Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate, an insulation structure, an isolation structure, sub-pixels and a packaging structure, the insulating structure is arranged on one side of the substrate; the isolation structure is arranged on the side, away from the substrate, of the insulation structure, a first opening and a second opening are formed in the isolation structure, and the first opening and the second opening both penetrate through the isolation structure in the thickness direction of the substrate; the sub-pixels are arranged in the first openings; the packaging structure is arranged on one side, close to the isolation structure, of the insulation structure; wherein the packaging structure covers one side, far away from the substrate, of the sub-pixel, and one side, far away from the substrate, of the isolation structure, and extends into the second opening. Therefore, the reliability of the display panel can be improved, the transmittance of the display panel can be improved, and the use performance of the under-screen module can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] OLEDs (Organic Light-Emitting Diodes) have attracted widespread attention due to their self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, and low energy consumption. As a next-generation display technology, they are gradually replacing traditional LCDs and are widely used in mobile phone screens, computer monitors, full-color TVs, and more. However, current OLED display panels suffer from poor reliability. Summary of the Invention

[0003] Based on this, the present application provides a display panel and a manufacturing method thereof, as well as a display device that can improve reliability.

[0004] According to one aspect of the present application, there is provided a display panel, comprising:

[0005] substrate;

[0006] an insulating structure, disposed on one side of the substrate;

[0007] an isolation structure, disposed on a side of the insulating structure facing away from the substrate, the isolation structure being provided with a first opening and a second opening, the first opening and the second opening both penetrating the isolation structure along a thickness direction of the substrate;

[0008] a sub-pixel disposed in the first opening;

[0009] The packaging structure is provided on a side of the insulating structure close to the isolation structure; wherein the packaging structure covers a side of the sub-pixel away from the substrate and a side of the isolation structure away from the substrate, and extends into the second opening.

[0010] According to the display panel of the embodiment of the present application, a second opening is provided on the isolation structure, and the second opening penetrates the isolation structure along the thickness direction of the substrate, and the encapsulation structure covers the side of the sub-pixel away from the substrate and the side of the isolation structure away from the substrate, and extends into the second opening. In this way, on the one hand, the coverage area of ​​the encapsulation structure on the isolation structure is increased, thereby extending the peeling path of the encapsulation structure, reducing the probability of peeling and spreading between the encapsulation structure and the isolation structure, and improving the encapsulation performance of the encapsulation structure; on the other hand, because the second opening penetrates the isolation structure along the thickness direction of the substrate, the transmittance of the isolation structure can be increased, thereby improving the transmittance of the display panel and improving the performance of the under-screen module. In summary, the present application can improve the reliability of the display panel, improve the transmittance of the display panel, and improve the performance of the under-screen module.

[0011] In one embodiment, the second opening includes a first sub-cavity close to the substrate and a first sub-opening away from the substrate; an orthographic projection of the first sub-opening on the substrate falls within an orthographic projection of the first sub-cavity on the substrate.

[0012] In one embodiment, a dimension of the first sub-opening along a first direction is smaller than a dimension of the first sub-cavity along the first direction, and the first direction is perpendicular to a thickness direction of the substrate and an extension direction of the isolation structure.

[0013] Optionally, the first sub-cavity includes a first end close to the substrate and a second end away from the substrate; and a size of the first sub-cavity along the first direction gradually increases from the first end to the second end.

[0014] In one embodiment, the isolation structure includes an isolation body and a blocking portion, wherein the blocking portion is provided on a side of the isolation body facing away from the substrate, and an orthographic projection of the isolation body on the substrate is located within an orthographic projection of the blocking portion on the substrate.

[0015] Optionally, the isolator and / or the blocking portion is a metal structure;

[0016] Optionally, one end of the blocking portion close to the first opening extends toward the center of the first opening and protrudes from a side wall of the isolating body close to the first opening.

[0017] Optionally, one end of the blocking portion close to the second opening extends toward the center of the second opening and protrudes from a side wall of the isolating body close to the second opening.

[0018] In one embodiment, the packaging structure contacts a sidewall of the blocking portion in the second opening close to the first sub-opening, a sidewall of the blocking portion close to the first sub-cavity, and a sidewall of the isolation body close to the first sub-cavity.

[0019] Optionally, the packaging structure further covers a side of the insulation structure exposed by the second opening facing away from the substrate.

[0020] In one embodiment, the encapsulation structure includes a first encapsulation layer and a second encapsulation layer, wherein the first encapsulation layer at least covers the side of the sub-pixel facing away from the substrate and at least a portion of the side wall of the isolation structure close to the sub-pixel; the second encapsulation layer is arranged in the second opening, and the second encapsulation layer also covers the side of the isolation structure facing away from the substrate and the first encapsulation layer.

[0021] Optionally, the encapsulation structure further includes a third encapsulation layer, and the third encapsulation layer covers the second encapsulation layer.

[0022] Optionally, the material of the first encapsulation layer includes an inorganic material.

[0023] Optionally, the material of the second encapsulation layer includes organic material.

[0024] Optionally, the material of the third encapsulation layer includes inorganic material.

[0025] In one embodiment, the isolation structure is provided with a plurality of first openings; a sub-pixel is correspondingly arranged in each of the first openings; the first packaging layer includes a plurality of sub-packaging parts; the plurality of sub-packaging parts are correspondingly arranged in the plurality of first openings; the sub-packaging parts cover the surface of the sub-pixel facing away from the substrate and at least a portion of the side wall of the isolation structure close to the sub-pixel.

[0026] In one embodiment, the sub-encapsulation portion corresponding to at least one sub-pixel adjacent to the second opening further covers at least a portion of a sidewall of the second opening.

[0027] Optionally, the sub-encapsulation portion corresponding to at least one sub-pixel adjacent to the second opening further covers a side of the isolation structure facing away from the substrate;

[0028] Optionally, the sub-encapsulation portion corresponding to at least one sub-pixel adjacent to the second opening further covers at least a portion of the insulating structure exposed by the second opening on a side facing away from the substrate.

[0029] Optionally, a light-emitting material layer and an electrode material layer stacked in sequence are provided on the side of the isolation structure facing away from the substrate; the sub-packaging portion corresponding to at least one of the sub-pixels adjacent to the second opening also covers the top surface of the electrode material layer, the side surface of the electrode material layer, and the side surface of the light-emitting material layer.

[0030] In one embodiment, a plurality of second openings are formed on the isolation structure; and at least one second opening is provided between two adjacent first openings.

[0031] Optionally, one second opening is provided between two adjacent first openings; and the sub-packaging portions in the two adjacent first openings extend and cover into the same second opening.

