Heat dissipation structure and laser

Abstract

The application belongs to the technical field of heat dissipation of lasers, and discloses a heat dissipation structure and a laser. The heat dissipation structure comprises heat dissipation plates and a heat conduction part. A plurality of heat dissipation plates enclose an installation space for accommodating a plurality of electrical elements, and the inner wall of the heat dissipation plate is used for installing the electrical elements. A heat insulating body is arranged between adjacent heat dissipation plates corresponding to different electrical elements with a working temperature difference greater than a first preset temperature. A heat conducting body is arranged between adjacent heat dissipation plates corresponding to different electrical elements with a working temperature difference less than a second preset temperature. The outer wall of at least part of the heat dissipation plates is provided with the heat conduction part, and the heat conduction part is used for transferring the heat generated by the electrical elements to the external environment through convection heat dissipation. Through the application, convection heat dissipation can be achieved, the influence of noise and vibration can be avoided, the structural compactness can be improved, and the waste of system resource configuration and unnecessary energy consumption can be reduced.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for lasers, and more particularly to a heat dissipation structure and a laser. Background Technology

[0002] In the process of converting electrical energy into optical energy, fiber lasers typically undergo a series of complex physical conversion processes. Since the conversion efficiency between electrical and optical energy cannot reach 100%, a large amount of waste heat is generated during the operation of the laser.

[0003] If this waste heat is not handled promptly and effectively, the accumulation of heat will affect the structural stability and safety of the laser, and may even cause equipment failure or performance degradation. Therefore, the design and implementation of laser heat dissipation technology are crucial to its normal operation.

[0004] In small lasers, forced air cooling is currently the most common heat dissipation method. This method typically relies on fans to accelerate heat dissipation; however, fans generate significant noise during operation, which negatively impacts the user experience and working environment. Furthermore, most existing laser cooling systems are designed to place all heat-generating components on a single heatsink. Since different components generate different amounts of heat and have different rated operating temperatures, the design often considers the minimum operating temperature requirements of these components to ensure they operate within a safe temperature range. This often results in overly large heatsinks, sometimes requiring even more powerful fans, leading to wasted system resources and unnecessary energy consumption. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation structure and a fiber laser, which uses natural convection to dissipate heat, avoiding the effects of noise and vibration, and improving the overall reliability of the structure. On the other hand, it can also provide targeted heat dissipation for different types of electrical components (with different safe operating temperature ranges), improve the compactness of the structure, and reduce the waste of system resource allocation and unnecessary energy consumption.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A heat dissipation structure, comprising:

[0008] A heat sink, comprising multiple heat sinks enclosing an installation space for accommodating multiple electrical components, wherein the inner wall of the heat sink is used to install the electrical components, and a heat insulation body is provided between adjacent heat sinks corresponding to different electrical components whose operating temperature difference is greater than a first preset temperature; and a heat conductor is provided between adjacent heat sinks corresponding to different electrical components whose operating temperature difference is less than a second preset temperature. The heat insulation body is used to prevent heat transfer between two adjacent heat sinks, and the heat conductor is used to allow heat transfer between two adjacent heat sinks.

[0009] The heat-conducting part is provided on at least part of the outer wall of the heat sink, and the heat-conducting part is used to transfer the heat generated by the electrical component to the external environment through convection heat dissipation.

[0010] As an alternative heat dissipation structure, the surface of the electrical component is attached to the wall of the heat sink facing the mounting space.

[0011] As an alternative heat dissipation structure, the heat-conducting part includes a plurality of heat-conducting sheets extending outward from the outer wall of the heat sink, and the plurality of heat-conducting sheets are arranged sequentially at intervals.

[0012] As an alternative heat dissipation structure, the heat-conducting part is provided with a cover plate on the side away from the heat sink, so as to form a convection channel between adjacent heat-conducting sheets.

[0013] As an alternative heat dissipation structure, the heat-conducting part includes a plurality of needle-like bodies disposed on the outer wall of the heat sink.

[0014] As an alternative heat dissipation structure, the heat conductor is a layer formed by coating a heat-conducting medium between adjacent heat dissipation plates; and / or, the heat insulation body is a layer formed by coating a heat-insulating medium between adjacent heat dissipation plates.

