Display module and connecting glue assembly

Abstract

The invention relates to a display module and a connecting glue assembly. The display module comprises a display panel, a supporting piece assembly and connecting glue. The supporting piece assembly comprises an opening and a supporting piece surrounding the opening, the supporting piece and the non-display side of the display panel seal one end of the opening, and the supporting piece and the non-display side of the display panel define a groove; the connecting glue is located in the groove, and the thickness of the connecting glue in the first direction is smaller than that of the supporting piece in the first direction; the signal stability of the ultrasonic fingerprint wave module in the use process is improved, the assembly precision of the ultrasonic fingerprint wave module can be improved, and the process complexity can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a connecting adhesive assembly. Background Art

[0002] Currently, ultrasonic fingerprint technology has the advantages of unlocking with just one press of the finger, using wet hands and oil stains, without the need for the touch panel (TP) to wake up and illuminate the display module. High-end flagship mobile phones are increasingly adopting ultrasonic fingerprint technology in the market.

[0003] Ultrasonic fingerprint modules extract fingerprint features by emitting ultrasonic pulses that reflect off fingerprint ridges and then receiving the reflected ultrasonic signals. However, existing ultrasonic fingerprint modules for displays can experience unstable signals during use. Summary of the Invention

[0004] The embodiment of the present application provides a display module and a connecting adhesive assembly, which increases the signal stability of the ultrasonic fingerprint wave module during use, improves the assembly accuracy of the ultrasonic fingerprint module, and reduces the process complexity.

[0005] To achieve the above objectives, according to a first aspect of the present application, a display module is provided, comprising:

[0006] Display panel;

[0007] A support member assembly, the support member assembly including an opening and a support member surrounding the opening, the support member stacked with the non-display side of the display panel, and the non-display side of the display panel closes one end of the opening and defines a groove with the support member;

[0008] a connecting adhesive, located in the groove and connected to the non-display side of the display panel along a first direction, wherein the thickness of the connecting adhesive is less than the thickness of the supporting member;

[0009] An ultrasonic fingerprint module is provided on a side of the connecting adhesive away from the display panel.

[0010] Optionally, the connecting glue includes a first adhesive layer, a conductive layer, and a second adhesive layer stacked sequentially along the first direction, the first adhesive layer being provided between the display panel and the conductive layer, and the second adhesive layer being provided on a side of the conductive layer away from the first adhesive layer and connected to the ultrasonic fingerprint module;

[0011] The thickness of the first adhesive layer is 1 μm to 25 μm, the thickness of the conductive layer is 1 μm to 25 μm, and the thickness of the second adhesive layer is 1 μm to 25 μm.

[0012] Optionally, the difference in thickness between the support member and the connection adhesive is 150 μm to 180 μm.

[0013] Optionally, the first adhesive layer includes black pressure-sensitive adhesive.

[0014] Optionally, the conductive layer comprises copper foil.

[0015] Optionally, the second adhesive layer includes a transparent pressure-sensitive adhesive.

[0016] Optionally, for the above-mentioned display module, the connecting adhesive is connected to the display panel;

[0017] The connecting glue component includes the connecting glue;

[0018] The connecting adhesive assembly further includes a cushioning layer, which is provided on a side of the connecting adhesive away from the display panel. When the connecting adhesive assembly is connected to the display panel, the cushioning layer extends beyond the supporting member in the first direction.

[0019] Optionally, the connecting adhesive assembly further includes a release film, and the release film is arranged between the padding layer and the connecting adhesive.

[0020] Optionally, the connecting adhesive assembly further includes a transparent adhesive layer, and the transparent adhesive layer is provided between the release film and the padding layer.

[0021] Optionally, the light transmittance of the cushioning layer is ≥85%, and the light transmittance of the transparent adhesive layer is ≥85%.

[0022] Optionally, the cushioning layer includes an upper surface and a lower surface arranged opposite to each other in the first direction, the dyne values ​​of the upper surface and the lower surface are ≥34, and the viscosity of the transparent adhesive layer is ≥1000 gf / inch.

[0023] The present application confines the connecting glue connecting the ultrasonic fingerprint module to a groove defined by the support member and the display panel, and makes the thickness of the support member greater than the thickness of the connecting glue. On the one hand, the connecting glue is stably constrained by the groove during use, which can effectively avoid displacement or glue layer leakage caused by extrusion, thereby ensuring the stability of ultrasonic signal transmission. On the other hand, the height difference formed by the support member and the connecting glue provides a positioning reference for the assembly of the ultrasonic fingerprint module, so that it can achieve self-positioning with the help of this height difference, which can not only improve the assembly accuracy but also reduce the process complexity.

[0024] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0026] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0027] Figure 1 It is a schematic diagram of the assembly of the display module and the connecting glue;

[0028] Figure 2 This is a schematic diagram of the assembly of the ultrasonic fingerprint module and the connecting glue.

