Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment. The display panel comprises a substrate; the isolation structure is positioned on one side of the substrate; the isolation structure comprises a heightening part, a supporting part and a shielding part which are arranged in a stacked mode in the direction away from the substrate, and the orthographic projection of the heightening part on the substrate is located in the orthographic projection of the side, close to the substrate, of the supporting part on the substrate; at least parts of the light-emitting devices are located in the corresponding isolation openings, each light-emitting device comprises a first electrode, a light-emitting functional layer and a second electrode which are arranged in a stacked mode in the direction away from the substrate, a gap is formed between the light-emitting functional layer and the supporting part, and the second electrodes make contact with the supporting part. According to the display panel, the heightening part, close to the substrate, in the isolation structure is arranged to be shrunk inwards relative to the supporting part to form the concave structure, so that the situation that part of sub-film layers in the light-emitting functional layer formed through evaporation make contact with the supporting part to form a leakage flow path can be reduced, and the display effect of the display panel is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic light-emitting diodes (OLEDs) and flat-panel displays based on technologies such as light-emitting diodes (LEDs) have become a mainstream display device due to their advantages, including high image quality, power efficiency, thin design, and wide application range. They are widely used in various consumer electronic products such as mobile phones, TVs, laptops, and desktop computers. Traditionally, in the production of display panels, pixel patterning is typically achieved using a fine metal mask (FMM). While FMM technology is mature and has extensive mass production experience, it also suffers from limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe the non-fine metal mask technology for reference.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the present application aims to provide a display panel, comprising: substrate; an isolation structure located on one side of the substrate; the isolation structure encloses a plurality of isolation openings spaced apart from each other, the isolation structure comprising a raised portion, a supporting portion, and a shielding portion stacked in a direction away from the substrate, the orthographic projections of the raised portion and the supporting portion on the substrate being located within the orthographic projection of the shielding portion on the substrate, and the orthographic projection of the raised portion on the substrate being located within the orthographic projection of the supporting portion on the side closest to the substrate on the substrate; A plurality of light-emitting devices, at least part of which is located in the corresponding isolation opening, the light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in a direction away from the substrate, a gap is formed between the light-emitting functional layer and the support portion, and the second electrode is in contact with the support portion.

[0005] In some possible implementations, the material of the raised portion includes an insulating material; Preferably, the material of the raised portion includes silicon nitride or silicon oxide; or, the material of the side of the raised portion facing the isolation opening includes aluminum oxide.

[0006] In some possible implementations, a first distance between an edge of an orthographic projection of the raised portion on the substrate and an edge of an orthographic projection of a side of the support portion close to the substrate on the substrate is greater than or equal to 0.05 micrometers. Preferably, the first distance is less than or equal to 0.4 micrometers.

[0007] In some possible implementations, the material of the raised portion includes a conductive material; Preferably, the material of the raised portion includes aluminum or molybdenum.

[0008] In some possible implementations, a first distance between an edge of an orthographic projection of the raised portion on the substrate and an edge of an orthographic projection of a side of the support portion close to the substrate on the substrate is greater than or equal to 0.2 micrometers. Preferably, the first distance is less than or equal to 0.5 micrometers.

[0009] In some possible implementations, the support portion includes a first sublayer and a second sublayer stacked in a direction away from the substrate; The orthographic projection of the second sub-layer on the substrate is located within the orthographic projection of the first sub-layer on the substrate; Preferably, the material of the first sub-layer includes molybdenum, the material of the second sub-layer includes aluminum, and the material of the third sub-layer includes titanium; Preferably, close to a side of the isolation opening, a distance between an edge of an orthographic projection of the first sub-layer on the substrate and an edge of an orthographic projection of the second sub-layer on the substrate is greater than or equal to 0.35 micrometers.

[0010] In some possible implementations, in a direction away from the substrate, the thickness of the raised portion is 500 angstroms to 3000 angstroms; Preferably, in a direction away from the substrate, the total thickness of the isolation structure is 7000 angstroms to 8000 angstroms.

[0011] In some possible implementations, the light-emitting functional layer includes a hole injection layer, a hole transport layer, and multiple other functional layers stacked in sequence in a direction away from the substrate; there is a gap between the hole injection layer and the hole transport layer and the support portion.