[0015] As an alternative heat dissipation structure, the six heat dissipation plates are arranged together to form a closed cube shape. The electrical components include one or more of a PCB board, a chip, and an optical fiber body. The optical fiber body and the PCB board are respectively disposed on two opposite heat dissipation plates, and the chip is disposed on one or more of the remaining heat dissipation plates.

[0016] As an alternative heat dissipation structure, the PCB board is bonded to the heat sink using thermally conductive adhesive.

[0017] As an alternative heat dissipation structure, the heat-conducting part is located on the outer wall of the heat sink on the side.

[0018] A laser includes multiple electrical components and a heat dissipation structure as described in any of the above embodiments.

[0019] Beneficial effects:

[0020] In a first aspect of the invention, the electrical components are directly mounted on the inner wall of a heat sink within the mounting space. This not only utilizes the heat conduction effect of the heat sink but also provides overall protection for the electrical components, preventing exposure and improving their operational safety and stability. Furthermore, this heat dissipation structure can typically accommodate various types of electrical components. Different types of electrical components may have different safe operating temperature ranges. Therefore, a heat insulation body or a heat conductor is adaptively placed between adjacent heat sinks. The heat insulation body prevents heat transfer between two adjacent heat sinks, while the heat conductor allows heat transfer between them. When the temperature difference between the electrical components on adjacent heat sinks exceeds a first preset temperature, a heat insulator is placed between the two heat sinks. This prevents heat exchange between the two adjacent heat sinks, allowing each component to dissipate heat independently. This avoids matching a heat sink with a component that generates less heat to one that generates more. Therefore, the structure or size of the heat sink can be tailored to the different heat generation levels of the electrical components, improving structural compactness and reducing waste of system resources and unnecessary energy consumption. Furthermore, when the temperature difference between the electrical components on adjacent heat sinks is less than a second preset temperature (i.e., the two safe operating temperatures of the two adjacent components are similar), a heat conductor can be placed between the two adjacent heat sinks to accelerate heat flow and improve heat dissipation efficiency. Additionally, a heat-conducting section is provided on the outer wall of the heat sink, directly contacting the external environment to achieve convection cooling, accelerating heat conduction and rapidly cooling the electrical components. This avoids the noise and vibration issues associated with forced air cooling in existing technologies, improving the overall structural reliability.

[0021] In a second aspect of the invention, the laser based on the above heat dissipation structure not only achieves heat dissipation for electrical components, but also, through the enclosed structural arrangement, places the electrical components inside the installation space and the heat-conducting part outside the installation space, effectively achieving improved heat dissipation through natural convection, thereby avoiding the influence of noise and vibration and improving the reliability of the laser; on the other hand, the enclosed structural design also concentrates the arrangement of the heat sink, improving the compactness of the laser, making the laser further miniaturized, reducing the waste of system resource allocation and unnecessary energy consumption. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the heat dissipation structure provided in an embodiment of the present invention;

[0023] Figure 2This is a first structural schematic diagram of the heat dissipation structure with hidden features provided in an embodiment of the present invention;

[0024] Figure 3 This is a second structural schematic diagram of the heat dissipation structure with hidden features provided in an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the cooperative structure between the optical fiber body and the heat sink provided in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the first structure of the chip and heat sink provided in an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the structure of a single chip and a single heat sink provided in an embodiment of the present invention;

[0028] Figure 7 This is a partial structural diagram of the chip and heat sink provided in an embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the second structure of the chip and heat sink provided in an embodiment of the present invention;

[0030] Figure 9 This is a schematic diagram of the structure of the PCB board and heat sink provided in the embodiment of the present invention;

[0031] Figure 10 This is a schematic diagram of the structure of the fastener and the heat sink provided in an embodiment of the present invention.

