Semiconductor packaging mold and packaging method

Abstract

The invention relates to the technical field of semiconductor packaging, and discloses a semiconductor packaging mold and a packaging method.The semiconductor packaging mold comprises a machine cover, the bottom end of the machine cover is fixedly connected with a packaging mechanism, the top end of the packaging mechanism is detachably connected with a feeding mechanism, and the left side and the right side of the packaging mechanism are both fixedly connected with rotating columns; a connecting rod is rotationally connected to the outer side of the rotating column, a rotating shaft is rotationally connected to the other end of the connecting rod, a rolling shaft is rotationally connected to the inner side of the rotating shaft, sliding blocks are fixedly connected to the left side and the right side of the packaging mechanism correspondingly, sliding grooves allowing the rolling shaft to slide are formed in the sliding blocks, and supporting rings are fixedly connected to the four corners of the bottom end of each sliding block correspondingly; sliding rods are rotationally connected to the inner walls of the two adjacent supporting rings. According to the invention, the design that automatic unloading can be completed during mold opening is adopted, so that the situation of production takt interruption is not caused any more, and the semiconductor packaging efficiency is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging mold and a packaging method. Background Art

[0002] Semiconductor packaging technology is a critical process for packaging integrated circuit chips into practical electronic devices. Its core goal is to protect the chips from physical damage and environmental interference while enabling electrical connections, heat dissipation, and signal transmission. The process includes die bonding, wire bonding, and molding, balancing performance, cost, and reliability through package structure design. Packaging technology directly impacts chip lifespan, power consumption, and integration, and is a critical link in the semiconductor industry chain. Semiconductor packaging molds are the core tools for achieving package molding, playing a particularly decisive role in the injection molding of the molding compound. The molds must precisely control the flow path and curing process of the molding compound to ensure a dense and defect-free package structure.

[0003] However, in the existing technology, some semiconductor packaging molds require operators to manually transfer the carrier tray to a dedicated unloading station for demolding after the semiconductor is packaged. The carrier tray then needs to be repositioned and the loading process repeated. This material turnover mode that relies on manual intervention causes interruptions in the production rhythm, thereby reducing the efficiency of semiconductor packaging.

[0004] Therefore, to address the above problems, a semiconductor packaging mold and a packaging method are proposed. Summary of the Invention

