Multi-level chain type power turn-off method, device, equipment, medium and program product

Abstract

The invention relates to the technical field of power supplies, and discloses a multi-level chain type power supply turn-off method, device and equipment, a medium and a program product. The method comprises the steps of obtaining a power-on and power-off dependency relationship between a normally-open sub-power-supply domain and a plurality of power-off sub-power-supply domains and a power-on and power-off dependency relationship between the power-off sub-power-supply domains; determining a connection hierarchical relationship between the normally-open sub power supply domain and the plurality of power supply domains capable of dropping electrons and a connection hierarchical relationship between the plurality of power supply domains capable of dropping electrons; wherein the connection hierarchical relationship between the normally-open sub power supply domain and the plurality of disconnectable electronic power supply domains and the connection hierarchical relationship between the plurality of disconnectable electronic power supply domains are used for connecting the normally-open sub power supply domain and the plurality of disconnectable electronic power supply domains; therefore, the sub-power-supply domain of the previous level controls the power-on and power-off of the sub-power-supply domain of the next level in the power-on state. According to the scheme, the chip verification efficiency can be improved, and the standby power consumption of the chip is reduced.

Description

Technical Field

[0001] The present invention relates to the field of power supply technology, and in particular to a multi-level chain power supply shutdown method, device, equipment, medium and program product. Background Art

[0002] A power domain is an area within a chip that is independently powered. Each power domain can be powered up or down independently. An always-on domain (AON) is a power domain that is always on and primarily used to maintain basic chip functions. The AON domain remains powered as long as the chip remains powered up. Power down refers to powering down a power domain. Power down technology divides the chip into multiple power domains, enabling or disabling them independently in different operating scenarios to reduce chip power consumption.

[0003] In related technologies, the power domain is divided into an AON domain and multiple power domains that can be powered off, and the power-on and power-off control logic of the power domain that can be powered off is placed in the AON domain. As the working scenario changes, the power-on and power-off control logic in the AON domain controls each power domain that can be powered off to switch power consumption modes according to different working modes, thereby achieving power-on or power-off operations. However, as the number of power domains that can be powered off increases, the power consumption modes also increase, and the control logic in the AON domain becomes more and more complex, resulting in increased power consumption and an increase in error rate, which in turn affects chip performance. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide a multi-level chain power shutdown method, apparatus, device, medium and program product to solve the problems of high power consumption and high error rate when shutting down the power.

[0005] In a first aspect, the present invention provides a multi-level chained power shutdown method, which is applied to a target power domain, wherein the target power domain includes a normally-on sub-power domain and multiple shut-down electronic power domains; the method includes:

[0006] Obtaining the up / down power dependency relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the up / down power dependency relationship between the multiple droppable electronic power domains;

[0007] Determining, based on the up / down power dependency relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the up / down power dependency relationship between the multiple droppable electronic power domains, a connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and a connection hierarchical relationship between the multiple droppable electronic power domains;

[0008] Among them, the connection hierarchical relationship between the normally-on sub-power domain and the multiple disconnectable electronic power domains, as well as the connection hierarchical relationship between the multiple disconnectable electronic power domains, are used to connect the normally-on sub-power domain and the multiple disconnectable electronic power domains, so that the sub-power domain of the previous level can control the power on and off of the sub-power domain of the next level when in the power-on state.

[0009] In an optional embodiment, the target power domain includes a first droppable electronic power domain; and determining, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains and the upper and lower power dependencies between the multiple droppable electronic power domains, the connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains, and the connection hierarchical relationship between the multiple droppable electronic power domains, includes:

[0010] If the normally-on sub-power domain being in the powered-on state is a necessary condition for the first flip-off electronic power domain to be powered on, then it is determined that the first flip-off electronic power domain is in a lower level than the normally-on sub-power domain.

[0011] In an optional embodiment, the target power domain further includes a power supply;

[0012] The power supply is connected to the first disconnectable electronic power domain via a first power switch;

[0013] The first power switch is electrically connected to the normally-open sub-power domain, and is configured to be closed or opened according to an instruction of the normally-open sub-power domain.

