency and accuracy. In other embodiments, the performance of the equipment can be further enhanced by increasing the data processing capabilities and control precision of the central controller, making it suitable for applications requiring higher testing efficiency and accuracy.

[0069] This invention also provides a method for testing residual stress in thin plates. The method is applied to the aforementioned thin plate residual stress testing device and further includes the following steps: S1, clamping and fixing the second end 42, and suspending the first end 41, detecting the warping deformation of the thin plate 40 to be tested, and obtaining initial deformation data; S2, clamping and fixing the second end 42 and the first end 41, supporting the bottom of the thin plate 40 to be tested, and then completing a grooving at a set depth and length on the thin plate 40 to be tested. After grooving, clamping the second end 42, and suspending the first end 41, detecting the warping deformation of the thin plate 40 to be tested, and obtaining cutting deformation data; S3, repeating step S2 multiple times to obtain multiple cutting deformation data corresponding to multiple groovings at different depths. Based on the initial deformation data and multiple cutting deformation data, calculating the residual stress distribution inside the thin plate 40 at different depths, thus realizing the residual stress test of the thin plate 40 to be tested along its thickness direction from the top surface to the interior.

[0070] The testing method proposed in this invention achieves comprehensive testing of residual stress within thin plates through precise clamping, cutting, and measurement steps. By cutting grooves at different depths in the thin plate, the warping changes before and after cutting are observed and measured. Based on stress release models from elastic or plastic theories, the residual stress at the groove locations is calculated, thereby determining the residual stress distribution at different depths. In terms of effectiveness, this testing method provides information on the residual stress distribution from the surface to the core of the thin plate, which is crucial for understanding the performance of thin plate materials during manufacturing and processing. It helps improve processing techniques, reduce or control residual stress in thin plate materials, and improve product quality. In other embodiments, the efficiency and accuracy of the test can be further improved by optimizing the sequence and parameters of the testing steps, making it suitable for applications with higher requirements for testing speed and accuracy.

[0071] It should be noted that in one specific embodiment of the present invention, the existing slitting method is used to measure the internal residual stress of a thin plate. This involves gradually releasing the internal stress of the material by cutting a series of grooves into the thin plate, and then observing and measuring the warping deformation of the thin plate caused by stress release. This method can provide information on the distribution of residual stress from the surface to the core of the thin plate, which is crucial for understanding the performance of the thin plate material during manufacturing and processing. The following is a detailed process for measuring the internal residual stress of a thin plate in one specific embodiment of the present invention: 1. Preparation stage: First, the thin plate sample needs to be fixed on the test platform to ensure the sample position is stable during slitting and to avoid any external forces interfering with the test results. In the unslitting state, a high-precision measuring tool (such as a laser displacement sensor 31) is used to measure the initial deformation state of the thin plate, including flatness and curvature, as a benchmark for subsequent analysis. 2. Slitting stage: The slitting path and depth are designed according to the location and depth of the residual stress to be tested. The grooving depth typically begins at the surface and gradually increases towards the center to measure stress changes from the surface to the center. A series of grooves are cut into the thin plate along a designed path using precision cutting tools (such as high-precision wire EDM or CNC machine tools). The cutting process requires extreme care to avoid introducing additional processing stress or damaging the specimen. Cutting conditions must be controlled: cutting speed, cutting force, and cooling conditions should be controlled during grooving to ensure that the cutting process does not significantly affect the measurement results. 3. Deformation Measurement Stage: Immediately after each grooving, the warping deformation of the thin plate is measured using the same high-precision measuring tool. Deformation measurements typically include changes in thickness, curvature, and tilt of the thin plate. The amount of deformation after each grooving is recorded; this data will be used for subsequent stress calculations. 4. Data Analysis Stage: Analyzing the deformation of the thin plate requires applying stress relief models based on elastic or plastic theories. This may involve using finite element analysis (FEA) software to simulate the grooving process. By comparing the measured deformation with the deformation predicted by the theoretical model, the residual stress at the grooving location can be calculated. The magnitude and distribution of residual stress can be determined through a series of grooving and deformation measurements. During the analysis, it may be necessary to correct the measurement data to eliminate the influence of geometric irregularities in the specimen itself and temperature variations. 5. Result Verification and Application: The reliability and consistency of the measurement method are verified by repeating tests and comparing the results of different specimens. The measurement process and data analysis methods may need to be modified to improve accuracy. The measured residual stress data can be used to improve processing techniques, such as adjusting heat treatment processes and optimizing machining parameters, to reduce or control residual stress in thin sheet materials, thereby improving the performance and quality of the final product.The grooving method proposed in the embodiments of this invention can provide intuitive information about the residual stress inside the material. However, it should be noted that grooving itself introduces some local stress, which must be taken into account during data analysis to ensure the accuracy of the measurement results. Furthermore, the grooved specimen may not be reusable because it has undergone structural damage. Therefore, this must be considered when selecting specimens.

