Photoelectric co-packaging temperature control framework based on embedded glass-based micro-channel

Abstract

The invention belongs to the field of photoelectric co-packaging, and particularly relates to a photoelectric co-packaging temperature control framework based on an embedded glass-based micro-channel. Independent lower-layer heat dissipation is carried out on a heat-sensitive component optical interconnection chip through an embedded glass-based micro-channel technology, an electric interconnection heat dissipation channel continues to use existing upper-layer heat dissipation, mutual isolation of two heat dissipation channels in the whole common packaging body is achieved, heat dissipation partition is achieved from a new dimension, and thermal crosstalk is avoided; the whole common packaging body dissipates heat at the upper layer and the lower layer, so that the effective heat dissipation area is greatly increased, and the heat dissipation capability of the packaging body is greatly improved; and the guidance quality of the heat dissipation channel is better through material selection and additional arrangement of the heat insulation layer. And a metal film temperature sensor can be additionally arranged, so that the temperature of a component can be monitored in real time, heat management regulation and control can be performed in a targeted manner, the temperature rise of a heating device and the heat contact efficiency between the micro-channels are balanced, and more efficient heat dissipation is realized.

Description

Technical Field

[0001] The present invention belongs to the field of optoelectronic co-packaging, and specifically relates to an optoelectronic co-packaging temperature control architecture based on embedded glass-based microchannels. Background Art

[0002] With the development of artificial intelligence, cloud computing, the internet, next-generation communications, and other virtual technologies, computers are becoming increasingly powerful and the amount of data they need to process is also increasing. As Moore's Law gradually breaks down and chip manufacturing processes gradually approach physical limits, single-chip packaging structures can no longer meet the current computing requirements. Therefore, engineers are increasing chip performance through two methods: 1. Researching optical chips through the development of optical interconnect technology, thereby fundamentally breaking through the physical limits of chips; 2. Encapsulating chips with multiple functions in a single package reduces the internal interconnect distances between chips, increasing transmission speeds between chips and improving overall performance.

[0003] Optical interconnect technology offers advantages such as wide bandwidth, immunity to electromagnetic interference, low transmission loss, and low power consumption, significantly outperforming electrical interconnects in overall performance. However, due to its less mature manufacturing technology, some engineers are now using optoelectronic co-packaging to improve chip performance. As the number and variety of chips packaged in a single package continue to increase, the heat dissipation challenges within the package continue to grow. Therefore, developing a heat dissipation mechanism within the co-package has become a pressing issue for engineers.

[0004] In existing optoelectronic packaging modules, optical engineers generally use the cold end of a TEC (semiconductor refrigeration element) to connect to an optical interconnect chip or other optical module. The heat generated during operation is then directed through the TEC's hot end to a heat sink, and then to the outside. Heat generated by the electrical interconnect chip during operation is generally directed through a heat-conducting metal into the heat sink and then to the outside. However, as the number of chips included in the package increases, sharing the same heat sink will cause heat from the electrical chip to affect the hot end of the TEC, causing the optical interconnect chip or laser module to fail. Furthermore, as the number of chips integrated into the package increases, the power consumption of the TEC will gradually increase, and its thermal efficiency will continue to decline, hindering further integration of the package and making it impossible to integrate high-power devices into the package. Summary of the Invention

[0005] In response to the above-mentioned problems or shortcomings, and in order to solve the heat dissipation problem inside the existing multi-chip co-package, the present invention provides an optoelectronic co-packaging temperature control architecture based on embedded glass-based microchannels, which is suitable for optoelectronic co-packaging of high-density chips or packaging of temperature-sensitive components.

[0006] A photoelectric co-packaged temperature control architecture based on embedded glass-based microfluidics includes an electrical interconnection chip, an optical interconnection chip, a glass adapter plate, an electrical interconnection chip heat sink, an organic substrate, and an embedded glass-based microfluidic channel.

[0007] The organic substrate is located at the bottom of the entire optoelectronic co-packaging temperature control structure.

[0008] The optical interconnection chip and the electrical interconnection chip are interconnected via a glass adapter plate and are both arranged above the organic substrate.

[0009] The electrical interconnect chip heat sink is directly arranged above the electrical interconnect chip, and the electrical interconnect chip dissipates heat in the upper layer of the entire package through the electrical interconnect chip heat sink.

[0010] The embedded glass-based micro-channel is arranged on the upper surface of the organic substrate in an embedded manner, and the embedded glass-based micro-channel is arranged below the optical interconnect chip in direct contact.

[0011] The upper surface of the optical interconnect chip is not in contact with the packaging shell and the electrical interconnect chip heat sink. The optical interconnect chip dissipates heat in the lower layer of the entire optoelectronic co-packaging temperature control architecture through the embedded glass-based microchannel below.

