Method, system and equipment for prolonging service life of filter element for SC-1 groove of cleaning machine

Through intelligent scanning diagnosis and three-stage oxidation tank treatment combined with eddy current cavitation flushing, the problem of short service life of the filter element for the SC-1 tank of the cleaning machine was solved, and the service life of the filter element was extended and the cost was reduced.

CN120661996AActive Publication Date: 2025-09-19SHANGHAI SEMICON WAFER TECH CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
CN202510816602.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-18
Publication Date
2025-09-19
Estimated Expiration
2045-06-18

AI Technical Summary

Technical Problem

The service life of the existing SC-1 tank filter element of the cleaning machine is short. Frequent replacement increases production costs and affects production efficiency, and the disposal of discarded filter elements brings environmental pressure.

Method used

The filter element is deeply cleaned to remove complex pollutants by adopting the methods of intelligent scanning diagnosis, digital twin-guided demolition, three-stage oxidation tank treatment and eddy cavitation collaborative flushing, combined with hydrogen peroxide immersion and pure water flushing.

Benefits of technology

It effectively doubles the service life of the filter element from 6 months to 12 months, reduces replacement frequency and production costs, and removes complex pollutants inside the filter element.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120661996A_ABST
    Figure CN120661996A_ABST
Patent Text Reader

Abstract

The embodiment of the invention relates to the technical field of cleaning of silicon wafer cleaning machines, and discloses a method, a system and equipment for prolonging the service life of a filter element for an SC-1 groove of a cleaning machine. Comprising the following steps: carrying out intelligent scanning diagnosis on a filter element in an SC-1 tank of a cleaning machine, generating scanning data, and carrying out digital twin guide filter element removal based on the scanning data; a three-stage oxidation pond is designed, the filter element is placed in the three-stage oxidation pond, three-stage gradient oxidation deep treatment is carried out, and composite pollutants existing in the filter element are removed; carrying out vortex cavitation synergistic flushing on the filter element with the composite pollutants removed, and carrying out physical-grade deep cleaning; after cleaning is completed, the washed filter element is installed back to the original position of the SC-1 groove of the cleaning machine through a clean tool. The technical problem that the service life of the filter element cannot be effectively prolonged in the prior art can be solved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the field of cleaning technology for silicon wafer cleaning machines, and in particular to a method, system, and equipment for extending the service life of a filter element for an SC-1 tank of a cleaning machine. Background Art

[0002] The SC-1 tank of a cleaning machine plays a vital role in the polishing pad cleaning process. Its internal filter element is responsible for filtering impurities from the cleaning fluid to ensure effective cleaning and proper operation of the equipment. However, existing filter elements used in the SC-1 tank of a cleaning machine have a short service life, typically only six months. Frequent filter element replacement not only increases production costs but can also cause equipment downtime, impacting production efficiency. Furthermore, the disposal of discarded filter elements poses a significant environmental burden.

[0003] Currently, there is an urgent need for a solution that is efficient and can extend the service life of the filter element for the lifting tank. Summary of the Invention

[0004] One purpose of the present application is to provide a method, system and equipment for extending the service life of the filter element for the SC-1 tank of the cleaning machine, at least to solve the technical problem that the existing technology cannot effectively extend the service life of the filter element for the SC-1 tank of the cleaning machine.

[0005] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0006] In a first aspect, some embodiments of the present application further provide a method for extending the service life of a filter element for an SC-1 tank of a cleaning machine, comprising the following steps:

[0007] Perform intelligent scanning and diagnosis of the filter element in the SC-1 tank of the cleaning machine, generate scan data, and use the digital twin to guide the removal of the filter element based on the scan data;

[0008] Designing a three-stage oxidation tank, placing the filter element in the three-stage oxidation tank and performing a three-stage gradient oxidation deep treatment to remove the composite pollutants present in the filter element;

[0009] The filter element that removes complex pollutants is flushed with eddy current cavitation to perform physical-level deep cleaning;

[0010] After cleaning is completed, use clean tools to install the rinsed filter element back to its original position in the SC-1 tank of the cleaning machine.