[0032] Optionally, the second openings arranged in parallel are provided between two adjacent first openings; and the sub-packages in the two adjacent first openings respectively extend and cover into the second openings adjacent to them.

[0033] In one embodiment, the orthographic projection of the isolation structure on the substrate is in a grid shape.

[0034] Optionally, there are multiple isolation structures, and the multiple isolation structures are distributed at intervals; the orthographic projection of the isolation structure on the substrate is ring-shaped and surrounds the corresponding sub-pixel; and at least one second opening is opened on the isolation structure.

[0035] In one embodiment, the packaging structure contacts the insulating structure in the second opening;

[0036] Optionally, the insulation structure includes a first insulation layer, and the encapsulation structure is in contact with the first insulation layer;

[0037] Optionally, a third opening is formed on the first insulating layer, the third opening is arranged corresponding to the first opening, and at least a portion of the sub-pixel is arranged in the third opening.

[0038] Optionally, the third opening penetrates at least a portion of the first insulating layer along a thickness direction of the substrate.

[0039] Optionally, a fourth opening is further formed on the first insulating layer, and the fourth opening corresponds to the second opening.

[0040] Optionally, the fourth opening penetrates at least a portion of the first insulating layer along a thickness direction of the substrate.

[0041] In one embodiment, the insulation structure further includes a second insulation layer, which is arranged on a side of the first insulation layer close to the substrate; the fourth opening penetrates the first insulation layer along the thickness direction of the substrate to expose the second insulation layer; and the packaging structure contacts the second insulation layer through the four openings.

[0042] Optionally, the first insulating layer is made of an inorganic material.

[0043] Optionally, the second insulating layer is made of an organic material.

[0044] Optionally, an orthographic projection of the isolation structure on the first insulating layer is located at a periphery of the third opening.

[0045] In one embodiment, the sub-pixel includes a first electrode, a light-emitting functional portion, and a second electrode stacked in sequence along a direction away from the substrate; the first electrode is located on a side of the first insulating layer close to the substrate, and the third opening penetrates the first insulating layer along the thickness direction of the substrate to expose the first electrode; the second electrode is connected to the isolation structure.

[0046] Optionally, the isolation structure is made of a conductive material.

[0047] Optionally, the first electrode is located between the first insulating layer and the second insulating layer.

[0048] Optionally, there is a distance between the light-emitting functional part and the isolation structure.

[0049] According to another aspect of the present application, a method for manufacturing a display panel is provided, comprising:

[0050] providing a substrate;

[0051] An insulating structure and an isolation structure are formed on one side of the substrate, wherein the isolation structure is arranged on a side of the insulating structure away from the substrate; a first opening and a second opening are provided on the isolation structure, wherein the first opening and the second opening both penetrate the isolation structure along the thickness direction of the substrate;

[0052] forming a sub-pixel in the first opening;

[0053] A packaging structure is formed on a side of the insulating structure close to the isolation structure; wherein the packaging structure covers a side of the sub-pixel away from the substrate and a side of the isolation structure away from the substrate, and extends into the second opening.

[0054] According to the method for manufacturing a display panel according to an embodiment of the present application, a second opening is provided on the isolation structure, and the second opening penetrates the isolation structure along the thickness direction of the substrate, and the encapsulation structure covers the side of the sub-pixel away from the substrate and the side of the isolation structure away from the substrate, and extends into the second opening. In this way, on the one hand, the coverage area of ​​the encapsulation structure on the isolation structure is increased, thereby extending the peeling path of the encapsulation structure, reducing the probability of peeling and spreading between the encapsulation structure and the isolation structure, and improving the encapsulation performance of the encapsulation structure; on the other hand, because the second opening penetrates the isolation structure along the thickness direction of the substrate, the transmittance of the isolation structure can be increased, thereby improving the transmittance of the display panel and improving the performance of the under-screen module. In summary, the present application can improve the reliability of the display panel, improve the transmittance of the display panel, and improve the performance of the under-screen module.

[0055] According to another aspect of the present application, a display device is provided, comprising the display panel according to any one of the above embodiments, thereby improving the display effect of the display device and enhancing the reliability of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 Schematic diagram of the cross-sectional structure of a display panel in related art.

[0057] Figure 2 A schematic diagram of a partial cross-sectional structure of a display panel provided in one embodiment of the present application.

[0058] Figure 3 for Figure 2 A schematic top view of a display panel is shown.

[0059] Figure 4 for Figure 2 Another partial cross-sectional structural schematic diagram of the display panel is shown.

[0060] Figure 5 A schematic diagram of a partial cross-sectional structure of a display panel provided in another embodiment of the present application.

[0061] Figure 6 for Figure 5 Another partial cross-sectional structural schematic diagram of the display panel is shown.

[0062] Figure 7 for Figure 6 A schematic diagram of the local enlarged structure of the display panel at point A is shown.

[0063] Figure 8 A schematic diagram of a partial cross-sectional structure of another display panel provided in an embodiment of the present application.

[0064] Figure 9 for Figure 8Another partial cross-sectional structural schematic diagram of the display panel is shown.

[0065] Figure 10 for Figure 9 A schematic diagram of the partial enlarged structure of position B of the display panel is shown.

[0066] Figure 11 A schematic diagram of a partial cross-sectional structure of another display panel provided in an embodiment of the present application.

[0067] Figure 12 A flowchart of a method for manufacturing a display panel provided in one embodiment of the present application.

[0068] Figure 13 A schematic structural diagram of a display device provided in one embodiment of the present application.

[0069] Description of reference numerals:

[0070] 1. Display device;

[0071] 10. Display panel; 11. Substrate; 12. Isolation structure; 13. Encapsulation structure; 131. Organic encapsulation layer;

[0072] 20. Display panel; 21. Substrate; 22. Insulation structure; 221. First insulation layer; 2211. Third opening; 2212. Fourth opening; 222. Second insulation layer; 23. Isolation structure; 23a. First opening; 23b. Second opening; 23b1. First sub-cavity; 23b2. First sub-opening; 231. Isolator; 232. Blocking portion; 24. Sub-pixel; 241. First electrode; 242. Light-emitting functional portion; 243. Second electrode; 25. Encapsulation structure; 251. First encapsulation layer; 251a. Sub-encapsulation portion; 252. Second encapsulation layer; 253. Third encapsulation layer; 26. Light-emitting material layer; 27. Electrode material layer; X, first direction. DETAILED DESCRIPTION

[0073] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0074] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0075] When describing positional relationships, unless otherwise specified, when an element, such as a layer, film, or substrate, is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Furthermore, when a layer is referred to as being "under" another layer, it can be directly underneath or one or more sub-pixels may also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more sub-pixels may also be present.

