Micro-channel radiator and electronic equipment

Abstract

The embodiment of the invention provides a micro-channel radiator and electronic equipment, and relates to the technical field of electronic heat dissipation, the micro-channel radiator comprises a radiator body used for being in contact with a to-be-cooled part, and the radiator body is internally provided with a heat exchange cavity and at least one flow channel. The radiator body is provided with an inlet and an outlet which are communicated with the heat exchange cavity, and the heat exchange cavity is at least divided into a first heat exchange area and a second heat exchange area in the direction from the inlet to the outlet. One end of the flow channel is communicated with the first heat exchange area, and the other end of the flow channel is communicated with the outlet, so that one part of fluid entering from the inlet flows through the first heat exchange area and flows to the outlet from the flow channel, and the other part of fluid flows to the outlet after flowing through the second heat exchange area. According to the micro-channel radiator provided by the embodiment of the invention, a part of high-temperature fluid after heat exchange in the first heat exchange area is discharged, and the low-temperature fluid exchanges heat with the second heat exchange area, so that the temperature difference of each area can be reduced, and the performance and the service life of the to-be-radiated part are ensured.

Description

Technical Field

[0001] The present application relates to the technical field of electronic heat dissipation, and in particular to a microchannel radiator and electronic equipment. Background Art

[0002] As electronic devices develop towards high power, high integration and high density, the heat they generate is also increasing, and usually a heat sink is needed to dissipate the heat, such as a microchannel heat sink.

[0003] In the related art, a heat exchange chamber is provided in the radiator, with an inlet on one side and an outlet on the other side, so that the fluid flows into the heat exchange chamber from the inlet and flows out from the outlet after sufficient heat exchange to dissipate heat and cool the electronic components.

[0004] However, the temperature uniformity of the front and rear regions of the heat sink along the direction from the inlet to the outlet is poor, which affects the performance and life of the electronic device. Summary of the Invention

[0005] Based on this, the present application provides a microchannel radiator and electronic equipment to solve the problem of poor temperature uniformity in the front and rear areas along the inlet to outlet direction of the existing radiator, which affects the performance and life of the battery device.

[0006] In a first aspect, the present application provides a microchannel heat sink, comprising a heat sink body for contacting a heat dissipation element, the heat sink body having a heat exchange cavity and at least one flow channel;

[0007] The radiator body has an inlet and an outlet respectively connected to the heat exchange chamber, and the heat exchange chamber is divided into at least a first heat exchange area and a second heat exchange area along the direction from the inlet to the outlet;

[0008] One end of the flow channel is connected to the first heat exchange zone, and the other end of the flow channel is connected to the outlet, so that part of the fluid entering from the inlet flows through the first heat exchange zone and flows from the flow channel to the outlet, and the other part of the fluid flows through the second heat exchange zone and then flows to the outlet.

[0009] In one possible implementation, a partition is provided in the radiator body, the partition being located in the first heat exchange region to divide a portion of the first heat exchange region into a first chamber and a second chamber, wherein the first chamber and the second chamber are at least partially stacked.

[0010] The first chamber is close to the heat element to be cooled, and allows the fluid flowing through the first chamber to flow into the flow channel and the second heat exchange area;

[0011] The second chamber is away from the heat element to be dissipated, and allows the fluid flowing through the second chamber to flow into the second heat exchange area.

[0012] In a possible implementation, the flow channel is communicated with a side of the first chamber facing away from the inlet.

[0013] In a possible implementation, a flow blocking portion is provided in the radiator body, and the flow blocking portion is located between the first chamber and the second heat exchange area to limit the flow of the fluid flowing from the first chamber to the second heat exchange area.

[0014] In a possible implementation, the radiator body has at least a partial flow guide portion, and the flow guide portion is located in the second heat exchange area to guide the fluid flowing through the second chamber to the second heat exchange area.

[0015] In a possible implementation, the flow guide portion is a flow guide slope, and the flow guide slope is located on a side of the heat exchange cavity away from the heat element to be dissipated;

[0016] A first distance is formed between the inner wall of the heat exchange cavity on the side close to the heat element to be dissipated and the guide slope, and the first distance gradually decreases from the inlet to the outlet.

[0017] In a possible implementation, a turbulent body is further included, and at least one of the first chamber and the second heat exchange area is provided with a plurality of turbulent bodies.

[0018] In a possible implementation, the fluid-disturbing fluids in the first chamber and / or the second heat exchange zone are arranged in a front-to-back staggered manner along the direction from the inlet to the outlet.

[0019] In a possible implementation, the cross-section of the disturbing body includes an ellipse, and the major axis of the ellipse is arranged along the direction from the inlet to the outlet.