[0011] In a second aspect, some embodiments of the present application further provide a system for extending the service life of a filter element for a cleaning machine SC-1 tank, comprising: a filter element removal module, a composite contaminant removal module, a deep cleaning module, and a filter element installation module;

[0012] The filter element removal module is used to perform intelligent scanning and diagnosis of the filter element in the SC-1 tank of the cleaning machine, generate scanning data, and perform digital twin-guided filter element removal based on the scanning data;

[0013] The composite pollutant removal module is used to design a three-stage oxidation tank, and the filter element is placed in the three-stage oxidation tank and subjected to a three-stage gradient oxidation deep treatment to remove the composite pollutants present in the filter element;

[0014] The deep cleaning module is used to perform eddy current cavitation coordinated flushing on the filter element to remove complex pollutants, and perform physical-level deep cleaning;

[0015] The filter element installation module is used to install the rinsed filter element back to its original position in the SC-1 tank of the cleaning machine using clean tools after cleaning is completed.

[0016] In a third aspect, some embodiments of the present application further provide an electronic device comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0017] Compared with the related art, the solution provided in the embodiment of the present application is:

[0018] (1) The present invention uses a method of hydrogen peroxide soaking combined with pure water rinsing to deeply clean the filter element, effectively remove impurities on the filter element, and double the service life of the filter element from 6 months to 12 months, which greatly reduces the frequency of filter element replacement and reduces production costs;

[0019] (2) The present invention constructs a three-stage gradient oxidation system to perform deep cleaning on the filter element, specifically removes complex pollutants, and can effectively remove complex pollutants inside the filter element; at the same time, this embodiment combines the eddy current field with cavitation resonance to achieve precise control of the position, energy, and timing of cavitation bubbles, effectively removing deep pore pollution in the filter element. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0021] Figure 1 This is a flow chart of a method for extending the service life of a filter element for a cleaning machine SC-1 tank according to the first embodiment of the present application;

[0022] Figure 2 This is a schematic diagram of a system structure for extending the service life of a filter element for a cleaning machine SC-1 tank according to the second embodiment of the present application;

[0023] Figure 3 The present invention provides a schematic diagram of the structure of an electronic device. DETAILED DESCRIPTION

[0024] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0025] First embodiment

[0026] The first embodiment of the present application relates to a method for extending the service life of a filter element for a cleaning machine SC-1 tank. Figure 1 As shown, the method may include the following steps:

[0027] S101. Perform intelligent scanning and diagnosis on the filter element in the SC-1 tank of the cleaning machine, generate scanning data, and use digital twin guidance to remove the filter element based on the scanning data.

[0028] In this example, the SC-1 tank filter element is illuminated with a dual-band near-infrared and terahertz scanner before removal. Near-infrared light (1200-2500nm) identifies organic contaminants (such as photoresist residue), while terahertz waves (0.1-1THz) penetrate deeply to detect fifth-order particles (such as silicon powder). After scanning, a computer generates a contaminant distribution heat map based on the light absorption characteristics, accurately quantifying the location and composition of the blockage.

[0029] Specifically, in this embodiment, the scanner probe is first moved 10 cm away from the filter surface at a constant speed of 5 cm / s to scan and obtain scanning data. Subsequently, the pollutant model is generated by characteristic absorption spectrum analysis, specifically:

[0030]

[0031] Among them, Γ is the comprehensive pollution index, α org is the absorption weight of organic pollutants, I NIR is the near-infrared light intensity attenuation rate, α inorg is the absorption weight of inorganic pollutants, I THz is the terahertz wave penetration depth loss rate, γ is the blockage gradient sensitivity coefficient, is the curvature of the blocking layer.

[0032] In this embodiment, if Γ<0.3, it is marked as a clean area; if Γ>0.6, it is marked as a contaminated area; if Γ>0.8, it is marked as a heavily contaminated area. Finally, a heat map including the distribution of pollutants is generated, thereby accurately quantifying the blockage location and composition.

[0033] Based on the scanned data, the filter element's stress state is simulated in a virtual model. The system automatically plans a removal path, avoiding vulnerable areas (such as the seal) and controlling the robotic arm to extract the filter element at the optimal angle and force to prevent physical damage.

