Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment, and aims to solve the problem of how to reduce the board surface area of a circuit board. The circuit board assembly provided by the invention comprises a first circuit board and a second circuit board which are connected with each other, a containing cavity is formed between the first circuit board and the second circuit board in a surrounding mode, a first contact is arranged on the side, facing the containing cavity, of the first circuit board, a second contact is arranged on the side, facing the containing cavity, of the second circuit board, and a second electronic component is arranged on the side, deviating from the containing cavity, of the second circuit board; the accommodating cavity is used for accommodating the card support assembly; the card holder assembly comprises a card holder body and a first card body and / or a second card body arranged on the card holder body. The first contact is used for being electrically connected with a first card body, and the second contact is used for being electrically connected with a second card body.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] A user identification card (SIM) is a storage unit used to register and use a carrier's network, storing information such as mobile communication identities, encryption keys, and contact lists. The demand for dual SIM cards and dual standby (DSS) is becoming increasingly widespread in mobile phones and other communications devices, and dual SIM card functionality has become a standard feature of these devices.

[0003] For example, a dual-SIM dual-standby phone often features a dual-layer card holder assembly, typically located on the circuit board at the bottom of the phone. The assembly consists of two card holders, upper and lower, and a top bracket. The upper card holder is typically integrated into the bracket, while the lower card holder is soldered to the circuit board. When a card tray and user identification card are inserted, the upper card body connects to the contacts on the upper card holder, while the lower card body connects to the contacts on the lower card holder, enabling signal transmission.

[0004] The double-layer card socket assembly in the related art has a large overall area, which occupies a large device layout space on the circuit board, which is not conducive to further miniaturization of the circuit board. Summary of the Invention

[0005] Embodiments of the present application provide a circuit board assembly and an electronic device to solve the problem of how to reduce the board area of ​​a circuit board.

[0006] In order to solve the above technical problems, this application is implemented as follows: In a first aspect, an embodiment of the present application provides a circuit board assembly.

[0007] The circuit board assembly provided in the embodiment of the present application includes: a first circuit board and a second circuit board connected to each other; a accommodating cavity is surrounded by the first circuit board and the second circuit board, a first contact is provided on a side of the first circuit board facing the accommodating cavity, the first contact at least partially protrudes toward the accommodating cavity relative to the first circuit board, a second contact is provided on a side of the second circuit board facing the accommodating cavity, the second contact at least partially protrudes toward the accommodating cavity relative to the second circuit board, and a second electronic component is provided on a side of the second circuit board away from the accommodating cavity; the accommodating cavity is used to accommodate a card tray assembly, wherein the card tray assembly includes a card tray body and a first card body and / or a second card body provided on the card tray body; the first contact is used to be electrically connected to the first card body, and the second contact is used to be electrically connected to the second card body.

[0008] Optionally, a carrier is provided on the portion of the first circuit board facing the accommodating cavity, the first contact is provided on the carrier, the first contact at least partially protrudes toward the accommodating cavity relative to the carrier, and a card holder ejection mechanism is fixedly connected to the carrier.

[0009] Optionally, the side of the first circuit board facing the second circuit board is the first component arrangement side, the orthographic projection of the second circuit board on the first component arrangement side forms a projection area, and the first electronic component is provided in an area of ​​the first component arrangement side located outside the projection area.

[0010] Optionally, the first card body and the second card body are any two of a first user identification card, a second user identification card, and a memory card.

[0011] Optionally, the second circuit board is a concave cavity circuit board, and a groove is provided on a side of the second circuit board facing the first circuit board, and the groove wall and the first circuit board form the accommodating cavity.

[0012] Optionally, a first protrusion and a second protrusion are respectively provided on both sides of the groove, the first protrusion is connected to the first circuit board on the side facing the first circuit board, and the second protrusion is connected to the first circuit board on the side facing the first circuit board.

[0013] Optionally, a first solder pad is provided on the side of the first protrusion facing the first circuit board, and a second solder pad is provided on the side of the second protrusion facing the first circuit board. The first solder pad is connected to the third solder pad of the first circuit board, and the second solder pad is connected to the fourth solder pad of the first circuit board.

