Anti-corrosion resonator, filter and electronic equipment
By setting a sealing structure at the release hole of the resonator and using waterproof vapor-proof materials and an insertion structure, the problem of water vapor corrosion after removing the cap is solved, and the reliability and cost-effectiveness of the resonator are improved.
Patent Information
- Application Number
- CN202510771748.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-11
- Publication Date
- 2025-09-19
AI Technical Summary
After the cap of a traditional corrosion-resistant resonator is removed, water vapor corrodes the lower electrode through the substrate, causing device failure. The sealing and water vapor protection are poor, which increases production costs and makes the device larger.
A sealing structure is used to seal the release hole of the resonator, and a waterproof vapor-proof material is used to cover and insert the structure to form a comprehensive protective barrier to prevent water vapor from entering the interior of the resonator.
The reliability and service life of the resonator are improved, the production cost is reduced and the device size is reduced.
Smart Images
Figure CN120675531A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to an anti-corrosion resonator, a filter and an electronic device. Background Art
[0002] The rapid development of modern electronic technology has placed increasingly stringent demands on the performance, size, and cost of electronic devices. As an important electronic component, corrosion-resistant resonators are widely used in numerous fields, including communications, radar, and sensors. Traditionally, corrosion-resistant resonator manufacturing employs a sealing ring and cap to ensure device reliability. This sealing method can, to a certain extent, protect the active area of the device from environmental influences. For example, in reliability testing at 85°C and 85% humidity for 1000 hours, devices using this sealing method achieved a 100% pass rate. The metal sealing ring and cap play a crucial role in sealing and protecting the device. However, this sealing method has significant drawbacks. The metal sealing ring and cap contribute significantly to the production cost, accounting for approximately 20-40%. This makes it difficult to reduce the overall device cost, hindering market competitiveness. Furthermore, with the increasing demand for device miniaturization, the larger size associated with this sealing method has become a limiting factor.
[0003] To address cost and size issues, removing the cap became a viable improvement. However, after removing the cap, the device was directly packaged onto the substrate, which provided far less sealing and moisture-proof protection than a metal sealing ring and cap combination. After 1000 hours of reliability testing at 85°C and 85% humidity, the product failed. Specifically, water vapor corroded the lower electrode along the release hole path through the substrate, causing the failure. Summary of the Invention
[0004] In view of this, the embodiments of the present application are directed to providing a corrosion-resistant resonator, a filter, and an electronic device to solve the problems of sealing and water vapor resistance of the device after the cap is removed.
[0005] The present application provides an anti-corrosion resonator, comprising: a resonator body and a blocking structure;
[0006] The resonator body includes a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film and an upper electrode;
[0007] Wherein, the piezoelectric layer film is provided with a release hole connected to the acoustic mirror;
[0008] The blocking structure is used to block the release hole.
[0009] In some embodiments, there are multiple release holes.
[0010] The blocking structure is used to block all the release holes.
[0011] In some embodiments, the blocking structure includes a covering structure;
[0012] The covering structure covers the opening of the release hole to block the release hole.
[0013] In some embodiments, the blocking structure further comprises an insertion structure;
[0014] The inserting structure is inserted into the release hole to block the release hole.
[0015] In some embodiments, each covering structure corresponds to an inserting structure to complete the blocking of a release hole.
[0016] In some embodiments, multiple insert structures correspond to one cover structure.
[0017] In some embodiments, the cover structure has an annular structure surrounding the resonator body.
[0018] In some embodiments, the material of the sealing structure is a water vapor releasing material.
[0019] The present application provides a filter comprising the above-mentioned anti-corrosion resonator.
[0020] The present application also provides an electronic device comprising the above-mentioned filter.
[0021] The present application provides an anti-corrosion resonator comprising a resonator body and a blocking structure. The resonator body comprises a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric film, and an upper electrode. The piezoelectric film is provided with a release hole connected to the acoustic mirror. The blocking structure is used to block the release hole. This configuration effectively blocks water vapor from entering, preventing problems such as breakage of the lower electrode due to water vapor corrosion, thereby improving the reliability and service life of the resonator. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.
[0023] Figure 1 It is a schematic diagram of the structure of a capped resonator.