[0020] In a possible implementation, the fluid disturbance device is connected to the inner wall of the heat exchange cavity on a side close to the heat element to be dissipated.

[0021] In a possible implementation, two flow channels are provided, and the two flow channels are respectively located on both sides of the heat exchange cavity along the direction from the inlet to the outlet.

[0022] In one possible implementation, the radiator body includes a bottom plate, a cover, and at least one partition plate. A heat exchange surface is provided on one side of the bottom plate, and the heat exchange surface is used to contact the heat element to be dissipated.

[0023] The cover is arranged on the side of the bottom plate away from the heat exchange surface to enclose and form a cavity. The partition is arranged in the cavity and divides the cavity into a heat exchange cavity and a flow channel.

[0024] An inlet and an outlet are left on at least one of the bottom plate and the cover.

[0025] In a possible implementation, a through hole is opened on the partition, and the through hole is located on a side close to the heat exchange surface, and the through hole connects the flow channel and the first heat exchange zone.

[0026] In a second aspect, the present application further provides an electronic device, comprising an electronic device and any one of the microchannel heat sinks provided in the first aspect, arranged on the electronic device.

[0027] In the microchannel radiator and electronic device provided in the present application, the microchannel radiator includes a radiator body, which is used to contact the parts to be cooled. A heat exchange chamber and at least one flow channel are arranged in the radiator body, and an inlet and an outlet connected to the heat exchange chamber are respectively arranged on the radiator body for fluid to enter and exit. The heat exchange chamber is divided into at least a first heat exchange zone and a second heat exchange zone along the direction from the inlet to the outlet so that the fluid flows through for heat exchange. One end of the flow channel is connected to the first heat exchange zone, and the other end of the flow channel is connected to the outlet, so that a part of the fluid entering from the inlet flows through the first heat exchange zone and flows from the flow channel to the outlet, discharging a part of the high-temperature fluid after heat exchange, and the other part of the fluid flows through the second heat exchange zone and flows to the outlet, continuing to exchange heat in the remaining areas and then discharging the fluid. Therefore, the microchannel radiator provided in the present application can reduce the temperature difference between the first heat exchange zone and the second heat exchange zone by discharging a portion of the high-temperature fluid after heat exchange in the first heat exchange zone and allowing the relatively low-temperature fluid to exchange heat with the second heat exchange zone, thereby making the temperature uniformity of each zone better. In particular, for a heat-dissipating component with multiple heating areas, each heat exchange zone can dissipate heat for each heating area separately, making the heat dissipation uniformity better, thereby ensuring the performance and life of the heat-dissipating component. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] Figure 1 A schematic diagram of the main cross-sectional structure of a microchannel radiator provided in an embodiment of the present application;

[0030] Figure 2 for Figure 1 Schematic diagram of the structure in which the cover is removed;

[0031] Figure 3 for Figure 2 A schematic diagram of a top view of the structure in which the partition and the guide portion are removed;

[0032] Figure 4 for Figure 3 Schematic diagram of the arrangement of the disturbing fluid at A in the middle;

[0033] Figure 5 A comparison chart of simulation results of the microchannel radiator provided in the embodiment of the present application and the conventional pin-type radiator.

[0034] Reference numerals:

[0035] 100: Radiator body;

[0036] 1001: Import;

[0037] 1002: Export;

[0038] 101: bottom plate;

[0039] 102: cover;

[0040] 103: partition;

[0041] 1031: through hole;

[0042] 110: heat exchange cavity;

[0043] 111: first heat exchange zone;

[0044] 112: second heat exchange zone;

[0045] 1111: first chamber;

[0046] 1112: Second chamber;

[0047] 120: runner;

[0048] 130: separator;

[0049] 140: flow blocking part;

[0050] 150: diversion part;

[0051] 200: Disturbing fluid. DETAILED DESCRIPTION

[0052] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of methods and apparatus consistent with certain aspects of the present application, as detailed in the appended claims.

[0053] The terms "first," "second," "third," "fourth," etc. (if any) in the specification and claims of the present application and in the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential sequence. It should be understood that the numbers used in this way are interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or apparatus.

