Chip mounting machine

Abstract

The invention relates to the technical field of semiconductor devices, in particular to a chip mounting machine which comprises a mounting machine main body, a bearing disc is rotatably arranged above the mounting machine main body, substrates designed in a circumferential array are placed on the upper end face of the bearing disc, a feeding disc is rotatably arranged above the mounting machine main body, and the feeding disc is rotatably arranged above the mounting machine main body. The upper end face of the feeding disc is provided with a plurality of sets of DAF chip films, an L-shaped support is rotationally arranged above the chip mounting machine body, an electric telescopic column is installed at the bottom end of the L-shaped support, and a vacuum suction cup is installed at the telescopic end of the electric telescopic column. The substrate and the vacuum chuck are arranged on the same vertical plane, so that the DAF chip film can be conveniently and completely pressed into the substrate, the problem that the DAF chip film and the substrate are difficult to combine due to deflection in the prior art is avoided, the substrate and the DAF chip film can be continuously mounted under the rotation of the bearing disc, and the operation is relatively convenient and rapid.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, in particular to a chip mounting machine. Background Art

[0002] The die mounter is a key equipment in the semiconductor packaging production line and is widely used in chip packaging. The purpose of the die mounter is to fix the cut and polished chips on the substrate for subsequent operations. It is an important process in packaging and affects the entire chip packaging. Its function is to create a reliable physical connection between the chip and the package, to create a conductive or insulating connection between the chip or the package, to provide heat conduction and to buffer and absorb internal stress.

[0003] Several existing solutions have been proposed. For example, a Chinese patent with publication number CN206388690U discloses a chip mounter comprising a device body, a chip pickup device mounted on the device body, and a cleaning device for cleaning the pickup head of the chip pickup device. The cleaning device is positioned along the path of the pickup head as it returns in the second direction. During this return, the cleaning device automatically cleans the pickup head. This solution eliminates the time-consuming and labor-intensive issue of regular manual cleaning of the pickup head, automating the cleaning process and improving work efficiency.

[0004] Although the above technical solution can automatically clean the suction head, there are still other problems in its actual use. For example, when loading the substrate and DAF chip film, since the DAF chip film needs to be pressed into the groove of the substrate, the DAF chip film and the substrate need to be located on the same axis. However, due to the vibration of the loading machine itself, the substrate may be displaced, affecting the loading of both.

[0005] To this end, the present invention provides a chip mounter. Summary of the Invention

[0006] In order to solve the above technical problems, the present invention provides a chip loader, including a loader body, a carrying plate is rotatably provided above the loader body, a substrate designed in a circular array is placed on the upper end surface of the carrying plate, a feed tray is rotatably provided above the loader body, a plurality of groups of DAF chip films are provided on the upper end surface of the feed tray, an L-shaped bracket is rotatably provided above the loader body, an electric telescopic column is installed at the bottom end of the L-shaped bracket, a vacuum suction cup is installed at the telescopic end of the electric telescopic column, the vacuum suction cup is used to adsorb the DAF chip film and transfer it to the inside of the substrate through the L-shaped bracket, and an electric heating plate is provided above the loader body and below the L-shaped bracket.

[0007] In one embodiment of the present invention, a plurality of groups of contact 1s are fixedly mounted on the outer peripheral surface of the carrier plate, and each group of contact 1s is designed to correspond one to one with each substrate. A mounting frame is provided above the loader body, and contact 2 is mounted on the end of the mounting frame. Contact 1 and contact 2 are designed to be on the same plane, and the carrier plate will contact contact 2 during the process of driving contact 1 to rotate.

[0008] In one embodiment of the present invention, a plurality of placement frames are installed on the upper end surface of the carrier plate, and an attachment plate is slidably provided inside each placement frame. The substrate is placed inside the placement frame, and the attachment plate is used to fix the substrate.

