Floating cold water plate

Abstract

The invention relates to a floating cold water plate, and relates to the field of heat exchange, the floating cold water plate comprises a liquid separation runner plate main body and a floating cold plate in sliding connection with the liquid separation runner plate main body, a cooling channel is arranged in the liquid separation runner plate main body, and the floating cold plate is provided with a heat conduction assembly, a limiting assembly for limiting the sliding range of the floating cold plate and a reset elastic piece for pushing the floating cold plate away. When the floating cold plate works, the floating cold plate slides towards the liquid separation runner plate body to enable the heat conduction assembly and the liquid separation runner plate body to conduct heat exchange to a greater degree, the heat conduction assembly comprises a heat conduction rod which is connected with the floating cold plate and matched with a heat conduction hole of the liquid separation runner plate body in a sliding mode, a heat conduction cavity is formed in the heat conduction rod, and liquid exchange holes are formed in the side wall. The technical effects that heat exchange can be effectively achieved, the heat exchange effect is enhanced through sliding adjustment of the floating cold plate, normal circulation and sealing of cooling liquid can be guaranteed through design of all assemblies, the overall performance is improved, and the service life is prolonged are achieved.

Description

Technical Field

[0001] The present application relates to the field of electrical components, and in particular to a floating cold water plate. Background Art

[0002] In the field of electrical components, with the continuous advancement of technology, the performance of electronic devices is constantly improving, and the operating speed and processing power of basic electrical components such as chips are constantly increasing. At the same time, the heat generated by these components during operation is also increasing, placing higher demands on heat dissipation technology. Liquid cooling, due to its efficient heat dissipation performance, is gradually becoming the mainstream cooling method for high-power chips. Cold plate liquid cooling technology can effectively adhere to heat-generating components. By circulating liquid through the flow channels within the cold plate, it removes the heat generated by the heat-generating components, providing a strong guarantee for the stable operation of electronic devices. It plays a vital role in improving the performance and extending the service life of electronic devices, and is widely used in various high-end electronic devices.

[0003] An existing Chinese patent, authorized with publication number CN219610420U, discloses a cold plate comprising a plate body and a floating pressure-regulating chamber. The plate body includes a cold plate flow channel, which communicates with an external circulating cooling device. The floating pressure-regulating chamber is located within the plate body. A floating block is sealed and slidably connected within the floating pressure-regulating chamber. The floating block separates the floating pressure-regulating chamber into a floating chamber and a follower chamber. The floating chamber communicates with the cold plate flow channel. Increased pressure within the cold plate flow channel drives the floating block to slide, increasing the volume of the floating chamber and providing pressure compensation for the cold plate flow channel. This cold plate incorporates a floating pressure-regulating chamber within the plate body to provide pressure compensation for the cold plate flow channel, enhancing safety.

[0004] The aforementioned related technologies have the following drawbacks: As chip power density increases, the number of high-power devices on circuit boards also increases, but it is often difficult to ensure that the heights of each power device are uniform. Conventional liquid cold plate cooling methods primarily prioritize chip contact, with thermal grease used to reduce interface thermal resistance, and thermal pads used to absorb height differences and reduce interface thermal resistance. However, as power density increases, the thermal resistance effect of the thermal pad thickness becomes increasingly significant, and the difference between the chip surface shell temperature and the cold plate surface temperature increases, so this needs to be improved. Summary of the Invention

[0005] In order to ensure the heat dissipation requirements of chips of different thicknesses, the present application provides a floating cold water plate.

[0006] A floating cold water plate comprises a liquid separation channel plate body and a floating cold plate slidably connected thereto, wherein a cooling channel is provided inside the liquid separation channel plate body, the floating cold plate is provided with a heat conduction component, the liquid separation channel plate body is provided with a limit component for limiting the sliding range of the floating cold plate, the liquid separation channel plate body is provided with a reset elastic member for pushing the floating cold plate away, the floating cold plate slides toward the liquid separation channel plate body in a working state, and the heat conduction component and the liquid separation channel plate body perform a greater degree of heat exchange.

