Automatic test device and test method for semiconductor module

Abstract

The invention provides an automatic testing device and method for a semiconductor module, and the device comprises a pedestal which is provided with a detection region; the supporting plate is arranged on the base in a sliding manner; the contact structure assembly is arranged on the supporting plate and used for being in butt joint with a detection contact of the semiconductor module; the electrifying contact mechanism is arranged on the supporting plate and used for being in butt joint with an electrode contact of the semiconductor module; the gluing pushing mechanism is arranged on the base in a sliding mode and connected with the supporting plate, the gluing pushing mechanism is provided with a vertically-through detection window, the contact structure assembly and the electrifying contact mechanism are both located in the detection window, and the detection window is used for containing a semiconductor module; and the heat dissipation mechanism comprises a liquid cooling plate, and the liquid cooling plate is located above the gluing pushing mechanism and is movably arranged in the vertical direction. The problems that in the prior art, due to the fact that multiple pressing mechanisms are used for respective control, the structure is complex, and operation is tedious are solved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor module detection, and more specifically, to an automated testing device and testing method for a semiconductor module. Background Art

[0002] Existing module test fixtures primarily utilize manual testing. Typically, a liquid cooling plate is placed at the bottom, thermally conductive adhesive is applied to the surface of the semiconductor module, and the module is secured to the plate. A pressing mechanism then presses down the contact assembly and energized contact mechanism to engage corresponding contacts on the semiconductor module. Because the contact assembly and energized contact mechanism operate in separate circuits and locations, they require separate control mechanisms via multiple pressing mechanisms, resulting in a complex structure and cumbersome operation.

[0003] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0004] The purpose of the present application is to provide an automated testing device and method for a semiconductor module, which solves the problem in the prior art of using multiple pressing mechanisms for separate control, resulting in a complex structure and cumbersome operation.

[0005] To achieve the above objectives, the technical solution adopted in this application is:

[0006] In one aspect, the present application provides an automated testing device for a semiconductor module, comprising: a base having a detection area;

[0007] A support plate, the support plate being slidably arranged on the base;

[0008] A contact structure assembly is provided on the support plate and is used for docking with the detection contacts of the semiconductor module;

[0009] An energized contact mechanism is provided on the support plate and is used to connect to the electrode contacts of the semiconductor module;

[0010] The glue-applying pushing mechanism is slidably arranged on the base and connected to the support plate. The glue-applying pushing mechanism has a detection window running through it from top to bottom. The contact structure assembly and the energized contact mechanism are both located in the detection window. The detection window is used to accommodate the semiconductor module;

[0011] And a heat dissipation mechanism, the heat dissipation mechanism includes a liquid cooling plate, the liquid cooling plate is located above the glue spreading and pushing mechanism and is movably arranged in the up and down directions.

[0012] On the other hand, the present application also provides a method for testing a semiconductor module, which is applied to the automated testing device for the semiconductor module described above. The method comprises:

[0013] Synchronously pushing the glue-applying pushing mechanism and the support plate to push the glue-applying pushing mechanism away from the detection area;

[0014] Mounting the semiconductor module on the glue-applying and pushing mechanism outside the detection area so that the detection contacts of the semiconductor module are located directly above the contact structure assembly and the electrode contacts of the semiconductor module are located directly above the energized contact mechanism;

[0015] Applying a thermal conductive adhesive layer on the upper surface of the semiconductor module;

[0016] Synchronously push the glue-applying mechanism and the support plate into the inspection area;

[0017] The semiconductor module is pressed downward by the liquid cooling plate to move the semiconductor module downward, and the detection contacts of the semiconductor module are docked with the contact structure assembly, and the electrode contacts of the semiconductor module are docked with the power contact mechanism.

[0018] The beneficial effect of the automated testing device for semiconductor modules provided in the present application is at least that: during the entire process, it is only necessary to press down the liquid cooling plate to press down all the semiconductor modules and dock them with the contact structure assembly and the energized contact mechanism synchronously. This simplifies the structure and can realize automatic downward pressure on the semiconductor modules, making the detection operation process simpler and improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art.

[0020] Figure 1 A schematic diagram of the structure of an automated testing device provided in an embodiment of the present application;

[0021] Figure 2 An exploded diagram of the automated testing device provided in an embodiment of the present application;

[0022] Figure 3 A schematic diagram of the structure of the contact structure assembly of the automated testing device provided in an embodiment of the present application when in use;

[0023] Figure 4 A schematic structural diagram of a contact connector of a contact structure assembly of an automated testing device provided in an embodiment of the present application;

[0024] Figure 5 An exploded cross-sectional view of a contact connector of a contact structure assembly of an automated testing device provided by an embodiment of the present application;

[0025] Figure 6 A schematic diagram of the structure of the energized contact mechanism of the automated testing device provided in an embodiment of the present application when in use;

[0026] Figure 7 A schematic structural diagram of a power-on contact mechanism of an automated testing device provided in an embodiment of the present application;

[0027] Figure 8 A cross-sectional view of a powered contact mechanism of an automated testing device provided in an embodiment of the present application;

[0028] Figure 9 A cross-sectional view of another structure of the energized contact mechanism of the automated testing device provided in an embodiment of the present application;

[0029] Figure 10 A schematic diagram of the structure of the glue-dispensing and pushing mechanism of the automated testing device provided in an embodiment of the present application when in use;

[0030] Figure 11 A schematic diagram of a partial structure of a glue-spreading and pushing mechanism of an automated testing device provided in an embodiment of the present application;

[0031] Figure 12 An exploded diagram of the glue-dispensing and pushing mechanism of the automated testing device provided in an embodiment of the present application;

[0032] Figure 13 An exploded diagram of the heat dissipation mechanism of the automated testing device provided in an embodiment of the present application;

[0033] Figure 14 A partial cross-sectional view of the heat dissipation mechanism of the automated testing device provided in an embodiment of the present application.

[0034] Among them, the reference numerals in the figures are:

[0035] 10. Semiconductor module; 100. Base; 1100. Support plate; 1110. Threaded hole; 1120. Guide rail; 1130. Lifting bar; 1140. Supporting horizontal plate; 1200. Bottom plate; 1300. Lateral support platform; 1400. Detection area; 1500. Locking column; 200. Contact structure assembly; 2210. Contact connector; 2220. Support member; 2221. Adjusting waist-shaped hole; 2222. Contact bottom plate; 2223. Vertical plate; 2224. Carrying plate; 2225. Threading hole; 2226. Mounting hole; 2230. Detection contact docking member; 2240. Plug-in platform; 2241. Plug-in column; 2242. Protruding platform; 2243. Mounting step; 2244, anti-slip member; 2250, conductive connector; 2251, docking groove; 2252, air avoidance groove; 2253, chamfer; 300, energized contact mechanism; 3100, connection and mounting portion; 3110, contact support plate; 3120, waist-shaped hole; 3130, sliding groove; 3200, column portion; 3210, mounting groove; 3220, guide through hole; 3221, first opening; 3222, second opening; 3230, column; 3240, bottom cover; 3300, contact portion; 3310, contact guide plate; 3311, guide plate head; 3312, guide plate tail; 3320, contact boss; 3330, connector; 3331, threaded hole; 3332, conductive plate; 3340, limit groove; 3341, insulating spacer; 3400, contact elastic member; 400, glue-applying and pushing mechanism; 4200, push-pull frame; 4210, push-pull frame; 4211, detection window; 4220, push-pull handle; 4230, push-pull guide rail; 4240, push-pull slide; 4250, limit fixed block; 4260, limit movable block; 4300, load-bearing frame; 4310, load-bearing frame; 4311, accommodating window; 4312, adjustment threaded hole; 4320, adjustment support platform; 4321, first waist-shaped hole; 4330, placement portion; 4331, inner groove; 4332, outer boss; 4333, support step; 4400, elastic component; 441 0. Guide column; 4420. Elastic part; 4430. Load-bearing sleeve; 4440. Buffer limit pad; 500. Heat dissipation mechanism; 5100. Heat dissipation bracket; 5110. Cylinder support plate; 5120. Support rod; 5130. Test space; 5200. Movable pressure plate; 5210. Movable plate body; 5220. Spacer table; 5221. Rounded corner; 5222. Left pipe clamp; 5223. Right pipe clamp; 5224. Pipe fixing hole; 5230. Guide slide; 5231. Sleeve; 5232. Slide flange; 5300. Drive assembly; 5310. Drive cylinder; 5400. Liquid cooling plate; 5410. Connecting ear; 5420. Liquid inlet pipe; 5421. Liquid outlet pipe. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0037] Example 1

