Device for testing shock resistance of barrel for semiconductor

Abstract

The invention discloses a semiconductor barrel impact resistance testing device, which specifically comprises a clamping assembly, a support assembly, a rotating assembly, an impact assembly and a heating assembly, and is characterized in that the clamping assembly is used for clamping a barrel body, and the support assembly is arranged on the ground or other supporting structures; the impact assembly is rotationally installed on the support assembly, the rotating assembly is used for driving the impact assembly to rotate, an impact block is arranged in the impact assembly and used for simulating internal impact borne by the barrel body, and the heating assembly is arranged in the barrel body and used for regulating and controlling the temperature in the barrel body; the rotating assembly comprises a trigger piece, and the trigger piece is used for regulating and controlling the punching speed of the impact block. The impact speed of the impact block is adjusted through the trigger piece, and internal stress impacts with different strengths are simulated; meanwhile, the heating assembly enables the barrel body to be in a specific temperature field, irregular impact at different temperatures in actual working conditions is simulated, and the impact resistance of the barrel body is comprehensively evaluated.

Description

Technical Field

[0001] The present invention relates to the technical field of impact resistance testing, and in particular to a device for testing the impact resistance of a semiconductor barrel. Background Art

[0002] Semiconductor drums are specialized containers used to carry, protect, transport, and store semiconductor wafers. They are used to store liquids such as semiconductor etching solutions and photoresists, as well as in semiconductor manufacturing, testing, and packaging processes. Shock resistance testing devices simulate external forces such as drops, collisions, and vibrations to test the physical integrity, structural stability, and cushioning performance of materials or equipment under impact. In the semiconductor drum sector, this test device is used to evaluate the ability of the drum and its internal structure to protect sensitive components such as wafers, ensuring that wafers remain intact even in the event of unexpected external forces.

[0003] The existing plastic barrel impact resistance testing device is shown in the Chinese application with application number: 202410623606.4: A plastic barrel impact resistance testing device, which mainly includes a base, a lifting assembly, an angle control assembly and a clamping assembly. The lifting assembly is installed on the lifting column, the angle control assembly is installed on the lifting bracket, and the clamping assembly is installed on the lifting bracket. The clamping assembly is used to fix the position of the plastic barrel. Through the setting of the angle control assembly and the lifting assembly, the plastic barrel can be dropped from various angles, thereby improving the impact resistance test accuracy of the plastic barrel.

[0004] However, in the actual operation of semiconductor barrels, the impact on the barrel body does not all come from external forces. During transportation, the contents and brackets in the barrel will generate impact forces on the inner wall of the barrel due to vibration or inertia. At the same time, different semiconductors require different storage temperatures. At different temperatures, the internal stress of the barrel body is redistributed. When impacted, it is prone to impact and cracks, affecting the impact resistance and stability of the barrel body.

[0005] Therefore, the above-mentioned plastic barrel impact resistance testing device fails to truly simulate the impact that the barrel body is subjected to during actual operation, cannot comprehensively evaluate the impact resistance of the barrel body at different temperatures, and cannot fully reflect the stress and impact caused by the movement of internal contents and temperature changes in the actual semiconductor transportation environment. Therefore, there are defects in insufficient simulation of actual working conditions and incomplete evaluation, so there is room for improvement. Summary of the Invention

[0006] The purpose of the present invention is to provide a semiconductor barrel impact resistance testing device to solve the technical problems that the existing plastic barrel impact resistance testing device cannot evaluate the impact resistance of the barrel body under internal impact and at different temperatures, and the test results are not accurate and comprehensive.

[0007] To achieve this object, the present invention adopts the following technical solutions: A device for testing the impact resistance of semiconductor barrels comprises a clamping assembly, a bracket assembly, a rotating assembly, an impact assembly and a heating assembly, wherein the clamping assembly is used to clamp the barrel body, and the bracket assembly is arranged on the ground or other supporting structures; the impact assembly is rotatably mounted on the bracket assembly, and the rotating assembly is used to drive the impact assembly to rotate; an impact block is provided in the impact assembly for simulating the internal impact on the barrel body; the heating assembly is provided in the barrel body for regulating the temperature inside the barrel body; the rotating assembly includes a trigger component, and the trigger component is used to regulate the rushing speed of the impact block.