[0012] In some possible implementations, a side of the raised portion facing the isolation opening is indented inwardly away from the isolation opening compared to a side of the support portion facing the isolation opening to form a concave structure; There is a gap between the hole injection layer and / or the hole transport layer and the support portion, and at least part of the other functional layers fills the recessed structure; the second electrode is located on a side of the other functional layers away from the substrate and in contact with the support portion.

[0013] In some possible implementations, the display panel further includes: A plurality of packaging units are provided, wherein the packaging units are located on a side of the corresponding light-emitting device away from the substrate, at least a portion of the packaging units is located within the isolation opening, and at least another portion of the packaging unit pair extends along the isolation structure toward the side wall of the isolation opening to a side of the isolation structure away from the substrate.

[0014] In some possible implementations, the display panel further includes: a first packaging layer located on a side of the isolation structure and the packaging unit away from the substrate; a second packaging layer located on a side of the first packaging layer away from the substrate; Preferably, the materials of the encapsulation unit and the second encapsulation layer include inorganic materials; and the material of the first encapsulation layer includes organic materials.

[0015] Another object of the present application is to provide a display panel, comprising: substrate; An isolation structure located on one side of the substrate; the isolation structure encloses a plurality of isolation openings spaced apart from each other, the isolation structure comprising a raised portion, a support portion, and a shielding portion stacked in a direction away from the substrate; the side of the raised portion facing the isolation opening is indented inwardly away from the isolation opening relative to the side of the support portion facing the isolation opening, forming a concave structure; A plurality of light-emitting devices, at least part of which is located in the corresponding isolation opening, the light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in a direction away from the substrate, a gap is formed between the light-emitting functional layer and the support portion, and the second electrode is in contact with the support portion.

[0016] Another object of the present application is to provide a method for manufacturing a display panel, the method comprising: providing a substrate; An isolation structure is formed on one side of the substrate; the isolation structure includes a plurality of isolation openings arranged at intervals, and the isolation structure includes a raised portion, a supporting portion, and a shielding portion stacked in a direction away from the substrate, wherein the orthographic projections of the raised portion and the supporting portion on the substrate are located within the orthographic projection of the shielding portion on the substrate, and the orthographic projection of the raised portion on the substrate is located within the orthographic projection of the supporting portion on the side close to the substrate on the substrate; A plurality of light-emitting devices are formed, wherein at least a portion of the light-emitting devices is located within the corresponding isolation openings, and the light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode stacked in a direction away from the substrate, wherein a gap is formed between the light-emitting functional layer and the support portion, and the second electrode is in contact with the support portion.

[0017] In some possible implementations, the step of forming an isolation structure on one side of the substrate includes: forming an insulating material layer, a supporting material layer, and a shielding material layer in sequence on one side of the substrate; Etching the shielding material layer and the manufacturing material layer to form the shielding portion and the supporting portion; The insulating material layer is etched to form the raised portion.

[0018] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel provided in the present application.

[0019] Compared with the prior art, this application has the following beneficial effects: The present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By setting the raised portion close to the substrate in the isolation structure to be retracted relative to the support portion, a recessed structure is formed. In this way, the contact between some sub-film layers in the light-emitting functional layer formed by vapor deposition and the support portion to form a leakage path can be reduced, thereby ensuring the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 A schematic diagram of a display panel in the related art; Figure 2One of the schematic diagrams of the display panel provided in this embodiment; Figure 3 The second schematic diagram of the display panel provided in this embodiment; Figure 4 The third schematic diagram of the display panel provided in this embodiment; Figure 5 A fourth schematic diagram of a display panel provided in this embodiment; Figure 6 The fifth schematic diagram of the display panel provided in this embodiment; Figure 7 The sixth schematic diagram of the display panel provided in this embodiment; Figure 8 This is a schematic flow chart of the steps of the method for manufacturing a display panel provided in this embodiment.

[0022] Icon: 111-substrate; 112-array functional layer; 120-first electrode; 130-pixel defining layer; 140-isolation structure; 141-raised portion; 142-support portion; 143-shielding portion; 1421-first sublayer; 1422-second sublayer; 810-light-emitting device; 910-isolation opening; 150-light-emitting functional layer; 160-second electrode; 170-packaging unit; 180-first packaging layer; 190-second packaging layer; 501-recessed structure; 151-hole injection layer; 152-hole transport layer; 153-other functional layers. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0026] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.