[0076] In the case of using “including,” “having,” and “comprising” described herein, another component may be added unless a clear limiting term such as “only,” “consisting of,” etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as having one number.

[0077] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this application.

[0078] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately," "approximately," or "substantially" can mean within one or more standard deviations, and is not limited here.

[0079] Furthermore, in the specification, the phrase “planar distribution diagram” refers to a drawing when the target portion is viewed from above, and the phrase “cross-sectional diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0080] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0081] OLED (Organic Light-Emitting Diode) has the characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, and low energy consumption. Therefore, it has attracted widespread attention. As a new generation of display method, it has begun to gradually replace traditional liquid crystal displays and is widely used in mobile phone screens, computer monitors, full-color TVs, etc.

[0082] See Figure 1 As shown, in the related OLED display panel 10, the organic encapsulation layer 131 in the encapsulation structure 13 covers at least a portion of the surface of the isolation structure 12 facing away from the substrate 11. The inventors have discovered that the bonding force between the organic encapsulation layer 131 and the surface of the isolation structure 12 facing away from the substrate 11 is relatively low. When a force is applied to the organic encapsulation layer 131, peeling occurs between the organic encapsulation layer 131 and the isolation structure 12, reducing the encapsulation performance of the encapsulation structure 13, resulting in poor reliability of the display panel 10 and prone to display anomalies and other issues.

[0083] Based on the above technical problems, embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device to improve the reliability of the display panel.

[0084] First, refer to Figure 2 and Figure 3 As shown, an embodiment of the present application provides a display panel 20. The display panel 20 includes a substrate 21, an insulating structure 22, an isolation structure 23, a sub-pixel 24, and an encapsulation structure 25. The insulating structure 22 is disposed on one side of the substrate 21. The isolation structure 23 is disposed on a side of the insulating structure 22 away from the substrate 21. The isolation structure 23 is provided with a first opening 23a and a second opening 23b. The first opening 23a and the second opening 23b both penetrate the isolation structure 23 along the thickness direction of the substrate 21. The sub-pixel 24 is disposed within the first opening 23a. The encapsulation structure 25 is disposed on a side of the insulating structure 22 close to the isolation structure 23. The encapsulation structure 25 covers the side of the sub-pixel 24 away from the substrate 21 and the side of the isolation structure 23 away from the substrate 21, and extends into the second opening 23b.

[0085] Specifically, the display panel 20 may be an organic light emitting diode display panel (Organic Light Emitting Diode, referred to as OLED), a quantum dot electroluminescent display panel (Quantum Dot Light Emitting Diodes, referred to as QLED), etc.

[0086] The substrate 21 may be an array substrate. Specifically, the substrate 21 may include a substrate (not shown) and a drive circuit layer (not shown) disposed on the substrate. The substrate may be a rigid substrate or a flexible substrate. For a rigid substrate, the substrate material may be glass or silicon wafer, for example. For a flexible substrate, the substrate material may be polyimide. The drive circuit layer includes a pixel drive circuit layer, which includes thin-film transistors.

[0087] The orthographic projection of the isolation structure 23 on the substrate 21 can be a grid or an independent ring. The isolation structure 23 can prevent crosstalk between sub-pixels 24 of different colors. Patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, etc. all describe related technical solutions for the isolation structure 23, the contents of which are incorporated into this application by reference for reference.

[0088] According to the display panel 20 of the embodiment of the present application, a second opening 23b is provided on the isolation structure 23. The second opening 23b penetrates the isolation structure 23 along the thickness direction of the substrate 21, and the encapsulation structure 25 covers the side of the sub-pixel 24 away from the substrate 21 and the side of the isolation structure 23 away from the substrate 21, and extends into the second opening 23b. In this way, on the one hand, the coverage area of ​​the encapsulation structure 25 on the isolation structure 23 is increased, thereby extending the peeling path of the encapsulation structure 25, reducing the probability of peeling and spreading between the encapsulation structure 25 and the isolation structure 23, and improving the encapsulation performance of the encapsulation structure 25; on the other hand, because the second opening 23b penetrates the isolation structure 23 along the thickness direction of the substrate 21, the transmittance of the isolation structure 23 can be increased, thereby improving the transmittance of the display panel 20 and improving the performance of the under-screen module. In summary, the present application can improve the reliability of the display panel 20, improve the transmittance of the display panel 20, and improve the performance of the under-screen module.

[0089] like Figure 2 As shown, in one embodiment, the second opening 23b includes a first sub-cavity 23b1 close to the substrate 21 and a first sub-opening 23b2 away from the substrate 21; the orthographic projection of the first sub-opening 23b2 on the substrate 21 falls within the orthographic projection of the first sub-cavity 23b1 on the substrate 21; that is, a groove structure with a "small opening and large cavity" is enclosed between the side wall of the second opening 23b and the insulating structure 22.

[0090] In this way, by covering the side of the sub-pixel 24 away from the substrate 21 and the side of the isolation structure 23 away from the substrate 21, and extending into the second opening 23b, the encapsulation structure 25 can form a "chimeric structure" with the sidewalls of the second opening 23b. Even if peeling occurs, the sidewalls of the first sub-opening 23b2 of the second opening 23b can act as a barrier, "locking" the encapsulation structure 25, thereby reducing the risk of peeling between the encapsulation structure 25 and the isolation structure 23 and improving the packaging reliability of the encapsulation structure 25. Furthermore, the coverage area of ​​the encapsulation structure 25 on the isolation structure 23 can be further increased, further extending the peeling path of the encapsulation structure 25, further reducing the probability of peeling occurring and spreading between the encapsulation structure 25 and the isolation structure 23, and improving the packaging reliability of the encapsulation structure 25.

[0091] like Figure 2 As shown, in one embodiment, the dimension L of the first sub-opening 23b2 along the first direction X is smaller than the dimension S of the first sub-cavity 23b1 along the first direction X, and the first direction X is perpendicular to the thickness direction of the substrate 21 and the extension direction of the isolation structure 23.

[0092] In this way, the sidewall of the second opening 23 b and the insulating structure 22 can be conveniently formed into a groove structure with a “small opening and large cavity”, thereby facilitating improvement of the packaging reliability of the packaging structure 25 .

[0093] like Figure 2 As shown, in one embodiment, the first sub-cavity 23b1 includes a first end close to the substrate 21 and a second end away from the substrate 21; the size of the first sub-cavity 23b1 along the first direction X gradually increases from the first end to the second end.