[0014] Optionally, the first circuit board is provided with a first circuit layer, and the first contact, the third solder pad and the fourth solder pad are all electrically connected to the first circuit layer; the second circuit board is provided with a second circuit layer, and the second contact, the second electronic component, the first solder pad and the second solder pad are all connected to the second circuit layer.

[0015] In a second aspect, an embodiment of the present application provides an electronic device.

[0016] The electronic device provided in the embodiment of the present application includes: a frame and any one of the circuit board assemblies provided in the embodiment of the present application.

[0017] Optionally, the frame is provided with a through hole communicating with the accommodating cavity, and the electronic device further comprises a card holder body, and the card holder body is detachably inserted into the accommodating cavity through the through hole.

[0018] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects: In an embodiment of the present application, the circuit board assembly includes a first circuit board and a second circuit board connected to each other, a accommodating cavity is defined between the first circuit board and the second circuit board, a first contact is defined on the side of the first circuit board facing the accommodating cavity, and a second contact is defined on the side of the second circuit board facing the accommodating cavity. Therefore, the first card body and the second card body included in the card holder assembly accommodated in the accommodating cavity can be electrically connected to the first circuit board via the first contact and the second contact, respectively.

[0019] Furthermore, the side of the second circuit board facing away from the accommodating cavity can be used to accommodate electronic components. For example, the second electronic components can be placed on the side of the second circuit board facing away from the accommodating cavity. This avoids placing the second electronic components on the first circuit board, which would otherwise occupy the component layout area of ​​the first circuit board, thereby reducing the surface area of ​​the first circuit board.

[0020] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 A schematic diagram of a circuit board assembly provided in an embodiment of the present application; Figure 2 A top view of a circuit board assembly provided in an embodiment of the present application; Figure 3 A schematic diagram of a substrate of a second circuit board provided in an embodiment of the present application; Figure 4 A schematic diagram of a circuit board assembly and a card tray assembly provided in an embodiment of the present application.

[0023] Description of reference numerals: 1- Circuit board assembly; 100 - first circuit board; 110 - first contact; 120 - carrier; 121 - card tray ejection mechanism; 130 - first component arrangement side; 140 - first electronic component; 151 - third solder pad; 152 - fourth solder pad; 160 - first circuit layer; 200 - second circuit board; 200a - substrate; 210 - second contact; 220 - second electronic component; 230 - projection area; 240 - groove; 241 - first protrusion; 242 - second protrusion; 243 - first pad; 244 - second pad; 250 - second circuit layer; 261 - through hole; 262 - conductive material; 300-accommodation cavity; 400 - card tray assembly; 410 - card tray body; 420 - first card body; 430 - second card body. DETAILED DESCRIPTION

[0024] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0026] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0027] Furthermore, it is required that the application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0028] The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0029] The present application embodiment provides a circuit board assembly. Figures 1 to 4 The circuit board assembly 1 provided in the embodiment of the present application includes: a first circuit board 100 and a second circuit board 200 connected to each other.

[0030] A receiving cavity 300 is defined between the first circuit board 100 and the second circuit board 200. A first contact 110 is provided on a side of the first circuit board 100 facing the receiving cavity 300. The first contact 110 at least partially protrudes from the first circuit board 100 toward the receiving cavity 300. In other words, the first contact 110 at least partially protrudes from the first circuit board 100 and is located within the receiving cavity 300.

[0031] A second contact 210 is provided on a side of the second circuit board 200 facing the accommodating cavity 300. The second contact 210 at least partially protrudes from the second circuit board 200 toward the accommodating cavity 300. In other words, the second contact 210 at least partially protrudes from the second circuit board 200 and is located within the accommodating cavity 300.

[0032] The second electronic component 220 is provided on the side of the second circuit board 200 facing away from the accommodating cavity 300. Thus, by arranging the second electronic component 220 on the side of the second circuit board 200 facing away from the accommodating cavity 300, it is possible to avoid arranging the second electronic component 220 on the first circuit board 100, thereby causing the second electronic component 220 to occupy the component arrangement area of ​​the first circuit board 100, thereby reducing the board area of ​​the first circuit board 100.