[0034] Specifically, the thermal map data is input into the simulation software, and the grid is automatically divided to obtain the fragile area of ​​the filter element, and the clamping force (i.e., the external removal force F ext ), and construct a multi-physics digital twin of the filter element to solve the optimal mechanical path for removal, specifically:

[0035]

[0036] Where Ω is the filter element geometry domain, σ vM is the von Mises stress, k is the plastic deformation penalty coefficient, is the plastic strain gradient, F ext is the external removal force (clamp holding force).

[0037] Based on the generated mechanical path, the robotic arm automatically performs dynamic variable stiffness demolition, specifically: in the clean area (i.e., Γ<0.3), rigid support (stiffness is 500N / mm) is used; in the contaminated area (i.e., Γ>0.6), flexible adsorption (stiffness is 50N / mm) is used.

[0038] After removal, a combined impedance-quality test is performed to determine the degree of filter element maintenance, specifically:

[0039]

[0040] Where Δm is the filter element mass increment, and Z″ / Z0″ is the normalized imaginary part of the reactance.

[0041] S102. Design a three-stage oxidation tank, place the filter element in the three-stage oxidation tank and perform a three-stage gradient oxidation deep treatment to remove the composite pollutants present in the filter element.

[0042] Traditional soaking is a "one-pot cooking" process. In this embodiment, a differentiated oxidation strategy is designed for the complex pollutants present in the filter element, and the treatment is graded according to the type of pollutants: the first level is to break down organic matter, the second level is to loosen inorganic scale, and the third level is to dissolve metal residues.

[0043] Specifically, this embodiment adopts an intelligent gradient oxidation system to construct a three-stage oxidation pool:

[0044] Primary catalytic oxidation tank: The filter element is immersed in a hydrogen peroxide solution containing iron ions (30% concentration). The iron ions catalyze the production of a large number of active oxygen free radicals, which quickly decompose organic matter such as oils and fats.

[0045] Secondary ultrasonic oxidation tank: Transfer to a low-concentration hydrogen peroxide tank (10%) and apply 40kHz ultrasonic waves. Ultrasonic waves generate microbubbles that burst in the filter pores, loosening stubborn particles.

[0046] Level 3 alkaline activation pool: soak in a weakly alkaline hydrogen peroxide pool (5%), the alkaline environment enhances the dissolution ability of metal oxides.

[0047] Specifically, in the primary pool, hydroxyl radicals are generated through the Fenton reaction, specifically: Fe 2+ +H2O2→Fe 3 ++·OH+OH - .

[0048] Among them, the degradation of pollutants follows the kinetic formula, specifically:

[0049]

[0050] Among them, C org is the organic matter concentration, k cat is the catalytic rate constant, C Fe+ is the concentration of ferrous ions, and [H2O2] is the concentration of hydrogen peroxide.

[0051] During the reaction process, the first-order reaction time t1 is:

[0052]

[0053] Among them, C org.0 is the initial organic matter concentration, C org.target is the target organic matter residual concentration.

[0054] In the secondary tank, since ultrasonic waves are applied, the energy of the ultrasonic waves needs to be controlled. In this embodiment, a cavitation energy formula is constructed, specifically:

[0055]

[0056] Among them, E cav is the cavitation energy density, η trans is the acoustic energy transfer efficiency, f is the actual frequency, f0 is the resonance reference frequency, α is the pore attenuation coefficient, d p is the penetration depth of pollutants, P ac is the sound power, specifically: P ac =3.5+0.02(dp-100), t2 is the ultrasonic action time, specifically:

[0057]

[0058] Where τ2 is the secondary cell time constant, C 0,2 is the pollutant concentration in the secondary pool, C min is the target residual concentration.

[0059] In the tertiary tank, the metal oxides are dissolved by a combined dissolution reaction in a weakly alkaline environment. The dissolution rate model constructed in this example is:

[0060]

[0061] Among them, R diss is the metal oxide dissolution rate, k OH is the base reaction constant, [OH - ] is the hydroxide concentration, E a is the activation energy, and T is the solution temperature.

[0062] The time t3 of the tertiary reaction is specifically:

[0063]

[0064] Among them, ρ m is the density of metal oxide, δ m is the thickness of the metal layer.

[0065] S103: Perform eddy current cavitation coordinated flushing on the filter element that removes complex pollutants to perform physical-level deep cleaning.