[0054] Currently, the main compact heat sink for dissipating heat from insulated gate bipolar transistors (IGBTs) is a pin-type heat sink. This type of heat sink is often processed using an integrated die-casting method and has the advantages of low cost, easy processing, and wear resistance. This structure mainly considers the feasibility of processing and reliability during use, and therefore makes certain compromises in heat transfer performance and flow resistance. During the heat dissipation process of high-power electronic devices, the closer the fluid is to the outlet area, the higher the temperature. Therefore, the temperature of electronic components closer to the outlet is higher, while the temperature of electronic components closer to the inlet is lower. This results in poor overall temperature uniformity of electronic components, which on the one hand affects the service life of some electronic components, and on the other hand, uneven distribution of thermal stress can easily lead to local fatigue damage. As the power of electronic devices increases, this problem of poor temperature uniformity will be further exacerbated. In addition, in order to control the temperature, the needles need to be arranged densely, and this dense staggered arrangement seriously hinders the flow of fluid, resulting in increased flow resistance. As the power of electronic devices continues to increase, this method of continuously increasing the number of needles is unsustainable, both from the perspective of temperature control and flow resistance.

[0055] In response to the above-mentioned problems existing in the prior art, the present application provides a microchannel radiator and an electronic device. The microchannel radiator provided by the present application includes a radiator body for contacting with a heat dissipation element, and a heat exchange cavity and at least one flow channel are provided in the radiator body, and an inlet and an outlet connected to the heat exchange cavity are provided on the radiator body respectively for fluid in and out, and the heat exchange cavity is divided into at least a first heat exchange zone and a second heat exchange zone along the direction from the inlet to the outlet so that the fluid flows through the heat exchange, and one end of the flow channel is connected to the first heat exchange zone, and the other end of the flow channel is connected to the outlet, so that a part of the fluid entering from the inlet flows through the first heat exchange zone and flows from the flow channel to the outlet, and is discharged. A part of the high-temperature fluid after heat exchange, and the other part of the fluid flows to the outlet after passing through the second heat exchange zone, and continues to exchange heat with the remaining areas before discharging the fluid. That is, by discharging a part of the high-temperature fluid after heat exchange in the first heat exchange zone, allowing the relatively low-temperature fluid to exchange heat with the second heat exchange zone, the temperature difference between the first heat exchange zone and the second heat exchange zone can be narrowed, and the temperature uniformity of each area can be better. Especially for the heat-dissipating parts with multiple heating areas, each heat exchange zone can dissipate heat for each heating area separately, so that the heat dissipation uniformity is better, thereby ensuring the performance and life of the heat-dissipating parts.

[0056] The following specific embodiments are used to describe the technical solution of the present application in detail. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0057] First, please refer to Figure 1-Figure 5 As shown, an embodiment of the present application provides a microchannel heat sink, including a heat sink body 100 for contacting a heat element to be cooled. The heat sink body 100 has a heat exchange cavity 110 and at least one flow channel 120 therein.

[0058] The radiator body 100 has an inlet 1001 and an outlet 1002 communicating with the heat exchange chamber 110 . The heat exchange chamber 110 is divided into at least a first heat exchange area 111 and a second heat exchange area 112 along the direction from the inlet 1001 to the outlet 1002 .

[0059] One end of the flow channel 120 is connected to the side of the first heat exchange zone 111 close to the heat element to be dissipated, and the other end of the flow channel 120 is connected to the outlet 1002, so that part of the fluid entering from the inlet 1001 flows through the first heat exchange zone 111 and flows from the flow channel 120 to the outlet 1002, and the other part of the fluid flows through the second heat exchange zone 112 and then flows to the outlet 1002.

[0060] The radiator body 100 in this embodiment is used to accommodate the heat exchange fluid. It can be a shell structure and can be formed by splicing or integrally forming. The outer shape is roughly a rectangular thin plate. One side of the outer surface of the radiator body 100 has a heat exchange surface, such as Figure 1The bottom surface in the heat exchange surface is used to contact the heat dissipation component (such as electronic devices). Therefore, the size of the heat exchange surface is related to the size of the heat dissipation component.

[0061] Among them, the radiator body 100 has a heat exchange chamber 110 for accommodating heat exchange fluid. An inlet 1001 is opened on one side of the radiator body 100, and an outlet 1002 is opened on the other side. The inlet 1001 and the outlet 1002 are respectively connected to the heat exchange chamber 110, so that the fluid can flow into the heat exchange chamber 110 from the inlet 1001, and then flow out from the outlet 1002 after heat exchange.

[0062] Furthermore, the heat exchange chamber 110 is divided into a first heat exchange zone 111 and a second heat exchange zone 112 along the length from the inlet 1001 to the outlet 1002. The first heat exchange zone 111 and the second heat exchange zone 112 respectively exchange heat with different areas on the heat sink. Of course, the chamber 110 can be divided into more areas. It should be noted that the specific sizes of the first heat exchange zone 111 and the second heat exchange zone 112 can be determined based on actual needs.

