Adhesive tape die cutting process
By laminating the release film and performing die-cutting and waste discharge operations before the tape die-cutting, the problem of die-cutting tool sticking and pulling glue is solved, and efficient and accurate tape die-cutting is achieved, which improves the precision and quality of the finished product.
Patent Information
- Application Number
- CN202510934086.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-08
- Publication Date
- 2025-09-19
AI Technical Summary
In the existing tape die-cutting process, the die-cutting tool is easily adhered to the glue, resulting in die-cutting tool passivation, affecting production efficiency, and when die-cutting the adhesive layer with high fluidity, it is easy to cause glue pulling and adhesive surface deformation, which cannot meet the precision requirements of the finished product.
A first release film is laminated on the adhesive surface of the tape, and the release film and tape are cut with a cutter die. After removing the waste, a second release film is covered. The release film is used to reduce the cutter's stickiness and the fluidity of the adhesive layer, thereby improving the stability of the tape and preventing deformation.
It reduces the occurrence of cutter gluing, improves production efficiency and die-cutting accuracy, and ensures high precision and high quality of the finished tape.
Smart Images
Figure CN120663384A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of adhesive tape die-cutting processing, in particular to an adhesive tape die-cutting process. Background Art
[0002] The tape cutting process is to cut the tape material, thereby die-cutting the tape material into rubber blocks or tapes of the shape or size required by the production design. Specifically, the tape material can be cut by flat knife die-cutting or roller knife die-cutting. The flat knife mold or roller knife mold can quickly cut and shape the tape material through the sharp blade. The tape die-cutting process is the most important process step in the tape processing. The die-cutting effect directly affects the quality of the finished tape.
[0003] However, in the existing tape die-cutting process, the adhesive layer is usually directly die-cut and shaped by a die-cutting tool. The die-cutting tool is prone to adherence to the adhesive, causing the die-cutting tool to become blunt. It is necessary to stop the machine multiple times in time to clean the die-cutting tool, affecting production efficiency. In particular, when die-cutting some adhesive layers with high fluidity, it is also easy to pull the adhesive, which can easily cause the adhesive surface of the finished adhesive layer to deform, and cannot meet the precision requirements of the finished tape, resulting in defective finished products. Therefore, it is necessary to provide a tape die-cutting process that reduces adhesive sticking and pulling, so as to improve die-cutting accuracy and die-cutting effect. Summary of the Invention
[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a tape die-cutting process.
[0005] The object of the present invention is achieved through the following technical solutions: A tape die-cutting process comprises the following steps: Providing an adhesive tape and a first release film, feeding the adhesive tape and the first release film to a first laminating roller, and laminating the adhesive tape and the first release film so that the first release film is laminated to the adhesive surface of the adhesive tape to obtain an adhesive tape with a release film; Performing a die-cutting operation on the adhesive tape with release film by a cutter, wherein the cutter sequentially cuts the first release film and the adhesive tape of the adhesive tape with release film, and then performing a waste discharge operation to discharge waste of the first release film outer frame, waste of the adhesive tape outer frame, and waste of the adhesive area of the first release film to obtain a molded adhesive tape; A second release film is provided, and the second release film and the molding tape are laminated by a second laminating roller so that the surface of the molding tape is covered with the second release film.
[0006] In one embodiment, in the waste discharge operation, the first release film outer frame waste is first rolled up and discharged through the first waste discharge roller to expose the tape outer frame waste, and then the original film is provided, and the original film and the tape outer frame waste are compounded by the third composite roller, and the original film and the tape outer frame waste are rolled up and discharged by the second waste discharge roller, and then a waste discharge tape is provided, and the waste discharge tape and the first release film adhesive area waste are compounded by the fourth composite roller, and the waste discharge tape and the first release film adhesive area waste are rolled up and discharged by the third waste discharge roller.
[0007] In one embodiment, a first buffer layer is provided on the surface of the third composite roller.
[0008] In one embodiment, a second buffer layer is provided on the surface of the fourth composite roller.
