A method for constructing a double-sided local jet electroplating model, an electroplating system and an electroplating method

Abstract

The application discloses a kind of double-sided local jet electroplating model construction method, electroplating system and electroplating method, belong to double-sided local jet electroplating equipment technical field, the construction method of this electroplating model includes: provide a kind of double-sided local jet electroplating device;According to the relationship between pressure and flow, the operation formula of electroplating model is constructed;Flow calculation formula is combined with Faraday electrolysis law, and is brought into the operation formula of electroplating model, and the operation formula between pressure and electroplating film thickness is obtained;According to the condition set, the electroplating product is obtained by electroplating workpiece, whether the actual film thickness of electroplating product meets standard requirement is judged.Through the above-mentioned electroplating model, not only the accuracy of predicting semiconductor lead frame double-sided local jet electroplating film thickness can be quickly realized, the error of actual electroplating product plating layer film thickness is reduced, but also the improvement of double-sided local jet electroplating film thickness uniformity can be promoted, to meet the requirement of high-end semiconductor lead frame product to high quality.

Description

Technical Field

[0001] This invention relates to a method for constructing a double-sided partial spray electroplating model, an electroplating system, and an electroplating method, belonging to the field of double-sided partial spray electroplating technology. Background Technology

[0002] With the rapid development of science and technology, the localized electroplating areas of semiconductor leadframes are becoming increasingly miniaturized in the field of electroplating equipment technology. Currently, localized spray electroplating technology is still in the stage of single-sided localized electroplating products. Especially for products with double-sided localized spray electroplating of leadframes, only one plating operation is possible on the front side, followed by another on the back. This process not only suffers from low electroplating efficiency but also leads to varying degrees of penetration and contact of the plating solution on the back side during the front plating process, resulting in metal displacement and contamination. To ensure the plating quality on the back side, it is necessary to remove the displaced metal to create a clean surface before replating, which easily leads to a high product defect rate, making it difficult to obtain high-quality, high-volume precision localized electroplating products for semiconductor leadframes.

[0003] Chinese patent document CN103774194A discloses an electroplating device for LED lead frames. Although this device can perform double-sided electroplating of LED lead frames, it cannot select the optimal conditions for the double-sided local spray electroplating model, nor can it achieve electroplating with different film thickness requirements on both sides of the workpiece by adjusting relevant parameters. This reduces the intelligent control efficiency of the double-sided local spray electroplating device and cannot guarantee the uniformity of the electroplated film thickness, thus failing to meet the high-quality requirements of high-end semiconductor lead frame products. Summary of the Invention

[0004] This invention provides a method for constructing a double-sided partial spray electroplating model, an electroplating system, and an electroplating method to solve the problems in the prior art where single-sided electroplating easily leads to a high product defect rate, and where double-sided electroplating equipment cannot screen the optimal conditions for the double-sided partial spray electroplating model, thus failing to guarantee the uniformity of the electroplated film thickness, making it difficult to obtain high-quality, high-volume semiconductor leadframe local precision electroplating products.

[0005] In a first aspect, the present invention provides a method for constructing a double-sided localized spray electroplating model, comprising:

[0006] Step 1: A double-sided partial spray electroplating device is provided. The electroplating device includes an electroplating solution tank, an upper mold, a lower mold, and a control system. The pressure and flow rate of the electroplating solution chambers of the upper mold and the lower mold are controlled by the control system.

[0007] Step 2: Formula for calculating the relationship between pressure and flow rate in the electroplating solution delivery chamber of the double-sided partial spray electroplating model:

[0008] P = P 0×( Q 0 / Q )×( T / T 0)Formula 1

[0009] In the formula, P The pressure in the electroplating solution chamber is MPa. P 0 represents the standard pressure, in MPa; Q 0 represents the standard flow rate, m 3 / h; Q For flow rate, m 3 / h; T Kelvin temperature, K; T 0 represents the Kjeldahl temperature under standard conditions, in Kelvin.

[0010] Among them, standard condition pressure P 0 represents 0.1 MPa; standard flow rate Q 0 is 12m 3 / h; Kjeldahl temperature under standard conditions T 0 is 25 + 273.15 K; since the working temperature of the electroplating solution is set to 55℃, the Kjeldahl temperature is... T The pressure is 55 + 273.15 K; substituting the above known conditions into Formula 1, we obtain the pressure of the electroplating solution under the above known conditions. P 1. The formula for calculating the relationship between flow rate and output:

[0011] P 1 = 1.2 × 328.15 / (298.15· Q )Formula 2

[0012] Step 3: Traffic Q The calculation formula is as follows:

[0013] Q = V × S Formula 3

[0014] In the formula, V The flow rate of the electroplating solution is m / h. S The total cross-sectional area of ​​the electroplating solution inlet is in meters. 2 ;

[0015] Step 4: The total cross-sectional area of ​​the electroplating solution inlet in Step 3. S Equal to the area of ​​the local plating zone on the workpiece, Formula 4 is derived based on the practical application of Faraday's law of electrolysis in the electroplating process:

[0016] S=CItη k / Dρ Formula 4

[0017] Substituting formulas 3 and 4 into formula 2, we get formula 5:

[0018] P 1 = 1.2 × 328.15 Dρ / (298.15· VCI k )Formula 5

[0019] In the formula, C For electrochemical equivalents, grams / Ampere-hour; I The current intensity is expressed in amperes. t Electroplating time, in hours; η k The cathode current efficiency is % D The thickness of the spray-coated film is in meters (m). ρ The density of the electroplated metal layer is gram. / m 3 ;

[0020] Step 5: Simulate and calculate the pressure of the upper mold electroplating solution chamber based on Formula 5. P 建模正 And the pressure of the electroplating solution chamber in the lower mold. P 建模反 The conditions for setting the upper mold and the lower mold are set respectively, so that the upper mold performs spray electroplating treatment on the front side of the workpiece, and the lower mold performs spray electroplating treatment on the back side of the workpiece; and the workpiece is subjected to double-sided partial electroplating to obtain the electroplated product of the workpiece.

[0021] Step 6: Local spray electroplating film thickness management and control for double-sided lead frames. Formula 5 is transformed to obtain Formula 6:

[0022] D =298.15· P 1 VCI k / 1.2×328.15· ρ Formula 6

[0023] The electroplating solution chamber pressure obtained in step 5 P 建模正 and P 建模反 Substituting into Formula 6, the thickness of the electroplated film on the front side of the plated part can be obtained through Formula 6. D建模正 and reverse modeling electroplating film thickness D 建模反 ;

[0024] Step 7: Double-sided localized spray electroplating film thickness threshold management. Measure the electroplating film thickness on both the front and back sides of the electroplated product obtained in Step 5 to obtain the measured front electroplating film thickness. D 实测正 and the thickness of the electroplated film on the reverse side D 实测反 If the judgment conditions are met

[0025] D 建模正 ≤ D 实测正 ≤ D 建模正 +5% D 建模正 Formula 7

[0026] D 建模反 ≤ D 实测反 ≤ D 建模反 +5% D 建模反 Formula 8

[0027] Therefore, the pressure in the electroplating solution chamber in step 5 is considered to be... P 建模正 and P 建模反 The specified conditions apply; otherwise, the actual conditions apply. D 实测正 and D 实测反 Based on, correction P 建模正 And verify P 建模反 Repeat steps 4 through 7 until formulas 7 and 8 are satisfied.

