Automatic base material rubberizing and receiving device

Abstract

The invention belongs to the technical field of lithium battery pole pieces, and particularly relates to an automatic base material gluing and receiving device which comprises a wall plate. The two sets of adhesive preparing mechanisms are installed on the wall plate and arranged on the two sides of the base material respectively, each adhesive preparing mechanism comprises an adhesive supplying assembly and an adhesive conveying assembly, the adhesive supplying assemblies are used for containing adhesive tapes, and the adhesive conveying assemblies are used for conveying the adhesive tapes to the corresponding adhesive pasting mechanisms; the two sets of rubberizing mechanisms are installed on the wall plate and arranged on the two sides of the base material correspondingly, the first rubberizing mechanism is used for rubberizing the first faces of the first base material and the second base material, and the second rubberizing mechanism is used for rubberizing the second faces of the first base material and the second base material so that the first base material and the second base material can be connected and formed; the material cutting mechanism comprises a cutting knife, and the cutting knife is matched with the first rubberizing mechanism or the second rubberizing mechanism in a telescopic mode and used for cutting off the material tail of the first base material; the double-sided rubberizing and receiving device can be used for automatically rubberizing and receiving double surfaces of two base materials, so that the labor cost can be saved, and automatic production can be realized.

Description

Technical Field

[0001] The invention belongs to the technical field of lithium battery pole piece processing, and particularly relates to an automatic substrate gluing and splicing device. Background Art

[0002] With the rapid development of the lithium battery industry, ultrasonic welding of electrode substrates has become an inevitable trend in the production process of lithium batteries. After ultrasonic welding, the electrode substrates are usually rolled using a roller pressing device to ensure a smooth surface, improve conductivity and compaction density, and thus increase the energy density of the battery.

[0003] In actual application of the existing material splicing device, the inventors found that there are at least the following technical problems: the unwinding of the electrode substrate is carried out by two fixed unwinding rollers in succession and rotation. When one unwinding is completed, the electrode substrate on the other unwinding roller needs to be unwound continuously. The current manual reel changing method requires manual shutdown to cut the substrate and splice the film with tape, which is cumbersome to operate, takes up manpower, and has low effective utilization rate.

[0004] Based on this, it is necessary to improve the defects of the existing technology to overcome the shortcomings in practical applications. Summary of the Invention

[0005] Based on the above-mentioned shortcomings and deficiencies in the prior art, one of the purposes of the present invention is to at least solve one or more of the above-mentioned problems in the prior art. In other words, one of the purposes of the present invention is to provide an automatic substrate gluing and splicing device that meets one or more of the above-mentioned needs.

[0006] In order to achieve the above-mentioned object of the invention, the present invention adopts the following technical solutions:

[0007] The present invention provides a device for automatically gluing and splicing substrates, comprising:

[0008] wall panels;

[0009] Two sets of glue preparation mechanisms are installed on the wall panel and are respectively arranged on both sides of the substrate. Each of the glue preparation mechanisms includes a glue supply component and a glue delivery component. The glue supply component is used to place the adhesive tape, and the delivery component is used to deliver the adhesive tape to the corresponding glue application mechanism;

[0010] Two sets of gluing mechanisms are installed on the wall panel and are respectively provided on both sides of the substrate, wherein the first gluing mechanism is used to glue the first surface of the first substrate and the second substrate, and the second gluing mechanism is used to glue the second surface of the first substrate and the second substrate, so that the first substrate and the second substrate are joined and formed;

[0011] The material cutting mechanism comprises a cutting knife, which can be telescopically matched with the first gluing mechanism or the second gluing mechanism and is used to cut the tail of the first base material.

[0012] As a preferred solution, the glue supply assembly includes a base, a glue release roller, a traction roller and a transition roller. The traction roller, the glue release roller and the transition roller are installed on the base. The adhesive tape is pulled by the traction roller so that the adhesive tape is output from the glue release roller and transmitted to the glue delivery assembly through the traction roller and the transition roller.