[0028] See Figure 1 In some related display panels, an isolation structure 140' having an isolation opening 910' is provided. When evaporating a light-emitting material layer and a conductive material layer to form the light-emitting functional layer 150' and the second electrode 160' of the light-emitting device 810, the light-emitting material layer and the conductive material layer between different isolation openings 910' can be disconnected. This allows the light-emitting functional layer 150' and the second electrode 160' to be formed by etching after full-layer evaporation. The second electrode 160' needs to be in contact with the conductive isolation structure 140', thereby being electrically connected to the circuit or trace providing the common voltage through the isolation structure 140'.

[0029] It has been found that when the light-emitting functional layer 150' is formed by evaporation, due to process errors, at least part of the film layers (such as the hole injection layer and the hole transport layer) in the light-emitting functional layer 150' may contact the isolation structure 140' (such as Figure 1 As shown in the dotted box position, leakage current is formed between the first electrode 120' and the isolation structure 140', which affects the power consumption or display effect of the display panel.

[0030] In view of this, this embodiment provides a solution that can reduce the risk of contact between the light-emitting functional layer and the isolation structure. The solution provided by this embodiment is described in detail below.

[0031] See Figure 2 , Figure 2 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 111 , an isolation structure 140 and a plurality of light-emitting devices 810 .

[0032] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass; or the material of the substrate 111 may include a flexible material, such as polyimide (Pi).

[0033] Optionally, an array functional layer 112 may be provided on one side of the substrate 111. The array functional layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array functional layer 112 may form multiple thin film transistors (TFTs) and wiring structures at different locations. The thin film transistors cooperate to form multiple pixel driving units or driving circuits, and the wiring structures provide signals or voltages to the circuits.

[0034] The isolation structure 140 is located on one side of the substrate 111. For example, the isolation structure 140 may be located on a side of the array functional layer 112 away from the substrate 111. The isolation structure 140 encloses a plurality of isolation openings 910 that are spaced apart.

[0035] The isolation structure 140 includes a raised portion 141, a support portion 142, and a shielding portion 143 stacked and arranged in a direction away from the base plate 111. The orthographic projections of the raised portion 141 and the support portion 142 on the base plate 111 are located within the orthographic projection of the shielding portion 143 on the base plate 111. For example, on the side facing the isolation opening 910, the shielding portion 143 protrudes toward the isolation opening 910 relative to the raised portion 141 and the support portion 142, forming an eaves structure.

[0036] The orthographic projection of the raised portion 141 on the substrate 111 is located within the orthographic projection of the side of the support portion 142 close to the substrate 111 on the substrate 111. For example, see Figure 3 The side of the raised portion 141 facing the isolation opening 910 is retracted inwardly away from the isolation opening 910 compared to the side of the support portion 142 facing the isolation opening 910 to form a recessed structure 501 .

[0037] At least a portion of the light-emitting device 810 is located within the corresponding isolation opening 910. The light-emitting device 810 includes a first electrode 120, a light-emitting functional layer 150, and a second electrode 160 stacked and arranged in a direction away from the substrate 111. A gap exists between the light-emitting functional layer 150 and the support portion 142, and the second electrode 160 contacts the support portion 142. The support portion 142 may be conductive.

[0038] Based on the above design, in the display panel provided in this embodiment, a recessed structure 501 is formed by setting the raised portion 141 close to the substrate 111 in the isolation structure 140 to be retracted compared to the support portion 142. When the light-emitting functional layer 150 is formed by vapor deposition, part of the sub-film layers in the light-emitting functional layer 150 cannot accumulate and climb at the recessed structure 501, thereby avoiding contact between part of the sub-film layers in the light-emitting functional layer 150 and the support portion 142 to form a leakage path, thereby ensuring the display effect of the display panel.

[0039] In some possible implementations, the material of the raised portion 141 includes an insulating material. In this way, even if the light-emitting functional layer 150 contacts the raised portion 141 , no leakage path is formed.

[0040] Optionally, the material of the raised portion 141 includes silicon nitride or silicon oxide; or, the material of the side of the raised portion 141 facing the isolation opening 910 includes aluminum oxide.

