Copper cover plate for vacuum impregnation of high-temperature superconducting magnet

Abstract

The invention discloses a copper cover plate for vacuum impregnation of a high-temperature superconducting magnet, which is characterized in that a plurality of step structures are arranged on a first surface of the copper cover plate along the length direction of the copper cover plate at first intervals, and the step structures are single-rounded rectangular step structures; the long edge direction of the single-rounded-corner rectangular step structure is parallel to the width direction of the copper cover plate, the width direction of the single-rounded-corner rectangular step structure is parallel to the length direction of the copper cover plate, and the linear short edge of the single-rounded-corner rectangular step structure is aligned to one long edge of the copper cover plate; a plurality of through holes are arranged at second intervals along the length direction of the copper cover plate. The copper cover plate for the vacuum impregnation of the high-temperature superconducting magnet can improve the fluidity of an impregnation material, can assist in vacuumizing and discharging soldering flux, can form certain gaps in the vacuum impregnation process, generates a capillary phenomenon, is beneficial to the flowing and rapid impregnation of the impregnation material, and improves the vacuum impregnation efficiency of the high-temperature superconducting magnet. And after vacuum impregnation is completed, the impregnation effect after the copper cover plate covers the high-temperature superconducting tape can be conveniently judged.

Description

Technical Field

[0001] The invention belongs to the field of superconducting magnets, in particular to a copper cover plate for vacuum impregnation of high-temperature superconducting magnets. Background Art

[0002] The mainstream technical route for magnetic confinement nuclear fusion is the superconducting tokamak device, which includes three types of superconducting magnets, namely toroidal magnets (TF magnets), poloidal magnets (PF magnets) and central solenoid magnets (CS). Among them, TF magnets are used to provide a stable toroidal magnetic field for plasma operation. Currently, low-temperature TF magnets using NbTi (niobium titanium) and Nb3Sn (niobium tin) wires generally use insulating magnets impregnated with epoxy.

[0003] Commonly used high-temperature superconducting (TF) magnets generally use uninsulated coils wound with second-generation high-temperature superconducting tapes, which are made by vacuum impregnation using low-melting-point alloy materials such as indium tin or lead tin. Since the magnetic induction intensity of high-temperature superconducting TF magnets during operation can be greater than 20T, good contact must be maintained between multiple strands of tape and between the tape and the magnet skeleton. In addition, in order to completely fix the high-temperature superconducting tape in the magnet skeleton slots, a copper cover plate of a certain thickness needs to be placed on the tape. However, existing copper cover plates generally have the problem of poor impregnation effect due to poor flow of the impregnating material during vacuum impregnation. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a copper cover plate for vacuum impregnation of high-temperature superconducting magnets. A plurality of step structures are arranged on a first surface of the copper cover plate along the length direction of the copper cover plate at first intervals.

[0005] Furthermore, the height of the step structure is 2 / 3 of the thickness of the copper cover plate.

[0006] Furthermore, the height of the step structure is 0.5-1 mm.

[0007] Furthermore, the step structure is a single rounded rectangular step structure.

[0008] Furthermore, the long side of the single rounded rectangular step structure is parallel to the width direction of the copper cover plate, the width direction is parallel to the length direction of the copper cover plate, and the straight short side of the single rounded rectangular step structure is aligned with a long side of the copper cover plate.

[0009] Furthermore, a plurality of through holes are provided at second intervals along the length direction of the copper cover plate.

[0010] Furthermore, the through hole is a circular through hole.

[0011] Compared with the prior art, the copper cover plate provided by the present invention for vacuum impregnation of high-temperature superconducting magnets has a first surface on which a plurality of step structures are arranged at first intervals along the length direction of the copper cover plate to improve the fluidity of the impregnating material and to assist in vacuum extraction and flux discharge; a plurality of through holes are arranged at second intervals along the length direction of the copper cover plate, so that certain gaps can be formed during the vacuum impregnation process, generating a capillary phenomenon, which facilitates the flow of the impregnating material and rapid impregnation. In addition, after the vacuum impregnation is completed, the impregnation effect after the copper cover plate covers the high-temperature superconducting tape can be easily judged. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A schematic diagram of a first surface of a copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to an embodiment of the present invention is shown; Figure 2 A schematic diagram of a second surface of a copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to a second embodiment of the present invention is shown; Description of main reference numerals: 1: copper cover plate, 11: first surface, 12: second surface, 2: step structure, 3: through hole. DETAILED DESCRIPTION

[0013] The following is a detailed description of specific embodiments of the present invention. It should be understood that the embodiments of the present invention are not limited to the embodiments shown in the accompanying drawings, and the scope of protection of the present invention is not limited by the specific embodiments. The terms "first," "second," and similar terms used in the present invention do not indicate any order, quantity, or importance, but are only used to distinguish different components. Similarly, terms such as "one," "an," or "the" do not indicate a quantitative limitation, but rather indicate the presence of at least one. Unless otherwise expressly indicated, throughout the specification and claims, the term "comprise" or variations such as "include" or "comprising" will be understood to include the elements or components stated, without excluding other elements or components. Terms such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0014] Unless otherwise defined, the meanings of all technical terms and scientific terms used in the present invention are the same as those commonly understood by ordinary technicians in the field. In addition, the meanings of the technical terms and scientific terms used in the present invention should be interpreted as having the same meanings as the corresponding terms defined in commonly used technical manuals, and should not be interpreted as having idealized or excessive formal meanings, unless explicitly defined in this way in the present invention.

