This application provides a
heat sink, a heat dissipation apparatus, a heat dissipation
system, and a communications device. The
heat sink includes: a heat dissipation substrate, a connector, and a
fastener, where the heat dissipation substrate is configured to dissipate heat for a packaged
chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged
chip and that is opposite to the circuit board; and a first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a
chip in the packaged chip, different heat conduction surfaces correspond to different chips, a first end of the connector is fastened to the first heat dissipation substrate, a second end of the connector suspends on an outer side of the second heat dissipation substrate, and the
fastener presses against an outer side of the first heat dissipation substrate, to prevent the first heat dissipation substrate from moving far away from the second heat dissipation substrate. A plurality of heat dissipation substrates that relatively slowly conduct heat with each other form one heat dissipation substrate, so that heat is properly and effectively dissipated for each chip in a packaged chip. Therefore, a service life of a chip having a relatively low temperature is effectively increased, and a service life of an electronic product is increased.