[0033] In the embodiment of the present application, the accommodating cavity 300 is used to accommodate the card tray assembly 400. The card tray assembly 400 includes a card tray body 410 and a first card body 420 and / or a second card body 430 provided on the card tray body 410. The first contact 110 is used to electrically connect to the first card body 420, and the second contact 210 is used to electrically connect to the second card body 430.

[0034] Illustratively, the card tray assembly 400 includes a card tray body 410 and a first card body 420. Alternatively, the card tray assembly 400 includes the card tray body 410 and a second card body 430. Alternatively, the card tray assembly 400 includes the card tray body 410, the first card body 420, and the second card body 430. Of course, it is understood that when the card tray body 410 is not provided with the first card body 420 or the second card body 430, the card tray body 410 can also be accommodated in the accommodating cavity 300.

[0035] In this way, in an embodiment of the present application, the circuit board assembly 1 includes a first circuit board 100 and a second circuit board 200 connected to each other, a accommodating cavity 300 is surrounded by the first circuit board 100 and the second circuit board 200, a first contact 110 is provided on the side of the first circuit board 100 facing the accommodating cavity 300, and a second contact 210 is provided on the side of the second circuit board 200 facing the accommodating cavity 300. Therefore, the card tray assembly 400 accommodated in the accommodating cavity 300 includes a first card body 420 and a second card body 430, which can be electrically connected to the first circuit board 100 via the first contact 110 and the second contact 210, respectively.

[0036] Furthermore, the side of the second circuit board 200 facing away from the accommodating cavity 300 can be used to arrange electronic components. For example, the second electronic component 220 can be arranged on the side of the second circuit board 200 facing away from the accommodating cavity 300. This avoids placing the second electronic component 220 on the first circuit board 100, which would otherwise occupy the component arrangement area of ​​the first circuit board 100, thereby reducing the surface area of ​​the first circuit board 100.

[0037] In some embodiments, the first card body 420 and the second card body 430 are any two of a first user identification card, a second user identification card, and a memory card. For example, the first card body 420 is a first user identification card, and the second card body 430 is a second user identification card. Alternatively, the first card body 420 is a first user identification card, and the second card body 430 is a memory card. These are not listed here one by one.

[0038] Illustratively, the first subscriber identification card is a Subscriber Identity Module (SIM) card or a User Identity Model (UIM) card. Of course, with technological advancements, other subscriber identification cards may become available in the future. Therefore, the first subscriber identification card may also be any other future subscriber identification card. The second subscriber identification card is similar to the first subscriber identification card and will not be further described here.

[0039] Exemplarily, the memory card may be a TransFlash (TF) memory card.

[0040] refer to Figure 1 and Figure 4 In some embodiments, a carrier 120 is provided on the portion of the first circuit board 100 facing the accommodating cavity 300. The first contact 110 is disposed on the carrier 120, with at least a portion of the first contact 110 protruding from the carrier 120 toward the accommodating cavity 300. In other words, the first contact 110 at least partially protrudes from the carrier 120 and is located within the accommodating cavity 300. A card tray ejection mechanism 121 is fixedly connected to the carrier 120.

[0041] In this way, by disposing the first contacts 110 and the card tray ejection mechanism 121 on the carrier 120, which is then connected to the first circuit board 100, the difficulty of arranging the first contacts 110 and the card tray ejection mechanism 121 can be reduced. It should be noted that the card tray ejection mechanism 121 is used to eject the card tray body 410 contained in the accommodating cavity 300 when the card tray body 410 itself is operated. When the card tray body 410 is provided with a first card body 420 and a second card body 430, the first card body 420 and the second card body 430 can be ejected from the accommodating cavity 300 along with the card tray body 410.

[0042] For example, the first contact 110 is formed by a first metal spring. The first metal spring is welded to the carrier 120, which is welded to the first circuit board 100. The first metal spring is electrically connected to the first circuit board 100 via the carrier 120. Of course, in other embodiments, the first metal spring may be directly welded to the first circuit board 100. The first metal spring is directly electrically connected to the first circuit board 100. The second contact 210 is formed by a second metal spring. The second metal spring is welded to the second circuit board 200. The second metal spring is electrically connected to the second circuit board 200.