[0038] like Figure 1 、 Figure 2 As shown, this embodiment provides an automated testing device for a semiconductor module 10 for testing the semiconductor module 10. To facilitate structural description, the automated testing device for the semiconductor module 10 is placed on a workbench, with the left-right direction of the workbench being the length direction, the direction facing and facing away from the operator being the width direction, and the up-down direction of the workbench being the up-down direction for structural description. All components of this embodiment are described with reference to these directions.

[0039] like Figure 1 、 Figure 2 As shown, the automated testing device for the semiconductor module 10 of this embodiment mainly includes: a base 100, a support plate 1100, a contact structure assembly 200, an energized contact mechanism 300, a glue-applying and pushing mechanism 400, and a heat dissipation mechanism 500. The base 100 has a detection area 1400. The detection area 1400 can be a flat area directly above the surface of the base 100, mainly to allow the semiconductor module 10 to be tested in this area. The support plate 1100 is slidably set on the base 100, the contact structure assembly 200 is set on the support plate 1100, and is used to connect the detection contacts of the semiconductor module 10, and the energized contact mechanism 300 is set on the support plate 1100, and is used to connect the electrode contacts of the semiconductor module 10. As shown Figure 2 、 Figure 11 As shown, the glue-applying and pushing mechanism 400 is slidably arranged on the base 100 and connected to the support plate 1100. The glue-applying and pushing mechanism 400 has a detection window 4211 that passes through from top to bottom. The contact structure assembly 200 and the energized contact mechanism 300 are both located in the detection window 4211. The detection window 4211 is used to accommodate the semiconductor module 10. Figure 2 、 Figure 13As shown, the heat dissipation mechanism 500 includes a liquid cooling plate 5400, which is positioned above the glue-applying and sliding mechanism 400 and is movable in the vertical direction. The glue-applying and sliding mechanism 400 and the support plate 1100 are synchronously pushed to push the glue-applying and sliding mechanism 400 away from the detection area 1400, thereby allowing the semiconductor module 10 to be mounted on the detection window 4211 outside the detection area 1400 and applying a layer of thermal conductive adhesive. The glue-applying and sliding mechanism 400 and the support plate 1100 are synchronously pushed into the detection area 1400, whereupon the liquid cooling plate 5400 presses down on the semiconductor module 10, thereby electrically connecting the semiconductor module 10 to the contact structure assembly 200 and the energized contact mechanism 300. By synchronously pushing the glue pushing mechanism 400 and the support plate 1100, the glue pushing mechanism 400 is pushed away from the detection area 1400, and then the semiconductor module 10 is installed on the glue pushing mechanism 400 outside the detection area 1400, so that the detection contacts of the semiconductor module 10 are located directly above the contact structure assembly 200, and the electrode contacts of the semiconductor module 10 are located directly above the energized contact mechanism 300, and then a thermal conductive adhesive layer is applied on the upper surface of the semiconductor module 10, and the glue pushing mechanism 400 and the support plate 1100 are synchronously pushed into the detection area 1400, and the semiconductor module 10 is pressed down by the liquid cooling plate 5400 to move the semiconductor module 10 downward, and the detection contacts of the semiconductor module 10 are docked with the contact structure assembly 200, and the electrode contacts of the semiconductor module 10 are docked with the energized contact mechanism 300. During the entire process, it is only necessary to press down the liquid cooling plate 5400 to press down all the semiconductor modules 10 and dock them with the contact structure assembly 200 and the energized contact mechanism 300 synchronously. This simplifies the structure and can achieve automatic downward pressure on the semiconductor module 10, making the detection operation process simpler and improving the detection efficiency.

[0040] like Figure 1 、 Figure 2 As shown, the base 100 further includes: a bottom plate 1200 and a lateral support platform 1300. The bottom plate 1200 is laid horizontally, and the lateral support platforms 1300 are arranged on both sides of the bottom plate 1200 in the longitudinal direction, and the lateral support platforms 1300 on both sides form an inspection area 1400. The glue pushing mechanism 400 is slidably arranged on the lateral support platforms 1300 on both sides along the width direction; the support plate 1100 is located in the inspection area 1400 and below the glue pushing mechanism 400, and is slidably arranged on the bottom plate 1200 along the width direction. A locking column 1500 is fixedly connected between the support plate 1100 and the glue pushing mechanism 400 to enable the glue pushing mechanism 400 and the support plate 1100 to be synchronously pushed into or out of the inspection area 1400.

[0041] like Figure 1 、 Figure 2 、 Figure 3As shown, further, the contact structure assembly 200 in this embodiment is placed on a support platform and detects the semiconductor module 10 placed on the fixture for positioning. After the semiconductor module 10 is placed on the fixture for positioning, the detection contacts of the semiconductor module 10 are used to electrically connect with the contact structure assembly 200, thereby detecting whether the semiconductor module 10 is functioning normally.

[0042] like Figure 3 、 Figure 4 As shown, the support plate 1100 is further provided with an array of multiple threaded holes 1110. The multiple threaded holes 1110 in the array are arranged in an orderly manner and can be arranged in various forms. The contact structure assembly 200 includes multiple contact connectors 2210, each of which includes a support member 2220 and a detection contact docking member 2230. The detection contact docking member 2230 is disposed on the support member 2220, primarily used to support the detection contact docking member 2230 and detachably connect it to the support plate 1100. The support member 2220 is provided with an adjustment waist-shaped hole 2221. The support member 2220 is selectively connected to one or two of the multiple threaded holes 1110 by screws passing through the adjustment waist-shaped hole 2221 to adjust the position of the detection contacts. This allows the detection contact docking member 2230 to be adjusted to align with the detection contacts of the semiconductor module 10 to be tested, thereby achieving a matching docking. In this way, the position of each contact connector 2210 can be adaptively adjusted according to the semiconductor modules 10 of different specifications, so that the detection contact connection mechanism can adapt to the semiconductor modules 10 of different specifications, realize the detection of semiconductor modules 10 of different specifications, improve versatility and increase practicality.