[0072] The working process and principle of a specific embodiment of the present invention will now be described in detail as follows:

[0073] The control assembly includes a control box 80, which is fixed on the base 50. The control box 80 has a ventilation hole 81 on the top and a wiring harness hole 82 on the side, through which the internal cables of the control box 80 are connected to the vertical slide rail structure 23 and the horizontal slide rail structure 22. A touch screen 90 is embedded in the protective housing 110 to display input parameters and test results. The cutting assembly 20 includes the vertical slide rail structure 23, the horizontal slide rail structure 22, the cutting motor 241, the milling cutter 242, and other main structures. The horizontal slide rail structure 22 realizes the horizontal movement function of the milling cutter 242, the vertical slide rail structure 23 realizes the vertical movement function of the milling cutter 242, and the cutting motor 241 realizes the rotary cutting of the milling cutter 242.

[0074] The upper end of the bottom drive unit 152 is hinged to the bottom support plate 151. The bottom support plate 151 can pass through the hole on the test bench 12. Under the action of the bottom drive unit 152, the bottom support plate 151 slides in the hole of the test bench 12. When the bottom support plate 151 moves upward to the maximum position, its top surface is flush with the bottom surface of the thin plate 40 to be tested.

[0075] The thin plate residual stress testing device proposed in this invention adopts an integrated design, which is convenient to operate and has high testing accuracy. It uses a laser displacement sensor 31 to collect sample deformation data in real time and accurately. The overall leveling of the device is achieved by adjusting the feet 60, ensuring the accuracy of the test. The connection between the central controller and the cutting component 20 is tight, ensuring the stability and reliability of the cutting process. The chip collection and removal structure effectively maintains the cleanliness of the working environment and improves the service life of the equipment. Overall, this device can significantly improve the efficiency and accuracy of residual stress testing of thin plate materials, and has important application benefits for controlling residual stress in thin plates and improving product quality.

