Construction method of double-sided local spraying electroplating model, electroplating system and electroplating method

Abstract

The invention discloses a construction method of a double-sided local spraying electroplating model, an electroplating system and an electroplating method, and belongs to the technical field of double-sided local spraying electroplating equipment.The construction method of the electroplating model comprises the steps that a double-sided local spraying electroplating device is provided; according to the relation between the pressure and the flow, an operation formula of the electroplating model is constructed; combining a flow calculation formula with a Faraday electrolysis law, and substituting the flow calculation formula and the Faraday electrolysis law into an operation formula of the electroplating model to obtain an operation formula between the pressure and the thickness of the electroplating film; and electroplating the plated part according to set conditions to obtain an electroplated product, and judging whether the actual film thickness of the electroplated product meets the standard requirement or not. Through the electroplating model, the accuracy of predicting the thickness of the double-sided local spraying electroplating film of the semiconductor lead frame can be quickly realized, the error of the thickness of the actual electroplating product coating film is reduced, the improvement of the thickness uniformity of the double-sided local spraying electroplating film can be promoted, and the requirement of high-end semiconductor lead frame products on high quality is met.

Description

Technical Field

[0001] The present invention relates to a construction method of a double-sided local jet electroplating model, an electroplating system and an electroplating method, and belongs to the technical field of double-sided local jet electroplating. Background Art

[0002] With the rapid development of science and technology, in the field of electroplating equipment technology, the local electroplating area of ​​semiconductor lead frames is increasingly evolving towards miniaturization. At present, the local area jet plating technology is still in the stage of single-sided local electroplating products, especially for products with double-sided local jet plating on lead frames, which can only be plated once on the front side and then on the back side. This process method not only has the problem of low electroplating efficiency, but also has the problem that when the front side is electroplated, the back side will be exposed to different degrees of infiltration and contact of the electroplating solution, and then the metal will be replaced, resulting in contamination of the back side. In order to ensure the quality of the electroplating on the back side, it is necessary to adopt a method of stripping the replaced metal. After removing it to form a clean surface, the back side can be plated again. This can easily lead to a high product defect rate, making it difficult to obtain high-quality, high-yield semiconductor lead frame local precision electroplating products.

[0003] Chinese patent document CN103774194A provides an electroplating device for LED lead frames. Although the electroplating device can achieve double-sided electroplating of LED lead frames, it cannot screen the optimal conditions of the double-sided local jet electroplating model, nor can it achieve electroplating with different film thickness requirements on both sides of the plated part by adjusting relevant parameters. This reduces the intelligent control operation efficiency of the double-sided local jet electroplating device, and cannot ensure the uniformity of the electroplated film thickness, and cannot meet the high quality requirements of high-end semiconductor lead frame products. Summary of the Invention

[0004] The present invention provides a method for constructing a double-sided local jet electroplating model, an electroplating system and an electroplating method to solve the problems in the prior art that single-sided electroplating easily leads to a high product loss rate, and that double-sided electroplating equipment is unable to screen the optimal conditions for the double-sided local jet electroplating model and cannot ensure the uniformity of the electroplating film thickness, resulting in difficulty in obtaining high-quality, high-yield semiconductor lead frame local precision electroplating products.

[0005] In a first aspect, the present invention provides a method for constructing a double-sided localized jet electroplating model, comprising: Step 1: Provide a double-sided localized spray electroplating device, the electroplating device comprising an electroplating solution tank, an upper mold, a lower mold, and a control system, wherein the pressure and solution flow of the electroplating solution chambers of the upper mold and the lower mold are controlled by the control system; Step 2: The calculation formula between the pressure and flow rate of the electroplating solution chamber in the double-sided local jet electroplating model is: P = P 0×( Q 0 / Q )×( T / T 0)Formula 1 Where, P is the pressure of the electroplating solution chamber, MPa; P 0 is the standard pressure, MPa; Q 0 is the standard flow rate, m 3 / h; Q is the flow rate, m 3 / h; T is the Kelvin temperature, K; T 0 is the standard temperature Kelvin, K; Among them, standard pressure P 0 is 0.1MPa; standard flow rate Q 0 is 12m 3 / h; standard Kelvin temperature T 0 is 25+273.15K; since the working temperature of the electroplating solution is set to 55℃, the Kelvin temperature T =55+273.15K; Substitute the above known conditions into formula 1 to obtain the pressure of the electroplating solution under the above known conditions P The calculation formula between 1 and flow rate: P 1=1.2×328.15 / (298.15· Q )Formula 2 Step 3: Traffic Q The calculation formula is: Q = V × S Formula 3 Where, V is the flow rate of the electroplating solution, m / h; S is the total cross-sectional area of ​​the electroplating solution opening, m 2 ; Step 4: The total cross-sectional area of ​​the plating solution opening in step 3 S Equal to the area of ​​the local plating area of ​​the plated part, based on the practical application of Faraday's law of electrolysis in the electroplating process, formula 4 is obtained: S=CItη k / Dρ Formula 4 Substituting Formula 3 and Formula 4 into Formula 2, we get Formula 5: P1=1.2×328.15· Dρ / (298.15· VCI k )Formula 5 Where, C is the electrochemical equivalent, g / ampere-hour; I is the current intensity, ampere; t is the plating time, hours; η k is the cathode current efficiency, %; D is the thickness of the spray electroplating film, m; ρ is the metal density of the electroplating layer, g / m 3 ; Step 5: Simulate the upper mold plating solution chamber pressure based on Formula 5 P 建模正 , and the lower mold plating solution chamber pressure P 建模反 The setting conditions are applied to the double-sided localized spray electroplating device, and the spray electroplating conditions of the upper mold and the lower mold are set respectively, so that the upper mold performs spray electroplating on the front side of the plated part, and at the same time, the lower mold performs spray electroplating on the back side of the plated part; and the plated part is locally double-sided electroplated to obtain the electroplated product of the plated part; Step 6: Management and control of the thickness conditions of the local spray plating of the double-sided lead frame. Transform Formula 5 to obtain Formula 6: D =298.15 P 1 VCI k / 1.2×328.15· ρ Formula 6 The plating solution chamber pressure obtained in step 5 P 建模正 and P 建模反 Substitute into formula 6, and the thickness of the electroplated film on the front of the plated part is obtained by formula 6: D 建模正 and reverse side modeling electroplating film thickness D 建模反 ; Step 7: Double-sided local spray electroplating film thickness threshold management, measure the electroplating film thickness on the front and back of the electroplated product obtained in step 5, and obtain the measured front electroplating film thickness D 实测正 and reverse side plating thickness D 实测反 If the judgment conditions are met D建模正 ≤ D 实测正 ≤ D 建模正 + 5% D 建模正 Formula 7 D 建模反 ≤ D 实测反 ≤ D 建模反 + 5% D 建模反 Formula 8 It is considered that the plating solution chamber pressure in step 5 is P 建模正 and P 建模反 The setting conditions apply, otherwise the actual D 实测正 and D 实测反 As a benchmark, correct P 建模正 and verify P 建模反 , repeat steps 4 to 7 until formula 7 and formula 8 are satisfied.

