Power module and power conversion equipment

Abstract

The invention provides a power module and power conversion equipment. The power module comprises a heat conducting plate, a first substrate and a first power device. In the first direction, the first substrate is arranged on one side of the heat conducting plate. The first power device is arranged on one side of the first substrate and is opposite to the heat conducting plate. A reinforcing structure is arranged on the side, facing the first substrate, of the heat conduction plate and comprises a first reinforcing wall, the first reinforcing wall surrounds at least part of the first substrate, and the first reinforcing wall and the first substrate are arranged in a spaced mode. In this way, the rigidity of the part, corresponding to the first substrate, of the heat conduction plate can be improved, the deformation of the heat conduction plate in the heat dissipation process of the first power device can be reduced, the stress applied to the first substrate due to the deformation of the heat conduction plate can be reduced, the cracking risk of the first substrate can be reduced, and the reliability of the substrate can be improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a power module and a power conversion device. Background Art

[0002] In power modules, heat generated by operating power devices is transferred to the external environment via the baseplate and heat conducting plate, dissipating heat from the power devices. However, in existing power modules, the baseplate's low strength makes it susceptible to brittle fracture during this process, resulting in low baseplate reliability and, consequently, low power module reliability. Summary of the Invention

[0003] This application provides a power module and a power conversion device. The power module is used in a power conversion device. The power module provided in this application can reduce the risk of substrate cracking, thereby improving the reliability of the substrate and the power module.

[0004] In a first aspect, embodiments of the present application provide a power module. The power module includes a heat conducting plate, a first substrate, and a first power device. In a first direction, the first substrate is disposed on one side of the heat conducting plate. The first power device is disposed on one side of the first substrate, facing away from the heat conducting plate. A reinforcement structure is provided on the side of the heat conducting plate facing the first substrate. The reinforcement structure includes a first reinforcement wall that surrounds at least a portion of the first substrate and is spaced apart from the first substrate.

[0005] In the power module provided by the present application, the heat generated by the first power device during operation is transferred to the external environment through the first substrate and the heat conducting plate, thereby achieving heat dissipation for the first power device. Compared with the existing power module in which the heat conducting plate is not provided with a reinforcement structure, the heat conducting plate is provided with a reinforcement structure on the side facing the first substrate, and the first reinforcement wall of the reinforcement structure surrounds at least a portion of the first substrate and is spaced apart from the first substrate. This design is conducive to increasing the rigidity of the portion corresponding to the heat conducting plate and the first substrate, and is conducive to reducing the deformation of the portion corresponding to the heat conducting plate and the first substrate during the heat dissipation process of the first power device, and is conducive to reducing the stress applied to the first substrate by the deformation of the heat conducting plate, and is conducive to reducing the risk of cracking of the first substrate, which is conducive to improving the reliability of the first substrate, the reliability of the power module, and the service life of the power module.

[0006] In one possible embodiment, the first substrate includes a first insulating layer, a first conductive layer and a first thermal conductive layer. In a first direction, the first conductive layer and the first thermal conductive layer are arranged on opposite sides of the first insulating layer, the first thermal conductive layer is arranged on the thermal conductive plate, the first conductive layer faces away from the thermal conductive plate, the first power device is arranged on one side of the first conductive layer and faces away from the first insulating layer, and the first insulating layer and the first reinforcing wall are spaced apart.

[0007] Heat generated by the first power device during operation is transferred to the heat conducting plate via the first conductive layer, the first insulating layer, and the first thermally conductive layer. Heat is then transferred to the external environment via the thermally conductive plate, dissipating heat from the first power device. The design of spacing the first insulating layer and the first reinforcing wall prevents damage to the first insulating layer from friction with the reinforcing structure, thereby improving the reliability of the first insulating layer and the first substrate.

[0008] In a possible implementation manner, a size of the reinforcement structure in the first direction is larger than a size of the first heat conducting layer in the first direction.

[0009] The design in which the size of the reinforcing structure in the first direction is larger than the size of the first heat-conducting layer in the first direction ensures that the reinforcing structure can have a strong reinforcing effect on the portion corresponding to the heat-conducting plate and the first substrate, which is beneficial to reducing the deformation of the portion corresponding to the heat-conducting plate and the first substrate during the heat dissipation process of the first power device, and is beneficial to reducing the stress applied to the first substrate by the heat-conducting plate due to deformation, and is beneficial to reducing the risk of cracking of the first substrate, which is beneficial to improving the reliability of the first substrate, which is beneficial to improving the reliability of the power module, and which is beneficial to extending the working life of the power module.

[0010] In one possible implementation, the power module includes a package that covers a portion of the heat conducting plate, the entire first substrate, all first power devices, and all reinforcement structures, and a side of the heat conducting plate facing away from the first substrate is exposed outside the package.

[0011] The package can protect the first substrate, the first power device and the reinforcement structure, preventing the first substrate, the first power device and the reinforcement structure from being affected by the external environment, which is beneficial to improving the reliability of the first substrate, the first power device and the reinforcement structure, and is beneficial to improving the reliability of the power module.

[0012] In one possible embodiment, the reinforcement structure includes a first reinforcement portion, which is stacked on one side of the heat conduction plate and faces the first substrate. The first reinforcement portion surrounds at least a portion of the first substrate and is spaced apart from the first substrate. The first reinforcement wall is the wall surface of the first reinforcement portion facing the first substrate.

[0013] The design of the first reinforcing portion surrounding at least a portion of the first substrate ensures that the first reinforcing portion can reinforce the portion of the heat conducting plate surrounding the first substrate, thereby increasing the rigidity of the portion of the heat conducting plate corresponding to the first substrate, reducing the deformation of the portion of the heat conducting plate corresponding to the first substrate during heat dissipation of the first power device, reducing the stress applied to the first substrate by the portion of the heat conducting plate corresponding to the first substrate due to deformation, reducing the risk of cracking of the first substrate, improving the reliability of the first substrate, improving the reliability of the power module, and extending the service life of the power module. The design of the first reinforcing portion and the heat conducting plate being stacked together increases the connection area between the first reinforcing portion and the heat conducting plate, increases the connection strength between the first reinforcing portion and the heat conducting plate, and improves the reinforcing effect of the first reinforcing portion on the heat conducting plate. Moreover, the structure is simple and easy to design, which helps reduce processing costs.

[0014] In one possible embodiment, the first reinforcement portion includes a first sub-reinforcement portion and a second sub-reinforcement portion. In the first direction, the second sub-reinforcement portion is arranged on one side of the first sub-reinforcement portion, the first sub-reinforcement portion is stacked on one side of the heat conduction plate and faces the first substrate, the first sub-reinforcement portion surrounds at least part of the first substrate, the second sub-reinforcement portion is located on one side of the first substrate and faces away from the heat conduction plate, the first sub-reinforcement portion and the second sub-reinforcement portion are both spaced apart from the first substrate, and the first reinforcement wall is the wall surface of the first sub-reinforcement portion facing the first substrate.

[0015] The first sub-reinforcement portion is stacked on one side of the heat conduction plate and faces the first substrate. The first sub-reinforcement portion surrounds at least a portion of the first substrate. The second sub-reinforcement portion is located on one side of the first substrate and faces away from the heat conduction plate. The design of the first sub-reinforcement portion and the second sub-reinforcement portion being spaced apart from the first substrate is conducive to improving the space utilization of the first reinforcement portion, reducing the area occupied by the first substrate and the first reinforcement portion on the heat conduction plate, facilitating the miniaturization design of the heat conduction plate, and facilitating the miniaturization design of the power module; moreover, it is conducive to reducing the weight of the first reinforcement portion, facilitating the lightweight design of the heat conduction plate, and facilitating the lightweight design of the power module.

[0016] In a possible implementation, the second sub-reinforcement portion is provided with a first through hole, which penetrates the second sub-reinforcement portion along a first direction, and a projection of the first power device in the first direction is located within the projection of the first through hole in the first direction.

[0017] The design of the projection of the first power device in the first direction and being located within the projection of the first through hole in the first direction can avoid interference between the first power device and the first reinforcement portion in the first direction, and can avoid reserving avoidance space between the first power device and the first reinforcement portion in the first direction, which is beneficial to reducing the size of the power module in the first direction and is beneficial to the miniaturized design of the power module.

[0018] In one possible embodiment, the first reinforcement portion is provided with a first spacing hole, the first spacing hole passes through the first reinforcement portion along the first direction, and the first spacing hole passes through the first reinforcement portion along its extension direction, and the extension direction of the first spacing hole is perpendicular to the first direction and the extension direction of the first reinforcement portion.

[0019] The design of the first spacing hole is beneficial to reducing the weight of the first reinforcement part, reducing the weight of the heat conducting plate, facilitating the lightweight design of the heat conducting plate, and facilitating the lightweight design of the power module while ensuring that the first reinforcement part can have a good reinforcement effect on the portion corresponding to the heat conducting plate and the first substrate.

[0020] In one possible embodiment, the power module includes a second substrate and a connector. The second substrate is disposed on one side of the heat conducting plate and faces the first substrate. In a second direction, the second substrate is located on one side of the first substrate and spaced apart from the first substrate. The connector is disposed between the first and second substrates. The second direction is perpendicular to the first direction.

[0021] The reinforcement structure includes a second reinforcement portion. In the second direction, the second reinforcement portion is located on one side of the first reinforcement portion. The second reinforcement portion is stacked on one side of the heat conduction plate and faces the second substrate. The second reinforcement portion surrounds at least a portion of the second substrate and is spaced apart from the second substrate, wherein the second reinforcement portion is fixedly stacked with the first reinforcement portion; or, the second reinforcement portion is spaced apart from the first reinforcement portion.

[0022] Because the connector is disposed between the first and second substrates, the first and second substrates flow through each other, which helps increase the flow area of ​​the power module. The design of the second reinforcement portion surrounding at least a portion of the second substrate and being spaced apart from the second substrate ensures that the second reinforcement portion can reinforce the portion of the heat conducting plate surrounding the second substrate, thereby helping to increase the rigidity of the portion of the heat conducting plate corresponding to the second substrate, helping to reduce the deformation of the portion of the heat conducting plate corresponding to the second substrate during the heat dissipation process of the first power device, helping to reduce the stress applied to the second substrate by the portion of the heat conducting plate corresponding to the second substrate due to deformation, helping to reduce the risk of cracking of the second substrate, helping to improve the reliability of the second substrate, helping to improve the reliability of the power module, and helping to extend the service life of the power module. Moreover, the design of the second reinforcement portion being stacked on the heat conducting plate helps to increase the connection area between the second reinforcement portion and the heat conducting plate, helping to increase the connection strength between the second reinforcement portion and the heat conducting plate, and helping to improve the reinforcing effect of the second reinforcement portion on the heat conducting plate.

[0023] In one possible embodiment, the second reinforcement portion is provided with a second spacing hole, which passes through the second reinforcement portion along the first direction and the second spacing hole passes through the second reinforcement portion along its extension direction, and the extension direction of the second spacing hole is perpendicular to the first direction and the extension direction of the second reinforcement portion.

[0024] The design of the second spacing hole is beneficial to reducing the weight of the second reinforcement part, reducing the weight of the heat conducting plate, facilitating the lightweight design of the heat conducting plate, and facilitating the lightweight design of the power module while ensuring that the second reinforcement part can have a good reinforcement effect on the part corresponding to the heat conducting plate and the second substrate.

[0025] In one possible embodiment, the reinforcement structure includes a first groove, which is recessed on one side of the heat conduction plate and faces the first substrate. The first substrate is accommodated in the first groove and is spaced apart from the peripheral wall of the first groove. The first reinforcement wall is the peripheral wall of the first groove.

[0026] The design of the first groove can avoid stress concentration in the portion corresponding to the heat conducting plate and the first substrate, thereby improving the rigidity of the portion corresponding to the heat conducting plate and the first substrate, reducing deformation of the portion corresponding to the heat conducting plate and the first substrate during heat dissipation of the first power device, reducing stress applied to the first substrate due to deformation of the portion corresponding to the heat conducting plate and the first substrate, reducing the risk of cracking of the first substrate, improving the reliability of the first substrate, improving the reliability of the power module, and extending the service life of the power module. Furthermore, this not only improves the space utilization of the heat conducting plate, reduces the space occupied by the heat conducting plate and the first substrate in the first direction, and facilitates the miniaturization of the power module, but also has a simple structure, is easy to design, and has low processing costs.

[0027] In one possible embodiment, the reinforcement structure includes a second groove, which is recessed on one side of the heat conduction plate and faces the first substrate. In the second direction, the second groove is located on one side of the first groove, and the second direction is arranged perpendicular to the first direction. The power module includes a second substrate and a connecting member, and the second substrate is accommodated in the second groove and is spaced apart from the peripheral wall of the second groove. The connecting member is arranged between the first substrate and the second substrate, wherein the second groove is spaced apart from the first groove; or, the second groove is connected to the first groove.

