Electronic equipment and heat dissipation device

Abstract

The invention provides electronic equipment for improving the cooling capacity of an IC chip and a heat dissipation device. A heat dissipation device (100) has a plurality of heat pipes (130) arranged in a left-right direction along a surface (10D) of an IC chip (10), and the plurality of heat pipes include bonding portions (131) formed by bonding heat pipes (130) adjacent to each other together. An intermediate position (L1) of the engaging portion (131) in the right-left direction is offset to a first side in the right-left direction with respect to an intermediate position (L2) of the surface (10D) in the right-left direction.

Description

Technical Field

[0001] The present disclosure relates to electronic equipment and a heat dissipation device. Background Art

[0002] Recent years have seen the use of integrated circuit (IC) chips, such as SoCs (systems on a chip), that integrate CPU (central processing unit), I / O (input / output), and other features. Furthermore, heat sinks are being used, each consisting of multiple heat pipes and a heat sink to cool the IC chip. Multiple heat pipes are bonded together across the width of each heat sink to form a joint that can thermally connect to a single IC chip.

[0003] [Citation List]

[0004] [Patent Document]

[0005] [PTL 1]

[0006] JP 2018-148026A Summary of the Invention

[0007] Technical issues

[0008] In view of the demand for cost reduction and miniaturization of equipment, it has been desired to provide a heat sink having a small-sized cooling structure that provides higher cooling capacity with higher efficiency.

[0009] An object of the present disclosure is to provide an electronic device and a heat dissipation device for improving the ability to cool an IC chip.

[0010] Solution to the problem

[0011] An electronic device according to the present disclosure includes an IC chip and a plurality of heat pipes, wherein the IC chip has a surface facing a first direction. The plurality of heat pipes are arranged along the surface in a second direction intersecting the first direction, and include a joining portion formed by joining adjacent heat pipes together. The joining portion is positioned relative to the surface along the first direction and is thermally connected to the surface. The middle position of the joining portion in the second direction is offset to a first side in the second direction relative to the middle position of the surface in the second direction. This can improve the ability to cool the IC chip.

[0012] In addition, the heat sink according to the present disclosure is a heat sink for covering a surface of an IC chip facing a first direction. The heat sink includes a plurality of heat pipes. The plurality of heat pipes are arranged along the surface in a second direction intersecting the first direction, and include a joining portion formed by joining adjacent heat pipes together. The joining portion is placed relative to the surface along the first direction and is thermally connected to the surface. The middle position of the joining portion in the second direction is offset to the first side in the second direction relative to the middle position of the surface in the second direction. As a result, the ability to cool the IC chip can be improved.

[0013] In addition, another electronic device according to the present disclosure includes an IC chip and a plurality of heat pipes, wherein the IC chip has a surface facing a first direction. The plurality of heat pipes are arranged along the surface in a second direction intersecting the first direction, and include a joining portion formed by joining adjacent heat pipes together. The joining portion is placed relative to the surface along the first direction and is thermally connected to the surface. The heat absorption efficiency of the joining portion in the region located on the first side relative to the middle position of the surface in the second direction is higher than the heat absorption efficiency of the joining portion in the region located on the second side relative to the middle position. Thus, the ability to cool the IC chip can be improved.

[0014] In addition, another heat dissipation device according to the present disclosure is a heat dissipation device for covering the surface of an IC chip facing a first direction. The heat dissipation device includes a plurality of heat pipes. The plurality of heat pipes are arranged along the surface in a second direction intersecting the first direction, and include a joining portion formed by joining together adjacent heat pipes. The joining portion is placed relative to the surface along the first direction and is thermally connected to the surface. The heat absorption efficiency of the joining portion in the region located on the first side relative to the middle position of the surface in the second direction is higher than the heat absorption efficiency of the joining portion in the region located on the second side relative to the middle position. Thereby, the ability to cool the IC chip can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. 4 is a plan view of a heat dissipation device incorporated in an electronic device according to an embodiment of the present disclosure.

[0016] Figure 2 This is an exploded perspective view of the components of an IC chip and a heat sink included in an electronic device.

[0017] Figure 3 It is a plan view of the heat sink.

[0018] Figure 4 It is along Figure 3 A cross-sectional view of the IC chip and the heat sink taken along line IV-IV.

[0019] Figure 5is a plan view schematically showing exemplary regions of respective functions mounted on the surface of an IC chip and exemplary placement positions of joining portions of heat pipes.

[0020] Figure 6 is a plan view schematically depicting other exemplary areas of various functions mounted on the surface of an IC chip and another exemplary placement position of the bonding portion of a heat pipe.

[0021] Figure 7 is a cross-sectional view of a heat dissipation device incorporated in an electronic device according to another embodiment of the present disclosure.