[0029] Figure 3 It is a schematic diagram of the structure of the connecting glue component;

[0030] Figure 4 This is a schematic diagram of the assembly of the connecting adhesive component and the display module;

[0031] Figure 5 It is a schematic diagram of the connecting glue assembly process;

[0032] Description of reference numerals:

[0033] 100. Display module; 10. Connecting glue assembly; 20. Support assembly; 30. Groove; 40. Easy-tear sticker; 50. Ultrasonic fingerprint module; 1. Connecting glue; 2. First protective layer; 3. Second protective layer; 4. First antistatic layer; 41. Antistatic strip; 5. Second antistatic layer; 6. Padding layer; 7. First release film; 8. Transparent adhesive layer; 11. First adhesive layer; 12. Conductive layer; 13. Second adhesive layer; 201. Opening; 202. Support; 61. Upper surface; 62. Lower surface; 501. Integrated circuit part; 502. Flexible printed circuit board part; 60. Display panel; 601. Non-display side. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0035] The ultrasonic fingerprint module 50 emits ultrasonic pulses, which are reflected by the fingerprint lines and then receive the reflected ultrasonic signals to extract fingerprint features. However, the ultrasonic fingerprint module 50 of the existing display screen may experience signal instability during use.

[0036] To solve the above technical problems, see Figure 1 , providing a display module 100, the display module 100 comprising:

[0037] Display panel 60, support assembly 20, connecting glue 1 and ultrasonic fingerprint module 50;

[0038] The support member assembly 20 includes an opening 201 and a support member 202 surrounding the opening 201. The support member 202 is stacked with the non-display side 601 of the display panel 60. The non-display side 601 of the display panel 60 closes one end of the opening 201 and defines a groove 30 with the support member 202.

[0039] The connecting glue 1 is located in the groove 30 and is connected to the non-display side 601 of the display panel 60 along the first direction (z). The thickness of the connecting glue 1 is less than the thickness of the supporting member 202; the ultrasonic fingerprint module 50 is arranged on the side of the connecting glue 1 away from the display panel 60.

[0040] The present application limits the connection glue 1 connecting the ultrasonic fingerprint module 50 to the groove 30 defined by the support member 202 and the display panel 60, and makes the thickness of the support member 202 greater than the thickness of the connection glue 1; on the one hand, the connection glue 1 is stably constrained by the groove 30 during use, which can effectively avoid displacement or glue layer leakage caused by extrusion, thereby ensuring the stability of ultrasonic signal transmission; on the other hand, the height difference formed by the support member 202 and the connection glue 1 provides a positioning reference for the assembly of the ultrasonic fingerprint module 50, so that it can achieve self-positioning with the help of this height difference, which can not only improve the assembly accuracy but also reduce the process complexity.

[0041] In some embodiments, the thickness difference between the support member 202 and the connection adhesive 1 is 150 μm to 180 μm.

[0042] The existing ultrasonic fingerprint module 50 is bonded to the screen body through a vacuum cavity by a bonding adhesive 1 and assembled with the display module 100. However, the existing bonding adhesive 1 is not conducive to the penetration of ultrasonic sound waves, increases the energy loss of ultrasonic waves during propagation, and thus reduces the amount of ultrasonic emission.

[0043] In some embodiments, the thickness of the support member 202 is 185 μm to 195 μm, for example, 185 μm, 188 μm, 189 μm, 190 μm, 192 μm, 195 μm, etc.

[0044] In some embodiments, the connecting glue 1 includes: a first adhesive layer 11, a conductive layer 12, and a second adhesive layer 13 stacked in sequence along the first direction (z), the first adhesive layer 11 is arranged between the display panel 60 and the conductive layer 12, and the second adhesive layer 13 is arranged on the side of the conductive layer 12 away from the first adhesive layer 11 and is connected to the ultrasonic fingerprint module 50; wherein, the thickness of the first adhesive layer 11 is 1μm~25μm, the thickness of the conductive layer 12 is 1μm~25μm, and the thickness of the second adhesive layer 13 is 1μm~25μm.

[0045] It is understood that in the implementation of this application, the thickness refers to the thickness in the first direction (z), and the thicknesses of the first adhesive layer 11, the second adhesive layer 13, and the conductive layer 12 can be the same or different. In the embodiment of this application, the thickness of the first adhesive layer 11 can be 1μm, 2μm, 3μm, 5μm, 6μm, 8μm, 9μm, 12μm, 15μm, 22μm, 25μm, etc.; the thickness of the conductive layer 12 can be 1μm, 2μm, 3μm, 5μm, 6μm, 8μm, 9μm, 12μm, 15μm, 22μm, 25μm, etc.; the thickness of the second adhesive layer 13 can be 1μm, 2μm, 3μm, 5μm, 6μm, 8μm, 9μm, 12μm, 15μm, 22μm, 25μm, etc.