[0007] By adopting the above technical solution, the number and position of floating cold plates can be flexibly set according to demand. When the chip heights are different, the floating cold plate can automatically slide to a corresponding degree under the pressure / pushing of the chip, thereby adaptively contacting multiple chips and allowing chips of different heights to achieve better cooling. In addition, when there is no chip in a certain position, the floating cold plate will not move. Therefore, the thermal conductive component of the floating cold plate in this position does not significantly exchange heat with the main body of the liquid separation channel plate. As a result, the floating cold plate in this position is in an inoperative state, thus not causing wasted heat exchange pressure. This allows the floating cold plates in the operating state to more evenly distribute heat exchange resources, thereby more accurately ensuring the cooling effect of multiple chips. In summary, the floating cold plate can adaptively slide under the pressure or pushing of the chip, ensuring good contact with chips of different heights and ensuring the heat dissipation requirements of chips of different thicknesses. When there is no chip in a certain position, the floating cold plate does not move and does not significantly exchange heat, thus avoiding wasted heat exchange pressure and allowing the floating cold plate in the operating state to more evenly distribute heat exchange resources, accurately ensuring the cooling effect of multiple chips.

[0008] Preferably, the heat conduction component includes a heat conduction rod connected to the floating cold plate, the liquid separation channel plate body is provided with a heat conduction hole connected to the cooling channel, and the heat conduction rod is adapted to and slidably connected to the heat conduction hole.

[0009] By adopting this technical solution, in the non-operating state, the heat-conducting rods slide along the heat-conducting holes, allowing the floating cold plates and the main body of the liquid distribution channel to maintain a basic heat exchange state. In the operating state, the heat-conducting rods slide deeper along the heat-conducting holes, and even the ends directly enter the cooling channels, achieving a greater degree of heat exchange and achieving a more complete heat exchange. This further reduces the temperature of the floating cold plates in the operating state, allowing them to cool the chips more efficiently. At the same time, the floating cold plates can adaptively slide according to the chip height, achieving good contact with chips of different heights, meeting the heat dissipation requirements of chips of different thicknesses, and avoiding wasted heat exchange pressure in areas without chips. This allows the floating cold plates in the operating state to more evenly distribute heat exchange resources and more accurately ensure chip cooling.

[0010] Preferably, a heat conduction cavity is provided inside the heat conduction rod, and a liquid exchange hole connected to the heat conduction cavity is further provided on the side wall of the heat conduction rod. When the floating cold plate is in a non-working state, the inner wall of the heat conduction hole covers the liquid exchange hole; when the floating cold plate is in a working state, the liquid exchange hole is located inside the cooling channel.

[0011] By adopting the above technical solution, when the floating cold plate is in a non-working state, the liquid exchange hole is sealed, and the coolant inside the heat conduction cavity is not connected to the coolant inside the cooling channel. Heat exchange is achieved only by the fit between the heat conduction rod and the heat conduction hole. When the floating cold plate is in a working state, the liquid exchange hole is directly connected to the cooling channel, and the coolant inside the heat conduction cavity can be directly circulated and exchanged with the coolant inside the cooling channel, more effectively achieving the cooling of the floating cold plate in the working state. In conjunction with the liquid separation channel plate body, floating cold plate, cooling channel, limit assembly, and reset elastic member, the floating cold plate can adapt to chips of different heights, allowing chips of different heights to be cooled well. The floating cold plate in the non-working state does not cause wasted heat exchange pressure, and the floating cold plate in the working state distributes heat exchange resources to a greater extent.

[0012] Preferably, the cooling channel includes a liquid supply area and a liquid return area, the liquid supply area is provided with a liquid supply port, the liquid return area is provided with a liquid return port, the number of the heat-conducting rods is two or more, the liquid supply area and the liquid return area both have corresponding heat-conducting cavities connected thereto, and a heat exchange flow channel is provided inside the floating cold plate, and the heat exchange flow channel is connected to two heat-conducting cavities respectively connected to the liquid supply area and the liquid return area.

[0013] By adopting this technical solution, the floating cold plate automatically adjusts its position according to the varying chip heights, ensuring optimal contact and cooling for each chip. Floating cold plates not in contact with chips do not undergo significant heat exchange, avoiding wasted heat exchange pressure and achieving precise resource allocation. During operation, coolant enters the supply area from the supply port, passes through the exchange port into the heat transfer cavity on one side, flows through the heat exchange channel into the heat transfer cavity on the other side, then enters the return area through the exchange port, and finally flows out of the return port. This, in conjunction with the refrigeration unit, circulates the coolant to meet the cooling needs of chips of varying heights.

