Electronic wire and flat wire connection method, connection system and new energy inverter

Abstract

The invention discloses an electronic wire and flat wire connection method, a connection system and a new energy inverter, and belongs to the technical field of new energy inverter manufacturing. According to the core of the method, a biform conductive terminal is adopted to replace traditional copper wire binding, and accurate crimping is realized through a connecting die under the regulation and control of a control unit. The system comprises a connecting mold, a pressure executing mechanism and a visual positioning module. The new energy inverter uses the connection structure to improve heat dissipation and reliability. According to the invention, the manual operation time is shortened from 60 seconds to 10 seconds, the efficiency is improved by 84%, the crimping resistance is reduced by 40%, the anti-vibration performance is enhanced, and the method is suitable for an automatic production line.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy inverter manufacturing, and in particular to a method for connecting an electronic wire and a flat wire, a connection system, and a new energy inverter. Background Art

[0002] like Figure 1 As shown, in the field of new energy inverter manufacturing, the reliable connection between the electronic wire end 1 and the flat wire end 2 is the key link to ensure the long-term stable operation of the equipment.

[0003] The traditional process of manually bundling copper wires suffers from significant technical flaws: First, manually bundling a single joint takes up to 60 seconds, making labor costs prohibitively high in mass production. Second, uneven pressure distribution across the bundling contact surface results in high contact resistance dispersion, which can easily lead to localized overheating under high-current conditions. Third, insufficient mechanical strength poses a risk of fracture at the joints due to equipment vibration. These process flaws directly limit the reliability and production efficiency of inverter products. Furthermore, existing connection systems generally lack precise pressure control and temperature management, making it difficult to achieve a stable plastic deformation connection. Summary of the Invention

[0004] The present invention provides a method for connecting electronic wires and flat wires, a connection system, and a new energy inverter, which can solve the problems of the prior art of manual copper wire bundling, such as long time consumption, low efficiency, high contact resistance, poor mechanical strength of the bundling points, and easy loosening in a vibrating environment.

[0005] To achieve the above objectives, the technical solutions adopted by the present invention are as follows:

[0006] A method for connecting an electronic wire and a flat wire comprises the following steps:

[0007] S1. Peel the ends of the electronic wire to expose the conductor, and remove the insulation layer from the ends of the flat wire;

[0008] S2. Lay the bottom of the two-shaped conductive terminal on the surface of the flat wire conductor, with the wings on both sides covering the exposed conductor of the electronic wire;

[0009] S3. The control unit controls the upper and lower mold assemblies of the connection mold to align, and the pressure actuator applies 5-10 MPa pressure to squeeze the two-shaped conductive terminals, so that the electronic wire and the flat wire form a mechanical and electrical connection;

[0010] S4. The controller synchronously triggers the pressure to maintain for 0.5-2 seconds and monitors the pressure curve. After the connection is completed, the mold is automatically opened.

[0011] As a further solution of the present invention: the material of the two-shaped conductive terminal is tin-plated copper with a thickness of 1.5±0.05 mm, and the inner wall of the wing is provided with anti-slip lines.

[0012] As a further solution of the present invention: The present invention also proposes a system for connecting an electronic wire and a flat wire, which is used to implement the above-mentioned method for connecting an electronic wire and a flat wire. The connection system includes:

[0013] A connection die, comprising a lower die set with a positioning groove and an upper die set with a punch head, wherein the shape of the positioning groove matches the second-shaped conductive terminal;

[0014] A pressure actuator, wherein the hydraulic cylinder of the pressure actuator drives the upper die set to move vertically through a connecting rod;

[0015] The control unit is connected to the pressure sensor and the displacement sensor to adjust the pressure and stroke in real time.

[0016] As a further solution of the present invention: the upper mold assembly includes an upper mold plate fixedly connected to the connecting rod, a heating block fixed to the bottom of the upper mold plate, a floating pressure block elastically connected to the heating block through a spring, and a punching head fixedly connected to the bottom of the floating pressure block, the displacement sensor is installed on the side wall of the punching head, and the laser probe points to the positioning reference surface of the lower mold.

[0017] As a further solution of the present invention: the gap between the floating pressure block and the heating block is 1-2 mm, and the floating stroke is controlled by a limit pin.

[0018] As a further solution of the present invention: the bottom of the punch head is provided with an arc-shaped pressing surface matching the contour of the two-shaped conductive terminal, the pressure sensor is embedded in the punch head, and the detection surface is flush with the arc-shaped pressing surface.

[0019] As a further solution of the present invention: a limiting groove matching the cross section of the flat wire is opened on the top of the lower template of the lower die assembly, and the limiting groove is connected to the positioning groove.

[0020] As a further solution of the present invention: the control unit includes a PLC controller and a HMI human-machine interface, and the PLC controller pre-stores a pressure-time control program.

[0021] As a further solution of the present invention: it also includes a visual positioning module, which includes a pure camera and an image processor. The pure camera is fixed directly above the lower template, and the optical axis is perpendicular to the positioning groove.