[0014] In an optional embodiment, the normally-on sub-power domain includes a power consumption mode switching module; the power consumption mode switching module is electrically connected to the first power supply switch, and is used to send an instruction corresponding to the current power consumption mode to the first power supply switch, so that the first power supply switch is closed or opened according to the instruction.

[0015] In an optional embodiment, the target power domain includes a second droppable electronic power domain and a third droppable electronic power domain; and determining, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains and the upper and lower power dependencies between the multiple droppable electronic power domains, the connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the connection hierarchical relationship between the multiple droppable electronic power domains includes:

[0016] If the second droppable electronic power domain being in the powered-on state is a necessary condition for the third droppable electronic power domain to be powered on, it is determined that the third droppable electronic power domain is located at a level below the second droppable electronic power domain.

[0017] In an optional embodiment, the power supply is connected to the third disconnectable electronic power domain via a second power switch;

[0018] The second power switch is electrically connected to the second switchable electronic power domain, and is configured to be closed or opened according to an instruction of the second switchable electronic power domain.

[0019] In a second aspect, the present invention provides a multi-level chain power shutdown device, which is applied to a target power domain, wherein the target power domain includes a normally-on sub-power domain and multiple disconnectable electronic power domains; the device includes:

[0020] A dependency module, configured to obtain the power dependency between the normally-on sub-power domain and the multiple droppable electronic power domains and the power dependency between the multiple droppable electronic power domains;

[0021] a hierarchical relationship module, configured to determine a connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains, and a connection hierarchical relationship between the multiple droppable electronic power domains, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, and the upper and lower power dependencies between the multiple droppable electronic power domains;

[0022] Among them, the connection hierarchical relationship between the normally-on sub-power domain and the multiple disconnectable electronic power domains, as well as the connection hierarchical relationship between the multiple disconnectable electronic power domains, are used to connect the normally-on sub-power domain and the multiple disconnectable electronic power domains, so that the sub-power domain of the previous level can control the power on and off of the sub-power domain of the next level when in the power-on state.

[0023] In a third aspect, the present invention provides a computer device comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the computer instructions to thereby execute the multi-level chain power shutdown method of the first aspect or any corresponding embodiment thereof.

[0024] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the multi-level chain power shutdown method of the first aspect or any corresponding embodiment thereof.

[0025] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions for causing a computer to execute the multi-level chain power shutdown method of the first aspect or any corresponding embodiment thereof.

[0026] The technical solution provided by the present invention can have the following beneficial effects:

[0027] The multi-level chain power shutdown method provided by the present invention first obtains the power-up and power-down dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the power-up and power-down dependencies between the multiple droppable electronic power domains. Then, based on the power-up and power-down dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the power-up and power-down dependencies between the multiple droppable electronic power domains, the connection hierarchical relationships between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the connection hierarchical relationships between the multiple droppable electronic power domains, are determined. The connection hierarchical relationships between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the connection hierarchical relationships between the multiple droppable electronic power domains, can be used in actual application scenarios to connect the normally-on sub-power domain and the multiple droppable electronic power domains, so that the sub-power domain of the previous level can control the power-up and power-down of the sub-power domain of the next level when in the powered-on state. The above scheme enables each sub-power domain in the actual application scenario to be powered on and off according to the connection hierarchy relationship, that is, the power on and off of the sub-power domain of the next level is controlled on the premise that the sub-power domain of the previous level is in the powered-on state, thereby avoiding the power on and off control logic of all the electronic power domains that can be turned off being arranged in the normally-on sub-power domain, reducing the logic control complexity and power consumption of the normally-on sub-power domain, which can not only reduce the chip verification complexity and error rate, improve verification efficiency, but also reduce the chip standby power consumption, thereby improving chip performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 A schematic diagram of a power-off structure in the related art is shown;

[0030] Figure 2 is a flow chart of a multi-level chain power shutdown method according to an embodiment of the present invention;

[0031] Figure 3 is a flow chart of another multi-level chain power shutdown method according to an embodiment of the present invention;