[0014] Preferably, the liquid supply area and the liquid return area both include a main area and several connected branch areas, the branch areas are connected to corresponding heat conduction holes, and the width of the main area increases in the direction approaching the liquid supply port / liquid return port.

[0015] By adopting the above technical solution, multiple heat transfer cavities and heat exchange channels are set up in the liquid supply area and the liquid return area to realize multiple independent coolant circulations, which are matched with corresponding floating cold plates respectively. The specific structural design of the liquid supply area and the liquid return area can enable the heat transfer holes away from the liquid supply port / liquid return port to obtain relatively balanced hydraulic pressure, thereby ensuring the coolant flow rate and maintaining uniform distribution of cooling resources.

[0016] Preferably, the heat-conducting rod sleeve is provided with a main sealing ring, and the main sealing ring is interference-fitted with the inner wall of the heat-conducting hole.

[0017] By adopting the above technical solution, the heat-conducting rod of the heat-conducting assembly is connected to the floating cold plate and slides with the heat-conducting hole of the liquid separation channel plate body. The main sealing ring is arranged on the heat-conducting rod and has an interference fit with the inner wall of the heat-conducting hole, thereby improving the sealing of the gap when the heat-conducting rod slides along the heat-conducting hole and reducing the risk of coolant leakage.

[0018] Preferably, the heat-conducting rod sleeve is provided with a floating state sealing ring, the floating state sealing ring is interference fit with the inner wall of the heat-conducting hole, and the floating state sealing ring is located on the side of the liquid exchange hole facing the cooling channel.

[0019] By adopting the above technical solution, when the floating cold plate is in the non-working state, the floating state sealing ring can seal the gap between the heat conduction rod and the heat conduction hole, thereby reducing the coolant communication between the cooling channel and the heat conduction cavity in the non-working state; when the floating cold plate is in the working state, the floating state sealing ring extends into the cooling channel, which can remove the communication restriction between the heat conduction cavity and the cooling channel, thereby realizing the flow and heat exchange of the coolant.

[0020] Preferably, the liquid separation channel plate body is provided with an end face sealing ring, and the end face sealing ring is located outside the heat conducting rod.

[0021] By adopting the above technical solution, in the working state, the end face sealing ring contacts the surface of the floating cold plate to form an end face seal. Since the heat conducting rod enters the cooling channel and squeezes the coolant, the leakage risk will increase. At this time, the end face sealing ring can reduce the leakage risk.

[0022] Preferably, the limit assembly includes a limit screw, the liquid separation channel plate body is provided with a mounting hole for threaded connection of the screw portion of the limit screw, the floating cold plate is provided with a sliding hole for sliding connection of the screw portion of the limit screw, and the nut portion of the limit screw is abutted against the side of the floating cold plate away from the liquid separation channel plate body.

[0023] By adopting the above technical solution, the sliding range of the floating cold plate can be limited.

[0024] Preferably, the reset elastic member is a spring, the liquid separation channel plate body and the floating cold plate are both provided with a receiving hole for inserting the spring end, and the end of the heat conducting rod connected to the floating cold plate is provided in the receiving hole.