[0028] In one embodiment of the present invention, the metal types of the electroplating solution include: monomeric plating layers of Au, Ag, Ni, Sn, Cu, Pd, Rh, and Pt, and binary alloy plating layers of Au-Ni and Au-Co.

[0029] Secondly, the present invention also provides a double-sided partial spray electroplating system, using the aforementioned electroplating model construction method, wherein the electroplating system comprises:

[0030] Electroplating solution tank;

[0031] An upper mold and a lower mold, wherein the upper mold can abut against the lower mold, and the upper mold and the lower mold are connected to the electroplating solution tank; the plated part is placed between the upper mold and the lower mold;

[0032] The control system is capable of controlling the pressure and flow rate of the electroplating solution chambers of the upper mold and the lower mold.

[0033] In one embodiment of the present invention, the upper mold includes an upper solution chamber, an upper pressure gauge, an upper flow meter, and an upper pump. The upper solution chamber is connected to the upper pressure gauge and the upper pump, respectively. The upper pump is connected to the electroplating solution tank, and the upper flow meter is installed between the upper pump and the upper solution chamber.

[0034] In one embodiment of the present invention, the lower mold includes a lower solution chamber, a lower pressure gauge, a lower flow meter, and a lower pump. The lower solution chamber is connected to the lower pressure gauge and the lower pump, respectively. The lower pump is connected to the electroplating solution tank, and the lower flow meter is installed between the lower pump and the lower solution chamber.

[0035] In one embodiment of the present invention, the control system includes an electroplating solution pressure control module A and a data training module A. The electroplating solution pressure control module A is connected to the upper pump and controls the inlet flow rate of the upper solution chamber by controlling the upper pump. The data training module A is connected to the upper pressure gauge.

[0036] In one embodiment of the present invention, the control system further includes an electroplating solution pressure control module B and a data training module B. The electroplating solution pressure control module B is connected to the lower pump and controls the inlet flow rate of the lower solution chamber by controlling the lower pump. The data training module B is connected to the lower pressure gauge.

[0037] In one embodiment of the present invention, the upper pump is connected to the upper solution chamber via a hose, and the lower pump is connected to the lower solution chamber via a pipe.

[0038] In one embodiment of the present invention, both the upper pump and the lower pump are variable frequency pumps. This allows for the adjustment of the solution flow rate in the pipeline according to demand. Q Size.

[0039] Thirdly, the present invention also provides an electroplating method using the aforementioned electroplating model construction method, the electroplating method comprising:

[0040] S1: Construct a database of double-sided local spray electroplating conditions, and an initial double-sided local spray electroplating model connected to the database;

[0041] S2: Extract two different double-sided partial spray electroplating conditions from the database, and perform actual spray electroplating on the workpiece using the double-sided partial spray electroplating system, applying the upper pressure... P 建模正 and lower pressure P 建模反 The pressure is set as the constant pressure for actual electroplating operations, and the flow rate of the electroplating solution is finely adjusted in real time through the control system. Q Used to maintain a constant pressure value;

[0042] S3: After the actual electroplating operation in S2 is completed, test the thickness of the electroplated film on the front side of the obtained electroplated product. D 实测正 and the thickness of the electroplated film on the reverse side D 实测反 The data, and the set frontal film thickness D 建模正 And the thickness of the reverse mask D 建模反 If the data is compared and meets the criteria of Formulas 7 and 8, it is imported into the initial model database, along with the corresponding upper solution chamber pressure. P 实测正 and the pressure in the lower solution chamber P 实测反 Used to refine the initial double-sided local spray electroplating model;

[0043] S4: The thickness of the electroplated film obtained in S3 D 实测正 and D 实测反 If formulas 7 and 8 are satisfied, then the pressure in the upper solution chamber is considered to be... P 建模正 and the pressure in the lower solution chamber P 建模反 If the specified conditions apply, otherwise the actual front electroplated film thickness will apply. D 实测正 and the thickness of the electroplated film on the reverse side D 实测反 Based on, correction P 建模正 And verify P 建模反 The actual operation of double-sided partial spray electroplating is carried out until formulas 7 and 8 are satisfied; wherein, in formulas 7 and 8 D 建模正 and D 建模反 These are the film thickness data for the front and back sides set in S3, respectively;

[0044] S5: Real-time loop from S2 to S5 to obtain a continuously iteratively upgraded double-sided local spray electroplating model;

[0045] S6: Select a double-sided local spray electroplating model from a certain generation upgrade of S5 and apply it to the double-sided local spray electroplating system to obtain the optimal electroplating solution chamber pressure. P 实测正 and electroplating solution chamber pressure P 实测反 The data is applied to the electroplating system, whereby the control system controls the flow rate in the pipeline to control the actual pressure of the electroplating solution chamber in the upper electroplating mold. P 实控正 The actual controlled pressure of the electroplating solution chamber of the lower electroplating mold P 实控反 To achieve the above-mentioned optimal electroplating solution chamber pressure P 实测正 and electroplating solution chamber pressure P 实测反 The value is determined and stabilized to complete the double-sided electroplating of the plated part.

[0046] The beneficial effects of this invention are as follows:

[0047] The double-sided partial spray electroplating model created in this invention can quickly establish the production conditions for the double-sided partial spray electroplating film thickness of various monomeric metal salts and binary metal salt electroplating solutions during actual production. Furthermore, through the double-sided partial spray electroplating film thickness condition electroplating model, it can not only quickly and accurately predict the double-sided partial spray electroplating film thickness of semiconductor leadframes, significantly reducing the error with the actual electroplated product's coating thickness, resulting in more precise and superior performance of the obtained electroplated products, but also promote the improvement of the uniformity of the double-sided partial spray electroplating film thickness, meeting the high-quality requirements of high-end semiconductor leadframe products.

[0048] The double-sided partial spray electroplating system created in this invention can regulate the flow rate in the pipeline through a variable frequency pump, thereby controlling the stability of the pressure in the upper and lower solution chambers of the electroplating mold. This ensures that the electroplating film thickness in the double-sided partial plating areas of the semiconductor part meets the standard control range. By employing the double-sided partial spray electroplating system, and through real-time continuous pressure optimization of the pump flow-pressure control system based on the simulated chamber pressure and actual flow rate, the optimal standard for the double-sided chamber pressure is obtained, ensuring precise management of the double-sided coating and achieving the selection of the best conditions for the double-sided partial spray electroplating model. Simultaneously, it can assist researchers in the design of electroplating molds, shortening the development time.

[0049] The double-sided partial spray electroplating system created by this invention sets up two completely independent systems to independently control the upper mold and the lower mold. By separately adjusting the pressure and flow rate of the solution chamber by the two systems, it is possible to simultaneously electroplat the front and back of the workpiece with different film thickness requirements, and ensure that the film thickness after electroplating meets the requirements, thereby improving the working efficiency of the double-sided partial spray electroplating system. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 This is a schematic diagram of a double-sided partial spray electroplating apparatus provided in an embodiment of the present invention.

[0052] Figure 2 This is a schematic diagram of a plated part provided in an embodiment of the present invention.

[0053] Figure 3 This is a schematic diagram of the film thickness test points provided in an embodiment of the present invention.