[0028] The design of the second groove avoids stress concentration in the portion corresponding to the heat conducting plate and the second substrate, thereby improving the rigidity of the portion corresponding to the heat conducting plate and the second substrate, reducing deformation of the portion corresponding to the heat conducting plate and the second substrate during heat dissipation of the first power device, reducing stress applied to the second substrate due to deformation of the portion corresponding to the heat conducting plate and the second substrate, reducing the risk of cracking of the second substrate, improving the reliability of the second substrate, improving the reliability of the power module, and extending the service life of the power module. Furthermore, this not only improves the space utilization of the heat conducting plate, reduces the space occupied by the heat conducting plate and the second substrate in the first direction, and facilitates the miniaturization of the power module, but also has a simple structure, is easy to design, and has low processing costs.

[0029] In a second aspect, embodiments of the present application further provide a power conversion device, comprising a circuit board and the power module described in any one of the first aspects, wherein the power module is assembled on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0031] Figure 1 This is a structural block diagram of the cooperation between the power conversion device, photovoltaic modules and power grid provided in the embodiment of the present application;

[0032] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of a power module of a power conversion device shown;

[0033] Figure 3 yes Figure 2 The schematic diagram of the structure of the power module shown is cut along line AA;

[0034] Figure 4 yes Figure 2 The schematic diagram of the three-dimensional structure of the power module shown is shown with the packaging component omitted;

[0035] Figure 5 yes Figure 4 A schematic diagram of a partial three-dimensional structure of a heat conducting plate of a power module shown;

[0036] Figure 6 yes Figure 5 The schematic diagram of the structure of the heat conducting plate shown in another angle;

[0037] Figure 7 yes Figure 4 The schematic diagram of the partial structure of the power module shown is from another angle;

[0038] Figure 8yes Figure 7 The schematic diagram of the structure of the power module shown is a cross-section along line BB with connectors omitted;

[0039] Figure 9 yes Figure 4 The three-dimensional structural diagram of the power module shown in another embodiment;

[0040] Figure 10 yes Figure 9 The schematic diagram of the structure of the power module shown is from another angle;

[0041] Figure 11 yes Figure 10 The schematic diagram of the structure of the power module shown is cut along the CC line;

[0042] Figure 12 yes Figure 4 The three-dimensional structural diagram of the power module shown in another embodiment;

[0043] Figure 13 yes Figure 12 A schematic diagram of a partial three-dimensional structure of a heat conducting plate of a power module shown;

[0044] Figure 14 yes Figure 2 The power module shown is a schematic structural diagram of another embodiment cut along line AA;

[0045] Figure 15 yes Figure 14 The three-dimensional structure diagram of the power module shown is omitted from the packaging and cover;

[0046] Figure 16 yes Figure 15 The schematic diagram of the structure of the power module shown is from another angle;

[0047] Figure 17 yes Figure 16 The schematic diagram of the structure of the power module shown is cut along line DD;

[0048] Figure 18 yes Figure 16 The power module shown is a schematic diagram of a portion of the structure cut along line EE with the substrate omitted;

[0049] Figure 19 yes Figure 18 The structure diagram of the power module shown is in another embodiment;

[0050] Figure 20 yes Figure 18 The structure diagram of the power module shown is in another embodiment;

[0051] Figure 21 yes Figure 18The structure diagram of the power module shown is in another embodiment;

[0052] Figure 22 yes Figure 18 The structure diagram of the power module shown is in another embodiment;

[0053] Figure 23 yes Figure 18 The structure diagram of the power module shown is in another embodiment;

[0054] Figure 24 yes Figure 18 The structure diagram of the power module shown is in another embodiment;

[0055] Figure 25 yes Figure 2 The shown schematic diagram is a three-dimensional structure of a power module in another embodiment with the packaging omitted;

[0056] Figure 26 yes Figure 25 The schematic diagram of the partial structure of the power module shown is from another angle. DETAILED DESCRIPTION

[0057] The present invention provides a power module and a power conversion device. The power module is used in a power conversion device. The power module provided by the present invention can reduce the risk of cracking of the substrate, thereby improving the reliability of the substrate and the reliability of the power module.

[0058] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0059] See also Figure 1 , Figure 1 This is a block diagram of the structure of a power conversion device 1000, a photovoltaic module 2000, and a power grid 3000, provided in an embodiment of the present application. Exemplarily, the power conversion device 1000 is a photovoltaic inverter. In other embodiments, the power conversion device 1000 may also be a rectifier, transformer, converter, or other electronic device used for power conversion, such as an inverter.

[0060] The power conversion device 1000 is used to convert the DC power output by the photovoltaic module 2000 into AC power and supply it to the power grid 3000. In other embodiments, the power conversion device 1000 can also be used to convert the DC power output by the photovoltaic module 2000 into AC power and supply it to a load device. The load device can include, but is not limited to, electronic devices that use AC power, such as motors, fans, or air conditioners. In other embodiments, the power conversion device 1000 can also be used in electric drive controllers. For example, the power conversion device 1000 can convert the DC power output by a battery into AC power to supply a motor.

[0061] In some embodiments, the power conversion device 1000 includes a circuit board 100, an input terminal 200, a power module 300, and an output terminal 400. The input terminal 200, the power module 300, and the output terminal 400 are all mounted on the circuit board 100. The input terminal 200 is used to receive the direct current (DC) power output from the photovoltaic module 2000. The power module 300 is used to receive the DC power transmitted from the input terminal 200 and convert the DC power into alternating current (AC). The output terminal 400 is used to receive the AC power output from the power module 300 and transmit the AC power to the power grid 3000. The power conversion device 1000 converts the DC power output from the photovoltaic module 2000 into AC power via the power module 300.

[0062] See also Figure 2 、 Figure 3 and Figure 4 , and combined with Figure 1 , Figure 2 yes Figure 1 The figure shows a schematic three-dimensional structure of the power module 300 of the power conversion device 1000. Figure 3 yes Figure 2 The power module 300 is shown as a schematic structural diagram cut along line AA. Figure 4 yes Figure 2 The power module 300 shown is a schematic diagram of a three-dimensional structure in which the packaging component 60 is omitted.

[0063] like Figure 2 、 Figure 3 and Figure 4 As shown, in some embodiments, the power module 300 includes a heat conducting plate 10, a substrate 20, a power device 30, a first terminal 40, a second terminal 50, and an encapsulation 60. In the Z-axis direction, the substrate 20 is disposed on one side of the heat conducting plate 10. In the Z-axis direction, the power device 30 is disposed on one side of the substrate 20 and faces away from the heat conducting plate 10. In the Z-axis direction, the first terminal 40 and the second terminal 50 are both disposed on one side of the substrate 20 and face away from the heat conducting plate 10. The encapsulation 60 covers a portion of the heat conducting plate 10, all of the substrate 20, all of the power device 30, a portion of the first terminal 40, and a portion of the second terminal 50. The side of the heat conducting plate 10 facing away from the substrate 20, the side of the first terminal 40 facing away from the substrate 20, and the side of the second terminal 50 facing away from the substrate 20 are all exposed outside the encapsulation 60.

[0064] like Figure 1 and Figure 3As shown, the first terminal 40 and the second terminal 50 are both mounted on the circuit board 100. The direct current transmitted from the input terminal 200 is transmitted to the power device 30 through the first terminal 40. The power device 30 is used to convert direct current into alternating current. The direct current output by the power device 30 is transmitted to the output terminal 400 through the second terminal 50. The heat generated by the power device 30 during operation can be transferred to the external environment through the substrate 20 and the heat conducting plate 10 to achieve heat dissipation of the power device 30. In this application, the Z-axis direction shown in the figure is defined as the first direction. The X-axis direction shown in the figure is defined as the second direction, and the Y-axis direction shown in the figure is defined as the third direction. The first direction, the second direction, and the third direction are arranged perpendicular to each other.

[0065] See also Figure 5 and Figure 6 , and combined with Figure 4 , Figure 5 yes Figure 4 FIG. 1 is a partial three-dimensional structural diagram of the heat conducting plate 10 of the power module 300 . Figure 6 yes Figure 5 The heat conducting plate 10 is shown in another structural diagram at another angle. Figure 6 The dotted lines in are used to indicate the positions of the first through hole 7121 , the first spacing hole 713 , the second through hole 7221 , and the second spacing hole 723 .

[0066] Exemplarily, the heat conducting plate 10 is a rectangular plate. In some other embodiments, the heat conducting plate 10 may also be a circular plate, a triangular plate or other special-shaped plates. The heat conducting plate 10 is made of a heat conducting material including but not limited to copper or aluminum. In this embodiment, the first direction (i.e., the Z-axis direction shown in the figure) is the thickness direction of the heat conducting plate 10, the second direction (i.e., the X-axis direction shown in the figure) is the length direction of the heat conducting plate 10, and the third direction (i.e., the Y-axis direction shown in the figure) is the width direction of the heat conducting plate 10. In some other embodiments, the second direction may also be the width direction of the heat conducting plate 10, and the third direction may also be the length direction of the heat conducting plate 10. Among them, the heat conducting plate 10 includes a first heat conducting surface 11 and a second heat conducting surface 12. In the Z-axis direction, the first heat conducting surface 11 and the second heat conducting surface 12 are back to back and spaced apart.

[0067] In some embodiments, the heat conducting plate 10 is provided with a reinforcing structure 70. Specifically, in the Z-axis direction, a reinforcing structure 70 is provided on one side of the heat conducting plate 10. That is to say, in the Z-axis direction, the reinforcing structure 70 is arranged on one side of the heat conducting plate 10. The reinforcing structure 70 is stacked on one side of the heat conducting plate 10. The reinforcing structure 70 is fixedly stacked on one side of the first heat conducting surface 11 of the heat conducting plate 10 and faces away from the second heat conducting surface 12. A connecting layer 13 is provided between the reinforcing structure 70 and the heat conducting plate 10. The connecting layer 13 is made of, but not limited to, solder, nano silver paste, silver, sintered copper or other sintered materials. The connecting layer 13 is fixedly stacked between the reinforcing structure 70 and the heat conducting plate 10. Through the connecting layer 13, the reinforcing structure 70 is arranged on one side of the heat conducting plate 10. In some other embodiments, the connecting layer 13 may also be omitted, and the reinforcing structure 70 and the heat conducting plate 10 may also be integrally formed. The reinforcement structure 70 may also be fixedly stacked with the heat conducting plate 10 by methods including but not limited to welding (including reflow soldering, laser welding, and brazing), bonding, snapping, or screws.

[0068] In some embodiments, the reinforcement structure 70 includes a first reinforcement portion 71 and a second reinforcement portion 72. In the X-axis direction (i.e., the second direction), the second reinforcement portion 72 is located on one side of the first reinforcement portion 71 and is fixedly connected to the first reinforcement portion 71. Specifically, the second reinforcement portion 72 is fixedly stacked with the first reinforcement portion 71. Exemplarily, the second reinforcement portion 72 and the first reinforcement portion 71 are integrally formed. In other embodiments, the second reinforcement portion 72 can also be fixedly stacked with the first reinforcement portion 71 by means including but not limited to welding or gluing. In other embodiments, the second reinforcement portion 72 can also be spaced apart from the first reinforcement portion 71 in the X-axis direction, that is, the second reinforcement portion 72 is spaced apart from the first reinforcement portion 71. In particular, the first reinforcement portion 71 and the second reinforcement portion 72 are both fixedly stacked on one side of the first heat conducting surface 11 and facing away from the second heat conducting surface 12. In other words, the first reinforcement portion 71 is stacked on one side of the heat conducting plate 10. The second reinforcement portion 72 is stacked on one side of the heat conducting plate 10.

[0069] The design of the first reinforcement portion 71 stacked on the heat conducting plate 10 is beneficial for increasing the connection area between the first reinforcement portion 71 and the heat conducting plate 10, increasing the connection strength between the first reinforcement portion 71 and the heat conducting plate 10, and improving the reinforcing effect of the first reinforcement portion 71 on the heat conducting plate 10. Furthermore, the structure is simple and easy to design, which helps reduce processing costs. The design of the second reinforcement portion 72 stacked on the heat conducting plate 10 is beneficial for increasing the connection area between the second reinforcement portion 72 and the heat conducting plate 10, increasing the connection strength between the second reinforcement portion 72 and the heat conducting plate 10, and improving the reinforcing effect of the second reinforcement portion 72 on the heat conducting plate 10. Furthermore, the structure is simple and easy to design, which helps reduce processing costs.