[0009] In one embodiment of the present invention, an electric push column is installed on the inner side of each group of the placement frames, the attachment plate is installed on the telescopic end of the electric push column, and a temporary storage plate is provided on the inner side of the placement frame. The temporary storage plate is slidably provided on the upper end surface of the carrying plate, and a collecting unit is provided on the outer side of the carrying plate, and the collecting unit is used to collect the chips that have been loaded; during operation, when the substrate is placed inside the placement frame, the substrate will be placed above the temporary storage plate, and then the controller controls the electric push column to move, so that the electric push column drives the attachment plate to move, and the attachment plate can fix the substrate, which is more convenient to operate, and under the subsequent action of the collecting unit, the chips that have been loaded can be automatically collected.

[0010] In one embodiment of the present invention, the collecting unit includes a penetration groove, and the penetration groove is provided in multiple groups and is respectively provided under each substrate, the diameter of the penetration groove is larger than the diameter of the substrate, and a contact three is installed above the loader body through a bracket, and the telescopic end of the electric push column is connected to the side wall of the temporary storage plate through a support rod; during operation, after one of the substrates is loaded, the controller is used to drive the carrying plate to rotate again, and the carrying plate drives the loaded substrate to rotate, and when the contact one and contact two corresponding to the outer side of the subsequent substrate are in contact, the contact one on the outer side of the loaded substrate also happens to be in contact with the contact three, and then the contact three will transmit an electrical signal to the controller, and the controller will control the two electric push columns and the attachment plate to move away from the substrate, that is, the electric push column will also drive the temporary storage plate away from the bottom of the loaded substrate through the support rod, and when the temporary storage plates on both sides are completely away from the bottom of the substrate, since the diameter of the penetration groove is larger than the diameter of the substrate, the loaded substrate will fall along the penetration groove into the recovery seat below, thereby realizing automatic recovery of the loaded substrate.

[0011] In one embodiment of the present invention, a limiting column is installed on the lower end surface of the temporary storage plate, and a column-shaped groove adapted to the limiting column is opened on the upper end surface of the carrying plate; during operation, when the temporary storage plate moves, the temporary storage plate will simultaneously drive the limiting column to move, and the limiting column will move under the limit of the column-shaped groove on the surface of the carrying plate, thereby ensuring that the temporary storage plates on both sides are completely away from the bottom of the loaded substrate, which is conducive to the recovery of the loaded substrate.

[0012] In one embodiment of the present invention, a fixed bracket is installed above the loader body, and a transmission platform is provided on the inner side of the fixed bracket. The transmission platform is composed of a conveyor belt and a transmission roller. A plurality of groups of DAF chip membranes are provided on the upper end surface of the transmission platform. Adsorption holes are opened on the upper end surface of the feed tray. A suction pipe is provided inside the adsorption hole, and the suction pipe is connected to an external air pump. One group of the DAF chip membranes is located above the adsorption hole, and the edge of the transmission platform is arranged corresponding to the adsorption hole.

[0013] In one embodiment of the present invention, a storage circular groove is provided on the upper end surface of the feeding tray, the shape of the storage circular groove is adapted to the shape of the DAF chip membrane, and the adsorption hole is provided at the center of the storage circular groove.

[0014] In one embodiment of the present invention, a vertical shaft 1 is rotatably provided above the main body of the loader, the bottom end of the vertical shaft 1 is connected to the output end of the motor, a disc is installed on the top of the vertical shaft 1, and the end of the L-shaped bracket is installed on the upper end surface of the disc; when working, the vertical shaft 1 and the disc are driven by the motor to rotate forward and reverse, and the disc can drive the L-shaped bracket and the electric telescopic column to rotate forward and reverse, which is convenient for loading the DAF chip film.

[0015] In one embodiment of the present invention, the outer circumference of the vertical axis 1 is installed with a limit plate 1 and a limit plate 2, and the limit plate 1 and the limit plate 2 are designed to be separated. The side wall of the loader body is installed with a limit column 1 and a limit column 2, and the limit column 1 and the limit column 2 are designed to correspond to the limit plate 1 and the limit plate 2 respectively.