[0032] In the picture:

[0033] 1. Heat sink; 11. Installation space; 12. Mounting boss; 13. Housing;

[0034] 2. Heat-conducting part;

[0035] 3. Electrical components; 31. PCB board; 32. Chip; 33. Fiber optic cable body;

[0036] 4. Thermal insulation;

[0037] 5. Heat conductor;

[0038] 6. Fasteners. Detailed Implementation

[0039] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0040] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0043] Please see the appendix Figure 1 -Appendix Figure 3 The first aspect of this embodiment relates to a heat dissipation structure, which includes a heat sink 1 and a heat-conducting part 2. Multiple heat sinks 1 are arranged to form an installation space 11 for accommodating multiple electrical components 3. The inner wall of the heat sink 1 is used to install the electrical components 3. A heat insulation body 4 or a heat-conducting body 5 can be provided between adjacent heat sinks 1 according to the operating temperature of the electrical components 3 mounted thereon. The heat insulation body 4 is used to prevent heat transfer between two adjacent heat sinks 1, and the heat-conducting body 5 is used to allow heat transfer between two adjacent heat sinks 1. A heat insulation body 4 is provided between adjacent heat sinks 1 corresponding to different electrical components 3 with an operating temperature difference greater than a first preset temperature; a heat-conducting body 5 is provided between adjacent heat sinks 1 corresponding to different electrical components 3 with an operating temperature difference less than a second preset temperature. At least a portion of the outer wall of the heat sink 1 is provided with a heat-conducting part 2, which is used to transfer the heat generated by the electrical components 3 to the external environment through convection heat dissipation.

[0044] The heat sink 1 can be a square plate made of copper or other metal. A coating can be applied to the surface of the heat sink 1 to further enhance heat dissipation and corrosion resistance. The number of heat sinks 1 can be adjusted according to the number of electrical components 3. Multiple heat sinks 1 are arranged to form an installation space 11. The electrical components 3 are directly mounted on the inner wall of the heat sinks 1 within the installation space 11. This not only utilizes the heat conduction effect of the heat sink 1 but also protects the electrical components 3, improving their airtightness, dust prevention, extending their service life, and enhancing their operational safety and stability. Furthermore, this heat dissipation structure can typically accommodate various types of electrical components 3. Different types of electrical components 3 may have different safe operating temperatures. In this embodiment, the operating temperature refers to the highest temperature at which the electrical component 3 can reach its optimal operating state based on this heat dissipation structure. Exceeding this temperature will immediately affect the electrical component 3 due to the thermal field, causing its operating state to decline. It can also be understood as the lowest temperature at which the optimal operating state of the electrical component 3 is disrupted. A heat insulation element 4 or a heat conductor 5 is adaptively provided between adjacent heat sinks 1. The heat insulation element 4 is used to prevent heat transfer between the two adjacent heat sinks 1, while the heat conductor 5 is used to allow heat transfer between the two adjacent heat sinks 1. Specifically, when the operating temperature difference of the electrical components 3 on the adjacent heat sinks 1 is greater than a first preset temperature, the heat insulation element 4 is provided between the two heat sinks 1. That is, the safe operating temperatures of the two sets of adjacent electrical components 3 differ significantly. By providing the heat insulation element 4 to prevent heat exchange between the two adjacent heat sinks 1, the heat sinks 4 can be used to dissipate heat from the two sets of adjacent electrical components 3. This avoids the need for a heat sink 1 to match the heat output of electrical components 3 that generate less heat. Therefore, the structure or size of the heat sink 1 can be specifically designed according to the different heat output levels of the electrical components 3, improving the compactness of the structure and reducing the waste of system resources and unnecessary energy consumption. Furthermore, when the temperature difference between the electrical components 3 on adjacent heat sinks 1 is less than the second preset temperature, that is, when the two safe operating temperatures between two sets of adjacent electrical components 3 are relatively close, a heat conductor 5 can be set between the two adjacent heat sinks 1 to accelerate the flow of heat and improve the heat dissipation efficiency.