[0046] It is understood that the thickness of the first adhesive layer 11 , the thickness of the second adhesive layer 13 and the thickness of the conductive layer 12 are not limited to the above examples.

[0047] In the embodiment of the present application, the connecting glue 1 is connected between the display panel 60 and the ultrasonic fingerprint module 50 .

[0048] It can be understood that in the embodiment of the present application, all or part of the ultrasonic fingerprint module 50 is connected to the connecting glue 1.

[0049] This application optimizes the structure of the connecting adhesive 1 connected to the ultrasonic fingerprint module 50, controlling the thickness of the two adhesive layers and the conductive layer 12 within the range of 1μm to 25μm, thereby reducing the obstruction to the emission of ultrasonic sound waves and increasing the emission of ultrasonic sound waves from the ultrasonic fingerprint module 50. The increase in ultrasonic sound wave emission contributes to the recognition accuracy of the ultrasonic fingerprint module 50, thereby improving the sensitivity of the ultrasonic fingerprint module 50.

[0050] In a specific embodiment, the thickness of the first adhesive layer 11 is 3 μm, the thickness of the conductive layer 12 is 6 μm, and the thickness of the second adhesive layer 13 is 6 μm.

[0051] The present embodiment provides an experiment for optimizing the thickness of the connecting adhesive 1, and the specific operation is as follows:

[0052] Provided is an experimental object 1: the thickness of the first adhesive layer 11 is 6 μm, the thickness of the conductive layer 12 is 6 μm, and the thickness of the second adhesive layer 13 is 6 μm. After experiments and simulations, the acoustic resistivity is greater than 1, which meets the conditions;

[0053] Experimental object 2 was provided: the structure and corresponding materials of Experimental object 2 were the same as those of Experimental object 1, except that the thickness of the first adhesive layer 11 was 6 μm, the thickness of the conductive layer 12 was 6 μm, and the thickness of the second adhesive layer 13 was 3 μm. After experiments and simulations, the acoustic resistivity was greater than 1, which met the requirements.

[0054] Provide experimental object 3: Experimental object 3 has the same structure and corresponding materials as experimental object 1, except that the thickness of the first adhesive layer 11 is 3 μm, the thickness of the conductive layer 12 is 6 μm, and the thickness of the second adhesive layer 13 is 6 μm. After experiments and simulations, the acoustic resistivity is greater than 1, which meets the conditions.

[0055] In the embodiment of the present application, the simulated acoustic resistivity refers to the acoustic resistivity of the ultrasonic wave emitted by the display module 100 as the simulated real sound, and the experimental result is a relative value result (i.e., a passing standard is set, greater than the passing standard>1, less than the passing standard<1).

[0056] It can be seen that when the thickness of the first adhesive layer 11 of the present application is 1 μm to 25 μm, the thickness of the conductive layer 12 is 1 μm to 25 μm, and the thickness of the second adhesive layer 13 is 1 μm to 25 μm, the ultrasonic emission requirements are all met.

[0057] In some embodiments, the first adhesive layer 11 includes a black pressure-sensitive adhesive.

[0058] In the embodiment of the present application, the black pressure-sensitive adhesive includes a substrate and a black filler dispersed in the substrate. The substrate can be made of acrylic, polyimide, polyurethane, silicone, etc. The black filler can be an organic black dye and / or an inorganic black dye. The organic black dye can be an azo black dye, such as Direct Black 38, Acid Black 1, Acid Black 242, Solvent Black 27, Solvent Black 29, Direct Black 168, etc. The inorganic black dye can be nano-carbon black, carbon nanotubes, graphene, etc. The use of nano-carbon black, carbon nanotubes, graphene, etc., which are conductive, can enhance the anti-electromagnetic interference capability of the display module 100.

[0059] It is understood that the materials of the base material and the black filler in the embodiments of the present application are not limited to the above examples.

[0060] In the embodiment of the present application, the black pressure-sensitive adhesive can absorb light, preventing reflections under strong light from affecting the display effect, thereby avoiding appearance problems caused by the ultrasonic fingerprint recognition device being set below the display screen.

[0061] In the embodiment of the present application, the transmittance of the black pressure-sensitive adhesive in the visible light range (380nm~780nm) is in the range of 10%~25%, and the sound attenuation coefficient in the ultrasonic frequency band (10~100MHz frequency band) is 0.5dB / mm.

[0062] In some embodiments, conductive layer 12 includes copper foil.

[0063] In the embodiment of the present application, copper foil is selected as the material of the conductive layer 12, which not only has the conductive function but also has the electromagnetic shielding and heat dissipation functions. Copper has good ductility and is moderately priced, which is conducive to controlling production costs.