[0006] In one embodiment of the present invention, the metal types of the electroplating solution include: single-layer plating of Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt, and alloy plating of binary alloy metals of Au-Ni and Au-Co.

[0007] In a second aspect, the present invention further provides a double-sided localized jet electroplating system, using the electroplating model construction method, the electroplating system comprises: electroplating solution tank; An upper mold and a lower mold, wherein the upper mold can abut against the lower mold, and the upper mold and the lower mold are connected to the electroplating solution tank; the plated workpiece is placed between the upper mold and the lower mold; A control system is provided, wherein the control system is capable of controlling the pressure and solution flow rate of the electroplating solution chambers of the upper mold and the lower mold.

[0008] In one embodiment of the present invention, the upper mold includes an upper solution chamber, an upper pressure gauge, an upper flow meter and an upper pump. The upper solution chamber is connected to the upper pressure gauge and the upper pump respectively. The upper pump is connected to the electroplating solution tank. The upper flow meter is installed between the upper pump and the upper solution chamber.

[0009] In one embodiment of the present invention, the lower mold includes a lower solution chamber, a lower pressure gauge, a lower flow meter and a lower pump. The lower solution chamber is connected to the lower pressure gauge and the lower pump respectively. The lower pump is connected to the electroplating solution tank. The lower flow meter is installed between the lower pump and the lower solution chamber.

[0010] In one embodiment of the present invention, the control system includes an electroplating solution pressure control module A and a data training module A. The electroplating solution pressure control module A is connected to the upper pump, and controls the liquid inlet flow rate of the upper solution chamber by controlling the upper pump. The data training module A is connected to the upper pressure gauge.

[0011] In one embodiment of the present invention, the control system also includes an electroplating solution pressure control module B and a data training module B. The electroplating solution pressure control module B is connected to the lower pump, and controls the liquid inlet flow rate of the lower solution chamber by controlling the lower pump. The data training module B is connected to the lower pressure gauge.

[0012] In one embodiment of the present invention, the upper pump is connected to the upper solution chamber via a hose, and the lower pump is connected to the lower solution chamber via a pipe.

[0013] In one embodiment of the present invention, the upper pump and the lower pump are both variable frequency pumps. The flow rate of the solution in the pipeline can be regulated according to demand. Q size.

[0014] In a third aspect, the present invention further provides an electroplating method, using the method for constructing an electroplating model, the electroplating method comprising: S1: Constructing a database of double-sided local jet electroplating conditions and an initial double-sided local jet electroplating model connected to the database; S2: Extract two different double-sided local spray electroplating conditions from the database, and use the double-sided local spray electroplating system to perform actual spray electroplating on the plated parts. P 建模正 and lower pressure P 建模反 Set to a constant pressure for actual electroplating operation, and fine-tune the flow of the electroplating solution in real time through the control system Q , used to maintain a constant pressure value; S3: After the actual electroplating operation in S2 is completed, the thickness of the electroplated film on the front of the obtained electroplated product is tested. D 实测正 and reverse side plating thickness D 实测反 Data, and the set front film thicknessD 建模正 and reverse film thickness D 建模反 The data are compared and if they meet the judgment conditions of formula 7 and formula 8, they are imported into the initial model database and the corresponding upper solution chamber pressure is P 实测正 , and the lower solution chamber pressure P 实测反 Used to improve the initial double-sided local jet electroplating model; S4: Electroplating film thickness obtained in S3 D 实测正 and D 实测反 If formulas 7 and 8 are satisfied, the upper solution chamber pressure is considered to be P 建模正 , and the lower solution chamber pressure P 建模反 The setting conditions are applicable, otherwise the actual front electroplating film thickness D 实测正 and reverse side plating thickness D 实测反 As a benchmark, correct P 建模正 and verify P 建模反 , the actual operation of double-sided local plating area spray electroplating is circulated until formula 7 and formula 8 are satisfied; wherein, formulas 7 and 8 D 建模正 and D 建模反 They are the film thickness data of the front and back sides set in S3 respectively; S5: Real-time loop S2 to S5 to obtain a continuously iteratively upgraded double-sided local jet electroplating model; S6: Select a double-sided local jet plating model upgraded from S5 and apply it to the double-sided local jet plating system to obtain the optimal plating solution chamber pressure. P 实测正 and plating solution chamber pressure P 实测反 The data is applied to the electroplating system, and the flow in the pipeline is controlled by the control system to control the actual control pressure of the electroplating solution chamber of the upper electroplating mold P 实控正 and the actual control pressure of the electroplating solution chamber of the lower electroplating mold P 实控反 Achieve the above-mentioned optimal plating solution chamber pressure P 实测正 and plating solution chamber pressure P 实测反 and stabilize it, thereby completing double-sided electroplating of the plated component.

[0015] The beneficial effects of the present invention are: The double-sided local jet electroplating model created by the present invention can quickly establish the production conditions for the double-sided local electroplating film thickness of various different monomeric metal salts and binary metal salt electroplating solutions in the actual production process. Furthermore, through the double-sided local jet electroplating film thickness condition electroplating model, it is possible not only to quickly achieve the accuracy of predicting the double-sided local jet electroplating film thickness of the semiconductor lead frame, greatly reducing the error with the actual electroplating product coating thickness, making the obtained electroplated product performance more precise and superior; but also to promote the improvement of the uniformity of the double-sided local jet electroplating film thickness, so as to meet the high quality requirements of high-end semiconductor lead frame products.

[0016] The double-sided localized jet electroplating system created by the present invention can regulate the flow rate in the pipeline through a variable frequency pump, control the stability of the pressure in the upper solution chamber and the lower solution chamber of the electroplating mold, and ensure that the electroplated film thickness in the localized plating area on both sides of the semiconductor plated part meets the standard control range. By adopting the double-sided localized jet electroplating system, the pump flow-pressure control system simulates the chamber pressure and actual flow rate, and performs continuous pressure optimization in real time, thereby obtaining the optimal standard for the double-sided chamber pressure, ensuring the precise management of the double-sided coating, and realizing the screening of the optimal conditions for the double-sided localized jet electroplating model. At the same time, it can assist R&D personnel in the design of electroplating molds and shorten R&D time.

[0017] The double-sided local jet electroplating system created by the present invention sets up two completely independent systems to independently control the upper mold and the lower mold. By independently regulating the pressure and flow of the solution chamber by the two systems, it is possible to simultaneously electroplate different film thickness requirements on the front and back of the plated part, and ensure that the film thickness after electroplating meets the requirements, thereby improving the working efficiency of the double-sided local jet electroplating system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic diagram of a double-sided localized spray electroplating device provided in an embodiment of the present invention.

[0020] Figure 2 A schematic diagram of a plated component provided in an embodiment of the present invention.

[0021] Figure 3 Schematic diagram of film thickness test points provided by an embodiment of the present invention.