[0043] like Figure 3 、 Figure 4 、 Figure 5As shown, the support member 2220 of this embodiment specifically includes: a contact base plate 2222, a vertical plate 2223, and a supporting plate 2224. The contact base plate 2222 is horizontally disposed, and an adjustment waist-shaped hole 2221 is provided on the contact base plate 2222, so that the support member 2220 can be adjustably fixed to the support plate 1100 via screws or pins. The vertical plate 2223 is vertically disposed on the contact base plate 2222, so that the vertical plate 2223 extends vertically. The supporting plate 2224 is disposed at one end of the vertical plate 2223 facing away from the contact base plate 2222 and is disposed parallel to the contact base plate 2222, thereby supporting the supporting plate 2224 via the vertical plate 2223. The detection contact docking member 2230 is disposed on the supporting plate 2224, so that the detection contact docking member 2230 can be raised so that the detection contact docking member 2230 can be vertically abutted against the detection contacts of the semiconductor module 10. In the specific structure, the contact base plate 2222, the vertical plate 2223 and the supporting plate 2224 form a "Z"-shaped structure, so that there is no air below the supporting plate 2224, and the space below the supporting plate 2224 is relatively large, so that there is enough space for the detection contact docking part 2230 to be installed.

[0044] like Figure 3 、 Figure 4 、 Figure 5 As shown, in this embodiment, the vertical plate 2223 is provided with a threading hole 2225 for passing a cable connected to the detection contact docking member 2230. The detection contact docking member 2230 is connected to an external test device via the cable. The external test device transmits signals to the semiconductor module to be tested via the detection contact docking member 2230, thereby achieving the detection function. Therefore, the threading hole 2225 limits the cable, effectively restraining the cable and preventing it from becoming tangled and causing a cluttered wiring.

[0045] like Figure 3 、 Figure 4 、 Figure 5 As shown, further, in this embodiment, a mounting hole 2226 is formed on the carrier plate 2224, and the detection contact docking member 2230 is installed in the mounting hole 2226. The detection contact docking member 2230 can be directly installed in the mounting hole 2226, which makes the installation structure simple and the adjustment more convenient.

[0046] like Figure 3 、 Figure 4 、 Figure 5 As shown, further, the detection contact docking member 2230 of this embodiment specifically includes: a docking platform 2240 and a conductive connector 2250 passing through the docking platform 2240; the docking platform 2240 is used to dock with the mounting hole 2226, so that the conductive connector 2250 can be stably fixed on the support member 2220.

[0047] like Figure 3 、 Figure 4 、 Figure 5 As shown, the docking platform 2240 in this embodiment specifically includes an inserting post 2241 and a protruding platform 2242. A mounting step 2243 is formed between the inserting post 2241 and the protruding platform 2242. The inserting post 2241 is inserted into the mounting hole 2226, and the protruding platform 2242 is positioned and connected to the supporting plate 2224 via the mounting step 2243. The diameter of the protruding platform 2242 is larger than the diameter of the inserting post 2241, thereby forming the mounting step 2243 between the two. When the inserting post 2241 is inserted into the mounting hole 2226, the lower surface of the protruding platform 2242 abuts against the upper surface of the supporting plate 2224.

[0048] like Figure 5 As shown, in another structure, the mounting hole 2226 and the plug-in post 2241 are matched with anti-slip members 2244 to ensure that the plug-in post 2241 is inserted into the mounting hole 2226 in a directional manner. The anti-slip member 2244 is mainly used to make the plug-in post 2241 more firmly inserted into the mounting hole 2226, so that the plug-in post 2241 will not rotate arbitrarily in the circumferential direction. Therefore, the anti-slip member 2244 can be a rubber cortex that adheres to the inner wall of the mounting hole 2226. When the plug-in post 2241 is inserted into the mounting hole 2226, it contacts the rubber cortex, squeezing each other and increasing friction, making the plug-in post 2241 more stable. The anti-slip member 2244 can also be a fool-proof structure, for example, by providing a flower groove on the inner wall of the mounting hole and providing a spline on the corresponding plug-in post. This can also ensure that the plug-in post is stably fixed in the mounting hole.

[0049] like Figure 3 、 Figure 4 、 Figure 5 As shown, further, a docking groove 2251 is provided on the conductive joint 2250 of this embodiment, and an air-avoiding groove 2252 is provided on the side wall of the conductive joint 2250, so that an elastic opening is formed on the opening side of the docking groove 2251. Specifically, the detection contacts of some semiconductor modules 10 are needle-shaped contacts. Then, during docking, the needle-shaped contact can be directly inserted into the docking groove 2251. Since the conductive joint 2250 is made of a metal tube, when the air-avoiding groove 2252 is provided, a plurality of spring pieces can be formed at the open end of the conductive joint 2250. The plurality of spring pieces are arranged around the central axis of the conductive joint 2250 so as to be elastic, so that an elastic opening is formed on the opening side of the docking groove 2251. The needle-shaped contact can be clamped by the elastic opening to achieve stable docking.

[0050] It should also be noted that if the contact is not a needle, then there will be a corresponding solder point at the detection contact position of the semiconductor module 10, and the solder point will also be a protruding form. Therefore, a chamfer 2253 is provided on the inner edge of the elastic opening. The chamfer 2253 gives the elastic opening an inverted cone shape, so that the elastic opening gradually decreases from top to bottom. When the protruding solder point presses against the elastic opening, the chamfer 2253 guides and compresses the elastic piece, allowing it to be stably embedded in the elastic opening.

[0051] like Figure 2 、 Figure 3 As shown, further, a guide rail 1120 is provided at the bottom of the support plate 1100 of this embodiment, and the support plate 1100 is slidably arranged on the guide rail 1120. The support plate 1100 can be movably arranged, and the detection contact connection mechanism can be easily pulled out as a whole, thereby facilitating the position adjustment of the multiple contact connectors 2210 thereon.

[0052] like Figure 2 、 Figure 6 、 Figure 7As shown, the energized contact mechanism 300 of this embodiment is adjustably mounted on the support plate 1100. The electrode contacts of the semiconductor module 10 positioned on the glue-applying and pushing mechanism 400 are electrically connected to the energized contact mechanism 300, thereby enabling detection. The energized contact mechanism 300 of this embodiment primarily comprises a connecting and mounting portion 3100, a column portion 3200, a contact portion 3300, and a contact spring 3400. The connecting and mounting portion 3100 is connected to the support plate 1100 to secure the entire structure. The column portion 3200 is mounted on the connecting and mounting portion 3100 and has a mounting slot 3210 defined along its height. The slot 3210 opens upward, forming an open side. A guide hole 3220 is provided through the column portion 3200 along its length, which may be a front-to-back direction. The guide hole 3220 communicates with the mounting slot 3210, thereby forming a mounting position. The contact part 3300 includes a contact guide plate 3310 and a contact boss 3320. The contact boss 3320 is fixedly arranged on one side of the height direction of the contact guide plate 3310. The contact guide plate 3310 is inserted into the guide through hole 3220 so that the contact boss 3320 is located on the open side of the mounting groove 3210. The guide through hole 3220 is relatively large in the up and down directions, which is sufficient to allow the contact guide plate 3310 and the contact boss 3320 to be inserted into the guide through hole 3220 from front to back, and after the contact boss 3320 reaches the position of the mounting groove 3210, the contact guide plate 3310 can be lifted upward, so that the contact boss 3320 is installed in the mounting groove 3210 and protrudes from the open side of the mounting groove 3210. The contact spring 3400 is positioned within the mounting slot 3210 and connected to the contact guide 3310. Under the elastic force of the contact spring 3400, the contact guide 3310 causes the contact boss 3320 to extend and retract within the open side of the mounting slot 3210. When the contact guide 3310 and the contact boss 3320 are inserted into the guide hole 3220 in the front-to-back direction, the contact spring 3400 is pressed downward. Once the contact boss 3320 reaches the mounting slot 3210, the contact spring 3400 causes the contact boss 3320 to rise, allowing it to rise and fall. It's easy to imagine that the length direction could also be the left-right direction.