[0009] In one embodiment, the first buffer layer is a foam buffer layer.
[0010] In one embodiment, the second buffer layer is a foam buffer layer.
[0011] In one embodiment, the Vickers hardness of the first buffer layer is greater than the Vickers hardness of the second buffer layer.
[0012] In one embodiment, the Vickers hardness of the first buffer layer is 50N / mm 2 ~60N / mm 2 The Vickers hardness of the second buffer layer is 40N / mm 2 ~45N / mm 2 .
[0013] In one embodiment, the first release film is a polyethylene release film.
[0014] In one embodiment, the thickness of the first release film is 20um~30um.
[0015] Compared with the prior art, the present invention has at least the following advantages: The present invention provides a first release film before the die-cutting operation on the adhesive tape, and laminates the first release film to the adhesive surface of the adhesive tape, and then uses a cutter to die-cut and cut the first release film and the adhesive tape in sequence, and die-cuts the adhesive tape into the required shape and size, and then performs a waste discharge operation to remove the waste to prepare a molded adhesive tape, thereby avoiding the cutter from directly contacting the adhesive layer of the adhesive tape and reducing the sticking of the cutter. At the same time, the first release film can also play a certain restraining role on the adhesive layer of the adhesive tape by bonding with the adhesive surface of the adhesive tape, which is beneficial to reducing the fluidity of the adhesive layer. After the cutter completes the die-cutting, When the adhesive tape and the first release film are withdrawn in sequence, the adhesive layer has good stability and is not easy to be pulled out, and the first release films on both sides of the cut can also play a certain glue scraping role on the cutter, further reducing the adhesive sticking to the cutter, thereby reducing the number of shutdowns to clean the cutter, which is beneficial to improving production efficiency. At the same time, the glue pulling situation is greatly reduced, and the second release film is re-attached in time after the waste is discharged, which effectively prevents the adhesive layer of the molded tape from flowing. The adhesive layer of the tape has good stability and avoids deformation, thereby greatly improving the die-cutting accuracy and die-cutting effect of the tape. The finished molded tape after die-cutting has high precision and good quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.
[0017] Figure 1 This is a flowchart of the steps of the tape die-cutting process according to one embodiment of the present invention;. DETAILED DESCRIPTION
[0018] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0020] For an implementation method, please refer to Figure 1 , a tape die-cutting process, comprising the following steps: S110, providing an adhesive tape and a first release film, feeding the adhesive tape and the first release film to a first laminating roller, laminating the adhesive tape and the first release film so that the first release film is laminated to the adhesive surface of the adhesive tape to obtain an adhesive tape with a release film.
[0021] It should be noted that the adhesive tape and the first release film are provided. The adhesive tape and the first release film are usually roll materials. The external feeding device also feeds the base film and moves in the production and processing direction by pulling the base film. The external unwinding roller rolls the adhesive tape to be die-cut onto the base film, with the adhesive surface of the adhesive tape facing up, so as to facilitate subsequent composite bonding with the first release film. Under the traction of the base film, the adhesive tape to be die-cut can move in the production and processing direction, and then the first release film is fed to the first composite roller through the external unwinding roller. The first composite roller It is a structure of two rollers spaced apart from each other in an upper and lower manner. When the adhesive tape moves to the first composite roller, the roller pressure of the first composite roller causes the side of the first release film with a certain viscosity to be composited and adhered to the adhesive surface of the adhesive tape, thereby compositeing the first release film to the adhesive surface of the adhesive tape. The first release film is arranged upward, which is conducive to the subsequent cutter die-cutting the first release film and the adhesive tape from top to bottom. The first release film can be used as an isolation layer to prevent the cutter from directly contacting the adhesive surface of the tape, which is conducive to greatly reducing the sticking situation in the subsequent die-cutting operation.
[0022] S120, performing a die-cutting operation on the adhesive tape with release film by a cutter, wherein the cutter sequentially die-cuts and cuts off the first release film and the adhesive tape of the adhesive tape with release film, and then performing a waste discharge operation to discharge the first release film outer frame waste, the tape outer frame waste and the first release film adhesive area waste to obtain a molded adhesive tape.