[0013] As a preferred solution, the glue feeding assembly includes a driving assembly and a lifting assembly, and the driving assembly and the lifting assembly cooperate to transfer the adhesive tape from the feeding assembly to the glue applying mechanism.

[0014] As a preferred solution, the lifting assembly includes a base plate, a downward pressure cylinder, a knife holder, a serrated knife, a guide assembly and a tape suction cup. The downward pressure cylinder and the knife holder are installed on the base plate, the knife holder is connected to the serrated knife, and the knife holder is connected to the tape suction cup through the guide assembly; the tape suction cup and the serrated knife are driven up and down by the downward pressure cylinder to adsorb the tape, and the tape is cut by the serrated knife.

[0015] As a preferred solution, the guide assembly includes a guide rod and an elastic member, the guide rod is installed between the tape suction cup and the knife holder, and the elastic member is sleeved on the guide rod to provide rebound force to the tape suction cup through the elastic member.

[0016] As a preferred solution, the drive assembly includes a drive motor, a gear, a rack, a linear guide and a fixed seat. The drive motor is installed on the fixed seat. The output end of the drive motor is connected to the gear, the gear is connected to the rack for transmission, the rack is installed on the linear guide, and the linear guide reciprocates relative to the fixed seat.

[0017] As a preferred solution, each of the gluing mechanisms includes a rotating cylinder, a rotating shaft, an axle seat, a first suction cup and a second suction cup. The rotating cylinder is transmission-connected to the first suction cup, and the two ends of the rotating shaft are respectively connected to the axle seat. The axle seat is connected to the first suction cup and the second suction cup. The first suction cup is driven to rotate by the rotating cylinder to link the second suction cup to rotate synchronously.

[0018] As a preferred solution, the gluing mechanism also includes a driving module and an adapter plate, the adapter plate is installed on the driving module, and the rotating cylinder is installed on the adapter plate. The two driving modules are moved closer or farther away to make the two first suction cups move closer or farther away to glue the substrate.

[0019] As a preferred solution, the first suction cup and the second suction cup are arranged vertically, the first suction cup includes a first adsorption part and a second adsorption part, a gap is provided between the first adsorption part and the second adsorption part, and are used to adsorb the first substrate and the second substrate respectively, and the second suction cup is used to adsorb the tape.

[0020] As a preferred solution, the cutting mechanism includes a spring, a guide rod and a support seat, the guide rod is installed on the support seat, one end of the guide rod is connected to the first suction cup, and the other end is configured as a free end, and the spring is sleeved on the guide rod to provide elastic force to the first suction cup so that the gap of the first suction cup can be telescopically matched with the cutting knife.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention provides an automatic gluing and splicing device for substrates, which can automatically gluing both sides of two substrates and automatically splicing the two substrates without manual gluing and splicing, thereby saving labor costs, realizing automated production, and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, without paying any creative work, they can also obtain drawings of other embodiments based on these drawings.

[0024] Figure 1 This is a top view of an automatic substrate gluing and splicing device according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the overall structure of an automatic substrate gluing and splicing device according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram from another perspective of an automatic substrate gluing and splicing device according to an embodiment of the present invention;

[0027] Figure 4 2 is a schematic structural diagram of a glue feeding assembly according to an embodiment of the present invention;

[0028] Figure 5 2 is a structural diagram of a glue application mechanism according to an embodiment of the present invention;

[0029] Figure 6 is a schematic diagram of the adhesive application mechanism according to an embodiment of the present invention from another perspective;

[0030] Figure 7 is a cross-sectional view of a gluing mechanism according to an embodiment of the present invention;

[0031] In the figure: 1 wall panel, 2 glue supply assembly, 21 base, 22 glue release roller, 23 traction roller, 24 transition roller, 3 glue feeding assembly, 311 drive motor, 312 gear, 313 rack, 314 linear guide, 315 fixed seat, 321 base plate, 322 pressing cylinder, 323 knife holder, 324 serrated knife, 331 guide rod, 332 elastic member, 34 tape suction cup, 35 tape, 4 glue application mechanism, 41 drive module, 42 adapter plate, 43 rotary cylinder, 44 rotary shaft, 45 shaft seat, 46 first suction cup, 47 second suction cup, 5 cutting mechanism, 51 cutting knife, 52 spring, 53 guide rod, 54 support seat, 61 first substrate, 62 second substrate. DETAILED DESCRIPTION

[0032] To more clearly illustrate the embodiments of the present application, the specific implementation methods of the present application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without inventive work.

