Vibration-free high and low temperature testing device, system and method
By using semiconductor refrigeration chips to replace moving parts such as air compressors and combining them with air compressor temperature change boxes, a vibration-free high and low temperature testing system is constructed, which solves the vibration problem in the existing technology, realizes efficient high and low temperature performance testing of vibration-sensitive components, improves test stability and reduces costs.
Patent Information
- Application Number
- CN202410642028.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-09-19
AI Technical Summary
Existing high and low temperature test chambers contain moving parts such as air compressors, which cause severe vibration and are not suitable for high and low temperature performance testing of vibration-sensitive MEMS fast-reflection mirrors, optical galvanometers, gyroscopes and other precision electronic components.
Semiconductor refrigeration chips are used to replace air compressors and refrigeration equipment with compressor plus Freon cycle, combined with the air compressor temperature change box to achieve vibration-free high and low temperature testing. The advantages of semiconductor refrigeration chips such as high reliability, long life and no noise are utilized to form a fast and stable testing system.
It realizes high and low temperature performance testing of vibration-sensitive precision electronic components, avoids vibration interference, reduces costs and improves test stability and reliability.
Smart Images
Figure CN120669007A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of measuring devices, and in particular relates to a vibration-free high and low temperature testing device, system and method. Background Art
[0002] High and low temperature testing, also known as high and low temperature cycle testing, is one of the product environmental reliability tests. Basically, all products are stored, preserved, or operated in a certain temperature environment. However, the temperature in some environments will constantly change, sometimes high and sometimes low. For example, in some areas with large temperature differences between day and night, or products repeatedly enter and exit high and low temperature areas during transportation, storage, and operation. The working stability and reliability of electronic products in different environments are crucial to their performance.
[0003] High and low temperature test chambers can help engineers evaluate the performance of electronic products under extreme conditions, such as high and low temperatures, thereby optimizing designs and improving product quality. Most high and low temperature test chambers use air compressors and air circulation to achieve temperature changes. However, due to the presence of moving parts like air compressors, high and low temperature test chambers vibrate severely, making them unsuitable for high and low temperature performance testing of vibration-sensitive components such as MEMS fast-reflection mirrors, optical galvanometers, and gyroscopes. Summary of the Invention
[0004] The present application provides a vibration-free high and low temperature testing device, system and method, which adopts semiconductor refrigeration chips to replace moving parts such as air compressors, refrigeration equipment with compressor plus Freon cycle for cooling, so as to achieve a vibration-free effect, and realize high and low temperature performance testing of precision electronic components sensitive to vibration such as optical galvanometers and gyroscopes. It also combines the advantages of fast temperature change and low cost of the air compressor temperature change box and high reliability, long life, no noise and no maintenance of the semiconductor refrigeration chips to form a fast, stable and vibration-free high and low temperature testing system.
[0005] To achieve one, part, or all of the above purposes or other purposes, the present invention provides a vibration-free high and low temperature testing device, system, and method.
[0006] A vibration-free high and low temperature testing device comprises: a test box, a semiconductor refrigeration plate is fixed on the outside of the test box, and a sample to be tested and a temperature sensing device are placed inside the test box; a support structure supports the test box; and the left and right sides of the test box body are connected to the air pipe.
[0007] A grid heat sink is provided between the support structure and the semiconductor refrigeration plate. The lower side of the semiconductor refrigeration plate is in close contact with the test box, and the upper side is in close contact with the grid heat sink.
[0008] The support structure and the test box each form a lead interface, and a soft rubber plug is provided in the lead interface;
[0009] The temperature sensing device is suspended and fixed inside the test box through the soft rubber plug.
[0010] The sample to be tested is fixed inside the test box via a fixing structure, and the fixing structure is a fixing frame or a copper wire passing through the soft rubber plug.
[0011] A shock-absorbing base is provided at the bottom of the supporting structure.
[0012] The front panel of the test box is made of high-transmittance glass, and the other panels are made of pure copper box panels; a laser and a PSD light receiver are set on the side close to the front panel. The laser generated by the laser passes through the front panel and irradiates the sample to be tested to generate reflected light. The reflected light enters the PSD light receiver for testing optical devices.
[0013] The support structure is a square frame with connection ports on the left and right sides. The air pipe passes through the connection ports and is connected to the test box. The support structure supports the air pipe.