[0032] Figure 4 2. It is a schematic diagram of a multi-level chain power shutdown structure according to an embodiment of the present invention;

[0033] Figure 5 is a schematic diagram of another multi-level chain power shutdown structure according to an embodiment of the present invention;

[0034] Figure 6is a structural block diagram of a multi-level chain power shutoff device according to an embodiment of the present invention;

[0035] Figure 7 Schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0037] A power domain is an area within a chip that is independently powered. Each power domain can be powered up or down independently. An always-on domain (AON) is a power domain that is always on and primarily used to maintain basic chip functions. The AON domain remains powered as long as the chip remains powered up. Power down refers to powering down a power domain. Power down technology divides the chip into multiple power domains, enabling or disabling them independently in different operating scenarios to reduce chip power consumption.

[0038] Figure 1 A schematic diagram of a power-off structure in related art is shown. Figure 1 As shown in the figure, the power domain is divided into an AON domain and multiple power domains that can be powered off, and the power-on and power-off control logic of the power domains that can be powered off are all placed in the AON domain. As the working scenario changes, the power-on and power-off control logic in the AON domain controls each power domain that can be powered off to switch the power consumption mode according to the different working modes, thereby realizing power-on or power-off operations. However, as the chip scale increases and the functions become more complex, the number of power domains that can be powered off in the chip increases, and the power consumption modes also increase accordingly. The control logic in the AON domain becomes more and more complex, resulting in increased verification difficulty and increased error rate. At the same time, the complexity of the control logic will also lead to an increase in the power consumption of the AON domain, which will increase the power consumption of the chip in standby mode (that is, the AON domain is powered on and other power domains are powered off). The standby power consumption of the chip is one of the important indicators for measuring chip performance, so the increase in power consumption of the AON domain will affect the chip performance.

[0039] According to an embodiment of the present invention, an embodiment of a multi-level chain power shutdown method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0040] In this embodiment, a multi-level chain power shutdown method is provided, which is applied to a target power domain. The target power domain includes a normally-on sub-power domain and multiple switchable electronic power domains. Figure 2 FIG. 1 is a flow chart of a multi-level chain power shut-down method according to an embodiment of the present invention. Figure 2 As shown, the process includes the following steps:

[0041] Step S201 : obtaining the up / down power dependency relationship between the normally-on sub-power domain and the multiple switchable electronic power domains, and the up / down power dependency relationship between the multiple switchable electronic power domains.

[0042] The target power domain is the power domain in the physical chip that needs to be powered off. For the convenience of description, each power domain in the target power domain is called a sub-power domain. Among them, the normally-on sub-power domain will not be powered off in any operating mode of the target power domain, and each power-off sub-power domain can be powered on and off (powered off) separately.

[0043] To obtain the power-up and power-down dependencies between the always-on sub-power domain and multiple droppable electronic power domains, it is necessary to analyze whether the power-up and power-down of each droppable electronic power domain depends on the always-on sub-power domain. Specifically, the analysis is performed to determine whether the always-on sub-power domain must be powered on when the target droppable electronic power domain is powered on. Similarly, the power-up and power-down dependencies between the always-on sub-power domain and the multiple droppable electronic power domains are obtained. The target droppable electronic power domain is any one of the multiple droppable electronic power domains.

[0044] To obtain the power-on and power-off dependencies between the multiple droppable electronic power domains, it is necessary to analyze whether the power-on and power-off between the droppable electronic power domains are related. Specifically, it is necessary to analyze whether, when a droppable electronic power domain is powered on, it is necessary to rely on the fact that another droppable electronic power domain is in the powered-on state. Similarly, the power-on and power-off dependencies between the multiple droppable electronic power domains are obtained.

[0045] Step S202 , determining a connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains, and a connection hierarchical relationship between the multiple droppable electronic power domains, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, and the upper and lower power dependencies between the multiple droppable electronic power domains.

[0046] Among them, the connection hierarchical relationship between the normally-on sub-power domain and the multiple disconnectable electronic power domains, as well as the connection hierarchical relationship between the multiple disconnectable electronic power domains, are used to connect the normally-on sub-power domain and the multiple disconnectable electronic power domains, so that the sub-power domain of the previous level can control the power on and off of the sub-power domain of the next level when in the power-on state.

