Efficient uniform-temperature heat dissipation device

Abstract

The invention relates to the technical field of chip heat dissipation, and discloses an efficient uniform-temperature heat dissipation device which comprises a centralized water cooling assembly, a PCB body used for bearing a heating element and a plurality of heat conduction assemblies. The centralized water cooling assembly comprises a conveying mechanism and a cooling mechanism, the conveying mechanism is used for conveying cooling liquid into the cooling mechanism, and the cooling liquid located in the cooling mechanism is discharged through the conveying mechanism; each heat conduction assembly is provided with a heat absorption end and a heat release end, phase change liquid circulates between the heat dissipation end and the heat exchange end through a channel, and the heat absorption ends of the multiple heat conduction assemblies are all arranged on the PCB body and tightly attached to the corresponding heating elements. According to the efficient uniform-temperature heat dissipation device, the heat dissipation occupied area is reduced, the heat dissipation requirement when the device is used in a high-density data center scene can be met, meanwhile, the heat dissipation temperature among different chips is evenly distributed, targeted regulation and control do not need to be conducted on different heating elements, the control efficiency is effectively improved, and the control cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a high-efficiency temperature-uniform heat dissipation device. Background Art

[0002] With the rapid development of artificial intelligence computing, 5G communications, and high-power power electronic equipment, the heat density of electronic chips is growing exponentially. As the power consumption of chip devices such as GPUs and CPUs continues to increase, high-density heat load scenarios require the cooling system to have sufficient heat dissipation capacity. Traditional air cooling solutions are approaching their physical limits, and immersion liquid cooling has problems with poor compatibility and high cost. Therefore, the industry needs a heat dissipation device with good heat dissipation performance, good compatibility, and high reliability.

[0003] At present, when used in high-heat-density data centers (i.e., high-power chips are relatively dense), water cooling adopts the method of directly installing a water-cooling head on the heat source. The cold water is heated after passing through the water-cooling head, and then flows out from the outlet. After being cooled by air cooling through the cooling end outside the server (i.e., high-heat-density data center), it enters the water-cooling head again and circulates continuously. However, the more water-cooling heads are used, the more pipes and corresponding cooling ends are required. Each cooling end needs to occupy a separate space for heat dissipation through air cooling. Due to the limitation of the installation area of ​​air cooling (i.e., the heat dissipation area of ​​the cooling end is small), it is necessary to choose a smaller cooling end or air cooling. The amount of heat removed by water cooling is limited, and the heat dissipation efficiency is poor, which cannot meet the heat dissipation requirements of high-power chips. Therefore, ordinary water cooling combined with air cooling can no longer meet the heat dissipation requirements when used in high-density data center scenarios. Furthermore, through the use of multiple water cooling heads, the inlet and outlet water flow of different water cooling heads must be regulated for different chips to be used with different chips to avoid local overheating of some chips. Therefore, the use of water cooling also faces the problem of low control efficiency and the need to regulate one by one, resulting in increased control costs. If multiple water cooling heads have a unified inlet and outlet water flow, there will be poor heat dissipation uniformity between different chips, which will lead to local overheating. Summary of the Invention

[0004] The purpose of the present invention is to provide an efficient uniform temperature heat dissipation device that reduces the heat dissipation area and can meet the heat dissipation requirements when used in high-density data center scenarios. At the same time, it makes the heat dissipation temperature between different chips uniform, and there is no need for targeted regulation of different heating elements, thereby effectively improving control efficiency and reducing control costs.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: Design an efficient uniform temperature heat dissipation device, including a centralized water cooling component, a PCB board for carrying heating elements, and multiple heat-conducting components; The centralized water cooling assembly includes a conveying mechanism and a cooling mechanism, wherein the conveying mechanism is used to convey the coolant into the cooling mechanism, and the coolant in the cooling mechanism is discharged through the conveying mechanism; The heat-conducting component is provided with a heat-absorbing end and a heat-releasing end, and a phase-change liquid circulates between the heat-releasing end and the heat-exchanging end through a channel. The heat-absorbing ends of the multiple heat-conducting components are all arranged on the PCB board and are closely attached to the corresponding heating elements. The heat-releasing ends of the multiple heat-conducting components are arranged in sequence along the first direction on the surface of the cooling mechanism.