[0054] In the diagram: 100A, upper mold; 100B, lower mold; 90, electroplating solution tank; 80A, upper solution chamber; 80B, lower solution chamber; 70A, upper pressure gauge; 70B, lower pressure gauge; 60A, upper flow meter; 60B, lower flow meter; 50A, upper pump; 50B, lower pump; 10, plated part; 200, control system; 20, plated part unit; 21, film thickness test point. Detailed Implementation

[0055] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0057] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0058] This application provides a method for constructing a double-sided localized jet electroplating model. This method applies the principles of continuity, fluidity, kinetic energy, potential energy, and pressure conservation of incompressible fluids. Through the pressure conservation law equation, it intelligently controls the double-sided localized jet electroplating system, providing accurate predictions for simultaneous electroplating of both sides of complex leadframe localized plating areas in a single operation. The method for constructing this double-sided localized jet electroplating model includes:

[0059] Step 1: A double-sided partial spray electroplating apparatus is provided, capable of completing partial electroplating processes on both sides in one operation. This double-sided partial spray electroplating apparatus includes an electroplating solution tank 90 and a mold assembly, namely an upper mold 100A and a lower mold 100B, as well as a control system 200. The upper mold 100A includes an upper solution chamber 80A, an upper pressure gauge 70A, an upper flow meter 60A, and an upper pump 50A. The lower mold 100B includes a lower solution chamber 80B, a lower pressure gauge 70B, a lower flow meter 60B, and a lower pump 50B. The pressure and flow rate of the electroplating solution chambers in the upper mold 100A and the lower mold 100B can be independently controlled by the control system.

[0060] Step 2: Based on the continuity, flowability, kinetic energy, potential energy, and pressure conservation laws of incompressible fluids in electroplating solutions from computational fluid dynamics, a double-sided local jet electroplating model is constructed. The calculation formula between the pressure and flow rate of the electroplating solution transported by the double-sided local jet electroplating model is as follows:

[0061] P =P 0×( Q 0 / Q )×( T / T 0)Formula 1

[0062] In Formula 1:

[0063] P The pressure in the electroplating solution chamber is MPa.

[0064] P 0 represents the standard pressure, in MPa;

[0065] Q 0 represents the standard flow rate, m 3 / h;

[0066] Q For flow rate, m 3 / h;

[0067] T Kelvin temperature, K;

[0068] T 0 represents the standard Kelvin temperature, in Kelvin.

[0069] In this invention, standard condition pressure P 0 is 0.1 MPa; the standard flow rate of the pump used in the double-sided partial spray electroplating device. Q 0 is 12m 3 / h; the standard conditions temperature is 25°C, therefore, the standard conditions Kjeldahl temperature T 0 is 25 + 273.15 K. Since the working temperature of the electroplating solution in this invention is set at 55°C, the Kjeldahl temperature... T The pressure is 55 + 273.15 K; substituting the above known conditions into Formula 1, the pressure of the electroplating solution under the above known conditions is... P 1. The formula for calculating the relationship between flow rate and volume;

[0070] P 1 = 0.1 × (12 / Q )×{(55+273.15) / (25+273.15)}

[0071] =0.1×12×(55+273.15) / { (25+273.15)× Q}

[0072] =1.2×328.15 / (298.15· Q )Formula 2

[0073] As can be seen from Formula 2, in the calculation formula for constructing the double-sided local spray electroplating model, the pressure of the mold electroplating solution chamber is... P 1 and traffic Q The flow rate is inversely proportional to the flow rate of the solution; therefore, the flow rate can be controlled by adjusting the pump of the double-sided local spray electroplating equipment. Q The pressure of the corresponding mold electroplating solution chamber can be obtained. P 1.

[0074] Step 3: The flow rate in Step 2 Q The calculation formula is shown in Formula 3:

[0075] Q = V × S Formula 3

[0076] In Formula 3:

[0077] V The flow rate of the electroplating solution is m / h.

[0078] S The total cross-sectional area of ​​the electroplating solution inlet is in meters. 2 .

[0079] From Formula 3, we can see that the flow rate... Q Total cross-sectional area of ​​the electroplating solution inlet in the mold cavity S Proportional, that is, the total cross-sectional area of ​​the mold cavity S The larger the volume, the higher the flow rate. Q The larger it is, the higher the pressure in its chamber. P The smaller the value of 1, the lower the flow rate. Therefore, when the area of ​​the local plating zone on the lead frame changes, the corresponding flow rate... Q and chamber pressure P All conditions 1 need to be re-adjusted.

[0080] Step 4: The total cross-sectional area of ​​the electroplating solution flow port in the mold cavity during Step 3. S Since the area of ​​the local plating area is equal to that of the plated part, Formula 4 is the practical application of Faraday's law of electrolysis in the electroplating process:

[0081] S=CItη k / Dρ Formula 4

[0082] In Formula 4:

[0083] C For electrochemical equivalents, grams / Ampere-hour;

[0084] I The current intensity is expressed in amperes.

[0085] t Electroplating time, in hours;

[0086] η k The cathode current efficiency is %

[0087] D The thickness of the spray-coated film is in meters (m).

[0088] ρ The density of the electroplated metal layer is gram. / m 3 ;

[0089] Substituting formulas 3 and 4 into formula 2, we obtain formula 5.

[0090] P 1 = 1.2 × 328.15 / (298.15· Q )

[0091] =1.2×328.15 / (298.15· VS )

[0092] =1.2×328.15 / (298.15· VCI k / Dρ )

[0093] =1.2×328.15· Dρ / (298.15· VCI k )Formula 5

[0094] As can be seen from Formula 5, the pressure in the electroplating solution chamber of the mold in this invention is... P 1. Spray electroplating film thickness in localized plating areas of the workpiece D Proportional to the flow rate of the electroplating solution V Current intensity I and electroplating time t Inversely proportional.

[0095] Step 5: Under the condition that all spray electroplating conditions remain unchanged except for the pressure of the mold electroplating solution chamber, the pressure of the upper electroplating mold electroplating solution chamber is simulated and calculated based on Formula 5 of the double-sided partial spray electroplating model constructed in this invention. P 建模正 And the pressure of the electroplating solution chamber in the lower electroplating mold. P 建模反 The setting conditions; and the pressure of the electroplating solution chamber in the upper electroplating mold of the model. P 建模正 and the pressure of the electroplating solution chamber in the lower electroplating mold P 建模反The conditions are actually applied to the actual operation of the double-sided partial spray electroplating device for partial spray electroplating on both sides of the plated part 10.

[0096] For the partial plating area on the front side of part 10, the upper mold 100A series equipment is used to set the spray electroplating conditions, and the spray electroplating treatment is performed independently on the partial plating area on the front side. For the partial plating area on the back side of part 10, the lower mold 100B series equipment is used to set the spray electroplating conditions, and the spray electroplating treatment is performed independently on the partial plating area on the back side. That is, after the upper and lower molds are closed, the independent A and B series equipment simultaneously completes the spray electroplating treatment on both sides of the partial area of ​​the lead frame in one go, resulting in a plating product with partial plating on both sides of the lead frame in one go.

[0097] Step 6: Localized spray electroplating film thickness management and control for double-sided lead frames. Equation 5 is transformed to obtain Equation 6:

[0098] D =298.15· PVCItη k / 1.2×328.15· ρ Formula 6

[0099] Based on the pressure of the electroplating solution chamber in the upper electroplating mold P 建模正 And the pressure of the electroplating solution chamber in the lower electroplating mold. P 建模反 The set conditions; using Formula 6, the corresponding electroplating film thickness for local spraying modeling of the upper lead frame can be calculated. D 建模正 And the thickness of the electroplated film in the local spray modeling of the lower lead frame. D 建模反 .