[0005] In order to remedy the above shortcomings, the present invention provides a semiconductor packaging mold and a packaging method, which aims to improve the problem in the prior art that some semiconductor packaging molds require operators to manually transfer the loading tray to a dedicated unloading station for demolding after the semiconductor is packaged, and then repeat the loading process, resulting in an interruption in the production rhythm, thereby reducing the efficiency of semiconductor packaging.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions: A semiconductor packaging mold comprises a machine cover, wherein the bottom end of the machine cover is fixedly connected to a packaging mechanism, the top end of the packaging mechanism is detachably connected to a feeding mechanism, the left and right sides of the packaging mechanism are fixedly connected to rotating columns, the outer side of the rotating column is rotatably connected to a connecting rod, the other end of the connecting rod is rotatably connected to a rotating shaft, the inner side of the rotating shaft is rotatably connected to a roller, the left and right sides of the packaging mechanism are fixedly connected to sliders, the interior of the slider is provided with a sliding groove for the roller to slide, the four corners of the bottom end of the slider are fixedly connected to support rings, the inner walls of two adjacent support rings are rotatably connected to sliding rods, and the four corners of the bottom end of the packaging mechanism are fixedly connected to plug posts plugged into the lower mold; As a further description of the above technical solution: The packaging mechanism includes a multi-stage cylinder, the top of the multi-stage cylinder is fixedly connected to the bottom end of the machine cover, the driving end of the multi-stage cylinder is fixedly connected to a pressure plate, the bottom end of the pressure plate is fixedly connected to an upper mold, one end of the rotating column is fixedly connected to the outer side of the upper mold, the top of the machine cover is fixedly connected to two injection molding machines, the outside of the injection molding machine is fixedly connected to a delivery pipe communicating with the upper mold, the four corners of the inner wall of the pressure plate are fixedly connected to guide sleeves, the inner wall of the guide sleeve is slidably connected to a guide column, the bottom end of the machine cover is fixedly connected to a guardrail, the bottom end of the guardrail is fixedly connected to an organism, the top of the organism is fixedly connected to a bottom plate, and the top of the bottom plate is fixedly connected to a lower mold; As a further description of the above technical solution: The feeding mechanism includes a material tray, the bottom end of the material tray is detachably connected to the top end of the lower mold, the top end of the material tray is fixedly connected to a surrounding frame, and the front end of the material tray is fixedly connected to two handles; As a further description of the above technical solution: The inner wall of the roller is slidably connected to a plurality of sliding posts, and adjacent sides of the plurality of sliding posts are rotatably connected to a connecting piece, and the interior of the connecting piece is movably connected to a plurality of movable balls; As a further description of the above technical solution: The top of the bottom plate is fixedly connected to two slope blocks, the rear end of the guardrail is fixedly connected to a guide frame, and the rear end of the body is fixedly connected to a slope plate; As a further description of the above technical solution: The outer portion of the delivery pipe is slidably connected to the inner wall of the cover, and the outer portion of the delivery pipe is fixedly connected to the inner wall of the pressure plate; As a further description of the above technical solution: The outer portion of the movable ball contacts the inner wall of the roller, and the outer portion of the movable ball also contacts the inner wall of the chute; As a further description of the above technical solution: The outer portion of the support ring is slidably connected to the inner wall of the slope block, and the outer portion of the sliding rod is also slidably connected to the inner wall of the slope block; A semiconductor packaging method is applicable to the above-mentioned semiconductor packaging mold, and the packaging method is as follows: S1. Place the semiconductor to be packaged on the tray, then align the pins with the holes on the lower mold and insert them to fix them. At the same time, add plastic material to the injection molding machine and melt it to prepare for subsequent injection molding operations. S2. Start the packaging device. The multi-stage cylinder drives the pressure plate and upper mold down until the upper mold, lower mold, and tray are closed. At this time, the hot plastic fluid inside the injection molding machine flows through the delivery pipe into the upper mold, injecting the semiconductor loaded on the surface of the tray. During the descent, the roller and its internal structure continue to slide inside the chute until they are completely merged, and the roller is in the right half of the U-shaped groove in the chute. S3. After the injection molding is completed, the multi-stage cylinder is controlled to drive the pressure plate and the upper mold to rise. At this time, the roller and its internal structure will continue to slide in the right half of the U-shaped groove in the slide. At the same time, after rising to a certain distance, it drives the material tray to rotate. At this time, the slide rod will slide in the groove of the slope block until the material tray slides out of the range of the guardrail along the slope block and the guide frame, and falls from the slope plate. At this time, the staff can collect it; S4. After completing the above steps, the staff can put another tray full of semiconductors back on the lower mold and continue the packaging operation.

[0007] The present invention has the following beneficial effects: In the present invention, a tray filled with semiconductors is first placed on top of the lower mold, with the pins engaging with the holes at the top of the lower mold. A multi-stage cylinder is then activated to lower the pressure plate and upper mold. As the upper and lower molds slowly merge, the roller slowly slides rightward within the chute until they are fully merged, positioning the roller in the right half of the chute, slightly to the right of the center of the U-shaped groove in the chute. After packaging is complete, the multi-stage cylinder is activated to raise the pressure plate and upper mold. Because the roller is in the right half of the U-shaped groove in the chute, it continues to slide rightward as it rises, raising the right side of the tray, tilting it. Continued ascent disengages the pins from the lower mold. Driven by the slide rod, the tray slides along the ramp and guide frame until it falls from the top of the ramp, where it can be collected by a worker. This automatic unloading design during mold opening eliminates interruptions in production flow, significantly improving semiconductor packaging efficiency.

[0008] 2. In the present invention, when the roller slides in the slide groove, the live balls here will slide synchronously in the slide groove under the restriction of the connecting parts, thereby forming a dynamic lubrication film during the movement and significantly reducing the interface friction coefficient. At the same time, the stress dispersion is achieved by utilizing the characteristics of the synchronous sliding of multiple live balls, effectively avoiding the jamming phenomenon that is prone to occur in traditional single-point contact, and further optimizing the design of automatic unloading when opening the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic three-dimensional diagram of a semiconductor packaging mold and a packaging method proposed by the present invention; Figure 2A schematic structural diagram of a semiconductor packaging mold and a pressing plate of a packaging method proposed in the present invention; Figure 3 This is a structural schematic diagram of an upper mold of a semiconductor packaging mold and a packaging method proposed by the present invention; Figure 4 A schematic structural diagram of a roller of a semiconductor packaging mold and packaging method proposed by the present invention; Figure 5 A schematic structural diagram of a slider of a semiconductor packaging mold and packaging method proposed in the present invention; Figure 6 for Figure 3 A magnified view of point A; Figure 7 A schematic structural diagram of a semiconductor packaging mold and a material tray of a packaging method proposed in the present invention; Figure 8 for Figure 7 Enlarged view of point B; Figure 9 This is an overall flow chart of a packaging method in a semiconductor packaging mold proposed by the present invention.