[0023] It should be noted that, in this embodiment, the cutter can adopt a flat knife cutter mold or a roller cutter mold to die-cut the release film tape. Specifically, the flat knife cutter mold or the roller cutter mold is designed according to the shape and size required for the tape production design. The flat knife cutter mold performs die-cutting on the release film tape by punching up and down, and the roller cutter mold performs die-cutting on the release film tape by rolling punching. The roller cutter mold has the advantages of high die-cutting efficiency and high precision, and the roller cutter mold can be preferably used for The tape with release film is die-cut and formed, and the cutter cuts and cuts the first release film and the tape in sequence without cutting the base film, which can ensure that the die-cut tape and the first release film are continuously fed in the moving direction by pulling the base film, and the tape with release film is die-cut into a forming tape area and an outer frame waste area. Then, by performing a waste discharge operation, the first release film outer frame waste, the tape outer frame waste and the first release film adhesive area waste are discharged, leaving a forming tape in the forming tape area with a shape and size that meets the production design requirements.
[0024] Specifically, before the die-cutting operation on the tape, a first release film is provided and the first release film is compounded to the adhesive surface of the tape, and then the first release film and the tape are die-cut in sequence by a cutter, and the tape is die-cut into the required shape and size, and then a waste discharge operation is performed to remove the waste to prepare a molded tape, thereby avoiding the cutter from directly contacting the adhesive layer of the tape and reducing the sticking of the cutter. At the same time, the first release film can also play a certain restraining role on the adhesive layer of the tape by bonding with the adhesive surface of the tape, which is beneficial to reducing the fluidity of the adhesive layer. When the cutter withdraws from the tape and the first release film in sequence after completing the die-cutting, the adhesive layer has good stability and is not easy to pull out, thereby reducing the number of shutdowns to clean the cutter, which is beneficial to improving production efficiency. At the same time, the glue pulling situation is greatly reduced, thereby greatly improving the die-cutting accuracy and die-cutting effect of the tape. The finished molded tape after die-cutting has high precision and good quality.
[0025] S130, providing a second release film, and laminating the second release film and the molding tape using a second laminating roller, so that the surface of the molding tape is covered with the second release film.
[0026] It should be noted that, in this embodiment, the second release film is in the form of a roll, and the second release film is fed to the second composite roller by an external unwinding roller. The second composite roller is also a two roller structure spaced apart from each other. The second release film is rolled and composited onto the molding tape by the roller pressure of the second composite roller. Subsequently, the molding tape with the second release film can be peeled off from the base film by a receiving device and then received into a material box or rolled into a roll. The molding tape with the second release film can also be directly fed to the next processing station. In other words, it can be processed according to the According to specific production needs, the molding tape with the second release film will be collected or transferred to the next station for further processing. In this way, the second release film will be re-attached in time after being discharged. The second release film can play a dust-proof protection role for the adhesive layer and has a certain adhesive force. It can play a certain restraining role on the adhesive layer of the molding tape, effectively preventing the adhesive layer of the molding tape from flowing. The adhesive layer of the tape has good stability and avoids deformation, thereby greatly improving the die-cutting accuracy and die-cutting effect of the tape. The finished molding tape after die-cutting has high precision and good quality.
[0027] In one embodiment, in the waste discharge operation, the first release film outer frame waste is first rolled up and discharged through the first waste discharge roller to expose the tape outer frame waste, and then the original film is provided, and the original film and the tape outer frame waste are compounded by the third composite roller, and the original film and the tape outer frame waste are rolled up and discharged by the second waste discharge roller, and then a waste discharge tape is provided, and the waste discharge tape and the first release film adhesive area waste are compounded by the fourth composite roller, and the waste discharge tape and the first release film adhesive area waste are rolled up and discharged by the third waste discharge roller.