[0043] In some embodiments, the first metal spring includes a first conductive contact portion that protrudes from the first circuit board 100 and is located within the accommodating cavity 300. The second metal spring includes a second conductive contact portion that protrudes from the carrier 120 and is located within the accommodating cavity 300. Thus, when the card holder body 410, which carries the first card body 420 and the second card body 430, is inserted into the accommodating cavity 300, the first card body 420 abuts against the first conductive contact portion of the first metal spring, thereby electrically connecting the first card body 420 to the first circuit board 100 via the first metal spring. The second card body 430 abuts against the second conductive contact portion of the second metal spring, thereby electrically connecting the second card body 430 to the second circuit board 200 via the second metal spring. Furthermore, when the second circuit board 200 is electrically connected to the first circuit board 100, the second card body 430 is electrically connected to the first circuit board 100 via the second metal spring and the second circuit board 200.

[0044] Exemplarily, the first circuit board 100 is a main board or a sub-board of an electronic device. In this way, the first card body 420 and the second card body 430 of the card tray assembly 400 accommodated in the accommodating cavity 300 can be electrically connected to the main board or the sub-board of the electronic device.

[0045] refer to Figure 2In some embodiments, the side of the first circuit board 100 where the first contacts 110 are located serves as the first component placement side 130. The orthographic projection of the first component placement side 130 on the second circuit board 200 forms a projection area 230, and the first electronic component 140 is located in an area of ​​the first component placement side 130 outside the projection area 230. In other words, the area of ​​the first component placement side 130 of the first circuit board 100 outside the second circuit board 200 can be used to accommodate the first electronic component 140.

[0046] It should be noted that in some embodiments, the first electronic component 140 includes multiple first sub-components, and the second electronic component 220 includes multiple second sub-components. For example, the first sub-components are resistors, inductors, capacitors, or chips, and the second sub-components are resistors, inductors, capacitors, or chips, for example.

[0047] Understandably, the reference Figure 2 If the second circuit board 200 is not provided, the second electronic component 220 needs to be arranged on the first component arrangement side 130. In this way, it is necessary to increase the board area of ​​the first circuit board 100 so that both the first electronic component 140 and the second electronic component 220 can be arranged on the first component arrangement side 130. As a result, the board area of ​​the first circuit board 100 will be larger. However, by adopting the solution provided in the embodiment of the present application, the second electronic component 220 can be arranged on the second circuit board 200. In this way, the number of electronic components that need to be arranged on the first circuit board 100 can be shared, thereby achieving the effect of reducing the board area of ​​the first circuit board 100.

[0048] In some embodiments, the side of the first circuit board 100 facing away from the second circuit board 200 serves as the second component placement side. A third electronic component (not shown) is disposed on the second component placement side. This allows the surface area of ​​the first circuit board 100 to be further reduced by placing electronic components on the back side of the first circuit board 100.

[0049] refer to Figure 3 In some embodiments, the second circuit board 200 is a cavity printed circuit board (PCB). A groove 240 is provided on the side of the second circuit board 200 facing the first circuit board 100. Figure 1 The groove wall of the groove 240 and the first circuit board 100 form an accommodating cavity 300. In this way, the difficulty of forming the accommodating cavity 300 can be reduced by using a concave cavity circuit board as the second circuit board 200.

[0050] For example, the second circuit board 200 can be processed into the groove 240 by using a controlled depth milling process on the basis of a conventional circuit board, so that the conventional circuit board processed by the controlled depth milling process becomes a cavity circuit board.

[0051] It should be noted that, of course, in other embodiments, the second circuit board 200 may also be a conventional circuit board, and the second circuit board 200 may be supported by a support member so as to form a receiving cavity 300 between the second circuit board 200 and the first circuit board 100. Of course, to facilitate understanding of the solutions provided by the embodiments of the present application by those skilled in the art, the solutions provided by the embodiments of the present application will be described below using the second circuit board 200 as a concave cavity circuit board as an example.