[0016] The above technical solution of the present invention has the following advantages over the prior art: The chip loading machine described in the present invention drives the loaded substrate to rotate through a carrying plate. When the corresponding contact one and contact two on the outer side of the subsequent substrate come into contact, the contact one on the outer side of the loaded substrate also happens to come into contact with contact three. Then contact three transmits an electrical signal to the controller. The controller controls the two electric push pins and the attachment plate to move away from the substrate. That is, the electric push pins also drive the temporary storage plate away from the bottom of the loaded substrate through the support rod. When the temporary storage plates on both sides are completely away from the bottom of the substrate, since the diameter of the penetration groove is larger than the diameter of the substrate, the loaded substrate will fall along the penetration groove into the recovery seat below, thereby realizing automatic recovery of the loaded substrate.

[0017] The chip mounting machine of the present invention can ensure that the DAF chip film is located in the storage circular groove under the suction action of the adsorption holes, thereby avoiding the problem of displacement of the DAF chip film caused by external wind force. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the structure of the carrier plate of the present invention; Figure 3 It is a schematic diagram of the top structure of the present invention; Figure 4 It is a partial structural diagram of the electric telescopic column of the present invention; Figure 5 It is a partial structural diagram of the electric heating plate of the present invention; Figure 6 It is a schematic diagram of the structure of the attachment plate portion of the present invention; Figure 7 It is a structural schematic diagram of a portion of the vertical axis of the present invention; Figure 8 It is a schematic diagram of the structure of the feeding tray of the present invention; Figure 9 It is a schematic diagram of the structure of the transmission platform of the present invention; Figure 10 It is a schematic structural diagram of the limiting plate 1 and limiting plate 2 of the present invention.

[0020] Explanation of the reference numerals in the specification: 1. loader body; 101. Feed tray; 102. Electric heating plate; 2. Carrying tray; 3. Base plate; 4. DAF chip film; 5. L-shaped bracket; 501. Electric telescopic column; 6. Vacuum suction cup; 7. Contact 1; 8. Mounting frame; 801. Contact 2; 9. Placement frame; 10. Attachment plate; 11. Electric push column; 111. Support rod; 12. Temporary storage plate; 13. Penetration groove; 14. Contact 3; 15. Limiting column; 16. Fixed bracket; 17. Transfer table; 18. Adsorption hole; 181. Storage groove; 19. Vertical axis 1; 20. Disc; 21. Limiting plate 1; 22. Limiting plate 2; 211. Limiting column 1; 221. Limiting column 2 DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0022] Reference Figures 1 to 5 As shown, a chip loader according to an embodiment of the present invention includes a loader body 1, a carrier plate 2 is rotatably provided above the loader body 1, a substrate 3 designed in a circular array is placed on the upper end surface of the carrier plate 2, a feed tray 101 is rotatably provided above the loader body 1, and a plurality of groups of DAF chip films 4 are provided on the upper end surface of the feed tray 101, an L-shaped bracket 5 is rotatably provided above the loader body 1, an electric telescopic column 501 is installed at the bottom end of the L-shaped bracket 5, and a vacuum suction cup 6 is installed at the telescopic end of the electric telescopic column 501, and the vacuum suction cup 6 is used to adsorb the DAF chip film 4 and transfer it to the inside of the substrate 3 through the L-shaped bracket 5, an electric heating plate 102 is provided above the loader body 1 and below the L-shaped bracket 5, and a groove adapted to the substrate 3 is provided above the carrier plate 2; During specific operation, the substrates 3 are placed on the upper end surface of the carrier plate 2 in a circular array, and when one group of substrates 3 and the vacuum suction cup 6 are on the same vertical plane, the positions of the vacuum suction cup 6 and the L-shaped bracket 5 are at the initial positions. Then, the electric heating plate 102 is controlled to preheat the corresponding substrate 3, and then the telescopic end of the electric telescopic column 501 is controlled to move downward, so that the electric telescopic column 501 drives the vacuum suction cup 6 and the DAF chip film 4 to move downward, and then the DAF chip film 4 will be pressed into the corresponding substrate 3. With the help of the preheated temperature of the substrate 3 and the pressure of the electric telescopic column 501, the DAF can be bonded to the substrate 3 as soon as possible, and then the heating of the electric heating plate 102 is stopped, and the substrate 3 is cooled, that is, the loading process is completed; when the process is completed, the vacuum suction cup 6 is controlled to no longer adsorb the DAF chip film 4, and the electric telescopic column 501 drives the vacuum suction cup 6 to move upward, away from the chip on which loading is completed; Such a design can make the substrate 3 stable above the carrier plate 2 and located on the same vertical plane as the vacuum suction cup 6, thereby facilitating the DAF chip film 4 to be completely pressed into the interior of the substrate 3, avoiding the problem in the prior art that the substrate 3 may be displaced, making it difficult to combine with the DAF chip film 4. Moreover, under the rotation of the carrier plate 2, the substrate 3 and the DAF chip film 4 can be continuously loaded, and the operation is relatively convenient and quick. Moreover, since a groove compatible with the substrate 3 is provided above the carrier plate 2, the upper end surface of the carrier plate 2 can limit and fix each substrate 3, which can avoid the problem of vibration of the loading machine itself, which may cause displacement of the substrate 3.