[0022] As a further solution of the present invention: The present invention also proposes a new energy inverter, wherein the internal power module of the new energy inverter adopts a combination of electronic wires and flat wires connected by the electronic wire and flat wire connection method, wherein the flat wire serves as a DC bus and the electronic wire serves as a signal acquisition line.

[0023] Beneficial effects of the present invention:

[0024] (1) The present invention uses two-shaped conductive terminals to replace traditional copper wire bundling, and achieves precise crimping through the connection mold under the control of the control unit. The present invention shortens the manual operation time from 60 seconds to 10 seconds, improves efficiency by 84%, and reduces the crimping resistance by 40%, making it suitable for automated production lines;

[0025] (2) The present invention achieves controllable plastic deformation through mold pressing, significantly improving the contact area and bonding strength. Existing processes cannot accurately control the loading pressure and holding time. The present invention uses a closed-loop control system to achieve precise control of process parameters. Traditional connection points rely solely on friction to maintain mechanical fixation. This solution forms an interlocking structure through metal plastic flow, enhancing vibration resistance.

[0026] (3) The two-shaped conductive terminal of the present invention forms a stable interface through tin plating, which effectively reduces the contact resistance fluctuation caused by oxidation of the connection interface, eliminates the local deformation caused by insufficient material strength during the crimping process, prevents the relative displacement between conductors under vibration environment, and realizes stable and reliable electrical connection and mechanical fixation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below with reference to the accompanying drawings.

[0028] Figure 1 This is a schematic diagram of the combined structure of electronic wire ends and flat wire ends connected by manual copper wire bundling.

[0029] Figure 2 This is a structural diagram of an electronic wire and flat wire connection system of the present invention;

[0030] Figure 3 1. It is a schematic top view of the lower module structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the structure of the two-shaped conductive terminal of the present invention;

[0032] Figure 5 This is a logic block diagram of an electronic wire and flat wire connection system of the present invention;

[0033] Figure 6 The present invention is a schematic diagram of the combined structure of an electronic wire end and a flat wire end connected by the connection method of the present invention.

[0034] In the figure: 1. Electronic wire end; 2. Flat wire end; 3. Two-shaped conductive terminal; 301. Anti-slip pattern; 4. Connecting mold; 401. Upper mold plate; 402. Heating block; 403. Spring; 404. Floating pressure block; 405. Punching head; 406. Limit pin; 407. Lower mold plate; 408. Limit groove; 409. Positioning groove; 5. Pressure actuator; 501. Hydraulic cylinder; 502. Connecting rod; 6. Displacement sensor; 7. Control box; 8. Pure camera; 9. Pressure sensor. DETAILED DESCRIPTION

[0035] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", "front", "back", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, and a specific direction structure and operation. Therefore, they cannot be understood as limiting the present invention.

[0037] In addition, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0038] In existing technologies, the process of connecting electronic wires to flat wires is generally manual, resulting in low efficiency, large fluctuations in contact resistance, and insufficient mechanical connection reliability. Traditional methods rely on operator experience to bundle cables, resulting in poor connection quality consistency and difficulty meeting the needs of large-scale production. In the manufacturing process of new energy inverters, the cable connections within the power module must withstand the dual test of high current loads and mechanical vibration. Traditional processes cannot achieve stable interface bonding strength and conductive properties.

[0039] To address these issues, researchers discovered that manual operation made it difficult to precisely control the pressure distribution on the contact surface, resulting in an insufficient number of microscopic contact points. By analyzing the mechanism of plastic deformation, they realized that metal materials can form a metallurgical bond under specific pressure. Based on this, they proposed using preformed conductive terminals as the connecting medium, enabling automated processing through die pressing. To address the issue of pressure control accuracy, a closed-loop control system was introduced to monitor pressure parameters in real time to ensure the stability of the plastic deformation process.

[0040] Therefore, the present application proposes a method for connecting electronic wires and flat wires, including the following steps: peeling the electronic wire end 1 to expose the conductor, and removing the insulation layer of the flat wire end 2; fitting the bottom of the two-shaped conductive terminal 3 to the surface of the flat wire conductor, and the wings on both sides cover the exposed conductor of the electronic wire; controlling the upper and lower mold groups of the connection mold 4 to align, and the pressure actuator 5 applies pressure to squeeze the two-shaped conductive terminal 3; controlling the pressure actuator 5 to synchronously trigger the pressure maintenance and monitor the pressure curve, and automatically opening the mold after the connection is completed.

[0041] Among them, stripping and exposing the conductor refers to removing the insulation layer of the electronic wire end 1 to expose the conductive material. This can be achieved by mechanical cutting or laser ablation to ensure that the surface cleanliness of the conductor meets the connection requirements. The two-shaped conductive terminal 3 refers to a metal connector with a bottom plane and double-sided wings. Its cross-sectional shape matches the cable size and is prepared by a stamping process. Pressure maintenance means that the pressure actuator 5 maintains a constant load state after reaching the set pressure value, and achieves stable pressure output through a hydraulic system or servo motor. Pressure curve monitoring refers to the collection of waveform data of pressure changes over time, using a pressure sensor 9 and a data acquisition module to build a real-time feedback system.