[0070] In some embodiments, the first reinforcement portion 71 includes a first sub-reinforcement portion 711 and a second sub-reinforcement portion 712. In the Z-axis direction (i.e., the first direction), the second sub-reinforcement portion 712 is arranged on one side of the first sub-reinforcement portion 711. Specifically, in the Z-axis direction, the second sub-reinforcement portion 712 is fixedly stacked on one side of the first sub-reinforcement portion 711. Among them, the first sub-reinforcement portion 711 is fixedly stacked on one side of the first heat conducting surface 11 of the heat conducting plate 10 and faces away from the second heat conducting surface 12. The first sub-reinforcement portion 711 is stacked on one side of the heat conducting plate 10. The second sub-reinforcement portion 712 faces away from the heat conducting plate 10. In the Z-axis direction, the second sub-reinforcement portion 712 is fixedly stacked on the surface of the first sub-reinforcement portion 711 facing away from the heat conducting plate 10.

[0071] Exemplarily, the first sub-reinforcement portion 711 is a rectangular frame. In other embodiments, the first sub-reinforcement portion 711 may also be a triangular frame, a circular frame, or other special-shaped frame. The first sub-reinforcement portion 711 includes a first section 7111, a second section 7112, a third section 7113, and a fourth section 7114. The first section 7111 and the second section 7112 extend along the X-axis. In the Y-axis, the first section 7111 and the second section 7112 are opposite and spaced apart. The third section 7113 and the fourth section 7114 extend along the Y-axis. In the X-axis, the third section 7113 and the fourth section 7114 are opposite and spaced apart. The third section 7113 and the fourth section 7114 are both connected to the first section 7111 and the second section 7112. It can be understood that the wall surface of the first section 7111 facing the second section 7112, the wall surface of the third section 7113 facing the fourth section 7114, the wall surface of the second section 7112 facing the first section 7111, and the wall surface of the fourth section 7114 facing the third section 7113 are sequentially connected and constitute the first reinforcing wall 701. In other words, the first reinforcing portion 71 includes the first reinforcing wall 701. The reinforcing structure 70 includes the first reinforcing wall 701. The first reinforcing wall 701 includes the wall surface of the first section 7111 facing the second section 7112, the wall surface of the third section 7113 facing the fourth section 7114, the wall surface of the second section 7112 facing the first section 7111, and the wall surface of the fourth section 7114 facing the third section 7113.

[0072] In other embodiments, the first reinforcement sub-portion 711 may include only any one, two, or three of the first segment 7111, the second segment 7112, the third segment 7113, and the fourth segment 7114. In other embodiments, the first segment 7111 and the second segment 7112 may extend in a direction inclined relative to the X-axis. The third segment 7113 and the fourth segment 7114 may extend in a direction inclined relative to the Y-axis.

[0073] Exemplarily, the second sub-reinforcement portion 712 is a rectangular plate. In some other embodiments, the second sub-reinforcement portion 712 may also be a triangular plate, a circular plate, or other special-shaped plate. In the Z-axis direction, the second sub-reinforcement portion 712 is stacked on one side of the first section 7111, the second section 7112, the third section 7113, and the fourth section 7114 and faces away from the heat transfer plate 10. The projection of the second sub-reinforcement portion 712 in the Z-axis direction covers the projection of the first section 7111 in the Z-axis direction, the projection of the second section 7112 in the Z-axis direction, the projection of the third section 7113 in the Z-axis direction, and the projection of the fourth section 7114 in the Z-axis direction. In other words, the projection of the first sub-reinforcement portion 711 in the Z-axis direction is located within the projection of the second sub-reinforcement portion 712 in the Z-axis direction.

[0074] In some embodiments, the second reinforcement sub-portion 712 is provided with a first through hole 7121. The first through hole 7121 extends through the second reinforcement sub-portion 712 along the Z-axis (i.e., the first direction). For example, the first through hole 7121 is a rectangular hole. In other embodiments, the first through hole 7121 may also be a circular hole, a triangular hole, or another irregularly shaped hole.

[0075] In some embodiments, the first reinforcement portion 71 is provided with first spaced holes 713. The first spaced holes 713 extend through the first reinforcement portion 71 along the Z-axis direction (i.e., the first direction) and extend through the first reinforcement portion 71 along its extension direction. The extension direction of the first spaced holes 713 is perpendicular to the Z-axis direction (i.e., the first direction) and the extension direction of the first reinforcement portion 71. The first spaced holes 713 are connected to the first through-hole 7121. Exemplarily, there are multiple first spaced holes 713. Specifically, there are four first spaced holes 713. In other embodiments, the number of first spaced holes 713 may be one, two, or more. The first spaced holes 713 include a first sub-spaced hole 713a, a second sub-spaced hole 713b, a third sub-spaced hole 713c, and a fourth sub-spaced hole 713d. The first sub-spaced hole 713a extends through the first section 7111 of the first sub-reinforcement portion 711 and the second sub-reinforcement portion 712 along the Z-axis direction. The first sub-spaced hole 713a extends along the Y-axis (i.e., the direction in which the first sub-spaced hole 713a extends) through the first segment 7111 and the second sub-reinforcement portion 712. The direction in which the first sub-spaced hole 713a extends (i.e., the Y-axis) is perpendicular to the first direction (i.e., the Z-axis) and the direction in which the first segment 7111 of the first reinforcement portion 71 extends (i.e., the X-axis). The first sub-spaced hole 713a communicates with the first through-hole 7121.

[0076] The second sub-spaced hole 713b extends through the second section 7112 of the first sub-reinforcement portion 711 and the second sub-reinforcement portion 712 along the Z-axis. Furthermore, the second sub-spaced hole 713b extends through the second section 7112 and the second sub-reinforcement portion 712 along the Y-axis (i.e., the direction in which the second sub-spaced hole 713b extends). The extension direction of the second sub-spaced hole 713b (i.e., the Y-axis direction) is perpendicular to the first direction (i.e., the Z-axis direction) and the extension direction of the second section 7112 of the first reinforcement portion 71 (i.e., the X-axis direction). The second sub-spaced hole 713b communicates with the first through-hole 7121.

[0077] The third sub-spacer hole 713c extends through the third section 7113 of the first sub-reinforcement portion 711 and the second sub-reinforcement portion 712 along the Z-axis direction. Furthermore, the third sub-spacer hole 713c extends through the third section 7113 and the second sub-reinforcement portion 712 along the X-axis direction (i.e., the direction in which the third sub-spacer hole 713c extends). The extension direction of the third sub-spacer hole 713c (i.e., the X-axis direction) is perpendicular to the first direction (i.e., the Z-axis direction) and the extension direction of the third section 7113 of the first reinforcement portion 71 (i.e., the Y-axis direction). The third sub-spacer hole 713c communicates with the first through-hole 7121.

[0078] The fourth sub-spacer hole 713d extends through the fourth section 7114 of the first sub-reinforcement portion 711 and the second sub-reinforcement portion 712 along the Z-axis direction. Furthermore, the fourth sub-spacer hole 713d extends through the fourth section 7114 and the second sub-reinforcement portion 712 along the X-axis direction (i.e., the direction in which the fourth sub-spacer hole 713d extends). The extension direction of the fourth sub-spacer hole 713d (i.e., the X-axis direction) is perpendicular to the first direction (i.e., the Z-axis direction) and the extension direction of the fourth section 7114 of the first reinforcement portion 71 (i.e., the Y-axis direction). The fourth sub-spacer hole 713d communicates with the first through-hole 7121.

[0079] The first sub-spaced hole 713a, the second sub-spaced hole 713b, the third sub-spaced hole 713c, and the fourth sub-spaced hole 713d are sequentially spaced apart along the extension direction of the first reinforcement portion 71. In other embodiments, the first sub-spaced hole 713a and the second sub-spaced hole 713b may be connected. The second sub-spaced hole 713b and the third sub-spaced hole 713c may also be connected. The third sub-spaced hole 713c and the fourth sub-spaced hole 713d may also be connected.

[0080] The first sub-spaced hole 713 a and the fourth sub-spaced hole 713 d may also be connected.

[0081] In some embodiments, in the X-axis direction, the second reinforcement portion 72 is located on the side of the fourth section 7114 facing away from the third section 7113. The second reinforcement portion 72 is fixedly connected to the fourth section 7114 and the second sub-reinforcement portion 712. Specifically, the second reinforcement portion 72 is fixedly stacked with the fourth section 7114 and the second sub-reinforcement portion 712. The second reinforcement portion 72 includes a third sub-reinforcement portion 721 and a fourth sub-reinforcement portion 722. In the Z-axis direction (i.e., the first direction), the fourth sub-reinforcement portion 722 is disposed on one side of the third sub-reinforcement portion 721. Specifically, in the Z-axis direction, the fourth sub-reinforcement portion 722 is fixedly stacked on one side of the third sub-reinforcement portion 721. The third sub-reinforcement portion 721 is fixedly stacked on one side of the first heat conducting surface 11 of the heat conducting plate 10 and faces away from the second heat conducting surface 12. The third sub-reinforcement portion 721 is stacked on one side of the heat conducting plate 10. The fourth sub-reinforcement portion 722 faces away from the heat conducting plate 10. In the Z-axis direction, the fourth sub-reinforcement portion 722 is fixedly stacked on the surface of the third sub-reinforcement portion 721 facing away from the heat transfer plate 10. The third sub-reinforcement portion 721 is fixedly stacked on the fourth section 7114. The fourth sub-reinforcement portion 722 is fixedly stacked on the second sub-reinforcement portion 712.

[0082] Exemplarily, the third sub-reinforcement portion 721 is a rectangular frame. In other embodiments, the third sub-reinforcement portion 721 may also be a triangular frame, a circular frame, or another irregularly shaped frame. The third sub-reinforcement portion 721 includes a fifth section 7211, a sixth section 7212, a seventh section 7213, and an eighth section 7214. The fifth section 7211 and the sixth section 7212 extend along the X-axis. In the Y-axis, the fifth section 7211 and the sixth section 7212 are spaced apart from each other. The seventh section 7213 and the eighth section 7214 extend along the Y-axis. In the X-axis, the seventh section 7213 and the eighth section 7214 are spaced apart from each other. The seventh section 7213 and the eighth section 7214 are both connected to the fifth section 7211 and the sixth section 7212. The seventh section 7213 is fixedly stacked with the fourth section 7114. The eighth section 7214 faces away from the fourth section 7114. The wall surface of the fifth section 7211 facing the sixth section 7212, the wall surface of the seventh section 7213 facing the eighth section 7214, the wall surface of the sixth section 7212 facing the fifth section 7211, and the wall surface of the eighth section 7214 facing the seventh section 7213 are sequentially connected and constitute the second reinforcing wall 702. In other words, the second reinforcing portion 72 includes the second reinforcing wall 702, and the reinforcing structure 70 includes the second reinforcing wall 702. The second reinforcing wall 702 includes the wall surface of the fifth section 7211 facing the sixth section 7212, the wall surface of the seventh section 7213 facing the eighth section 7214, the wall surface of the sixth section 7212 facing the fifth section 7211, and the wall surface of the eighth section 7214 facing the seventh section 7213.

[0083] In other embodiments, the third reinforcement sub-portion 721 may include only any one, any two, or any three of the fifth segment 7211, the sixth segment 7212, the seventh segment 7213, and the eighth segment 7214. In other embodiments, the fifth segment 7211 and the sixth segment 7212 may extend in a direction oblique to the X-axis. The seventh segment 7213 and the eighth segment 7214 may extend in a direction oblique to the Y-axis.

[0084] Exemplarily, the fourth sub-reinforcement portion 722 is a rectangular plate. In other embodiments, the fourth sub-reinforcement portion 722 may also be a triangular plate, a circular plate, or other special-shaped plate. In the Z-axis direction, the fourth sub-reinforcement portion 722 is stacked on one side of the fifth section 7211, the sixth section 7212, the seventh section 7213, and the eighth section 7214, and faces away from the heat transfer plate 10. The projection of the fourth sub-reinforcement portion 722 in the Z-axis direction covers the projection of the fifth section 7211 in the Z-axis direction, the projection of the sixth section 7212 in the Z-axis direction, the projection of the seventh section 7213 in the Z-axis direction, and the projection of the eighth section 7214 in the Z-axis direction. In other words, the projection of the third sub-reinforcement portion 721 in the Z-axis direction is located within the projection of the fourth sub-reinforcement portion 722 in the Z-axis direction. The fourth sub-reinforcement portion 722 is fixedly stacked with the second sub-reinforcement portion 712. The projection of the fourth reinforcing sub-portion 722 in the X-axis direction completely overlaps with the projection of the second reinforcing sub-portion 712 in the X-axis direction. In other embodiments, they may not completely overlap.

[0085] In some embodiments, the fourth reinforcement sub-portion 722 is provided with a second through hole 7221. The second through hole 7221 extends through the fourth reinforcement sub-portion 722 along the Z-axis (i.e., the first direction). Exemplarily, the second through hole 7221 is a rectangular hole. In other embodiments, the second through hole 7221 may also be a circular hole, a triangular hole, or another irregularly shaped hole.