[0025] By adopting the above technical solution, on the one hand, the accommodating hole is convenient for accommodating the spring, especially when the floating cold plate and the liquid separation channel plate body are in contact with each other in the working state, the existence of the accommodating hole can ensure that the floating cold plate and the liquid separation channel plate body are completely in contact with each other, and the spring still has storage space after being compressed. On the other hand, when the floating cold plate and the liquid separation channel plate body are completely in contact with each other, since the heat conducting rod instantly enters the cooling channel and squeezes the coolant, there is a stage of sudden increase in hydraulic pressure in this state, which is prone to leakage. If the leaked liquid directly contacts the chip, it will directly cause contamination. After the accommodating hole is set, even if a small amount of leakage occurs, it can still be temporarily stored in the accommodating hole below, and it is convenient for the staff to conduct regular inspections and timely detect leakage, providing a certain fault tolerance for leakage pollution.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. The floating cold plate automatically slides in response to the chip's squeezing / pushing, adaptively contacting multiple chips and ensuring optimal cooling for chips at different heights. Furthermore, the floating cold plate in its non-operating state does not waste heat exchange pressure, while the operating floating cold plates can more evenly distribute heat exchange resources, ensuring more precise cooling for multiple chips. 2. In operation, the heat-conducting rod slides deeper along the heat-conducting hole, and even the end directly enters the cooling channel, enabling greater and more sufficient heat exchange, allowing the floating cold plate to cool the chip more efficiently; 3. When the floating cold plate is in working state, the liquid exchange hole is directly connected to the cooling channel. The coolant inside the heat conduction cavity can be directly circulated and exchanged with the coolant inside the cooling channel, which can more effectively achieve the cooling of the floating cold plate in working state. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of Example 1 of the present application; Figure 2 This is a structural diagram illustrating the connection between the liquid separation channel body and the floating cold plate in Example 1 of the present application; Figure 3 This is a structural diagram illustrating the connection relationship between the floating cold plate and the limiting assembly in Example 1 of the present application; Figure 4 This is a structural diagram illustrating the connection relationship between the floating cold plate and the heat conducting component in Example 1 of the present application; Figure 5 This is a structural diagram illustrating the connection relationship between the liquid supply area and the liquid return area in Example 1 of the present application; Figure 6 In Example 1 of this application Figure 5The cross-sectional view along the AA direction is used to illustrate the connection between the liquid separation channel plate body and the floating cold plate; Figure 7 This is a structural diagram illustrating the connection between the heat conducting rod and the cooling channel in Example 1 of the present application when the floating cold plate is in a non-working state; Figure 8 This is a structural diagram illustrating the connection between the heat conducting rod and the cooling channel in the working state of the floating cold plate in Example 1 of the present application; Figure 9 In Example 1 of this application Figure 5 The cross-sectional view along the BB direction is used to show the connection relationship between the floating cold plate and the limit assembly; Figure 10 This is a structural diagram for illustrating the angle relationship between the liquid exchange hole and the heat conduction cavity in Example 2 of the present application; Figure 11 This is a structural diagram illustrating the connection relationship between the thermally conductive gasket and the floating cold plate in Example 3 of the present application.

[0028] In the picture: 1. Liquid distribution channel plate body; 10. Cooling channel; 100. Heat conduction hole; 11. Liquid supply area; 110. Liquid supply port; 12. Liquid return area; 120. Liquid return port; 13. Main area; 131. Branch area; 2. Floating cold plate; 20. Heat exchange channel; 3. Heat conducting assembly; 31. Heat conducting rod; 310. Heat conducting cavity; 311. Liquid exchange hole; 4. Reset elastic member; 40. Accommodation hole; 41. Spring; 5. Main sealing ring; 51. Floating state sealing ring; 52. End face sealing ring; 6. Limit assembly; 61. Limit screw; 62. Mounting hole; 63. Slide hole; 7. Thermal pad; 71. Range extender board. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. The described embodiments are only possible technical implementations of the present invention, but are not limited thereto. Those skilled in the art can fully combine the embodiments of the present invention, and other embodiments obtained without creative work are also within the scope of protection of the present invention.

[0030] This application mainly adopts the adaptive adjustment of the floating cold plate to achieve heat dissipation of chips of different heights, thereby ensuring the heat dissipation requirements of chips of different thicknesses, improving the cooling effect and resource allocation efficiency. The following is a further detailed description of this application.

[0031] Example 1 Reference Figures 1 to 4 The floating cold water plate provided in the embodiment of the present application includes a liquid separation channel plate body 1, a floating cold plate 2, a heat conducting component 3, a limit component 6 and a reset elastic member 4, wherein the floating cold plate 2 is slidably connected to the liquid separation channel plate body 1, the heat conducting component 3 is arranged on the floating cold plate 2, the limit component 6 is arranged on the liquid separation channel plate body 1 and is used to limit the sliding range of the floating cold plate 2, and the reset elastic member 4 is arranged on the liquid separation channel plate body 1 to push the floating cold plate 2 away. In the working state, the floating cold plate 2 slides toward the liquid separation channel plate body 1 and the heat conducting component 3 and the liquid separation channel plate body 1 perform a greater degree of heat exchange. The thickness of the chip determines the sliding distance of the floating cold plate 2 at the corresponding position, and thus determines the degree of heat exchange. This allows chips of different heights to achieve better cooling, and thicker chips obtain more cooling resources. It also allows the floating cold plate 2 in the working state to more evenly distribute the heat exchange resources, thereby more accurately ensuring the cooling effect of the chip.