[0053] like Figure 7 、 Figure 8As shown, the contact guide plate 3310 of this embodiment is divided into a guide plate head portion 3311 and a guide plate tail portion 3312 along its length, separated by the contact boss 3320. The guide through-hole 3220 is divided into a first opening 3221 and a second opening 3222 along its length, separated by the mounting slot 3210. The first opening 3221 and the second opening 3222 are located on opposite sides of the column portion 3200. Along its length, the guide plate head portion 3311 is shorter than the guide plate tail portion 3312. The guide plate head portion 3311 is movably embedded in the first opening 3221 along its height, while the guide plate tail portion 3312 extends beyond the second opening 3222. In the specific structure, the contact guide plate 3310 extends a predetermined length in the front-to-back direction to form a long strip, and the contact boss 3320 is located on the upper surface of the contact guide plate 3310 and is located near the rear end, so that the length of the guide plate head 3311 is greater than the length of the guide plate tail 3312, thereby facilitating the guide plate tail 3312 and the contact boss 3320 to be inserted into the guide through hole 3220 first, and when the guide plate head 3311 is embedded in the first hole 3221, the contact boss 3320 is embedded in the mounting groove 3210 and moves along the up and down directions.

[0054] like Figure 7 、 Figure 8 As shown, further, in this embodiment, the guide plate head 3311 is configured as a square, and the first opening 3221 is a square hole. The side surfaces of the square guide plate head 3311 cooperate with the side walls of the first opening 3221 to allow the contact boss 3320 to move in the height direction. The left and right side walls of the first opening 3221 are used to limit the position, allowing the left and right side walls of the guide plate head 3311 to abut against the inner wall of the first opening 3221 for vertical movement, thereby limiting the left and right position of the guide plate head 3311, optimizing the structure, and ensuring the stability of the contact boss 3320 in the height direction.

[0055] In addition, the contact boss 3320 can be square, and the open side of the mounting groove 3210 also adopts a square opening. When the contact boss 3320 is inserted into the mounting groove 3210, it can cooperate with the square opening, especially the side walls in the front and rear directions match the inner walls of the square opening in the front and rear directions, so that it can be effectively limited in the front and rear directions, ensuring the stability of the contact boss 3320 in the height direction.

[0056] like Figure 7 、 Figure 8 As shown, further, in this embodiment, a connecting piece 3330 is provided on the guide plate tail 3312. The connecting piece 3330 is located outside the second hole 3222 and is used to connect a cable. The connecting piece 3330 makes cable connection more convenient.

[0057] like Figure 7 、 Figure 8 As shown, in this embodiment, a threaded hole 3331 is formed on the guide plate tail portion 3312. The connecting member 3330 includes a conductive plate 3332. The guide plate has a locking through-hole. Screws are passed through the locking through-hole and screwed into the threaded hole 3331, thereby removably connecting the conductive plate 3332 to the guide plate tail portion 3312. The use of screws for fastening facilitates the installation and removal of the conductive plate 3332. The conductive plate 3332 is stably fixed to the guide plate tail portion 3312, and is not easily loosened when the entire structure is moved, thus achieving an effective loosening effect.

[0058] like Figure 7 、 Figure 9 As shown, further, in some structures of the contact guide plate 3310, a limiting groove 3340 is provided on the side of the contact guide plate 3310 facing away from the contact boss 3320, and one end of the contact elastic member 3400 is disposed within the limiting groove 3340. In this embodiment, the contact elastic member 3400 can be a spring, which is retained at the bottom of the mounting groove 3210 and abuts against the bottom of the contact guide plate 3310 to push against the contact guide plate 3310. However, if the lower portion of the limiting groove 3340 is relatively shallow, the contact elastic member 3400 may easily wobble at the bottom of the mounting groove 3210. Therefore, the limiting groove 3340 is also used to retain the upper portion of the spring, ensuring that the spring is stably retained within the mounting groove 3210.

[0059] like Figure 7 、 Figure 9 As shown, an insulating spacer 3341 is disposed within the retaining groove 3340, against which the contact spring 3400 rests. Since electrical conduction occurs via the contact guide plate 3310, and the spring is a metal spring, the insulating spacer 3341 insulates the spring, preventing it from carrying current. This allows the current to be fully utilized, concentrating on the contact guide plate 3310 and the contact boss 3320. Furthermore, the insulating spacer 3341 increases contact friction with the spring, thereby keeping the spring in a relatively fixed position during compression and preventing circumferential rotation.

[0060] like Figure 6 、 Figure 7 、 Figure 8As shown, the column portion 3200 of this embodiment specifically includes: a column 3230 and a bottom cover 3240. The guide through-hole 3220 and the mounting slot 3210 are both provided on the column 3230, and the bottom cover 3240 is connected to the bottom of the column 3230 to block the mounting slot 3210. The design of the column 3230 and the bottom cover 3240 facilitates the formation of a through-hole in the axial direction of the column, and then the formation of a guide through-hole 3220 in the front-to-back direction. After the bottom of the through-hole is sealed with the bottom cover 3240, the mounting slot 3210 is formed. This further facilitates the processing of the hole-slot structure. In addition, the spring can be inserted from the bottom of the through-hole into the mounting slot 3210 and then sealed with the bottom cover 3240, making the installation of the spring more convenient and facilitating assembly and disassembly.

[0061] like Figure 6 、 Figure 7 、 Figure 8 As shown, further, the connection and installation portion 3100 of this embodiment specifically includes a contact support plate 3110, which is connected to the column portion 3200. The contact support plate 3110 can be specifically arranged on one side of the column in the longitudinal direction. A waist-shaped hole 3120 is opened on the contact support plate 3110, and it is adjustably connected to the support plate 1100 by inserting screws. In the specific structure, the left and right sides of the upper surface of the support plate 1100 are provided with lifting bars 1130. The lifting bars 1130 extend in the front-to-back direction and have multiple adjustment holes opened on the lifting bars 1130. A supporting cross plate 1140 is provided between the lifting bars 1130 on both sides. The left and right ends of the supporting cross plate 1140 are respectively adjustably connected to the adjustment holes on the lifting bars 1130 on both sides. The contact support plate 3110 can be connected to the support horizontal plate 1140 by adjusting the position of the waist-shaped hole 3120 on the screw, thereby facilitating the adjustment of the position of the power contact mechanism 300 and making the power contact mechanism 300 more practical. There are two support horizontal plates 1140, located at the front and rear ends respectively. Each of the two support horizontal plates 1140 is equipped with multiple power contact mechanisms 300, so that the position can be adjusted to accommodate semiconductor modules 10 of different specifications.