[0086] In some embodiments, the second reinforcement portion 72 is provided with second spaced holes 723. The second spaced holes 723 extend through the second reinforcement portion 72 along the Z-axis direction (i.e., the first direction) and extend through the second reinforcement portion 72 along its extension direction. The extension direction of the second spaced holes 723 is perpendicular to the Z-axis direction (i.e., the first direction) and the extension direction of the second reinforcement portion 72. The second spaced holes 723 communicate with the second through-hole 7221. Exemplarily, there are multiple second spaced holes 723. Specifically, there are four second spaced holes 723. In other embodiments, the number of second spaced holes 723 may be one, two, or more. The second spaced holes 723 include a fifth sub-spaced hole 723a, a sixth sub-spaced hole 723b, a seventh sub-spaced hole 723c, and an eighth sub-spaced hole 723d. The fifth sub-spaced hole 723a extends through the fifth section 7211 of the third sub-reinforcement portion 721 and the fourth sub-reinforcement portion 722 along the Z-axis direction. The fifth sub-spacer hole 723a extends along the Y-axis (i.e., the direction in which the fifth sub-spacer hole 723a extends) through the fifth segment 7211 and the fourth sub-reinforcement portion 722. The extension direction of the fifth sub-spacer hole 723a (i.e., the Y-axis) is perpendicular to the first direction (i.e., the Z-axis) and the extension direction of the fifth segment 7211 of the second reinforcement portion 72 (i.e., the X-axis). The fifth sub-spacer hole 723a communicates with the second through-hole 7221.

[0087] The sixth sub-spacer hole 723b extends through the sixth section 7212 of the third sub-reinforcement portion 721 and the fourth sub-reinforcement portion 722 along the Z-axis. Furthermore, the sixth sub-spacer hole 723b extends through the sixth section 7212 and the fourth sub-reinforcement portion 722 along the Y-axis (i.e., the direction in which the sixth sub-spacer hole 723b extends). The extension direction of the sixth sub-spacer hole 723b (i.e., the Y-axis direction) is perpendicular to the first direction (i.e., the Z-axis direction) and the extension direction of the sixth section 7212 of the second reinforcement portion 72 (i.e., the X-axis direction). The sixth sub-spacer hole 723b communicates with the second through-hole 7221.

[0088] The seventh sub-spacer hole 723c extends through the seventh section 7213 of the third sub-reinforcement portion 721 and the fourth sub-reinforcement portion 722 along the Z-axis direction. Furthermore, the seventh sub-spacer hole 723c extends through the seventh section 7213 and the fourth sub-reinforcement portion 722 along the X-axis direction (i.e., the direction in which the seventh sub-spacer hole 723c extends). The extension direction of the seventh sub-spacer hole 723c (i.e., the X-axis direction) is perpendicular to the first direction (i.e., the Z-axis direction) and the extension direction of the seventh section 7213 of the second reinforcement portion 72 (i.e., the Y-axis direction). The seventh sub-spacer hole 723c is connected to the second through hole 7221. Furthermore, the seventh sub-spacer hole 723c is connected to the fourth sub-spacer hole 713d. In other embodiments, these connections may not be necessary.

[0089] The eighth sub-spacer hole 723d extends through the eighth section 7214 of the third sub-reinforcement portion 721 and the fourth sub-reinforcement portion 722 along the Z-axis direction. Furthermore, the eighth sub-spacer hole 723d extends through the eighth section 7214 and the fourth sub-reinforcement portion 722 along the X-axis direction (i.e., the direction in which the eighth sub-spacer hole 723d extends). The extension direction of the eighth sub-spacer hole 723d (i.e., the X-axis direction) is perpendicular to the first direction (i.e., the Z-axis direction) and the extension direction of the eighth section 7214 of the second reinforcement portion 72 (i.e., the Y-axis direction). The eighth sub-spacer hole 723d communicates with the second through-hole 7221.

[0090] The fifth sub-interval hole 723a, the sixth sub-interval hole 723b, the seventh sub-interval hole 723c, and the eighth sub-interval hole 723d are sequentially spaced apart along the extension direction of the second reinforcing portion 72. In other embodiments, the fifth sub-interval hole 723a and the sixth sub-interval hole 723b may be connected. The sixth sub-interval hole 723b and the seventh sub-interval hole 723c may also be connected. The seventh sub-interval hole 723c and the eighth sub-interval hole 723d may also be connected.

[0091] The fifth sub-spaced hole 723a and the eighth sub-spaced hole 723d may also be connected.

[0092] See also Figure 7 and Figure 8 , and combined with Figure 1 、 Figure 4 and Figure 6 , Figure 7 yes Figure 4 The power module 300 is shown as a partial structural schematic diagram at another angle. Figure 8 yes Figure 7 The power module 300 shown is a schematic structural diagram cut along line BB, omitting the connector 23 .

[0093] like Figure 4 、 Figure 7 and Figure 8 As shown, in some embodiments, in the Z-axis direction, the substrate 20 is arranged on one side of the heat conducting plate 10 and faces the reinforcement structure 70. Specifically, the substrate 20 is stacked on one side of the heat conducting plate 10, and the substrate 20 is stacked on one side of the first heat conducting surface 11 and faces away from the second heat conducting surface 12. The substrate 20 is surrounded by the reinforcement structure 70 and is spaced apart from the reinforcement structure 70. In other words, the reinforcement structure 70 surrounds the substrate 20 and is spaced apart from the substrate 20. The reinforcement structure 70 is used to increase the stiffness of the corresponding portion of the heat conducting plate 10 and the substrate 20. It should be noted that the portion corresponding to feature A and feature B refers to the portion where the projection of feature A in the Z-axis direction completely overlaps with the projection of feature B in the Z-axis direction.

[0094] In some embodiments, the substrate 20 includes a first substrate 21, a second substrate 22, and a connector 23. In other words, the power module 300 includes a first substrate 21, a second substrate 22, and a connector 23. The first substrate 21 is stacked on one side of the first heat-conducting surface 11 and faces away from the second heat-conducting surface 12. The first substrate 21 is located in the first reinforcing portion 71, and a portion of the first substrate 21 is surrounded by the first reinforcing portion 71 and is spaced apart from the first reinforcing portion 71. In other words, the first reinforcing portion 71 is stacked on one side of the heat-conducting plate 10 and faces the first substrate 21. The first reinforcing portion 71 surrounds a portion of the first substrate 21. The first reinforcing portion 71 is spaced apart from the first substrate 21. In some other embodiments, the first reinforcing portion 71 may also surround the entire first substrate 21, that is, the first reinforcing portion 71 surrounds at least a portion of the first substrate 21 and is spaced apart from the first substrate 21. The first reinforcing portion 71 is used to increase the rigidity of the portion of the heat-conducting plate 10 corresponding to the first substrate 21.

[0095] Specifically, the first substrate 21 is partially surrounded by the first sub-reinforcement portion 711. In the X-axis direction, the first substrate 21 and the first sub-reinforcement portion 711 are spaced apart. And in the Y-axis direction, the first substrate 21 and the first sub-reinforcement portion 711 are spaced apart. In other words, the first sub-reinforcement portion 711 of the first reinforcement portion 71 is stacked on one side of the heat conducting plate 10 and faces the first substrate 21. The first sub-reinforcement portion 711 surrounds part of the first substrate 21 and is spaced apart from the first substrate 21. In some other embodiments, the first sub-reinforcement portion 711 may also surround the entire first substrate 21. It can be understood that the first sub-reinforcement portion 711 surrounds at least part of the first substrate 21 and is spaced apart from the first substrate 21.

[0096] The first reinforcing wall 701 faces the first substrate 21. That is, the first reinforcing wall 701 is the wall surface of the first sub-reinforcing portion 711 facing the first substrate 21, and the first reinforcing wall 701 is the wall surface of the first reinforcing portion 71 facing the first substrate 21. The first reinforcing wall 701 surrounds a portion of the first substrate 21. In the X-axis direction, the first reinforcing wall 701 is opposite to and spaced from the first substrate 21. In the Y-axis direction, the first reinforcing wall 701 is opposite to and spaced from the first substrate 21. In other embodiments, the first reinforcing wall 701 may also surround the entire first substrate 21. It will be understood that the first reinforcing wall 701 surrounds at least a portion of the first substrate 21 and is spaced from the first substrate 21.

[0097] In the Z-axis direction, the first substrate 21 is located between the heat transfer plate 10 and the second sub-reinforcement portion 712, and is spaced apart from the second sub-reinforcement portion 712. In other words, the second sub-reinforcement portion 712 is located on one side of the first substrate 21 and faces away from the heat transfer plate 10. The second sub-reinforcement portion 712 is spaced apart from the first substrate 21. It is understood that both the first sub-reinforcement portion 711 and the second sub-reinforcement portion 712 are spaced apart from the first substrate 21.

[0098] The first sub-reinforcement portion 711 is stacked on one side of the heat conducting plate 10 and faces the first substrate 21. The first sub-reinforcement portion 711 surrounds at least a portion of the first substrate 21. The second sub-reinforcement portion 712 is located on one side of the first substrate 21 and faces away from the heat conducting plate 10. The design of the first sub-reinforcement portion 711 and the second sub-reinforcement portion 712 being spaced apart from the first substrate 21 is conducive to improving the space utilization of the first reinforcement portion 71, and is conducive to reducing the area occupied by the first substrate 21 and the first reinforcement portion 71 on the heat conducting plate 10, which is conducive to the miniaturization design of the heat conducting plate 10 and the miniaturization design of the power module 100. Moreover, it is conducive to reducing the weight of the first reinforcement portion 71, which is conducive to the lightweight design of the heat conducting plate 10 and the lightweight design of the power module 300.

[0099] Exemplarily, the first substrate 21 is a DBC (Direct Bond Copper). In other embodiments, the first substrate 21 may also be a substrate including but not limited to an AMB (Active Metal Bonding), an IMS (Insulated Metal Substrate), or a PCB (Printed Circuit Board).

[0100] In some embodiments, the first substrate 21 includes a first insulating layer 211, a first conductive layer 212, a second conductive layer 213, and a first thermally conductive layer 214. Exemplarily, the first insulating layer 211 is made of an insulating material including, but not limited to, ceramic or epoxy resin. The first conductive layer 212 and the second conductive layer 213 are made of, but not limited to, copper or aluminum. The first thermally conductive layer 214 is made of a thermally conductive material including, but not limited to, copper or aluminum. The first insulating layer 211, the first conductive layer 212, the second conductive layer 213, and the first thermally conductive layer 214 are all rectangular layers. In other embodiments, the first insulating layer 211, the first conductive layer 212, the second conductive layer 213, and the first thermally conductive layer 214 may also be other shaped layers, such as circular layers or triangular layers.

[0101] In the Z-axis direction, the first conductive layer 212 and the second conductive layer 213 are disposed on one side of the first insulating layer 211. Specifically, in the Z-axis direction, the first conductive layer 212 and the second conductive layer 213 are stacked on one side of the first insulating layer 211, and the first conductive layer 212 and the second conductive layer 213 are fixedly stacked on one side of the first insulating layer 211. In the X-axis direction, the first conductive layer 212 and the second conductive layer 213 are arranged in sequence and spaced apart. In the Z-axis direction, the first thermal conductive layer 214 is disposed on one side of the first insulating layer 211 and faces away from the first conductive layer 212. Specifically, in the Z-axis direction, the first thermal conductive layer 214 is stacked on one side of the first insulating layer 211 and faces away from the first conductive layer 212, and the first thermal conductive layer 214 is fixedly stacked on one side of the first insulating layer 211 and faces away from the first conductive layer 212. That is, in the Z-axis direction (ie, the first direction), the first conductive layer 212 and the first heat conductive layer 214 are disposed on opposite sides of the first insulating layer 211 .

[0102] Among them, a first interconnection member 215 is provided between the first conductive layer 212 and the second conductive layer 213. One end of the first interconnection member 215 is stacked on one side of the first conductive layer 212 and faces away from the first insulating layer 211, and the other end is stacked on one side of the second conductive layer 213 and faces away from the first insulating layer 211. For details, please refer to the connection method between the reinforcement structure 70 and the heat conducting plate 10, which will not be repeated here. The projection of the first interconnection member 215 in the Z-axis direction is located at the first through hole 7121 (such as Figure 6 (as shown) within the projection in the Z-axis direction. Exemplarily, the first interconnect 215 is a bonding wire. The bonding wire is made of a conductive material including, but not limited to, copper, silver, or aluminum. In other embodiments, the first interconnect 215 may also be another conductive device such as a copper clip, a silver clip, or an aluminum clip. Through the first interconnect 215, current flows between the first conductive layer 212 and the second conductive layer 213.