[0063] In addition, the radiator body 100 has a flow channel 120 for promptly discharging the high-temperature fluid after heat exchange. One end of the flow channel 120 is connected to the side of the first heat exchange zone 111 close to the heat element to be cooled, and the other end of the flow channel 120 is connected to the outlet 1002.

[0064] Specifically, after the fluid flows through the first heat exchange zone 111, the temperature of the fluid closer to the heat element to be dissipated is relatively higher. This portion of the high-temperature fluid after heat exchange flows into the flow channel 120 and is promptly discharged. On the other hand, the temperature of the fluid farther from the heat element to be dissipated is relatively lower. This portion of the low-temperature fluid flows into the second heat exchange zone 112 to continue heat exchange with the remaining area. Alternatively, the fluid flowing through the first heat exchange zone 111 does not flow into the second heat exchange zone 112 and is directly discharged.

[0065] The simulation results of the microchannel radiator in the embodiment of the present application are compared with those of the conventional single-layer pin-type radiator. Figure 5 As shown, Figure (a) is a temperature cloud diagram of the fluid cross section of the microchannel radiator in an embodiment of the present application, (b) is a streamline-pressure cloud diagram of the microchannel radiator in an embodiment of the present application, (c) is a streamline-flow velocity cloud diagram of the microchannel radiator in an embodiment of the present application, (d) is a temperature cloud diagram of the fluid cross section of the conventional needle-column radiator, (e) is a streamline-pressure cloud diagram of the conventional needle-column radiator, and (f) is a streamline-flow velocity cloud diagram of the conventional needle-column radiator.

[0066] As can be seen from the above figure, from the cross-sectional temperature cloud map, it can be found that the fluid temperature of the conventional needle-column radiator gradually decreases from the inlet to the outlet, and the temperature difference of the fluid between the inlet and outlet is close to 20°C. However, the fluid temperature change trend of the microchannel radiator in the embodiment of the present application is significantly different. After the fluid temperature in the first heat exchange zone 111 gradually rises, the high-temperature fluid flows away from the lateral flow channel 120, and the upper low-temperature fluid flows into the second heat exchange zone 112, which has a strong effect on promoting the heat exchange in the second heat exchange zone 112. From the streamline-pressure cloud map, it can be seen that the fluid in the microchannel radiator in the embodiment of the present application has obvious stratified flow. After passing through the first heat exchange zone 111, the lower layer of fluid flows to the flow channels 120 on both sides. Due to the reduction in channel size, the flow rate increases significantly here. In addition, the pressure difference between the inlet and outlet is also significantly reduced compared to the conventional needle-column radiator.

[0067] It can be understood that, compared with the heat exchange structure in the prior art that does not discharge the high-temperature fluid in a timely manner, the application of the microchannel radiator in the embodiment of the present application can reduce the temperature difference between the first heat exchange zone 111 and the second heat exchange zone 112 by timely discharging a portion of the high-temperature fluid after heat exchange in the first heat exchange zone 111, allowing the relatively low-temperature fluid to exchange heat with the second heat exchange zone 112, thereby making the temperature uniformity of each area better. In particular, for a heat-dissipating component with multiple heating areas, each heat exchange zone can dissipate heat for each heating area separately, so that the heat dissipation uniformity is better.

[0068] Thus, the microchannel radiator provided in the embodiment of the present application includes a radiator body 100 for contacting a heat element to be radiated, and a heat exchange chamber 110 and at least one flow channel 120 are provided in the radiator body 100, and an inlet 1001 and an outlet 1002 are provided on the radiator body 100 respectively, which are connected to the heat exchange chamber 110, so as to allow fluid to enter and exit, and the heat exchange chamber 110 is divided into at least a first heat exchange zone 111 and a second heat exchange zone 112 along the direction from the inlet 1001 to the outlet 1002, so that the fluid flows through the heat exchange, and one end of the flow channel 120 is connected to the first heat exchange zone 111, and the other end of the flow channel 120 is connected to the outlet 1002, so that a part of the fluid entering from the inlet 1001 is The fluid flows through the first heat exchange zone 111 and flows from the flow channel 120 to the outlet 1002, discharging a portion of the high-temperature fluid after heat exchange, and the other portion of the fluid flows through the second heat exchange zone 112 and flows to the outlet 1002, continuing to heat the remaining areas and then discharging the fluid. That is, by discharging a portion of the high-temperature fluid after heat exchange in the first heat exchange zone 111 and allowing the relatively low-temperature fluid to exchange heat with the second heat exchange zone 112, the temperature difference between the first heat exchange zone 111 and the second heat exchange zone 112 can be reduced, so that the temperature uniformity of each area is better. In particular, for a heat-dissipating component with multiple heating areas, each heat exchange zone can dissipate heat for each heating area separately, so that the heat dissipation uniformity is better, thereby ensuring the performance and life of the heat-dissipating component.