[0012] Furthermore, it also includes a metal film temperature sensor arranged between the optical interconnect chip and the embedded glass-based microfluidic channel. The metal film temperature sensor uses a metal material with high thermal conductivity to evenly distribute the heat on the optical interconnect chip, thereby allowing the heat of the optical interconnect chip to be absorbed by the microfluidic channel more quickly; at the same time, the metal film temperature sensor monitors the temperature of the optical interconnect chip in real time and regulates the heat dissipation intensity of the microfluidic channel.

[0013] Furthermore, the microchannels etched in the embedded glass-based microchannels are arranged in corresponding partitions according to the different positions of the hot spots of each optical interconnect chip in the current optoelectronic co-packaging temperature control architecture and the power of different heat sources to achieve more efficient heat dissipation.

[0014] Furthermore, the partitioned arrangement of the microchannels refers to regulating the microchannel density and channel diameter of the microchannel partitions corresponding to each optical interconnect chip according to the power of the heat source of each optical interconnect chip to improve the heat dissipation capacity. The greater the heat dissipation demand, the larger the corresponding microchannel density and channel diameter.

[0015] Furthermore, the partition arrangement of the microchannels also includes the transmission direction of the microchannel fluid in the microchannel partitions.

[0016] Furthermore, a heat insulating layer is provided in the gap between the upper surface of the optical interconnect chip and the packaging shell and the heat sink of the electrical interconnect chip to further prevent heat crosstalk between components inside the package.

[0017] Furthermore, the temporary bonding glue used to fix the electrical interconnect chip to the glass adapter plate and the organic substrate adopts a bonding glue with low thermal conductivity (such as a polymer material) to improve thermal isolation; an insulation layer is provided between devices with more serious thermal crosstalk to constrain the main heat transfer direction of each device.

[0018] Furthermore, the embedded glass-based microfluidic channel uses insulating condensate (such as oily insulating oil or fluorinated liquid).

[0019] For multi-chip co-packages, the present invention innovatively proposes to use embedded glass-based microfluidic technology to provide a separate lower-layer heat dissipation for heat-sensitive components such as optical interconnect chips, while the electrical interconnect heat dissipation channels continue to use the existing upper layer of the co-package for heat dissipation. This achieves "mutual isolation" of the two heat dissipation channels within the entire co-package, realizing heat dissipation partitioning from a new dimension, avoiding heat crosstalk, and greatly increasing the heat dissipation capacity of the package. It also provides for adding a thermal insulation layer to components with severe thermal crosstalk, making the heat dissipation channel more directional. The introduction of a chip-level liquid-cooled radiator—a microfluidic radiator—improves the heat dissipation efficiency by an order of magnitude, while also providing a point-to-point microfluidic partitioning targeted heat dissipation design that differentiates the thermal efficiency of each thermal element, making it more conducive to integrating more chips in the same package. Moreover, compared to traditional optoelectronic co-packaging structures, the present invention also makes the top and bottom of the package effective heat dissipation directions, greatly increasing the effective heat dissipation area of ​​the package. It is further proposed to set up a metal thin film temperature sensor between the microchannel and the optical interconnect chip, which can not only directly monitor the temperature of components in real time and perform targeted thermal management and regulation, but also balance the temperature rise of the heating device and the thermal contact efficiency between the microchannel to achieve more efficient heat dissipation.

[0020] In summary, compared to traditional optoelectronic co-packaging heat dissipation technology, this invention eliminates the use of TEC thermoelectric coolers for optical interconnect chips and directly utilizes embedded glass-based microfluidics to provide separate, highly efficient heat dissipation management for the optical interconnect chips. This, supplemented by other components and thermal insulation layers, achieves optimized heat dissipation guidance for the upper and lower zones of the package, significantly improving the heat dissipation and thermal management efficiency of multi-chip co-packages. This invention effectively addresses existing heat dissipation and thermal crosstalk issues within multi-chip co-packages, providing technical support for further increasing the package's integration density and enabling the integration of high-power devices within the package. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 This is a schematic diagram of the traditional optoelectronic co-packaging structure;

[0023] Figure 3 Schematic diagram of heat transfer route in an embodiment.

[0024] Figure 4 Schematic diagram of the structure of the embedded glass-based microfluidic channel in the embodiment.

