Jig for lead frame and etching method of lead frame
By using a vacuum pump and support blocks of a support frame to fix and support the lead frame during the etching process, the problem of etching damage caused by lack of support for the base island is solved, and a more stable etching effect is achieved.
Patent Information
- Application Number
- CN202511033420.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-25
- Publication Date
- 2025-09-19
AI Technical Summary
During the lead frame etching process, the lack of support on the base island causes the etching liquid to spray or the mechanical vibration to generate impact force, which damages the base island.
A fixture is used, including an etching table, a vacuum pump and a support frame. The lead frame is fixed by adsorption by the vacuum pump, and the base island is supported by the support block of the support frame to improve etching stability.
The base island at the bottom of the lead frame is supported by the support blocks of the support frame, thereby improving the stability of etching and avoiding damage to the base island.
Smart Images
Figure CN120674322A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of lead frames, in particular to a jig for lead frames and an etching method for lead frames. Background Art
[0002] As electronic products such as mobile phones and laptops develop towards miniaturization, portability, ultra-thinness, multimedia, and the low-cost requirements required by mass consumption, the lead frame needs to be partially masked during etching or electroplating, while others need to be exposed to facilitate the next process. This is typically done using dry film exposure and development technology, with the main steps being lamination, exposure, development, windowing, chemical etching, and film stripping. The dry film protects the frame, while chemical etching exposes the chip-carrying island formed within the metal sheet of the lead frame, along with the external pins connected to the external circuit board. Alternatively, a carrier and tape can be used to apply tape to the areas that need to be masked, which is then removed after the etching or electroplating process.
[0003] In the prior art, when etching a lead frame, the lead frame is first positioned using a positioning structure, and then etching is performed. When etching the base island of the lead frame, the bottom lacks support, which may cause the etching liquid to spray or mechanical vibration to generate impact force and damage the base island. For this reason, the present invention proposes a jig for a lead frame and a method for etching a lead frame to solve the above-mentioned technical problems. Summary of the Invention
[0004] An object of the present invention is to provide a jig for a lead frame and an etching method for a lead frame to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a jig for a lead frame and a method for etching a lead frame, wherein the jig for a lead frame and the method for etching a lead frame comprise: an etching table, a placement groove is provided at the bottom of the etching table, a vacuum pump is provided in the placement groove, an adsorption platform is provided on the surface of the etching table, adsorption holes are provided on the surface of the adsorption platform, an adsorption tube is provided in the adsorption hole, a connecting tube is provided at one end of the adsorption tube, the vacuum pump is connected to the connecting tube via a pipeline, a lead frame is placed on the surface of the adsorption platform, and a base island is etched on the surface of the lead frame; The support frame is provided with a positioning screw at the bottom of the support frame, a positioning nut is screwed on the surface of the positioning screw, a threaded hole is opened on the surface of the support frame, a lifting screw is screwed in the threaded hole, and a support block is provided on the surface of the lifting screw.
[0006] Preferably, the vacuum pump is fixedly connected to the inner surface of the placement groove by positioning bolts. Multiple groups of adsorption holes are provided, and the multiple groups of adsorption holes are linearly arranged at equal intervals on the surface of the adsorption platform. The adsorption tubes are all inserted into the adsorption holes. Fixing card slots are provided on the side of the placement groove, and two groups of fixing card slots are provided. The two groups of fixing card slots are symmetrically distributed with respect to the placement groove.
[0007] Preferably, fixing seats are provided on the surface of the connecting pipe. Two groups of connecting pipes are provided, and the two groups of connecting pipes are fixedly connected to the surface of the fixing seat. A bottom plate is provided on the surface of the fixing seat. The bottom plate is in the shape of a square plate. A moving groove is provided on the surface of the bottom plate. A support rod is provided at the end face of the moving groove. Two groups of bottom plates are provided, and the two groups of bottom plates are symmetrically distributed with respect to the long side center line on the surface of the fixing seat.
[0008] Preferably, a limiting spring and a positioning block are sleeved on the surface of the support rod. A fixing card plate is provided on the side of the positioning block. One end of the fixing card plate is inserted into the fixing card slot. One end of the limiting spring is fixedly connected to the side of the positioning block, and the other end of the limiting spring is fixedly connected to the end face of the moving groove. The positioning block is slidably connected to the surface of the support rod.