[0023] Reference Figures 1 to 5 As shown, a plurality of groups of contacts 7 are fixedly mounted on the outer circumference of the carrier plate 2. Each group of contacts 7 corresponds to each substrate 3. A mounting frame 8 is provided above the loader body 1. A second contact 801 is mounted on the end of the mounting frame 8. The first contact 7 and the second contact 801 are designed to be on the same plane. When the carrier plate 2 drives the first contact 7 to rotate, it will contact the second contact 801. During operation, when the carrier plate 2 drives the substrate 3 to rotate, since contact 1 7 is set on the corresponding side of each substrate 3, the carrier plate 2 will move toward the side close to contact 2 801 during the process of driving contact 1 7 to rotate synchronously. When contact 1 7 contacts contact 2 801, the circuit is connected, and it will transmit the electrical signal to the controller through the power cord. The controller will control the carrier plate 2 to stop rotating. At this time, one of the substrates 3 also moves to the bottom of the vacuum suction cup 6, that is, one of the substrates 3 and the vacuum suction cup 6 are located on the same vertical axis. After that, the telescopic end of the above-mentioned electric telescopic column 501 moves down, so that the substrate 3 and the DAF chip film 4 can be loaded onto each other. This can avoid the problem of deviation between the substrate 3 and the DAF chip film 4, which makes it difficult to combine and load the two.

[0024] Reference Figures 2 to 6 As shown, the upper end surface of the carrier plate 2 is equipped with multiple sets of placement frames 9, and an attachment plate 10 is slidably provided inside each set of placement frames 9. The substrate 3 is placed inside the placement frame 9, and the attachment plate 10 is used to fix the substrate 3. The attachment plate 10 is made of elastic rubber. When working, refer to the attachment Figure 2 As shown, each substrate 3 is placed inside the placement frame 9, and with the attachment plate 10 fixing the substrate 3, the stability of the subsequent combination of the DAF chip film 4 and the substrate 3 can be improved, avoiding the problem of displacement of the substrate 3 under the pressure of the electric telescopic column 501.

[0025] An electric push column 11 is installed on the inner side of each group of the placement frames 9, and the attachment plate 10 is installed on the telescopic end of the electric push column 11. A temporary storage plate 12 is provided on the inner side of the placement frame 9, and the temporary storage plate 12 is slidably set on the upper end surface of the carrier plate 2. A collecting unit is provided on the outer side of the carrier plate 2, and the collecting unit is used to collect the chips that have been loaded. During operation, when the substrate 3 is placed inside the placement frame 9, the substrate 3 will be placed above the temporary storage plate 12, and then the controller controls the electric push column 11 to move, so that the electric push column 11 drives the attachment plate 10 to move, and the attachment plate 10 can fix the substrate 3. The operation is more convenient, and under the action of the subsequent collection unit, the loaded chips can be automatically collected.