[0041] Alternatively, see Figure 3 If the material of the raised portion 141 comprises an insulating material, a first distance W1 between the edge of the orthographic projection of the raised portion 141 on the substrate 111 and the edge of the orthographic projection of the side of the support portion 142 closest to the substrate 111 on the substrate 111 is greater than or equal to 0.05 microns. In other words, the depth of the raised portion 141 retracted relative to the support portion 142 is greater than or equal to 0.05 microns. Alternatively, the first distance is less than or equal to 0.4 microns.

[0042] In this way, it can be ensured that the recessed structure 501 formed by the inward shrinkage of the raised portion 141 has sufficient depth to prevent at least part of the sub-layers of the light-emitting functional layer 150 from contacting the support portion 142 .

[0043] In other possible implementations, the material of elevated portion 141 includes a conductive material. For example, the material of elevated portion 141 includes aluminum or molybdenum. Alternatively, the material of support portion 142 includes aluminum and / or molybdenum. In this way, elevated portion 141 and at least some other sub-layers of isolation structure 140 share the same material or manufacturing process, thereby reducing manufacturing complexity.

[0044] Optionally, when the material of the raised portion 141 includes a conductive material, a first distance W1 between an edge of an orthographic projection of the raised portion 141 on the substrate 111 and an edge of an orthographic projection of the side of the support portion 142 closer to the substrate 111 on the substrate 111 is greater than or equal to 0.2 micrometers. Alternatively, preferably, the first distance is less than or equal to 0.5 micrometers.

[0045] In this way, the recessed structure 501 formed by the inward shrinkage of the raised portion 141 can be ensured to have sufficient depth. Even if at least part of the sub-layers of the light-emitting functional layer 150 extend into the recessed structure 501 , they will not contact the conductive raised portion 141 .

[0046] In some possible implementations, the support portion 142 may be formed of a film layer. For example, the support portion 142 may be formed by etching an aluminum film layer.

[0047] For other possible implementations, see Figure 4 The support portion 142 includes a first sub-layer 1421 and a second sub-layer 1422 stacked in a direction away from the substrate 111 .

[0048] The orthographic projection of the second sub-layer 1422 on the substrate 111 is located within the orthographic projection of the first sub-layer 1421 on the substrate 111. For example, on the side facing the isolation opening 910, the first sub-layer 1421 protrudes toward the isolation opening 910 more than the second sub-layer 1422. This increases the overlapping area between the second electrode 160 and the first sub-layer 1421, reduces the overlapping resistance, and improves the overlapping effect between the second electrode 160 and the first sub-layer 1421.

[0049] Optionally, the material of the first sub-layer 1421 includes molybdenum, the material of the second sub-layer 1422 includes aluminum, and the material of the third sub-layer includes titanium.

[0050] Optionally, on the side near the isolation opening 910, a distance W1 between an edge of the orthographic projection of the first sublayer 1421 on the substrate 111 and an edge of the orthographic projection of the second sublayer 1422 on the substrate 111 is greater than or equal to 0.35 microns. This ensures that the first sublayer 1421 protrudes sufficiently longer than the second sublayer 1422, thereby ensuring a sufficient overlap area between the second electrode 160 and the first sublayer 1421, reducing overlap resistance and improving the overlap effect between the second electrode 160 and the first sublayer 1421.

[0051] For some possible implementations, see again Figure 3 In the direction away from the substrate 111, the thickness H1 of the raised portion 141 is 500 angstroms to 3000 angstroms. This ensures that the recessed structure 501 formed by the inward retraction of the raised portion 141 has sufficient height. Even if at least part of the sub-layer of the light-emitting functional layer 150 extends into the recessed structure 501, it will not contact the conductive raised portion 141.

[0052] Optionally, the total thickness H2 of the isolation structure 140 in the direction away from the substrate 111 is 7000 angstroms to 8000 angstroms. That is, after adding the raised portion 141, the total height H2 of the isolation structure 140 can be maintained within the range of 7000 angstroms to 8000 angstroms by reducing the thickness of other film layers in the isolation structure 140, thereby reducing the impact on light extraction performance or other structural stability.

[0053] For some possible implementations, see Figure 5 The light-emitting functional layer 150 includes a hole injection layer 151 , a hole transport layer 152 and a plurality of other functional layers 153 , which are sequentially stacked in a direction away from the substrate 111 .