[0032] Reference Figure 5 、 Figure 6 and Figure 7 Specifically, the heat conducting assembly 3 includes a heat conducting rod 31, which is connected to the floating cold plate 2 and, in this embodiment, is integrally formed. Heat conducting rod 31 is typically made of a highly thermally conductive metal, such as copper or aluminum, which has excellent thermal conductivity and can quickly transfer heat. Of course, other thermally conductive composite materials can also be used, as long as they meet the requirements for efficient thermal conductivity.

[0033] The liquid-distributing channel plate body 1 is provided with a cooling channel 10 within, and a heat-conducting hole 100 is provided at the bottom of the liquid-distributing channel plate body 1, which is connected to the cooling channel 10. The heat-conducting rod 31 is adapted to and slidably connected to the heat-conducting hole 100. The heat-conducting rod 31 is generally designed to be cylindrical in shape to better slide with the circular heat-conducting hole 100, but can also be designed into other shapes such as square according to actual needs.

[0034] In the non-working state, the heat conducting rod 31 is slidably connected to the heat conducting hole 100, so that several floating cold plates 2 and the liquid separation channel plate body 1 maintain a basic heat exchange state. When a floating cold plate 2 at a certain place is in the working state, for example, it slides after contacting with the chip to be cooled, the heat conducting rod 31 slides deeper along the heat conducting hole 100, and even the end of the heat conducting rod 31 directly enters the cooling channel 10, so as to achieve a greater degree and more sufficient heat exchange, thereby achieving further cooling of the floating cold plate 2 in the working state, so that the floating cold plate 2 in the working state can cool the chip more efficiently.

[0035] Reference Figure 7 and Figure 8Furthermore, a heat conduction cavity 310 is provided inside the heat conduction rod 31, and a fluid exchange hole 311 is provided on the side wall of the heat conduction rod 31, which is connected to the heat conduction cavity 310. When the floating cold plate 2 is in a non-operating state, the inner wall of the heat conduction hole 100 covers the fluid exchange hole 311. At this time, the coolant inside the heat conduction cavity 310 is not connected to the coolant inside the cooling channel 10, and heat exchange is achieved only by the contact between the heat conduction rod 31 and the heat conduction hole 100. When the floating cold plate 2 is in an operating state, the fluid exchange hole 311 is located inside the cooling channel 10 and is directly connected to the cooling channel 10. Therefore, in this state, the coolant inside the heat conduction cavity 310 can directly circulate and exchange with the coolant inside the cooling channel 10. For example, the heat flow inside the heat conduction cavity 310 rises and enters the cooling channel 10, and the cold flow inside the cooling channel 10 sinks and enters the heat conduction cavity 310. By directly communicating the coolant, the floating cold plate 2 is cooled more effectively in the operating state. The size and number of the liquid exchange holes 311 can be designed according to the flow rate and heat conduction requirements of the coolant. Generally speaking, the liquid exchange holes 311 can be designed as small circular holes, and a plurality of them can be set and evenly distributed along the circumference of the heat conducting rod 31 to ensure smooth flow of the coolant.

[0036] Reference Figure 5 and Figure 6 The cooling channel 10 includes a liquid supply area 11 and a liquid return area 12. The liquid supply area 11 is provided with a liquid supply port 110, and the liquid return area 12 is provided with a liquid return port 120. There are two or more heat-conducting rods 31. The liquid supply area 11 and the liquid return area 12 each have a corresponding heat-conducting cavity 310 connected thereto. A heat exchange flow channel 20 is provided inside the floating cold plate 2. The heat exchange flow channel 20 is connected to the two heat-conducting cavities 310 connected to the liquid supply area 11 and the liquid return area 12 respectively. The flow path of the coolant in the working state is as follows: the coolant enters the liquid supply area 11 from the liquid supply port 110, then enters the heat-conducting cavity 310 on one side from the liquid exchange hole 311, then enters the heat-conducting cavity 310 on the other side through the heat exchange flow channel 20, then enters the liquid return area 12 through the liquid exchange hole 311, and finally flows out from the liquid return port 120, which can cooperate with the refrigeration device to realize the cooling and circulation of the coolant.