[0022] Figure 8 is a cross-sectional view of a heat dissipation device incorporated in an electronic device according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0023] [1. Overview of IC Chips and Heat Dissipation Devices]

[0024] Figure 1 FIG. 1 is a plan view of a heat dissipation device 100 incorporated into an electronic device. Figure 2 1 is an exploded perspective view of constituent elements of an IC chip 10 and a heat sink 100 incorporated in an electronic device. Figure 3 1 is a plan view of the heat sink 100 , in which a substrate 120 to be described later is depicted in an enlarged manner. Figure 4 It is along Figure 3 1 is a cross-sectional view of the IC chip 10 and the heat sink 100 taken along line IV-IV.

[0025] In the following description, Figure 2 The Z1 direction and the Z2 direction along the Z axis shown in the other figures will be referred to as the upward direction and the downward direction, respectively. In addition, the X1 direction and the X2 direction along the X axis perpendicular to the Z axis will be referred to as the left direction and the right direction, respectively. In addition, the Y1 direction and the Y2 direction along the Y axis perpendicular to the Z axis and the X axis will be referred to as the forward direction and the backward direction, respectively. It should be noted that these directions are defined only to explain the shape of elements such as the parts, components, and portions of the heat sink 100 and the relative positional relationship between the IC chip 10 and the heat sink 100, for example, and do not limit the posture of the IC chip 10 and the heat sink 100 in the electronic device. For example, an electronic device incorporating the IC chip 10 and the heat sink 100 can be placed upside down on a mounting surface such as a floor. Alternatively, the electronic device can be placed with its side surface (i.e., the surface in the X-axis or Y-axis direction) in contact with the mounting surface.

[0026] The IC chip 10 is, for example, a SoC that integrates the functions of a GPU (Graphics Processing Unit), a CPU, and I / O. The IC chip 10 may also include memory functions such as ROM (Read Only Memory) or RAM (Random Access Memory). In the present disclosure, the IC chip 10 is a flat semiconductor formed of silicon or the like, which is referred to as a bare die. The IC chip 10 may incorporate circuits for implementing the functions of a GPU and other features. Figure 2 and Figure 4 As indicated in FIG, IC chip 10 has a flat plate-like shape and includes an upper surface 10U facing upward and a lower surface 10D (surface) facing downward (in the first direction). When IC chip 10 is driven, the portion of IC chip 10 including at least lower surface 10D generates heat. In the following description, lower surface 10D of IC chip 10 is also referred to as heat dissipation surface 10D.

[0027] like Figure 4 As depicted in FIG, the IC chip 10 is mounted on a circuit board 20. Figure 1 and Figure 2 The circuit board 20 is omitted from the illustration. The circuit board 20 may be covered by a circuit board shield 30 formed of a conductive material such as iron or aluminum. In this case, the circuit board shield 30 may also be formed with an opening at the position of the IC chip 10 so as to expose the heat dissipation surface 10D. A heat sink 100 for cooling the IC chip 10 may be attached to the position of the opening of the circuit board shield 30. The heat sink 100 is placed on the lower side of the IC chip 10 covered by the circuit board shield 30 ( Figure 2 direction shown by Z2 in the figure).

[0028] like Figure 1 and Figure 2 As depicted, the heat dissipation device 100 has a heat receiving plate 110 (heat receiving member), a base plate 120, a plurality of heat pipes 130 (six heat pipes 130 in this embodiment, as shown in FIG. Figure 4 ), heat sinks 140a and 140b. The heat receiving plate 110, the plurality of heat pipes 130, and the heat sinks 140a and 140b are each formed of metal to cool the IC chip 10. The heat receiving plate 110, the plurality of heat pipes 130, and the heat sinks 140a and 140b can be formed of a metal with high thermal conductivity (such as aluminum or copper), or alternatively, iron. The substrate 120 can also be formed of a conductive material such as iron or aluminum.

[0029] like Figure 2 As depicted in FIG, the substrate 120 has an opening 121 at its center. In a plan view of the circuit board unit, the opening of the substrate 120 is formed at the position of the IC chip 10. Figure 2 As shown, the first contact portion 111 is upward ( Figure 2The top of the first connection portion 111 constitutes a heat receiving surface 111U (see FIG. 11A ) in contact with the heat radiation surface 10D of the IC chip 10. Figure 4 ). The heat release surface 10D may be coated with grease or liquid metal to transfer heat to the heat receiving surface 111U. Figure 1 and Figure 2 As depicted in , in the heat dissipation device 100 , the heat reception surface 111U of the heat reception plate 110 is exposed in the upward direction.

[0030] like Figure 4 As shown, a plurality of heat pipes 130 are arranged along the heat dissipation surface 10D of the IC chip 10 in the left-right direction (a second direction intersecting the first direction, i.e., Figure 4 The heat pipes 130 are arranged in the X-axis direction (in the X-axis direction) and include a joint portion 131 formed by joining adjacent heat pipes 130 together. The joint portion 131 may be the portion where all the multiple heat pipes 130 (in this embodiment, five heat pipes) included in the heat dissipation device 100 are joined together. The joint portion 131 may be the portion where the multiple heat pipes 130 are welded or joined together by fixing means such as brazing.