[0033] In the description of the embodiments of this application, the terms "upper," "lower," "front," and "rear," etc., regarding orientations or positions, are based on the orientations or positions shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used solely for descriptive purposes and have no special meaning.

[0034] According to some embodiments of this application, please refer to Figures 1 to 7 As shown, an automatic gluing and splicing device for substrates is provided, comprising a wall panel 1, two sets of glue preparation mechanisms, two sets of gluing mechanisms 4 and a cutting mechanism 5. The two sets of glue preparation mechanisms are installed on the wall panel 1 and are respectively arranged on both sides of the substrate. Each glue preparation mechanism includes a glue supply component 2 and a glue feeding component 3. The glue supply component 2 is used to place the tape, and the feeding component 3 is used to transport the tape to the corresponding gluing mechanism 4; the two sets of gluing mechanisms 4 are installed on the wall panel 1 and are respectively arranged on both sides of the substrate, wherein the first gluing mechanism is used to glue the first side of the first substrate 61 and the second substrate 62, and the second gluing mechanism is used to glue the second side of the first substrate 61 and the second substrate 62, so that the first substrate 61 and the second substrate 62 are spliced ​​and formed; the cutting mechanism 5 includes a cutting knife 51, which can be telescopically matched with the first gluing mechanism or the second gluing mechanism, and is used to cut the tail of the first substrate 61.

[0035] In some embodiments of the present application, the two groups of glue preparation mechanisms have the same structure and are respectively installed on the left and right sides of the wall panel 1. Each glue preparation mechanism includes a glue supply component 2 and a glue delivery component 3. The following description is based on one group of preparation mechanisms, and the other group of preparation mechanisms can be used as a reference without repetition.

[0036] In some embodiments of the present application, the glue supply component 2 includes a base 21, a glue release roller 22, a traction roller 23 and a transition roller 24. The base 21 is fixed on the rear side wall of the wall panel 1. The traction roller 23, the glue release roller 22 and the transition roller 24 are installed on the base 21. The adhesive tape 35 is pulled by the traction roller 24 so that the adhesive tape 35 is output from the glue release roller 22 and transmitted to the glue delivery component 3 through the traction roller 23 and the transition roller 24.

[0037] Specifically, the traction roller 23 is connected to the traction motor 25, and the traction motor 25 is installed on the base 21. The tape 35 is output by the glue release roller 22, so that the material head of the tape 35 passes through the transition roller 24 and the traction roller 23 in sequence, and the traction roller 23 is driven by the traction motor 25 to rotate, so that the tape 35 is output to the glue feeding component 3.

[0038] According to some embodiments of the present application, the glue feeding assembly 3 includes a driving assembly and a lifting assembly, and the driving assembly and the lifting assembly cooperate to transfer the tape from the feeding assembly to the glue applying mechanism.

[0039] In some specific embodiments, the driving assembly includes a driving motor 311, a gear 312, a rack 313, a linear guide 314 and a fixed base 315. The driving motor 311 is installed on the fixed base 315. The output end of the driving motor 311 is connected to the gear 312. The gear 312 is connected to the rack 313 for transmission. The rack 313 is installed on the linear guide 314. The linear guide 314 reciprocates relative to the fixed base 315.

[0040] Specifically, the drive motor 311 and the fixing seat 315 are fixedly connected to the base 21 , and the drive motor 311 drives the gear 312 to rotate, so that the gear 312 engages with the rack 313 to link the linear guide rail 314 to reciprocate linearly in the front-rear direction.