[0026] Reference Figures 2 to 8 As shown, the collecting unit includes a penetration groove 13, and the penetration groove 13 is provided in multiple groups and is respectively provided under each substrate 3. The diameter of the penetration groove 13 is larger than the diameter of the substrate 3. The upper part of the loader body 1 is provided with a contact 3 14 through a bracket. The telescopic end of the electric push column 11 is connected to the side wall of the temporary storage plate 12 through a support rod 111. During operation, when one of the substrates 3 is loaded, the controller is used to drive the carrier plate 2 to rotate again, and the carrier plate 2 drives the loaded substrate 3 to rotate. When the contact 1 7 corresponding to the outer side of the subsequent substrate 3 contacts the contact 2 801, At this time, the contact 1 7 on the outside of the loaded substrate 3 also just contacts the contact 3 14, and then the contact 3 14 will transmit the electrical signal to the controller, and the controller will control the two electric push pins 11 and the attachment plate 10 to move away from the substrate 3, that is, the electric push pin 11 will also drive the temporary storage plate 12 away from the bottom of the loaded substrate 3 through the support rod 111. When the temporary storage plates 12 on both sides are completely away from the bottom of the substrate 3, since the diameter of the penetration groove 13 is larger than the diameter of the substrate 3, the loaded substrate 3 will fall along the penetration groove 13 to the recovery seat below, thereby realizing the automatic recovery of the loaded substrate 3.

[0027] The lower end surface of the temporary storage plate 12 is installed with a limiting column 15, and the upper end surface of the carrying plate 2 is provided with a column-shaped groove adapted to the limiting column 15; during operation, when the temporary storage plate 12 moves, the temporary storage plate 12 will simultaneously drive the limiting column 15 to move, and the limiting column 15 will move under the limit of the column-shaped groove on the surface of the carrying plate 2, so as to ensure that the temporary storage plates 12 on both sides are completely away from the bottom of the loaded substrate 3, which is conducive to the recovery of the loaded substrate 3.

[0028] Reference Figures 3 to 10As shown, a fixed bracket 16 is installed above the loader body 1, and a transmission platform 17 is provided on the inner side of the fixed bracket 16. The transmission platform 17 is composed of a conveyor belt and a transmission roller. The upper end surface of the transmission platform 17 is provided with multiple groups of DAF chip membranes 4, and the upper end surface of the feeding tray 101 is provided with adsorption holes 18. A suction pipe is provided inside the adsorption hole 18, and the suction pipe is connected to an external air pump. One group of the DAF chip membranes 4 is located above the adsorption hole 18, and the edge of the transmission platform 17 is corresponding to the adsorption hole 18. When working, refer to the attached Figure 9 As shown, the DAF chip film 4 that has not yet been loaded can be transported to the corresponding adsorption holes 18 above the feeding tray 101 through the transfer table 17. The adsorption holes 18 are kept in a negative pressure state by an external air pump and a suction pipe, so that the DAF chip film 4 that has not yet been loaded can be temporarily adsorbed on the surface of the feeding tray 101. When the DAF chip film 4 under the vacuum suction cup 6 is loaded, the L-shaped bracket 5 is controlled to rotate close to the feed tray 101. When the L-shaped bracket 5 moves to the position corresponding to the adsorption hole 18, the rotation of the L-shaped bracket 5 is stopped, and then the electric telescopic column 501 is controlled to move downward, so that the electric telescopic column 501 drives the vacuum suction cup 6 to move to the side of the DAF chip film 4 above the adsorption hole 18. After that, the vacuum suction cup 6 can adsorb the DAF chip film 4, and then the L-shaped bracket 5 is controlled to move to the initial position. In this way, not only can the substrate 3 be loaded continuously, but also the DAF chip film 4 can be loaded continuously.

[0029] It should be noted that the suction force of the vacuum suction cup 6 is much greater than the negative pressure of the adsorption hole 18, so that the vacuum suction cup 6 can directly adsorb the DAF chip film 4; it should also be noted that when there is a DAF chip film 4 above the adsorption hole 18, the transfer platform 17 stops rotating at this time. After the DAF chip film 4 above the adsorption hole 18 is removed, the transfer platform 17 starts to rotate and transfers the DAF chip film 4 above it to the side of the adsorption hole 18 below. Since the edge of the transfer platform 17 is arranged corresponding to the adsorption hole 18, the DAF chip film 4 above the transfer platform 17 can just fall to the side of the adsorption hole 18.