[0066] In this embodiment, after cleaning the filter element of complex contaminants, it then undergoes a cavitation bubble physical cleaning process: the filter element is placed in a pure water tank and a Helmholtz resonator is activated, causing the water flow to oscillate at a frequency of 25kHz. The high-speed shearing of the water generates millions of bubbles, which instantly collapse on the surface of the filter material, releasing a high-pressure shock wave that dislodges impurities embedded deep within the filter element.

[0067] In this embodiment, the flushing trough is designed as a 60° inclined conical structure, and the water flow rises in a spiral. This vortex shape ensures that the bubbles evenly cover the inner and outer surfaces of the filter element, eliminating any blind spots.

[0068] Specifically, in this embodiment, a dual-chamber Helmholtz resonator is used to generate controllable cavitation bubbles, and the resonant frequency is calculated as follows:

[0069]

[0070] Among them, f c is the cavitation resonance frequency, c is the speed of sound in water, A nis the resonant neck cross-sectional area, V c is the volume of the resonance cavity, L n is the resonance neck length. By adjusting V c This precisely locks the resonant frequency at 25kHz.

[0071] Subsequently, the cavitation bubble dynamics equation is obtained based on the resonance frequency calculation, specifically:

[0072]

[0073] Where R is the instantaneous radius of the cavitation bubble, p v is the water vapor pressure, p ∞ is the hydrostatic pressure, σ is the surface tension coefficient, P ac is the sound pressure amplitude, and μ is the dynamic viscosity.

[0074] Based on formula (11), the cavitation bubble expansion-collapse is driven, and the single bubble collapse energy is calculated, specifically:

[0075]

[0076] in, E collapse is the collapse energy, R max is the maximum radius of the cavitation bubble.

[0077] In the eddy current field, the cavitation bubble collapse energy E collapse Quantified into a space vector, and the eddy current field control equation is constructed, specifically:

[0078]

[0079] Among them, F cav is the cavitation force vector, N is the cavitation bubble density, x i is the position of the i-th bubble.

[0080]

[0081] Where u is the velocity vector, ν is the kinematic viscosity,

[0082] S104. After cleaning, use clean tools to install the rinsed filter element back into its original position in the SC-1 tank of the cleaning machine. During the installation process, ensure that the filter element is firmly installed and well sealed to prevent leakage of the cleaning solution. After this treatment, the service life of the filter element can be extended from the original 6 months to 12 months.

[0083] This embodiment constructs a three-stage gradient oxidation system to perform deep cleaning of the filter element, specifically removes complex pollutants, and can effectively remove complex pollutants inside the filter element; at the same time, this embodiment combines the eddy current field with cavitation resonance to achieve precise control of the position-energy-timing of cavitation bubbles, effectively achieving the removal of deep pore pollution in the filter element.

[0084] The steps of the various methods above are divided only for the purpose of clear description. During implementation, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent. Adding insignificant modifications or introducing insignificant designs to the algorithm or process without changing the core design of the algorithm and process are all within the scope of protection of this patent.

[0085] Second embodiment

[0086] The second embodiment of the present application relates to a system for extending the service life of a filter element for a cleaning machine SC-1 tank, such as Figure 2 As shown, it includes: a filter element removal module 1, a composite pollutant removal module 2, a deep cleaning module 3 and a filter element installation module 4;

[0087] The filter element removal module 1 is used to perform intelligent scanning and diagnosis on the filter element in the SC-1 tank of the cleaning machine, generate scanning data, and perform digital twin-guided filter element removal based on the scanning data;

[0088] The composite pollutant removal module 2 is used to design a three-stage oxidation tank, in which the filter element is placed and subjected to a three-stage gradient oxidation deep treatment to remove the composite pollutants present in the filter element;

[0089] The deep cleaning module 3 is used to perform eddy current cavitation coordinated flushing on the filter element to remove complex pollutants and perform physical-level deep cleaning;

[0090] The filter element installation module 4 is used to install the rinsed filter element back to its original position in the cleaning machine SC-1 tank using clean tools after cleaning is completed.