[0024] Figure 2 This is a schematic diagram of the structure of a resonator packaged with a cap on a PCB board.
[0025] Figure 3 It is a schematic diagram of the structure of the resonator after removing the cap.
[0026] Figure 4 It is a schematic diagram of the structure of the resonator after the cap is removed and packaged on the substrate.
[0027] Figure 5 It is a schematic structural diagram of a resonator provided in one embodiment of the present application.
[0028] Figure 6 It is a structural schematic diagram of a resonator provided in another embodiment of the present application.
[0029] Figure 7 It is a structural schematic diagram of a resonator provided in another embodiment of the present application.
[0030] Figure 8 It is a structural schematic diagram of a resonator provided in another embodiment of the present application.
[0031] Figure 9 It is a structural diagram of the resonator.
[0032] Reference numerals:
[0033] 110. Substrate; 120. Acoustic mirror; 130. Lower electrode; 140. Piezoelectric layer film; 150. Upper electrode; 160. Passivation layer; 180. Release hole; 190. Metal sealing ring; 200. Electrode connection part; 210. Cap; 230. PCB board; 320. Sealing structure. DETAILED DESCRIPTION
[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.
[0035] With the rapid development of modern electronic technology, higher and higher requirements are being placed on the performance, size, and cost of electronic devices. As an important electronic component, resonators are widely used in many fields such as communications, radar, and sensors.
[0036] As technology advances, demands for device miniaturization, reduction in production costs, and increased device reliability are all increasing.
[0037] At present, the device is mainly sealed by adding a sealing ring and a cap, such as Figure 1 As shown, the metal sealing ring 190 and the cap 210 mainly play the role of sealing and protecting the effective area of the device. Figure 2 As shown, in a reliability test at 85°C and 85% humidity for 1000 hours, the pass rate reached 100%. The metal sealing ring 190 and the cap 210 are mainly used to seal and protect the active area of the device.
[0038] Since the metal sealing ring 190 and the cap 210 account for about 20-40% of the production cost, the most effective way to effectively reduce the overall cost of the device is to remove the cap 210, such as Figure 3 As shown, this not only reduces production costs but also effectively reduces device size.
[0039] After removing the cap 210, the device is directly packaged onto the substrate, such as Figure 4 As shown. Since the substrate 230 has little effect on sealing and waterproofing the device, the product fails after a 1000h reliability test at 85℃ and 85% humidity. Figure 9 The failure was caused by water vapor passing through the substrate and corroding the lower electrode film along the release hole 180, which is a channel reserved for removing the sacrificial layer in the cavity.
[0040] The present invention addresses the problem of corrosion and hydrolysis during the reliability verification process after the cap is removed. This application proposes a structure to block the release hole 180 of the resonator to prevent water vapor and corrosion.
[0041] After introducing the basic principles of the present application, various non-limiting embodiments of the present application will be described in detail with reference to the accompanying drawings.
[0042] Reference Figure 5 The present application provides an anti-corrosion resonator, comprising: a resonator body and a blocking structure 320; the resonator body comprises a stacked substrate 110, an acoustic mirror 120, a lower electrode 130, a piezoelectric layer film 140 and an upper electrode 150; wherein the piezoelectric layer film is provided with a release hole 180 connected to the acoustic mirror; the blocking structure 320 is used to block the release hole 180. After the resonator cap is removed, water vapor can easily pass through the substrate along the release hole 180 channel to corrode the lower electrode film layer, causing device failure. The blocking structure 320 can effectively block the entry of water vapor, avoid problems such as breakage of the lower electrode due to water vapor corrosion, and thus improve the reliability and service life of the resonator.
[0043] Specifically, there are multiple release holes 180 ; the blocking structure 320 is used to block all the release holes 180 .