[0031] like Figure 4 As shown, the joint portion 131 of the heat pipe 130 is placed below the heat dissipation surface 10D of the IC chip 10 (in the first direction) and is thermally connected to the heat dissipation surface 10D of the IC chip 10. Here, thermal connection means that the joint portion 131 is in direct contact or indirect contact with the heat dissipation surface 10D. Indirect contact means that, for example, grease, liquid metal, or a metal layer is interposed between the joint portion 131 and the heat dissipation surface 10D so that the joint portion 131 and the heat dissipation surface 10D are in contact. Figure 4 In the example shown in FIG, the heat receiving plate 110 is interposed between the bonding portion 131 and the heat radiation surface 10D. Within the opening 121 of the substrate 120, the heat receiving plate 110 is in contact with both the heat radiation surface 10D of the IC chip 10 and the bonding portion 131 of the heat pipe 130. The bonding portion 131 is indirectly in contact with and thermally connected to the heat radiation surface 10D via the heat receiving plate 110.

[0032] like Figure 4 As shown, the heat receiving plate 110 is interposed vertically (in the Z-axis direction) between the heat dissipation surface 10D of the IC chip 10 and the bonding portion 131 of the heat pipe 130. The heat receiving plate 110 has a first connection portion 111 that contacts and is thermally connected to the heat dissipation surface 10D. The heat receiving plate 110 also has a second connection portion 112 that contacts and is thermally connected to the bonding portion 131. More specifically, the lower surface 112D of the second connection portion 112 contacts the bonding portion 131 of the heat pipe 130. The first connection portion 111 protrudes upward from the upper surface 112U of the second connection portion 112.

[0033] The heat pipe 130 transfers the heat of the IC chip 10 received via the heat receiving plate 110 to the Figure 1 The heat sink 140a or 140b is depicted in FIG. The heat sink 140a, 140b releases the heat of the IC chip 10 transferred via the heat pipe 130. This enables the heat sink 100 to cool the IC chip 10 in contact with the heat receiving surface 111U.

[0034] The heat receiving plate 110 is fixed to the base plate 120 by a fixing means such as brazing. Figure 4 As depicted in FIG, the heat reception plate 110 includes a fixing portion 114L positioned on the left side (X1 side) of the first connection portion 111, and a fixing portion 114R positioned on the right side (X2 side) of the first connection portion 111. The fixing portions 114L and 114R are provided on the lower surface of the heat reception plate 110 (the lower surface 112D of the second connection portion 112). The fixing portions 114L and 114R are fixed to the base plate 120 by fixing means such as brazing.

[0035] [2. Placement position of the bonding portion relative to the IC chip]

[0036] Figure 5 10D is a plan view schematically illustrating exemplary regions of respective functions mounted on the IC chip 10 and exemplary placement positions of the bonding portions 131 of the heat pipes 130 on the heat radiation surface 10D. Figure 6 FIG. 1 is a plan view schematically illustrating another exemplary region of each function mounted on the IC chip 10 and another exemplary placement position of the bonding portion 131 on the heat radiation surface 10D. Figure 5 and Figure 6 In each of the examples, the middle position L1 of the engaging portion 131 in the right-left direction (second direction) is offset to the first side in the right-left direction (second direction) relative to the middle position L2 of the heat radiation surface 10D in the right-left direction. Figure 5 and Figure 6 The left side (X1 side in the example). The middle position L1 of the joint portion 131 is the middle position of all the heat pipes 130 located below the IC chip 10 in the left-right direction. Thus, the heat absorption efficiency of the joint portion 131 on the first side (for example, the left side) of the middle position L2 in the right-left direction relative to the heat radiation surface 10D becomes higher than that on the second side (for example, the left side) relative to the middle position L2. Figure 5 and Figure 6 The heat absorption efficiency of the bonding portion 131 on the right side (X2 side) in the example shown in FIG. Incidentally, "heat absorption efficiency" refers to the degree to which heat can be absorbed from the heat radiation surface 10D. For example, heat absorption efficiency can be restated as "heat absorption amount" or "heat transfer coefficient."

[0037] exist Figure 5 and Figure 6 In the example depicted, the intermediate position L1 of the joint portion 131 is offset to the left side (X1 side) with respect to the intermediate position L2 of the heat dissipation surface 10D in the right-left direction. As a result, the heat absorption efficiency of the joint portion 131 in the region on the left side of the intermediate position L2 of the heat dissipation surface 10D (for example, the CP region 10c described later) becomes higher than the heat absorption efficiency of the joint portion 131 in the region on the right side of the intermediate position L2 of the heat dissipation surface 10D (for example, the I / O region 10a described later). By doing so, the heat released from the heat dissipation surface 10D can be efficiently absorbed.

[0038] As Figure 5 and Figure 6 shown, the IC chip 10 includes an I / O region 10a (first region) in which a circuit for performing data input / output processing functions is installed, a GP region 10b (second region) for performing a first arithmetic processing function for parallel arithmetic processing, and a CP region 10c (third region) for performing a second arithmetic processing function. "Parallel arithmetic processing" is, for example, a pipeline processing for parallelly executing multiple processes (for example, instruction fetching and decoding), or a data parallel processing achieved by performing the same process on different parts of data. Further, the "first arithmetic processing function" is, for example, a function for image processing (arithmetic processing required for drawing an image), a machine learning process such as deep learning, or other processes. The "second arithmetic processing function" is a function for general arithmetic processing different from image processing and machine learning processing. The GP region 10b mainly has a GPU function, while the CP region 10c mainly has a CPU function. The temperature of the surface (heat dissipation surface 10D) of the IC chip 10 varies according to the details of the processes executed by the respective regions described above.