[0008] Optionally, the impact resistance testing device also includes an adjustment component, which includes a base plate, a contact block, a support block and a moving part. The barrel body is fixed to the base plate through the clamping component. The contact blocks are provided in multiple groups. The contact blocks are provided on the bottom surface of the base plate and are distributed away from each other. The moving part is used to drive the support block to move in the horizontal direction. The contact block abuts against the support block, and the contact surface between the support block and the contact block is inclined.

[0009] Optionally, the adjustment assembly further includes a connecting member, which includes a connecting column and a connecting plate. The connecting column is fixed to the ground or other supporting structure, the connecting plate is fixed to the center of the bottom surface of the base plate, and the connecting plate is rotatably mounted on the connecting column.

[0010] Optionally, the adjustment assembly further includes a friction plate, the friction plate is disposed on the ground, and the support block vibrates and slides on the top surface of the friction plate.

[0011] Optionally, the trigger member includes a guide ring, a rotating rod, an elastic member, a sliding member and a sensing member. The guide ring rotates coaxially with the rotating ring. The rotating rod is fixed to the outer peripheral wall of the guide ring along the radial direction of the guide ring. A slot is provided on the guide ring. The elastic member is arranged in the slot. When the rotating assembly rotates, the sliding member squeezes the elastic member, and the sensing member is slidably installed on the slot. The sliding member is electrically connected to the sensing member.

[0012] Optionally, the impact assembly includes a rotating ring, a connecting block and a limit piece. The rotating assembly drives the rotating ring to rotate. The connecting block is fixed on the rotating ring at equal angles. A channel is provided on the connecting block. The limit piece is provided in the channel for clamping the impact block.

[0013] Optionally, the limiting member includes a first magnetic plate and a second magnetic plate, the first magnetic plate is fixed to the bottom surface of the channel, the second magnetic plate has opposite magnetic poles to the first magnetic plate, the impact block is clamped between the first magnetic plate and the second magnetic plate, and the first magnetic plate is an electromagnet.

[0014] Optionally, the adjustment assembly further includes an annular track, a rotating block and a driving member, the annular track is arranged on the top surface of the base plate, the rotating block is rotatably installed in the annular track through the driving member, and the clamping assembly is fixed on the rotating block.

[0015] Optionally, the impact resistance testing device further includes a cover body, which is fixed on the bracket assembly and covers the upper end of the barrel body.

[0016] Optionally, a mounting plate is rotatably mounted on the bottom of the cover body, and the impact assembly is rotatably mounted at a non-axial position of the mounting plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects: The present invention releases the impact block through rotating centrifugation, directly exerting impact on the inner wall of the barrel, accurately simulating actual impact scenarios such as turbulent chemical liquid in the barrel and misoperation of the wafer loading robot arm in the semiconductor process; the impact speed of the impact block is adjusted by the trigger part to simulate internal stress impacts of different intensities; the heating component puts the barrel body in a specific temperature field, synchronously reflecting the mechanical response of the material under thermal expansion or contraction state, simulating irregular impacts at different temperatures in actual working conditions, and comprehensively evaluating the impact resistance of the barrel body. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention.

[0020] Figure 1 A schematic diagram of the overall structure of the impact resistance testing device provided in an embodiment of the present invention; Figure 2for Figure 1 Enlarged view of point A in the middle; Figure 3 A schematic front view of the structure of an impact resistance testing device provided by an embodiment of the present invention; Figure 4 for Figure 3 Enlarged view of point B in the middle; Figure 5 A schematic diagram of the overall structure of an impact assembly provided by an embodiment of the present invention; Figure 6 A schematic diagram of the overall structure of a trigger member provided in an embodiment of the present invention.