[0028] It can be understood that after the release film tape is die-cut and formed, the release film tape is die-cut into a forming tape area and an outer frame waste area. In this embodiment, the waste discharge operation is divided into three steps. First, the first release film outer frame waste is peeled off and then reeled out through the first waste roller. After the first release film outer frame waste is removed, the adhesive surface of the tape outer frame waste is exposed. At this time, the original film is provided and fed to the third composite roller. Specifically, the third composite roller is also a two-roller structure spaced apart from each other. The original film and the tape outer frame waste are rolled and composited by the roller pressure of the third composite roller, and the tape outer frame waste is rolled out through the adhesive surface The waste tape is then reeled in by the third row of waste rollers, so that the waste in the adhesive area of the first release film is reeled in and discharged together with the original film. The waste tape is then reeled in and discharged together with the original film. The waste tape is then reeled in and discharged together with the original film. The waste tape is reeled in and discharged together with the original film. The waste tape is reeled in and discharged together with the original film. The waste tape is reeled in and discharged together with the original film. The waste tape is reeled in and discharged together with the original film. The waste tape is reeled in and discharged together with the original film. The waste tape is reeled in and discharged together with the original film. The waste tape is reeled in and discharged together with the original film. The waste tape is reeled in and discharged together with the original film.
[0029] Specifically, in this embodiment, the first release film outer frame waste, the tape outer frame waste and the first release film glue area waste are discharged step by step. On the one hand, it can ensure the waste discharge effect of the first release film outer frame waste, the tape outer frame waste and the first release film glue area waste respectively, ensure that each waste is discharged completely, and ensure the quality of the molded tape. On the other hand, the first release film outer frame waste, the tape outer frame waste and the first release film glue area waste are discharged separately. The peeling force and winding force required to discharge each waste separately are relatively small, which can ensure that each waste is discharged smoothly. At the same time, the force on the molded tape during the waste discharge process is also small, avoiding affecting the shape and size of the molded tape. In particular, the first release film glue area waste is discharged after the tape outer frame waste is discharged. Discharge, in this way, the waste of the first release film adhesive area is covered on the top of the molding tape, which can retain the restraint force on the molding tape, reduce the fluidity of the molding tape part, and is conducive to better separation between the tape outer frame waste and the molding tape, and prevent the molding tape from being affected by the tape outer frame waste and causing glue pulling, thereby reducing defects. In other words, discharging the waste in steps can avoid the large peeling force and winding force of the first release film outer frame waste, the tape outer frame waste and the first release film adhesive area waste being lifted up and discharged at the same time, which affects the structural stability of the molding tape, and the fluidity of the molding tape is reduced during the waste discharge operation, and the structural stability is good, thereby greatly improving the tape die-cutting accuracy and effect, and further improving the accuracy and quality of the finished molding tape after die-cutting.
[0030] In one embodiment, the surface of the third composite roller is provided with a first buffer layer. It can be understood that by providing the first buffer layer on the surface of the third composite roller, that is, the surfaces of the two roller bodies spaced apart from each other on the upper and lower sides of the third composite roller are both provided with a first buffer layer, and the first buffer layer is made of a flexible material with a certain buffering effect. In this embodiment, the first buffer layer is a foam buffer layer. The foam has good flexibility and good buffering performance, which is beneficial to reducing the mechanical strength of the third composite roller and playing a certain buffering role on the roller pressure of the third composite roller. On the one hand, since the third composite roller performs a composite operation on the original film and the tape outer frame waste, at this time, the first release film outer frame waste has been discharged, and there is a certain height difference between the outer frame waste area and the molding tape area. The first buffer layer has a certain elasticity and can better fit the outer frame waste. The first buffer layer plays a certain buffering role, reducing the roller pressure of the third composite roller, which is beneficial to prevent the colloid of the molding tape part from being squeezed and deformed due to excessive pressure when the original film and the tape outer frame waste are rolled and composited, and is beneficial to avoid the glue layer of the molding tape overflowing to the tape outer frame waste, thereby avoiding the glue pulling when the tape outer frame waste is discharged later. While ensuring complete waste discharge, the molding effect of the molding tape is ensured, and the precision and quality of the finished molding tape after die-cutting are further improved.