[0006] Optionally, the heat-conducting component includes a heat-absorbing plate, a connecting pipe and a heat-releasing plate. One end of the heat-absorbing plate is connected to the heat-releasing plate through the connecting pipe. Phase-change liquid circulates between the heat-absorbing plate and the heat-releasing plate through the connecting pipe. The other end of the heat-absorbing plate abuts against the corresponding heating element for heat exchange. Multiple heat-releasing plates are arranged in sequence along the first direction on the surface of the cooling mechanism, and one surface of the heat-releasing plate is used to abut against the surface of the cooling mechanism for heat exchange.

[0007] Optionally, the connecting pipe includes a return pipe and an air flow pipe, one end of the air flow pipe is fixedly connected to one end of the heat absorbing plate, and the other end of the air flow pipe is fixedly connected to one end of the heat releasing plate, one end of the return pipe is fixedly connected to one end of the heat absorbing plate and is located on one side of the air flow pipe, and the other end of the return pipe is fixedly connected to one end of the heat releasing plate.

[0008] Optionally, the cooling mechanism includes a liquid inlet and a liquid outlet, and two conveying mechanisms are provided, and the conveying mechanism includes a joint, a bellows and a joint block, the joint is provided at one end of the bellows, and the joint block is provided at the other end of the bellows, wherein one of the bellows is connected to the output end of the condenser through the joint, and is connected to the liquid inlet through the joint block, and the other bellows is connected to the input end of the condenser through the joint, and is connected to the liquid outlet through the joint block.

[0009] Optionally, a plurality of combined cavities are sequentially arranged between the liquid inlet and the liquid outlet; wherein, the combined cavity includes a plurality of inlet channels spaced apart along the second direction, and the liquid inlet is sequentially connected to the bottom-layer inlet channels in the plurality of combined cavities; in the combined cavity, the remaining inlet channels are respectively arranged together with the corresponding bottom-layer inlet channels and connected to the liquid outlet.

[0010] Optionally, the intermediate inlet flow channel in the combined cavity includes a first channel, a second channel and a third channel connected in sequence, the input end of the first channel is connected to the bottommost inlet flow channel, the coolant flows along the first direction after entering the first channel, then flows along the second direction after entering the second channel, and flows along the first direction after flowing to the third channel, and the third channel is connected to the liquid outlet.

[0011] Optionally, the topmost inlet flow channel in the combined cavity includes a heat exchange channel, the input end of the heat exchange channel is connected to the bottommost inlet flow channel, the coolant enters the heat exchange channel and flows along the first direction, and the heat exchange channel and the third channel are at the same height along the second direction, the topmost inlet flow channel and the middle inlet flow channel both include secondary heat exchange cavities, the output end of the third channel is connected to the corresponding secondary heat exchange cavity input end, the output end of the heat exchange channel is connected to the corresponding secondary heat exchange cavity input end, and the output end of the secondary heat exchange cavity is connected to the liquid outlet.

[0012] Optionally, the secondary heat exchange chamber includes heat exchange channel one and heat exchange channel two, the output end of the third channel is connected to the corresponding input end of heat exchange channel one, the output end of the heat exchange channel is connected to the corresponding input end of heat exchange channel one, the input end of heat exchange channel two is connected to the output end of heat exchange channel one, and the coolant flows in the opposite direction of the second direction after entering heat exchange channel one, and flows in the opposite direction of the first direction after flowing to heat exchange channel two.

[0013] Optionally, the cooling mechanism further includes a recovery channel, the output end of the second heat exchange channel is connected to the input end of the recovery channel, and the output end of the recovery channel is connected to the liquid outlet.

[0014] Optionally, the cooling mechanism includes a first cover plate, a second cover plate, a first partition plate, a second partition plate, a shell and a bottom plate, the bottom plate is fixedly connected to the lower surface of the shell, the recovery channel is formed between the bottom plate and the shell, the first partition plate and the second partition plate are arranged on the shell in sequence along the first direction, one end of the first cover plate abuts against the upper surface of the shell, and the other end abuts against the surface of one end of the first partition plate, one end of the second cover plate abuts against the upper surface of the shell, and the other end is opposite to the first cover plate, and abuts against the surface of the first cover plate connected to the first partition plate.

