Loudspeaker diaphragm

Abstract

The invention relates to the technical field of loudspeakers, in particular to a loudspeaker diaphragm which comprises a bonding pad frame, a vibrating diaphragm and a conductive circuit, the bonding pad frame is composed of a frame main body, a supporting frame and a plurality of connecting parts, the connecting parts are arranged between the frame main body and the supporting frame at intervals, and the vibrating diaphragm is arranged between the supporting frame and the bonding pad frame. One end of each connecting part is connected with the frame main body, the other end of each connecting part is connected with the supporting frame, the conductive circuit is formed on the vibrating diaphragm by adopting a vacuum plating process, the vibrating diaphragm and the bonding pad frame are bonded into a whole, and the vibrating diaphragm comprises a first composite layer, a second composite layer, a third composite layer and a metal layer. Wherein the second composite layer is located between the first composite layer and the third composite layer. The vibrating diaphragm is simple in structure, reasonable in design, small in size, capable of meeting the development requirement for miniaturization of sound production electronic products, long in service life and worthy of vigorous popularization and application, and the conductive circuit cannot be abraded in the long-term vibration process of the vibrating diaphragm.

Description

Technical Field

[0001] The present invention relates to the technical field of loudspeakers, in particular to a loudspeaker diaphragm. Background Art

[0002] The diaphragm is an important component of the speaker's vibration system and a crucial part for achieving electroacoustic conversion. Traditional speaker diaphragms are mounted on a pad frame, which is typically made of plastic. The diaphragm vibrates by bonding the coil to the diaphragm and using the pad to conduct electricity. However, due to this connection structure, the diaphragm floats up and down during vibration, and the conductive wires connecting the coil on the diaphragm to the pad (the coil's input and output wires) are easily disconnected due to vibration, thus affecting the speaker's service life. To address this issue, a conductive layer has been designed on the diaphragm. This conductive layer is connected to the speaker coil through the solder points on the pad frame to achieve sound generation. For example, the invention patent with application number CN202020645709.8 adopts this structure. However, this design still has the following disadvantages: 1. The pad frame is large and cannot meet the demand for miniaturization of sound-generating electronic products; 2. The conductive coating on the diaphragm will wear during long-term vibration, resulting in a short product life. To address this problem, the inventors have improved the structure of the speaker diaphragm. Summary of the Invention

[0003] The purpose of the present invention is to provide a loudspeaker diaphragm with a simple structure, reasonable design, and small size, which meets the development needs of miniaturization of sound-producing electronic products. At the same time, the conductive circuit of the diaphragm will not be worn during long-term vibration, and the service life is long, thereby solving the problems raised by the above technical background.

[0004] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a loudspeaker diaphragm, comprising a pad frame, a diaphragm and a conductive circuit, wherein the pad frame is composed of a frame body, a support frame and a connecting part, a plurality of the connecting parts are provided, and the plurality of the connecting parts are spaced apart between the frame body and the support frame, one end of each of the connecting parts is connected to the frame body, and the other end is connected to the support frame, the conductive circuit is formed on the diaphragm by a vacuum plating process, the diaphragm is bonded to the pad frame as a whole, the diaphragm comprises a first composite layer, a second composite layer, a third composite layer and a metal layer, wherein the second composite layer is located between the first composite layer and the third composite layer, and a first glue layer is respectively provided between the second composite layer and the first composite layer and between the second composite layer and the third composite layer, the second glue layer is coated with a second glue layer on an end face of the third composite layer away from the second composite layer, and the metal layer is formed on the second glue layer by a room temperature vacuum plating process.

[0005] Preferably, the frame body, the support frame and the connecting portion are integrally formed by a stamping process.

[0006] Preferably, the frame body and the support frame have the same thickness, both between 0.01 mm and 3 mm.

[0007] Preferably, the cross section of the connecting portion is U-shaped, and the connecting portion is electrically connected to the conductive circuit, and a conductive connection area is formed at the connecting portion.

[0008] Preferably, the pad frame is made of conductive material.