[0014] A vibration-free high and low temperature testing system uses the vibration-free high and low temperature testing device, including: a temperature control module, a testing device and a controller, the testing box is connected to the temperature control module through the air pipe, and the semiconductor refrigeration plate and the temperature sensing device are both connected to the controller.
[0015] The temperature control module includes a temperature-changing box, an air pipe, and an air valve. The temperature-changing box replaces the gas in the test box through the air pipe, and the air valve isolates the replaced gas.
[0016] A vibration-free high and low temperature testing method, using the vibration-free high and low temperature testing system, comprising:
[0017] The sample to be tested is fixed inside the test box, and high light transmittance glass is used as a front panel to seal the test box;
[0018] The temperature-changing box replaces the gas in the test box through the gas pipe, and the gas valve isolates the replaced gas;
[0019] The controller applies voltage to the semiconductor refrigeration chip, and the semiconductor refrigeration chip maintains the temperature of the gas in the test box under the action of the current;
[0020] The temperature sensing device is connected to the controller through the soft rubber plug to transmit the temperature data of the gas in the test box to the controller.
[0021] Compared with the prior art, the beneficial effects of the present invention mainly include:
[0022] 1. This application provides a vibration-free high and low temperature test device that uses semiconductor refrigeration chips to replace moving parts such as air compressors and refrigeration equipment with a compressor plus Freon cycle to cool them, achieving a vibration-free effect and enabling high and low temperature performance testing of vibration-sensitive precision electronic components such as optical galvanometers and gyroscopes;
[0023] 2. This application combines the advantages of the air compressor temperature change box's rapid temperature change and low cost with the semiconductor refrigeration chip's high reliability, long life, no noise, and no maintenance required to form a fast, stable, and vibration-free high and low temperature testing system.
[0024] In order to make the above and other objects, features and advantages of the present invention more clearly understood, preferred embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0026] Figure 1 A schematic structural diagram of a vibration-free high and low temperature testing system provided in an embodiment of the present application.
[0027] Figure 2 A schematic structural diagram of a vibration-free high and low temperature testing device provided in an embodiment of the present application. DETAILED DESCRIPTION
[0028] The foregoing and other technical aspects, features, and functions of the present invention are clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. Directional terms such as up, down, left, right, front, and back, used in the following embodiments, are intended solely to refer to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes only and are not intended to limit the present invention.
[0029] The present application provides a vibration-free high and low temperature testing device, system and method, which adopts semiconductor refrigeration chips to replace moving parts such as air compressors, refrigeration equipment with compressor plus Freon cycle for cooling, so as to achieve a vibration-free effect, and realize high and low temperature performance testing of precision electronic components sensitive to vibration such as optical galvanometers and gyroscopes. It also combines the advantages of fast temperature change and low cost of the air compressor temperature change box and high reliability, long life, no noise and no maintenance of the semiconductor refrigeration chips to form a fast, stable and vibration-free high and low temperature testing system.
[0030] The following detailed description of the various embodiments of the present application is provided in conjunction with the accompanying drawings. However, those skilled in the art will appreciate that many technical details are provided in the various embodiments of the present application to facilitate a better understanding of the present application. However, even without these technical details and the various variations and modifications based on the following embodiments, the technical solutions claimed in the present application can still be implemented.
[0031] like Figure 2 Shown is a structural schematic diagram of a vibration-free high and low temperature testing device provided in an embodiment of the present application.
[0032] like Figure 2 As shown, the test device includes a test box 23, a semiconductor refrigeration plate 21 is fixed on the outside of the test box 23, and a sample 26 to be tested and a temperature sensor 27 are placed inside the test box 23; a support structure 22 supports the test box 23; and the left and right sides of the test box 23 are connected to the air pipe 12.
[0033] As a preferred embodiment of the present invention, the semiconductor refrigeration sheet 21 in this embodiment needs to be tightly attached to the test box 23 to change the temperature of the test box 23, thereby changing the temperature inside the test box 23 and maintaining the required temperature value of the gas inside the test box 23.
[0034] A grid heat sink 24 is provided between the support structure 22 and the semiconductor refrigeration sheet 21 . The lower side of the semiconductor refrigeration sheet 21 is in close contact with the test box 23 , and the upper side is in close contact with the grid heat sink 24 .
[0035] The support structure 22 and the test box 23 each form a lead interface, and a soft rubber plug 28 is provided in the lead interface; the temperature sensing device 27 is suspended and fixed inside the test box 23 through the soft rubber plug 28.