[0021] Illustrations: 10. Clamping assembly; 20. Bracket assembly; 30. Trigger member; 311. Guide ring; 312. Rotating rod; 313. Elastic member; 314. Sliding member; 315. Sensing member; 316. Notch; 317. Slide; 40. Impact assembly; 410. Impact block; 420. Rotating ring; 430. Connecting block; 440. Limiting member; 441. First magnetic plate; 442. Second magnetic plate; 450. Channel; 50. Heating assembly; 60. Barrel; 70. Ground; 80. Adjustment assembly; 810. Bottom plate; 820. Contact block; 830. Support block; 840. Moving member; 850. Connecting member; 851. Connecting column; 852. Connecting plate; 860. Friction plate; 870. Annular track; 880. Rotating block; 90. Cover; 100. Mounting plate. DETAILED DESCRIPTION

[0022] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0024] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0025] Figure 1 A schematic diagram of the overall structure of the impact resistance testing device provided in an embodiment of the present invention; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 A schematic front view of the structure of an impact resistance testing device provided by an embodiment of the present invention; Figure 4 for Figure 3 Enlarged view of point B in the middle; Figure 5 A schematic diagram of the overall structure of an impact assembly provided by an embodiment of the present invention; Figure 6 A schematic diagram of the overall structure of a trigger member provided in an embodiment of the present invention.

[0026] The impact resistance testing device provided in this embodiment is used in scenarios such as semiconductor transportation and storage. In this embodiment, by improving the structure of the impact resistance testing device, a simulation of the actual application scenario of a semiconductor barrel is achieved, so that the impact on the barrel body is closer to actual application, thereby improving the accuracy of evaluating the impact resistance of the barrel body.

[0027] See also Figures 1-6 The semiconductor barrel impact resistance testing device provided in this embodiment includes a clamping assembly 10, a bracket assembly 20, a rotating assembly, an impact assembly 40 and a heating assembly 50. The clamping assembly 10 is used to clamp the barrel body 60, and the bracket assembly 20 is set on the ground 70 or other supporting structures; the impact assembly 40 is rotatably installed on the bracket assembly 20, and the rotating assembly is used to drive the impact assembly 40 to rotate. An impact block 410 is provided in the impact assembly 40 for simulating the internal impact of the barrel body 60. The heating assembly 50 is provided in the barrel body 60 for regulating the temperature inside the barrel body 60; the rotating assembly includes a trigger 30, which is used to regulate the rushing speed of the impact block 410.

[0028] Specifically, the clamping assembly 10 stably fixes the barrel body 60 to be tested through a mechanical clamp to ensure that the barrel body 60 is stably maintained at the set position during the test. The clamping method needs to be designed according to the size and shape of the barrel body 60, such as using an adjustable clamp or an annular clamp structure to adapt to barrel bodies 60 of different specifications; the heating assembly 50 is located inside the barrel body 60, and the temperature of the environment inside the barrel body 60 is adjusted by an electric heating wire or an infrared radiation module. A temperature sensor is provided on the bracket assembly 20 for real-time monitoring of the temperature inside the barrel, and dynamically adjusts the heating power of the electric heating wire or the infrared radiation module through the control module to make the temperature inside the barrel body 60 The temperature is stabilized at a preset value (for example, -50°C to 300°C) to simulate the high and low temperature environments that the barrel body 60 may experience in the semiconductor process; wherein, the heating wire and the infrared radiation module can be set on the bracket assembly 20, and the impact assembly 40 rotates coaxially on the heating assembly 50. The rotating assembly drives the heating assembly 50 and the impact assembly 40 to rotate synchronously, so that the impact assembly 40 is heated synchronously with the barrel body 60 during the rotation process, so that the impact block 410 can more realistically simulate the low-temperature or high-temperature impact on the inner wall of the barrel body 60 under actual working conditions, thereby improving the authenticity of the impact environment simulation and thereby improving the reliability of the detection data.

[0029] During semiconductor manufacturing, barrel 60 may experience extreme environments such as high-temperature etching solutions (above 150°C) or low-temperature cleaning (below -40°C). The heating assembly 50 precisely controls the temperature to replicate actual operating conditions, improving the consistency between the test environment and the actual application environment. The material's impact resistance varies significantly with temperature. For example, barrel 60 becomes more brittle at low temperatures and may creep at high temperatures. The heating assembly 50 allows for repeated impact testing at different temperatures to test the temperature sensitivity of the barrel 60 material. By combining high-temperature cycling (e.g., alternating between -50°C and 300°C) with impact loading, the performance degradation of the barrel 60 after long-term use can be simulated, allowing its service life to be assessed.