[0103] The first heat-conducting layer 214 is fixedly stacked opposite to the first heat-conducting surface 11 by means including but not limited to welding or gluing. The first heat-conducting layer 214 is stacked on the heat-conducting plate 10. The first heat-conducting layer 214 is arranged on the heat-conducting plate 10. For details, please refer to the connection method between the reinforcement structure 70 and the heat-conducting plate 10, which will not be repeated here. The first conductive layer 212 and the second conductive layer 213 are facing away from the heat-conducting plate 10. In the X-axis direction, the first insulating layer 211 is spaced apart from the first sub-reinforcement portion 711. And in the Y-axis direction, the first insulating layer 211 is spaced apart from the first sub-reinforcement portion 711. The first insulating layer 211 is spaced apart from the first sub-reinforcement portion 711. In the Z-axis direction, the first conductive layer 212 and the second conductive layer 213 are both spaced apart from the second sub-reinforcement portion 712. It can be understood that the size of the first reinforcement portion 71 in the Z-axis direction is larger than the size of the first heat-conducting layer 214 in the Z-axis direction. The dimension of the reinforcement structure 70 in the Z-axis direction (ie, the first direction) is greater than the dimension of the first heat conducting layer 214 in the Z-axis direction (ie, the first direction).

[0104] In some embodiments, the first insulating layer 211 includes a first wall 2111, a second wall 2112, a third wall 2113, and a fourth wall 2114. In the Z-axis direction, the first wall 2111 and the second wall 2112 are spaced apart from each other. There are two third walls 2113. In the Y-axis direction, the two third walls 2113 are spaced apart from each other. The two third walls 2113 are connected to the first wall 2111 and the second wall 2112. There are two fourth walls 2114. In the X-axis direction, the two fourth walls 2114 are spaced apart from each other. The two fourth walls 2114 are connected to the first wall 2111, the second wall 2112, and the two third walls 2113. The first conductive layer 212 and the second conductive layer 213 are fixedly stacked on one side of the first wall 2111 and facing away from the second wall 2112. The first thermally conductive layer 214 is fixedly laminated on one side of the second wall 2112 and faces away from the first wall 2111. In the Y-axis direction, one third wall 2113 faces the first section 7111 and is spaced apart from it, while another third wall 2113 faces the second section 7112 and is spaced apart from it. In the X-axis direction, one fourth wall 2114 faces the third section 7113 and is spaced apart from it, while another fourth wall 2114 faces the fourth section 7114 and is spaced apart from it. In other words, both third walls 2113 and both fourth walls 2114 are spaced apart from the first reinforcing wall 701.

[0105] The two third walls 2113 and the two fourth walls 2114 of the first insulating layer 211 constitute the first mating peripheral wall 216 of the first substrate 21. In other words, the first substrate 21 includes the first mating peripheral wall 216, which is the peripheral wall of the first insulating layer 211. It will be understood that the first mating peripheral wall 216 is opposite and spaced apart from the first reinforcing wall 701 of the first reinforcement portion 71. The first insulating layer 211 is spaced apart from the first reinforcing wall 701. The design of the first insulating layer 211 and the first reinforcing wall 701 being spaced apart prevents damage to the first insulating layer 211 from friction with the reinforcement structure 70, thereby improving the reliability of the first insulating layer 211 and the first substrate 21.

[0106] In some embodiments, the second substrate 22 is stacked on one side of the first heat conducting surface 11 and faces away from the second heat conducting surface 12. That is, the second substrate 22 is disposed on one side of the heat conducting plate 10 and faces the first substrate 21. In the X-axis direction (i.e., the second direction), the second substrate 22 is located on one side of the first substrate 21 and is spaced apart from the first substrate 21. The second substrate 22 is located within the second reinforcing portion 72, and is partially surrounded by and spaced apart from the second reinforcing portion 72. That is, the second reinforcing portion 72 is stacked on one side of the heat conducting plate 10 and faces the second substrate 22. The second reinforcing portion 72 surrounds a portion of the second substrate 22. The second reinforcing portion 72 is spaced apart from the second substrate 22. In other embodiments, the second reinforcing portion 72 may surround the entire second substrate 22, that is, the second reinforcing portion 72 surrounds at least a portion of the second substrate 22 and is spaced apart from the second substrate 22. The second reinforcing portion 72 is used to increase the rigidity of the portion of the heat conducting plate 10 corresponding to the second substrate 22.

[0107] Specifically, the second substrate 22 is partially surrounded by the third sub-reinforcement portion 721. In the X-axis direction, the second substrate 22 and the third sub-reinforcement portion 721 are spaced apart. And in the Y-axis direction, the second substrate 22 and the third sub-reinforcement portion 721 are spaced apart. In other words, the third sub-reinforcement portion 721 of the first reinforcement portion 71 is stacked on one side of the heat conducting plate 10 and faces the second substrate 22. The third sub-reinforcement portion 721 surrounds a portion of the second substrate 22 and is spaced apart from the second substrate 22. In some other embodiments, the third sub-reinforcement portion 721 may also surround the entire second substrate 22. It can be understood that the third sub-reinforcement portion 721 surrounds at least a portion of the second substrate 22 and is spaced apart from the second substrate 22.

[0108] The second reinforcing wall 702 faces the second substrate 22. In other words, the second reinforcing wall 702 is the wall surface of the third sub-reinforcing portion 721 facing the second substrate 22, and the second reinforcing wall 702 is the wall surface of the first reinforcing portion 71 facing the second substrate 22. The second reinforcing wall 702 surrounds a portion of the second substrate 22. In the X-axis direction, the second reinforcing wall 702 is opposite to and spaced from the second substrate 22. In the Y-axis direction, the second reinforcing wall 702 is opposite to and spaced from the second substrate 22. In other embodiments, the second reinforcing wall 702 may also surround the entire second substrate 22. It will be understood that the second reinforcing wall 702 surrounds at least a portion of the second substrate 22 and is spaced from the second substrate 22.

[0109] In the Z-axis direction, the second substrate 22 is located between the heat transfer plate 10 and the fourth sub-reinforcement portion 722, and is spaced apart from the fourth sub-reinforcement portion 722. In other words, the fourth sub-reinforcement portion 722 is located on one side of the second substrate 22, facing away from the heat transfer plate 10, and is spaced apart from the second substrate 22. It is understood that both the third sub-reinforcement portion 721 and the fourth sub-reinforcement portion 722 are spaced apart from the second substrate 22.

[0110] The third sub-reinforcement portion 721 is stacked on one side of the heat conducting plate 10 and faces the second substrate 22. The third sub-reinforcement portion 721 surrounds at least a portion of the second substrate 22. The fourth sub-reinforcement portion 722 is located on one side of the second substrate 22 and faces away from the heat conducting plate 10. The design of the third sub-reinforcement portion 721 and the fourth sub-reinforcement portion 722 being spaced apart from the second substrate 22 is beneficial to improving the space utilization rate of the second reinforcement portion 72, reducing the area occupied by the second substrate 22 and the second reinforcement portion 72 on the heat conducting plate 10, facilitating the miniaturization design of the heat conducting plate 10, and facilitating the miniaturization design of the power module 100. Moreover, it is beneficial to reducing the weight of the second reinforcement portion 72, facilitating the lightweight design of the heat conducting plate 10, and facilitating the lightweight design of the power module 300.

[0111] Exemplarily, the second substrate 22 is a DBC. In some other embodiments, the second substrate 22 may also be a substrate including but not limited to AMB, IMS or PCB. The second substrate 22 includes a second insulating layer 221, a third conductive layer 222, a fourth conductive layer 223 and a second thermal conductive layer 224. In the Z-axis direction, the third conductive layer 222 and the fourth conductive layer 223 are arranged on one side of the second insulating layer 221, and the second thermal conductive layer 224 is arranged on the other side of the second insulating layer 221. In the X-axis direction, the third conductive layer 222 and the fourth conductive layer 223 are arranged in sequence and spaced apart. For details, please refer to the relevant description of the first substrate 21 and will not be repeated here. Among them, a second interconnecting member 225 is provided between the third conductive layer 222 and the fourth conductive layer 223. The second interconnecting member 225 can refer to the relevant description of the first interconnecting member 215 and will not be repeated here. The projection of the second interconnecting member 225 in the Z-axis direction is located at the second through hole 7221 (such as Figure 6 The projection of the third conductive layer 222 and the fourth conductive layer 223 in the Z-axis direction is shown. Through the second interconnecting member 225, the third conductive layer 222 and the fourth conductive layer 223 communicate with each other. The second substrate 22 includes a second mating peripheral wall 226. The second mating peripheral wall 226 is the peripheral wall of the second insulating layer 221. For details, please refer to the description of the first mating peripheral wall 216 and will not be repeated here.

[0112] The second heat-conducting layer 224 is fixedly stacked opposite to the first heat-conducting surface 11 by means including but not limited to welding or gluing. The second heat-conducting layer 224 is stacked on the heat-conducting plate 10. The second heat-conducting layer 224 is arranged on the heat-conducting plate 10. For details, please refer to the connection method between the reinforcement structure 70 and the heat-conducting plate 10, which will not be repeated here. The third conductive layer 222 and the fourth conductive layer 223 are facing away from the heat-conducting plate 10. The second insulating layer 221 is spaced apart from the third sub-reinforcement portion 721. The second mating peripheral wall 226 is opposite to and spaced apart from the second reinforcement wall 702. The second insulating layer 221 is spaced apart from the second reinforcement wall 702. For details, please refer to the relevant description of the first insulating layer 211, which will not be repeated here. In the Z-axis direction, the third conductive layer 222 and the fourth conductive layer 223 are both spaced apart from the fourth sub-reinforcement portion 722. It can be understood that the size of the second reinforcement portion 72 in the Z-axis direction is larger than the size of the second heat-conducting layer 224 in the Z-axis direction. The dimension of the reinforcement structure 70 in the Z-axis direction (ie, the first direction) is greater than the dimension of the second heat conducting layer 224 in the Z-axis direction (ie, the first direction).

[0113] In some embodiments, the connector 23 is disposed between the first substrate 21 and the second substrate 22. Specifically, the connector 23 is stacked and disposed between the first conductive layer 212 of the first substrate 21 and the third conductive layer 222 of the second substrate 22, through methods including but not limited to welding or gluing. The connector 23 is also disposed between the first conductive layer 212 of the first substrate 21 and the third conductive layer 222 of the second substrate 22. For details, please refer to the connection method between the reinforcement structure 70 and the thermal conductive plate 10, and will not be repeated here. Because the connector 23 is disposed between the first substrate 21 and the second substrate 22, the first substrate 21 and the second substrate 22 pass through the flow, which helps increase the flowable area of ​​the power module 300.

[0114] In the Z-axis direction, the projection of the connector 23 in the Y-axis direction overlaps with the projection of the first reinforcement portion 71 in the Y-axis direction and the projection of the second reinforcement portion 72 in the Y-axis direction. In other embodiments, they may not overlap. Exemplarily, the connector 23 is a bonding wire. The bonding wire is made of other conductive materials including, but not limited to, copper, aluminum, or silver. In other embodiments, the connector 23 may also be a copper clip, aluminum clip, silver clip, or other conductive device.

[0115] like Figure 4 、 Figure 6 and Figure 7 As shown, in some embodiments, the power device 30 includes a first power device 31 and a second power device 32. The first power device 31 is disposed on one side of the first substrate 21 and facing away from the heat transfer plate 10 by means including but not limited to welding or gluing. The second power device 32 is disposed on one side of the second substrate 22 and facing away from the heat transfer plate 10. The first power device 31 and the second power device 32 cooperate to connect the photovoltaic module 2000 (such as Figure 1 The output DC power is converted into AC power.

[0116] Exemplarily, the first power device 31 is a chip. In some other embodiments, the first power device 31 may also be other electronic devices including but not limited to IC (Integrated Circuit), IGBT (Insulate-Gate Bipolar Transistor), MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), diode, passive components (such as capacitors and resistors), BGA (Ball Grid Array package, ball grid array package) devices, QFN (Quad Flat Non-leaded package, square flat non-leaded package) devices, SOP (Small Outline Package, small outline package) devices or TO (Transistor Outline, transistor outline package) devices. The number of first power devices 31 can be one or more. The first power device 31 can be flip-chip mounted on the first substrate 21 or mounted upright on the first substrate 21.

[0117] The first power device 31 is disposed on one side of the first conductive layer 212 and faces away from the first insulating layer 211. The first power device 31 is stacked on one side of the first conductive layer 212 and faces away from the first insulating layer 211. For details, please refer to the relevant description of the reinforcement structure 70 and the heat conducting plate 10, and will not be repeated here. The projection of the first power device 31 in the Z-axis direction (i.e., the first direction) is located within the projection of the first through hole 7121 in the Z-axis direction (i.e., the first direction). The design of the projection of the first power device 31 in the Z-axis direction (i.e., the first direction) and being located within the projection of the first through hole 7121 in the Z-axis direction (i.e., the first direction) can avoid interference between the first power device 31 and the second sub-reinforcement portion 712 of the first reinforcement portion 71 in the Z-axis direction (i.e., the first direction), can avoid interference between the first power device 31 and the first reinforcement portion 71 in the Z-axis direction (i.e., the first direction), and can avoid reserving avoidance space between the first power device 31 and the first reinforcement portion 71 in the Z-axis direction (i.e., the first direction), which is beneficial to reducing the size of the power module 300 in the Z-axis direction (i.e., the first direction) and is beneficial to the miniaturization design of the power module 300.