[0015] The present invention provides an efficient temperature-averaging heat dissipation device, which has the following beneficial effects: The efficient uniform temperature heat dissipation device is arranged on the PCB board through the heat-absorbing end of the heat-conducting component, and is respectively in contact with (i.e., tightly attached to) its corresponding heating elements (i.e., chips or electronic components). Since a phase-change liquid circulates between the heat-absorbing end and the heat-releasing end through a channel, the phase-change liquid in the heat-absorbing end changes into a gas after absorbing heat, and the phase-change gas enters the heat-releasing end through the channel for heat dissipation and then changes into a liquid. The phase-change liquid flows back to the heat-releasing end through the channel, and the coolant is continuously transported to the cooling mechanism through the conveying mechanism, and then the cooling mechanism contacts with multiple heat-releasing ends to dissipate heat. The multiple heat-releasing ends are integrated for heat dissipation. First, the heat dissipation area required for multiple air cooling when dissipating heat to the heat-releasing end can be reduced, that is, the amount of air cooling used can be reduced. At the same time, further, through the phase change of the phase-change liquid, the phase change process (liquid absorbs heat and changes into gas, and gas releases heat and condenses at the heat-releasing end) has a nearly isothermal characteristic. This means that no matter how much heat is absorbed by the heat-absorbing end of the thermal conductive component (that is, the power difference of the corresponding heating elements), the temperature of its heat-releasing end tends to be very close. The cooling mechanism then evenly removes the heat from these heat-releasing ends with similar temperatures. The phase-change liquid inside the thermal conductive component corresponding to the high-power heating element circulates faster and the phase change changes more drastically, but the heat it transfers to the surface of the cooling mechanism is eventually efficiently removed by the flowing coolant. Due to the isothermal characteristics of the phase change, the temperature of the heat-releasing end of the corresponding high-power thermal conductive component will not be significantly higher than the temperature of the heat-releasing end of the adjacent corresponding low-power thermal conductive component. At the same time, due to the heat absorption compatibility of the phase-change liquid, the temperature between different heating elements is uniform, and local overheating will not occur. The temperature distribution on the entire PCB board is uniform, and there is no need for targeted regulation of different heating elements, which effectively improves control efficiency and reduces control costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the installation structure of the efficient temperature-averaging heat dissipation device of the present invention; Figure 2 Schematic diagram of the three-dimensional structure of the efficient temperature-averaging heat dissipation device of the present invention; Figure 3 Schematic diagram of the installation structure of the cooling mechanism in the present invention; Figure 4 Schematic diagram of the front cross-sectional structure of the cooling mechanism of the present invention; Figure 5 For the present invention Figure 4 A schematic diagram of the enlarged structure at point A; Figure 6 This is a schematic diagram of the flow direction structure of the flow channel from an axonometric perspective in the present invention.

[0017] In the figure: 10, PCB board; 20, heat conduction component; 21, heat absorption plate; 22, connecting pipe; 221, return pipe; 222, air flow pipe; 23, heat release plate; 30, centralized water cooling component; 31, conveying mechanism; 311, joint; 312, bellows; 313, joint block; 32, cooling mechanism; 321, liquid inlet; 322, liquid outlet; 323, recovery channel; 324, first cover plate; 325, second cover plate; 326, first partition plate; 327, second partition plate; 328, shell; 329, bottom plate; 8, heating element. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative work shall fall within the scope of protection of the present invention.

[0019] See also Figures 1 to 6 The present invention provides a technical solution: a uniform temperature heat dissipation device, which is specifically used in the use scenario of dissipating heat from heating elements (i.e., chips), and more specifically in the use scenario of dissipating heat from high-density heating elements. It can reduce the problem of a large heat dissipation area required when water cooling is combined with air cooling, and at the same time improve the uniformity of heat dissipation among multiple heating elements.