[0091] It is not difficult to find that this embodiment is a system embodiment corresponding to the first embodiment, and this embodiment can be implemented in conjunction with the first embodiment. The relevant technical details mentioned in the first embodiment are still valid in this embodiment, and to reduce repetition, they are not repeated here. Accordingly, the relevant technical details mentioned in this embodiment can also be applied to the first embodiment.

[0092] It is worth mentioning that all modules involved in this embodiment are logical modules. In actual applications, a logical unit can be a physical unit, a part of a physical unit, or a combination of multiple physical units. In addition, to highlight the innovation of this application, this embodiment does not include units that are not closely related to solving the technical problems proposed by this application. However, this does not mean that other units do not exist in this embodiment.

[0093] In addition, some embodiments of the present application further provide an electronic device. The electronic device may be various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, etc. The electronic device may also be various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices.

[0094] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, enable the processor to perform the steps of the method provided in any one or more of the above embodiments. Figure 3 An exemplary structural diagram of the electronic device is disclosed. Figure 3 As shown, the electronic device includes: one or more processors 1101, a memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Wherein, the components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or required herein.

[0095] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 3 The bus connection is taken as an example.

[0096] The input device 1103 can receive input digital or character information and generate key signal input related to user settings and function control of the electronic device, such as input devices such as a touch screen, a keypad, a mouse, a trackpad, a touch pad, an indicator stick, one or more mouse buttons, a trackball, and a joystick. The output device 1104 can include a display device, an auxiliary lighting device (e.g., an LED), and a tactile feedback device (e.g., a vibration motor). The display device can include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display, and a plasma display. In some embodiments, the display device can be a touch screen.

[0097] To provide interaction with a user, the electronic device may be a computer. The computer may include: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0098] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium. When executed by a processor, the computer program / instruction implements the steps of the method provided in any one or more of the above embodiments. The computer-readable medium may be included in the electronic device described in the above embodiments, or it may exist independently and not be incorporated into the device. The computer-readable medium carries one or more computer-readable instructions.

[0099] The memory 1102 can be used as a non-transitory computer-readable storage medium to store non-transitory software programs, non-transitory computer executable programs, and modules. The processor 1101 executes the non-transitory software programs, instructions, and modules stored in the memory 1102 to execute various functional applications and data processing of the server, thereby implementing the program instructions / modules corresponding to the method provided in any one or more of the above embodiments of the present application.

[0100] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and applications required for at least one function; the data storage area may store data created based on the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely located relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0101] It should be noted that the computer-readable medium described in this application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or component, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device or device.

[0102] Computer-readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology for information storage. The information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc-read only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0103] Computer program code for performing the operations of the present application can be written in one or more programming languages, or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on the remote computer or server. In cases involving a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., through the Internet using an Internet service provider).

[0104] In the above-described embodiment, can realize wholly or in part by software, hardware, firmware or its arbitrary combination.For example, can adopt application-specific integrated circuit (ASIC), general computer or any other similar hardware device to realize.In certain embodiments, the software program of the present application can be carried out to realize above steps or function by processor.Similarly, the software program of the present application (comprising relevant data structure) can be stored in computer-readable recording medium, for example, RAM memory, magnetic or optical drive or floppy disk and similar device.In addition, some steps or functions of the present application can adopt hardware to realize, for example, as the circuit that cooperates with processor to perform each step or function.

[0105] The computer program product provided by the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, all or part of the process or function described in the embodiment of the present application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instruction can be stored in a computer-readable storage medium, or transmitted from a computer-readable storage medium to another computer-readable storage medium. For example, the computer instruction can be transmitted from a website, a computer, a server or a data center by wired (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.) mode to another website, a computer, a server or a data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium can be a magnetic medium, (such as a floppy disk, a hard disk, a magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid-state drive solid state disk (SSD)).

[0106] The flowcharts or block diagrams in the accompanying drawings illustrate the possible architectures, functions and operations of the devices, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of code, and the module, program segment or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, as well as the combination of boxes in the block diagram and / or flowchart, can be implemented with a dedicated hardware-specific system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0107] The scope of this application is defined by the appended claims rather than the foregoing description and is therefore intended to encompass within this application all changes that come within the meaning and range of equivalents of the claims. Any reference signs in the claims should not be construed as limiting the claims to which they relate. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in a device claim may also be implemented by one unit or device through software or hardware. Words such as "first" and "second" are only used to distinguish the description and do not indicate any particular order, nor should they be understood as indicating or implying relative importance.