[0037] Reference Figure 5, the shape and structural design of the liquid supply area 11 and the liquid return area 12 must ensure that the coolant can flow and distribute evenly to avoid local overheating or uneven cooling. Therefore, the present application sets the liquid supply area 11 and the liquid return area 12 to include a main area and several connected branch areas, the branch areas are connected to the corresponding heat conduction holes 100, and the width of the main area increases in the direction close to the liquid supply port 110 / return liquid port 120. Through such a flow channel shape design, even at the heat conduction hole 100 far away from the liquid supply port 110 / return liquid port 120, a relatively balanced hydraulic pressure can still be obtained, reducing the impact of hydraulic loss after the distance increases, thereby ensuring the coolant flow rate at the distant heat conduction hole 100, and maintaining the uniform distribution of cooling resources of several cooling plates as much as possible. The connection method between the main area and the branch area can adopt a smooth transition method to reduce the resistance of the coolant flow.

[0038] Reference Figure 7 and Figure 8 The outer side of the heat-conducting rod 31 is provided with an annular groove and is covered with a main sealing ring 5. The main sealing ring 5 is interference-fitted with the inner wall of the heat-conducting hole 100. The main sealing ring 5 is generally made of elastic materials such as rubber, which has good sealing performance and can effectively prevent coolant leakage. In addition to rubber, other sealing materials such as silicone can also be used. The main sealing ring 5 can improve the sealing performance of the gap when the heat-conducting rod 31 slides along the heat-conducting hole 100, reducing the risk of coolant leakage.

[0039] In addition, the heat-conducting rod 31 is also provided with an annular groove and is covered with a floating state sealing ring 51. The floating state sealing ring 51 has an interference fit with the inner wall of the heat-conducting hole 100 and is located on the side of the liquid exchange hole 311 facing the cooling channel 10. When the floating cold plate 2 is not in operation, the floating state sealing ring 51 seals the gap between the heat-conducting rod 31 and the heat-conducting hole 100, reducing the coolant flow between the cooling channel 10 and the heat-conducting cavity 310 in the non-operating state. When the floating cold plate 2 is in operation, the floating state sealing ring 51 extends into the cooling channel 10, removing the restriction on the flow between the heat-conducting cavity 310 and the cooling channel 10, thereby achieving the flow and heat exchange of the coolant. The floating state sealing ring 51 can also be made of materials such as rubber or silicone, and its sealing performance and elasticity must be able to adapt to different operating conditions.

[0040] Furthermore, the liquid separation channel plate body is provided with an end face sealing ring 52, which is located on the outside of the heat conducting rod 31 and is clearance-fitted. In the working state, the end face sealing ring 52 can contact the surface of the floating cold plate 2, thereby forming an end face seal. Since the heat conducting rod 31 instantly enters the cooling channel 10 and squeezes the coolant in the working state, the risk of leakage is higher at this time. In this state, the end face sealing ring 52 plays a further role in protection and reduces the risk of leakage. The end face sealing ring 52 can be designed in an annular shape, tightly fitting between the liquid separation channel plate body and the floating cold plate 2.

[0041] Reference Figure 7 As with 8, the reset elastic member 4 is a spring 41. The liquid separation channel plate body 1 and the floating cold plate 2 are both provided with a receiving hole 40 for the end of the spring 41 to be inserted. The end of the heat conducting rod 31 connected to the floating cold plate 2 is provided in the receiving hole 40. The spring 41 is usually a coil spring 41, which has good elasticity and restoring force. On the one hand, the receiving hole 40 is convenient for accommodating the spring 41, especially when the floating cold plate 2 is in contact with the liquid separation channel plate body 1 in the working state, the presence of the receiving hole 40 can ensure that the floating cold plate 2 and the liquid separation channel plate body 1 are completely in contact, and the spring 41 still has storage space after being compressed. On the other hand, when the floating cold plate 2 is in full contact with the liquid distribution channel plate body 1, the heat conducting rod 31 instantly enters the cooling channel 10 and squeezes the coolant. Therefore, there is a stage of sudden increase in hydraulic pressure in this state, and leakage is likely to occur during this stage. If the leaked liquid directly contacts the chip, it will directly cause contamination. After the accommodating hole 40 is provided, even if a small amount of leakage occurs, it can still be temporarily stored in the accommodating hole 40 below, and it is convenient for the staff to conduct regular inspections and timely detect leakage, which provides a certain fault tolerance for leakage pollution.