[0031] In one embodiment, the surface of the fourth composite roller is provided with a second buffer layer. The second buffer layer is a foam buffer layer. It can be understood that, similarly, in this embodiment, the upper and lower roller bodies of the fourth composite roller are respectively provided with a second buffer layer, and the second buffer layer adopts a foam buffer layer. The foam buffer layer has flexibility and can produce a certain buffering effect, which is beneficial to reduce the mechanical strength of the fourth composite roller and has a certain buffering effect on the roller pressure of the fourth composite roller. The fourth composite roller is used to perform compounding operations on the waste tape and the first release film glue area waste. At this time, the first release film outer frame waste and the tape outer frame waste have been discharged, and only the first release film glue area waste and the molding glue are left. When the waste discharge tape is compounded onto the waste material in the adhesive area of the first release film, the second buffer layer is provided to reduce the roller pressure of the fourth compounding roller, which is beneficial to preventing the colloid in the molding tape part from being squeezed and deformed due to excessive pressure, so that the adhesive layer of the molding tape overflows to the outside of the waste material in the adhesive area of the first release film, thereby avoiding the adhesive layer of the molding tape and the waste discharge tape from adhering to each other, thereby avoiding the glue pulling when the waste discharge tape is subsequently wound up, ensuring the waste discharge effect while ensuring the molding effect of the molding tape, and further improving the precision and quality of the finished molding tape after die-cutting.
[0032] In one embodiment, the Vickers hardness of the first buffer layer is greater than the Vickers hardness of the second buffer layer. It is understood that in this embodiment, the Vickers hardness of the first buffer layer is greater than the Vickers hardness of the second buffer layer. In other words, the greater hardness of the first buffer layer ensures that the third composite roller has sufficient strength. Because there is a height difference between the outer frame waste area and the molding tape area during the composite operation of the third composite roller, and the tape outer frame waste has not yet been discharged, the adhesive layer structure of the molding tape is squeezed and is less likely to deform. The greater hardness of the first buffer layer of the third composite roller ensures sufficient roller pressure to complete the lamination of the original film and the tape outer frame waste, ensuring the normal and effective discharge operation. The lower Vickers hardness of the second buffer layer ensures the structural stability of the molding tape and the precision and quality of the finished product. Specifically, the Vickers hardness of the first buffer layer is 50N / mm2-60N / mm2, and the Vickers hardness of the second buffer layer is 40N / mm2-45N / mm2. For example, the first buffer layer has a Vickers hardness of 55 N / mm², while the second buffer layer has a Vickers hardness of 42 N / mm². The moderate Vickers hardness of the first and second buffer layers ensures a good roll-to-roll lamination effect while also improving the quality and precision of the finished tape.
[0033] In one embodiment, the first release film is a polyethylene release film. The thickness of the first release film is 20um~30um. It is understandable that the first release film is a thin polyethylene release film with a thickness of 20um~30um. Specifically, the thickness of the first release film can be 20um, 22um, 24um, 26um, 28um or 30um, which can ensure the lightness and thinness of the first release film. The polyethylene release film has the advantages of good flexibility and easy processing and molding. The thickness is set to 20um~30um, which has good wrapping performance. When the die-cutting operation is performed, the first release film after cutting can have a certain shrinkage and coating function at the cut point, and timely wrap the edge of the adhesive layer of the molding tape at the cut point to a certain extent, reducing the fluidity of the adhesive layer of the molding tape, and helping to avoid the glue pulling on the edge of the adhesive layer of the molding tape at the cut point when the cutter exits after die-cutting. The finished molding tape obtained by die-cutting has high precision and good quality.
[0034] In one embodiment, the second release film is thicker than the first release film. As will be appreciated, using a thicker second release film ensures sufficient mechanical strength. Since the second release film covers the molding tape, it provides protection for the molding tape. This ensures better support and protection for the molding tape, facilitating subsequent material transfer and collection operations, resulting in improved practicality.