[0009] Preferably, the adsorption platform is integrally in the shape of a "C"-shaped plate structure. Guide grooves are provided on the side of the adsorption platform. Two groups of guide grooves are provided, and the two groups of guide grooves are symmetrically distributed with respect to the long side center line of the end face of the adsorption platform. A traction groove is provided on the surface of one group of guide grooves. The length of the long side of the side of the traction groove is the same as the length of the long side of the side of the guide groove. The adsorption platform is fixedly connected to the surface of the etching table.
[0010] Preferably, the positioning screw rod is fixedly connected to the bottom of the support frame. The positioning screw rod passes through the traction groove, and the positioning screw rod is slidably connected to the traction groove. One end of the support frame is inserted into the guide groove, and the support frame is slidably connected to the guide groove. Multiple groups of support frames are provided, and one ends of the multiple groups of support frames are all inserted into the guide groove.
[0011] Preferably, the support block is fixedly connected to the surface of the lifting screw rod. The support block is in the shape of a circular plate structure. A buffer groove is provided on the surface of the support block. The buffer groove is in the shape of a circular plate structure.
[0012] Preferably, a buffer spring is provided on the surface of the buffer groove. One end of the buffer spring is fixedly connected to the surface of the buffer groove, and the other end of the buffer spring is fixedly connected to a buffer rod.
[0013] Preferably, a damping sleeve is sleeved on the surface of the buffer rod. The outer ring surface of the damping sleeve contacts the side of the buffer groove. An auxiliary block is provided on the surface of the buffer rod. The auxiliary block is in the shape of a circular plate structure.
[0014] The etching method for the fixture for the lead frame specifically includes the following steps: S1: First, the support frame is displaced, and then fixed with a positioning nut and a positioning screw so that the support block is located directly below the base island to be etched; S2: The lead frame to be etched is then placed on the adsorption platform, and the vacuum pump is started so that the adsorption tube and the connecting tube generate suction to adsorb and fix the lead frame; S3: Finally, when the lead frame etching is completed, the vacuum pump is turned off to make the adsorption tube lose suction, and then the etched lead frame can be removed. Compared with the prior art, the present invention has the following beneficial effects: The jig for a lead frame and the etching method for a lead frame proposed in the present invention first loosen the positioning nut and then adjust the displacement of the support frame. The support frame can be adjusted according to the number of base islands. After the support frame is adjusted appropriately, the positioning nut is tightened to fix the support frame. Then, a vacuum pump is used in conjunction with an adsorption tube to fix the lead frame on the surface of the adsorption platform. Then, a support block is provided above the support frame to support the base island portion below the lead frame, so as to facilitate supporting the bottom of the lead frame during subsequent etching and improve the stability of etching the lead frame. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the structure of the present invention when tilted; Figure 3 for Figure 2 A in the middle is an enlarged structural diagram; Figure 4 It is a side view of the structure of the present invention; Figure 5 for Figure 4 The enlarged structural diagram at B in the middle; Figure 6 This is a schematic diagram of the adsorption platform structure of the present invention; Figure 7 This is a structural schematic diagram of the adsorption platform of the present invention when it is tilted; Figure 8 for Figure 7 The enlarged structural diagram at C in the middle; Figure 9 It is a partial cross-sectional view of the structure of the present invention; Figure 10 for Figure 9 Enlarged structural diagram at point D in the middle.