[0062] like Figure 6 、 Figure 7 、 Figure 8 As shown, further, in this embodiment, the bottom of the contact support plate 3110 is provided with a sliding groove 3130, which is used to be mounted on the supporting horizontal plate 1140. By mounting the sliding groove 3130 on the supporting horizontal plate 1140 and cooperating with the sidewall of the horizontal plate for guidance, the support plate 1100 can be stably moved, so that the position of the energized contact mechanism can be adjusted with high precision.

[0063] like Figure 1 、 Figure 2 、 Figure 10As shown, the glue-coating and pushing mechanism 400 of this embodiment is used to push the semiconductor module 10, allowing the semiconductor module 10 to be pulled out to be coated with a thermally conductive adhesive layer, and then pushing the semiconductor module 10 after the thermally conductive adhesive layer is applied into the testing area 1400. The glue-coating and pushing mechanism 400 of this embodiment mainly includes: a push-pull frame 4200 and a supporting frame 4300. The testing area 1400 on the base 100 is correspondingly provided with a contact structure assembly 200 and an energized contact mechanism 300, so that the semiconductor module 10 can be docked with the connector in the testing area 1400 to achieve an electrical connection, thereby performing power-on testing on the semiconductor module 10. The push-pull frame 4200 is slidably disposed on the base 100 along the width direction. The push-pull frame 4200 can be pulled back and forth on the base 100, thereby being pulled out from above the testing area 1400 and pushed into the testing area 1400. The support frame 4300 is mounted on the push-pull frame 4200 via an elastic component 4400. The support frame 4300 is used to support the semiconductor module 10. The support frame 4300 is pushed by the push-pull frame 4200 to move the semiconductor module 10 out of the testing area 1400, allowing the semiconductor module 10 located outside the testing area 1400 to be coated with a layer of thermally conductive adhesive. The push-pull frame 4200 pulls the support frame 4300 and the semiconductor module 10 thereon to move forward and backward on the base 100, thereby pulling the semiconductor module 10 out of and into the testing area 1400. After the semiconductor module 10 is pulled forward out of the testing area 1400, an operator can apply adhesive to the surface of the semiconductor module 10. Once the adhesive application is complete, the semiconductor module 10 is pushed backward into the testing area 1400 for testing. Therefore, by setting the detection area 1400 on the base 100, the supporting frame 4300 is set on the push-pull frame 4200, and the supporting frame 4300 is used to carry the semiconductor module 10, so that the push-pull frame 4200 is slidably set on the base 100 along the width direction, so that the push-pull frame 4200 drives the supporting frame 4300 to move synchronously on the base 100. When the semiconductor module 10 is to be coated with thermal conductive adhesive, the push-pull frame 4200 is pulled to move the supporting frame 4300 and the semiconductor module 10 thereon out of the detection area 1400, so as to apply a layer of thermal conductive adhesive to the semiconductor module 10 located outside the detection area 1400, thereby completing the coating of the thermal conductive adhesive with the support of the supporting frame 4300, and eliminating the need to remove the semiconductor module 10 from the supporting frame 4300, thereby improving safety; when testing the semiconductor module 10 coated with thermal conductive adhesive, the push-pull frame 4200 is pushed to drive the supporting frame 4300 and the semiconductor module 10 to slide into the detection area 1400, so that the semiconductor module 10 can be powered on for testing in the detection area 1400.The carrier body 4300 is mounted on top via the elastic component 4400. During testing, the carrier body 4300 can be pressed downward to allow the semiconductor module 10 thereon to move downward and mate with the connector in the testing area 1400, thereby achieving electrical connection of the semiconductor module 10. Therefore, during the gluing and testing process of the semiconductor module 10, the support provided by the push-pull frame 4200 and the carrier body 4300 prevents the semiconductor module 10 from falling during the gluing process. This push-pull method improves the gluing efficiency and simplifies the testing process of the semiconductor module 10.

[0064] like Figure 1 、 Figure 10 、 Figure 11 As shown, the push-pull frame 4200 of this embodiment specifically includes a push-pull frame 4210 and a push-pull handle 4220. The push-pull frame 4210 defines a vertically extending detection window 4211. Both sides of the push-pull frame 4210 are slidably mounted on the base 100 along its length. The push-pull handle 4220 is fixedly mounted on the edge of the push-pull frame 4210 on the extension side. Specifically, the front side of the base 100 serves as the extension side, while the rear side serves as the insertion side. The push-pull frame 4210 can be a rectangular frame with a hollow center to form the detection window 4211, so that the lower portion of the detection window 4211 faces the inspection area 1400. Two push-pull handles 4220 can be provided, both located on the front edge of the push-pull frame 4210. The two push-pull handles 4220 are spaced apart in the left-right direction, making it convenient for the operator to grasp and push the push-pull frame 4200.

[0065] like Figure 2 、 Figure 11 、 Figure 12 As shown, further, in this embodiment, push-pull guide rails 4230 are provided on both sides of the base 100 in the width direction. The push-pull guide rails 4230 extend along the length direction and can be dovetail-shaped guide rails. Push-pull slides 4240 are provided on both sides of the bottom of the push-pull frame 4210 in the width direction. The push-pull slides 4240 are mounted on the push-pull guide rails 4230 and slide. The push-pull slides 4240 cooperate with the push-pull guide rails 4230 on both sides to ensure that the push-pull frame 4210 can be pushed back and forth on the base 100 in a relatively smooth and stable manner.

[0066] like Figure 10 、 Figure 11As shown, further, in this embodiment, the push-pull slide 4240 is arranged on the push-in side of the width direction of the push-pull frame 4210. Only one push-pull slide 4240 can be provided on one of the left and right sides. This push-pull slide 4240 is arranged at the rear side of the bottom of the push-pull frame 4210, so that when the push-pull frame 4210 moves forward, the push-pull slide 4240 always moves smoothly on the push-pull guide rail 4230. A limit fixing block 4250 is provided at one end of the base 100 facing the pull-out side. The limit fixing block 4250 is located outside the push-pull guide rail 4230 and below the push-pull frame 4210 to support the push-pull frame 4210. During the sliding process on one side of the push-pull slide 4240, the push-pull frame 4210 is supported by the limiting fixed block 4250 at the front end of the base 100. When the push-pull frame 4210 is pushed into the inspection area 1400, the push-pull frame 4210 is supported on both the front and rear sides, ensuring the support stability of the push-pull frame 4210. The push-pull frame 4210 can then stably support the carrier body 4300 and the semiconductor module 10 thereon. When the push-pull frame 4210 is pulled out of the inspection area 1400, the push-pull frame 4210 moves on the upper surface of the limiting fixed block 4250, ensuring the support stability during the movement.

[0067] like Figure 10 、 Figure 12 As shown, further, a limit movable block 4260 is provided on one end of the push-pull frame 4210 facing the push-in side. The limit movable block 4260 is located outside the push-pull guide rail 4230 and is used to abut against the limit fixed block 4250 to limit the pull-out position of the push-pull frame 4210. On one side in the left-right direction, the limit movable block 4260 is provided at the rear end of the push-pull frame 4210. The limit movable block 4260 is an L-shaped block. When it moves with the push-pull frame 4210, it can be located outside the push-pull guide rail 4230 and move. When it moves to the front side with the push-pull frame 4210, it is blocked by the rear end surface of the limit movable block 4260, so that the push-pull frame 4210 will not move forward further, thereby limiting the pull-out limit position of the push-pull frame 4210. Therefore, the upper surface of the limiting movable block 4260 is used to support the push-pull frame 4210 for sliding, and the rear end surface of the limiting movable block 4260 cooperates with the limiting movable block 4260 to achieve limiting. Multiple functions can be achieved through only one limiting movable block 4260, thereby optimizing the structure.