[0064] In some embodiments, the second adhesive layer 13 includes a transparent pressure-sensitive adhesive.

[0065] In the embodiment of the present application, the material of the second adhesive layer 13 includes one or more combinations of acrylate, epoxy resin, polyurethane, and silicone.

[0066] It is understandable that the material of the second adhesive layer 13 of the present application is not limited to the above examples.

[0067] The visible light transmittance of the second adhesive layer 13 is in the range of 80% to 90%, and the attenuation coefficient in the ultrasonic frequency band is ≤0.5dB / mm.

[0068] In some embodiments, see Figure 2 The ultrasonic fingerprint module 50 includes an integrated circuit (IC) portion 501 and a flexible printed circuit (FPC) portion 502 connected to the IC portion 501 ; wherein the IC portion 501 is connected to the connecting glue 1 .

[0069] In some embodiments, at least a portion of the FPC portion 502 extends outside of the groove 30 .

[0070] In some embodiments, the support member 202 includes a foam layer, a substrate layer, and a copper foil layer stacked in sequence in the first direction (z), wherein the foam layer is close to the non-display side 601 of the display panel 60 .

[0071] During the bonding process, one side of the bonding adhesive 1 is attached to the bottom of the groove 30, and then a roller is used to apply pressure to ensure a secure bond. However, in actual production, the thickness of the conventional bonding adhesive assembly 10 during the bonding process is less than the depth of the groove 30, which prevents the roller from applying effective pressure. Consequently, the bonding adhesive 1 is unable to securely bond to the display panel 60.

[0072] To solve this problem, in some embodiments, the connecting adhesive assembly 10 also includes a raising layer 6; wherein, the raising layer 6 is arranged on the side of the connecting adhesive 1 away from the display panel 60, so that when the connecting adhesive assembly 10 is connected to the display panel 60, it exceeds the support member 202 in the first direction (z).

[0073] By adding the padding layer 6, the adhesive connection component 10 is heightened so that the adhesive connection component 10 extends beyond the support member 202 in the first direction (z) during the attachment process. This allows the roller device to apply pressure on the adhesive connection component 10 to increase the attachment strength.

[0074] In the embodiment of the present application, the connecting adhesive assembly 10 further includes a first release film 7 , which is disposed between the raising layer 6 and the connecting adhesive 1 .

[0075] In the embodiment of the present application, a first release film 7 is provided to adhere one side of the connecting glue 1 to the display panel 60 , and then the first release film 7 is removed, and the padding layer 6 is taken away from the connecting glue 1 at the same time, and the other side of the connecting glue 1 is adhered to the ultrasonic fingerprint module 50 .

[0076] In an embodiment of the present application, the connecting glue assembly 10 also includes a transparent adhesive layer 8, which is arranged between the padding layer 6 and the first release film 7, and is directly connected to the padding layer 6 in the first direction (z), thereby realizing the connection between the first release film 7 and the padding layer 6 through the transparent adhesive layer 8.

[0077] In a specific embodiment, the total thickness of the first protective layer 2 , the connecting adhesive 1 , and the first release film 7 is 115 μm.

[0078] In some embodiments, the thickness of the cushioning layer 6 is 0.05-0.15 mm, for example, 0.05 mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.12 mm, 0.15 mm, etc. The thickness of the transparent adhesive layer 8 is 0.01-0.05 mm, for example, 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, etc.

[0079] In some embodiments, see Figure 3 and Figure 4 A connecting adhesive assembly 10 is provided, which further includes a first protective layer 2 and a second protective layer 3. The first protective layer 2 is arranged on the side of the connecting adhesive 1 away from the raising layer 6, and the second protective layer 3 is arranged on the side of the raising layer 6 away from the connecting adhesive 1.

[0080] In the connecting adhesive assembly 10 provided in the embodiment of the present application, the connecting adhesive 1 is arranged between the first protective layer 2 and the second protective layer 3 to protect it from being contaminated and affecting the use effect of the assembled device.

[0081] It can be understood that in the embodiment of the present application, after the first protective layer 2 is removed, the connecting adhesive component 10 is assembled with the display panel 60. At this time, the thickness of the part of the connecting adhesive component 10 after removing the first protective layer 2 in the first direction (z) exceeds the thickness of the support member 202.

[0082] In some embodiments, the first protective layer 2 is a second release film.

[0083] It is understandable that the second release film can be removed from the connecting adhesive 1 , while protecting the connecting adhesive 1 and not affecting the use of the connecting adhesive 1 .

[0084] In some embodiments, the first protective layer 2 includes a first adhesive layer and a first non-adhesive layer stacked along a first direction (z), wherein the material of the first non-adhesive layer includes polyethylene terephthalate (PET), the first adhesive layer is arranged on the side of the first adhesive layer 11 away from the conductive layer 12, and the first non-adhesive layer is arranged on the side of the first adhesive layer away from the first adhesive layer 11.