[0015] In the figure: 1. Etching table; 2. Placement groove; 3. Vacuum pump; 4. Adsorption platform; 5. Adsorption hole; 6. Adsorption tube; 7. Connecting pipe; 8. Pipeline; 9. Lead frame; 10. Base island; 11. Support frame; 12. Positioning screw; 13. Positioning nut; 14. Threaded hole; 15. Lifting screw; 16. Support block; 17. Fixed slot; 18. Fixed seat; 19. Bottom plate; 20. Moving slot; 21. Support rod; 22. Limiting spring; 23. Positioning block; 24. Fixed card plate; 25. Guide slot; 26. Traction slot; 27. Buffer slot; 28. Buffer spring; 29. Buffer rod; 30. Damping sleeve; 31. Auxiliary block. DETAILED DESCRIPTION
[0016] In order to clearly and completely describe the objectives and technical solutions of the present invention and make the advantages more clearly understood, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0017] Example 1: Please refer to Figures 1-10 The present invention provides a technical solution: a jig for a lead frame and an etching method for a lead frame, wherein the jig for a lead frame and the etching method for a lead frame include: an etching table 1, a placement groove 2 is provided at the bottom of the etching table 1, a vacuum pump 3 is provided in the placement groove 2, an adsorption platform 4 is provided on the surface of the etching table 1, an adsorption hole 5 is provided on the surface of the adsorption platform 4, an adsorption tube 6 is provided in the adsorption hole 5, a connecting tube 7 is provided at one end of the adsorption tube 6, the vacuum pump 3 is connected to the connecting tube 7 via a pipeline 8, a lead frame 9 is placed on the surface of the adsorption platform 4, and a base island 10 is etched on the surface of the lead frame 9; a support frame 11, a positioning screw 12 is provided at the bottom of the support frame 11, a positioning nut 13 is screwed on the surface of the positioning screw 12, a threaded hole 14 is provided on the surface of the support frame 11, a lifting screw 15 is screwed in the threaded hole 14, and a support block 16 is provided on the surface of the lifting screw 15; First, loosen the positioning nut 13 and then adjust the displacement of the support frame 11. The support frame 11 can be adjusted according to the number of base islands 10. After the support frame 11 is adjusted appropriately, tighten the positioning nut 13 to fix the support frame 11. Then, use the vacuum pump 3 in conjunction with the adsorption tube 6 to fix the lead frame 9 on the surface of the adsorption platform 4. Then, a support block 16 is provided above the support frame 11 to support the base island 10 below the lead frame 9, so as to support the bottom of the lead frame 9 during subsequent etching and improve the stability of etching the lead frame 9.
[0018] Example 2: Based on Example 1, in order to facilitate the positioning of the lead frame 9 and facilitate subsequent etching, an adsorption platform 4 is provided. The vacuum pump 3 is fixedly connected to the inner surface of the placement groove 2 by means of positioning bolts. Multiple groups of adsorption holes 5 are provided. The multiple groups of adsorption holes 5 are linearly arranged equidistantly on the surface of the adsorption platform 4. The adsorption tubes 6 are all inserted into the adsorption holes 5. A fixed card slot 17 is provided on the side of the placement groove 2. The fixed card slot 17 is provided in two groups. The two groups of fixed card slots 17 are symmetrically distributed about the placement groove 2. During use, when the lead frame 9 needs to be placed on the surface of the adsorption platform 4, the vacuum pump 3 can be started, and the air inside the adsorption hole 5 can be extracted through the cooperation of the connecting tube 7 and the adsorption tube 6 to form a negative pressure environment, so that the lead frame 9 can be adsorbed and fixed, which is convenient for subsequent etching of the lead frame 9.
[0019] In order to facilitate the support of the connecting pipe 7, a fixed seat 18 is provided, a fixed seat 18 is provided on the surface of the connecting pipe 7, and two groups of connecting pipes 7 are fixedly connected to the surface of the fixed seat 18, and a bottom plate 19 is provided on the surface of the fixed seat 18. The bottom plate 19 is a square plate structure, and a movable groove 20 is opened on the surface of the bottom plate 19. A support rod 21 is provided on the end face of the movable groove 20. Two groups of bottom plates 19 are provided, and the two groups of bottom plates 19 are symmetrically distributed about the center line of the long side of the surface of the fixed seat 18. A limit spring 22 and a positioning block 23 are sleeved on the surface of the support rod 21. A fixed clamping plate 24 is provided on the side of the positioning block 23. One end of the fixed clamping plate 24 is inserted into the fixed clamping groove 17, and one end of the limit spring 22 is fixedly connected to the side of the positioning block 23. The other end of the limit spring 22 is fixedly connected to the end face of the movable groove 20, and the positioning block 23 is slidably connected to the surface of the support rod 21; When in use, first insert the fixed card plate 24 into the fixed card slot 17 to support the fixed seat 18, so that the two sets of connecting pipes 7 can be supported and fixed. The setting of the limit spring 22 can facilitate the automatic reset after the subsequent pulling of the fixed card plate 24 through its own elastic force, and on the other hand, it can avoid the problem of arbitrary displacement of the fixed card plate 24.