[0094] This, on the one hand, increases the difference between the dimension L of the first sub-opening 23b2 along the first direction X and the dimension S of the first sub-cavity 23b1 along the first direction X, allowing the sidewalls of the second opening 23b to effectively "lock" the package structure 25, thereby reducing the risk of peeling between the package structure 25 and the isolation structure 23 and improving the package reliability of the package structure 25. On the other hand, it further extends the peeling path of the package structure 25, further reducing the probability of peeling occurring and spreading between the package structure 25 and the isolation structure 23, effectively improving the package reliability of the package structure 25.

[0095] like Figure 2 、 Figures 4 to 6 、 Figure 8 、 Figure 9 、 Figure 11As shown, in one embodiment, the isolation structure 23 includes an isolation body 231 and a blocking portion 232, the blocking portion 232 is arranged on the side of the isolation body 231 facing away from the substrate 21, and the orthographic projection of the isolation body 231 on the substrate 21 is located within the orthographic projection of the blocking portion 232 on the substrate 21.

[0096] In this way, the isolation structure 23 can form an undercut structure with a "large top and small bottom", and the isolation structure 23 corresponding to the first opening 23a can have an "eaves", so that the light-emitting material and the electrode material in the adjacent sub-pixels 24 can be separated during the evaporation process, thereby avoiding crosstalk between sub-pixels 24 of different colors, thereby improving the display effect of the display panel 20; in addition, the isolation structure 23 corresponding to the second opening 23b can have an "eaves", that is, the orthographic projection of the first sub-opening 23b2 of the second opening 23b on the substrate 21 falls into the second opening 23b within the orthographic projection of the first sub-cavity 23b1 on the substrate 21, thereby helping to improve the packaging reliability of the packaging structure 25, thereby improving the reliability of the display panel 20.

[0097] In a specific embodiment, the isolator 231 and / or the blocking portion 232 are metal structures.

[0098] like Figure 2 、 Figures 4 to 11 As shown, in a specific embodiment, one end of the blocking portion 232 close to the first opening 23 a extends toward the center of the first opening 23 a and protrudes from the side wall of the isolation body 231 close to the first opening 23 a.

[0099] In this way, by making one end of the blocking portion 232 close to the first opening 23a protrude from the side wall of the isolator 231 close to the first opening 23a, the protruding part of the blocking portion 232 corresponding to the first opening 23a forms a "eaves", so that the isolation structure 23 has the function of isolating the light-emitting material and the electrode material, thereby avoiding crosstalk between sub-pixels 24 of different colors, thereby improving the display effect of the display panel 20.

[0100] like Figure 2 、 Figures 4 to 11 As shown, in a specific embodiment, one end of the blocking portion 232 close to the second opening 23 b extends toward the center of the second opening 23 b and protrudes from the side wall of the isolating body 231 close to the second opening 23 b.

[0101] In this way, by making one end of the blocking portion 232 close to the second opening 23b protrude beyond the side wall of the isolating body 231 close to the second opening 23b, the protruding portion of the blocking portion 232 corresponding to the second opening 23b forms a "roof", that is, the side surface of the protruding portion of the blocking portion 232 defines the first sub-opening 23b2 of the second opening 23b, and the lower surface of the protruding portion of the blocking portion 232 (i.e., the surface of the blocking portion 232 close to the substrate 21) and the side wall of the isolating body 231 close to the second opening 23b define the first sub-cavity 23b1 of the second opening 23b.

[0102] like Figures 8 to 11 As shown, in one embodiment, the packaging structure 25 contacts the sidewall of the blocking portion 232 in the second opening 23b close to the first sub-opening 23b2, the sidewall of the blocking portion 232 close to the first sub-cavity 23b1, and the sidewall of the isolation body 231 close to the first sub-cavity 23b1.

[0103] In this way, when peeling occurs between the packaging structure 25 and the isolation structure 23, the blocking portion 232 in the second opening 23b close to the side wall of the first sub-opening 23b2, the blocking portion 232 close to the side wall of the first sub-cavity 23b1, and the isolation body 231 close to the side wall of the first sub-cavity 23b1 can play a blocking role, slowing down the "peeling" of the packaging structure 25 and "locking" the packaging structure 25, thereby reducing the risk of peeling between the packaging structure 25 and the isolation structure 23, and improving the packaging performance of the packaging structure 25.

[0104] like Figures 8 to 11 As shown, in one embodiment, the encapsulation structure 25 further covers the side of the insulation structure 22 exposed by the second opening 23 b facing away from the substrate 21 .

[0105] In this way, the contact area between the packaging structure 25 and the insulating structure 22 can be increased, and the bonding force between the packaging structure 25 and the insulating structure 22 can be improved, thereby reducing the risk of peeling between the packaging structure 25 and the isolation structure 23 and improving the packaging performance of the packaging structure 25.

[0106] like Figure 2 、 Figures 4 to 11 As shown, in one embodiment, the encapsulation structure 25 includes a first encapsulation layer 251 and a second encapsulation layer 252, the first encapsulation layer 251 at least covers the side of the sub-pixel 24 facing away from the substrate 21 and at least a portion of the side wall of the isolation structure 23 close to the sub-pixel 24; the second encapsulation layer 252 is arranged in the second opening 23b, and the second encapsulation layer 252 also covers the side of the isolation structure 23 facing away from the substrate 21 and the first encapsulation layer 251.

[0107] In this way, on the one hand, the second packaging layer 252 can be in contact with the insulating structure 22, and the bonding force between the two is relatively large, thereby reducing the risk of peeling of the second packaging layer 252; on the other hand, the coverage area of ​​the second packaging layer 252 on the isolation structure 23 can be increased, thereby extending the peeling path of the second packaging layer 252, reducing the probability of peeling occurring and spreading between the second packaging layer 252 and the isolation structure 23, improving the packaging reliability of the second packaging layer 252, and then improving the packaging reliability of the packaging structure 25, and then improving the reliability of the display panel 20.

[0108] like Figure 2 、 Figures 4 to 11 As shown, in one embodiment, the encapsulation structure 25 further includes a third encapsulation layer 253 , and the third encapsulation layer 253 covers the second encapsulation layer 252 .

[0109] In this way, multi-layer encapsulation is achieved through the first encapsulation layer 251 , the second encapsulation layer 252 and the third encapsulation layer 253 , so as to further improve the encapsulation performance of the encapsulation structure 25 and enhance the reliability of the display panel 20 .

[0110] In one embodiment, the first encapsulation layer 251 is made of an inorganic material. Inorganic materials generally have good density and can isolate water vapor and oxygen, thereby reducing the impact of water vapor on the sub-pixels 24 and improving the display effect of the display panel 20.

[0111] In one embodiment, the second encapsulation layer 252 is made of an organic material.