[0047] After obtaining the power-up and power-down dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the power-up and power-down dependencies between the multiple droppable electronic power domains, the control logic relationships between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the control logic relationships between the multiple droppable electronic power domains, can be determined based on the power-up and power-down dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, and the power-up and power-down dependencies between the multiple droppable electronic power domains. This allows determining how to specifically connect the normally-on sub-power domain and the multiple droppable electronic power domains. For example, if the power-up and power-down of a first droppable electronic power domain depends on the normally-on sub-power domain, and the power-up and power-down of a second droppable electronic power domain depends on the first droppable electronic power domain, then the normally-on sub-power domain controls the power-up and power-down of the first droppable electronic power domain, and the first droppable electronic power domain controls the power-up and power-down of the second droppable electronic power domain, thereby forming a multi-level, chain-like connection hierarchy relationship. Similarly, the connection hierarchy relationship between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the connection hierarchy relationship between the multiple droppable electronic power domains, is obtained. Among them, a sub-power domain (normally on sub-power domain or removable electronic power domain) of the upper level can control the power on and off of at least one sub-power domain of the lower level. For example, the first removable electronic power domain can separately control the power on and off of the second removable electronic power domain and the third removable electronic power domain.

[0048] After obtaining the connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the connection hierarchical relationship among the multiple droppable electronic power domains, the connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the connection hierarchical relationship among the multiple droppable electronic power domains can be used to connect the sub-power domains of the target power domain in an actual application scenario (for example, in a physical chip), so that the power-on and power-off of each sub-power domain can be controlled according to the connection hierarchical relationship, that is, the power-on and power-off of the sub-power domain of the next level can be controlled on the premise that the sub-power domain of the previous level is in the powered-on state, thereby avoiding the power-on and power-off control logic of all droppable electronic power domains being arranged in the normally-on sub-power domain, reducing the logic control complexity and power consumption of the normally-on sub-power domain, reducing the chip verification complexity and error rate, improving verification efficiency, reducing chip standby power consumption, and thus improving chip performance.

[0049] The multi-level chain power shutdown method provided in this embodiment first obtains the power-up and power-down dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the power-up and power-down dependencies between the multiple droppable electronic power domains. Then, based on the power-up and power-down dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the power-up and power-down dependencies between the multiple droppable electronic power domains, the method determines the connection hierarchical relationships between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the connection hierarchical relationships between the multiple droppable electronic power domains. The connection hierarchical relationships between the normally-on sub-power domain and the multiple droppable electronic power domains, as well as the connection hierarchical relationships between the multiple droppable electronic power domains, can be used in actual application scenarios to connect the normally-on sub-power domain and the multiple droppable electronic power domains, so that the sub-power domain of the previous level, when powered on, controls the power-up and power-down of the sub-power domain of the next level. The above scheme enables each sub-power domain in the actual application scenario to be powered on and off according to the connection hierarchy relationship, that is, the power on and off of the sub-power domain of the next level is controlled on the premise that the sub-power domain of the previous level is in the powered-on state, thereby avoiding the power on and off control logic of all the electronic power domains that can be turned off being arranged in the normally-on sub-power domain, reducing the logic control complexity and power consumption of the normally-on sub-power domain, which can not only reduce the chip verification complexity and error rate, improve verification efficiency, but also reduce the chip standby power consumption, thereby improving chip performance.

[0050] In this embodiment, a multi-level chain power shutdown method is provided, which is applied to a target power domain. The target power domain includes a normally-on sub-power domain and multiple switchable electronic power domains. Figure 3 FIG. 1 is a flow chart of a multi-level chain power shut-down method according to an embodiment of the present invention. Figure 3 As shown, the process includes the following steps:

[0051] Step S301 : obtaining the up / down power dependency relationship between the normally-on sub-power domain and the multiple switchable electronic power domains, and the up / down power dependency relationship between the multiple switchable electronic power domains.

[0052] For details, please see Figure 2 Step S201 of the illustrated embodiment will not be described in detail here.