[0022] In the figure: 100A, upper mold; 100B, lower mold; 90, electroplating solution tank; 80A, upper solution chamber; 80B, lower solution chamber; 70A, upper pressure gauge; 70B, lower pressure gauge; 60A, upper flow meter; 60B, lower flow meter; 50A, upper pump; 50B, lower pump; 10, plated part; 200, control system; 20, plated part unit; 21, film thickness test point. DETAILED DESCRIPTION

[0023] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," and "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0025] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed or detachable connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and connections within two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention.

[0026] The present invention provides a method for constructing a double-sided localized jet electroplating model. This method utilizes the continuity, fluidity, kinetic energy, potential energy, and pressure conservation laws of incompressible fluids to intelligently control a double-sided localized jet electroplating system using the pressure conservation law equation. This method can provide accurate predictions for simultaneous electroplating of the front and back sides of complex lead frame localized plating areas. The method includes: Step 1: Provide a double-sided partial jet electroplating device capable of completing partial electroplating on both the front and back surfaces simultaneously. The double-sided partial jet electroplating device includes a plating solution tank 90 and mold devices, namely, an upper mold 100A and a lower mold 100B, and a control system 200. The upper mold 100A includes an upper solution chamber 80A, an upper pressure gauge 70A, an upper flowmeter 60A, and an upper pump 50A. The lower mold 100B includes a lower solution chamber 80B, a lower pressure gauge 70B, a lower flowmeter 60B, and a lower pump 50B. The pressure and solution flow in the plating solution chambers of the upper mold 100A and lower mold 100B can be independently controlled by the control system.

[0027] Step 2: Based on the continuity, fluidity, kinetic energy, potential energy and pressure conservation laws of the incompressible fluid of the electroplating solution in computational fluid dynamics, a double-sided local jet electroplating model is constructed. The calculation formula between the pressure and flow rate of the electroplating solution transported by the double-sided local jet electroplating model is: P = P 0×( Q 0 / Q )×( T / T 0)Formula 1 Wherein, in formula 1: P is the pressure of the electroplating solution chamber, MPa; P 0 is the standard pressure, MPa; Q 0 is the standard flow rate, m 3 / h; Q is the flow rate, m 3 / h; T is the Kelvin temperature, K; T 0 is the standard temperature in Kelvin, K.

[0028] In the present invention, the standard pressure P 0 is 0.1MPa; the standard flow rate of the pump used in the double-sided local spray electroplating device Q 0 is 12m 3 / h; the standard temperature is 25℃, so the standard Kelvin temperature T 0 is 25+273.15K. Since the working temperature of the electroplating solution of the present invention is set to 55°C, the Kelvin temperature T =55+273.15K; Substitute the above known conditions into formula 1, and the pressure of the electroplating solution under the above known conditions is P The calculation formula between 1 and flow rate; P 1=0.1×(12 / Q )×{(55+273.15) / (25+273.15)} =0.1×12×(55+273.15) / {(25+273.15)× Q} =1.2×328.15 / (298.15· Q )Formula 2 From formula 2, we can see that in the calculation formula of constructing the double-sided local jet electroplating model, the pressure of the mold electroplating solution chamber is P 1 and flow Q Inversely proportional, therefore, the solution flow rate is regulated by regulating the pump of the double-sided local jet electroplating equipment Q , the corresponding mold plating solution chamber pressure can be obtained P 1.

[0029] Step 3: Traffic from Step 2 Q The calculation formula is shown in Formula 3: Q = V × S Formula 3 Among them, in formula 3: V is the flow rate of the electroplating solution, m / h; S is the total cross-sectional area of ​​the electroplating solution opening, m 2 .

[0030] From formula 3, we can see that the flow rate Q The total cross-sectional area of ​​the openings for the electroplating solution to flow into the mold cavity S Proportional to the total cross-sectional area of ​​the mold cavity S The larger the flow Q The greater the chamber pressure P 1 is smaller. Therefore, when the local plating area of ​​the lead frame changes, the corresponding flow rate Q and chamber pressure P 1 conditions need to be re-debugged.

[0031] Step 4: The total cross-sectional area of ​​the mold cavity through which the plating solution flows in step 3 S It is equal to the area of ​​the local plating area of ​​the plated part. Therefore, the practical application of Faraday's law of electrolysis in the electroplating process is formula 4: S=CItη k / Dρ Formula 4 Wherein, in formula 4: C is the electrochemical equivalent, g / ampere-hour; I is the current intensity, ampere; t is the plating time, hours; η k is the cathode current efficiency, %; D is the thickness of the spray electroplating film, m; ρ is the metal density of the electroplating layer, g / m 3 ; Substituting Formula 3 and Formula 4 into Formula 2, we obtain Formula 5.

[0032] P 1=1.2×328.15 / (298.15· Q ) =1.2×328.15 / (298.15· VS ) =1.2×328.15 / (298.15· VCI k / Dρ ) =1.2×328.15· Dρ / (298.15· VCI k )Formula 5 From formula 5, we can know that the pressure of the mold electroplating solution chamber of the present invention is P 1. The thickness of the spray electroplating film in the local plating area of ​​the plated part D Directly proportional to the plating solution flow rate V , current intensity I and plating time t Inversely proportional.

[0033] Step 5: Under the condition that all other spray plating conditions except the mold electroplating solution chamber pressure condition remain unchanged, the pressure of the electroplating solution chamber of the upper electroplating mold is simulated and calculated based on Formula 5 of the double-sided local spray plating model constructed by the present invention. P 建模正 , and the pressure of the plating solution chamber of the lower plating mold P 建模反 Setting conditions; and modeling the upper electroplating mold plating solution chamber pressure P 建模正 and the pressure of the plating solution chamber of the lower plating mold P 建模反The conditions are actually applied to the actual operation of the double-sided local spray electroplating device to perform spray electroplating on the double-sided parts of the plated part 10.

[0034] For the localized front-side plating area of ​​the part 10, the upper mold 100A series equipment is used to set the spray plating conditions and independently perform the spray plating process on this localized front-side plating area. For the localized back-side plating area of ​​the part 10, the lower mold 100B series equipment is used to set the spray plating conditions and independently perform the spray plating process on this localized back-side plating area. That is, after the upper and lower molds are closed, the independent A and B series equipment simultaneously perform the spray plating process on both sides of the localized lead frame area, resulting in a plated product with the localized plating areas on both sides plated in one go.

[0035] Step 6: Double-sided lead frame local spray plating film thickness condition management and control. Transform formula 5 to get formula 6: D =298.15 PVCItη k / 1.2×328.15· ρ Formula 6 According to the upper plating mold plating solution chamber pressure P 建模正 , and the pressure of the plating solution chamber of the lower plating mold P 建模反 Setting conditions; Formula 6 can be used to calculate the corresponding upper lead frame local spray modeling plating film thickness D 建模正 , and the thickness of the local jet modeling plating film on the lower lead frame D 建模反 .