[0039] In the GP region 10b (second region), M cores for performing the first arithmetic processing function for image processing and machine learning processing are installed. Further, in the CP region 10c (third region), N (N < M) cores for performing the second arithmetic processing function for general arithmetic processing are installed. The number of cores installed in the GP region 10b is greater than the number of cores installed in the CP region 10c.

[0040] The number of cores installed in the GP area 10b is, for example, 50 or more. The number of cores installed in the GP area 10b may be 100 or more, or 200 or more. The number of cores installed in the GP area 10b may be 500 or more, or 1000 or more. In contrast, the number of cores installed in the CP area 10c is, for example, 30 or less. The number of cores installed in the CP area 10c may be 20 or less, or 10 or less. The number of cores installed in the CP area 10c may be five or less, or may be two or one.

[0041] When the IC chip 10 is driven (for example, when the electronic device is executing an application such as a game), the average temperature of the area is highest in the GP area 10b, followed by the CP area 10c, and lowest in the I / O area 10a. The "average temperature" is the average temperature per unit area (for example, 1 mm2) in each of the I / O area 10a, the GP area 10b, and the CP area 10c. 2 ) is the average temperature.

[0042] exist Figure 5 and Figure 6 In the example depicted in FIG, the CP region 10c, GP region 10b, and I / O region 10a are arranged in this order on the heat dissipation surface 10D, from the first side to the second side (more specifically, from the left side (X1 side) to the right side (X2 side)). The GP region 10b is positioned so as to include the center portion of the IC chip 10. The CP region 10c is positioned on one side of the GP region 10b, and the I / O region 10a is positioned on the other side of the GP region 10b. As a result, the average temperature of the area on the first side (e.g., the left side) relative to the center position L2 in the left-right direction (second direction) of the heat dissipation surface 10D becomes higher than the average temperature of the area on the second side (e.g., the right side) relative to the center position L2 in the left-right direction of the heat dissipation surface 10D. At the same time, the center position L1 of the bonding portion 131 is offset to the first side (e.g., the left side) relative to the center position L2 of the heat dissipation surface 10D. This allows for efficient absorption of heat released from the heat dissipation surface 10D.

[0043] exist Figure 5 and Figure 6 In the example depicted in FIG, at least a portion of the I / O area 10a is placed on the right side (the second side, i.e., the middle position L2 in the right-left direction) relative to the heat radiation surface 10D. Figure 5 and Figure 6 X2 side in the middle). Figure 5 In the example in FIG, the entire I / O area 10a is placed on the right side relative to the middle position L2 of the heat radiation surface 10D. Figure 6In the example shown, the I / O area 10a is positioned to the right and left of the center position L2 of the heat radiation surface 10D. Furthermore, in this example, the size of one portion of the I / O area 10a located to the right (second side) of the center position L2 is larger than the size of another portion of the I / O area 10a located to the left (first side) of the center position L2 of the heat radiation surface 10D. Furthermore, the center position L1 of the joint portion 131 is offset to the area (left side) opposite to the right area (right side relative to the center position L2 of the heat radiation surface 10D). This right area extensively covers the I / O area 10, where the average temperature is the lowest. This effectively absorbs heat released from the heat radiation surface 10D.

[0044] exist Figure 5 and Figure 6 In the example depicted in FIG, the CP region 10c is placed on the left side (the first side, i.e., the middle position L2 in the right-left direction) relative to the heat radiation surface 10D. Figure 5 and Figure 6 (X1 side in the figure). More specifically, the entire CP area 10c is positioned to the left of the center position L2 of the heat radiation surface 10D. Simultaneously, the center position L1 of the joint portion 131 is offset to the left of the center position L2 of the heat radiation surface 10D, an area encompassing the CP area 10c. With the center position L1 of the joint portion 131 offset relative to the center position L2 of the heat radiation surface 10D, the average temperature in the CP area 10c is higher than that in the I / O area 10a. This allows efficient absorption of heat released from the heat radiation surface 10D.

[0045] exist Figure 5 and Figure 6 In the example depicted in FIG, the GP region 10b is placed on the left side (the first side, i.e., the middle position L2 of the heat radiation surface 10D). Figure 5 and Figure 6 X1 side) and right side (the second side, i.e. Figure 5 and Figure 6The center position L1 of the bonding portion 131 in the left-right direction is set to overlap with the GP region 10b, which has the highest average temperature when the IC chip 10 is driven (during application execution). The bonding portion 131 covers the entire GP region 10b. Furthermore, the center position L1 of the bonding portion 131 is located between the CP region 10c and the center position L2 of the heat dissipation surface 10D in the right-left direction. In this way, the center position L1 of the bonding portion 131 is located within the GP region 10b and offset to the CP region 10c, which has the second highest average temperature after the GP region 10b. This allows the heat released from the heat dissipation surface 10D to be efficiently absorbed.