[0100] Step 7: Threshold for managing the thickness of the localized electroplating film on the double-sided lead frame. Based on the above-described localized electroplating apparatus, actual electroplating operations are performed on the localized electroplating areas on both sides of the lead frame. The obtained thickness of the electroplated film in the localized electroplating areas on both sides is... D 实测正 and D 实测反 If the following conditions are met:

[0101] D 建模正 ≤ D 实测正 ≤ D 建模正 +5% D 建模正 Formula 7

[0102] D 建模反 ≤ D实测反 ≤ D 建模反 +5% D 建模反 Formula 8

[0103] Then confirm the pressure of the electroplating solution chamber in the upper electroplating mold in step 5. P 建模正 And the pressure of the electroplating solution chamber in the lower electroplating mold. P 建模反 The specified conditions apply; otherwise, the actual conditions apply. D 实测正 and D 实测反 Based on, correction P 建模正 And verify P 建模反 Repeat steps 4 through 7 until formulas 7 and 8 are satisfied.

[0104] Furthermore, the types of metals in the electroplating solution include:

[0105] Monomer coatings include Au, Ag, Ni, Sn, Cu, Pd, Rh, and Pt.

[0106] Binary alloy metals with Au-Ni and Au-Co alloy coatings.

[0107] In addition, such as Figure 1 As shown, the present invention also provides a double-sided partial spray electroplating system, which utilizes the above-mentioned electroplating model to achieve double-sided electroplating of the workpiece. This double-sided partial spray electroplating system includes an electroplating solution tank 90 and a mold device, namely an upper mold 100A and a lower mold 100B, as well as a control system 200. The upper mold 100A and the lower mold 100B can abut against each other, and the workpiece 10 is placed between the upper mold 100A and the lower mold 100B, enabling simultaneous electroplating of both sides of the workpiece 10. Both the upper mold 100A and the lower mold 100B are connected to the electroplating solution tank 90, and they share a single electroplating solution tank 90.

[0108] In some embodiments, the upper mold 100A includes an upper solution chamber 80A, an upper pressure gauge 70A, an upper flow meter 60A, and an upper pump 50A. The upper solution chamber 80A is connected to the upper pressure gauge 70A. During the spray electroplating process on a partial plating area on the front side of the workpiece 10 when the upper and lower molds are closed, the upper pressure gauge 70A can monitor the pressure value inside the upper solution chamber 80A in real time. The upper solution chamber 80A is connected to the upper pump 50A, and an upper flow meter 60A is installed between the upper solution chamber 80A and the upper pump 50A. The upper flow meter 60A can monitor the flow rate of the electroplating solution transported to the upper solution chamber in real time. The upper pump 50A can transport the electroplating solution in the electroplating solution tank 90 to the upper solution chamber 80A for spray electroplating on a partial plating area on the front side of the workpiece 10. After electroplating, the electroplating solution returns to the electroplating solution tank 90 according to a predetermined circuit.

[0109] In some embodiments, the lower mold 100B includes a lower solution chamber 80B, a lower pressure gauge 70B, a lower flow meter 60B, and a lower pump 50B. The lower solution chamber 80B is connected to the lower pressure gauge 70B. After closing with the upper mold 100A, during the spray electroplating process targeting a localized plating area on the reverse side of the workpiece 10, the lower pressure gauge 70B can monitor the pressure value within the lower solution chamber 80B in real time. The lower solution chamber 80B is connected to the lower pump 50B, and a lower flow meter 60B is disposed between the lower solution chamber 80B and the lower pump 50B. The lower flow meter 60B can monitor the flow rate of the electroplating solution transported to the lower solution chamber 80B in real time. The lower pump 50B can transport the electroplating solution in the electroplating solution tank 90 to the lower solution chamber 80B to perform spray electroplating on the partial plating area on the reverse side of the workpiece 10. After electroplating, the electroplating solution returns to the electroplating solution tank 90 according to the predetermined circuit.

[0110] In some embodiments, the control system 200 includes an electroplating solution pressure control module A and a data training module A, as well as an electroplating solution pressure control module B and a data training module B. Both the upper pump 50A and the lower pump 50B are connected to the control system 200. The control system 200 controls the pressure and flow rate of the electroplating solution by controlling the force output by the upper pump 50A and the lower pump 50B. By setting independent A and B systems, the pressure and flow rate of the electroplating solution in the upper solution chamber 80A and the lower solution chamber 80B can be controlled separately. This allows for not only localized electroplating on both sides of the workpiece but also electroplating of different electroplating areas and film thicknesses on both sides of the workpiece.

[0111] In some embodiments, the electroplating solution pressure control module A is used to control the operation module of spraying electroplating solution into the local plating area on the front side of the lead frame, based on formula 6 and the local film thickness on the front side of the lead frame. D 建模正The requirements are to calculate and obtain the modeling pressure for constructing a frontal local spray electroplating model. P 建模正 Data. Electroplating solution flow control module A is a control module used to control the flow rate of electroplating solution sprayed in the local plating area on the front of the lead frame. It simulates the electroplating solution flow control model of the upper solution chamber 80A using incompressible electroplating solution flow formulas 1 and 2, and controls the flow rate in the pipeline via the upper pump 50A. Q 正 The pressure of the electroplating solution in the upper solution chamber (80A) is adjusted to achieve intelligent control, so that the difference fluctuation tends to be within a small range.

[0112] In some embodiments, the data training module A, on the one hand, is used to train the measured data of the electroplating solution pressure monitored by the upper pressure gauge 70A in the upper solution chamber 80A. P 实测正 The modeling data was compared and trained. On the other hand, actual electroplating operations were performed on the double-sided local plating areas of the lead frame, and the obtained double-sided local plating areas were sprayed with electroplated film of thickness... D 实测正 and film thickness D 建模正 Conduct comparative training.

[0113] In some embodiments, the electroplating solution pressure control module B is used to control the operation module of spraying electroplating solution into the local plating area on the reverse side of the lead frame, based on formula 6 and the local film thickness on the reverse side of the lead frame. D 建模反 The requirements are to calculate and obtain the modeling pressure for constructing a localized spray electroplating model on the reverse side. P 建模反 Data. Electroplating solution flow control module B is a control module used to control the flow rate of electroplating solution sprayed in the local plating area on the reverse side of the lead frame. It simulates the electroplating solution flow control model of the lower solution chamber 80B using incompressible electroplating solution flow formulas 1 and 2, and controls the solution flow rate in the pipeline via the lower pump 50B. Q 反 The pressure of the electroplating solution in the lower solution chamber 80B is adjusted to achieve intelligent control, so that the difference fluctuation tends to be within a small range.

[0114] In some embodiments, the data training module B, on the one hand, is used to transmit the measured pressure data of the electroplating solution monitored by the lower pressure gauge 70B in the lower solution chamber 80B. P 实测反 The modeling data was compared and trained. On the other hand, actual electroplating operations were performed on the double-sided local plating areas of the lead frame, and the obtained double-sided local plating areas were sprayed with electroplated film of thickness... D 实测反 and film thickness D 建模反 Conduct comparative training.

[0115] In some embodiments, the method is applicable to semiconductor electronic components to be processed, including: connector terminals, lead frames, and wafer chips, which are precision products.