[0042] Specifically, the conductor surface treatment eliminates the residual insulating material and provides a clean contact interface for subsequent connection. The bottom of the two-shaped conductive terminal 3 is fitted with the flat wire conductor to form a surface contact, and the double-sided wings wrap the electronic wire conductor to establish a three-dimensional constraint structure. During the mold closing process, the punch head 405 applies vertical pressure to the two-shaped conductive terminal 3, causing the wings to produce plastic deformation and tightly wrap the cable conductor, such as Figure 6 During the pressure-holding phase, continuous loading promotes metal lattice reorganization, forming a stable metallurgical bonding interface. Pressure curve monitoring identifies abnormal pressure fluctuations, allowing timely adjustment of loading parameters to ensure consistent joint quality.

[0043] Compared to existing technologies, traditional manual bundling relies on the elastic deformation of the wire itself to generate contact pressure. This solution, however, achieves controlled plastic deformation through die pressing, significantly increasing contact area and bond strength. Existing processes cannot precisely control loading pressure and hold time. This solution utilizes a closed-loop control system to precisely control process parameters. Traditional connection points rely solely on friction to maintain mechanical fixation. This solution utilizes plastic flow of metal to form an interlocking structure, enhancing vibration resistance.

[0044] Through the above technical solution, this application achieves automated processing of connecting electronic wires and flat wires, eliminating quality fluctuations caused by manual operation. Plastic deformation of the metal forms a stable contact interface, reducing contact resistance and increasing current-carrying capacity. The three-dimensional constraint structure enhances the tensile strength and vibration resistance of the connection points, meeting the requirements of long-term use under harsh working conditions. Closed-loop pressure control ensures consistent deformation at each connection point, effectively improving product qualification rates.

[0045] The present application further proposes that the material of the second-shaped conductive terminal 3 is tin-plated copper with a thickness of 1.5±0.05 mm, and the inner wall of the wing is provided with anti-slip lines 301.

[0046] Among them, copper tin plating refers to a composite metal material with a copper substrate and a tin layer electroplated on the surface. Specifically, it can be achieved by using an electroplating process to form a 5-10μm tin plating layer on the surface of the copper substrate. This material forms an anti-oxidation protective layer while maintaining conductivity. The thickness of 1.5±0.05mm refers to the thickness of the plate of the main part of the terminal. Specifically, it can be achieved by precision stamping die processing. This thickness range ensures that the terminal has sufficient structural strength and can effectively transmit pressure. The anti-slip pattern 301 refers to the concave and convex structure formed by the processing of the inner surface of the wing. Specifically, it can be achieved by using a roll forming process to form a staggered grid pattern with a depth of 0.1-0.3mm. This pattern enhances the friction of the contact surface through mechanical bite, such as Figure 4 shown.

[0047] Specifically, the copper substrate is electroplated with tin to form a dual metal structure. Copper performs the primary conductive function, while the tin layer isolates the contact with air to prevent oxidation reactions, allowing the connection interface to maintain stable contact resistance even in humid environments. The precisely controlled thickness of the plate ensures that the terminal can provide sufficient support strength when subjected to extrusion deformation, while also fully conforming to the conductor surface through plastic deformation, eliminating the uneven pressure distribution caused by traditional manual bundling. The grid-like pattern on the inner wall of the wing is embedded in the conductor surface during the crimping process, forming a multi-point mechanical bite structure, which improves the ability to resist vibration displacement by increasing the micro-roughness of the contact surface.

[0048] Compared to existing technologies, the bare copper wire used in traditional manual bundling processes lacks a surface protective layer, which can easily form an oxide film over time, leading to increased contact resistance. This solution, however, creates a stable interface through tinning. Existing connectors generally use single-thickness sheet materials, which are prone to deformation and failure when too thin, and difficult to plastically deform when too thick. This solution balances strength and deformation requirements by optimizing thickness parameters. Conventional flat contact surfaces are prone to slippage under vibration conditions. This solution creates a mechanical interlocking effect through a textured structure.

[0049] Through the above technical solution, the present application effectively reduces the contact resistance fluctuation caused by oxidation of the connection interface, eliminates local deformation caused by insufficient material strength during the crimping process, prevents relative displacement between conductors under a vibration environment, and achieves stable and reliable electrical connection and mechanical fixation.

[0050] See also Figure 2 、 Figure 3 and Figure 5As shown, the present application further proposes an electronic wire and flat wire connection system, including a connection mold 4, a pressure actuator 5, and a control unit. The connection mold 4 includes a lower mold assembly with a positioning groove 409 and an upper mold assembly with a punch 405. The positioning groove 409 is shaped to match the second-shaped conductive terminal 3. The hydraulic cylinder 501 of the pressure actuator 5 drives the upper mold assembly to move vertically through a connecting rod 502. The control unit is connected to the pressure sensor 9 and the displacement sensor 6 to adjust the pressure and stroke in real time.