[0046] like Figure 4 As depicted in FIG, the heat reception plate 110 includes a first connection portion 111 in contact with the heat radiation surface 10D and a second connection portion 112 in contact with the joint portion 131. The first connection portion 111 protrudes upward from an upper surface 112U of the second connection portion 112. The width of the first connection portion 111 in the left-right direction is smaller than the width of the second connection portion 112 in the left-right direction.

[0047] like Figure 4 As shown, the middle position L3 of the first connection portion 111 in the left-right direction coincides with the middle position L2 of the heat radiation surface 10D in the left-right direction. In addition, the middle position L4 of the second connection portion 112 in the left-right direction is offset to the left (first side, i.e., Figure 4 (X1 side in the figure). The center position L4 of the second connection portion 112 coincides with the center position L1 of the joint portion 131 in the left-right direction. Similar to the center position L2 of the heat radiation surface 10D and the center position L1 of the joint portion 131, the center position L3 of the first connection portion 111 and the center position L4 of the second connection portion 112 are offset in the left-right direction on the heat reception plate 110. This allows the heat reception plate 110 to efficiently transfer heat from the heat radiation surface 10D to the joint portion 131 of the heat pipe 130 after the heat reception surface 111U of the first connection portion 111 receives it.

[0048] like Figure 2 As shown, on the left side (X1 side) and the right side (X2 side) of the substrate 120, recesses 122L and 122R are formed in a manner recessed downward relative to the upper surface 120U of the substrate 120. Figure 4 As depicted in , the fixing portions 114L and 114R of the heat reception plate 110 are fixed to the inner sides of the recessed portions 122L and 122R of the base plate 120. Figure 4 As indicated in , the upper surface of the heat reception plate 110 (the upper surface 112U of the second connection portion 112 ) and the upper surface 120U of the base plate 120 are arranged in the same position in the vertical direction.

[0049] like Figure 2 and Figure 3 As depicted in FIG, a notch 115L is formed at the front end (the end on the Y1 side) of the left fixing portion 114L in the heat reception plate 110. At the rear end (the end on the Y2 side) of the right fixing portion 114R, the width of the left notch 115L in the left-right direction (X-axis direction) differs from the width of the right notch 115R in the left-right direction. The width of the left notch 115L in the left-right direction matches the width of the left recess 122L. The width of the right notch 115R in the left-right direction matches the width of the right recess 122R.

[0050] The width of the right side cutout 115R of the heat reception plate 110 in the left-right direction ( Figure 4 The width W1 of the right side recess 122R is smaller than the width of the left side cutout 115L in the left-right direction ( Figure 4 It should be noted that the width W2 of the left side recess 122L of the heat receiving plate 110 in the left-right direction (the width W2 of the left side recess 122L) may be smaller than the width of the right side recess 115R (the width of the right side recess 122R). In the case where the heat receiving plate 110 is reversed in the left-right direction and the front-back direction, the above arrangement prevents the heat receiving plate 110 from being fitted into the recesses 122L and 122R. That is, in the case where the heat receiving plate 110 is reversed in the left-right direction and the front-back direction, the heat receiving plate 110 is not allowed to be attached to the substrate 120. Thereby, it is possible to suppress the heat receiving surface 111U of the substrate 120 from deviating from the pre-designed position. For example, in the case where the heat receiving plate 110 is reversed in the left-right direction and the front-back direction. Figure 4 In the position shown, the heat reception plate 110 can effectively transfer the heat of the heat radiation surface 10D received by the heat reception surface 111U of the first connection portion 111 to the joint portion 131 of the heat pipe 130 .

[0051] [3. Modifications]

[0052] It is to be noted that the present invention is not limited to the above-described embodiments.

[0053] (1) Figure 7 FIG is a cross-sectional view of a heat dissipation device 200 incorporated into an electronic device according to another embodiment of the present disclosure. Figure 7 As shown, the heat sink 200 includes a heat receiving block 210 as a heat receiving member instead of the flat plate-shaped heat receiving plate 110 . A heat receiving surface 211U of the top (top end) of the heat receiving block 210 contacts the heat radiation surface 10D of the IC chip 10 .

[0054] like Figure 7As shown, a recess 212 is formed in an upwardly concave manner in the middle portion of the lower surface 210D of the heat receiving block 210. A plurality of heat pipes 130 are mounted in the recess 212. In this manner, the plurality of heat pipes 130 mounted in the recess 212 of the heat receiving block 210 can form a joint portion 131 arranged in the left-right direction (the X-axis direction, i.e., the second direction) along the heat radiation surface 10D of the IC chip 10. The width of the recess 212 in the left-right direction can be the same as (or substantially the same as) the width of the joint portion 131 in the left-right direction.