[0010] Legend: 1. Machine body; 2. Guardrail; 3. Machine cover; 4. Multi-stage cylinder; 5. Press plate; 6. Upper mold; 7. Injection molding machine; 8. Conveying pipe; 9. Guide sleeve; 10. Guide post; 11. Bottom plate; 12. Lower mold; 13. Material tray; 14. Frame; 15. Handle; 16. Rotating column; 17. Connecting rod; 18. Rotating shaft; 19. Roller; 20. Sliding column; 21. Connecting piece; 22. Live ball; 23. Slider; 24. Slide groove; 25. Support ring; 26. Sliding rod; 27. Insert column; 28. Slope block; 29. ​​Guide frame; 30. Slope plate. DETAILED DESCRIPTION

[0011] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0012] Reference Figures 1 to 3The present invention provides an embodiment of a semiconductor packaging mold, comprising a cover 3, the bottom end of the cover 3 is fixedly connected to a guardrail 2, the bottom end of the guardrail 2 is fixedly connected to an organic body 1, the organic body 1 here is a packaging device as a whole, the cover 3 here is used to protect various mechanisms on the surface of the organic body 1, the bottom end of the cover 3 is fixedly connected to a packaging mechanism, the packaging mechanism includes a multi-stage cylinder 4, the top of the multi-stage cylinder 4 is fixedly connected to the bottom end of the cover 3, the cover 3 here provides a stable support for the multi-stage cylinder 4, the driving end of the multi-stage cylinder 4 is fixedly connected to a pressing plate 5, the bottom end of the pressing plate 5 is fixedly connected to an upper mold 6, after the multi-stage cylinder 4 is started, it can drive the pressing plate 5 and the upper mold 6 here to slide up and down, the top end of the cover 3 is fixedly connected to two injection molding machines 7, the outside of the injection molding machine 7 is fixedly connected to a conveying pipe 8 communicated with the upper mold 6, the injection molding machine 7 here can melt the plastic material by heat, thereby completing the subsequent semiconductor packaging operation, and the conveying pipe 8 here is used to convey the hot melt fluid in the injection molding machine 7.

[0013] The outside of the delivery pipe 8 is slidably connected to the inner wall of the machine cover 3, and the outside of the delivery pipe 8 is fixedly connected to the inner wall of the pressing plate 5. The length of the delivery pipe 8 here is only for illustration. The staff can adjust or customize the specific length of the delivery pipe 8 according to the height of the upper mold 6 when it descends. The four corners of the inner wall of the pressing plate 5 are fixedly connected with guide sleeves 9, and the inner wall of the guide sleeve 9 is slidably connected with a guide column 10. When the pressing plate 5 descends, it will drive the guide sleeve 9 to slide on the guide column 10, ensuring the stability of the pressing plate 5 when it descends and preventing deviation. The top of the body 1 is fixedly connected to the bottom plate 11, and the top of the bottom plate 11 is fixedly connected to the lower mold 12. The body 1 and the bottom plate 11 here provide stable support for the lower mold 12 to ensure For the normal operation of the semiconductor packaging process, the top of the packaging mechanism is detachably connected to a loading mechanism, which includes a material tray 13. The material tray 13 here is used to accommodate multiple semiconductors to be packaged. The bottom end of the material tray 13 is detachably connected to the top of the lower mold 12. The top of the material tray 13 is fixedly connected to a frame 14. The frame 14 here prevents the semiconductors from accidentally falling off from the inside of the material tray 13. The front end of the material tray 13 is fixedly connected to two handles 15. The handles 15 here are for staff to use for loading materials. The left and right sides of the packaging mechanism are fixedly connected to rotating columns 16. One end of the rotating column 16 is fixedly connected to the outer side of the upper mold 6. When the upper mold 6 descends, it can drive the rotating column 16 here to descend together.