[0053] Step S302 , determining a connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains, and a connection hierarchical relationship between the multiple droppable electronic power domains, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, and the upper and lower power dependencies between the multiple droppable electronic power domains.

[0054] Specifically, the power-on and power-off dependencies between the normally-on sub-power domain and multiple removable electronic power domains are determined. Taking the first removable electronic power domain among the multiple removable electronic power domains as an example, if the normally-on sub-power domain being in a powered-on state is a necessary condition for the first removable electronic power domain to be powered on, then the first removable electronic power domain is determined to be at the next level below the normally-on sub-power domain.

[0055] The power-on and power-off dependencies between multiple removable electronic power domains are as follows: taking the second and third removable electronic power domains among the multiple removable electronic power domains as an example, if the second removable electronic power domain being in a powered-on state is a necessary condition for the third removable electronic power domain to be powered on, then the third removable electronic power domain is determined to be at a level below the second removable electronic power domain.

[0056] Furthermore, the normally-on sub-power domain can independently control the power on and off of multiple removable electronic power domains at the same time. For example, if the normally-on sub-power domain being in the powered-on state is a necessary condition for the second removable electronic power domain to be powered on, then the second removable electronic power domain is determined to be at the next level of the normally-on sub-power domain, that is, the first removable electronic power domain and the second removable electronic power domain are at the same level, and the power on and off control of the first removable electronic power domain by the normally-on sub-power domain and the power on and off control of the second removable electronic power domain by the normally-on sub-power domain are in parallel and do not interfere with each other.

[0057] A removable electronic power domain can independently control the power on and off of multiple other removable electronic power domains simultaneously. For example, if the second removable electronic power domain being in the powered-on state is a prerequisite for the fourth removable electronic power domain to be powered on, then the fourth removable electronic power domain is determined to be at the next level below the second removable electronic power domain. That is, the third and fourth removable electronic power domains are at the same level. The power on and off control of the third and fourth removable electronic power domains by the second removable electronic power domain are parallel and do not interfere with each other.

[0058] It should be noted that in the actual application scenario of this embodiment, there is no situation where multiple upper-level sub-power domains jointly control the power on and off of the same lower-level sub-power domain.

[0059] Among them, the connection hierarchical relationship between the normally-on sub-power domain and the multiple disconnectable electronic power domains, as well as the connection hierarchical relationship between the multiple disconnectable electronic power domains, are used to connect the normally-on sub-power domain and the multiple disconnectable electronic power domains, so that the sub-power domain of the previous level can control the power on and off of the sub-power domain of the next level when in the power-on state.

[0060] Specifically, taking the connection between the normally-on sub-power domain and the first removable electronic power domain as an example, the target power domain also includes a power supply, which is connected to the first removable electronic power domain through a first power switch. The first power switch is electrically connected to the normally-on sub-power domain and is used to close or open according to the instructions of the normally-on sub-power domain to switch the power consumption mode of the first removable electronic power domain. When the first power switch is closed, the first removable electronic power domain is powered on, and when the first power switch is opened, the first removable electronic power domain is powered off.

[0061] Optionally, the normally-on sub-power domain includes a power consumption mode switching module, which is electrically connected to the first power switch and is used to send an instruction corresponding to the current power consumption mode to the first power switch so that the first power switch is closed or opened according to the instruction.

[0062] The connection between multiple removable electronic power domains takes the second removable electronic power domain and the third removable electronic power domain as an example. The power supply is connected to the third removable electronic power domain through a second power switch. The second power switch is electrically connected to the second removable electronic power domain and is used to close or open according to the instruction of the second removable electronic power domain to switch the power consumption mode of the third removable electronic power domain. When the second power switch is closed, the third removable electronic power domain is powered on, and when the second power switch is opened, the third removable electronic power domain is powered off.

[0063] Optionally, the second switchable electronic power domain includes a power consumption mode switching module, which is electrically connected to the second power supply switch and is used to send an instruction corresponding to the current power consumption mode to the second power supply switch so that the second power supply switch is closed or opened according to the instruction.