[0030] More specifically, the rotating assembly consists of a motor, a reducer and a drive shaft. The motor controls the speed through a frequency converter to drive the impact assembly 40 to rotate on the axis inside the barrel body 60. A releasable impact block 410 is installed inside the impact assembly 40, and its initial position is fixed by a locking structure. During rotation, the centrifugal force gradually increases, and the potential kinetic energy of the impact block 410 increases accordingly. The trigger 30 is the core control unit of the rotating assembly. When the motor speed reaches the set threshold, the trigger 30 is connected to the control system to release the constraint on the impact block 410, causing it to fly radially under the action of centrifugal force and hit the inner wall of the barrel body 60 with a specific impact force. The impact speed can be controlled by adjusting the speed to control the magnitude of the centrifugal force, thereby simulating internal stress shocks of different intensities. After the impact occurs, the deformation, vibration frequency and crack extension of the barrel body 60 are recorded by a high-speed camera. Combined with the temperature data and impact parameters, the impact resistance of the barrel body 60 under different temperature-stress coupling conditions is analyzed to generate a material fatigue curve or a structural failure threshold report.

[0031] The impact block 410 is released by rotating centrifugation to directly impact the inner wall of the barrel 60, accurately simulating actual impact scenarios such as turbulent chemical liquid in the barrel and misoperation of the wafer loading robot arm in the semiconductor process; illustratively, the mass and shape of the impact block 410 can be customized (such as imitating a wafer box or valve component) to further improve the simulation; at high temperatures, the yield strength of the barrel body 60 material decreases, and the impact may cause permanent deformation, and the risk of brittle fracture increases at low temperatures. The heating component 50 puts the barrel body 60 in a specific temperature field, and the impact test can simultaneously reflect the mechanical response of the material under thermal expansion or contraction; through combined testing of different temperatures and impact parameters, a three-dimensional relationship diagram of "temperature-impact energy-failure mode" of the barrel body 60 material is drawn, and through extreme conditions testing, design defects can be identified in advance to avoid catastrophic failures in actual use.

[0032] See also Figure 1 and Figure 2Furthermore, the impact resistance testing device also includes an adjustment component 80, which includes a base plate 810, a contact block 820, a support block 830 and a moving part 840. The barrel body 60 is fixed to the base plate 810 through the clamping component 10. There are multiple groups of contact blocks 820, which are arranged on the bottom surface of the base plate 810 and are distributed away from each other. The moving part 840 is used to drive the support block 830 to move in the horizontal direction. The contact block 820 abuts against the support block 830, and the contact surface between the support block 830 and the contact block 820 is inclined. Specifically, the barrel body 60 to be tested is fixed to the top surface of the base plate 810 by the clamping assembly 10, ensuring that the barrel body 60 is rigidly connected to the base plate 810, and the vibration energy can be transmitted to the barrel body 60 without attenuation; illustratively, two groups of contact blocks 820 are radially symmetrically installed on the bottom surface of the base plate 810, and the contact blocks 820 are made of wear-resistant alloy, and the bottom surface is processed into a circular arc surface, which reduces the sliding friction of the contact surface, reduces the generation of wear particles, and extends the service life of the contact blocks 820 and the support blocks 830; the support blocks 830 are arranged correspondingly below the two groups of contact blocks 820, and the top of the support blocks 830 is set as an inclined surface. The support blocks 830 are driven by the moving part 840 and reciprocate in the horizontal direction, wherein the moving part 840 can be set as a cylinder.