[0030] The upper end surface of the feeding tray 101 is provided with a storage groove 181, the shape of which matches the shape of the DAF chip film 4, and the adsorption hole 18 is arranged at the center of the storage groove 181; during operation, when the conveying platform 17 transports the DAF chip film 4 at its edge to the top of the feeding tray 101, if the DAF chip film 4 can just fall into the storage groove 181, the suction force of the adsorption hole 18 can ensure that the DAF chip film 4 is located in the storage groove 181, thereby preventing the DAF chip film 4 from being displaced by external wind. If the DAF chip film 4 fails to fall completely into the storage circular groove 181, the DAF chip film 4 can be slowly and completely adsorbed into the storage circular groove 181 under the suction force of the adsorption hole 18, that is, it can have a certain correction effect on the position of the DAF chip film 4, thereby improving the subsequent adsorption and docking of the vacuum suction cup 6 and the DAF chip film 4.

[0031] A vertical shaft 19 is rotatably provided above the loader body 1, the bottom end of the vertical shaft 19 is connected to the output end of the motor, a disc 20 is installed on the top end of the vertical shaft 19, and the end of the L-shaped bracket 5 is installed on the upper end surface of the disc 20; when working, the vertical shaft 19 and the disc 20 are driven by the motor to rotate forward and reverse, and the disc 20 can drive the L-shaped bracket 5 and the electric telescopic column 501 to rotate forward and reverse, which is convenient for loading the DAF chip film 4.

[0032] The outer circumference of the vertical shaft 19 is installed with a limit plate 1 21 and a limit plate 2 22, and the limit plate 1 21 and the limit plate 2 22 are of separate design. The side wall of the loader body 1 is installed with a limit column 1 211 and a limit column 2 221, and the limit column 1 211 and the limit column 2 221 are respectively designed to correspond to the limit plate 1 21 and the limit plate 2 22; when working, in the initial state, the end of the limit column 1 211 contacts the side wall of the limit plate 1 21, and the limit column 2 221 does not contact the limit plate 2 22, and refer to the attached Figure 10 As shown in the position; when the disc 20 drives the L-shaped bracket 5 to rotate toward the side close to the feeding tray 101, the disc 20 will simultaneously drive the vertical shaft 19 and the limiting plate 22 to rotate. When the limiting plate 22 contacts the end of the limiting column 221, the vacuum suction cup 6 is just on the same vertical axis as the adsorption hole 18. At this time, the rotation of the vertical shaft 19 is stopped, and the DAF chip film 4 on the adsorption hole 18 is grasped through the above steps; After the DAF chip film 4 is grasped, the vertical axis 19 drives the disc 20 and the L-shaped bracket 5 to move toward the side close to the substrate 3. When the limit plate 21 contacts the end of the limit column 211, the vacuum suction cup 6 is just on the same vertical axis as the substrate 3, which facilitates its combination with the substrate 3. Such a design can ensure that the vacuum suction cup 6 can be adsorbed to the center of the DAF chip film 4, and also facilitates the DAF chip film 4 to be combined with the substrate 3, thereby improving the loading efficiency.