[0042] Reference Figure 9 The limiting assembly 6 includes a limiting screw 61, the liquid separation channel plate body 1 is provided with a mounting hole 62 for threaded connection of the screw portion of the limiting screw 61, and the floating cold plate 2 is provided with a sliding hole 63 for sliding connection of the screw portion of the limiting screw 61, and the nut portion of the limiting screw 61 is abutted against the side of the floating cold plate 2 away from the liquid separation channel plate body 1. The limiting screw 61 is generally made of metal, such as stainless steel, which has high strength and durability. The function of the limiting screw 61 is to accurately control the sliding range of the floating cold plate 2 to prevent it from excessive sliding or detaching from the liquid separation channel plate body 1. In other embodiments, the limiting assembly 6 can also adopt a pin shaft / pin hole, or a limiting key / key slot combination to achieve sliding limitation. Since it belongs to the existing technology known to those skilled in the art, it will not be repeated in this embodiment.

[0043] The operating principle of this embodiment is as follows: when the chips on the circuit board are at different heights, the floating cold plate 2 automatically slides to a corresponding degree under the pressure / pushing of the chips, ensuring that each floating cold plate 2 maintains good contact with its corresponding chip. In its non-operating state, the thermal conductive assembly 3 performs basic heat exchange with the liquid distribution channel plate body 1. When the floating cold plate 2 is in operation, the thermal conductive rods 31 extend further into the cooling channels 10. Through direct contact between the thermal conductive rods 31 and the coolant and the exchange of coolant, a greater degree of heat exchange is achieved, improving heat dissipation efficiency.

[0044] The limiter assembly 6 ensures that the floating cold plate 2 slides within a reasonable range, and the reset spring 4 restores the floating cold plate 2 to its initial position after the chip is removed. Furthermore, the various sealing rings effectively prevent coolant leakage, and the design of the accommodating hole 40 facilitates the placement of the spring 41 while providing a margin of error for potential leaks. Through adaptive adjustment and an efficient heat exchange mechanism, the entire system can meet the cooling requirements of chips of varying heights, improving both heat dissipation and resource allocation efficiency. Compared to existing technologies, it better addresses the heat dissipation issues associated with varying chip heights and increased power density.

[0045] Example 2 Reference Figure 10 The difference between this embodiment and embodiment 1 is that the angle of the liquid exchange hole 311 is inclined relative to the radial direction of the heat transfer cavity 310, and the inclination angles and orientations of the plurality of liquid exchange holes 311 are consistent, so that the flow direction of the liquid exchange holes 311 into the heat transfer cavity 310 is vortex-shaped, which is more conducive to the coolant entering the interior of the floating cold plate 2 in the working state.

[0046] The implementation principle of this embodiment is: if the angles of the multiple liquid exchange holes 311 are all set radially, the flow directions of the liquid exchange holes 311 at symmetrical positions may collide and impact, which may easily cause flow resistance at the top of the heat conduction cavity 310 and affect the heat exchange efficiency. By adjusting the angles of the multiple liquid exchange holes 311, the flow of coolant can be promoted and the cooling effect can be improved.

[0047] Example 3 Reference Figure 11 The difference between this embodiment and embodiment 1 is that the liquid exchange hole 311 is long and narrow, and the length direction is consistent with the sliding direction of the heat conducting rod 31 .

[0048] Furthermore, this embodiment differs from Embodiment 1 in that the bottom of the floating cold plate 2 is provided with a thermally conductive gasket 7, which can be made of silicone grease. The bottom of the fluid exchange channel within the floating cold plate 2 is in direct contact with the thermally conductive gasket 7. When the chip contacts the thermally conductive gasket 7, the chip can squeeze the thermally conductive gasket 7, causing it to partially bend and deform, extending into the space within the fluid exchange channel. Accordingly, the top of the thermally conductive gasket 7 and the top of the inner wall of the fluid exchange channel are both provided with a plurality of range extenders 71, and the upper and lower range extenders 71 are staggered.

[0049] The implementation principle of this embodiment is: when the chip is thicker, the movement distance of the floating cold plate 2 in the working state is greater, and the portion of the liquid exchange hole 311 on the heat conducting rod 31 entering the interior of the cooling channel 10 is greater, so the coolant flow cross section at this location is larger, and more coolant flows through.

[0050] When the chip contacts the thermal pad 7, a thicker chip results in a deeper interlacing of the range extender plates 71, creating a longer coolant flow path and achieving better cooling. Furthermore, as the chip becomes thicker, the thermal pad 7 is squeezed more tightly against it, making its edges more likely to deform and even partially wrap around the top of the chip. This compensates for the problem of some thicker chips being unable to meet cooling requirements by cooling only the top surface.