[0076] like Figures 8 to 14The following details the cutting and testing process for the thin plate 40 to be tested: 1. Equipment leveling: The base 50 is leveled by adjusting the four adjusting feet 60 of the present invention; 2. Tool setting: The top of the tool setting device 25 is adjusted to be flush with the bottom of the cavity of the test bench 12 used to support the thin plate 40 to be tested; 3. The vertical slide rail structure 23 drives the cutting motor 241 to move downward, and the horizontal slide rail structure 22 drives the cutting motor 241 to move horizontally. When the milling cutter 242 contacts the tool setting device 25, the initial vertical coordinates of the bottom of the cavity of the test bench 12 are obtained. That is, after the cutting part 24 contacts the top of the tool setting device 25, the cutting part 24 obtains the vertical limit coordinate value. When the cutting part 24 cuts a groove, the groove depth of the cutting part 24 on the thin plate 40 to be tested is known according to the vertical limit coordinate value and the vertical displacement data of the cutting part 24; 4. Preparation before sample placement: Before placing the thin plate 40 to be tested into the test bench 12, as follows... Figure 8 As shown, at this time, the top of the bottom support plate 151 is flush with the bottom of the cavity of the test bench 12 used to support the thin plate 40 to be tested, the bottom of the pressure head 141 is flush with the top of the cavity of the test chamber 121, and the upper push rod 131 retracts and moves away from the bottom of the cavity; 5. As Figure 9 As shown, the thin plate 40 to be tested is placed into the test chamber 121, that is, placed at the bottom of the chamber of the test table 12 used to support the thin plate 40 to be tested; 6. As shown Figure 10 As shown, the electric pull rod 161 moves downward, driving the pressure plate 162 and the pressure head 141 to move downward, thereby bringing the pressure head 141 into contact with the thin plate 40 to be tested, thus achieving the clamping and fixing of the second end 42 of the thin plate 40 to be tested; the bottom drive part 152 retracts, driving the bottom support plate 151 to move downward, causing the bottom support plate 151 to detach from the thin plate 40 to be tested, and the upper push rod 131 retracts, causing the upper push rod 131 to detach from the first end 41 of the thin plate 40 to be tested, and the laser displacement sensor 31 collects the data of the thin plate 40 to be tested in this state, obtaining the initial deformation data; 7. As Figure 11 As shown, the bottom drive unit 152 extends, driving the bottom support plate 151 to move upward, so that the bottom support plate 151 contacts the lower surface of the thin plate 40 to be tested, and the upper push rod 131 extends, so that the upper push rod 131 presses against the first end 41 of the thin plate 40 to be tested; 8. As Figure 12 As shown, the cutting motor 241 drives the milling cutter 242 to start grooving to achieve the set grooving depth; 9. After grooving is completed, as shown... Figure 13As shown, the bottom drive unit 152 retracts, causing the bottom support plate 151 to move downwards, so that the bottom support plate 151 detaches from the thin plate 40 to be tested. The upper push rod 131 retracts, so that the upper push rod 131 detaches from the thin plate 40 to be tested. The laser displacement sensor 31 collects the distance to the thin plate 40 to be tested in this state, and obtains a cutting deformation data; 10. Repeat the above processes 7 to 9 to realize the warping amount collection test at different groove depths, obtain multiple cutting deformation data, and then calculate the residual stress inside the thin plate 40 to be tested; 11. As Figure 14 As shown, the electric pull rod 161 extends upward, driving the pressure plate 162 and the pressure head 141 to move upward, thereby causing the pressure head 141 to disengage from the thin plate 40 to be tested. The bottom drive part 152 retracts, driving the bottom support plate 151 to move upward, so that the bottom support plate 151 contacts the thin plate 40 to be tested. The upper push rod 131 retracts, causing the upper push rod 131 to disengage from the thin plate 40 to be tested, thereby allowing the sample to be removed. 12. Based on the warping deformation obtained by the laser displacement sensor 31 under different groove depths and widths, the quantitative test of the residual stress from the surface to the core of the thin plate is realized.