[0118] Exemplarily, the second power device 32 is a chip. In other embodiments, the second power device 32 may also be other electronic devices including, but not limited to, an IC, an IGBT, a MOSFET, a diode, a passive component (such as a capacitor and a resistor), a BGA device, a QFN device, or a TO device. The number of second power devices 32 may be one or more. The second power device 32 may be flip-chip mounted on the second substrate 22 or mounted face-up on the second substrate 22.

[0119] The second power device 32 is disposed on one side of the third conductive layer 222 and faces away from the second insulating layer 221. The second power device 32 is stacked on one side of the third conductive layer 222 and faces away from the second insulating layer 221. For details, please refer to the relevant description of the reinforcement structure 70 and the heat conducting plate 10, and will not be repeated here. The projection of the second power device 32 in the Z-axis direction is located within the projection of the second through hole 7221 in the Z-axis direction. The design of the projection of the first power device 31 in the Z-axis direction is located within the projection of the second through hole 7221 in the Z-axis direction. This design can prevent interference between the second power device 32 and the fourth sub-reinforcement portion 722 of the second reinforcement portion 72 in the Z-axis direction, prevent interference between the second power device 32 and the second reinforcement portion 72 in the Z-axis direction, and reserve a clearance space between the second power device 32 and the second reinforcement portion 72 in the Z-axis direction, which helps reduce the size of the power module 300 in the Z-axis direction and facilitates the miniaturization of the power module 300.

[0120] Both the first power device 31 and the second power device 32 generate a large amount of heat during operation. The heat generated by the first power device 31 during operation can be transferred to the heat conducting plate 10 via the first conductive layer 212, the first insulating layer 211, and the first thermally conductive layer 214. The heat can then be transferred to the external environment through the thermally conductive plate 10, thereby dissipating heat for the first power device 31. The heat generated by the second power device 32 during operation can be transferred to the heat conducting plate 10 via the third conductive layer 222, the second insulating layer 221, and the second thermally conductive layer 224. The heat can then be transferred to the external environment through the thermally conductive plate 10, thereby dissipating heat for the second power device 32. During the heat dissipation process for the first and second power devices 31, 32, the thermally conductive plate 10 is susceptible to deformation due to the heat.

[0121] The design of the first reinforcing portion 71 surrounding at least a portion of the first substrate 21 ensures that the first reinforcing portion 71 can reinforce the portion of the heat conducting plate 10 surrounding the first substrate 21, thereby facilitating an increase in the rigidity of the portion of the heat conducting plate 10 corresponding to the first substrate 21, and facilitating a reduction in deformation of the portion of the heat conducting plate 10 corresponding to the first substrate 21 during heat dissipation of the power device 30 (including the first power device 31 and the second power device 32). This helps reduce the stress exerted on the first substrate 21 by the portion of the heat conducting plate 10 corresponding to the first substrate 21 due to deformation, and thus reduces the risk of cracking of the first substrate 21. This helps improve the reliability of the first substrate 21, improves the reliability of the power module 300, and extends the service life of the power module 300.

[0122] The design of the first spacing hole 713 is beneficial to reducing the weight of the first reinforcement portion 71 while ensuring that the first reinforcement portion 71 can have a good reinforcement effect on the portion corresponding to the heat conducting plate 10 and the first substrate 21, which is beneficial to reducing the weight of the heat conducting plate 10, and is beneficial to the lightweight design of the heat conducting plate 10 and the lightweight design of the power module 300.

[0123] The size of the reinforcement structure 70 in the Z-axis direction (ie, the first direction) is larger than that of the first heat conducting layer 214 (ie, Figure 8 The design of the dimensions of the heat conducting plate 10 in the Z-axis direction (i.e., the first direction) ensures that the reinforcement structure 70 can have a strong reinforcement effect on the portion corresponding to the heat conducting plate 10 and the first substrate 21, which is beneficial to reducing the deformation of the portion corresponding to the heat conducting plate 10 and the first substrate 21 during the heat dissipation process of the power device 30 (including the first power device 31 and the second power device 32), and is beneficial to reducing the stress applied to the first substrate 21 by the heat conducting plate 10 due to the deformation, which is beneficial to reducing the risk of cracking of the first substrate 21, which is beneficial to improving the reliability of the first substrate 21, which is beneficial to improving the reliability of the power module 300, and which is beneficial to extending the service life of the power module 300.

[0124] The design of the second reinforcing portion 72 surrounding at least a portion of the second substrate 22 and being spaced apart from the second substrate 22 ensures that the second reinforcing portion 72 can reinforce the portion of the heat conducting plate 10 surrounding the second substrate 22, thereby facilitating an increase in the rigidity of the portion of the heat conducting plate 10 corresponding to the second substrate 22, and facilitating a reduction in deformation of the portion of the heat conducting plate 10 corresponding to the second substrate 22 during heat dissipation of the power devices 30 (including the first power device 31 and the second power device 32). This helps reduce the stress exerted on the second substrate 22 by the portion of the heat conducting plate 10 corresponding to the second substrate 22 due to deformation, and thus reduces the risk of cracking of the second substrate 22. This helps improve the reliability of the second substrate 22, improves the reliability of the power module 300, and extends the service life of the power module 300.

[0125] The design of the second spacing hole 723 is beneficial to reducing the weight of the second reinforcement portion 72 while ensuring that the second reinforcement portion 72 can have a good reinforcement effect on the portion corresponding to the heat conducting plate 10 and the second substrate 22, which is beneficial to reducing the weight of the heat conducting plate 10, and is beneficial to the lightweight design of the heat conducting plate 10 and the lightweight design of the power module 300.

[0126] The size of the reinforcement structure 70 in the Z-axis direction (ie, the first direction) is larger than that of the second heat conducting layer 224 (ie, Figure 8 The design of the dimensions of the heat conducting plate 10 in the Z-axis direction (i.e., the first direction) ensures that the reinforcement structure 70 can have a strong reinforcement effect on the portion corresponding to the heat conducting plate 10 and the second substrate 22, which is beneficial to reducing the deformation of the portion corresponding to the heat conducting plate 10 and the second substrate 22 during the heat dissipation process of the power device 30 (including the first power device 31 and the second power device 32), and is beneficial to reducing the stress applied to the second substrate 22 by the deformation of the heat conducting plate 10, which is beneficial to reducing the risk of cracking of the second substrate 22, which is beneficial to improving the reliability of the second substrate 22, which is beneficial to improving the reliability of the power module 300, and which is beneficial to extending the service life of the power module 300.

[0127] It can be understood that the reinforcement structure 70 is used to increase the stiffness of the portion of the heat conducting plate 10 corresponding to the first substrate 21, and the stiffness of the portion of the heat conducting plate 10 corresponding to the second substrate 22. Thus, the reinforcement structure 70 is used to increase the stiffness of the portion of the heat conducting plate 10 corresponding to the substrate 20. In the power module 300 provided in this application, the heat generated by the power device 30 (including the first power device 31 and the second power device 32) during operation is transferred to the external environment through the substrate 20 (including the first substrate 21 and the second substrate 22) and the heat conducting plate 10, thereby dissipating heat from the power device 30.

[0128] Compared with the existing power module 300 in which the heat conducting plate 10 is not provided with the reinforcing structure 70, the heat conducting plate 10 is provided with a reinforcing structure 70 on the side facing the first substrate 21, and the first reinforcing wall 701 of the reinforcing structure 70 surrounds at least a portion of the first substrate 21 and is spaced apart from the first substrate 21. This design is conducive to increasing the rigidity of the portion corresponding to the heat conducting plate 10 and the first substrate 21, and is conducive to reducing the deformation of the portion corresponding to the heat conducting plate 10 and the first substrate 21 during the heat dissipation process of the power device 30 (including the first power device 31 and the second power device 32). It is conducive to reducing the stress applied to the first substrate 21 by the deformation of the heat conducting plate 10, which is conducive to reducing the risk of cracking of the first substrate 21, which is conducive to improving the reliability of the first substrate 21, which is conducive to improving the reliability of the power module 300, and which is conducive to extending the service life of the power module 300.

[0129] The design of the second reinforcing wall 702 of the reinforcing structure 70 surrounding at least a portion of the second substrate 22 and being spaced apart from the second substrate 22 is conducive to increasing the rigidity of the portion corresponding to the heat conducting plate 10 and the second substrate 22, and is conducive to reducing the deformation of the portion corresponding to the heat conducting plate 10 and the second substrate 22 during the heat dissipation process of the power device 30 (including the first power device 31 and the second power device 32), and is conducive to reducing the stress applied to the second substrate 22 by the heat conducting plate 10 due to the deformation, and is conducive to reducing the risk of cracking of the second substrate 22, and is conducive to improving the reliability of the second substrate 22, and is conducive to improving the reliability of the power module 300, and is conducive to extending the service life of the power module 300.

[0130] In some embodiments, in the Z-axis direction, the first terminal 40 is disposed on one side of the first substrate 21 and facing away from the heat transfer plate 10. Specifically, the first terminal 40 is disposed on one side of the second conductive layer 213 and facing away from the first insulating layer 211, through methods including but not limited to welding or gluing. The first terminal 40 is fixedly stacked on one side of the second conductive layer 213 and facing away from the first insulating layer 211. For details, please refer to the connection method between the reinforcement structure 70 and the heat transfer plate 10, which will not be repeated here. Exemplarily, there are multiple first terminals 40. Specifically, there are three first terminals 40. In other embodiments, the number of first terminals 40 may also be one, two, or more. The projection of the first terminal 40 in the Z-axis direction is located within the projection of the first through-hole 7121 in the Z-axis direction. The first terminal 40 is attached to the circuit board 100 on the side facing away from the first substrate 21, through methods including but not limited to welding, gluing, or plugging.

[0131] In some embodiments, in the Z-axis direction, the second terminal 50 is disposed on a side of the second substrate 22, facing away from the heat transfer plate 10. Specifically, the second terminal 50 is disposed on a side of the fourth conductive layer 224, facing away from the second insulating layer 221, through methods including but not limited to welding or gluing. The second terminal 50 is fixedly laminated on a side of the fourth conductive layer 224, facing away from the second insulating layer 221. For details, please refer to the connection method between the reinforcement structure 70 and the heat transfer plate 10, and will not be repeated here. In the X-axis direction, the second terminal 50 is disposed opposite the first terminal 40. Exemplarily, there are multiple second terminals 50. Specifically, there are three second terminals 50. In other embodiments, the number of second terminals 50 may be one, two, or more. The projection of the second terminal 50 in the Z-axis direction is located within the projection of the second through-hole 7221 in the Z-axis direction. The second terminal 50 is attached to the circuit board 100 on the side facing away from the second substrate 22, through methods including but not limited to welding, gluing, or plugging.

[0132] like Figure 1 、 Figure 4 and Figure 8As shown, direct current (DC) power transmitted from the first terminal 40 is transmitted from the first terminal 40 to the first conductive layer 212 via the second conductive layer 213 and the first interconnect 215. The DC power is then transmitted from the first conductive layer 212 to the first power device 31 and then to the second power device 31 via the connector 23 and the third conductive layer 222. By continuously switching the first power device 31 and the second power device 32, the first and second power devices 31 and 32 can convert the DC power into AC power. The AC power is then transmitted from the third conductive layer 222 to the second terminal 50 via the second interconnect 225 and the fourth conductive layer 223. From the second terminal 50, the AC power is then transmitted to the power grid 3000 via the output terminal 400, where it is supplied to the power grid 3000.

[0133] Please refer again Figure 2 、 Figure 3 and Figure 4 , exemplarily, the package 60 is made of silicone gel. In some other embodiments, the package 60 may also be made of a plastic packaging material including but not limited to epoxy resin or polyimide. The package 60 covers part of the heat conducting plate 10, the entire first substrate 21, the entire second substrate 22, all connectors 23, all first power devices 31, all second power devices 32, part of the first terminals 40, part of the second terminals 50 and all reinforcing structures 70. Among them, the second heat conducting surface 12 of the heat conducting plate 10 is exposed to the outside of the package 60, that is, the side of the heat conducting plate 10 facing away from the first substrate 21 is exposed to the outside of the package 60. The side of the first terminal 40 facing away from the first substrate 21 is exposed to the outside of the package 60, and the side of the second terminal 50 facing away from the second substrate 22 is exposed to the outside of the package 60. The power module 300 is encapsulated by the package 60. The package 60 can protect the first substrate 21, the second substrate 22, the connector 23, the first power device 31, the second power device 32 and the reinforcement structure 70, preventing the first substrate 21, the second substrate 22, the connector 23, the first power device 31, the second power device 32 and the reinforcement structure 70 from being affected by the external environment, which is beneficial to improving the reliability of the first substrate 21, the second substrate 22, the connector 23, the first power device 31, the second power device 32 and the reinforcement structure 70, and is beneficial to improving the reliability of the power module 300.