[0033] It can be understood that when the moving part 840 drives the support block 830 to move horizontally, the contact block 820 slides along the inclined surface of the support block 830. Due to the inclination of the contact surface, the horizontal displacement of the support block 830 will be converted into a vertical displacement of the contact block 820; the speed, frequency, and stroke of the motion parameters of the two groups of moving parts 840 are independently controlled to cause the base plate 810 to shake with different amplitudes, and then transmit the shaking to the barrel body 60, so that the impact component 40 forms an impact on the inside of the barrel body 60 in different directions. It is used to simulate the semiconductor production line, when the robot arm frequently grabs or places the wafer box, the barrel body 60 is caused to have an instantaneous impact due to positioning error or sudden acceleration, or the barrel body 60 may experience random bumps during transportation by an air cushion vehicle or handling by a forklift, etc., which causes an impact on the inside of the barrel body 60, so as to more realistically reflect the stress state of the barrel body 60 under complex working conditions.

[0034] See also Figure 1 and Figure 2Furthermore, the adjustment assembly 80 also includes a connecting member 850, which includes a connecting column 851 and a connecting plate 852. The connecting column 851 is fixed to the ground 70 or other supporting structure, and the connecting plate 852 is fixed to the center of the bottom surface of the base plate 810. The connecting plate 852 is rotatably installed with the connecting column 851. Specifically, the connecting plate 852 and the connecting column 851 are rotatably installed, so that the bottom plate 810 is rotatably installed on the ground 70. When the two sides of the bottom plate 810 are affected by the contact block 820 and the support block 830 and shake, the shaking amplitude of the bottom plate 810 is more obvious due to the unchanged height of the bottom center position of the bottom plate 810, thereby causing the barrel body 60 to swing more significantly. When the barrel body 60 swings significantly, the impact block 410, under the action of centrifugal force, dynamically changes the impact position of the inner wall of the barrel body 60 with the swing trajectory, and can cover more axial and circumferential areas of the barrel body 60, simulating the large swings and random impacts that semiconductor barrels may experience during transportation or lifting by air cushion vehicles, thereby realizing the difference in impact resistance performance of different positions of the barrel body 60. At the same time, the deformation resistance of the barrel body 60 under unbalanced load is detected, so as to more comprehensively expose the potential failure risk of the barrel body 60 under extreme multi-physical field coupling conditions, thereby improving the accuracy of the impact resistance performance detection of the barrel body 60.

[0035] See also Figure 1 Furthermore, the adjustment assembly 80 further includes a friction plate 860, which is mounted on the ground 70. The support block 830 vibrates and slides on the top surface of the friction plate 860. Specifically, the support block 830 is rotatably mounted on the telescopic end of the movable member 840. When the movable member 840 operates at varying speeds, frequencies, and strokes, the support block 830 vibrates and slides along the surface of the friction plate 860, causing the bottom plate 810 to vibrate, which in turn transmits the vibration to the barrel 60. This simulates the random vibration conditions caused by friction or inertia between the barrel 60 and the ground 70 or other mounting platform in actual semiconductor applications, thereby improving the authenticity of the simulation of the impact resistance of the barrel 60 under actual operating conditions.

[0036] See also Figure 6Furthermore, the trigger member 30 includes a guide ring 311, a rotating rod 312, an elastic member 313, a sliding member 314 and a sensing member 315. The guide ring 311 rotates coaxially with the impact assembly 40. The rotating rod 312 is fixed to the outer peripheral wall of the guide ring 311 along the radial direction of the guide ring 311. A slot 316 is provided on the guide ring 311, and the elastic member 313 is arranged in the slot 316. When the rotating assembly rotates, the sliding member 314 squeezes the elastic member 313, and the sensing member 315 is slidably installed on the slot 316. The sliding member 314 is electrically connected to the sensing member 315. Exemplarily, a sliding groove 317 is provided on the rotating rod 312. The sensing member 315 is slidably installed in the sliding groove 317 and is tightened and fixed to a preset position on the rotating rod 312 by bolts. The sliding groove 317 is connected to the notch 316, and the sensing member 315 is exposed in the notch 316. When the rotating assembly rotates, due to the action of centrifugal force, the sliding member 314 squeezes the elastic member 313. When the motor reaches a preset speed, the sliding member 314 is electrically connected to the sensing member 315 and transmits an electrical signal to the control system, triggering the impact block 410 to rush out of the impact assembly 40, thereby achieving different centrifugal force impacts of the impact block 410 on the inner wall of the barrel body 60. Preferably, a conductor is provided on the sliding member 314. When the sliding member 314 contacts the sensing member 315, the sliding member 314 and the sensing member 31 form a closed circuit, causing the trigger member 30 to generate a trigger signal, driving the impact block 410 to be released from the impact assembly 40. By adjusting the fixed position of the sensing element 315, the impact force of the impact block 410 on the inner wall of the barrel body 60 can be adjusted to different levels, thereby achieving multi-condition impact simulation on the inner wall of the barrel body 60, realizing multi-level impact resistance performance testing, and improving the accuracy of impact resistance performance testing. Among them, the elastic element 313 can be a spring.