[0014] Reference Figures 3 to 5The outer side of the rotating column 16 is rotatably connected to a connecting rod 17, and the other end of the connecting rod 17 is rotatably connected to a rotating shaft 18. The connecting rod 17 here can rotate at the end of the rotating column 16, and the rotating shaft 18 can also rotate at the other end of the connecting rod 17. The inner side of the rotating shaft 18 is rotatably connected to a roller 19, and the inner wall of the roller 19 is slidably connected to a plurality of sliding columns 20. The adjacent side of the plurality of sliding columns 20 is rotatably connected to a connecting piece 21, and the internal movability of the connecting piece 21 is connected to a plurality of live balls 22. The outer surface of the live ball 22 is connected to the roller The inner wall of the shaft 19 is in contact with the connecting piece 21 here connecting multiple live balls 22 together. At the same time, they can rotate around the roller 19 under the drive of the slide column 20. The left and right sides of the packaging mechanism are fixedly connected with sliders 23. The interior of the slider 23 is provided with a slide groove 24 for the roller 19 to slide. The outside of the live ball 22 is also in contact with the inner wall of the slide groove 24. When the upper mold 6 drives the rotating column 16 and the inner structure to descend, the roller 19 and multiple live balls 22 can slide inside the slide groove 24.

[0015] Reference Figures 6 to 8 The four corners of the bottom end of the slider 23 are fixedly connected with support rings 25, and the inner walls of two adjacent support rings 25 are rotatably connected with slide rods 26. The four corners of the bottom end of the packaging mechanism are fixedly connected with plug-in columns 27 that are plugged into the lower mold 12. The shapes of the front and rear ends of the plug-in columns 27 are opposite. This design mainly ensures the fixation of the normal unloading tray 13 and the lower mold 12, and can also slide out smoothly when unloading is required.

[0016] Reference Figure 3 The top of the bottom plate 11 is fixedly connected to two slope blocks 28, and the outer part of the support ring 25 is slidably connected to the inner wall of the slope block 28. The slope block 28 here provides a guide for the slide rod 26 to prevent the route from deviating. The outer part of the slide rod 26 is also slidably connected to the inner wall of the slope block 28. The rear end of the guardrail 2 is fixedly connected to a guide frame 29, and the rear end of the body 1 is fixedly connected to a slope plate 30. The guide frame 29 and the slope plate 30 here are used to further guide the sliding material tray 13, and then the staff can collect it.

[0017] Reference Figure 9 A semiconductor packaging method is applicable to the above-mentioned semiconductor packaging mold, and the packaging method is as follows: S1. Place the semiconductor to be packaged on the tray 13, then align the pins 27 with the holes on the lower mold 12 and insert them. Because the shapes of the front and rear pins 27 are opposite, they can be fixed in place under normal conditions. At the same time, plastic material is added to the injection molding machine 7 and melted to prepare for the subsequent injection molding operation, that is, the semiconductor packaging operation; S2. Start the packaging device. The multi-stage cylinder 4 drives the pressure plate 5 and the upper mold 6 to descend until the upper mold 6 is closed with the lower mold 12 and the material tray 13. At this time, the thermoplastic fluid inside the injection molding machine 7 will flow into the interior of the upper mold 6 along the delivery pipe 8, and the semiconductor loaded on the surface of the material tray 13 will be injection-molded. During the descent, the rotating column 16 and the structure inside it will also descend. At this time, the roller 19 and the structure of its inner wall will also slide inside the chute 24, and the multiple live balls 22 connected by the connector 21 will form a dynamic lubrication film during the movement and significantly reduce the interface friction coefficient. At the same time, the characteristics of the multiple synchronous sliding of the live balls 22 are used to achieve stress dispersion, effectively avoiding the jamming phenomenon that is easy to occur in traditional single-point contact. Until the upper mold 6 is completely merged with the material tray 13 and the lower mold 12, the roller 19 is in the right half of the U-shaped groove in the chute 24. At this time, the semiconductor packaging step can be started; S3. After the injection molding is completed, the multi-stage cylinder 4 is controlled to drive the pressing plate 5 and the upper mold 6 to rise. At this time, the roller 19 and its internal structure will continue to slide in the right half of the U-shaped groove in the chute 24. Because the roller 19 is in the right half of the chute 24 at this time, it will drive the right side of the material tray 13 to rise first when rising, so that the material tray 13 is in a tilted state. At this time, the slide rod 26 will slide in the groove of the slope block 28 until the roller 19 and the live ball 22 slide out of the range of the chute 24 from the right side of the slider 23. The material tray 13 will slide out of the range of the guardrail 2 along the slope block 28 and the guide frame 29, and then fall from the slope plate 30. At this time, the staff can collect it. S4. After completing the above steps, the staff can place another tray 13 filled with semiconductors back on the lower mold 12 to continue the packaging operation. The two trays 13 work in a switching manner, thus replacing the existing single tray 13 loading and unloading operation. This design of automatic unloading during mold opening eliminates the need for interruptions in production cycle, thereby greatly improving the efficiency of semiconductor packaging.