[0077] In summary, this invention provides a thin plate residual stress testing device and method. By setting up a clamping support assembly 10, a cutting assembly 20, and a laser testing assembly 30 to work together, this invention achieves the fixation, cutting, and internal residual stress detection of the thin plate 40 to be tested using a simple structure. Based on the grooving method detection principle and combined with related structures, this invention achieves efficient and automatic measurement of the internal residual stress of the thin plate 40 to be tested. By cutting a series of grooves on the thin plate 40 to gradually release the internal stress of the material, the warping deformation caused by stress release is measured. Then, based on the initial deformation data and multiple cutting deformation data obtained after grooving at different depths, the internal residual stress of the thin plate 40 to be tested is calculated. Based on different groove depths, lengths, and widths, and according to the relationship between plate thickness, groove depth, and warping deformation, quantitative characterization of the residual stress from the surface to the core of the thin plate is achieved, thereby realizing quantitative testing of the residual stress from the surface to the interior of the thin plate 40 to be tested. The thin-plate residual stress testing device proposed in this invention can test not only surface residual stress but also residual stress along the entire thickness. This invention can quickly assess the magnitude of internal residual stress in the thin plate under test, as well as the fluctuation of residual stress between different batches of material. This enables effective monitoring of residual stress across multiple batches of thin plates, helps establish residual stress control standards for thin plates, and improves the uniformity of residual stress in thin plate materials. This invention has a simple structure and low cost, is easy to assemble and maintain, and solves the problems of low testing efficiency, complex structure, and high equipment cost in existing thin-plate residual stress testing devices. It can achieve fully automated testing, improve testing efficiency for large batches of thin plates, effectively meet the needs of industrial-scale large-scale thin-plate residual stress testing, and is suitable for large-scale promotion and use.

[0078] The technical features of the embodiments described above can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered to be within the scope of this specification.

[0079] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0080] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0081] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0082] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0083] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0084] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A device for testing residual stress in thin plates, characterized in that, include: The assembly includes a clamping support component (10), a cutting component (20), and a laser testing component (30). The clamping support component (10) includes at least one clamping testing structure (11), which includes a test bench (12), a first clamping part (13), a second clamping part (14), and a bottom support part (15). The test bench (12) has a test cavity (121) inside, and the test bench (12) also has a test inlet (122) communicating with the test cavity (121). At least a portion of the first clamping part (13), the second clamping part (14), and the bottom support part (15) are respectively disposed in the test cavity (121), and the first clamping part (13) is disposed in the test inlet (122). The test plate (40) to be tested enters the test chamber (121) from the test inlet (122) along its length direction. The two ends of the test plate (40) along its length direction are the first end (41) and the second end (42), respectively. The first end (41) is close to the test inlet (122). The bottom support (15) is used to support the bottom of the test plate (40). The first clamping part (13) is used to fix the first end (41). The second clamping part (14) is used to fix the second end (42). The cutting assembly (20) is used to cut grooves of different depths on the test plate (40). The laser testing assembly (30) is used to detect the warping deformation of the test plate (40). The second clamping part (14) includes a pressure head (141) and a second limiting plate (142); the second limiting plate (142) is fixedly mounted on the test bench (12), and the second limiting plate (142) has a second limiting groove arranged in the vertical direction. A part of the pressure head (141) slides and limits the inner wall of the second limiting groove; when there are multiple clamping test structures (11), the clamping support assembly (10) also includes a second driving part (16), which is simultaneously driven connected to the pressure heads (141) of multiple clamping test structures (11) to drive multiple pressure heads (141) to reciprocate in the vertical direction at the same time, so as to simultaneously approach or move away from the second end (42). The second drive unit (16) includes two electric pull rods (161) and a pressure plate (162). The two electric pull rods (161) are respectively connected to the two ends of the pressure plate (162) to drive the pressure plate (162) to move up and down simultaneously. The pressure plate (162) is respectively connected to the pressure head (141) of the multiple clamping test structures (11) to drive the multiple pressure heads (141) to reciprocate in the vertical direction simultaneously.

2. The thin plate residual stress testing device according to claim 1, characterized in that, Before the thin plate (40) to be tested is slotted, the second clamping part (14) clamps the second end (42), the first clamping part (13) separates from the first end (41), and the bottom support part (15) separates from the bottom of the thin plate (40) to be tested, so that the first end (41) of the thin plate (40) to be tested is suspended. The laser testing component (30) detects the warping deformation of the thin plate (40) to be tested at this time and obtains the initial deformation data. When the thin plate (40) to be tested is slotted, the second clamping part (14) clamps the second end (42), the first clamping part (13) fixes the first end (41), and the bottom support part (15) supports the thin plate (40) to be tested. The bottom of the thin plate (40) is measured; after the thin plate (40) is grouted once, the second clamping part (14) clamps the second end (42), the first clamping part (13) separates from the first end (41), and the bottom support part (15) separates from the bottom of the thin plate (40) so that the first end (41) of the thin plate (40) after cutting is suspended. The laser testing component (30) detects the warping deformation of the thin plate (40) at this time and obtains a cutting deformation data. Based on the initial deformation data and multiple cutting deformation data obtained after grooving at different depths, the residual stress inside the thin plate (40) is calculated.