[0055] It should be noted that the number of heat pipes 130 constituting the joint portion 131 may be as follows: Figure 4 The five shown, or Figure 7 The middle position L1 of the joint portion 131 is the middle position of all the heat pipes 130. Figure 7 In the case where there are six heat pipes 130, the middle position L1 is the middle position of the six heat pipes 130. The number of heat pipes 130 constituting the joint portion 131 may be a number other than five or six.

[0056] Also in Figure 7 In the example shown in FIG, the middle position L1 of the joint portion 131 is offset to the left (X1 side) relative to the middle position L2 of the heat radiation surface 10D in the right-left direction. Figure 5 、 Figure 6 ) and the like, the heat absorption efficiency of the area on the left side relative to the middle position L2 of the heat radiation surface 10D is higher than that of the I / O area 10a (refer to Figure 5 、 Figure 6 ) and the like, the heat absorption efficiency of the area on the right side (X2 side) relative to the middle position L2 of the heat radiation surface 10D is improved. As a result, the heat released from the heat radiation surface 10D can be absorbed efficiently.

[0057] (2) Figure 8 FIG is a cross-sectional view of a heat dissipation device 300 included in an electronic device according to another embodiment of the present disclosure. Figure 8 In the example depicted in FIG, unlike the heat sink 100 described above, the center position L1 of the joint portion 131 in the right-left direction (second direction) coincides with the center position L2 of the heat radiation surface 10D in the right-left direction. On the heat reception plate 110, the center position L3 of the first connection portion 111 in contact with the heat radiation surface 10D in the left-right direction, and the center position L4 of the second connection portion 112 in contact with the joint portion 131 in the left-right direction, also coincide with the center position L2 of the heat radiation surface 10D.

[0058] Also in Figure 8In the illustrated example, the engaging portion 131 is on the left side (the first side, ie, the left side) of the middle position L2 in the left-right direction relative to the heat radiation surface 10D. Figure 8 The heat absorption efficiency in the region of the bonding portion 131 on the X1 side in the middle position L2 is higher than that in the region of the bonding portion 131 on the right side relative to the middle position L2 (the second side, ie, Figure 8 In the example of FIG8 , five heat pipes arranged in the left-right direction (X-axis direction) along the heat dissipation surface 10D of the IC chip 10 constitute the junction portion 131. The three heat pipes 130a on the left side (X1 side) have higher thermal conductivity than the two heat pipes 130b on the right side (X2 side).

[0059] For example, the heat pipes 130 (e.g., three heat pipes 130a) that comprise the junction 131 located on the left side (X1 side) relative to the center position L2 in the left-right direction of the heat radiation surface 10D can have a different cross-sectional structure than the heat pipes 130 (e.g., two heat pipes 130b) that comprise the junction 131 located on the right side (X2 side) relative to the center position L2. Here, "having different cross-sectional structures" means that the cross-sectional shape, size, and internal structure of the heat pipes 130 are different. For example, the internal structure of the heat pipes 130a on the left side (X1 side) can be designed to provide higher thermal conductivity than the internal structure of the heat pipes 130b on the right side (X2 side).

[0060] exist Figure 8 In the depicted example, the cross-sectional dimensions (height H1 in the vertical direction (Z-axis direction)) of the three heat pipes 130a on the left are larger than the cross-sectional dimensions (height H2) of the two heat pipes 130b on the right. Different cross-sectional dimensions allow the CP region 10c (see Figure 5 and Figure 6 ) and the heat absorption efficiency of other areas on the left side relative to the middle position L2 of the heat radiation surface 10D is higher than that of the I / O area 10a (see Figure 5 and Figure 6 ) and the heat absorption efficiency of other areas on the right side relative to the middle position L2 of the heat radiation surface 10D. As a result, the heat released from the heat radiation surface 10D can be absorbed efficiently.

[0061] In addition, the joint portion 131 is not limited in configuration to Figure 8 In another example, the joining portion 131 may be configured such that the thermal conductivity of the material forming the heat pipe 130 a on the left side ( X1 side) is higher than the thermal conductivity of the material forming the heat pipe 130 b on the right side ( X2 side).

[0062] As another alternative, the heat dissipation efficiency (eg, heat release amount proportional to the heat dissipation size) of the heat sink connected to the heat pipe 130a on the left side (X1 side) may be made higher than that of the heat sink connected to the heat pipe 130b on the right side (X2 side).

[0063] This configuration also allows the heat absorption efficiency to be higher in the area to the left (X1 side) of the center position L2 relative to the heat radiation surface 10D than in the area to the right (X2 side) of the center position L2 relative to the heat radiation surface 10D. This allows for efficient absorption of heat released from the heat radiation surface 10D.

[0064] (3) In the above embodiment, if Figure 5 and Figure 6 , the heat dissipation surface 10D of the IC chip 10 is described as including the I / O area 10a, the GP area 10b, and the CP area 10c. However, the heat dissipation surface 10D of the IC chip 10 is not limited to this and may include the I / O area 10a and the GP area 10b but exclude the CP area 10c. In this case, the GP area 10b may be positioned on a first side (e.g., the left side (X1 side)) relative to the center position L2 of the heat dissipation surface 10D, and the I / O area 10a may be positioned on a second side (e.g., the right side (X2 side)) relative to the center position L2 of the heat dissipation surface 10D.