[0112] In this way, the display panel 20 is protected by stacking inorganic and organic layers. Inorganic materials generally have good density and can isolate water vapor and oxygen. Organic materials have the characteristic of flexibility. Using organic materials as a layer of the second encapsulation layer 252 can buffer external stress, preventing the display panel 20 from being affected by external stress and affecting the display effect. At the same time, it can reduce the risk of encapsulation failure caused by fracture of the inorganic layer.

[0113] In one embodiment, the third encapsulation layer 253 is made of an inorganic material.

[0114] In this way, by stacking multiple inorganic layers and organic layers, the packaging performance of the packaging structure 25 can be improved, and the reliability of the display panel 20 can be improved.

[0115] like Figure 2 、 Figures 4 to 7As shown, in one embodiment, a plurality of first openings 23a are provided on the isolation structure 23; a sub-pixel 24 is correspondingly arranged in each first opening 23a; the first encapsulation layer 251 includes a plurality of sub-encapsulation portions 251a; the plurality of sub-encapsulation portions 251a are correspondingly arranged in the plurality of first openings 23a; the sub-encapsulation portions 251a cover the surface of the sub-pixel 24 facing away from the substrate 21 and at least a portion of the side wall of the isolation structure 23 close to the sub-pixel 24.

[0116] In this way, the sub-encapsulation portion 251 a can effectively prevent external moisture from diffusing toward the sub-pixel 24 and effectively prevent external defects from extending toward the sub-pixel 24 , thereby improving the encapsulation reliability of the first encapsulation layer 251 .

[0117] like Figures 5 to 7 As shown, in one embodiment, the sub-encapsulation portion 251 a corresponding to at least one sub-pixel 24 adjacent to the second opening 23 b also covers at least a portion of the sidewall of the second opening 23 b .

[0118] In this way, direct contact between the second packaging layer 252 and the sidewall of the isolation structure 23 near the second opening 23 b can be reduced, the risk of peeling of the second packaging layer 252 can be reduced, the packaging reliability of the second packaging layer 252 can be improved, and the packaging reliability of the packaging structure 25 can be improved.

[0119] like Figures 8 to 11 As shown, in one embodiment, the sub-encapsulation portion 251 a corresponding to at least one sub-pixel 24 adjacent to the second opening 23 b also covers the side of the isolation structure 23 facing away from the substrate 21 .

[0120] On the one hand, when evaporating the light-emitting material and electrode material of the sub-pixel 24, the light-emitting material and electrode material can be deposited on the side of the isolation structure 23 facing away from the substrate 21, and the sub-packaging portion 251a covers the side of the isolation structure 23 facing away from the board, thereby completely encapsulating the top of the isolation structure 23. In the subsequent etching process, the light-emitting material and electrode material on the top of the isolation structure 23 are retained to form a stacked light-emitting material layer 26 and an electrode material layer 27. In this way, the risk of peeling between the sub-packaging portion 251a and the isolation structure 23 is reduced, thereby improving the packaging performance of the sub-packaging portion 251a.

[0121] On the other hand, the sub-encapsulation portion 251a covers a portion of the surface of the spacer 231 near the sub-pixel 24, the surface of the barrier 232 near the substrate 21 (i.e., the lower surface of the protruding portion of the barrier 232), and the surface of the barrier 232 facing away from the substrate 21. This forms a sealing structure between the sub-encapsulation portion 251a and the spacer 231, and between the sub-encapsulation portion 251a and the lower surface of the protruding portion of the barrier 232. This effectively prevents external moisture from diffusing toward the sub-pixel 24 and effectively prevents external defects from extending toward the sub-pixel 24, thereby improving the packaging reliability of the sub-encapsulation portion 251a.

[0122] like Figures 8 to 11 As shown, in one embodiment, the sub-encapsulation portion 251a corresponding to at least one sub-pixel 24 adjacent to the second opening 23b also covers at least a portion of the insulating structure 22 exposed by the second opening 23b on a side facing away from the substrate 21.

[0123] In this way, the coverage area of ​​the sub-package portion 251a on the isolation structure 23 can be increased, and the peeling path of the sub-package portion 251a can be extended, thereby reducing the risk of peeling between the sub-package portion 251a and the isolation structure 23 and improving the packaging performance of the sub-package portion 251a.

[0124] like Figures 8 to 11 As shown, in one embodiment, a light-emitting material layer 26 and an electrode material layer 27 stacked in sequence are provided on the side of the isolation structure 23 facing away from the substrate 21; the sub-packaging portion 251a corresponding to at least one sub-pixel 24 adjacent to the second opening 23b also covers the top surface of the electrode material layer 27, the side surface of the electrode material layer 27, and the side surface of the light-emitting material layer 26.

[0125] In this way, the sub-packaging portion 251a surrounds the light-emitting material layer 26 and the electrode material layer 27, which can avoid the formation of a cavity between the sub-packaging portion 251a and the top of the isolation structure 23, thereby reducing the risk of peeling between the sub-packaging portion 251a and the isolation structure 23 and improving the packaging performance of the sub-packaging portion 251a.

[0126] like Figures 8 to 11 As shown, in one embodiment, a plurality of second openings 23 b are formed on the isolation structure 23 ; at least one second opening 23 b is provided between two adjacent first openings 23 a .

[0127] like Figures 8 to 10 As shown, in one embodiment, a second opening 23b is provided between two adjacent first openings 23a; the sub-packaging portions 251a in the two adjacent first openings 23a extend and cover into the same second opening 23b.

[0128] In this way, one second opening 23 b can achieve enhanced packaging for the sub-packaging portions 251 a on both sides thereof, which is beneficial to improving the packaging reliability of the display panel 20 .

[0129] like Figure 11 As shown, in one embodiment, a second opening 23b arranged in parallel is provided between two adjacent first openings 23a; the sub-packaging portions 251a in the two adjacent first openings 23a respectively extend to cover the second openings 23b adjacent thereto.

[0130] In this way, two adjacent sub-packaging portions 251a can each “occupy” their own second opening 23b, which is beneficial to increasing the coverage area of ​​each sub-packaging portion 251a in the second opening 23b, thereby improving the packaging performance of the sub-packaging portion 251a.

[0131] like Figure 3 As shown, in one embodiment, the orthographic projection of the isolation structure 23 on the substrate 21 is in a grid shape.

[0132] In this way, the isolation structure 23 having the first opening 23 a and the second opening 23 b can be easily formed.

[0133] In one embodiment, there are multiple isolation structures 23 , which are spaced apart. The orthographic projection of the isolation structure 23 on the substrate 21 is annular and surrounds the corresponding sub-pixel 24 . At least one second opening 23 b is formed on the isolation structure 23 .