[0037] See also Figure 5 Furthermore, the impact assembly 40 includes a rotating ring 420, a connecting block 430, and a stopper 440. The rotating assembly drives the rotating ring 420 to rotate. The connecting block 430 is fixed to the rotating ring 420 at an equal angle. The connecting block 430 is provided with a channel 450. The stopper 440 is disposed within the channel 450 to clamp the impact block 410. For example, multiple groups of impact blocks 410 can be disposed within a group of channels 450.

[0038] See also Figure 5 and Figure 6The limiting member 440 includes a first magnetic plate 441 and a second magnetic plate 442. The first magnetic plate 441 is fixed to the bottom surface of the channel 450. The second magnetic plate 442 has a magnetic pole opposite to that of the first magnetic plate 441. The impact block 410 is sandwiched between the first and second magnetic plates 441, 442. The first magnetic plate 441 is an electromagnet. Specifically, the rotating assembly drives the rotating ring 420 to rotate. At this time, the first and second magnetic plates 441 and 442 have magnetic poles opposite to each other, clamping the impact block 410 within the channel 450. When the sliding member 314 contacts the induction member 315, the first magnetic plate 441 is energized, causing it to generate a magnetic field with the same magnetic pole as the second magnetic plate 442. The second magnetic plate 442 is acted upon by the magnetic force and moves away from the first magnetic plate 441. The impact block 410 acts on the barrel body 60 under the action of centrifugal force, thereby impacting the barrel body 60.

[0039] Before conducting the impact resistance test, the impact force corresponding to each angle is measured in advance. The barrel body 60 to be tested is securely fixed to the top surface of the base plate 810 using the clamping assembly 10, ensuring a rigid connection between the barrel body 60 and the base plate 810 to achieve undiminished transmission of vibration or impact energy. Two sets of contact blocks 820 are radially symmetrically mounted on the bottom surface of the base plate 810. These contact blocks 820 are made of a wear-resistant alloy and feature a rounded bottom surface. This is designed to reduce sliding friction when in contact with the support block 830, minimizing the generation of wear particles and extending its service life. The support block 830 is positioned below the contact block 820 and features an inclined top surface. It is driven by a moving member 840 (e.g., a cylinder) to reciprocate horizontally. During this movement, the contact block 820, guided by the inclined support surface, slides vertically, causing the base plate 810 to vibrate to varying degrees. Because the center of the bottom surface of base plate 810 is pivotally connected to the ground 70 via connector 850, namely, connecting plate 852 and connecting post 851, the center of the bottom surface remains at a constant height during the shaking process, causing the shaking at both ends of the base plate to be more intense, thereby causing the barrel 60 to oscillate significantly. This oscillation simulates the complex stress conditions caused by impact, error, and vibration during robotic arm operation or handling of barrel 60 in a semiconductor production line, thereby enhancing the test's ability to reproduce realistic results.

[0040] During the test, the moving member 840 independently controls the speed, frequency, and stroke of the support blocks 830 on both sides, causing the base plate 810 to shake asymmetrically in multiple directions, while also driving the barrel body 60 to swing at different angles. During this process, the vibration of the base plate 810 is also achieved through the sliding between the support blocks 830 and the friction plate 860. The friction plate 860 is fixed to the ground 70, and the support blocks 830 vibrate and slide on its surface. Combined with the unstable speed and frequency set by the moving member 840, this further simulates the random vibration caused by friction, uneven load, or sudden acceleration during actual transportation or production, providing the barrel body 60 with a realistic anti-vibration working load.