[0054] There is a gap between the hole injection layer 151 and / or the hole transport layer 152 and the support portion 142. Optionally, there is a gap between the hole injection layer 151 and the hole transport layer 152 and the support portion 142. That is, the hole injection layer 151 and the hole transport layer 152 do not contact the support portion 142, thereby preventing the hole injection layer 151 and the hole transport layer 152 from forming a leakage path between the first electrode 120 and the support portion 142.

[0055] In some possible implementations, there is a gap between the hole injection layer 151 and the hole transport layer 152 and the support portion 142, and at least part of the other functional layer 153 fills the recessed structure 501. The second electrode 160 is located on a side of the other functional layer 153 away from the substrate 111 and contacts the support portion 142.

[0056] For example, in this embodiment, other functional layers 153 in the light-emitting functional layer 150, except the hole injection layer 151 and the hole transport layer 152, will not cause leakage even if they contact the conductive portion of the isolation structure 140. Therefore, in this embodiment, other functional layers 153, except the hole injection layer 151 and the hole transport layer 152, can at least partially fill the recessed structure 501. In this way, the subsequently evaporated second electrode 160 can be better deposited to contact the support portion 142.

[0057] For some possible implementations, see Figure 6 The display panel provided in this embodiment also includes a plurality of packaging units 170, which are located on the side of the corresponding light-emitting device 810 away from the substrate 111. At least a portion of the packaging unit 170 is located within the isolation opening 910, and at least another portion of the packaging unit 170 extends along the isolation structure 140 toward the side wall of the isolation opening 910 to the side of the isolation structure 140 away from the substrate 111.

[0058] Optionally, there may be a gap between adjacent packaging units 170 , and the gap is located on a side of the isolation structure 140 away from the substrate 111 .

[0059] For some possible implementations, see Figure 7 The display panel provided in this embodiment further includes a first encapsulation layer 180 and a second encapsulation layer 190 .

[0060] The first encapsulation layer 180 is located on a side of the isolation structure 140 and the encapsulation unit 170 away from the substrate 111 .

[0061] The second encapsulation layer 190 is located on a side of the first encapsulation layer 180 away from the substrate 111 .

[0062] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials; and the material of the first encapsulation layer 180 includes organic materials.

[0063] Optionally, the materials of encapsulation unit 170 and second encapsulation layer 190 include inorganic materials, and the material of first encapsulation layer 180 includes organic materials. For example, encapsulation unit 170 and second encapsulation layer 190 can be formed by chemical vapor deposition (CVD), and first encapsulation layer 180 can be formed by inkjet printing (IJP).

[0064] In some possible implementations, the display panel provided in this embodiment may further include an optical film (e.g., a polarizer), a transparent adhesive layer (e.g., an optical glue layer), a cover plate, and other film layer structures located on the side of the second encapsulation layer 190 away from the substrate 111.

[0065] This embodiment further provides a display panel, which may include a substrate 111 , an isolation structure 140 , and a plurality of light-emitting devices 810 .

[0066] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass; or the material of the substrate 111 may include a flexible material, such as polyimide (Pi).

[0067] Optionally, an array functional layer 112 may be provided on one side of the substrate 111. The array functional layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array functional layer 112 may form multiple thin film transistors (TFTs) and wiring structures at different locations. The thin film transistors cooperate to form multiple pixel driving units or driving circuits, and the wiring structures provide signals or voltages to the circuits.

[0068] The isolation structure 140 is located on one side of the substrate 111. For example, the isolation structure 140 may be located on a side of the array functional layer 112 away from the substrate 111. The isolation structure 140 encloses a plurality of isolation openings 910 that are spaced apart.

[0069] The isolation structure 140 includes a raised portion 141, a supporting portion 142 and a shielding portion 143 stacked in a direction away from the substrate 111. The side of the raised portion 141 facing the isolation opening 910 is retracted inward away from the isolation opening 910 compared to the side of the supporting portion 142 facing the isolation opening 910 to form a recessed structure 501.

[0070] At least a portion of the light-emitting device 810 is located within the corresponding isolation opening 910. The light-emitting device 810 includes a first electrode 120, a light-emitting functional layer 150, and a second electrode 160 stacked and arranged in a direction away from the substrate 111. A gap exists between the light-emitting functional layer 150 and the support portion 142, and the second electrode 160 contacts the support portion 142. The support portion 142 may be conductive.