[0018] Working Principle: The operator neatly arranges the semiconductor chips to be packaged in the grooves of tray 13. A frame 14 prevents the chips from falling out. Pins 27 are then used to quickly lock the chips into position with lower mold 12. The reversed design of the front and rear pins 27 ensures a secure connection under normal conditions. Simultaneously, injection molding machine 7 heats the solid plastic material to a liquid state, which is then injected into the flow channel of upper mold 6 via delivery pipe 8, preparing for subsequent semiconductor packaging.

[0019] When the multi-stage cylinder 4 is started to drive the pressure plate 5 to drive the upper mold 6 downward, the guide sleeve 9 slides along the guide column 10 to ensure vertical accuracy. When the upper mold 6 and the lower mold 12 are closed, the hot melt fluid wraps the chip in the tray 13 to complete the injection molding. During this process, the rotating column 16 descends synchronously with the upper mold 6, and drives the roller 19 to slide in the slide 24 through the connecting rod 17 and the rotating shaft 18. The active balls 22 on the inner wall of the roller 19 form a dynamic lubricating film under the constraint of the connecting piece 21. The friction coefficient is significantly reduced by the synchronous rolling of multiple particles. At the same time, the coordinated movement of the active balls 22 is used to balance the stress and avoid the jamming phenomenon caused by traditional single-point contact. Until the upper mold 6 and the lower mold 12 are completely merged, the roller 19 is in the right half of the U-shaped groove in the slide 24.

[0020] After injection molding is completed, the multi-stage cylinder 4 lifts the upper mold 6. The roller 19, located in the right half of the chute 24 inside the slider 23 and offset from the center of gravity, preferentially lifts the right side of the tray 13, causing it to tilt. The slide rod 26 then slides along the arc-shaped groove of the ramp 28 until the roller 19 and the ball 22 slide out of the chute 24 on the right side of the slider 23. At this point, under the action of gravity and the guide mechanism, the tray 13 passes through the buffer slopes of the guide frame 29 and the ramp 30 in sequence, and finally slides out of the guardrail 2 for automatic unloading.

[0021] Alternating between the two material trays 13 eliminates downtime. The self-lubricating properties of the active balls 22 and the optimized trajectory of the chute 24 ensure long-term stable operation. The coordination between the guide sleeve 9 and the guide post 10 ensures the vertical motion accuracy of the pressure plate 5. The linkage design between the support ring 25 and the slide rod 26 ensures a stable discharge trajectory. This device seamlessly integrates the injection molding, heat dissipation, and discharge processes through the precise temperature control of the injection molding machine 7, the quantitative feeding of the delivery pipe 8, the dynamic lubrication of the active balls 22, and the optimized space of the chute 24. This significantly improves production efficiency and yield rate while reducing the risk of errors caused by manual intervention.

[0022] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor packaging mold, comprising a cover (3), characterized in that: The bottom end of the cover (3) is fixedly connected to a packaging mechanism, and the top end of the packaging mechanism is detachably connected to a feeding mechanism. The left and right sides of the packaging mechanism are fixedly connected to a rotating column (16), the outer side of the rotating column (16) is rotatably connected to a connecting rod (17), the other end of the connecting rod (17) is rotatably connected to a rotating shaft (18), and the inner side of the rotating shaft (18) is rotatably connected to a roller (19). The left and right sides of the packaging mechanism are fixedly connected to sliders (23), and a sliding groove (24) for the roller (19) to slide is provided inside the slider (23). The four corners of the bottom end of the slider (23) are fixedly connected to support rings (25), and the inner walls of two adjacent support rings (25) are rotatably connected to sliding rods (26). The four corners of the bottom end of the packaging mechanism are fixedly connected to plug-in columns (27) plugged into the lower mold (12).