[0069] In some embodiments, the radiator body 100 has a partition 130 therein, which is located in the first heat exchange area 111 to divide part of the first heat exchange area 111 into a first chamber 1111 and a second chamber 1112. The first chamber 1111 and the second chamber 1112 are at least partially stacked.

[0070] The first chamber 1111 is close to the heat element to be cooled, and allows the fluid flowing through the first chamber 1111 to flow into the flow channel 120 and the second heat exchange area 112 .

[0071] The second chamber 1112 is away from the heat element to be dissipated, and allows the fluid flowing through the second chamber 1112 to flow into the second heat exchange area 112 .

[0072] Specifically, if Figure 1 As shown, the partition 130 is used to divide the heat exchange chamber 110 in the first heat exchange zone 111 into a first chamber 1111 and a second chamber 1112. The partition 130 can be a partition, that is, the partition divides the heat exchange chamber 110 in the first heat exchange zone 111 into two layers, the first chamber 1111 is located on the side close to the heat exchange surface, and the second chamber 1112 is located on the side away from the heat exchange surface.

[0073] In this way, the fluid is divided into two parts after flowing into the first heat exchange zone 111. One part of the fluid enters the first chamber 1111 and mainly exchanges heat with the heat-dissipating components to be cooled corresponding to the first heat exchange zone 111. After the heat exchange, a high-temperature fluid is formed, and then a part of it is discharged through the flow channel 120 and enters the second heat exchange zone 112 at the same time; the other part of the fluid enters the second chamber 1112. Since it does not participate in the main heat exchange, it maintains a relatively low temperature and flows directly into the second heat exchange zone 112 to exchange heat with the heat-dissipating components to be cooled corresponding to the second heat exchange zone 112, thereby ensuring the heat exchange effect of the second heat exchange zone 112 and reducing the temperature between the two.

[0074] Furthermore, in this embodiment, the flow channel 120 is communicated with a side of the first chamber 1111 away from the inlet 1001 .

[0075] Set it up like this, Figure 2 As shown, the high-temperature fluid is discharged from the flow channel 120 after the fluid has been fully heat exchanged in the first heat exchange zone 111 as much as possible, so as to avoid the fluid being discharged from the flow channel 120 before being fully heat exchanged.

[0076] The specific communication position and structure between the flow channel 120 and the first chamber 1111 can be determined according to actual needs and are not specifically limited in this embodiment.

[0077] Furthermore, in this embodiment, a flow block 140 is provided in the radiator body 100 . The flow block 140 is located between the first chamber 1111 and the second heat exchange area 112 to limit the flow of the fluid flowing from the first chamber 1111 to the second heat exchange area 112 .

[0078] With this arrangement, the flow-blocking portion 140 can significantly restrict the flow of high-temperature fluid after sufficient heat exchange in the first chamber 1111 into the second heat exchange area 112, thereby reducing the impact of the high-temperature fluid on the second heat exchange area 112. The extent of the flow-limiting effect of the flow-blocking portion 140 on the flow between the first chamber 1111 and the second heat exchange area 112 can be determined based on actual needs and is not specifically limited in this embodiment.

[0079] For example, Figure 3 As shown, the flow blocking portion 140 is two blocks, which are arranged between the first chamber 1111 and the second heat exchange area 112. A flow groove flows between the two blocks to allow part of the fluid flowing through the first chamber 1111 to flow through.

[0080] Of course, the flow blocking portion 140 may also be replaced by other types of flow blocking structures, as long as the structure can limit the flow of the fluid, and no excessive restrictions are made in this embodiment.

[0081] Furthermore, in this embodiment, the heat sink body 100 has at least a portion of the guide portion 150 therein. The guide portion 150 is located in the second heat exchange area 112 to guide the fluid flowing through the second chamber 1112 to the second heat exchange area 112 .

[0082] Specifically, if Figure 2 As shown, the guide part 150 is used to guide the fluid flowing through the second chamber 1112 to the second heat exchange area 112. It can be a guide surface, a guide groove, etc. The guide part 150 is used to guide the fluid flowing through the second chamber 1112 to the second heat exchange area 112, thereby reducing the resistance of the fluid flowing from the second chamber 1112 to the second heat exchange area 112.

[0083] Illustratively, in this embodiment, the guide portion 150 is a guide slope, and the guide slope is located on a side of the heat exchange cavity 110 that is away from the heat element to be dissipated.