[0134] Therefore, by distributing multiple isolation structures 23 at intervals; the positive projection of the isolation structure 23 on the substrate 21 is ring-shaped and surrounds the corresponding sub-pixel 24, so that different isolation structures 23 can be insulated, which can facilitate the independent control of the sub-pixels 24 corresponding to adjacent isolation structures 23; by providing at least one second opening 23b on the isolation structure 23, the risk of peeling between the packaging structure 25 and the isolation structure 23 can be reduced, thereby improving the packaging reliability of the packaging structure 25.

[0135] like Figure 2 、 Figure 5 、 Figure 8 As shown, in one embodiment, the packaging structure 25 contacts the insulation structure 22 in the second opening 23 b.

[0136] Insulating structure 22 includes an insulating material, which includes at least one of an organic material and an inorganic material. Encapsulating structure 25 includes at least one of an organic material and an inorganic material. That is, encapsulating structure 25 and insulating structure 22 are made of similar materials. Thus, by contacting encapsulating structure 25 with insulating structure 22 within second opening 23b, the similar materials and strong bonding between encapsulating structure 25 and insulating structure 22 can reduce the risk of peeling between encapsulating structure 25 and isolation structure 23, thereby improving the packaging performance of encapsulating structure 25.

[0137] In one embodiment, the insulation structure 22 includes a first insulation layer 221 , and the package structure 25 contacts the first insulation layer 221 .

[0138] In this way, by making the packaging structure 25 contact the first insulating layer 221 , the bonding force between the packaging structure 25 and the first insulating layer 221 is greater, thereby reducing the risk of peeling between the packaging structure 25 and the isolation structure 23 and improving the packaging performance of the packaging structure 25 .

[0139] In one embodiment, a third opening 2211 is defined on the first insulating layer 221 . The third opening 2211 and the first opening 23 a are correspondingly disposed. At least a portion of the sub-pixel 24 is disposed within the third opening 2211 .

[0140] In one embodiment, the third opening 2211 penetrates at least a portion of the first insulating layer 221 along the thickness direction of the substrate 21 .

[0141] like Figure 2 、 Figure 5 、 Figure 8 As shown, in a specific example, the third opening 2211 penetrates the first insulating layer 221 along the thickness direction of the substrate 21.

[0142] The sub-pixel 24 includes a first electrode 241, a light-emitting functional portion 242, and a second electrode 243, which are stacked in sequence along a direction away from the substrate 21; the first electrode 241 is located on a side of the first insulating layer 221 close to the substrate 21, and the first electrode 241 can be exposed by passing the third opening 2211 through the first insulating layer 221 along the thickness direction of the substrate 21; at the same time, the first insulating layer 221 can separate the isolation structure 23 and the first electrode 241, so that the isolation structure 23 and the first electrode 241 and adjacent first electrodes 241 are insulated from each other.

[0143] like Figure 4 ,like Figure 6 、 Figure 7 、 Figures 9 to 11As shown, in one embodiment, a fourth opening 2212 is further formed on the first insulating layer 221 , and the fourth opening 2212 corresponds to the second opening 23 b.

[0144] In this way, the contact area between the package structure 25 and the first insulating layer 221 can be increased, and the bonding force between the package structure 25 and the first insulating layer 221 can be improved, thereby improving the packaging performance of the package structure 25 .

[0145] In one embodiment, the fourth opening 2212 penetrates at least a portion of the first insulating layer 221 along the thickness direction of the substrate 21 .

[0146] In this way, the contact area between the package structure 25 and the first insulating layer 221 can be further increased, and the bonding force between the package structure 25 and the first insulating layer 221 can be further improved, thereby effectively improving the packaging performance of the package structure 25 .

[0147] like Figure 4 ,like Figure 6 、 Figure 7 、 Figures 9 to 11 As shown, in a specific example, the fourth opening 2212 penetrates the first insulating layer 221 along the thickness direction of the substrate 21 .

[0148] In this way, a release path is provided for the water vapor in the film layer below the first insulating layer 221 (i.e., the film layer on the side of the first insulating layer 221 close to the substrate 21), reducing the impact of water vapor on the film layer below the first insulating layer 221 and improving the reliability of the display panel 20.

[0149] In a specific example, the first insulating layer 221 may be a pixel definition layer (PDL) or other insulating film layers.

[0150] In another specific example, the material of the first insulating layer 221 includes an inorganic material, such as silicon oxide, silicon nitride, etc.

[0151] Therefore, the first insulating layer 221 can isolate water vapor and oxygen, thereby improving the reliability of the display panel 20 .

[0152] In one embodiment, the insulating structure 22 further includes a second insulating layer 222, which is arranged on a side of the first insulating layer 221 close to the substrate 21; the fourth opening 2212 penetrates the first insulating layer 221 along the thickness direction of the substrate 21 to expose the second insulating layer 222; the packaging structure 25 contacts the second insulating layer 222 through the fourth opening 2212.

[0153] In this manner, the encapsulation structure 25 can be in contact with both the first insulating layer 221 and the second insulating layer 222, thereby increasing the coverage area of ​​the encapsulation structure 25 on the insulating structure 22 and improving the bonding strength between the encapsulation structure 25 and the insulating structure 22, thereby improving the encapsulation performance of the encapsulation structure 25 and the reliability of the display panel 20. Furthermore, the fourth opening 2212 penetrates the first insulating layer 221 along the thickness direction of the substrate 21, thereby providing a release path for moisture in the second insulating layer 222, reducing the effect of moisture on the second insulating layer 222 and the film layers below the second insulating layer 222, and improving the reliability of the display panel 20.

[0154] In one embodiment, the second insulating layer 222 may be a planar layer PLN, or other insulating film layers.

[0155] In another specific example, the material of the second insulating layer 222 includes organic material.

[0156] like Figure 2 ,like Figures 4 to 11 As shown, in one embodiment, the orthographic projection of the isolation structure 23 on the first insulating layer 221 is located at the periphery of the third opening 2211 .

[0157] Thus, the isolation structure 23 can be prevented from limiting the light emission angle of the sub-pixel 24 .

[0158] like Figure 2 ,like Figures 4 to 11 As shown, in one embodiment, the sub-pixel 24 includes a first electrode 241, a light-emitting functional portion 242, and a second electrode 243 stacked in sequence along a direction away from the substrate 21; the first electrode 241 is located on a side of the first insulating layer 221 close to the substrate 21, and the third opening 2211 penetrates the first insulating layer 221 along the thickness direction of the substrate 21 to expose the first electrode 241; the second electrode 243 is connected to the isolation structure 23.