[0116] Optionally, the upper solution chamber 80A and the upper pump 50A are connected by a flexible hose of sufficient strength to facilitate the vertical downward movement of the upper mold 100A and its closure with the lower mold 100B. The lower solution chamber 80B and the lower pump 50B can be connected by a PP pipe, eliminating the need for the lower solution chamber 80B to move vertically.

[0117] Optionally, both the upper pump 50A and the lower pump 50B are variable frequency pumps, which can adjust the flow rate of the solution in the pipeline according to demand. Q Size.

[0118] Furthermore, embodiments of the present invention also provide an electroplating method that utilizes the aforementioned method for constructing a double-sided localized spray electroplating model and a double-sided localized spray electroplating system. This electroplating method includes:

[0119] S1: Construct a database of double-sided localized spray electroplating conditions based on intelligent control. The double-sided localized spray electroplating conditions include: film thickness modeling data for localized plating areas on both sides of the lead frame. D 建模正 , D 建模反 Pressure data from the upper pressure gauge 70A P 建模正 Pressure data from the lower pressure gauge 70B P 建模反 Flow data from the upper flow meter Q 正 and flow data from the lower flow meter Q 反 The initial double-sided localized spray electroplating model, connected to the database, is constructed by considering factors such as electroplating solution density, electroplating solution temperature, power supply current, pump frequency, and connecting pipe diameter.

[0120] S2: Two different double-sided partial spray electroplating conditions are extracted from the database. An intelligently controlled double-sided partial spray electroplating system is used to perform the actual operation of spray electroplating on both sides of the lead frame, applying pressure from the upper part. P 建模正 and lower pressure P 建模反 The pressure is set as the constant pressure for actual electroplating operations, and the flow rate of the electroplating solution is finely adjusted in real time by the intelligent control system of the variable frequency pump. Q It is used to maintain a constant pressure value.

[0121] S3: After the actual electroplating operation in S2 is completed, test the thickness of the electroplated film on the front side of the obtained double-sided partial spray electroplated lead frame product. D 实测正 and the thickness of the electroplated film on the reverse side D 实测反 The spray electroplating film thickness data, and the set front film thickness. D 建模正 And the thickness of the reverse mask D 建模反 If the data is compared and meets the criteria of Formulas 7 and 8, it is imported into the initial model database, along with the corresponding pressure of the electroplating solution chamber in the upper electroplating mold. P 实测正 And the pressure of the electroplating solution chamber in the lower electroplating mold. P 实测反 Used to refine the initial double-sided local spray electroplating model.

[0122] S4: in equations 7 and 8 D 建模正 and D 建模反 These are the modeling film thickness data for the front and back sides, respectively, set in S3. The modeling film thickness data for the front and back sides can be the same or different, depending on the actual R&D needs. The obtained double-sided localized spray electroplating film thickness... D 实测正 and D 实测反 If the following conditions are met:

[0123] D 建模正 ≤ D 实测正 ≤ D 建模正 +5% D 建模正 Formula 7

[0124] D 建模反 ≤ D 实测反 ≤ D 建模反 +5% D 建模反 Formula 8

[0125] Then confirm the pressure in the upper electroplating solution chamber. P 建模正 And the pressure of the electroplating solution chamber in the lower electroplating mold. P 建模反 The specified conditions apply; otherwise, the actual conditions apply. D 实测正 and D 实测反 Based on, correctionP 建模正 And verify P 建模反 The actual operation of double-sided localized spray electroplating is carried out until formulas 7 and 8 are satisfied.

[0126] S5: Real-time loop from S2 to S5 to obtain a continuously iteratively upgraded double-sided local spray electroplating model.

[0127] S6: Select a double-sided partial spray electroplating model from a certain generation upgrade of S5 and apply it to the double-sided partial spray electroplating system to obtain the optimal electroplating solution chamber pressure of the upper electroplating mold. P 实测正 and the pressure of the electroplating solution chamber in the lower electroplating mold P 实测反 The data is applied to the electroplating system, where the flow rate in the pipeline is controlled by the control system 200 to control the actual pressure of the electroplating solution chamber in the upper electroplating mold. P 实控正 The actual controlled pressure of the electroplating solution chamber of the lower electroplating mold P 实控反 To achieve the optimal upper electroplating mold electroplating solution chamber pressure mentioned above P 实测正 and the pressure of the electroplating solution chamber in the lower electroplating mold P 实测反 The value is determined and stabilized to complete the double-sided electroplating of the plated part 10.

[0128] The above electroplating method can help R&D personnel to accurately and quickly screen the optimal conditions for double-sided partial spray electroplating models, which facilitates the design of electroplating molds, shortens R&D time, and reduces R&D costs.

[0129] Example 1

[0130] like Figure 2 and Figure 3 As shown, this embodiment, combined with a case study of the actual operation of a selected intelligent control double-sided partial spray electroplating device for spray electroplating on both sides of a lead frame, describes in detail the construction process of the fast, accurate optimization, classification and discrimination model data processing system of the present invention. This embodiment employs... Figure 2 The plated part 10 shown has a film thickness test point 21 located at the following position: Figure 3The center black dot ● of the local plating area in each plating unit 20 is located at the following coordinates: Column A, 10 (14.6, 7.3), 9 (14.6, 21.9), 8 (14.6, 36.5), 7 (14.6, 51.1), 6 (14.6, 65.7), 5 (14.6, 80.3), 4 (14.6, 94.9), 3 (14.6, 109.5), 2 (14.6, 124.1), 1 (14.6, 1... 38.7); Column B: 10 (21.9, 7.3), 9 (21.9, 21.9), 8 (21.9, 36.5), 7 (21.9, 51.1), 6 (21.9, 65.7), 5 (21.9, 80.3), 4 (21.9, 94.9), 3 (21.9, 109.5), 2 (21.9, 124.1), 1 (21.9, 138.7); Column C: 10 (36.5, 7.3), 9 (36.5, 21.9), 8 (36.5, 36.5), 7 (36.5, 51.1), 6 (36.5, 65.7), 5 (36.5, 80.3), 4 (36.5, 94.9), 3 (36.5, 109.5), 2 (36.5, 124.1), 1 (36.5, 138.7); Column D: 10 (51.1, 7.3), 9 (51.1, 21.9), 8 (51.1, 36.5), 7 (51.1, 51.1), 6 (51.1, 65.7), 5 (51.1, 80.3), 4 (51.1, 94.9), 3 (51.1, 109.5), 2 (51.1, 124.1), 1 (51.1, 138.7).

[0131] According to Figure 3 The design drawings of the lead frame shown have the following electroplating specifications: 2.5μm ≤ silver plating thickness ≤ 3.5μm; in this embodiment, the standard silver plating film thickness is 3.0μm.

[0132] Evaluation criteria for double-sided partial spray plating of lead frames:

[0133] ◆ Local film thickness on the front side of the lead frame corresponding to the upper mold:

[0134] 3.0μm≤front silver coating thickness≤3.0+0.15μm (3.0×5%)

[0135] ◆Local film thickness on the reverse side of the lead frame corresponding to the lower mold:

[0136] 3.0μm≤Reverse silver plating film thickness≤3.0+0.15μm (3.0×5%)

[0137] Actual test 1

[0138] Based on the fluid formula of the incompressible electroplating solution in the initial double-sided local spray electroplating model, the pressure conditions were calculated and simulated to obtain:

[0139] P 建模正 It is 2.5 MPa ;

[0140] P 建模反 It is 3.1 MPa .