[0020] See also Figures 1 to 5 , the present invention provides a technical solution: an efficient uniform temperature heat dissipation device, comprising a centralized water cooling component 30, a PCB board 10 for carrying a heating element 8, and a plurality of heat conducting components 20; The centralized water cooling assembly 30 includes a conveying mechanism 31 and a cooling mechanism 32. The conveying mechanism 31 is used to convey the coolant into the cooling mechanism 32. The coolant in the cooling mechanism 32 is discharged through the conveying mechanism 31. The heat conducting component 20 is provided with a heat absorbing end and a heat releasing end. A phase change liquid circulates through a channel between the heat releasing end and the heat exchanging end. The heat absorbing ends of the multiple heat conducting components 20 are all arranged on the PCB board 10 and are closely attached to the corresponding heating elements 8. The heat releasing ends of the multiple heat conducting components 20 are sequentially arranged on the surface of the cooling mechanism 32 along the first direction. The heat-absorbing ends of multiple heat-conducting components 20 are independently attached to each heating element 8 on the PCB board 10, and heat is efficiently transferred to its heat-releasing end through the internally circulating phase-change liquid; all the heat-releasing ends are densely arranged along the first direction and directly thermally coupled to the surface of the cooling mechanism 32 of the centralized water-cooling component 30. The coolant driven by the conveying mechanism 31 flows through the cooling mechanism 32 to synchronously absorb heat. The independent heat-conducting components 20 realize precise thermal management of the dispersed heat sources (i.e., heating elements 8, chips), while the concentrated linear arrangement of the heat-releasing ends on the surface of the cooling mechanism 32 constructs a unified and efficient heat dissipation interface. The phase-change circulation inside the heat-conducting components 20 actively balances the temperature differences of each heating element 8, effectively eliminating local hot spots and ensuring a highly uniform temperature field on the PCB board 10. The concentrated coupling of the heat-releasing ends and the cooling structure maximizes the heat exchange capacity of the coolant to achieve heat transfer and dissipation, reduce the risk of thermal stress caused by uneven temperature, and improve the long-term operation reliability and stability of high-power density electronic systems (such as multi-chip modules and server clusters).

[0021] The heat-absorbing end of the heat-conducting component 20 is set on the PCB board 10 and is respectively in contact with (i.e., tightly attached to) its corresponding heating element 8 (i.e., chip or electronic component). Since a phase-change liquid circulates between the heat-absorbing end and the heat-releasing end through a channel, the phase-change liquid in the heat-absorbing end changes into gas after absorbing heat, and the phase-change gas enters the heat-releasing end through the channel to dissipate heat and then changes into liquid. The phase-change liquid returns to the heat-releasing end through the channel, and continuously transports the coolant to the cooling mechanism 32 through the conveying mechanism 31, and then contacts with multiple heat-releasing ends through the cooling mechanism 32 to dissipate heat. The multiple heat-releasing ends are integrated for heat dissipation. First, the heat dissipation area required for multiple air cooling when dissipating heat to the heat-releasing end can be reduced, that is, the amount of air cooling used can be reduced. At the same time, further, through the phase change of the phase-change liquid, the phase change process (liquid absorbs heat and changes into gas, and gas releases heat and condenses at the heat-releasing end) has a nearly isothermal characteristic, which means that no matter how much heat is absorbed by the heat-absorbing end of the heat-conducting component 20 (i.e., The heat released by the heat-conducting component 20 corresponding to the high-power heat-conducting component 8 is circulated faster and the phase change is more drastic. However, the heat transferred to the surface of the cooling mechanism 32 is eventually efficiently carried away by the flowing coolant. Due to the isothermal characteristics of the phase change, the temperature of the heat-conducting end of the high-power heat-conducting component 20 is not significantly higher than the temperature of the heat-conducting end of the adjacent low-power heat-conducting component 20. At the same time, due to the heat absorption compatibility of the phase change liquid, the temperature between different heat-conducting components 8 is uniform, and local overheating will not occur. The temperature distribution on the entire PCB board 10 is uniform, and there is no need to carry out targeted regulation of different heat-conducting components 8, which effectively improves the control efficiency and reduces the control cost. Furthermore, the PCB board 10 can be made of a thermally conductive material, such as copper, in the area covered by the thermally conductive component 20.

[0022] In this embodiment, as a preferred solution, the heat conduction component 20 includes a heat absorbing plate 21, a connecting pipe 22 and a heat radiating plate 23. One end of the heat absorbing plate 21 is connected to the heat radiating plate 23 through the connecting pipe 22. A phase change liquid circulates between the heat absorbing plate 21 and the heat radiating plate 23 through the connecting pipe 22. The other end of the heat absorbing plate 21 abuts against the corresponding heating element 8 for heat exchange. A plurality of heat radiating plates 23 are sequentially arranged on the surface of the cooling mechanism 32 along the first direction. One surface of the heat radiating plate 23 is used to abut against the surface of the cooling mechanism 32 for heat exchange. By absorbing heat, The plate 21 forms a closed circulation channel with the heat dissipation plate 23 through the connecting pipe 22. Each heat absorption plate 21 is independently attached to the surface of the corresponding heating element 8 on the PCB board body 10 to capture heat energy, and multiple heat dissipation plates 23 are closely arranged in sequence along the first direction. The bottom plane of the heat dissipation plate is in full contact with the surface of the cooling mechanism 32 for heat exchange. The closed circulation channel realizes precise control of the local heat source, while the heat dissipation plate 23 dissipates heat. The phase change liquid (i.e., phase change medium) rapidly vaporizes at the heat absorption end to absorb high heat flux, and condenses and releases at the heat release end, thereby balancing the temperature difference of different power components.