3. The thin plate residual stress testing device according to claim 1, characterized in that, The first clamping part (13) includes an upper push rod (131), a first driving part (132) and a first limiting plate (133). The first limiting plate (133) is fixedly disposed on the test bench (12) and located above the test inlet (122). The first limiting plate (133) has a first limiting groove arranged in the vertical direction. A part of the upper push rod (131) slides and limits the inner wall of the first limiting groove. The first driving part (132) is driven to connect with the upper push rod (131). The first driving part (132) is used to drive the upper push rod (131) to reciprocate in the vertical direction to move closer to or away from the first end (41).

4. The thin plate residual stress testing device according to claim 3, characterized in that, The bottom support part (15) includes a bottom support plate (151) and a bottom drive part (152); the bottom support plate (151) is slidably limited to the inner wall of the test chamber (121); the bottom drive part (152) is drivenly connected to the bottom support plate (151), and the bottom drive part (152) is used to drive the bottom support plate (151) to move up and down to get closer to or away from the bottom of the thin plate (40) to be tested; wherein, the upper push rod (131), the bottom support plate (151), and the thin plate (40) to be tested are connected. Thin plates (40) are projected onto the same horizontal plane in the vertical direction respectively. The projection of the upper top rod (131) is located within the projection of the bottom support plate (151) so that the upper top rod (131) and the bottom support plate (151) clamp and fix the thin plate (40) to be tested. At least half of the projection of the thin plate (40) to be tested coincides with the projection of the bottom support plate (151). The overlapping part is the suspended part on the thin plate (40) to be tested. The laser testing component (30) detects the warping deformation of the suspended part.

5. The thin plate residual stress testing device according to claim 1, characterized in that, The cutting assembly (20) includes a support frame (21), a horizontal slide rail structure (22), a vertical slide rail structure (23), and a cutting part (24). The support frame (21) is fixedly installed, the horizontal slide rail structure (22) is fixedly installed on the support frame (21), and the vertical slide rail structure (23) is horizontally movable on the horizontal slide rail structure (22). The cutting part (24) is vertically movable on the vertical slide rail structure (23). The cutting part (24) is used to cut grooves on the thin plate (40) to be inspected.

6. The thin plate residual stress testing device according to claim 5, characterized in that, The thin plate residual stress testing device also includes a base (50), and the clamping support assembly (10) and the support frame (21) are respectively fixedly mounted on the base (50); the cutting assembly (20) also includes a tool setter (25), which is height-adjustably mounted on the base (50). By adjusting the top height of the tool setter (25), the top height of the tool setter (25) is made consistent with the bottom height of the fixed thin plate (40) to be tested. After the cutting part (24) contacts the top of the tool setter (25), the cutting part (24) obtains the vertical limit coordinate value. When the cutting part (24) cuts grooves, the groove depth of the cutting part (24) on the thin plate (40) to be tested is known according to the vertical limit coordinate value and the vertical displacement data of the cutting part (24); and / or, the cutting part (24) includes a cutting motor (241) and a milling cutter (242), the cutting motor (241) is fixedly mounted on the vertical slide rail structure (23) to follow the movement of the vertical slide rail structure (23); the cutting motor (241) is detachably driven connected to the milling cutter (242) to drive the milling cutter (242) to cut grooves on the thin plate (40) to be tested.