[0051] In summary, thicker chips obtain a larger proportion of cooling resources and have better cooling effects, thereby better realizing resource allocation, that is, chips of different thicknesses obtain more matched cooling resources.

[0052] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A floating cold water plate, characterized in that: The invention comprises a liquid separation channel plate body (1) and a floating cold plate (2) slidably connected thereto, wherein a cooling channel (10) is provided inside the liquid separation channel plate body (1), the floating cold plate (2) is provided with a heat conduction component (3), the liquid separation channel plate body (1) is provided with a limit component (6) for limiting the sliding range of the floating cold plate (2), the liquid separation channel plate body (1) is provided with a reset elastic member (4) for pushing the floating cold plate (2) away, and the floating cold plate (2) slides toward the liquid separation channel plate body (1) in a working state, and the heat conduction component (3) and the liquid separation channel plate body (1) perform a greater degree of heat exchange.

2. A floating cold water plate according to claim 1, characterized in that: The heat-conducting assembly (3) comprises a heat-conducting rod (31), the heat-conducting rod (31) is connected to the floating cold plate (2), the liquid separation channel plate body (1) is provided with a heat-conducting hole (100) connected to the cooling channel (10), and the heat-conducting rod (31) is adapted to and slidably connected to the heat-conducting hole (100).

3. A floating cold water plate according to claim 2, characterized in that: A heat conduction cavity (310) is provided inside the heat conduction rod (31), and a liquid exchange hole (311) communicating with the heat conduction cavity (310) is further provided on a side wall of the heat conduction rod (31); when the floating cold plate (2) is in a non-working state, the inner wall of the heat conduction hole (100) covers the liquid exchange hole (311); when the floating cold plate (2) is in a working state, the liquid exchange hole (311) is located inside the cooling channel (10).

4. The floating cold water plate according to claim 3, characterized in that: The cooling channel (10) comprises a liquid supply area (11) and a liquid return area (12); the liquid supply area (11) is provided with a liquid supply port (110); the liquid return area (12) is provided with a liquid return port (120); the number of the heat-conducting rods (31) is more than two; the liquid supply area (11) and the liquid return area (12) both have corresponding heat-conducting cavities (310) in communication therewith; a heat-exchange flow channel (20) is provided inside the floating cold plate (2); the heat-exchange flow channel (20) is in communication with two heat-conducting cavities (310) in communication with the liquid supply area (11) and the liquid return area (12), respectively.

5. The floating cold water plate according to claim 4, characterized in that: The liquid supply area (11) and the liquid return area (12) both include a main area (13) and a plurality of connected branch areas (131), wherein the branch areas (131) are connected to corresponding heat conduction holes (100), and the width of the main area (13) increases in a direction approaching the liquid supply port (110) / the liquid return port (120).

6. The floating cold water plate according to claim 2, characterized in that: The heat-conducting rod (31) is sleeved with a main sealing ring (5), and the main sealing ring (5) is interference-fitted with the inner wall of the heat-conducting hole (100).

7. The floating cold water plate according to claim 3, characterized in that: The heat conducting rod (31) is sleeved with a floating state sealing ring (51), the floating state sealing ring (51) is interference fit with the inner wall of the heat conducting hole (100), and the floating state sealing ring (51) is located on the side of the liquid exchange hole (311) facing the cooling channel (10).

8. The floating cold water plate according to claim 2, characterized in that: The liquid separation channel plate body is provided with an end face sealing ring (52), and the end face sealing ring (52) is located outside the heat conducting rod (31).

9. The floating cold water plate according to claim 1, characterized in that: The limiting assembly (6) includes a limiting screw (61), the liquid separation channel plate body (1) is provided with a mounting hole (62) for threaded connection of the screw portion of the limiting screw (61), the floating cold plate (2) is provided with a sliding hole (63) for sliding connection of the screw portion of the limiting screw (61), and the nut portion of the limiting screw (61) abuts against a side of the floating cold plate (2) away from the liquid separation channel plate body (1).

10. The floating cold water plate according to claim 2, characterized in that: The reset elastic member (4) is a spring (41), and the liquid separation channel plate body (1) and the floating cold plate (2) are both provided with a receiving hole (40) for inserting the end of the spring (41), and one end of the heat conducting rod (31) connected to the floating cold plate (2) is provided in the receiving hole (40).

Images