[0051] The connecting die 4 is a tooling assembly used to support the wire and perform the stamping operation. Specifically, it can be formed from high-hardness alloy steel. The contour of the positioning groove 409 forms a clearance fit with the outer contour of the two-shaped conductive terminal 3, achieving precise positioning of the terminal and wire through geometric constraints. The pressure actuator 5 is a power device that generates and transmits mechanical pressure. Specifically, it can be a servo hydraulic system combined with a four-link mechanism 502. It eliminates lateral forces through vertical linear motion and ensures that the direction of pressure transmission coincides with the mold clamping axis. The control unit is an intelligent control system that implements closed-loop adjustment of process parameters. Specifically, it can be an industrial PLC integrated with a high-speed AD module. By collecting signals from the pressure sensor 9 and the laser displacement sensor 6 in real time, it dynamically adjusts the output pressure and displacement of the hydraulic cylinder 501.

[0052] Specifically, after the wire is placed in the lower die's positioning slot 409, the hydraulic cylinder 501 pushes the upper die vertically downward via the connecting rod 502. When the punch 405 contacts the two-shaped conductive terminal 3, the pressure sensor 9 is triggered. The control unit automatically adjusts the hydraulic output according to a preset pressure threshold, causing the terminal tabs to plastically deform and wrap around the wire conductor. A displacement sensor 6 monitors the punch 405's travel in real time. When it detects that the terminal deformation reaches a set value, the control unit switches to pressure-holding mode and activates a timing function. The entire process is controlled through a closed-loop dual-parameter pressure-displacement system, eliminating the effects of material springback and assembly clearance on connection quality.

[0053] Compared to existing technologies, traditional manual bundling processes rely on operator experience to control crimping force, resulting in uneven pressure distribution and fluctuations in contact resistance. Conventional stamping equipment also uses a single pressure control mode, which cannot compensate for positioning deviations caused by die wear. This solution, through the synergy of die positioning structures and sensor feedback control, ensures that the pressure application direction is strictly perpendicular to the die reference plane. It also dynamically adjusts process parameters based on real-time deformation, ensuring consistent mechanical conditions for each connection operation.

[0054] Through the above technical solution, this application effectively solves the problem of unstable contact resistance caused by insufficient pressure control accuracy in traditional processes, eliminates the risk of false connection or wire breakage caused by positioning deviation, and at the same time shortens the single connection operation time to less than 5 seconds through automated control, significantly improving the reliability and operating efficiency of the connection between electronic wires and flat wires in new energy inverter production lines.

[0055] The present application further proposes that the upper mold assembly includes an upper mold plate 401 fixedly connected to the connecting rod 502, a heating block 402 fixed to the bottom of the upper mold plate 401, a floating pressure block 404 elastically connected to the heating block 402 through a spring 403, and a punch head 405 fixedly connected to the bottom of the floating pressure block 404, the displacement sensor 6 is installed on the side wall of the punch head 405, and the laser probe points to the positioning reference surface of the lower mold.

[0056] Among them, the upper template 401 refers to a load-bearing structure rigidly connected to the connecting rod 502 of the pressure actuator 5, and can be specifically made of high-strength steel plate to form a stable power transmission path. Among them, the heating block 402 refers to a temperature control module integrated at the bottom of the upper template 401, and can be specifically made of a combination of a resistance heating plate and a heat-conducting copper block to provide the thermal energy compensation required for the plastic deformation of the material during the pressure application process. Among them, the floating pressure block 404 refers to a buffer mechanism elastically connected to the heating block 402 via a spring 403, and can be specifically made of a cylindrical coil spring 403 in combination with a guide column to adaptively adjust the contact pressure distribution during the pressure application process. Among them, the punch head 405 refers to a forming component that directly acts on the two-shaped conductive terminal 3, and can be specifically made of cemented carbide material to uniformly transmit pressure to the connection part. Among them, the displacement sensor 6 refers to a detection device that monitors the movement trajectory of the punch head 405, and can be specifically made of a magnetostrictive displacement sensor 6 to provide real-time feedback of the position offset during the pressure application process.

[0057] Specifically, the upper template 401 is rigidly connected to the pressure actuator 5 to form a power input interface, and the heating block 402 performs temperature compensation on the two-shaped conductive terminal 3 through heat conduction to reduce the material's resistance to deformation. The floating pressure block 404 forms an elastic pressure interface under the action of the spring 403. In the initial stage of the punch head 405 contacting the conductive terminal, it absorbs mechanical impact through the floating gap, and gradually transforms into a rigid pressure state as the pressure increases. The displacement sensor 6 collects the axial displacement data of the punch head 405 in real time during the pressure process, and the laser probe synchronously scans the spatial coordinates of the lower mold positioning reference surface. After the data of the two are fused, a closed-loop control signal is formed to dynamically correct the pressure trajectory and positioning deviation. This structure simultaneously realizes temperature regulation, pressure adaptive distribution and spatial positioning calibration during the pressure process.