[0141] Modeling pressure conditions were applied to a smart-controlled double-sided local spray electroplating device. Based on a silver film thickness of 3.0 μm, spray electroplating was performed on both sides of the lead frame. The actual electroplated part was obtained. The silver-plated sample of the lead frame was tested using a Fischer FISCHERSCOPE X-RAY XDV-SDD. The film thickness data of the local plating area on the front side is shown in Table 1, and the film thickness data of the local plating area on the back side is shown in Table 2.

[0142] Table 1 Frontal film thickness data

[0143]

[0144] Table 2 Reverse film thickness data

[0145]

[0146] Table 1 shows that the silver plating thickness in the localized area on the front of the leadframe ranges from Min 3.057 to Max 3.118 μm, with an error range of 1.9% to 3.9% compared to the product design standard thickness of 3.0 μm. Therefore, the solution chamber pressure on the front of the upper mold used for localized electroplating on the front of the leadframe should be 2.5 μm. MPa The conditions were confirmed, and the fluid calculation formula for the incompressible electroplating solution of the double-sided local spray electroplating model is accurate and practical.

[0147] Table 2 shows that the silver plating thickness in the localized area on the reverse side of the leadframe ranges from Min 3.061 to Max 3.115 μm, with an error range of 2.0% to 3.8% compared to the product design standard thickness of 3.0 μm. Therefore, the solution chamber pressure on the reverse side of the lower mold, which is also used for localized electroplating on the reverse side of the leadframe, is 3.1 μm. MPa The conditions were also confirmed, and the fluid calculation formula for the incompressible electroplating solution of the double-sided local spray electroplating model is accurate and practical.

[0148] Actual test 2

[0149] Based on the fluid formula of the incompressible electroplating solution in the initial double-sided local spray electroplating model, the pressure conditions were calculated and modeled; the following was obtained:

[0150] P 建模正 It is 3.1 MPa ;

[0151] P 建模反 It is 3.6 MPa .

[0152] The modeling pressure conditions were applied to the intelligent control double-sided local spray electroplating device. Based on the standard of 3.0 μm silver film thickness, the double-sided local spray electroplating operation was carried out on the lead frame to obtain the measured electroplated part 2. The equipment in measured 1 was used to detect the local silver-plated sample of the lead frame. The local film thickness data of the front side is shown in Table 3, and the local film thickness data of the back side is shown in Table 4.

[0153] Table 3 Frontal film thickness data

[0154]

[0155] Table 4. Reverse film thickness data

[0156]

[0157] Table 3 shows that the silver plating thickness in the localized area on the front of the leadframe ranges from Min 3.085 to Max 3.143 μm, with an error range of 2.8% to 4.8% compared to the product design standard thickness of 3.0 μm. Therefore, the solution chamber pressure on the front of the upper mold used for localized electroplating on the front of the leadframe should be 3.1 μm. MPa The conditions were confirmed, and the fluid calculation formula for the incompressible electroplating solution of the double-sided local spray electroplating model is accurate and practical.

[0158] Table 4 shows that the silver plating thickness in the localized area on the reverse side of the leadframe ranges from Min 3.099 to Max 3.145 μm, with an error range of 3.3% to 4.8% compared to the product design standard thickness of 3.0 μm. Therefore, the solution chamber pressure on the reverse side of the lower mold, which is also used for localized electroplating on the reverse side of the leadframe, is 3.6 μm. MPa The conditions were also confirmed, and the fluid calculation formula for the incompressible electroplating solution of the double-sided local spray electroplating model is accurate and practical.

[0159] Based on the data obtained from measurements 1 and 2, training calculations were performed using formulas 5 to 6 of the double-sided local spray electroplating model of the lead frame of the present invention. Under the simulated double-sided local spray electroplating conditions of the lead frame, the solution chamber pressure data of the front and back sides of the double-sided local spray electroplating mold of the lead frame were obtained. The detailed results are shown in Table 5.

[0160] Table 5. Pressure in the forward and reverse solution chambers and coating thickness

[0161]

[0162] Table 5 shows that, based on the measured data obtained from measurements 1 and 2, and by applying formulas 5 to 6 of the lead frame double-sided partial spray electroplating model of this invention under different solution chamber pressure conditions on the front and back sides of the lead frame double-sided partial spray electroplating mold, training calculations were performed to simulate the range of solution chamber pressure on the front side of the partial spray electroplating mold from 2.3 to 3.3 in simulations 1 to 9. MPa The average film thickness obtained from simulation calculations ranged from 3.092 to 3.128 μm, depending on the variation. Similarly, the solution chamber pressure on the reverse side of the localized spray electroplating mold ranged from 3.1 to 3.8 μm. MPa The variation in thickness was calculated, and the average thickness of the reverse side film obtained from the simulation was 3.096–3.129 μm.

[0163] The solution chamber pressure on the front side of the double-sided partial spray electroplating mold for the lead frame, measured in both tests 1 and 2, is 2.5. MPa and 3.1 MPa The pressure range of its solution chamber is 2.3–3.3. MPa Between; similarly, the pressure of the solution chamber on its opposite side is 3.1. MPa and 3.6 MPa Its pressure range is 3.1 to 3.8. MPa Between. From the film thickness test results in Tables 1-4, it can be seen that the film thickness data obtained from electroplating on both sides of the electroplating mold under the solution chamber pressure conditions of measured 1 and measured 2 both satisfy the calculation formulas 7 and 8 of the lead frame double-sided local spray electroplating model of this invention. To verify that the solution chamber pressure is lower than that of measured 1, the upper mold solution chamber pressure of simulation 1-2, 2.35, was selected. MPa The pressure in the lower mold solution chamber is 2.95. MPa Actual measurement 3 was performed; similarly, to verify the higher solution chamber pressure than measured 2, the upper mold solution chamber pressure of simulation 8-9 was selected as 3.25. MPa The pressure in the lower mold solution chamber is 3.75. MPa The film thickness data of the local coating areas on the front and back sides of the actual measurement 4, actual measurement 3, and actual measurement 4 are shown in Table 6.

[0164] Table 6. Thickness of Double-Sided Partial Silver Plating Film

[0165]

[0166] As shown in Table 6, the measured pressure of the upper mold solution chamber on the front side of the double-sided partial spray electroplating mold of lead frame 3 is 2.35. MPaUnder these conditions, the minimum silver film thickness in the front local plating area is 2.995 μm, exceeding the lower limit of the management standard and failing to meet the requirement of 3.0 μm ≤ front silver film thickness ≤ 3.0 + 0.15 μm; the pressure in the lower mold solution chamber on the reverse side is 2.95. MPa Under these conditions, the minimum thickness of the silver film in the localized plating area on the reverse side is 2.992 μm, which also exceeds the lower limit of the management standard and does not meet the requirement of the discrimination standard 3.0 μm ≤ silver film thickness on the reverse side ≤ 3.0 + 0.15 μm; therefore, the measured pressure of the mold solution chamber on the front and back sides of the double-sided localized spray electroplating mold of lead frame 3 cannot be included in the construction database of the double-sided localized spray electroplating model of this invention.