[0159] It is understood that the light-emitting functional portion 242 includes at least a light-emitting layer (EML), and may also include one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL). Alternatively, the first light-emitting functional portion 242132a may also be a stacked light-emitting layer, that is, including at least two light-emitting layers and a charge generation layer (CGL) located between each adjacent light-emitting layer.

[0160] It should be noted that the first electrode 241 may be an anode, and the second electrode 243 may be a cathode. Both the first electrode 241 and the second electrode 243 are electrically connected to the pixel driving circuit layer.

[0161] In one embodiment, the isolation structure 23 includes a conductive material.

[0162] Thus, the second electrodes 243 of the plurality of sub-pixels 24 are electrically connected through the metal layer of the insulator 231 , thereby reducing the voltage drop between the plurality of second electrodes 243 , thereby improving the uniformity of the brightness of the display screen of the display panel 20 and improving the display quality of the display panel 20 .

[0163] In one embodiment, the separator 231 includes at least one metal layer, and the second electrode 243 is electrically connected to the metal layer.

[0164] Thus, the second electrodes 243 of the plurality of sub-pixels 24 are electrically connected through the metal layer of the insulator 231 , thereby reducing the voltage drop between the plurality of second electrodes 243 , thereby improving the uniformity of the brightness of the display screen of the display panel 20 and improving the display quality of the display panel 20 .

[0165] In one example, the material of the metal layer includes at least one of a metal and a metal oxide. For example, the metal may be silver, copper, titanium, aluminum, etc. The metal oxide may be tin oxide, zinc oxide, cadmium oxide, indium oxide, indium tin oxide, zinc indium oxide, zinc gallium oxide, zinc aluminum oxide, titanium tantalum oxide, etc.

[0166] In another example, the separator 231 may include a first metal layer (not shown) and a second metal layer (not shown) stacked in a direction away from the substrate 21. The orthographic outer contour of the first metal layer on the substrate 21 is located outside the orthographic outer contour of the second metal layer on the substrate 21. Here, the first metal layer and the second metal layer are stacked in sequence in a direction away from the substrate 21. In one example, the material of the first metal layer may be Mo, and the material of the second metal layer may be Al.

[0167] In one embodiment, the material of the blocking portion 232 includes an insulating material; or, the material of the blocking portion 232 includes a conductive material; for example, the blocking portion 232 can be a metallic conductive material such as silver, copper, titanium, or aluminum.

[0168] In this embodiment, when the material of the blocking portion 232 includes a conductive material, the strength and hardness of the blocking portion 232 can be improved, so that the blocking portion 232 is not prone to collapse during the molding process of the isolation structure 23, thereby ensuring the projection relationship between the blocking portion 232 and the isolation body 231 on the substrate 21, which is conducive to obtaining the isolation structure 23 of the desired shape.

[0169] In one embodiment, the first electrode 241 is located between the first insulating layer 221 and the second insulating layer 222 .

[0170] In this way, the isolation structure 23 and the first electrode 241 as well as adjacent first electrodes 241 can be insulated from each other.

[0171] In one embodiment, there is a distance between the light emitting functional portion 242 and the isolation structure 23 .

[0172] In this way, it can be ensured that the film layers of the light-emitting functional parts 242 of different colors are insulated from each other, thereby avoiding the problem of current crosstalk between adjacent light-emitting functional parts 242, and ensuring that when the sub-pixels 24 of the corresponding colors are lit, the current will not be transmitted horizontally to the adjacent sub-pixels 24, thereby preventing the display panel 20 from having color crosstalk problems and improving the display effect.

[0173] Second, see Figure 12 As shown, the embodiment of the present application provides a method for manufacturing a display panel 20, including:

[0174] S10, providing a substrate 21;

[0175] S20, forming an insulating structure 22 and an isolation structure 23 on one side of the substrate 21, wherein the isolation structure 23 is disposed on a side of the insulating structure 22 facing away from the substrate 21; a first opening 23a and a second opening 23b are defined in the isolation structure 23, and both the first opening 23a and the second opening 23b penetrate the isolation structure 23 along the thickness direction of the substrate 21;

[0176] S30, forming a sub-pixel 24 in the first opening 23a;

[0177] S40, forming a packaging structure 25 on a side of the insulating structure 22 close to the isolation structure 23; wherein the packaging structure 25 covers the side of the sub-pixel 24 away from the substrate 21 and the side of the isolation structure 23 away from the substrate 21, and extends into the second opening 23b.

[0178] According to the method for manufacturing the display panel 20 of the embodiment of the present application, a second opening 23b is provided on the isolation structure 23. The second opening 23b penetrates the isolation structure 23 along the thickness direction of the substrate 21, and the encapsulation structure 25 covers the side of the sub-pixel 24 away from the substrate 21 and the side of the isolation structure 23 away from the substrate 21, and extends into the second opening 23b. In this way, on the one hand, the coverage area of ​​the encapsulation structure 25 on the isolation structure 23 is increased, thereby extending the peeling path of the encapsulation structure 25, reducing the probability of peeling and spreading between the encapsulation structure 25 and the isolation structure 23, and improving the encapsulation performance of the encapsulation structure 25; on the other hand, because the second opening 23b penetrates the isolation structure 23 along the thickness direction of the substrate 21, the transmittance of the isolation structure 23 can be increased, thereby improving the transmittance of the display panel 20 and improving the performance of the under-screen module. In summary, the present application can improve the reliability of the display panel 20, improve the transmittance of the display panel 20, and improve the performance of the under-screen module.

[0179] Thirdly, see Figure 13 As shown, an embodiment of the present application provides a display device 1, which includes the display panel 20 of any of the above embodiments. This can improve the display effect of the display device 1 and enhance the reliability of the display device 1.

[0180] The display device 1 can be a laptop computer, a mobile phone, a wireless device, a personal digital assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a watch, a clock, a calculator, a television monitor, a flat-panel display, a computer monitor, a car display (e.g., an odometer display, etc.), a navigator, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rearview camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, etc.

[0181] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0182] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; an insulating structure, disposed on one side of the substrate; an isolation structure, disposed on a side of the insulating structure facing away from the substrate, the isolation structure being provided with a first opening and a second opening, the first opening and the second opening both penetrating the isolation structure along a thickness direction of the substrate; a sub-pixel disposed in the first opening; The packaging structure is provided on a side of the insulating structure close to the isolation structure; wherein the packaging structure covers a side of the sub-pixel away from the substrate and a side of the isolation structure away from the substrate, and extends into the second opening.