[0015] Figure 1 A schematic diagram of the first surface of a copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to the first embodiment of the present invention is shown. Figure 1 On a first surface 11 of the copper cover plate 1 for vacuum impregnation of the high-temperature superconducting magnet (i.e., the surface facing the high-temperature superconducting tape during vacuum impregnation), a plurality of stepped structures 2 are provided at first intervals along the length of the copper cover plate 1. In this embodiment, the copper cover plate 1 is an elongated strip, having the same shape as the high-temperature superconducting tape to be covered.

[0016] By arranging a plurality of step structures 2 at intervals along the length direction of the copper cover plate 1, the fluidity of the impregnating material can be improved, and the plurality of step structures 2 can help to evacuate the vacuum and discharge the flux during the vacuum impregnation process of the high-temperature superconducting magnet.

[0017] Specifically, the height of the step structure 2 is 2 / 3 of the thickness of the copper cover plate 1 .

[0018] Furthermore, the height of the step structure 2 is 0.5-1 mm.

[0019] By setting the height of the step structure 2 to 2 / 3 of the thickness of the copper cover plate 1, or even 0.5-1 mm, the fluidity of the impregnating material and the vacuuming and flux removal effects during vacuum impregnation can be guaranteed, and the weight of the copper cover plate 1 can be ensured not to be too heavy and the volume can be ensured not to be too large; and setting the height of the step structure 2 to 2 / 3 of the thickness of the copper cover plate 1, or even 0.5-1 mm, can also ensure that the step structure 2 is firmly connected to the copper cover plate 1, ensuring stability during impregnation.

[0020] Specifically, the step structure 2 is a single rounded rectangular step structure, which can better reduce flow resistance and improve the effects of vacuuming and flux removal.

[0021] Furthermore, the long side of the single rounded rectangular step structure 2 is parallel to the width direction of the copper cover plate 1 , and the width direction is parallel to the length direction of the copper cover plate 1 , and the straight short side of the single rounded rectangular step structure 2 is aligned with a long side of the copper cover plate 1 .

[0022] Further, see Figure 1 、 Figure 2 On the copper cover plate 1 for vacuum impregnation of the high-temperature superconducting magnet, a plurality of through holes 3 are arranged at second intervals along the length direction of the copper cover plate 1, penetrating the first surface 11 and the second surface 12 (i.e., the surface facing away from the high-temperature superconducting tape during vacuum impregnation).

[0023] Furthermore, from the perspective of force, in order to avoid stress concentration to the greatest extent possible, the through hole 3 is a circular through hole.

[0024] By arranging a plurality of through holes 3 at a second interval along the length direction of the copper cover plate 1, a certain gap can be formed during the vacuum impregnation process, generating a capillary phenomenon, which facilitates the flow of the impregnating material and rapid impregnation; in addition, after the vacuum impregnation is completed, the impregnation effect of the copper cover plate 1 after covering the high-temperature superconducting tape can be easily determined through the through holes 3.

[0025] In summary, the copper cover plate 1 for vacuum impregnation of high-temperature superconducting magnets provided by the present invention has a first surface 11 on which a plurality of step structures 2 are arranged at first intervals along the length direction of the copper cover plate 1 to improve the fluidity of the impregnating material and help to draw a vacuum and discharge the flux; a plurality of through holes 3 are arranged at second intervals along the length direction of the copper cover plate 1, so that certain gaps can be formed during the vacuum impregnation process, generating a capillary phenomenon, which is conducive to the flow of the impregnating material and rapid impregnation. In addition, after the vacuum impregnation is completed, the impregnation effect after the copper cover plate 1 covers the high-temperature superconducting tape can be easily judged.

[0026] The foregoing descriptions of specific exemplary embodiments of the present invention are for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that many modifications and variations are possible in light of the foregoing teachings. The exemplary embodiments have been selected and described for the purpose of explaining the specific principles of the invention and their practical application, thereby enabling those skilled in the art to make and utilize a variety of exemplary embodiments of the invention and various options and variations. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A copper cover plate for vacuum impregnation of high-temperature superconducting magnets, characterized in that: On the first surface (11) of the copper cover plate (1), a plurality of step structures (2) are arranged at first intervals along the length direction of the copper cover plate.

2. The copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to claim 1, characterized in that: The height of the step structure (2) is 2 / 3 of the thickness of the copper cover plate (1).

3. The copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to claim 1, characterized in that: The height of the step structure (2) is 0.5-1 mm.

4. The copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to claim 1, characterized in that: The step structure (2) is a single rounded rectangular step structure.

5. The copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to claim 4, characterized in that: The long side direction of the single rounded rectangular step structure is parallel to the width direction of the copper cover plate (1), and the width direction is parallel to the length direction of the copper cover plate (1). The straight short side of the single rounded rectangular step structure is aligned with a long side of the copper cover plate (1).

6. The copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to any one of claims 1 to 5, characterized in that: A plurality of through holes (3) are arranged at second intervals along the length direction of the copper cover plate (1).

7. The copper cover plate for vacuum impregnation of a high-temperature superconducting magnet according to claim 6, characterized in that: The through hole (3) is a circular through hole.

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