[0036] Step 7: Double-sided lead frame partial jet plating film thickness management threshold. Based on the above double-sided partial jet plating device, the actual electroplating operation is performed on the double-sided partial plating area of ​​the lead frame. The obtained double-sided partial plating area jet plating film thickness is D 实测正 and D 实测反 , if: D 建模正 ≤ D 实测正 ≤ D 建模正 + 5% D 建模正 Formula 7 D 建模反 ≤ D 实测反 ≤ D 建模反 + 5%D 建模反 Formula 8 Then confirm the pressure of the upper electroplating mold plating solution chamber in step 5 P 建模正 , and the pressure of the plating solution chamber of the lower plating mold P 建模反 The setting conditions apply; otherwise, the actual D 实测正 and D 实测反 As a benchmark, correct P 建模正 and verify P 建模反 , repeat steps 4 to 7 until formula 7 and formula 8 are satisfied.

[0037] Furthermore, the metal types of the electroplating solution include: Single layer plating Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt.

[0038] Alloy coating: binary alloy metals of Au-Ni and Au-Co.

[0039] In addition, if Figure 1 As shown, the present invention also provides a double-sided localized jet plating system, which utilizes the above-mentioned electroplating model to achieve double-sided electroplating of the plated workpiece. The double-sided localized jet plating system includes a plating solution tank 90 and a mold device, namely an upper mold 100A and a lower mold 100B, and a control system 200. The upper mold 100A and the lower mold 100B can abut against each other, and the plated workpiece 10 is placed between the upper mold 100A and the lower mold 100B, so that both sides of the plated workpiece 10 can be electroplated simultaneously. The upper mold 100A and the lower mold 100B are both connected to the plating solution tank 90, and the two share the same plating solution tank 90.

[0040] In some embodiments, the upper mold 100A includes an upper solution chamber 80A, an upper pressure gauge 70A, an upper flow meter 60A, and an upper pump 50A. The upper solution chamber 80A is connected to the upper pressure gauge 70A. When the upper and lower molds are closed and spray plating is being performed on a localized front surface area of ​​the workpiece 10, the upper pressure gauge 70A can monitor the pressure within the upper solution chamber 80A in real time. The upper solution chamber 80A is connected to the upper pump 50A. An upper flow meter 60A is disposed between the upper solution chamber 80A and the upper pump 50A. The upper flow meter 60A can monitor the flow rate of the plating solution delivered to the upper solution chamber in real time. The upper pump 50A can transfer the plating solution within the plating solution tank 90 to the upper solution chamber 80A for spray plating on the localized front surface area of ​​the workpiece 10. After plating, the plating solution returns to the plating solution tank 90 according to a predetermined loop.

[0041] In some embodiments, the lower mold 100B includes a lower solution chamber 80B, a lower pressure gauge 70B, a lower flow meter 60B, and a lower pump 50B. The lower solution chamber 80B is connected to the lower pressure gauge 70B. After closing with the upper mold 100A, the lower pressure gauge 70B can monitor the pressure in the lower solution chamber 80B in real time during the jet electroplating process on the localized plating area on the reverse side of the workpiece 10. The lower solution chamber 80B is connected to the lower pump 50B, and a lower flow meter 60B is disposed between the lower solution chamber 80B and the lower pump 50B. The lower flow meter 60B can monitor the flow rate of the electroplating solution delivered to the lower solution chamber 80B in real time. The lower pump 50B can transport the electroplating solution in the electroplating solution tank 90 to the lower solution chamber 80B to perform spray electroplating on the local plating area on the back side of the plated workpiece 10. After electroplating, the electroplating solution returns to the electroplating solution tank 90 according to a predetermined loop.

[0042] In some embodiments, the control system 200 includes a plating solution pressure control module A and a data training module A, as well as a plating solution pressure control module B and a data training module B. Both the upper pump 50A and the lower pump 50B are connected to the control system 200. The control system 200 controls the pressure and flow of the plating solution by controlling the force output by the upper pump 50A and the lower pump 50B. By providing independent A and B systems, the pressure and flow of the plating solution within the upper solution chamber 80A and the lower solution chamber 80B can be controlled separately, enabling not only partial plating on the front and back sides of a workpiece, but also plating with varying plating areas and film thicknesses on the front and back sides of the workpiece.

[0043] In some embodiments, the electroplating solution pressure control module A is used to control the operation module of spraying the electroplating solution on the local plating area on the front side of the lead frame, and the film thickness of the local area on the front side of the lead frame is calculated by formula 6. D 建模正 The requirements of the calculation are used to obtain the modeling pressure for constructing the front local jet electroplating model. P 建模正 The electroplating solution flow control module A is used to control the flow of the electroplating solution sprayed in the local plating area on the front of the lead frame. The flow rate of the incompressible electroplating solution is simulated by the flow rate formulas 1 and 2 of the upper solution chamber 80A. The flow rate in the pipeline is controlled by the upper pump 50A. Q 正 The pressure of the electroplating solution in the upper solution chamber 80A is controlled and intelligently controlled so that the difference fluctuation tends to be within a small range.

[0044] In some embodiments, the data training module A is used to convert the actual pressure data of the electroplating solution monitored by the upper pressure gauge 70A in the upper solution chamber 80A into the actual pressure data of the electroplating solution monitored by the upper pressure gauge 70A.P 实测正 On the other hand, the actual electroplating operation is carried out on the local plating area on both sides of the lead frame, and the obtained double-sided local plating area spray plating film thickness is calculated. D 实测正 and film thickness D 建模正 Conduct contrast training.

[0045] In some embodiments, the electroplating solution pressure control module B is used to control the operation module of spraying the electroplating solution in the local plating area on the reverse side of the lead frame, and the film thickness of the local area on the reverse side of the lead frame is calculated by formula 6. D 建模反 The requirements of the calculation are used to obtain the modeling pressure for constructing the reverse local jet electroplating model. P 建模反 The plating solution flow control module B is used to control the flow of the plating solution sprayed in the local plating area on the back of the lead frame. It simulates the plating solution flow control model of the lower solution chamber 80B through the flow formulas 1 and 2 of the incompressible plating solution, and controls the solution flow in the pipeline through the lower pump 50B. Q 反 The pressure of the electroplating solution in the lower solution chamber 80B is controlled and intelligently controlled so that the difference fluctuation tends to be within a small range.

[0046] In some embodiments, the data training module B is used to convert the actual measured data of the electroplating solution pressure monitored by the lower pressure gauge 70B in the lower solution chamber 80B into the actual measured data of the electroplating solution pressure monitored by the lower pressure gauge 70B. P 实测反 On the other hand, the actual electroplating operation is carried out on the local plating area on both sides of the lead frame, and the obtained double-sided local plating area spray plating film thickness is calculated. D 实测反 and film thickness D 建模反 Conduct contrast training.

[0047] In some embodiments, the method is applicable to semiconductor electronic components to be processed, and the semiconductor electronic components to be processed include: connector terminals, lead frames, and wafer chip precision products.