[0052] refer to Figure 1 and Figure 3 In some embodiments, a first protrusion 241 and a second protrusion 242 are respectively provided on both sides of the groove 240. The first protrusion 241 is connected to the first circuit board 100 on the side facing the first circuit board 100, and the second protrusion 242 is connected to the first circuit board 100 on the side facing the first circuit board 100. In this way, by connecting the first protrusion 241 to the first circuit board 100 and the second protrusion 242 to the first circuit board 100, the groove wall of the groove 240 and the first circuit board 100 can enclose a receiving cavity 300.

[0053] refer to Figure 1 and Figure 3 In some embodiments, a first solder pad 243 is provided on the side of the first protrusion 241 facing the first circuit board 100, and a second solder pad 244 is provided on the side of the second protrusion 242 facing the first circuit board 100. The first solder pad 243 is connected to the third solder pad 151 of the first circuit board 100, and the second solder pad 244 is connected to the fourth solder pad 152 of the first circuit board 100. In this way, the second circuit board 200 can be fixedly connected to the first circuit board 100 by soldering the first solder pad 243 to the third solder pad 151 and the second solder pad 244 to the fourth solder pad 152.

[0054] In some embodiments, the first circuit board 100 is provided with a first circuit layer 160, and the first contact 110, the third solder pad 151, and the fourth solder pad 152 are all electrically connected to the first circuit layer 160. The second circuit board 200 is provided with a second circuit layer 250, and the second contact 210, the second electronic component 220, the first solder pad 243, and the second solder pad 244 are all connected to the second circuit layer 250.

[0055] In this way, the second circuit board 200 can be fixedly and electrically connected to the first circuit board 100 by soldering the first solder pad 243 and the third solder pad 151, and the second solder pad 244 and the fourth solder pad 152. Furthermore, the second contact 210 and the second electronic component 220 electrically connected to the second circuit layer 250 are electrically connected to the first circuit layer 160 of the first circuit board 100.

[0056] It should be noted that, exemplarily, the second circuit layer 250 may include a plurality of sub-circuit layers spaced apart along the thickness direction of the second circuit board 200. Figure 1 and Figure 3 The second circuit board 200 includes a substrate 200a. The second contacts 210 and the second electronic component 220 are connected to the substrate 200a. The substrate 200a is provided with a plurality of through holes 261. The through holes 261 are filled with a conductive material 262, so that the corresponding sub-circuit layers can be electrically connected by the conductive material 262.

[0057] In order to enable those skilled in the art to better understand the solution provided by the embodiment of the present application, the following briefly introduces the assembly method of the circuit board assembly 1.

[0058] In some embodiments, a first circuit board 100 may be fabricated first. A first electronic component 140 , a carrier 120 , a third pad 151 , and a fourth pad 152 are disposed on a first component placement side 130 of the first circuit board 100 . A first contact 110 is disposed on the carrier 120 .

[0059] Then, a second circuit board 200 can be manufactured. A second contact 210 is provided at the bottom of a groove 240 of the second circuit board 200. A first protrusion 241 and a second protrusion 242 are provided on either side of the groove 240. The first protrusion 241 facing the first circuit board 100 is provided with a first soldering pad 243, and the second protrusion 242 facing the first circuit board 100 is provided with a second soldering pad 244. A second electronic component 220 is provided on the side of the second circuit board 200 facing away from the accommodating cavity 300.

[0060] Then, the first soldering pad 243 and the third soldering pad 151 can be soldered, and the second soldering pad 244 and the fourth soldering pad 152 can be soldered, so that the second circuit board 200 is fixedly and electrically connected to the first circuit board 100. This also allows the second contact 210 and the second electronic component 220 electrically connected to the second circuit layer 250 to be electrically connected to the first circuit layer 160 of the first circuit board 100.

[0061] It should be noted that the above assembly method is only an example. Those skilled in the art can also flexibly adjust the order of each step according to their needs when implementing the solution provided in the embodiment of the present application, which will not be further explained here.

[0062] An embodiment of the present application provides an electronic device. The electronic device provided by the embodiment of the present application includes: a frame and any one of the circuit board assemblies 1 provided by the embodiment of the present application.

[0063] In some embodiments, the frame is provided with a through hole communicating with the accommodating cavity 300 , and the electronic device further includes a card holder body 410 , which is detachably inserted into the accommodating cavity 300 through the through hole.