[0108] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art may easily propose variations or substitutions within the technical scope disclosed in the present application, and such variations or substitutions shall be encompassed within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims, and the above embodiments shall be regarded as exemplary and non-limiting.

Claims

1. A method for extending the service life of a filter element for a cleaning machine SC-1 tank, characterized in that: The following steps are involved: Perform intelligent scanning and diagnosis of the filter element in the SC-1 tank of the cleaning machine, generate scan data, and use the digital twin to guide the removal of the filter element based on the scan data; Designing a three-stage oxidation tank, placing the filter element in the three-stage oxidation tank and performing a three-stage gradient oxidation deep treatment to remove the composite pollutants present in the filter element; The filter element that removes complex pollutants is flushed with eddy current cavitation to perform physical-level deep cleaning; After cleaning is completed, use clean tools to install the rinsed filter element back to its original position in the SC-1 tank of the cleaning machine.

2. The method for extending the service life of the filter element for the SC-1 tank of the cleaning machine according to claim 1, characterized in that: The process of intelligently scanning and diagnosing the filter element in the SC-1 tank of the cleaning machine, generating scan data, and performing digital twin-guided filter element removal based on the scan data is as follows: Dual-band scanning and non-contact scanning of the filter element are used to obtain scanning data. The pollutant distribution model is generated through characteristic absorption spectrum analysis. The comprehensive pollution index of the filter element is calculated in real time and a three-dimensional pollution heat map is output. The three-dimensional pollution heat map includes clean areas and polluted areas. A multi-physics digital twin of the filter element is constructed based on the three-dimensional pollution heat map, and an optimal mechanical removal path is obtained by solving the optimal mechanical removal path. Based on the optimal mechanical removal path and the three-dimensional pollution heat map, a mechanical arm is operated to perform dynamic variable stiffness removal of the filter element. Perform impedance-quality combined testing on the removed filter element to determine the degree of maintenance required and obtain the filter element to be maintained.

3. The method for extending the service life of the filter element for the SC-1 tank of the cleaning machine according to claim 2, characterized in that: The pollutant distribution model is specifically: Among them, Γ is the comprehensive pollution index, α org is the absorption weight of organic pollutants, I NIR is the near-infrared light intensity attenuation rate, α inorg is the absorption weight of inorganic pollutants, I THz is the terahertz wave penetration depth loss rate, γ is the blockage gradient sensitivity coefficient, is the curvature of the blocking layer.

4. The method for extending the service life of the filter element for the SC-1 tank of the cleaning machine according to claim 2, characterized in that: The process of constructing a multi-physics digital twin of the filter element based on the three-dimensional pollution heat map, solving the optimal mechanical path for removal, and operating the mechanical arm to perform dynamic variable stiffness removal of the filter element based on the path and the three-dimensional pollution heat map is as follows: Inputting the three-dimensional pollution heat map data into the simulation software, and automatically dividing the grid to identify vulnerable areas; The clamping force stiffness of the robot arm clamp is set based on the polluted area in the three-dimensional pollution heat map, and the optimal demolition mechanical path is constructed based on the vulnerable area and the clamping force, wherein the clamping force stiffness includes: using rigid clamping stiffness in the clean area and using flexible adsorption stiffness in the polluted area; The robot arm is controlled to perform a dynamic variable stiffness removal operation based on the path and the clamping force stiffness.

5. The method for extending the service life of the filter element for the SC-1 tank of the cleaning machine according to claim 2, characterized in that: The three-stage oxidation pool is designed, and the filter element is placed in the three-stage oxidation pool and subjected to three-stage gradient oxidation deep treatment to remove the composite pollutants in the filter element. The process is as follows: Immerse the filter element in a first-stage pool of 30% hydrogen peroxide solution containing iron ions, and set the first-stage reaction time to quickly oxidize the organic matter in the filter element; The organic matter removal filter element is vertically suspended in a 10% hydrogen peroxide secondary pool and 40kHz ultrasonic waves are applied to generate microbubbles which burst simultaneously in the filter element pores, shaking off the stubborn particles in the filter element. The filter element after removing stubborn particles is transferred to a 5% weak alkaline hydrogen peroxide three-stage pool, and the three-stage reaction time is set to further dissolve the metal oxides in the filter element.