[0036] As a preferred embodiment of the present invention, the temperature sensing device 27 in this embodiment is a thermometer probe, which is a linear PT100 temperature sensing device. The thermometer probe is suspended and fixed inside the pure copper test box 23 through a soft rubber plug 28, and is connected to the controller 3 through the soft rubber plug 28.
[0037] The sample 26 to be tested is fixed inside the test box 23 by a fixing structure, which is a fixing frame or a copper wire passing through a soft rubber plug 28 .
[0038] A shock-absorbing base 25 is provided at the bottom of the supporting structure 22. As a preferred embodiment of the present invention, the shock-absorbing base 25 in this embodiment can use a shock-absorbing mechanism such as a spring or a rubber cushion.
[0039] The front panel of the test box 23 is made of high-transmittance glass, and the other panels are made of pure copper box boards; a laser and a PSD light receiver are set on the side close to the front panel. The laser generated by the laser shines through the front panel onto the sample to be tested 26 to generate reflected light, which enters the PSD light receiver for testing optical devices.
[0040] As a preferred embodiment of the present invention, the test box 23 in this embodiment is made of pure copper panels except the front panel. Copper is an excellent thermal conductive material with a very high thermal conductivity coefficient of up to 401W / mK. It can not only transfer heat quickly, but also has stable thermal conductivity and will not change due to temperature changes.
[0041] The support structure 22 is a square frame with connection ports on the left and right sides. The air pipe 12 passes through the connection ports and is connected to the test box 23 . The support structure 22 supports the air pipe 12 .
[0042] like Figure 1 Shown is a schematic structural diagram of a vibration-free high and low temperature testing system provided in an embodiment of the present application.
[0043] like Figure 1 As shown, a vibration-free high and low temperature testing system uses the above-mentioned vibration-free high and low temperature testing device, including: a temperature control module 1, a testing device 2 and a controller 3, the test box 23 is connected to the temperature control module 1 through the air pipe 12, and the semiconductor refrigeration plate 21 and the temperature sensing device 27 are both connected to the controller 3.
[0044] The temperature control module 1 includes a temperature-changing box 11 , an air pipe 12 and an air valve 13 . The temperature-changing box 11 replaces the gas in the test box 23 through the air pipe 12 , and the air valve 13 isolates the replaced gas.
[0045] As a preferred embodiment of the present invention, the temperature variable box 11 in this embodiment is an air compressor temperature variable box, which is mainly used to generate air at different temperatures and replace the gas in the test box 23 through the air pipe 12. After the replacement is completed, the replaced gas is isolated through the air valve 13.
[0046] As a preferred embodiment of the present invention, the gas valve 13 in this embodiment can be a solenoid valve or a common gas valve manually controlled.
[0047] A vibration-free high and low temperature testing method, using the vibration-free high and low temperature testing system, comprising:
[0048] Step S1: The sample 26 to be tested is fixed inside the test box 23 and the high light transmittance glass is used as the front panel to seal the test box 23;
[0049] Step S2: The temperature-changing box 11 replaces the gas in the test box 23 through the gas pipe 12, and the gas valve 13 isolates the replaced gas;
[0050] Step S3: the controller 3 applies voltage to the semiconductor refrigeration chip 21, and the semiconductor refrigeration chip 21 maintains the temperature of the gas in the test box 23 under the action of the current;
[0051] Step S4 : the temperature sensing device 27 is connected to the controller 3 through the soft rubber plug 28 , and transmits the temperature data of the gas in the test box 23 to the controller 3 .
[0052] In step S3 , the controller 3 is electrically connected to the semiconductor refrigeration chip 21 to provide power to the semiconductor refrigeration chip 21 . The semiconductor refrigeration chip 21 maintains the temperature of the gas in the test box 23 under the action of the current.
[0053] As a preferred embodiment of the present invention, the internal gas temperature of the test box 23 in this embodiment tends to room temperature due to convection and radiation, and the controller 3 applies a positive voltage to the semiconductor refrigeration plate 21 to maintain the required low temperature, and applies a negative voltage to maintain the required high temperature.
[0054] In step S4 , the controller 3 is connected to the temperature sensor 27 via a signal. The temperature sensor 27 collects temperature data of the gas in the test box 23 . The controller 3 continuously reads the temperature data collected by the temperature sensor 27 and controls the temperature to be constant.