[0041] In some specific embodiments, the lifting assembly includes a base plate 321, a downward pressure cylinder 322, a knife holder 323, a serrated knife 324, a guide assembly and a tape suction cup 34. The downward pressure cylinder 322 and the knife holder 323 are installed on the base plate 321, the knife holder 323 is connected to the serrated knife 324, and the knife holder 323 is connected to the tape suction cup 34 through the guide assembly; the downward pressure cylinder 322 drives the tape suction cup 34 and the serrated knife 324 to move up and down to adsorb the tape 35, and the serrated knife 324 cuts the tape 35.

[0042] Furthermore, the base plate 321 is connected to the rack 312 , and the rack 312 can be used to link the base plate 321 to move in the front-rear direction.

[0043] Furthermore, the guide assembly includes a guide rod 331 and an elastic member 332 . The guide rod 331 is installed between the tape suction cup 34 and the knife holder 323 . The elastic member 332 is sleeved on the guide rod 331 to provide a rebound force to the tape suction cup 34 through the elastic member 332 .

[0044] When the pressing cylinder 322 moves from the initial position to the first station to drive the tape suction cup 34 to press down on the second suction cup 47, the tape suction cup 34 starts vacuuming and sucks up the material head of the tape 35, and is reset to the initial position from the first station by the pressing cylinder 322; then, after the driving component links the lifting component to move a distance in the front and rear direction of the second suction cup 47, the pressing cylinder 322 is pressed down to the second station to drive the tape suction cup 34 to press down on the second suction cup 47, the tape suction cup 34 stops vacuuming and the second suction cup 47 starts vacuuming. At this time, the tape 35 is transferred from the tape suction cup 34 to the second suction cup 47 ; Then the pressing cylinder 322 rises from the second station and is reset to the initial position along the front and rear direction of the second suction cup 47 through the driving component linkage lifting component; finally, the pressing cylinder 322 drives the tape suction cup 34 from the initial position to the first station through the first stroke, so that the tape suction cup 34 is tightly attached to the second suction cup 47, and the pressing cylinder 322 continues to press down through the second stroke. At this time, the tape suction cup 34 compresses the elastic part 332, and at the same time, the knife seat 323 links the serrated knife 324 to protrude from the lower surface of the tape suction cup 34, and cuts the tail of the tape 35, thereby realizing the conveying of the tape 35 to the second suction cup 47.

[0045] In some specific embodiments, each glue-applying mechanism 4 includes a driving module 41, an adapter plate 42, a rotating cylinder 43, a rotating shaft 44, an axle seat 45, a first suction cup 46 and a second suction cup 47. The rotating cylinder 43 is transmission-connected to the first suction cup 46, and the two ends of the rotating shaft 44 are respectively connected to the axle seat 45. The axle seat 45 is connected to the first suction cup 46 and the second suction cup 47. The first suction cup 46 is driven to rotate by the rotating cylinder 43 to link the second suction cup 47 to rotate synchronously.

[0046] Specifically, the driving module 41 is fixedly connected to the front side wall of the wall panel, the adapter plate 43 is connected to the driving module 41, the rotating cylinder 43 is installed on the adapter plate 42, and the output end of the rotating cylinder 43 is connected to the first suction cup 46. The first suction cup 46 and the second suction cup 47 are fixedly connected and arranged vertically. The two ends of the first suction cup 46 are respectively connected to the shaft seat 45. The rotating shaft 44 is installed between the two shaft seats 45. The shaft seat 45 is fixedly connected to the second suction cup 47. The first suction cup 46 is driven to rotate by the rotating cylinder 43, and the second suction cup 47 is linked to rotate synchronously so that the tape on the second suction cup 47 is glued to the substrate.

[0047] Since the two gluing mechanisms are distributed on the left and right sides of the substrate, the gluing mechanism on the right is called the first gluing mechanism, and the gluing mechanism on the left is called the second gluing mechanism. The two driving modules 41 can drive the corresponding adapter plates 43 to move in the left and right directions, so that the two first suction cups 46 move closer or farther away, and then glue the first and second surfaces of the first substrate 61 and the second substrate 62 respectively.