[0064] Step S303 : generating a strategy for controlling power on and off of the target sub-power domain based on the connection hierarchical relationship of each sub-power domain in the target power domain.

[0065] For example, if it is necessary to control the power on and off of the first removable electronic power domain, based on the connection hierarchical relationship of the sub-power domains in the target power domain, it can be known that the upper level of the first removable electronic power domain is the normally-on sub-power domain, and a first strategy for controlling the power on and off of the first removable electronic power domain can be generated. The first strategy is used to indicate how to control the power on and off of the first removable electronic power domain. Specifically, the first strategy indicates controlling the power on and off of the first removable electronic power domain through the normally-on sub-power domain. The user can control the power on and off of the first removable electronic power domain in the actual chip according to the strategy, for example, sending a control instruction to the normally-on sub-power domain so that the normally-on sub-power domain sends a close / open instruction to the first power switch, and then the first power switch is closed / opened, and the first removable electronic power domain is powered on / off.

[0066] If powering on or off the third removable electronic power domain is required, based on the hierarchical connection relationship between the sub-power domains in the target power domain, it can be determined that the third removable electronic power domain is directly above the second removable electronic power domain. The prerequisite for powering on or off the third removable electronic power domain is that the second removable electronic power domain is powered on. Therefore, a second policy for controlling powering on or off the third removable electronic power domain can be generated. This second policy indicates that powering on or off the third removable electronic power domain should be controlled through the second removable electronic power domain. Users can then power on or off the third removable electronic power domain in the actual chip based on this second policy. For example, a control instruction can be sent to the second removable electronic power domain, causing it to send a close / open instruction to the second power switch, which in turn closes / opens the second power switch and powers on or off the third removable electronic power domain.

[0067] As one or more specific application examples of the embodiments of the present invention, the optimal implementation scheme or the solution that the inventor most wants to embody is described below in combination with specific application scenarios.

[0068] Figure 4 1 is a schematic diagram of a multi-level chain power shutdown structure according to an embodiment of the present invention. Figure 4 As shown in the figure, except for the AON domain, all other power domains are powered on or off based on changes in the application scenario. By analyzing the application scenarios, it can be concluded that when power domains 3 and 5 are powered, power domain 1 is always powered. Based on this, the power-on and power-off control logic for power domains 3 and 5 can be moved from the AON domain to power domain 1. Similarly, the power-on and power-off control logic for power domains 4 and 6 can be moved from the AON domain to power domain 2. With this process, the power-on and power-off control logic within the AON domain only needs to control the power-on and power-off of power domains 1 and 2, thereby simplifying the power-on and power-off control logic and reducing the power consumption of the AON domain.

[0069] For application scenarios with more power domains, the same approach can be used to simplify the power-on and power-off control logic. Figure 5 FIG. 1 is another schematic diagram of a multi-level chain power shutdown structure according to an embodiment of the present invention. Figure 5 As shown, the AON domains control the power on and off of power domains 1 and 2 respectively. Power domain 1 controls the power on and off of power domains 3, 5, and 7 respectively. Power domain 5 controls the power on and off of power domain 8, and so on. This is not repeated here. It can be seen that the power shutdown structure of each power domain is a multi-level chain structure. The more power domains there are, the more obvious the multi-level chain power shutdown structure is in simplifying the power on and off control logic and reducing the chip's standby power consumption.

[0070] This embodiment also provides a multi-level chain-type power shutdown device for implementing the above-mentioned embodiments and preferred implementations. Details already described will not be repeated here. As used below, the term "module" may refer to a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware, is also possible and contemplated.

[0071] This embodiment provides a multi-level chain power shutdown device, which is applied to a target power domain. The target power domain includes a normally open sub-power domain and multiple disconnectable electronic power domains, such as Figure 6 As shown, the device includes:

[0072] A dependency module 601 is configured to obtain a power dependency relationship between the normally-on sub-power domain and the multiple droppable electronic power domains, and a power dependency relationship between the multiple droppable electronic power domains.