[0084] A first distance is formed between the inner wall of the heat exchange chamber 110 on the side close to the heat element to be dissipated and the guide slope, and the first distance gradually decreases from the inlet 1001 to the outlet 1002 .

[0085] Specifically, continue as Figure 1 As shown, the guide slope is located on the side of the heat exchange cavity 110 away from the heat exchange surface and close to the second chamber 1112. The distance between the guide slope and the inner wall close to the heat exchange surface gradually decreases from the inlet 1001 to the outlet 1002. Figure 1 Indicated by the positive direction of the X axis.

[0086] In this way, the fluid can smoothly enter the second heat exchange zone 112 under the action of the guiding slope. Changing the slope of the guiding slope can change the position where the upper fluid flows into the rear row of the second heat exchange zone 112, thereby reducing the temperature of the local hot spot in a targeted manner. The specific slope and length of the guiding slope, as well as the specific size of the first spacing, can be determined according to actual needs and are not excessively limited in this embodiment.

[0087] In some embodiments, the microchannel radiator provided in the embodiments of the present application further includes a fluid turbulence 200 , and at least one of the first chamber 1111 and the second heat exchange area 112 is provided with a plurality of fluid turbulence 200 .

[0088] With such a configuration, under the action of the turbulent body 200, complex turbulence can be formed when the fluid flows through, thereby making the fluid heat exchange more sufficient. Figure 3 As shown, a plurality of fluid turbulences 200 are alternately disposed in the first chamber 1111 and the second heat exchange zone 112. Of course, fluid turbulences 200 may also be disposed only in the first chamber 1111 or the second heat exchange zone 112.

[0089] Furthermore, in some embodiments, the flow disturbing fluid 200 of the first chamber 1111 and / or the second heat exchange zone 112 is arranged in a front-to-back staggered manner along the direction from the inlet 1001 to the outlet 1002 .

[0090] In this way, the turbulence effect can be enhanced, making the heat exchange more sufficient and the heat exchange effect better. Figure 3 、 Figure 4 As shown, the flow disturbing body 200 is a protrusion provided in the first chamber 1111 and / or the second heat exchange area 112, such as a needle column, a fin, a corrugated plate, etc.

[0091] For example, in this embodiment, the cross-section of the flow disruptor 200 includes an ellipse, and the major axis of the ellipse is arranged along the direction from the inlet 1001 to the outlet 1002 .

[0092] That is, the disrupting body 200 is an elliptical cylinder, and the long axis of the ellipse is arranged along the direction from the inlet 1001 to the outlet 1002. While ensuring the heat exchange contact surface, it can also reduce a certain flow resistance, thereby improving the heat exchange effect.

[0093] The major axis of the ellipse can be set to about 3 mm, the minor axis can be set to about 1.5 mm, and the height of the ellipse can be set to about 3.5 mm. Figure 4 As shown in the X-axis direction, the distance between the front and rear elliptical cylinders can be set to about 3.5 mm. Figure 4As shown in the Y-axis direction, the spacing between adjacent elliptical cylinders can be set to about 1.25 mm.

[0094] Optionally, a preset gap is left between the fluid turbulence 200 and the inner wall of the heat exchange chamber 110 facing away from the heat exchange element to be dissipated. That is, the average height in the heat exchange chamber 110 can be set to approximately 6 mm, so that the fluid turbulence 200 does not contact the inner wall of the heat exchange chamber 110 facing away from the heat exchange surface. This effectively reduces flow resistance.

[0095] In addition, the flow disruptor 200 can also be set with a draft angle of about 3 degrees, forming a thicker bottom and thinner top structure, which reduces the difficulty of demolding and further reduces the flow resistance. Of course, the flow disruptor 200 can also be set to other shapes and spacings, such as cylindrical, rhombic, or special-shaped columns, according to actual needs, and is not limited in this embodiment.

[0096] Furthermore, in this embodiment, the fluid disturbance body 200 is connected to the inner wall of the heat exchange cavity 110 on the side close to the heat element to be dissipated.

[0097] In this way, the heat on the heat dissipation element can be quickly transferred to each fluid turbulence body 200 and diffused into the fluid through the fluid turbulence body 200, thereby improving the heat exchange rate.

[0098] In some embodiments, two flow channels 120 are provided, and along the direction from the inlet 1001 to the outlet 1002 , the two flow channels 120 are respectively located on both sides of the heat exchange chamber 110 .

[0099] Specifically, if Figure 2 As shown, the two flow channels 120 are arranged from the inlet 1001 to the outlet 1002. Figure 2 As shown in the positive direction of the X-axis, such an arrangement can ensure the flow area of ​​the flow channel 120, is easy to process, and has a more reasonable structure.