[0055] In summary, the present application provides a vibration-free high and low temperature testing device, system and method, which uses semiconductor refrigeration plates to replace moving parts such as air compressors, compressors and Freon cycle refrigeration equipment for cooling, so as to achieve a vibration-free effect, and realize high and low temperature performance testing of precision electronic components that are sensitive to vibration, such as optical galvanometers and gyroscopes. It also combines the advantages of the air compressor temperature change box's fast temperature change and low cost, and the semiconductor refrigeration plates' high reliability, long life, no noise, and no maintenance required, to form a fast, stable, and vibration-free high and low temperature testing system.
[0056] In order to facilitate the description of the present invention, some common English nouns or letters are used for illustrative reference only and are not intended to be restrictive or specific. The scope of protection of the present invention should not be limited by their possible Chinese translations or specific letters.
[0057] It should also be noted that, in this article, relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.
Claims
1. A vibration-free high and low temperature testing device, characterized in that: include: A test box (23) is provided, wherein a semiconductor refrigeration plate (21) is fixed on the outside of the test box (23), and a sample to be tested (26) and a temperature sensing device (27) are placed inside the test box (23); a support structure (22) supports the test box (23); and the left and right sides of the test box (23) are connected to the air pipe (12).
2. A vibration-free high and low temperature testing device according to claim 1, characterized in that: A grid heat sink (24) is provided between the support structure (22) and the semiconductor refrigeration plate (21); the lower side of the semiconductor refrigeration plate (21) is in close contact with the test box (23), and the upper side is in close contact with the grid heat sink (24).
3. The vibration-free high and low temperature testing device according to claim 1, characterized in that: The support structure (22) and the test box (23) each form a lead interface, and a soft rubber plug (28) is provided in the lead interface; The temperature sensing device (27) is suspended and fixed inside the test box (23) via the soft rubber plug (28).
4. The vibration-free high and low temperature testing device according to claim 3, characterized in that: The sample to be tested (26) is fixed inside the test box (23) via a fixing structure, wherein the fixing structure is a fixing frame or a copper wire passing through the soft rubber plug (28).
5. The vibration-free high and low temperature testing device according to claim 1, characterized in that: A shock-absorbing base (25) is provided at the bottom of the support structure (22).
6. The vibration-free high and low temperature testing device according to claim 1, characterized in that: The front panel of the test box (23) is made of high-transmittance glass, and the other panels are made of pure copper box panels; a laser and a PSD light receiver are provided on a side close to the front panel, and the laser light generated by the laser is irradiated onto the sample to be tested (26) through the front panel to generate reflected light, and the reflected light enters the PSD light receiver for testing optical devices.
7. The vibration-free high and low temperature testing device according to claim 1, characterized in that: The support structure (22) is a square frame with connection ports opened on the left and right sides. The air pipe (12) passes through the connection ports and is connected to the test box (23). The support structure (22) supports the air pipe (12).
8. A vibration-free high and low temperature testing system, characterized in that: The vibration-free high and low temperature testing device according to any one of claims 1 to 7 comprises: a temperature control module (1), a testing device (2) and a controller (3); the testing box (23) is connected to the temperature control module (1) through the air pipe (12); the semiconductor refrigeration plate (21) and the temperature sensing device (27) are both connected to the controller (3).
9. The vibration-free high and low temperature testing system according to claim 8, characterized in that: The temperature control module (1) comprises a temperature-changing box (11), an air pipe (12) and an air valve (13); the temperature-changing box (11) replaces the gas in the test box (23) through the air pipe (12); and the air valve (13) isolates the replaced gas.
10. A vibration-free high and low temperature testing method, characterized in that: The vibration-free high and low temperature testing system according to any one of claims 8 to 9 comprises: The sample to be tested (26) is fixed inside the test box (23) and the high light transmittance glass serves as a front panel to seal the test box (23); The temperature-changing box (11) replaces the gas in the test box (23) through the gas pipe (12), and the gas valve (13) isolates the replaced gas; The controller (3) applies voltage to the semiconductor refrigeration chip (21), and the semiconductor refrigeration chip (21) maintains the temperature of the gas in the test box (23) under the action of the current; The temperature sensing device (27) is connected to the controller (3) through the soft rubber plug (28) to transmit the temperature data of the gas in the test box (23) to the controller (3).