[0045] It should be noted that the specific values ​​of the first and second preset temperatures can be specifically set and adjusted based on the test results or the heat generation statistics of the electrical components 3. For example, the range of the first and second preset temperatures can be 5℃-15℃, and the first preset temperature ≥ the second preset temperature; they can be close to or equal. In this embodiment, the first preset temperature is 15℃. When the temperature difference between the electrical components 3 on two adjacent heat sinks 1 is greater than 15℃, it is determined that the safe operating temperatures of the two sets of adjacent electrical components 3 differ significantly. Therefore, when the two sets of adjacent electrical components 3 are operating safely, the resulting temperature field will form obvious relatively high-temperature and relatively low-temperature zones, causing a thermal conduction effect between the relatively high-temperature and relatively low-temperature zones. This affects the heat dissipation of the electrical components 3 in the relatively low-temperature zone, causing the corresponding electrical components 3 to deviate from their safe operating temperatures, thus affecting their performance. This embodiment prevents the two electrical components 3 from affecting each other by setting a heat insulation body 4 on the two electrical components 3 to prevent heat exchange between the two adjacent heat sinks 1. In this embodiment, the second preset temperature can be 5°C. When the electrical components 3 on two adjacent heat sinks 1 are operating safely, since the temperature difference is less than 5°C, it can be determined that the safe operating temperatures of the two sets of adjacent electrical components 3 are very close. Therefore, there will not be a significant relative high or low temperature zone in the temperature field of the two sets of adjacent electrical components 3. A heat conductor 5 can be set between the two adjacent heat sinks 1 to accelerate the flow of heat and improve the heat dissipation efficiency. Furthermore, a heat-conducting part 2 is provided on the outer wall of the heat sink 1. The heat-conducting part 2 is in direct contact with the external environment, usually air with a relatively low temperature, to achieve convection heat dissipation, accelerate the heat conduction of the heat sink 1, and achieve rapid cooling of the electrical components 3. This avoids the noise and vibration caused by the forced air cooling of the prior art and improves the reliability of the overall structure.

[0046] Optionally, the surface of the electrical component 3 is attached to the wall of the heat sink 1 facing the mounting space 11.

[0047] Specifically, the heating surface of the electrical component 3 can be directly attached to the heat sink 1, thereby enabling rapid heat transfer and directing heat out through the heat sink 1. The electrical component 3 can be tightly fitted to the heat sink 1 using limiting structures such as limiting grooves on the heat sink 1, or it can be bonded to the heat sink 1 using a thermally conductive adhesive.

[0048] By directly attaching the electrical component 3 to the heat sink 1, the heat conduction efficiency can be avoided by setting an intermediate heat conduction structure, and the compactness of the structure can also be improved.

[0049] Optionally, the heat-conducting part 2 includes a plurality of heat-conducting fins extending outward from the outer wall of the heat sink 1, and the plurality of heat-conducting fins are arranged sequentially at intervals.

[0050] In one implementation of this embodiment, the heat-conducting fins can have various structural forms, including but not limited to planar fin structures, curved fin structures, and branched dendritic fin structures. By spacing the heat-conducting fins apart, the contact area with external components is increased, thereby improving convective heat dissipation efficiency.

[0051] Optionally, a cover plate (not shown in the figure) is provided on the side of the heat-conducting part 2 away from the heat sink 1 to form a convection channel between adjacent heat-conducting plates.

[0052] In this embodiment, a vertical convection channel is formed by the outer wall of the heat sink 1, two adjacent heat-conducting parts 2, and part of the cover plate. Due to the temperature difference, cold air can continuously pass through the convection channel in the vertical direction and carry away heat. The heat dissipation efficiency is improved by the natural flow of air in the vertical direction.

[0053] Optionally, the heat-conducting part 2 includes a plurality of needle-like bodies disposed on the outer wall of the heat sink 1.

[0054] In another implementation of this embodiment, the heat-conducting part 2 is needle-rib shaped, that is, heat-conducting needles are arrayed on the outer wall of the heat sink 1. The heat-conducting needles contact the external air through the circumferential outer wall, thereby achieving convective heat dissipation. By reasonably setting the density of the heat-conducting needles, the heat dissipation effect can be easily adjusted and the adaptability can be improved.

[0055] Optionally, the heat conductor 5 is a layered body formed by coating a heat-conducting medium between adjacent heat dissipation plates 1, and the heat insulation body 4 is a layered body formed by coating a heat insulation medium between adjacent heat dissipation plates 1.

[0056] In this embodiment, the heat conductor 5 can be coated with thermally conductive adhesive at the connection surface between the heat sinks 1, thereby improving the thermal conductivity of the two adjacent heat sinks 1. The heat insulation body 4 can be a heat insulation film, which is directly bonded to the connection surface between the heat sinks 1 to form a heat insulation layer during use, preventing heat conduction between the two adjacent heat sinks 1 and ensuring that their heat dissipation does not affect each other.

[0057] Please continue to refer to the appendix. Figure 1 -Appendix Figure 3 In this embodiment, the heat dissipation structure is discussed in detail for a closed cubic shape formed by six heat sinks 1, and for electrical components 3 including one or more of PCB board 31, chip 32 and optical fiber body 33.