[0023] In this embodiment, as a preferred solution, the connecting pipe 22 includes a return pipe 221 and an air flow pipe 222, one end of the air flow pipe 222 is fixedly connected to one end of the heat absorbing plate 21, and the other end of the air flow pipe 222 is fixedly connected to one end of the heat releasing plate 23. One end of the return pipe 221 is fixedly connected to one end of the heat absorbing plate 21 and is located on one side of the air flow pipe 222, and the other end of the return pipe 221 is fixedly connected to one end of the heat releasing plate 23. After the phase change liquid changes phase in the heat absorbing plate 21, it enters the heat releasing plate 23 through the return pipe 221 or the air flow pipe 222. After condensing on the heat releasing plate 23, it can return to the heat absorbing plate 21 through the return pipe 221 or the air flow pipe 222. There is a certain height difference between the return pipe 221 and the air flow pipe 222. At the same time, the horizontal height of the heat releasing plate 23 can be higher than the heat absorbing plate 21, which is conducive to the phase change gas entering the heat releasing plate 23, and the condensed liquid flows back to the heat absorbing plate 21.

[0024] In this embodiment, as a preferred solution, the cooling mechanism 32 includes a liquid inlet 321 and a liquid outlet 322. The delivery mechanism 31 is provided with two, and the delivery mechanism 31 includes a joint 311, a bellows 312 and a joint 311 block. The joint 311 is provided at one end of the bellows 312, and the joint 311 block is provided at the other end of the bellows 312. One of the bellows 312 is connected to the output end of the condenser through the joint 311 and is connected to the liquid inlet 321 through the joint 311 block. The other The bellows 312 is connected to the input end of the condenser through the joint 311, and is connected to the liquid outlet 322 through the joint 311 block. The two sets of conveying mechanisms 31 bridge the condenser and the liquid inlet 321 or liquid outlet 322 of the cooling mechanism 32 through the bellows 312. The two ends of the bellows 312 are respectively locked to the condenser port with the joint 311, and the joint 311 block is pressed against the liquid port flange of the cooling mechanism 32 to form a dual-channel closed-loop flow path for inputting or outputting coolant into or out of the cooling mechanism 32.

[0025] In this embodiment, as a preferred solution, multiple combined cavities are sequentially arranged between the liquid inlet 321 and the liquid outlet 322; wherein the combined cavities include multiple inlet flow channels spaced apart along the second direction, and the liquid inlet 321 is sequentially connected to the bottom-most inlet flow channels of the multiple combined cavities; in the combined cavities, the remaining inlet flow channels are respectively provided with the corresponding bottom-most inlet flow channels and are connected to the liquid outlet 322; Multiple inlet channels are provided through the multiple combined cavities. The other inlet channels in each combined cavity (i.e., the middle inlet channel and the uppermost inlet channel) are connected to the lowermost inlet channel, i.e., a common inlet arrangement is provided. It can also be understood that the lowermost inlet channel can transport cooling liquid to the other inlet channels (i.e., the middle inlet channel and the uppermost inlet channel). According to the equal height of the isobaric surfaces of the same static fluid in the communicating vessel, i.e., the liquid levels of the same liquid are equal, when the same liquid is flowing, it can be referred to the principle of the U-shaped tube, and there will be a tendency for the liquid levels to be equal, which is a natural result of the same liquid tending to pressure equilibrium in the gravitational field. At this time, the liquid levels entering the other inlet flow channels (i.e., the middle inlet flow channel and the uppermost inlet flow channel) from the lowest inlet flow channel are also at the same height. It can be understood that the coolant enters the other inlet flow channels (i.e., the middle inlet flow channel and the uppermost inlet flow channel) with the same opening height almost at the same time, and the coolant first enters the lowest inlet flow channel through the liquid inlet 321. As the liquid level in the lowest inlet flow channel rises, it then overflows into the other inlet flow channels (i.e., the middle inlet flow channel and the uppermost inlet flow channel) until the coolant is transported to the liquid outlet 322 through the other inlet flow channels (i.e., the middle inlet flow channel and the uppermost inlet flow channel) and then discharged.