[0041] During the process of the barrel body 60 swinging at multiple angles, the impact assembly 40 starts to operate. After the rotating assembly is started, it drives the rotating ring 420 to rotate at high speed. The connecting blocks 430 are distributed at equal angles on the rotating ring 420 and drive the impact blocks 410 therein to generate centrifugal force as they rotate. The trigger member 30 operates synchronously, the guide ring 311 rotates coaxially with the rotating assembly, and the sliding member 314 and the sensing member 315 are installed on the rotating rod 312 set on the outer peripheral wall of the guide ring. As the rotation speed increases, the sliding member 314 squeezes the elastic member 313 (such as a spring) in the notch 316 under the action of centrifugal force, and touches the sensing member 315 when the preset rotation speed is reached, generating an electrical signal and transmitting it to the control system.

[0042] When the trigger signal arrives, the first magnetic plate 441 in the stopper 440 is energized, aligning its magnetic poles with those of the second magnetic plate 442. This repulsive force exerted on the second magnetic plate 442 forces it away from the first magnetic plate 441. The impact block 410, held therein, is released under the combined effects of magnetic and centrifugal forces, rushing out of the channel 450 and striking the inner wall of the barrel 60 at high speed. This type of impact has random directionality and controllable intensity. By adjusting the fixed position of the induction element 315 in the chute 317, the triggering timing can be changed, thereby controlling the centrifugal force at the time of release of the impact block 410, thereby simulating multi-point and multi-level impacts on the inner wall of the barrel 60.

[0043] Throughout the testing process, the barrel 60, supported by the complex support structure formed by support block 830, contact block 820, and friction plate 860, not only experiences multi-frequency and multi-amplitude shaking and vibration, but also withstands high-speed impacts imparted by the rotating release impact block. This fully reflects the actual stress conditions experienced by the barrel 60 under extreme operating conditions such as transportation and handling in the semiconductor industry. The final test results are used to assess the barrel 60's impact resistance in various axial and circumferential regions, as well as its deformation resistance under unbalanced loads, effectively enhancing the comprehensiveness and accuracy of impact resistance testing.

[0044] See also Figure 1 and Figure 2 Furthermore, the adjustment assembly 80 also includes an annular track 870, a rotating block 880, and a driving member. The annular track 870 is provided on the top surface of the base plate 810. The rotating block 880 is rotatably mounted within the annular track 870 by the driving member. The clamping assembly 10 is fixed to the rotating block 880. Specifically, the driving member drives the rotating block 880 to slide along the annular track 870. Since the clamping assembly 10 is fixed to the rotating block 880, the rotation of the clamping assembly 10 realizes the rotation of the barrel body 60. The impact block 410 can be released at different circumferential positions along the inner wall of the barrel body 60, covering key areas such as welds, reinforcement ribs, and flange interfaces. This increases the range of action of the impact block 410 on the barrel body 60 and enables detection of differences in impact resistance at various positions within the barrel body 60.

[0045] See also Figure 1 Furthermore, the impact resistance testing device also includes a cover 90, which is fixed to the bracket assembly 20 and covers the upper end of the barrel 60. Specifically, the cover 90 acts as a rigid barrier to form an independent testing space, effectively intercepting the impact block 410 and debris, and preventing physical harm to the operator. More specifically, the cover 90 is made of high-strength steel or polycarbonate composite material. Furthermore, when the testing device integrates a heating or cooling component, the provision of the cover 90 reduces heat loss or cooling leakage, ensuring a uniform and stable temperature field within the barrel.

[0046] See also Figure 3 Furthermore, a mounting plate 100 is rotatably mounted on the bottom of the cover 90, and the impact assembly 40 is rotatably mounted on the mounting plate 100 at a non-axial position. Specifically, the mounting plate 100 is rotatably mounted on the cover 90 via a drive assembly. During the rotation of the mounting plate 100, the impact assembly 40 simultaneously rotates within the barrel 60 and along the center of the mounting plate 100. This randomizes the impact block 410's impact position on the barrel 60, avoiding test blind spots caused by impacts at fixed positions. A single continuous run can cover the entire area, reducing equipment testing time and sample consumption.