[0044] Specifically, in the design of the resonator, there are multiple release holes 180. These release holes 180 are provided on the piezoelectric layer film and are connected to the acoustic mirror. The presence of multiple release holes 180 may be due to considerations such as acoustic performance optimization or manufacturing process. In the working principle of the resonator, structures such as acoustic mirrors play a key role in the reflection and propagation of sound waves. The setting of the release holes 180 may be related to the propagation path and energy distribution of the sound waves inside the resonator. For example, an appropriate number and distribution of release holes 180 may help adjust the reflection and propagation mode of the sound waves to achieve the desired resonant frequency and performance indicators. The blocking structure 320 is used to block all the release holes 180. This is to comprehensively prevent external factors such as water vapor from entering the resonator through the release holes 180 and causing damage to the internal structure. If only some of the release holes 180 are blocked, water vapor may still enter through the unblocked holes, thereby failing to effectively solve the problem of corrosion of the lower electrode film layer. By blocking all the release holes 180 , a complete protective barrier can be formed at the key parts of the entire resonator, ensuring the integrity and stability of the internal structure and maintaining the normal working state and performance of the resonator.
[0045] Specifically, refer to Figure 5 The blocking structure 320 includes a covering structure; the covering structure covers the opening of the release hole 180 to block the release hole 180. The covering structure covers the opening of the release hole 180. By directly blocking the opening of the release hole 180, it prevents foreign substances (such as water vapor) from entering the release hole 180, thereby preventing water vapor from entering the resonator along the channel of the release hole 180 and corroding components such as the lower electrode. This covering method is relatively direct and simple, and can effectively block the release hole 180, a channel through which water vapor may enter, and is a relatively effective protective measure.
[0046] Further, refer to Figure 6 , the blocking structure 320 also includes an insertion structure; the insertion structure and the covering structure are an integrated structure; the insertion structure is inserted into the release hole 180 to block the release hole 180. The insertion structure is inserted into the release hole 180. When the covering structure covers the opening of the release hole 180, the insertion structure further penetrates into the release hole 180 to block the release hole 180 from the inside. This combination of internal and external blocking can more effectively prevent substances such as water vapor from entering the release hole 180. The insertion structure can fill the space inside the release hole 180, reduce the channels where water vapor may exist, and work together with the covering structure to enhance the blocking effect, provide more reliable protection for the resonator, and prevent the lower electrode film layer from being corroded.
[0047] Further, refer to Figure 7, each covering structure corresponds to an inserting structure, which is used to complete the blocking of a release hole 180. In this way, the covering structure and the inserting structure have a one-to-one correspondence with the release hole 180. That is, each release hole 180 has a special set of covering structures and inserting structures for blocking. This one-to-one design ensures that each release hole 180 can be fully and effectively blocked. There will be no situation where a certain release hole 180 is not properly blocked, thereby ensuring the protection effect of the entire resonator. By implementing such targeted blocking measures for each release hole 180, it is possible to prevent water vapor from entering the interior of the resonator to the greatest extent, protect the lower electrode film layer and other internal structures from corrosion, and maintain the normal performance and reliability of the resonator. Furthermore, when a blocking structure 320 is damaged, the individual blocking structure 320 can be replaced instead of replacing all the blocking structures 320.
[0048] In some embodiments, reference Figure 8 , multiple insertion structures share one covering structure; this design can simplify the overall complexity of the blocking structure 320 and reduce the number of components. For example, if multiple release holes 180 are relatively close in space and arranged regularly, by using multiple insertion structures to share one covering structure, these adjacent release holes 180 openings can be covered simultaneously by a larger covering structure, and then multiple insertion structures are respectively inserted into the corresponding release holes 180. This can ensure the blocking effect while making it easier to manufacture and install the blocking structure 320. Furthermore, in this way, the connection between the blocking structure 320 and the resonator body is also tighter.
[0049] Specifically, such as Figure 8 As shown, the covering structure is annular and surrounds the resonator body. The covering structure is designed to be annular, and this shape is set around the outer contour of the resonator body. It is like a "ring" surrounding the resonator body, and its inner and outer diameters are determined according to the size of the resonator body and the distribution position of the release hole 180. It tightly surrounds the resonator body and has a certain fit with the outer surface of the resonator body, but at the same time does not have a negative impact on the acoustic and electrical performance inside the resonator body. Its position must be able to effectively cover the release hole while avoiding interfering with the normal operation of other components.