[0033] Working principle: When the substrates 3 are placed in a circular array on the upper end surface of the carrier plate 2, and one group of substrates 3 and the vacuum suction cup 6 are on the same vertical plane, the positions of the vacuum suction cup 6 and the L-shaped bracket 5 are at the initial positions. Then, the electric heating plate 102 is controlled to preheat the corresponding substrate 3, and then the telescopic end of the electric telescopic column 501 is controlled to move downward, so that the electric telescopic column 501 drives the vacuum suction cup 6 and the DAF chip film 4 to move downward, and then the DAF chip film 4 will be pressed into the corresponding substrate 3. With the help of the preheated temperature of the substrate 3 and the pressure of the electric telescopic column 501, the DAF can be bonded to the substrate 3 as soon as possible, and then the heating of the electric heating plate 102 is stopped, and the substrate 3 is cooled, thus completing the loading process; when the process is completed, the vacuum suction cup 6 is controlled to no longer adsorb the DAF chip film 4, and the electric telescopic column 501 drives the vacuum suction cup 6 to move upward, away from the chip on which loading is completed; When the carrier plate 2 drives the substrates 3 to rotate, since contact 1 7 is provided on one side corresponding to each substrate 3, the carrier plate 2 will move toward the side close to contact 2 801 during the synchronous rotation of contact 1 7. When contact 1 7 contacts contact 2 801, the circuit is connected, and the electrical signal is transmitted to the controller through the power line. The controller controls the carrier plate 2 to stop rotating. At this time, one of the substrates 3 also moves to the bottom of the vacuum suction cup 6, that is, one of the substrates 3 and the vacuum suction cup 6 are on the same vertical axis. Then, when the above-mentioned electric telescopic column 501 is extended and retracted, the electric signal is transmitted to the controller through the power line. The controller controls the carrier plate 2 to stop rotating. At this time, one of the substrates 3 also moves to the bottom of the vacuum suction cup 6, that is, one of the substrates 3 and the vacuum suction cup 6 are on the same vertical axis. When the end is moved downward, the substrate 3 and the DAF chip film 4 can be loaded onto each other, thereby avoiding the problem that the substrate 3 and the DAF chip film 4 are deflected, which makes it difficult for the two to be loaded together. The loading machine in the embodiment of the present invention has strong automation. When the substrate 3 is placed inside the placement frame 9, the substrate 3 is placed above the temporary storage plate 12. Then, the controller controls the electric push column 11 to move, so that the electric push column 11 drives the attachment plate 10 to move, and the attachment plate 10 can fix the substrate 3. The operation is relatively convenient, and under the action of the subsequent collection unit, the loaded chips can be automatically collected. When one of the substrates 3 is loaded, the controller drives the carrying plate 2 to rotate again, and the carrying plate 2 drives the loaded substrate 3 to rotate. When the corresponding contact 1 7 on the outer side of the subsequent substrate 3 contacts the contact 2 801, the contact 1 7 on the outer side of the loaded substrate 3 also happens to contact the contact 3 14. Then the contact 3 14 will transmit an electrical signal to the controller, and the controller will control the two electric push columns 11 and the attachment plate 10 to move away from the substrate 3, that is, the electric push column 11 will also drive the temporary storage plate 12 away from the bottom of the loaded substrate 3 through the support rod 111. When the temporary storage plates 12 on both sides are completely away from the bottom of the substrate 3, since the diameter of the penetration groove 13 is larger than the diameter of the substrate 3, the loaded substrate 3 will fall along the penetration groove 13 to the recovery seat below, thereby realizing automatic recovery of the loaded substrate 3. After the vacuum suction cup 6 has been loaded, the DAF chip film 4 can be continuously loaded. If the DAF chip film 4 fails to completely fall into the storage groove 181, the suction force of the adsorption holes 18 can slowly and completely adsorb the DAF chip film 4 into the storage groove 181, which can correct the position of the DAF chip film 4 to a certain extent, thereby improving the subsequent adsorption and docking between the vacuum suction cup 6 and the DAF chip film 4. In the initial state, the end of the limiting column 211 contacts the side wall of the limiting plate 21, and the limiting column 221 does not contact the limiting plate 22. Figure 10 As shown in the position; when the disc 20 drives the L-shaped bracket 5 to rotate toward the side close to the feeding tray 101, the disc 20 will simultaneously drive the vertical shaft 19 and the limiting plate 22 to rotate. When the limiting plate 22 contacts the end of the limiting column 221, the vacuum suction cup 6 is just on the same vertical axis as the adsorption hole 18. At this time, the rotation of the vertical shaft 19 is stopped, and the DAF chip film 4 on the adsorption hole 18 is grasped through the above steps; After the DAF chip film 4 is grasped, the vertical axis 19 drives the disc 20 and the L-shaped bracket 5 to move toward the side close to the substrate 3. When the limit plate 21 contacts the end of the limit column 211, the vacuum suction cup 6 is just on the same vertical axis as the substrate 3, which facilitates its combination with the substrate 3. Such a design can ensure that the vacuum suction cup 6 can be adsorbed to the center of the DAF chip film 4, and also facilitates the DAF chip film 4 to be combined with the substrate 3, thereby improving the loading efficiency.