[0026] In this embodiment, as a preferred solution, the middle inlet flow channel in the combined cavity includes a first channel, a second channel, and a third channel that are connected in sequence. The input end of the first channel is connected to the bottom-layer inlet flow channel. After entering the first channel, the coolant flows in the first direction, then flows in the second direction after entering the second channel, and flows in the first direction after flowing into the third channel. The third channel is connected to the liquid outlet 322. The coolant first enters the bottom-level inlet channel through the liquid inlet 321. As the liquid level of the bottom-level inlet channel rises, it enters the first channel. Then, the liquid (i.e., coolant) flows along the first direction (i.e., flows toward the second channel), flows to the second channel, flows into the second channel along the second direction, then flows to the third channel, flows into the third channel along the first direction, and finally flows to the liquid outlet 322.

[0027] In this embodiment, as a preferred solution, the uppermost inlet flow channel in the combined cavity includes a heat exchange channel, the input end of the heat exchange channel is connected to the lowermost inlet flow channel, the coolant enters the heat exchange channel and flows along the first direction, and the heat exchange channel and the third channel are at the same height along the second direction, the uppermost inlet flow channel and the middle inlet flow channel both include a secondary heat exchange cavity, the output end of the third channel is connected to the corresponding secondary heat exchange cavity input end, the output end of the heat exchange channel is connected to the corresponding secondary heat exchange cavity input end, and the output end of the secondary heat exchange cavity is connected to the liquid outlet 322. Similarly, the coolant first enters the lowermost inlet flow channel through the liquid inlet 321. As the liquid level of the lowermost inlet flow channel rises until it enters the heat exchange channel, the liquid (i.e., coolant) flows along the first direction. Since the heat exchange channel and the third channel are at the same height, it can be understood that the liquid ( That is, the cooling liquid enters the third channel and the heat exchange channel almost at the same time, and the liquid enters the third channel and the heat exchange channel at the same time, avoiding the problem of heat cascade caused by passing through the heat exchange channel first and then through the third channel. That is, the heat release end at the front end of the liquid flow direction is fully cooled or even excessively cooled, while the heat release end at the end of the liquid flow direction absorbs heat at the front end, resulting in a higher temperature when it flows to the corresponding position of the heat release end at the end of the liquid flow direction, and the absorbed heat is close to saturation, so that the heat dissipation effect of the heat release end at the end of the liquid flow direction is poor, resulting in the heat release end at the end of the liquid flow direction heating up faster, and also affecting the corresponding heating element 8 (chip) unable to obtain good heat dissipation and causing temperature rise, so that the cooling liquid received by different inlet flow channels of the combined cavity is the initial cooling liquid, that is, the cooling liquid that has not undergone heat exchange.

[0028] In this embodiment, as a preferred solution, the secondary heat exchange chamber includes heat exchanger one and heat exchanger two, the output end of the third channel is connected to the corresponding input end of heat exchanger one, the output end of the heat exchange channel is connected to the corresponding input end of heat exchanger one, and the input end of heat exchanger two is connected to the output end of heat exchanger one. After the coolant enters heat exchanger one, it flows in the opposite direction of the second direction, flows in the opposite direction of the first direction after flowing to heat exchanger two, flows through the third channel or heat exchange channel and enters the corresponding heat exchanger one, then flows in the opposite direction of the second direction in heat exchanger one to enter heat exchanger two, and then flows in the opposite direction of the first direction until it enters the liquid outlet 322. Through the setting of the secondary heat exchange chamber, the coolant that has not been completely heat exchanged can be further utilized, thereby improving the utilization effect of the coolant.

[0029] In this embodiment, as a preferred solution, the cooling mechanism 32 also includes a recovery channel 323. The output end of the second heat exchange channel is connected to the input end of the recovery channel 323. The output end of the recovery channel 323 is connected to the liquid outlet 322. The setting of the recovery channel 323 is used to recover the coolant after heat exchange, and then discharge it into the liquid outlet 322, and then discharge it through the conveying mechanism 31.