[0058] Compared with the existing technology, the upper module of the traditional connection system is an integral rigid structure. It cannot compensate for the difference in material deformation resistance during the pressure application process, which can easily lead to local overpressure or underpressure on the terminal. The existing technology lacks temperature compensation function, and the cold pressing process is prone to material rebound problems. The existing positioning system relies solely on mechanical limits and cannot monitor the position offset during the pressure application process in real time. This solution realizes adaptive pressure distribution and material thermal softening effect during the pressure application process through the combined design of the floating pressure block 404 and the heating block 402. Combined with the coordinated detection of the displacement sensor 6 and the laser probe, it effectively eliminates positioning deviations caused by assembly errors or material deformation.

[0059] Through the above technical solution, the present application realizes dynamic balanced control of the pressure distribution at the connection part, ensuring uniform plastic deformation of the two-shaped conductive terminal 3; reduces the material deformation resistance through temperature compensation, and avoids rebound defects caused by the cold pressing process; and improves the position control accuracy of the pressure application process to the submillimeter level through a multi-sensor fusion positioning system, thereby significantly improving the mechanical strength and conductive stability of the connection between the electronic wire and the flat wire.

[0060] The present application further proposes that the gap between the floating pressure block 404 and the heating block 402 is 1-2 mm, and the floating stroke is controlled by the limit pin 406.

[0061] The gap between the floating pressure block 404 and the heating block 402 refers to the vertical space reserved between them, which can be achieved through machining tolerance control. This gap allows the floating pressure block 404 to elastically move during pressure application. The limit pin 406 is a mechanical limiter installed in the movement path of the floating pressure block 404, which can be implemented by a cylindrical pin and a limit hole. The contact between the pin and the hole wall constrains the displacement range of the floating pressure block 404.

[0062] Specifically, when the punch 405 contacts the second-shaped conductive terminal 3, the floating pressure block 404, through the elastic action of the spring 403, creates a buffering effect, allowing the punching force to automatically adjust to the thickness of the wire. When there is a height difference between the contact surface of the terminal and the wire, the floating pressure block 404 moves vertically within the allowable clearance, avoiding localized stress concentration caused by rigid contact. The limit pin 406 limits the maximum displacement of the floating pressure block 404, ensuring that the terminal deformation remains within the plastic deformation threshold, preventing degradation of conductivity due to excessive compression.

[0063] Compared to existing technologies, the traditional connection mold 4 uses a fixed pressure block structure. This can easily lead to uneven pressure distribution when assembly errors or material thickness fluctuations occur, resulting in uncontrolled terminal deformation. This solution achieves adaptive adjustment of pressure transmission through the synergy of a floating structure and a limit mechanism, ensuring the plastic deformation effect while eliminating the risk of overpressure.

[0064] Through the above technical solution, this application solves the problem of uneven pressure distribution caused by the rigid contact of the pressure block, ensuring that the contact surface between the two-shaped conductive terminal 3 and the wire material undergoes uniform plastic deformation during the pressure application process, effectively reducing the discreteness of the contact resistance. At the same time, through mechanical limit constraints, the degradation of conductivity caused by excessive material deformation is avoided, ensuring the mechanical stability of the connection part under equipment vibration conditions.

[0065] The present application further proposes that the bottom of the punch head 405 is provided with an arc-shaped pressing surface that matches the contour of the two-shaped conductive terminal 3, and the pressure sensor 9 is embedded in the inside of the punch head 405, and the detection surface is flush with the arc-shaped pressing surface.

[0066] The curved pressing surface refers to a curved structure at the bottom of the punch head 405 having a curvature consistent with the outer surface of the second-shaped conductive terminal 3. This can be achieved by numerically controlling the curved surface profile, which enables the punch head 405 to form surface contact with the conductive terminal. The pressure sensor 9 is embedded within the punch head 405, which means that the sensor is integrated into the main structure of the punch head 405. This can be achieved by using a micro-thin film pressure sensor element with an interference fit on the base of the punch head 405, with the sensor detection surface and the curved pressing surface being coplanar.

[0067] Specifically, during the stamping process, the curved pressure surface completely covers the top and two side wing areas of the two-shaped conductive terminal 3, ensuring that pressure is evenly transmitted to the contact interface between the conductive terminal and the wire. The pressure sensor 9 inside the punch head 405 directly senses the actual pressure value applied by the curved pressure surface. Because the detection surface is flush with the pressure surface, measurement errors caused by mechanical structural deformation in the pressure transmission path are avoided. When the pressure actuator 5 applies pressure, the control unit obtains real-time contact surface pressure distribution data through the sensor and dynamically adjusts the output pressure of the hydraulic cylinder 501 to ensure that all parts of the conductive terminal reach the preset plastic deformation threshold.