[0009] Preferably, the thickness of the first composite layer, the second composite layer and the third composite layer are all between 3-12 μm, and the first composite layer, the second composite layer and the third composite layer are all made of PEEK material.

[0010] Preferably, the metal layer is gold, silver, copper or aluminum.

[0011] Preferably, the thickness of the first glue layer and the second glue layer is 5-10 μm, and the first glue layer and the second glue layer are acoustic damping glue or acrylic glue.

[0012] Preferably, the conductive circuit is formed on the metal layer, and the conductive circuit is a flexible circuit with a thickness between 0.05 mm and 1 mm.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention provides a loudspeaker diaphragm, which includes a pad frame, a diaphragm and a conductive circuit, wherein the pad frame is composed of a frame body, a support frame and a connecting part, the overall structure is simple and the design is reasonable, the conductive circuit is formed on the diaphragm by a vacuum plating process, and the diaphragm and the pad frame are bonded into one body, so that the diaphragm drives the pad frame to vibrate together during the vibration process, and the thickness of the frame body and the support frame is between 0.01mm-3mm, so that the volume of the loudspeaker diaphragm can be made very thin and the volume becomes smaller, which is convenient for the development demand of miniaturization of sound-emitting electronic products. In addition, the conductive circuit is designed. When the conductive circuit is formed, a metal layer is first formed on the diaphragm by a vacuum plating process, and then a conductive circuit is formed on the metal layer, and the excess conductive layer is washed away at the same time. Compared with traditional conductive coatings, the conductive circuit designed in this way will not wear out during use and has a longer service life, and is worthy of vigorous promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the overall structural diagram of the present invention; Figure 2 It is a structural diagram of the pad frame of the present invention; Figure 3 is a structural diagram of the diaphragm of the present invention; Figure 4 It is a partial cross-sectional view of the diaphragm of the present invention.

[0015] The reference numerals and names in the figures are as follows: 1. Pad frame; 11. Frame body; 12. Support frame; 13. Connection part; 14. Hollow hole; 2. Diaphragm; 21. First composite layer; 22. Second composite layer; 23. Third composite layer; 24. Metal layer; 25. First glue layer; 26. Second glue layer; 27. Protective layer; 3. Conductive circuit. DETAILED DESCRIPTION

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0017] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0018] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0019] See also Figures 1 to 3The present invention provides an embodiment: a loudspeaker diaphragm, which includes a pad frame 1, a diaphragm 2 and a conductive circuit 3. The overall structure is simple and the design is reasonable, wherein the pad frame 1 is made of conductive material, the conductive circuit 3 is a flexible circuit with a thickness between 0.05mm and 1mm, and the conductive circuit 3 is formed on the diaphragm 2 by a vacuum electroplating process. The diaphragm 2 and the pad frame 1 are bonded into one body. Compared with traditional conductive coatings, the conductive circuit 3 has a longer service life.

[0020] Specifically, the pad frame 1 is composed of a frame body 11, a support frame 12 and a connecting part 13. The support frame 12 is located on the inner side of the frame body 11. There are multiple connecting parts 13, and the multiple connecting parts 13 are spaced apart between the frame body 11 and the support frame 12. One end of each connecting part 13 is connected to the frame body 11, and the other end is connected to the support frame 12. A hollow hole 14 is formed between the frame body 11 and the support frame 12. The frame body 11, the support frame 12 and the connecting part 13 are integrally formed by a stamping process. The thickness of the frame body 11 and the support frame 12 are the same, both between 0.01mm-3mm. In this way, the pad frame 1 is smaller in size, which is conducive to the development demand of miniaturization of sound-emitting electronic products.

[0021] Specifically, the cross section of the connecting portion 13 is U-shaped, and the connecting portion 13 is electrically connected to the conductive circuit 3, and a conductive connection area is formed on the connecting portion 13. The coil of the speaker (not shown) is in contact with the conductive connection area to achieve conduction.