[0068] like Figure 10 、 Figure 11 、 Figure 12As shown, the carrier body 4300 of this embodiment specifically includes a carrier frame 4310 and adjustable support platforms 4320 spaced apart in the width direction. The carrier frame 4310 defines a vertically extending receiving window 4311. The carrier frame 4310 adopts a rectangular frame structure, with its length and width being shorter than the push-pull frame 4210. The carrier frame 4310 is movable upward and downward above the push-pull frame 4210 via an elastic assembly 4400. The adjustable support platforms 4320 are disposed within the receiving window 4311. The adjustable support platforms 4320 on either side are respectively used to support the two ends of the semiconductor module 10. The front and rear adjustable support platforms 4320 can be arranged in mirror symmetry. The front and rear ends of the semiconductor module 10 can be placed on the adjustable support platforms 4320 on each side, providing stable support for the semiconductor module 10. The elastic assembly 4400 also allows the semiconductor module 10 to be pressed downward, so that the lowered semiconductor module 10 contacts the connector below, achieving electrical connection.

[0069] like Figure 10 、 Figure 11 、 Figure 12 As shown, further, in this embodiment, the adjustment support platform 4320 is provided with multiple placement portions 4330 spaced apart along the length. The placement portions 4330 on the front and rear sides cooperate to limit the position of a semiconductor module 10. Arranging multiple placement portions 4330 along the length allows multiple semiconductor modules 10 to be tested at once, improving testing efficiency. The placement portion 4330 specifically includes: an inner groove 4331 and an outer boss 4332; the inner groove 4331 is provided on the side wall of the adjustment support platform 4320, and the outer boss 4332 is provided on the side wall of the adjustment support platform 4320 and is located on both sides of the opening of the inner groove 4331. The upper surface of the outer boss 4332 is recessed from the upper surface of the adjustment support platform 4320 to form a support step 4333, which is used to support and limit the semiconductor module 10. The supporting steps on both sides not only limit the semiconductor module 10 in the width direction, but also support the semiconductor module 10 in the up and down directions. The inner groove 4331 can avoid the contacts on the semiconductor module 10 and achieve stable fixation of the semiconductor module 10.

[0070] like Figure 10 、 Figure 11 、 Figure 12 As shown, further, in this embodiment, the supporting frame 4310 is provided with adjustment threaded holes 4312 on both sides of the longitudinal direction. The adjustment support platform 4320 is provided with first waist-shaped holes 4321 at both ends. The first waist-shaped holes 4321 are connected to the adjustment threaded holes 4312 via screws. This allows the front and rear positions of the adjustment support platforms 4320 to be adjusted to accommodate semiconductor modules 10 of different specifications, improving versatility.

[0071] like Figure 12 As shown, the elastic assembly 4400 of this embodiment specifically includes: a plurality of guide posts 4410 and a plurality of elastic members 4420. The plurality of guide posts 4410 are arranged on the push-pull frame 4200 in the vertical direction, and the elastic members 4420 are sleeved on the guide posts 4410. For example, there are four guide posts 4410, each located at the four corners of the upper surface of the push-pull frame 4200. The elastic members 4420 are springs and are arranged one-to-one with the guide posts 4410. The support frame 4300 is provided with a bearing sleeve 4430, which is slidably sleeved on the guide posts 4410. The bearing sleeve 4430 is arranged corresponding to the guide posts 4410 and is fixedly mounted on the four corners of the support frame 4300. The elastic members 4420 are located between the push-pull frame 4200 and the support frame 4300. The elastic component 4400 can cause the carrier body 4300 to move downward when under pressure and be lifted up when not under pressure, thereby enabling the semiconductor module 10 thereon to move downward and upward.

[0072] like Figure 12 As shown, in this embodiment, a buffering and limiting pad 4440 is further provided on the push-pull frame 4200 or the supporting frame 4300. The buffering and limiting pad 4440 is located between the push-pull frame 4200 and the supporting frame 4300. The buffering and limiting pad 4440 can be made of a rubber block or a silicone block. The buffering and limiting pad 4440 can limit the downward movement limit position of the supporting frame 4300 and cushion the pressure on the supporting frame 4300 after it is compressed.

[0073] like Figure 1 、 Figure 2 、 Figure 13As shown, the heat dissipation mechanism 500 of this embodiment mainly includes: a heat dissipation bracket 5100, a movable pressure plate 5200, a drive assembly 5300 and a liquid cooling plate 5400. The heat dissipation bracket 5100 can be vertically arranged on the base 100. The movable pressure plate 5200 is movably connected to the heat dissipation bracket 5100 and can move in the up and down directions. A test space 5130 for placing semiconductor modules is formed below the movable pressure plate 5200. Therefore, the detection area 1400 is located in the test space 5130. The test space 5130 has corresponding connectors. The semiconductor module to be tested is located in the test space 5130 and is detachably connected to the corresponding connectors, so that the semiconductor module can be powered on for testing. The heat dissipation surface of the semiconductor module located in the test space 5130 faces upward, and a layer of thermal conductive adhesive is provided on the heat dissipation surface to facilitate heat conduction of the heat generated by the semiconductor module during the detection process. The drive assembly 5300 is disposed on the heat dissipation bracket 5100 and connected to the movable pressure plate 5200, and can provide power to drive the movable pressure plate 5200 to move up and down. The liquid cooling plate 5400 is fixedly disposed on the movable pressure plate 5200 and is located on the lower surface of the movable pressure plate 5200, thereby enabling the liquid cooling plate 5400 to be positioned above the semiconductor module. The movable pressure plate 5200 is driven by the drive assembly 5300 to move in the up and down direction, thereby driving the liquid cooling plate 5400 to abut against the semiconductor module located in the test space 5130. This causes the liquid cooling plate 5400 to move downward and directly abut against the thermally conductive adhesive layer on the upper surface of the semiconductor module. During the test process, the heat generated by the semiconductor module when it is powered on is transferred from the thermally conductive adhesive layer to the liquid cooling plate 5400, and dissipated through the liquid cooling plate 5400. When the test is complete, the drive assembly 5300 drives the movable pressure plate 5200 upward, moving the liquid cooling plate 5400 away from the semiconductor module, facilitating removal of the tested semiconductor module from the test space 5130. Specifically, after the upper surface of the semiconductor module to be tested is coated with a layer of thermally conductive adhesive and positioned within the test space 5130, power is applied, thereby positioning the semiconductor module below the liquid cooling plate 5400. During the test, the movable pressure plate 5200, driven by the drive assembly 5300, moves vertically, driving the lower surface of the liquid cooling plate 5400 against the semiconductor module within the test space 5130, thereby dissipating heat from the semiconductor module during testing. In this way, after the heat dissipation surface of the semiconductor module is facing upward, a thermal conductive adhesive layer can be directly applied, replacing the original solution of facing the heat dissipation surface of the semiconductor module downward. The downward-pressing liquid cooling plate 5400 is then moved downward to rest against the heat dissipation surface of the semiconductor module for effective heat dissipation. This eliminates the need to manually flip the semiconductor module over so that the heat dissipation surface faces downward for heat dissipation, making the operation process simpler and improving detection efficiency.