[0065] As another alternative, the heat release surface 10D may include the I / O region 10a and the CP region 10c, but not the GP region 10b. In this case, the CP region 10c may be positioned on the left side relative to the center position L2 of the heat release surface 10D in the right-left direction, and the I / O region 10a may be positioned on the right side relative to the center position L2 of the heat release surface 10D.

[0066] In these structures as well, the engaging portion 131 is at the middle position L1 in the left-right direction (see Figure 5 and Figure 6 ) is offset relative to the middle position L2 of the heat radiation surface 10D. This makes the heat absorption efficiency of the joint portion 131 in the left side (X1 side in Figures 5 and 6) higher than that in the right side (X2 side) relative to the middle position L2 of the heat radiation surface 10D. Figure 5 6 ). This makes it possible to efficiently absorb the heat emitted from the heat radiation surface 10D, which improves the ability to cool the IC chip.

[0067] 4. Summary (1)

[0069] As described above, the electronic device according to the present disclosure includes an IC chip and a plurality of heat pipes. The IC chip has a heat dissipation surface facing a first direction. The plurality of heat pipes are arranged along the heat dissipation surface in a second direction intersecting the first direction, and include a joint portion formed by joining adjacent heat pipes together. The joint portion is placed in the first direction with respect to the heat dissipation surface and is thermally connected to the heat dissipation surface. The intermediate position of the joint portion in the second direction is offset toward the first side in the second direction with respect to the intermediate position of the heat dissipation surface in the second direction. Thus, the ability to cool the IC chip can be improved. (9)

[0071] The heat dissipation device according to the present disclosure is a heat dissipation device for covering the heat dissipation surface facing the first direction of an IC chip. The heat dissipation device includes a plurality of heat pipes. The plurality of heat pipes are arranged along the heat dissipation surface in a second direction intersecting the first direction, and include a joint portion formed by joining adjacent heat pipes together. The joint portion is placed in the first direction with respect to the heat dissipation surface and is thermally connected to the heat dissipation surface. The intermediate position of the joint portion in the second direction is offset toward the first side in the second direction with respect to the intermediate position of the heat dissipation surface in the second direction. Thus, the ability to cool the IC chip can be improved. (2)

[0073] In the electronic device according to (1) above, the average temperature of the region of the surface on the first side may be higher than the average temperature of the region of the surface on the second side with respect to the intermediate position of the surface in the second direction. (3)

[0075] In the electronic device according to (1) or (2) above, the IC chip may include a first region in which a circuit for performing a data input / output processing function is formed. At least a part of the first region may be placed on the second side with respect to the intermediate position of the surface in the second direction. [[ID=十七]](4)

[0077] In the electronic device according to (3) above, the first region may be placed on both the first side and the second side. The size of a part of the first region on the second side may be larger than the size of another part of the first region on the first side. (5)

[0079] In the electronic device according to any one of (1) to (4) above, the IC chip may include a second region and a third region. The second region has M cores installed therein to perform a first arithmetic processing function for parallel arithmetic processing, and the third region has N (N<M) cores installed therein to perform a second arithmetic processing function. The third region may be placed on the first side. (6)

[0081] In the electronic device according to (5) above, a middle position of the engaging portion in the second direction may be interposed between the third region and a middle position of the surface in the second direction. (7)

[0083] The electronic device according to any one of (1) to (6) above may include a heat receiving member interposed between the surface and the joining portion. The heat receiving member may also have a first connection portion in contact with and thermally connected to the surface and a second connection portion in contact with and thermally connected to the joining portion. The middle position of the first connection portion in the second direction may coincide with the middle position of the surface in the second direction. The middle position of the second connection portion in the second direction may be offset toward the first side relative to the middle position of the surface in the second direction. (8)

[0085] In the electronic device according to the above (7), a middle position of the second connection portion in the second direction may coincide with a middle position of the engagement portion in the second direction. (10)

[0087] Another electronic device according to the present disclosure includes an IC chip and a plurality of heat pipes, wherein the IC chip has a heat release surface facing a first direction. The plurality of heat pipes are arranged along the heat release surface in a second direction intersecting the first direction, and include a joint portion formed by joining adjacent heat pipes together. The joint portion is placed in the first direction relative to the heat release surface and is thermally connected to the heat release surface. The heat absorption efficiency of the joint portion on the first side of the middle position relative to the heat release surface in the second direction is higher than the heat absorption efficiency of the joint portion in the region on the second side relative to the middle position. Thus, the ability to cool the IC chip can be improved. (13)

[0089] Another heat dissipation device according to the present disclosure is a heat dissipation device for covering a heat dissipation surface of an IC chip facing a first direction. The heat dissipation device includes a plurality of heat pipes. The plurality of heat pipes are arranged along the heat dissipation surface in a second direction intersecting the first direction, and include a joint portion formed by joining adjacent heat pipes together. The joint portion is placed in the first direction relative to the heat dissipation surface and is thermally connected to the heat dissipation surface. The heat absorption efficiency of the joint portion on the first side relative to the middle position of the heat dissipation surface in the second direction is higher than the heat absorption efficiency of the joint portion on the second side relative to the middle position. Thereby, the ability to cool the IC chip can be improved. (11)