[0134] See also Figure 9 、 Figure 10 and Figure 11 , and combined with Figure 4 , Figure 9 yes Figure 4 FIG. 1 is a schematic diagram of the three-dimensional structure of a power module 300 according to another embodiment. Figure 10 yes Figure 9 The structure of the power module 300 shown is shown in another angle. Figure 11 yes Figure 10 The structure diagram of the power module 300 shown is a cross-section diagram along line CC.

[0135] like Figure 9 、 Figure 10 and Figure 11 As shown, in some other embodiments, the first reinforcing portion 71 and the second reinforcing portion 72 may also be spaced apart. That is, in the X-axis direction, the second reinforcing portion 72 is located on one side of the first reinforcing portion 71 and is spaced apart from the first reinforcing portion 71. The first reinforcing portion 71 surrounds the entire first substrate 21 and is spaced apart from the first substrate 21. Specifically, the first sub-reinforcing portion 711 of the first reinforcing portion 71 surrounds the entire first substrate 21 and is spaced apart from the first substrate 21. The first reinforcing wall 701 of the first reinforcing portion 71 surrounds the entire first substrate 21 and is spaced apart from the first substrate 21. In the Z-axis direction, the second sub-reinforcing portion 712 is located on one side of the first substrate 21 and faces away from the heat transfer plate 10, and the second sub-reinforcing portion 712 is spaced apart from the first substrate 21. The second sub-reinforcing portion 712 is provided with a first through hole 7121. The projection of the first interconnecting member 215 in the Z-axis direction, the projection of the first power device 31 in the Z-axis direction, and the projection of the first terminal 40 in the Z-axis direction are located within the projection of the first through hole 7121 in the Z-axis direction. For details, please refer to Figure 4 The first reinforcement portion 71 is not provided with a first separation hole 713 (such as Figure 4 As shown), the first separation hole 713 can be omitted.

[0136] The second reinforcing portion 72 surrounds the entire second substrate 22 and is spaced apart from the second substrate 22. Specifically, the third sub-reinforcing portion 721 of the second reinforcing portion 72 surrounds the entire second substrate 22 and is spaced apart from the second substrate 22. The second reinforcing wall 702 of the second reinforcing portion 72 surrounds the entire second substrate 22 and is spaced apart from the second substrate 22. In the Z-axis direction, the fourth sub-reinforcing portion 722 is located on one side of the second substrate 22 and faces away from the heat transfer plate 10, and the fourth sub-reinforcing portion 722 is spaced apart from the second substrate 22. The fourth sub-reinforcing portion 722 is provided with a second through hole 7221. The projection of the second interconnecting member 225 in the Z-axis direction, the projection of the second power device 32 in the Z-axis direction, and the projection of the second terminal 50 in the Z-axis direction are located within the projection of the second through hole 7221 in the Z-axis direction. For details, please refer to Figure 4 The second reinforcement portion 72 is not provided with a second separation hole 723 (such as Figure 4(as shown), that is, the second partition hole 723 can be omitted. The connector 23 is disposed between the first substrate 21 and the second substrate 22. In the Z-axis direction, the connector 23 is located on one side of the reinforcement structure 70, facing away from the heat transfer plate 10, and is spaced apart from the reinforcement structure 70. It will be appreciated that the reinforcement structure 70 can be configured in a variety of ways. The design of the reinforcement structure 70 is low-cost, which helps reduce the processing cost of the heat transfer plate 10 and the power module 300.

[0137] See also Figure 12 and Figure 13 , and combined with Figure 4 , Figure 12 yes Figure 4 FIG. 1 is a schematic diagram of the three-dimensional structure of a power module 300 according to another embodiment. Figure 13 yes Figure 12 FIG. 1 is a partial three-dimensional structural diagram of the heat conducting plate 10 of the power module 300 .

[0138] In other embodiments, the number of first sub-partitioning holes 713a may be multiple. Specifically, the number of first sub-partitioning holes 713a is 2. In other embodiments, the number of first sub-partitioning holes 713a may be 3, 4, or more. The multiple first sub-partitioning holes 713a are spaced apart along the X-axis direction.

[0139] In yet other embodiments, the number of the second sub-partition holes 713b, the third sub-partition holes 713c, the fourth sub-partition holes 713d, the fifth sub-partition holes 723a, the sixth sub-partition holes 723b, the seventh sub-partition holes 723c, and the eighth sub-partition holes 723d may also be 2, 3, or more. The plurality of second sub-partition holes 713b are spaced apart along the X-axis. The plurality of third sub-partition holes 713a are spaced apart along the Y-axis. The plurality of fourth sub-partition holes 713d are spaced apart along the Y-axis. The plurality of fifth sub-partition holes 723a are spaced apart along the X-axis. The plurality of sixth sub-partition holes 723b are spaced apart along the X-axis. The plurality of seventh sub-partition holes 723c are spaced apart along the Y-axis. The plurality of eighth sub-partition holes 723d are spaced apart along the Y-axis. The first partition holes 713 and the second partition holes 723 can be arranged in various ways. The design cost of the first partition holes 713 and the second partition holes 723 is low, and the design cost of the reinforcement structure 70 is low, which is beneficial to reducing the processing cost of the heat conducting plate 10 and the processing cost of the power module 300.

[0140] See also Figure 14 、 Figure 15 、 Figure 16 、 Figure 17 and Figure 18 , and combined with Figure 3 and Figure 5 , Figure 14 yes Figure 2 The power module 300 shown is a schematic structural diagram of another embodiment cut along line AA. Figure 15 yes Figure 14 The power module 300 shown in the figure omits the packaging component 60 and the cover plate 80 . Figure 16 yes Figure 15 The structure of the power module 300 shown is shown in another angle. Figure 17 yes Figure 16 The structure diagram of the power module 300 shown is cut along line DD. Figure 18 yes Figure 16 The power module 300 shown is a partial structural diagram of a section along line EE omitting the substrate 20 .

[0141] like Figure 3 、 Figure 14 and Figure 15 In some other embodiments, the package 60 may also be made of a plastic packaging material including but not limited to epoxy resin or polyimide. The power module 300 also includes a cover plate 80. The cover plate 80 is located on the side of the substrate 20 facing away from the heat conducting plate 10. The cover plate 80 is located on the side of the first substrate 21 facing away from the heat conducting plate 10, and is located on the side of the second substrate 22 facing away from the heat conducting plate 10. The cover plate 80 is sleeved on the outside of the first terminal 40 and the second terminal 50. Specifically, the cover plate 80 is sleeved on the outside of multiple first terminals 40 and the outside of multiple second terminals 50. In the Z-axis direction, the distance between the cover plate 80 and the substrate 20 is smaller than the size of the first terminal 40 in the Z-axis direction and the size of the second terminal 50 in the Z-axis direction. The cover plate 80 is spaced apart from the substrate 20. The cover plate 80 is partially embedded in the package 60. In other words, the package 60 covers a portion of the cover plate 80. The side of the cover plate 80 facing away from the first substrate 21 is exposed to the outside of the package 60 , and the side of the cover plate 80 facing away from the second substrate 22 is exposed to the outside of the package 60 .

[0142] The design of the cover 80 ensures that after the package 60 encapsulates the power module 300, the side of the first terminal 40 facing away from the first substrate 21 and the side of the second terminal 50 facing away from the second substrate 22 are exposed to the outside of the package 60. The cover 80 plays a limiting role, which is beneficial to reducing the difficulty of encapsulating the power module 300 with the package 60, reducing the cost of encapsulating the power module 300 with the package 60, and reducing the processing cost of the power module 300.

[0143] like Figure 15 、 Figure 16 and Figure 17As shown, in this embodiment, the first reinforcement portion 71 only includes the first sub-reinforcement portion 711, i.e., the second sub-reinforcement portion 712 is omitted. The first reinforcement portion 71 surrounds a portion of the first substrate 21 and is spaced apart from the first substrate 21. The first reinforcement wall 701 of the first reinforcement portion 71 surrounds a portion of the first substrate 21 and is spaced apart from the first substrate 21. It can be understood that the first reinforcement wall 701 is the wall surface of the first reinforcement portion 71 facing the first substrate 21. The first reinforcement portion 71 is provided with a first partition hole 713. Specifically, the first sub-partition hole 713 includes a third sub-partition hole 713c and a fourth sub-partition hole 713d. In other words, the first reinforcement portion 71 is provided with the third sub-partition hole 713c and the fourth sub-partition hole 713d. The third sub-partition hole 713c extends through the third section 7113 of the first sub-reinforcement portion 711 along the Z-axis direction. The third sub-partition hole 713c also extends through the third section 7113 along the X-axis direction. The fourth sub-partition hole 713d passes through the fourth section 7114 of the first sub-reinforcement part 711 along the Z-axis direction. The fourth sub-partition hole 713d passes through the fourth section 7114 along the X-axis direction. Figure 5 As shown) and the second sub-partition hole 713b, that is, the first sub-partition hole 713a and the second sub-partition hole 713b can be omitted.

[0144] The second reinforcement portion 72 includes only the third sub-reinforcement portion 721, i.e., the fourth sub-reinforcement portion 722 is omitted. In the X-axis direction, the second reinforcement portion 72 is located on one side of the first reinforcement portion 71 and is fixedly stacked with the first reinforcement portion 71. Specifically, the second reinforcement portion 72 is located on one side of the fourth section 7114 and faces away from the third section 7113. The seventh section 7213 of the second reinforcement portion 72 is fixedly stacked with the fourth section 7114. In the X-axis direction, the eighth section 7214 faces away from the fourth section 7114. In other embodiments, the seventh section 7213 and the fourth section 7114 may be spaced apart, i.e., the second reinforcement portion 72 and the first reinforcement portion 71 may be spaced apart. The second reinforcement portion 72 surrounds a portion of the second substrate 22 and is spaced apart from the second substrate 22. The second reinforcement wall 702 of the second reinforcement portion 72 surrounds a portion of the second substrate 22 and is spaced apart from the second substrate 22. It can be understood that the second reinforcement wall 702 is the wall surface of the second reinforcement portion 72 facing the second substrate 22.

[0145] The second reinforcement portion 72 is provided with a second partition hole 723. Specifically, the second partition hole 723 includes a seventh sub-partition hole 723c and an eighth sub-partition hole 723d. In other words, the second reinforcement portion 72 is provided with a seventh sub-partition hole 723c and an eighth sub-partition hole 723d. The seventh sub-partition hole 723c penetrates the seventh section 7213 of the third sub-reinforcement portion 721 along the Z-axis direction. And the seventh sub-partition hole 723c penetrates the seventh section 7213 along the X-axis direction. The eighth sub-partition hole 723d penetrates the eighth section 7214 of the third sub-reinforcement portion 721 along the Z-axis direction. And the eighth sub-partition hole 723d penetrates the eighth section 7214 along the X-axis direction. The seventh sub-partition hole 723c is connected to the fourth sub-partition hole 713d. Among them, the second reinforcement portion 72 is not provided with a fifth sub-partition hole 723a (such as Figure 5 As shown) and the sixth sub-partition hole 723b, that is, the fifth sub-partition hole 723a and the sixth sub-partition hole 723b can be omitted.

[0146] like Figure 15 、 Figure 16 and Figure 18 As shown, in this embodiment, the cross-sectional shape of the first reinforcement portion 71 and the cross-sectional shape of the second reinforcement portion 72 are both rectangular. In other embodiments, the cross-sectional shape of the first reinforcement portion 71 and the cross-sectional shape of the second reinforcement portion 72 may also be circular, triangular or other special shapes. It should be noted that the cross-sectional shape of the first reinforcement portion 71 refers to the shape after the first reinforcement portion 71 is cut along a direction perpendicular to its extension direction. The cross-sectional shape of the second reinforcement portion 72 refers to the shape after the second reinforcement portion 72 is cut along a direction perpendicular to its extension direction. It can be understood that the structures of the first reinforcement portion 71 and the second reinforcement portion 72 are various, the structures of the reinforcement structure 70 are various, and the design cost of the reinforcement structure 70 is low, which is conducive to reducing the processing cost of the heat conducting plate 10 and the processing cost of the power module 300.

[0147] See also Figure 19 、 Figure 20 、 Figure 21 、 Figure 22 、 Figure 23 and Figure 24 , and combined with Figure 15 , Figure 19 yes Figure 18 FIG. 1 is a schematic structural diagram of a power module 300 according to another embodiment. Figure 20 yes Figure 18 FIG. 1 is a schematic structural diagram of a power module 300 according to another embodiment. Figure 21 yes Figure 18 FIG. 1 is a schematic structural diagram of a power module 300 according to another embodiment. Figure 22 yes Figure 18 FIG. 1 is a schematic structural diagram of a power module 300 according to another embodiment. Figure 23 yes Figure 18 FIG. 1 is a schematic structural diagram of a power module 300 according to another embodiment. Figure 24 yes Figure 18 FIG. 1 is a schematic structural diagram of a power module 300 according to another embodiment.