[0074] like Figure 2 、 Figure 13As shown, the movable platen 5200 of this embodiment specifically includes a movable platen body 5210 and a spacer platform 5220. The movable platen body 5210 is connected to the drive assembly 5300 and moves in the vertical direction when driven by the drive assembly 5300. The spacer platform 5220 is disposed on the upper surface of the movable platen body 5210. In the specific structure, the drive assembly 5300 passes through the spacer platform 5220 and is connected to the movable platen body 5210. The spacer platform 5220 can be fixed to the movable platen body 5210, thereby increasing the thickness of the movable platen body 5210 at the connection between the drive assembly 5300. In addition, the spacer 5220 separates the movable plate body 5210 from the heat dissipation bracket 5100, which can limit the upper limit position of the movable plate body 5210, and can also buffer the upward pulling force applied by the driving component 5300 when pulling the movable plate body 5210 upward, so that the movable plate body 5210 can be stably pressed down and moved upward in the up and down directions.

[0075] like Figure 2 、 Figure 13 As shown, further, the spacer platform 5220 of this embodiment is located in the middle of the width direction of the movable plate body 5210 and extends along the length direction to the two longitudinal edges of the movable plate body 5210. The spacer platform 5220 is configured as an elongated strip, extending in the left and right directions and fixed to the upper surface of the movable plate body 5210. This can reduce the structural weight of the entire movable pressure plate 5200 while limiting the upper limit of the movable plate body 5210. Furthermore, the provision of a single spacer platform 5220 allows the central portion connected to the drive assembly 5300 to form a single unit with the left and right end portions, thereby increasing the structural strength and ensuring the load-bearing capacity of the movable pressure plate 5200. The edges of the upper surface of each longitudinal end of the spacer platform 5220 are rounded corners 5221. The rounded corners 5221 prevent protrusions on the left and right sides of the spacer platform 5220, making the structure more stable. Furthermore, the rounded corners 5221 prevent sharp points that could cause injuries to the operator.

[0076] like Figure 2 、 Figure 13 As shown, further, the heat dissipation bracket 5100 of this embodiment includes: a cylinder support plate 5110 and a plurality of support rods 5120. The cylinder support plate 5110 is horizontally arranged above the movable plate body 5210, and the plurality of support rods 5120 are vertically arranged below the cylinder support plate 5110. In a specific structure, four support rods 5120 can be provided, and the four support rods 5120 are arranged at four points along a rectangle and vertically arranged in the vertical direction. The four support rods 5120 can be fixed to the base 100, and the cylinder support plate 5110 is fixed to the top of the four support rods 5120, thereby achieving stable support for the cylinder support plate 5110.

[0077] like Figure 2 、 Figure 13 As shown, in this embodiment, the movable plate body 5210 is further provided with a plurality of guide slides 5230; the plurality of guide slides 5230 are arranged in conjunction with the plurality of support rods 5120, and the guide slides 5230 are sleeved on the support rods 5120 to enable the movable plate body 5210 to slide in the vertical direction. The precision of the center hole of the guide slides 5230 and the precision of the outer wall of the support rod 5120 are relatively high, and the two are matched to enable the movable plate body 5210 to slide stably in the vertical direction.

[0078] like Figure 2 、 Figure 13 As shown, the guide slide 5230 of this embodiment further includes: a sliding sleeve 5231, which is embedded in the movable plate body 5210 and through which the support rod 5120 is inserted; and a slide flange 5232, which is fixedly mounted on the sliding sleeve 5231 and connected to the movable plate body 5210 via screws. The sliding sleeve 5231 passes through the movable plate body 5210 and is fixed by the sliding flange 5232 at its upper end, ensuring the connection stability of the guide slide 5230.

[0079] like Figure 2 、 Figure 13 As shown, the drive assembly 5300 of this embodiment specifically includes a drive cylinder 5310, which is fixedly mounted on the upper surface of the cylinder support plate 5110. The push rod of the drive cylinder 5310 passes through the cylinder support plate 5110 and is connected to the movable plate body 5210. The use of the drive cylinder 5310 for pneumatic driving enables faster vertical movement of the movable plate body 5210 and a faster drive response.

[0080] like Figure 2 、 Figure 13 As shown, the liquid cooling plate 5400 of this embodiment further protrudes in the width direction from both side edges of the movable plate body 5210. The protrusions in the width direction of the liquid cooling plate 5400 indicate that the movable plate body 5210 is shorter in the front-to-back direction. This reduces the weight of the movable plate body 5210 and concentrates pressure on the middle portion, which is structurally reinforced by the spacer 5220 to ensure pressure stability during the downward pressure on the liquid cooling plate 5400.

[0081] like Figure 2 、 Figure 13 As shown, in this embodiment, the liquid cooling plate 5400 is provided with connecting ears 5410 on both sides of the length direction. The connecting ears 5410 are used to pass screws to connect to the lower surface of the movable plate body 5210. The liquid cooling plate 5400 is screwed to the movable plate body 5210 via the connecting ears 5410 on the left and right sides, which is a simple and stable connection method.

[0082] like Figure 2 、 Figure 13 As shown, further, a liquid inlet pipe 5420 and a liquid outlet pipe 5421 are provided at one end of the liquid cooling plate 5400 in the longitudinal direction of this embodiment. Both the liquid inlet pipe 5420 and the liquid outlet pipe 5421 extend through the movable plate body 5210. The spacer 5220 is provided with a plurality of fixed pipe holes 5224 extending along the width thereof. Both the liquid inlet pipe 5420 and the liquid outlet pipe 5421 are positioned within the fixed pipe holes 5224. By engaging the spacer 5220 with the liquid inlet pipe 5420 and the liquid outlet pipe 5421, the pipes can move synchronously during the movement of the movable plate body 5210 without being damaged by pressure from movable parts such as the movable plate body 5210. Furthermore, by limiting the position of the liquid inlet pipe 5420 and the liquid outlet pipe 5421 on the spacer 5220, the liquid inlet pipe 5420 and the liquid outlet pipe 5421 are arranged in a standardized manner, preventing entanglement.

[0083] like Figure 13 、 Figure 14 As shown in the specific structure, the liquid inlet pipe 5420 is used as an example for structural description. The liquid inlet pipe 5420 passes through the movable plate body 5210 in the vertical direction, and then passes through the spacer platform 5220 in the horizontal direction to achieve locking. Some fixing structures are also provided on the upper surface of the movable plate body 5210 to fix the liquid inlet pipe 5420 on the upper surface of the movable plate body 5210. These fixing structures do not need to exceed the height of the spacer platform 5220. A left pipe clamp 5222 and a right pipe clamp 5223 are provided on the spacer platform 5220. A fixed pipe hole 5224 is formed between the left pipe clamp 5222 and the right pipe clamp 5223. Both the left pipe clamp 5222 and the right pipe clamp 5223 are elastic and can open or close the fixed pipe hole 5224, thereby locking the liquid inlet pipe 5420 in the fixed pipe hole 5224 for limiting the position. In addition, a retaining ring can be fixed on the outside of the liquid inlet pipe 5420. The diameter of the retaining ring is slightly larger than that of the liquid inlet pipe. The outer diameter of the channel 5420 is determined by the retaining rings, which are respectively located on the front and rear sides of the fixed pipe hole 5224 and abut against the left pipe clamp 5222 and the right pipe clamp 5223. In this way, the forward and backward movement of the liquid inlet pipe 5420 can be limited. During the up and down movement of the movable pressure plate 5200, the liquid inlet pipe 5420 can move synchronously with the movable pressure plate 5200. The embedded structure of the liquid outlet pipe 5421 refers to the liquid inlet pipe 5420, so as to avoid the pipe from being entangled or torn.