[0073] A hierarchical relationship module 602 is configured to determine a connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains, and a connection hierarchical relationship between the multiple droppable electronic power domains, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, and the upper and lower power dependencies between the multiple droppable electronic power domains;

[0074] Among them, the connection hierarchical relationship between the normally-on sub-power domain and the multiple disconnectable electronic power domains, as well as the connection hierarchical relationship between the multiple disconnectable electronic power domains, are used to connect the normally-on sub-power domain and the multiple disconnectable electronic power domains, so that the sub-power domain of the previous level can control the power on and off of the sub-power domain of the next level when in the power-on state.

[0075] In an optional embodiment, the target power domain includes a first removable electronic power domain; and the hierarchical relationship module is further configured to:

[0076] If the normally-on sub-power domain being in the powered-on state is a necessary condition for the first flip-off electronic power domain to be powered on, then it is determined that the first flip-off electronic power domain is in a lower level than the normally-on sub-power domain.

[0077] In an optional embodiment, the target power domain further includes a power supply;

[0078] The power supply is connected to the first disconnectable electronic power domain via a first power switch;

[0079] The first power switch is electrically connected to the normally-open sub-power domain, and is configured to be closed or opened according to an instruction of the normally-open sub-power domain.

[0080] In an optional embodiment, the normally-on sub-power domain includes a power consumption mode switching module; the power consumption mode switching module is electrically connected to the first power supply switch, and is used to send an instruction corresponding to the current power consumption mode to the first power supply switch, so that the first power supply switch is closed or opened according to the instruction.

[0081] In an optional implementation, the target power domain includes a second droppable electronic power domain and a third droppable electronic power domain; and the hierarchical relationship module is further configured to:

[0082] If the second droppable electronic power domain being in the powered-on state is a necessary condition for the third droppable electronic power domain to be powered on, it is determined that the third droppable electronic power domain is located at a level below the second droppable electronic power domain.

[0083] In an optional embodiment, the power supply is connected to the third disconnectable electronic power domain via a second power switch;

[0084] The second power switch is electrically connected to the second disconnectable electronic power domain, and is configured to be closed or disconnected according to an instruction from the second disconnectable electronic power domain.

[0085] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0086] The multi-level chain power shutdown device in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0087] The embodiment of the present invention also provides a computer device having the above Figure 6 The multi-level chain power shutdown device shown.

[0088] See also Figure 7 , Figure 7 is a structural diagram of a computer device provided by an optional embodiment of the present invention, such as Figure 7As shown, the computer device includes: one or more processors 10, memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components utilize different buses to communicate with each other and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in the memory or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Equally, multiple computer devices can be connected, and each device provides part of the necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 7 A processor 10 is taken as an example.

[0089] The processor 10 may be a central processing unit, a network processor, or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic, or any combination thereof.

[0090] The memory 20 stores instructions that can be executed by at least one processor 10, so that the at least one processor 10 executes the method shown in the above embodiment.

[0091] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created based on the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely located relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0092] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0093] The computer device also includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30 and the output device 40 can be connected via a bus or other means. Figure 7 The bus connection is taken as an example.

[0094] The input device 30 can receive input digital or character information and generate key signal input related to user settings and function control of the computer device, such as a touch screen, a keypad, a mouse, a trackpad, a touch pad, an indicator stick, one or more mouse buttons, a trackball, a joystick, etc. The output device 40 can include a display device, an auxiliary lighting device (e.g., an LED), and a tactile feedback device (e.g., a vibration motor). The above-mentioned display device includes but is not limited to a liquid crystal display, a light emitting diode, a display, and a plasma display. In some optional embodiments, the display device can be a touch screen.

[0095] The embodiment of the present invention also provides a computer-readable storage medium. The above-mentioned method according to the embodiment of the present invention can be implemented in hardware, firmware, or implemented as a computer code that can be recorded in a storage medium, or implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and downloaded through a network and will be stored in a local storage medium, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state drive, etc.; further, the storage medium can also include a combination of the above-mentioned types of memory. It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor or hardware, the method shown in the above embodiment is implemented.

[0096] A portion of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the form in which the computer program instruction exists in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc. Accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium that can be accessed by the computer.