[0071] Based on the above design, in the display panel provided in this embodiment, a recessed structure 501 is formed by setting the raised portion 141 close to the substrate 111 in the isolation structure 140 to be retracted compared to the support portion 142. When the light-emitting functional layer 150 is formed by vapor deposition, part of the sub-film layers in the light-emitting functional layer 150 cannot accumulate and climb at the recessed structure 501, thereby avoiding contact between part of the sub-film layers in the light-emitting functional layer 150 and the support portion 142 to form a leakage path, thereby ensuring the display effect of the display panel.

[0072] See Figure 8 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0073] Step S110 , providing a substrate 111 .

[0074] In step S120, an isolation structure 140 is formed on one side of the substrate 111; the isolation structure 140 includes a plurality of isolation openings 910 arranged at intervals, and the isolation structure 140 includes a raised portion 141, a supporting portion 142 and a shielding portion 143 stacked in a direction away from the substrate 111, the orthographic projections of the raised portion 141 and the supporting portion 142 on the substrate 111 are located within the orthographic projection of the shielding portion 143 on the substrate 111, and the orthographic projection of the raised portion 141 on the substrate 111 is located within the orthographic projection of the side of the supporting portion 142 close to the substrate 111 on the substrate 111.

[0075] In step S130, a plurality of light-emitting devices 810 are formed, at least part of which is located in the corresponding isolation opening 910. The light-emitting device 810 includes a first electrode 120, a light-emitting functional layer 150 and a second electrode 160 stacked in a direction away from the substrate 111. There is a gap between the light-emitting functional layer 150 and the support portion 142, and the second electrode 160 is in contact with the support portion 142.

[0076] In some possible implementations, when the raised portion 141 includes insulating material, step S120 may include the following sub-steps.

[0077] In step S121 , an insulating material layer, a supporting material layer, and a shielding material layer are sequentially formed on one side of the substrate 111 .

[0078] Step S122, etching the shielding material layer and the manufacturing material layer to form the shielding portion 143 and the supporting portion 142; In step S123 , the insulating material layer is etched to form a raised portion 141 .

[0079] That is, in this embodiment, after the shielding portion 143 and the supporting portion 142 are etched, the insulating material layer may be etched through a separate process to form the padding portion 141 .

[0080] This application also provides an electronic device, comprising a display panel provided herein, or a display panel manufactured using the method for manufacturing a display panel provided herein. This electronic device may include a mobile phone, tablet computer, smart wearable device, television, laptop computer, monitor, or other device with a display function.

[0081] In summary, the present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By setting the raised portion close to the substrate in the isolation structure to be retracted relative to the supporting portion, a recessed structure is formed. In this way, the contact between some sub-film layers in the light-emitting functional layer formed by vapor deposition and the supporting portion to form a leakage path can be reduced, thereby ensuring the display effect of the display panel.

[0082] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; an isolation structure located on one side of the substrate; the isolation structure encloses a plurality of isolation openings spaced apart from each other, the isolation structure comprising a raised portion, a supporting portion, and a shielding portion stacked in a direction away from the substrate, the orthographic projections of the raised portion and the supporting portion on the substrate being located within the orthographic projection of the shielding portion on the substrate, and the orthographic projection of the raised portion on the substrate being located within the orthographic projection of the supporting portion on the side closest to the substrate on the substrate; A plurality of light-emitting devices, at least part of which is located in the corresponding isolation opening, the light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in a direction away from the substrate, a gap is formed between the light-emitting functional layer and the support portion, and the second electrode is in contact with the support portion.

2. The display panel according to claim 1, wherein: The material of the raised portion includes insulating material; Preferably, the material of the raised portion includes silicon nitride or silicon oxide; or, the material of the side of the raised portion facing the isolation opening includes aluminum oxide.

3. The display panel according to claim 2, wherein: A first distance between an edge of an orthographic projection of the raised portion on the substrate and an edge of an orthographic projection of a side of the support portion close to the substrate on the substrate is greater than or equal to 0.05 microns; Preferably, the first distance is less than or equal to 0.4 micrometers.

4. The display panel according to claim 1, wherein: The material of the raised portion includes a conductive material; Preferably, the material of the raised portion includes aluminum or molybdenum.

5. The display panel according to claim 4, wherein: A first distance between an edge of an orthographic projection of the raised portion on the substrate and an edge of an orthographic projection of a side of the support portion close to the substrate on the substrate is greater than or equal to 0.2 microns; Preferably, the first distance is less than or equal to 0.5 micrometers.