[0034] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A chip loader, characterized in that: It includes a loader body, a carrying plate is rotatably provided above the loader body, a substrate designed in a circular array is placed on the upper end surface of the carrying plate, a feed tray is rotatably provided above the loader body, a plurality of groups of DAF chip films are provided on the upper end surface of the feed tray, an L-shaped bracket is rotatably provided above the loader body, an electric telescopic column is installed at the bottom end of the L-shaped bracket, a vacuum suction cup is installed at the telescopic end of the electric telescopic column, the vacuum suction cup is used to adsorb the DAF chip film and transfer it to the inside of the substrate through the L-shaped bracket, and an electric heating plate is provided above the loader body and below the L-shaped bracket.

2. A chip mounter according to claim 1, characterized in that: A plurality of groups of contact 1s are fixedly mounted on the outer peripheral surface of the carrier plate, and each group of contact 1s is designed to correspond one to one with each substrate. A mounting frame is provided above the loader body, and contact 2 is mounted on the end of the mounting frame. Contact 1 and contact 2 are designed to be on the same plane, and the carrier plate will contact contact 2 when driving contact 1 to rotate.

3. A chip mounter according to claim 2, characterized in that: The upper end surface of the carrier plate is provided with a plurality of placement frames, and an attachment plate is slidably provided inside each placement frame. The substrate is placed inside the placement frame, and the attachment plate is used to fix the substrate.

4. A chip mounter according to claim 3, characterized in that: An electric push column is installed on the inner side of each group of the placement frames, and the attachment plate is installed on the telescopic end of the electric push column. A temporary storage plate is provided on the inner side of the placement frame, and the temporary storage plate is slidably provided on the upper end surface of the carrying plate. A collection unit is provided on the outer side of the carrying plate, and the collection unit is used to collect the chips that have been loaded.

5. The chip mounter according to claim 4, characterized in that: The collection unit includes a penetration groove, which is provided in multiple groups and is respectively provided under each substrate. The diameter of the penetration groove is larger than the diameter of the substrate. Contact three is installed above the loader body through a bracket, and the telescopic end of the electric push column is connected to the side wall of the temporary storage plate through a support rod.

6. The chip mounter according to claim 5, characterized in that: A limiting column is installed on the lower end surface of the temporary storage plate, and a column-shaped groove adapted to the limiting column is opened on the upper end surface of the carrying plate.

7. The chip mounter according to claim 5, characterized in that: A fixed bracket is installed above the loader body, and a transmission platform is provided on the inner side of the fixed bracket. The transmission platform is composed of a conveyor belt and a transmission roller. A plurality of groups of DAF chip membranes are provided on the upper end surface of the transmission platform. Adsorption holes are opened on the upper end surface of the feed tray. A suction pipe is provided inside the adsorption hole, and the suction pipe is connected to an external air pump. One group of the DAF chip membranes is located above the adsorption hole, and the edge of the transmission platform is arranged corresponding to the adsorption hole.

8. The chip mounter according to claim 7, characterized in that: The upper end surface of the feeding tray is provided with a storage circular groove, the shape of which is adapted to the shape of the DAF chip membrane, and the adsorption hole is arranged at the center of the storage circular groove.

9. The chip mounter according to claim 8, characterized in that: A vertical shaft 1 is rotatably provided above the main body of the loader, the bottom end of the vertical shaft 1 is connected to the output end of the motor, a disc is installed on the top end of the vertical shaft 1, and the end of the L-shaped bracket is installed on the upper end surface of the disc.

10. The chip mounter according to claim 9, characterized in that: The outer circumference of the vertical axis 1 is installed with a limit plate 1 and a limit plate 2, and the limit plate 1 and the limit plate 2 are designed to be separated. The side wall of the loader body is installed with a limit column 1 and a limit column 2, and the limit column 1 and the limit column 2 are designed to correspond to the limit plate 1 and the limit plate 2 respectively.

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