[0148] like Figure 15 、 Figure 19 、 Figure 20 、 Figure 21 、 Figure 22 and Figure 23 As shown, in some other embodiments, the cross-sectional shape of the first reinforcement portion 71 and the cross-sectional shape of the second reinforcement portion 72 may also be an I-shaped (eg, Figure 19 As shown), "T" shape (as shown Figure 20 As shown), "L" shape (as Figure 21 As shown), trapezoidal (as Figure 22 As shown), triangle (as Figure 23 shown) or other special shapes.

[0149] like Figure 15 and Figure 24 As shown, in other embodiments, the outer surfaces of the first reinforcement portion 71 and the second reinforcement portion 72 may also be roughened. For example, the outer contour of the first reinforcement portion 71 and the outer contour of the second reinforcement portion 72 may be wavy. The structures of the first reinforcement portion 71 and the second reinforcement portion 72 are various, and the structures of the reinforcement structure 70 are various. The design cost of the reinforcement structure 70 is low, which helps reduce the processing cost of the heat conducting plate 10 and the processing cost of the power module 300.

[0150] See also Figure 25 and Figure 26 , and combined with Figure 4 , Figure 25 yes Figure 2 The power module 300 shown is a schematic diagram of a three-dimensional structure in another embodiment in which the packaging component 60 is omitted. Figure 26 yes Figure 25 The power module 300 is shown as a partial structural schematic diagram at another angle.

[0151] In some other embodiments, the reinforcement structure 70 is disposed on one side of the heat conducting plate 10 and faces the substrate 20. The substrate 20 is housed in the reinforcement structure 70. The reinforcement structure 70 includes a first reinforcement wall 701 and a second reinforcement wall 702. The first reinforcement wall 701 surrounds the entire first substrate 21 and is spaced apart from the first substrate 21. The second reinforcement wall 702 surrounds the entire second substrate 22 and is spaced apart from the second substrate 22. Specifically, the reinforcement structure 70 includes a first groove 73 and a second groove 74. The first groove 73 extends from the first heat conducting surface 11 along the Z-axis. The first reinforcement wall 701 is a peripheral wall of the first groove 73. In the X-axis direction (i.e., the second direction), the second groove 74 is located on one side of the first groove 73. The second groove 74 extends from the first heat conducting surface 11 along the Z-axis direction. The second groove 74 is spaced apart from the first groove 73. The second reinforcement wall 702 is a peripheral wall of the second groove 74. The second reinforcement wall 702 is spaced apart from the first reinforcement wall 701. Exemplarily, the first groove 73 and the second groove 74 are both rectangular grooves. In other embodiments, the first groove 73 and the second groove 74 can also be circular grooves, triangular grooves or other special-shaped grooves.

[0152] The first substrate 21 of the substrate 20 is received in the first groove 73 and spaced apart from the peripheral wall of the first groove 73 (i.e., the first reinforcing wall 701). Specifically, the first mating peripheral wall 216 of the first substrate 21 (i.e., the peripheral wall of the first insulating layer 211) faces and is spaced apart from the peripheral wall of the first groove 73 (i.e., the first reinforcing wall 701). The first insulating layer 211 is spaced apart from the first reinforcing wall 701. The design of the first groove 73 prevents stress concentration in the portion of the heat conducting plate 10 corresponding to the first substrate 21, thereby improving the rigidity of the portion corresponding to the heat conducting plate 10 and the first substrate 21. This helps reduce deformation of the portion corresponding to the heat conducting plate 10 and the first substrate 21 during heat dissipation of the power devices 30 (including the first power device 31 and the second power device 32). This helps reduce stress applied to the first substrate 21 by deformation of the portion corresponding to the heat conducting plate 10 and the first substrate 21, thereby reducing the risk of cracking of the first substrate 21 and improving the reliability of the first substrate 21, thereby improving the reliability of the power module 300 and extending the service life of the power module 300. Furthermore, this design not only improves the space utilization of the heat conducting plate 10 and reduces the space occupied by the heat conducting plate 10 and the first substrate 21 in the Z-axis direction (i.e., the first direction), but also facilitates the miniaturization of the power module 300. Furthermore, the design is simple, easy to design, and has low processing costs.

[0153] The second substrate 22 of the substrate 20 is received in the second groove 74 and spaced apart from the peripheral wall of the second groove 74 (i.e., the second reinforcing wall 702). Specifically, the second mating peripheral wall 226 of the second substrate 22 (i.e., the peripheral wall of the second insulating layer 221) opposes and is spaced apart from the peripheral wall of the second groove 74 (i.e., the second reinforcing wall 702). The second insulating layer 221 is spaced apart from the second reinforcing wall 702. The design of the second groove 74 prevents stress concentration in the portion of the heat conducting plate 10 corresponding to the second substrate 22, thereby improving the rigidity of the portion corresponding to the heat conducting plate 10 and the second substrate 22. This helps reduce deformation of the portion corresponding to the heat conducting plate 10 and the second substrate 22 during heat dissipation of the power devices 30 (including the first power device 31 and the second power device 32). This reduces stress applied to the second substrate 22 by deformation of the portion corresponding to the heat conducting plate 10 and the second substrate 22, thereby reducing the risk of cracking of the second substrate 22 and improving the reliability of the second substrate 22, thereby improving the reliability of the power module 300 and extending the service life of the power module 300. Furthermore, this design not only improves the space utilization of the heat conducting plate 10 and reduces the space occupied by the heat conducting plate 10 and the second substrate 22 in the Z-axis direction (i.e., the first direction), but also facilitates the miniaturization of the power module 300. Furthermore, the design also simplifies the structure, facilitates design, and reduces manufacturing costs. In other embodiments, the second groove 74 can also communicate with the first groove 73. The second reinforcing wall 702 may also be connected to the first reinforcing wall 701 . The first reinforcing wall 701 and the second reinforcing wall 702 together surround the entire first substrate 21 and the entire second substrate 22 .

[0154] Please refer again Figure 4 、 Figure 7 、 Figure 9 、 Figure 11 、 Figure 12 、 Figure 15 、 Figure 16 、 Figure 25 and Figure 26 , an embodiment of the present application provides a power module 300. The power module 300 includes a heat conducting plate 10, a first substrate 21, and a first power device 31. In the Z-axis direction (i.e., the first direction), the first substrate 21 is disposed on one side of the heat conducting plate 10. The first power device 31 is disposed on one side of the first substrate 21 and faces away from the heat conducting plate 10. A reinforcement structure 70 is provided on the side of the heat conducting plate 10 facing the first substrate 21. The reinforcement structure 70 includes a first reinforcement wall 701. The first reinforcement wall 701 surrounds at least a portion of the first substrate 21 and is spaced apart from the first substrate 21.

[0155] In the power module 300 provided in the present application, heat generated by the first power device 31 during operation is transferred to the external environment via the first substrate 21 and the heat conducting plate 10, thereby dissipating heat for the first power device 31. Compared to the existing power module 300 in which the heat conducting plate 10 is not provided with a reinforcing structure 70, the heat conducting plate 10 is provided with a reinforcing structure 70 on the side facing the first substrate 21, and the first reinforcing wall 701 of the reinforcing structure 70 surrounds at least a portion of the first substrate 21 and is spaced apart from the first substrate 21. This design helps to increase the rigidity of the portion of the heat conducting plate 10 corresponding to the first substrate 21, helps to reduce deformation of the portion of the heat conducting plate 10 corresponding to the first substrate 21 during heat dissipation for the first power device 31, helps to reduce stress applied to the first substrate 21 by deformation of the heat conducting plate 10, helps to reduce the risk of cracking of the first substrate 21, helps to improve the reliability of the first substrate 21, helps to improve the reliability of the power module 300, and helps to extend the service life of the power module 300.

Claims

1. A power module, characterized in that: The power module includes: heat conducting plate; a first substrate, disposed on one side of the heat conducting plate in a first direction; and a first power device, the first power device being disposed on one side of the first substrate and facing away from the heat conducting plate; A reinforcement structure is provided on a side of the heat conducting plate facing the first substrate. The reinforcement structure includes a first reinforcement wall. The first reinforcement wall surrounds at least a portion of the first substrate and is spaced apart from the first substrate.

2. The power module according to claim 1, characterized in that: The first substrate includes a first insulating layer, a first conductive layer and a first thermal conductive layer. In the first direction, the first conductive layer and the first thermal conductive layer are arranged on opposite sides of the first insulating layer. The first thermal conductive layer is arranged on the thermal conductive plate, and the first conductive layer faces away from the thermal conductive plate. The first power device is arranged on one side of the first conductive layer and faces away from the first insulating layer. The first insulating layer and the first reinforcing wall are spaced apart.

3. The power module according to claim 2, characterized in that: A size of the reinforcement structure in the first direction is greater than a size of the first heat conducting layer in the first direction.

4. The power module according to claim 1, wherein: The power module includes a package, which covers a portion of the heat conducting plate, the entire first substrate, the entire first power device, and the entire reinforcement structure. The side of the heat conducting plate facing away from the first substrate is exposed to the outside of the package.

5. The power module according to any one of claims 1 to 4, characterized in that: The reinforcement structure includes a first reinforcement portion, which is stacked on one side of the heat conduction plate and faces the first substrate. The first reinforcement portion surrounds at least a portion of the first substrate and is spaced apart from the first substrate. The first reinforcement wall is the wall surface of the first reinforcement portion facing the first substrate.

6. The power module according to claim 5, characterized in that: The first reinforcing portion includes a first sub-reinforcing portion and a second sub-reinforcing portion. In the first direction, the second sub-reinforcing portion is arranged on one side of the first sub-reinforcing portion. The first sub-reinforcing portion is stacked on one side of the heat conduction plate and faces the first substrate. The first sub-reinforcing portion surrounds at least a portion of the first substrate. The second sub-reinforcing portion is located on one side of the first substrate and faces away from the heat conduction plate. The first sub-reinforcing portion and the second sub-reinforcing portion are both spaced apart from the first substrate. The first reinforcing wall is the wall surface of the first sub-reinforcing portion facing the first substrate.

7. The power module according to claim 6, characterized in that: The second sub-reinforcement portion is provided with a first through hole, which penetrates the second sub-reinforcement portion along the first direction, and the projection of the first power device in the first direction is located within the projection of the first through hole in the first direction.

8. The power module according to claim 5, characterized in that: The first reinforcement portion is provided with a first spacing hole, which penetrates the first reinforcement portion along the first direction and penetrates the first reinforcement portion along its extension direction. The extension direction of the first spacing hole is perpendicular to the first direction and the extension direction of the first reinforcement portion.

9. The power module according to claim 5, characterized in that: The power module includes a second substrate and a connecting member. The second substrate is arranged on one side of the heat conducting plate and faces the first substrate. In the second direction, the second substrate is located on one side of the first substrate and is spaced apart from the first substrate. The connecting member is arranged between the first and second substrates. The second direction is perpendicular to the first direction. The reinforcement structure includes a second reinforcement portion, wherein the second reinforcement portion is located on one side of the first reinforcement portion in the second direction, the second reinforcement portion is stacked on one side of the heat conducting plate and faces the second substrate, the second reinforcement portion surrounds at least a portion of the second substrate and is spaced apart from the second substrate, wherein the second reinforcement portion is fixedly stacked with the first reinforcement portion; Alternatively, the second reinforcement portion is spaced apart from the first reinforcement portion.

10. The power module according to claim 9, characterized in that: The second reinforcement portion is provided with a second spacing hole, which penetrates the second reinforcement portion along the first direction and penetrates the second reinforcement portion along its extension direction. The extension direction of the second spacing hole is perpendicular to the first direction and the extension direction of the second reinforcement portion.

11. The power module according to any one of claims 1 to 4, characterized in that: The reinforcement structure includes a first groove, which is recessed on one side of the heat conducting plate and faces the first substrate. The first substrate is accommodated in the first groove and spaced apart from the peripheral wall of the first groove. The first reinforcement wall is the peripheral wall of the first groove.

12. The power module according to claim 11, characterized in that: The reinforcing structure includes a second groove, the second groove is recessed on one side of the heat conducting plate and faces the first substrate, and in a second direction, the second groove is located on one side of the first groove, and the second direction is perpendicular to the first direction; The power module includes a second substrate and a connecting member. The second substrate is received in the second groove and is spaced apart from the peripheral wall of the second groove. The connecting member is arranged between the first substrate and the second substrate. Wherein, the second groove is spaced apart from the first groove; Alternatively, the second groove is communicated with the first groove.

13. A power conversion device, characterized in that: The power conversion device includes a circuit board and the power module according to any one of claims 1 to 12, and the power module is assembled on the circuit board.

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