[0068] Compared to existing technologies, conventional punching head 405 uses a flat pressure head structure, which can only apply pressure to a single point on the top of the conductive terminal, resulting in insufficient pressure in the fin area. The pressure sensor 9 is usually externally located on the connecting rod 502 outside the punching head 405 and cannot directly detect the actual pressure on the contact surface. This solution achieves three-dimensional pressure distribution control through a curved pressure surface, combined with a built-in pressure sensing structure to eliminate measurement errors and solve the problem of contact resistance fluctuation.

[0069] Through the above technical solution, the present application can accurately control the uniformity of pressure distribution on the contact surface between the conductive terminal and the wire during the stamping process, obtain real pressure data in real time and feed it back to the control system, ensure that the connection interface forms a stable metallurgical bond, and effectively reduce the discreteness of contact resistance.

[0070] The present application further proposes that a limiting groove 408 matching the cross-section of the flat wire is opened on the top of the lower template 407 of the lower module, and the limiting groove 408 is connected to the positioning groove 409.

[0071] Among them, the limiting groove 408 refers to a groove structure opened on the top of the lower template 407 that is consistent with the cross-sectional shape of the flat wire. Specifically, it can be achieved by CNC machining to form a groove body that matches the width and thickness of the flat wire. This structure is used to constrain the horizontal displacement of the flat wire. The positioning groove 409 refers to a groove structure for accommodating the two-shaped conductive terminal 3. Specifically, it can be achieved by milling to form a groove body that matches the bottom contour of the terminal. This structure is used to fix the spatial position of the conductive terminal. The connection structure between the limiting groove 408 and the positioning groove 409 refers to the formation of a continuous positioning reference surface between the two groove bodies. Specifically, it can be achieved by aligning the axis of the groove body. This structure ensures that the conductive terminal and the flat wire conductor form a position coupling relationship.

[0072] Specifically, after the flat wire end 2 is inserted into the limiting groove 408, its conductor surface is constrained to a predetermined height. When the two-shaped conductive terminal 3 is placed in the positioning groove 409, the vertical distance between the bottom of the conductive terminal and the flat wire conductor is precisely controlled. During the stamping process, the pressure applied by the punch 405 is evenly transmitted to the surface of the flat wire conductor through the conductive terminal. Because the limiting groove 408 and the positioning groove 409 form a continuous positioning reference, the contact area between the conductive terminal and the flat wire is completely covered, avoiding the phenomenon of localized pressure concentration caused by positional offset.

[0073] Compared to existing technologies, traditional connection systems use only a single positioning groove 409 to secure the conductive terminal, without applying geometric constraints to the flat wire, which can easily cause the flat wire to slip laterally during the stamping process. While the V-shaped positioning blocks commonly used in existing technologies can limit wire displacement, they cannot achieve full coverage of the contact surface. This solution, through the synergistic effect of limiting grooves 408 and positioning grooves 409, ensures surface contact between the flat wire conductor and the conductive terminal, rather than line contact, significantly improving the uniformity of pressure distribution.

[0074] Through the above technical solution, this application achieves precise positioning of the two flat wire ends during the connection process, eliminating the problem of insufficient contact area caused by wire sliding. The accuracy of the pressure transmission path during the stamping process is guaranteed, and the conductor contact surface is evenly compressed across the entire area, effectively reducing the discreteness of the contact resistance. The mechanical strength of the connection part is improved through geometric constraints, and the vibration resistance is enhanced.

[0075] The present application further proposes that the control unit includes a PLC controller and a HMI human-machine interface arranged in a control box 7, and the PLC controller pre-stores a pressure-time control program.

[0076] The control box 7 refers to the hardware structure for the integrated control unit, which can be implemented as a metal sealed box. Its function is to provide physical protection and electromagnetic shielding for the PLC controller and HMI human-machine interface, thereby enhancing the system's anti-interference capability. The PLC controller refers to a programmable logic controller, which can be implemented as a modular industrial-grade PLC. Its function is to execute the logic instructions for pressure application, maintenance, and monitoring through a pre-stored pressure-time control program, ensuring accurate execution of process parameters. The HMI human-machine interface refers to the terminal for operator interaction with the equipment, which can be implemented as a touch screen display. Its function is to visualize the pressure curve and real-time status data, and provide a parameter input interface to achieve human-machine collaborative control. The pressure-time control program refers to the preset pressure application timing logic, which can be implemented as a ladder diagram programming language. Its function is to dynamically adjust the pressure curve according to the connection process requirements and eliminate parameter deviations caused by manual operation.

[0077] Specifically, the PLC controller receives real-time signals from the pressure sensor 9 and displacement sensor 6 and controls the timing of the pressure actuator 5 according to pre-stored program logic. During the connection process, the pressure-time control program drives the hydraulic cylinder 501 to perform the extrusion operation according to the preset pressure value and hold time, while the pressure curve changes are displayed in real time on the HMI human-machine interface. When pressure fluctuations exceeding the threshold are detected, the PLC controller automatically adjusts the output of the hydraulic cylinder 501 to ensure that the extrusion process meets the preset parameter range. The control box 7 integrates the PLC controller and the HMI human-machine interface in a closed space, preventing external electromagnetic interference from affecting signal transmission stability.