[0050] For those release holes distributed in a ring around the resonator body, the annular covering structure can cover all holes at once. This eliminates the need to set up a separate covering structure for each hole, simplifies the layout of the blocking structure, and thus improves the efficiency and comprehensiveness of the blocking.
[0051] Specifically, the material of the sealing structure is a waterproof and vapor-proof material. The material of the sealing structure is selected as a waterproof and vapor-proof material, which is determined based on the function it needs to achieve. Since the resonator is susceptible to water vapor corrosion after the cap is removed, the main function of the sealing structure is to prevent water vapor from entering the inside of the resonator through the release hole. Therefore, the selection of a waterproof and vapor-proof material can directly address this problem and effectively block the intrusion of water vapor. The waterproof and vapor-proof material has the characteristic of low water vapor permeability. It can form an effective water vapor barrier in the process of blocking the release hole, ensuring that water vapor cannot easily penetrate the sealing structure and enter the inside of the resonator. This material may have a dense molecular structure or a special chemical composition, which makes it difficult for water vapor molecules to pass through. Compared with ordinary materials, the waterproof and vapor-proof material can better protect the lower electrode film layer and other internal structures of the resonator from water vapor corrosion, thereby improving the reliability and service life of the resonator.
[0052] Specifically, the waterproof and airtight material includes a high-temperature-resistant colloid. Because the release pores are larger than 10 μm, viscous colloids can avoid entering the acoustic mirror and only cover the surface. Other solid materials are likely to enter the cavity during growth. The extent of this intrusion varies depending on the material and growth process, but as long as they do not enter the acoustic mirror in the main resonance region, it is sufficient.
[0053] Specifically, the water vapor-proof material includes at least one of polyimide glue, positive photoresist, negative photoresist, single crystal silicon gallium nitride, gallium arsenide, sapphire, quartz and silicon carbide.
[0054] As will be understood by those skilled in the art, the corrosion-resistant resonator according to the present invention can be used to form filters or electronic devices.
[0055] The electronic equipment here includes but is not limited to intermediate products such as RF front-ends, filter amplification modules, as well as terminal products such as mobile phones, WIFI, and drones.
[0056] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.
[0057] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0058] The terms "first," "second," "third," "fourth," and so on (if any) in the specification and claims of this application and the drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the application described herein can, for example, be implemented in an order other than those illustrated or described herein.
[0059] In addition, the terms "comprises" and "having" and any variations thereof are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.
[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. An anti-corrosion resonator, characterized in that: include: Resonator body and blocking structure; The resonator body includes a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film and an upper electrode; Wherein, the piezoelectric layer film is provided with a release hole connected to the acoustic mirror; The blocking structure is used to block the release hole.
2. The corrosion-resistant resonator according to claim 1, characterized in that There are multiple release holes; The blocking structure is used to block all the release holes.
3. The corrosion-resistant resonator according to claim 1, characterized in that The blocking structure includes a covering structure; The covering structure covers the opening of the release hole to block the release hole.
4. The corrosion-resistant resonator according to claim 3, characterized in that The blocking structure further includes an insertion structure; The inserting structure and the covering structure are an integrated structure; The inserting structure is inserted into the release hole to block the release hole.
5. The corrosion-resistant resonator according to claim 4, characterized in that Each covering structure corresponds to an inserting structure and is used to complete the blocking of a release hole.
6. The corrosion-resistant resonator according to claim 1, characterized in that Multiple insertion structures share one covering structure.
7. The corrosion-resistant resonator according to claim 6, characterized in that The covering structure is an annular structure surrounding the resonator body.
8. The corrosion-resistant resonator according to claim 1, characterized in that The material of the blocking structure is a waterproof and airtight material.
9. The corrosion-resistant resonator according to claim 8, characterized in that The waterproof material includes: a high temperature resistant colloid substance.
10. The corrosion-resistant resonator according to claim 8, characterized in that The waterproof and gas-proof material includes at least one of polyimide glue, positive photoresist, negative photoresist, single crystal silicon gallium nitride, gallium arsenide, sapphire, quartz and silicon carbide.
11. A filter, characterized in that: The invention comprises the anti-corrosion resonator according to any one of claims 1 to 10.
12. An electronic device, characterized in that: Comprising the filter according to claim 11.