[0064] In the case of a mobile phone, the frame is the midframe of the mobile phone. The midframe includes a frame portion, and the through-holes are provided in the frame portion. The first circuit board 100 is a sub-board of the electronic device. Of course, in some embodiments, the first circuit board 100 can also be the mainboard of the electronic device. The second circuit board 200 can be considered as a circuit board stacked on the first circuit board 100. The surface area of ​​the second circuit board 200 is smaller than the surface area of ​​the first circuit board 100.

[0065] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0066] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: A first circuit board (100) and a second circuit board (200) connected to each other; A receiving cavity (300) is provided between the first circuit board (100) and the second circuit board (200); a first contact (110) is provided on a side of the first circuit board (100) facing the receiving cavity (300); the first contact (110) at least partially protrudes relative to the first circuit board (100) toward the receiving cavity (300); a second contact (210) is provided on a side of the second circuit board (200) facing the receiving cavity (300); the second contact (210) at least partially protrudes relative to the second circuit board (200) toward the receiving cavity (300); and a second electronic component (220) is provided on a side of the second circuit board (200) facing away from the receiving cavity (300); The accommodating cavity (300) is used to accommodate a card tray assembly (400), wherein the card tray assembly (400) comprises a card tray body (410) and a first card body (420) and / or a second card body (430) provided on the card tray body (410); The first contact (110) is used for electrically connecting to the first card body (420), and the second contact (210) is used for electrically connecting to the second card body (430).

2. The circuit board assembly according to claim 1, wherein: A carrier (120) is provided on a portion of the first circuit board (100) facing the accommodating cavity (300), the first contact (110) is provided on the carrier (120), and the first contact (110) at least partially protrudes relative to the carrier (120) toward the accommodating cavity (300), and a card tray ejection mechanism (121) is fixedly connected to the carrier (120).

3. The circuit board assembly according to claim 1, wherein: The side of the first circuit board (100) on which the first contact (110) is provided is a first component arrangement side (130); an orthographic projection of the second circuit board (200) on the first component arrangement side (130) forms a projection area (230); and a first electronic component (140) is provided in an area of ​​the first component arrangement side (130) located outside the projection area (230).

4. The circuit board assembly according to claim 1, wherein: The first card body (420) and the second card body (430) are any two of a first user identification card, a second user identification card, and a memory card.

5. The circuit board assembly according to any one of claims 1 to 4, wherein: The second circuit board (200) is a concave circuit board, and a groove (240) is provided on a side of the second circuit board (200) facing the first circuit board (100), and the groove wall of the groove (240) and the first circuit board (100) enclose the accommodating cavity (300).

6. The circuit board assembly according to claim 5, wherein: A first protrusion (241) and a second protrusion (242) are respectively provided on both sides of the groove (240); the first protrusion (241) is connected to the first circuit board (100) on the side facing the first circuit board (100), and the second protrusion (242) is connected to the first circuit board (100) on the side facing the first circuit board (100).

7. The circuit board assembly according to claim 6, wherein: A first soldering pad (243) is provided on the side of the first protrusion (241) facing the first circuit board (100), and a second soldering pad (244) is provided on the side of the second protrusion (242) facing the first circuit board (100), the first soldering pad (243) is connected to the third soldering pad (151) of the first circuit board (100), and the second soldering pad (244) is connected to the fourth soldering pad (152) of the first circuit board (100).

8. The circuit board assembly according to claim 7, wherein: The first circuit board (100) is provided with a first circuit layer (160), and the first contact (110), the third solder pad (151), and the fourth solder pad (152) are all electrically connected to the first circuit layer (160); The second circuit board (200) is provided with a second circuit layer (250), and the second contact (210), the second electronic component (220), the first soldering pad (243), and the second soldering pad (244) are all connected to the second circuit layer (250).

9. An electronic device, characterized in that: include: A frame and a circuit board assembly according to any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that The frame is provided with a through hole communicating with the accommodating cavity (300), and the electronic device further comprises a card holder body (410), wherein the card holder body (410) is detachably inserted into the accommodating cavity (300) via the through hole.

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