[0084] Example 2

[0085] This embodiment further provides a method for testing a semiconductor module, which is applied to the automated testing device for the semiconductor module described above. The method includes:

[0086] Step S100: synchronously pushing the glue-coating pushing mechanism and the support plate to push the glue-coating pushing mechanism away from the detection area;

[0087] Step S200: Mount the semiconductor module on the glue-applying and pushing mechanism outside the detection area so that the detection contacts of the semiconductor module are located directly above the contact structure assembly and the electrode contacts of the semiconductor module are located directly above the energized contact mechanism;

[0088] Step S300: applying a thermal conductive adhesive layer on the upper surface of the semiconductor module;

[0089] Step S400: synchronously push the glue-coating pushing mechanism and the support plate into the inspection area;

[0090] Step S500: Press the semiconductor module downward through the liquid cooling plate to move the semiconductor module downward, and connect the detection contacts of the semiconductor module to the contact structure assembly, and connect the electrode contacts of the semiconductor module to the power contact mechanism.

[0091] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An automated testing device for a semiconductor module, characterized in that: include: a base, wherein the base has a detection area; a support plate, the support plate being slidably disposed on the base; a contact structure assembly, the contact structure assembly being disposed on the support plate and being used for docking with detection contacts of a semiconductor module; an energized contact mechanism, the energized contact mechanism being disposed on the support plate and being used for connecting to electrode contacts of a semiconductor module; A glue-applying and sliding mechanism, the glue-applying and sliding mechanism being slidably disposed on the base and connected to the support plate, the glue-applying and sliding mechanism having a detection window extending vertically therethrough, the contact structure assembly and the energized contact mechanism both being located within the detection window, the detection window being used to accommodate a semiconductor module; and a heat dissipation mechanism, the heat dissipation mechanism comprising a liquid cooling plate, the liquid cooling plate being located above the glue-applying and pushing mechanism and being movably arranged in an up-and-down direction; By synchronously pushing the glue-applying and pushing mechanism and the support plate, the glue-applying and pushing mechanism is pushed away from the detection area, so as to install the semiconductor module on the detection window outside the detection area and apply a thermal conductive glue layer; By synchronously pushing the glue-coating and pushing mechanism and the support plate into the detection area, the liquid cooling plate presses down the semiconductor module, so that the semiconductor module is electrically connected to the contact structure assembly and the energized contact mechanism.

2. The automated testing device for a semiconductor module according to claim 1, wherein: The base comprises: a bottom plate, the bottom plate being laid horizontally; Lateral support platforms, the lateral support platforms being arranged on both sides of the bottom plate in the longitudinal direction, and the detection area being enclosed between the lateral support platforms on both sides; The glue-coating pushing mechanism is slidably arranged on the lateral support platforms on both sides along the width direction; The support plate is located in the detection area and below the glue-coating and pushing mechanism, and is slidably arranged on the bottom plate along the width direction.

3. The automated testing device for a semiconductor module according to claim 2, wherein: A locking column is fixedly connected between the support plate and the glue-coating pushing mechanism, so that the glue-coating pushing mechanism and the support plate are synchronously pushed into or out of the detection area.

4. The automated testing device for a semiconductor module according to claim 1, wherein: The glue-coating pushing mechanism comprises: a push-pull frame, which is slidably arranged on the base along the width direction; A supporting frame, the supporting frame being arranged on the push-pull frame via an elastic component, and the supporting frame being used to support a semiconductor module; The supporting frame is pushed by the push-pull frame to drive the semiconductor module to move out of or into the testing area.

5. The automated testing device for semiconductor modules according to claim 4, wherein: The push-pull frame comprises: a push-pull frame, the push-pull frame enclosing the detection window extending vertically, and both sides of the push-pull frame in the longitudinal direction being slidably arranged on the base; A push-pull handle is fixedly arranged on the edge of the pull-out side of the push-pull frame.

6. The automated testing device for semiconductor modules according to claim 4, wherein: The carrier body includes: a carrier frame, the carrier frame enclosing a accommodating window that passes through from top to bottom; Adjustment support platforms are arranged at intervals in the width direction, and the adjustment support platforms are arranged in the accommodating window. The adjustment support platforms on both sides are respectively used to support the two ends of the semiconductor module.

7. The automated testing device for a semiconductor module according to claim 1, wherein: The heat dissipation mechanism includes: a heat dissipation bracket, which is vertically arranged on the base; A movable pressing plate, the movable pressing plate being movably connected to the heat dissipation bracket and being located above the detection window of the glue-applying and pushing mechanism; a driving assembly, the driving assembly being arranged on the heat dissipation bracket and connected to the movable pressing plate; A liquid cooling plate, the liquid cooling plate being fixedly arranged on the movable pressing plate; The movable pressing plate is driven by the driving assembly to move in the up and down directions, so as to drive the liquid cooling plate to abut against the semiconductor module located on the glue-coating and pushing mechanism.

8. The automated testing device for a semiconductor module according to claim 1, wherein: The energized contact mechanism comprises: a connecting and mounting portion, the connecting and mounting portion being configured to be connected to the support plate; A column portion, the column portion is arranged on the connecting mounting portion, and the column portion is provided with a mounting groove along the height direction and a guide through hole is provided through the column portion along the length direction, the guide through hole is connected to the mounting groove; A contact portion, the contact portion comprising a contact guide plate and a contact boss, the contact boss being fixedly disposed on one side in a height direction of the contact guide plate, the contact guide plate being inserted into the guide through hole so that the contact boss is located on an open side of the mounting slot; A contact elastic member is provided in the mounting groove and connected to the contact guide plate. The contact guide plate causes the contact boss to expand and contract at the open side of the mounting groove under the elastic force of the contact elastic member.

9. The automated testing device for a semiconductor module according to claim 1, wherein: The support plate is provided with an array consisting of a plurality of threaded holes; The contact structure assembly includes a plurality of contact connectors, each of which includes: A support member, wherein the support member is provided with a waist-shaped adjustment hole; A detection contact docking member, wherein the detection contact docking member is arranged on the support member; The support member is selectively connected to one or two of the plurality of threaded holes by passing a screw through the adjustment waist-shaped hole, so as to adjust the position of the detection contact.

10. A method for testing a semiconductor module, characterized in that: An automated testing device for a semiconductor module according to any one of claims 1 to 9, wherein the testing method comprises: Synchronously pushing the glue-coating pushing mechanism and the support plate to push the glue-coating pushing mechanism away from the detection area; Mounting the semiconductor module on the glue-applying and pushing mechanism outside the detection area so that the detection contacts of the semiconductor module are located directly above the contact structure assembly and the electrode contacts of the semiconductor module are located directly above the energized contact mechanism; Applying a thermal conductive adhesive layer on the upper surface of the semiconductor module; Synchronously pushing the glue-coating pushing mechanism and the support plate into the detection area; The semiconductor module is pressed downward by the liquid cooling plate to move the semiconductor module downward, and the detection contacts of the semiconductor module are docked with the contact structure assembly, and the electrode contacts of the semiconductor module are docked with the power contact mechanism.

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