[0058] Specifically, the six heat sinks 1 and the heat-conducting part 2 can form a closed "U-shaped" structure, and the optical fiber body 33 is arranged around and placed on the heat sink 1 at the top position, the PCB board 31 is placed on the heat sink 1 at the bottom position, and the three chips 32 are arranged sequentially on the three heat sinks 1 on the side.

[0059] It should be noted that, please refer to the appendix. Figure 4 -Appendix Figure 9 The heat generation capabilities of chip 32, optical fiber body 33, and PCB board 31 increase sequentially, and the heat generation capabilities of chip 32 and optical fiber body 33 are similar. Therefore, PCB board 31, located on the heat sink 1 at the bottom, can affect the heat dissipation of chip 32. To prevent excess heat from PCB board 31 from being transferred to chip 32 through heat sink 1 and affecting the working performance of chip 32, a heat insulation material 4 is added at the connection between PCB board 31 and the corresponding heat sink 1 of chip 32 to prevent heat transfer between the two. In addition, since PCB board 31 has the strongest heat generation capability, in order to improve the heat dissipation effect on PCB board 31, in this embodiment, a joint extended heat dissipation structure is formed between the heat sink 1 on the side without chip 32 and the heat sink 1 with PCB board 31, so as to improve the heat dissipation efficiency of PCB board 31. Meanwhile, since the combined extended heat dissipation structure needs to contact not only the heat sink 1 of the chip 32 but also the heat sink 1 of the optical fiber body 33, a heat insulation body 4 is also provided at the contact point between the combined extended heat dissipation structure and the heat sink 1 of the optical fiber body 33. Because the heat generation capabilities of the chip 32 and the optical fiber body 33 are similar, heat insulation bodies 4 or heat conductors 5 can be specifically provided on the heat sink 1 where the chip 32 is located and the heat sink 1 where the optical fiber body 33 is located, depending on the requirements. The heat conductor 5 allows heat conduction between the chip 32 and the optical fiber body 33. Furthermore, by adding heat conductors 5 to the three sets of heat sinks 1 where the chip 32 is located, heat can be conducted between them.

[0060] Optionally, the PCB board 31 is bonded to the heat sink 1 with thermally conductive adhesive.

[0061] In this embodiment, the PCB board 31 is directly bonded to the heat sink 1 with thermally conductive adhesive. The thermally conductive adhesive has a thermal conductivity effect, which ensures that the PCB board 31 can quickly conduct heat to the heat sink 1 and further transfer heat to the external environment through convection heat dissipation via the thermally conductive part 2.

[0062] Optionally, the heat-conducting part 2 is located on the outer wall of the heat sink 1 on the side.

[0063] In this embodiment, heat-conducting parts 2 are provided on four circumferentially arranged heat dissipation plates 1. The heat-conducting parts 2 adopt heat dissipation fins, thereby forming a "U" shaped layout. This allows all electrical components 3 to be encapsulated inside the structure, isolated from the outside world, and not in direct contact, thus improving space utilization and meeting the heat dissipation requirements of small lasers.

[0064] Please see the appendix Figure 6 -Appendix Figure 8 Optionally, the heat sink 1 with chip 32 is provided with mounting boss 12, and chip 32 is disposed on mounting boss 12.

[0065] Specifically, the mounting boss 12 is integrally formed on the inner wall of the heat sink 1. The material of the mounting boss 12 is the same as that of the heat sink 1, thereby ensuring stable heat dissipation. At the same time, the mounting boss 12 can be used to limit the chip 32, which can improve assembly efficiency and ensure the uniformity of adhesive coating during encapsulation. A housing 13 for encapsulation is provided on the outside of the chip 32 to protect the chip 32. The housing 13 is fixed to the heat sink 1 with thermally conductive adhesive.

[0066] In this embodiment, the chip 32 is directly mounted after the mounting boss 12 before the housing 13 is encapsulated. This avoids the conventional fiber laser method of first encapsulating the pump source and then fixing the encapsulated pump source to a heat sink for heat dissipation through welding or bonding. This avoids introducing additional thermal resistance and improves heat transfer efficiency and heat dissipation effect.

[0067] Please see the appendix Figure 10 Optionally, adjacent heat sinks 1 are connected by a number of fasteners 6, and the fasteners 6 are connected to the inner wall of the heat sink 1.