7. The thin plate residual stress testing device according to claim 1, characterized in that, The laser testing assembly (30) includes multiple laser displacement sensors (31), at least one of the laser displacement sensors (31) is disposed in the test cavity (121) of the test bench (12), and the laser displacement sensor (31) is used to detect the warping deformation of the thin plate (40) to be tested located in the test cavity (121); when there are multiple clamping test structures (11), at least one of the laser displacement sensors (31) is disposed on the test bench (12) of each clamping test structure (11); and / or, the first clamping part (13) includes a first limiting plate (133), the first limiting plate (133) has a laser hole, and the test laser emitted by the laser displacement sensor (31) irradiates the thin plate (40) to be tested through the laser hole to perform warping deformation detection.

8. The thin plate residual stress testing device according to claim 1, characterized in that, The thin plate residual stress testing device also includes a base (50) and multiple adjustable feet (60). The clamping support assembly (10) and the cutting assembly (20) are respectively fixedly mounted on the base (50). The multiple adjustable feet (60) are spaced apart at the bottom of the base (50) to support the base (50). The base (50) is leveled by adjusting the adjustable feet (60). And / or, the thin plate residual stress testing device further includes a debris collection assembly (70), which includes a debris collection box (71) and a vacuum cleaner. The debris collection box (71) is connected to the test chamber (121) and is used to collect debris generated when the cutting assembly (20) cuts grooves. The debris collection box (71) has a debris discharge port (711). The vacuum cleaner is connected to the interior of the debris collection box (71) through the debris discharge port (711). The vacuum cleaner sucks up the debris collected in the debris collection box (71) through the debris discharge port (711) to clean the debris collection box (71).

9. The thin plate residual stress testing device according to claim 1, characterized in that, The thin plate residual stress testing device also includes a central controller, which is electrically connected to the clamping support assembly (10), the cutting assembly (20), and the laser testing assembly (30) to control the clamping support assembly (10), the cutting assembly (20), and the laser testing assembly (30) to work together; the thin plate residual stress testing device also includes a control box (80), in which the central controller is located, and the control box (80) has a ventilation hole (81) and a wire harness hole (82). The ventilation hole (81) is used to ventilate and dissipate heat inside the control box (80); the wire harness hole (82) is used to pass a wire harness connected to the central controller; the central controller calculates the residual stress inside the thin plate (40) to be tested based on the initial deformation data and multiple cutting deformation data obtained after multiple groovings at different depths; The thin plate residual stress testing device also includes a touch screen (90) and a master control button (100). The touch screen (90) is electrically connected to the central controller and is used to display information and perform touch control. The master control button (100) is electrically connected to the central controller and is used to control the thin plate residual stress testing device to be turned on or off. And / or, the thin plate residual stress testing device further includes a base (50) and a protective housing (110), wherein the clamping support assembly (10), the cutting assembly (20) and the laser testing assembly (30) are respectively disposed inside the protective housing (110); the protective housing (110) is disposed on the base (50).

10. A method for testing residual stress in thin plates, characterized in that, The thin plate residual stress testing method is applied to the thin plate residual stress testing apparatus according to any one of claims 1 to 9, and the thin plate residual stress testing method further includes the following steps: S1. Clamp and fix the second end (42) and suspend the first end (41) in the air, detect the warping deformation of the thin plate (40) to be tested at this time, and obtain the initial deformation data; S2. Clamp and fix the second end (42) and the first end (41), and support the bottom of the thin plate (40) to be tested. Then, make a groove on the thin plate (40) to be tested with a set depth and a set length. After the groove is completed, clamp the second end (42) and suspend the first end (41) in the air. Detect the warping deformation of the thin plate (40) to be tested at this time and obtain a cutting deformation data. S3. Repeat step S2 multiple times to obtain multiple cutting deformation data corresponding to multiple grooves of different depths. Based on the initial deformation data and multiple cutting deformation data, calculate the residual stress distribution inside the thin plate (40) under different depths, and realize the residual stress test of the thin plate (40) under test from the upper surface to the interior along its thickness direction.

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