[0025] Figure numerals: 1-electrical interconnection chip, 2-optical interconnection chip, 3-electrical interconnection chip heat sink, 4-temporary bonding glue, 5-embedded glass-based microchannel, 6-metal temperature sensor, 7-glass adapter plate, 8-TEC cooling module, 9-organic substrate, 10-conduction heat transfer, 11-natural convection heat transfer, 12-forced convection heat transfer, 13-liquid inlet, 14-liquid outlet, 15-flow channel. DETAILED DESCRIPTION

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0027] In the optoelectronic packaging structure, the operating temperatures of the optical interconnect chip and the electrical interconnect chip are different. Since the two interconnect chips share the same heat dissipation structure, as the number and types of packaged chips increase, the thermal crosstalk between the two will greatly reduce the performance of the optical interconnect chip and even cause the optical interconnect chip to fail.

[0028] In order to solve this thermal crosstalk problem, the present invention innovatively uses different heat dissipation paths for the optical interconnect chip and the electrical interconnect chip, and uses relatively independent heat dissipation structures to partition the heat dissipation of each module, thereby reducing this thermal crosstalk problem. Its basic structure is as follows Figure 1 As shown, an embedded groove is machined on an organic substrate (9) according to the size of the embedded glass-based microfluidic channel (5). After the embedded glass-based microfluidic channel (5) is placed, a metal temperature sensor (6) is placed above the embedded glass-based microfluidic channel (5). At the same time, the metal temperature sensor (6) is installed on the optical interconnect chip (2) to monitor the temperature change of the condensate and the operating temperature of the optical interconnect chip. When the surface temperature of the optical interconnect chip changes, the heat removed by the condensate in the microfluidic channel is changed by changing the flow rate or temperature of the condensate in the microfluidic channel, thereby stabilizing the temperature of the optical interconnect chip.

[0029] At the same time, the electrical interconnection chip and the optical interconnection chip are interconnected through a glass adapter plate (7). Due to the low thermal conductivity of glass, the heat of the electrical interconnection chip can be greatly suppressed from affecting the optical interconnection chip. At the same time, due to the adjustability of the thermal expansion coefficient of glass, the thermal stress between it and the organic substrate (9) can be greatly reduced, thereby increasing the overall reliability.

[0030] In order to prevent thermal crosstalk between the optical interconnect chip and the electrical interconnect chip through the electrical interconnect chip heat sink (3), the optical interconnect chip and the metal heat sink are separated by a certain distance. If the thermal power consumption of the electrical interconnect chip is high, a heat insulating medium (heat insulating layer) can be applied in the gap between the electrical interconnect chip heat sink (3) and the optical interconnect chip to reduce the radiation heat exchange between them. The electrical interconnect chip heat sink (3) is in direct contact with the electrical interconnect chip to dissipate heat for the electrical interconnect chip. Since the heat generated by the optical interconnect chip during operation will be directly taken away by the condensate in the microchannel and will not pass through the metal heat sink on the top, the metal heat sink is only responsible for the heat dissipation of the electrical interconnect chip. The two chips will use different heat dissipation paths, which greatly reduces the thermal crosstalk problem between different chips, allowing chips under different working conditions to work in the same package without interfering with each other. At the same time, due to the addition of the heat dissipation path (microchannel) at the bottom, the effective heat dissipation area of ​​the common package is increased in an unconventional dimension, which is conducive to multi-chip integration.

[0031] In addition, in order to prevent liquid leakage in the microchannel from affecting or damaging the devices in the package, a highly reliable bonding technology should be selected when bonding the embedded glass-based microchannel. At the same time, since the flow channel diameter in the embedded glass-based microchannel is relatively small, the condensate should be filtered to prevent the flow channel from being blocked by particles in the condensate; and an insulating liquid (such as oily insulating oil or fluorinated liquid) should be used as the condensate.

[0032] For components with different heat generation and different heat dissipation requirements in the package, embedded glass-based microchannels with different size partitions can be manufactured to meet the customized heat dissipation goals of multiple heat sources. This embodiment is only demonstrated for a single component. Figure 4 It is a structural schematic diagram corresponding to an embedded glass-based microchannel, including a liquid inlet (13), a liquid outlet (14), and a flow channel (15).

[0033] Figure 3 This is a schematic diagram of the heat transfer route of this embodiment. The electrical interconnect chip (1) realizes upward conductive heat transfer (10) on the top of the entire package through the electrical interconnect chip heat sink (3). The optical interconnect chip (2) realizes forced convection heat transfer (12) at the bottom of the package through the embedded glass-based microchannel (5) arranged below it. Inside the package, due to the independent heat dissipation partition guidance of the upper and lower partitions of the main heat-generating components, as well as the combined effect of the glass transfer plate (low thermal conductivity), the insulation layer and the insulation material (such as low thermal conductivity temporary bonding glue), because of the correlation between temperature difference and heat transfer rate, there is also natural convection heat transfer (11), further effectively utilizing the correlation between temperature difference and heat transfer rate to reduce thermal crosstalk between internal components.