6. The display panel according to claim 1, wherein: The support portion includes a first sublayer and a second sublayer stacked in a direction away from the substrate; The orthographic projection of the second sub-layer on the substrate is located within the orthographic projection of the first sub-layer on the substrate; Preferably, the material of the first sub-layer includes molybdenum, the material of the second sub-layer includes aluminum, and the material of the third sub-layer includes titanium; Preferably, close to a side of the isolation opening, a distance between an edge of an orthographic projection of the first sub-layer on the substrate and an edge of an orthographic projection of the second sub-layer on the substrate is greater than or equal to 0.35 micrometers.

7. The display panel according to claim 1, wherein: In a direction away from the substrate, the thickness of the raised portion is 500 angstroms to 3000 angstroms; Preferably, in a direction away from the substrate, the total thickness of the isolation structure is 7000 angstroms to 8000 angstroms.

8. The display panel according to claim 1, wherein: The light-emitting functional layer includes a hole injection layer, a hole transport layer and a plurality of other functional layers stacked in sequence in a direction away from the substrate; there is a gap between the hole injection layer and the hole transport layer and the support portion.

9. The display panel according to claim 8, wherein: The side of the raised portion facing the isolation opening is inwardly contracted away from the isolation opening compared to the side of the support portion facing the isolation opening to form a concave structure; There is a gap between the hole injection layer and / or the hole transport layer and the support portion, and at least part of the other functional layers fills the recessed structure; the second electrode is located on a side of the other functional layers away from the substrate and in contact with the support portion.

10. The display panel according to claim 1, wherein The display panel further includes: A plurality of packaging units are provided, wherein the packaging units are located on a side of the corresponding light-emitting device away from the substrate, at least a portion of the packaging units is located within the isolation opening, and at least another portion of the packaging unit pair extends along the isolation structure toward the side wall of the isolation opening to a side of the isolation structure away from the substrate.

11. The display panel according to claim 10, wherein: The display panel further includes: a first packaging layer located on a side of the isolation structure and the packaging unit away from the substrate; a second packaging layer located on a side of the first packaging layer away from the substrate; Preferably, the materials of the encapsulation unit and the second encapsulation layer include inorganic materials; and the material of the first encapsulation layer includes organic materials.

12. A display panel, characterized in that: The display panel includes: substrate; An isolation structure located on one side of the substrate; the isolation structure encloses a plurality of isolation openings spaced apart from each other, the isolation structure comprising a raised portion, a support portion, and a shielding portion stacked in a direction away from the substrate; the side of the raised portion facing the isolation opening is indented inwardly away from the isolation opening relative to the side of the support portion facing the isolation opening, forming a concave structure; A plurality of light-emitting devices, at least part of which is located in the corresponding isolation opening, the light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in a direction away from the substrate, a gap is formed between the light-emitting functional layer and the support portion, and the second electrode is in contact with the support portion.

13. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; An isolation structure is formed on one side of the substrate; the isolation structure includes a plurality of isolation openings arranged at intervals, and the isolation structure includes a raised portion, a supporting portion, and a shielding portion stacked in a direction away from the substrate, wherein the orthographic projections of the raised portion and the supporting portion on the substrate are located within the orthographic projection of the shielding portion on the substrate, and the orthographic projection of the raised portion on the substrate is located within the orthographic projection of the supporting portion on the side close to the substrate on the substrate; A plurality of light-emitting devices are formed, wherein at least a portion of the light-emitting devices is located within the corresponding isolation openings, and the light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode stacked in a direction away from the substrate, wherein a gap is formed between the light-emitting functional layer and the support portion, and the second electrode is in contact with the support portion.

14. The method according to claim 1, wherein The step of forming an isolation structure on one side of the substrate includes: forming an insulating material layer, a supporting material layer, and a shielding material layer in sequence on one side of the substrate; Etching the shielding material layer and the manufacturing material layer to form the shielding portion and the supporting portion; The insulating material layer is etched to form the raised portion.

15. An electronic device, characterized in that: The electronic device includes the display panel according to any one of claims 1 to 12, or the electronic device includes a display panel manufactured by the method for manufacturing a display panel according to any one of claims 13 to 14.

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