[0048] Optionally, a strong hose can be used to connect upper solution chamber 80A to upper pump 50A to facilitate vertical downward movement of upper mold 100A and closing of lower mold 100B. A PP pipe can be used to connect lower solution chamber 80B to lower pump 50B, eliminating the need for vertical movement of lower solution chamber 80B.

[0049] Optionally, both the upper pump 50A and the lower pump 50B are variable frequency pumps, which can adjust the flow rate of the solution in the pipeline according to demand.Q size.

[0050] In addition, an embodiment of the present invention further provides an electroplating method that utilizes the above-mentioned double-sided localized jet electroplating model construction method and double-sided localized jet electroplating system. The electroplating method includes: S1: Build a database of double-sided local jet plating conditions based on intelligent control. The double-sided local jet plating conditions include: film thickness modeling data of the local plating areas on the front and back sides of the lead frame D 建模正 、 D 建模反 , Upper pressure gauge 70A pressure data P 建模正 And the lower pressure gauge 70B pressure data P 建模反 , flow data of upper flow meter Q 正 and flow data of the lower flow meter Q 反 , electroplating solution density, electroplating solution temperature, power supply current, pump frequency and connecting pipe diameter, so as to construct an initial double-sided local jet electroplating model connected to the database.

[0051] S2: Extract two different double-sided local spray electroplating conditions from the database, and use the intelligent controlled double-sided local spray electroplating system to perform actual spray electroplating on both sides of the lead frame. P 建模正 and lower pressure P 建模反 Set to a constant pressure for actual electroplating operation, and fine-tune the flow of the electroplating solution in real time through the intelligent control system of the variable frequency pump Q , used to maintain a constant pressure value.

[0052] S3: After the actual electroplating operation in S2 is completed, the thickness of the electroplated film on the front side of the obtained lead frame double-sided local spray electroplated product is tested. D 实测正 and reverse side plating thickness D 实测反 The spray plating film thickness data is different from the set front film thickness D 建模正 and reverse film thickness D 建模反 The data are compared and if they meet the judgment conditions of formula 7 and formula 8, they are imported into the initial model database, and the corresponding upper electroplating mold electroplating solution chamber pressure is P 实测正 , and the pressure of the plating solution chamber of the lower plating mold P 实测反 Used to improve the initial double-sided local jet electroplating model.

[0053] S4: in equations 7 and 8 D 建模正 and D 建模反 The modeling film thickness data of the front and back sides set in S3 can be the same or different, and can be set according to actual R&D needs. D 实测正 and D 实测反 , if: D 建模正 ≤ D 实测正 ≤ D 建模正 + 5% D 建模正 Formula 7 D 建模反 ≤ D 实测反 ≤ D 建模反 + 5% D 建模反 Formula 8 Then confirm the upper plating solution chamber pressure P 建模正 , and the pressure of the plating solution chamber of the lower plating mold P 建模反 The setting conditions apply; otherwise, the actual D 实测正 and D 实测反 As a benchmark, correct P 建模正 and verify P 建模反 , the actual operation of double-sided local plating area jet electroplating is circulated until formula 7 and formula 8 are satisfied.

[0054] S5: Real-time loop S2 to S5 to obtain a continuously iterative and upgraded double-sided local jet electroplating model.

[0055] S6: Select a double-sided local jet plating model upgraded from S5 and apply it to the double-sided local jet plating system to obtain the optimal upper plating mold plating solution chamber pressure. P 实测正 and the pressure of the plating solution chamber of the lower plating mold P 实测反 The data is applied to the electroplating system, and the flow in the pipeline is controlled by the control system 200 to control the actual control pressure of the electroplating solution chamber of the upper electroplating mold P 实控正and the actual control pressure of the electroplating solution chamber of the lower electroplating mold P 实控反 Achieve the above optimal upper plating mold plating solution chamber pressure P 实测正 and the pressure of the plating solution chamber of the lower plating mold P 实测反 and stabilize it, completing the double-sided electroplating of the plated component 10.

[0056] The above electroplating method can assist R&D personnel in accurately and quickly screening the optimal conditions for double-sided local jet electroplating models, facilitate R&D personnel in designing electroplating molds, shorten R&D time, and reduce R&D costs.

[0057] Example 1 like Figure 2 and Figure 3 As shown, this embodiment combines the actual operation case of the intelligent controlled double-sided local spray electroplating device to be selected to spray electroplating on the double-sided parts of the lead frame, and describes in detail the construction process of the fast, accurate optimization, classification and discrimination model data processing system of the present invention. Figure 2 The plated part 10 shown in the figure has a film thickness test point 21 at Figure 3The position coordinates of the black point ● in the center of the local plating area of ​​each plating unit 20 are: 10 (14.6, 7.3), 9 (14.6, 21.9), 8 (14.6, 36.5), 7 (14.6, 51.1), 6 (14.6, 65.7), 5 (14.6, 80.3), 4 (14.6, 94.9), 3 (14.6, 109.5), 2 (14.6, 124.1), 1 (14.6, 1 38.7); Column B: 10 (21.9, 7.3), 9 (21.9, 21.9), 8 (21.9, 36.5), 7 (21.9, 51.1) 6 (21.9, 65.7), 5 (21.9, 80.3), 4 (21.9, 94.9), 3 (21.9, 109.5), 2 (21.9, 124.1), 1 (21.9, 138.7); Column C: 10 (36.5, 7.3), 9 (36.5, 21.9), 8 (36.5, 36.5), 7 (36.5, 51.1), 6 (36.5, 65.7), 5 (36.5, 80.3), 4 (36.5, 94.9), 3 (36.5, 109.5), 2 (36.5, 124.1), 1 (36.5, 138.7); 10 (51.1, 7.3), 9 (51.1, 21.9), 8 (51.1, 36.5), 7 (51.1, 51.1), 6 (51.1, 65.7), 5 (51.1, 80.3), 4 (51.1, 94.9), 3 (51.1, 109.5), 2 (51.1, 124.1), 1 (51.1, 138.7).

[0058] Based on Figure 3 The design drawing of the lead frame shown has an electroplating specification of: 2.5 μm ≤ silver plating thickness ≤ 3.5 μm; in this embodiment, the standard silver plating film thickness is 3.0 μm.

[0059] Evaluation criteria for double-sided local jet plating of lead frames: ◆、Partial film thickness on the front side of the lead frame corresponding to the upper mold: 3.0μm≤front silver plating thickness≤3.0+0.15μm (3.0×5%) ◆、Local film thickness on the reverse side of the lead frame corresponding to the lower mold: 3.0μm≤Reverse silver plating thickness≤3.0+0.15μm (3.0×5%) Actual measurement 1 According to the fluid formula of the incompressible electroplating solution in the initial double-sided local jet electroplating model, the simulated pressure conditions are obtained: P 建模正 2.5 MPa ; P 建模反 3.1 MPa .