[0085] The aforementioned adhesive assemblies 10 are stacked before entering the assembly line. Once on the line, they are separated using suction equipment. While stacked, static electricity is generated between the assemblies, making separation difficult. Furthermore, the static electricity can interfere with production equipment, making it difficult to identify the assemblies.

[0086] In some embodiments, see Figure 3 The connecting adhesive assembly 10 further includes a first antistatic layer 4 , which is disposed on a side of the first protective layer 2 away from the connecting adhesive 1 .

[0087] A first antistatic layer 4 is provided on the side of the first protective layer 2 away from the connecting glue 1 to prevent static electricity generated when the connecting glue components 10 are stacked on each other, making them easy to separate when entering the production line and preventing static electricity from interfering with production equipment.

[0088] In some embodiments, the outer edge of the first protective layer 2 extends beyond the outer edge of the connecting glue 1 in a direction from the center of the connecting glue assembly 10 to the outside of the connecting glue assembly 10, and the first antistatic layer 4 is connected to the part of the first protective layer 2 that extends beyond the connecting glue 1.

[0089] In the embodiment of the present application, by arranging the first antistatic layer 4 on the outer edge of the first protective layer 2, the connecting adhesive 1 with a multi-layer structure can be avoided, and the peeling force of the connecting part between the first protective layer 2 and the connecting adhesive 1 can be increased, thereby avoiding the reverse release situation of taking away the connecting adhesive component 10 (the second protective layer 3 in the connecting adhesive component 10 is peeled off or the connecting adhesive components 10 are peeled off from each other) when peeling off the first protective layer 2.

[0090] In the embodiment of the present application, the shape of the first antistatic layer 4 is not specifically limited.

[0091] In some embodiments, the first antistatic layer 4 includes one or more antistatic strips 41 .

[0092] By providing the first antistatic layer 4 in a strip shape, the contact area between the first antistatic layer 4 and the first protective layer 2 can be further reduced, thereby preventing the reverse separation phenomenon from occurring.

[0093] In a specific embodiment, the first antistatic layer 4 includes two antistatic strips 41, which are respectively provided at the two ends of the connecting glue 1 connected to the center of the connecting component and pointing to the outside of the connection;

[0094] In a specific embodiment, the anti-static strip 41 is an anti-static tape.

[0095] Furthermore, the inventor team discovered that simply providing the first anti-static component on one side of the first protective layer 2 cannot completely discharge the static electricity generated between the connecting adhesive components 10 .

[0096] To solve this problem, in some embodiments, the connecting glue assembly 10 also includes a second antistatic layer 5, which is arranged on the side of the second protective layer 3 away from the connecting glue 1; wherein, the positive projection of the connecting glue 1 on the second antistatic layer 5 is located within the boundary of the second antistatic layer 5.

[0097] It can be understood that, in the embodiment of the present application, the orthographic projection of the connecting glue 1 on the second antistatic layer 5 does not exceed the boundary range of the second antistatic layer 5 .

[0098] In the embodiment of the present application, the second antistatic layer 5 can be configured to be the same as or different from the first antistatic layer 4 according to the configuration process of the ultrasonic fingerprint module 50. For example, the first protective layer 2 is first removed and connected to the non-display side 601 of the display panel 60, and then the second protective layer 3 is removed. At this time, the optimal configuration of the first protective layer 2 and the second protective layer 3 is: the peeling force of the second protective layer 3 from the connecting glue 1 is greater than the peeling force from the first protective layer 2 to the connecting glue 1. Correspondingly, the first antistatic layer 4 is connected to the portion of the first protective layer 2 that exceeds the connecting glue 1, and the first antistatic layer 4 is configured as one or more antistatic strips 41 to reduce the peeling force of the first protective layer 2 from the connecting layer, and the second antistatic layer 5 is connected to the second protective layer 3 in a layered structure in the first direction (z), increasing the peeling force of the second protective layer 3 from the connecting glue 1. In this way, the difference between the peeling force of the second protective layer 3 and the peeling force of the first protective layer 2 is increased, thereby preventing the connection glue 1 from being taken away from the second protective layer 3 when the first protective layer 2 is removed.

[0099] In some embodiments, a transparent adhesive layer 8 is connected between the second protective layer 3 and the raising layer 6 to connect the second protective layer 3 and the raising layer 6 .

[0100] In some embodiments, the transmittance of the raising layer 6 is ≥85%, and the raising layer 6 includes an upper surface 61 and a lower surface 62 arranged opposite to each other in the first direction (z), and the dyne value of the upper surface 61 and the lower surface 62 is ≥34; the transmittance of the transparent adhesive layer 8 is ≥85%, and the viscosity of the transparent adhesive layer 8 is ≥1000gf / inch.