[0022] See also Figure 4 The diaphragm 2 in the figure includes a first composite layer 21, a second composite layer 22, a third composite layer 23 and a metal layer 24, wherein the second composite layer 22 is located between the first composite layer 21 and the third composite layer 23, and a first glue layer 25 is respectively provided between the second composite layer 22 and the first composite layer 21 and between the second composite layer 22 and the third composite layer 23. The end surface of the third composite layer 23 away from the second composite layer 22 is coated with a second glue layer 26, and the metal layer 24 is formed on the second glue layer 26 by a room temperature vacuum plating process, and the metal layer 24 is gold, silver, copper or aluminum.

[0023] Specifically, the thickness of the first composite layer 21 , the second composite layer 22 and the third composite layer 23 are all between 3 μm and 12 μm, and the first composite layer 21 , the second composite layer 22 and the third composite layer 23 are all made of PEEK material.

[0024] Specifically, the thickness of the first glue layer 25 and the second glue layer 26 is 5-10 μm, and the first glue layer 25 and the second glue layer 26 are acoustic damping glue or acrylic glue.

[0025] More specifically, the conductive circuit 3 is formed on the metal layer 24 . In order to protect the conductive circuit 3 , a protective layer 27 is provided on the outer side of the conductive circuit 3 . The protective layer 27 is made of silver oxide.

[0026] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A loudspeaker diaphragm, characterized in that: The invention comprises a pad frame (1), a diaphragm (2) and a conductive circuit (3), wherein the pad frame (1) is composed of a frame body (11), a support frame (12) and a connecting portion (13), a plurality of connecting portions (13) are provided, and the plurality of connecting portions (13) are arranged at intervals between the frame body (11) and the support frame (12), one end of each connecting portion (13) is connected to the frame body (11), and the other end is connected to the support frame (12), the conductive circuit (3) is formed on the diaphragm (2) by a vacuum plating process, the diaphragm (2) and the pad frame (1) are bonded into one body, and the diaphragm (2) The invention comprises a first composite layer (21), a second composite layer (22), a third composite layer (23) and a metal layer (24), wherein the second composite layer (22) is located between the first composite layer (21) and the third composite layer (23), and a first glue layer (25) is provided between the second composite layer (22) and the first composite layer (21) and between the second composite layer (22) and the third composite layer (23), respectively; an end surface of the third composite layer (23) away from the second composite layer (22) is coated with a second glue layer (26), and the metal layer (24) is formed on the second glue layer (26) by a room temperature vacuum plating process.

2. The loudspeaker diaphragm according to claim 1, characterized in that: The frame body (11), the support frame (12) and the connecting portion (13) are integrally formed using a stamping process.

3. The loudspeaker diaphragm according to claim 2, characterized in that: The frame body (11) and the support frame (12) have the same thickness, both between 0.01 mm and 3 mm.

4. The loudspeaker diaphragm according to claim 1, characterized in that: The cross section of the connecting portion (13) is U-shaped, and the connecting portion (13) is electrically connected to the conductive circuit (3), and a conductive connection area is formed on the connecting portion (13).

5. The loudspeaker diaphragm according to claim 1, characterized in that: The pad frame (1) is made of conductive material.

6. The loudspeaker diaphragm according to claim 1, characterized in that: The thickness of the first composite layer (21), the second composite layer (22), and the third composite layer (23) are all between 3 and 12 μm, and the first composite layer (21), the second composite layer (22), and the third composite layer (23) are all made of PEEK material.

7. The loudspeaker diaphragm according to claim 1, characterized in that: The metal layer (23) is gold, silver, copper or aluminum.

8. The loudspeaker diaphragm according to claim 1, characterized in that: The thickness of the first glue layer (25) and the second glue layer (26) is 5-10 μm, and the first glue layer (25) and the second glue layer (26) are acoustic damping glue or acrylic glue.

9. The loudspeaker diaphragm according to claim 1, characterized in that: The conductive circuit (3) is formed on the metal layer (24), and the conductive circuit (3) is a flexible circuit with a thickness between 0.05 mm and 1 mm.

Images