[0060] The modeled pressure conditions were applied to the intelligently controlled double-sided local jet electroplating device. Based on the standard of 3.0 μm silver film thickness, the actual operation of jet electroplating was carried out on the double-sided local parts of the lead frame, and the measured electroplated parts were obtained. The FISCHERSCOPE X-RAY XDV-SDD manufactured by Fischer was used to detect the local silver-plated samples of the lead frame. The film thickness data of the local plating area on the front side are shown in Table 1, and the film thickness data of the local plating area on the back side are shown in Table 2.

[0061] Table 1 Front film thickness data

[0062] Table 2 Reverse film thickness data

[0063] As shown in Table 1, the silver film thickness range of the local area on the front of the lead frame is Min3.057~Max3.118μm, and the error range from the product design standard film thickness of 3.0μm is 1.9%~3.9%; therefore, the solution chamber pressure of the upper mold front for the local electroplating condition of the lead frame front is 2.5 MPa The conditions are confirmed, and the fluid calculation formula of the incompressible electroplating solution in the double-sided local jet electroplating model is accurate and practical.

[0064] As shown in Table 2, the silver film thickness of the local area on the reverse side of the lead frame ranges from Min3.061 to Max3.115μm, and the error range from the product design standard film thickness of 3.0μm is 2.0% to 3.8%. Therefore, the solution chamber pressure of the reverse side of the lower mold for the local electroplating condition on the reverse side of the lead frame is 3.1μm. MPa The conditions are also confirmed, and the fluid calculation formula of the incompressible electroplating solution in the double-sided local jet electroplating model is accurate and practical.

[0065] Actual measurement 2 The pressure condition of the model is calculated based on the fluid formula of the incompressible electroplating solution in the initial double-sided local jet electroplating model; the following is obtained: P 建模正 3.1 MPa ; P 建模反 3.6 MPa .

[0066] The modeled pressure conditions were applied to the intelligently controlled double-sided local jet electroplating device. Based on the standard of 3.0 μm silver film thickness, the actual operation of jet electroplating was carried out on both sides of the lead frame, and the plated parts of the measured 2 electroplating were obtained. The equipment in the measured 1 was used to detect the local silver-plated samples of the lead frame. The film thickness data of the local plating area on the front side are shown in Table 3, and the film thickness data of the local plating area on the back side are shown in Table 4.

[0067] Table 3 Front film thickness data

[0068] Table 4 Reverse film thickness data

[0069] As shown in Table 3, the silver film thickness range of the local area on the front of the lead frame is Min3.085~Max3.143μm, and the error range from the product design standard film thickness of 3.0μm is 2.8%~4.8%; therefore, the solution chamber pressure of the upper mold front for the local electroplating condition of the lead frame front is 3.1 MPa The conditions are confirmed, and the fluid calculation formula of the incompressible electroplating solution in the double-sided local jet electroplating model is accurate and practical.

[0070] As shown in Table 4, the silver film thickness of the local area on the reverse side of the lead frame ranges from Min3.099 to Max3.145μm, and the error range from the product design standard film thickness of 3.0μm is 3.3% to 4.8%. Therefore, the solution chamber pressure of the reverse side of the lower mold for the local electroplating condition on the reverse side of the lead frame is 3.6 MPa The conditions are also confirmed, and the fluid calculation formula of the incompressible electroplating solution in the double-sided local jet electroplating model is accurate and practical.

[0071] Based on the data obtained from measurement 1 and measurement 2, the training operation was performed using Formulas 5 to 6 of the lead frame double-sided localized jet electroplating model of the present invention. Under the conditions of simulating the double-sided localized jet electroplating of the lead frame, the solution chamber pressure data of the front and back sides of the lead frame double-sided localized jet electroplating mold were obtained. The detailed results are shown in Table 5.

[0072] Table 5. Pressure of positive and negative solution chambers and coating thickness

[0073] As shown in Table 5, based on the measured data obtained from measurement 1 and measurement 2, by applying the formulas 5 to 6 of the lead frame double-sided localized jet plating model of the present invention to perform training operations under different solution chamber pressure conditions on the front and back sides of the lead frame double-sided localized jet plating mold, the simulation results of 1 to 9 show that the solution chamber pressure range of the localized jet plating mold is 2.3 to 3.3. MPaThe average film thickness of the front side obtained by simulation is in the range of 3.092~3.128μm; similarly, with the change of the solution chamber pressure on the back side of the local spray electroplating mold, the range is 3.1~3.8 MPa The average value of the reverse film thickness obtained by simulation calculation ranges from 3.096 to 3.129 μm.

[0074] The solution chamber pressure on the front side of the lead frame double-sided local spray plating mold in measurement 1 and measurement 2 is 2.5 MPa and 3.1 MPa In the solution chamber pressure range of 2.3~3.3 MPa Similarly, the pressure of the solution chamber on the other side is 3.1 MPa and 3.6 MPa In its pressure range 3.1~3.8 MPa From the film thickness test results in Tables 1 to 4, it can be seen that the film thickness data on the front and back sides of the electroplating mold obtained by the solution chamber pressure conditions of the electroplating in Measure 1 and Measure 2 both meet the calculation formulas 7 and 8 of the lead frame double-sided local jet electroplating model of the present invention. In order to verify the solution chamber pressure lower than that of Measure 1, the solution chamber pressure of the upper mold in the middle of Simulations 1 and 2 is 2.35 MPa , the lower mold solution chamber pressure is 2.95 MPa Similarly, in order to verify that the solution chamber pressure is higher than that of the measurement 2, the solution chamber pressure of the upper mold in the middle of simulation 8-9 is 3.25 MPa , the lower mold solution chamber pressure is 3.75 MPa The film thickness data of the local plating areas on the front and back sides of the measurement 3 and the measurement 4 are shown in Table 6.

[0075] Table 6 Double-sided local silver plating film thickness

[0076] As shown in Table 6, the measured pressure of the upper mold solution chamber on the front side of the lead frame double-sided local spray plating mold is 2.35 MPa Under these conditions, the minimum thickness of the silver film in the local plating area on the front side is 2.995μm, which exceeds the lower limit of the management standard and does not meet the requirement of the judgment standard 3.0μm≤front silver film thickness≤3.0+0.15μm; the pressure of the solution chamber of the lower mold on the back side is 2.95 MPa Under these conditions, the minimum value of the silver film thickness in the local plating area on the reverse side is 2.992 μm, which also exceeds the lower limit of the management standard and does not meet the requirement of the judgment standard 3.0 μm ≤ silver film thickness on the reverse side ≤ 3.0 + 0.15 μm; therefore, the mold solution chamber pressure on the front and back sides of the lead frame double-sided local jet plating mold measured in 3 cannot be included in the construction database of the double-sided local jet plating model of the present invention.