[0167] The measured pressure in the upper mold solution chamber of the double-sided partial spray electroplating mold on the lead frame was 3.25. MPa Under these conditions, the maximum thickness of the silver plating film in the localized plating area on the front side is 3.156 μm, exceeding the upper limit of the management standard and failing to meet the requirement of 3.0 μm ≤ front silver plating film thickness ≤ 3.150 μm; the pressure in the lower mold solution chamber on the reverse side is 3.75. MPa Under these conditions, the maximum thickness of the silver film in the reverse local plating area is 3.161 μm, which also exceeds the upper limit of the management standard and does not meet the requirement of the discrimination standard 3.0 μm ≤ reverse silver film thickness ≤ 3.1500 μm; therefore, the measured mold solution chamber pressure on the front and back sides of the lead frame double-sided local spray electroplating mold of the present invention cannot be included in the construction database of the double-sided local spray electroplating model of the present invention.

[0168] The results of actual measurements 1 to 4 are arranged in the order of simulation 2, actual measurement 1, simulation 2 to 7, actual measurement 2 and simulation 8. The detailed results are shown in Table 7.

[0169] Table 7. Thickness of Double-Sided Partial Silver Plating Film

[0170]

[0171] Table 7 shows the mold solution chamber pressure on the front side of the double-sided partial spray electroplating mold for the lead frame. P 模拟正 The range is 2.4 to 3.2. MPa Under certain conditions, the film thickness on the front side of the lead frame D 建模正 The range is 3.095–3.124 μm. The mold solution chamber pressure on the reverse side of the double-sided localized spray electroplating mold for the lead frame. P 模拟反 The range is 3.0 to 3.7. MPa Under certain conditions, the film thickness on the reverse side of the lead frame D 建模反 The range is 3.099–3.125 μm.

[0172] As can be seen from the above sequence, the authenticity of the initial simulation 2 and the final simulation 8 needs to be further verified by actual measurement using the double-sided local spray electroplating device of the present invention. The data of simulation 2 and simulation 8 are measured by the double-sided local spray electroplating device of the present invention. Among them, the measured data 5 is the data obtained under the conditions of simulation 2, and the measured data 6 is the data obtained under the conditions of simulation 8. The local plating area film thickness data of the front and back sides of measured data 5 and measured data 6 are shown in Table 8.

[0173] Table 8. Thickness of Double-Sided Partial Silver Plating Film

[0174]

[0175] As shown in Table 8, the measured film thickness error of 5 is 3.20%–3.93% on the front side and 3.37%–4.03% on the back side, which meets the requirements of the present invention. D Requirements for the judgment criteria.

[0176] 3.0μm≤front silver coating thickness≤3.0+0.15μm (3.0×5%)

[0177] 3.0μm≤Reverse silver plating film thickness≤3.0+0.15μm (3.0×5%)

[0178] The results of measurements 1-6 show that adjusting the mold solution chamber pressure on the front side of the double-sided local spray electroplating mold of the lead frame can achieve the desired effect. P The range is 2.4 to 3.0. MPa Under these conditions; and the pressure of the mold solution chamber on the reverse side of the double-sided partial spray electroplating mold. P The range is 3.2 to 3.7. MPa Under these conditions, it can ensure that the thickness of the silver plating film on both sides of the lead frame meets the discrimination requirements.

[0179] In summary, this invention, through the creation of Formula 6, a calculation model for the thickness of the lead frame double-sided local spray electroplating film, enables intelligent control of the upper chamber pressure during the actual operation of the double-sided local spray electroplating device on the lead frame. P 实测正 and lower chamber pressure P 实测反 The set value is adjusted and stabilized. The more stable the pressure value, the smaller the error between the thickness of the coating on both sides of the double-sided local spray electroplating, resulting in more precise and superior product performance.

[0180] Based on the integration of semiconductor leadframe double-sided partial spray electroplating technology and intelligent control technology in this invention, the created double-sided leadframe partial spray electroplating calculation model can quickly establish the production conditions for the double-sided partial spray electroplating film thickness of leadframes in various monomeric metal salts and binary metal salt electroplating solutions during actual production. Furthermore, through the intelligent control system of the leadframe double-sided partial spray electroplating film thickness condition calculation model, it can not only quickly and accurately predict the double-sided partial spray electroplating film thickness of semiconductor leadframes, significantly reducing the error with the actual electroplated product's coating thickness, but also promote the improvement of the uniformity of the double-sided partial spray electroplating film thickness, thus meeting the high-quality requirements of high-end semiconductor leadframe products.

[0181] The intelligent control system for double-sided localized jet electroplating constructed in this invention can stabilize the pressure in the upper and lower chambers of the electroplating mold by precisely adjusting the pump flow rate, thereby controlling the jet electroplating film thickness in the double-sided localized plating area of ​​the semiconductor lead frame within a standard range. By employing a jet electroplating intelligent control system with a double-sided localized mold chamber structure, the system continuously optimizes the pressure in real time based on the simulated chamber pressure and actual flow rate of the pump flow-pressure control system. This obtains the optimal standard for the double-sided chamber pressure, ensuring precise management of the double-sided plating layer and enabling a precise and rapid method and system for constructing a double-sided localized jet electroplating model.

[0182] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for constructing a double-sided partial spray electroplating model, characterized in that, include: Step 1: A double-sided partial spray electroplating device is provided. The electroplating device includes an electroplating solution tank (90), an upper mold (100A), a lower mold (100B), and a control system (200). The pressure and flow rate of the electroplating solution chambers of the upper mold (100A) and the lower mold (100B) are controlled by the control system (200). Step 2: Formula for calculating the relationship between pressure and flow rate in the electroplating solution delivery chamber of the double-sided partial spray electroplating model: P = P 0×( Q 0 / Q )×( T / T 0) Official 1 In the formula, P The pressure in the electroplating solution chamber is MPa. P 0 represents the standard pressure, in MPa; Q 0 represents the standard flow rate, m 3 / h; Q For flow rate, m 3 / h; T Kelvin temperature, K; T 0 represents the Kjeldahl temperature under standard conditions, in Kelvin. Among them, standard condition pressure P 0 represents 0.1 MPa; standard flow rate Q 0 is 12m 3 / h; Kjeldahl temperature under standard conditions T 0 is 25 + 273.15 K; since the working temperature of the electroplating solution is set to 55℃, the Kjeldahl temperature is... T The pressure is 55 + 273.15 K; substituting the above known conditions into Formula 1, we obtain the pressure of the electroplating solution under the above known conditions. P 1. The formula for calculating the relationship between flow rate and output: P 1=1.2×328.15 / (298.15 Q ) Formula 2 Step 3: Traffic Q The calculation formula is as follows: Q = V × S Formula 3 In the formula, V The flow rate of the electroplating solution is m / h. S The total cross-sectional area of ​​the electroplating solution inlet is in meters. 2 ; Step 4: The total cross-sectional area of ​​the electroplating solution inlet in Step 3. S Equal to the area of ​​the local plating zone on the workpiece, Formula 4 is derived based on the practical application of Faraday's law of electrolysis in the electroplating process: S=CItη k / Dρ Formula 4 Substituting formulas 3 and 4 into formula 2, we get formula 5: P 1=1.2×328.15 Dρ / (298.15 VCItη k ) Formula 5 In the formula, C For electrochemical equivalents, grams / Ampere-hour; I The current intensity is expressed in amperes. t Electroplating time, in hours; η k The cathode current efficiency is % D The thickness of the spray-coated film is in meters (m). ρ The density of the electroplated metal layer is gram. / m 3 ; Step 5: Simulate and calculate the pressure of the electroplating solution chamber in the upper mold (100A) based on Formula 5. P 建模正 And the electroplating solution chamber pressure of the lower mold (100B) P 建模反 The conditions for setting the upper mold (100A) and the lower mold (100B) are set and applied to the double-sided partial spray electroplating device. The upper mold (100A) performs spray electroplating on the front side of the plated part (10), while the lower mold (100B) performs spray electroplating on the back side of the plated part (10). The plated part (10) is then subjected to double-sided partial electroplating to obtain the electroplated product of the plated part (10). Step 6: Double-sided localized spray electroplating film thickness management and control, transforming Formula 5 to obtain Formula 6: D =298.15 P 1 VCItη k / 1.2×328.15 ρ Formula 6 The electroplating solution chamber pressure obtained in step 5 P 建模正 and P 建模反 Substituting into Formula 6, the thickness of the electroplated film on the front side of the plated part (10) can be obtained through Formula 6. D 建模正 and reverse modeling electroplating film thickness D 建模反 ; Step 7: Double-sided localized spray electroplating film thickness threshold management. Measure the electroplating film thickness on both the front and back sides of the electroplated product obtained in Step 5 to obtain the measured front electroplating film thickness. D 实测正 and the thickness of the electroplated film on the reverse side D 实测反 If the judgment conditions are met D 建模正 ≤ D 实测正 ≤ D 建模正 + 5% D 建模正 Formula 7 D 建模反 ≤ D 实测反 ≤ D 建模反 + 5% D 建模反 Formula 8 Therefore, the pressure in the electroplating solution chamber in step 5 is considered to be... P 建模正 and P 建模反 The specified conditions apply; otherwise, the actual conditions apply. D 实测正 and D 实测反 Based on, correction P 建模正 And verify P 建模反 Repeat steps 4 through 7 until formulas 7 and 8 are satisfied.