[0030] In this embodiment, as a preferred solution, the cooling mechanism 32 includes a first cover plate 324, a second cover plate 325, a first partition plate 326, a second partition plate 327, a shell 328 and a bottom plate 329. The bottom plate 329 is fixedly connected to the lower surface of the shell 328. The recovery flow channel 323 is formed between the bottom plate 329 and the shell 328. The first partition plate 326 and the second partition plate 327 are sequentially arranged on the shell 328 along the first direction. One end of the first cover plate 324 abuts against the upper surface of the shell 328, and the other end abuts against the surface of one end of the first partition plate 326. One end of the second cover plate 325 abuts against the upper surface of the shell 328, and the other end is opposite to the first cover plate 324 and abuts against the surface of the first partition plate 326 connected to the first cover plate 324. A heat exchange channel is formed between the first cover plate 324 and the first partition plate 326, a third channel is formed between the second cover plate 325 and the second partition plate 327, a first channel is formed between the first partition plate 326 and the shell 328, and a second channel is formed in the shell 328 for connecting the third channel and the second channel. A plurality of first heat exchange fins extending along the first direction are provided on the surface of the first cover plate 324 facing the first partition plate 326 and the surface of the second cover plate 325 facing the second partition plate 327. The plurality of first heat exchange fins are arranged side by side and are correspondingly located in the heat exchange channel or the third channel. A second heat exchange path communicating with the heat exchange channel is formed between the first partition plate 326 and the shell 328, and a second heat exchange path communicating with the third channel is formed between the second partition plate 327 and the shell 328. A plurality of second heat exchange fins extending along the first direction are provided on the surface of the first partition plate 326 facing the shell 328 and the surface of the second partition plate 327 facing the shell 328.

[0031] The heat release end of the heat conducting component 20 is sequentially arranged on the surfaces of the first cover plate 324 and the second cover plate 325 away from the first heat exchange fin, and is used for heat exchange when the first cover plate 324 and the second cover plate 325 abut against each other. The heat of the heat release end is transferred to the coolant through the first cover plate 324 and the second cover plate 325, and the coolant dissipates heat to the heat release end through the first cover plate 324 and the second cover plate 325 as a medium.

[0032] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An efficient temperature-dissipating heat dissipation device, characterized by: It comprises a centralized water cooling component (30), a PCB board (10) for carrying a heating element (8), and a plurality of heat-conducting components (20); The centralized water cooling assembly (30) comprises a conveying mechanism (31) and a cooling mechanism (32), wherein the conveying mechanism (31) is used to convey the cooling liquid into the cooling mechanism (32), and the cooling liquid in the cooling mechanism (32) is discharged through the conveying mechanism (31); The heat-conducting component (20) is provided with a heat-absorbing end and a heat-releasing end, and a phase-changing liquid circulates between the heat-releasing end and the heat-exchanging end through a channel. The heat-absorbing ends of the plurality of heat-conducting components (20) are all provided on the PCB board (10) and are closely attached to the corresponding heating elements (8), and the heat-releasing ends of the plurality of heat-conducting components (20) are sequentially provided on the surface of the cooling mechanism (32) along a first direction.

2. The high-efficiency temperature-uniform heat dissipation device according to claim 1, characterized in that: The heat-conducting assembly (20) includes a heat-absorbing plate (21), a connecting pipe (22) and a heat-releasing plate (23). One end of the heat-absorbing plate (21) is connected to the heat-releasing plate (23) through the connecting pipe (22). Phase-changing liquid circulates between the heat-absorbing plate (21) and the heat-releasing plate (23) through the connecting pipe (22). The other end of the heat-absorbing plate (21) abuts against the corresponding heating element (8) for heat exchange. A plurality of the heat-releasing plates (23) are sequentially arranged on the surface of the cooling mechanism (32) along a first direction. One surface of the heat-releasing plate (23) is used for abutting against the surface of the cooling mechanism (32) for heat exchange.

3. The high-efficiency temperature-uniform heat dissipation device according to claim 2, characterized in that: The connecting pipe (22) comprises a return pipe (221) and an air flow pipe (222), one end of the air flow pipe (222) is fixedly connected to one end of the heat absorbing plate (21), and the other end of the air flow pipe (222) is fixedly connected to one end of the heat emitting plate (23), one end of the return pipe (221) is fixedly connected to one end of the heat absorbing plate (21) and is located on one side of the air flow pipe (222), and the other end of the return pipe (221) is fixedly connected to one end of the heat emitting plate (23).