2. The display panel according to claim 1, wherein: The second opening includes a first sub-cavity close to the substrate and a first sub-opening away from the substrate; an orthographic projection of the first sub-opening on the substrate falls within an orthographic projection of the first sub-cavity on the substrate.

3. The display panel according to claim 2, wherein: A dimension of the first sub-opening along a first direction is smaller than a dimension of the first sub-cavity along the first direction, and the first direction is perpendicular to a thickness direction of the substrate and an extension direction of the isolation structure; Optionally, the first sub-cavity includes a first end close to the substrate and a second end away from the substrate; and a size of the first sub-cavity along the first direction gradually increases from the first end to the second end.

4. The display panel according to claim 2, wherein: The isolation structure includes an isolation body and a blocking portion, wherein the blocking portion is provided on a side of the isolation body facing away from the substrate, and an orthographic projection of the isolation body on the substrate is located within an orthographic projection of the blocking portion on the substrate; Optionally, the isolator and / or the blocking portion is a metal structure; Optionally, one end of the blocking portion close to the first opening extends toward the center of the first opening and protrudes from a side wall of the isolating body close to the first opening; Optionally, one end of the blocking portion close to the second opening extends toward the center of the second opening and protrudes from a side wall of the isolating body close to the second opening.

5. The display panel according to claim 4, wherein: The packaging structure is in contact with the side wall of the blocking portion in the second opening close to the first sub-opening, the side wall of the blocking portion close to the first sub-cavity, and the side wall of the isolator close to the first sub-cavity; Optionally, the packaging structure further covers a side of the insulation structure exposed by the second opening facing away from the substrate.

6. The display panel according to claim 1, wherein: The encapsulation structure includes a first encapsulation layer and a second encapsulation layer, wherein the first encapsulation layer at least covers a side of the sub-pixel facing away from the substrate and at least a portion of a sidewall of the isolation structure close to the sub-pixel; the second encapsulation layer is disposed in the second opening, and further covers a side of the isolation structure facing away from the substrate and the first encapsulation layer; Optionally, the encapsulation structure further includes a third encapsulation layer, and the third encapsulation layer covers the second encapsulation layer; Optionally, the material of the first encapsulation layer includes an inorganic material; Optionally, the material of the second encapsulation layer includes organic material; Optionally, the material of the third encapsulation layer includes inorganic material.

7. The display panel according to claim 6, wherein: The isolation structure is provided with a plurality of first openings; a sub-pixel is correspondingly arranged in each of the first openings; the first packaging layer includes a plurality of sub-packaging parts; the plurality of sub-packaging parts are correspondingly arranged in the plurality of first openings; the sub-packaging parts cover the surface of the sub-pixel facing away from the substrate and at least a portion of the side wall of the isolation structure close to the sub-pixel.

8. The display panel according to claim 7, wherein: The sub-encapsulation portion corresponding to at least one sub-pixel adjacent to the second opening further covers at least a portion of a sidewall of the second opening; Optionally, the sub-encapsulation portion corresponding to at least one sub-pixel adjacent to the second opening further covers a side of the isolation structure facing away from the substrate; Optionally, the sub-encapsulation portion corresponding to at least one sub-pixel adjacent to the second opening further covers at least a portion of the insulating structure exposed by the second opening on a side facing away from the substrate; Optionally, a light-emitting material layer and an electrode material layer stacked in sequence are provided on a side of the isolation structure facing away from the substrate; The sub-encapsulation portion corresponding to at least one of the sub-pixels adjacent to the second opening further covers the top surface of the electrode material layer, the side surfaces of the electrode material layer, and the side surfaces of the light-emitting material layer.

9. The display panel according to claim 7, wherein: The isolation structure is provided with a plurality of second openings; and at least one second opening is provided between two adjacent first openings. Optionally, one second opening is provided between two adjacent first openings; the sub-encapsulation portions in the two adjacent first openings extend and cover into the same second opening; Optionally, the second openings arranged in parallel are provided between two adjacent first openings; and the sub-packages in the two adjacent first openings respectively extend and cover into the second openings adjacent to them.

10. The display panel according to claim 7, wherein: The orthographic projection of the isolation structure on the substrate is in a grid shape; Optionally, there are multiple isolation structures, and the multiple isolation structures are distributed at intervals; The orthographic projection of the isolation structure on the substrate is annular and surrounds the corresponding sub-pixel; The isolation structure is provided with at least one second opening.

11. The display panel according to claim 1, wherein The packaging structure contacts the insulating structure in the second opening; Optionally, the insulation structure includes a first insulation layer, and the encapsulation structure is in contact with the first insulation layer; Optionally, a third opening is formed on the first insulating layer, the third opening is arranged corresponding to the first opening, and at least a portion of the sub-pixel is arranged in the third opening; Optionally, the third opening penetrates at least a portion of the first insulating layer along the thickness direction of the substrate; Optionally, a fourth opening is further formed on the first insulating layer, and the fourth opening corresponds to the second opening; Optionally, the fourth opening penetrates at least a portion of the first insulating layer along a thickness direction of the substrate.

12. The display panel according to claim 11, wherein: The insulating structure further includes a second insulating layer, which is disposed on a side of the first insulating layer close to the substrate; the fourth opening penetrates the first insulating layer along the thickness direction of the substrate to expose the second insulating layer; The packaging structure is in contact with the second insulating layer through the fourth opening; Optionally, the material of the first insulating layer includes an inorganic material; Optionally, the material of the second insulating layer includes organic material; Optionally, an orthographic projection of the isolation structure on the first insulating layer is located at a periphery of the third opening.

13. The display panel according to claim 12, wherein: The sub-pixel includes a first electrode, a light-emitting functional portion, and a second electrode stacked in sequence in a direction away from the substrate; the first electrode is located on a side of the first insulating layer close to the substrate, and the third opening penetrates the first insulating layer along the thickness direction of the substrate to expose the first electrode; The second electrode is connected to the isolation structure; Optionally, the material of the isolation structure includes a conductive material; Optionally, the first electrode is located between the first insulating layer and the second insulating layer; Optionally, there is a distance between the light-emitting functional part and the isolation structure.

14. A method for manufacturing a display panel, characterized in that: include: providing a substrate; forming an insulating structure and an isolation structure on one side of the substrate, wherein the isolation structure is arranged on a side of the insulating structure away from the substrate; The isolation structure is provided with a first opening and a second opening, and the first opening and the second opening both penetrate the isolation structure along the thickness direction of the substrate; forming a sub-pixel in the first opening; A packaging structure is formed on a side of the insulating structure close to the isolation structure; wherein the packaging structure covers a side of the sub-pixel away from the substrate and a side of the isolation structure away from the substrate, and extends into the second opening.

15. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 13.

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