[0077] The measured pressure of the upper mold solution chamber on the front of the lead frame double-sided local spray plating mold is 3.25 MPa Under these conditions, the maximum thickness of the silver film in the local plating area on the front side is 3.156μm, which exceeds the upper limit of the management standard and does not meet the requirement of the judgment standard of 3.0μm≤front silver film thickness≤3.150μm; the pressure of the solution chamber of the lower mold on the back side is 3.75 MPa Under these conditions, the maximum thickness of the silver-plated film in the reverse local plating area is 3.161 μm, which also exceeds the upper limit of the management standard and does not meet the requirement of the judgment standard 3.0 μm ≤ reverse silver-plated film thickness ≤ 3.1500 μm; therefore, the mold solution chamber pressure on the front and back sides of the lead frame double-sided local jet electroplating mold measured in 4 cannot be included in the construction database of the double-sided local jet electroplating model of the present invention.

[0078] The results of measurement 1 to measurement 4 are arranged in the order of simulation 2, measurement 1, simulations 2 to 7, measurement 2, and simulation 8. The detailed results are shown in Table 7.

[0079] Table 7 Double-sided local silver plating film thickness

[0080] From Table 7, we can see that the mold solution chamber pressure on the front side of the lead frame double-sided local spray plating mold is P 模拟正 Range: 2.4 to 3.2 MPa When the film thickness on the front of the lead frame is D 建模正 The range is 3.095~3.124μm. The mold solution chamber pressure on the reverse side of the lead frame double-sided local jet plating mold P 模拟反 Range: 3.0~3.7 MPa When the film thickness on the back of the lead frame is D 建模反 The range is 3.099~3.125μm.

[0081] It can be seen from the above sequence that the authenticity of the starting simulation 2 and the ending simulation 8 needs to be further verified by actual measurement using the double-sided local jet electroplating device for the lead frame of the present invention. The data of simulation 2 and simulation 8 are measured by the double-sided local jet electroplating device of the present invention, wherein the measured data 5 is the data obtained under the conditions of simulation 2, and the measured data 6 is the data obtained under the conditions of simulation 8. The film thickness data of the local plating areas on the front and back sides of the measured data 5 and 6 are shown in Table 8.

[0082] Table 8 Double-sided local silver plating film thickness

[0083] As shown in Table 8, the measured film thickness error of 5 is 3.20% to 3.93% on the front side and 3.37% to 4.03% on the back side, which meets the film thickness requirements of the present invention. D Requirements for the judgment criteria.

[0084] 3.0μm≤front silver plating thickness≤3.0+0.15μm (3.0×5%) 3.0μm≤Reverse silver plating thickness≤3.0+0.15μm (3.0×5%) The results of measurements 1 to 6 show that by regulating the mold solution chamber pressure on the front side of the lead frame double-sided local spray plating mold P Range: 2.4 to 3.0 MPa Under the conditions; and the mold solution chamber pressure on the reverse side of the double-sided local spray plating mold P Range: 3.2~3.7 MPa Under these conditions, it can ensure that the silver plating thickness on both sides of the lead frame meets the judgment requirements.

[0085] In summary, the present invention realizes intelligent control of the upper chamber pressure during the actual operation of the double-sided local spray electroplating device on the double-sided local lead frame by creating the lead frame double-sided local spray electroplating film thickness condition calculation model formula 6. P 实测正 and lower chamber pressure P 实测反 The set value is set and stabilized. The more stable the pressure value is, the smaller the error between the thickness of the coating on both sides produced by double-sided local spray electroplating is, making the performance of the obtained product more precise and superior.

[0086] Based on the integration of the semiconductor lead frame double-sided local jet electroplating technology and the intelligent control technology of the present invention, the double-sided lead frame local jet electroplating calculation model created can quickly establish the production conditions of the lead frame double-sided local jet electroplating film thickness of various different monomer metal salts and binary metal salt electroplating solutions in the actual production process. Then, through the intelligent control system of the lead frame double-sided local jet electroplating film thickness condition calculation model, it can not only quickly realize the accuracy of predicting the double-sided local jet electroplating film thickness of the semiconductor lead frame, greatly reduce the error with the actual electroplating product coating film thickness, but also promote the improvement of the uniformity of the double-sided local jet electroplating film thickness, so as to meet the high quality requirements of high-end semiconductor lead frame products.

[0087] The double-sided localized jet plating intelligent control system constructed by the present invention can stabilize the upper and lower chamber pressures of the plating mold by precisely adjusting the pump flow rate, thereby controlling the thickness of the jet-plated film in the localized plating areas on both sides of the semiconductor lead frame within a standard range. By adopting a double-sided localized mold cavity structure, the jet plating intelligent control system continuously optimizes the pressure in real time based on the simulated chamber pressure and actual flow rate of the pump flow-pressure control system, thereby obtaining the optimal standard for the double-sided chamber pressure, ensuring precise management of the double-sided plating layer, and realizing a method and system for accurately and quickly obtaining a double-sided localized jet plating model.

[0088] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A method for constructing a double-sided localized jet electroplating model, characterized in that: include: Step 1: providing a double-sided localized spray electroplating device, the electroplating device comprising an electroplating solution tank (90), an upper mold (100A), a lower mold (100B), and a control system (200), wherein the pressure and solution flow of the electroplating solution chambers of the upper mold (100A) and the lower mold (100B) are controlled by the control system (200); Step 2: The calculation formula between the pressure and flow rate of the electroplating solution chamber in the double-sided local jet electroplating model is: P = P 0×( Q 0 / Q )×( T / T 0) Official 1 Where, P is the pressure of the electroplating solution chamber, MPa; P 0 is the standard pressure, MPa; Q 0 is the standard flow rate, m 3 / h; Q is the flow rate, m 3 / h; T is the Kelvin temperature, K; T 0 is the standard temperature Kelvin, K; Among them, standard pressure P 0 is 0.1MPa; standard flow rate Q 0 is 12m 3 / h; standard Kelvin temperature T 0 is 25+273.15K; since the working temperature of the electroplating solution is set to 55℃, the Kelvin temperature T =55+273.15K; Substitute the above known conditions into formula 1 to obtain the pressure of the electroplating solution under the above known conditions P The calculation formula between 1 and flow rate: P 1=1.2×328.15 / (298.15 Q ) Formula 2 Step 3: Traffic Q The calculation formula is: Q = V × S Formula 3 Where, V is the flow rate of the electroplating solution, m / h; S is the total cross-sectional area of ​​the electroplating solution opening, m 2 ; Step 4: The total cross-sectional area of ​​the plating solution opening in step 3 S Equal to the area of ​​the local plating area of ​​the plated part, based on the practical application of Faraday's law of electrolysis in the electroplating process, formula 4 is obtained: S=CItη k / Dρ Formula 4 Substituting Formula 3 and Formula 4 into Formula 2, we get Formula 5: P 1=1.2×328.15 Dρ / (298.15 VCItη k ) Formula 5 Where, C is the electrochemical equivalent, g / ampere-hour; I is the current intensity, ampere; t is the plating time, hours; η k is the cathode current efficiency, %; D is the thickness of the spray electroplating film, m; ρ is the metal density of the electroplating layer, g / m 3 ; Step 5: Simulate the upper mold (100A) electroplating solution chamber pressure based on Formula 5 P 建模正 , and the lower mold (100B) electroplating solution chamber pressure P 建模反 The setting conditions are set, and the above conditions are actually applied to the double-sided local spray electroplating device, and the spray electroplating conditions of the upper mold (100A) and the lower mold (100B) are set respectively, so that the upper mold (100A) performs spray electroplating on the front side of the plated part (10), and at the same time, the lower mold (100B) performs spray electroplating on the back side of the plated part (10); and the plated part (10) is locally electroplated on both sides to obtain the electroplated product of the plated part (10); Step 6: Double-sided local spray plating film thickness condition management and control, transform formula 5 to obtain formula 6: D =298.15 P 1 VCItη k / 1.2×328.15 ρ Formula 6 The plating solution chamber pressure obtained in step 5 P 建模正 and P 建模反 Substitute into formula 6, and the thickness of the electroplated film on the front surface of the plated part (10) is obtained by formula 6: D 建模正 and reverse side modeling electroplating film thickness D 建模反 ; Step 7: Double-sided local spray electroplating film thickness threshold management, measure the electroplating film thickness on the front and back of the electroplated product obtained in step 5, and obtain the measured front electroplating film thickness D 实测正 and reverse side plating thickness D 实测反 If the judgment conditions are met D 建模正 ≤ D 实测正 ≤ D 建模正 + 5% D 建模正 Formula 7 D 建模反 ≤ D 实测反 ≤ D 建模反 + 5% D 建模反 Formula 8 It is considered that the plating solution chamber pressure in step 5 is P 建模正 and P 建模反 The setting conditions apply, otherwise the actual D 实测正 and D 实测反 As a benchmark, correct P 建模正 and verify P 建模反 , repeat steps 4 to 7 until formula 7 and formula 8 are satisfied.