[0078] Compared to existing technologies, traditional connection systems rely on manual experience to adjust pressure parameters, which cannot guarantee consistency across product batches. This solution, however, uses a PLC controller with pre-stored programs to solidify the optimal pressure curve. Combined with an HMI (human-machine interface), this allows for visual parameter setting, making the pressure application process fully programmable and eliminating random errors caused by manual operation. The existing problem of decentralized control units, resulting in insufficient anti-interference capabilities, is addressed in this solution through the integrated design of the control box 7.

[0079] Through the above technical solution, this application achieves automated closed-loop control of the pressure application process, ensuring that the pressure value and hold time strictly follow the preset program, thereby significantly improving the stability of the connection quality between the electronic wire and the flat cable. At the same time, the real-time monitoring function provided by the HMI human-machine interface reduces the need for manual intervention, allowing operators to quickly identify and correct abnormal working conditions.

[0080] The present application further proposes that the visual positioning module includes a pure camera 8 and an image processor. The pure camera 8 is fixed directly above the lower template 407, and the optical axis is perpendicular to the positioning groove 409.

[0081] The visual positioning module refers to a device that uses optical imaging technology to achieve spatial coordinate recognition. Specifically, it can be implemented using an industrial-grade pure camera 8 in conjunction with an image processing algorithm. It is used to capture the real-time position information of the two-shaped conductive terminal 3 within the positioning groove 409. The pure camera 8 is a charge-coupled device image sensor, specifically a high-resolution area array camera. Its vertical optical axis arrangement can avoid image distortion and ensure the geometric accuracy of the image data. The image processor refers to the computing unit that performs image analysis and coordinate calculation. Specifically, it can be implemented using an embedded FPGA chip. It uses an edge detection algorithm to extract the contour coordinates of the two-shaped conductive terminal 3 and calculate its offset from the mold reference surface.

[0082] Specifically, when the pure camera 8 is mounted directly above the lower mold plate 407, its field of view covers the area of ​​the positioning slot 409. The vertical arrangement of the optical axis eliminates perspective distortion in the captured image. When the two-shaped conductive terminal 3 is placed in the positioning slot 409, the pure camera 8 captures the terminal image and transmits it to the image processor, which uses grayscale threshold segmentation and contour fitting algorithms to identify the terminal's center coordinates. The image processor feeds the calculated coordinate offset back to the control unit, driving the pressure actuator 5 to adjust the position of the upper mold assembly, ensuring precise alignment between the punch head 405 and the terminal. This process is completed automatically before the mold closes, requiring no human intervention.

[0083] In some embodiments, the mounting bracket of the camera 8 can be equipped with a fine-tuning mechanism, such as a fixed base with XY slide rails, to facilitate calibration of the perpendicular relationship between the camera optical axis and the positioning slot 409. The image processor algorithm can further integrate a template matching function, such as pre-storing the outline data of standard terminals to improve positioning accuracy through similarity comparison.

[0084] Compared with existing technologies, traditional manual positioning relies on the operator to visually adjust the terminal position, which is subject to issues such as viewing angle errors and poor operational consistency. This solution uses a visual positioning module to automatically capture and calculate terminal coordinates, eliminating the subjective errors of human judgment. It also reduces positioning time from seconds to milliseconds, significantly improving production line cycle time.

[0085] Through the above technical solution, this application solves the problem of inaccurate terminal-die alignment caused by manual positioning deviations, achieving fully automated precision control of the connection process. The visual positioning system ensures real-time calibration of terminal position through non-contact measurement, avoiding uneven extrusion deformation caused by misalignment, thereby improving the electrical performance and mechanical reliability of the connection interface.

[0086] This application further proposes a combination of electronic wires and flat wires connected by an electronic wire and flat wire connection method for the internal power module of the new energy inverter, wherein the flat wire serves as a DC bus and the electronic wire serves as a signal acquisition line.

[0087] Among them, the method for connecting electronic wires and flat wires refers to a method for mechanically crimping and electrically connecting the electronic wire conductor and the flat wire conductor through the two-shaped conductive terminal 3. Specifically, it can be achieved by applying pressure to the terminal by a stamping die, which forms a stable contact interface through the plastic deformation of the metal. Among them, the two-shaped conductive terminal 3 refers to a conductive component with a bottom bearing surface and a wing structure on both sides. Specifically, it can be achieved by stamping and forming a copper tin-plated material. Its structure adapts to the cross-sectional characteristics of the flat wire and the electronic wire, and realizes multi-point contact through the wing covering. Among them, the pressure actuator 5 synchronously triggers the pressure maintenance and monitors the pressure curve, which refers to the real-time feedback of pressure data through the sensor and the control of the pressure holding time. Specifically, it can be achieved by using a hydraulic system in conjunction with a closed-loop control program. This method ensures that the terminal deformation process is controlled.