[0097] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations shall fall within the scope of protection of the present invention.

Claims

1. A multi-level chain power shutdown method, characterized in that: Applied to a target power domain, the target power domain includes a normally-on sub-power domain and multiple disconnectable electronic power domains; the method includes: Obtaining the up / down power dependency relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the up / down power dependency relationship between the multiple droppable electronic power domains; Determining, based on the up / down power dependency relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the up / down power dependency relationship between the multiple droppable electronic power domains, a connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and a connection hierarchical relationship between the multiple droppable electronic power domains; Among them, the connection hierarchical relationship between the normally-on sub-power domain and the multiple disconnectable electronic power domains, as well as the connection hierarchical relationship between the multiple disconnectable electronic power domains, are used to connect the normally-on sub-power domain and the multiple disconnectable electronic power domains, so that the sub-power domain of the previous level can control the power on and off of the sub-power domain of the next level when in the power-on state.

2. The method according to claim 1, characterized in that The target power domain includes a first droppable electronic power domain; and determining, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains and the upper and lower power dependencies between the multiple droppable electronic power domains, the connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the connection hierarchical relationship between the multiple droppable electronic power domains, comprises: If the normally-on sub-power domain being in the powered-on state is a necessary condition for the first flip-off electronic power domain to be powered on, then it is determined that the first flip-off electronic power domain is in a lower level than the normally-on sub-power domain.

3. The method according to claim 2, characterized in that The target power domain also includes a power supply; The power supply is connected to the first disconnectable electronic power domain via a first power switch; The first power switch is electrically connected to the normally-open sub-power domain, and is configured to be closed or opened according to an instruction of the normally-open sub-power domain.

4. The method according to claim 3, characterized in that The normally-on sub-power domain includes a power consumption mode switching module; the power consumption mode switching module is electrically connected to the first power switch, and is used to send an instruction corresponding to the current power consumption mode to the first power switch, so that the first power switch is closed or opened according to the instruction.

5. The method according to claim 4, characterized in that The target power domain includes a second droppable electronic power domain and a third droppable electronic power domain; and determining, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains and the upper and lower power dependencies between the multiple droppable electronic power domains, the connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains and the connection hierarchical relationship between the multiple droppable electronic power domains, includes: If the second droppable electronic power domain being in the powered-on state is a necessary condition for the third droppable electronic power domain to be powered on, it is determined that the third droppable electronic power domain is located at a level below the second droppable electronic power domain.

6. The method according to claim 5, characterized in that The power supply is connected to the third disconnectable electronic power domain via a second power switch; The second power switch is electrically connected to the second switchable electronic power domain, and is configured to be closed or opened according to an instruction of the second switchable electronic power domain.

7. A multi-level chain power shutoff device, characterized in that: Applicable to a target power domain, the target power domain includes a normally-on sub-power domain and multiple disconnectable electronic power domains; the device includes: A dependency module, configured to obtain the power dependency between the normally-on sub-power domain and the multiple droppable electronic power domains and the power dependency between the multiple droppable electronic power domains; a hierarchical relationship module, configured to determine a connection hierarchical relationship between the normally-on sub-power domain and the multiple droppable electronic power domains, and a connection hierarchical relationship between the multiple droppable electronic power domains, based on the upper and lower power dependencies between the normally-on sub-power domain and the multiple droppable electronic power domains, and the upper and lower power dependencies between the multiple droppable electronic power domains; Among them, the connection hierarchical relationship between the normally-on sub-power domain and the multiple disconnectable electronic power domains, as well as the connection hierarchical relationship between the multiple disconnectable electronic power domains, are used to connect the normally-on sub-power domain and the multiple disconnectable electronic power domains, so that the sub-power domain of the previous level can control the power on and off of the sub-power domain of the next level when in the power-on state.

8. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the multi-level chain power shutdown method according to any one of claims 1 to 6 by executing the computer instructions.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the multi-level chain power shutdown method according to any one of claims 1 to 6.

10. A computer program product, characterized in that The method comprises computer instructions for causing a computer to execute the multi-level chain power shutdown method according to any one of claims 1 to 6.

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