4. The high-efficiency temperature-uniform heat dissipation device according to claim 1, characterized in that: The cooling mechanism (32) includes a liquid inlet (321) and a liquid outlet (322). Two conveying mechanisms (31) are provided. The conveying mechanisms (31) include a joint (311), a bellows (312) and a joint block (313). The joint (311) is provided at one end of the bellows (312), and the joint block (313) is provided at the other end of the bellows (312). One of the bellows (312) is connected to the output end of the condenser through the joint (311) and is connected to the liquid inlet (321) through the joint block (313). The other bellows (312) is connected to the input end of the condenser through the joint (311) and is connected to the liquid outlet (322) through the joint block (313).

5. The high-efficiency uniform temperature heat dissipation device according to claim 4, characterized in that: A plurality of combined cavities are sequentially arranged between the liquid inlet (321) and the liquid outlet (322); The combined cavity comprises a plurality of inlet channels spaced apart along the second direction, and the liquid inlet is sequentially connected to the bottom-layer inlet channels in the plurality of combined cavities; in the combined cavity, the remaining inlet channels are respectively provided with a common inlet with the corresponding bottom-layer inlet channels, and are connected to the liquid outlet (322).

6. The high-efficiency temperature-uniform heat dissipation device according to claim 5, characterized in that: The intermediate inlet flow channel in the combined cavity comprises a first channel, a second channel and a third channel which are connected in sequence. The input end of the first channel is connected to the bottom inlet flow channel. The coolant flows in the first direction after entering the first channel, then flows in the second direction after entering the second channel, and flows in the first direction after flowing to the third channel. The third channel is connected to the liquid outlet (322).

7. The high-efficiency temperature-uniform heat dissipation device according to claim 6, characterized in that: The uppermost inlet flow channel in the combined cavity includes a heat exchange channel, the input end of the heat exchange channel is connected to the lowermost inlet flow channel, the coolant enters the heat exchange channel and flows along the first direction, and the heat exchange channel and the third channel are at the same height along the second direction, the uppermost inlet flow channel and the middle inlet flow channel both include a secondary heat exchange cavity, the output end of the third channel is connected to the corresponding secondary heat exchange cavity input end, the output end of the heat exchange channel is connected to the corresponding secondary heat exchange cavity input end, and the output end of the secondary heat exchange cavity is connected to the liquid outlet (322).

8. The high-efficiency temperature-uniform heat dissipation device according to claim 7, characterized in that: The secondary heat exchange chamber includes a first heat exchange channel and a second heat exchange channel. The output end of the third channel is connected to the corresponding input end of the first heat exchange channel. The output end of the heat exchange channel is connected to the corresponding input end of the first heat exchange channel. The input end of the second heat exchange channel is connected to the output end of the first heat exchange channel. After entering the first heat exchange channel, the coolant flows in the opposite direction of the second direction. After flowing to the second heat exchange channel, it flows in the opposite direction of the first direction.

9. The high-efficiency temperature-uniform heat dissipation device according to claim 8, characterized in that: The cooling mechanism (32) further includes a recovery channel (323), the output end of the second heat exchange channel is connected to the input end of the recovery channel (323), and the output end of the recovery channel (323) is connected to the liquid outlet (322).

10. The high-efficiency uniform temperature heat dissipation device according to claim 9, characterized in that: The cooling mechanism (32) includes a first cover plate (324), a second cover plate (325), a first partition plate (326), a second partition plate (327), a shell (328) and a bottom plate (329), wherein the bottom plate (329) is fixedly connected to the lower surface of the shell (328), and the recovery flow channel (323) is formed between the bottom plate (329) and the shell (328), and the first partition plate (326) and the second partition plate (327) are sequentially arranged on the shell (328) along a first direction, one end of the first cover plate (324) abuts against the upper surface of the shell (328), and the other end abuts against the surface of one end of the first partition plate (326), one end of the second cover plate (325) abuts against the upper surface of the shell (328), and the other end is opposite to the first cover plate (324), and abuts against the surface of the first cover plate (324) connected to the first partition plate (326).

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