[0047] In summary, the impact resistance testing device provided in this embodiment has the advantages of comprehensive evaluation conditions and high accuracy of evaluation results.

[0048] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor barrel impact resistance testing device, characterized in that: It includes a clamping assembly, a bracket assembly, a rotating assembly, an impact assembly and a heating assembly. The clamping assembly is used to clamp the barrel body, and the bracket assembly is set on the ground or other supporting structures; The impact assembly is rotatably mounted on the bracket assembly, and the rotating assembly is used to drive the impact assembly to rotate. The impact assembly is provided with an impact block for simulating the internal impact of the barrel body. The heating assembly is provided in the barrel body for regulating the temperature inside the barrel body. The rotating assembly includes a triggering member, which is used to adjust the rushing speed of the impact block.

2. The semiconductor barrel impact resistance testing device according to claim 1, characterized in that: It also includes an adjustment component, which includes a base plate, a contact block, a support block and a moving part. The barrel body is fixed to the base plate by the clamping component. The contact blocks are provided in multiple groups. The contact blocks are arranged on the bottom surface of the base plate and are distributed away from each other. The moving part is used to drive the support block to move in the horizontal direction. The contact block abuts against the support block, and the contact surface between the support block and the contact block is arranged at an angle.

3. A semiconductor barrel impact resistance testing device according to claim 2, characterized in that: The adjustment assembly also includes a connecting member, which includes a connecting column and a connecting plate. The connecting column is fixed to the ground or other supporting structure, and the connecting plate is fixed to the center of the bottom surface of the base plate. The connecting plate is rotatably mounted on the connecting column.

4. The semiconductor barrel impact resistance testing device according to claim 2, characterized in that: The adjustment assembly further comprises a friction plate, which is arranged on the ground, and the support block vibrates and slides on the top surface of the friction plate.

5. The semiconductor barrel impact resistance testing device according to claim 1, characterized in that: The impact assembly includes a rotating ring, a connecting block and a limiting member. The rotating assembly drives the rotating ring to rotate. The connecting block is fixed on the rotating ring at equal angles. A channel is provided on the connecting block. The limiting member is provided in the channel for clamping the impact block.

6. The semiconductor barrel impact resistance testing device according to claim 5, characterized in that: The trigger member includes a guide ring, a rotating rod, an elastic member, a sliding member and a sensing member. The guide ring rotates coaxially with the impact assembly. The rotating rod is fixed to the outer peripheral wall of the guide ring along the radial direction of the guide ring. A slot is provided on the guide ring. The elastic member is arranged in the slot. When the rotating assembly rotates, the sliding member squeezes the elastic member. The sensing member is slidably installed on the slot. The sliding member is electrically connected to the sensing member.

7. The semiconductor barrel impact resistance testing device according to claim 6, characterized in that: The limiting member includes a first magnetic plate and a second magnetic plate. The first magnetic plate is fixed to the bottom surface of the channel. The second magnetic plate has opposite magnetic poles to the first magnetic plate. The impact block is clamped between the first magnetic plate and the second magnetic plate. The first magnetic plate is an electromagnet.

8. The semiconductor barrel impact resistance testing device according to claim 2, characterized in that: The adjustment assembly further includes an annular track, a rotating block and a driving member. The annular track is arranged on the top surface of the base plate. The rotating block is rotatably installed in the annular track through the driving member. The clamping assembly is fixed on the rotating block.

9. The semiconductor barrel impact resistance testing device according to claim 1, characterized in that: It also includes a cover body, which is fixed on the bracket assembly and covers the upper end of the barrel body.

10. The semiconductor barrel impact resistance testing device according to claim 9, characterized in that: A mounting plate is rotatably mounted on the bottom of the cover body, and the impact assembly is rotatably mounted on a non-axial position of the mounting plate.

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