2. The method for constructing an electroplating model according to claim 1, characterized in that, The metal types in the electroplating solution include: single-component plating layers Au, Ag, Ni, Sn, Cu, Pd, Rh, Pt, and binary alloy plating layers Au-Ni and Au-Co.

3. A double-sided partial spray electroplating system, characterized in that, The electroplating system, using the method for constructing the electroplating model according to claim 1 or 2, comprises: Electroplating solution tank (90); An upper mold (100A) and a lower mold (100B) are provided, wherein the upper mold (100A) is capable of abutting against the lower mold (100B), and the upper mold (100A) and the lower mold (100B) are in communication with the electroplating solution tank (90); the plated part (10) is placed between the upper mold (100A) and the lower mold (100B); The control system (200) is capable of controlling the pressure and flow rate of the electroplating solution chambers of the upper mold (100A) and the lower mold (100B).

4. The electroplating system according to claim 3, characterized in that, The upper mold (100A) includes an upper solution chamber (80A), an upper pressure gauge (70A), an upper flow meter (60A), and an upper pump (50A). The upper solution chamber (80A) is connected to the upper pressure gauge (70A) and the upper pump (50A) respectively. The upper pump (50A) is connected to the electroplating solution tank (90). The upper flow meter (60A) is installed between the upper pump (50A) and the upper solution chamber (80A).

5. The electroplating system according to claim 4, characterized in that, The lower mold (100B) includes a lower solution chamber (80B), a lower pressure gauge (70B), a lower flow meter (60B), and a lower pump (50B). The lower solution chamber (80B) is connected to the lower pressure gauge (70B) and the lower pump (50B) respectively. The lower pump (50B) is connected to the electroplating solution tank (90). The lower flow meter (60B) is installed between the lower pump (50B) and the lower solution chamber (80B).

6. The electroplating system according to claim 4, characterized in that, The control system (200) includes an electroplating solution pressure control module A and a data training module A. The electroplating solution pressure control module A is connected to the upper pump (50A) and controls the inlet flow rate of the upper solution chamber (80A) by controlling the upper pump (50A). The data training module A is connected to the upper pressure gauge (70A).

7. The electroplating system according to claim 5, characterized in that, The control system (200) further includes an electroplating solution pressure control module B and a data training module B. The electroplating solution pressure control module B is connected to the lower pump (50B) and controls the inlet flow rate of the lower solution chamber (80B) by controlling the lower pump (50B). The data training module B is connected to the lower pressure gauge (70B).

8. The electroplating system according to claim 5, characterized in that, The upper pump (50A) is connected to the upper solution chamber (80A) via a hose, and the lower pump (50B) is connected to the lower solution chamber (80B) via a pipe.

9. The electroplating system according to claim 8, characterized in that, Both the upper pump (50A) and the lower pump (50B) are variable frequency pumps.

10. An electroplating method, characterized in that, Using the electroplating system according to any one of claims 3-9, the electroplating method comprises: S1: Construct a database of double-sided local spray electroplating conditions, and an initial double-sided local spray electroplating model connected to the database; S2: Extract two different double-sided local spray electroplating conditions from the database, and perform actual spray electroplating on the plated part (10) using the double-sided local spray electroplating system, and apply the upper pressure. P 建模正 and lower pressure P 建模反 The pressure is set as the constant pressure for the actual electroplating operation, and the flow rate of the electroplating solution is finely adjusted in real time by the control system (200). Q Used to maintain a constant pressure value; S3: After the actual electroplating operation in S2 is completed, test the thickness of the electroplated film on the front side of the obtained electroplated product. D 实测正 and the thickness of the electroplated film on the reverse side D 实测反 The data, and the set frontal film thickness D 建模正 And the thickness of the reverse mask D 建模反 If the data is compared and meets the criteria of Formulas 7 and 8, it is imported into the initial model database, along with the corresponding upper solution chamber pressure. P 实测正 and the pressure in the lower solution chamber P 实测反 Used to refine the initial double-sided local spray electroplating model; S4: The thickness of the electroplated film obtained in S3 D 实测正 and D 实测反 If formulas 7 and 8 are satisfied, then the pressure in the upper solution chamber is considered to be... P 建模正 and the pressure in the lower solution chamber P 建模反 If the specified conditions apply, otherwise the actual front electroplated film thickness will apply. D 实测正 and the thickness of the electroplated film on the reverse side D 实测反 Based on, correction P 建模正 And verify P 建模反 The actual operation of double-sided partial spray electroplating is carried out until formulas 7 and 8 are satisfied; wherein, in formulas 7 and 8 D 建模正 and D 建模反 These are the film thickness data for the front and back sides set in S3, respectively; S5: Real-time loop from S2 to S5 to obtain a continuously iteratively upgraded double-sided local spray electroplating model; S6: Select a double-sided local spray electroplating model from a certain generation upgrade of S5 and apply it to the double-sided local spray electroplating system to obtain the optimal electroplating solution chamber pressure. P 实测正 and electroplating solution chamber pressure P 实测反 The data is applied to the electroplating system, and the flow rate in the pipeline is controlled by the control system (200) to control the actual pressure of the electroplating solution chamber of the upper electroplating mold. P 实控正 The actual controlled pressure of the electroplating solution chamber of the lower electroplating mold P 实控反 To achieve the above-mentioned optimal electroplating solution chamber pressure P 实测正 and electroplating solution chamber pressure P 实测反 The value is adjusted and stabilized to complete the double-sided electroplating of the plated part (10).

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