[0101] In the embodiments of the present application, the dyne value is obtained by preparing a sample for the test material under standard test, measuring the water drop angle, and testing the surface of the material with a dyne pen to obtain data; the viscosity is obtained by preparing a sample for the test material under standard test, attaching it to SUS, and testing the interface peeling force; and the transmittance is obtained by optical instruments.

[0102] In the embodiment of the present application, by configuring the transmittance of the cushioning layer 6 and the transparent adhesive layer 8 to be ≥85%, it is convenient to monitor whether the connecting adhesive component 10 is firmly attached and accurately positioned during attachment.

[0103] In the embodiment of the present application, when the dyne value of the upper surface 61 and the lower surface 62 of the cushioning layer 6 is ≥34 and the viscosity of the transparent adhesive layer 8 is ≥1000 gf / inch, the firmness of the connection between the cushioning layer 6 and the transparent adhesive layer 8 can be ensured.

[0104] See also Figure 4 When removing the second protective layer 3, an easy-tear sticker 40 is usually positioned on the edge of the outer surface of the second protective layer 3 of the connecting adhesive assembly 10 away from the connecting adhesive 1, and then the second protective layer 3 is removed by the easy-tear sticker 40. At this time, if the easy-tear sticker 40 located at the edge is too close to the edge of the connecting adhesive 1, there is a risk that the easy-tear sticker 40 will come into contact with the connecting adhesive 1, and the material of the easy-tear sticker 40 will contaminate the connecting adhesive 1, thereby destroying the continuity of the conductive layer 12 in the connecting adhesive 1.

[0105] To solve this problem, in some embodiments, the outer edge of the second protective layer 3 extends beyond the outer edge of the connecting adhesive 1 in a direction from the center of the connecting adhesive assembly 10 to the outside of the connecting adhesive assembly 10 .

[0106] At this time, the portion of the second protective layer 3 that extends beyond the outer surface of the connection adhesive 1 can be used to position the easy-tear sticker 40 to prevent the easy-tear sticker 40 from contaminating the connection adhesive 1 .

[0107] In some embodiments, the weight of the first release film 7 is greater than the weight of the first protective layer 2 .

[0108] At the same time, by setting the weight difference between the first release film 7 and the first protective layer 2, the weight of the first release film 7 per unit area of ​​the connecting adhesive 1 is greater, and therefore the peeling force required to peel it off is also greater, thereby avoiding the reverse release situation in which the connecting adhesive 1 is pulled off the first release film 7 when the first release film 7 is torn off.

[0109] In one embodiment, the weight of the first release film 7 and the weight of the first protective layer 2 are not less than 4g. The inventors discovered that by increasing the weight difference between the first release film 7 and the first protective layer 2 to 4g or more, the peel force difference between the two can be increased, thereby better preventing the reverse release phenomenon.

[0110] Of course, it is understandable that the peeling force of the first release film 7 , the cushioning layer 6 and the second protective layer 3 from the connecting layer cannot be greater than the peeling force of the second adhesive layer 13 from the conductive layer 12 .

[0111] In some embodiments, the first release film 7 includes a second adhesive layer and a second non-adhesive layer disposed opposite to each other along the first direction (z), wherein the material of the second non-adhesive layer includes PET.

[0112] In one embodiment, the second adhesive layer is disposed on a side of the second adhesive layer 13 away from the conductive layer 12 , and the second non-adhesive layer is disposed on a side of the second adhesive layer away from the second adhesive layer 13 .

[0113] In the first embodiment of the present application, see Figure 3 The connecting adhesive assembly 10 includes: a first antistatic layer 4, a first protective layer 2, a connecting adhesive 1, a first release film 7, a cushioning layer 6, a second protective layer 3 and a second antistatic layer 5 stacked in sequence in a first direction (z);

[0114] The first protective layer 2 is provided on a side of the first adhesive layer 11 away from the conductive layer 12 , and the first release film 7 is provided on a side of the second adhesive layer 13 away from the conductive layer 12 ;

[0115] A transparent adhesive layer is provided on both sides of the spacer layer 6 in the first direction (z); a first release film 7 is provided on the side of the transparent adhesive layer away from the spacer layer 6, which is away from the second protective layer 3; and the second protective layer 3 is provided on the side of the other release film away from the spacer layer 6; the light transmittance of the spacer layer 6 is ≥85%, and the light transmittance of the transparent adhesive layer 8 is ≥85%; the spacer layer 6 includes an upper surface 61 and a lower surface 62 arranged opposite to each other in the first direction (z); the dyne values ​​of the upper surface 61 and the lower surface 62 are ≥34, and the viscosity of the transparent adhesive layer 8 is ≥1000 gf / inch;