[0068] Specifically, the fixing member 6 is a right-angle fixing plate. Two fixing members 6 are provided between two adjacent sets of heat dissipation plates 1. The fixing member 6 can be detachably connected to the heat dissipation plate 1 by threaded fasteners, or it can be fixed to the heat dissipation plate 1 by non-detachable means such as welding.

[0069] In this embodiment, the stability of the overall heat dissipation structure can be improved by setting the fixing component 6, and vibration factors can be avoided from damaging the overall heat dissipation structure.

[0070] In this embodiment, the heat sink 1 uses surface treatment to enhance radiation heat transfer. The surface treatment methods include, but are not limited to, anodizing, spray painting, electrophoresis and other surface treatment processes, which enhance the heat sink's ability to dissipate heat through infrared radiation.

[0071] The second aspect of this embodiment also relates to a laser, which includes electrical components 3 and above heat dissipation structures.

[0072] Based on the above heat dissipation structure, the laser not only achieves heat dissipation for the electrical component 3, but also, through the enclosed structure, places the electrical component 3 inside the mounting space 11 and the heat-conducting part 2 outside the mounting space 11, effectively achieving improved heat dissipation through natural convection, thereby avoiding the influence of noise and vibration and improving the reliability of the laser. On the other hand, the enclosed structure design also centrally arranges the heat sink 1, improving the compactness of the laser, making the laser more miniaturized, reducing the waste of system resource allocation and unnecessary energy consumption.

[0073] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation structure, characterized in that, include: A heat sink (1) is formed by multiple heat sinks (1) enclosing an installation space (11) for accommodating multiple electrical components (3). The inner wall of the heat sink (1) is used to install the electrical components (3). A heat insulation body (4) is provided between adjacent heat sinks (1) corresponding to different electrical components (3) with a working temperature difference greater than a first preset temperature. A heat conductor (5) is provided between adjacent heat sinks (1) corresponding to different electrical components (3) with a working temperature difference less than a second preset temperature. The heat insulation body (4) is used to prevent heat transfer between two adjacent heat sinks (1), and the heat conductor (5) is used to allow heat transfer between two adjacent heat sinks (1). The heat-conducting part (2) is provided on the outer wall of at least part of the heat sink (1), and the heat-conducting part (2) is used to transfer the heat generated by the electrical component (3) to the external environment through convection heat dissipation.

2. The heat dissipation structure according to claim 1, characterized in that, The surface of the electrical component (3) is attached to the wall of the heat sink (1) facing the mounting space (11).

3. The heat dissipation structure according to claim 1, characterized in that, The heat-conducting part (2) includes a plurality of heat-conducting sheets extending outward from the outer wall of the heat sink (1), and the plurality of heat-conducting sheets are arranged at intervals in sequence.

4. The heat dissipation structure according to claim 3, characterized in that, The heat-conducting part (2) is provided with a cover plate on the side away from the heat sink (1) so that a convection channel is formed between adjacent heat-conducting sheets.

5. The heat dissipation structure according to claim 1, characterized in that, The heat-conducting part (2) includes a plurality of needle-like bodies disposed on the outer wall of the heat sink (1).

6. The heat dissipation structure according to claim 1, characterized in that, The heat conductor (5) is a layered body formed by coating a heat-conducting medium between adjacent heat sinks (1); and / or, The heat insulation body (4) is a layered body formed by coating the heat insulation medium between adjacent heat dissipation plates (1).

7. The heat dissipation structure according to any one of claims 1-6, characterized in that, The six heat sinks (1) are arranged together to form a closed cube. The electrical components (3) include one or more of the following: PCB board (31), chip (32) and optical fiber body (33). The optical fiber body (33) and the PCB board (31) are respectively arranged on two heat sinks (1) that are arranged opposite each other, and the chip (32) is arranged on one or more of the remaining heat sinks (1).

8. The heat dissipation structure according to claim 7, characterized in that, The PCB board (31) is bonded to the heat sink (1) with thermally conductive adhesive.

9. The heat dissipation structure according to claim 7, characterized in that, The heat-conducting part (2) is located on the outer wall of the heat sink (1) on the side.

10. A laser, characterized in that, It includes multiple electrical components (3) and a heat dissipation structure as described in any one of claims 1-9.

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