[0100] In some embodiments, the radiator body 100 includes a bottom plate 101 , a cover 102 and at least one partition 103 . A heat exchange surface is provided on one side of the bottom plate 101 , and the heat exchange surface is used to contact the heat element to be cooled.

[0101] The cover 102 is disposed on a side of the bottom plate 101 away from the heat exchange surface to enclose and form a cavity. The partition 103 is disposed in the cavity and divides the cavity into a heat exchange chamber 110 and a flow channel 120 .

[0102] An inlet 1001 and an outlet 1002 are left on at least one of the bottom plate 101 and the cover 102 .

[0103] Specifically, if Figure 1As shown, the bottom plate 101 is a thin plate structure with a heat exchange surface on its bottom surface. The cover body 102 is covered on the upper surface of the bottom plate 101 and encloses a cavity. The partition 103 is strip-shaped and divides the cavity into a heat exchange cavity 110 and a flow channel 120. An inlet 1001 is left on one side of the bottom plate 101 or the cover body 102, and an outlet 1002 is left on the other side.

[0104] The bottom plate 101, cover 102, and partition 103 can be individually machined and then welded together. Furthermore, the flow disruptor 200 can be integrally die-cast with the bottom plate 101. The partition 130, flow blocking portion 140, and flow guide 150 can be plate-like structures that are individually machined and then welded to the bottom plate 101, cover 102, or partition 103.

[0105] Furthermore, in this embodiment, a through hole 1031 is formed on the partition 103 . The through hole 1031 is located on a side close to the heat exchange surface. The through hole 1031 communicates with the flow channel 120 and the first heat exchange area 111 .

[0106] Specifically, if Figure 1 、 Figure 2 As shown, a through hole 1031 or a notch is provided on the side of the partition 103 close to the heat exchange surface, and the through hole 1031 connects the flow channel 120 and the first heat exchange zone 111. In order to ensure better discharge of the high-temperature fluid in the first heat exchange zone 111, the through hole 1031 needs to be located on the side away from the inlet 1001 so that the fluid can flow into the flow channel 120 only after sufficient heat exchange.

[0107] The specific shape, size, position, etc. of the through hole 1031 can be determined according to actual needs and are not excessively restricted in this embodiment.

[0108] In a second aspect, an embodiment of the present application further provides an electronic device, comprising an electronic device, on which is disposed a microchannel heat sink provided by any of the above embodiments. The electronic device may be a transistor, a chip, a semiconductor, or the like.

[0109] The structure of the microchannel radiator has been described in detail in the above embodiments and will not be described again here.

[0110] It can be understood that the electronic device provided in the embodiment of the present application is configured with the above-mentioned microchannel radiator, which includes a radiator body 100 for contacting the heat element to be radiated, and a heat exchange cavity 110 and at least one flow channel 120 are provided in the radiator body 100, and an inlet 1001 and an outlet 1002 are respectively provided on the radiator body 100, which are connected to the heat exchange cavity 110, for fluid to enter and exit, and the heat exchange cavity 110 is divided into at least a first heat exchange area 111 and a second heat exchange area 112 along the direction from the inlet 1001 to the outlet 1002, so that the fluid flows through the heat exchange area, and one end of the flow channel 120 is connected to the first heat exchange area 111, and the other end of the flow channel 120 is connected to the outlet 1002, so that the heat from the inlet 10 Part of the fluid entering 01 flows through the first heat exchange zone 111 and flows from the flow channel 120 to the outlet 1002, discharging part of the high-temperature fluid after heat exchange, and the other part of the fluid flows through the second heat exchange zone 112 and then flows to the outlet 1002, continuing to heat the remaining areas and then discharging the fluid. That is, by discharging part of the high-temperature fluid after heat exchange in the first heat exchange zone 111 and allowing the relatively low-temperature fluid to exchange heat with the second heat exchange zone 112, the temperature difference between the first heat exchange zone 111 and the second heat exchange zone 112 can be reduced, so that the temperature uniformity of each area is better. In particular, for a heat-dissipating component with multiple heating areas, each heat exchange zone can dissipate heat for each heating area separately, so that the heat dissipation uniformity is better, thereby ensuring the performance and life of the heat-dissipating component.

[0111] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered merely as exemplary, and the true scope and spirit of the present application are indicated by the claims.