6. The method for extending the service life of the filter element for the SC-1 tank of the cleaning machine according to claim 5, characterized in that: The organic matter removal filter element is vertically suspended in a 10% hydrogen peroxide secondary pool and 40kHz ultrasonic waves are applied to generate microbubbles which then burst simultaneously in the filter element pores to loosen the stubborn particles in the filter element. Calculating the penetration depth of pollutants in the filter element based on the three-dimensional pollution heat map, and setting the ultrasonic sound power based on the depth; The cavitation energy model is obtained by calculating the ultrasonic sound power, and the cavitation energy density is calculated; The secondary reaction time is set based on the comprehensive pollution index, and the primary immersion time of ultrasonic energy is controlled in combination with the cavitation energy density.

7. The method for extending the service life of the filter element for the SC-1 tank of a cleaning machine according to claim 1, characterized in that: The process of performing eddy current cavitation coordinated flushing on the filter element to remove composite pollutants and perform physical-level deep cleaning is as follows: The filter element is placed in a pure water tank and the Helmholtz resonator is activated to make the water flow oscillate at a specific frequency to generate high-pressure bubbles. After the bubbles burst, high-pressure shock waves are released to shake out impurities deep in the filter element, completing physical-level deep cleaning.

8. The method for extending the service life of the filter element for the SC-1 tank of the cleaning machine according to claim 7, characterized in that: The filter element is placed in a pure water tank, and the Helmholtz resonator is activated to make the water flow oscillate at a specific frequency to generate high-pressure bubbles. After the bubbles burst, high-pressure shock waves are released to shake out the deep impurities in the filter element. The process of completing the physical-level deep cleaning is as follows: Adjusting the cavity volume and neck size of the Helmholtz resonator to calculate the resonant frequency, and generating micron-sized cavitation bubbles of uniform size based on the resonant frequency; Constructing a cavitation bubble dynamics equation based on the resonance frequency, controlling cavitation bubble expansion based on the dynamics equation, and calculating single bubble collapse energy; quantifying the collapse energy into a cavitation force vector and embedding it into a spiral flow field control equation as a source term, and driving the water flow to form a spiral rising vortex based on the control equation; The spiral rising vortex makes the cavitation bubbles evenly cover the outer surface of the filter element. After bursting, the high-pressure shock wave is released to shake out the impurities deep in the filter element, completing the physical level deep cleaning.

9. A system for extending the service life of a filter element for a cleaning machine SC-1 tank, implemented by the method for extending the service life of a filter element for a cleaning machine SC-1 tank according to any one of claims 1 to 8, characterized in that: include: Filter element removal module (1), composite pollutant removal module (2), deep cleaning module (3) and filter element installation module (4); The filter element removal module (1) is used to perform intelligent scanning diagnosis on the filter element in the SC-1 tank of the cleaning machine, generate scanning data, and perform digital twin-guided filter element removal based on the scanning data; The composite pollutant removal module (2) is used to design a three-stage oxidation pool, and the filter element is placed in the three-stage oxidation pool and subjected to a three-stage gradient oxidation deep treatment to remove the composite pollutants present in the filter element; The deep cleaning module (3) is used to perform eddy current cavitation coordinated flushing on the filter element to remove complex pollutants, thereby performing physical-level deep cleaning; The filter element installation module (4) is used to install the rinsed filter element back to its original position in the cleaning machine SC-1 tank using clean tools after cleaning is completed.

10. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method according to any one of claims 1 to 8.

Citation Information

Patent Citations

  • Silicon powder filter element cleaning and regenerating process for polycrystalline silicon production enterprise

    CN113893618A

  • Cleaning method of polished silicon carbide wafer and corresponding cleaning agent

    CN114678259A

  • Air purification equipment and control method thereof

    CN116857788A

  • Cleaning technique of material by valence conversion method based on oxidation and reduction colloid method

    JP2005052810A

  • Process for regenerating clogged filters

    US5240613A