2. The semiconductor packaging mold according to claim 1, wherein: The packaging mechanism includes a multi-stage cylinder (4), the top of the multi-stage cylinder (4) is fixedly connected to the bottom of the machine cover (3), the driving end of the multi-stage cylinder (4) is fixedly connected to a pressure plate (5), the bottom end of the pressure plate (5) is fixedly connected to an upper mold (6), one end of the rotating column (16) is fixedly connected to the outside of the upper mold (6), the top of the machine cover (3) is fixedly connected to two injection molding machines (7), the outside of the injection molding machine (7) is fixedly connected to a conveying pipe (8) communicating with the upper mold (6), the four corners of the inner wall of the pressure plate (5) are fixedly connected to guide sleeves (9), the inner wall of the guide sleeve (9) is slidably connected to a guide column (10), the bottom end of the machine cover (3) is fixedly connected to a guardrail (2), the bottom end of the guardrail (2) is fixedly connected to the body (1), the top of the body (1) is fixedly connected to a bottom plate (11), and the top of the bottom plate (11) is fixedly connected to a lower mold (12).

3. The semiconductor packaging mold according to claim 2, wherein: The feeding mechanism comprises a material tray (13), the bottom end of the material tray (13) is detachably connected to the top end of the lower mold (12), the top end of the material tray (13) is fixedly connected to a surrounding frame (14), and the front end of the material tray (13) is fixedly connected to two handles (15).

4. The semiconductor packaging mold according to claim 1, wherein: The inner wall of the roller (19) is slidably connected to a plurality of slide posts (20), and adjacent sides of the plurality of slide posts (20) are rotatably connected to a connecting piece (21), and the interior of the connecting piece (21) is movably connected to a plurality of live balls (22).

5. The semiconductor packaging mold according to claim 2, wherein: The top end of the bottom plate (11) is fixedly connected to two slope blocks (28), the rear end of the guardrail (2) is fixedly connected to a guide frame (29), and the rear end of the machine body (1) is fixedly connected to a slope plate (30).

6. The semiconductor packaging mold according to claim 2, wherein: The outside of the delivery pipe (8) is slidably connected to the inner wall of the machine cover (3), and the outside of the delivery pipe (8) is fixedly connected to the inner wall of the pressure plate (5).

7. The semiconductor packaging mold according to claim 4, wherein: The outside of the active ball (22) contacts the inner wall of the roller (19), and the outside of the active ball (22) also contacts the inner wall of the chute (24).

8. The semiconductor packaging mold according to claim 5, wherein: The outside of the support ring (25) is slidably connected to the inner wall of the slope block (28), and the outside of the sliding rod (26) is also slidably connected to the inner wall of the slope block (28).

9. A semiconductor packaging method, wherein the semiconductor packaging mold according to any one of claims 1 to 8 is used for packaging, wherein: The packaging method is as follows: S1. Place the semiconductor to be packaged on the tray (13), then align the pins (27) with the holes on the lower mold (12) and insert them to fix them. At the same time, add the plastic material to the injection molding machine (7) to melt it in preparation for the subsequent injection molding operation; S2. Start the packaging device, and the multi-stage cylinder (4) drives the pressure plate (5) and the upper mold (6) to descend until the upper mold (6) is closed with the lower mold (12) and the material tray (13). At this time, the thermoplastic fluid inside the injection molding machine (7) flows into the interior of the upper mold (6) along the delivery pipe (8), and the semiconductor loaded on the surface of the material tray (13) is injected. During the descent process, the roller (19) and its internal structure will slide inside the chute (24) until they are completely merged, and the roller (19) is located in the right half of the U-shaped groove in the chute (24); S3. After the injection molding is completed, the multi-stage cylinder (4) is controlled to drive the pressure plate (5) and the upper mold (6) to rise. At this time, the roller (19) and its internal structure will continue to slide in the right half of the U-shaped groove in the slide (24). At the same time, after rising to a certain distance, the material tray (13) is driven to rotate. At this time, the slide rod (26) will slide in the groove of the slope block (28) until the material tray (13) slides out of the range of the guardrail (2) along the slope block (28) and the guide frame (29) and falls from the slope plate (30). At this time, the staff can collect it; S4. After completing the above steps, the staff can put another tray (13) filled with semiconductors back on the lower mold (12) and continue the packaging operation.

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