[0048] Furthermore, the first suction cup 46 includes a first suction portion 461 and a second suction portion 462 . A gap is provided between the first suction portion 461 and the second suction portion 462 , and are respectively used to suction the first substrate 61 and the second substrate 62 . The second suction cup 47 is used to suction the tape 35 .

[0049] In a specific embodiment, the first gluing mechanism and the second gluing mechanism have the same structure, and the first adsorption portion 461 and the second adsorption portion 462 respectively control vacuum adsorption separately. When the first adsorption portion 461 in the second gluing mechanism is used to adsorb the tail of the first substrate 61, the second adsorption portion 462 is used to adsorb the head of the second substrate 62. The second suction cup 47 in the first gluing mechanism is used to glue the first surfaces of the first substrate 61 and the second substrate 62 so that the tail of the first substrate 61 and the head of the second substrate 62 are connected.

[0050] Furthermore, the driving module 41 in the first gluing mechanism drives it away from the second gluing mechanism, and the rotating cylinder 43 in the first gluing mechanism drives the first suction cup 46 to rotate 90°. At this time, the second suction cup 47 is facing upward, and the first suction cup 46 is arranged facing the substrate. The driving module 41 drives the first gluing mechanism close to the second gluing mechanism, so that the first adsorption part 461 in the first gluing mechanism is used to adsorb the tail of the first substrate 61, and the second adsorption part 462 is used to adsorb the head of the second substrate 62. At the same time, the first adsorption part 461 and the second adsorption part 462 in the first gluing mechanism stop vacuuming, and then the substrate is transferred to the first gluing mechanism.

[0051] Furthermore, the rotating cylinder 43 in the second gluing mechanism drives the first suction cup 46 to rotate 90°. At this time, the first suction cup 46 faces upward, and the second suction cup 47 is arranged facing the substrate. The second gluing mechanism is driven close to the first gluing mechanism through the driving module 41, so that the tape on the second suction cup 47 in the second gluing mechanism is glued to the second surface of the first substrate 61 and the second substrate 62, so that the tail of the first substrate 61 and the head of the second substrate 62 are connected and formed.

[0052] In some embodiments of the present application, one of the gluing mechanisms is telescopically coordinated with the material cutting mechanism 5. Specifically, the first gluing mechanism is telescopically coordinated with the material cutting mechanism 5. The material cutting mechanism 5 includes a spring 52, a guide rod 53 and a support seat 54. The guide rod 53 is installed on the support seat 54. One end of the guide rod 53 is connected to the first suction cup 46, and the other end is configured as a free end. The spring 52 is sleeved on the guide rod 53 to provide elastic force to the first suction cup 46 so that the gap of the first suction cup 46 can be telescopically coordinated with the cutting knife 51.

[0053] Specifically, when the first suction cup on the first gluing mechanism contacts the substrate on the second gluing mechanism, the first suction cup compresses the spring and causes the cutting blade 51 to move along the gap on the second gluing mechanism to cut off the tail of the first substrate.

[0054] According to the present application, a device for automatically gluing and splicing substrates is provided, which can automatically gluing both sides of two substrates and automatically splicing the two substrates without the need for manual gluing and splicing, which is conducive to saving labor costs, realizing automated production, and improving work efficiency.

[0055] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0056] The above description is only a detailed description of the preferred embodiments and principles of the present application. For ordinary technicians in this field, there may be changes in the specific implementation methods based on the ideas provided by the present invention, and these changes should also be regarded as the scope of protection of this application.