[0088] Specifically, during the assembly of the new energy inverter power module, the flat wire is fixed in the lower mold positioning groove 409 as a DC busbar, and the electronic wire conductor is stripped and contacts the wing of the two-shaped conductive terminal 3. When the punch head 405 is pressed down, the pressure actuator 5 applies pressure according to the preset program, causing the terminal wing to plastically deform and cover the electronic wire conductor, while the bottom forms a surface contact with the flat wire conductor. The control unit monitors the punch stroke through the displacement sensor 6 and dynamically adjusts the pressure parameters based on the data from the pressure sensor 9. After reaching the preset pressure threshold, the pressure holding stage is maintained to ensure that the interface between the terminal and the conductor is fully deformed.

[0089] Compared to existing technologies, traditional manual bundling processes rely on operator experience, are subject to local overheating caused by uneven contact pressure distribution, and are time-consuming for each operation. This solution uses an automated stamping connection process to achieve controlled plastic deformation of the terminal and conductor, eliminating quality fluctuations caused by manual operation while reducing connection time to a single process cycle.

[0090] Through the above technical solution, this application solves the problem of reliable connection between high-current transmission and signal acquisition lines of power modules. The DC bus reduces contact resistance through a surface contact structure, and the signal line enhances vibration resistance through plastic deformation connection. The automated process reduces the unit connection operation time to a single equipment cycle, adapting to mass production needs.

[0091] The above detailed description of the preferred embodiments of the present invention should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent of the present invention.

Claims

1. A method for connecting an electronic wire and a flat wire, characterized in that: The following steps are involved: S1. Peel the ends of the electronic wire to expose the conductor, and remove the insulation layer from the ends of the flat wire; S2. Lay the bottom of the two-shaped conductive terminal on the surface of the flat wire conductor, with the wings on both sides covering the exposed conductor of the electronic wire; S3. The control unit controls the upper and lower mold assemblies of the connection mold to align, and the pressure actuator applies 5-10 MPa pressure to squeeze the two-shaped conductive terminals, so that the electronic wire and the flat wire form a mechanical and electrical connection; S4. The control unit controls the pressure actuator to synchronously trigger the pressure to maintain for 0.5-2 seconds and monitor the pressure curve. After the connection is completed, the mold is automatically opened.

2. A method for connecting an electronic wire and a flat wire according to claim 1, characterized in that: The material of the two-shaped conductive terminal is tin-plated copper with a thickness of 1.5±0.05mm, and the inner wall of the wing is provided with anti-slip texture.

3. An electronic wire and flat wire connection system, used to implement an electronic wire and flat wire connection method according to any one of claims 1 or 2, characterized in that: include: A connection die, comprising a lower die set with a positioning groove and an upper die set with a punch head, wherein the shape of the positioning groove matches the second-shaped conductive terminal; A pressure actuator, wherein the hydraulic cylinder of the pressure actuator drives the upper die set to move vertically through a connecting rod; The control unit is connected to the pressure sensor and the displacement sensor to adjust the pressure and stroke in real time.

4. The electronic wire and flat wire connection system according to claim 3, characterized in that: The upper die assembly includes an upper die plate fixedly connected to the connecting rod, a heating block fixed to the bottom of the upper die plate, a floating pressure block elastically connected to the heating block through a spring, and a punch head fixedly connected to the bottom of the floating pressure block. The displacement sensor is installed on the side wall of the punch head, and the laser probe points to the positioning reference surface of the lower die.

5. The electronic wire and flat wire connection system according to claim 4, characterized in that: The gap between the floating pressure block and the heating block is 1-2 mm, and the floating stroke is controlled by a limit pin.

6. The electronic wire and flat wire connection system according to claim 4, characterized in that: The bottom of the punch head is provided with an arc-shaped pressing surface that matches the contour of the two-shaped conductive terminal. The pressure sensor is embedded in the punch head, and the detection surface is flush with the arc-shaped pressing surface.

7. The electronic wire and flat wire connection system according to claim 4, characterized in that: A limiting groove matching the cross section of the flat wire is provided on the top of the lower template of the lower die assembly, and the limiting groove is communicated with the positioning groove.

8. The electronic wire and flat wire connection system according to claim 3, characterized in that: The control unit includes a PLC controller and a HMI human-machine interface arranged in a control box, and the PLC controller pre-stores a pressure-time control program.

9. The electronic wire and flat wire connection system according to claim 3, characterized in that: It also includes a visual positioning module, which includes a pure camera and an image processor. The pure camera is fixed directly above the lower template, and the optical axis is perpendicular to the positioning groove.

10. A new energy inverter, characterized by: The internal power module of the new energy inverter adopts a combination of electronic wires and flat wires connected by an electronic wire and flat wire connection method according to claim 1 or 2, wherein the flat wire serves as a DC bus and the electronic wire serves as a signal acquisition line.

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