[0112] It should be understood that the present application is not limited to the precise structure described above and shown in the appended drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A microchannel radiator, characterized in that: It comprises a radiator body (100) for contacting a heat element to be cooled, wherein the radiator body (100) has a heat exchange cavity (110) and at least one flow channel (120); The radiator body (100) is provided with an inlet (1001) and an outlet (1002) respectively connected to the heat exchange cavity (110); the heat exchange cavity (110) is divided into at least a first heat exchange zone (111) and a second heat exchange zone (112) along a direction from the inlet (1001) to the outlet (1002); One end of the flow channel (120) is connected to the first heat exchange zone (111), and the other end of the flow channel (120) is connected to the outlet (1002), so that a portion of the fluid entering from the inlet (1001) flows through the first heat exchange zone (111) and flows from the flow channel (120) to the outlet (1002), and another portion of the fluid flows through the second heat exchange zone (112) and then flows to the outlet (1002).

2. The microchannel radiator according to claim 1, characterized in that: The radiator body (100) has a partition (130) therein, the partition (130) being located in the first heat exchange area (111) to separate a portion of the first heat exchange area (111) into a first chamber (1111) and a second chamber (1112), the first chamber (1111) and the second chamber (1112) being at least partially stacked. The first chamber (1111) is close to the heat element to be cooled, and allows the fluid flowing through the first chamber (1111) to flow into the flow channel (120) and the second heat exchange zone (112); The second chamber (1112) is away from the heat element to be dissipated, and allows the fluid flowing through the second chamber (1112) to flow into the second heat exchange zone (112).

3. The microchannel radiator according to claim 2, characterized in that: The flow channel (120) is in communication with a side of the first chamber (1111) that is away from the inlet (1001).

4. The microchannel radiator according to claim 2, characterized in that: A flow blocking portion (140) is provided in the radiator body (100), and the flow blocking portion (140) is located between the first chamber (1111) and the second heat exchange area (112) to limit the flow rate of the fluid flowing from the first chamber (1111) to the second heat exchange area (112).

5. The microchannel heat sink according to claim 2, characterized in that: The radiator body (100) has at least a portion of a guide portion (150) therein, and the guide portion (150) is located in the second heat exchange area (112) to guide the fluid flowing through the second chamber (1112) to the second heat exchange area (112).

6. The microchannel heat sink according to claim 5, characterized in that: The guide portion (150) is a guide slope, and the guide slope is located on a side of the radiator body (100) in the heat exchange cavity (110) facing away from the heat element to be dissipated; A first distance is formed between the inner wall of the heat exchange cavity (110) on the side close to the heat element to be dissipated and the guide slope, and the first distance gradually decreases in the direction from the inlet (1001) to the outlet (1002).

7. The microchannel heat sink according to claim 2, characterized in that: It also includes a fluid turbulence (200), and at least one of the first chamber (1111) and the second heat exchange zone (112) is provided with a plurality of the fluid turbulence (200).

8. The microchannel heat sink according to claim 7, characterized in that: The disturbing fluid (200) of the first chamber (1111) and / or the second heat exchange zone (112) is arranged in a front-to-back staggered manner along the direction from the inlet (1001) to the outlet (1002).

9. The microchannel heat sink according to claim 7, characterized in that: The cross-section of the disrupting body (200) comprises an ellipse, and the major axis of the ellipse is arranged along the direction from the inlet (1001) to the outlet (1002).

10. The microchannel heat sink according to claim 7, characterized in that: The fluid disturbance body (200) is connected to the inner wall of the heat exchange cavity (110) on a side close to the heat element to be dissipated.

11. The microchannel heat sink according to claim 1, wherein: The flow channels (120) are provided in two numbers, and along the direction from the inlet (1001) to the outlet (1002), the two flow channels (120) are respectively located on both sides of the heat exchange cavity (110).

12. The microchannel heat sink according to any one of claims 1 to 11, characterized in that: The radiator body (100) comprises a bottom plate (101), a cover (102) and at least one partition (103); a heat exchange surface is provided on one side of the bottom plate (101); the heat exchange surface is used to contact the heat element to be radiated; The cover (102) is arranged on a side of the bottom plate (101) away from the heat exchange surface to enclose and form a cavity, and the partition (103) is arranged in the cavity and divides the cavity into the heat exchange cavity (110) and the flow channel (120); The inlet (1001) and the outlet (1002) are left on at least one of the bottom plate (101) and the cover (102).

13. The microchannel heat sink according to claim 12, characterized in that: A through hole (1031) is provided on the partition (103), the through hole (1031) is located on a side close to the heat exchange surface, and the through hole (1031) communicates with the flow channel (120) and the first heat exchange area (111).

14. An electronic device, characterized in that: The invention comprises an electronic device and the micro-channel heat sink according to any one of claims 1 to 13 arranged on the electronic device.

Images