Claims

1. A device for automatically gluing and splicing substrates, characterized in that: include: wall panels; Two sets of glue preparation mechanisms are installed on the wall panel and are respectively arranged on both sides of the substrate. Each of the glue preparation mechanisms includes a glue supply component and a glue delivery component. The glue supply component is used to place the adhesive tape, and the delivery component is used to deliver the adhesive tape to the corresponding glue application mechanism; Two sets of gluing mechanisms are installed on the wall panel and are respectively provided on both sides of the substrate, wherein the first gluing mechanism is used to glue the first surface of the first substrate and the second substrate, and the second gluing mechanism is used to glue the second surface of the first substrate and the second substrate, so that the first substrate and the second substrate are joined and formed; The cutting mechanism comprises a cutting knife, which can be telescopically matched with the first gluing mechanism or the second gluing mechanism and is used to cut the tail of the first base material.

2. The automatic adhesive bonding and splicing device for substrates according to claim 1, characterized in that: The glue supply assembly includes a base, a glue release roller, a traction roller and a transition roller. The traction roller, the glue release roller and the transition roller are installed on the base. The adhesive tape is pulled by the traction roller so that the adhesive tape is output from the glue release roller and transmitted to the glue feeding assembly through the traction roller and the transition roller.

3. The automatic adhesive bonding and splicing device for substrates according to claim 1, characterized in that: The glue feeding assembly includes a driving assembly and a lifting assembly. The driving assembly and the lifting assembly cooperate with each other to transfer the adhesive tape from the feeding assembly to the glue applying mechanism.

4. The automatic adhesive bonding and splicing device for substrates according to claim 3, characterized in that: The lifting assembly includes a base plate, a downward pressure cylinder, a knife holder, a serrated knife, a guide assembly and a tape suction cup. The downward pressure cylinder and the knife holder are installed on the base plate, the knife holder is connected to the serrated knife, and the knife holder is connected to the tape suction cup through the guide assembly; the tape suction cup and the serrated knife are driven up and down by the downward pressure cylinder to adsorb the tape, and the tape is cut by the serrated knife.

5. The automatic adhesive bonding and splicing device for substrates according to claim 4, characterized in that: The guide assembly includes a guide rod and an elastic member. The guide rod is installed between the tape suction cup and the knife seat. The elastic member is sleeved on the guide rod to provide a rebound force to the tape suction cup through the elastic member.

6. The automatic adhesive bonding and splicing device for substrates according to claim 3, characterized in that: The driving assembly includes a driving motor, a gear, a rack, a linear guide and a fixed seat. The driving motor is installed on the fixed seat. The output end of the driving motor is connected to the gear. The gear is transmission-connected to the rack. The rack is installed on the linear guide. The linear guide reciprocates relative to the fixed seat.

7. The automatic adhesive bonding and splicing device for substrates according to claim 1, characterized in that: Each of the gluing mechanisms includes a rotating cylinder, a rotating shaft, an axle seat, a first suction cup and a second suction cup. The rotating cylinder is connected to the first suction cup in a transmission manner. The two ends of the rotating shaft are respectively connected to the axle seat. The axle seat is connected to the first suction cup and the second suction cup. The first suction cup is driven to rotate by the rotating cylinder to link the second suction cup to rotate synchronously.

8. The automatic adhesive bonding and splicing device for substrates according to claim 7, characterized in that: The gluing mechanism also includes a driving module and an adapter plate, the adapter plate is installed on the driving module, and the rotating cylinder is installed on the adapter plate. The two driving modules move closer or farther away to make the two first suction cups move closer or farther away so as to glue the substrate.

9. The automatic adhesive bonding and splicing device for substrates according to claim 7, characterized in that: The first suction cup and the second suction cup are arranged vertically. The first suction cup includes a first adsorption part and a second adsorption part. A gap is provided between the first adsorption part and the second adsorption part, and the first adsorption part and the second adsorption part are used to adsorb the first substrate and the second substrate respectively. The second suction cup is used to adsorb the tape.

10. The automatic adhesive bonding and splicing device for substrates according to claim 7, characterized in that: The cutting mechanism includes a spring, a guide rod and a support seat. The guide rod is installed on the support seat. One end of the guide rod is connected to the first suction cup, and the other end is configured as a free end. The spring is sleeved on the guide rod to provide elastic force to the first suction cup so that the gap of the first suction cup can be extended and contracted to fit the cutting knife.

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