[0091] In the electronic device according to (10) above, the cross-sectional structure of the heat pipe located on the first side at the middle position relative to the surface in the second direction and constituting the joint portion may be different from the cross-sectional structure of the heat pipe located on the second side at the middle position relative to the surface and constituting the joint portion. (12)

[0093] In the electronic device according to (10) or (11) above, the heat dissipation efficiency of the heat sink connected to the heat pipe on the first side at the middle position relative to the surface in the second direction and constituting the joint portion may be higher than the heat dissipation efficiency of the heat sink connected to the heat pipe on the second side at the middle position and constituting the joint portion.

Claims

1. An electronic device, comprising: An integrated circuit chip having a surface facing a first direction; And A plurality of heat pipes, wherein, The plurality of heat pipes are arranged along the surface in a second direction intersecting the first direction and include a joint portion formed by joining adjacent heat pipes together, The joint portion is placed along the first direction with respect to the surface and is thermally connected to the surface, and The intermediate position of the joint portion in the second direction is offset to the first side in the second direction with respect to the intermediate position of the surface in the second direction.

2. The electronic device according to claim 1, wherein, With respect to the intermediate position of the surface in the second direction, the average temperature of the region on the first side of the surface is higher than the average temperature of the region on the second side of the surface.

3. The electronic device according to claim 1, wherein, The integrated circuit chip includes a first region in which a circuit for performing data input / output processing functions is formed, At least a part of the first region is placed on the second side with respect to the intermediate position of the surface in the second direction.

4. The electronic device according to claim 3, wherein, The first region is placed on the first side and the second side, and A part of the first region on the second side is larger in size than another part of the first region on the first side.

5. The electronic device according to claim 1, wherein, The integrated circuit chip includes a second region and a third region, the second region has M cores installed therein to perform a first arithmetic processing function for parallel arithmetic processing, the third region has N (N<M) cores installed therein to perform a second arithmetic processing function, and The third region is placed on the first side.

6. The electronic device according to claim 5, wherein, The intermediate position of the joint portion in the second direction is between the third region and the intermediate position of the surface in the second direction.

7. The electronic device according to claim 1, further comprising: A heat receiving member interposed between the surface and the joint portion, wherein, The heat receiving member has a first connecting portion in contact with the surface and thermally connected to the surface, and a second connecting portion in contact with the joint portion and thermally connected to the joint portion, The intermediate position of the first connecting portion in the second direction coincides with the intermediate position of the surface in the second direction, and The intermediate position of the second connecting portion in the second direction is offset toward the first side with respect to the intermediate position of the surface in the second direction.

8. The electronic device according to claim 7, wherein, The intermediate position of the second connecting portion in the second direction coincides with the intermediate position of the joint portion in the second direction.

9. A heat dissipation device for covering the surface of an integrated circuit chip facing a first direction, the heat dissipation device comprising: A plurality of heat pipes, wherein, The plurality of heat pipes are arranged along the surface in a second direction intersecting the first direction and include a joint portion formed by joining adjacent heat pipes together, The engaging portion is positioned relative to the surface in the first direction and is thermally connected to the surface, and A middle position of the engagement portion in the second direction is offset to a first side in the second direction relative to a middle position of the surface in the second direction.

10. An electronic device comprising: an integrated circuit chip having a surface facing a first direction; and A plurality of heat pipes, wherein The plurality of heat pipes are arranged along the surface in a second direction intersecting the first direction, and include a joining portion formed by joining heat pipes adjacent to each other together, The engaging portion is positioned relative to the surface in the first direction and is thermally connected to the surface, and The heat absorption efficiency of the joining portion on a first side relative to a middle position of the surface in the second direction is higher than the heat absorption efficiency of the joining portion on a second side relative to the middle position.

11. The electronic device according to claim 10, wherein: A cross-sectional structure of the heat pipe constituting the joint portion on a first side of a middle position relative to the surface in the second direction is different from a cross-sectional structure of the heat pipe constituting the joint portion on a second side relative to the middle position.

12. The electronic device according to claim 10, wherein: The heat dissipation efficiency of the heat sink connected to the heat pipe constituting the joint portion on the first side of the middle position relative to the surface in the second direction is higher than that of the heat sink connected to the heat pipe constituting the joint portion on the second side relative to the middle position.

13. A heat dissipation device for covering a surface of an integrated circuit chip facing a first direction, the heat dissipation device comprising: A plurality of heat pipes, wherein The plurality of heat pipes are arranged along the surface in a second direction intersecting the first direction, and include a joining portion formed by joining heat pipes adjacent to each other together, The engaging portion is positioned relative to the surface in the first direction and is thermally connected to the surface, and The heat absorption efficiency of the joining portion on a first side relative to a middle position of the surface in the second direction is higher than the heat absorption efficiency of the joining portion on a second side relative to the middle position.

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