2. The method for constructing an electroplating model according to claim 1, wherein: The metal types of the electroplating solution include: single-layer plating Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt, and alloy plating Au-Ni and Au-Co binary alloy metals.

3. A double-sided local spray electroplating system, characterized in that: Using the method for constructing an electroplating model according to claim 1 or 2, the electroplating system comprises: electroplating solution tank (90); An upper mold (100A) and a lower mold (100B), wherein the upper mold (100A) can abut against the lower mold (100B), and the upper mold (100A) and the lower mold (100B) are connected to the electroplating solution tank (90); the plated part (10) is placed between the upper mold (100A) and the lower mold (100B); A control system (200) is provided, wherein the control system (200) is capable of controlling the pressure and solution flow rate of the electroplating solution chambers of the upper mold (100A) and the lower mold (100B).

4. The electroplating system according to claim 3, characterized in that: The upper mold (100A) includes an upper solution chamber (80A), an upper pressure gauge (70A), an upper flow meter (60A) and an upper pump (50A). The upper solution chamber (80A) is connected to the upper pressure gauge (70A) and the upper pump (50A), respectively. The upper pump (50A) is connected to the electroplating solution tank (90). The upper flow meter (60A) is installed between the upper pump (50A) and the upper solution chamber (80A).

5. The electroplating system according to claim 4, characterized in that: The lower mold (100B) includes a lower solution chamber (80B), a lower pressure gauge (70B), a lower flow meter (60B) and a lower pump (50B). The lower solution chamber (80B) is connected to the lower pressure gauge (70B) and the lower pump (50B) respectively. The lower pump (50B) is connected to the electroplating solution tank (90). The lower flow meter (60B) is installed between the lower pump (50B) and the lower solution chamber (80B).

6. The electroplating system according to claim 4, characterized in that: The control system (200) comprises an electroplating solution pressure control module A and a data training module A. The electroplating solution pressure control module A is connected to the upper pump (50A) and controls the liquid inlet flow rate of the upper solution chamber (80A) by controlling the upper pump (50A). The data training module A is connected to the upper pressure gauge (70A).

7. The electroplating system according to claim 5, characterized in that: The control system (200) further includes an electroplating solution pressure control module B and a data training module B. The electroplating solution pressure control module B is connected to the lower pump (50B) and controls the liquid inlet flow rate of the lower solution chamber (80B) by controlling the lower pump (50B). The data training module B is connected to the lower pressure gauge (70B).

8. The electroplating system according to claim 5, characterized in that: The upper pump (50A) is connected to the upper solution chamber (80A) via a hose, and the lower pump (50B) is connected to the lower solution chamber (80B) via a pipe.

9. The electroplating system according to claim 8, characterized in that: The upper pump (50A) and the lower pump (50B) are both variable frequency pumps.

10. An electroplating method, characterized in that: Using the electroplating system according to any one of claims 3 to 9, the electroplating method comprises: S1: Constructing a database of double-sided local jet electroplating conditions and an initial double-sided local jet electroplating model connected to the database; S2: Extract two different double-sided local spray electroplating conditions from the database, and use the double-sided local spray electroplating system to perform actual spray electroplating on the plated part (10). P 建模正 and lower pressure P 建模反 The constant pressure is set to the actual electroplating operation, and the flow rate of the electroplating solution is fine-tuned in real time through the control system (200). Q , used to maintain a constant pressure value; S3: After the actual electroplating operation in S2 is completed, the thickness of the electroplated film on the front of the obtained electroplated product is tested. D 实测正 and reverse side plating thickness D 实测反 Data, and the set front film thickness D 建模正 and reverse film thickness D 建模反 The data are compared and if they meet the judgment conditions of formula 7 and formula 8, they are imported into the initial model database and the corresponding upper solution chamber pressure is P 实测正 , and the lower solution chamber pressure P 实测反 Used to improve the initial double-sided local jet electroplating model; S4: Electroplating film thickness obtained in S3 D 实测正 and D 实测反 If formulas 7 and 8 are satisfied, the upper solution chamber pressure is considered to be P 建模正 , and the lower solution chamber pressure P 建模反 The setting conditions are applicable, otherwise the actual front electroplating film thickness D 实测正 and reverse side plating thickness D 实测反 As a benchmark, correct P 建模正 and verify P 建模反 , the actual operation of double-sided local plating area spray electroplating is circulated until formula 7 and formula 8 are satisfied; wherein, formulas 7 and 8 D 建模正 and D 建模反 They are the film thickness data of the front and back sides set in S3 respectively; S5: Real-time loop S2 to S5 to obtain a continuously iteratively upgraded double-sided local jet electroplating model; S6: Select a double-sided local jet plating model upgraded from S5 and apply it to the double-sided local jet plating system to obtain the optimal plating solution chamber pressure. P 实测正 and plating solution chamber pressure P 实测反 The data is applied to the electroplating system, and the flow rate in the pipeline is controlled by the control system (200) to control the actual control pressure of the electroplating solution chamber of the upper electroplating mold. P 实控正 and the actual control pressure of the electroplating solution chamber of the lower electroplating mold P 实控反 Achieve the above-mentioned optimal plating solution chamber pressure P 实测正 and plating solution chamber pressure P 实测反 The value of is adjusted and stabilized, thereby completing the double-sided electroplating of the plated part (10).

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