[0035] Compared with the prior art, the present invention has at least the following advantages: The present invention provides a first release film before the die-cutting operation on the adhesive tape, and laminates the first release film to the adhesive surface of the adhesive tape, and then uses a cutter to die-cut and cut the first release film and the adhesive tape in sequence, and die-cuts the adhesive tape into the required shape and size, and then performs a waste discharge operation to remove the waste to prepare a molded adhesive tape, thereby avoiding the cutter from directly contacting the adhesive layer of the adhesive tape and reducing the sticking of the cutter. At the same time, the first release film can also play a certain restraining role on the adhesive layer of the adhesive tape by bonding with the adhesive surface of the adhesive tape, which is beneficial to reducing the fluidity of the adhesive layer. After the cutter completes the die-cutting, When the adhesive tape and the first release film are withdrawn in sequence, the adhesive layer has good stability and is not easy to be pulled out, and the first release films on both sides of the cut can also play a certain glue scraping role on the cutter, further reducing the adhesive sticking to the cutter, thereby reducing the number of shutdowns to clean the cutter, which is beneficial to improving production efficiency. At the same time, the glue pulling situation is greatly reduced, and the second release film is re-attached in time after the waste is discharged, which effectively prevents the adhesive layer of the molded tape from flowing. The adhesive layer of the tape has good stability and avoids deformation, thereby greatly improving the die-cutting accuracy and die-cutting effect of the tape. The finished molded tape after die-cutting has high precision and good quality.
[0036] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.
Claims
1. A tape die-cutting process, characterized in that: The following steps are involved: Providing an adhesive tape and a first release film, feeding the adhesive tape and the first release film to a first laminating roller, and laminating the adhesive tape and the first release film so that the first release film is laminated to the adhesive surface of the adhesive tape to obtain an adhesive tape with a release film; Performing a die-cutting operation on the adhesive tape with release film by a cutter, wherein the cutter sequentially cuts the first release film and the adhesive tape of the adhesive tape with release film, and then performing a waste discharge operation to discharge waste of the first release film outer frame, waste of the adhesive tape outer frame, and waste of the adhesive area of the first release film to obtain a molded adhesive tape; A second release film is provided, and the second release film and the molding tape are laminated by a second laminating roller so that the surface of the molding tape is covered with the second release film.
2. The adhesive tape die-cutting process according to claim 1, characterized in that: In the waste discharge operation, the first release film outer frame waste is first rolled up and discharged through the first waste discharge roller to expose the tape outer frame waste, and then the original film is provided, and the original film and the tape outer frame waste are compounded by the third composite roller, and the original film and the tape outer frame waste are rolled up and discharged by the second waste discharge roller, and then a waste discharge tape is provided, and the waste discharge tape and the first release film adhesive area waste are compounded by the fourth composite roller, and the waste discharge tape and the first release film adhesive area waste are rolled up and discharged by the third waste discharge roller.
3. The adhesive tape die-cutting process according to claim 2, characterized in that: A first buffer layer is provided on the surface of the third composite roller.
4. The adhesive tape die-cutting process according to claim 3, characterized in that: A second buffer layer is provided on the surface of the fourth composite roller.
5. The adhesive tape die-cutting process according to claim 4, characterized in that: The first buffer layer is a foam buffer layer.
6. The adhesive tape die-cutting process according to claim 4, characterized in that: The second buffer layer is a foam buffer layer.
7. The adhesive tape die-cutting process according to claim 4, characterized in that: The Vickers hardness of the first buffer layer is greater than the Vickers hardness of the second buffer layer.
8. The adhesive tape die-cutting process according to claim 7, characterized in that: The Vickers hardness of the first buffer layer is 50N / mm 2 ~60N / mm 2 The Vickers hardness of the second buffer layer is 40N / mm 2 ~45N / mm 2 .
9. The adhesive tape die-cutting process according to any one of claims 1 to 8, characterized in that: The first release film is a polyethylene release film.
10. The adhesive tape die-cutting process according to any one of claims 1 to 8, characterized in that: The thickness of the first release film is 20um~30um.