[0020] Embodiment 3: On the basis of Embodiment 2, a positioning screw 12 is provided to facilitate the adjustment of the support frame 11. The positioning screw 12 is fixedly connected to the bottom of the support frame 11. The positioning screw 12 passes through the traction groove 26, and the positioning screw 12 is slidably connected to the traction groove 26. One end of the support frame 11 is inserted into the guide groove 25, and the support frame 11 is slidably connected to the guide groove 25. There are multiple groups of support frames 11, and one end of each group of support frames 11 is inserted into the guide groove 25. The adsorption platform 4 is integrally in a "C"-shaped plate structure. Guide grooves 25 are provided on the side surface of the adsorption platform 4. There are two groups of guide grooves 25, and the two groups of guide grooves 25 are symmetrically distributed about the center line of the long side of the end face of the adsorption platform 4. A traction groove 26 is provided on the surface of one group of guide grooves 25, and the length of the long side of the side surface of the traction groove 26 is the same as the length of the long side of the side surface of the guide groove 25. The adsorption platform 4 is fixedly connected to the surface of the etching table 1; During use, first, the two guide grooves 25 are used to support the support frame 11. When it is necessary to adjust the position of the support frame 11, first slide the support frame 11 in cooperation with the guide groove 25. When the support frame 11 is moved to a suitable position, the positioning nut 13 can be tightened. By tightening the positioning nut 13 in cooperation with the positioning screw 12, the support frame 11 can be fixed to facilitate adaptation to different lead frames 9.
[0021] To improve the protection during the etching of the lead frame 9, a support block 16 is provided. The support block 16 is fixedly connected to the surface of the lifting screw 15. The support block 16 is in a circular plate structure. A buffer groove 27 is provided on the surface of the support block urchased. The buffer groove 27 is in a circular plate structure. A buffer spring 28 is provided on the surface of the buffer groove 27. One end of the buffer spring 28 is fixedly connected to the surface of the buffer groove 27, and the other end of the buffer spring 28 is fixedly connected to a buffer rod 29. A damping sleeve 30 is sleeved on the surface of the buffer rod 29. The outer ring surface of the damping sleeve 30 contacts the side surface of the buffer groove 27. An auxiliary block 31 is provided on the surface of the buffer rod 29. The auxiliary block 31 is in a circular plate structure; During use, after the displacement of the support frame 11, the support block 16 is located directly below the base island 10. The lifting screw 15 can cooperate with the threaded hole 14 to facilitate the separation of the support block 16 from the support frame 11. Then, the auxiliary block 31 and the buffer spring 28 are used to buffer the impact force generated on the surface of the base island 10 due to etching. The setting of the damping sleeve 30 can prevent the buffer rod 29 from continuously rebounding due to the elastic force of the buffer spring 28.
[0022] During actual use, first loosen the positioning nut 13 and then adjust the displacement of the support frame 11. The support frame 11 can be adjusted according to the number of base islands 10. When the support frame 11 is adjusted appropriately, tighten the positioning nut 13 to fix the support frame 11. Then, the lead frame 9 is fixed on the surface of the adsorption platform 4 through the vacuum pump 3 in cooperation with the adsorption tube 6. Then, the support block 16 is provided above the support frame 11 to support the base island 10 below the lead frame 9, so as to facilitate the support of the bottom of the lead frame 9 during subsequent etching and improve the stability of the etching of the lead frame 9.
[0023] The etching method of the jig for the lead frame specifically comprises the following steps: S1: First, the support frame 11 is displaced, and then fixed with the positioning nut 13 and the positioning screw 12 so that the support block 16 is located directly below the base island 10 to be etched; S2: The lead frame 9 to be etched is then placed on the adsorption platform 4, and the vacuum pump 3 is started so that the adsorption tube 6 cooperates with the suction force generated by the connecting tube 7 to adsorb and fix the lead frame 9; S3: Finally, when the etching of the lead frame 9 is completed, the vacuum pump 3 is turned off to make the adsorption tube 6 lose its suction force, and then the etched lead frame 9 can be removed.
[0024] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.
Claims
1. A fixture for a lead frame, characterized in that: The fixture for the lead frame includes: an etching table (1), a placement groove (2) is formed at the bottom of the etching table (1), a vacuum pump (3) is arranged in the placement groove (2), an adsorption platform (4) is arranged on the surface of the etching table (1), adsorption holes (5) are formed on the surface of the adsorption platform (4), adsorption tubes (6) are arranged in the adsorption holes (5), a connecting tube (7) is arranged at one end of the adsorption tube (6), and the vacuum pump (3) is connected to the connecting tube (7) by a pipeline (8). The lead frame (9) is placed on the surface of the adsorption platform (4), and a base island (10) is etched on the surface of the lead frame (9). A support frame (11), a positioning screw (12) is arranged at the bottom of the support frame (11), a positioning nut (13) is screwed on the surface of the positioning screw (12), a threaded hole (14) is formed on the surface of the support frame (11), a lifting screw (15) is screwed in the threaded hole (14), and a support block (16) is arranged on the surface of the lifting screw (15).