[0116] The combined thickness of the first protective layer 2, the connecting adhesive 1, and the first release film 7 is 115 μm. The weight of the first protective layer 2 is 3 to 4 g, the weight of the first release film is 5 to 7 g, the thickness of the cushioning layer 6 is 0.05 to 0.15 mm, and the thickness of the transparent adhesive layer 8 is 0.01 to 0.05 mm. The outer edge of the first protective layer 2 extends beyond the outer edge of the connecting adhesive 1 in the direction from the center of the connecting adhesive assembly 10 toward the outside of the connecting adhesive assembly 10. The first antistatic layer 4 is connected to the portion of the first protective layer 2 that extends beyond the connecting adhesive 1 in the direction from the center of the connecting adhesive assembly 10 toward the outside of the connection. The first antistatic layer 4 includes two antistatic strips 41, which are respectively provided at the ends of the connecting adhesive 1 in the direction from the center of the connecting assembly toward the outside of the connection.

[0117] The second antistatic layer 5 is a layered structure, and the orthographic projection of the connecting glue 1 on the second antistatic layer 5 is located within the boundary of the second antistatic layer 5 .

[0118] In another specific embodiment 2 of the present application, a connecting adhesive assembly 10 having a structure similar to that of embodiment 1 is provided. The difference is that two antistatic strips 41 are provided at a position where the first protective layer 2 is located at the center of the connecting adhesive assembly 10, and the orthographic projections of the two antistatic strips 41 on the connecting adhesive 1 are located within the range of the connecting adhesive 1. The antistatic ability and anti-release probability of embodiment 1 and embodiment 2 are tested, and the test results are as follows:

[0119] In the product of Example 1, the defective rate of the connecting adhesive assembly 10 due to static electricity causing the sheets to adhere to each other is 0%; and the anti-release ratio is 0.6% to 1%.

[0120] In the product of Example 2, the defective rate of the connecting adhesive assembly 10 due to static electricity causing the sheets to adhere to each other was 0%; and the anti-release ratio was 1.2% to 2%.

[0121] It can be understood that the quantitative products in Examples 1 and 2 are from different batches, and the release ratio is the ratio of products from different batches, which is expressed as a range.

[0122] From the above results, it can be seen that the adsorption failure rate of the products of Example 1 and Example 2 is 0% after adding the antistatic strips 41. Therefore, after adding the antistatic strips 41, the failure rate of mutual adsorption of sheets caused by static electricity can be effectively reduced.

[0123] Furthermore, compared to Example 2, in Example 1, the first antistatic layer 4 is connected to the first protective layer 2 at a portion extending beyond the connecting adhesive 1 in the direction from the center of the connecting adhesive assembly 10 to the outside of the connection, so that the anti-release ratio in mass production is lower than that in Example 2. Moreover, in Example 1, by setting the sum of the thicknesses of the first protective layer 2, the connecting adhesive 1, and the second release film 7 to 115 μm, the weight of the first protective layer 2 to 3 g to 4 g, the weight of the second release film to 5 g to 7 g, the thickness of the cushioning layer 6 to 0.05 to 0.15 mm, and the thickness of the transparent adhesive layer 8 to 0.01 to 0.05 mm, the anti-release ratio can be controlled to be 0.6% to 1%.

[0124] See also Figure 5 , this application also provides the steps of assembling the connecting glue 1:

[0125] Step S1: providing a display panel 60 and a support assembly 20, wherein the support assembly 20 is located on a non-display side 601 of the display panel 60, and the support assembly 20 includes an opening 201 and a support member 202 surrounding the opening 201 in a first direction (z). The support member 202 is stacked with the non-display side 601, and the non-display side 601 closes one end of the opening 201 and defines a groove 30 with the support members 202 on both sides of the opening 201;

[0126] Step S2: providing a connection adhesive assembly 10, the connection adhesive assembly 10 comprising a connection adhesive 1 and a spacer layer 6 stacked in a first direction, the spacer layer 6 being located on a side of the connection adhesive 1 away from the display panel 60;

[0127] Step S3: applying pressure on the side of the padding layer 6 away from the connecting adhesive 1 to make the connecting adhesive 1 adhere to the display panel;

[0128] Step S4: removing the raised layer 6.

[0129] In some embodiments, step S2: the connecting glue assembly 10 also includes a first protective layer 2, a second protective layer 3 and a first release film 7, the first protective layer 2 is arranged on the side of the connecting glue 1 away from the raising layer 6, the second protective layer 3 is arranged on the side of the raising layer 6 away from the connecting glue 1, and the first release film 7 is arranged between the raising layer 6 and the connecting glue 1.