[0034] As can be seen from the above embodiments, the present invention innovatively proposes to use embedded glass-based microchannel technology to perform independent lower-layer heat dissipation for heat-sensitive components and optical interconnect chips, while the electrical interconnect heat dissipation channel continues to use the existing upper-layer heat dissipation, achieving mutual isolation between the two heat dissipation channels within the entire co-package, realizing heat dissipation partitioning from a new dimension and avoiding thermal crosstalk. The entire co-package dissipates heat at both the upper and lower levels, greatly increasing the effective heat dissipation area and significantly enhancing the heat dissipation capacity of the package. Furthermore, through material selection and the addition of a thermal insulation layer, the guidance of the heat dissipation channel is improved. A metal thin film temperature sensor can also be added to monitor the temperature of the components in real time for targeted thermal management and regulation, while also balancing the temperature rise of the heating device and the thermal contact efficiency between the microchannels, achieving more efficient heat dissipation.

Claims

1. An optoelectronic co-packaged temperature control architecture based on embedded glass-based microfluidics, comprising an electrical interconnect chip, an optical interconnect chip, a glass adapter plate, an electrical interconnect chip heat sink, and an organic substrate, characterized in that: Also included are embedded glass-based microfluidic channels; The organic substrate is located at the bottom of the entire optoelectronic co-packaging temperature control structure; The optical interconnection chip and the electrical interconnection chip are interconnected via a glass adapter plate and are both arranged above the organic substrate; The electrical interconnect chip heat sink is directly arranged above the electrical interconnect chip, and the electrical interconnect chip dissipates heat in the upper layer of the entire package through the electrical interconnect chip heat sink; The embedded glass-based microfluidic channel is arranged on the upper surface of the organic substrate in an embedded manner, and the embedded glass-based microfluidic channel is arranged directly in contact with the lower side of the optical interconnect chip; The upper surface of the optical interconnect chip is not in contact with the packaging shell and the electrical interconnect chip heat sink. The optical interconnect chip dissipates heat in the lower layer of the entire optoelectronic co-packaging temperature control architecture through the embedded glass-based microchannel below.

2. The optoelectronic co-packaging temperature control architecture based on embedded glass-based microfluidic channels according to claim 1, characterized in that: It also includes a metal film temperature sensor arranged between the optical interconnect chip and the embedded glass-based microfluidic channel. The metal film temperature sensor evenly distributes the heat on the optical interconnect chip, allowing the heat of the optical interconnect chip to be absorbed by the microfluidic channel more quickly. At the same time, the metal film temperature sensor monitors the temperature of the optical interconnect chip in real time and regulates the heat dissipation intensity of the microfluidic channel.

3. The optoelectronic co-packaging temperature control architecture based on embedded glass-based microfluidic channels according to claim 1, characterized in that: The microchannels etched in the embedded glass-based microchannels are arranged in corresponding zones according to the different positions of the hot spots of each optical interconnect chip in the current optoelectronic co-packaging temperature control architecture and the power of different heat sources.

4. The optoelectronic co-packaging temperature control architecture based on embedded glass-based microfluidic channels as claimed in claim 3, characterized in that: The partitioned arrangement of the microchannels refers to regulating the microchannel density and channel diameter of the microchannel partitions corresponding to each optical interconnect chip according to the power of the heat source of each optical interconnect chip to improve the heat dissipation capacity. The greater the heat dissipation demand, the larger the corresponding microchannel density and channel diameter.

5. The optoelectronic co-packaging temperature control architecture based on embedded glass-based microfluidic channels as claimed in claim 3, characterized in that: The partitioned arrangement of the microchannels also includes the transmission direction of the microchannel fluids in the microchannel partitions.

6. The optoelectronic co-packaging temperature control architecture based on embedded glass-based microfluidic channels according to claim 1, characterized in that: A heat insulation layer is also provided in the gap between the upper surface of the optical interconnection chip and the packaging shell and the heat sink of the electrical interconnection chip.

7. The optoelectronic co-packaging temperature control architecture based on embedded glass-based microfluidic channels according to claim 1, characterized in that: The temporary bonding glue used to fix the electrical interconnect chip to the glass transfer plate and the organic substrate adopts a bonding glue with low thermal conductivity. A thermal insulation layer is provided between devices with more serious thermal crosstalk to restrict the main heat transfer direction of each device.

8. The optoelectronic co-packaging temperature control architecture based on embedded glass-based microfluidic channels according to claim 1, characterized in that: The condensate used in the embedded glass-based microfluidic channel is an insulating liquid.

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