2. The jig for lead frame according to claim 1, wherein: The vacuum pump (3) is fixedly connected to the inner surface of the placement groove (2) by a positioning bolt. Multiple groups of adsorption holes (5) are formed, and the multiple groups of adsorption holes (5) are linearly arranged at equal distances on the surface of the adsorption platform (4). The adsorption tubes (6) are all inserted into the adsorption holes (5). Fixed clamping grooves (17) are formed on the side surface of the placement groove (2), and two groups of fixed clamping grooves (17) are formed. The two groups of fixed clamping grooves (17) are symmetrically distributed with respect to the placement groove (2).
3. The jig for lead frame according to claim 1, wherein: A fixing seat (18) is arranged on the surface of the connecting tube (7). Two groups of connecting tubes (7) are arranged, and the two groups of connecting tubes (7) are both fixedly connected to the surface of the fixing seat (18). A bottom plate (19) is arranged on the surface of the fixing seat (18). The bottom plate (19) has a square plate-like structure. A moving groove (20) is formed on the surface of the bottom plate (19). A support rod (21) is arranged at the end face of the moving groove (20). Two groups of bottom plates (19) are arranged, and the two groups of bottom plates (19) are symmetrically distributed with respect to the long-side center line on the surface of the fixing seat (18).
4. The jig for a lead frame according to claim 3, wherein: A limiting spring (22) and a positioning block (23) are sleeved on the surface of the support rod (21). A fixed clamping plate (24) is arranged on the side surface of the positioning block (23). One end of the fixed clamping plate (24) is inserted into the fixed clamping groove (17). One end of the limiting spring (22) is fixedly connected to the side surface of the positioning block (23), and the other end of the limiting spring (22) is fixedly connected to the end face of the moving groove (20). The positioning block (23) is slidably connected to the surface of the support rod (21).
5. The jig for lead frame according to claim 1, wherein: The adsorption platform (4) is integrally in an "L"-shaped plate-like structure. Guide grooves (25) are formed on the side surface of the adsorption platform (4). Two groups of guide grooves (25) are formed, and the two groups of guide grooves (25) are symmetrically distributed with respect to the long-side center line of the end face of the adsorption platform (4). A traction groove (26) is formed on the surface of one group of guide grooves (25). The length of the long side of the side surface of the traction groove (26) is the same as the length of the long side of the side surface of the guide groove (25). The adsorption platform (4) is fixedly connected to the surface of the etching table (1).
6. The jig for a lead frame according to claim 1, wherein: The positioning screw (12) is fixedly connected to the bottom of the support frame (11), the positioning screw (12) passes through the traction groove (26), the positioning screw (12) is slidably connected to the traction groove (26), one end of the support frame (11) is inserted into the guide groove (25), the support frame (11) is slidably connected to the guide groove (25), and the support frame (11) is provided with multiple groups, and one end of the multiple groups of support frames (11) is inserted into the guide groove (25).
7. The jig for a lead frame according to claim 1, wherein: The support block (16) is fixedly connected to the surface of the lifting screw (15), the support block (16) is a circular plate-shaped structure, and a buffer groove (27) is provided on the surface of the support block (16), and the buffer groove (27) is a circular plate-shaped structure.
8. The jig for a lead frame according to claim 7, wherein: A buffer spring (28) is provided on the surface of the buffer groove (27), one end of the buffer spring (28) is fixedly connected to the surface of the buffer groove (27), and the other end of the buffer spring (28) is fixedly connected to a buffer rod (29).
9. The jig for a lead frame according to claim 8, wherein: The surface of the buffer rod (29) is provided with a damping sleeve (30), the outer ring surface of the damping sleeve (30) contacts the side surface of the buffer groove (27), and the surface of the buffer rod (29) is provided with an auxiliary block (31), which is a circular plate-shaped structure.
10. An etching method for a lead frame jig according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: First, the support frame (11) is displaced, and then fixed using the positioning nut (13) and the positioning screw (12) so that the support block (16) is located directly below the base island (10) to be etched; S2: The lead frame (9) to be etched is then placed on the adsorption platform (4), and the vacuum pump (3) is started to allow the adsorption tube (6) to cooperate with the suction force generated by the connecting tube (7) to adsorb and fix the lead frame (9); S3: Finally, when the etching of the lead frame (9) is completed, the vacuum pump (3) is turned off to make the adsorption tube (6) lose its suction force, and then the etched lead frame (9) can be removed.