[0130] Step S3 includes:

[0131] Step S301: After removing the first protective layer 2, a roller device is used to apply pressure to the outer surface of the connecting adhesive component 10 away from the first protective layer 2, so that the first adhesive layer 11 is attached to the bottom of the groove 30.

[0132] Step S302: While removing the padding layer 6, the first release film 7 and the second protective layer 3 are removed at the same time.

[0133] In some embodiments, step S302 includes the following steps:

[0134] Step S3021: The outer edge of the second protective layer 3 extends beyond the outer edge of the connecting adhesive 1 in a direction from the center of the connecting adhesive assembly 10 toward the outside of the connecting adhesive assembly 10. An easy-tear label 40 is positioned on the outer surface of the connecting adhesive assembly 10 extending from the first protective layer 2 and along the first direction (z) to the second protective layer 3. The easy-tear label 40 is located on the outer surface corresponding to the portion extending beyond the connecting adhesive 1 in a direction from the center of the connecting adhesive assembly 10 toward the outside of the connecting adhesive assembly 10.

[0135] Step S3022 : applying a peeling force to the easy-tear tape 40 to peel the second protective layer 3 , the cushioning layer 6 and the first release film 7 from the connecting adhesive 1 .

[0136] It can be understood that when the second protective layer 3 is the last layer of the connecting adhesive component 10 arranged along the first direction (z) from the first protective layer 2, the outer surface is a part of the second protective layer 3; when the second protective layer 3 is provided with a second antistatic layer 5 on the side away from the cushioning layer 6, that is, the second antistatic layer 5 is the last layer of the connecting adhesive component 10 arranged along the first direction (z) from the first protective layer 2, the outer surface is a part of the second antistatic layer 5. Of course, the outer surface can also be composed of the second protective layer 3 and the second antistatic layer 5 at the same time, that is, a part of the easy-to-tear label 40 is connected to the second protective layer 3, and the other part is connected to the second antistatic layer 5. At this time, the orthographic projection of the second antistatic layer 5 on the second protective layer 3 exceeds the orthographic projection range of the connecting adhesive 1 on the second protective layer, but does not exceed the range of the second protective layer 3.

[0137] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0138] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0139] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0140] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that: The display module includes: Display panel; A support member assembly, the support member assembly including an opening and a support member surrounding the opening, the support member stacked with the non-display side of the display panel, and the non-display side of the display panel closes one end of the opening and defines a groove with the support member; a connecting adhesive, located in the groove and connected to the non-display side of the display panel along a first direction, wherein a thickness of the connecting adhesive in the first direction is less than a thickness of the supporting member in the first direction; An ultrasonic fingerprint module is provided on a side of the connecting adhesive away from the display panel.

2. The display module according to claim 1, wherein: The connecting glue includes a first adhesive layer, a conductive layer, and a second adhesive layer stacked in sequence along the first direction, wherein the first adhesive layer is provided between the display panel and the conductive layer, and the second adhesive layer is provided on a side of the conductive layer away from the first adhesive layer and connected to the ultrasonic fingerprint module; The thickness of the first adhesive layer is 1 μm to 25 μm, the thickness of the conductive layer is 1 μm to 25 μm, and the thickness of the second adhesive layer is 1 μm to 25 μm.

3. The display module according to claim 1 or 2, characterized in that: The difference in thickness between the support member and the connecting adhesive is 150 μm to 180 μm.

4. The display module according to claim 2, wherein: The first adhesive layer includes black pressure-sensitive adhesive.

5. The display module according to claim 2, wherein: The conductive layer includes copper foil.

6. The display module according to claim 2, wherein: The second adhesive layer includes a transparent pressure-sensitive adhesive.

7. A connecting adhesive assembly, characterized in that: Used in the display module according to any one of claims 1 to 6, connecting the connecting adhesive to the display panel; The connecting glue component includes the connecting glue; The connecting adhesive assembly further includes a cushioning layer, which is provided on a side of the connecting adhesive away from the display panel. When the connecting adhesive assembly is connected to the display panel, the cushioning layer extends beyond the supporting member in the first direction.

8. The connecting adhesive assembly according to claim 7, characterized in that: The connecting adhesive assembly further includes a release film, which is arranged between the padding layer and the connecting adhesive.

9. The connecting adhesive assembly according to claim 8, characterized in that: The connecting adhesive assembly further includes a transparent adhesive layer, and the transparent adhesive layer is arranged between the release film and the padding layer.

10. The connecting adhesive assembly according to claim 9, characterized in that: The transmittance of the cushioning layer is ≥85%, and the transmittance of the transparent adhesive layer is ≥85%; and / or the cushioning layer includes an upper surface and a lower surface arranged opposite to each other in the first direction, the dyne value of the upper surface and the lower surface is ≥34, and the viscosity of the transparent adhesive layer is ≥1000gf / inch.

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